Specification for Production - Panasonic Industrial Devices Europe
Contents
1. 0000000 0 0 000000000 S CO er CO CC CO O Q Or Or On Er Er Q UG 8 c po L A2 Cc C O O O B i O O O 0000000060 Ey O49 0000000060 00000000 0 EM k Y EX Pi v dE n trailer empty component leader empty Top ps PUN more 1 x circumference packed area minimum 10 pitch 4 standard circumterence H US hub 100mm to avoid min 160mm 500pcs fixing of tape end on sealed modules Empty spaces in component packed area shall be less than two per reel and those spaces shall not be consecutive Top cover tape shall not be found on reel holes and shall not stick out from the reel HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 22 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 24 3 COMPONENT DIRECTION Komponentenanordnung J O 1 X Q Q1 oo Direction of unreeling for customer Pin 1 Marking Bottom Side Circle r 1 0 mm with no copper near Pin 1 ono ENW59620A1CF 000000000 24 4 LABEL FOR PACKAGE 105 mm gt A Panasonic A 1T 0801511 saneso Aes C2. 1 Sensitivity 1 2kbps 1 PER eg Saturation maximum input power level 15 In band Spurious Emission 65 dBm Spurious Emissions lt 1GHz f Le dBm Spurious Emissions gt 1GHz 66 1 33 dBm Nr Sender Min Typ Max Einheit 3 Maximum Oupu Power messueaatrin foaneurt fo o om 2 Minimum ouparoner f om s mw p he je 4 Oetwemmamm F wfe mge ln e dm s WvwmecQ wm L e o em Spurious Emissions lt 1GHz except Nos Gl QM o o9 dam s Spurious Emissions 470 MHz to 862 MHz 10dem Ta Ter dm 9 Spurious Emissions gt 1GHz 10dBm oo Ee ee Stand By Idle and Sleep Mode Nr In Bereitschaft und Stromsparmodus Min Typ Max Einheit 1 Spurious Emissions lt 1G z 5 1 57 Bm 2 Spurious Emissions gt 1G z IL 65 1 3 Bm HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT i PAGE Thema Wireless M Bus Module PAN7550 Seite 13 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 15 SOLDERING TEMPERATURE TIME PROFILE FOR REFLOW SOLDERING Temperatur Zeit Profil fur die Reflowlotung 15 1 FOR LEAD SOLDER Recommended temp profile 10 1s for reflow soldering N 30 20 10s Temp C 235 C max i gt 220 5 C AA 2
3. AEB EE 17 23 2 Installation TF pn EE 18 23 3 Usage Con mon ga ote EE 18 23 4 Storage MEISSA EE 19 EE een oon e teo ER ER ree emos 19 29 50 OI dent oe eroe DR GERE WER FAR Pe Lo Lag aa re E Ee Re cs 19 24 Package EN uuu ue tdt bu nee cies ease Dec ate apr e ax sus xL ie ON M DUNS 21 24 1 O 1 EE 21 E CDG EE 21 SI ul elle ER amp 9 wel Tor Package EE ER BE CE DIMENSION EE 23 24 ie xiuebetzTviel lte 24 HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D en Wireless M Bus Module PAN7550 Ber re PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 24 1 Cover tape reel strength a tin eru inve P eme ta vec xU s n od i d pa Cue 24 2D Ordering IntormiatiQLDissie asco cato eaaet rtl aetema eo dee hehe tee alos see 25 20 eu Lee ET en TT ETT ww 26 Zr Data Sheer Sta Senn ne ee EC 26 28 Related Documents NNN NENNEN RANNER EE 26 29 General Information eee mener MEER eee A 27 90 Life Support Poll6V TEEN etes 27 HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJE
4. Selects test mode for JTAG pins on Port1 The device protection fuse TEST is connected to TEST Spy Bi Wire test clock input during programming and test Ar Reset or nonmaskable interrupt input Spy Bi Wire test data input output during programming and test Input for external DCO resistor to define DCO frequency HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 9 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 7 BLOCK DIAGRAM Blockdiagramm PAN7550 UFL Plug Footprint optional UART SP BSL Ceramic JTAG Balun amp Filter Spy Bi Wire OpAmp UO Pins 1 8 3 6V 13 768 kHz 26 MHz Bottom Pad Power Supply Crystal Crystal optional 8 KEY PARTS LIST Liste der Schl sselkomponenten Teilenummer Material Glass cloth epoxide resin with gold plating Material ZSNC S1S8 8 8 thickness 0 30mm MSP430F2274 Texas Instruments www ti com IC part name All information are based on 4 chapter 28 CC1101 Texas Instruments www ti com All information are based on 6 chapter 28 9 TEST CONDITIONS Mefsbedingungen Measurements are made under room temperature and humidity unless otherwise specified Messungen un
5. soldering heat have mechanical damage HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt Reflow soldering with PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 16 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 20 RECOMMENDED LAND PATTERN Empfohlenes Land Pattern aocoeggeegogomg min 5 00 mm Ki 5 E Top View D 13 70 In comparison to the module we recommend to use 5Oum bigger pad size to each direction 0 30 mm 1 70 mm 2 4Dmm 4 30 mm When using the ceramic antenna this minimum area is restricted means no ground no line and in general no metal e g screws ipogpppooobDE 32 00 mm pu a min 5 0 mm 1 70 mm 0 30 mm 2 40 mm 3 30 mm Dimensions in millimeters The land pattern dimensions above are meant to serve only as a guid This information is provided without any legal liability For the footprint it is recommended to incorporate a 50um bigger size for the pads in each direction compared to the module footprint Please refer to chapter 17 Footprint of the Module For the solder paste screen please use the same screen for the module Solde
6. DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 21 DEVELOPMENT OF APPLICATIONS Please refer to 1 2 and 3 in chapter 28 Related Documents 22 RELIABILITY TESTS Zuverlassigkeitstests The measurement should be done after being exposed to room temperature and humidity for 1 hour Die Messungen sollten erst nach einer Stunde Lagerung unter normalen Bedingungen erfolgen pmo D o moo Punkt Grenzwerte ae a Freq 10 50Hz Amplitude 1 5mm Electrical parameter should be a 20min cycle ihrs each of XYZ axis in specification Y Freq 30 100Hz 6G b 20min cycle 1hrs each of XYZ axis Vibration test Shoe test Doppo onto hard wood from height of 50cm for 40 C for 30min and 85 C for 30min Heat cycle test the same as above each temperature 300 cycles Moisture test 60 C 90 RH 300h Low temp test 40 C 300h 6 High temp test 85 C 300h 23 CAUTIONS Warnungen Failure to do so may result in degrading of the product s functions and damage to the product 23 1 DESIGN NOTES Designhinweise 1 Please follow the conditions written in this specification especially the control signals of this module 2 The supply voltage has to be free of AC ripple voltage for example from a battery or a low noise regulator output For noisy supply voltages provide a decoupling circuit for example a ferrite in series connection and a blocking capacitor to ground of at least 47uF directly at the module 3 This p
7. III c 1P Customer Code 2P ENW59620xyCF E ZU UO LO MUN NN IL D D I mt i ml TURN l 1T Lotcode YYWWDLL YY year here 08 WW normal calendar week here 01 D day here 5 Friday L line identifier if more as one here 1 L lot identifier per day e g 1 2 3 1P Customer Code if any otherwise put company name on it 2P Panasonic Order Code refer to chapter 25 9D Datecode as YYWW Q Quantity here 1000 can differ on customer request HW SW Hardware Software Release refer to chapter 25 G Identifier that the product is ROHS conform please refer also to 26 HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH REV D 23 of 27 13 03 2010 DS 7550 0868 102 PAGE Seite Datum No DATE Produktspezifikation Wireless M Bus Module DAN 7550 CUSTOMER PART NUMBER PAN7550 PANASONIC PART NUMBER PRODUCT SPECIFICATION ENW59620 2 xyCF 24 5 REEL DIMENSION CLASSIFICATION Einstufung SUBJECT Thema DESIGNED erstellt Z I S E is Z I LU SKa 4 t003zvvz V ASM 439 9MO IWVN Ins Q govdHvM WW LINN H H NOIL23S Renate om T ix qvos UI JONVATIOL zer a SIN 5 S XZ AINO MOND NOISND SAILONONCO sl OL amp OL 9 T ER ON HU 85 NIW S OH KINO OVI CIMINO AALONGNOD TL Me
8. digital I O pins combined should not exceed 48 mAdc to hold the maximum voltage drop specified in 4 2 The supply voltage must be free of AC ripple voltage for example from a battery or a low noise regulator output For noisy supply voltages please provide a decoupling circuit for example a ferrite in series connection and a blocking capacitor to ground of at least 47uF directly at the module The exact ripple tolerance will be published in a later revision 11 OPERATING CONDITIONS Betriebsbedingungen Thet ical value ra RF Input Frequency a 868 0 868 3 870 0 3 Return loss of load at pin 13 Receive Transmit Mode to A up ANT 500 reference load Positive going input m threshold voltage for all digital I O pins 0 45xVcc a 0 75xVcc Negative going input Em threshold voltage for all digital I O pins Vi 0 25xVcc 0 55xV cc 6 Input voltage hysteresis Input voltage hysteresis for all digital I O pins Mela a re HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT i PAGE Thema Wireless M Bus Module PAN7550 Seite 11 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 rm I ta range 12 DC ELECTRICAL CHARACTERISTICS Assume Vcc 3 0V Tamb 25 C if nothing else sta
9. resulting HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH
10. 00 C 150 10 C e Time s 15 2 FOR LEAD FREE SOLDER Our used temp profile for reflow soldering 30 20 10s Temp C 230 C 250 C max y 220 C 150 C 190 C Time s Reflow permissible cycles 2 Opposite side reflow is prohibited due to the module weight HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 14 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 16 MODULE DIMENSIONS Modulabmessungen Punkt Abmessung Toleranz Bemerkung 17 FOOTPRINT OF THE MODULE Lotpads vom Modul ssgESSSSSSG Pad1 4x 1 30mm x 1 30mm DE 47 e res we Antenna s HgESEUSSSSESNi Li B 1 t t 0 35 mm m KE 1 65 mm E E E E 245 mm EBEN 3 25 mm lt SeN F 32 00 mm u All dimensions are in millimeters The outer dimensions have a tolerance of 0 2mm HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Mo
11. CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT i PAGE Thema Wireless M Bus Module PAN7550 Seite 1 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 Specification for Production Applicant Manufacturer Panasonic Electronic Devices Europe GmbH Hardware Zeppelinstrasse 19 21337 L neburg Germany Applicant Manufacturer Wireless M Bus Stack from ScatterWeb GmbH or Software your own written software Software Version Contents Approval for Mass Production Customer By signing this document Customer accepts the validity of the below mentioned contents and declares his full notice to it Some passages may be changed if required the validity shall not be affected thereby CHECKED APPROVED SIGNATURE NOTE AT LEAST ONE SET OF APPROVED SPECIFICATIONS SHOULD BE RETURNED TO THE ADDRESS OF THE ISSUING PARTY APPROVED CHECKED DESIGNED genehmigt gepruft erstellt HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 2 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER _ DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 TABLE OF CONTENTS 1 Key Feallres esse een 4 2 Applications for the Module eren ere
12. CT i PAGE Thema Wireless M Bus Module PAN7550 Seite 4 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 1 KEY FEATURES Schl sseleigenschaften e General Features Small Size 13 7 mm x 32 0 mm x 2 85 mm Temperature Range from 40 C to 85 C Supply Voltage Range from 1 8 V to 3 6 V Very low Current Consumption for increased Battery Life Additional 64k internal SPI EEPROM UART and SPI Bus 3 Antenna Options Internal Ceramic Antenna UFL Plug Single Port 50 Ohm 32kByte 256Byte Flash and 1kByte RAM Memory IrDA Encoder and Decoder Configurable Operational Amplifier Brownout Detector Bootstrap Loader 12 channel 10 Bit A D Converter with internal Reference Sample and Hold Autoscan and Data Transfer Controller 2 x 16 Bit Timers with Capture Compare Registers o In total 27 digital I O lines with programmable pullup pulldown resistors O O O O O O O O O Oo X O e RF Features Programmable Data Rate from 1 2 to 500 kBaud NRZ mode High Sensitivity 109 typ at 1 PER and 1 2 kbps Programmable Output Power from 10 to 30 dBm Full 128 bit Encryption Very Low Power Modes Support for 2 FSK GFSK MSK OOK and ASK Programmable Carrier Sense CS Indicator Preamble Quality Indicator PQI Link Quality Indicator LQI and Clear Channel Assessment CCA O O O O 02 0 OO 2 APPLICATIONS FOR THE MODULE Anwendungen f r das Modul AMR Automatic Meter Reading M
13. ETY CAUTIONS Sicherheitshinweise These specifications are intended to preserve the quality assurance of products and individual components Before use check and evaluate the operation when mounted on your products Abide by these specifications without deviation when using the products These products may short circuit If electrical shocks smoke fire and or accidents involving human life are anticipated when a short circuit occurs then provide the following failsafe functions as a minimum 1 Ensure the safety of the whole system by installing a protection circuit and a protection device 2 Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status 23 6 OTHER CAUTIONS Weitere Hinweise 1 This specification sheet is copyrighted Please do not disclose it to a third party 2 Please do not use the products for other purposes than those listed 3 Be sure to provide an appropriate fail safe function on your product to prevent an additional damage that may be caused by the abnormal function or the failure of the product 4 This product has not been manufactured with any ozone chemical controlled under the Montreal Protocol 5 These products are not intended for other uses other than under the special conditions shown below Before using these products under such special conditions check their performance and reliability under the said specia
14. NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 24 6 TOTAL PACKING HANDLING barcode a barrier A sealed 1 quantity of desiccant according to calculation 2 optional desiccant placed into the corner of the barrier bag inner carton box size 340 x 340 x 53 mm 24 7 COVER TAPE REEL STRENGTH Force direction 0 10deg Speed 300mm min Cover tape reel strength LS LS 4 A4 a 0 098 0 68N 10 70g HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 25 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 25 ORDERING INFORMATION Bestellinformationen o Ordering part number Engineering Sample PAN7550 no EEPROM 1 ENW5Z620A2CF Wireless M Bus Module which includes Ceramic Antenna Wireless M Bus Stack from ScatterWeb included please refer to 1 Engineering Sample PAN7550 no EEPROM 2 ENW5Z620B2CF Wireless M Bus Module which includes UFL Connector Wireless M Bus Stack from ScatterWeb included please refer to 1 Engineering Sample PAN7550 no EEPROM 3 7 ENW5Z620C2CF Wireless M Bus Module which includes RF out on SMD pad 1 Wireless M Bus Stack from ScatterWeb
