Service Repair Instruction
Contents
1. Optical appearance complete function 4 Check if PIN Code is activated delete the PIN Code if necessary Basis is the international standard of DIN ISO 2859 Use Normal Sample Plan Level Il and the Quality Border 0 4 for LSO Remark All sample checks must be documented Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 37 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 Annex 1 Test SIM Card There are two different Test SIM Cards in use 1 Test SIM Card from the company ORGA Pin 1 number 0000 PUK 1 l 12345678 Pin 2 number 0000 PUK 2 l 23456789 2 Test SIM Card from the company T D1 Pin 1 number 1234 PUK i 76543210 Pin 2 number 5678 PUK 2 i 98765432 Technical Documentation 04 2006 TD Repair L1 L3 C81 _R1 0 pdf Page 38 of 51 Company Confidential 2006 BenQ BenQ mobile Annex 2 Battery Date Code overview Varta Date code example N9A lt Year N 2001 aae aee eee Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D Dec Maker s marking Revision Letter A B Hitachi Maxwell Date code example __ _N 9 A MX Year N 2001 ds e Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D Dec Maker s marking Revision Letter A B Sanyo Date code example m gt _ _N 9 A SY Year N 2001 OO _ o Supplier Code Month2. SoftwareUpdate i IMEI _ a Siemens Phone with S Gold Y a i SW from Mastertable al p M afs Mapping StartUpdate 6 30880 S7700 4100 Er Read out phone type Variant gt gt Appears in the window above Remarks Release 1 0 Select the mobile phone CPU type Start SW Update Choose if customer data shall be erased If Yes activate the boxes in front of xfs and mapping The decision about a Siemens authorised SW Update depends only on the Service Release Table The SW which is booted by GRT can be below the SW mentioned in the service Release Table if this SW is not released for the Net Operator If xfs and mapping are activated GRT will erase in any case the customer data even if the action is cancelled lf the user wants to download another variant then the automatically identified one he has simply to select another variant from the list Afterwards he has to start the SW Update Technical Documentation TD Repair L1 L3 C81 R1 0 pdf Company Confidential 2006 BenQ 04 2006 Page 24 of 51 Bengo mobile Release 1 0 Case 2 Operator SWAP red Step 1 Carry out step 1 4 to start SW Update SoftwareUpdate Select the mobile phone CPU type IMEI OOOO O CXV65 CXV70 f Siemens Phone with S Gold l Ea M55 MBB actuals Wl M65 ME5R MCBO Sw from Mastertable E Sou Start SW Update S66 SK65 SL55 SL56 SL65 30980 57700 4100S Choose i
3. Print test labels V is activated by default After having printed a well aligned test label you can uncheck the setting and print the correct label Hint For correct printing of IMEI labels you must have a Zebra label printer with special material that fits for label printing This printer has to be connected to local LPT1 printer port also see Installation of IMPRINT and MUST feature a printing resolution of 300dpi Technical Documentation 04 2006 TD Repair _L1 L3 C81 R1 0 pdf Page 32 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 9 International Mobile Equipment Identity IMEI The mobile equipment is uniquely identified by the International Mobile Equipment Identity IMEI which consists of 15 digits Type approval granted to a type of mobile is allocated 6 digits The final assembly code is used to identify the final assembly plant and is assigned with 2 digits 6 digits have been allocated for the equipment serial number for manufacturer and the last digit is spare The part number for the C81 is S30880 S3330 xxx where the last for letters specify the housing and software variant C81 series IMEI label is accessible by removing the battery Re use of IMEI label is possible by using a hair dryer to remove the IMEI label On this IMEI label BenQ has also includes the data code for production or service which conforms to the industrial standard DIN EN 60062 The data code comprises of 2
4. characters first character denotes the year and the second character denotes the month For example Year T 2005 JUNE To display the IMEI number exit code and SW HW version key 0 6 Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 33 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 10 General Testing Information General Information The technical instruction for testing GSM mobile phones is to ensure the best repair quality Validity This procedure is to apply for all from BenQ mobile authorized level 2 up to 3 workshops Procedure All following checks and measurements have to be carried out in an ESD protected environment and with ESD protected equipment tools For all activities the international ESD regulations have to be considered Get delivery gt Ensure that every required information like fault description customer data a s o is available gt Ensure that the packing of the defective items is according to packing requirements gt Ensure that there is a description available how to unpack the defective items and what to do with them Enter data into your database Depends on your application system gt Ensure that every data which is required for the IRIS Reporting is available in your database gt Ensure that there is a description available for the employees how to enter the data Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf
