Linx SDM-USB-QS-S datasheet: pdf
Contents
1. THEORY OF OPERATION Figure 7 below shows a block diagram of the QS module TX Buffer 128 Bytes DATA_OUT lt DATA_IN RTS lt CTS DTR lt DSR DCD lt Rl 485_TX lt TX_IND RX_IND RX Buffer USB DPLL 384 Bytes Figure 7 SDM USB QS S Block Diagram The USB transceiver block provides the physical interface for the USB signalling USB Serial Interface USB Protocol UART FIFO Transceiver Engine SIE Engine Controller The USB DPLL locks onto the NRZ data and provides separate recovered clock and data signals to the Serial Interface Engine SIE The SIE performs the parallel to serial and serial to parallel conversion bit stuffing un stuffing and CRC calculations on the USB data The USB Protocol Engine manages the data from the USB control endpoint the USB protocol requests from the USB host controller and the commands for controlling the functional parameters of the UART Data from the USB data out endpoint is stored in the TX buffer and removed from the buffer to the UART transmit register under control of the UART FIFO controller Data from the UART receive register is stored in the RX buffer prior to being removed by the SIE on a USB request for data from the device data in endpoint The UART FIFO controller handles the transfer of data between the RX and TX buffers and the UART transmit and receive registers The UART performs asynchronous 7 8 bit parallel2. INTERFACE MODULE TECHNOLOGIES PLL DGS SDM USB QS S USB MODULE DESIGN GUIDE DESCRIPTION The Linx QS Series USB module allows the rapid 0 812 addition of USB to virtually any device Housed in lt T a compact SMD package the QS module Se tes a provides a complete solution for converting LINX between USB and logic level serial sources The USB MODULE module can be directly connected to virtually any SEL IS CS serial device including microprocessors DEN RS232 RS485 level converters or Linx wireless a Top VIEW RF modules The QS module is completely self contained and requires no external components 0 125 except a USB jack and includes all necessary Zs firmware and drivers freeing the designer from SIDE VIEW complicated programming Power can be supplied externally or from the USB bus Both Figure 1 Package Dimensions USB 1 1 and USB 2 0 are supported at data rates to 3Mbps FEATURES m Single Chip USB to Asynchronous m VID PID Serial Number and Serial Data Conversion Descriptors Programmed via USB m Low Cost m No External Components Needed m 3Mbps baud rate Except a USB Jack E Supports Low Speed USB Compact Surface mount Package m Full Handshaking Support for Drivers and Firmware Included RS232 and RS485 Bus or Self Powered APPLICATIONS INCLUDE Interface Upgrade Legacy Peripherals Interfacing Microcontrollers To USB USB to RS232 R8485 Converters Interfacing RF Modules To USB U
3. the Linx website gives you instant access to the latest information regarding the products and services of Linx It s all here manual and software updates application notes a comprehensive knowledge base FCC information and much more Be sure to visit often NTENNA wo Aa FACTOR www antennafactor com The Antenna Factor division of Linx offers a diverse array of antenna styles many of which are optimized for use with our RF modules From innovative embeddable antennas to low cost whips domes to yagi s and even GPS Antenna Factor likely offers or can design an antenna to meet your requirements ONMECTOR CIIV THE VALUE OF CONNECTIONS www connectorcity com Through its Connector City division Linx offers a wide selection of high quality RF connectors including FCC compliant types such as RP SMAs that are an ideal match for our modules and antennas Connector City focuses on high volume OEM requirements which allows standard and custom RF connectors to be offered at a remarkably low cost Page 11 TECHNOLOGIES TE A WIRELESS MADE SIMPLE U S CORPORATE HEADQUARTERS LINX TECHNOLOGIES INC 575 S E ASHLEY PLACE GRANTS PASS OR 97526 PHONE 541 471 6256 FAX 541 471 6251 http www linxtechnologies com Disclaimer Linx Technologies is continually striving to improve the quality and function of its products for this reason we reserve the right to make changes without no