15. SION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 19 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 23 4 STORAGE NOTES Lagerhinweise 1 The module may not be stressed mechanically during storage 2 Do not store these products in the following conditions or the performance characteristics of the product such as RF performance will be adversely affected e Storage in salty air or in an environment with a high concentration of corrosive gas such as Cl2 H2S NH3 SO2 or NOX e Storage in direct sunlight e Storage in an environment where the temperature may be outside the range of 5 C to 35 C range or where the humidity may be outside the 45 to 85 range e Storage of the products for more than one year after the date of delivery at your company if the avoidance all the above conditions 1 to 3 have been met 3 Storage period Please check the adhesive strength of the embossed tape and soldering after 6 months of storage 4 Please keep this product away from water poisonous gas and corrosive gas 5 This product should not be stressed or shocked when transported 6 Please follow the specification when stacking packed crates max 10 23 5 SAF
16. UMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 26 ROHS DECLARATION RoHS Erkl rung Declaration of environmental compatibility for supplied products Hereby we declare to our best present knowledge based on declaration of our suppliers that this product does not contain the following substances which are banned by Directive 2002 95 EC ROHS or contains a maximum concentration of 0 1 by weight in homogeneous materials for Lead and lead compounds Mercury and mercury compounds Chromium VI PBB polybrominated biphenyl category PBDE polybrominated biphenyl ether category And a maximum concentration of 0 01 by weight in homogeneous materials for e Cadmium and cadmium compounds 27 DATA SHEET STATUS Datenblatt Status This data sheet contains data from the PRELIMINARY specification Supplementary data will be published at a later date Panasonic Electronic Devices Europe GmbH reserves the right to change the specification without notice in order to improve the design and supply the best possible product Please consult the most recently issued data sheet before initiating or completing a design If there is an update please download under PAN7550 Latest Data Sheet 28 RELATED DOCUMENTS Mitgeltende Dokumente For an update please search in the suitable homepage 1 User s Guide to the Wireless M Bus Stack ScatterWeb GmbH Download 2 User s Guide to the Wireless M Bus Stack company Steinbeis Download 3 Ma
17. Wireless M Bus Module PAN7550 Seite 24 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 24 PACKAGING Verpackung 24 1 TAPE DIMENSION 2 P 0 E 1 ce 2 00 0 15 1 4 0050 1 1 o 0 30 0 05 e a Y ME Oe 000000090 C CX EN f 8 E Dj C LJ C LJ gt a Ch 0 REF 22 40 3 W J j OO0oo0o00 0000000 Ai _0 20 0 05 Qe Gei O gt io CN mu H We O Ko Y P1 Ao 8 80 DETAIL A wd SECTION Y Y SCALE 24 1 SCALE 1 5 1 Ao 14 10 0 1 FT Bo 32 40 0 1 Measured from centreline of sprocket hole Ko 3 20 0 1 SECTION X X to centreline of pocket K1 2 80 0 1 SCALE 1 5 1 OD Cumulative tolerance of 10 sprocket e 2020 740 15 holes is 0 2 OI fro P4 20 00 0 1 hole to centreline of pocket So 40 40 Wei Tooling code Flatbed qv i jal w 44 00 0 3 Estimated max length 63 meter 22B3 reel ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED 24 2 PACKING IN TAPE Direction of unreeling for customer gt
18. able to use two different interfaces the JTAG interface or the Spy Bi Wire interface An application kit is also available for fast prototyping and application evaluation For details please refer to 3 4 SCOPE OF THIS DOCUMENT Umfang dieses Dokumentes This product specification applies to the Wireless M Bus Module ENW59620 2 xyCF The xy is the indicator for different versions refer to chapter 25 Ordering Information The used platform is the microcontroller MSP430F2274 in combination with the transceiver CC1101 from the Texas Instruments www ti com For details please refer to 4 5 and 6 5 HISTORY FOR THIS DOCUMENT Versionsverwaltung dieses Dokumentes Revision Date Modification Remarks Version Datum Anderungen Bemerkungen 29 06 2009 Initial draft version Update chapter Block Diagram EEPROM now optional 30 07 2009 Added values for chapter Absolute Maximum Ratings Operating Conditions DC dne Electrical Characteristics and AC Electrical Characteristics Correct some incorrect links Correct the Ordering Information Updated chapter Development of Applications C 16 02 2010 l Packaging and Related Documents 13 03 2010 Add new ordering codes which includes the EEPROM version modification in chapter Ordering Information HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION N
