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MC68330 Integrated CPU32 Processor User`s Manual MC68330

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1. 3 3 V OR 5 0 V 5 0 V 16 78 MHZ 25 16 MHZ NUM CHARACTERISTIC SYMBOL MIN MAX MIN MAX UNIT System Frequency P de 16 78 dc 25 16 MHz Crystal Frequency ina 25 50 25 50 kHz On Chip VCO System Frequency fs 0 13 16 78 0 13 25 16 MHz On Chip VCO Frequency Range fyco 0 1 33 5 0 1 50 3 MHz External Clock Operation J 0 16 0 25 MHz PLL Start up Time tre 20 20 ms Limp Mode Clock Frequency fimp KEZ SYNCR X bit 0 fsys 2 fsys 2 SYNCR X bit 1 fsys feys CLKOUT stability AcLK 1 H JAA A 15 CLKOUT Period in Crystal Mode a 59 6 40 ns 1B6 External Clock Input P eriod texTeyc 62 5 40 ns 1C7 External Clock Input Period with PLL texTcyc 62 5 40 ns 2 38 CLKOUT Pulse Width in Crystal Mode tew 28 19 ns 2B 3B9 CLKOUT Pulse Width in External Mode textcw 28 18 ns 2C 3C10 CLKOUT Pulse Width in External w PLL Mode textow 31 20 ns 4 5 CLKOUT Rise and Fall Times tori 5 4 ns a The electrical specifications in this document for both the 8 39 and 16 78 MHz 3 3 V 0 3 V are preliminary and apply only to the appropriate MC68330V low voltage part b The 16 78 MHz specifications apply to the MC68330 5 0 V 5 operation MOTOROLA MC68330 USER S MANUAL ADDENDUM For More Information On This Product Go to www freescale com 16 Freescale Semiconductor Inc c The 25 16 MHz
2. MOTOROLA MC68330 USER S MANUAL ADDENDUM For More Information On This Product Go to www freescale com 27 28 Freescale Semiconductor Inc FREEZE gt lt BKPT DSCLK gt lt 81 lt IFETCH DSI X X IPIPE DSO Figure 15 Background Debug Mode Serial Port Timing ww BaP e Nae e a FREEZE IFETCH DSI Figure 16 Background Debug Mode FREEZE Timing MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc IEEE 1149 1 ELECTRICAL SPECIFICATIONS See notes a b c and d corresponding to part operation GND 0 Vdc TA 0 to 70 C see Figures 20 21 and 22 3 3 VOR 5 0 V 5 0 V 16 78 MHZ 25 16 MHZ NUM CHARACTERISTIC MIN MAX MIN MAX UNIT TCK Frequency of Operation 0 16 78 0 25 MHz 1 TCK Cycle Time in Crystal Mode 59 6 40 ns 2 TCK Clock Pulse Width Measured at 1 5 V 28 18 ns 3 TCK Rise and Fall Times 0 5 0 3 ns 6 Boundary Scan Input Data Setup Time 16 10 ns 7 Boundary Scan Input Data Hold Time 26 18 ns 8 TCK Low to Output Data Valid 0 40 0 26 ns 9 _ TCK Low to Output High Impedance 0 60 0 40 ns 10 TMS TDI Data Setup Time 15 10 ns 11 TMS TDI Data Hold Time 15 10 ns 12 TCK Low to TDO Data Valid 0 25 0 16 ns 13 TCK Low to TDO High Impedance 0 25 0 16 ns a
3. 5 0 V 5 electrical specifications are preliminary d For extended temperature parts TA 40 to 85e0C These specifications are preliminary 1 2 10 Tit 12 All internal registers retain data at 0 Hz Assumes that a stable VcCsyn is applied that an external filter capacitor with a value of 0 1 uF is attached to the XFC pin and that the crystal oscillator is stable Lock time is measured from power up to RESET release This specification also applies to the period required for PLL lock after changing the W and Y frequency control bits in the synthesizer control register SYNCR while the PLL is running and to the period required for the clock to lock after LPSTOP Determined by the initial control voltage applied to the on chip VCO The X bit in the SYNCR controls a divide by two scaler on the system clock output CLKOUT stability is the average deviation from programmed frequency measured at maximum bys Measurement is made with a stable external clock input applied using the PLL All crystal mode clock specifications are based on using a 32 768 kHz crystal for the input When using the external clock input mode MODCK reset value 0 V the minimum allowable ExTcyc period will be reduced when the duty cycle of the signal applied to EXTAL exceeds 5 tolerance The relationship between external clock input duty cycle and minimum tEXTcyc is expressed Minimum tEXTcyc period minimum textcw 50 external clock input du
4. Inc is an Equal Opportunity Affirmative Action Employer Literature Distribution Centers USA EUROPE Motorola Literature Distribution P O Box 20912 Arizona 85036 JAPAN Nippon Motorola Ltd 4 32 1 Nishi Gotanda Shinagawa ku Tokyo 141 Japan ASIA PACIFIC Motorola Semiconductors H K Ltd Silicon Harbour Center No 2 Dai King Street Tai Po Industrial Estate TT SEMICONDUCTOR PRODUCT INFORMATION me For More Information On This Product Go to www freescale com
5. See Note 1 and 4 Cin pF All Input Only Pins 10 All 1 0 Pins 20 Load Capacitance See Note 4 C 100 pF L a The electrical specifications in this document for both the 16 78 MHz 3 3 V 0 3 V are preliminary and apply only to the appropriate MC68330V low voltage part b The 16 78 MHz specifications apply to the MC68330 5 0 V 5 operation c The 25 16 MHz 5 0 V 5 electrical specifications are preliminary d For extended temperature parts TA 40 to 85e0C These specifications are preliminary 14 MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 1 Input Only Pins BERR BGACK BKPT BR DSACK1 DSACKO EXTAL TCK TDI TMS Output Only Pins A23 A0 AS BG CLKOUT CS3 CS1 DS FC2 FC0 FREEZE IFETCH IPIPE LWE RMC R W SIZ1 SIZO TDO UWE Input Output Pins Group 1 D15 DO Group 2 A31 A24 CSO IRQ7 IRQ1 MODCK Group 3 HALT RESET 2 VOH specification for HALT and RESET is not applicable because they are open drain pins 3 Supply current measured with system clock frequency of 16 78 MHz Capacitance is periodically sampled rather than 100 tested 43 AC ELECTRICAL SPECIFICATIONS CONTROL TIMING See notes a b c and d corresponding to part operation GND 0 Vdc TA 0 to 70 C see numbered notes see Figure 6
