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1. M CFR CS Oth OIE Functions for flexible operation RA Inspection TIER Programming Taten Verification 1 74U74 Utility TEBE Ea Functions NI YNYFYT CARTS BARAR MR EMNET 4 Ly 71 2745 3 10U R7U v RU AVIA SR NON v NY FV 7 FRODE amp 187 4 sioe SERA 3 EO B OSA LR Bb DS SB ERE FA SN BCR 7I ERO Vy ZR Pattern Matching Histogram Solder Paste Extra Parts Wave fillet IC Lead bridge Grey Level Analysis NG Matching Re inspection for NG Various Filtering Master picture search order optimization Sampling inspection Angle Measurement Position Measurement Scratch Stain Crack detection and wave soldering inspection BET NLC L 6887 FEN A N T N SHN D e Bui Sog AVVIK TIT My Wb AVY IF IN Ab AVY TIRES S TERREA A XT alae A LE TO 716 TO v 7185 8 2 4 GE BE RER ER RAM FRM BUND RE VA DERE MT NE al Auto programming by CAD data Importing Gerber data Auto positioning Stamp method Group Pack method Stamp Database Exporting stamp information switching illuminations Camera special illuminations Zooming Block for panellized PCB Block duplication 24 master pics Auto flipped master pics Switch visible Invisible of frames Color PCB side recognition Masking Off Line debugging Off Line Teaching Tact Simulator SIERT N ER EN GRETE BRRR UA NUR TUL I A CatchSystem 217 IXV NET XR E A SEES HESARI TROMH Good Not Good confirmation2. 22X by NER E Automatic visual Inspector marantz electronics Desk Top series U22X 350 amp U22X 650 In Line series U22X 350L amp U22X 650L SEDYLIKNITTERULIHNTLOERN RERE HXI Camera Configuration AM 742 2 TOP Camera P 1 74 F2X7 Fy Angular Cameras gt 4 X47 XB HAHN BAEZ HIT 8 Angular cameras in each 45 degree Z4 Y 4X 208 BIC 74 E D 2 008 AAC B EN FEO BRE LAR HT B surrounding Top camera 8 angular camera views surrounding Top camera view all view can be zoomed in YA FZx 70EBifeteRUIcvTA24gduc4SBSM EH Automatic Inspection by matching algorithm in angular camera views Ch186 UT RDAT DER EA LE E BIER EE EOD EHER o I FIRE Double use angular cameras can also use during verification U IDEE Lifted Lead de iL H RZ OR Tombstone MOAB No Solder N HENGER csse HEGER xy ASHE HENDER Ly hXxS TBR Angular Camera TOP Camera Angular Camera TOP Camera Angular Camera TOP Camera E ETOR S TROEL DT T ay ICRU RBENKL TEVUT4 bAE Pictures by angular cameras sent to Quality Management Software optional for traceability lbid ERE ERE fk Result and Images MR INA VIvFVIK KR Parts Inspection Pattern Matching Inspection MIDAERHHENPUSLTET FD RILAR DIR LID FIRE Combination of 4 inspection algorithm catches any defects INZ874Uvy MSS gt ERDE Solder Fillet Inspection Histogram Inspection BIG De DEL BAER EFF Fr LT TORE VE B
3. mode Cell mode Map View normal high density mode List mode Printing Output to CatcySystem Show comments Alert accumulative false calls NG calls Prevent escaping by human error OF SSI IL Var 44 P RE J hd CSE BRS We SUE HT 7NE FP 77 4 5 ERBE N I RICkOT IE VO AER HELP H HARE VI 9 4 So SERRE E P Ny SY 7 TER Auto calibration Warp calibration Read barcode Position offset per FoV Auto side swapping Output coordinates Authorisation Hour counter Auto rail width correction Program change by barcode Mouse action with Help key Verification step mode Bad mark skip AZ lIfmiUuUuEE 7Z7Hk7r7 7Z7a SMT Quality Management Software Option BARENSOHHRILN SEXT ER HRL SEL ES Il