19. dule PAN7550 Seite 15 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 18 LABELING DRAWING Kennzeichnung des Moduls durch Label PAN7550 ES yy 000000 zz 090622 I 13 7 mm This label is suitable for reflow soldering and designed for the engineering sample status Information in the 2D Barcode are the date code in the format Year Month Day 6 signs here 081211 serial number 7 signs here 0000000 ordering number 8 signs without ENW and F please refer also to chapter 25 the identifier for the hardware release 2 signs here yy the identifier for the software release 2 signs here zz and the ES separated by a semicolon ES stands for Engineering Samples please refer to chapter General Information In mass production status the ES will be eliminated The point on the label below left is the identifier for pin 1 of the module As a summary Xy Number 9 and 10 from the ordering code please refer to chapter 25 yy Identifier for the hardware version ZZ Identifier for the software version 19 MECHANICAL REQUIREMENTS Mechanische Anforderungen Item Limit Condition Punkt Grenzwerte Bedingung More than 75 of the soldering area shall be Solderability coated by solder Lotfahigkeit Mehr als 75 der Lotflache soll mit Lotpaste roco mmMEnGADIE temperate profile bedeckt sein Resistance to Must satisfy electrical requirements and not 2 Please refer to chapter 15 2
20. edical Applications Wireless Sensors Industrial Applications RKE Two way Remote Keyless Entry Remote Control Systems Automotive Applications Home Automation Systems HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT i PAGE Thema Wireless M Bus Module PAN7550 Seite 5 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 3 DESCRIPTION OF THE MODULE Beschreibung des Moduls The PAN7550 module is a short range low power 868 MHz ISM band modem which is mainly intended for Wireless M Bus applications regarding to the EN 13757 4 standard It includes a very low power microcontroller MCU based on the MSP430 family and a low power RF transceiver from Texas Instruments This combination provides cost effective solutions for short range data links and wireless networks The module is offered with an internal ceramic chip antenna an UFL plug or a 50 ohm single port on the bottom side of the module The main software solution for the PAN7550 is the Wireless M Bus Stack from ScatterWeb GmbH For details please refer to 1 In addition you are also free to develop your own software by using any software development solution for the mentioned microcontroller For device flash programming you are
21. included please refer to 1 4 ENW5Z620A1CF Same as number 1 but without Software ENW5Z620B1CcF Same as number 2 but without Software ENW5Z620C1CF Same as number 3 but without Software Engineering Sample PAN7550 with EEPROM ENW5Z622A2CF Wireless M Bus Module which includes Ceramic Antenna Wireless M Bus Stack from ScatterWeb included please refer to 1 e D Engineering Sample PAN7550 with EEPROM ENW5Z622B2CF Wireless M Bus Module which includes UFL Connector 1 Wireless M Bus Stack from ScatterWeb included please refer to 1 D ER Engineering Sample PAN7550 with EEPROM ENW5Z622C2cCF Wireless M Bus Module which includes RF out on SMD pad Wireless M Bus Stack from ScatterWeb included please refer to 1 10 ENW5Z622A1CF Same as number 7 but without Software ENW5Z622B1CF Same as number 8 but without Software ENW5Z622C1CF Same as number 9 but without Software Note 1 Minimum order quantity 2 The Z in the ordering part number refers to the engineering sample status After mass production the Z will be changed to the 9 HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 26 of 27 CUSTOMER PART NUMBER PANASONIC PART N
22. l HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT i PAGE Thema Wireless M Bus Module PAN7550 Seite 20 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 conditions carefully to determine whether or not they can be used in such a manner e In liquid such as water salt water oil alkali or organic solvent or in places where liquid may splash e Indirect sunlight outdoors or in a dusty environment e In an environment where condensation occurs e n an environment with a high concentration of harmful gas e g salty air HCl CI2 SO2 H2S NH3 and NOX 6 If an abnormal voltage is applied due to a problem occurring in other components or circuits replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory 7 When you have any question or uncertainty both of you and Panasonic sincerely cope with it HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema
23. lock signal TACLK input ADC10 conversion clock General purpose digital I O pin o JI co N gt GA I O N e ud Timer A capture CCIOA input compare OUTO output BSL transmit General purpose digital I O pin ES Timer_B capture CCI1A input compare OUT1 output General purpose digital I O pin Timer B capture CCI2A input compare OUT2 output USCI AO transmit data output inUARTmode slave in master out in SPlmode USCI AO receive data input in UART mode slave out master in in SPI mode NC Not Connected 0 ee Terme 2 P1 4 UC Test Clock input for device programming and test 34 General purpose digital I O pin Timer A compare OUTO output Test Mode Select input for device programming and test General purpose digital I O pin Timer A compare OUT1 output P1 6 UO Test Data Input or Test Clock Input for programming and test C2 NO CA NO NO N O o HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT i PAGE Thema Wireless M Bus Module PAN7550 Seite 8 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 ey Name Type ve le EEE NN Test Data ia Oucout or Test Data Input for oo and test
24. m nennen nnn rrr E 4 9 Description of the Module eem nem nnn MR 5 4 Scope of this Document eee eer rmn rrr i a ro sie rra E EE 5 9 History Tor this DOCUMENE oit EE etc o o WE d 5 6 Terminal E3yOUul inier tto t o oa x odere octies Coe 6 f Block Diagram ee A 9 8 sec hee ee a A 9 9 Test e el ue tee CEET ae AEN 9 10 Absolute Maximum Ratings ENEE 10 11 Operating Conditions 2 2 222022200222000000 0000nnen nennen AN 8 10 12 DC Electrical Characteristics so ls EE 11 13 A D converter Characteristics eoe Ese NM eee nn nnne 11 14 AC Electrical Characteristics AER D 12 15 Soldering Temperature Time Profile for reflow soldering 13 15 1 For lead solder 40 Eee 13 15 2 For lead free solder EE esee 13 16 Module DIMENSIONS 20 We RER mmm 14 17 FootPrint of the Module EB Eee nmn 14 18 Labeling Drawing 9 V WE 15 19 Mechanical Requirements AER REA mmm 15 20 Recommended Land Pattern e 9999 B menn nnnm nnnm 16 21 Development of Applications EE BR 17 22 Reliability Tests E RE 17 23 e E de EE otn 17 23 1 Design Notes
25. nehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT i PAGE Thema Wireless M Bus Module PAN7550 Seite 7 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 zu zu zu Description No Name Type p General purpose digital I O pin Timer_B capture CCIOB input compare OUTO output ADC10 analog input A12 OAO analog output 10 P4 3 UC General purpose digital I O pin 11 P4 4 UO Timer_B capture CCI1B input compare OUT1 output ADC10 analog input A13 OA1 analog output Ground Pin for external antenna 50 Q General purpose digital I O pin Timer B compare OUT2 output ADC10 analog input A14 OAO analog input I3 General purpose digital I O pin Timer_B switch all TBO to TB3 outputs to high impedance ADC10 analog input A15 OA1 analog input I3 General purpose digital I O pin General purpose digital I O pin l ADC10 analog input A7 OA1 analog input I2 I O PWR General purpose digital I O pin Timer_A capture CCI1B input compare OUT1 output ADC10 analog input A3 negative reference voltage output input OAM analog input 1 OA1 analog output General purpose digital I O pin Timer A compare OUT2 output P2 4 UO ADC10 analog input A4 positive reference voltage output input OA analog input IO General purpose digital I O pin P1 0 UC Timer_A c
26. ng ONV O 3 JOH NOSMNV O 39Nv14 1338 HOLVI Z 3 vX l FILU f AINO MOIE 3ALVdISSIQ 2ILVIS Ol DL il a L4 X 1100232Z 30N343434 A1gN3SSV S EI Saal TW OILVLSILNV OL MO138 v LINO SNIMVNO LONGOMd 9 uno109 3dAL JONVY US ON3931 LONGONd 2IM3N39 C f ALIALLSIS33 30VJaNS G O3iv15 UE B SSMYSHLO SSSINN LSVIGGNVS 39V4UNS TV Z g L93SNI ONTE V HLIM 3AO9 LSNW 0901 11V 7 CY us LA LON 7 NOISS34430 OI Oo Ov 18 7 WNS O L L x378 3Auvdlssld S407109 TIV Y gt c 3ALLDONONDD JILVLS DILVLSILNV F e f 23 90 j Zi j Y D ale ILON A MJI AVG M3IA 3915 M3IA LNOMSJ A NOISS34d3Q WG O 21 ILON 33S i 0901 JIoAO93M 0901 0S3 MOONIM MOANM MOGNIM Dat AHL CH NHL L noia 7 N Sr 3svg 94A 0901 3ZIS 8NH 0907 3002 ILVQ Ve LL Q gt Lu Q o O GER SOE o Y I en H A 9 u gj 5 o ui x 8 25 sOw Z O 0o lt Z c ai Pi NN 0088 Es a NOISS33d3Q WWS O NOBS34430 WNG O JIY S SV3NII uie T dh T a T uu O g uu 0 8 fe o T 7e X EE Due to tape width of 44mm the reel width will be 52mm Z O N gt Q 0 O Q X A gt O Z LU O LU Y LL SS C L CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 24 of 27 CUSTOMER PART NUMBER PANASONIC PART
