MG2639_V2 Module Hardware Design User Manual
Contents
1. 12 SABE NDNIDUANERERNERT n 12 SNNT A a 12 3 1 3 SIM CARD ANEREN 12 3 1 4 6 nemen tense re re rennen 13 3 1 5 NETWORK 13 3 2 MODULE POWER CONSUMPITION 0 13 3 3 RELIABILITY 5 6 14 34 ESDCHARACTERISTICS 14 4 INTERFACE CIRCUIT 5 Rau asa IRR IRR IRR IRR RR RR Rana ssa naa 15 4 1 RESET AND POWER DESIGN 15 4 2 UARTINTEBPEAGE oec vet e 17 4 2 1 VARTI INTERPACE r A 18 4 22 UART2 19 4 3 SIM 20 4 4 5520000 oe ctu a a odeuedercvvsuvevedbveveuedeued 20 5 MECHANICAL DIMENSIONS 5 3 2 22 5 1 MODULE S APPEARANCE2. TXD_2V8 TXD_3V3 VDDIO Remarks the module doesn t support USB 4 2 1 UART1 Interface Figure 4 5 UART1 DCE DTE connection relationship MG2639 V2 Application RXD1 TXD TXD1 RXD CTS1 RIS RTS1 CTS DTR1 TE DSR1 DSR DCD1 DCD RINGO RING DCE DTE This document is not allowed to transmit without ZTE 58 18 ZTE CORPORATION All rights reserved Corporation s permission CIE See the definitions of UART1 interface in table 4 3 Table 4 3 UART1 Interface Definitions UART Receive data DTE transmits serial data 8 RTS1 Ready to send DTE informs DCE to send 16 TXD1 Transmit data DTE receives serial data 25 DTR1 I Dataterminalready DTE is ready 9 CTS1 I Clear to send DCE has switched to Rx mode 4 RING Ringtone indication Inform DTE upon a remote call 26 DSR1 Data set ready DCE is ready 10 DCD1 Carrier detection Data link connected 4 2 2 UART2 Interface Figure 4 6 UART2 DCE DTE connection relationship MG2639 V2 Application RXD2 TXD TXD2 RXD DCE DTE See the definitions of UART2 interface in table 4 4 Table 4 4 UART2 Interface Definitions UART Receive data DTE transmits serial data 30 TXD2 Transmit data DTE receives serial data This document is not allowed to transmit wi
3. 3 0V SIM card Vmax 3 15V Vmin 2 9V 1 8V SIM card Vmax 1 9V Vmin 1 71V Compatible with 3 0V 1 8V SIM card 15 UART RXD1 Receive through First group of ports Vitmax 0 25 VDDIO Vinmin 0 75 VDDIO VoLmax 0 1 5 VDDIO Voumin 0 85 VDDIO 16 UART TXD1 Transmit through first group of ports Vitmax 0 25 VDDIO Vinmin 0 75 VDDIO VoLmax 0 1 5 VDDIO Voumin 0 85 VDDIO 17 POWER SYSRST_N Module reset Valid at low level For details please refer to 4 1 Power and reset 18 AUDIO SPK2_P Headset speaker 19 AUDIO SPK1_P Host speaker 20 21 AUDIO AUDIO SPK1_N MIC2_P bell kel feel Kan Host speaker Headset receiver This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved CIE 22 AUDIO MIC1_P Host receiver 23 AUDIO MIC1_N Host receiver Internal pull up valid at 24 POWER PWRKEY_N power on off please refer 4 1 Power and reset Duplexing PIN valid at low level besides the Dataterminal Vitmax 0 25 VDDIO Vinmin DTR signal also used as 0 75 VDDIO the module s wakeup 25 UART DTR1 ready _ WAKEUP Vormax70 15 VDDIO Voumin signal as the module 0 85 VDDIO enters the sleep mode and needs to wake up by the external signal Vitmax 0 25 VDDIO Vinmin 0 75 VDDIO 26 UART DSR1 Data set ready Votmax
4. s main chipset You have to pull down the SYSRST_N signal 500ms when resetting the module 3 1 2 UART MG2639_V2 module provides two serial interfaces UART1 and UART2 The UART1 supports 8 wire serial BUS interface or 4 wire serial BUS interface or 2 wire serial interface while UART2 supports 2 wire serial interface only The module can communicate externally and input the AT commands through the UART interface 3 1 3 SIM Card Interface MG2639_V2 module baseband processor integrates SIM card interface conforming to ISO 7816 3 standard and it s compatible with SIM card with two voltages 1 8V 3 0V and reserves SIM card interface signal on the stamp hole PIN Users should note that SIM card s electrical interface definitions are the same as SIM card socket s definitions Table 3 1 SIM card s electronic signals Classification 14 VSIM o O SIM card voltage 1 8V 3V maximum 11 SIM_RST o O SIM card reset output current 30mA 12 SIM_CLK o SIM card clock 13 SIM DATA SIM card data This document is not allowed to transmit without ZTE 98 12 Hl ZTE CORPORATION All rights reserved Corporation s permission CIE 3 1 4 Audio Interface MG2639_V2 module supports 2CH audio signal inputs outputs These two MIC inputs are coupled in AC domain and the offset voltage is added inside and they should directly connect with the receiver See the audio interface signals in the table below Table 3 2 Audio interface s sig
