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SERVICE MANUAL

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3. Gan T ow zd NOV 029 wor E SO y E Dm For y Su Moy es 18 SAY 50 1 10 38 ATT t rmi A n s E pn Yes E 80 wo 108 1042 608 A01 IDA Tori 2 9 9 v 30 OUTPUT BOARD SCHEMATIC DIAGRAM 31 510301 60d 80d LENT JEU HSV SVA 855 Ove Tva SIO TVG TUNG oa a SLT LLI 811 9rco 801 DA BIA A68 ereo Beo 2123 41 11 arpa XDA DD Iva 6 SSAG SSAC oval SVA pve osaa 8018 sida oa 6118 81018 DAGADVA OALIE wol ONIGV A ONASA SV LVOISV 328dS MNOWIdS Lvanv JAJAJA 7 414183 E cH DA YO Epa 1 1 RINT Wo TUM Loca SSATIIV 6 81 0 OVHDIH LVOI 9 SVOI VOI vol LNIGV_A OGL 9
4. 0090012 mewsenzssom PES 2 Sv RESISTOR RS 3 6 78 866 0090020 SW RESISTOR RS 3 686266 R605 R606 R609 R610 R617 ws 9 O 2 0 65668 Ks 2 0000118 ARECN FILM RESISTOR uewmossesmarEp s 82 612 es www sio osno ses 85 3 swocendra 5 103 simos 2 3o SID Gpac TeR S0V104 220 0603 2 0310066 soo paar r es 0390095 96 888 2 E so We 2 rcesrces i 3 rcsnrcemsrce ment __ c 47 2969 715 186 5 0880185 ic 3 805 fic e T fun osso ic 2 uerus RB 954 SA 1940008 SET 85 1 160 wsos josss e cot www 1 88 3 v cov OVD vow on sme 3 v ervpexvpes 700002 9065 ea 156 3 2100010 ANECTONORS O06 SHAPED 5mm 1865 4 682 866 865 8 8 2100008 CNECTON GRO O06 SHAPED 75mm S 2 2100004 CONECT ON RES O06 SHAPED 10mm
5. 48 ball FBGA 48 pin TSOP 44 pin SO CFI Common Flash Interface compliant Provides device specific information to the system allowing host software to easily reconfigure for different Flash devices Compatibility with JEDEC standards Pinout and software compatible with single power supply Flash Superior inadvertent write protection Data Polling and toggle bits Provides a software method of detecting program or erase operation completion Ready Busy pin RY BY Provides a hardware method of detecting program or erase cycle completion not available on 44 pin SO Erase Suspend Erase Resume Suspends an erase operation to read data from or program data to a sector that is not being erased then resumes the erase operation Hardware reset pin RESET Hardware method to reset the device to reading array data Publication 22358 Rev Amendment 3 Issue Date November 10 2000 AMDA PRODUCT SELECTOR GUIDE Family Part Number Am29LV160D Speed Option Voltage Range Vcc 2 7 3 6 V Max access time ns tacc Max CE access time ns tcp OE access time ns top Note See AC Characteristics for full specifications BLOCK DIAGRAM RY BY 0090 0015 1 Voc an Sector Switches Vss Erase Voltage WE oe ontrol BYTE gt Command Register PGM Voltage Generator Chip Enable E Output
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7. 65 51 0 Flash memory devices in FBGA may be if exposed to ultrasonic cleaning methods The package and or data integrity may be compromised if package body is exposed to temperatures above 150 C for prolonged periods of time PIN CONFIGURATION 0 19 000 0014 0015 1 BYTE CE OE WE RESET RY BY Vss NC 20 addresses 15 data inputs outputs DQ15 data input output word mode A 1 LSB address input byte mode Selects 8 bit or 16 bit mode Chip enable Output enable Write enable Hardware reset pin Ready Busy output N A SO 044 3 0 volt only single power supply see Product Selector Guide for speed options and voltage supply tolerances Device ground Pin not connected internally 15 LOGIC SYMBOL 000 0015 A 1 OE WE RESET BYTE RY BY N A SO 044 AMD HYUNDAI 8 1 HY57V641620HG DESCRIPTION HY57V641620HG 4 Banks x 1M x 16Bit Synchronous DRAM The Hyundai HY57V641620HG is a 67 108 864 bit CMOS Synchronous DRAM ideally suited for the main memory applications which require large memory density and high bandwidth HY57V641620HG is organized as 4banks of 1 048 576x16 HY57V641620HG is offering fully synchronous operation referenced to a positive edge of the clock All inputs and outputs are synchro nized with the rising edge of the clock input The data paths are internally pipelined to ach