5. 1 Jan 2 Feb 9 Sep O Oct N Nov D Dec Maker s marking Revision Letter A B NEC Date code example _ NSA Year N 2001 ee a Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D D c Maker s marking Revision Letter A B IS Panasonic Date code er ON o Year N 2001 0 2002 aioli Code Month 1 Jan 2 2002 J Sep O Oct N Nov D De c Maker s marking Revision Letter A B Sony Date code example _ PNAS Year 0 2002 poor Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D D c Maker s marking Revision Letter A B Technical Documentation Release 1 0 04 2006 TD Repair L1 L3_C81_R1 0 pdf Page 39 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 11 Introduction of Service Repair Documentation Level 3 basic C81 Purpose This part of Service Repair Documentation is intended to carry out repairs on BenQ Mobile repair level 3basic only for workshops without level 3 equipment special agreement required The described failures shall be repaired in BenQ authorized local workshops only The level 3basic partners are obliged to send exchanged boards SWAP to the next higher Service Repair Partner All repairs have to be carried out in an ESD protected environment and with ESD protected equipment tools For all activities the international ESD regulations have t
6. BenQ BenQ mobile Release 1 0 Assemble Earpiece Assemble Microphone by using Tweezers Assemble Vibramotor by using Tweezers Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 16 of 51 Company Confidential 2006 BenQ BenQ mobile EN Step 12 Before assembling the PCB in the Upper Case it is mandatory to remove the Display Foil Step 13 Assemble the PCB into the Upper Case Step 14 Assemble the Lower Case with the before assembled Upper Case Technical Documentation 04 2006 TD_Repair_L1 L3_C81_R1 0 pdf Page 17 of 51 Company Confidential 2006 BenQ BenQ mobile ENO Step 15 F Place screws by using the Torque Screwdriver 15 Assemble Battery Assemble Battery Cover Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 18 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 5 BenQ Service Equipment User Manual Introduction Every LSO repairing BenQ handset must ensure that the quality standards are observed BenQ has developed an automatic testing system that will perform all necessary measurements This testing system is known as BenQ Mobile Service Equipment e For disassembling assembling Torque Screwdriver Part Number F 30032 P 228 A1 Opening tool Case opening without destroying Part Number F 30032 P 38 A1 Alternative Opening tool Part Number F30032 P583 A1 Tweeze
7. Connector RF okay Caused by customer No location update possible Back to customer without repair SCRAP has to be send separately to WSC Clean RF connector check for twisted or bent contacts check for dry joints Continue with higher repair level Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z297 C554 E commerce name CONN ANT RFO05301 PG E commerce order number L50615 Z277 C287 E commerce name SWI RF ANTENNA MS 147 Soldering temperature 240 255 C Technical Documentation TD Repair L1 L3_C81_R1 0 pdf 11 2005 Page 49 of 51 Company Confidential 2005 BenQ Bengo mobile Release 1 0 RS MMC Connector Problems Fault Symptoms Customer MMC malfunction MMC connector problems not okay SCRAP has to be send separately to WSC Back to customer without repair Watch for oxidation and damaged pads of the MMC connector not check for twisted or bent contacts check for dry joints Check the status of the MMC connector visually Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Q okay Continue with Exchange MMC gt g higher repair level connector Connector MMC Use soldering iro
8. Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 10 of 51 Company Confidential 2006 BenQ BenQ mobile EEEN Remove the Keypad MMI by using the Alternative Opening Tool Remove the Keypad Technical Documentation 04 2006 TD_Repair_L1 L3_C81_R1 0 pdf Page 11 of 51 Company Confidential 2006 BenQ Beng mobile Release 1 0 Remove Display from PCB by using Alternative Opening Tool very carefully Put the Camera Ejector Jig professional through the four edges between the Camera and the Camera Connector Now push the Ejector Jig and pull out the Camera carefully Technical Documentation 04 2006 TD_Repair_L1 L3_ C81_R1 0 pdf Page 12 of 51 Company Confidential 2006 BenQ BenQ mobile Baieaceue Overview Upper Parts Overview Lower Parts 5 Assembly of C81 Assemble Camera Assemble Display Module very carefully Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 13 of 51 Company Confidential 2006 BenQ BenQ mobile ENO Assemble Keypad Assemble Keypad MMI Technical Documentation 04 2006 TD_Repair_L1 L3_C81_R1 0 pdf Page 14 of 51 Company Confidential 2006 BenQ BenQ mobile Step 7 Technical Documentation TD Repair _L1 L3_C81_R1 0 pdf Release 1 0 Assemble MMC Holder Assemble the Side Key into the given frame Now fix the Side Key Connector into the Side Key frame 04 2006 Page 15 of 51 Company Confidential 2006
