取扱い説明書 INSTRUCTION MANUAL
Contents
1. Keying Layout SERIES 6411 M1 8 INSTRUCTION MANUAL No 205 03 279 106 03 004 PAGE 3 7 KYOCERA ConnectorProductsCorporation 3 PRECAUTIONS IN HANDLING 3 1 MOUNTING 1 Please make sure that the product is free from deformity caused by the unnecessary stress to the contacting points and the tails 2 Recommended Pad Size PCI SIG M 2 The recommended pad size shown below This dimension will be those corresponding to the standard of the PCI SIG M2 eM sees ANCHOR PLATE 0 3 T UPPER CONTACT 1 5 04y n 2 15 SE LOMER CONTACT 1 5 2 2M The overall layout please refer to the drawings AO 3 Recommended Stencil Size2. So that the module substrate and the connector is straight when viewed from the top and insert as far as it will go X Proper Insertion Oblique Insertion Insufficient Insertion The module board shall be fixed down screw down on to other mechanical parts board after being inserted SERIES 6411 M1 8 INSTRUCTION MANUAL No 205 03 279 106 03 004 PAGE 6 7 KYOCERA Connector Products Corporation 3 3 ENGAGEMENT 1 PC SIG M 2 Module board please use the one that corresponds to the standard of the PCI SIG M 2 2 Module board please use something that imposition is always at the tip If the imposition is not going to use the thing there is a concern that the failure o
3. 100 tm The following is the stencil size The following dimensions will be stencil thickness dimension in the case of 100um If your stencil thickness is different please specify the stencil size with reference to the volume of solder paste are listed t 100 um The case of t 100um stencil thickness QANCHOR PLATE 2 15 UPPER CONTACT 1 7 JS ap The overall layout please refer eLOWER CONTACT 1 5 3 to the drawings A pus UPPER CONTACT 0 051 mm i LOWER CONTACR 0 045 mm ANCHOR PLATE 0 33 mr SERIES 6411 M1 8 INSTRUCTION MANUAL No 205 03 279 106 03 004 PAGE 4 7 KYOCERA ConnectorProductsCorporation 4 When the mounting condition differs from those of our prof
4. KCERd KYOCERA Connector Products Corporation SPEC No 205 03 279 INSTRUCTION MANUAL Senes 6411 M 2 Connector M1 8 Type O EDN 093 2 5 13 H Tamai Y Okabe No EDN DCN DATE PREPARED CHECKED APPROVED 106 03 003 KYOCERA ConnectorProductsCorporation TABLE OF CONTENTS N 2 1 MODEL NUMBERS n n AIR 2 2 PART NAMES Co 3 1 MOUNTING t t RR nnn 3 2 ENGAGEMENT sn m mmm e e e 3 3 CAUTIONS OF THE MODULE BOARD 4 STORAGE MANAGEMENT 1 i OUTLINE PART NAMES AND MODEL NUMBERS 5555 PRECAUTIONS IN HANDLING s OTHER CAUTIONS SERIES 6411 M1 8 INSTRUCTION MANUAL No 205 03 279 106 03 004 PAGE 1 7 KYOCERA ConnectorProductsCorporation 1 OUTLINE
5. 6411 PCI SIG M 2 0 5mm 6411 M1 8 Series 6411 connector is a card edge connector 0 5mm PITCH corresponding to the standard PCI SIG M 2 Please follow instructions and cautions hereunder 2 PARTNAMES AND MODEL NUMBERS 2 1 MODEL NUMBERS 2 6411 067 00 883 Packing NE 0 Connector Assembly Variation 4 Emboss Assembly A Key A 5 B Key B m No of No of pos C Key C PCI SIG Standard D Key D 0 M1 8 TYPE HEIGHT 1 8MAX E KeyE F Key F Variation G Key G Boss ANCHOR Hos Key PLATE J Key J 0 e e K Key K L2 L Key L M Key M SERIES 6411 M1 8 INSTRUCTION MANUAL No 205 03 279 106 03 004 PAGE 2 7 KYOCERA Connector Products Corporation 2 2 PART NAMES 1 Connector INSULATOR ANCHOR PLATE LOWER CONTACT UPPER CONTACT 2 Keying 6 125 KEYA 6 625 KEY M 5 125 KEYL KEYB 5 525 4 125 KEYK KEYC 4 625 3 125 KEY J KEY D 3 625 2 125 KEY H KEYE 2 925 1 125 KEY G KEYF 31 625
6. ANUAL No 205 03 279 106 03 004 PAGE 5 7 KYOCERA ConnectorProductsCorporation 3 2 ENGAGEMENT 1 If something touches the contact points or with some foreign object the spring could be deformed 2 The module board shall be inserted and separated correctly according to the direction and the process as shown below 25 7 2 The module board shall be placed on the mouth first at the maximum of 25 deg inclination Then insert and separate the module board after pushing it down to parallel with the mounting board The module board shall be inserted completely Lie TD
7. ccurs when you insert a module substrate 8 0 08 J Module board taper 3 Before inserting the module board make sure that there is no dirt such as flux stuck on the contact pad of the module board in the mounting process 4 STORAGE MANAGEMENT Store connectors under normal temperature normal humidity and no dust condition When storing connectors out of the embossed tape do not apply any pressure to contact tails and anchor plates 5 OTHER CAUTIONS Do not throw products or apply large shock to them though contact ta
8. ile in any way please make sure that you do not observe any deformity nor color change with the mounted connector before the mounted PCB is installed in the unit 250 230 180 30310 s 150 902 30 s TEMP ON THE PARTS C PRE HEAT TIME s Recommended Profile 5 N If you need to mount on the N reflow condition please make sure to conduct the reflow test in advance 6 Please do not apply flux onto the tail and PC board when it is soldered manually Splattered or migrated flux inside the connector or to the contact points may cause imperfect contact Also avoid giving any stress to the product with the soldering iron It could deform tail or melt insulator Soldering iron SERIES 6411 M1 8 INSTRUCTION M
9. ils and anchor plate are protected in the embossed tape when delivered SERIES 6411 M1 8 INSTRUCTION MANUAL No 205 03 279 106 03 004 PAGE 7 7
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