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HyperLynx Thermal User Manual

1. 33 Conduction 34 Heat SINK rr 34 Thermal ou lid er RE MUR E WARREN RAT 37 tere E E E Cd esie ed dee qid aed 38 Modeling a Chip or on the Board 1 20 0 cece ee eee 40 Modeling Daughter Boards 42 456 ease cee eRe eee eee GU RENE 40 Modeling Parallel Daughter Boards 0 00 cece teens 40 Modeling Perpendicular Daughter Boards 20 0 0 c eee eee eee 41 Metal Core or Thick Ground Plane in Boards 0 0 0 cece 41 Metal Strips on the Board i c sss oe bene RE RA GGG REX PY ROGER RA qp 41 JATI ISOLODIC WINE tacea NE eed d aeu deb d uis e 41 Adjacent Board or Wall Rake ea A ex RR RR ne 42 Chapter 6 Indust y sesso e a Caw TRUE 43 Avionic Space Applications aw ewe ee AERE YA RA NR E es 43 Closed System sua Per ace eee eee hee ROPER TE PEE ERE E RES 43 Air Conditions NEP 44 Component Details eqs rasics xe dee ep adr ATA E XS RE RA 44 Board SUMING gest ode gatos FREE RAO AY i EE E E Oe AAR eor n 44 OUIBES coe Rds E OES ROC PG I ERATE eee EG eae A 44 Computer Instrumentation Applications 0 0 00 cece eee teens 44 Heat Sink or Ch
2. To delete all components of a partname 1 Choose View Search by Component Name and select the partname that you wish to identify from the list 2 Click OK AII of the components of that particular partname will be marked with an X 3 Click the Delete key on your keyboard after the component is identified 4 You will be asked to confirm that you would like to delete all components of that partname Click Yes and all of that partname will be removed from the board Toolbar The Toolbar command displays the toolbar on the top of the screen The toolbar can be used for easy and quick executions of various often used commands You can click here to display or hide the toolbar Status bar The Status bar is displayed on the bottom of the screen You may see the instruction on how to proceed with the present command It also lets you know at what location the present cursor is with respect to the origin of the board which is the lower left corner of the board The unit of location is set at file unit menu 60 HyperLynx Thermal User Manual V9 0 Library Menu HyperLynx Thermal Menus Library Menu The Master Library stores the information of all the interested components The Working Library only contains the components of the current board Components can be updated from the Master to the Working Library or copied from the Working Library to the Master Library The Material Library lists the conductivities of many com
3. HyperLynx Thermal User Manual Software Version 9 0 1999 2008 Mentor Graphics Corporation All rights reserved This document contains information that is proprietary to Mentor Graphics Corporation The original recipient of this document may duplicate this document in whole or in part for internal business purposes only provided that this entire notice appears in all copies In duplicating any part of this document the recipient agrees to make every reasonable effort to prevent the unauthorized use and distribution of the proprietary information This document is for information and instruction purposes Mentor Graphics reserves the right to make changes in specifications and other information contained in this publication without prior notice and the reader should in all cases consult Mentor Graphics to determine whether any changes have been made The terms and conditions governing the sale and licensing of Mentor Graphics products are set forth in written agreements between Mentor Graphics and its customers No representation or other affirmation of fact contained in this publication shall be deemed to be a warranty or give rise to any liability of Mentor Graphics whatsoever MENTOR GRAPHICS MAKES NO WARRANTY OF ANY KIND WITH REGARD TO THIS MATERIAL INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE MENTOR GRAPHICS SHALL NOT BE LIABLE FOR ANY INCIDENTAL INDIRECT SPEC
4. The heat sink to air thermal resistance measured in C Watt This value is a function of heat sink design and of air speed Enter the value at 10 ft sec air velocities In the analysis the adequate values at local air velocity will be evaluated automatically Radiative Emissivity The averaged emissivity of the component a value between 0 and 1 Casing temperature limit Junction temperature limit The limiting temperature of the component casing beyond which the Temperature Excess Display will show the warning colors The limiting temperature set for the junctions of a component If this limit is exceeded it will be displayed in the Excess Temp screen Temperature at end The temperature set at the other end of the thermal screw Gap Parameters Air gap Gap conductivity The gap between the bottom of the package and the board When conduction pads or paste are inserted into the gap beneath the component this is the conductivity of the conduction pads or paste HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Dialog Boxes Edit Working Library Dialog Box Edit Working Library Dialog Box Access Library Working The Working Library has all of the components on your board This library can be expanded by adding more components and saved into the Master Library for future use Table 11 7 Edit Working Library Dialog Box Contents Parameter Description Update from Master Matches
5. cee eee 82 Local Property Definition Dialog BOX pie icc ee yam x e xe 84 Thermal Via Definition Dialog BOX PSE Ree ee Eee eS 85 Trace Power Density Dialog BOX sexe eke 87 Trace Properties Dialog BOX ped RIP Qaam 87 Glossary Index Third Party Information End User License Agreement HyperLynx Thermal User Manual V9 0 5 Table of Contents HyperLynx Thermal User Manual V9 0 Chapter 1 Getting Started with HyperLynx Thermal Use HyperLynx Thermal to analyze board level thermal problems on placed partially routed or fully routed PCB designs from all popular PCB layout environments Temperature profiles gradients and excess temperature maps enable you to resolve board and component overheating early in the design process This section contains the following topics HyperLynx Thermal Basics on page 8 Creating a New Board on page 14 Preparing a Board for Thermal Analysis on page 15 Performing Thermal Analysis and Reviewing the Results on page 17 Tips on using HyperLynx Thermal on page 17 HyperLynx Thermal User Manual V9 0 7 Getting Started with HyperLynx Thermal HyperLynx Thermal Basics HyperLynx Thermal Basics This section contains the following e Product Overview on page 8 e Starting HyperLynx Thermal on page 9 Navigating HyperLynx Thermal on page 10 Product Overv