9. activated Of course JPICS hardware and authorisation have to be available Technical Documentation 04 2006 TD Repair L1 L3_C81_R1 0 pdf Page 22 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 Window explanation This general explanation is valid for all SW Update channels Personal Repair Operator SWAP Operator SWUpdate After using Check Variant Phone IMEI Number will be shown here SoftwareUpdate IMEI Window to select the mobile a E Siemens Phone with S Gold phone CPU mil Shows the different SW Versions J SetviceRelease a SW inside the mobile phone a b Version of Service Release Table SW Seal el Ei ml c Version of Master Table SW o am puo t s pdate CheckW arnant Stop leave SW Update Automatic read out function of Select ae for phone type Variant Appearing SA ae e Settings mapping in the window above K Activation of the boxes will cause erase of customer date while SW Update Remarks In case of malfunction please check o Is the correct phone type selected o Is the correct COM Port selected o lIfavariant is missing move back to Settings select the missing variant and conncet the GRM Server Then continue with SW Update Technical Documentation 04 2006 TD Repair L1 L3_C81_R1 0 pdf Page 23 of 51 Company Confidential 2006 BenQ BenQ mobile Case 1 Personal Repair green Step 1 Carry out step 1 4 to start SW Update
10. blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number E commerce order name E commerce order number E commerce order name E commerce order number E commerce order name Soldering temperature Technical Documentation TD Repair L1 L3 C81 R1 0 pdf L50634 Z97 C461 CONNECTOR BOARD TO BOARD 40 POL 1 5MM L50697 F5008 F306 CONNECTOR BOARD TO BOARD 16 POL L50634 Z97 C460 CONNECTOR BOARD TO BOARD 40 POL 1MM 360 C TIP Temp 11 2005 Page 45 of 51 Company Confidential 2005 BenQ Bengo mobile Release 1 0 Battery Connector Problems Fault Symptoms Customer GRT Mobile does not switch on No connection to GRT Back to customer without repair Battery connector problems Not oka SY caused by customer SCRAP has to be send separately to WSC check for twisted or bent contacts check for dry joints Okay Continue with i higher repair level Watch for oxidation and damaged pads of the battery connector Not okay Check the status of the battery connector visually Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Q Exchange battery connector Connector BATTERY Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resold
11. check e Ringer Loudspeaker individual check check e Frequency Error e GSM Spec e Phase Error RMS e Phase Error Peak e Average Power e Power Time Template e Frequency Error e GSM Spec e Phase Error RMS e Phase Error Peak e Average Power e Power Time Template 04 2006 Page 36 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 External Antenna 7 Call from MS e GSM900 e Keyboard check e individual e high TCH check e second highest PCL e BS Power 75 dBm e middle BCCH TX GSM Band 1 e high TCH e Frequency Error e GSM Spec e second highest PCL e Phase Error RMS e BS Power 75 dBm e Phase Error Peak e middle BCCH e Average Power e Power Time Template RX GSM Band 1 e high TCH e RX Level e GSM Spec e BS Power 102 dBm e RX Qual e 50 Frames e BER Class Ib e middle BCCH e BER Class Il e BER ee Frames 10 Handover to GSM Band fo Including Handover Check 11 TX GSM Band 2 e high o e n Error e GSM S e second highest PCL e Phase Error RMS e BS Power 75 dBm e Phase Error Peak e middle BCCH e Average Power e Power Time Template 12 RX GSM Band2 e high TCH e RX Level e GSM Spec e BS Power 102 dBm e RX Qual e 50 Frames e BER Class Ib e middle BCCH e BER Class II e BER Erased Frames Final Inspection The final inspection contains 1 A 100 network test location update and set up call 2 Refer to point 3 3 3 A random sample checks of Data reset if required
12. soldering iron to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z93 C364 E commerce order name IO JACK NANO 12 POL E commerce order number L50620 U6029 D670 E Commerce name FILTER EMI Fi Type6 PB Free Soldering temperature 360 C TIP Temp check for twisted or bent contacts check for dry joints Continue with higher repair level Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Q Technical Documentation 11 2005 TD Repair L1 L3_C81_R1 0 pdf Page 44 of 51 Company Confidential 2005 BenQ BenQ mobile Release 1 0 Board to Board Connector Problems Fault Symptoms Customer Display problems Keypad illumination problems GRT Keypad malfunction Current measured failed Keypad malfunction not okay Exchange BtoB connector Connector BOARD TO BOARD B to B connector problems Watch for oxidation and damaged pads of the B to B connector Check the status of the B to B connector visually Back to customer without repair not okay y caused by customer SCRAP has to be send separately to WSC check for twisted or bent contacts check for dry joints gt not Continue with higher repair level Use soldering iron hot air
