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1. Parameter Test condition comment Min Typ Max Unit Voltage supply 0 3 4 0 V Vin for 5 V tolerant pins 0 3 5 5 V Vin for all other pins s 0 3 2 8 V Table 2 Operating conditions and input power specifications Parameter Test condition comment Min Typ Max Unit Operating temperature range Industrial 40 85 C Input supply voltage 3 3 V supply input 3 1 3 3 3 6 V Corresponds to have both the Standby micro and the radio in standby 5 uA power states Corresponds to have the micro Sleep in stop power state and the radio lt 1 mA in sleep power state 3 3 V Corresponds to have the micro supply Power state active and the radio in sleep 15 mA power state Idle Radio is deactivated 13 mA Not connected Scanning Cycle average 25 mA Connected RX idle Correspond to have active both 80 mA or active the processor and the radio Connected TX active Refer to 18 dBm output power 250 2 mA 1 Typical results are at room temperature only 2 Max values are in the range of 400 mA and depend on operating conditions DoclD025635 Rev 3 3 16 Digital interface specifications SPWF01SA SPWF01SC 3 Digital interface specifications Table 3 Digital interface specifications I O pins Parameter Test condition comment Min Typ Max Unit VIH 1 4 V Inputs VIL 0 6 V VOH IOH 4 mA 1 8 V Outputs VOL IOL 4 mA 0 4 V Programmable 80 1
2. lt T SPWF01SA Sf i life augmented SPWFO01 SC Serial to Wi Fi b g n intelligent modules Datasheet production data e Multiple antenna options Integrated antenna SPWF01SA xy versions Integrated U FI connector SGPWF01SC xy versions e Industrial operating temperature range e FCC CE IC certified e RoHS compliant e Surface mount PCB module SPWFO1SA 11 Applications e Smart appliances e Industrial control and data acquisition e Home automation and security systems e Wireless sensors e Cable replacement e Medical equipment e Machine to machine communication SPWF01SC 11 Features e 2 4 GHz IEEE 802 11 b g n transceiver e STM32 ARM Cortex M3 e Multiple Integrated Flash memory options 1 5 MB SPWF01Sx 1y orderable parts 512 kB SPWF01Sx 2y orderable parts e 64KB RAM memory e 32 kHz XTAL to support low power modes e 16 GPIOs serial port UART SPI 12C interfaces available e Small form factor 26 92 x 15 24 x 2 35 mm e Upto 18 dBm output power e Single voltage supply 3 3 V typ April 2014 DoclD025635 Rev 3 1 16 This is information on a product in full production www st com Description SPWF01SA SPWF01SC 1 Description The SPWF01SA and the SPWF01SC intelligent Wi Fi modules represent a plug and play and standalone 802 11 b g n solution for easy integration of wireless Internet connectivity features into existing or new products Configured
3. OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN A SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS B AERONAUTIC APPLICATIONS C AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS AND OR D AEROSPACE APPLICATIONS OR ENVIRONMENTS WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE THE PURCHASER SHALL USE PRODUCTS AT PURCHASER S SOLE RISK EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR AUTOMOTIVE AUTOMOTIVE SAFETY OR MEDICAL INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS PRODUCTS FORMALLY ESCC QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY Resale of ST products with provisions different from the statements and or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever any liability of ST ST and the ST logo are trademarks or registered trademarks of ST in various countries Information in this document supersedes and replaces all information previously supplied The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners 2014
