SM/SMP User Manual
Contents
1. compressed during that time which will help extend the life Handling and Cleaning of the SM Interposer Always handle the SM by the outside edges and avoid touching the top and bottom of the conductive columns Important Do not touch or rub the conductive columns of SM Never use a stiff wire brush on the SM interposer Never use any alcohol or cleaning chemicals on the SM If the PCB is cleaned with chemicals always be sure it is completely dry prior to touching the SM Use compressed air to blow dust debris from the top and bottom of the SM prior to use and assembly If there is debris that cannot be removed by air use a soft animal hair brush to lightly clean the SM It may also be helpful to use a microscope and tweezers to remove some contaminants Note Some loose silver particles from the SM conductive columns are normal and do not impact functionality If there is excessive particle dispersion please contact Ironwood Electronics at 1 800 404 0204 or info ironwoodelectronics com 3lPage SM_SMP doc Rev A 2 06 2015 VP2. onto the pins alternating opposing corners until it is seated against the socket Work carefully to avoid enlarging or deforming the SM tooling holes Work the opposite direction to remove the SM carefully easing it off the guide pins Do not use a sharp instrument and or grab one corner and pull it off the guide pins because it can cause damage to the SM tooling holes Assembly of the Socket to the PCB Assure that the test site PCB pads and immediately surrounding surfaces are free of contaminants and any sticky or chemical residues Then blow clean with compressed air Place the socket s alignment pins into the corresponding holes in the PCB Hold the socket stiffener on the back side of the PCB so it lines up with the mounting holes secure the socket to the PCB and stiffener using the mounting screws or fasteners Assure that the socket is firmly seated and coplanar with the PCB Removal and Storage of the Socket Remove the socket from the PCB and store with the SM attached in the protective packaging provided Do not allow multiple sockets to rub against each other If the SM interposer is separate from the socket always keep it contained and protected in the supplied packaging box and or small bags This will keep the SM from being touched or damaged and prevent the accumulation of dust and debris If the socket remains attached to the PCB it is recommended to store the socket with the lid open so the SM remains un actuated not
3. CSP POP Full and Partial Arrays Available Up to 0 28 mm 40 50 grams lead 55 C to 155 C P Flex layer gt 2 000 000 actuations SM elastomer gt 500 000 actuations Contact life is influenced by introduction of bias to the IC and the plating of the IC leads which will have an impact in the degradation of the contact performance In some cases socket will experience IC sticking issue for temperature tests above 60 C After test device will get stuck on the elastomer and device might require tweezers to release the IC from the socket 2lPage SM_SMP doc Rev A 2 06 2015 VP r O nN WO O d Tel 800 404 0204 L E C T R O N C S www ironwoodelectronics com Socket with SM Interposer Assembly and Maintenance Instructions Assembly of the SM Interposer to the Socket The socket may come with the SM interposer already assembled to the socket body To install or remove the SM please proceed with the following steps Blow off both sides with compressed air during assembly to remove any debris Do not touch or rub the SMcolumns Install the SM so the DUT leads touch the SM columns on one side and the PCB pads touch the SM columns on the other side Gently press one of the SM tooling holes over a first corresponding guide pin Do the same for the other tooling hole and guide pin diagonally opposite When both tooling holes are on the guide pins use a flat tip tweezers or similar tool to ease the SM further down
4. SM SMP User Manual DR 200000099 gt e o gt n LE gt gt o a o AO La 7 a e gt m Sale e pa o n gt ate a n n n no n Va gt Rd o LI vt SAS a r O A WO O d Tel 800 404 0204 L E C T R O N C S Mii renwoodelecironiescom SM SMP socket uses SM amp SMP contact technology for high speed low inductance high endurance and wide temperature applications SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation These conductive columns diameter optimized for 50 ohm impedance are suspended in a non conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time temperature and cycles This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed Solutions are available for 0 25mm to 1 27mm LGA BGA QFN CSP POP WLP and other packages Figure 1 SM SMP Socket with Swivel Lid Figure 2 SM Elastomer The silver ball matrix contact technology is also available with a protective plunger matrix a gold plated copper cylinder that sits on top of the conductive columns This plunger matrix protects the conductive column from contamination from various solder ball interfaces A quickly replaceable plunger matrix enables minimal downtime during final
5. production test The product family code for this line of sockets is SMP SMP Elastomer layer Protective layer Relaxed Actuate Figure 3 SM Elastomer 1IPage SM_SMP doc Rev A 2 06 2015 VP SM Elastomer Electrical 0 5mm pitch Bandwidth Frequency Response Self Inductance Mutual Inductance Capacitance to Ground Mutual Capacitance Contact Resistance Initial Current Rating Mechanical Contact Length Compressed Pitch Packages Compliance Range Travel Contact Force Lead Initial Operating Temperature Expected Life SMP Elastomer Electrical 0 5mm pitch Bandwidth Frequency Response Self Inductance Mutual Inductance Capacitance to Ground Mutual Capacitance Contact Resistance Initial Current Rating Mechanical Contact Length Compressed Pitch Packages Compliance Range Travel Contact Force Lead Initial Operating Temperature Expected Life Ironwood ELECTRONICS Tel 800 404 0204 www ironwoodelectronics com Idb O gt 40 GHz 0 10 nH 0 02 nH 0 14 pF 0 01 pF lt 25mQ 4 amps 14C heat rise 0 45 mm lt 0 3mm Mixed Pitch Available BGA LGA QFN DFN CSP POP Full and Partial Arrays Available Up to 0 23 mm 40 50 grams lead 55 C to 155 C gt 10 000 actuations 1db gt 40 GHz lt 0 15 nH lt 0 05 nH lt 0 14 pF lt 0 02 pF lt 25mQ 4 amps O 14C heat rise 0 63 mm lt 0 4mm Mixed Pitch Available BGA LGA QFN DFN
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