13. Bengo mobile Release 1 0 Service Manual C81 Level 1 3 Date Department Notes to change Technical Documentation 04 2006 TD_Repair_L1 L3_C81_R1 0 pdf Page 1 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 Table of Content 1 Rey FEIO a E E de decieslcctoneuueskewssvwecesncconeencs 3 2 Unit Description of C81 sasasssnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnn nennu nnmnnn nnmnnn nnmnnn nnmnnn 4 3 Expioded View Of OET siinisovisoisinsnoinuoiinuniaonan iaaiaee 5 4 Disassembly Of CET sssccaetounsesna tases stron steaneneetcanene aetapeanveesixpedtensshiwsinasiecasacsauustentaciatesadsocantanuee csnace 6 3 POSSCIDIY OF CG T a E EEEE EEIE EE Ei SE 13 5 BenQ Service Equipment User Manual cscccececcssssneeeeseeessseeeeeeeenseeeeeeeeenseeesseeeenneees 19 6 GRT Software Functionality Configuration ccccsssscsssssseeeeeesseesecenseeseeeneeeeeeesseesseeees 20 7 GRT Software Regular Usage cccccsssseeecsesseeeecenneeeecenseeeecoaseeeseenseeeseenseeeseoassessoneseessooees 22 8 JPICS Java based Product Information Controlling System ccccsessseeseeseeeeeseeseees 27 9 International Mobile Equipment Identity IMEI cceseeeeeeneeseesseseenseeseesseseeseeseenseesoees 33 10 General Testing INformatiOn ccccceeseeseeeeceeseeeeseenseeeseeeseeseoeseeeseoeaseeseooaseeeeoenseeseoeneesaes 34 11 Introduction of Service Repair Do
14. C81 All repairs as well as disassembling and assembling have to be carried out in an ESD protected environment and with ESD protected equipment tools For all activities the international ESD regulations have to be considered For more details please check information in c market https market benqmobile com SO welcome lookup asp There you can find the document ESD Guideline Remove Battery Cover Remove Battery Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 6 of 51 Company Confidential 2006 BenQ BenQ mobile Baissea so Remove screws by using the Torque Screwdriver T5 Disconnect Lower Case from Upper Case Technical Documentation 04 2006 TD_Repair_L1 L3_ C81_R1 0 pdf Page 7 of 51 Company Confidential 2006 BenQ Bena mobile Release 1 0 To avoid scratches it is mandatory to place a protection foil onto the Display Remove MMC Holder Technical Documentation 04 2006 TD Repair L1 L3_C81_R1 0 pdf Page 8 of 51 Company Confidential 2006 BenQ BenQ mobile aise 0 Remove Vibramotor by using Tweezers Remove Microphone by using Tweezers Remove Earpiece by using the Alternative Opening Tool Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 9 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 Take out the Side Key Connector by pushing it outside the frame Now you can remove the Side Key easily
15. O BOARD 14 POL X75 C81 X3500 L50634 Z97 C516 CONNECTOR HYDRA CAMERA SOCKET C81 X3800 L36334 Z93 C297 CONNECTOR ANTENNA 6mm C81 X4800 L50634 Z297 C348 CONNECTOR RS MMC READER X75 C81 Z1601 L50620 U6029 D670 FILTER EMI Fi Type6 PB Free Hardware requirements According to General soldering information V1 3 check C market for updates Jigs Tools and working materials for all described repairs hot air blower soldering gun tweezers flux solder Technical Documentation 04 2006 TD Repair L1 L3_C81_R1 0 pdf Page 41 of 51 Company Confidential 2006 BenQ BenQ mobile Roae C81 Board Layout Display Connector Upper board side B to B Connector Tal CURI a aed i a ge aoe i aie he a a ee ee el bel cee RS MMC Reader Lower Board Side Camera Connector SIM Card Reader EMI Filter re aee mamm e eme ane Nano IO Connector RF Antenna Connector Battery Connector Technical Documentation 04 2006 TD_Repair_L1 L3_C81_R1 0 pdf Page 42 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 SIM Card Problems Fault Symptoms Customer Handset does not accept SIM card Back to customer without repair SIM Card Problems Watch for oxidation and damaged pads of the SIM Card reader Not okay Caused by customer SCRAP has to be send separately to WSC check for twisted or bent contacts check for dry joints No
16. Page 34 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 Incoming check and check after assembling Verify the customers fault description gt After a successful verification pass the defective item to the responsible troubleshooting group gt If the fault description can not be verified perform additional tests to save time and to improve repair quality Switch on the device and enter PIN code if necessary unblock phone Check the function of all keys including side keys Check the display for error in line and row and for illumination Check the ringer loudspeaker acoustics by individual validation Perform a GSM Test as described on page 36 Check the storage capability gt Check internal resistance and capacity of the battery gt Check battery charging capability of the mobile phone gt Check charging capability of the power supply gt Check current consumption of the mobile phone in different mode Visual inspection gt Check the entire board for liquid damages gt Check the entire board for electrical damages gt Check the housing of the mobile phone for damages SW update gt Carry out a software update and data reset according to the master tables and operator customer requirements Repairs The disassembling as well as the assembling of a mobile phone has to be carried out by considering the rules mentioned in the dedicated manuals If special equipment is required the
