Precision Lead-free Reflow Oven Contents
Contents
1. C setting the time between 0 30s when the temperature key select heat preservation segment and then press the key SET to lower than 250 C setting the time 0 1Min After that press the key SET to enter the temperature setting state Press the key or change the save the setting or press the key RUN to discard modification setting value and then press the key SET to save 1t or press the key RUN to discard the modification You can t change the setting temperature lower 50 SOLDER TEMP TIME e MSLDR 250C 00 30 SOMA SLD R BRP ROR IO C than the last process EXIT Y OK SOLDER TEMP e MKEEP 235C 0000 0000 g FIX 1847 Y BRE F R 24t nd RE 00090 000909 Fig 18 Text Welding set Fig 19 Curve Welding set SOLDER SLDR 1250 C EAS FIA 154 A 5 HE FIA 54 fr 5 HE SOLDER TEMP TIME y SLDR 230 00 30 a Fig 24 Text Insulation set Fig 25 Curve Insulation set EXIT y OK SOLDER TEMP SOLDER KEEP 000909 000906 pee p TA at e Soa TA ae to S oa nl Fig 20 Text Temperature settings Fig 21 Curve Temperature settings 000909 0009 FIX att A Ge xx FIX at A LS rmx Fig 26 Text Temperature settings Fig 27 Curve Temperature settings X Setting parameter of cooling 14 15 Under the interface in Fig28 Fig29 Fig30 Fig31 press the key to select cooling segment and press the key SET to enter the temperature setti2. PCB board It is a gentle transition of next temperature paragraph also setting the time 1 5Min in this segment You also can set the time by the size of the board and the number of the components 2 The purpose and role of the heating Activated the liquid flux of tin pulp under the role of the liquid flux remove the oxide of surface components inside the tin pulp preparation for soldering In this section the temperature of the lead alloy solder and precious metal alloy solder should be set 150C 180 C eg Sn42 Bi58 Indium tin alloy low temperature Lead Solder Sn43 Pb43 Bil4 low temperature lead solder and so on Set the Mid temperature lead solder alloy temperature between 180 220 C Set the high temperature lead free solder alloy temperature between 220 250 C If you have solder and tin pulp information the temperature of the heating can be installed in less than tin pulp melting point temperature of 10 C is the best around 3 The purpose and role of the soldering The purpose is to complete the SMT soldering As this stage is the highest temperature in the whole soldering process the components is easy to damage This process the solder physical and chemical changes of the largest are also to the improvement of soldering process The solder dissolves very easily in the high temperature oxidation in air If you have solder and tin pulp information you can installed the temperature of the soldering higher than tin pulp me
3. return back mode select or press the key RUN enter the operation standby state as shown in SOLDER TEMP TIME a HEAT 220C 01 30 s SOLDER HE AT IICA RIO EXIT a v OK 0000 000909 FIA 1247 g HE FIA 247 eB KE Fig 12 Text Heat settings Fig 13 Curve Heat settings SOLDER TEMP TIME wa HEAT 220 CEET JORDANIA 220 C ROUNO 300 EXIT v OK 00090 0000 FIX 3247 os RE F A 1547 T q KE Fig 14 Text Temperature settings Fig 15 Curve Temperature settings SOLDER TEMP TIME T HEAT 220C 01 30 S10 0 D 5 aun IEA OS S 0 1 30 FO EXIT OK FIX e Fig 16 Text Time Settings Fig 17 Curve Time Settings SOLDER TEMP TIME SLDR pl Ome 00 30 i S10 51D 5 Gans oD AOS S 00 30 O 300 200 EXIT v OK X Setting parameter of soldering Under the interface in Fig18 Fig19 Fig20 Fig21 Fig22 0 0 t ou Fig23 press the key select soldering segment and then press the key A zt Y 8 aie ae Y RE SET to enter the temperature setting state Press the key or setting Fig 22 Text Time Settings Fig 23Curve Time Settings the temperature between heating segment 300 C Press the key SET save X Setting parameter of heat preservation the setting and enter the time setting state When the temperature setting Under the interface in Fig24 Fig25 Fig26 Fig27 press the between 250 300