8. 32 LETOL SNQDtOT 90153 ad r a TS 50153 SNOML F 8 0 80 Teen SNADNO E d OSJOSOC L LH008H6CIA V A9T 3hOCC 0531 80 31 ad r ad z 6653 SL nul Su SNA AO 055 SNGDIWSA 6161 T SNOILNSAA 6 A6 BITT TATADIOA bimo OIZOL ESTA 60291 vor 91 ITIL LTO A 5 8771 EB TTA OGA LOT HOCNREEOCNRE EDEN TOCNA ON T8IZATSIZAZITASOTNA LONA 90ZNA SOZNY sn euriou 1 SONY ON TUS 5 ESITA 06TH LETH POTN EOTNY 2smopeoosto aay IVE SAO 8 8 OF 9t NOAA 6t IOa ST ONOd ENOA TINGGI 91 8 ZI_ sVvod_L ST 9 6l J SNQ MO 0 SNODYIO SE NDS Ntt 5 80 90 SNO 05 OVE SE TIVA cc St t vt VINCE 3 tt SVG 0953 LVING It OVC DE 6c
9. 99 o 2 3 5 0 QO POWER switch PLAYIPAUSE button Disc tray STOP button OPEN CLOSE button mic 1 jack IRSENSOR mic 2 jack 6 Display window 4 PREVENTION OF STATIC ELECTRICITY DISCHARGE The laser diode in the traverse unit optical pickup may brake down due to static electricity of clothes or human body Use due caution to electrostatic breakdown when servicing and handling the laser diode 4 1 Grounding for electrostatic breakdown prevention Some devices such as the DVD player use the optical pickup laser diode and the optical pickup will be damaged by static electricity in the working environment Proceed servicing works under the working environment where grounding works is completed 4 1 1 Worktable grounding 1 Put a conductive material sheet or iron sheet on the area where the optical pickup is placed and ground the sheet 4 1 2 Human body grounding 1 Use the anti static wrist strap to discharge the static electricity from your body safety 3 1577x409x2 tiff Anti static wrist strap 1M9 onductive material sheet or iron sheet 4 1 3 Handling of optical pickup 1 To keep the good quality of the optical pickup maintenance parts during transportation and before installation the both ends of the laser diode are short circuited After replacing the parts with new ones remove the short circuit according to the correct procedure See this Technical Guide
10. APIOL 8 41 PNIGV AIAL SSA dsn 004 6NIGV A LLNOWMd OWI ona dNI dO NNI dO do ATSIZAL 034 OSA OTA NDS NOTA TATA dORWOSD ddAS 141 INL 40493 as 28 as vs an JN VIN DEE A bakah E laki Hole lt lt lt ii EE ATINA sa SIV SV LV ov SV cv SIA OGL SO TIAL SDL OW y 40 dO 040 ATSIZAL 7 01 Odd 1 053 bih 67EN INST vum Tee 6 Tata EST 0172 OSAL Ir 991 8 3801380 INAJONL CU osos SOLA avoT 90558 9 91 040 TOEN AALS 8 18 NAdOYL 015 STEA 138013 91 4 80534 SNQ NI MOT 9158 S TAJI INIA eu COM STEN ALANA 0 DENG s 515 EC LL OdOA OHALOA 9 5 oo EEAV OAT 268 S zer18sz LOCA WEE 60 108 N AST HROCC 10 2 S SIOENST S rO6E SOEA OSNA S SIOENST 10 8
11. Array lt gs Column Column po Active Pre 5 UDQ Decoders bid 9 a DQ14 o DQ15 Column Add Bank Select Counter A0 Address A1 Registers gt 8 Burst 9 Counter 5 o A11 BAO BAT Mode Registers Data Out Control Pipe Line Control 18 MTK 8 2 MT1389 MT1389 Progressive Scan DVD Player SOC Specifications are subject to change without notice MediaTek 1389 is a DVD player system on chip SOC which incorporates advanced features like high quality TV encoder and state of art de interlace processing The MT1389 enables consumer electronics manufacturers to build high quality cost effective DVD players portable DVD players or any other home entertainment audio video devices Based on MediaTek s world leading DVD player SOC architecture the MT1389 is the 3 generation of the DVD player SOC It integrates the MediaTek 2 generation front end analog RF amplifier and the Servo MPEG AV decoder The progressive scan of the MT1389 utilized a proprietary advanced motion adaptive de interlace algorithm to achieve the best movie video playback It can easily detect 3 2 2 2 pull down source and restore the correct original pictures It also supports a patent pending edge preserving algorithm to remove the saw tooth effect Key Features RF Servo MPEG Integration CVBS Y C m High Performance Audio Processor Component m Motion Adaptive Edge Preserving De interlace
12. WIrTLV wen TIMANG WII 91 15 Cx9T c IS WYAAS rozn goza MOT SOITA A01 4n001 SHIHNI SECOL em ODA SPIPNI MEDIA LOA 9 31 T _L_ tot EETOLFTISTT x SNQ A9I 001 95531 A9T 3n0T 05531 91 01 62291 A A91 4n01 SCCOL 91 01 LOL TIL A91 4n01 095755 101 LOTAN Ta s vov OVLVdS OLVASV aicen 71394 89 pSIZA Mrz 58158 15153 55153 ESITA SNM ArT M89 8tICH 889 95158 8 1 89 01 A91 4n01 15631 91 801 91 01 QOL A9 TAROT A91 4n01 A91 4n01 0817 9550 SA S181957 0170 8050 gr SA SISIOST xi 5000 LIZA 98TA SNAOFEISI 90cn 5 1 80 8 34 35 10 SPARE PARTSLIST DV514S MATERIAL LIST 1 MAIN PANEL 0601 ENEE VIGW 0022550 0603 85 iam s 1 o ETT Ss 1 16W 10K 45 0603 res 4 kornaro ww V19W5IK 5