4. general purpose input output General purpose input output Input pull down and 5V 1 SPI MISO Plo ue i Restore to factory tolerant settings GPIO 1 O 17 General purpose SPI MOSI Input pull down and 5V input output tolerant GPIO 2 1 O 19 Cenaa areal SPI Chip Select Floating and 5V tolerant input output General purpose Input pull down and 5V GPIO 3 O 1 input output SPI Clock alert General purpose input output Input pull down and 5V 22 ADC 0 GPIO 6 O Wake Up Sleep tolerant Inhibit General purpose UARTS Receive data GPIO 4 I O 1g input output input 4 General purpose UARTS3 Transmit data GPIO S VO 20 input output output General purpose GPIO 7 1 0 13 input output ADC 1 STA Mini AP switch G i UART2 Transmit data GPIO 8 O 4 w o output 4 Pee ADC2 G UART2 Receive data GPIO 9 O 7 pp input 4 PSESE ADC3 GPIO 11 VO 11 12C SCL General purpose GPIO 12 1 0 12 input output 12C SDA GPIO 15 O 21 General purpose DAC input output Monitoring purpose with no alternate function GPIO 10 Vo 5 LED Drive Blinking while run GPIO 13 V0 15 LED a Link 6 16 DoclD025635 Rev 3 ky SPWF01SA SPWF01SC Pinout description GPIO 14 VO 14 LED Drive Power Up UART Pins RXD1 l 8 JARIT Receive data 5V tolerant input TXD1 o 6 UART1 Transmit data 5V Tolerant output CTS1_DN l 9 SARTI ae een Active Low 5V Tolerant RTS1_DP O 10 MARIT Request to Active Low 5V tolerant send output Reset
5. Active low for 5 ms with RESETn l 3 Reset input pull up to 2 5VDC Not 5V tolerant SUPPLY Pins and paddle Decouple with 10uF 3 3 V 24 Voltage Supply capacitor Ground 23 Ground Add plenty of ground Ground Paddle 25 Ground f uario thermal dissipation and ground return Boot loader BOOTO 2 Boot loader 1 The activation of ALT function depends upon the firmware version or upon the variable configuration To perform the factory reset of the variables pin GPIOO must be high during powerup GPIO function running when low power mode variable is enabled Deprecated starting from the release 3 0 of at full stack Introduced with the release 3 0 of AT Full stack To enable the STAToMiniAP switch the GPIO 7 needs to be put low together with the HW reset a pF oO N 6 To enable the firmware download pin BOOTO needs to be high during power up RESETn need to be pulled low at least 5 ms to initiate the firmware download sequence Application tip As a general rule when commutation issues may occur we suggest to use a level translator to match the I O pins voltage of the connected 4 DoclD025635 Rev 3 7 16 Module reflow SPWF01SA SPWF01SC 6 8 16 Module reflow The SPWF01SA and SPWF01SC are surface mount modules with a 6 layer PCB The recommended final assembly reflow profiles are indicated below The soldering phase must be executed with care in order to prevent an undesired melting phenomen
6. around a single chip 802 11 transceiver with integrated PA and an STM32 32 bit microcontroller with an extensive GPIO suite the modules also incorporate timing clocks and voltage regulators Two different options exist based on the integrated Flash memory The SPWF01Sx 2y orderable parts integrate 1 5 MB of Flash while The SPWF01Sx 2y orderable parts integrate 512 kB of Flash The module is available either configured with an embedded micro 2 45 GHz ISM band antenna SPWF01SA or with an u FL connector for external antenna connection SPWF01SC With low power consumption and small form factor the modules are ideal for fixed and mobile wireless applications as well as challenging battery operated applications The SPWF01Sx y1 orderable parts are released with an integrated full featured TCP IP protocol stack with added web server and additional application service capabilities The SW package also includes an AT command layer interface for user friendly access to the stack functionalities via the UART serial port Figure 1 Block diagram 3 3 V 3 3 V Supply Supply CW1100 CW1100 UART b g n SP1 12C bgm SP1 12C GPIOs gt ers GPIOs lt 2 Laon Flash 1MB SPWF01Sx 1y SPWF01Sx 2y 3 2 16 DoclD025635 Rev 3 SPWF01SA SPWF01SC General electrical specifications 2 General electrical specifications Table 1 Absolute maximum ratings