6. flow is always calculated and combined with the forced flow to provide a combined velocity figure The average exit air temperature is averaged across the top edge of the board and also takes into account the board spacing The thermal wake exit temperature is also provided for your reference This is the averaged air temperature in the thermal wakes or thermal boundary layer across the exit edge of the board 67 HyperLynx Thermal Menus Analyze Menu 68 HyperLynx Thermal User Manual V9 0 Chapter 11 HyperLynx Thermal Dialog Boxes The following dialog boxes are available from the HyperLynx Thermal application Board Property Definition Dialog Box Edit Working Library Dialog Box Boundary Condition Definition Dialog e Environment Condition Definition Dialog Box Box e Component Properties Dialog Box Local Property Definition Dialog Box e Edit Master Library Dialog Box Thermal Via Definition Dialog Box e Edit Material Library Dialog Box e Trace Power Density Dialog Box e Edit Part Dialog Box Trace Properties Dialog Box HyperLynx Thermal User Manual V9 0 69 HyperLynx Thermal Dialog Boxes Board Property Definition Dialog Box Board Property Definition Dialog Box Access Board Property Define general properties for your board Table 11 1 Board Property Definition Dialog Box Contents Parameter Maximum board length Xmax Description This value is the measurement of the board length in the X di
7. 96 THETAjc see also Junction to Casing Thermal Resistance 30 96 THETAsa 97 Thickness of Layer 96 100 JKLMNOPQRSTUVWXYZ Tips on using HyperLynx Thermal 17 Trace Power Density 97 Trace Thickness 97 Units 26 Boundary Condition Unit 26 Conversion of Units 26 Parameter Units 26 Use With Interfaced File 8 Volume Fraction of Metal nominal 97 W Width 97 MBISTArchitect Process Guide V8 2008 2 Third Party Information This section provides information on open source and third party software that may be included in the HyperLynx Thermal product This software application may include libxml2 version 2 6 11 third party software which is distributed on an AS IS basis WITHOUT WARRANTY OF ANY KIND either express or implied libxml2 version 2 6 11 may be subject to the following copyrights 1991 by the Massachusetts Institute of Technology Permission to use copy modify distribute and sell this software and its documentation for any purpose is hereby granted without fee provided that the above copyright notice appear in all copies and that both that copyright notice and this permission notice appear in supporting documentation and that the name of M I T not be used in advertising or publicity pertaining to distribution of the software without specific written prior permission M I T makes no representations about the suitability of this software for any purpose It is provided as is with
8. SECTION 7 THE PROVISIONS OF THIS SECTION 8 SHALL SURVIVE THE EXPIRATION OR TERMINATION OF THIS AGREEMENT INFRINGEMENT 9 1 Mentor Graphics will defend or settle at its option and expense any action brought against you alleging that Software infringes a patent or copyright or misappropriates a trade secret in the United States Canada Japan or member state of the European Patent Office Mentor Graphics will pay any costs and damages finally awarded against you that are attributable to the infringement action You understand and agree that as conditions to Mentor Graphics obligations under this section you must a notify Mentor Graphics promptly in writing of the action b provide Mentor Graphics all reasonable information and assistance to defend or settle the action and c grant Mentor Graphics sole authority and control of the defense or settlement of the action 9 2 If an infringement claim is made Mentor Graphics may at its option and expense a replace or modify Software so that it becomes noninfringing b procure for you the right to continue using Software or c require the return of Software and refund to you any license fee paid less a reasonable allowance for use 9 3 Mentor Graphics has no liability to you if infringement is based upon a the combination of Software with any product not furnished by Mentor Graphics b the modification of Software other than by Mentor Graphics c the use of other than a current u
9. Select and then left click and move the board Reference Name Enable this option to display the reference designators on the corner of components To disable select it again Grid HyperLynx Thermal User Manual V9 0 Enable this option to identify the intersections of the mesh lines on the board This helps the user to be more aware of where cutouts local property differences and very small components will be recognized by the software Please notice that this grid is determined automatically according to the board size by the program to optimize the accuracy and analysis time It will appear only after the analysis was made the first time 57 HyperLynx Thermal Menus View Menu Table 10 2 View Menu Contents Select the Power command to display the power of the components Click Power to see the component power displayed and click Power again to view without showing power To change power of all of one type of component do so in Working Library To change this one only right click this component then change the power scale factor input This value will be the percent of the power defined in the working library Please notice that the Power can also be input externally through a text file Refined Select to specify particular components for refined data RE These values will be saved in the text file xxxx loc after the analysis is run For refined components the data that will appear in the xxxx loc file is as f