5. Corporation s permission ZTE CORPORATION All rights reserved 58 23 Ji 5 3 PCB Dimensions See the module s PCB dimensions in figure 5 3 Figure 0 3 Relevant encapsulation dimensions from TOP view 25 00 0 10 This document is not allowed to transmit without ZTE 38 24 Ji QZTE CORPORATION rights reserved Corporation s permission IEF Figure 0 4 Relevant encapsulation dimensions from BOTTOM view 13 22 25 82 Precautions while designing PCB 1 Copper clad and wiring are forbidden on each layer of the PCB at the area below the RF test points 2 For the convenience of testing and maintenance it might be necessary to drill holes on the PCB to expose J TAG test points This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 58 25 Ji
6. PLL Phase Locked Loop PPP Point to point protocol R RAM Random Access Memory RF Radio Frequency ROM Read only Memory RMS Root Mean Square RTC Real Time Clock S SIM Subscriber Identification Module SMS Short Message Service SMT Surface Mount Technology This document is not allowed to transmit without ZTE ZTE CORPORATION All rights reserved Corporation s permission CIE SRAM Static Random Access Memory T TA Terminal adapter TDMA Time Division Multiple Access TE Terminal Equipment also referred it as DTE U UART Universal asynchronous receiver transmitter UIM User Identifier Management USB Universal Serial Bus USIM Universal Subscriber Identity Module VSWR Voltage Standing Wave Ratio Z ZTE ZTE Corporation This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 2 Descriptions of module s external interfaces MG2639 V2 module adopts a 30PIN stamp hole connector for the external connections PIN 28 2 1 Definitions of module s interfaces See the definitions of the 30PIN stamp hole of MG2639 V2 module below Table 2 1 30Pin stamp hole definition No Classification Definition 1 0 Description DC feature Remarks 1 GND GND Ground 2 ANT RF_ANT I O RF antenna plug 3 GND G
7. nnne 22 5 2 MODULE S ASSEMBLY 0 6 6 irse rr ni renis 23 This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved BVE 5 3 PCB DIMENSIONS ott cott eesti 24 This document is not allowed to transmit without ZTE BVE CORPORATION rights reserved Corporation s permission 1 Figures Figure 1 1 Module s application block 7 2 Figure 2 11 shape matching network diagram 9 Figure 5 1 MG2639 V2 appearance diagram nennen nennen nnne 22 Figure 5 2 Module s assembly 23 Figure 5 3 Relevant encapsulation dimensions from TOP 24 Tables Table 1 1 Module s functions nnne nhnnnnnn neis 1 Table 2 1 30Pin stamp hole definition nennen nnns 6 Table 4 1 Voltage characteristics 2 e rrrere tree tree eere ee EVE EE EE EUER EE FE VP FEE VE VER Eve PEU Roa 16 This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved VII I CIE 1 General description of module With 30 PIN stamp hole interface MG2639 V2 module developed by ZTE Corporation is a kind
8. of GSM850 EGSM900 DCS1800 PCS1900 industrial module which can be built in the Set Top Box vehicle mounted terminals and enable users to get access to the Internet wirelessly and send receive Emails browse the web pages download at high speed etc It enables users to get access to the Internet any time in a place where the GSM network is covered It also features in SMS voice call etc and provides highly free and convenient solutions for users in mobile data communication and truly realizes the dream of mobile office This chapter mainly provides a general description of the module including basic functions and logic block diagram 1 1 Introduction of module s functions See the functions of MG2639 V2 module