7. 20 kQ pull up or down When turned on resistor 4 16 DoclD025635 Rev 3 Kys SPWF01SA SPWF01SC RF characteristics 4 RF characteristics Table 4 RF characteristics Parameter Test condition comment Min Typ Max Unit 11b 1 Mbps 96 dBm 11b 2 Mbps 93 dBm 11b 5 5 Mbps 91 dBm 11b 11 Mbps 87 dBm 11g 9 Mbps 89 5 dBm 11g 18 Mbps 86 dBm RX Sensitivity 11g 36 Mbps 80 dBm 11g 54 Mbps 74 5 dBm 11n MCS1 13 Mbps 86 5 dBm 11n MCS3 26 Mbps 81 5 dBm 11n MCS5 52 Mbps 74 dBm 11n MCS7 65 Mbps 71 dBm Paok CH1 to 14 11g 54 Mbps 10 PER 1 dB Maximum input signal CH7 11g 54 Mbps 20 dBm 11Mbps 38 dBc 9 Mbps 20 dBc Adjacent channel rejection 54 Mbps 4 dBc MCS1 24 dBc MCS7 3 dBc 11b 1 Mbps 18 3 dBm jib 11 Mbps 802 11b spectral mask aa ce euiguesewer 11g 9 Mbps 802 11g spectral mask 18 3 dBm 11g 54Mbps EVM 27caB 4 5 13 7 dBm 11in MCS1 802 11n spectral mask 18 3 dBm 11n MCS7 EVM 27 dB 13 5 dBm On board antenna gain Average 1 2 dBi External antenna gain a 2 8 dBi 1 Output power and sensitivities are measured with a 50 Q connection at the antenna port DoclD025635 Rev 3 5 16 Pinout description SPWF01SA SPWF01SC 5 Pinout description SIGNAL Name Type i Main function Alternate functions Notes Number GPIO
8. 4mm pe lolerances 0 025mm BOTTOM VIEW An antenna area of 217 x 520 mils must be free of any ground metalization or traces under the unit The area extending away from the antenna should be free from metal on the PCB and housing to meet expected performance levels Pin 25 is the required paddle ground and is not shown in this diagram DoclD025635 Rev 3 ky SPWF01SA SPWF01SC Package mechanical data Figure 7 Wi Fi footprint 1 524 F 13 ee a 26 a co 25 y 30 12 F oll er 1x185 47 RECOMMENDED LAND PATTERN TOP VIEW PCB design requires a detailed review of the center exposed pad This pad requires good thermal conductivity Soldering coverage should be maximized and checked via x ray for proper design There is a trade off between providing enough soldering for conductivity and applying too much which allows the module to float on the paddle creating reliability issues ST recommends two approaches a large center via that allows excess solder to flow down into the host PCB with smaller vias around it or many smaller vias with just enough space f
9. STMicroelectronics All rights reserved STMicroelectronics group of companies Australia Belgium Brazil Canada China Czech Republic Finland France Germany Hong Kong India Israel Italy Japan Malaysia Malta Morocco Philippines Singapore Spain Sweden Switzerland United Kingdom United States of America www st com 16 16 DoclD025635 Rev 3 ky
10. ase Read Carefully Information in this document is provided solely in connection with ST products STMicroelectronics NV and its subsidiaries ST reserve the right to make changes corrections modifications or improvements to this document and the products and services described herein at any time without notice All ST products are sold pursuant to ST s terms and conditions of sale Purchasers are solely responsible for the choice selection and use of the ST products and services described herein and ST assumes no liability whatsoever relating to the choice selection or use of the ST products and services described herein No license express or implied by estoppel or otherwise to any intellectual property rights is granted under this document If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY FITNESS FOR A PARTICULAR PURPOSE AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION
11. on particular attention must be paid to the setup of the peak temperature The following are some suggestions for the temperature profile based on the IPC JEDEC J STD 020C July 2004 recommendations Table 5 Soldering values Profile feature PB free assembly Average ramp up rate Tsmax to Tp 3 C sec max Preheat Temperature min T min 150 C Temperature max T max 200 C Time T min to T max ts 60 100 sec scare 217 emp L 60 70 sec Time TL Peak temperature Tp 240 0 C Time within 5 C of actual peak temperature Tp 10 20 sec Ramp down rate 6 C sec Time from 25 C to peak temperature 8 minutes max Figure 2 Soldering profile P 5 Critical Zone T toT LoT Temperature gt mM _ 25 C to Peak Time gt AM17477v1 DoclD025635 Rev 3 ky SPWF01SA SPWF01SC Regulatory compliance 7 Regulatory compliance RF compliance The RF certifications obtained are described in Table 6 below Table 6 RF certification summary Comment FCC ID VRA SG9011203 On board antenna and external SG901 1066 with connector version IC ID 7420A SG9011203 On board antenna and external SG901 1066 with connector version ETSI Compliant Approved with on board antenna and connector version Note The SG901 1066 from Sagrad Inc is the only approved antenna using the UFL connector version FCC and IC This module has been tested and f