13. 0603 85 Res 390095 90 888 har SOV 104 80 20 0603 Pees cwscusces 0310047 SW TCR 50V 101 5 NPO 0603 866 lusus 1 1 2 www uus 1 1 2 si T A 2360026 REC NG HEAD ATGSEVSLENGTHZmm e 1 om wem o cbucivmeuwez2s e 2 096 _ jw eer ED SEN 052 8688 155 jew 7P80 2 0 2PLUG WITH L NEEDLE THE 2120766 FLAT CABLE nr XS401 28 215 4P SCREEN SHIELDED 2150181 WHITE RED YELLOW AND BLACK BEN um 1340003 RESTORE HORIZONTAL 6x 6x 1 3 401 K403 SWTOH CONNECT VFD SCREEN 5233018 SCFT SPONE SPACER 10x6x16 DOUBLE FACED HARD AND FRONT PANEL 150x6x0 1 SIGNLE SIDED WITH GLUE BETWEEN LED AND E STOER IN REAR SIDE RADIATION SCREEN CONNECT IR SENSOR AND 5232919 7 7 10 0 BLE FACED HARD 2 anne 50 8 es 2 EN pa 2 BOARD MATERIAL CODE MATERIAL NAME SPECIFICATIONS UNITUANTI LOCATION 901919 16W 1000 15 0603 865 1 87 0090002 SMO 2 205 0603 recs 1 R706 0310066 SMD TCR 50V 102 10 0603 1 701 706 716 723 728 30222 96 0310207 50 Gpac
14. 3 volt microprocessors Manufactured 0 23 um process technology Fully compatible with 0 32 um Am29LV160B device High performance Access times as fast as 70 ns Ultra low power consumption typical values at 5 MHz 200 nA Automatic Sleep mode current 200 nA standby mode current 9 read current 20 mA program erase current Flexible sector architecture One 16 Kbyte two 8 Kbyte one 32 Kbyte and thirty one 64 Kbyte sectors byte mode One 8 Kword two 4 Kword one 16 Kword and thirty one 32 Kword sectors word mode Supports full chip erase Sector Protection features A hardware method of locking a sector to prevent any program or erase operations within that sector Sectors can be locked in system or via programming equipment Temporary Sector Unprotect feature allows code changes in previously locked sectors Unlock Bypass Program Command Reduces overall programming time when issuing multiple program command sequences Top or bottom boot block configurations available 11 Embedded Algorithms Embedded Erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors Embedded Program algorithm automatically writes and verifies data at specified addresses Minimum 1 000 000 write cycle guarantee per sector 20 year data retention at 125 C Reliable operation for the life of the system Package option
15. Enable OE Logic Vcc Detector Cell Matrix Address Latch 0 19 Am29LV160D 12 AMDA CONNECTION DIAGRAMS A15 1 48 A16 14 2 O 47 BYTE A13 3 46 Vss 12 4 45 DQ15 A 1 A11 5 44 DQ7 A10 6 43 DQ14 A9 7 42 DQ6 A8 8 41 DQ13 A19 9 40 DQ5 NC 10 39 DQ12 WE 11 Standard TSOP 38 DQ4 RESET 12 37 Vcc NC 13 36 DQ11 NC 14 35 DQ3 RY BY 15 34 DQ10 A18 16 33 DQ2 A17 17 32 DQ9 A7 18 31 DQ1 A6 19 30 DQ8 A5 20 29 DQ0 A4 21 28 OE A3 22 27 Vss A2 23 26 CE At 24 25 AO A16 48 A15 BYTE 47 A14 Vss 46 A13 DQ15 A 1 45 12 007 44 A11 0014 43 10 006 42 Ag DQ13 41 A8 DQ5 40 A19 0012 39 004 38 WE Voc 37 RESET Reverse TSOP 36 NC DQ3 35 NC 0010 34 RY BY DQ2 33 18 bag 32 17 001 31 7 008 30 DQO 29 A5 OE 28 4 Vss 27 A3 CE 26 A2 AO 25 A1 13 AMDA CONNECTION DIAGRAMS RESET gt O O 3 5 wo Es E ES m m m m s 2 2 8 gt gt gt Special Handling Instructions Special handling is required for Flash Memory products in FBGA packages gt 8 amp 9 gt 2 0 8 2 E 6 8 gt 2 25 0012 23 Voc Top View Balls Facing Down A16 BYTE DQ15 A 1
16. SDPIF m 108MHz 12 bit 6 CH TV Encoder MT1389L Applications Audio DAC m Standard DVD Players m Portable DVD Players Front panel Remote DRAN DVD Player System Diagram Using MT1389 19 MEDIATER MT1389 PRELIMINARY SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL NO DISCLOSURE General Feature List 1024 bytes on chip RAM m Super Integration DVD player single chip Up to 4M bytes FLASH programming High performance analog amplifier Servo controller and data channel processing 1 2 PEG video Dolby AC 3 DTS DVD Audio Unified memory architecture Versatile video scaling amp quality enhancement OSD amp Sub picture 2 D graphic engine Built in clock