10. a layer This parameter sets the thermal conductivity of the base organic material of the board When there are three layers this value is used either for layers 1 and 3 or layer 2 Values for epoxy is about 0 115 Btu hrftF or 0 2 Please see the Material Library for more conductivity values They are usually two orders of magnitude smaller than metals Therefore metal volume fraction in board is very influential to overall conductivity Conductivity of traces or non traces They are defined similarly to the conductivities at a layer The trace is considered as on the outside of a board on top of the skin which does not belong to any of the 3 layers Daughter Board A classification for all parallel or perpendicular daughter boards In the Library the class of daughter board is for a parallel daughter board A perpendicular daughter board should be modeled as a component of the total dimension with power equal to the sum of the powers of the components on this daughter board The analysis gives the board temperature under this component which is the edge boundary temperature of this perpendicular daughter board Then if needed a separate analysis can be made to this daughter board with the edge temperature specified It surrounding air conditions can be obtained from the Local command Default component casing or junction limits You may set a uniform default limiting temperature for all the component casings and another one for junction
11. a physical layer can be several layers of a board THETAcb This value appears in the numerical output when you have a system that is closed on the front side and the backside It is the thermal resistance from component to board This value is TAIR C when there is an open system on at least one side THETAjc The thermal resistance between the IC junction and the component casing in degC Watt This value is very dependent upon the testing method used The present THETAjc values in the 96 HyperLynx Thermal User Manual V9 0 Glossary of Terms library are derived from the Semi Therm Proceedings TI and Signetics DataBooks etc If unknown set to 0 0 See THETAjc Junction to Casing Thermal Resistance for more details THETAsa Thermal resistance between sink to air See THETAsa Sink to Air Thermal Resistance for more details Trace Power Density The power per unit area on the trace Trace Thickness The thickness of the trace The trace is not a layer it is an extra skin on the board Volume Fraction of Metal nominal The default value set for the metal volume fraction of the board at this location See Metal Volume Fractionfor more details Width The width of the component or the width of the local zone set into layers See DYfor more details X The X location of the mouse cursor or the package on the board The location of the package 15 measured from the lower left corner of the package to the lower left corner of the
12. as a single board in detail with the local environment applied The mother board temperature at this location will be applied to the edge of the daughter board as a boundary condition Metal Core or Thick Ground Plane in Boards Go to the BOARD menu and choose the Property sub menu where you are able to assign the physical layers of the board You may have an 8 layer PCB attached to a metal core with another 6 layer PCB at the back side Therefore the first physical layer is the 8 layer PCB at front side the second layer is the metal core and the third layer is the 6 layer PCB at back side You may assign the thermal conductivity for each layer To assign the metal core select the Layer 2 from the View menu then go to Local Properties menu and assign 100 metal faction to the whole board area This also can be applied to a ground plane where a high metal volume fraction will exist Metal Strips on the Board You may have a PCB of 8 layers with a metal strip set in layer 4 If you don t have stackup information divide the layers such that the first 3 layers are one physical layer layer 4 is set as the second layer and the rest is the third physical layer Set them in the PROPERTY command Go to the same BOARD menu and choose the command LOCAL PROPERTY Go to the first layer and use the cursor to set a rectangle for this metal strip Within this rectangular zone the metal content becomes for example 30 to represent the effects of this me
13. authorized representatives of the parties Waiver of terms or excuse of breach must be in writing and shall not constitute subsequent consent waiver or excuse Rev 060210 Part No 227900
14. be modified if the material from which the pins are made is not copper Pin Thickness The thickness of the pins on the component or package Pin Width The width of the pins on the component or package Power Dissipation The likely heat dissipation rate for this package If you just interfaced from ECAD this value will be a default You should update from the Master Library to update them set a new value in Working Library or import a text file through File Import menu 94 HyperLynx Thermal User Manual V9 0 Glossary of Terms Radiative Emissivity The averaged emissivity of the component a value between 0 and 1 Rotation The nominal orientation of a package in the Working Library has the long side in the X direction and the shorter one in Y direction To rotate allows for a 90 degree turn Scaling Factor for Power This parameter is the scaling factor for the power dissipation of this component with respect to the nominal value of power for this type of component in the working library 0 5 means only 5096 power of the nominal value in Working Library A value between 0 01 and 99 can be assigned Screw Thermal screws attached to the board and connected to an external heat sink Search by component name The ability to locate all components of a particular partname on a board Frequently many components are of the same component name This is also useful in deleting all components of a same partname Search by Reference D