in table 1 1 Table 1 1 Module s functions Integrated Full Duplex UART SMT 500 Antenna Connector Parameter MG2639 V2 General Features Frequency Bands GSM850 EGSM900 DCS1800 PCS1900 Dimensions 30 0x25 0x2 68mm Weight 7g Operating Temperature Range 30 C 70 C Storage Temperature Range 40 C 85 C Performance Operating Voltage Range 3 4V 4 25V Typical 3 8V Standby Current 2mA 75dBm Standard power consumption Talk Current 128mA 75dBm Max Current 300mA 104dBm GSM850 EGSM900 Class 4 2W DCS1800 PCS1900 Class 1 1W Rx Sensitivity 107dBm Interfaces Connector 30Pin Stamp hole Antenna AT commands Data transmission SIM Card In
9. the microphone with the sensitivity lower than 51 5dB since the max gain in MIC2 reaches 51 5dB The level of MIC2 P is about 1 73V Note In order to get better audio effect for users we present the following suggestions 1 During the process of using MG2639 V2 module it s advised to use 100pf amp 33pf capacitance on its external audio path and serially connect with the beads to improve the audio quality 2 Connect TVS tube or pressure sensitive resistance on the audio path approaching the module s interface to prevent the ESD from damaging the module 3 Make sure the use environment and module are well grounded and there is no mutual influence 4 The power ripple supplied to the module is less than 50mV This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 58 21 Ji 5 Mechanical dimensions It introduces the module s mechanical dimensions 5 1 Module s Appearance Diagram Figure 0 1 MG2639_V2 appearance diagram Dimensions LxWxH 30 0x25 0x2 68mm Weight lt 6g This document is not allowed to transmit without ZTE 2211 QZTE CORPORATION All rights reserved Corporation s permission IEF 5 2 Module s Assembly Diagram See the module assembly diagram in figure 5 2 Figure 0 2 Module s assembly diagram 25 00 0 10 10 30 00 0 This document is not allowed to transmit without ZTE
10. the network signal The module is very strict with the requirements on power and GND 1 The filtering must be performed to power and GND and the power ripple must be controlled under 50Mv Do not power any other part in the system because it might affect the RF performance 2 Select the power cables with at least 80mil traces during the layout and keep the integrality of ground line 3 Make sure the Max instantaneous output current is larger than 2A if the Max input current is very high Power on The module is under power off status after it s normally powered on To turn on the module provide a 2s 5s low level pulse to PWRKEY_N pin when the module is OFF If one 1K resistance is connected with PWRKEY_N the module can be turned on after power supply Power off To turn off the module use AT command AT ZPWROFF or provide 2s 5s low level pulse to PWRKEY_N PIN Reset Use the above method to firstly power off and then power on to hard reset the module If the external reset function has to be used low level pulse lasting at least 500ms should be provided to RESET Pin within 2 seconds after the module is turned on Before that the external I O signal must be kept at low level See the reset circuit design in figure 4 1 If SYSRST_N Pin is not used suspend the pin See the module s power on off time sequence in figure 4 3 below Figure 4 3 Power on off time sequence Power off status
11. works at the same time See the audio interface circuit in figure 4 8 Figure 4 8 Audio interface circuit reference design principle diagram This document is not allowed to transmit without ZTE 20 Yi ZTE CORPORATION All rights reserved Corporation s permission 1 Stamp hole Note the capacitance value which is not marked is 33pF Microphone The MIC_N amp MIC_P are both differential interfaces and they can also be used for single ended input It s recommended to use differential method to reduce the noises The MIC_2 interface is only used for single ended input Directly connect to the microphone since two inputs are coupled in AC