Meet the Needs of the SMT Age
Contents
1. fixing lower 2 3 Adjust upper and lower nozzle positions rotate the knob to lower the upper heater by moving upper heater backward forward make the centre of upper nozzle and lower nozzle align After adjusting lock the forward backward handle and fix the heater not moving forward backward Then lift the upper heater If need to rotate upper heater loosen the upper heater rotate lock If not tighten it Knob for locking the upper heater from Diagram moving forward backward Email salesO8 scotle com Tel 8675589378931 http www scotle com Adjust the position of 2 4 Adjust PCB clamping device and PCB support bar close up the clamping device and support bar both sizes before putting PCB on it then lift the PCB support pillar which can be adjusted to a proper position according to PCB size and make it be in line with the stage of the PCB clamping device which prevents the PCB from getting deformed As shown in the following picture PCB support pillar Hole for putting PCB clamping 2 5 Put PCB onto the support bar then align BGA chip with the upper and lower nozzles make their cores in one line Adjust PCB clamping device till the board is inthe stage of the clamp device As shown in the following diagram 2 6 Lower the upper heater head adjust PCB forward amp backward make sure the upper nozzle can cover the whole BGA chip then lock the positioning mechanism for clamping Meanwhile adjust P2. ball please repeat steps 1 4 13 Shenzhen SCOTLE Technology Email salesO8 scotle com Tel 8675589378931 http www scotle com Put solder ball on Tilt the kit Put the spare balls 6 BGA reball soldering 6 1 Put the BGA with the balls on the heating area and then solder the balls onthe BGA land Setting the soldering temp 230 C for leaded 250 C for lead free 6 2 After setting temperature start the soldering station and wait for the temperature going up to the required value and keep constant temp 6 3 When constant temp put the reballed BGA onto the soldering station witha high temperature paper underlaid to heat meanwhile use a hot air gunas a assistant heating from the upper surface 6 4 When the balls are melted they become shining liquid and line up Then move the BGA to cooling station to cool down Solderi ng finishes avert Aw j j rte sree it ae Ley a O E 6 t odo an a u 8 DE mE mE 7 Apply solder flux Email sales08 scotle com Tel 8675589378931 http www scotle com 7 1 To guarantee soldering quality make sure that the PCB land is free of dust before applying solder flux The best way is to wipe the land before applying solder flux every time 7 2 Apply a layer of soldering flux on the PCB solder land with a brush pen Excessive flux may result inthe balls shorted in reverse it easily causes missing solder So the soldering flux coating s
3. e Standard mode suitable for most of common PCB boards and BGA without special requirements lower temperature is a little higher than upper temperature Email salesO8 scotle com Tel 8675589378931 http www scotle com High Temp Top Mainly for BGA with heat sink itself and good heat resistance or some BGAs under which there are some heat reactive components For this mode upper temp is higher than lower temp Desoldering and soldering heating mainly depends on upper part and lower heating is as an assistant High Temp Bottom mainly for Crystal naked BGA and double layer BGA For this mode lower temp is higher than upper temp Desoldering and soldering heating mainly depends on lower part and upper heating is as an assistant Special mode Mainly designed for desoldering of glued boards and some boards with requirements for low peak temp leaded leadfree to gather the profile process changing for leaded and leadfree Auto calculate to perform desoldering while heating it auto calculates and changes target profiles PCB Bake Setting Temp bottom IR setting temperature Actual Temp actual temperature of bottom IR Output limit the Max output power of bottom IR input range 0 32000 setting time set the bake time will stop heating automatically when reach the time Remaining time the countdown of bake process Run start BGA Reballing setting Temp setting temperature of lower heater Actual Temp ac
