Spring Pin Socket User Manual
Contents
1. 1 59mm x4 Side View 0 79mm x2 Ce 1 59mm 0 18mm Figure 5 Insulation Plate example drawing 5 SSI doc Rev A IP Rev B C D RP Rev E VP Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com P Ironwood Electronics IC Insertion extraction A vacuum pen is recommended for insertion extraction of ICs Figure 6 shows a typical vacuum pen TL vacuumpen 01 can be purchased separately Hand insertion of ICs and extraction using a small tweezers is also acceptable e gt 12 70mm 0 500 127 00mm 5 000 Figure 6 Vacuum Pen with Attachments 6 SSI doc Rev A IP Rev B C D RP Rev E VP P Ironwood Electronics Imm amp 1 27mm Center Spring Probe Specification Operating Temperature Continuous usage 40 C to 150 C Mechanical Specifications Individual spring pin force 30g 1 102 at 0 098 2 49mm recommended operating position Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com Spring pin cycle life 500 000 cycles Electrical Specifications P P112A P P138A P P127A Contact resistance 27 38mQ 28 19mO Self Inductance 0 62nH 0 70nH Mutual Inductance 0 065nH Cross talk lt 10dB to 8GHz Insertion loss Sie lt2. 1 dB to 10GHz Rise time 24 6 ps Pin to ground Capacitance 0 45pF Pin to pin Capacitance 0 042pF Current carrying capacity 4A 4 5A 0 8mm Center Spring Probe Specification Operating Temperature Continuous usage 40 C to 120 C Mechanical Specifications Individual spring pin force 22g 0 80z at 0 162 4 11mm recommended operating position Spring pin cycle life 500 000 cycles Electrical Specifications P P114A Contact resistance 18 62mQ Self Inductance 0 84nH Insertion loss lt 1dB to 6 7 GHz a lt 3dB to 12 GHz Pin to ground Capacitance 0 76pF Pin to pin Capacitance 0 068pF Current carrying capacity 3A 0 5mm Center Spring Probe Specification Operating Temperature Continuous usage 40 C to 150 C Mechanical Specifications Individual spring pin force 7 SSI doc Rev A IP Rev B C D RP Rev E VP Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com P Ironwood Electronics 16g 0 560z at 0 150 3 81mm recommended operating position Spring pin cycle life 500 000 cycles Electrical Specifications P P115A P P139A Contact resistance 82 28mQ Self Inductance 1 3nH Mutual Inductance 0 15nH Cross talk lt 15dB to 6 5GHz Insertsn loss lt 0 25dB to 4 5 GHz lt 3dB to 10 GHz Rise time lt 26 ps Pin to ground Capacit
3. environment and usage Finish SnPb plating or Immersion Au or Immersion Ag Other plating may be used but testing may be required Solder mask clearance over pad surface is acceptable Cleanliness Isopropyl Alcohol or equivalent should be used to clean the board surface prior to attaching socket IC and PCB Reflow Requirement If the same IC is used for number of cycles crown tip on spring pin damages the Sn63Pb37 solder balls on IC and conical tip damages HASL hot air solder level pads on PCB From our test results we recommend reflowing IC solder balls every 10 cycles and HASL PCB every 30 cycles Gold plated PCBs will not need any reflows 3 SSI doc Rev A IP Rev B C D RP Rev E VP Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com Ironwood Electronics Socket Assembly Refer to figure 4 for graphical illustrations 1 Install the socket base assembly onto the target PCB with the hardware socket base screws provided Because of asymmetrical tooling holes the socket can be assembled with only one orientation 2 Open the clamshell lid and place BGA package solder ball side down into the socket NOTE BGA orientation on target PCB is critical If an IC frame optional is supplied place it over the BGA package This IC frame may be necessary for packages which the encapsulate around the die does not extend to the edge of the IC s s
4. Spring Pin Socket User Manual Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com P Ironwood Electronics Spring Pin Socket User Manual Selecting a BGA Spring pin socket seesseessoossoosssocsssccssocesocesooessocessecssocssoosscosesoesssccssocesocssoossssessssesssesesoose 2 PCB Requirements iisscs sicesscescossovseceessensdesssvevssessuesvevsvesensvssevacsssnnsieesscavees sous vests srov stb os sve as s riesi iiser 3 Thickness sissies sd ssesiessiccsssons sootnas scossensssestenssustteosscotssossssossensseseee souesbee socecsoespocedenss eoa S vosuesdendoodvecscansvessdessseasssessosssvelsoes 3 JYTTE o PEE EE ETT A T TE ssseniecsuses sesssoesvoesobeseanssesssacesedesessssscvsaceses 3 Cleanliness iscsi ccs2iscecessideedesces ceeedsesceveaexeccvocssscesvaessoe0esbareusescosdeesdebsedsssecestasscossssad EEN ENO oies Tore NERE 3 IC and PCB Reflow Requirement sseccsecssccssocesocecooecooecscooscocccoscccoeeosocssooesososcocccossesoeecsecssssesesecossesseesose 3 Socket AsseMmply csc ccscssaescivexecacuancneacicueussvanscnsevivscius tuixon easy ucenuseuantuanesudaunsuansausaneevandeauseaeneukunseeunreunanenrasennveens 4 Backing and insulation Plate sgsissiscccevisesciscssssivavesivecevsonccesvasevsanossvacsoussnssduasssuseneooveesecponesesnqseesssaseesasisevecsveeee 5 IC Insertion extracti n sssssssssssessccsssesssosssssssessse scesssssseosssess
5. Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com Regular visual inspection to identify abnormal wear and contaminants on the socket or test probes Examine the composition of any debris present and determine its source Try to minimize the source of debris if possible Verify that the socket is properly mounted to the load board and that it s flush to the top surface of the load board Do not use any chemicals for cleaning the socket Do not use any lubricants for test probe cleaning Light Cleaning Procedure Required equipment needed Soft to medium bristle nylon brush Set of screwdrivers Set of Hex Allen wrenches Small electronics industrial vacuum Non powdered latex or rubber gloves or finger cots Cleaning Procedure Remove the socket from the load board and brush any debris from the solder pads of the load board while vacuuming If the socket is equipped with a manual lid remove or open it to gain access to the test probe tips Hold the test socket in the vertical position brush and vacuum at the same time to avoid any contaminants going inside the socket or working their way into the test probe assembly This operation is sometimes easier with two people Rotate the socket 90 degrees and repeat the previous step Brush and vacuum the socket including the nest if equipped Re assemble the socket onto the load board when cleaning is
6. ance 0 53pF Pin to pin Capacitance 0 045pF Current carrying capacity 2 5A 0 4mm Center Spring Probe Specification Operating Temperature Continuous usage 40 C to 120 C Mechanical Specifications Individual spring pin force 20g 0 702 at operating position Spring pin cycle life 500 000 cycles Electrical Specifications P P136A P P134A Contact resistance 62MQ Self Inductance 1 1nH lt 1dB to 11 5 GHz lt 3dB to 19 3 GHz Pin to ground Capacitance 0 58pF Current carrying capacity 1 5A Insertion loss Socket Maintenance Setting up a Preventative Maintenance Program is important in maintaining both Socket and Test Probe life expectancy as well as good electrical continuity which will help minimize false rejects and low test yields Generally light cleaning is recommended for a preventative maintenance program of the test socket assembly The most effective way to determine a schedule is by tracking test yields The maintenance schedule should be based on when yields begin to fall below the performance of a new test socket Some customers perform light cleanings on a per day basis or at 20 000 or 50 000 cycle intervals The schedule depends on the amount of debris or contamination that the socket and test probes are subject to The following items should be included in a typical maintenance program 8 SSI doc Rev A IP Rev B C D RP Rev E VP P Ironwood Electronics
7. ased on spring pin technology SS BGA socket is a solder less socket that can be mounted on to a PCB using supplied hardware The PCB should have mounting and alignment holes at proper locations see page 2 of the drawing for recommended PCB layout information The typical SS BGA socket footprint is only 5mm larger than the maximum IC size It is compatible with the alternate SG BGA Figure 1 Spring Pin Socket elastomer socket footprint If there are pre existing holes in the PCB an SS BGA socket can be custom designed to accommodate those holes please call Ironwood en Figure 2 Picture of Imm ter Spring Pi Figure 1 shows a typical spring pin socket The spring pin functions as the eee contactor between the IC package and the circuit board The spring pin used in the socket is a low resistance lt 0 02Q connector Figure 2 shows a picture of the 1mm center double ended spring pin Double ended spring probes are primarily comprised of two plungers barrel and spring The spring gold plated music wire is sandwiched between two plungers gold plated hardened Beryllium Copper inside the barrel gold plated Phosphor Bronze The spring probe has high current rating 4 0A continuous single probe in free air ambient The operating temperature range is 40 to 150 C The solder balls from the IC package come in contact with the crown end of spring pin The bottom end of spring pin contacts the circuit board pad completin
8. complete If your test socket is to be put in storage it is recommended that the light cleaning procedure be performed before storage so that any harmful contaminants left on the test probes do not harden and become difficult to remove For example solder buildup will oxidize over time and will permanently damage probe tips Always store the socket assembly in a dust free fully enclosed package What to avoid when cleaning Use of compressed air is strongly discouraged Compressed Air will drive contaminants into the internal working parts of the test probes Do not apply solder or heat to the test probes Use of alcohol or other cleaners can leave a residue and carry contaminants into the internal working parts of the test probes Repeated mechanical cleaning of the probe tips will shorten the time period between required maintenance and more importantly it will start to remove surface plating which can result in continuity issues as well as contact failures and elevated resistance 9 SSI doc Rev A IP Rev B C D RP Rev E VP Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com P Ironwood Electronics e Heavy cleaning should be avoided if possible and if needed should only be performed once in the lifetime of the test probes Heavy cleaning can be done by using the same tools and methods as with light cleaning with the exception of a soft brass br