17. atch for oxidation and damaged pads of the Display connector SCRAP has to be send separately to WSC not okay check for twisted or bent contacts check for dry joints Check the status of the Display connector visually Use the resistor test Exchange function of a multimeter Continue with display to check connection higher repair level between spring connector contacts and soldering contacts The value must be 0Q Connector DISPLAY Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z97 C635 E commerce order name CONN AXK734245 Soldering temperature 360 C TIP Temp Technical Documentation 11 2005 TD Repair L1 L3_C81_R1 0 pdf Page 48 of 51 Company Confidential 2005 BenQ BenQ mobile RF Antenna Problems Fault Symptoms Customer GRT Network search Release 1 0 Failure by TX RX measurements No location update possible RF connector Problems Watch for oxidation and damaged pads of the RF connector Not Not okay Check the dust inside the RF connector Okay Not okay Check the status of the RF connector visually Okay Not Use the resistor test Exchange okay function of a multimeter RF connector to check connection between input and output contacts The value must be 0Q Okay
18. ation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 29 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 Generate Codes In the JPICS application you can choose to generate e Masterphone codes e Simlock Unlock Codes Masterphone codes The Masterphone code is used to unlock blocked mobiles Masterphone codes can only be supplied for mobiles which have been delivered in a regular manner gt ex Global Home My BenQ E Mail Beng mobile Troubleshooting Masterphone Code Mobile info Input IMEI label printing IMEI 35163000001 1691 DB Location kamp Lintfort Mobile data Producttype si55 Deliverypartnumber 36880 N4910 4150 31 Simlock unlock co Si version foco Partnumber 530880 54910 A100 53 warranty eas Status Mormal BFBus Status Delivery information Deliverynote Lc00001579 Deliverydate 15 09 05 Masterphone codes Mobile cades Mobile unlock cade 0003 40158737 6 connected Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 30 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 Simlock Unlock Code The Simlock Unlock Codes can only be generated if the following conditions are given e Mobile must have an active Simlock inside e The user must be given the authorization to obtain Simlock Unlock Codes for the variant of the operator to which the mobile was delivered last time JPICS PICS internet p
19. cumentation Level 3 basic C81 esses 40 Technical Documentation 04 2006 TD_Repair_L1 L3_C81_R1 0 pdf Page 2 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 1 Key Feature SIM Card e Small Plug In 1 8 V or 3 V SIM card Battery e Lition Battery Pack o Nominal Capacity 780mAh o GSM Capacity 750mAh Stand by Time e gt 250h 132 x 176 262K colour TFT 1 8 inch hard caps in IMF technology 12 key block 0 9 2 function keys SEND END ON OFF key combined with the END key the symbol inside O is used as a symbol for ON OFF 5 way navi key 2 soft keys for different SW enabled functions 1 dedicated hard key provider key white as illumination colour tactile finder on key 5 6 white LEDs for keypad Integrated 1 3 Mega Pixel camera Integrated camera flash light Three in one earpiece for handset handsfree and ringing tones Uni directional microphone e Loud signal emitter soundringer only for rectangular sound signals e Polyphonic ringer tones 64 voices e Hands free mode e Different selectable volume levels for handsfree handset and ringer mode MP3 ringtones and music player Real Audio 8 MPEG4 AAC AAC AAC AMR NB e Audio streaming AMR NB AAC AAC Real Audio 8 e 64 chords polyphonic ringtones e Video resolution QCIF subQCIF decoding H263 MPEG4 Real Video 8 available within 2 SW release encoding 15fps H263
20. er new component afterwards E commerce order number L50634 Z97 C482 E Commerce name CONNECTOR BATTERY 3 POL X85 2 Soldering temperature 240 255 C Technical Documentation 11 2005 TD Repair L1 L3_C81_R1 0 pdf Page 46 of 51 Company Confidential 2005 BenQ Bengo mobile Release 1 0 Camera Connector Problems Fault Symptoms Customer Camera malfunction Back to customer without repair Camera connector Problems not EN okay ee caused by customer camera connector SCRAP has to be send separately to WSC ne Check the status of the sth casa bent contacts i check for dry joints not okay okay Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Q Continue with Exchange higher repair level camera connector Connector CAMERA Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z297 C634 E commerce order name CONN AXK7L30227 Soldering temperature 360 C TIP Temp Technical Documentation 11 2005 TD Repair L1 L3_C81_R1 0 pdf Page 47 of 51 Company Confidential 2005 BenQ Bengo mobile Release 1 0 Display Problems Fault Symptoms Customer GRT Display problems Current measured failed not okay caused by customer Back to customer without repair W
