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USER`S MANUAL

1. 5 Operators handling to CSP to be educated thoroughly e CSP WBGA is not a conventional package whereby the chip is protected with EMC for physical damage To handle such a fragile part in the PCB assembly manufacturing environment exceptional care is required The operators handling the chip have to be educated thoroughly on the handling procedure 6 Minimum handling is required The layout for CSP package are fully automatic with minimum handling Revision 4 FEB 2007 2 General Handling method 1 Box conveyance Do not open except for approved protective work station t is recommended surface mount products should be assembled after opening this moisture barrier bag under 305 60 R H within 70 days deliver the products with specified packing SEC packing specification do not change packing material or shape Do not to strike the box materials with hard objects or step on them DO not re packing the box during transfer to user without SEC s approval Do not drop the box higher than 70cm otherwise inside products will be damaged Do not fill up more than 6 stack large size box Revision 4 FEB 2007 2 General Handling method 2 Reel Type Handling Guidelines e CSP is packed by Tray or Reel type according to customer s request Reel type packing is filled up with N2 gas CSP packed Carrier Tape should not be unreeled not to be touched on the floor gt Touching on the f
2. USERS MANUAL Chip Scale Package e To make a win win situation for CSP products supplier and customer Samsung provides the information of CSP package s characteristics and manuals to maintain high quality so that the problems of customer process can be minimized or prevented e Samsung will support the technical information when customer s request it Written by Module team FEB 2007 Rev 03 Revised by Device Packaging technology team FEB 2007 Rev 04 Revision 4 FEB 2007 Main contents en lt says understanding of CSP package general handling method box moving tray reel module PCB defect mode in mounting process chip crack cleaning repair solder joint reliability and visual inspection criteria 1 Understanding of CSP 1 Structure comparison between Conventional and CSP Page 3 2 Bending Test comparison between conventional and CSP Page 4 3 Main CSP failure mode WBGA Type Page 5 6 4 Main CSP failure mode FBGA Type Page 7 5 Operators handling to CSP to be educated thoroughly Page 8 2 General handling method 1 Box conveyance Page 9 2 Reel type packing Page 10 11 3 Tray type packing Page 12 14 4 Mounting Process module PCB Page 15 22 5 Memory module handling guidelines Page 23 28 3 Defect mode in SMT process 1 Chip crack defect Page 29 2 Pick up amp Placement Process Guidelines Page 30 32 3 Water cleaning process Page 33 4 Repa
3. Page 31 3 Recommend Nozzle amp Head unit system Recommended the pick up surface of nozzle is flatness for preventing damage and scratch of package The nozzle size should be smaller than package size The inside diameter of nozzle 1s selected proper size for maintain vacuum pressure for keeping package during nozzle move Recommended the head unit system needs an automatic stop function or controller for preventing over pressure to the nozzle or inappropriate mount amp pick up height operation The head unit must have buffer spring system for decreasing pressure and impact of placement during nozzle down Recommended the placement buffer spring force is maximum 250g Revision 4 FEB 2007 Page 32 3 Defect mode amp cause in mounting process ex 3 Water cleaning process e Basically water cleaning process is not recommended Use of No cleaning solder paste is strongly recommended e f the water cleaning process is inevitably requested CSP should not contact chain and belt area of the cleaning equipment Fixed manual jig should be used e Although jig is used for the process Dip or Ultrasonic cleaning should be avoided Sufficient bake after cleaning process is requested to perform completed elimination of moisture and solvent e Solvent Ultrasonic cleaning process is not recommended either i Main point HCFC141B solvent chemical or similar chemical is deadly affected on gold wire bro