domain and 1 9V offset voltage is generated Speaker The SPK_P amp SPK_N are both differential interfaces with 32 ohm impedance while the SPK2_P is single ended interface with 32 ohm impedance GSM GPRS module audio interface is designed as below Design of the audio interface on the receiver Select the microphone with the sensitivity lower than 51 5dB since the max gain inside MIC1 reaches 51 5dB The level of MIC1_P is about 1 48V Note if other kind of audio input method is adopted the dynamic range of input signals should be within 0 5V If the dynamic range is lower than 0 5V then the pre amplifier should be added If the dynamic range is higher than 0 5V then network attenuation should be added Design of the audio interface on the earphone Select
12. 0 15 VDDIO Vormin 0 85 VDDIO 27 POWER VDDIO 2 8V output Vmin 2 7V Typical 2 8V powered by external Vmax 2 9V level conversion 28 GND GND Group 3 Receive through b DDIO V inmin 29 UART RXD2 Se group of Voimav 0 15 VDDIO Voumin 0 85 VDDIO Transmit Viimac 0 25 VDDIO Vitimin 30 UART TXD2 through Second DDIO group of ports Votmax 0 1 5 VDDIO Voumin 0 85 VDDIO 2 2 Antenna interface Regarding the antenna of MG2639_V2 module proper measures should be taken to reduce the access loss of effective bands and good shielding should be established between external antenna and RF connector Besides external RF cables should be kept far away from all interference sources such as high speed digital signal or switch power supply According to mobile station standard stationary wave ratio of MG2639_V2 module s antenna should be between 1 1 and 1 5 and input impedance is 50 ohm Different environments may have different requirements on the antenna s gain Generally the larger gain in the band and smaller outside the band the better performance the antenna has Isolation degree among ports must more than 30dB when multi ports antenna is used For example between two different polarized ports on dual polarized antenna two different frequency ports on dual frequency antenna or among four ports on dual polarized dual frequency antenna isolation degree should be more than 30dB MG2639_V2 m
13. 501010 3 0015 60 90 40 05 3 003015 in S T ce al B SECTION 2 020 010 2 3 Antenna interface s RF performance See the antenna interface s RF performance in table 2 2 This document is not allowed to transmit without ZTE 28 10 91 ZTE CORPORATION All rights reserved Corporation s permission CIE Table 2 2 Antenna interface s RF performance Antenna interface s RF Module s uplink Module s downlink Power ER MS gt BTS BTS gt MS performance sensitivity GSM850 824MHz 849MHz 869MHz 894MHz 33 2 lt 107dBm EGSM900 880MHz 915MHz 925MHz 960MHz 332 lt 107dBm DCS1800 1710MHz 1785MHz 1805MHz 1880MHz 302 lt 107dBm PCS1900 1850MHz 1910MHz 1930MHz 1990MHz 30 2 lt 107dBm This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 5 1104 CIE 3 Module s electrical characteristics This chapter mainly introduces the module s electrical characteristics including the level power consumption reliability of module s interfaces 3 1 Descriptions of levels of interface signals It describes the MAX MIN and typical value of the level of module s external interfaces 3 1 4 Reset The reset PIN is pulled up to 2 8V Vmax 2 9V Vmin 2 7V Typical 2 8V through the resistance inside the module The SYSRST_N PIN is used to reset the module
14. CDMA Development Group Coding Scheme CSD Circuit Switched Data CPU Central Processing Unit D DAI Digital Audio interface DAC Digital to Analog Converter DCE Data Communication Equipment This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved FIR CIE DSP Digital Signal Processor DTE Data Terminal Equipment DTMF Dual Tone Multi Frequency DTR Data Terminal Ready E EDGE Enhanced Data Rate for GSM Evolution EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility EMI Electro Magnetic Interference ESD Electronic Static Discharge ETS European Telecommunication Standard F FDMA Frequency Division Multiple Access FR Full Rate G GPRS General Packet Radio Service GSM Global Standard for Mobile Communications H HR Half Rate I IC Integrated Circuit IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union L LCD Liquid Crystal Display LED Light Emitting Diode M MCU Machine Control Unit MMI Man Machine Interface MS Mobile Station MTBF Mean Time Before Failure P PCB Printed Circuit Board PCL Power Control Level PCS Personal Communication System PDU Protocol Data Unit