4. C The method worked on leaded BGA chip is the same as lead free one Rework Skills 1 OO lf we are not sure the BGA is leaded or lead free for safety concerns we take a leaded profile to test To test means to desolder a BGA with the wire sensing inserted During heating when TC on the touch screen goes to 190 C flip the BGA with a tweezers Here if the balls are already melted we can say it is leaded In reverse we can Say itis lead free Only when TC goes to 217 C can the BGA balls be melted we might know it is lead free Usually we select or make an appropriate profile according to the size of BGA and the thickness of PCB The thicker PCB is the more temperature in lower part we need to increase Profile setting for South Bridge and North Bridge is almost the same But exactly NB North Bridge needs a little more temperature than SB South Bridge usually a few degrees only For the two store VGA on laptop motherboard we need to increase temperature in lower part and decrease temperature in upper part a bit in stage 4 of upper part set 210 220 C The reason why we do so is 24 Email salesO8 scotle com Tel 8675589378931 http www scotle com that high temperature in upper part will damage the small chips on the VGA VI Installation of Supporting Clamp for Laptop PCB Usage of clamps for laptop PCB 1 We offer a set of clamps for laptop PCB along with the machine 6pcs as show
5. CB clamping device left amp right make sure the whole BGA chip is covered by upper nozzle completely finally lock the positioning mechanism for clamping 8 Email salesO8 scotle com Tel 8675589378931 http www scotle com As shown in the following diagram PCB put on the stage of ee a Knob for lock ramping PCB positioning mechanism for Conclusion A qualified board clamping should be as follows The whole PCB must be inside of the bottom area IR heater so that is can be heated evenly The upper nozzle must properly cover the BGA so that the chip can be heated evenly Besides the cores of BGA chip upper and lower nozzle must be in one line Observe bottom of PCB to make sure the supporting pillar and bottom nozzle can support the surface of the PCB The upper nozzle heating position lowest position is 1mm away from the BGA surface 3 Remove Desolder 3 1 Clip PCB to the board supports clamp and fix the PCB as what we introduced as above 3 2 Select or set a suitable profile click Desolder on the touch screen the system will perform desolder process When heating completes it will alarm Meanwhile the vacuum is ready it will buzz when the pen starts vacuum Rotate the knob to lift the upper heater head then immediately plug the hole of the vacuum pen with the thumb and take the red tip of the pen close to the surface of BGA to pick it up from the PCB Release the vacuum pen the BGA will come do
6. Email sales08 scotle com Tel 8675589378931 http www scotle com BGA Hot Air BGA Rework Station Model No Scotle HR360 USER MANUAL vV1 O Scotle HR360 SCOTLE HR360 Shenzhen Scotle Technology Co Ltd ADD First Floor A Dormitory Nankeng First Industry Park Bantian Longgang District Shenzhen China Website www scotle com Tel 8675589378931 E mail sales08 scotle com Directory Scotle Shenzhen SCOTLE Technology Email salesO8 scotle com Tel 8675589378931 http www scotle com I Instructions on Installation and Operating precautions cccccceecceecceeeceeeeeeseeseeeaeeeaeeeeeees 2 II Introduction of Rework Station Scotle HR360 I BGA OO eran PFO Ce CUMS See ee ehe 5 MICO OUI S ee ee ee ne ee 5 2 GIAMBINd DOAA nee rennen ee nen 6 I Renova Decoder een 9 4 Glean Bande aorar ee Beten eine 10 5 BOA Repall nee aaa 11 6 BGA reball soldering uses 14 TAPON SOTO ee ENE ee ee ee 14 SENIO wesen ee ee 15 OS NEIN van oe DE RIND EINGEHEN NEE ENDETE RN HS ENERGIE IN A ASIEN 15 IV Introduction of Touch Screen Conti ns 15 V Creating a Profile VI Installation of Supporting Clamp for Laptop PCB sannnanneennnennnennnnnnnnnnnnnnnnnsnrnnnrrnnrennernnnne 25 VI Alarm Malfunction and Solutions ua aan 27 Vil Maintenance IX Scotle HR360 Technical Parameters I Instructions on Installation and Operating precautions Assembling Site To ensure security and avoid possible damages the Rewor
