COLOR MONITOR SERVICE MANUAL
Contents
1. SVS napa 1BV LEO I Te s KY A ED Driver CH O USE X Not USE ue R E FB4 1 2v8 Delete 1 Cap an 4 2V source aysi Eo FB2 A323 R324 Q103 0104 Q105 Q106 t T xd epe aros j a 3 3 3 E o tue o tue i Ce isis ss Bas Se E ME T 27 x x a o a a 1er 1ev fT P P ay many READY BESS Ha x ae t KST3808 MTF c EBA 4 Q109 B asta o x x cual lg Ice ered B ease BSS o AT p je a V ini s 10031HA H06 10 P402 E Ri Um as z sog SE o D o mn x om a a aon Eo ee m E m 5 m E mn E a E oO E a em m E DRV Bm gt gt 2m 9 5 2 EOS 5 2 3 2 5 2 E Wafer O USE X Not USE radere fi J E P102 P103 L FB1 Aso FB2 27 LGD o x SE2. nmm 19 DISASSEMBLY 22 2 5 Sette tet tI encima tst 9 EXPLODED VIEW iioii resis 20 BLOCK DIAGRAM inicial aii di 11 REPLACEMENT PARTS LIST 22 DESCRIPTION OF BLOCK DIAGRAM 12 SCHEMATIC DIAGRAM nmm 26 SPECIFICATIONS 1 LCD CHARACTERISTICS 4 MAX RESOLUTION Type TFT Color LCD Module Analog 1366 x 768 60Hz Active Display Area 18 5 inch diagonal Pixel Pitch 0 3 H x0 3 V Size 430 3 H x 254 6 V x 10 5 D 5 POWER SUPPLY Color Depth 16 7M colors 6 bit with A FRC 5 1 Power Adaptor Built in Power Electrical Interface 1ch LVDS Input AC 100 240 V 50 60 Hz 1 0A Surface Treatment Anti Glare Hard Coating 3H Operating Mode Normally White 5 2 Power Consumption Backlight Unit White LED MODE HN SYNC VIDEO POWER CONSUMPTION LED COLOR O less than 18 W max 2 OPTICAL CHARACTERISTICS POWER ON NORMAL N ON ACTIVE less than 18 W max RED 2 1 Viewing Angle by Contrast Ratio gt 10 Horizontal Left 85 85 Typ Right 85 85 Typ less than 0 3W RED Vertical Top 75 85 Typ Bottom 75 85 Typ 2 2 Luminance ess than 0 3 W_ aiene AA white pattern 0 70V DPMSOFF OFF OFFIOFF OFF lessthan03W than 0 3 W SED e 150 min Full whitepattern 0 70V 9 1 41 add MEDIUM zt 150 min Full white pattern 0 70V up to30 COOL 6 ENVIRONMENT 2 3 Contrast Ratio ee 6 1 Operating Temper
3. 3 Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board 4 Securely crimp each connection and solder it 5 Inspect on the circuit board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake 2 Securely crimp the leads of replacement component around notch at stake top 3 Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures LGE Internal Use Only Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefully scratch away the sold
4. IC Copyright 022010 LG Electronics Inc All right reserved Only for training and service purposes Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body 2 Bend into a U shape the end of each of three leads remaining on the circuit board 3 Bend into a U shape the replacement transistor leads 4 Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal contact then solder each connection Power Output Transistor Device Removal Replacement 1 Heat and remove all solder from around the transistor leads 2 Remove the heat sink mounting screw if so equipped 3 Carefully remove the transistor from the heat sink of the circuit board 4 Insert new transistor in the circuit board 5 Solder each transistor lead and clip off excess lead 6 Replace heat sink Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body 2 Bend the two remaining leads perpendicular y to the circuit board
5. Y gt I es MM maes saPB5 SDAO TXDO 38 NC 15 l KIA11475T33 I 3 3VS E Oo AN OM Nx ogo C rm m wo 10 10 I0 QD Ww IN out E P ae EO zx o mialuia ol Jalo loim ola im a x n mio ulm 2M Serial F ash GND ADJ l bal E READY xl S z OlOOQoZz ix io lo o ximuooo I O Ii l l zu L 50 D essa Shel Si SiS S z PT aj d d d g e 3 avs 1 Ey TIO iov X Q OJOINININ IN GG gt ziziziziz I N wo BlAlSo SisajeE OW EN lt Q a a z mim z x o ELI ee L 3 HEEE A 4 g A aw IC104 1 cing l 3 345 oat aa gt 2 i 6 d mo W25X20BVSNIG KIA11126T l 1 2VS i i DSLB DET amp q n g N ul E ce H l H e SPI CS Sl a ye T 16V t IN QUT t l gt gt i j GNOLADY e z Rob EM y Pan A155 10K i lk EADY PEADY epu J OK ons ARE s SUPRA Aigo Mi Biss H zz I Ph ren D PS AW LIE s LO Aw SPI_CLK Bt TE 10V X100 NP_Flash E i FEADY 1 gee ma sp AW 1 SPI DI i ta i th ek e l Large thermal PAD on battom side DON Svs VU l REAN MEE E EEE TE TE 3 35 T 2r a0 E 8 7 1 2v5 Use Internal LOO a 15 g A a U Pn 16v a D 1UF L 9 X y THE N SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT DNLY MANUFATURES SPECFIED PARTS