15. board On side 2 locations are still measured in respect to their position on side 1 as if the board is transparent Y The Y location of the mouse cursor or the package on the board The location of the package is measured from the lower left corner of the package to the lower left corner of the board On side 2 locations are still measured in respect to their position on side 1 as if the board is transparent HyperLynx Thermal User Manual 97 98 Glossary of Terms HyperLynx Thermal User Manual V9 0 ABCDEFGHIJKLMNOPQRSTUVWXYZ A Adjacent Board Emissivity 89 Adjacent Board Power Dissipation 89 Air Comes From 89 Air Flow at Boundary 29 Air Gap 89 Air Pressure 89 Air Temperature at Boundary 29 Analysis Accuracy Control 89 B BGA 89 Board Location 89 Board Placed 89 Board Property Definition 70 Board Spacing 89 Q Card Guide Width 89 Casing Temperature Limit 90 Class 90 Component Height 30 Component Naming Guidelines 23 Components at front channel 90 Conductivity of metal at a layer 90 Conductivity of non metals at a layer 91 Conductivity of traces or non traces 91 Creating a New Board 14 D Daughter Board 91 Default component casing or junction limits 91 DIP 91 DX 91 DY 91 DZ 91 Effective Height 92 Emissivity of this board 92 MBISTArchitect Process Guide V8 2008 2 Index Em 92 Exporting a Design from Expedition 19 G Gap
16. board itself For a printed wire board this value is usually on the order of 0 01 Generally a value lower than 0 07 is used Typically for a board of 0 064 inch thickness 1 oz of copper has an equivalent metal volume fraction of 296 If a metal plate or plane cover the full area is used on the board you may include the metal plate volume in this value Otherwise you shall set the plate as a Local one of the layers The board temperature displayed on screen represents the average temperature across the thickness of the board Name of Component This is the part number of a component This must be less than 16 alphanumeric characters in length You can review the list of all components in the library and see the Component Naming Guidelines Number of Pins The total number of pins on the package or component No of Iteration This parameter determines the maximum number of iterations allowed In a strong convective system this parameter may be set to low or medium For a closed system with mainly conduction setting this parameter to high is recommended To insure accuracy a value of high is recommended for most cases Partname Name of Component with up to 16 alphanumerical characters Pin Number of Pins See Number of Pins Pin Length The average length of the pins on the package or component that are exposed to air Pin Thermal Conductivity The thermal conductivity of the pins on the component or package This parameter should
17. click a region on the board to open the Thermal Via Definition Dialog Box and calculate the metal volume fraction in an area containing thermal vias Thermal vias are similar to conventional vias but they are placed to enhance the conduction across the board locally Frequently the inside of the vias is filled with solder 62 HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Menus Board Menu Table 10 4 Board Menu Contents Menu Item Desciption An odd shaped board can be approximated by many cuts which can be overlapped each of rectangular or rounded shape Up to 25 cuts can be made on the board Very small cuts whose dimensions are smaller than a mesh size will be ignored in analysis Mesh size can be viewed by using the View Grid menu This shows the intersections of the mesh lines A cut should cover the territory of at least one mesh area on the grid view to be considered in analysis Mesh size is also usually stated in the Numerical Output 1 Select Board Cutout 2 Click the upper left corner of the area you would like to remove from the board 3 Move the mouse to the lower right corner of the area 4 Click again to set the cut out area A window will pop up allowing you to modify the location or size of the cutout if necessary You may also specify if the cutout is round in this screen You may right click on any cutout to see its detailed specification If you want to remove this cutout then pre
18. description of this modeling is shown below If the heat distribution is expected to be very non uniform on the heat sink you may model it with several heat sinks Each covers an estimated territory of the overall heat sink This modeling is discussed at the end of this section A heat sink with several components mounted on it will be modeled by placing a thin fictitious component on the board and then place this sink on its top This fictitious component will have a power dissipation of the sum of the power of all the components on top of the heat sink The above example is that of a heat sink where the component power is rather evenly distributed However if the distribution of power and therefore heat is more concentrated in one or another region and uneven temperature distribution is expected on the heat sink two or more fictitious components should be modeled depending on the distribution of heat and the estimated territory of each temperature zone The summation of all the powers of the fictitious components should be equal to the total power When you model the original heat sink with several smaller heat sinks you must increase the THETAsa of each sink by a factor that is the inverse of the fraction which is the area ratio of the small heat sink to the original heat sink For example if the original THETAsa is 2 C Watt and the small sink is 1 3 of the original area the THETAsa of the small one will be 6 C Watt The final result of the