7. Time Guul Time Advanced Menu Assist Menu Picture 1 Peak Temp display the highest temperature of 1 thermocouple during heating process clear away the lasttime record when start heating Vaccum press down button vaccum starting button color become pink Reset vaccum off button color become red Cool start or stop cooling fan by hand Remark forbid opening it during the heating and do not close it during the cooling time Hold hold current segment temperature during the heating process Solder execute solder operation on the basis of setting profile Desolder execute desolder operation on the basis of setting profile Segldx current segment No of upper temperature profile Upper actual temperature of upper heater Lower actual temperature of lower heater Bottom actual temperature of bottom IR 1 TC display the actual temperature of thermocouple 1 2 TC display the actual temperature of thermocouple 2 Remaining time remaining time for upper in the current stage 16 Email salesO8 scotle com Tel 8675589378931 http www scotle com Heating time total current heating time Remaining cool time start count down when the cooling fan stop the cooling fan stop then count 0 Reflow time statistic the total time when the 1 thermocouple measure time over the reflow setting time Main menu as show as picture 1 Advanced menu management setting and display temperature profile Assist menu include auto pro
8. atch the BGA pins finally fine adjust the stencil lock otherwise you have to Ter Weal PR 3 An Final lock EL a a wrereyte TI Er tse reese runs hinsrns Peer yee s Susan e s elas gros a Hr yeep ee Ves FLLI AREKE s9poooe fesse Todus Ssss seees toore ess Fados Fos EKE C weer wig eats KICK Ic u wurde wre sssr CATS A Fa ae ee vss es BEL Serre to make its holes match the BGA 5 4 Adjust the gap between BGA and stencil By adjusting the Screw to make the gap between BGA and the stencil 2 8 3 4 of the ball diameter Make sure one hole for one ball going through only and it is convenient to take out the stencil 5 5 First exam if the solder ball size matches the chip and stencil second put it on the stencil as the following picture shows then shake the whole kit lightly to let the ball drop to the BGA land through the stencil s holes Finally check whether every pin has been reballed make sure no pin missing then we can put the spare balls aside and take out the cover note that tilt the kit while taking out the cover incase that the reballed balls go out from the holes of the stencil After that the qualifiedly reballed BGA can be taken out At this time if some pins found missing not yet reballed we can make it up by a right tweezers After reballing completely recollect the spare balls 5 6 When change for other BGA chip of different size as well as solder
9. d upper temperature sensing wire is working 2 Lower part heating abnormal 2 1 Reason After starts heating withthe power consumption of more than 99 if the practically sensed temperature is below 150 C the lower heater should heat up at a speed of more than twice of the it s normal speed If it can not reach that temperature standard continuously for 5s the system will give alarm 2 2 Troubleshooting a make sure the temperature parameter setting is correct b check whether the blast blower lower heating coil and lower temperature sensing wire is working Vl Maintenance In order to guarantee the machine function and prolong service life of the machine during usage we have to do some maintenance on the system regularly as follows Components name Maintenance method Maintenance period Open the cover clean the fan with high l i Upper heater pressure air mon Up amp Down Drive Apply some butter on mechanism on upper lead rail rack gear and 1 month heater other drive mechanism Open the front cover of the machine use vacuum cleaner to suck the dust and dirt and check whether the components fixed well Electronic box 3 months 28 Email salesO8 scotle com Tel 8675589378931 http www scotle com Apply some butter on lead rail rack gear and 1 month other drive mechanism Rotaliina nart of Apply some butter on lead l er 2 rail rack gear and other 1 month heater drive mechanism Fo
10. ed 11 Scotle Shenzhen SCOTLE Technology Email sales08 scotle com Tel 8675589378931 http www scotle com ieee eee ee ee den Phe ee Tr ner hr SALAS ESSE Pee ae nern Seer tewsteren SOP eeesaetane ste beenee Stencil 3 2 i Spare ball 5 2 Apply solder flux to BGA equally then place BGA as the picture showing below adjust the locating block to make BGA s diagonal and the reball kit s diagonal match together only in this case the BGA is located in the center of the reball kit finally lock the four locating block it fix it EL EEE TT T oe FAT nn nn LN RE tee trina oe RE eT eee Sheds tog A Ben co dr ran A MeN yao Te See BRERA Teen Az eee vee ee eee tJ eee eevee an u rn II EU N Oee ee eee ee ii eT eS FSS TUE ER U U U Er eee D CET EBERLE RE I EHE Eu EEE Se amp EEE U EU eh ee u ee Ao eae ae ar ae in ea ET PH Screw adjusting the Apply solder gap 5 3 Put the cover with stencil inside over the kit then move the stencil lightly to make a its holes match the BGA pins In case this method is not good enough to make stencils holes and BGA pins match each other pay attention to the deviation place remove the cover frame release the screw readjust BGA and repeat all 12 Scotle shenzhen SCOTLE Technology Email salesO8 scotle com Tel 8675589378931 http www scotle com those actions only to make sure the stencil s holes m