6. Asystem32Wdrivers folder b Run Userport exe Remove E 2 Edit Week of Manufacture Year of Manufacture Serial Number a Input User Info Data b Click Update button C Click Write button c Remove all default number d Add 300 3FF 300 3FF Remove fone e Click Start button f Click Exit button Copyright 2010 LG Electronics Inc All right reserved 11 Only for training and service purposes LGE Internal Use Only SERVICE OSD 1 Turn off the power switch at the right side of the display 2 Wait for about 5 seconds and press MENU POWER switch for 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as described below a CLEAR ETI To initialize using time c Auto Color W B balance and Automatically sets the gain and offset value press key for over 3 sec d AGING Select Aging mode on off b Module To select applied module d NVRAM INIT EEPROM initialize 24C16 press key for over 3 sec e R G B 9300K Allows you to set the R G B 9300K value manually f R G B 6500K Allows you to set the R G B 6500K value manually g R G B Offset Allows you to set the R G B Offset value manually Analog Only h R G B Gain Allows you to set the R G B Gain value manually Analog Only TTT Vid
7. BE USED FOR THE CRITICAL COMPONENTS IN TE A SYMBOL MARK OF THE SCHEMETIC LGElectronics MODEL exes DATE uicem LG ELECTRONICS BLOCK sum SHEET 3172 PDF created with pdfFactory Pro trial version www pdffactory com P300 DSB47C 15BS1YN32 monu TT T z z g JSuUB NPU TI UAM SX Mey imu o m ia a RED_GND c is T GNDR GND_2 RED e e gt RED GREEN_GND 4 ENDG DDC DARE GA c gt DSUB SODA BLU GND gt GREEN E GNDB H_SYNC BLUE gt HSYN WE 6 C gt BLUE V SYNC NECS e e C VSYNC SYNC_GND ES IDC cuM Er UC e gt DSUB SCL gt DSUB DET gt gt zzz zx 3 3VS m f FE AE y 5 ET lo fu KB A A A A A E s STBT BL 8 8 818 Q 8B BIB S O Op j dj oO gt gt gt gt LU THE IN SY BOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET e LG ELECTRONICE MODEL amp ass DATE 90131 3429 ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR IHE CRITICAL COMPONENTS IN THE N SYMBOL MARK OF THE SCHEMETIC Elect
8. Back Resol Frequency mode section polarity Period l Porch ution KkHz Hz E me ue fe fee fe a s pe je n p o s jus as i s pe Lem pun me nn m mer we e T m CERE m mo es e p s m ls me pe ee pope a So a me m m 9 o zo mm m m s s ja 7 Copyright 022010 LG Electronics Inc All right reserved Par ae Only for training and service purposes LGE Internal Use Only DISASSEMBLY Set 1 Place the monitor face Down on the cushion or soft cloth 2 Remove the stand body and atand base from the product 3 1 Pull the front cover upward 2 Then let the all latches are separated 3 Put the front face down 4 Disassemble back cover Copyright c 2010 LG Electronics Inc All right reserved 0 Only for training and service purposes LGE Internal Use Only BLOCK DIAGRAM 1IX3 O1nv 535 uonpun iN3W J9 od shay anya a31 f166989 LN LGE Internal Use Only A H 8 5 8 NENON uejbeiq 19019 S 2Zv61L3 Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes DESCRIPTION OF BLOCK DIAGRAM 1 Video Controller Part This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock The pixel clock for each mode is generated by the PLL The range of the pixel clock is from 28MHz to 85MHz in E1942S
9. EN to Sy Dery be 17 io BX10 4g 4M T Z Y2M A Pigg 19V_LED AX 40 19 T4P Z gt Y2P A heras P106 TOR AX14 TSM m ELKDUTM A OO rds d ANN 20 e YAM A gia pe IC108 al ad ER I co Y4P A SRAD T APW7302B erleno RX42 TEM vmupros 148 22 i SEMA Yapa gt TT P ET as ss HX12T GP VBW2D 12 121 I 1 a TENE e3 aL eon I L Y8P A 7 SL Lar vinj a i 7 EN lle 3 IVS Lice y 24 I O OLKOUTM A z E Sito ud umm cl EUN REX 25 CLK2P E Tak Lx CONP 15V ara WN DO CLKOUTF A SVS 4 L od Ts Tes s 1 2v5 Iph 5 ADC SVZTVCC as T7M A j 3 3 5NS a Ji 18V 3 Bela 2 A s ex 1 ADC_1 2V 27 7P yaa 3 3VS 5vS a 17 Toun g SS L105 Remy 0123 TRAF AGND ag Lvos_3 3v li Ige Toa LG 1 T1 i Eu I c129 o loa7uF BINT SPI_CLK amp pw Eee cu EE de El az A117 560157 O 29 Seem SPT dk 14 10031HR 30 insere T nj as 130 0 047uF gt P4104 C101 casa cisa cis 3 F B D PL oo 3 30 C SPI DI San 7 piis uF 195 203 aur 223 aur za eur Ri04 R119 Secis O P47uF GIN 31 SPI SO Y inv dev 15V 16v 15V 109 GREEN WW A SP1 DO o 1 100 A129 1006137 O paur GIN 32 SPI CE E EA Ne ane PAS I C A SsPI CS NNBT3804INXPI yg a 56C133 0 047uF y ts Opa gt RIN 5 PCO PWMA DBC P Flasn 888 i RAZR Looe 134 0 p47uF 34 R152 4 7K L TON A123 56 HSYNCI 35 P34 MSCL iL SEE i R12g 56 VSYNCI TOUTP 36 P35 MSDA Large thermal PAD on battam side Sup scii A425 3a PB4 CLO AXDO 37 DGND m
