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1. cannot be used as a GDS Since the review sample can be for all defects you may see empty circles without any defects when the wafer map is in either clustered or unclustered defects state plete lt Wake Pas KIG 255X User s Manual WE Note When you turn Review Sample on regardless of cluster state you can draw circles around all review sample locations Create a Wafer Map Menu Map Data Operations Utility Tools App_setup Configuration Exit Cap Rate Database Operation Figure 8 1 Operations Menu To create a wafer map 1 Select the data set you want to analyze Chapter 8 Wafer Map Analysis 2 From the main menu select Operations then select Analysis Click on the Wafer Map button part of the Analysis Window on the left side of the screen Figure 8 2 Figure 8 2 Operations Menu Produces Analysis Window If there is only one wafer in the data set the Wafer Map window appears Figure 8 3 In this case skip step 3 and go on to step 4 For data sets with more than one wafer select wafers you want to review from the Wafer Map list See Figure 8 3 When you select multiple wafers in the current data set a Wafer List box appears Figure 8 3 8 3 KIG 255X User s Manual Data Operations Utility Tools App_setup Configuration Exit ANALYSIS Pr Wafer Seti Map Water Ust _ eves 1 lot lids 4 inspections 30 wafer scans 9916 defects Lot_ID Wafer_ID Step
2. 54974 9125 09 NONE 9714 68 13 64 L4154974_9125 14 NONE 7768 85 3 72 L4154974_9125 17 NONE 10146 18 2 48 14154974 _9125 17 4106 12 19 84 L4154974_9125 21 NONE 4114 18 4 96 4154974_9125 21 NONE 1779 63 25 41 L4154974_9125 22 NONE 6602 50 2 48 L4154974_9125 24 NONE 3641 59 2 48 L4154974_9125 24 NONE 3694 40 1 24 L4154974_9125 24 NONE 3819 65 3 72 14154974_9125 24 NONE Dies 10 Defs 16 images 0 Figure 8 4 Die Map Pop up Menu and Common Chart Features For more information on options and features common to all charts i e GDS outputting charts chart annotation etc see the sections at the beginning of this chapter titled Pop up Menu Features and Common Chart Features Customizing a Wafer Map To customize the Wafer Map Display 1 Place the cursor over the wafer map you want to customize click the right trackball button select Set Parameters from the pop up menu 2 Standard Color Coding shows unclustered defects as black dots clustered defects as green dots defects with images as red dots 8 8 Chapter 8 Wafer Map Analysis 3 Color Coding by Common Added Removed is available for Wafer Maps which have been through DSA calculation and where only two steps are in the map The three colors in display represent e Defects common to both steps e Defects seen only on the earlier step e Defects seen only on the later step 07 09 96 11 30 AM a kkkkkkkkkkkkk
3. KLA Instruments MEMORANDUM Wafer Inspection Business Unit July 1 1996 TO Distribution FROM Beth Topolovsky SUBJECT KLA 2551 PLC Minutes and Actions Items from the PLC meeting held June 25th Next PLC Tuesdays at 1 30 CASE 3 Meetings Fridays at 9 20 Both held in Nameless Accomplishments e Joel our Tech writer is making great progress with the v4 0 manual Thanks Joel and everyone else in the group for helping out The manual s going to be another best Open Issues The following bullet items are focus areas in the 2552 group These issues are have multiple ramifications with v4 0 release and sustaining efforts of the product e 1400 UPS incompatibility The 1400 power supply code is not a plug and play with the 1200 code Sharon and Lynne have been digging into the problems that branch into code sequencing errors Sun O S problems etc e Printer The HP1600 printer is not working correctly with the 25xx 21xx The issues are to implement either postscript or PLCS printer language each having serious draw backs on speed or print quality Raju the 2552 contractor will be scoping the project e JUNIX SunSoft patches for v4 0 have been in the works for over a year The impediments have been SunSofts lack of prioritization and working solutions The 2552 engr team has received spotty patches that have taken many hours to install and test only to find that the solution isn t viable Sharon and I have successful escalated the attent