27. nual to the Application Kit from Panasonic Download 4 Datasheet MSP430F2274 Document Number SLAS504B JULY 2006 REVISED JULY 2007 Texas Instruments 5 MSP430Fx2xx User Manual Document Number SLAU144E Texas Instruments 6 CC1101 Datasheet Document Number SWRSO61E April 2009 REVISED April 2009 Texas Instruments APPROVED CHECKED DESIGNED genehmigt gepruft erstellt HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 97 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 29 GENERAL INFORMATION Allgemeine Informationen Panasonic Electronic Devices Europe GmbH 2010 All rights reserved This product description does not claim to be complete and free of mistakes Please contact the related product manager with any errata inquries If we deliver samples to the customer these samples have the status Engineering Samples This means the design of this product is not yet completed Engineering Samples may be partially or fully functional and there may be differences published in the Data Sheet Engineering Samples are not qualified and are not to be used for reliability testing or series production Disclaimer Customer acknowledges that samples may deviate from
28. o REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 6 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 6 TERMINAL LAYOUT Anschlu belegung BE BB BE BB 9 8 i GND GND Top View 13 70 Antenna 42 Si RS bb BS A BD ex zh 1 65 mm 2 45 mm 3 25 mm 32 00 mm Please refer also to the MSPA30F2274 technical data sheet and reference manual which is given in 4 and 5 in the chapter Related Documents No Name Type Supply Voltage 3 P2 0 IO General purpose digital I O pin ACLK output l ADC10 analog input AO OAO analog input IO General purpose digital I O pin Timer A clock signal at INCLK 4 P2 1 UO SMCLK signal output ADC10 analog input A1 OAO analog output General purpose digital I O pin Timer_A capture CCIOB input BSL receive compare OUTO output ADC10 analog input A2 OAO analog input I1 5 P2 2 UC General purpose digital I O pin P3 0 UO USCI BO slave transmit enable USCI AO clock input output ADC10 analog input A5 General purpose digital I O pin zii USCI BO slave in master out in SPI mode General purpose digital I O pin mI DE USCI BO slave out master in in SPI mode General purpose digital I O pin E SE USCI BO clock input output USCI AO slave transmit enable HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business ge
29. r paste screen cutouts with slightly different dimensions might be optimum depending on your soldering process For example the chosen solder paste screen thickness might havean effect The solder screen thickness depends on your production standard We recommend 120um to 150um IMPORTANT Although the bottom side of PAN7550 is fully coated no copper such as through hole vias planes or tracks on the board component layer should be located below the PAN7550 to avoid creating a short In cases where a track or through hole via has to be located under the module please make a note that it has to be kept away from PAN7550 bottom pads The PAN7550 multilayer pcb contains an inner RF shielding plane therefore no pcb shielding plane below the module is needed When using the antenna pad version please place the antenna on the edge of your carrier board if allowable If you have any questions on these points please contact your local Panasonic representative Before releasing the layout we recommend to sent the schematic and layout for final check to wireless eu panasonic com APPROVED CHECKED DESIGNED genehmigt gepr ft erstellt HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT i PAGE Thema Wireless M Bus Module PAN7550 Seite 17 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER
30. roduct should not be mechanically stressed when installed 4 Heat is the major cause of shortening the life of these products Please keep this product away from heat Avoid assembly and use of the target equipment in conditions where the products temperature may exceed the maximum tolerance 5 The supply voltage should not be exceedingly high or reversed It should not carry noise and or spikes 6 Please keep this product away from other high frequency circuits HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepr ft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 18 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 23 2 INSTALLATION NOTES Verarbeitungshinweise 1 Reflow soldering is possible twice based on the conditions in chapter 15 Please set up the temperature at the soldering portion of this product according to this reflow profile 2 Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat 3 Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components 4 Ifa vinyl covered wire comes into con