11. file operation PCB bake function and BGA reballing operation interface Advanced menu Profile No Others Bottom Temp Reflow Temp Alarm Temp Cool Time Upper Air Lower Air Nozzle size Speed Ginn Picture 2 Profile No 1 49 Save save current value into the database Segment S1 S8 Upper C upper heater setting temperature Time S gt constant temperature wait time on the current stage Lower C lower heater setting temperature 17 Email salesO8 scotle com Tel 8675589378931 http www scotle com Time S constant temperature wait time on the current stage Bottom Temp bottom IR setting temperature Reflow Temp apply to the analysis the 1 thermocouple over the melting point temperature time of soldering ball Alarm Temp alarm for high temperature Cool time the cooling fan open operation time after finish heating Upper air speed control upper heater air soeed input range 1 3 corresponding to low speed intermediate speed high speed Lower air speed control lower heater air soeed input range 1 3 corresponding to low speed intermediate speed high speed Nozzle Size corresponding nozzle size 3 Assist Menu Auto generate Profile Standard Pf N Hishremp Special Mode To Lower Mode Auto Caculate AGA Soleering Parameter BGA Reballing Settng Temp Actual Temp c 38 Air Speed 1 4 RUN Auto generate Profile
12. hall be even with a proper amount so as to remove the dust and foreign materials from the BGA balls and improve the welding effect Applying solder flux to BGA is the same 8 Mounting Fix the PCB on the station Mount the reballed BGA on the PCB in right position When positioning align BGA land with PCB land by referring to the silk screen frame Note that the direction sign on BGA should be corresponding with the one on PCB 9 Solder 9 1 Clip the PCB with renewed BGA placed to the supports exam the alignment of BGA and PCB adjust the supports 9 2 Set or choose an appropriate profile according to the PCB type press Solder button on touch screen it will perform soldering process When finish it buzzes to alarm meanwhile cooling starts as well The cooling time canbe setin the profile Then lift upper heater and put it aside When cooling completes take PCB out of the machine Notes The difference between Solder and Desolder process is the way of cooling i e cooling starts right after soldering completes but cooling starts 8 seconds time is settable after desoldering removing process completes IV Introduction of Touch Screen Control Turn on the machine The touch screen will automatically POWER ON as shownin picture 1and picture 2 Model No Scotle HR360 hot air BGA rework station Version No V1 00 1 Main Menu 0 8 6 12C 18 260 a Remaining Remaining peflow time Lower ana TC
13. k Station should be located where it complies with following conditions Away from inflammables Free from splashing of water or other liquids Free from the direct airflow impact from air conditioner heater or ventilator With good ventilation dry and free from excessive dust 9 9 Stable and flat location that is free from vibration and shock Power Supply Power and voltage should meet the below requirements Use the power supply with little voltage fluctuation Voltage fluctuation AC220V 10 Frequency fluctuation 50 60HzZ 0 3 Email salesO8 scotle com Tel 8675589378931 http www scotle com Space requirements To facilitate operation and maintenance when we have to move the machine forward backward and turn it itis required to reserve a room that is gt 300mm far from the back Operation Precautions While operating the rework station pls follow the following precautions 1 After switching on the power supply firstly check if there is airflow blowing from the upper lower hot air nozzle If not itis prohibited to start heating Otherwise the heater will get burnt 2 Set different profiles for various BGA The maximum temperature setting of any segment of the profile shall be less than 300 C Refer to the BGA tin bead welding profile while using the lead free rework 3 Check the PCB land and BGA tin bead one by one before mounting BGA After mounting check the appearance one by one If any abnormal sympto