19. dissipation If In rack Right or Left of Rack input adjacent board power e Temperature of Case wall The adjacent wall temperatures This parameter can also be used in place of Adjacent board power dissipation if the temperature of the adjacent board s is known Incoming Air Velocity Velocity at leading edge of the board for each side These are very important in a commercial type of application for open systems cooled with airflow If the systems are sealed closed there will be no airflow and this setting should be 0 0 6 To define thermal boundary conditions at the edges of your board choose Environment Boundary a Click twice to select beginning and ending boundary coordinates for an edge of your board this opens the Boundary Condition Definition Dialog Box b Enter Thermal parameter values and click OK 16 HyperLynx Thermal User Manual V9 0 Getting Started with HyperLynx Thermal Performing Thermal Analysis and Reviewing the Results Note _____________________________________________________________ Boundary conditions are very important when you are analyzing a sealed closed system For a sealed system cooling is usually provided at the edges of the board Without some mechanism for dissipating heat the board will usually reach unacceptably high temperatures due to ineffective thermal radiation This is a frequently happened error when user model a closed system but without addressing where the heat goes aw
20. extend over the full board and their material 15 the same as that of the traces only then may their contribution to the metal volume fraction be included here too The default metal volume fraction is usually 1 to 3 for an average PCB with no ground plane or metal core For a typical board of 0 064 inch thickness and loz copper the metal volume fraction is about 296 Metal Volume Fraction is a critical parameter and is discussed separately See Metal Volume Fraction in Boards Default component casing limit This is the default temperature limit for every component casing on the board The casing limit can be set for individual components in the Working library and will override this value if specified The amount that the component exceeded its limit can be viewed by selecting the View Excess Temperature menu Default component junction limit This is the default temperature limit for every component junction on the board The junction temperature limit can be set for individual components in the Working library and will override this value if specified The amount that the junction exceeded its limit can be viewed by selecting the View Excess Temperature menu HyperLynx Thermal User Manual V9 0 71 HyperLynx Thermal Dialog Boxes Boundary Condition Definition Dialog Box Boundary Condition Definition Dialog Box Access Environment gt Boundary A cross hair will appear on the screen Click twice to specify
21. heat sink temperature will be the casing temperature of all the components on it If you want to know the respective junction temperature simply hand calculate the difference of junction to casing temperatures and add onto the casing temperature The temperature difference is the component power in watts multiplied by the THETAjc One Heat sink on top of several components The casing temperatures of all the components will be about the same as the heat sink temperature Therefore the modeling will be 1 Add the total number of pins for all components that are under the heatsink 2 Add the total height of the component heatsink For example if there are 8 components all 1 height and the heatsink is 1 the height that you should use is 2 3 Add the powers of all the components together 4 Hliminate all of the original 8 components from your board 5 Place a fictitious component at the location of the heat sink with the same length and width as the sink but very little height and the pin number equal to the total number of pins from 1 Assign the total power from statement 3 to this component 36 HyperLynx Thermal User Manual V9 0 Advanced Modeling Decreasing the Thermal Output of a Component 6 Design this heat sink with its height equal to the total height minus the height of the fictitious component Then place this heat sink on the fictitious component 7 Run the analysis 8 You will get an overall tempe
22. indicate Mentor Graphics as a source of a product but is intended to indicate a product from or associated with a particular third party A current list of Mentor Graphics trademarks may be viewed at www mentor com terms conditions trademarks cfm Table of Contents Chapter 1 Getting Started with HyperLynx Thermal eeeeeeeeeeeereenns 7 HyperLynx Thermal BAas8168 4 becaPeszcRheteszeceReeREerzeOtAnrqeka bwzaedvs dnd 8 Proguct DvervieW usus oes ed ipe k ERU i ERES SA E OPERE RU EE RE 8 Starting HyperLynx Thermal 22v amy ws Eua RA Rd RE dac RES 9 Navigating HyperLynx Thermal 5 ese RE RR ERES 10 Creating a New soe cra e YER GUN C ERST C DERE P CEA 14 Preparing a Board for Thermal Analysis 0 0 0 0 cece eee eee 15 Performing Thermal Analysis and Reviewing the Results 17 Tips on using HyperLynx Thermal ees det RE REDE ERI AE EE RES 17 Chapter 2 Importing and Setting up a Board e eeooiee er horto rhb rr hh s 19 The Expedition PCB Interface to HyperLynx Thermal 19 Importing se ews once x pirena OY CORR 19 The IDF Interface into HyperLynx Thermal seseleleeeeeeeees 19 Preparing an Interfaced Case for Analysis 0 0 cece eee eee eee eae 20 Importing a Power Tile aslc ges ERR A EU ERR E Edda act s 2
23. is saved under the name betasoft clb and should be backed up before installing any other version of HyperLynx Thermal 77 HyperLynx Thermal Dialog Boxes Edit Part Dialog Box Edit Part Dialog Box Access From the Edit Master Library Dialog Box click Add by parameters or Edit part Use this to create a new master library component or edit an existing component Table 11 6 Edit Part Dialog Box Contents Parameter Description General Parameters Name of part Displays the part name You can not modify this field Class The class refers to the specific configuration of a type of package See Class on page 90 Geometry Parameters Round Component Select to enter the dimensions for a round component For a rectangular component enter the coordinate for the left side For a rectangular component enter the coordinate for the bottom For a rectangular component enter the coordinate for the right side For a rectangular component enter the coordinate for the top Diameter If you selected Round Component enter the diameter of the component Height DZ This is the dimension of the package in the Z direction This is the final height of the package after mounted on the board If a socket is used under a component you must add the height of the socket to this parameter for the component in the Working library If a heat sink is added on top of this component the extra height of the sink is