4. RA3 AN3 RAO ANO RA4 AN4 RA7 MCLR VPP USB Type B Connector Figure 11 Interface With A Microprocessor SOFTWARE CONSIDERATIONS The host application can access the QS module in two ways First is through Virtual COM Port drivers These drivers make the QS appear as an extra COM port on the host PC This allows the application to use standard writes and reads to a serial port and the drivers will redirect data to the USB device Second are a series of custom functions supported by the direct driver dlls These functions are also described in the Programmer s Guide where examples are given in both Visual Basic and C The Programmers guide can be downloaded from the Linx web site www linxtechnologies com In addition to the Programmer s Guide the QS Master Development Kit MDEV USB QS includes example software and sample system source code This source code provides the driver function declarations examples of how to use the functions in a program and other code that may be of use Page 10 ON LINE RESOURCES TECHNOLOGIES EE TT www linxtechnologies com e Latest News L INX e Data Guides CONPANATE LAUNCH PARE e Application Notes CLAY es ems e Knowledge Base e Software Updates m n If you have questions regarding any Linx product and have Internet access make www linxtechnologies com your first stop Our website is organized in an intuitive format to give you the answers you need in record time Day or night
5. SB Smart Card Readers USB Modems ORDERING INFORMATION PART DESCRIPTION SDM USB QS S USB Module MDEV USB QS Master Development Kit Supports Windows 98 2000 ME XP USB 1 1 and 2 0 Compatible Robotics USB Instrumentation USB Game Controllers USB to Serial Converter Cables Revised 1 10 04 Page 1 ABSOLUTE MAXIMUM RATINGS PIN DESCRIPTIONS rere ewatnon use0P USB data signal plus Supply voltage Vcc 6 0 VDC Max Current Sourced By Data Pins mA Max Current Sunk By Data Pins mA Operating temperature 70 C Storage temperature 40 90 C 1 C o UJ U U Soldering temperature 225 C for 10 seconds Any input or output Pin 0 5 to Vcc 0 5 VDC NOTE Exceeding any of the limits of this section may lead to permanent damage to the device Furthermore extended operation at these maximum ratings may reduce the life of this device USBDM USB data signal minus Ground supply Positive power supply ELECTRICAL SPECIFICATIONS Parameter Designation in Typical POWER SUPPLY Operating Voltage Vcc 5 0 Supply Current Icc 26 UART SECTION Data Rate Data Output Logic Low VOL Logic High EEPROM Size USB SECTION Data Output Logic Low Logic High Single Ended RX Threshold Differential Common Mode Differential Input Sensitivity ENVIRONMENTAL Operating Temperature Range into suspend mode RX IND This line will pulse low when receiving data from the USB bus This allows for the connection of a LED indicat
6. The modules come programmed for 100mA but if the final product will draw more than this then the device descriptors will need to be changed as described in the next section CHANGING THE DEVICE DESCRIPTORS The QS can be customized to display your product s name manufacturer name and to use different Product Identifiers PID and Vendor Identifiers VID This allows an end user to see the final product s name in their Windows Device Manager and when the hardware is first loaded The PID and VID are set by the USB Implementers Forum and should not be changed unless the final product has gone through the certification process and received its own unique IDs The Manufacturer Description and Serial Number strings can all be modified using the Linx Programming Software which is included in the module s development system This easy to use software will reprogram the module via the USB bus and can be done as a part of the final testing procedure Once the module is reprogrammed some modifications to the driver files may be necessary If a VID and PID other than the default Linx numbers are used these numbers will need to be added to the files This requires modifying several lines in the inf files and is described in detail in the programmer user manual Modifying the name displayed by the Windows Device Manager requires changing only one line also described in the programmer user manual Note when these drivers are installed on a syste
7. m with Windows XP an error message may be displayed stating that these drivers are not certified and could potentially crash the system As long as no other changes are made to the inf files this should not be a concern Page 8 TYPICAL APPLICATIONS There are many potential uses for the QS Series modules but three will be described here Figure 9 shows the QS and a MAX213 RS232 level converter IC from Maxim This creates a USB to RS232 converter that supports all of the standard handshaking lines Similarly RS485 or RS422 level converter chips could be used for designs requiring those standards USB Type B Connector MAX213 TX DATA2 DTR2 Figure 9 RS232 To USB Converter The QS Series modules can be used with Linx RF modules to create a wireless link between two PCs Figure 10 shows a design using the ES Series RF modules One potential feature not shown in the schematic below is that one of the output lines of the QS module RTS or DTR could be connected to the PDN lines of the RF modules enabling the host to turn the RF modules on and off USB Type B Connector USB Type B Connector TX Side Figure 10 Wireless Modem Using The Linx ES Series RF Modules Page 9 TYPICAL APPLICATIONS CONT Figure 11 below shows the QS module connected to a microprocessor This is the design used in the QS Master Development Kit and the documentation for the kit describes the connections and software RA2 AN2 RA1 AN1 18
