QUICK BGA EA-H00 BGA/SMD Rework Station
Contents
1. If you want to replace the Suction Pad of IR System please turn off power and replace it after waiting for vacuum suction nozzle and Top Heater to cool down Take Suction Pad out of suction nozzle downwards and install a new one in opposite direction Note PL is a precise equipment Please don t make any changes to it Otherwise the precision of this equipment will be affected Pagel9 e QUICK BGA EA H00 OPERATION MANUAL 11 QUICKSOFT brief instruction 11 1 operation interface 1 Operation interface this interface reaction executive condition of flow we can real time operate by this interface 2 parameter of operation interface be setting from parameter testing interface in operation interface do not need setting BGASOFT Main Interface Alignment Parameter Adj Curve analysis Advanced Set Help Topheat 140 45 160 50 210 35 Current Process Parameter display Preheat Temp 170 Preheat valve values TO 140 Process name Testi Load Process Fan CoolFanSpeed 80 Cool Fan Time 60 Bu Flow curve display Fan on off Fan in out Solder Have two technology mode auto change Desolder from solder desolder Flow schedule Parameter display the parameter of this area do not be setting in operation in2. Bottom Heater starts to heat up and Top Heater moves downwards and reach to bottom IR window will show a series of setting temperatures during working Indicate when it reaches TO T2 and TL When the bottom temperature reaches TO the top heater begins to heat up When the temperature reaches TL it will give a sound alert automatically Low frequency When the temperature reaches T3 it will also give a sound alert automatically Middle frequency When the solder has melted down press the vacuum suction tube to pick up the component Press the vacuum suction tube the vacuum pump start to work and pick up component then return to original position The system stops heating The Top Heater moves upwards and stops at top Top Cooling fan and Outside Cooling Fan spreads out to blow cooling air simultaneously 90 seconds after the top heater starts moving upwards the vacuum suction tube looses component automatically After the two Cooling Fans blow cooling air for 150 seconds the whole de soldering process will be over Pagel7 i it RA BGA2015 OPERATION MANUAL amu CK 9 PL System Operation 9 1 Component function l Crosswise Cooling Fan Besides the existing top cooling system the system adds outside Cooling Fan again to speed up the cooling process of PCB 2 PCB fixture The movable PCB fixture 1s able to fix PCBs of different sizes It has four Fixing Knobs Two PCB Fixing Knobs are used for locking P
3. It s able to set the unit of display temperature during work flow In parameter modifying use UP and DOWN keys to set the value of it Sensor It is used for choosing the system s sensor type Users can also choose K type sensor used for measuring temperature besides system s IR sensor The signal of chosen sensor will be displayed and used for process controlling In parameter modifying use the UP and DOWN key to set the value Password It is used for setting password It is designed for preventing the equipment unnecessary or non authorized change When it is set to 000 the password protecting is useless The password is used for all flows and it can be useful and useless in each flow The system requires inputting correct password before any change Using of password refer to A item For instance Modify parameter of flow and make 130 S1 70s T2 160 C S2 50s 130 Flow one has been selected password press MENU 110 press MENU select 1 S1 060s T1 110 C press MENU T1 110 C rotate MENU 1 060s 1 060s Pagell BGA2015 OPERATION MANUAL T1 130 C 1 060s T1 130 C _S1 060s T1 130 C 51 060s press OK press MENU rotate MENU rotate MENU press MENU press OK press MENU Pagel2 _T1 130 C 91 060s T1 130 C S1 060s T1 130 C S1 070s amu rotate MENU press MENU press OK
4. press MENU rotate MENU press MENU press MENU BGA2015 OPERATION MANUAL press MENU rotate MENU rotate MENU press MENU rotate MENU rotate MENU TO 090 C rotate MENU _T FAN 1008S Pe amu CK press OK rotate MENU rotate MENU press MENU press OK rotate MENU T FAN 100S press OK SPD 80 Pagel3 i it RR BGA2015 OPERATION MANUAL amu CK TC 022C Tb 019 C ready for flow D Modify laser alignment mode For instance Modify the laser alignment mode and set it to on select 1 rotate MENU type desolder press MENU type desolder laser off type desolder type desolder press laser off laser on type desolder laser on 1 After finishing the modification the next step communication speed will not be able modified by keyboard 2 Press OK key to exit Now the system has saved all parameter settings window will display 022 Tb 019 C ready for flow 3 After all technology parameters have been selected press BEGIN key and the system perform the set flow E System Error Indication 1 In initial state if the top sensor or outer sensor 15 broken it displays Pagel4 BGA2015 OPERATION MANUAL TC sem T sense error If the bottom sensor is broken it displays Tb C B sense error If above status happens user should stop operating amu 1 During th
