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1. freq GHz CUS SEY February 6 2014 Page 6 14 Document Ref isp_ble_DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si BLE MODULE insight 3p ISP130301 Radiation Pattern in 3 planes Module mounted on a USB dongle ground plane gain dBi 2 45GHz gain dBi 2 45GHz Ground Plane Effect Simulation gt E A USB dongle Cell phone config 1 Cell phone config 1 with ground plane ground plane side ground plane size 18 x 30 mm size 40 x 100 mm size 40 x 100 mm February 6 2014 Page 7 14 Document Ref isp ble DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si BLE MODULE nagata ISP130301 Cell phone config 2 with Cell phone config 3 with side ground plane side ground plane size 40 x 100 mm size 40 x 100 mm Cell phone config 1 with side ground plane Return loss dB Ce
2. Segger J Link Lite downloadable for free from http www segger com jlink software html S100 nRF51822 SoftDevice fully qualified Bluetooth low energy stacks for nRF51822 integrated in ISP130301 module The S100 series of SoftDevices object code no source can be downloaded from www nordicsemi com after purchasing ISP130301 DK1 nRF51 Software Development Kit SDK nRF51 SDK can be downloaded from www nordicsemi com after purchasing ISP130301 DK1 It contains example of source codes applications C language Precompiled HEX files Source code Keil ARM project files ns February 6 2014 Page 9 14 Document Ref isp_ble_DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si BLE MODULE Insight st ISP130301 4 Mechanical Outlines Mechanical Dimensions Dimensional drawing for 8 x 11 x 1 2 mm 57 Pad LGA Package 0 3mm PIN 1 INDICATOR C 0 3 mm 0 275 mm 0 65 mm 11 mm 0 4mm 1 0mm 0 4mm 1 2mm a a SEY February 6 2014 Page 10 14 Document Ref isp ble DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information co
3. schematic showing ISP130301 module connections antenna Anti OUT_MOD _ OUT_ANT le te io L3 AVDD c8 D ae vale 7 G9 C Ao ow t oo ree 2 Ww Q N D D Ww rd Cc ty u32 3222 7 FERETE 3 pa bee a ca ba ba bab aacaaaca y aaaea 81D 312 21215 3 T i zs wW 2 2 2 2 2 2343 33 3 a 8 3 8 5 5 3 5 L L 2 E g pi g gt a z N 3 gt be KP Be t agg siup 3 February 6 2014 Page 5 14 Document Ref isp_ble_DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si BLE MODULE insignt Sif ISP130301 2 RF Performances RF Specifications according to standards Parameter BT V4 Value Std limit Unit Condition Better than Channels np Level for BER Channels 0 to 39 height Typical Antenna Return Loss Module mounted on a USB dongle ground plane 9 1 0 mM O 12 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0
4. Insight SiP It s all in the package BLE MODULE ISP130301 ISP130301 Bluetooth Low Energy Module with Integrated Antenna Key Features Single Mode BLE v4 0 Slave or Master Proprietary 2 4 GHz protocols Based on Nordic Semiconductor nRF51 family 2 4GHz low energy RF Transceiver 32bit ARM Cortex MO CPU with 256kB Flash Analog and Digital peripherals Ultra Low Power Consumption Single 2 1 to 3 6 V supply Very small size 8 0 x 11 0 x 1 2 mm 4 Temperature 25 to 75 C Fully integrated RF matching and Antenna Integrated 16 MHz and 32 768 kHz Clocks Certifications FCC certification pending CE certification pending IC certification pending Bluetooth SIG certified RoHS compliant Storage j inductor amp I Aiai ADC x 8 Caps RA SPI x2 SPI SWD Interface I2C x2 2c GPIO UART Clocks Cortex RF Antenna Balun RF matching nRF51xxx Applications Space constrained BLE Slave Devices Sport and fitness sensors Health care sensors Out of Range OOR sensors Personal User Interface Devices PUID Remote controls General Description This module is based on nRF51822 Nordic Semiconductor 2 4GHz wireless System on Chip SoC integrating a 2 4 GHz transceiver a 32 bit ARM Cortex MO CPU a flash memory and analog and digital peripherals It can support BLE and a range of proprietary 2 4 GHz protocols such as Gazell from Nordic Semicond
