Elastomer Socket - Ironwood Electronics
Contents
1. r O N WO O d Tel 800 404 0204 F C T R O N C S www ironwoodelectronics com GHz BGA Socket User Manual gt www ironwoodelectronics com g q lt m em ares Oo eb pm Sa T 5 E P Page 1 SGB doc Rev R VP 11 5 10 rO n WO O d Tel 800 404 0204 L E C T R O N C S www ironwoodelectronics com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF QFN Socket Assembly Torque Driver Vacuum Pen Elastomer Cleaning Procedure Surface Mount SM Adaptor Thru Hole TH Adaptor GHZ socket Mechanical Specifications Elastomer Specification Heat Sink Specifications pa a ma MRR LQ WO 04 G Lh Lh WW Page 2 SGB doc Rev S RP 12 5 14 roO n WO O d Tel 800 404 0204 L E C T R O N C S www ironwoodelectronics com Selecting a BGA socket The IC package drawing is required to select the correct GHz socket Go to www ironwoodelectronics com Select the Products link then under the Browse menu select the GHz BGA amp MLF socket link For 1 27mm Imm 0 8mm and 0 75mm pitch BGA devices select the SG BGA 6xxx link For 0 65mm and 0 5mm pitch BGA device select the SG BGA 7xxx link In the table select the part number that corresponds to your IC size length mm x width mm array size rows x columns and pitch mm Note More than2. 500 Page 11 SGB doc Rev S RP 12 5 14 roO n WO O d Tel 800 404 0204 L E C T R O N C S www ironwoodelectronics com Recommended Reflow Profile High Temperature RoHS Profile for n96 5 Ag3 0 Cu 5 and n96 5 Ag3 5 alloys Reflow Time 30 60 Sec RAMP lt 2 0 C Second Soaking Zone Soak Temp 140 200 C Soak Time 60 90 Sec Pre heat 1 Pre heat 2 120 150 180 210 240 270 200 330 Time Sec Figure 12 Recommended Reflow Profile High Temperature RoHS 4 Surface tension between the adapter s solder spheres and the target PCB s pads will self align the part during the reflow process 5 Reflow e Use caution when profiling to insure minimal temperature difference lt 150 C and preferably lt 100 C between components Forced convection reflow with nitrogen preferred 50 75 PPM Preheat stage temperature ramp rate lt 20 C per second Time required in Flux Activation stage 120 seconds Flux Activation stage temperature range 140 to 145 C Time required in Solder stage 30 60 seconds Maximum temperature 230 249 C Do not exceed 10 seconds at maximum temperature Cool Down stage temperature reduction rate lt 20 C per second NOTE It may be necessary to adjust the amount of heat when attaching the part due to the fact that the adapter mass is different from the actual IC package Solder sphere spec Sn96 5 Ag3 0 Cu0 5 and its melting point 219 C 6 Clean PCB with the flux manufacturers
3. as socket with a fan Papst 3412 9 GL 35 9 CFM 6 muffin blowing directly on it For high power dissipation a specific heat sink lid can be designed using QFIN software Please call Ironwood Tech Support 1 800 404 0204 IC Size mm R Socket Fan amp Socket Only Trend Socket Fan Trend Socket Only Figure 15 Heat Sink Characteristics 0 O C Q sind L TA O Bem E U fm Page 15 SGB doc Rev S RP 12 5 14
4. 100 C Solder balls from the IC package come in contact with the top end of elastomer wire The bottom end of the elastomer wire contacts the circuit board pad and thereby makes an electrical path for the signal The number of wire filaments making contact depends on the solder ball and circuit board pad diameters Figure 3 shows the cross sectional side view of the elastomer with the BGA IC The GHz socket can be summarized as a mechanism in which a downward force applied to an IC compresses its solder balls onto an elastomer which in turn compresses on the circuit board thereby making electrical connection a Signal goes from BGA solder ball to elastomer to Customer s board BGA chip j _ 0 75mm thick Elastomer A ustomer s target board Figure 3 Elastomer cross sectional side view PCB Requirements General Where IC body size is lt 30 5mm GHz socket requires 4 mounting holes Where IC body size is gt 30 5mm GHz socket requires 8 mounting holes e Two alignment holes are employed in all sockets See drawing for location details BGA pattern is not symmetrical with mounting holes due to angled wires in elastomer see drawing for layout details Please refer to page 2 of the socket drawing for all PCB recommendations Thickness 1 6mm minimum This will change as per customer s application environment and usage Finish SnPb plating or Immersion Au or Immersion Ag Other plating may be used but t