5. Camera RPC optional computer LCD optional Note The parts will be packed according to the packing list If you don t purchase the optional part it will not be in the package If any part stated above is missed out please contact with our company or agents immediately 4 Safety Instructions AN Note For safety of system and operator please read this manual carefully before operating the unit Please note that the unit is suitable for soldering and de soldering of electronic Page2 ZI ee BGA2015 OPERATION MANUAL amu CK components Note Top and bottom IR radiator will be very hot during working so explosive and combustible object or gas and solvent is strictly prohibited in working areas also please don touch the hot housing parts Note The laser alignment device includes two secondary laser device so don t see the laser bean directly N Note When the system happens trouble and needs maintenance it should be carried on by a experienced and authorized technician or expert or contact with service agent and factory The unit with dangerous voltage The inexperienced work is dangerous for operators 5 specifications and Technical Parameters 5 1 Specifications 1 Total power 2400W max 2 Power of Bottom Heater 400W 4 1600W Infrared ceramic heating tube 3 Power of Top Heater 120W 6 720W Infrared heating tube wavelength about 2 8um size 60 60mm 4 Preheating Time of Bottom Heater about 90
6. a proper speed the component permits In parameter modifying use the UP and DOWN knob to set the value of T1 T2 It is the temperature when finish the heat preservation of reflow soldering The pre heating temperature rises to T2 after the time of S1 finishes Within this time PCB and component pre heating is finished and the solder is activated In parameter modifying use the UP and DOWN key to set the value of T2 T3 It is the peak value temperature of reflow soldering When the temperature reaches T2 the temperature equably rises to T3 with a definite raising speed The soldering or de soldering will be finished when the temperature reaches to the peak value and performs the next step In parameter modifying use the UP and DOWN key to set the value of T3 TL Melting temperature of solder At this temperature the solder starts to melt down and turn into liquid During the soldering and de soldering users can press CAL Key to calibrate the value of TL when the solder turn into liquid In parameter modifying use the UP and DOWN knob to set Pagel0 di it ER BGA2015 OPERATION MANUAL amu CK the value of TL 51 Heating time rising from to T2 User can set the value in the range of 0 300s S2 Heating time rising from T2 to T3 User can set the value in the range of 0 300s S3 Prolonged heating time Heat preservation time after the temperature reach T3 and user can also set the value in the range of 0 999s Unit
7. arm down Fan infaut Work Mode C Desolder Solder Start Stop Counterpoint height memory setting height After setting auto memory this height the same specification chip counterpoint call save flow do not need adjust counterpoint height Counterpoint height cancel cancel saved counterpoint height Suck height memory sucking height which have be set After setting auto memory this height when suck the same chip next time we can call the saved flow not need adjust counterpoint height Cancel suck height cancel suck height which have be saved In flow edit display show goal flow name and technology type desolder solder nozzle size down distance and heat dissipation air quantity etc Down distance adjust heat head height range setting range 0 255mm heat dissipation air quantity setting range 35 100 can adjust on the basis of PCB adjust After edit parameter in parameter setting display in flow edit display input flow name appropriate nozzle size select flow technology curve is desolder or solder And then click parameter save save curve can save current parameter and flow curve Come riffline Heater arm Fan Pris Cool fan state Wire Gratis Page 21 QUICK BGA EA H00 OPERATION MANUAL cm U CK In parameter setting display can set parameter setting range refer to 5 1 TO only satisfy TIRZTO top infrared heater can start working No special purpose please set gt TO C
8. CB Clamp Bar to fix PCB The other two Fixture Fixing Knobs are used for locking the PCB Fixture to prevent it from moving lengthways and transverse Unscrew PCB Fixing Knobs and move the Slide Block to open the PCB Clamp Bar make the distance in accordance with PCB size Fix PCB between Clamp Bars and screw down PCB Fixing Knob after adjusting position If you want to lock PCB Fixture please screw down Fixture Fixed Knob Fixed Knob Slide 4 RPC Reflow Process Camera RPC s position can be adjusted First unscrew Fixed Knob in corresponding direction and then adjust RPC can be moved up and down or turned Pagel8 ill RR BGA2015 OPERATION MANUAL amu CK 10 Equipment Maintenance Remark For ensuring reliable function and maintenance of equipment please use parts provided by original factory Please turn off power switch of each part and pull out power plug when not in use A Note After cutting off the power supply the housing is still very hot so please don t use any dangerous or combustible solvent to clean it Clean parts Clean the dust on system with clean towel Suggest to use dry or wet towel to clean the equipment Solder on the glass of Bottom Radiator can be cleaned out with hard object Please be careful not to break down the glass Clean the prism of PL camera with pledget and be careful not to scrape it Use the towel with cleaning oil to clean PCB fixture and orbit Replace Suction Pad