4. set much longer time The small area or less parts PCB set shorter time generally In order to ensure quality of back solder in this stage should shorten the time as much as possible to protecting components 4 The purpose and role of the heat preservation Let high temperature liquid solder solidified into solid state soldering points Solidification quality has a direct impact the crystal structure of the solder and mechanical properties If the solidification to fast will lead the solder formation of crystalline rough solder joint is not bright mechanical properties decrease Under high temperature and mechanical impact soldering points easily crack lose mechanical and electrical connections role lower product durability We always use to stop heating methods and heat preservation for some time In the temperature slow decline process the solder can solidification and crystal good Generally set the temperature point lower than the solder point 10 20 C around Use of natural cooling when the temperature dropped to the temperature point it will enter cooling paragraph 5 The purpose and role of the cooling paragraph This cooling segment is simple usually cooled to the temperature will not scalding the people To speed up the process of operation may also stop the process when the temperature fell to below 150 C To avoid burns to use tools hand belt or heat resistant grove take out the PCB board 6 Note General temperature cur
5. ATTEN INSTRUMENTS SM T Precision Lead free Reflow Oven Model AT R3028 User manual J O a OoOo o INSTRUMENTS LEAD FREE REFLOW OVEN E z x E 3 050 000 oT 2 8 4 5 6 7 8 8 1011 12 19 14 15 Minute ON OFF RIN y t SET SHENZHEN ATTEN ELECTRONICS CO LTD Contents Introducti ON usina Aaa E ad Main technique paramet ssrisssissssansidericsiasisK isss toison edoiaicaidariiissiidaae Structure INtrOCUCTION ccccccccccccccccccccccccccccccccccccccsccscscscscsccccccccceed Function key introduction ssessssesesesssoecooesoeoesooesoeossoeoeoesesoeooo 5 The function of temperature CUrV E essssssoesoeoesosesoecoesosoessseoeooeoeossee 5 Common alloy solder temperature curve adjustment parameters 8 Common alloy solder physical constant and characteristics oooooooooom o 9 Running Oper AMON mori si a ir LU Back soldering Opera esororionaic ricerca 17 Faults alar assim arcoiris 18 ACAO E india dal Introduction The MINI IR REFLOW OVEN is equipment that used for electron production and maintain of SMT technique The product adopts the far infrared heating components and excellent sense temperature materials Through the precise control of the microcomputer make the temperature control curve match to the request of the SMT production technique completely The temperature control curve of the equipment can be adjusted accurately so it can satisfy the request of m
6. ME e ERROR C 01 00 e SOLDER Detecting Element 300 200 Detecting Element 00090 00090 FIA z4 SY x F X z4 O F zE Fig42 Text Detecting Element Fig43 Curve Detecting Element 3 Failure of heating element When there is something wrong of the heating element the machine will alarm and then the fan start to work the screen displayed Heating Element asshownin Fig44 Fig45 You can press the key SET or RUN to quit and return standby menu When the machine alarm it will enter the safe mode automatically If the fan did not work or the heating element working continues you had better turn off the power immediately and check the fault 19 SOLDER TEMP TIME e ERROR 28C 01 00 Heating Element 0 0090 F R t E T z5 Fig44 Text Heating Element 20 SOLDER Heating Element 300 000o FIX 15 47 t Y KE Fig45 Curve Heating Element pr Attentions Please use the special power supply outlet that is over 15A solely never used the same outlet with other electrical appliance Must ensure the grounding well The Infrared Reflow Oven should be set horizontally there should be over 20cm between its periphery and walls 3 Don t use the machine on wet or high temperature environment Don t use the water to clear the machine body directly 5 Don t use the iron wire or other tools insert or plug up the air intake and the 9 a