lets CatchSystem Yield quality improvements from inspection data CatchSystem CS Center B vH7 7EOSISSTROT y MELET B Sw aD S RZ ULI CS Watch CS Repair CS Analyzer B ONG ERATE AL E PCBERLONGEMENGEIATO B NAM SRM EIN TAIED Brea Ate RIN W R CPK Lene ZEHLET NG SIPTO BIER BERUHT B S ELA HOIEZ VES R LANE HND S SER amp 9 E 247 PCBZ Lot EEERHES E Collect data and store it on SQL CHEF BEREDT KEYTA AE N I Re database via LAN E Live performance indication of E Display a PCB map with SERRE E Remotely judge multiple AOls production process defect points and enlarged lll Scatter pareto and time inspection results l Indicates Process Capability picture of each defect graph for analyzing Index W Display the
4. A By clamping ae amp amp ig PCB size Min 50x50 Max 350x250 Min 50x50 Max 650x540 ta R tk IS PCB thickness 0 4 2mm Z fi PR Clearance Em E025 mmiT HR KRIZ D 20 mmnbU RU Uv Z7 Yy INEA SMM Top less than 25 mm Bottom less than 30 mm 35mm Bottom Clearance without backup HMLY 4 TF TI430mmLL P HDL S 4 Z cl 38mm amp CORR EPR APR 30mm top clearance for HML type and 38mm for HDL type B iS ES EB Inspection Unit vA x 5 Camera 2 Mega pixel top camera 8 side cameras AR BH Illumination White LED Side LED Diffuse on Axis LED or RGB LEDs Diffuse on Axis LED R S HA X Inspection algorithm JE UY W T 72 Pattern Matching ER FZ27 A Histogram z x ZA Inspection stages 7U AA amp A TERMI U DO 7 D BU 38FH SPI post CIP pre and post re flow X Em EB m Inspection targets Fy TEMA QFP 77 LERMm Passive active and axial components QFP IC etc BB m f x IA E Component Inspection Am BE AL ttt em JU v Z7 Missing Shifting components polarity incorrect components Solder fillet E fill f fr IA Ej Solder Paste Inspection AV ICCB DTN 2U v Shifted insufficient excess shortage ti g Field of view Top Camera Approx 32 x 24 mm 20um 30 x 22 5 mm 18um CEXSHHSHRSPSERR Side Camera Approx f 6 x 6 mm 12 um iR B FM Speed Vii Kf 0 00 1 SSC LIC d 0 001 sec point depends on the PC A BAITS CER C fi FHOOER UE BERUHT LS HIHI ER mas zc fs HU TIE VE BR MCOUY TIER RS fe LERSRLCBR 325 FT KANDE EL fv TEL All tt OO IR H
5. AS THES bE CER E KES NET FI H EVV ELET CDS DSS LC B AIR NSL OLC d OX EOD TC OD F7 K PERRET SCEMBGZOIRI OD CHSDPUDT RCTS The specifications in this catalog are subject to change without notice due to improvement det AGENCY ss RH 8 mn YS5VVIL NIZIR MEET AI SARA T 240 0005 Fa E EET ER T ARR RT 345 HD YBP 4 774 4F TEL 045 340 5566 FAX 045 340 5567 COASOI NRHA FR 2 348 HRD L eT http www model22x com
6. ETNTN OY TRU COPED RELIG OI OKCU IDEEN HAN DA RAMEE B3 ick CRA Bal C0 C SET PAARL CONSER DSL RAD I BE Subtract the target picture from the master picture If the difference is less than the criterion target picture is regarded as matched Highly accurate inspection can be performed because not only the difference of brightness but also saturation and hue are the factors of criterion WIESO CA MZ FLD RE UT SESI R TUZ OK LAS 71V1 75 s X ERA CI VA D REU V SPLORSIGSUCUOES F V TVER DORE C NG Simple inspection if the histogram of brightness is within the target range it is judged as Good Suitable for inspecting solder area where no typical pattern exists Fast inspection speed because of simple inspection fS EU ze fe 3 VF CAS RE RAE IRI E Body vert Fi nn te SL Shifted Missing Wrong text IND SED BARE gt PRIEUR EITI Solder Paste Inspection