4. Toggle the A button to select all wafers or click on Clear to clear all the wafers in the list Click the OK button to display the wafer map If you selected more than one wafer data for all selected wafers will be stacked and displayed in a single wafer map If the wafer results being stacked come from different setups with different die sizes defects will be displayed without die outlines If the wafers are different sizes or some are notched and others are flatted an error message will appear A wafer map cannot be drawn in this case 4 Display the Wafer Map pop up menu by clicking on the right button of the trackball while the cursor is positioned over the wafer map KIA 255X User s Manual 5 Select Next Wafer or Previous Wafer to toggle the display to different maps in the data set The Next Wafer and Previous Wafer commands are only enabled when you are viewing individual wafer maps from a multiple wafer data set These selections are disabled if you are viewing data for more than one wafer on a single wafer map or if you are viewing data for only one wafer 6 classify defects from a single wafer map select Classify in the pop up menu Use GDS to select dice clusters or individual defects and classify 7 To display the wafer list select Wafer List in the Wafer Map pop up menu The Wafer List displays data about current selections in the map You cannot however use the Wafer List to change data displayed in the wa
5. _ID Host defects 1 A6062235 OL DGATE wisdile 34 gt 3 6062235 01 uisd112 ooe A6062235_ Ol BITHAP wisdile lt 68 7 A6062235 02 BITMAP wisdi12 77 10 16062235 03 wisdil2 72 oe 13 _A6062235 04 BITHAP wisdile 97 15 96062235 05 LIDEP wisdll2 lt 1221 6 246 mean defect density UP orientation Reclustering OFF 8 o 5 a 16 AG062235 05 LIETC wisdile 139 gt 19 A6062235 06 LIDEP wisd112 2088 i Step on mene Sree i att orean Cok Batch By step By Lot itype By a me Source rans a Es Ratio Figure 8 3 Wafer Map List Chapter 8 Wafer Map Analysis CJ Sample Select Regions __ Operations Utility Tools App setup Configuration Exit Step Color Legend BITMAP LIETC W LIDEP DGATE Figure 8 4 Wafer Map Select more than one wafer on the list to combine data for several wafers into one map or select a single wafer to view data for each map separately a Select the wafers you want to include in the wafer map by clicking on them in the Wafer Map List box Organize the listing of lot wafer IDs by lot number or process step by clicking on the By Step or By Lot button respectively
6. dice with clustered defects are deleted The same is true for the Classify function Defects which cannot currently be seen on the wafer are also affected by this action b Select Delete in the Wafer Map pop up menu 10 If desired use graphical data selectors to create a more specialized analysis a Select the regions clusters or dice you want to use with the middle button of the trackball To select a single cluster defect or die click once To select more than one click and drag or do maaa You can also use Shift click and drag to 3 b Click on one of the analysis buttofis i in ie lene 2 of the main application window such as Pareto Chart Ifdesired you can further specialize the data by repeating steps 10a b to create a second generation analysis with graphical data selectors 11 Look at Details If desired you can look at details related to your selection Select Details from the pop up window to view the following information e Total defects e Unclustered defects of clusters of defective dice of dice with clusters e Cluster threshold e Minimum cluster size ae ak J 8 7 255X User s Manual Data Analysis Utility Tools App_setup Configuration Exit Def ID DieX DieY Loc X lt um Loc Y um Categ imag Size X um Size Y um Lot Wafer Step 4871 97 8 06 L4154974_9125 26 NONE 6292 47 4 34 L4154974_9125 02 N0NE 9927 36 14 26 L41