4. be not suitable for the customer Please regard them as recommendations Revision 4 FEB 2007 Page 29 3 Defect mode amp cause in mounting process en 2 Pick up amp Placement Process Guidelines t is necessary to the control of package pick up amp placement force for preventing the chip crack of package To guarantee the pick up amp placement force it is important to control the pick up amp mount height The incongruent pick up amp mount height cause the chip crack of package Pick up Process Pick up the package at the proper height level The height level is the pick up height H1 from basic pick up position to the surface of tray pocket The basic pick up position of each equipment is different The pick up height is selected in the adequate range for preventing excessive down pressure of nozzle a lt Pick up nozzle H1 Tray or Reel amp Tape pocket e s Package Revision 4 FEB 2007 Page 30 3 Defect mode amp cause in mounting process en 2 Placement Process Placement the package at the proper mount level The mount level is the mount height H2 from basic pick up position of package to the surface of PCB The basic pick up position of each equipment depends on package size The mount height is selected in the adequate range for preventing excessive down pressure of nozzle a lt Pick up nozzle PCB N _ B Package H 2 Revision 4 FEB 2007
5. 2 General Handling method 4 Mounting Process module PCB eam ase e Cleaning jig in which PCBs are inserted is prohibited to be located on the rail of equipment it must be stored in a safe place Be sure to put on the wrist strap e f PCB falls on the floor in the unloading process due to equipment jamming take out the product one by one to perform scope inspection over all fallen modules to screen failures e Handle PCBs one by one e Minimize equipment trouble Revision 4 FEB 2007 Page 18 2 General Handling method 4 Mounting Process module PCB on J eserin CSP stored in the scrap box should be taken out one by one for which scope inspection should be performed Only good products should be flowed to next e A CSP must be handled one by one e Be sure to put on the wrist strap e Placing assembled PCB on Recycle Jig or Recycle Device is prohibited One by One Handling e Placing assembled module products on Recycle Jig or Recycle Device is prohibited One by One Handling Revision 4 FEB 2007 Page 19 2 General Handling method 4 Mounting Process module PCB ee Tesa e Placing assembled module products on the floor metallic material equipment product is prohibited Jig with PCB attached should be handled as one by one as possible when Jig is stored in an overlapping way arrange it in an orderly manner Jig with PCB attached m
6. External area e Reject if Solder Ball coplanarity exceeds 4Mil e However even though solder Ball coplanarity is good if Package is so Bent that Package coplanarity deviates from war Factor Wf criteria Is is a defect WE PKG Warpage Unit Mil PKG Length Unit Inch gt Reject if Wf is 2 5 or more then e Any exposure of base matal on PSR areas by scratches is rejectable Except edge Area 20mil 3 2 Scratch DR Reject if PCB or EMC Burr exceeds 4Mil Package e Reject if burr of PCB Plating Line Burr exceeds LOMil Revision 4 FEB 2007 Page 48 4 Visual Inspection Criteria LI 3 External area e Reject if base metal or core is exceeds 6Mil Max 150um 3 4 PSR Coverage e Reject for contamination short between ball and ball 3 3 if there is flux contamination which is romoved by Flux air blow it is not defect Contamination e Reject for flux contamination greater then 2 5 x 2 5mm e If crack Caused by PKG Broken attacks solder ball 3 6 Land or VIA Hole it is defect PCB Broken amp e If PCB Edge area exceeds 20mils Length x20mil Crack FBGA Width it is defect e defect if base metal is exposed Visual Inspection or scope X30 Inspection THE END Revision 4 FEB 2007 Page 49