24. of heat conduction convection and radiation Conduction Heat is transferred through solids by conduction The rate of conduction is proportional to the thermal conductivity of the material and the cross section of the conduction path and is inversely proportional to the length of the path The thermal conductivity of materials such as copper and epoxy prominent materials used in most PCB designs are drastically different When a heat source is present in a subject all generated heat per unit of time should leave the subject if a steady state temperature is maintained in that subject Convection Heat is transferred through fluids by convection The cooling of a subject by the movement of air flowing over its surface is of great interest The heat convection from the subject to the air flowing over its surface increases as the difference in temperature between the solid surface and the mean temperature of the air increases The hot air wake of hot solids at the upstream also reduces the local heat convection For this reason one subject standing in the flow stream can be cooled easily while another subject embedded in its hot wakes may not get sufficient cooling Another factor in convection is the velocity of the airflow With high velocities the convective wash is strong and the cooling becomes significant HyperLynx Thermal User Manual V9 0 47 Background on Thermal Modeling Heat Transfer On Electronic Boards of these f
25. power in working library is Displays the default power Input power scaling factor 74 Enter a value to scale the power dissipation for an instance of a part The power dissipation is multiplied by this number See Power dissipation HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Dialog Boxes Component Properties Dialog Box Analysis of Components Placed Outside the Board Outline If component is placed outside or partially outside of the board outline it may be ignored during the analysis Details are below e The component will not contribute or will partially contribute proportionally to percentage of it s area inside board outline to heat source distribution so the power dissipation for the component will be ignored e The junction to case and sink to air thermal resistances for the component will be ignored The component temperature will be set equal to temperature of the air in the computational grid cell nearest to the location of the particular component HyperLynx Thermal User Manual V9 0 75 HyperLynx Thermal Dialog Boxes Edit Master Library Dialog Box Edit Master Library Dialog Box Access Library Master The Master Library has thousands of components along with all their pertinent parameters saved within it This library contains the standard names from the Motorola handbook Since every company uses different names for their components we chose to use Motorola s as the sta
26. should follow steps 4 5 and 6 1 Scroll down to a few lines past Output of Board Analysis to the line that reads Side Ref Des Tc C oe 95 2 Place your cursor immediately after the e in Side and add a space and the word Name Save and close your XXXXX out file Open the RELEX file that corresponds to the HyperLynx Thermal file Select the System tab Go to File Import pL o due m dn At the bottom of the window that pops up there is a drag menu titled Files of Type Select All files HyperLynx Thermal User Manual V9 0 49 Background on Thermal Modeling Reliability Background 8 Go to the directory where your XXXXX out file resides highlight that file and click Import 9 Select I want to update the selected assembly from the first group and Import reliability prediction information from the second group 10 Click Next 11 From the drag menu select Betasoft and click Next 12 Click Finish 50 HyperLynx Thermal User Manual V9 0 Chapter 8 Troubleshooting and Technical Support Many users have tested HyperLynx Thermal in the past several years and we have compiled a list of the common problems that these users have encountered It is very likely that you will find the solution to your particular problem here If the analysis works but it indicates that components overlap Please go back to the Placement Menu and move components
27. specified separately The effective height of heat sink is only used to evaluate its influence to the airflow 78 HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Dialog Boxes Edit Part Dialog Box Table 11 6 Edit Part Dialog Box Contents Parameter Description Effective height 0 1 For a Heat Sink specify the effective height of the heat sink to the airflow The value will be a percent in decimal form with 1 being total blockage and 0 being no blockage For extruded fins oriented perpendicular to the airflow that all the air 1s blocked this is the total height The value will be 10096 If the extruded fins are parallel to airflow this value is usually about 50 if wide spacing of fins occurs For example in a pin fin with a staggered array this 15 close to 10096 For an in line array and parallel to flow 8096 is a good approximation Pin Parameters Number of pins Enter the number of pins the component has Pin length The average length of the pins on the package or component that are exposed to air Pin Width The width of the pins on the component or package Pin Thickness The thickness of the pins on the component or package Pin thermal conductivity Enter the thermal conductivity of the pin or click Specify conductivity by select material and select a material Thermal Parameters Power dissipation The heat dissipation rate for this package If you just interfaced from ECAD this v