21. f customer data shall be erased If Yes activate the boxes in front of xfs and mapping Read out phone type Variant gt gt Appears in the window above Remarks The decision about a Siemens authorised SW Update depends only on the Master Table The user has no chance to influence the decision Xfs and mapping are always activated there is no chance to deactivate them GRT will erase in any case the customer data even if the action is cancelled lf the user wants to download another variant then the automatically identified one he has simply to select another variant from the list Afterwards he has to start the SW Update Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 25 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 Case 3 Operator SWUpdate blue Step 1 Carry out step 1 4 to start SW Update SoftwareUpdate Select the mobile phone CPU type Li Siemens Phone with S Gold Ns a se SW from Mastertable Bi ES S65 S66 1 oi SK65 SL56 SL56 SL65 Choose if customer data shall be erased 530880 57700 410 gt If Yes activate the boxes in front of xfs lh a Read out phone type Variant gt gt Appears in the window above Remarks The decision about a Siemens authorised SW Update depends only on the Master Table The user has no chance to influence the decision Xfs and mapping can be activated on demand GRT wi
22. he administration of the JPICS web server and the PICS database server can only be provided by the JPICS TRUST Center of the responsible department in Kamp Lintfort In case of any questions or requests concerning smart cards or administration of the databases please ask your responsible BenQ Customer Care Manager Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 28 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 Installation overview The following installation description assumes that a web browser is already installed JPICS is tested with the following browsers 1 Internet Explorer Version 5 5 and higher 2 Netscape Version 6 and higher For further information regarding supported browsers browser version and supported operating systems see the Sun FAQ s Here is a step by step instruction to install all the required components It is necessary to follow this order 1 Smart Card Reader Omnikey Cardman 2020 USB or Cardman 3121 USB CardOS interface Siemens Version 3 0 B 2 3 Java Runtime Environment Sun 4 Java additional components Every user is responsible for a proper installation matching the license agreements For installation and further access you need the following 1 The JPICS Installation CD 2 The Smart Card JPICS Remark We recommend using Cardman 2020 USB or Cardman 3121 USB Serial card readers are not supported Technical Document
23. l 2006 BenQ Bengo mobile Release 1 0 7 GRT Software Regular Usage Step 1 Select the section SWUpdate Step 2 Choose the area you want to work with SoftwareUpdate Concept Please choose your update concept PersonalRepair Operators wap Operators pdate Cancel e Personal Repair Personal Repair is always accessible Basis for the decision if a SW Update is authorised by Siemens is the so called Service Release Table Example Mobile Phone has already SW50 Service Release Table shows SW50 In this case SW Update is not necessary and therefore not authorized In any case customer data can be erased on request xfs and mapping have to be activated Of course JPICS hardware and authorisation have to be available e Operator SWAP This area is only accessible if you are released by the service management to perform SW Updates for Net Operators Basis for the decision if a SW Update is authorised by Siemens is the so called Master Table Customer data will be erased without any exception and any chance to influence by the user JPICS hardware and authorisation have to be available e Operator SWUpdate This area is only accessible if you are released by the service management to perform SW Updates for Net Operators Basis for the decision if a SW Update is authorised by Siemens is the so called Master Table Like in Personal Repair customer data can be erased on request xfs and mapping have to be
24. ll erase in any case the customer data even if the action is cancelled lf the user wants to download another variant then the automatically identified one he has simply to select another variant from the list Afterwards he has to start the SW Update Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 26 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 8 JPICS Java based Product Information Controlling System JPICS PICS internet portal Microsoft Internet Explorer bereitgestellt von BenQ mobile Kamp Lintfort mB s tps Global Home hy BenQ E Mail E z Beng mobile a Username SparkaJP Password Overview The following functions are available for the LSO e General mobile information e Generate PINCODE e Generate SIMLOCK UNLOCK Code e Print IMEI labels Technical Documentation 04 2006 TD_Repair_L1 L3_ C81_R1 0 pdf Page 27 of 51 Company Confidential 2006 BenQ BenQ mobile paisacese Z JPICS PI s SAS Seles we sir Global Home hhy BenQ E Mail Mobile info IMEI label printing Masterphone codes Simlock unlock co BFBus Status 4 itUncdiemn connected The access to the JPICS server which is located in Kamp Lintfort is protected by chip card and in addition using secure socket layer SSL connection The JPICS server is only available for authorized users with a specially coded smart card These smart cards and t