5. 20 019 Surface Mount SM Adaptor a por See figure 9 If the target soma om circuit board already exists or mounting holes cannot be FRAGD ar equivalent high Emp material Nor clad drilled on the board then a A SM adaptor can be used with q A A S a iini aa i has solder balls on the bottom side and round pads on the topside It looks very similar to the actual IC except it is slightly larger than the IC It has threaded insert on four corners GHz socket can be mounted on to this adapter using the screws that mate into the threaded insert Materials Non clad FR4 Phosphorous Bronze pins 63Sn 37Pb Solder balls Figure 10 SM Adaptor Signal Path threaded insert The solder balls from IC package come in contact with the top end of elastomer wire The bottom end of elastomer wire contacts the SM adaptor board pad The bottom side of the pad is connected to the target circuit board via solder ball and thereby makes an electrical path for the signal Figure 10 illustrates this concept graphically VAO L Assembly Ironwood Electronics SMT adaptor can vary greatly in size mass and thickness Because there are many unknown variables for each customer s situation it is difficult to recommend an ideal temperature profile for attaching an Ironwood adapter to a particular customer s target board A few of the unknowns which make a profile suggestion difficult 1 The target PCB size mass 2 Number and size of componen
6. 9 0 4826mm typ 0 019 559mm 0 220 3 18mm A Pg e 020mm 0 008 0 0005 Substrate 3 18mm 0 025mm 0 125 0 ee L 1 X _FR4 G10 qr equivalent high temp material Non clad Pin Brass PS 2 Plating 10u Au over 50u Ni min Figure 13 TH Adaptor uN Figure 15 TH Adaptor Receptacle Signal Path SGB doc Rev S RP 12 5 14 a rO N WO O d Tel 800 404 0204 E L a C T R O N C S www ironwoodelectronics com GHZ socket Mechanical Specifications Individual contact force BGA Package Depth of penetration mm Force per ball grams Typical 1 27mm pitch BGA Notes 0 75mm Nominal solder ball diameter was used in the calculation T 0 6mm Nominal solder ball diameter was used in the calculation ti 0 4mm Nominal solder ball diameter was used in the calculation Conductive Elastomer Life Needs cleaning after 200 cycles Shelf life 1 year 0 5mm Thick Notes Maximum contact resistance with 0 2mm compression contact resistance will decrease with increased compression Measurements were taken using 0 4mm square electrodes The 0 75mm value is interpolated from a test of 0 5mm 1mm and 2 0mm elastomers 7 The test used 0 5mm wide Au plated electrodes with a 0 5mm gap between them 500VDC was used with a 1mm thick elastomer compressed 0 35mm Measurements were taken with a flat gold plated electrode The 0 75mm value is interpolated from a test of several elastomer thicknesses rang
7. e settings Page 6 SGB doc Rev S RP 12 5 14 roO n WO O d Tel 800 404 0204 L E C T R O N C S www ironwoodelectronics com wa Compression Screw Socket Top Assembly a Socket Lid Il Po Compression plate IC Frame s II BGA Package tse Socket Base Assembly Angle wire elastomer ___ Insulation Plate Target PCB with SMT pads not necessary for 25mm or smaller packages not necessary for 25mm Nylon Washer or smaller packages pete Fe 99 ames Figure 5 Exploded View Socket Assembly Torque Driver Select the appropriate Ironwood torque driver for your socket torque specified on page 1 of the part drawing The following adjustable drivers are sold separately and include hex bits listed in table For other bits please call Ironwood Tech Support 1 800 404 0204 Part Number TL Torquedriver 01 occ aaa TL Torquedriver 02 A TL Torquedriver 03 ek aes oe TL Torquedriver 05 8 in oz preset 1 27mm 3mm TL Torquedriver 06 16 in oz preset 1 27mm 3mm TL Torquedriver 09 danas a a Page 7 SGB doc Rev S RP 12 5 14 rO n WO O d Tel 800 404 0204 E L E C T R O N C S www ironwoodelectronics com Legend HBA 4 hex bit adaptor accommodates other 1 4 hex drive insert bits Torque Conversion Factors lin lbs 16in Oz 0 113 Nm Vacuum Pen 7 05007 A vacuum pen is recommended for insertion extraction of ICs Figure 7