5. SiP BLE MODULE aig ISP1303001 6 Packaging amp Storage Package marking S Pf BOBOM YY ww ISP130301C VYWW 5mm max CE FE IC ISP130301 Product number Two digit year number Two digit week number Moisture Sensitivity All plastic packages absorb moisture During typical solder reflow operations when SMDs are mounted onto a PCB the entire PCB and device population are exposed to a rapid change in ambient temperature Any absorbed moisture is quickly turned into superheated steam This sudden change in vapor pressure can cause the package to swell If the pressure exerted exceeds the flexural strength of the plastic mold compound then it is possible to crack the package Even if the package does not crack interfacial delamination can occur Since the device package is sensitive to moisture absorption it is recommended to bake the product before assembly The baking process for dry packing is 24 hours at 125 C as February 6 2014 Page 14 14 Document Ref isp ble DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice
6. d have a label which indicates that it contains our module The label should use wording such as Contains IC XXXXXX ISP130301 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below IC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Le pr sent appareil est conforme aux CNR d industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnement a ns February 6 2014 Page 13 14 Document Ref isp ble DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight
7. d metal pad that is connected to ground The NC pads are 0 8 x 0 8 or 0 4 x 0 4 mm and are to be connected to isolated metal pads on the application PCB for mechanical stability and reliability drop test PTT S SYS February 6 2014 Page 2 14 Document Ref isp ble DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE ASST k ISP130301 Pi Pin function i Description 6 NC NotConnected_ Isolated pad on application PCB for mechanical stability 8 NC NotConnected_ Isolated pad on application PCB for mechanical stability 9 P017 Digitall O General purpose I O pin S O This pin is the RF I O pin of the BLE module It should be connected to Pin 26 OUT_ANT for normal operation During certification the pin may be connected via to an RF connector for module measurement using a Bluetooth test setup This pin is connected to the internal antenna It should be connected to Pin 24 OUT MOD for normal operation During certification the pin may be connected to an RF connector for antenna measurement Power supply 2 1 3 6V VDD in nRF51822 doc System reset active low Also HW debug and flash nRESET progra
8. ll phone config 1 ground plane Cell phone config 2 with side ground plane Cell phone config 3 with side ground plane USB dongle ground plane freq GHz a cs February 6 2014 Page 8 14 Document Ref isp_ble_DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE es ISP1303001 3 Product Development Tools Interface ISP130301 integrates a full microprocessor interface with up to 32 General Purpose I O pins GPIO and several functions 2 x SPI 2 x 12C UART 8 x ADC SWDIO interface Hardware The following development kit is recommended for using and testing ISP130301 module Insight SiP Development Kit ISP130301 DK1 need to be purchased separately Development Tools and Software The following development tools and software are recommended for using and testing 1SP130301 module Nordic Semiconductor nRFgo Studio downloadable from www nordicsemi com after purchasing ISP130301 DK1 Nordic Semiconductor Master Control Panel downloadable from www nordicsemi com after purchasing ISP130301 DK1 Keil MDK ARM Lite downloadable for free from https www keil com demo eval arm htm
9. mming I O Analog input ADC input 6 February 6 2014 Page 3 14 Document Ref isp_ble_DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si BLE MODULE insight tf ISP130301 Pin NETS Pin function Description 41 PO_06 AIN7 Digital I O General purpose I O pin P Analog input ADC input 7 Analog input ADC Reference voltage Analog input ADC input 4 Analog input ADC input 5 Analog input ADC input 2 PO 31 Digital I O General purpose I O pin Analog input ADC input 3 AREFO Analog input ADC Reference voltage GND_EP Exposed metal pad Should be connected to ground plane on application PCB ISP130301pad placement and pin assignment for the LGA QFN package TOP VIEW February 6 2014 Paae 4 14 Document Ref isp ble DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si BLE MODULE insight 31 ISP130301 Electrical Schematic Electrical