25. n to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z97 C415 E commerce order name CONNECTOR RS MMC X75 CONNECTOR RS MMC X75 Soldering temperature 360 C TIP Temp Attention Avoid excessive heat in order not to damage the plastic material of the connector Technical Documentation 11 2005 TD Repair L1 L3_C81_R1 0 pdf Page 50 of 51 Company Confidential 2005 BenQ Bengo mobile Release 1 0 EMI Filter Problems Fault Symptoms Customer GRT No Data Connectivity via I O Connector No Software Update possible Get Mobile Info Fails Back to customer without repair EMI Filter Problems Not oka lt gt caused by customer SCRAP has to be send separately to WSC check for dry joints Watch for oxidation and damaged pads of the EMI Filter Check the status of the EMI Filter visually oray Continue with higher repair level Exchange the EMI Filter EMI Filter Use soldering iron to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50620 U6029 D670 E Commerce name FILTER EMI Fi Type6 PB Free Soldering temperature 360 C TIP Temp Technical Documentation 11 2005 TD Repair L1 L3_C81_R1 0 pdf Page 51 of 51 Company Confidential 2005 BenQ
26. o be considered Assembling disassembling has to be done according to the latest C81 Level 1 3 repair documentation The Service Partner has to ensure that every repaired mobile Phone is checked according to the latest released General Test Instruction document both documents are available in the Technical Support section of the C market Check at least weekly C market for updates and consider all C81 related Customer Care Information C81 Partnumber on IMEI label 30880 S3330 xxx while may be any letter A Z and xxx may be any number from 100 101 102 Scrap Handling All Scrap information given in this manual are related to the SCRAP Rules and instructions Attention Consider the new LEAD FREE soldering rules available in the communication market avoid excessive heat Scope This document is the reference document for all BenQ mobile authorised Service Partners which are released to repair BenQ mobile phones up to level 3basic Terms and Abbreviations Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 40 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 List of available Level 3 basic parts Product ID Order Number Description CM C81 X1400 L36334 Z97 C213 CONNECTOR BATTERY 3 POL C81 X1504 L50634 Z93 C364 IO JACK NANO 12 POL C81 X1604 L36334 Z97 C337 CONNECTOR SIM CARD READER K1 C81 X2200 L50634 Z97 C380 CONNECTOR DISPLAY 20POL C81 X2705 L50634 Z97 C363 CONNECTOR BOARD T
27. ortal Microsoft Internet Explorer bereitgestellt von BenQ mobile Kamp Lintfort allea Te et F i F TE p i x JF j Global Home hy BenQ E Mail Simlock Unlock Code Mobile info et information For given IMEI IMEI label printing IMEI 350673547 180612 DB Lacation kamp Lintfort Mobile data Producttype c45 Deliverypartnumber 36880 55100 K139 15 Simlock unlock co EV Ea Partnumber 530880 55100 A139 14 warranty 21 08 05 Status Normal BFBus Status Delivery information Deliverynote 0066015319 Deliverydate 22 08 03 Mobile codes Metworkcade Network Mastercode 5 Providercode 5 Provider Mastercode Masterphone codes SIM Mastercode SIM Reeanablecode Corporatecode Corporate Mastercode Network Subnet Code Network Subnet Mastercode 0004 28101158 e connected Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 31 of 51 Company Confidential 2006 BenQ BenQ mobile EEEN Printing IMEI label The module printing IMEI label offers the possibility to re print IMEI labels for mobiles again DER Global Home hy BenQ E Mail Reprint IMEI Label Input IMEI 351630000011691 Prine ries DB Location Kamp Lintfort IMEI label printing L l I I I I I I I Simlock unlock co Mobile info BFBuUS Status connected You are able to print 1 label in just one step To prevent that misaligned labels are being printed the setting
28. reach the server until you get an error message Do not select a very long time aa Settings for Swup and Jpi s Mobile Fort for JPics incl Initialisation MobilePort Speed fi 115200 Standard x JPics Server Timeout fi 80 seconds Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 20 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 Step 3 Connect to GRM Server e Choose in the section GRM the Connect to GRM Database functionality Limit ULimit Result Status ersion Enter your GRT Username and oe LI Password into this fields Password Connect Protocol Cancel aoe SS Activate always both boxes if you IM Update Sequence Files connect to the database Start M Update Firmware with Connect Status Configure GRAM connection settings It you IT infrastructure parameter have changed use this button to move to the configuration mask e End the connection with a click onto the Exit button appearing after successful data exchange GRT Software has now finished all required settings and configuration tasks All files have been down and uploaded In dependency of the selected number of mobile phones and variants the volume of transferred date could be 100MB Technical Documentation 04 2006 TD_Repair_L1 L3_ C81_R1 0 pdf Page 21 of 51 Company Confidentia
