BGA Rework Station (SP-360C)
Contents
1. Shuttle star BGA Rework Station SP 360C User s Manual Version V1 03 Shenzhen Shuttle Star Industrial Co Ltd 3F Building B Huangtian Brightway Industrial Park Xixiang Baoan District Shenzhen China Tel 86 775 27513884 Fax 86 755 27513017 E mail overseas xs sz com Website www xs sz com www shuttlestar com cn Directory 1 Instructions on Operation and Operating Precautiong11 1111 1 TAtroducton of REWOrk Sanon SPRING aNG 9 3 Operating Procedures 10 aaa mamaammammmunun 7 A initrodichonto Louch Screen Conto NANANA ine 17 5 Creating a Profile esses amma 25 6 Instruction on Installation of Supporting clamp for Laptop PCB 29 7 Alarm Malfunction and Troubleshooting esssesseeeeeeeeeeseeeenses 31 AN BANA ues ae ARA 32 Q Specifications sees aano 33 I Instructions on Installation and Operating Precautions To ensure safety and prevent possible damage to the rework station it is required to install the rework station at a location complying with the following conditions Away from inflammables Install the rework station at a location free from splashing of water or other liquids Install the rework station at a location free from the direct airflow impact from air conditioner heater or ventilator Install the rework station at a location with good ventilation Install the rework station at a dry location Install the rework station at a location free from excessive dust2. oke Http www xs sz com Shuttle star E mail overseas xs sz com Tel 86 755 275 13884 Hotline 86 13510894956
3. 18 to offset then we can get a suitable profile 9 Ifthe preheat time is too short which doesn t meet requirement 60 90s leadfree there are two solutions to make a suitable profile 9 1 When the profile running finishes stage 2 with a temperature TC below 150 C we 26 can increase the set temperature or prolong the time in this stage on both upper and lower parts The standard requirement is that TC wire sensed temperature must up to 150 C when stage 2 ends 9 2 The profile running finishes stage 2 with a temperature TC of 150 C or more In this case we should prolong the time in stage 3 The prolonged time must be the number missing in preheat time i e We prolong how much seconds it misses in the preheat time preheat time must be between 60 90s 10 Ifreflow time is too short below 40 90s which also does not meet requirement the solution is to prolong time in stage 4 or 5 The same as point 9 2 i e to prolong how much seconds it misses in the reflow time reflow time must be between 40 90s 11 Suppose the preheat time and reflow time are too long preheat time over 60 90s reflow time over 40 90s we can take a reverse method of the above 12 After changing the setting we get a new profile Also we have to test this new profile again The method of testing is the same as what we mentioned in Fig 2 Even this profile is still not qualified we have to change and readjust setting again and again until it i
4. Adjust the position of nozzles rotate the Knob adjusting upper heater up and down lower the upper heater by rotating the Knob adjusting upper heater forward amp backward make sure the cores of upper and lower nozzles are in one line Then lock the Knob for locking upper heater forward amp backward to make the upper heater can not be moved forward and backward any more Finally lift the upper heater and put it aside If need to rotate the upper heater loosen the Knob for locking upper heater from rotating if not tighten it diagram Knob for locking upper heater from moving forward amp backward Knob adjusting upper Knob for locking upper Adjust the position of nozzles heater up and down heater from rotating 2 4 Adjust PCB clamping device and PCB support bar close up the clamping device and support bar both sizes before putting PCB on it then lift the PCB support pillar which can be adjusted to a proper position according to PCB size and make it be in line with the stage of the PCB clamping device which prevents the PCB from getting deformed As shown in the following picture PCB support pillar Hole for putting support pillar PCB clamping device 2 5 Put PCB onto the support bar then align BGA chip with the upper and lower nozzles make their cores in one line Adjust PCB clamping device till the board is in the stage of the clamp device 2 6 Lower the upper heater head adjust PCB f