7. any kinds of soldering paste which are different material parameters It can shut down and alarm the faults automatically Also it has many functions such as soldering maintenance and drying The structural performance and operation has been upgraded and improved Using Chinese English bilingual operating system and efficient and convenient power switch Main technique parameter Working voltage AC220V AC110V order Working frequency 50 60Hz Maximum output power 1650W Heating methods infrared radiation and hot air mix heating Operating system Chinese English operating system Working mode automatic soldering mode maintenance mode adjustable LX A AR RN NS Temperature curve paragraph warm up heating soldering heat preservation and cooling segment Range of temperature and time on warm up 70 150 C 0 5Min Range of temperature and time on heating warm up temperature to 250 C 0 5Min x Range of temperature and time on soldering heating temperature to 300 C 0 30s Range of temperature and time on heating preservation soldering temperature 0 50 C x Tray specifications 305x320mm Size 460x372x275mm Structure introduction Power jack fuse and power switc Main body mc APN Operate button pf b y eo fj Figl Mechanical structure Work salver placed PCB board and other drying goods Salver pull pull the salver to placed things Power jack fuse and power switch supply powe
8. e have nothing operate over 30Min will shut down automatically REPAIR IVIVE 200C 30 00 REPAIR SI E ION 300 RUN 00090 RE FIX 18 47 Y RE F X 24t T Y Fig 32 Text Maintenance Fig 33Curve Maintenance REPAIR T 200 CIN 300 REPAIR TEMP TIME a 30 00 v OK 00090 00090 FIX 35 4T E RE FIX 5 4T Y KE Fig 34Text Temperature settings Fig 35Curve Temperature settings REPAIR TEMP TIME REPAIR II VEAMOS 5 30 00 o 300 AOR 30 00 o 200 OK 0000 000909 FIX 547 y HE FIX iB fF Eps KE Fig 36Text Time Settings Fig 37Curve Time Settings Back soldering operation After setting the equipment have safety conduction to operation Put the circuit board in the middle of the tray closed chassis press the key RUN ae enter the working state as shown in Fig38 Fig39 The working lamp of machine will be light and the screen will be display working the temperature display current temperature the time display setting time When the temperature reaches the set point the time start to countdown after the completion of the countdown the machine will enter the next section When the machine is working the working lamp will be shut down or flashing when the actual temperature over the setting value 5 C the machine will open the fan to cooling When the machine is running you want to exit please press the key RUN You also can press the key RUN to stop exhau
9. er is designed to solder the circuit board components the whole process are PREH warm up HEAT heating SLDR solder KEEP heat preservation and COOL wait for the machine to cool down the mode Repair is designed to dismantle circuit board components there is only one temperature setting segment Before you enter the working mode make sure the parameters whether right or not You must set the parameter of the machine when you first time use it or the tin pulp formula has been changed You also can change the language Chinese or English which you want 1 power on Turn on the main power switch back of the instrument on the left top of the display have red light lighted then press the key ON OFF on the panel AAP and English displayed in the screen and the LED of the fan is lighted As shown in Fig 3 Bes SMDi S7c i PIP TEF Precision Lead free Reflow Oven o gt English AT R3028 O 0 12 3 4 5 6 7 8 9 10 11 12 13 14 15 4 f Minute FIX 1217 y 4 HE Fig 3 Operation Panel 2 Select the language As shown in Fig3 the display shows 45 P X and English You can press the key or to change it and press the key SET to save 10 the setting The screen arrowhead pointed is the language which you selected the acquiescence is you select last time 3 Select working mode After you select the language the dis
10. ir outlet Don t make the dangerous goods that is combustible explosive near the machine Don t dry the goods which have combustible gas Don t hit the body avoid damaging the heat pipe If detects the heat pipe had been break should turn off the power supply and repaired it Don t stretch your hand into the cabinet when the machine has not fall to the safe temperature Don t use the machine on tablecloth to prevent plug up the air intake 10 If the heat pipe damaged must replace it with the same manufacturer production A