28. to resolve the overlaps A few overlaps will not crash the program but they will decrease accuracy in the analysis If the analysis crashes during iteration Don t panic There is a 95 chance that you have simply specified some component parameters that are not meaningful Please go to the Working Library select a component click Edit part and review each type of component individually For example some typical problems include the component height is negative the number of pins is 0 0 or all the parameters are 0 0 etc Still More Troubles If you are still having trouble at this point please contact Mentor Graphics technical support by visiting http supportnet mentor com Technical Support Please contact Mentor Graphics technical support by visiting http supportnet mentor com HyperLynx Thermal User Manual V9 0 51 Troubleshooting and Technical Support Technical Support 52 HyperLynx Thermal User Manual V9 0 Chapter 9 Program Specifications and Requirements The specifications of HyperLynx Thermal as related to various parameters are described in the following sections Package types supported The package types supported range from conventional through hole and surface mount with both being either rectangular or circular Types of air flow supported The various types of airflow supported are Natural forced combined or fully closed at ground avionic or space applications HyperLynx Thermal User Man
29. types supported 22 saa bed Ra xax RR ad e RR ARE eR eda 53 Types of air flow supported bd zek s e ER RES ARE XR E RET PISA RS 53 Chapter 10 HyperLynx Thermal Menus 5452229592 29 9 3 P REOR RET ERE PE RUPEE 55 Pile Ment PDT 55 View oo 57 Library Mets PH C T 61 Bun 62 Placement Menu 22k eo ge Sake cd CREER REUS Oa REN OS Ru DRE eg 65 Environment MEDI ous aces E rl e RUE cba Roy 66 Analyze Men C b ES 67 Chapter 11 HyperLynx Thermal Dialog BOXES 60 666 05529 roh rrr eR 69 Board Property Definition Dialog Box 0 0 cee eet eee ee 70 Boundary Condition Definition Dialog Box 2 0 0 0 0 eee eee ee 72 Component Properties Dialog BOX issus se dwided aside dee xo ex Ree Daa 74 Analysis of Components Placed Outside the Board Outline 75 Edit Master Library Dialog REOR RR RR E PERO E 76 Edit Material Library Dialog lleleeeseeeeeee e 11 Edit P rt Dialog ERA Eg a P RO Hes op deg doppi 78 Edit Working Library Dialog Box leleeeeeeeeeeee I 8l Environment Condition Definition Dialog Box 0 0
30. your board s components with similar ones in the master library and sets their parameters accordingly Add by parameters Opens the Edit Part Dialog Box You can add a new component to the master library with this command You will need to input specific parameters such as size power package type number of pins etc Copy part This command will allow you to copy the parameters of a specific component under another name If the name in the master library isn t the one you use you can copy it to your preferred name Edit part Opens the Edit Part Dialog Box so you can modify parameters for a component Highlight the component in the library column and click Edit Component Any changes that you make to the component will be temporarily saved when you click OK You can permanently save the changes by choosing File gt Save File gt Save As or running an analysis Delete part Click to delete a selected part from the Library You will be asked to confirm that you would like to delete that component from the master library Save Master Lets you save your current library and updates the old library file on the hard drive The Master library is saved in betasoft mlb HyperLynx Thermal User Manual V9 0 81 HyperLynx Thermal Dialog Boxes Environment Condition Definition Dialog Box Environment Condition Definition Dialog Box Access Environment Condition Environment Conditions Parameters describe the condit
31. 1 Chapter 3 Library Names Units and Wiles 524224592 23 Component Naming Guidelines 0 0 0 cece eee een eee 23 Package Ayes RE RR 23 Patt Name SulliXBS soos suena a nret irnak Re M edd 24 luci PR 24 6S glee ys BR RIAM ME NUS RO EE ARR ERU I PES 25 Lista desc oE EE Ea E wax EEE E qaa A EA 26 Conversion of E E elie AE S 26 PUGS pP cinara kan ae bed AERE A A R E A RG 27 Chapter 4 Critical Parameters Enean TEES 29 Metal Volume Fraction m Boards egy ee 20 Air Flow Temperature at Boundary RE tes Gee ED 29 Posver DISSIDIHOD XE EE RS RS E E ENTES KERUN VEF 30 Pin Dimensions Component Height 0 0 0 0 cece eee eee 30 THETAjc Junction to Casing Thermal Resistance 0 0 00 cee eee 30 THETAsa Sink to Air Thermal Resistance 30 HyperLynx Thermal User Manual V9 0 3 Table of Contents Chapter 5 Advanced Modeling aac eic Fra eee Rob e RC 33 Decreasing the Thermal Output of a Component 0 0 0 0 cee eee eee 33 Relocating Overheated Components 220244 su o08 eR
32. Conductivity 92 Gap 92 Gravity 92 Grid 92 H Heat pipe 92 Heat sink 92 Height 92 Humidity Ratio 92 Importing a Design 19 Import 92 Incoming Air Temperature 93 Incoming Air Velocity 93 Initial temperature of iteration 93 Junction Temperature Limit 93 Junction to Casing Thermal Resistance 30 93 K Kair 93 Kpin 93 Kx Ky 93 L Length 93 M Maximum Board Length Width 93 Metal Volume Fraction 29 94 Mixed 93 N Name of Component 94 No of Iteration 94 99 ABCDEFGHI Number of Pins 94 p Partname 94 Performing Thermal Analysis and Reviewing the Results 17 Pin Dimensions 30 Pin Length 94 Pin Thermal Conductivity 94 Pin Thickness 94 Pin Width 94 Power Dissipation 30 94 Preparing an Interfaced Case for Analysis 20 Product Overview 8 EM m Radiative Emissivity 95 Rotation 95 lt 6 Scaling Factor for Power 95 Screw 95 Search by component name 95 Search by Reference Designator 95 Shift all Components in a direction 95 Sink to Air Thermal Resistance 95 SI 95 SMD Leadless 96 SMD Long Leads 95 SMD Medium leads 95 SMD Small Outline 96 Stand Alone Use 8 Starting HyperLynx Thermal 9 System 96 Temperature Coefficient 96 Temperature of Casing Wall 96 Temperature of Sink at Edge 96 The IDF Interface into HyperLynx Thermal 19 Thermal Resistance of Wedge Lock 96 THETAcb