5. preheat temperature Reflow the first column for setting low reflow temperature the second column for setting high reflow temperature the third column shows the time taken from low reflow temperature to high reflow temperature Max Temp shows the max temperature that the wire sensor senses from the BGA The black zone shows the real time profile trends where green line stands for upper heater blue line stands for lower heater red line stands for the practical profile from BGA PCB next is the profile name usually are the BGA model numbers Stanby to show the status of the machine The top middle zone in the whole black zone shows the alarm events TC shows the currently sensed temperature by wire sensor X coordinate indicates time unit second Y coordinate represents temperature unit centidegree Solder click it to automatically perform the soldering process according to the selected profile Desolder click it to automatically perform the desoldering process according to the selected profile or set parameters Stop stop the system while running Vacuum vacuum start switch Press down means ON reset means OFF Cooling start cooling function it will stop cooling automatically while heating Laer pointer to power on the laer pointer Menu click to enter menu column refer to Fig 3 SetTemp click to enter parameter setting column refer to Fig 6 SV shows the set value of temperature PV shows the practically measured va
6. the machine cools down If contaminants remain there they may give off bad smell after restart NOTE Never clean the IR heater heating panel with liquids the stubborn dirt on it can be cleared of with crocus paper I Introduction of Rework Station SP360C BGA Rework Station SP360C made by Shuttle Star has 3 heaters Upper Heater Lower Heater and Bottom IR Heater Thereinto the Upper Heater amp Lower Heater which are hot air heaters heat directly towards the BGA chip to make sure the chip get enough heat so that it can reach its melting point and be soldered well The large heating area at the bottom is series IR heating panel called Bottom IR Heater which heats directly towards the whole PCB preheat to make sure PCB be heated evenly so that it won t get deformed SP360C overall schematic diagram Part name 10 option switch for bottom IR heating panel Bottom IR Heater I1 12 13 14 15 knob for micro adjusting the height of upper heater knob for locking the upper heater in longitudinal direction knob for locking the upper heater from forward and backward knob for adjusting the height of upper heater laser pointer for alignment upper Heater upper nozzle lower nozzle lower heater knob for adjusting the height of lower heater vacuum pen USB interface touch screen thermocouple wire sensor 16 17 18 19 20 21 22 23 PCB supports locking knob PCB positioning knob LE
7. D lamp PCB supporting bar PCB clamping device bottom heating panel Bottom IR Heater cooling fan mains switch II Operating Procedures BGA rework on PCB should comply with the following procedures 1 Bakeout Both PCB and BGA chip must be baked 1n a constant temperature oven with a temperature range from 80 C 100 C for 8h 20h The purpose for baking is to dehumidify the PCB as well as the BGA in case bubble phenomenon occurs during rework Tablel moisture sensibility grade lt 30 C 85 RH 2 tyear lt 30 0 60 RH ga 4weeks lt 30 0 60 RH 3 in lt 80 060 RH Cl som os 48h s30C606RH sa 2am s30C606RH Refer to the labeled 30 C 6024 RH time Table2 baking time encapsulatio moisture n baking time sensibility grade thinkness 2 Clamping board 2 1 To choose upper nozzle and lower nozzle suitable for BGA size 2 2 Upper nozzle is fixed onto the upper heater head tighten the screw for tightening upper nozzle to fix it It can be adjusted according BGA s position and angle Lower nozzle is fixed on the lower heater head can tighten the screw for tightening lower nozzle to fix it Rotate the knob adjusting lower nozzle up and down clockwise to lift the lower nozzle This time tighten the screw for tightening lower nozzle to fix it diagram Screw for tightening upper nozzle Knob adjusting lower nozzle up and down Screw for tightening lower nozzle 2 3
8. Install the rework station at a location free from vibration or shock Install the rework station at a stable and flat location Power Supply Power and voltage should meet the following requirements Use the power supply with little voltage fluctuation Voltage fluctuation AC220V 10 Frequency fluctuation 50 60Hz 0 3 Space Requirements To facilitate operation component replacement and maintenance for the rework station it is required to reserve gt 300mm space at the back of the rework station for the upper part of the machine will be moved and rotated while Reserve gt 300mm space at the back of the machi ne Operating Precautions l While using the rework station please follow the