6. TA PD 8JA 1 where TA Ambient Temperature C BJA Package Thermal Resistance Junction to Ambient C W PD PINT PI O PINT ICC xVcc Watts Chip Internal Power PIO Power Dissipation on Input and Output Pins User Determined For most applications P1 O lt PINT and can be neglected An approximate relationship between Pp and TJ if P O is neglected is PD K TJ 273 C 2 Solving Equations 1 and 2 for K gives K PD TA 273 C JA PD2 3 where K is a constant pertaining to the particular part K can be determined from Equation 3 by measuring Pp at thermal equilibrium for a known TA Using this value of K the values of PD and Ty can be obtained by solving Equations 1 and 2 iteratively for any value of TA 41 AC ELECTRICAL SPECIFICATION DEFINITIONS The AC specifications presented consist of output delays input setup and hold times and signal skew times All signals are specified relative to an appropriate edge of the clock and possibly to one or more other signals The waveforms shown in Figure 5 define the measurement of the AC specifications To test the parameters guaranteed by Motorola drive inputs to the voltage levels specified in the figure Outputs are specified with minimum and or maximum limits as appropriate and are measured as shown Inputs are specified with minimum setup and hold times and are measured as shown Finally the measurement for signal to signal spec
7. The electrical specifications in this document for both the 8 39 and 16 78 MHz 3 3 V 0 3 V are preliminary and apply only to the appropriate MC68330V low voltage part b The 16 78 MHz specifications apply to the MC68330 5 0 V 5 operation c The 25 16 MHz 5 0 V 5 electrical specifications are preliminary d For extended temperature parts Ta 40 to 85 C These specifications are preliminary TCK Figure 17 TCK Input Timing Diagram MOTOROLA MC68330 USER S MANUAL ADDENDUM 29 For More Information On This Product Go to www freescale com 30 TCK DATA INPUTS DATA OUTPUTS DATA OUTPUTS DATA OUTPUTS Freescale Semiconductor Inc INPUT DATA VALID OUTPUT DATA VALID A OUTPUT DATA VALID Figure 18 Boundary Scan Timing Diagram MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com TCK TDI TMS TDO TDO TDO Freescale Semiconductor Inc INPUT DATA VALID OUTPUT DATA VALID AD A aaas OUTPUT DATA VALID Figure 19 Test Access Port Timing Diagram MOTOROLA MC68330 USER S MANUAL ADDENDUM For More Information On This Product Go to www freescale com 31 Freescale Semiconductor Inc Motorola reserves the right to make changes without further notice to any products herein Motorola makes no warranty representation or guarantee regarding the suita
8. R W Low tonRL 0 30 0 20 ns 219 R W High to AS CS Asserted TRAAA 15 10 _ ns 22 R Low to DS Asserted Write taasa 70 47 ns 23 CLKOUT High to Data Out Valid tcupo 30 20 ns 24 Data OutValid to Negating Edge of AS CS UWE LWE FastTermination tovasn 15 10 ns Write 25 DS CS Negated to Data Out Invalid Data Out Hold SNDOI 15 10 ns 26 Data Out Valid to DS Asserted Write tovsa 15 10 ns 27 Data In Valid to CLKOUT Low Data Setup toicL 5 5 ns 27A Late BERR HALT BKPT Asserted to CLKOUT Low Setup Time teELCL 20 10 ns 28 AS DS UWE LWE Negated to DSACK BERR HALT Negated SNDN 0 80 0 50 ns 294 DS CS Negated to Data In Invalid Data In Hold tonpt 0 0 E ns 2944 IDS CS Negated to Data In High Impedance tsHDI 60 40 ns 304 CLKOUT Low to Data In Invalid Fast Termination Hold teLDI 15 10 ns MOTOROLA MC68330 USER S MANUAL ADDENDUM 17 For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 44 AC TIMING SPECIFICATIONS CONTINUED See notes a b c and d corresponding to part operation GND 0 Vdc TA 0 to 7000C see numbered notes see Figure 7 Figure 16 3 3 VOR 5 0 V 5 0 V 16 78 MHZ 25 16 MHZ NUM CHARACTERISTIC SYMBOL MIN MAX MIN MAX UNIT 30A4 CLKOUT Low to Data In High Impen
9. latency from IRQx asserted to the prefetch of the first instruction in the interrupt handler is about 37 clocks worst case instruction length in clocks using two clock memory and autovector termination From the instruction timing tables this gives 37 71 DIVS L with worst case lt fea gt 108 clocks worst case interrupt latency time For applications requiring shorter interrupt response time use simpler addressing modes and or avoid using longer instructions specifically DIVS L DIVU L MUL L to reduce latency 7 INTERRUPT HOLD TIME AND SPURIOUS INTERRUPTS Add to the Interrupt Acknowledge Bus Cycles section on page 3 27 All interrupts including level 7 are level sensitive and must remain asserted until the corresponding IACK cycle otherwise a spurious interrupt exception may result or the interrupt may be ignored entirely This is also true for external interrupts that are autovectored using either the AVEC signal or the AVEC register because the SIM will not respond to an interrupt arbitration cycle on the IMB if the external interrupt at that level has been removed 8 ADDITIONAL NOTE ON INTERNAL AUTOVECTOR OPERATION Add to the Autovector Interrupt Acknowledge Cycle section on page 3 30 If an external interrupt level is autovectored either by the AVEC register programming or the external AVEC signal an external ACK will be started and terminated internally The interrupting device should not respond to this ACK in any way or t