Pattern Matching Inspection Solder Paste Area Inspection EIC Do not miss defects by applying the suitable inspection algorithm Fr ZB Master picture DE Captured JS Ds BAR a are DEE Solder Fillet Histogram Inspection rTFr Lie Captured picture TRE EMR Inspection SIE RUICKS picture Result A II I ZYF IHR RAPT Inspection area S Histogram RUE MACH SBA Ratio in criterion range 865 SRE CAD aban Extra Parts Inspection Missing Parts Inspection NY SERNA Sarre RL HE RD 3 BB KU FE TA FIIREH INT 9 SARRY h Gbtmz LC TER B
7. Y TU FEN 3 MENDRTT Detect the status of solder printed surface by examining area position and form Inspection program can be created manually auto sampling or imported Garber data by using free converter software ZO DIN ICH Shifting Insufficient and short Excess ISP RE d IC 52 ORI KE BOF ERC VERDES EREZNI RIRH NGI XE CODY GR Any foreign object can be found without designating the inspection area Slight variations of PBC is absorbed by self learning function and false calls can be controlled Easy to find Not Good parts with an arrow M a 5 EI STYTTTTTTT1 BM Se FHRA Standard Inspection Extra Parts Inspection AXTF camera LYA lens REB Resolution 20 u HERE Resolution 18 75 u 2007535 E fs rov 32x24mm Ei f Fov 30x22 5mm BERE 2 Mega Pixel B HA ae UXGAsize i En 16000200 Prior to Speed High resolution rte 4548 STAY E D S BEREICHE EUSEB CB 8 Angular Cameras In 360 degree For faster inspection For high density PCB REB Resolution 20 u REB Resolution 18 75 u REB Resolution 10u REAAZE K BI f Fov 32x24mm BI f Fov 30x22 5mm BEBE 20078 rote m Ba 2 Mega Pixel UXGAsize Prior to Speed 1600x1200 a j i High resolution l eRe IC EOS FEE abo cmo For faster inspection For high density PCB REB Resolution 25 u REB Resolution 20 u REB Resolution 18 75 u JAN Ei Fov 32x24mm BI rov 256x192m
8. e Side Red light e White light i SEX e cmo For Pre Reflow DQ JP sms For Post Reflow HDL TYPE HML TYPE aan SARE U RGB 3 HHE K E ee Paz e SEE En o ERA e RGB lights e Diffuse On Axis light e Diffuse On Axis light e Side Red light e White light SEX e c moll For Pre Reflow D Q UZH f lcBill For Post Reflow ML TYPE RGB 7j z BGB3 e RGB lights 3 U 70 KK EE For Post Reflow BD En Se d fie Post Mounting J UZL Post Reflow KI YNRYFY TICKS FIRE Cian V RE RGBAD FRAB E AKZO LAN CHAI AL v NERE Check text of odd component if it is correct or wrong Solder fillet inspection by RGB lightings and histogram method RGBAD FRAA CHA Bild BA Clearly defects are captures by RGB lightings 1 I ig EN ME SRI Printer P amp P for Small Components P amp P for Odd IL Components J7H Reflow Oven PX HE ST MH Function Details bm ND BEAL R Angle Measurement F IDYUTDBET NET det RETRETT FAR HTBZDENGE RNET Function for inspecting LED chip Measure the angle to detect the theta rotation FX BEN EDER Scratch Stain Detection BFIy7DKAIST LKENPE INNS VDO RIB YT 275050 0 Ie XDUORSICBRUES Detect the scratch or stain on celamic or pattern Detect the crack of costy