8. o the USB bus and the device INSTALLING THE DRIVERS The drivers for the USB module are included with the module s development system or may be downloaded from the Linx web site www linxtechnologies com These drivers should be downloaded onto the hard drive of a PC or onto a disk When the module is attached to the PC for the first time Windows will automatically detect the device and search for the best driver The user will be prompted to provide a location for Windows to find the drivers so the user will then browse to the folder or the disk click Next and Windows will do the rest Windows XP may return an error window shown in the figure below Fiir balan A ha mimaa yi Ae riiai ie a harn Lew LTUSS Devica Ae it pee Wiis L Se LES E werty i See all ms i i ra T E 5 wth Viiri Er d ale a a er Era Cortina you ialen ef the edie mary spore ar dealan he ne n ol a Syne Giles aay ori lee tutu Macai aiy fears hall poe eho lve eala noe al ac Che herders riaka for eoltwarn thaw hea parkoj Windowsi Logo beating Figure 6 Windows XP Driver Error Window This window is simply a warning that the driver has not gone through Microsoft s certification process and could potentially pose a problem for the system The drivers provided for the QS module have been independently tested and should not pose any problems unless modified by the user Click the Continue Anyway button to finish the installation process Page 6
9. or TX IND This line will pulse low when transmitting data on the USB E bus This allows for the connection of a LED indicator Goes low during USB Suspend Mode This pin can be used to 5 SUSP_IND power down external logic when the host puts the USB bus N ND C Transmit enable line for RS485 applications Data Terminal Ready control handshake output S R D CAUTION This product incorporates numerous static sensitive components Always wear an ESD wrist strap and observe proper ESD handling procedures when working with this device Failure to observe this precaution may result in module damage or failure D CT Clear To Send control handshake input 11 Request To Send control handshake output S O gt af gt O Cc ur mo a Figure 2 SDM USB QS S Pinout Top View Oa I eer nian pa Page 2 Page 3 PIN ASSIGNMENTS DATA_IN lt 13 SUSP_IND DATA_OUT 12 1 2 3 4 5 6 7 8 e 485 1 PRODUCTION GUIDELINES The QS modules are packaged in a hybrid SMD package that supports hand or automated assembly techniques Since QS modules contain discrete components internally the assembly procedures are critical to ensuring the reliable function of the QS product The following procedures should be reviewed with and practiced by all assembly personnel PAD LAYOUT The following pad layout diagram is designed to facilitate both hand and automated assembly SOD mayum J Figu
10. re 3 Recommended PCB Layout HAND ASSEMBLY The QS module s primary mounting surface is sixteen pads located on the bottom of the module Since these pads are inaccessible during mounting castellations that run up the side of the module have been provided to facilitate solder Soldering Iron wicking to the module s underside Tip This allows for very quick hand soldering for prototyping and small volume production If the recommended pad guidelines have been followed the pads will protrude slightly past the edge of the module Use a fine soldering tip to heat the board pad and the castellation then introduce solder to the pad at the module s edge The solder will wick underneath the module providing reliable attachment Tack one module corner first and then work around the device taking care not to exceed the times listed below Figure 4 QS Soldering Technique Absolute Maximum Solder Times Hand Solder Temp TX 225 C for 10 Seconds Hand Solder Temp RX 225 C for 10 Seconds Recommended Solder Melting Point 180 C Reflow Oven 220 C Max See adjoining diagram Page 4 AUTOMATED ASSEMBLY For high volume assembly most users will want to auto place the modules The modules have been designed to maintain compatibility with reflow processing techniques however due to the their hybrid nature certain aspects of the assembly process are far more critical than for other component types Following are brief disc
11. tice The information contained in this Data Sheet is believed to be accurate as of the time of publication Specifications are based on representative lot samples Values may vary from lot to lot and are not guaranteed Linx Technologies makes no guarantee warranty or representation regarding the suitability or legality of any product for use in a specific application None of these devices is intended for use in applications of a critical nature where the safety of life or property is at risk The user assumes full liability for the use of product in such applications Under no conditions will Linx Technologies be responsible for losses arising from the use or failure of the device in any application other than the repair replacement or refund limited to the original product purchase price Some devices described in this publication are patented Under no circumstances shall any user be conveyed any license or right to the use or ownership of these patents 2004 by Linx Technologies Inc The stylized Linx logo Linx and Wireless made Simple are the trademarks of Linx Technologies Inc Printed in U S A