7. Handling Guidelines Wrong Handling e Do not twist or bow a memory module eDo not stack memory modules in a hand Revision 4 FEB 2007 Page 27 2 General Handling method en 5 Memory Module Handling Guidelines Wrong Handling eDo not insert with holding packages and passive elements it can cause package cracks and detachment of passive elements by higher inserting force e nsert only one memory module at one time do not insert multiple memory module at the same time eDo not press both sides of PCB at the same time e Pressing with both hands at the same time may cause solder joint cracks and package cracks by memory module twist and bow because Inserting force in both sides at the same time is higher about two times than one given separately Revision 4 FEB 2007 Page 28 3 Defect mode amp cause in mounting process ex 1 Chip crack defect e Dislocations of chip on Tray pocket by handling Chip mounter s improper pick up position e Improper Tray loading on Chip mounter Recommending Mounting Pick and placer steel with bottom side rubber pad Vacuum sucker Picker Collect Steel size should be smaller than Chip size Placer buffer spring force Max 250g the better the lower Placing conditions The mount height 0 1mm Pick up conditions The pick up height 0 1mm Regarding Tray bow x Above conditions are for SEC Test and Module process s conditions so they might
8. P Broken 13 6 144FBGA sro 0 48 PKG Broken 24 3 256M SDRAM 256M SDRAM 0 45 CHIP Broken 4 30 541 SOP2 5AFBGA 0 57 PKG Broken 4 85 Revision 4 FEB 2007 1 Understanding of CSP type package 3 Main CSP failure mode WBGA Type Chip crack caused by mechanical damage v Pi m rea SS a THe li LEN mm amm l E a eS A z ro LLU e UL iu fe i Fig 1 Top view Fig 2 Side view Fig 3 Cell crack after decap e Due to it s structure the edges are very weak against physical damage that can affect wafer pattern So the most common factors of functional failure are chip crack and chip out e Be sure to use vacuum pad in handling one by one handling tray to tray handling Revision 4 FEB 2007 1 Understanding of CSP type package Gold wire broken caused by mechanical damage Mechanical damage 009473 Aak mmm f Gold wire broken By very soft Silicone type Encapsulant Gold wire is covered so touching this area or handling on it is prohibited Revision 4 FEB 2007 1 Understanding of CSP type package 4 Main CSP failure mode FBGA Type 4 PKG Broken caused by mechanical damage gir l an e Because of slight package weight it is easy to escape from package tray e Becare of tray handling Move it on tray bended One by One Handling No Manual Handling process 1 Understanding of CSP type package en
9. amp cause in mounting process tams enad 5 Solder joint reliability 2 LI Phenomenon LI Defect cause Revision 4 FEB 2007 Component side oe TI eN PCB side Solder ball Solder paste No amp Insufficient solder paste PCB bow during on PCB solder ball land SMT re flow Package warpage Solder ball cutted Page 39 3 Defect mode amp cause in mounting process eq Lu Recommending Set up the auto inspection system for check paste volume before component loading step on the PCB e Optimize the the re flow temperature for surface mounting PCB bow e IQC Component warpage within 4mil ball cutting within 30 of height e Check the contamination of the solder ball and solder ball land Revision 4 FEB 2007 Page 40 3 Defect mode amp cause in mounting process PSAMSUNGg 5 Solder joint reliability 3 LI Phenomenon component Fig 2 Fig 3 Fig 4 Fig 3 fracture surface of ball on the PCB side The fracture surface become shine by the re flow heat Fig 4 fracture surface of ball on the component side The fracture surface become shine by the re flow heat Revision 4 FEB 2007 Page 41 3 Defect mode amp cause in mounting process ayg r LI Defect cause e Void in side solder ball that occurred by out gassing from flux of the solder paste in the surface mounting process e Void Generation Mechanism KD maa hd Step 2 Du