generator Built in high quality TV encoder Built in progressive video processor Audio effect post processor Audio input port High Performance Analog RF Amplifier Programmable fc Dual automatic laser power control Defect and blank detection level signal generator Speed Performance on Servo Channel Decoding DVD ROM up to 4 5 CD ROM up to 24XS Channel Data Processor Digital data slicer for small jitter capability Built in high performance data PLL for channel data demodulation EFM EFM data demodulation Enhanced channel data frame sync protection amp DVD ROM sector sync protection Servo Control and Spindle Motor Control Programmable frequency error gain and phase error gai
17. personnel wear wrist straps for ground Open the LD short lands quickly with a soldering iron after a circuit is connected Keep the power source of the pick up protected from internal and external sources of electrical noise Refrain from operation and storage in atmospheres containing corrosive gases such as H2S SO2 NO2 and CI2 or toxic gases or in locations containing substances especially from the organic silicon cyan formalin and phenol groups which emit toxic is particularly important to ensure that none of the above substances are present inside the unit Otherwise the motor may no longer run 6 Electrical Confirmation 6 1 Video Output Luminance Signal Confirmation DO this confirmation after replacing a P C B Measurement point Color bar 7590 DVDT S15 Video output terminal PLAY Title 46 DVDT S15 Or PLAY Title 12 DVDT S01 DVDT S01 Measuring equipment tools Confirmation value 200mV dir 10 sec dir 1000mVp p 30mV Purpose To maintain video signal output compatibility 1 Connect the oscilloscope to the video output terminal and terminate at 75 ohms 2 Confirm that luminance signal Y S level is 1000mVp p 30mV 6 2 Video Output Chrominance Signal Confirmation Do the confirmation after replacing P C B Measurement point Color bar 75 DVDT S15 Video output terminal PLAY Title 46 DVDT S15 or PLAY Title 12 DVDT S01 DVDT S01 Measuring equipment tools Confirmation value Screwdriver O
18. 00 SHAFT SLIDE SUB 1EA2812A15300 SPRING COMP TYOUSEI ala 1 2812 15400 SPRING COMP 1EA0B10B20100 1EA0B10B20200 ASSY PWB ASSY PWB SEXEA25700 SPECIAL SCREW BIN M2X11 SEXEA25900 SPECIAL SCREW M1 7X2 2 SFBPN204ROSE SCR S TPG PAN 2X4 SFSFN266ROSE SCR S TPG FLT 2 6X6 SWXEA15400 SPECIAL WASHER 1 8X4 X0 25 Note This parts list is not for service parts supply 5 2 Bracket Explosed View and Part List E W PAS Pic 2 Materials to Pic 2 l bracket 14 front silicon rubber 2 belt 15 Back silicon rubber 3 screw 16 Pick up 4 belt wheel 17 Pick up 5 gearwheel 18 switch 6 iron chip 19 Five pin flat plug 7 Immobility mechanism equipment 20 screw 8 Magnet 21 PCB 9 Platen 22 motor 10 Bridge bracket 23 Motor wheel 11 screw 24 screw 12 screw 25 tray 13 Big bracket Before going process with disassembly and installation please carefully both peruse the chart and confirm the materials 5 3 MISCELLANEOUS 5 3 1 Protection of the LD Laser diode Short the parts of LD circuit pattern by soldering Soldered short pattern for laser diode CD Soldered short pattern for laser diode DVD 5 3 2 Cautions on assembly and adjustment Make sure that the workbenches jigs tips tips of soldering irons and measuring instruments are grounded and that
19. 2 Do not use a tester to check the laser diode for the optical pickup Failure to do so willdamage the laser diode due to the power supply in the tester 4 2 Handling precautions for Traverse Unit Optical Pickup 1 Do not give a considerable shock to the traverse unit optical pickup as it has an extremely high precise structure 2 When replacing the optical pickup install the flexible cable and cut is short land with a nipper See the optical pickup replacement procedure in this Technical Guide Before replacing the traverse unit remove the short pin for preventingstatic electricity and install a new unit Connect the connector as short times as possible 3 The flexible cable may be cut off if an excessive force is applied to it Use caution when handling the cable 4 The half fixed resistor for laser power adjustment cannot be adjusted Do not turn the resistor 5 Assembling and disassembling the mechanism unit 5 1 Optical pickup Unit Explosed View and Part List Materials to Pic 1 PARTS CODE PARTS NAME 14692200 SF HD60 IEA0311A06300 ASSY CHASSIS COMPLETE IEA0M10A15500 IEA0M10A15501 ASSY MOTOR SLED ASSY MOTOR SLED IEA2451A24700 HOLDER SHAFT IEA2511A29100 GEAR RACK IEA2511A29200 GEAR DRIVE IEA2511A29300 GEAR MIDDLE A 1EA2511A29400 GEAR MIDDLE B 1EA2744A03000 SHAFT SLIDE 3 4 5 6 7 8 9 1EA2744A031