8. esting may be required Ideally pad surface that is flush or higher than the solder mask is recommended Note Our internal tests were successful with 0 001 0 002 thick solder mask above the pad surface on 0 5mm to 1 27mm pitch elastomer sockets Cleanliness Isopropyl Alcohol or similar should be used to clean the board surface prior to attaching socket Page 4 SGB doc Rev S RP 12 5 14 rO N WO O d Tel 800 404 0204 E L E C T R O N C S www ironwoodelectronics com Backing Plate For an IC body size of 19mm and above the GHz socket requires a backing plate to prevent the deflection of the target circuit board due to the high downward forces If the backside of target PCB contains capacitors and resistors a custom insulation plate with cavities milled for those capacitors and resistors can be designed The insulation plate sandwiches between the backing plate and the target PCB Figure 4 shows an example insulation plate 2 09mm Hea l with component layout Top View 5 080mmt0 025mm referen a i 2 09mm 1 E E LO N 2 36 00mm E LO N o o MM a Za 36 00m a saan ay Side View 0 79mm x2 C 1 59mm 0 18mm Figure 4 Example Insulation Plate BGA Socket Assembly Refer to figure 5 for graphical illustrations 1 Install the socket base assembly on the target PCB with the base mounting hardware provided Because of the asymmetrical location of the tooling holes the socket can be assembled o
9. et can be assembled onto the target PCB with only one orientation rotation Place the IC package into the socket using either a vacuum pen or tweezers MLF type packages pad side down NOTE The package orientation on the target PCB 1s critical 2a Center small IC packages inside the IC guide using tweezers Use a microscope if needed 2b Press on top of the IC with tweezers Begin by pressing on the area close to the center of the IC Then press slightly on all four corners of the IC NOTE If you are experiencing problems pressing the IC package into the IC guide it is an indicator that the IC package is not properly centered Re center package if necessary If an IC compression frame optional is supplied place it over the MLF package Place the compression plate on top of the IC package Install the socket top assembly on to the socket base assembly and swivel to lock into the position If your socket contains a shoulder screw silver in color DO NOT tighten them they are preset at our factory If your socket uses a black oxide socket head cap screw tighten them until they make contact with the lid Turn the compression screw clockwise to the specified torque called out on page 1 of the drawing Be careful not to over tighten compression screw Over tightening will damage the elastomer NOTE the torque value on page 1 of the drawing is the maximum recommended torque value Typically the socket should work with smaller torqu
10. ing from 0 1mm to 2 0mm This is a conservative estimate based on Imm thick elastomer test results with test probes spaced at 0 5mm Measurements were taken with test probes at 0 5mm pitch The 0 75mm value is interpolated from a test of several elastomer thicknesses ranging from 0 1mm to 2 0mm The wires are on a 0 1x0 1mm grid and 0 05x0 05mm grid Multiple wires make contact per solder ball based on its size and depth of penetration The following table shows typical BGA parameters and its current carrying capability mm mm per ball capacity mA 08 0 3 0 5 0 2 0 3 200 450 0 25 0 35 0 15 0 25 200 450 0 2 0 3 0 12 0 18 200 450 Elastomer Specification Operating Temperature Continuous usage 35C to 85C 100C for up to 250 hours Compression set 150C for 22hrs Thickness change 4 5 Vibration Standard MIL STD202 METHOD 204 CONDITION A No change in resistance and thickness Page 14 SGB doc Rev S RP 12 5 14 rO N WO O d Tel 800 404 0204 E L E C T R O N C S www ironwoodelectronics com Humidity Standard MIL STD202 METHOD 106 Resistance change 26 mQ Thickness change 1 Standard MIL STD202 METHOD 103 CONDITION A Resistance change 15 mQ Thickness change 6 Thermal Shock Standard MIL STD202 METHOD 107 CONDITION A Resistance change 19 mQ Thickness change 1 Heat Sink Specifications The graph Figure 15 shows thermal resistance of the socket as well