11. lting point temperature of 30 50 C We divided the solder into three low temperature solder 150 180 C mid temperature solder 190 220 C high temperature solder 230 260 C Now commonly used lead free solder materials for high temperature solder low temperature solder is generally precious metals lead free solder and the special requirements of low temperature lead solder General electronic products use rarely 1t often use in specific requirements for electronic equipment At present many lead free solder are also no substitute for lead solder as the mid temperature leaded solder has excellent electrical properties mechanical properties impact resistance properties of hot and cold the antioxidant properties therefore in a common electronic products also large scale use In this segment you can set the time according to the requirement in the following After high temperature melting solder shown as liquid all the components of SMT floating on the surface of the liquid solder In the surface tension effects of the flux and liquid floating components will be move to the center of the solder pad have the role of reform automatically Also in the humid of the solder flux the solder tin and surface metal of components formed ae alloy layer infiltrated into components structural organization which form the ideal soldering structural Setting the time about 10 30s a large area and the larger components shade of PCB should be
12. ng press the key SET once to enter the time parameter setting state as shown in Press the key or setting the time between 0 5Min press the key SET to saving After saving the parameter press the key RUN enter the standby state as shown in SOLDER TEMP TIME PREH 150 01 00 a SOLDER PRE H SY C S 01 00 200 EXIT KE O 3247 i HE FIX 12 4T Fig6 Text Pre heat settings Fig7 Curve Pre heat settings SOLDER TEMP TIME SOLDER PREH IT 150 CRANRIINO ys PREH 150C 01 00 O MA E EXI a v OK o 15 47 Y RE FIR 3247 ES KE Fig8 Text Temperature settings Fig9 Curve Temperature settings SOLDER TEMP TIME SOLDER PREH 1 150C S 0 1 00 PREH EN 01 00 y a AAC EXIT ae v OK Be KE 9 15 47 q HE FIX 1547 Fig 10 Text Time Settings Fig 11 Curve Time Settings 212 X Setting parameter of heating As shown in Fig12 Fig13 Figl4 Fig15 Figl6 Fig17 press the key select the heating segment the screen display heating press the key SET enter the temperature setting state As shown in press the key or gt setting the temperature between warm up segment 220 C Press the key SET save the temperature setting and enter the time setting state As shown in press the key or setting the time between 0 5Min press the key SET to saving and
13. ng state Press the key or change the setting value from 70 C to the setting last process and then press the key SET to save it or press the key RUN to discard the modification SOLDER TEMP SOLDER T 150C 150C o EXIT F R 18 47 Ge E FIX 35 47 Y KE Fig 28Text Cooling settings Fig 29Curve Cooling settings SOLDER TEMP S10 9D 5 eu 1010 ummm T 150 C e EKos 150 C o 200 EXIT 00090 00009 FIX at e Ge i in FIX at A Ge xx Fig 30 Text Temperature settings Fig 31 Curve Temperature settings lt Setting parameter of repair mode Under the interface of standby as shown in Fig32 Fig33 Fig34 Fig35 Fig36 Fig37 press the key to select the repair mode press the key SET to enter the temperature setting state as shown in Press the key or to change the temperature press the key SET to save On the repair mode the temperature range is divided into three parts when the temperature setting between 70 150 C no need to setting time when the temperature setting between 150 200 C setting the time between 0 15Min when the temperature setting between 200 250 C setting the time 0 10Min 216 When the machine operation set time will shut down automatically NOTE On the setting the mode if the machine have nothing operate it will return back to the standby state on the standby state the machin
14. play will be show the work state Back soldering or Repair press the key to select the work mode As shown in Fig4 Fig5 under the standby screen press the key RUN to enter the working state press the key SET to enter the parameters setting press the key ON OFF to exit the operation system SOL DE RIE TIME PREH 7T 150C8 01 000 a PREH Oe 01 00 l 200 RUN 0000 0000o FIX 18 47 T RE FIX 18 47 Y KE Fig 4 Text Standby interface 4 Setting parameters Fig 5 Curve Standby interface On the standby menu press the key SET to enter the parameter setting state The mode column displayed the current mode Back soldering The segment column displayed the current selective segment press the key or gt to select segment you want to setting Press the key RUN returns back the standby menu and press the key SET to enter the temperature setting state As shown in figure 4 X Setting parameter of warm up Press the key SET once to enter the setting state of warm up as shown in fig 5 Press the key SET again enter the temperature setting state as shown in Fig6 Fig7 Fig8 Fig9 Figl0 Figli 11 press the key or change the temperature between 70 150 C Press the key SET to saving or press the key RUN to discard modification After temperature setti