10. NPL e es x 1 2v8 dos a pisi uri Others x wW 9 o 4 SENN aov gt d 3 3vs Ez uy o II geEe ar eae a ind FB4 i J CE 22 23 12 2 2 23 31 24 h 5 b Ove 12507WA 0BL 5 n P103 m m a 8 E ES als x s 6 las 5 Fan LED emp TA apu E ziziogign gt D z R RIE E al l m x j al l x m lo EMAW2BO Ob TININININIAIN IN a a a aye Rye wee att E lmiejaujeE a ius oo jafalo p Z ojojo wl o w o w o w oo om w o w o w o D103 VENZO12 5D1F oulojulo ojololulo gt gt clojijolclolclolwluloluclojulojo s Fm n fejaolaojao jala ajajaja gt gt gt gt gt gt gt gt gt gt gt gt gt gt gt up1D4 16v pa Rx BR tO IO NF i Taro EP mu PBE INTEQ ApCO KS SESS VOET1 LVDS OUT gt KEYO t ANM LC VvDT4 Close to Scaler Je400 MEN x 8110 33PA2 ADCEJPWND DBC gt ENA OVP ne del pa PA6 SCL2 RXD2 PWMC y 129 DAV S w contral l 1 0 t KEYO Qerasnatiol EEUU PA7 DA2 TXD2 4 SENP ead E ud REY or E PBE SCL1 RXD1 5 SENN ane Pee PB7 SDA1 TXD1 5 COMP YoN g gt en 20 aby n C105 READY T voP g PT 29 See SESE A The I M os vaca Ob L L NC 1 g SE ee Y1P B oe 27 NC_2 5 4M eas Y2M B Y 26 T vera C2 P p 4 i NC 3 10 TS c Y1P B 7 I 7 NC 4 44 2M ence CLKOLITM B O PR NC_5 Tap CLKOUTP 8 DO c YeP B vana O ma NC_6 13 CLK 1M c CLKOUTM E YaP B Pre NC 7 44 TCLK1P CLKOUTP 5 YDM A O z T m YOR A O P NC 8 15 TM C Y3M B BX1C 4g 3P inis YAM A DE ch y HX1Ct L VDS GND a O PTE NEAR DC JACK T
11. Use Only SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 of this publication NOTE f unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly b Disconnecting or reconnecting any receiver electrical plug or other electrical connection c Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard d Discharging the picture tube anode 2 Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a Suitable high voltage probe Do not test high voltage by drawing an arc 3 Discharge the picture tube anode only by a first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected and then b touch t
12. Website http biz L Gservice com f G E mail http www LGEservice com techsup html COLOR MONITOR CHASSIS NO LM12A MODEL FLATRON E19428 E19425 A Same model for Service CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL Recommended Troubleshooting amp Repairing Guide i P CD TELEVISION LCD TELEVISION M NLO CollectionofLCD a V2 0 LCD TV Repair Aa x TV Repair Tips a Ead Tips amp Case Histories ELM LCD LED amp 3D TV Plasma amp 3D TV ull Repair Membership Site jeu Repair Membership qs AA wel Site e bo 7 ABI AL DIE OES Y pirtin n Bonar Projection TV amp Troubleshooting amp 7 DLP LCD Projector Repairing LCD TV Repair Membership Site ESSA Guide i y a Plasma TV Repair Guide Toas LCD TV Repair Display Fault m Secrets Revealed Troubleshooting Basic e a T qp True Repair Case i Histories LCD Monitor Repair UL Vol 1 10 Trus Repair Guide Case Histories of LCD Monitor croblsonting amp ag ri SMPS Switch Mode Testing Electronic A Power Supply Repair Components like a Pro cwm Guide EX f For Beginner aera Laptop Motherboard II Laptop Repair x Repair Course ia T pes ES am Video Collection CONTENTS SEFECIFICATION Si ct dc a iS 2 ADJUSTMENT iutussrasdss s 14 PREGAUTION Sissi is dd 4 TROUBLESHOOTING GUIDE 16 TIMING GCHAR T eie m ie e eco EE iie ente 8 WIRING DIAGRAM