11. l stick out as you will damage the elastomer Roll it around inside the socket or look through a microscope to better see and collect the debris in the socket Figure 8 Elastomer Orientation if re assembly is necessary The Elastomer is assembled to the elastomer guide using a silicone adhesive DO NOT remove the elastomer from the guide substrate when cleaning However should the elastomer fall out orientation back into the elastomer guide is critical The socket will not function properly if the elastomer orientation is incorrect See figure 8 to reinstall the elastomer into the elastomer guide should it fall out Caution the elastomer will absorb liquids and may become deformed if it soaks too much Do not apply liquids directly to the elastomer or submerse the elastomer 1n liquid Page 9 SGB doc Rev S RP 12 5 14 roO n WO O d Tel 800 404 0204 L E C T R O N C S www ironwoodelectronics com For a more thorough cleaning use the stiff nylon brush and a solution of half DI water and half isopropyl alcohol Wet the sane brush scrub the surfaces of the elastomer and blow both sides dry Ei with clean dry shop air After allowing to fully dry clean the surfaces with the rolled tape method to remove any dust or lint accidentally deposited in the drying process Only perform the saib thorough cleaning with the elastomer removed from the elastomer guide 18 725mm 0 737 Threaded Insert 50 3mm typ
12. mation The typical Figure 1 GHz BGA Socket GHz socket is 5mm larger than the maximum IC size If there are pre existing holes in the PCB a GHz socket can be custom designed to accommodate those holes please call Ironwood Tech Support 1 800 404 0204 Figure 2 SEM Figure shows a typical GHz BGA socket The Z axis conductive elastomer used in the socket as a contactor between the IC package and the circuit board is a low resistance lt 0 0192 connector Figure 2 shows an SEM picture of the elastomer The elastomer consists of a fine pitch matrix 0 1mm x 0 1mm of gold plated wires 40 micron diameter which are embedded at a 63 degree angle in a soft insulating sheet of silicone rubber Another elastomer used for high Page 3 SGB doc Rev S RP 12 5 14 roO n WO O d Tel 800 404 0204 L E C T R O N C S www ironwoodelectronics com density application consists of an ultra fine pitch matrix 0 05mm x 0 05mm of gold plated wires 20 micron diameter which are also embedded at a 63 degree angle in a soft insulating sheet of silicone rubber The insulation resistance between connections with 500V DC is 1000 MQ The elastomer is ideal for high current SOmA per filament applications where a thin high density anisotropic connector is required The gold plated brass filaments protrude several microns from the top and bottom surfaces of the silicone sheet The operating temperature range for the elastomer is 35 to
13. ne Q O the complete socket assembly from the ane board Roll tape loosely around a fingertip adhesive side out With finger positioned parallel to the bottom of the elastomer roll the tape over the surface The bottom side of the elastomer can be cleaned without removing 1t from the socket base assembly After cleaning the bottom side carefully remove the elastomer guide and elastomer from the base and clean the top side with a fresh piece of tape a Socket Base a Dowel Pin Ball Guide E Elastomer N Socket Base Assembly Elastomer Guide A A lt B B Note Wire orientation in the elastomer rong wire orientation To use the poster putty you do not have to remove the elastomer with the guide from the socket base simply take the socket off the PCB to clean the bottom side of the socket roll the poster rong wire orientation putty around on the elastomer surface on the bottom and on the PCB To clean the inside of the socket it is best if the socket is re mounted to the PCB so you don t push the elastomer off the guide Depending on how big the socket base 1s you can either use your fingers or some sort of longer tool pencil or tweezers will work and attach the poster putty on the end be careful not to let the sharp point of the too