29. rs Camera Ejector Tool Professional Part Number F30032 P514 At e For testing All mobile phones have to be tested with the GRT Software The service partner is responsible to ensure that all required hardware is available For additional Software and Hardware options as well as the supported GRT equipment please check the GRT User manual Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 19 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 6 GRT Software Functionality Configuration Sep 1 Select Settings gt gt SWUP JPICS lt Settings GRM SWUpdate Equipment LSOJLSP Data Eolas LLimit ULimit Result Status MEI oa r actual SWVersion ea Talktime hh mm ss Operating Time hh mm ss Hardware ID E asic Diy SOt i S S lt TCS Contat OOt CS st i S Error Code m Mobilelnfo Siemens Phone with S Gold M usePowerSupply chk Exit GetMobilelnfo r actual Error Description Step 2 Proceed as follows gt Select all required Variants you need to repair click onto the in front of the product name gt Check Com Port setting If necessary change it gt Check speed setting Select always the lowest speed if your PC does not have a fast serial card gt Enter the value for JPICS Server Timeout Be careful this value defines how long GRT tries to
30. service partner has to use it and to ensure the correct function of the tools If components and especially soldered components have to be replaced all rules mentioned in dedicated manuals or additional information e g service information have to be considered Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 35 of 51 Company Confidential 2006 BenQ BenQ mobile GSM Test Release 1 0 With the availability of the GRT Test Alignment software this tool has to be used to perform the outgoing test gt Connect the mobile board via internal antenna antenna coupler and external antenna car cradle universal antenna clip to a GSM tester gt Use a Test SIM For Triple Band phones use a separate test case if the test software allows only one handover Skip the GSM Band test cases if not performed by the mobile phone 1 Test file 2 Test file Example nternal Antenna L a Test case Location Update e GSM Band 1 e BS Power 55 dBm e middle BCCH Call from BS e ow TCH e highest PCL BS Power 75 dBm e middle BCCH TX GSM Band 1 e low TCH e highest PCL e BS Power 75 dBm e middle BCCH eang to GSM Band fo c Handover Check TX GSM Band 2 e low o e highest PCLO e BS Power 75 dBm e middle BCCH Technical Documentation TD Repair L1 L3 C81 R1 0 pdf Band 1 GSM900 Band 2 GSM1800 Band 1 GSM1900 Parameter Measurements Limits e Display check e individual
31. streaming Real Video 8 3 GPP H 263 MPEG4 Display Keypad Camera Multimedia Audio Technical Documentation 04 2006 TD Repair _L1 L3_C81_R1 0 pdf Page 3 of 51 Company Confidential 2006 BenQ Bengo mobile Release 1 0 2 Unit Description of C81 The C81 is designed as a Bar phone with two PCBs The whole unit consists of a NolD Block and parts for the customization The NolD Block itself is made of the soldered PCBs and the preassembled upper and lower cases It is full functional and testable The parts for the customization are the keypad the front cover and the battery cover but only the battery cover will be exchangeable for the end user All plastic parts are 1 shot molded plastic parts The Front cover and battery cover are lacquered with high glossy black Hydra piano black The Upper casing is lacquered silver BEmQ SIEMENS ii f Technical Documentation 04 2006 TD_Repair_L1 L3_C81_R1 0 pdf Page 4 of 51 Company Confidential 2006 BenQ Bene mobi le Release 1 0 3 Exploded View of C81 Front Cover preassembly Edge key ie a Imd Lens Upper case Keypad MMI Modified _ Minos PCB Nano IO ae Battery preassembly D Battery Cover Microphone Antenna Vibramotor Speaker Module Technical Documentation 04 2006 TD Repair L1 L3 C81 R1 0 pdf Page 5 of 51 Company Confidential 2006 BenQ BenQ mobile Release 1 0 4 Disassembly of
32. t okay Check the status of the SIM Card reader visually Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Q Continue with higher repair level Exchange SIM Card reader Connector SIM Card Reader Use soldering iron to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z297 C458 E commerce ordername CONNECTOR SIM CARD READER R65 SHORT Soldering temperature 360 C TIP Temp Technical Documentation 11 2005 TD Repair L1 L3_C81_R1 0 pdf Page 43 of 51 Company Confidential 2005 BenQ Bengo mobile Release 1 0 I O Connector Problems Fault Symptoms Customer Problems with external loudspeaker or microphone when using a car kit Problems with accessories connected at the IO connector IO connector Problems Back to customer without repair Not W ae okay atch for oxidation and Caused by customer damaged pads of the IO connector SCRAP has to be send separately to WSC Not Check the dust inside the IO connector Clean IO connector Not okay Check the status of th Exchange the ec e status o e EMI Filter visually damaged Filter Okay Not okay Check the status of the IO connector visually Exchange IO connector Connector IO Jack Use
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