20. 2 BCK 28 519S 1 C NI 68 1940077 2 0mm FUSE FUSE CN501 F501 T501 1940045 Pr paw 2300021 16 280 2300028 250V 502 GROUND CH P CF 3870115 AB903 501 G505 fass eu PAS EA 5 DECODE BOARD MATERIAL CODE MATERIAL NAME SPECIFICATIONS UNIT UANTTI LOCATION R201 R204 R212 R222 R228 R236 R245 R247 R251 R255 0090001 SMD RESI STCR 1 16W 00 45 0603 25 R257 R258 R282 R297 R299 R303 R318 R331 R2159 R234 R268 R279 R233 R261 R270 R273 R274 0 gt gt 9 0090272 101666 550603 85 2 8364 8367 839 90003 SND 100 5 0603 2 18361 8 9 R231 R232 R256 R263 R264 0 gt gt 9 zum u LIEN R294 R295 L202 0090232 1 16W 1500 5 0603 R2180 0090009 1 16W 3300 5 0603 PG 3 R221 R277 R281 0090013 SMD RESISTCR 25 0603 Pros 2 rzso r200 R213 R215 R254 R2102 R21 59 eu LIES 04 R2117 R2128 0090016 SD RESISTOR MIO 1 5K 2595 0603 es 2 8323 8324 0090249 1 16W 5100 5 0603 PCS 4 R205 R214 R325 R327 R238 R240 R2130 R2131 R2 134 R2135 R2138 R2140 R21 59 E 0090019 SMD RESI STOR 1 16W 4 7K 5 0603 RO IR HIIS 0 R2151 mp R208 229 R309 R311 R313 STR 59 R314 R329 R330 R339 R21 0090023 SMD RESI 1 16W 10K 45 0603 16 01 82106 R2108 82109 R21 64 R2184
21. 3 PAG TER 101 80 20 75mm r 1 Jess OPATA 0089 101 210 7 5mm 85 99 0200224 1000V103480 20 75mm RS 1 Jeso STURBANCE 0210116 MKP61 X2 275VAC 104420 15 1 BCS501 mn CAPAC TOR Mumrvexsvacmeamus p 1 fees onoo 06088 2076 ISmm 1 csr rmv TTS 185 wes jeburievienwsedzis 5 1 wes dm epurzsvamenwied s 85 2 20050 o lomem 2 69162 wes o C Ks 1 mw VERTICALIOUHIASmm Pes 2 oo onec PS 2 sen eos sms oae HER303SHAPEDRISmm P 2 080 58 ume _ T r pe Jie RS 4 sp sws ajam wan om ws ic 86 js C ic T E ewe ic 102 T so he O IC IC 780049 TE NT Cd 1000022 POER Gi D FILTER JLBIIS3 33uH 0 SWTCH POVER 046042
22. 4 SMD CAPAC TCR 50V 104 80 20 0603 03 305 C309 C311 C312 C3 23 C2138 C2143 C2150 C21 57 C2160 C2162 C2164 C216 6 C2175 C284 C287 C207 C211 C214 C216 C217 0310058 SMD CAPAC TCR 25V 104 80 20 0603 C224 C226 C231 C234 C239 C241 C254 C256 C259 C26 7 C274 C279 C282 C301 C3 03 C305 C309 C311 C312 C3 23 C2138 C2143 C2150 C21 57 C2160 C2162 C2164 C216 6 C2175 C284 C287 C201 C204 C221 C240 C317 C322 C325 C328 C333 C32 0310234 SMD CAPAC TCR 16V 105 80 20 0603 6 C327 C285 C286 C223 C255 C278 C294 C297 0310066 SMD CAPAC TCR 50V 102 10 0603 2112 2115 2118 2121 PG PG 0310231 SW CAPAC TCR 50V 122 10 0603 2 153 Pr jez 4888 sboearn row aaa ro osos r s 16V 473 10 0603 Rs 2 3626 165774 80 20 0605 jas 00355 2 msixe 5 INTR sunzmw 185 6 1249428 3900579 METI C BEADS NOUCTOR RH354708 75 1 1226 L201 L203 L228 L236 L301 0390095 SMD MET BEADS FCM1608K 221T05 31 L304 L305 L307 L312 L314 L316 L324 L219 wx 1 1 88 www a s Fes 15 FR 18 y mar 1 2 www 56 0800 somar pes A 565 10 amp S 7
23. NY 0 180001 ze 0153 ie Acer x Vano 80ST 3 319158 OOPNI Aor mooot A01 4n0001 55 10 ced 1153 90531 50531 E Bs i 4 VC Hn0T Pe ct ope 90891 3 80 20 AO rosar AXIUEOT BEN E 80521 062 ap as NAO ASNS sedi AS GITT uondo y 1 Hn01 1 Fr EISA 01 91 9 1 0 8053 TOSOLT 091 i JE E 9 9 E r 26 POWER BOARD SCHEMATIC DIAGRAM noui BCNOQS 220V L E 27 SCHEMATIC DIAGRAM 51931 ae a A 98 01 9 eS 1 91931 6 9 AAA A e Uv 0 6 69 0000 SL6AGQ 501 8092 9 91 09 31 y EOIIL 7099 5098 woos 14098 509 31 I AQT ANTZ 90921 9 109IL al 094 A9l dnz 60921 TC SCO tMO 28 SCHEMATIC DIAGRAM 29 OUTPUT BOARD SCHEMATIC DIAGRAM