9. g an electrical path for the signal The socket mechanism can be summarized as a downward force applied on the IC which compresses solder balls on the spring probe which in turn compresses on the circuit board and thereby making electrical connection Selecting a BGA Spring pin socket Please refer to the IC package drawing to select the corresponding BGA spring pin socket Visit the Ironwood website www ironwoodelectronics com Select the Products link Next under the Browse menu select the GHz BGA amp MLF Socket SG SS link In the table select the part number from the first column which corresponds to your pin count IC body size array size and pitch The top webpage frame will show a link to the drawing a picture of the socket JPEG format and provide low volume price information The drawing is a four page PDF file The first page shows the socket cross sectional views and the material details The second page provides the recommended PCB layout Note BGA pads 2 SSI doc Rev A IP Rev B C D RP Rev E VP Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com P Ironwood Electronics are not symmetrical to the mounting holes The third page shows the compatible BGA specification The fourth page details backing insulation plate dimensions Check the BGA pattern and the following four parameters 1 IC co planarity value s
10. hould be less than or equal to that shown in the table 2 Maximum total height of IC should be less than or equal to that shown in the table 3 Maximum solder ball diameter of IC should be less than or equal to that shown in the table 4 Maximum and minimum solder ball height should fall within the range shown in the table If any of the above parameters do not match please call Ironwood Tech Support 1 800 404 0204 to help select a socket which may currently be in development PCB Requirements Please refer to page 2 of the socket drawing for all PCB recommendations For IC body sizes of 30mm or below the socket requires 4 mounting holes For IC body sizes of 31mm or above the socket requires 8 mounting holes Two alignment holes are used in all sockets The center for the first is 2 54mm below the upper right mounting hole center and the second has a center dimension 5 08mm above the lower left mounting hole center The BGA pattern is not symmetrical to the mounting holes The BGA pattern is same as the one used for the elastomer socket It is shifted due to the fact that the wire filaments in the elastomer are at an angle the shift is half the elastomer thickness in the positive x direction The same footprint used by elastomer socket is recommended for spring pin socket for interchangeability Again please refer to page 2 of the drawing for recommended footprint Thickness 1 5mm minimum This will change per customer application
11. ossssoisessoos cesoyes cossross sosse discs abn eAGaa Rae NLS 6 Imm amp 1 27mm Center Spring Probe Specification essseesssesssecssocesoosecocesscsssccesocesoosssoeescecessesesecesosess 7 0 8mm Center Spring Probe Specification eeessoessocsssesssecssocssoossoocsssecssecesocesoosescoosesoeessecssocesoosssosssseessee 7 0 5mm Center Spring Probe Specification eeessoessocsssecssecesocssoosscosessecssocesocesocsescosesoeessecssocesoossoossssesssee 7 0 4mm Center Spring Probe Specification eesseessoessocsssecssccssccescocesocessccesocesocecsoosesoessscessecesocessosssoesssee 8 Socket Maintenance acces canctsizcnencaascnecsetncaasseivedacdeadeoescadcubessetbennadadesbacdetcceanieinsdeucuieaueeseatednodenchedaaieaunisadesunenehe 9 Light Cleaning Procedure ixssciisssessaseesseessssocevassie cvveassvsnsessensesassceavcesssnonessisncssntnvasssassseduvesstncs soon saceasnstseesenes 10 Heat Sink Specifications sssssiccccsssecsiesyoesiveessvidseavsaccevsvsdcesnssevesaesyencesesennssabscdcasessvuscesoodsevassssevessveeseasseeenees 10 1 SSI doc Rev A IP Rev B C D RP Rev E VP Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com P Ironwood Electronics Socket Mechanics SS BGA sockets provide high bandwidth in a small cost effective ZIF socket for prototype test and burn in applications SS BGA socket is a simple mechanical socket b
12. ubstrate 3 Close the clamshell lid 4 Turn the compression screw clockwise until the compression plate makes contact with the BGA package 5 Turn the compression screw further so that BGA balls are compressed on the spring pins to make contact When turning becomes hard full compression is achieved Internal stops will prevent over compression when turned by hand Customer s BGA Package Compression Screw Latch Socketlid SocketBase SocketBase Assem bly BEEN JE Insulation plate Customer s PCB Nylon washer S ocketbase screw LJ Figure 4 Graphical Illustration of Socket Assembly 4 SSI doc Rev A IP Rev B C D RP Rev E VP Tel 800 404 0204 952 229 8200 Fax 952 229 8201 11351 Rupp Dr Suite 400 Burnsville MN 55337 www ironwoodelectronics com P Ironwood Electronics Backing and insulation Plate For all IC body sizes spring pin sockets require a rigid metal backing plate to prevent deflection of the target circuit board due to a high normal force required to compress the spring pins If the backside of the target PCB contains capacitors and resistors a custom insulation plate with cavities cut for those components can be designed This insulation plate sandwiches between the backing plate and target PCB as shown in figure 4 Figure 5 shows an example of a custom insulation plate Top view with component layout reference only
13. ush being used with a very small amount of alcohol Remember that an excess of alcohol and heavy brushing can lead to damage as well as unfavorable test results Heat Sink Specifications For high power dissipation a specific heat sink lid can be designed using QFIN software Please call Ironwood Tech Support 1 800 404 0204 10 SSI doc Rev A IP Rev B C D RP Rev E VP
Download Pdf Manuals
Related Search