10. ds when inserting or pulling CSP into or from tray A single CSP must be handled one by one e Be sure to put on the wrist strap Tray containing CSP is susceptible to damage with a slight shock and the secondary damage by dislocation inside tray is possible e One by One Handling CSP dislocated inside tray must be moved to its proper position with using vacuum pad e Loading of tray with CSP dislocated inside tray can cause CSP crack Revision 4 FEB 2007 Page 13 2 General Handling method eqn 3 Tray Type Handling Guidelines pie Tesan when you handle a tray must check 4 side stacked tray when you moves stacked tray you must benidng it minmun 2 side or cross bending Revision 4 FEB 2007 Page 14 2 General Handling method eqn 4 Mounting Process module PCB eme esenem e When jamming occurs in the conveyor belt feeding CSP those CSP must be stored in tray handling it one by one with vacuum pad e Be sure to put on the wrist strap e f jig loading PCB is kept between equipments during 2nd surface printing process CSP bumps against equipment thereby causing WBGA crack e One by One Handling f assembled PCBs are handled in an overlapping way many WBGA cracks might occur Never handle assembled products in an overlapping way e One by One Handling Revision 4 FEB 2007 Page 15 2 General Handling method PSAMSUNGg 4 Mou
11. ecycle Tray is dragged on the floor tray may be tripped on the floor which causes CSP crack Page 22 2 General Handling method en 5 Memory Module Handling Guidelines Proper Handling mare e Anti ESD Strap or ESD safe work mat should be applied Memory module should be picked up from packing tray only one by one Please hold it gently with two hands Revision 4 FEB 2007 Page 23 2 General Handling method PSAMSUNGg 5 Memory Module Handling Guidelines Proper Handling eae e Place a memory module gently on the socket in both hands a t Li mi a yy er oy i 11 p m ji Bin amili e Press both top sides of PCB as left thumb separately Insert one top side of PCB and then insert the other side ex D gt Q or Revision 4 FEB 2007 Page 24 2 General Handling method o GE 5 Memory Module Handling Guidelines Wrong Handling ae Be eri O e Do not stack two or more memory modules eDo not grasp two or more memory modules at one time Revision 4 FEB 2007 Page 25 2 General Handling method en 5 Memory Module Handling Guidelines Proper Handling mare ase e Donotdrop memory modules to the floor e Handling memory modules near to tool jig is prohibited because Rigid Metals can give memory modules damage Revision 4 FEB 2007 Page 26 2 General Handling method GE 5 Memory Module
12. ir reball method process Page 34 5 Solder joint reliability Page 35 44 4 Inspection criteria 1 Marking Area Page 45 2 Solder Ball Area Page 45 47 3 External area Page 48 49 Revision 4 FEB 2007 1 Understanding of CSP type package en 1 Structure comparison between Conventional and CSP e CSP type component is very brittle and fragile because of it s characteristics That s why a special attention must be paid to machine jamming and handling before assembled in PCB board and during progress e CSP WBGA has no EMC mold protection because of it s size and speed issue so if it is bumped dropped or handled carelessly Mostly function failure occurs SO special caution must be taken except FRBGA TBGA BOC Substrate PCB amp PI Tape Solder ball Gog Wire ENCAP EMC mold protect Gold wire Gold Wire Subsirate BOC E Substrate PCB Gold Wire EMC mold protect Lead frame Die attach adhesive z Solder ball Gold Wi ENCAP Conventional i WEGA 1 Solder ball Substrate PCB package FBGA Chip scale package Revision 4 FEB 2007 1 Understanding of CSP type package en 2 Bending Test comparison between conventional and CSP e Test method Force gth Force speed 0 25mm min Len 4 CSP Conventional type Package Breakdown a kgf Length mm Breakdown point kgf 54WBGA 64M SDRAM 512M DDR2 54TSOP2 See 256M GDDR3 0 23 CHI
13. ken of the component Revision 4 FEB 2007 Page 33 3 Defect mode amp cause in mounting process 4 Repair reball method process Vacuum tool height optimize Chip support jig NO CONTACT JIG Dressing cleaning Chip crack Solder lon Side chi max peak temp 220 C cama lim thermal g i i a re eee No touch on encap basa reka Gold wire Do cleaning by manual Detached Dressing Cleaning damaged prohibit ultrasonic IC Dry cleaning Ball J Tape scratch Don t push the over mounting Cu patter force on solder ion joo Vacuum Tool Ea Revision 4 FEB 2007 Page 34 3 Defect mode amp cause in mounting process PSAMSUNGg 5 Solder joint reliability 1 LU Phenomenon Fig 1 2 Solder joint crack of the component side after surface mounting solder joint crack are happened in the side ball of the component e Fig 3 Magnification the solder joint crack line fig2 after etching with chemical Fig 4 EDX spectrum of IMC table 1 IMC composition amp thickness data Table 1 AEE RE ag PAE a aR ey e e ye pi ye rp Revision 4 FEB 2007 Page 35 3 Defect mode amp cause in mounting process en LI Defect cause e OSP s organic solder ability preservative pad design does not have any Cu diffusion barrier so during the re flow cu in PCB land diffuses to component s solder ball land and make Cu rich IMC Ni Cu Sn This Cu rich IMC maker so