following operating precautions After turning on the power supply master switch of the rework station check whether there is airflow wind blowing from both upper and lower hot air heaters If no wind blowing no heating otherwise the heaters will get burnt Set the different profiles for various BGA to be reworked The maximum set temperature of any segment of the profile shall be less than 300 C Refer to the BGA tin bead welding profile for the temperature setting while using the lead free rework Check for the perfection of the PCB plate soldering pan and BGA tin beads one by one prior to the installation of BGA check the appearance one by one after the BGA welded and stop installing the BGA and measure the temperature if a
9. SSR is power on when the machine is turned on and whether PLC has data output 3 alternate the SSR to exam whether it is broken 4 check the upper lower heater element take a multimeter to measure the resistance of the IR heater whether connecting line 1s well connected 3 Thermocouple shows wrong value 3276 7 Troubleshooting 1 check whether the wire head of the thermocouple is fine 2 cut the damaged part of the wire and twist tow newly comeout heads 3 check the inner connecting line of the thermocouple whether it is well connected if not re connect it yellow is red is 4 The vacuum too weak to pick up the IC Troubleshooting 1 check whether the vacuum is working 2 check whether the windpipe is loose 3 check whether the vacuum pen leaks 5 Tripping while starting machine Troubleshooting 1 check whether the ground line and null line in the plug get shorted 2 disassembly the IR heater panel to check whether the wire is loose 3 check whether the wire connection in lower heater is shorted circuit VII Maintenance In order to guarantee the machine function and prolong service life of the machine during usage we have to do some maintenance on the system regularly as follows Components name Maintenance method Maintenance period Open the cover clean the fan with Upper heater 1 month high pressure air Up amp Down Drive mechanism on Apply some butter on lead rail rack i th m
10. d chip called leaded profile 1 for leadfree chip called leadfree profile The user can create new appropriate profiles for different BGA chips based on the existing standard rofiles in the machine Before creating a new profile for a BGA we have to use a existing profile and test whether the profile fits the BGA by inserting the wire sensor into the BGA while desoldering to see the temperature Sct lTompcrature Best leadfree profile requirement Preheat temperature 150 190 C Preheat time 60 90 S Reflow temperature 217 217 C Reflow time 40 90 S Max temperature peak TC 240 C 5 C Tpper Offcnt Leadfree profile setting Fig 1 During the whole heating process there 8 stages from preheating to cooling but usually only 5 stages are enough and available 1 PRE Stage 1 preheating the board in this stage temperature is low usually below 100 C like in Fig 1 55 C 2 RISE Stage 2 temperature rising in this stage we want temperature rise quickly so we usually set 205 C for leadfree and 190 C for leaded 3 Cons Stage 3 keeping temperature constant in this stage we keep a constant temperature of 20 30 C lower than stage 2 so as to wipe off the impurity on the board because during this period the flux is volatilizing which does good for wiping off the impurity 4 REF Stage 4 ball melting and reflowing in this stage the ball begins to melt and reaches to the peak so the temperature should be high usual
11. e intersecting the profile line 2 Input the temperature of the line first then click the intersecting point A amp B 3 Click on the profile line without moving your figure drag point A or B to the point where shows the temperature you want to analyze please note that the input column for A amp B at the right shows the current data of Temperature and Time while A amp B is being dragged Tip Point A and point B appears alternately e g first click point B appears second click point A appears then third click point B appears again System Help Requirement for solder Melting point for leadfree BGA ball 2171C Preheat Temp 150 190C Preheat Time 60 905 Reflow Temp 217 217 C Reflow Time 40 905 Max Temp Peak 240451 Melting point for leaded BGA ball 1837 Preheat Temp 150 183 C Preheat Time 60 1205 Reflow Temp 183 1831C Reflow Time 40 905 Max Temp Peak 2104510 Fig 5 In Fig 5 Describes the requirement for BGA soldering 21 Set Temperature Nozzle Upper Lower Offset Offset Cooling see pomatoaa ato Fig 6 Pre Power In Fig 6 PCB click it to enter edit window refer to Fig 8 Nozzle Here describes the size of nozzle that this chip needs Click the profile setting in the yellow zone popping an edit window like Fig 9 Pre Power Here shows the output power for Bottom IR Heater while heating Area Here shows the set temperature for Bottom IR Heater i e Upper Offset Lower Of