15. CIE MG2639_V2 Module Hardware Design User Manual Version V1 1 ZTE Corporation All rights reserved PHOBIA TREAT ARF 1 Copyright Statement If you accept this manual of ZTE Corporation it means that you have agreed to the following terms and conditions if you don t agree please stop using this manual The copyright of this manual belongs to ZTE Corporation ZTE Corporation reserves any rights not expressly granted in this manual The contents in this manual are the proprietary information of ZTE Corporation This manual and any image table data or other information contained in this manual may not be reproduced transferred distributed utilized or disclosed without the prior written permission of ZTE Corporation ZTE qx are the registered trademark of ZTE Corporation All other trademarks appeared in this manual are owned by the relevant companies Nothing contained in this manual should be construed as granting by implication estoppel or otherwise any license or right to use any trademarks displayed in this manual without the prior written permission of ZTE Corporation or third party obligee This product conforms to the design requirements of relevant environment protection and personal safety The storage usage and disposal of this product should comply with the product user manual relevant contracts or requirements of laws and regulation in relevant countries ZTE Cor
16. ND Ground Vitmax 0 25 VDDIO Vinmin te VD The voltage varies upon Ring signal Votmax 0 15 VDDIO Vonmin PARE RING O indication 0 85 VDDIO 2 output driver capability is 4mA 5 GND GND Ground Vmin 3 4V Vmax 4 25v 6 POWER VBAT I Work voltage Typical 3 9V Internal pull down Network signal drive at high level For 7 Other RSSI LED d indication P details please refer to 3 1 5 Vitmax 0 25 VDDIO Vinmin 8 UART RTS1 O Ready to send 0 75 VDDIO This document is not allowed to transmit without ZTE 28 6 91 OZTE CORPORATION All rights reserved Corporation s permission CIE VoLmax 0 1 5 VDDIO VoHmin 0 85 VDDIO UART CTS1 Clear to send Vitmax 0 25 VDDIO Vinmin 0 75 VDDIO VoLmax 0 1 5 VDDIO Voumin 0 85 VDDIO 10 UART DCD1 Carrier detection Vitmax 0 25 VDDIO Vinmin 0 75 VDDIO VoLmax 0 1 5 VDDIO Voumin 0 85 VDDIO 11 UART SIM_RST SIM card reset 3 0V SIM card Votmax 0 3 6V Voumin 0 9 VSIM 1 8V SIM card Vormax 0 2 VSIM Voumin 0 9 VSIM 12 UART SIM_CLK SIM card clock 3 0V SIM card Vormax7 0 4 V Voumin 0 9 VSIM 1 8V SIM card VoLmax 0 12 VSIM Voumin 0 9 VSIM 13 SIM SIM_DATA 1 0 SIM card data 3 0V SIM card Vitmax 0 4V Vinmin 0 9 VSIM Vormax7 0 4 V Voumin 0 9 VSIM 1 8V SIM card Vitmax 0 15 VSIM Vinmin VSIM 0 4 VoLmax70 15 VSIM Voumin VSIM 0 4 14 SIM VSIM SIM card voltage
17. Power on sequence Power on status Power off sequence Power off status This document is not allowed to transmit without ZTE 16 Ji ZTE CORPORATION All rights reserved Corporation s permission 1 Table 4 2 Power on off circuit time characteristics ta tb tc ta te 20ms 10ms 3s 3s 6s VDDIO The module has one LDO voltage output pin which can be used to supply external power to the main board The voltage output is available only when the module is on The normal output voltage is 2 8V and the user should absorb the current from this pin as little as possible less than 10m4A Generally it is recommended to use this pin to pull up the chipset PIN as per the requirements of level matching Therefore it s not recommended to use this pin for other purposes Other advice In order