14. lder joint crack therefore crack easily occures by mechanical stress Ni rich IMC NisSn NixCuySnz IMC we r gt Cu Diffusion theory Cu diffuses very fast when it is A A sl we la tee melted with solder Sn Pb on the high temperature adhere to the Ni rich IMC n prevent its outside diffusible speed is more about 10 100 times ARNOM GOWIN ANG SPANG Gr HU TEN than inside speed IMC Cu content in solder and reflow condition should be closely controlled Revision 4 FEB 2007 3 Defect mode amp cause in mounting process LI Fracture mode of pull test comparison between osp and Ni Au Cu plating PCB component PCB OSP type 1 98 1 0 Ni Au Cu 1 1 19 23 plating type Lu Recommending e PCB Solder ball land type Non Solder Mask Defined NSMD Ni Au Cu Plating e Plating thickness Ni over 3 0um Au over 0 25 um Plating method electronic plating e PCB land diameter with 1 1 ratio to the component land e Caution If the using OSP type PCB Rework or repair thermal stress Mechanical stress drop push etc Revision 4 FEB 2007 Page 37 3 Defect mode amp cause in mounting process en x Remark e Why happened solder joint crack in the side ball of the component e Cause Side ball of the package are take a more stressed than center ball it is verified by the simulation Damage point with mechanical stress Revision 4 FEB 2007 3 Defect mode
15. loor might causes CSP broken or chip crack failures e Reel packing should not be distorted during Un Reel CSP may be out of the reel pockets It may causes the chip mounting M C error CSP may be damaged Revision 4 FEB 2007 Page 10 2 General Handling method 2 Reel Type Handling Guidelines MM Description Tools or other things should not be on the reel Otherwise CSP may be damaged If tape hole is damaged Chip mounting M C will have error e Be careful not CSP to be distorted from the reel pockets during peeling the cover tape from carrier tape Recommending cover tape peeling angle is more than 120 e When storing the some used reel packing reel at least 50cm vacant pocket to protect CSP Revision 4 FEB 2007 2 General Handling method 3 Tray Type Handling Guidelines Description e During CSP handling use of metallic material especially tweezers is prohibited e A single CSP must be handled one by one e Be sure to put on the wrist strap e Be sure to use vacuum pad in CSP handling e One by One handling Keep CSP at a designated location Tray and do not deposit a number of CSP in an overlapping way e Holding or storing CSP in an overlapping way is prohibited Revision 4 FEB 2007 Page 12 2 General Handling method en 3 Tray Type Handling Guidelines ame eserle e Be sure to use vacuum pad instead of the han
16. nting Process module PCB ee f assembled PCB falls on the floor CSP crack occur 100 f some PCBs fall on the floor scope inspection over all fallen PCBs shall be performed CSP crack defect shall be screened 100 and then subsequent process shall flow e Be sure to handle it one by one e f failure occurs during 2nd surface printing process and 1st surface part with CSP is placed on the equipment bottom CSP crack will occur f product causes failure during printing process be sure to insert it into Cleaning Jig to clean it e This is Cleaning Jig insertion status of the modules e failed in the printing process such products should be moved also in Jig status after cleaning e Holding or storing PCB in an overlapping way is prohibited Revision 4 FEB 2007 Page 16 2 General Handling method 4 Mounting Process module PCB Revision 4 FEB 2007 eUse of metallic material especially Tweezers in CSP Handling is prohibited A single CSP product must be handled one by one e Be sure to put on the wrist strap Avoid handling PCBs in an overlapping way when performing visual inspection and never leave modules on the floor e PCBs must be handled one by one e When printing process causes PCB failures store PCBs in Cleaning Jig if Cleaning Jig is not available keep CSP attached Surface from facing the floor Locating PCBs on the floor is prohibited Page 17