12. etes IV Introduction to Touch Screen Control Turn on the machine The touch screen will automatically POWER ON as shown in Fig 1 English ah Ai Sc M Shuttle Star Industrial Tel 86 0755 27515884 Email overseas shuttlestar com cn Add 3F Building B HuangTian Bri zhtway Industrial Park X1X1 Faz 665 0755 27513017 Http FEF 5 2 I com ang BaoAn District ShenZhen Fig 1 The company s LOGO ss located at the top left corner English Click it to select English menu Chinese Click it to select Chinese simplified menu Password click the black column to input password Note If password is missing it can be recovered only by re downloading program Therefore please keep it in mind User permissions shown as follows password can be changed only in the group of Engineer Default Group Permissions password 1234 Technician Can enter operating mode only in this mode parameters can be read only 8888 Engineer Can enter both operating and debugging mode in this mode parameters can be changed and saved Preheat EU Reflow Ea Max Temp ER solder Desolder 510p Vacuum Cooling Focus Power Heat Cool HU rene sareen Bel Tine Setem Fig 2 In Fig 2 The upward side if the analysis column Preheat the first column for setting low preheat temperature the second column for setting high preheat temperature the third column shows the time taken from low preheat temperature to high
13. fset Here we can input the compensation value for lower heater 1f we would like to change the profile or parameter setting If we input 10 it means the SV set temperature for lower heater increase 10 C at whole if we input 10 it means the SV set temperature for lower heater decrease 10 C at whole Cooling Here shows the time that the system takes for cooling automatically once heating completes Alarm Here shows the alarming time 5s also 5s means the system give alarm 5 seconds before the heating completes When alarm stops heating completes Save click to save the set and good to the system Download click it to download the current profile for use Close click it to close the window if no changes want to take Input characters Caps In Fig 7 Input characters please input the PCB name Po gt switching key for different input BONES page up amp down to select word Fig 8 In Fig 8 After click the input column in the yellow zone input the profile code to the popped window then click OK Notice Please Input The Name Of Picture Fig 9 In Fig 9 Tip Please insert USB here we can cut the current menu picture and download to USB there is a USB interface outside Picture s format is BMP stands for PCB s information V Creating a Profile Usually speaking our company make and save 2 standard profiles in the machine during adjustment 1 for leade
14. l drop to the BGA chip through the stencil s holes Finally check whether every pin has been reballed make sure no pin missing then we can put the spare balls aside and take out the cover note that tilt the kit while taking out the cover in case that the reballed balls go out together with the stencil After that the qualifiedly reballed BGA can be taken out At this time if some pins found missing not yet reballed we can make it up by a right tweezers After reballing completely recollect the spare balls 5 6 When change for other BGA chip of different size as well as solder ball please repeat steps 1 4 14 Put solder ball on 6 BGA reball soldering Tilt the kit Put the spare balls aside 6 1 Prepare a soldering station for BGA reball soldering set soldering station temperature at 230 C for leaded BGA and 250 C for leadfree BGA 6 2 After setting temperature start the soldering station and wait for the temperature going to the required value and being constant 6 3 When the temperature keep constant put the reballed BGA onto the soldering station with a high temperature paper underlaid to heat meanwhile use a hot air gun as a assistant heating from the upper surface 6 4 When the balls are melted they become liquid with light color and line up Also it will give off fumes Seeing this stop heating and take away the BGA from the Station 7 Apply solder flux 7 1 To guarantee soldering q