10. page 4 13 last paragraph When operating as a global chip select CSO does not assert for accesses to either the MBAR or to internal peripheral module registers 23 TYPO INGLOBAL CHIP SELECT OPERATION On page 4 13 the last sentence of the last paragraph is incorrect It should read When the CPU32 begins fetching after reset CSO is asserted for every address until the V bit in the chip select base address register is set 24 ADDITIONAL NOTE ON PORT A B OUTPUT TIMING Add to the External Bus Interface Operation description on page 4 14 The Port A and Port B output pins transition after the S4 falling edge for the internal write to the respective data register This places port pin transitions at roughly the same time DS negates for the data register write note this output delay is not currently specified in the Electrical Specifications 25 MBAR REGISTER RESET VALUES On page 4 17 the reset values for MBAR bits 31 12 are undefined MOTOROLA MC68330 USER S MANUAL ADDENDUM 7 For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 26 MBAR AS7 BIT AND IACK CYCLES On page 4 18 for the second code sequence change the MOVE L FFFFF001 DO to MOVE L FFFFF101 D0 This sets AS7 in the MBAR to prevent the address decode for the internal 4K register block from responding to CPU space accesses In particular it prevents the register block decode of FFFFFxxx from interfering with I
11. the SIM40 registers or the CPU state 15 EXTERNAL RESET On page 3 48 Figure 3 27 the RESET signal negates for two clocks between internal and external assertions not one RESET is not actively negated and its rise time depends on the pullup resistor used MOTOROLA MC68330 USER S MANUAL ADDENDUM 3 For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 16 POWER ON RESET The figure on page 3 49 is incorrectly labeled as Figure 3 27 The figure should be labeled as Figure 3 28 Also the figure is incorrect and should be replaced with Figure 1 below CLKOUT vco e S a LOCK i e ye a M CC 328 X__ gi SIX _ a 14CLOCKS TCLKIN TCLKOUT esem A LT o BUS CYCLES BUS STATE ADDRESS AND UNKNOWN gt lt CONTROL SIGNALS THREE STATED NOTES 1 Internal start up time 2 SSP read here 3 PC read here 4 First instruction fetched here Figure 1 Initial Reset Operation Timing In Figure 1 above Initial Reset Operation Timing CLKOUT is not gated by VCO lock or other internal control signals and can begin toggling as soon as VCC is high enough for the internal logic to begin operating For crystal mode and external clock with VCO mode after the VCO frequency has reached an initial stable value the 328 TCLKIN delay is counted down and VCO lock is set after completion of the 328 clock delay For external clock mode without VCO the 328 TCLKIN delay starts as soo
12. 3 3 V Plastic Quad Flat Pack 0 16 0 C to 70 C MC68330FC16V FC Suffix 3 3 V Thin Quad Flat Pack 0 16 0 C to 70 C MC68330PV16V PV Suffix 38 ELECTRICAL CHARACTERISTICS Most of the electrical characteristics are not printed in the MC68330 Integrated CPU32 Processor User s Manual They are reprinted here for your convenience 39 MAXIMUM RATINGS The following ratings define a range of RATING SYMBOL VALUE UNIT os conditions in which the device will operate Supply Voltage Vcc 0 3to 7 0 V without being damaged However Input Voltage Vin 0 3 to 7 0 V sections of the device may not operate normally while being exposed to the peering empeleiuie ange TA eae 3 electrical extremes This device contains Storage Temperature Range Tstg 55 to 150 C circuitry to protect against damage due to high static voltages or electrical fields however Motorola advises users to take normal precautions to avoid application of any voltages higher than maximum rated voltages to this high impedance circuit Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level e g either GND or VCC MOTOROLA MC68330 USER S MANUAL ADDENDUM For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 40 POWER CONSIDERATIONS The average chip junction temperature TJ in C can be obtained from TJ
13. 70 C see numbered notes see Figure 7 Figure 16 3 3 V OR 5 0 V 5 0 V 16 78 MHZ 25 16 MHZ NUM CHARACTERISTIC SYMBOL MIN MAX MIN MAX UNIT 6 CLKOUT High to Address FC SIZ Valid tcHAV 0 30 0 20 ns 6A CLKOUT High to RMC Valid tCHAVB 0 35 0 25 ns 7 CLKOUT High to Address Data FC SIZ RMC High Impedance topaz 0 60 0 40 ns 8 CLKOUT High to Address FC SIZ RMC Invalid touazn 0 0 ns 99 CLKOUT Low to AS DS CS UWE LWE IFETCH IPIPE IACK Asserted teLsa 3 30 3 20 ns gA 2 JAS to DS or CS Asserted Read tots 15 15 6 6 ns 11 Address FC SIZ RMC Valid to AS CS and DS Read UWE LWE tavsa 15 10 ns Asserted 12 CLKOUT Low to AS DS CS UWE LWE IFETCH IPIPE IAC K Negated teLSN 3 30 3 20 ns 13 JAS DS CS UWE LWE IACK Negated to Address FC SIZ Invalid tonal 15 10 ns Address Hold 14 JAS CS UWE LWE and DS Read Width Asserted tswa 100 70 ns 14A DS Width Asserted Write towaw 45 30 ns 14B JAS CS UWE LWE IACK and DS Read Width Asserted Fast towpw 40 30 ns Termination Cycle 453 JAS DS CS UWE LWE Width Negated ton 40 30 ns 16 CLKOUT High to AS DS UWE LWE R W High Impedance tousz 60 40 ns 17 JAS DS CS UWE LWE Negated to R W High tonRN 15 10 ns 18 CLKOUT High to R W High touRH 0 30 0 20 ns 20 CLKOUT High to
14. 767 11534 23069 23069 46137 92275 12 1704 3408 6816 6816 13631 27263 44 5898 11796 23593 23593 47186 94372 13 1835 3670 7340 7340 14680 29360 45 6029 12059 24117 24117 48234 96469 14 1966 3932 7864 7864 15729 31457 46 6160 12321 24642 24642 49283 98566 15 2097 4194 8389 8389 16777 33554 47 6291 12583 25166 25166 50332 100663 16 2228 4456 8913 8913 17826 35652 48 6423 12845 25690 25690 51380 102760 17 2359 4719 9437 9437 18874 37749 49 6554 13107 26214 26214 52429 104858 18 2490 4981 9961 9961 19923 39846 50 6685 13369 26739 26739 53477 106955 19 2621 5243 10486 10486 20972 41943 51 6816 13631 27263 27263 54526 109052 20 2753 5505 11010 11010 22020 44040 52 6947 13894 27787 27787 55575 111149 21 2884 5767 11534 11534 23069 46137 53 7078 14156 28312 28312 56623 113246 22 3015 6029 12059 12059 24117 48234 54 7209 14418 28836 28836 57672 115343 23 3146 6291 12583 12583 25166 50332 55 7340 14680 29360 29360 58720 117441 24 3277 6554 13107 13107 26214 52429 56 7471 14942 29884 29884 59769 119538 6 MC68330 USER S MANUAL ADDENDUM MOTOROLA Freescale Semiconductor Inc Table 1 System Frequencies From 32 768 kHz R