14. lso lead free First of all we choose a lead free profile and check the settings as in shown Fig 1 Second clamp the PCB to the supports and insert wire sensor into BGA for testing temperature Third start desoldering as in shown Fig 2 When heating completes look over the Analyze column to check the preheat time reflow time and max temperature peak whether they meet the requirement of lead free technology as in shown Fig 1 7 lf every parameter in Fig 1 meets requirement that means this profile is suitable for this BGA then we can save it as LF BGA model number Next time we repair the same BGA chip as this no need to test the profile any more but use it directly In reverse we have to change settings then save 8 If the max temperature peak TC is lower or higher than the standard required temperature 245 lead free we can take C a method as follows e g The tested Max temperature is 220 C 245 220 x1 2 30 e g The tested Max temperature is 260 C 245 260 x1 2 18 We put 30 or 18 to offset then we can get a suitable profile 9 If the preheat time is too short which doesn t meet requirement 60 90s lead free 22 Email salesO8 scotle com Tel 8675589378931 http www scotle com there are two solutions to make a suitable profile 9 1 When the profile running finishes stage 2 with a temperature TC below 150 C we can increase the set temperature or prolong
15. m occurs stop mounting and check the temperature immediately The soldering can be continuously performed only after the proper adjusting Otherwise it may damage the BGA or PCB plate 4 Regularly clean the surface of the machine In particular keep the IR heating board surface clean Prevent the dirt drops on it The dirt may affect the proper heat radiation and result in poor welding quality as well as 2 Email salesO8 scotle com Tel 8675589378931 http www scotle com considerably reduce the lifetime of the IR heater 5 Untrained operator can t change any set parameters 6 Avoid electric fans or other equipments blowing toward to the rework station while it is working or it may cause the heater s abnormal temperature rise and the work piece will get burnt 7 While it is working don t put any stuff on the heating area Otherwise the stuff will get burnt The PCB should be put on the supporting frame 8 Itis prohibited to touch the heating area to avoid burn while working 9 While working keep the rework station away from the flammable sprays liquid or gas 10 Don t remove the front panel or cover of the electric cabinet that is with HV high voltage components in that may cause electric shock 11 In case the metal or liquid falls into the station while it s working Shut off power and pull out the plug Clean away all the dirt after the machine cools down It will give out bad smell if there is dirt when it restarts No
16. n in the following picture 2 The clamps are fixed on the tapped hole of PCB supports according to the PCB size fixed by rotating the knob as shown in the following picture 29 Scotle shenzhen SCOTLE Technology Email salesO8 scotle com Tel 8675589378931 http www scotle com 26 Email salesO8 scotle com Tel 8675589378931 http www scotle com 3 Clamping laptop PCB put PCB on the supports make sure the cores of BGA upper nozzle and lower nozzle are ina line Adjust PCB clamping device move the clamps to the holes on PCB and fit then fit the knob on the supports finally pull the clamps tight before tighten the knob to make the PCB neat Refer to the following picture Locking the PCB Locking the PCB Vil Alarm Malfunction and Solutions 1 Upper part heating abnormal 1 1 Reason a After starts heating with the power consumption of more than 99 if the practically sensed temperature is below 150 C the upper heater should heat up ata speed of more than twice of the it s normal b If the practically sensed temperature is over 150 C the upper heater should heat up at the speed of 0 1 C S c lf any of the above two situations can not be qualified the system will give alarm 1 2 Troubleshooting Zt Email salesO8 scotle com Tel 8675589378931 http www scotle com a make sure the temperature parameter setting is correct b check whether the blast blower upper heating coil an