15. r for main body and suddenness protect Display display the setting parameter and working state Operate button operate the machine and setting parameter Function key introduction ATTEN AT R3028 INSTRUMENTS LEAD FREE REFLOW OVEN O o 123 4 5 6 7 8 9 10 11 12 13 14 15 Minute ON OFF RUN y 4 SET ON OFF Button Fig2 Operation Panel SET Button ON OFF press the key to turn on or turn off the machine If the working state hasn t quit or the temperature hasn t declined to safety the system can t force quit lt gt gt using to change the setting parameter SET running setting parameter and save the setting RUN running the machine exit running state or exit setting state The function of temperature curve In the SMT production process adjust the temperature curve according to different alloy formula or tin solder paste which make the better quality of product Usually the reflow soldering has five temperature segments The temperature and the time can be set to satisfy the request of different PCB board In order to better explain the requirements of the various temperatures and the role we will describe every temperature segment in the follow 1 The purpose and role of the warm up Heating the PCB board from room temperature to 120 150 C which make the moisture fully volatile and eliminate the internal stress and some residue gas of the
16. st and return to standby mode When the machine running to cooling segment fan starts and full exhaust When the temperature cooling to setting value the buzzer will be alarm status bar shows that the complete SOLDER PREH 1T 100C 8 01 00 SOLDER TEMP TIME e Epas 102C m 01 00 a Working 00090 00909 HA at A Ge uz F R at o Ge rmx Fig 38Text Operation Fig 39Curve Operation Faults alarm 1 Dangerous temperature There 1s a highest safe setting temperature on each process while the machine working After you switch on the machine 1t will detect the current temperature If the temperature exceeds the safe temperature 10 C the display will show Dangerous Temperature and blink The buzzer alarm and then the fan start to work The alarm will be stop and the machine running normally when the temperature decline to safety As shown in Fig40 Fig41 18 SOLDER TEMP TIME d ERROR as 01 00 o SOLDER Dangerous Temperature 300 Dangerous Temperature 00090 0000 HA 34H 4 SY uz HA 4 SY xx Fig40Text Dangerous Temperature Fig41Curve DangerousTemperature 2 Failure of detecting element When there 1s something wrong of the temperature detecting element the screen displayed Detecting Element as shown in Fig42 Fig43 the machine alarm and the fan start to work You can also press the key SET or RUN to quit and return standby menu SOLDER TEMP TI
17. ve set from the low temperature after satisfy the soldering requirements as much as possible to reduce the soldering temperature Also can through extend back soldering time to reduce the temperature this will be conducive to the protection of low temperature components especially some connectors and plug Some components can not satisfy temperature requirement can be used to after soldering to solve Common alloy solder temperature curve adjustment parameters C I min C 1min C 30s e ES Low temperature leaded __ Sn43 Pb43 Bil4 Lead free mid temperature Sn87 Ag3 Cu3 In7 130 150 180 190 240 250 Lead free mid temperature Sn91 Zn9 130 150 180 190 240 250 Lead free mid temperature ee 130 150 180 190 250 260 Common alloy solder physical constant and characteristics Melting Solder alloy temperat Mechanical properties ure Ag Sb Au Cu Zn iquidus ls Strength tai pool MPa C2 HB 183 61 ps 166 MO TE E ts es E 10 po 29 41 pps 27 B2 5 ps 13 99 30 p6 20 18 62 Be 2 179 64 p9 tes 3 E OL LE E O LA OS A 965 135 21 45 55 3 134 97 5125 304 30 p2 po Bs a O Td pd 2451 400 1bsS ee 7 43 pa tal 163 ss pr 4 fo e fff sat 18 77 0030 193 0 os AS a Running operation There are two working mode to select in this equipment which are Solder and Repair The mode Sold
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