12. or the viscosity of the chosen solder flux to allow some solder to flow into the smaller vias Either of these approaches must result in 60 or more full contact solder coverage on the paddle after reflow ST strongly encourages PCB layout teams to work with their EMS providers to ensure vias and solder paste designs that will result in satisfactory performance DoclD025635 Rev 3 13 16 Ordering information SPWF01SA SPWF01SC 9 Note 14 16 Ordering information Table 7 Ordering information Order codes Description SPWF01SA 11_ Wi Fi module with integrated antenna 1 5 MB of Flash and Wi Fi full stack SPWF01SC 11_ Wi Fi module with integrated u FL connector 1 5 MB of Flash and Wi Fi full stack SPWF01SA 21_ Wi Fi module with integrated antenna 512 kBytes of Flash and Wi Fi full stack SPWF01SC 21 Wi Fi module with integrated U FI connector 512 kBytes of Flash and Wi Fi full stack Refer to the user manual for a complete list of features and commands available in the Wi Fi full stack 3 DoclD025635 Rev 3 SPWF01SA SPWF01SC Revision history 10 Revision history Table 8 Document revision history Date Revision Changes 05 Dec 2013 1 Initial release 22 Jan 2014 2 Figure 3 has been modified 16 Apr 2014 3 Updated with references to modules with reduced Flash memory DoclD025635 Rev 3 15 16 SPWF01SA SPWF01SC Ple
13. ound to comply with the FCC part 15 and IC RSS 210 rules These limits are designed to provide reasonable protection against harmful interference in approved installations This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference may not occur in a particular installation This device complies with part 15 of the FCC rules Operation is subject to the following two conditions 1 The device must not cause harmful interference and 2 The device must accept any interference received including interference that may cause undesired operation Modifications or changes to this equipment not expressly approved by the party responsible for compliance may render void the user s authority to operate this equipment Modular approval FCC and IC FCC ID VRA SG9011203 IC 7420A SG9011203 In accordance with FCC part 15 the modules SPWF01SA and SPWF01SC are listed above as a modular transmitter device DoclD025635 Rev 3 9 16 Regulatory compliance SPWF01SA SPWF01SC CE 10 16 Labeling instructions When integrating the SPWF01SA and SPWF01Sc into the final product it must be ensured that the FCC labeling requirements specified below are satisfied Based on the Public Notice from FCC the product into which the ST transmitter module is installed mus
14. t display a label referring to the enclosed module The label should use wording like the following Contains Transmitter Module FCC ID VRA SG90112013 IC 7420A SG9011203 Any similar wording that expresses the same meaning may also be used This module complies with the following European EMI EMC and safety directives and standards EN 300 328 V 1 8 1 2012 06 EN 301 489 17 V 2 2 1 2012 09 amp EN301 489 1 V 1 8 1 2008 04 EN60950 1 2006 A1 2010 Figure 3 CE certified 4 DoclD025635 Rev 3 SPWF01SA SPWF01SC Package mechanical data 8 Package mechanical data In order to meet environmental requirements ST offers these devices in different grades of ECOPACK packages depending on their level of environmental compliance ECOPACK specifications grade definitions and product status are available at www st com ECOPACK is an ST trademark Figure 4 Top view of the module shield Shield OOD OG OOO o les CE Logo O O DD A O000O ky DoclD025635 Rev 3 11 16 Package mechanical data SPWF01SA SPWF01SC Note 12 16 Figure 5 Bottom view of the module Data Matrix Board Design Reference FCC and IC IDs Model Series Name Figure 6 Wi Fi dimensions TOP VIEW coni na B st F S ToP vew p e 1 i 1651 pitch 152

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