9. m Ei f amp Fov 24x18mm I73 Y7A 1207 u Sr 1 2 Mega Pixel z ER SXGA size EE Prior to Cost 1280x960 en E Performance B R Er lc Eo E2 Bm bc 508 For faster inspection For high density PCB I d A Tz ED MIE Post Printing Q Fy Jul inset Post Mounting Q PARREIRA Cla EOLA DTN ALES Ty Z8 aO D L A L S RI Fast 2D inspection for solder excess insufficient misalignment Check presence wrong reversing or misalignment of components FEE KER Cit EOS LRAT VI r RISE SCIO c AD OSA Accurate inspection by flat reflection of Diffuse On Axis light Find any foreign object on PCB by missing component detection Nm NAF HBA LZ OD B3 515 I3 EEIELSHETER Combination of Camera Lens Lighting is selectable up to environment fw TYPE e EACH e White mono light Q SIRI e Size EDEN For 2D SPI and Pre Reflow IC Oti E v 7 13 Pl SHS ATR BAS SIS RAR Easy detecting of the polarity with Diffuse On Axis light ta STELLE EEE 111111111 H HA lightings HDA TYPE HMA TYPE e F 84 HS y e RGB 3 8 a eia A ua se 6 ERA e RGB lights e Diffuse On Axis light e Diffuse On Axis light
10. package component ZEILE THA EN TER Previous model 1 ITTIHUrU X U series Inline model AERJ I High Spec Camera fr B5 80 BB ED With Diffuse On Axis light 5 2 ERE C 5 ISDA L RARE ABM 2Mega pixel camera has wider Fov thus enable to reduce inspection time much AReRAC3 amp Be OLE DREI GREEN RGB Z 5 ML AHOMMICARS NB RED ORE In addition to RGB layered lightings Diffuse On Axis light can detect fillet even shadowed by high component KARA 45 Faia amp 65 amp U TERM Ab 15 Foy Reduce time for 4596 Vo false call with ARMEE 220 VOY no color irregularity HEEN 34 777 Dimension 15 down Weight 22 down I ir Power Consumption 34 down 1S BERE Small High Performance 94 REIVIN NTL HER A MR eMALIARN VY ANKET Ib Compact size and less power consuming model Fit to today s factory environment BD op O fS EXT IE TR Position Measurement FYTORENEN ESSI WE JU v Ty VC E LOSE RDS EDER C SC LE RELEY Function for inspecting LED chip Measure the distance from the settled position to detect the Y 1 shifting ZH amp 1807Uv2 d Bf STI Wave Soldering Detection TRIIPYTYSOEVROFHOK EST SIOOAIY ICH Vy Pane i BICROLES Exclusive function for wave soldering Easy detection of short between through holes Q mH JU 3 Previous model Previous model 9 ERBE Previous model U22XHDL 350L
11. repair data ll Output report E Real time monitoring in your graphically E Search by line PCB Lot office via LAN production span or barcode tt f Specifications B LEDIG Bench Top Machine U22XHMA 350 U22XHDA 350 U22XHMA 650 U22XHDA 650 44 Y 5 Dimensions W707 D712 H492 W940 D1015 H500 A B s Weight 65kg 110kg JE Power supply AC100V 240V 78 amp 3227 Power consumption 450W PC 3d f A IM 14 Operating environment Temperature 15 30degrees C Humidity 15 8096RH no condensation E JJ Motor Servo Motor x 3 f IX L il i J S Precision of repeated positioning lt 0 05mm ie 8p 3 x Max speed 720mm sec R amp FH Boardsize 350 x 250 650 x 540 2 R BR Clearance ER Emb525mmb R R NEKN70 mm Top less than 25 mm Bottom less than 70 mm HMLY 4 TI amp E30mmA TF HDLY 4 TIKAOmM FE TODE LEAR 30mm top clearance for HML type and 40mm for HDL type BH 1 34 8 Inline Machine U22XHMA 350L U22XHDA 350L U22XHMA 650L U22XHDA 650L A d No Dimensions W740 D786 H1236 wies4rs86018600 W1OAO D1077 H1270 vta hea 1800 A d Weight 180kg 240kg s i Power supply 100 240VAC Xi 2 5 TH Powerconsumption 700W PC XTY RH IE 14 Operating environment Temperature 15 30degrees C Humidity 15 8096RH no condensation 8 JJ Motor Servo Motor x 3 4 3 U fil E ta E Precision of repeated positioning lt 0 05mm fe 8 im m x E Max speed 720mm sec I 7 N 7 FB Conveyer IJYNP7 RE R Conveyer speed 10 500 mm sec E ih E A PCB fixing method BURR GI
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