24. R2105 SMD RESI SIR 1 16W 15K 5 0603 PS 2 R209 R223 0090025 SMD RES SR 1 16W 20K 5 0603 PCS 4 R211 R312 R315 R316 R2129 R2133 R2137 R2141 R 0 998 ERES m aooo 0090029 5 RES SIR 1 1988 47K 23 0603 85 jo 0090197 soRssxR 2 ew SW RESISTOR ewes 8 2 _ ep rem _ 9 ref fer R224 R246 R252 R308 R310 0 e poro ref 902 Gra a 0003759 CARBON FI LM RESI STCR 1 4W2 2045 RS 1 R26 TC202 TC221 TC230 TC232 2601819 ID ED11 16V220U 20 6x12 C5 pcs 4 TC207 TC209 TC301 TC204 TC210 TC237 TC246 0 gt 3 2601889 ID 9 1 01116 1000420006 12 C5 5 2 1 235 1 238 a SMD CAPAC TCR 50 20 5 NPO 0603 Pas 2 C222 C232 0310190 SMD CAPA TCR 50 27 5 NPO 0603 2 C275 C276 C262 C266 C289 C290 C292 0310045 SW TCR 50 47 5 NPO 0603 17 293 295 296 298 299 2101 2102 2104 2105 206 0310047 SW CAPAC TCR 50V 101 5 NPO 0603 C233 C2111 C2114 C2117 C 2120 C2123 C2126 0310051 SW CAPAC TCR 50V 331 5 NPO 0603 Pas 2 C212 C213 0310048 SMD CAPAC TR 50V 151 5 NPO 0603 2 C304 C306 C207 C211 C214 C216 C217 C224 C226 C231 C234 C239 C241 C254 C256 C259 C26 7 C274 C279 C282 C301 C3 0 709 gt 031008
25. RS 2 e e el 4 SUBSIDIART BOARD MATERIAL CODE SWTCH Davi lt 31 9 wo 161 2 6 prse i I aja 1 POWER BOARD MATERIAL CODE 7100010 NECN GRO 0 SHAPEDSmm J5022PS10JPS19JPS2O RS 1551 r msu 0000273 OREN FILM RESISTOR U4W330 S SHAPEDIO es 0000362 CAREC FILM RESISTOR U4W2200 5 SHAPED 10 85 1 Rus 0000278 foen FILM RESISTOR U4W3300 5 SHAPED 10 Pas 1 0000279 CAREC FILM RESISTOR 114W4700 5 SHAPED 10 85 1 rsa 0000284 CAREC FILM RESISTOR U4WI SK25 SHAPED 10 85 1 0000461 OREN FILM RESISTOR 85 1 R 0000283 FILM RESISTOR U4WIK 5 SHAPED 10 85 1 Ra METAL FILMRESISTOR O 4 3 8 1 58 88986 ps 1 s 37 METAL LM RESI STOR 1 4W10K 1 SHAPED 10 59 9 ES 0010159 METAL DE RESI STOR 2W39K 5 SHAPED FLAT 15x7 R503 0070001 H GH VOLTAGE RESI STOR 1 2W680K 5 501 0200136 PCRCELA N CAPAC TCR 50V 473 420 5mm CCT ons 250 221 10 106 0200267 C TR Ers 2sovac221120 mm Pcs 2 8658805 020022
26. SERVICE MANUAL DV514S e Q0 J CONTENTS 1 SAFETY PRECAUTIONS A A A SAS IA GA 2 PREVENTION OF ELECTRO STATIC DISCHARGE ESD TO ELECTROSTATICALLY SENSITIVE ES DEVICES einen Be DER 3 CONTROL BUTTON LOCATIONS AND EXPLANATIONS m 4 PREVERTION OF STATIC ELECTRICITY DISCHARGE X 5 ASSEMBLING AND DISASSEMBLING THE MECHANISM UNIT 88 nenne 5 1 OPTICAL PICKUP UNIT EXPLOSED VIEW AND PART LIST e 52 BRACKET EXPLOSED VIEW AND PART LIST eee HR 53 MISCELLANEOUS ersten enter 6 ELECTRICAL CONFIRMATION e HH nne enn ee 6 1 VIDEO OUTPUT LUMINANCE SIGNAL CONFIRMATION RH 6 2 VIDEO OUTPUT CHROMINANCE SIGNAL CONFIRMATION 7 MPEG BOARD CHECK WAVEFORM 9 ANPOLVICOD aaa 84 BHY57V644620BD PP 37 MTI Ea d or eo a 9 SCHEMATIC amp PCB WIRING DIAGRAM eier 10 SPARE PARTS LIST een 1 SAFETY PREAUTIONS 1 1 GENERAL GUIDELINES 1 When servicing observe the original lead dress if a short circuit is found replace all parts which have been overheated or damaged by the short circuit 2 After servicing see to it that all the protective devices such as insulation barrier insulation papers shields are properly installed 3 After servicing m
27. TCR ees 5 TCR 0390095 SM MAGNET C BEADS FCM1608K 221T05 EUREN PCS PCS PCS 1716 0310085 SMDCMACTOR 50 20P 5264 00603 65 9009 6 47 5 0603 PGS 0090029 SMD RESISTOR 116W 47K 5 0603 PCS PCS PCS PCS PCS IIGW 12K 45 0603 16V 105 80 20 0603 1N4148 55 0000171 ovENHIMRSSKR 0000181 FILM RESISTOR OOOO 8565 VAW22K 25 SHAPED 10 85 1 810 0000132 lovENHIMRSSKR MEET 7 5 8 2 1 AW2K25 SHAPED 10 85 Rm SHAPED 75 85 0390057 MAGNETIC BEADS INDUCTR RH354708 nern 1090045 ELECTRO C TRANSFORMER TX179ATW JK705 110078 TEMA SE JAVI RG PS 1 SA 001 012 BLACK IRON PIECE 91009 ser 87 ZD701 ZD704 EM 1940140 14P 1 0mm STRAIGHT DUAL LINE 1 XS701 PLUG JP701 JP704 JP710 JP712 J IET Emm EOE oen SOS SHAPED Tomm PPOP 21 fonen O06 SHAPED 125mm 185 1 69 soersner carro fos E XXHANOPAIKR 50 2 ATEO 1585 fem mar E ve vw owe 8 8 8 8 6 56 ee a E E 3 OK BOARD wesa Ks 1 CTS 7770696069 86 3300 svi 0603 Fes 1 es
28. ake the following leakage current checks to prevent the customer from being exposed to shock hazards 2 PREVENTION OF ELECTRO STATIC DISCHARGE ESD TO ELECTROSTATICALLY SENSITIVE ES DEVICES Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge ESD 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any ESD on your body by touching a known earth ground Alternatively obtain and wear a commercially availabel discharging ESD wrist strap which should be removed for potential shock reasons prior to applying power to the unit under test 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as alminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only a grounded tip soldering iron to solder or unsolder ES devices 4 Use only an anti static solder removal device Some solder removal devices not classified as anti static ESD protected can generate electrical charge sufficient to damage ES devices 5 Do not use freon propelled chemicals These can generate el