to make sure the data is saved safely please don t cut off the power when the module is on It s strongly recommended to add battery or soft switch like the power key on the module 4 2 UART interface MG2639 V2 module provides an integrated full duplex UART1 interface and an accessorial full duplex UART2 interface with the maximal baud rate is 115200bps The external interface adopts 2 8V CMOS level signal which conforms to RS 232 interface protocol The UART1 interface could be used as serial interface for AT commands transmission data service and software upgrade The UART2 interface can be used to debug the
18. applications Note when using the module for overall unit design users should educe UART1 for module s software upgrade MG2639 V2 module s output IO level is 2 8V it needs to transfer the level when connecting with standard 3 3V or 5V logic circuit such as MCU or RS232 drive chip MAX3238 etc Figure 4 3 shows the COM port level transfer circuit The converted signal should connect with MCU or RS232 drive chip directly Common low power switch triode should be applied as the crystal triode shown in Figure 4 3 Please note that the module won t enter sleep mode as RXD is at high level The module s output I O level is 2 8V therefore the level should be converted when it connects with standard 3 3V or 5V logic circuit such as MCU or RS232 drive chip MAX3238 etc Normally a triode is used to realize the level conversion Figure 4 3 shows the level conversion to 3 3V through the serial port The resistance and capacitance in figure 4 3 are just for reference and they need to be recalculated during the design The diode in Figure 4 4 is Schottky diode forward voltage drop is 0 3V If you select other diodes please select one with lower forward voltage drop to make sure RXD_2V8 is below the threshold when inputting low level This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved 171 CIE Figure 4 4 interface reference design diagram VDDIO VCC 3 3V 1K
19. nal definitions Classification No Definition 170 Description Remas MICLN 1 Wostrecetver_ pifferential input MICLP 1 Hostreceiver__ 21 2 1 Single ended input SPKLN 0 Hestspesker pifferential input SPKiP 0 jHostspeaker 18 SPK2P Headset speaker Single ended input 3 1 5 Network Signal Indication RSSI LED drive at high level Power on status LED off Network searching status LED blinks at 3Hz dle status LED blinks at 1Hz Traffic status call data LED blinks at 5Hz The RSSI LED PIN output status is defined according to the software protocol The RSSI LED PIN is common 1 0 port and it s output driving capability is 4mA 3 2 Module Power Consumption It describes the module s power consumption under each status Table 3 3 MG2639 V2 power consumption Status Frequency Rx power MIN Ave MAX Remarks Power off 34uA VBAT 4 2V Idle 1mA Sleep GSM850 208 mA Talk EGSM900 233 mA GSM1800 177 mA GSM1900 172 mA Ae 67mA searching This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION rights reserved R 13 vi CIE 3 3 Reliability Characteristics The module s reliability testing items include High low temperature operation high low temperature storage thermal shock alternating temperature humidity etc The test resul
20. odule provides two kind of external antenna interfaces therefore customers can select reasonably according to the product form to optimize the cost of BOM A ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation s permission 1 Program 1 PIN2 is used as the antenna PIN Pay attention to the following when using it as the antenna s feed PIN 1 The feed connected to PIN2 is 50ohm micro strip or strip line To approach the module put shape or F shape matching network for later tuning Figure 2 11 shape matching network diagram MG2639 V2 2 The RF wires must be kept away from the GND and generally the distance should be 3 times of the width of RF wires 3 It s forbidden to put some interference sources such as DCDC WIFI module around RF wires or RF port Program 2 When using RF plug as the antenna feed disconnect PINZ from the main board and make sure there are some clean areas below or around PIN2 Keep 2mm distance between the surface of PIN2 and GND and drill holes below PIN2 It s not suggested to use the compatible design of PIN2 at the same time when using the RF connector Figure 2 2 Antenna interface diagram This document is not allowed to transmit without ZTE Corporation s permission CORPORATION All rights reserved 58 9 vi 2 Figure 2 3 RF test socket s dimensions 0