14. nto the target PCB with only one orientation rotation 2 Place BGA package solder ball side down into the socket NOTE BGA orientation on target PCB is critical If IC frame optional supplied place it over the BGA package 3 Place the compression plate on top of the BGA package Page 5 SGB doc Rev S RP 12 5 14 rO N WO O d Tel 800 404 0204 E L a C T R O N C S www ironwoodelectronics com Install the socket top assembly on to the socket base assembly and swivel to lock into the position If your socket contains a shoulder screw silver in color DO NOT tighten them they are preset at our factory If your socket uses a black oxide socket head cap screw tighten them until they make contact with the lid Turn the compression screw clockwise until it makes contact with the compression plate and or the BGA package Apply torque specified on page 1 of the part drawing using a torque driver accurate or hex key approximate supplied with socket Using hex key turn an additional 1 8th to 1 4th of a turn The sockets between 19mm and 27mm will include hex nuts and washers for optional use without the backing plate it is recommended that the backing plate be used however MLF QEN Socket Assembly Refer to figure 5 for graphical illustrations 1 Install the socket base assembly on the target PCB with the base mounting hardware provided Because of the asymmetrical location of the tooling holes the sock
15. one part number may match your criteria A frame on the top of the page will show the socket price and links to PDF and JPEG files The JPEG file is a picture of socket The PDF file will have three pages The first page shows the socket cross sectional views and the material details The second page shows the recommended PCB layout Note BGA pads are not symmetrical to the mounting holes The third page shows the compatible BGA specification Check the following four parameters 1 IC co planarity the value should match or be less 2 Maximum total height of IC should match or be less 3 Maximum solder ball diameter of IC should match or be less 4 Maximum and minimum solder ball height should fall within the range If any of the above parameters do not match go back to the table and select a different part number that matched the initial criteria and repeat the four parameter checks If a part number cannot be found to match IC parameters please call Ironwood Tech Support 1 800 404 0204 Socket Mechanics GHz BGA sockets provide 6 5 to 10 GHz bandwidth in a small cost effective ZIF socket for prototype and test applications The GHz BGA socket is a simple mechanical socket based on elastomer connector technology The GHz socket is a solder less socket that can be mounted onto a PCB using screws and nuts PCBs will require mounting and alignment holes at proper locations see page 2 of the drawings for recommended PCB layout infor
16. recommended process Page 12 SGB doc Rev S RP 12 5 14 Ironwood ELECTRONICS Thru Hole TH Adaptor If the target circuit board exists with a thru hole pattern then a TH adaptor can be used with a GHz socket TH adapter See figure 13 has terminal pins on the bottom side and round pads on the topside It is slightly larger than the IC size It has threaded insert on four corners GHz socket can be mounted on to this adapter using the screws that mate into the threaded insert Materials Non clad FR4 Phosphorous Bronze pins threaded insert The solder balls from IC package come in contact with the top end of elastomer wire The bottom end of elastomer wire contacts the TH adaptor board pad The bottom side of the pad is connected to the target circuit board via terminal pins and thereby makes an electrical path for the signal Figure 14 illustrates this concept graphically TH adaptor can be plugged onto a socket receptacle which is surface mount soldered on to the target PCB Figure 15 illustrates this concept graphically Figure 14 TH Adaptor Signal Path Page 13 Tel 800 404 0204 www ironwoodelectronics com 20 725mm 0 8 16 L e 2 50mm 0 098 3 04mm 0 120 250mm 0 098 10 40mm 0 409 554mm 0 100 stomm 0 105 00000000000000 90000000004000 DO ODO OGO 09 O 20 725mm pagsali 15 725mm 0 816 0 409 0 619 5 08mm 0 80mm typ 0 200 l 0 031 Threaded Insert 15725mm 0 61