9. ZI QUICK BGA EA H00 OPERATION MANUAL umu CK CID eee CK QUICK BGA EA H00 BGA SMD Rework Station Operation Manual Thank you for purchasing our BGA SMD Rework System The system is exclusively designed for reworking and soldering SMD component Please carefully read this manual before operating the system Store this manual in a safe easily accessible place for future reference ZI sm QUICK BGA EA H00 OPERATION MANUAL umu CK Contents MEM IEEE 1 2 Producb 2 Js CODON state des deas edu MIN NI DM i NEU 2 AT IR SIR 5 Specifications and Technical 3 Dee 3 22 LCC Wine Al Paralelo eerie aret umquam 4 6 Install and Connect 5 nes aevum 5 MP IEEE 5 ODBICETIHIO 5 Te COMUEO 6 So HESS 6 SM ME cT TOT T TUNER 6 5 2 Parameters ee 7 5 2 Operating TECHNICS INS UC HOM ies NAM M HERUM IUE 15 ETEO ER OPTIO 18 ompobc nro O e a E E E E EEEE 18 Eguipment a 19 Is QUICKSOFT brief instruc
10. an also click flow select in edit flow display call saved parameter and modify tt heat dissipation air quantity 35 100 Note parameter setting please refer to technology require 11 3 curve analysis interface 1 Curve analysis display this display can analysis KT3 flow curve know peak temperature of this flow temperature rise slope temperature change of every heat process and time thus judge if correspond technology flow 2 Incurve analysis interface can save or delete current curve or call saved curve analysis and also print current curve file 3 After open flow file flow curve interface auto display flow curve if flow file contain external type temperature test data then display temperature arise time maximum temperature rise slope peak temperature Du BGASOFT Main Interface Alignment Parameter Adj Curve analysis Advanced Set Help Temp Current process Testi 250 200 gt N L4 wae n ee X 150 eum X ine X Delete NA NS 50 0 1 2 3 rein Data analysis interface 11 4dvanced setting interface Advanced setting in this interface we can set operation limits of authority communicate video etc and also can set TO temperature curve colour and wire wide and can select china and English Page 22 QUICK BGA EA H00 OPERATION MANUAL imu CK DE Main Interface Alignment Parameter Adj Curve ana
11. dify the working mode and make it in desolder mode password rotate MENU select 1 select 1 rotate MENU type solder select 1 type desolder Page9 select 1 press MENU type solder select 1 press OK type desolder di it eee BGA2015 OPERATION MANUAL amu CK After finishing modifying working mode if you want to modify laser alignment mode operate as D item shows if no need to modify it please press DOWN key to browse the next parameter settings C 1 Modify Parameter of working flow If it is necessary to modify parameter of a working flow first you must select the working flow and then modify its parameter The soldering technics is decided by TO TB T2 T3 51 S2 and S3 It describes the temperature graph during the system working TL denotes Melting temperature of solder and the range between T2 and T3 TO TO is the valve temperature for bottom heater required by top heater when it heats up Also it 1s the first temperature of this technics process When the work flow begins the bottom heater starts to heat up After reaching the TO the top heater begins to heat up TC TB The test temperature of bottom preheating Tb set temperature of bottom heating TC Real time temperature of top heating It 1s the heat preservation starting temperature of reflow soldering It is the second temperature of this technics process The temperature rises to with
12. e upward or downward movement of Top Heater or holding out and drawing back of fan arm if it doesn t reach over 10 seconds the unit will come back to initial state all and singular in spite of what state it 1 here It displays Th FC Move error And forbid all mechanical movement of machine until restart 2 When TC is less than 180 C during working if the rising temperature is less than 7 and the system will exit the process and display TC raise error 3 If TC is over than 265 C during working the system will exit the process and display over error 8 3 Operating technics instruction N Note Top and Bottom Heater will be very hot during working so please don touch the hot housing parts Note The laser alignment device includes a secondary laser device so don t see the laser bean directly Pagel5 Z IL ee BGA2015 OPERATION MANUAL amu CK 8 3 1Soldering Technics 1 Turn on power switch of each part 2 Move PCB Fixture with fixed PCB and make it above the Bottom Radiator and make the soldered component on the PCB between Top Radiator and Bottom Radiator The position 1s easy to be measured with laser alignment device The right position should make the red laser point 1n the center of component 3 Adjust aperture system and get a proper window size 4 Adjust RPC in appropriate place adjust size and focus of image with PL keyboard to display component image in the m