15. ll come down from the pen Heating finishes 8 seconds this value is settable later the system starts cooling automatically After cooling we can take the PCB out from the supports Distance between nozzle and BGA 1mm Plug the hole up with t humb Vacuum pen hole To pick up BGA 4 Clean pad The PCB pad and BGA pad must be cleaned in a short time after desoldering Because damage to the pad is small while the PCB or BGA haven t cooled of completely Please refer to the following steps cleaning PCB is the same 4 1 Prepare a soldering iron with temperature 370 C for leadfree chip and 320 C for l1 leaded chip 2 Apply a small layer solder flux to BGA equally 3 Mop the chip with the soldering iron to clean it 4 Take a wick to clean the pad until it is neat gt A A A KR 5 Wipe pad To ensure the reliability of BGA soldering wipe the pad with some volatile solvent as strong as possible such as industrial alcohol Apply solder flux Mop the pad with with brush soldering iron Mop with both iron and wick 5 BGA Reball 5 1 Choose a stencil a reballing kit and proper solder ball that match the BGA put the stencil between the kit s frame and cover then rotate the screw to lock up But please do not lock it tight so that it can be micro adjusted and moved 12 HULULL BEE T Z r A oil Spare ball accumulator 5 2 apply solde
16. lue of temperature Power shows the current power Time shows the time that the constant temperature lasts in the current stage Heat at the upper displays the constant temperature time of this stage at the lower displays the total heating time Cool at the upper displays the cooling time currently remained at the lower displays the current total cooling time Status shows the system status PrtScm click it to print the screen refer to Fig 9 Fig 3 In Fig 3 Analyze click it to enter analysis column refer to Fig 4 Operate Screen click it to return to operating screen refer to Fig 2 Start Screen click it to return to start screen refer to Fig 1 Change password enter to change password input new password then click OK Help click it to enter Requirement for solder refer to Fig 5 In Fig 4 Line input a temperature value there will be a referring line showing the temperature value in the profile diagram A the left column for setting temperature Y coordinate for point A the right column for setting time X coordinate for point A B the left column for setting temperature Y coordinate for point B the right column for setting time X coordinate for point B Time difference shows the time that the profile runs from point A to point B There three ways of operating the analyze function 1 Input the a general value in the Temperature and Time column of A amp B directly exam point A and B whether they ar
17. ly is highest and time should be long 5 REF Stage 5 reflowing from the peak to ball s melting point in this stage temperature must be lower than Stage 4 and time usually is 5 10S in upper heater Insert the wire sensor into the BGA to test the temperature of it Testing temperature Fig 2 6 Check the PCB to be repaired and confirm it is leaded or leadfree E g PCB is leadfree of course BGA also leadfree First of all we choose a leadfree profile and check the settings as in shown Fig 1 Second clamp the PCB to the supports and insert wire sensor into BGA for testing temperature Third star Remove as in shown Fig 2 When heating completes look over the Analyze column to check the preheat time reflow time and max temperature peak whether they meet the requirement of leadfree technology as in shown Fig 1 7 Tf every parameter in Fig l meets requirement that means this profile is suitable for this BGA then we can save it as LF BGA model number Next time we repair the same BGA chpp as this we no need to test the profile any more but use it directly In reverse we have to change settings then save 8 Ifthe max temperature peak TC 1s lower or higher than the standard required temperature 245 C leadfree we can take a method as follows e g The tested Max temperature is 220 C 245 220 x1 2 30 e g The tested Max temperature is 260 C 245 260 x1 2 18 we put 30 or