17. sed Maximum Package Body Temperature for handling the part 3 4 Surface tension between the adaptor s R ES BOMM seressceocioo sf pr N solder spheres and the target PCB s pads will self align the part during the reflow 150 per Second process 7 7 7 5 Reflow as per Figure 11 e Use caution when profiling to insure minimal temperature difference lt 15 C and preferably lt 10 C o Fu between components dions 7 e Forced convection reflow with a ee nitrogen preferred 50 75 PPM e Preheat stage temperature ramp rate a asi da lt 2 C per second e Time required in Flux Activation Figure 11 Recommended Reflow Profile non RoHS stage 150 to 180 seconds Flux Activation stage temperature range 150 to 183 C Time required in Solder stage 60 seconds Maximum temperature 210 220 C Do not exceed 10 seconds at maximum temperature Cool Down stage temperature reduction rate lt 20 C sec NOTE It may be necessary to adjust the amount of heat when attaching the part due to the fact that the adaptor mass is different from the actual IC package Solder sphere spec 63Sn 37Pb and its melting point 183 C 6 Clean PCB with the flux manufacturers recommended process after reflow Install the GHz socket on the SM adaptor as per assembly instruction provided in the GHz socket assembly section 250 150 180 Seconds E c lt 2 C per Second Temperature C 100 0 100 200 300 400
18. shows a typical vacuum pen TL vacuumpen 01 can be purchased separately Hand insertion of ICs and extraction using a small tweezers are also acceptable Tweezers A small tweezers is recommended for insertion extraction of ICs having a body size of 7x7mm or smaller Figure 6 shows a typical small tweezers with a GHz MLF socket Figure 7 Vacuum Pen with Figure 6 Tweezers with SG MLF socket Attachments Elastomer Cleaning Procedure Elastomer cleaning requirements vary with customer applications and are dependent on variables such as contact force BGA package condition and the environment it is used in A light cleaning is recommended every 200 to 300 cycles A thorough cleaning is recommended every 1000 to 2000 cycles These recommendations are suggestions only and should be increased or decreased based on observation Page 8 SGB doc Rev S RP 12 5 14 a rO N WO O d Tel 800 404 0204 E L a C T R O N C S www ironwoodelectronics com Required Tools Scotch Magic Transparent tape or similar or poster putty Eaa O IN O Henkel DUCPTY2 Poster Putty Removable Reusable Nontoxic or a similar O brand For more thorough cleaning Renan ones technique use alcohol De Ionized DI water a stiff nylon brush and clean dry shop air e S O The Elastomer can be quickly cleaned of dust and debris with a piece of transparent tape approximately 2 inches long Remove Sa
19. ts next to the adapter target pattern 3 Reflow oven type 4 Type of solder paste flux used 5 Solder stencil characteristics thickness and aperture size Therefore we offer the following profiles as a guide reference to mounting our standard and high temperature ROHS Giga snaP and BGA SMT adapters While the following should work for most scenarios Ironwood Page 10 SGB doc Rev S RP 12 5 14 rO N WO O d Tel 800 404 0204 E L a C T R O N C S www ironwoodelectronics com recommends contacting your solder paste flux manufacturer for proper reflow profiles for your particular set up and equipment Recommended Reflow Profile Low Temperature Non RoHS Ironwood s SMT adaptor closely emulates a BGA package and therefore can employ similar processes to attach it to a target board The steps involved in the soldering process are as follows 1 Using a flux dispenser place a small amount of flux water soluble or no clean on the middle of the target PCB lands Spread the flux evenly over the PCB lands 2 Apply a small amount of TAC flux on opposite corners of the PCB lands 3 Note the target board land pattern orientation and the SM adaptor Pin 1 location Place the adaptor solder ball side down onto the flux and land pattern align as closely as possible to the land pattern of the target PCB The SM adaptors are durable enough to be handled by hand however vacuum pen or pick amp place equipment can be u
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