13. ght data can be referred 0 120 51 508 2 140 52 458 713 195 53 158 183 150 0 100 1 130 581 4068 2 145 52 45 3 200 53 158 183 160 0 150 2 140 51 308 2 150 52 508 73 200 C 53 208 183 160 0 155 3 140 581 4068 2 150 52 508 73 195 53 258 183 165 0 160 4 160 51 508 2 180 52 408 3 230 53 158 1 217 170 0 150 5 160 851 4068 T2 175 C 52 508 3 225 53 208 1 217 180 0 170 6 170 851 4068 2 185 52 508 3 228 53 208 1 217 180 0 180 7 180 581 4068 2 185 52 508 3 228 53 258 1 217 190 0 185 Page4 i it RR BGA2015 OPERATION MANUAL amu CK 6 Install and Connect System 6 1 Place System Unwrap the packing of the unit then take out BGA EA HIO Main Unit and put it on the horizontal worktable Make sure whether the unit and parts are in good conditions 6 2 Install RPC 1 Unscrew RPC Fixing Knob on the RPC Fixing Bracket and install RPC in the Bracket tighten knob 2 Put the plug of RPC connecting wire into Camera Socket 3 RPC s position can be adjusted Unscrew fixing knob in corresponding direction and then adjust RPC can be moved up and down or turned RPC Fixing Bracket RPC Reflow Process Camera 6 3 System Connecting Please check whether the
14. lect 0 Page7 di it eee BGA2015 OPERATION MANUAL amu CK password Rotate MENU password 0 press MENU select 0 select 0 password 0 rotate MENU password 00 press MENU select 0 select 0 password 00 rotate MENU password 000 press OK select 0 select 0 saving Password Any key return After input password 1 If you want to modify the password return to above mode to input the new password If password 1 modified successfully it will show saving Password Any key return 2 If you want to modify the next working flow operate as the following item If you don t want to modify please press DOWN knob to browse the following parameter settings B Modify working flow For instance Modify the working flow and make it become 1 flow Pages BGA2015 OPERATION MANUAL password rotate MENU select 0 password rotate MENU select 0 password _ select 1 Pies amu CK password press MENU Step select 0 p password press OK Step select 1 1 When carry on the forth step Step if press SET key you can browse and modify parameter of this flow shown as C 1 item 2 After finishing modifying of working flow 1 if you want to modify the next working mode operate as C item shows If you don t want to modify it yon can press DOWN knob to browse the next parameter settings C Modify working mode For instance Mo
15. lysis Advanced Set Help Password setting K type sensor s curve option Curve option Temp Unit gt Top hot air 1 gt Ca ogi f Celsius KT2 Protect parameter Preheat 1 Fahrenheit Video option Language Video setup Simplified Chinese VideaQut setup wideo Ch English Image size ah Close UCK Password setting can set enter password and parameter protect two type password The people who obtain enter password can operation this software but no parameter modify power The people who obtain parameter protect can operation this software and modify parameter If not set parameter protect password people who obtain enter password also modify parameter Language version select can select language china or English Select Chinese then software interface 1s Chinese Select English then software interface is English Colour of K type temperature curve setting provide different colour and curve wide In technology interface temperature display by curve different colour express different K type temperature sensor Page 23 Changzhou Quick Soldering Co Ltd Add No 11 FengXiang Road Wujin High Tech Industrial Development Zone Jiangsu China Tel 86 519 86225678 Fax 86 519 86558599 Zip code 213167 Website www quick global com
16. nd adjust the window size then tighten knobs The scale 2 on the housing means 20mm and 3 means 30mm other scale 1s similar For example if you want to adjust size to 50x50 mm adjust two knobs to the scale of 5 and tighten them Page6 ill BGA2015 OPERATION MANUAL mu cK Scale Note Adjusting the aperture system can protect the adjacent components on the PCB from being heated But when the aperture system is adjusted to small size the Top Radiator will be very hot and decrease its lifetime so it s necessary to increase the window size appropriately to avoid the damage ofthe Top Radiator 8 2 Parameters Setting Parameter settings order as the follows A password Password settings By select 0 Flow settings it can modify parameter inside C type solder Working mode settings D _ laser off Laser alignment settings E _ baud 19200 Communication speed settings A Input password The initial password of system is 000 At the same time system also has the omnipotent password 159 If you forget the setting password you can input 159 to make the password of system come back to initial password 000 Note If want to modify any parameter system you must input password otherwise you can only browse them For instance Input the initial password 000 of system TC 022 C Tb 019 C press MENU password press MENU ready for flow se