18. ny abnormal symptom occurs The welding can be continuously performed only after the proper adjusting otherwise it may damage the BGA or PCB plate Regularly clean the surface of the machine In particular keep the IR heating plate surface clean and prevent the contaminated material deposits on it The deposits may affect the proper heat radiation and result in the poor welding quality as well as considerably reduce the lifetime of the IR heating body Operator without being trained can not change any set parameter Avoid electric fans or other equipment blowing towards the rework station while it is working or it may cause abnormal temperature rise in heating zone and thus the work piece will get burnt Keep the heating zone away from inflammables after startup or it may cause fire or explosion put the PCB for process onto the PCB supporting racks To avoid burn please wear heat proof gloves and never touch the high temperature zone while working Never use inflammable sprays liquids or gases at any location close to the rework station while the machine is working 10 Don t remove the front panel or cover of the electric cabinet because the electric cabinet 11 contains HV high voltage components which may cause electric shock In case any metal or liquid accidentally falls into the rework station while working shut off power and remove power line immediately Remove such foreign matter or contaminants after
19. on upper heater gear and other drive mechanism Open the back cover of the machine use vacuum cleaner to suck the dust Electronic box 3 months and dirt and check whether the components fixed well Forward amp Backward Drive Apply some butter on lead rail rack r th mon mechanism on upper heater gear and other drive mechanism Rotating part mechanism on optical Apply some butter on the drive parts 1 month system Clean the heating tube with dry Bottom IR heating panel 1 day cloth do not use wet one Apply some lubricant to the PCB PCB clamps supports and shaft of support guiding 1 month axle 32 IX Technical Specification Technical specification Max PCB size 430mmx350mm Applicable PCB Workable area 430x350mm Max size 55mmx55mm Upper heater 350 C Lower heater 350 C Sub bottom IR heater 300 C 16sections of programmable Temperature control l temperature control setting Power for operation 3500W Main upper heater 800W Power consumption Lower heater 800W Bottom IR heater 2400W System parameter Power for requirement SHUTTLE STAR INDUSTRIAL CO LTD Our company has been delicated into the R amp D of the new products and the improvement of technology All the parameters of our products are subject to our latest information Welcome to select and purchase other products of our company we will provide goods as per your particular requirement Shenzhen Shuttle Star Industrial Co Ltd
20. orward amp backward make sure the upper nozzle can cover the whole BGA chip then lock the positioning mechanism for clamping Meanwhile adjust PCB clamping device left amp right make sure the whole BGA chip is covered by upper nozzle completely finally lock the positioning mechanism for clamping diagram PCB put on the stage of clamping Knob for lock clamping device PCB positioning mechanism for Cl ampi ng Conclusion A qualified board clamping should be as follows The whole PCB must be inside of the bottom area IR heater so that is can be heated evenly The upper nozzle must properly cover the BGA so that the chip can be heated evenly Besides the cores of BGA chip upper and lower nozzle must be in one line 3 The PCB support pillar should touch the board lightly 3 Remove Desolder 3 1 Clip PCB to the board supports clamp and fix the PCB as what we introduced above 3 2 Select or set a suitable profile click Remove on the touch screen the system will perform desolder process When heating completes it will give alarm meanwhile the vacuum is available for pick up chip it will buzz when the pen starts vacuum This time rotate the knob to lift the upper heater head then immediately plug the hole of the 10 vacuum pen up with the thumb and remove the suction nozzle on the tip of the pen to the BGA chip then pick it up from the PCB Release the vacuum pen the BGA wi
21. r flux to BGA equally then place BGA as the picture showing below adjust the locating block to make BGA s diagonal and the reball kit s diagonal match together only in this case the BGA 1s located in the center of the reball kit finally lock the four locating block it fix it Locating block Apply solder Screw adjusting the gap Reball kit s Lower die flux between BGA and stencil diagonal holder 5 3 Put the cover with stencil inside over the kit then move the stencil lightly to make its holes match the BGA pins In case this method is not good enough to 13 make stencil s holes and BGA pins match each other pay attention to the deviation place open the cover frame readjust BGA and repeat all those actions only to make sure the stencil s holes match the BGA pins finally lock otherwise you have to micro adjust the stencil Final lock Adjust stencil to make its holes match the BGA pins E o a EO x a a NN ASE BA EA 5 4 Adjust the gap between BGA and stencil By adjusting the Screw adjusting the gap between BGA and stencil we can make the gap between BGA and the stencil 2 3 3 4 of the ball diameter Make sure one hole for one ball going through only and it is convenient to take out the stencil 5 5 First exam the solder ball size whether it matches the chip and stencil second put it on the stencil as the following picture shows then shake the whole kit lightly to let the bal