17. om Tel 8675589378931 http www scotle com Remaining Guul Time Reflow time Main Moma Advanced Menu Assist Menu Lead free profile setting Fig 1 Segidx Upper Lower ist TC ond TC Remaining Remaining Time Time During the whole heating process there are 8 stages from preheating to cooling but usually only 5 stages are enough and available 1 PRE Stage 1 preheating the board in this stage temperature is low usually below 100 C 2 RISE Stage 2 temperature rising in this stage we want temperature rise quickly so we usually set 205 C for lead free and 190 C for leaded 3 Cons Stage 3 keeping temperature constant in this stage we keep a constant temperature of 20 30 C lower than stage 2 so as to wipe off the impurity on the board because during this period the flux is volatilizing which does good for wiping off the impurity 4 REF Stage 4 ball melting and reflowing in this stage the ball begins to melt and reaches to the peak so the temperature should be high usually is highest and time should be long 5 REF Stage 5 reflowing from the peak to ball s melting point in this stage temperature must be lower than Stage 4 and time usually is 5 10S in upper heater 21 Insert the wire sensor into the BGA to test the temp of balls Testing temperature Fig 2 6 Check the PCB to be repaired and confirm it is leaded or lead free E g PCB is lead free of course BGA a
18. pot light 19 Cooling fan 20 21 Lamp on off 14 15 16 PCB supporting bar 17 18 Power switch 22 Laser light on off I BGA Operating Procedures BGA rework on PCB should comply with the following procedures 1 Bakeout Both PCB and BGA must be baked in a constant temperature oven at a temperature range from 80 C 100 C for 8h 20h The purpose of baking is to dehumidify the PCB and BGA in case blowout during rework Table 1 Moisture sensibility grade Context Saving RH relative humidity Timeless lt 30 C 85 RH Gi Scotle Shenzhen SCOTLE Technology Email salesO8 scotle com Tel 8675589378931 http www scotle com Refer to th nn lt 30 C 60 RH labeled time Table 2 Baking time Hu midity Seal o sensitivity Baking time thickness grade 4hs lt 1 4MM 2a O1 sa NO lt 2 0MM 2a lt 4 0MM 2a 5a w 2 Clamping board 1 1 To select proper upper nozzle and lower nozzle suitable for BGA sizes 1 2 Upper nozzle is fixed on the upper heater head Tighten the screw to fix the nozzle that can be adjusted as per BGA position and angle Lower nozzle is fixed on the lower heater Rotate the up down fine adjusting knob to lift the nozzle and then tighten the screw to fix the nozzle 6 Email salesO8 scotle com Tel 8675589378931 http www scotle com Screw for fixing upper g Diagram Knob for up down adjusting Screw for
19. rward amp Backward Driver on upper heater Clean the heating tube Bottom IR heating panel with dry cloth do not use 1 day wet one Apply some lubricant to PCB clamps the PCB supports and 1 month shaft of support guiding axle IX Scotle HR360 Technical Parameters Technical Parameters Top heater 350 C Temp Control 29 Email salesO8 scotle com Tel 8675589378931 http www scotle com Sub bottom heater 300 C Power for operation 3800W Power bottom heater 2400W Dimension LxW xH 620 600 650mm P for requirement system Other scotle BGA rework station models Scotle ir360 Scolte ir360 pro Scotle HR460C Scotle HR360 ADD First Floor A Dormitory Nankeng First Industry Park Bantian Longgang District Shenzhen China Website www scotle com Tel 8675589378931 E mail sales08 scotle com 30
20. te Never clean the IR heater heating board with liquid Use fine sand paper to rub away the stubborn dirt on the IR heating board We will be irresponsible for replacing the heater for free for the previous mentioned reason Il Introduction of Rework Station Scotle HR360 BGA Rework Station Scotle HR360 made by Scotle has 3 heaters Upper Heater Lower Heater and Bottom IR Heater The upper and lower heaters heat directly towards BGA part to ensure BGA gets enough heat to reach the melting point to come to good welding quality The bottom heating zone is large area IR heating board for preheating the whole PCB board to insure even heating and prevent the PCB get deformed scotle HR360 Diagram Scotle shenzhen SCOTLE Techn ology a Ph pete Email salesO8 scotle com Tel 8675589378931T Nttp www scotle con Parts name 1 Knob for fine adjusting the height of the upper heater 2 Knob for locking the upper heater from moving forward backward 3 Handle for locking upper heater from rotating Email salesO8 scotle com Tel 8675589378931 http www scotle com 4 Knob for adjusting upper heater up down O1 Upper heater OD Upper nozzle N Lower nozzle 00 Lower heater co Vacuum pen Knob for adjusting the lower heater up down 0 1 Temperature sensor joint 2 4 4 12 Touch screen 13 Knob for locking PCB jig Knob for positioning PCB Laser light 7 PCB clamping device S