31. tact with the products then the cover will melt and generate toxic gas damaging the insulation Never allow contact between the cover and these products to occur 5 This product should not be mechanically stressed or vibrated when reflowed 6 If you want to repair your board by hand soldering please keep the conditions of this chapter 7 Please do not wash this product 8 Please refer to the recommended pattern when designing a board 9 Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit 23 3 USAGE CONDITIONS NOTES Benutzerhinweise 1 Please take measures to protect the unit against static electricity If pulses or other transient loads a large load applied in a short time are applied to the products check and evaluate their operation befor assembly on the final products 2 Please do not use dropped products 3 Please do not touch damage or place dirt on the pins 4 Please follow the recommended condition ratings about the power supply applied to this product 5 Electrode peeling strength Do not add pressure of more than 4 9N when soldered on PCB 6 Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage 7 These products are intended for general purpose and standard use in general electronic equipment such as home appliances office equipment information and communication equipment HIGH FREQUENCY PRODUCTS DIVI
32. ted No Item Condition Remark Symbol Value Unit Min Typ EIE Transmit current consumption Transmit Mode 10dBm licr ook 32 2 Receive current consumption Gg ee Sleep uC LPM 3 Ice 0 59 HA consumption Stand by Idle uC activ Ica 2 mA digital I O pin characteristics Please refer to 4 MCU Electrical Characteristics digital O pin input capacitance all non supply pins Cn Vw 5 pr FOW yoltage WathIng cetecuon Please refer to 4 MCU Electrical Characteristics Power on reset re arm voltage 13 A D CONVERTER CHARACTERISTICS 1 AD characteristics Please refer to 4 MCU Electrical Characteristics A D timing performance Please refer to 4 MCU Electrical Characteristics characteristics The A D negative reference voltage VREF is connected to pin 20 P2 3 The A D positive reference voltage VREF is connected to pin 21 P2 4 HIGH FREQUENCY PRODUCTS DIVISION APPROVED CHECKED DESIGNED Module Business genehmigt gepruft erstellt PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT i PAGE Thema Wireless M Bus Module PAN7550 Seite 12 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 14 AC ELECTRICAL CHARACTERISTICS Vcc 3 0V RE 25 C 50Q load at ANT No Receiver Limit Unit Nr Empfanger Min Typ Max Einheit 1
33. ter normalen Bedingungen Abweichungen sind gesondert notiert Temperature 25 10 C Humidity 40 to 85 RH Temperatur 25 10 C Luftfeuchtigkeit 40 to 85 RH APPROVED CHECKED DESIGNED genehmigt gepruft erstellt HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES EUROPE GmbH CLASSIFICATION PRODUCT SPECIFICATION No REV Einstufung Produktspezifikation DS 7550 0868 102 D SUBJECT PAGE Thema Wireless M Bus Module PAN7550 Seite 10 of 27 CUSTOMER PART NUMBER PANASONIC PART NUMBER DATE PAN7550 ENW59620 2 xyCF Datum 13 03 2010 10 ABSOLUTE MAXIMUM RATINGS Absolute Grenzwerte The maximum ratings may not be exceeded under any circumstances not even momentarily as permanent damage to the module will result No Item Symbol Absolute Maximum Ratings Unit l Punkt Zeichen Absolute Grenzwerte Einheit Ripple on Vcc tbd ripple DE 2200kHz a 3 Digital input voltages 0 3 to 0 3 to Voct0 3 max3 9 000 3 max 3 9 Instantaneous maximum current aingie pin limit for all digital I O IB pg mAdc pins 5 storage temperature range 50 to 150 ae 2 Operating temperature range 40 to 85 A x 7 RF Input Power ESD on any pin except for pin 13 ANT V THHBM Human Body Model HBM Lead temperature E L ttemperat r Please refer to Please refer to chapter 15 2 15 2 Moisture Sensitivity Level Moisture Sensitivity Level MSL 3 168 hours E CN 1 The maximum total current for all
34. the Data Sheet and may bear defects due to their status of development and the lack of qualification mentioned above Panasonic Electronic Devices Europe GmbH disclaims any liability or product warranty for Engineering Samples In particular Panasonic Electronic Devices Europe GmbH disclaims liability for damages caused by e the use of the Engineering Sample other than for Evaluation Purposes particularly the installation or integration in an other product to be sold by Customer e deviation or lapse in function of Engineering Sample e improper use of Engineering Samples Panasonic Electronic Devices Europe GmbH disclaimes any liability for consequential and incidental damages In case of any questions please contact your local sales partner or the related product manager 30 LIFE SUPPORT POLICY Politik fur Lebenserhaltungssysteme This Panasonic Electronic Devices Europe GmbH product is not designed for use in life Support appliances devices or systems where malfunction can reasonably be expected to result in a significant personal injury to the user or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Electronic Devices Europe GmbH for any damages
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