15. ACK cycles address FFFFFFFx and possibly corrupting the vector number returned This change does not affect normal interrupt acknowledge operation for the internal modules 27 ADDITIONAL NOTE ON VCO OVERSHOOT On page 4 25 place the following note under the Y bits description NOTE A VCO overshoot can occur when increasing the operating frequency by changing the Y bits in the SYNCR register The following procedure controls the effects of this overshoot 1 Write the X bit to zero This will reduce the previous frequency by one half 2 Write the Y bits to the desired frequency divided by 2 3 After the VCO lock has occurred write the X bit to one This changes the clock frequency to the desired frequency Steps 1 and 2 may be combined 28 BUS ERROR STACK FRAME On page 5 82 in the next to last paragraph delete the internal transfer count register is located at SP 10 and the SSW is located at SP 12 The stack space allocation is the same for both faults the location of the internal count register and SSW remains the same The only difference is that the faulted instruction program counter location SP 10 and SP 12 will contain invalid data To tell the difference between the two stack frames look at the first nibble of the faulted exception format vector word located at SP E it will be 0 for the four word frame and 2 for the six word frame 29 DSO TIMING On page 5 92 Figure 5 32 DSO transitions one clock later than sho
16. CL 84 2 ns 16 78 MHz clock MOTOROLA MC68330 USER S MANUAL ADDENDUM 19 For More Information On This Product Go to www freescale com Freescale Semiconductor Inc so S1 S2 S3 S4 s5 CLKOUT ANY f lt 5 6 maa O A31 A0 FC2 FC0 S SIZ1 SIZ0 A ni RMC ra Qo RW a nn 28 DSACK1 DSACKO X D15 D0 ASYNCHRONOUS INPUTS NOTE All timing is shown with respect to 0 8V and 2 0V levels Figure 7 Read Cycle Timing Diagram 20 MC68330 USER S MANUAL ADDENDUM For More Information On This Product Go to www freescale com MOTOROLA CLKOUT A31 A0 FC2 FC0 SIZ1 SIZ0 RMC RW DSACK1 DSACKO D15 D0 BERR HALT BKPT Freescale Semiconductor Inc NOTE All timing is shown with respect to 0 8V and 2 0V levels Figure 8 Write Cycle Timing Diagram MOTOROLA MC68330 USER S MANUAL ADDENDUM 21 For More Information On This Product Go to www freescale com 22 Freescale Semiconductor Inc CLKOUT A31 A0 FC2 FCO IZ1 S1Z0 RM RW D15 D0 BKPT Figure 9 Fast Termination Read Cycle Timing Diagram MC68330 USER S MANUAL ADDENDUM For More Information On This Product Go to www freescale com MOTOROLA Freescale Semiconductor Inc CLKOUT A31 A0 FC2 FCO 1Z1 SIZ0 RMC RW UWE L
17. Freescale Semiconductor Inc Order this document by MOTOROLA casos Microprocessor and Memory Technologies Group MC68330 Addendum to MC68330 Integrated CPU32 Processor User s Manual 26 January 1996 This addendum to the initial release of the MC68330UM AD User s Manual provides corrections to the original text plus additional information not included in the original This document and other information on this product is maintained on the AESOP BBS which can be reached at 800 843 3451 from the U S and Canada or 512 891 3650 Configure modem for up to 14 4Kbaud 8 bits 1 stop bit and no parity Terminal software should support VT100 emulation Internet access is provided by telneting to pirs aus sps mot com 129 38 233 1 or through the World Wide Web at http pirs aus sps mot com 1 OPERAND ALIGNMENT On page 3 7 third paragraph under 3 2 2 change the first two lines to The CPU32 restricts all operands both data and instructions to be word aligned That is word and long word operands must be located on a word boundary Longword operands do not have to be longword aligned 2 TYPO IN FAST TERMINATION TIMING DIAGRAM On page 3 16 UWE and LWE in Figure 3 6 do not assert during a fast termination write The signals should remain high 3 ADDITIONAL NOTE ON MBAR DECODE Add to the CPU Space Cycles description on page 3 22 The CPU space decode logic allocates the 256 byte block from 3FF00 3FFFF to the SIM modu
18. V and 2 0 V levels unless otherwise noted 2 This number can be reduced to 5 ns if strobes have equal loads 3 If multiple chip selects are used the CS width negated 15 applies to the time from the negation of a heavily loaded chip select to the assertion of a lightly loaded chip select 4 These hold times are specified with respect to DS or CS on asynchronous reads and with respect to CLKOUT on fast termination reads The user is free to use either hold time for fast termination reads 5 If the asynchronous setup time 47 requirements are satisfied the DSACK low to data setup time 31 and DSACK low to BERR low setup time 48 can be ignored The data must only satisfy the data in to CLKOUT low setup time 27 for the following clock cycle BERR must only satisfy the late BERR low to CLKOUT low setup time 27A for the following clock cycle 6 To ensure coherency during every operand transfer BG will not be asserted in response to BR until after cycles of the current operand transfer are complete and RMC is negated In the absence of DSACK BERR is an asynchronous input using the asynchronous setup time 47 8 Specification 47A for 16 78 MHz 3 3 V 0 3V will be 8 ns 9 During interrupt acknowledge cycles up to two wait states may be inserted by the processor between states SO and S1 10 Address Access Time 2tcyc CW tCHAV tDICL 112 2 ns 16 78 MHz clock Chip Select Access Time 2tcyc tCLSA tDI