13. ature 10 C 35 C 50 F 95 F 3 SIGNAL Refer to the Timing Char M 6 2 Relative Humidity 10 80 Non condensing 6 3 MTBF 30 000 HRS with 90 o De Confidence level Type Separate Sync Lamp Life 30 000 Hours Min 3 2 Video Input Signal 1 Type R G B Analog 7 DIMENSIONS with TILT 2 Voltage Level 0 0 7 V Width 44 1 cm 17 36 3 Input Impedance 75Q Depth 34 9 6m 13 7 E 3 3 Operating Frequency Fieignt 16 8 cm 6 61 7 Analog Horizontal 30 61kHz 8 WEIGHT with TILT SWIVEL Vertical 56 75H ee E Net Weight 2 4 kg 4 62 Ibs Gross Weight 3 2kg 7 04 lbs Copyright 2010 LG Electronics Inc All right reserved ds LGE Internal Use Only Only for training and service purposes PRECAUTION WARNING FOR THE SAFETY RELATED COMPONENT There are some special components used in LCD monitor that are important for safety These parts are marked on the schematic diagram and the replacement parts list t is essential that these critical parts should be replaced with the manufacturer s specified parts to prevent electric shock fire or other hazard Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT Must mount the module using mounting holes arranged in four corners Do not press on the panel edge of the frame strongly or elec
14. case This part consists of the Scaler ADC convertor TMDS receiver and LVDS transmitter The Scaler gets the video signal converted analog to digital interpolates input to 1366 X 768 resolution signal and outputs 8 bit R G B signal to transmitter 2 Power Part TThis part consists of one regulator convert power From 19V to 5V 19V is provided by adapter 5V is provided for LCD panel Also 5V is converted 3 3V by regulator Converted Power is provided for IC in the main board Boost converter of LED block converters 19V to AUO M185XWO01 VF is 34V CMI M185BGE L22 is 24 8V and operates back light LED strings of module in E1942S case 3 MICOM Part This part is include video controller part And this part consists of Flash IC which stores control data and the Micom The Micom distinguishes polarity and frequency of the H V sync are supplied from signal cable The controlled data of each modes is stored in Copyright 022010 LG Electronics Inc All right reserved 10 Only for training and service purposes LGE Internal Use Only ADJUSTMENT Windows EDID V1 0 User Manual 2 EDID Read amp Write 1 Run WinEDID exe Operating System MS Windows 98 2000 XP i Port Setup Windows 98 gt Doesn t need setup Windows 2000 XP gt Need to Port Setup This program is available for LCD Monitor only oooom bHm m N O fr is uis CO iO oomwootr aaa eee 1 Port Setup a Copy UserPort sys file to CAWINNT
15. cement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device LGE Internal Use Only General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F 2 Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead 3 Keep the soldering iron tip clean and well tinned 4 Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spray on cleaners 5 Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F b Heat the component lead until the solder melts c Quickly draw the mel
16. ces can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only a grounded tip soldering iron to solder or unsolder ES devices 4 Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices 5 Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ES devices 6 Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most repla
17. eforms Copyright 2010 LG Electronics Inc All right reserved 15 Only for training and service purposes LGE Internal Use Only WIRING DIAGRAM AUO EAD61905268 CMI EAD61905281 by EAD61426311 MAIN BOARD 66319000115 Copyright 022010 LG Electronics Inc All right reserved 16 Only for training and service purposes LGE Internal Use Only EXPLODED VIEW IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety related characteristics These parts are identified by N in the Schematic Diagram and EXPLODED VIEW It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X RADIATION Shock Fire or other Hazards Do not modify the original design without permission of manufacturer Copyright c 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only PCB P N EAX64697101 1 ENSIS ERE Date 2011 12 L101 D105 32304 BR210 Qu m iL IFB4