29. as DVD Audio Specification 2 D Graphic Engine Support decode Text and Bitmap Support line rectangle and gradient fill Support bitblt Chroma key copy operation Clip mask MEDIA TER PRELIMINARY SUBJECT TO CHANGE WITHOUT NOTICE Audio Effect Processing Dolby Digital AC 3 EX decoding DTS DTS ES decoding MLP decoding for DVD Audio MPEG 1 layer 1 layer 2 audio decoding MPEG 2 layerl layer2 2 channel audio High Definition Compatible Digital HDCD Windows Media Audio WMA Advanced Audio Coding AAC Dolby ProLogic II Concurrent multi channel and downmix out 60958 61937 output PCM bit stream mute mode Custom IEC latency up to 2 frames Pink noise and white noise generator Karaoke functions Microphone echo Microphone tone control Vocal mute vocal assistant Key shift up to 8 keys Chorus Flanger Harmony Reverb Channel equalizer 30 surround processing include virtual surround and speaker separation 21 MT1389 MTK CONFIDENTIAL NO DISCLOSURE m TV Encoder Six 108MHz 12bit DACs Support NTSC PAL BDGHINM PAL 60 Support 525p 625p progressive TV format Automatically turn off unconnected channels Support PC monitor VGA Support Macrovision 7 1 L1 Macrovision 525P and 625P CGMS A WSS Closed Caption W Progressive Output Automatic detect film or video source 3 2 pull down source detection Advanced Motion adaptive de interlace Edge Preserving Minimum external memor
30. ectrical charges sufficient to damage ES devices 6 Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam alminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed Caution Be sure no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity ESD notice 1885x323x2 tiff IMPORTANT SAFETY NOTICE There are special components used in this equipment which are imporant for safety These parts are marked by A in the schematic diagrams Exploded Views and replacement parts list It is essential that these critical parts should be replaced with manufacturer s specified parts to prevent shock fire or other hazards Do not modify the original design without permission of manufacturer Front Panel Illustration
31. ieve very high bandwidth All input and output voltage levels are compatible with LVTTL Programmable options include the length of pipeline Read latency of 2 or 3 the number of consecutive read or write cycles initiated by a single control command Burst length of 1 2 4 8 or Full page and the burst count sequence sequential or interleave A burst of read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst read or write command on any cycle This pipelined design is not restricted by a 2N rule FEATURES Single 3 3 0 3V power supply Note All device pins are compatible with LVTTL interface standard 400mil 54pin TSOP II with 0 8mm of pin pitch All inputs and outputs referenced to positive edge of system clock Data mask function by UDQM or LDQM Internal four banks operation Auto refresh and self refresh 4096 refresh cycles 64ms Programmable Burst Length and Burst Type 1 2 4 8 or Full page for Sequential Burst 1 2 4 or 8 for Interleave Burst Programmable CAS Latency 2 3 Clocks 16 HYUNDAI PIN CONFIGURATION PIN DESCRIPTION HY57V641620HG 88 8 54pin TSOP II 400mil x 875mil 0 8mm pin pitch 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 PIN NAME DESCRIPTION CLK Clock The system clock input All othe