21. owed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved CIE Preface Summary This document introduces MG2639_V2 module s product principle diagram PINs hardware interface and module s mechanical design which can instruct the users how to quickly and conveniently design different kinds of wireless terminals based on this type of module Target Readers This document mainly applies to the following engineers System designing engineers Mechanical engineers Hardware engineers Software engineers Test engineers This document is not allowed to transmit without ZTE CORPORATION rights reserved Corporation s permission 1 Contents 1 GENERAL DESCRIPTION OF MODULE j uu ccc cccceceeceeceeceeceeceeseeeeeeeeeeeeseuseuseuseuseeeeeeeeeeseuseues 1 11 INTRODUCTION OEFEMODULEISPUNCTIONS Ime rnm nnne 1 12 MODULE S PRINCIPLE 2 1 3 ETA ETGEN RI Ir cU 3 2 DESCRIPTIONS OF MODULE S EXTERNAL INTERFACES 6 2 4 DEFINITIONS OF MODULE S INTERFACES m 6 2 2 ANTENNA 8 2 3 ANTENNA INTERFACE S 6 10 3 MODULE S ELECTRICAL CHARACTERISTICS 12 3 1 DESCRIPTIONS OF LEVELS OFINTERRACESIGNALS
22. poration keeps the right to modify or improve the product described in the manual without prior notice and meanwhile keeps the right to modify or retract this manual If there is anything ambiguous in this manual please consult ZTE Corporation or its distributor or agent promptly This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION All rights reserved R Version update description Product version Document version Document No Document update descriptions MG2639_V2 V1 1 Released for the first time Writer Document version Date Written by Requested by Approved by 1 1 2012 8 23 Liu Yang Zhu Ying ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation s permission 1 With strong technical force ZTE Corporation can provide CDMA GPRS WCDMA GSM module customers with the following all around technical support 1 Provide complete technical documentation 2 Provide the development board used for R amp D test production after sales etc 3 Provide evaluations and technical diagnosis for principle diagram PCB test scenarios 4 Provide test environment ZTE Corporation provides customers with onsite supports and also you could get supports through telephone website instant messenger E mail etc This document is not all
23. put voltage through the adjustment of R5 and R6 Please refer to the specification of MIC29302 for detailed parameter design Please note that the components in the figure are just for your reference For details please adjust according to the actual circuit Figure 4 1 Power and reset circuit reference design principle diagram Power DIET ual FE VBAT pply MI gt VT1 11 2 4 VD1 SC Bm C3 C4 TVS 100uf 0 1uf R1 15 cues L Baa ee PWRKEY_N SYSRST_N MCU_ON OFF MCU_RESET R3 4 7K Figure 4 2 Power reference circuit E gt IN SHUT 10K _ GND C6 C7 C8 Re ps O 1uF our 100uF C5 L 2 2K p 10uF D1 1K MIC29302 This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION rights reserved 15H CIE Power design MG2639_V2 module is powered by VBAT If the external power cannot be stably started it s recommended to add buffer circuit in the circuit See the module s required voltage characteristics in table 4 1 Table 4 1 Voltage characteristics Classification MIN Typical MAX Input voltage 3 4V 3 8V 4 25V Input current imA 300mA depends on