12. to serial and serial to parallel conversion of the data on the RS232 RS422 and RS485 interface Control signals supported by the UART include RTS CTS DSR DTR DCD and RI The UART provides a transmitter enable control signal 485_TX to assist with interfacing to RS485 transceivers The UART supports RTS CTS DSR DTR and X On X Off handshaking options Handshaking where required is handled in hardware to ensure fast response times The UART also supports the RS232 BREAK setting and detection conditions Page 7 POWER SUPPLY GUIDELINES The USB module can be powered in two ways from the USB bus or from an external source If neccisary a voltage regulator can be used to supply a clean 5V as the external source or the VCC pin can be connected to the bus power pin of the USB connector Using the bus to power the module is an advantage because the module then uses power from the host rather than from the peripheral This is especially helpful if the peripheral is battery powered Figure 8 shows the schematic for a bus powered device USB Type B Connector GND GND Figure 8 USB Bus Powered Schematic The USB specification has strict allowances for using power from the bus A device is allowed to use 100mA before enumeration 500mA during normal operation and 500uA in suspend mode A descriptor stored in the EEPROM will tell the host how much current the device will pull from the bus so that the host can allocate the appropriate power
13. ussions of the three primary areas where caution must be observed Reflow Temperature Profile The single most critical stage in the automated assembly process is the reflow process The reflow profile below should not be exceeded since excessive temperatures or transport times during reflow will irreparably damage the modules Assembly personnel will need to pay careful attention to the oven s profile to ensure that it meets the requirements necessary to successfully reflow all components while still remaining within the limits mandated by the modules themselves Ideal Curve Forced Air Reflow Profile Limit Curve 220 C 210C 7 180C fy gt a4 27 i gt Temperature 150 aan NY Reflow Zone Soak Zone 20 40 Sec 100 2 Minutes Max Preheat Zone 7 i 7 Ramp up 2 2 3 Minuies Cooling 1 1 5 Minut s l l 2 30 60 90 120 150 180 210 240 270 300 330 360 Time Seconds gt Figure 5 Maximum Reflow Profile Shock During Reflow Transport Since some internal module components may reflow along with the components placed on the board being assembled it is imperative that the modules not be subjected to shock or vibration during the time solder is liquid Washability The modules are wash resistant but are not hermetically sealed Linx recommends wash free manufacturing however the modules can be subjected to a wash cycle provided that a drying time is allowed prior to appl
14. ying electrical power to the modules The drying time should be sufficient to allow any moisture that may have migrated into the module to evaporate thus eliminating the potential for shorting damage during power up or testing If the wash contains contaminants the performance may be adversely affected even after drying Page 5 MODULE DESCRIPTION The Linx SDM USB QS S module will convert USB signals from a host such as a PC or hub into TTL logic level signals This enables the module to be connected directly to microcontrollers or Linx RF modules for wireless applications or to RS232 or RS485 level converters for communication with legacy devices The module handles all of the complicated enumeration and bus communication processes thus freeing the designer to focus on handling the data All necessary firmware is included in the module and the device descriptors can easily be changed to customize the device The host application software can access the USB device by simple custom functions or by standard Windows Win32 API calls In addition Virtual Com Port drivers are available that make the USB module appear to the PC as an additional COM port without the need for additional system resources such as an IRQ or address This allows the designer to program the application software to use standard serial or parallel ports and then to simply select the port that represents the USB module The drivers will then automatically direct the data t
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