19. WE D15 D0 Figure 10 Fast Termination Write Cycle Timing Diagram MOTOROLA MC68330 USER S MANUAL ADDENDUM For More Information On This Product Go to www freescale com 23 Freescale Semiconductor Inc S0 S1 S2 3 S4 S5 D P Nes aA VW ta Ay a DSACKO DSACK1 Figure 11 Bus Arbitration Timing Active Bus Case 24 MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc Figure 12 Bus Arbitration Timing Idle Bus Case MOTOROLA MC68330 USER S MANUAL ADDENDUM For More Information On This Product Go to www freescale com 25 26 CLKOUT A31 A0 D15 D0 wo E 4 Freescale Semiconductor Inc SHOW CYCLE gt lt start OF EXTERNAL CYCLE gt Figure 13 Show Cycle Timing Diagram MC68330 USER S MANUAL ADDENDUM For More Information On This Product Go to www freescale com MOTOROLA Freescale Semiconductor Inc S0 0 2 CLOCKS 1 S2 3 S4 55 lt gt 6 lt gt 1Z1 1Z0 8 FC3 FCO A31 A0 lt gt lt _t AS os D lt as DSACK1 S es Ue 31 _ gt D15 D0 Up to two wait states may be inserted by the processor between states SO and S1 Figure 14 IACK Cycle Timing Diagram
20. bility of its products for any particular purpose nor does Motorola assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability including without limitation consequential or incidental damages Typical parameters can and do vary in different applications All operating parameters including Typicals must be validated for each customer application by customer s technical experts Motorola does not convey any license under its patent rights nor the rights of others Motorola products are not designed intended or authorized for use as components in systems intended for surgical implant into the body or other applications intended to support or sustain life or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur Should Buyer purchase or use Motorola products for any such unintended or unauthorized application Buyer shall indemnify and hold Motorola and its officers employees subsidiaries affiliates and distributors harmless against all claims costs damages and expenses and reasonable attorney fees arising out of directly or indirectly any claim of personal injury or death associated with such unintended or unauthorized use even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part Motorola and are registered trademarks of Motorola Inc Motorola
21. dance toLDH 90 60 ns 315 DSACK Asserted to Data In Valid toapl 50 32 ns 31A DSACK Asserted to DSACK Valid Skew LADY 30 20 ns 32 HALT and RESET Input Transition Time turri 200 140 ns 33 CLKOUT Low to BG Asserted lopa 30 20 ns 34 CLKOUT Low to BG Negated toLBN 30 20 ns 356 BR Asserted to BG Asserted RMC Not Asserted BRAGA 1 C 1 CLK OUT 37 BGACK Asserted to BG Negated SAGN 1 2 5 1 2 5 CLK OUT 39 BG Width Negated ton 2 2 CLK OUT 39A BG Width Asserted ton 1 1 CLK OUT 46 R W Width Asserted Write or Read tawa 150 100 ns 46A R W Width Asserted Fast Termination Write or R ead tawas 90 60 ns 47A8 Asynchronous Input Setup Time taist 8 5 5 E ns 47B Asynchronous Input Hold Time tart 15 10 ns 485 7 DSACK Asserted to BERR HALT Asserted toapa 30 20 ns 53 Data Out Hold from CLKOUT High thocu 0 0 ns 54 CLKOUT High to Data Out High Impedance touDH 30 20 ns 55 R W Asserted to Data Bus Impedance Change tpapc 40 25 ns 56 RESET Pulse Width Reset Instruction turpw 512 512 CLK OUT 56A RESET Pulse Width Input from External Device tRPwi 590 590 CLK OUT 57 BERR Negated to HALT Negated Rerun teNHN 0 0 ns 70 CLKOUT Low to Data Bus Driven Show Cycle tscLDD 0 30 0 20 ns 71 Data Setup Time to CLKOUT Low Show Cycle tscLDS 15 10 ns 72 Data Hold from CLKOUT Low S
22. e Semiconductor Inc For More Information On This Product Go to www freescale com CLKOUT VCO CLKOUT VCO CLKOUT VCO CLKOUT VCO y2 KHZ KHZ KHz KHZ y2 KHZ KHZ KHZ KHZ W 02 W 02 W 12 W 12 W 0 W 0 W 1 W 1 X 0 X 1 X X X 0 X 1 X X X 0 X 1 X X X 0 X 1 X X 0 131 262 524 524 1049 2097 32 4325 8651 17302 17302 34603 69206 1 262 524 1049 1049 2097 4194 33 4456 8913 17826 17826 35652 71303 2 393 786 1573 1573 3146 6291 34 4588 9175 18350 18350 36700 73400 3 524 1049 2097 2097 4194 8389 35 4719 9437 18874 18874 37749 75497 4 655 1311 2621 2621 5243 10486 36 4850 9699 19399 19399 38797 77595 5 786 1573 3146 3146 6291 12583 37 4981 9961 19923 19923 39846 79692 6 918 1835 3670 3670 7340 14680 38 5112 10224 20447 20447 40894 81789 7 1049 2097 4194 4194 8389 16777 39 5243 10486 20972 20972 41943 83886 8 1180 2359 4719 4719 9437 18874 40 5374 10748 21496 21496 42992 85983 9 1311 2621 5243 5243 10486 20972 41 5505 11010 22020 22020 44040 88080 10 1442 2884 5767 5767 11534 23069 42 5636 11272 22544 22544 45089 90178 11 1573 3146 6291 6291 12583 25166 43 5
23. eference CLKOUT vco CLKOUT vco CLKOUT VCO CLKOUT VCO y2 KHz KHZ KHz KHZ y2 KHZ KHZ KHZ KHZ W 0 W 0 W 1 W 1 W 0 W 0 W 1 W 1 X 0 X 1 X X X 0 X 1 X X X 0 X 1 X X X 0 X 1 X X 25 3408 6816 13631 13637 27263 54526 57 7602 15204 30409 30409 60817 121635 26 3539 7078 14156 14156 28312 56623 58 7733 15466 30933 30933 61866 123732 27 3670 7340 14680 14680 29360 58720 59 7864 15729 31457 31457 62915 125829 28 3801 7602 15204 15204 30409 60817 60 7995 15991 31982 31982 63963 127926 29 3932 7864 15729 15729 31457 62915 61 8126 16253 32506 32506 65012 130023 30 4063 8126 16253 16253 32506 65012 62 8258 16515 33030 33030 66060 132121 31 4194 8389 16777 16777 33554 67109 63 8389 16777 33554 33554 67109 134218 1 Some W X Y bit combinations shown may select a CLKOUT or VCO frequency higher than spec Refer to Section 11 Electrical Characteristics for CLKOUT and VCO frequency limits 2 Any change to Wor Y results in a change in the VCO frequency the VCO should be allowed time to relock if necessary 3 Programming which violates current 25MHz electrical specs is shown in italics any combination of W 1 and Y gt 23 22 ADDITIONAL NOTE FOR GLOBAL CHIP SELECT On