32. n of spindle PLL to control spindle motor on CLV and CAV mode Built in ADCs and DACs for digital servo control Provide 2 general PWM Tray control can be PWM output or digital output W Embedded Micro controller Built in 8032 micro controller Built in internal 373 and 8 bit programmable lower address port 20 interface Supports 5 3 3 Volt FLASH interface Supports power down mode Supports additional serial port DVD ROM CD ROM Decoding Logic High speed ECC logic capable of correcting one error per each P codeword or Q codeword Automatic sector Mode and Form detection Automatic sector Header verification Decoder Error Notification Interrupt that signals various decoder errors Provide error correction acceleration Buffer Memory Controller Supports 16Mb 32Mb 64Mb 128Mb SDRAM Supports 16 bit SDRAM data bus Provide the self refresh mode SDRAM Block based sector addressing Support 3 3 Volt DRAM Interface Video Decode Decodes MPEGI video and MPEG2 main level main profile video 720 480 and 720x576 Smooth digest view function with I P and B picture decoding Baseline extended sequential and progressive image decoding Support CD G titles Video OSD SPU HLI Processor Arbitrary ratio vertical horizontal scaling of video from 0 25X to 256X 65535 256 16 4 2 color bitmap format OSD 256 16 color RLC format OSD Automatic scrolling of OSD image Slide show transition
33. r inputs are registered to the SDRAM on the rising edge of CLK CKE Clock Enable Controls internal clock signal and when deactivated the SDRAM will be one of the states among power down suspend or self refresh cs Chip Select Enables or disables all inputs except CLK CKE and DQM Selects bank to be activated during RAS activity BAUEN Bank Address Selects bank to read written during CAS activity A11 Address Row Address RAO RA11 Column Address CAO CA7 Auto precharge flag A10 Row Address Strobe UA Un RAS CAS Column Address Strobe De CAS 111 Refer function truth table for details Write Enable LDQM UDQM Data Input Output Mask Controls output buffers in read mode and masks input data in write mode 000 0015 Data Input Output Multiplexed data input output pin VDD VSS Power Supply Ground Power supply for internal circuits and input buffers VDDQ VSSQ Data Output Power Ground Power supply for output buffers NC No Connection No connection 17 HYUNDAI HY57V641620HG FUNCTIONAL BLOCK DIAGRAM 1Mbit x 4banks x 16 Synchronous DRAM Self refresh logic Internal Row amp timer counter 1Mx16 Bank 3 CLK Row active Row 1Mx16 Bank 2 CKE Pre x Decoders 2 1 16 Bank 1 CS 2 2 1Mx16 Bank 0 6566996696 666 666 66 5 i DQ 0 Aga m SAS 5 E lt D Q 5 3 refresh 9 AE
34. scilloscope 200mV dir 10 sec dir 621mVp p 30mV Purpose To maintain video signal output compatibility 1 Connect the oscilloscope to the video output terminal and terminate at 75 ohme 2 Confirm that the chrominance signal C level is 621 mVp p 30mV 7 MPEG BOARD WAVEFORM 7 1 27MHz WAVEFORM 500MS s Sample T 1 i o Display Style SIEN Vectors Accumulate 00ms Dot Accumulate 500ms ay 100mY lt lt M 25 5 Chi f 6mv 50005 H 100mY Style Vectors 7 2 IC VIPER22 5 WAVEFORM DIAGRAM 173 Acqs Delay Time 16 5ns Tek 10MS s Intensified Delayed Only 10 V Ref2 100mV 500 5 Trigger Position 25 Time Base Main Only 10 AMD 8 Am29LV160D 16 Megabit 2 M x 8 Bit 1 M x 16 Bit CMOS 3 0 Volt only Boot Sector Flash Memory DISTINCTIVE CHARACTERISTICS This Data Sheet states AMD s current technical specifications regarding the Product described herein This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications Single power supply operation Full voltage range 2 7 to 3 6 volt read and write operations for battery powered applications Regulated voltage range 3 0 to 3 6 volt read and write operations and for compatibility with high performance 3
35. y requirement m Audio Input Line in SPDIF in for versatile audio processing m Outline 256 pin LQFP package 3 3 1 8 Volt Dual operating voltages 9 0 SCHEMATIC amp PCB WIRING DIAGRAM FRONT SCHEMATIC DIAGRAM UN AE S88E00SH corn 91 40001 LSY L39 951 9338 5531 5895 75 7825 0 6 67 JJ 1895 LI 3541 8955 8895 81 6995 151 1398 983 9985 684 6988 SM PDAS ON ESWEDAS TSWZIAS 158 1998 196914 V IDAAF00T IIAZ AINGOW Torn 077 elrd 608 SA 8tTITNI 0 c NIdL 508 Dad wor O C NId 0193 0755 cora 7998 O 22 FRONT SCHEMATIC DIAGRAM 23 SUBSIDIART BOARD SCHEMATIC DIAGRAM Uv eee BIBIT TE O C NIdS 1065 O O 3 ASINVIIS 1068 i SUBSIDIART BOARD SCHEMATIC DIAGRAM 25 POWER BOARD SCHEMATIC DIAGRAM

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