17. nfrared temperature sensor for de soldering parts and the middle wavelength infrared heater The soldering process is under the monitoring of non contact infrared sensor and optimum control of process can be achieved at any time The middle wavelength infrared heater has a well proportioned and safe heating and power and flexibleness necessary for the system so it can also deal with some PCBs with big thermal capacity and other high temperature situation lead free soldering easily The adjustable aperture under the infrared heater can protect the adjacent components which are sensitive to the temperature on PCB from being heated No need for nozzles 00 works under the open environment that is it can calibrate and test temperature in soldering process When the melting of solder is found by visual inspection press down the calibrating button to record the melting temperature of solder IR has 10 types of working modes and programmable temperature controlling can modify the parameters of every working modes IR system and setting of parameters are operated by outside Keyboard as well as by IR soft Pagel di i RR BGA2015 OPERATION MANUAL cK 2 Product Picture 3 Enchase component Please check whether the following parts are included and intact Main Unit BGA EA H00 Control box BGA EA H00 Operation Manual video line USB connect line video capture card BGA tool box IR
18. onitor clearly 5 Select parameter with keyboard Refer to Parameters setting Input password 000 Select the required flow if need to modify perform relevant operation Select solder working mode Select IR laser alignment mode No change to communication speed and press EXIT key to exit IR window shows 0222 Tb 019 C ready for flow Press START key and the system start working perform content of selected flow 6 IR window will display series of setting temperatures and the current temperature of Tb and TC during working and indicate when it reaches TO T2 T3 and TL 51 S2 and S3 are counted down and user can know about the setting value clearly 7 If you see the solder has melted down It is watched with RPC and Monitor you can press CAL key to calibrate temperature of TL to adjust the display temperature to liquid temperature IL 8 When the temperature reaches TL there will be a voice signal 9 When the temperature reaches T3 the sound signal changes to a briefness sound and the system delays heating by S3 seconds After that the system will not heat up anymore and exit the process automatically the technical process 1s over 10 The system can perform a series of function action during working A After press START key the top heater move downwards near to bottom B After the system sounds unvaryingly the top heater move upwards and Top Cooling Fan and Ou
19. s size 260 260mm 5 Top heater range size 20 60mm 6 Heating time of Top Heater about 10s room temperature 230 C 7 Vacuum Pump 12V 300mA 0 05Mpa 8 Top cooling Fan 24V 300mA 00 9 Laser Alignment Tube 5V 30mA 2pcs 10 LCD Display window 65 7 23 5 mm 16 2 character 11 Communication Standard USB connector Connect with PC 12 Movable Motor stepping motor 13 Movable Arm Range 128mm 14 Infrared Temperature sensor 0 300 C Testing range 00 Outside K Type Sensor 3pcs 16 Max PCB Size 400mm 400mm 17 fuse 20A 220V Page3 All BGA2015 OPERATION MANUAL au cK Net weight 52kg Packaging dimension 970 830 520 mm Note When purchasing the equipment please indicate the working voltage 5 2 Technical Parameters TL Melting temperature of solder T1 Heat preservation starting temperature of reflow soldering T2 Heat preservation ending temperature of reflow soldering T3 Peak value temperature of soldering and de soldering Valve temperature The lowest temperature of Bottom Heater when Top Heater heats up TO TB Tir The set temperature of bottom heater TB The real time temperature of bottom heater TC The real time temperature of top heater Sl Heating time rising from T1 to T2 52 Heating time rising from T2 to T3 S3 Heat preservation time of T3 IR EA H00 Rework System has ten working modes and its parameter can be changed according to demand The following ei