24. et circuit that generates an appropriate delay for the power source being used as well as a voltage monitor if needed MOTOROLA MC68330 USER S MANUAL ADDENDUM 9 For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 35 SRAM INTERFACE The SRAM interface shown in Figure 7 4 page 70 3 is incorrect The corrected drawing is shown below in Figure 4 MC68340 MCM6206 35 EVEN BYTE ODD BYTE Figure 4 SRAM Interface 36 ADDITIONAL NOTES ON ROM INTERFACE On page 7 4 Figure 7 5 EPROM interface Connect OE to CSO and CE to ground to maximize available access time at the expense of power consumption Alternatively connect OE and CE to CS0 to deselect the EPROM between accesses and lower power consumption 10 MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 37 STANDARD MC68330 ORDERING INFORMATION Update table 12 1 as shown in Table 2 below Table 2 Standard MC68330 Ordering Information SUPPLY PACKAGE TYPE FREQUENCY TEMPERATURE ORDER NUMBER VOLTAGE MHZ 5 0 V Plastic Quad Flat Pack 0 16 0 C to 70 C MC68330FC16 FC Suffix 0 16 40 C to 85 C MC68330CFC16 0 25 0 C to 70 C MC68330FC25 5 0 V Thin Quad Flat Pack 0 16 0 C to 70 C MC68330PV16 PV Suffix 0 16 40 C to 85 C MC68330CPV16 0 25 0 C to 70 C MC68330PV25
25. he resulting operation is undefined 9 ADDITIONAL NOTES ON RETRY TERMINATION On page 3 34 Table 3 4 When HALT and BERR are asserted together in case 5 to force a retry of the current bus cycle relative timing of HALT and BERR must be controlled to avoid inadvertantly causing bus error termination case 3 This can be done several ways 1 by asserting HALT and BERR either synchronously to the clock to directly controlling which edge each is recognized on or 2 asynchronously with HALT asserted for time spec 47A spec 47B ns before BERR to guarantee recognition on or before the same clock edge as BERR 2 MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 10 NEGATION OF HALT AND BERR FOR RETRY SEQUENCE AND LATE RETRY SEQUENCE Figure 3 19 and Figure 3 20 on pages 3 37 and 3 38 respectively should show BERR and HALT being negated one half clock cycle earlier 11 ACTIVE NEGATE ON BUS ARBITRATION The 68330 actively pulls up all three stateable bus pins other than the data bus before three stating them during bus arbitration This pullup function is not guaranteed to result in spec VOH levels before three stating but will help reduce rise time on these signals when using weak external bus pullups 12 ADDITIONAL NOTE ON BUS ARBITRATION PRIORITY For the bus arbitration description beginning on page 3 40 The arbitration prior
26. how Cycle SCLDH 10 6 ns 80 DSI Input Setup Time ae 15 10 ns 81 DSI Input Hold Time ee 10 6 ns 82 DSCLK Setup Time tisgs 15 10 ns 83 DSCLK Hold Time lice 10 6 ns 18 MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 44 AC TIMING SPECIFICATIONS CONTINUED See notes a b c and d corresponding to part operation GND 0 Vdc TA 0 to 70 C see numbered notes see Figure 7 Figure 16 3 3 VOR 5 0 V 5 0 V 16 78 MHZ 25 16 MHZ NUM CHARACTERISTIC SYMBOL MIN MAX MIN MAX UNIT 84 DSO Delay Time aun teye teyct ns 25 16 85 DSCLK Cycle tsceye 2 2 CLK OUT 86 CLKOUT High to FREEZE Asserted ae 0 50 0 35 ns 87 CLKOUT High to FREEZE Negated aaa 0 50 0 35 ns 88 CLKOUT High to IFETCH High Impedance tiez 0 50 0 35 ns 89 CLKOUT High to IFETCH Valid te 0 50 0 35 ns a The electrical specifications in this document for both the 8 39 and 16 78 MHz 3 3 V 0 3 V are preliminary and apply only to the appropriate MC68330V low voltage part b The 16 78 MHz specifications apply to the MC68330 5 0 V 5 operation c The 25 16 MHz 5 0 V 5 electrical specifications are preliminary d For extended temperature parts Ta 40 to 85 C These specifications are preliminary 1 All AC timing is shown with respect to 0 8
27. ifications is shown NOTE The testing levels used to verify conformance to the AC specifications do not affect the guaranteed DC operation of the device as specified in the DC electrical characteristics 12 MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc DRIVE CLK DRIVE TO 05V VALID OUTPUTS 1 CLK OUTAT i nel lt x A gt B VALID VALID OUTP UTS 2 CLK OUTPUT n OUTPUT Nt DRIVETO gt 24V INPUTS 3 CLK DRIVETO _ 0 5V INPUTS 4 CLK 2 0 V ALL SIGNALS 5 0 8 V 2 0 V 0 8 V NOTES 1 This output timing is applicable to all parameters specified relative to the rising edge of the clock 2 This output timing is applicable to all parameters specified relative to the falling edge of the clock 3 This input timing is applicable to all parameters specified relative to the rising edge of the clock 4 This input timing is applicable to all parameters specified relative to the falling edge of the clock 5 This timing is applicable to all parameters specified relative to the assertion negation of another signal LEGEND A Maximum output delay specification B Minimum output hold time C Minimum input setup time specification D Minimum input hold time specification E Signal valid to signal valid specification maximum or minimum F Signal valid to signal invalid specification maximum or mini