22. s qualified then save in the machine sot lemapoerature Best leadfree profile requirement Preheat temperature 150 183 C Preheat time 60 120S Reflow temperature 183 183 C Reflow time 60 90 S Max temperature peak TC 210 C45 C s a 1 IPOT TG i Pra Poecr T T UT pat erage VapLling Leaded profile setting The method worked on leaded BGA chip is the same as leadfree one Rework Skills 1 If we are not sure the BGA is leaded or leadfree for safety concerns we take a leaded profile to test To test means to desolder a BGA with the wire sensing inserted During heating when TC on the touch screen goes to 190 C flip the BGA with a tweezers Here if the balls are already melted we can say it is leaded In reverse we can say it is leadfree Only when TC goes to 217 C can the BGA balls be melted we might know it is leadfree 2 Usually we select or make an appropriate profile according to the size of BGA and the thickness of PCB The thicker PCB is the more temperature in lower part we need to increase 3 Profile setting for South Bridge and North Bridge is almost the same But exactly NB North Bridge needs a little more temperature than SB South Bridge usually a few degrees only For the two store VGA on laptop motherboard we need to increase temperature in lower part and decrease temperature in upper part a bit in stage 4 of upper part set 210 220 C The reason why we do so is that high temperat
23. uality make sure that the PCB pad is free of dust before applying solder flux The best way is to wipe the pad before applying solder flux every time 7 2 Apply a layer of soldering flux on the PCB solder pad with a brush pen Excessive flux may result in the balls shorted in reverse it easily causes missing solder So the soldering flux coating shall be even with a proper amount so as to remove the dust and foreign materials from the BGA tin beads and improve the welding effect Applying solder flux to BGA is the same 8 Placement Lay the PCB on a table place the reballed BGA onto the PCB manually Align BGA pad with PCB pad by referring to the silk screen frame Note that the direction sign on BGA should be corresponding with the one on PCB 9 Solder 9 1 Clip the PCB with renewed BGA placed to the supports exam the alignment of BGA and PCB adjust the supports 9 2 Set or choose a appropriate profile according to the PCB type start Solder on touch screen it will perform soldering process When finish it buzzes to give alarm meanwhile cooling stars as well The cooling time can be set in the profile Then lift upper heater and put it aside When cooling completes take PCB out of the machine Notes The difference between Solder and Remove process is the way of cooling i e cooling starts right after soldering completes but cooling starts 8 seconds time is settable after desoldering removing process compl
24. ure in upper part will damage the small chips on the VGA VI Instruction on Installation of Supporting Clamp for Laptop PCB Usage of clamps for laptop PCB 1 We offer a set of clamps for laptop PCB along with the machine 4 pcs as shown in the following picture Clamps neck 2 The clamps are fixed on the tapped hole of PCB supports according to the PCB size fixed by rotating the knob as shown in the following picture Tapped hole 3 Clamping laptop PCB put PCB on the supports make sure the cores of BGA upper nozzle and lower nozzle are in a line Adjust PCB clamping device move the clamps to the holes on PCB and fit then fit the knob on the supports finally pull the clamps tight before tighten the knob to make the PCB neat Refer to the following picture 30 VIL Alarm Malfunction and Troubleshooting 1 Bottom IR not heating Troubleshooting 1 check whether the profile parameters bottom temperature is correct 2 check the whether the indicator of SSR is power on when the machine is turned on and whether PLC has data output 3 alternate the SSR to exam whether it is broken 4 check the IR heater take a multimeter to measure the resistance of the IR heater whether connecting line is well connected 2 Upper lower part heating abnormal Troubleshooting 1 check whether the profile parameters upper lower temperature is correct 2 check the whether the indicator of
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