20. supply voltage accords with the rated voltage on the system nameplate Please check whether all switches are turned off Connect the video cord of outside Indicator or Monitor to the VIDEO OUT socket Connect IR camera RPC to IR camera socket Connect control box to socket connect ground line to ground hole After all above steps insert power plug into power sockets and turn on switch Page5 7 8 i it RR BGA2015 OPERATION MANUAL amu cK Connect USB line Connect video line Connect control box Connect ground line control box Instructions During selecting working flow period UP and DOWN knobs are used for controlling the moving upward or downward of cursor but when in standby interface it can increase or decrease the digital Function of OK key Make the BGA IR enter parameters setting mode and cursor move a step forward Function of cool stop key if BGA IR in flow stop an finish flow if BGA IR in flow open or close cool fan Function of START key in standby state make BGA IR enter solder and desolder Function of in out suck key cool fan stretch out or retraction in desolder mode when flow reach T3 section it can control IR suck mouth suck chip IR System Operation 8 1 Part Function Adjust the Aperture System The Aperture System of Top Radiator can be adjust from 20x20 mm to 60x60 mm by two Adjustment Knobs Unscrew the knobs before adjusting a
21. terface it can be setting in parameter debug interface Flow select express technology flow file which parameter have be edit K type sensor KT1 KT3 only connect K type temperature sensor can display temperature Flow curve display window temperature curve of KT1 KT3 easy to real time watch and curve analysis Flow status bar this bar display flow status by colour colour is corresponding to working colour Status bar real time display current state contain communicate state online offline the location of heat head up middle down aligning arm location Cexternal middle interior head dissipation open close vacuum state open close Page 20 le QUICK BGA EA H00 OPERATION MANUAL Only when communicate state is online we can control equipment auto carry out flow by software Working area contain every working button heat arm up heat arm down dissipation 99 66 open dissipation close cooling fan enter cooling fan out 11 2 parameter testing interface Parameter testing interface when solder or desolder new chip by this display we can do solder or desolder testing Flow edit te sting Preheat Temp Tir 160 display Process name Test CoolFanSpeed 80 Load Process di splay K type sensor noc 2 CIEN HR KT3 SO RR Work zone display i Heater arm up Fan on off Heater
22. tion 20 URE EIE TE 20 11 2 parameter testing interface 21 analysis mMer 22 ACC OSC INO 22 di it eee BGA2015 OPERATION MANUAL amu CK 1 Summary Thank you for using QUICK BGA EA H00 Rework System This system which adopts micro processor control and infrared sensor technology to do soldering and de soldering to surface mount components safely and accurately increases bottom heating power based on the original one It can also control the whole technical process and record all the information by means of the IR Software thus meeting the higher technical demands of modern electronic industry It becomes one of the most valued electronic equipments in this field QUICK BGA 00 consists of two parts QUICK IR 00 Infrared Rework System and QUICK PL EA H00 Precision Placement System In order to control the soldering process optimally and get the nondestructive and reproductive PCB temperature IR EA HOO s heating power is up to 2400W suitable for all applications such as large or small PCB as well as lead free process The technology of re flow soldering controlled by closed loop ensures the precise and smaller technical window even heat distribution and appropriate peak value of temperature for lead free soldering IR EA H00 Rework System adopts micro processor control and infrared sensor technology It has the precision non contact i
23. tside Cooling Fan spread out to blow cooling air simultaneously C After 150 seconds the two Cooling Fns stop blowing and the soldering technics has been finished 8 3 2 De soldering Technics 1 Turn on power switch of each part 2 Fix the PCB on the top of Bottom Heater and make the de soldered component between Top Pagel6 BGA2015 OPERATION MANUAL amu CK 10 11 12 13 14 15 16 Heater and Bottom Heater The position is easy to be measured with laser alignment device The right position should make the red laser point in the center of component and the suction pad in center of component also Press the vacuum suction tube to check whether suction pad 1s in the center of component If the deflection is too much the tube will not be able to pick up the component Adjust aperture system and get a proper window size Adjust RPC in appropriate place adjust size and focus of image with PL keyboard to display component image in the monitor clearly Select parameter with keyboard Refer to Parameters setting Input password 000 Select the required flow if need to modify perform relevant operation Select desolder working mode Select IR laser alignment mode No change to communication speed and press OK key to exit IR window shows moo TC 022C Tb 019 C ready for flow F Press START key and the system start working perform content of selected flow After pressing START key
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