28. ity between possible bus masters for this device is external request via BR highest priority then CPU lowest 13 ADDITIONAL NOTE ON BUS ARBITRATION AND OPERAND COHERENCY For the bus arbitration description beginning on page 3 40 Each bus master maintains operand coherency when a higher priority request is recognized For example a CPU write of a longword operand to a byte port results in a sequence of four bus cycles to complete the operand transfer the CPU will not release the bus until the completion of the fourth bus cycle The RMC read write sequences for a TAS instruction are also indivisible to guarantee data coherency Arbitration is allowed between each operand transfer of a multi operand operation such as a MOVEM instruction or exception stacking 14 ADDITIONAL NOTES ON RESET INTERACTION WITH CURRENT BUS CYCLE Add to the Reset Operation description beginning page 3 47 Hardware resets are delayed until completion of the current operand transfer for maintaining operand coherency The processor resets at the end of the bus cycle in which the last portion of the operand is transfered or after the bus monitor has timed out The bus monitor operates whether or not it is enabled for the time period to which the BMT bits are set The following reset sources initialize all internal registers to their reset state external POR software watchdog double bus fault loss of clock Execution of a RESET instruction does not effect any of
29. le An internal two clock termination is provided by this initial decode for any access to this range but selection of specific registers depends on additional decode Accesses to the MBAR register at longword 3FFO00 are internal only and are only visible by enabling show cycles Users should directly access only the MBAR register and use the LPSTOP instruction to generate the LPSTOP broadcast access to 3FFFE The remaining address range 3FF04 3FFFD is Motorola reserved and should not be accessed This document contains information on a product under development Motorola reserves the right to change or discontinue this product without notice ee SEMICONDUCTOR PRODUCT INFORMATION m 1996 Motorola Inc All Rights Reserved For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 4 ADDITIONAL NOTES ON CPU SPACE ADDRESS ENCODING On page 3 22 Figure 3 10 the BKPT field for the Breakpoint Acknowledge address encoding is on bits 4 2 and the T bit is on bit 1 The Interrupt Acknowledge LEVEL field is on bits 3 1 5 BREAKPOINTS On page 3 21 the first paragraph implies that either a software breakpoint BKPT instruction or hardware breakpoint can insert an instruction As noted in the following paragraphs only a software breakpoint can insert an instruction on the breakpoint acknowledge cycle 6 INTERRUPT LATENCY Add to the Interrupt Acknowledge Bus Cycles section on page 3 27 Interrupt
30. mum Figure 5 Drive Levels and Test Points for AC Specifications MOTOROLA MC68330 USER S MANUAL ADDENDUM 13 For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 42 DC ELECTRICAL SPECIFICATIONS See notes a b c and d corresponding to part operation GND 0 Vdc TA 0 to 70 C see numbered notes CHARACTERISTIC SYMBOL MIN MAX UNIT Input High Voltage except clock sti f My SY OY PC Input Low Voltage Vi GND 0 8 V Clock Input High Voltage EXTAL X1 Vince 0 7 VCC Vcc 0 3 V Undershoot 0 8 V Input Leakage Current All Input Only Pins lin 2 5 2 5 uA Vin Vcc or GND Hi Z Off S tate Leakage Current All Non Crystal Outputs and I O Pins See Note loz 20 20 uA 1 Vin 0 5 2 4 V Signal Low Input Current ViL 0 8 V TMS TDI I 0 015 0 2 mA Signal High Input Current ViH 2 0 V TMS TDI l4 0 015 0 2 mA Output High Voltage See Notes 1 and 2 VoH V IOH 0 8 mA Vcc 4 75 V All Noncrystal Outputs except HALT RESET 2 4 Output Low Voltage See Note 1 VoL V lo 2 0 mACLKOUT FREEZE IPIPE IFETCH 0 5 Ig 3 2 mAA23 A0 D15 D0 FC2 FC0 SIZ1 SIZO 0 5 Ig 5 3 mAAII Other Output Only and Group 2 1 0 Pins oa Io 15 3 mAHALT RESET Total Supply Current at 5 V 5 16 78 MHz RUN see Note 3 lop 120 mA STOP VCO Off S 300 uA IDD Power Dissipation at5 V 5 16 78 MHz Py 630 mW Input Capacitance
31. n When using external clock with VCO mode for frequencies gt 1MHz start with a capacitance value of 10000pf F_MHz For example at 16 0MHz the recommended XFC capacitance is approximately 10000pf 16 0 625pf choose the next higher standard value available 20 VCO FREQUENCY LIMIT On page 4 11 last paragraph although clearing the X bit does affect the system frequency it has no affect on the VCO frequency because the divider that X controls lies outside the feedback loop Changing the W or Y bits does change the VCO frequency Users should consider the maximum VCO frequency limit when programming these bits 21 CLKOUT AND VCO FREQUENCY PROGRAMMING On page 4 12 Table 4 2 should be replaced by the following full table of frequencies Although a complete table is shown for all W X Y combinations users must observe both CLKOUT and VCO frequency limits when programming the SYNCR For example a system operating frequency CLKOUT of 25 16MHz can be selected with W X Y 1 1 23 resulting ina VCO frequency of 50 3MHz However programming W X Y 1 0 47 to achieve the same system frequency would result in a VCO frequency of gt 100MHz which is outside the spec VCO frequency operating range Programming that violates current 25MHz electrical specs is shown in italics MOTOROLA MC68330 USER S MANUAL ADDENDUM 5 For More Information On This Product Go to www freescale com Table 1 System Frequencies From 32 768 kHz Reference Freescal