18. eo Signal Generator Control Line Power inlet required Power Select Switch 110V 220V F V Sync On Off Switch Switch must be ON Figure 1 Cable Connection Copyright 2010 LG Electronics Inc All right reserved _ _ Only for training and service purposes 12 LGE Internal Use Only TROUBLESHOOTING GUIDE 1 NO POWER NO POWER POWER INDICATOR OFF NO CHECK ADAPTER 19V IS IC103 PIN25 3 3V PIN27 1 2V CHECK 1C102 PIN3 5V CHECK 1C103 PIN 42 43 CHECK CRYSTAL X100 PULSE CHECK IC103 Waveforms Copyright c 2010 LG Electronics Inc All right reserved 13 LGE Internal Use Onl Only for training and service purposes y 2 NO RASTER OSD IS NOT DISPLAYED MAIN NO RASTER OSD IS NOT DISPLAYED CHECK IC103 PIN25 3 3V PIN27 1 2V CHECK IC102 PIN3 5V IC504 1 2V 1 CHECK PIN 42 43 IC103 PIN42 43 SOLDERING CONDITION 2 CHECK X100 3 TROUBLE IN IC103 CHECK IC103 PIN36 V SYNC CHECK CONNECTION LINE FROM D SUB TO IC103 And PIN35 H SYNC YES TROUBLE IN CABLE OR LCD MODULE Copyright 2010 LG Electronics Inc All right reserved 14 Only for training and service purposes LGE Internal Use Only 3 TROUBLE IN DPM TROUBLE IN DPM CHECK P300 PIN1 CHECK PC HSYNC PIN14 VSYNC PC IS GOING INTO DPM MODE CHECK IC103 PIN35 36 CHECK H V SYNC LINE SYNC PULSE WIL YES TROUBLE IN IC 103 Wav
19. er resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire Copyright 022010 LG Electronics Inc All right reserved Only for training and service purposes At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges LGE Internal Use Only TIMING CHART Total i
20. he other end of the insulated clip lead to the picture tube anode button using an insulating handle to avoid personal contact with high voltage 4 Do not spray chemicals on or near this receiver or any of its assemblies 5 Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 10 by volume Acetone and 90 by volume isopropyl alcohol 90 99 strength CAUTION This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required 6 Do not defeat any plug socket B voltage interlocks with which receivers covered by this service manual might be equipped 7 Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed 8 Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes 9 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devi
21. ronics BLOCK Interface SHEET 2 72 PDF created with pdfFactory Pro trial version www pdffactory com JANUARY 2012 P NO MFL67122126 Printed in China
22. ted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuitboard printed foil 6 Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F b First hold the soldering iron tip and solder the strand against the component lead until the solder melts c Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil d Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and then bent flat against the circuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Removal 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts 2 Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the
23. tric shock as this will result in damage to the screen A WARNING BE CAREFUL ELECTRIC SHOCK If you want to replace with the new backlight CCFL or inverter circuit must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms Handle with care wires or connectors of the inverter circuit If the wires are pressed cause short and may burn or take fire Leakage Current Hot Check Circuit AC Volt meter Good Earth Ground such as WATER PIPE CONDUIT etc To Instrument s exposed METALLIC PARTS Do not scratch or press on the panel with any sharp objects such as pencil or pen as this may result in damage to the panel 1 5 Kohm 10W Protect the module from the ESD as it may damage the electronic circuit C MOS Make certain that treatment person s body are grounded through wrist band Do not leave the module in high temperature and in areas of high humidity for a long time The module not be exposed to the direct sunlight Avoid contact with water as it may a short circuit within the module e f the surface of panel become dirty please wipe it off with a softmaterial Cleaning with a dirty or rough cloth may damage the panel A CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal
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