7. fer map 8 To view a die map for one of the dice in the wafer map a Click on the desired die with the left button of the trackball to display a die map Figure 8 9 b Select individual defects in the die map by clicking on them in the map or by selecting them in the scrolling list at the bottom of the window review images select Jnage Review from the pop up menu of the Die Map or the Wafer Map Refer to Chapter 8 Storing and Accessing Images for additional details d When you are done viewing defects for the die map click on the Close Window button to close the window To print just the defect list select Output Defect List from the pop up menu f To print just the die map select Output Die Map from the pop up menu 9 To delete dice defects in a region or clusters in a region from the wafer map EF Note Once you delete a die from the wafer map it is permanently deleted from the 255X database a Select toggle switches for Regions Clusters or Die Click with the middle mouse button and drag around the regions of defects clusters or dice to be deleted Alternatively you can click on individual dice defects or clusters with the middle mouse button to select them Or you can choose Select from the wafer map pop up menu Chapter 8 Wafer Map Analysis F If the wafer map is in the Clustered Defects state and you choose Select All from the pop up menu then click on Delete only
8. ion at SunSoft keep your fingers crossed e v3 6 12 v3 6 12 is a patch including multiple fixes and enhancements The patch has taken longer than expected to fix test and document The patch is now scheduled to be released and beta tested at HP and NEC on July 3rd e 2552 sustaining engr manuf I will be writing a proposal for sustaining engr for the 2552 given the transition of engineering staff to the KLArity product e PC Qualification A contractor for qualifying the new PC for the 2552 has be identified and will be ready to start June 24 on a part time basis e Customer feedback LSI and TI both have action items for the respective groups to work through The majority of the issues are poor backups and non responsiveness to bugs seen in the field e V3 6 release to the field v3 6 has been manufacturing released to the field for 4 months and we have not yet completed the distribution to the field Mike Milos and Phil Desjandin are to be working this out e Reliable backups are still not resolved New focus will be brought to the project e V4 0 beta sites We have 3 potential beta sites for v4 0 Now the key is reeling them in on time Attendees V Neil A Adams Dan N S McCauley L Tran E Mail Distribution Lauri Heath Chuck Neilson WISARD Defect Mktg L Hirsch J Gutierrez Dave Loring Phil Desjardins Art Schnitzer Mike Milos Vincent Kim Stan Speelman M Bellanca A Kuwashima Dale Jones F Carter M Mathews Vicki Neil N Montgo
9. kkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkxkk User name J SOLKOFF 38 Queue ENGINEERING HP4SI_ PCL File name Server ENG WIBU_HP4SI Directory Description Microsoft Word NEW 8 July 9 1996 11 44am KEKKKEKKEKE KKK KKK KKK KKK KEK KEK KEKE KER KR KEKE KEK KEK KEKE KKK KKK KKK KEK KKK KEKE KEKE KEKE KEKE KEKE KEKE J SSS O00 L K FFFFF FFFFF J 5 5 L O F F J S O O L 7 555 KK FFFF FFFF J S O O L F J J 5 SO O L K K O O F F JJJ SSS LLLLL K K OOO F F kkkkkxkxkxkxkxkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkk L SSS TITTET L S S T L 5 T L SSS E L S T L S S E LLLLL SSS kkxkkkkkkkkkkkkkkkkkkkkk kkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkk KLA
10. mery Jeff Burns D Freeman Lynne Tran Bobby Bell Beth Wiseman Dave Abisia Therese Kells Dan Grasetti Dave Fletcher David Moezidis Allen Liu Ken WellsS Landstrom Ernest Young A Kuwashima Alan Loo F Tiu Paper Distribution D McClintock G Dickerson Robert Mathews B Bonnar Ashok Kulkarni page 1 of 2 KLA CONFIDENTIAL Chapter 8 The Analysis Process Wafer Maps ills how This chapter gives instructions for nalysis Basic wafer map analysis inetudes the following stey Co 12 sts i p 1 Creating a wafer map 0 2 If desired deleting dice defects or clusters from map 3 Graphically selecting dice defects or clusters and continue analysis 4 if desired printing wafer map or saving to file ae a Cusrte THQ Ay Wafer Map Features Cola Ex i 7 Ynclustered defects are represented by black dots and clusters are green Clustered and 4 unclustered defects with images saved are shown in nent window or single maps displays lot ID wafer ID and defect count Commefit window of stacked maps is empty A single radio button in the wafer map window allows you to turn the Review Sample feature ON or OFF A circle is drawn around each defect which is part of the review sample when this button is pushed in To turn Review Sample off click on the button again Review Sample is valid only for results from a 21 with clustering option Review Sample

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