24. terface Data Features 1 8V 3 0V GPRS Class 10 This document is not allowed to transmit without ZTE Corporation s permission ZTE CORPORATION rights reserved LR CIE Parameter MG2639_V2 Mobile Station Class B Max Downlink 85 6kbps Max Uplink 42 8kbps Internal TCP IP amp UDP Embedded FTP Protocol SMS Support TEXT PDU Mode Pointto point MO MT SMS Cell Broadcast Voice call Vocoders HR FR EFR AMR Echo Cancellation Volume Control DTMF AT Command Set GSM 07 05 GSM 07 07 ZTE Proprietary AT Commands 1 2 Module s principle diagram See the application block diagram of MG2639 V2 in figure 1 1 Figure 1 1 Module s application block diagram This document is not allowed to transmit without ZTE ZTE CORPORATION All rights reserved Corporation s permission 3 IEF MG2639MD Block Diagram RF ANT TX uuo d PA amp Switch JOU M communication AB Control Aay J9MOd 1 3 Abbreviations A ADC Analog Digital Converter AFC Automatic Frequency Control AGC Automatic Gain Control ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASIC Application Specific Integrated Circuit B BER Bit Error Rate BTS Base Transceiver Station C CDMA Code Division Multiple Access CDG
25. thout ZTE Corporation s permission ZTE CORPORATION rights reserved 19K 4 3 SIM card interface MG2639_V2 module supports 1 8V or 3 0V SIM card Refer to figure 4 7 for design Figure 4 7 SIM card circuit reference design diagram FU1 SIM CARD INTERFACE OHM USIM 004 SIM RST SIM_DATA l ex SIM CLK 0 NOTE 1 The SIM card PCB wiring should be laid closely around the module as much as possible 2 The VSIM CLK DATA and RST signals should be enveloped by the ground wires The position of 33pF capacitance should be reserved on CLK DATA and RST signals wiring and the position should be close to the SIM card socket to prevent the interference sources from affecting the SIM card s reading writing 3 Since the ESD components are very close to the SIM card socket it s recommended to add TVS components on 4 CH SIM card signals meanwhile the signal wires need go through TVS component before entering the module s baseband processor during the layout to avoid damaging the module 4 The width of VSIM power wiring should be above 6mil at least recommended to use 8mil 5 The filter capacitance of VSIM power wiring adopts 1uf the value can t be larger than 10uf or smaller than 1uf and then 0 1uf capacitance is added 4 4 Audio interface MG2639_V2 module provides audio input and output interfaces through its PINs There are 2 Speaker interfaces and 2 Microphone interfaces Only one pair I O
26. ts must conform to the industrial requirements See the module s working temperature in the table below Table 3 4 MG2639_V2 module s temperature characteristics Parameters Descriptions MIN MAX Remarks T N ki 30 o ormal working 30 C 75 temperature Make sure there is Ta Limited work Ant 485 C ER obvious decline temperature in the RF performance Ts Module s stora 40 ge 40 C 485 C temperature 3 4 ESD Characteristics See the ESD characteristics at room temperature below Table 3 5 ESD performance Interface Testing items Testing requirements Performance Air discharge 8 kV Nothing unusual Antenna interface Contact discharge 6 kV Nothing unusual Air discharge 8 kV Nothing unusual SIM card interface Contact discharge 6 kV Nothing unusual This document is not allowed to transmit without ZTE B 14 vi ZTE CORPORATION All rights reserved Corporation s permission 1 4 Interface circuit design It provides the reference design circuit of the interface and precautions according to the module s functions 4 1 Reset and power design See the power and reset circuit reference design principle in figure 4 1 Since VD1 is TVS tube you can select appropriate parameters according to the actual selected power supply since VT1 is MOS tube you can select CJ2305 from Changjiang Electronics or DMP2305U 7 from DIODES Refer to figure 4 2 for the design of power circuit Select MIC29302 and adjust the out
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