10. ntained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si BLE MODULE insight 3i ISP130301 SMT Assembly Guidelines Recommended PCB Land Pattern and Solder Mask layout y Z v Pa pad Ider _ EAAS 70 425 mm E 0 05 all i E a February 6 2014 Page 11 14 Document Ref isp ble DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si BLE MODULE insight If ISP130301 Antenna Keep Out Zone Recommended metal keep out areas for optimal antenna performance no metal no traces and no components on any layer except mechanical LGA pads 18 0 mm min Metal exclusion zone to edge ae of board no metal on any layer except mechanical LGA pads 4 m z ea board SEERE TILL m TTT NRA TF ELLE TOR VIEW a February 6 2014 Page 12 14 Document Ref isp ble DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The info
11. rmation contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE ata ISP1303001 5 Quality amp User information USA User information This intends to inform how to specify the FCC ID of our module ISP130301 on the product Based on the Public Notice from FCC the host device should have a label which indicates that it contains our module The label should use wording such as Contains FCC ID XXXXX ISP130301 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below FCC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with part 15 of the FCC rules Operation is subject to the following two conditions 1 This device may not cause harmful interference 2 This device must accept any interference received including interference that may cause undesired operation Caution Any Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment CANADA User information This intends to inform how to specify the IC ID of our module ISP130301 on the product According to Canadian standards RSS 210 and RSS Gen the host device shoul
12. uctor Fully qualified BLE stacks for nRF51822 are implemented in the S100 series of SoftDevices which can be freely downloaded 1SP130301 can then be used in Master and Slave modes for BLE and for both ends of other proprietary protocols The ANT protocol can be handled on request The module is specifically designed for both PC peripherals and ultra low power applications such as sports and wellness sensors Ultra low power consumption and advanced power management enables battery lifetimes up to several years on a coin cell battery Even though its very small size 8x11x1 2mm the module integrates decoupling capacitors 16 MHz and 32 kHz crystals load capacitors DC DC converter RF matching circuit and antenna in addition to the wireless SoC The module forms a standalone BLE node for which only the addition of a suitable DC power source is necessary for proximity or Out of Range applications Sensor applications require only the further addition of the appropriate sensors As the module has several end applications the antenna was designed to be compatible with several ground plane sizes such as USB dongle or cell phone February 6 2014 Page 1 14 Document Ref isp ble DS130301_R4 doc Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
13. without written permission Specification subject to change without notice Insight SiP BLE MODULE aig ISP1303001 Contents fe mi e ee e 9 1e 11 61112 seen ee ene eee ee eee ene ee ee ee eee Page 1 2 ARERO OO E Page 1 6 3 Product Development Tools cccscccccseeeceeeeseeeeeeeeeeseeeeseeeessaeeeseueeesaeeeseeeeseaeeeseeeseaeesseeeesens Page 1 9 4 Mechanical Outline sirsenis iig ii a ai Eia ai Page 1 10 5 Quality amp User INformation ccccccseeccccceseeceeceeeeeeeseeeeeeeecaeeeeesseaeeeesaeaueeesseaueeessaeeeeesaageeees Page 1 13 Bil AGI ACIUING eFC Scr cece cpea sitet Grease E E E E EA E EE E E S Page 1 14 1 Electrical Specifications Electrical Performance The specifications of the module follow those of the nRF51822 The following high level parameters are given for the module The operating temperature range is 25 to 75 C with the following performances Parameter VEUT Supply voltage Supply Voltage Current consumption Static levels Peak current receiver active supply at 2 1V Peak current transmitter active 4 dBm Output Power Peak current transmitter active 0 dBm Output Power Current drain connection less state Current drain between connection events Pin Assignment The module uses an LGA format with a double row of pads on a 0 65 mm pitch The pad layout follows the QFN Jedec standard for 2 row LGA parts Pads 1 thru 56 are signal pins 0 4 x 0 4 mm Pad 57 is an expose

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