21. the time in this stage on both upper and lower parts The standard requirement is that TC wire sensed temperature must up to 150 C when stage 2 ends 9 2 The profile running finishes stage 2 with a temperature TC of 150 C or more In this case we should prolong the time in stage 3 The prolonged time must be the number missing in preheat time i e We prolong how much seconds it misses in the preheat time preheat time must be between 60 90s 10 If reflow time is too short below 40 90s which also does not meet requirement 10 1 The solution is to prolong time in stage 4 or 5 The same as point 9 2 i e to prolong how much seconds it misses in the reflow time reflow time must be between 40 90s 10 2 Suppose the preheat time and reflow time are too long preheat time over 60 90s reflow time over 40 90s we can take a reverse method of the above 10 3 After changing the setting we get a new profile Also we have to test this new profile again The method of testing is the same as what we mentioned in Fig 2 Even this profile is still not qualified we have to change and readjust setting again and again until it is qualified then save in the machine 23 Email salesO8 scotle com Tel 8675589378931 http www scotle com 08 6 at 18 240 390 36C Remaining Remaining Remaining i Time Time Guul Time Reflow time Main Mera Advanced Menu Assist Menu Leaded profile setting Segldx Upper Lower 1st TC ond T
22. tual temperature of lower heater Air speed input range 1 4 Setting time the require time for reballing heating process Remaining time the countdown of reballing heating operation Run start Email salesO8 scotle com Tel 8675589378931 http www scotle com x Maintenance skill 1 When we are not sure if the BGA is lead free or leaded for safety we had better treat the BGA as leaded Enter the leaded temp profile insert the wire sensor into BGA start desoldering on the touch screen Check if the BGA melted with nipper when the measured temp up to 190 C It is leaded BGA if the ball melt It is lead free BGA if the ball melt when 217 C 2 Select proper profile based on BGA size and PCB thickness We need to increase the bottom temp ifthe PCB is too thick 3 For usual computer board the temp setting are similar The temp for north bridge is several degrees higher than south bridge In case the notebook PCB the lower temp setting is high with the upper temp at 210 220 C for the display card If the upper temp setting is high the balls on video memory will melt that will result in failed soldering V Creating a Profile To set BGA temp profile insert the wire sensor into BGA to check if the profiles meet the requirements Our company provide with lead free and leaded profile for reference Entry parameter setting screen set the profile parameters as per various BGA types as following 20 Email salesO8 scotle c
23. wn from the pen Then the cooling fan starts work Cooling finishes Take the PCB out from the supports Email sales08 scotle com Tel 8675589378931 http www scotle com Distance 1 2mm between nozzle and Cover the hole with Pick up the BGA after Vacuum pen s hole AFET 4 Clean Land The PCB land and BGA land must be cleaned ina short time after desoldering Because the damage to the land is small while the PCB or BGA haven t cooled down completely Please refer to the following steps Cleaning PCB Is the same As shown as following diagram 4 1 Prepare a soldering iron with temperature 370 C for lead free chip and 320 C for leaded chip 4 2 Apply a little layer solder flux to BGA equally 4 3 Mop the chip with the soldering iron to clean it 4 4 Take a wick to clean the land until it is neat 4 5 Wipe pad To ensure the reliability of BGA soldering wipe the pad with some volatile solvent such as Industrial alcohol 10 Scotle shenzhen SCOTLE Technology Email sales08 scotle com Tel 8675589378931 http www scotle com BEE Te Apply solder Mop the pad with flux with brush soldering iron Mop with both iron and wick 5 BGA Reball 5 1 Choose a stencil a reballing kit and proper solder ball that match the BGA put the stencil between the kit s frame and cover then screw up to lock the stencil But please do not lock it tight so that it can be fine adjusted and mov
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