17. ring the re flow voids can xe be generated in the ball of the w component by the volatilization of the 0 some flux of the paste Step 1 There is no solder joint void in component and fracture surface is rough which is normal Revision 4 FEB 2007 Page 42 Step 3 As the re flow temperature increase the size of voids are getting bigger by combine small voids And voids move to the side of the component Step 4 The size of void is maximized at the peak temp of the re flow And solder ball can be taken off by the pushing force of gas The fracture surface become shine by the re flow heat Revision 4 FEB 2007 Page 43 3 Defect mode amp cause in mounting process en Lu Recommending e Re Flow Profile Dwell time at pre heating 150 175 C 60 100sec Peak Temp The better low temperature MAX 220 C dwell time at over 200 C 30 50sec Profile Condition should be closely controlled e Solder paste Paste volume The better the lower x Re flow condition should be optimized by the design of experience because of difference the component type PCB type and atmosphere of re flow process x The re flow profile sharp that the recommended by SEC is tent type Revision 4 FEB 2007 Page 44 4 Visual Inspection Criteria LI 1 Marking Area Marking oo Typography Cutting Reject if marking Typography has been cutting LI 2 Solder Ball Area g
18. t FBGA BOC Reject if Solder ball coplanarity exceeds below criteria Coplanarity gt TBGA Max 3mil 75um gt FC BGA HBGA Max 6mil 150um gt U LGA Max 4 Omil 100um gt WBGA Max 4Mil 100um Revision 4 FEB 2007 Page 45 4 Visual Inspection Criteria LI 2 Solder Ball Area e Reject if Solder ball Misplacement exceeds below criteria FBGA BOC 2 2 1 2 7mm O Amil 4 125um Solder Bal ami MCP TBGA WBGA Max 3 mil 75um U LGA Max 80um FC BGA Max 8mil 200um 2 3 e Reject if Solder Ball is fused or connected Double Ball with adjacent Balls It is a defect e REJECT if solder Ball is Missing or incompletely 2 4 fused in such a way as to cause the PCB Ball Pad Missing Ball pattern to be even slightly exposed It is a defect Revision 4 FEB 2007 Page 46 4 Visual Inspection Criteria LI 2 Solder Ball Area 2 5 e Reject if solder ball cut or crushed over 30 cause ni ali Damaged Ball Solde the mechnical damage e Conduction Material 2 6 Reject for foreign greater then 2 between ball and g ball Pe betes a I Non conduction material Reject if The others Foreign Materials short the ball area between ball to ball and size of foreign material exceeds ball pitch Reject if Spots size exceeds 2 of PCB Size solder Ball Area Revision 4 FEB 2007 Page 47 4 Visual Inspection Criteria LI 3
19. ust follow Auto Process loading unloading in process of various equipment e f manual operation should be performed inevitably it must be stored in a safe place Revision 4 FEB 2007 Page 20 2 General Handling method en 4 Mounting Process module PCB Revision 4 FEB 2007 e When PCBs move QC X Ray Inspection Monitor etc be sure to use the dedicated Jig and it is prohibited to move Jig in an overlapping way e RIMM products must be handled one by one When monitor or QC is performed in unloading stage it is required to monitor in Jig status not a single module status One by One Handling e When operators take out Jig from Rail to perform monitor or QC in unloading stage ensure that CSP don t bump against the equipment e Holding or storing CSP in an overlapping is prohibited Page 21 2 General Handling method PSAMSUNGg 4 Mounting Process module PCB Revision 4 FEB 2007 This show the way PCBs are dropped on the equipment due to jamming in the equipment rail first minimize the equipment trouble and if PCBs fall on the floor 100 inspection by scope must be performed to screen failures e Minimize equipment trouble when loading PCBs on Recycle Tray in Unloading stage if loading mistake is occurred place the products in their proper location and then next process shall flow e Dragging the loaded Recycle Tray on the floor is prohibited e f the loaded R

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