32. n as EXTAL clock transitions are recognized See Additional Notes on Power On Reset on page 9 for more POR information 17 ADDITIONAL NOTE FOR EXTERNAL CLOCK MODE WITH PLL On page 4 8 External Clock Mode with PLL the PLL phase locks the CLKOUT falling edge to the falling edge of the EXTAL input clock Maximum skew between falling edges of the EXTAL and CLKOUT signals is specified in AC ELECTRICAL SPECIFICATIONS CONTROL TIMING on page 15 18 VCO BLOCK DIAGRAM The clock output from the VCO block shown in Figure 4 4 on page 4 9 is actually the VCO output divided by 2 See the corrected figure below default values for W X and Y SYNCR bits and resulting clock frequencies are shown in italics 4 MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc EXTAL XTAL XFC Tn 32 768KHz 33 55MHz SYSTEM CLOCK 8 39MHz 2 10MHz 524KHz 64 MODULUS DIVIDER 1 64 32 768KHz FEEDBACK DIVIDER Default bit values after reset and resulting frequencies are shown in italics for VCO operation with a 32 768KHz crystal oscillator circuit Figure 2 Clock Block Diagram for Crystal Operation 19 RECOMMENDED XFC CAPACITOR VALUES On page 4 11 second paragraph of 4 2 3 1 Phase Comparator and Filter and page 7 2 last paragraph The XFC capacitor recommendation of 0 01uF to 0 1uF applies specifically to crystal mode operatio
33. ry on page 7 3 with the following paragraphs The SIM module generates a power on reset POR when it detects a positive going Vcc transition the VCC threshold is typically in the range 2 0 2 7V and varies depending on processing and environmental variables Hysteresis is included in the reset circuit to prevent reassertion for a monotonically increasing VCC voltage however excessively long VCC rise times gt 100 ms may allow the reset logic to release RESET before VCC has stabilized Users should not rely on the reset thresholds provided in the SIM to monitor Vcc because internal logic may fail at voltages between spec VCCmin and the reset trigger threshold Instead use an external low voltage monitor circuit such as the MC34064 When the processor is used in crystal clock mode the simplest external reset logic consists of simply a 1K pullup resistor from RESET to Vcc This solution relies on a monotonically increasing Vcc that has a rise time on the order of 100ms or less the actual allowable rise time depends on the startup time of the 32 768kHz oscillator circuit As noted above this does not provide rigorous VCC monitoring and may be susceptible to sags or glitches in the Vcc supply voltage In external clock mode either with or without the PLL the POR time delay of 328 Telkin does not provide adequate time for VCC to stabilize before allowing reset to negate Applications using these two clocking modes should include an external res
34. ty cycle tolerance Minimum external clock low and high times are based on a 45 duty cycle When using the external clock input mode with the PLL MODCK reset value 0 V the external clock input duty cycle can be at minimum 20 to produce a CLKOUT with a 50 duty cycle For crystal mode operation the minimum CLKOUT pulse width is based on a 47 duty cycle For external clock mode operation the minimum CLKOUT pulse width is based on a 45 duty cycle with a 50 duty cycle input clock For external clock w PLL mode operation the minimum CLKOUT pulse width is based on a 50 duty cycle For external clock mode there is a 10 40 ns skew between the input clock signal and the output CLKOUT signal from the MC68330 Clock skew is measured from the rising edges of the clock signals For external clock mode w PLL there is a 5 ns skew between the input clock signal and the output CLKOUT signal from the MC68330 Clock skew is measured from the rising edges of the clock signals GQ lt x gt NOTES 1 All timing except two and three is measured with respect to 0 8 V and 2 0 V 2 Two and three are measured from 1 5 V to 1 5 V Figure 6 Clock Output Timing Diagram MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 44 AC TIMING SPECIFICATIONS See notes a b c and d corresponding to part operation GND 0 Vdc TA 0 to
35. wn 30 TYPO ON BDM RSREG COMMAND On page 5 98 Section 5 7 2 8 6 RSREG register bit 8 should be a 1 31 IPIPE TIMING On page 5 109 Figure 5 38 shows the third IPIPE assertion low lasting for 1 5 CLKs It actually asserts for an additional 0 5 CLKs IPIPE transitions occur after the falling edge of CLKOUT 8 MC68330 USER S MANUAL ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc 32 ADDITIONAL NOTE ON OSCILLATOR LAYOUT GUIDELINES Add to the Processor Clock Circuitry page 7 1 and Serial Interface page 7 4 sections In general use short connections and place external oscillator components close to the processor Do not route other signals through or near the oscillator circuit especially high frequency signals like CLKOUT and AS Place a ground shield around the oscillator logic use a separate trace for ground to the oscillator so that it does not carry any digital switching noise 33 RECOMMENDED 32KHZ OSCILLATOR CIRCUIT On page 7 2 Figure 7 2 the component values shown in the example 32kHz oscillator circuit may not provide enough loop gain for all crystals For a more generally robust oscillator circuit change C1 and C2 as shown below Users can substitute a10M resistor for the 20M R2 bias resistor as shown XTAL MC683xx EXTAL Figure 3 Sample Crystal Circuit 34 ADDITIONAL NOTES ON POWER ON RESET Replace Section 7 1 2 Reset Circuit

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