33. IAL OR CONSEQUENTIAL DAMAGES WHATSOEVER INCLUDING BUT NOT LIMITED TO LOST PROFITS ARISING OUT OF OR RELATED TO THIS PUBLICATION OR THE INFORMATION CONTAINED IN IT EVEN IF MENTOR GRAPHICS CORPORATION HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES RESTRICTED RIGHTS LEGEND 03 97 U S Government Restricted Rights The SOFTWARE and documentation have been developed entirely at private expense and are commercial computer software provided with restricted rights Use duplication or disclosure by the U S Government or a U S Government subcontractor is subject to the restrictions set forth in the license agreement provided with the software pursuant to DFARS 227 7202 3 a or as set forth in subparagraph c 1 and 2 of the Commercial Computer Software Restricted Rights clause at FAR 52 227 19 as applicable Contractor manufacturer is Mentor Graphics Corporation 8005 S W Boeckman Road Wilsonville Oregon 97070 7777 Telephone 503 685 7000 Toll Free Telephone 800 592 2210 Website www mentor com SupportNet supportnet mentor com Send Feedback on Documentation supportnet mentor com user feedback form cfm TRADEMARKS The trademarks logos and service marks Marks used herein are the property of Mentor Graphics Corporation or other third parties No one is permitted to use these Marks without the prior written consent of Mentor Graphics or the respective third party owner The use herein of a third party Mark is not an attempt to
34. Import menu The board placement file will be extracted through the ECAD interface program and will automatically be loaded into HyperLynx Thermal when the file is opened Set the operating environment in the Environment Condition Definition Dialog Box Also specify the board properties in the Board Property Definition Dialog Box Review all of your components in the Edit Working Library Dialog Box for correct powers and other entries Power can be imported from a text file or entered manually Now you can run the analysis and check the results 8 HyperLynx Thermal User Manual V9 0 Getting Started with HyperLynx Thermal HyperLynx Thermal Basics Starting HyperLynx Thermal You can create your own design from scratch open an existing design or import a design from an ECAD interface Once you save your design inside HyperLynx Thermal it will have a HLT extension e To open an existing HLT design choose File gt Open e Toimport a board that was created in another environment choose File gt Import gt IDF Interface see Importing a Design on page 19 To create a board from scratch choose File gt New see Creating a New Board on page 14 HyperLynx Thermal User Manual V9 0 Getting Started with HyperLynx Thermal HyperLynx Thermal Basics Navigating HyperLynx Thermal This example goes through the basic usage of HyperLynx Thermal 1 Open HyperLynx Thermal 2 Choose File Open and open a board if
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36. TAjc Junction to Casing Thermal Resistance Metal Volume Fraction in Boards Air Flow Temperature at Boundary etc HyperLynx Thermal User Manual V9 0 17 Getting Started with HyperLynx Thermal Tips on using HyperLynx Thermal 3 Make sure all components are placed inside the board outline For details regarding what occurs when components are placed outside the board outline see Analysis of Components Placed Outside the Board Outline 4 Review the Advanced Modeling chapter to see if you handled design variations correctly 5 Be sure to glance over the parameters for your main components in the Working Library see the Working Library Dialog Box on page 81 to make sure everything is correct e Verify the pin number and dimensions for your hot components 6 Periodically save your file while working on it 18 HyperLynx Thermal User Manual V9 0 Chapter 2 Importing and Setting up a Board This section contains the following topics The Expedition PCB Interface to HyperLynx Thermal on page 19 Importing a Design on page 19 Preparing an Interfaced Case for Analysis on page 20 Importing a Power file on page 21 The Expedition PCB Interface to HyperLynx Thermal You can export designs directly from Expedition PCB to HyperLynx Thermal The Expedition PCB interface to HyperLynx Thermal is embedded in the Expedition software No additional files are necessary 1 From Expedition open the printed ci
37. a heat pipe on the board See Heat pipe on page 38 65 HyperLynx Thermal Menus Environment Menu Table 10 5 Placement Menu Contents Menu Item Desciption Shift Components Opens the Shift Components Definition dialog box Use to shift all of the components in the x or y direction while maintaining the orientation of the components Enter a positive number in the x direction to move the components to the right Enter a negative number in the x direction will move the components to the left Enter a positive number in the y direction to move the components up Enter a negative number in the y direction to move the components down Note If you shift components outside the board outline they will not contribute to the analysis Environment Menu Use the Environment menu to define boundary and environment conditions for the board Table 10 6 Environment Menu Contents Menu Item Desciption Boundary Opens the Boundary Condition Definition Dialog Box B Use this to define thermal boundary conditions on the edges of your board Condition Opens the Environment Condition Definition Dialog E Box Use this to define environment conditions for the board 66 HyperLynx Thermal User Manual V9 0 Analyze Menu HyperLynx Thermal Menus Analyze Menu Use the analyze menu to perform your thermal analysis and review the results Table 10 7 Analyze Menu Contents Menu Item Desciption Selecting RUN
38. air coolings Height The height of a component after installed on the board DZ Humidity Ratio The relative humidity a value between 0 0 and 1 0 Note that 1 0 represents total saturation of water vapor or steam Import The ability to bring in either the design from your CAD placement software or the power dissipation from an external ASCII file by component name and or reference designator 92 HyperLynx Thermal User Manual V9 0 Glossary of Terms Incoming Air Temperature or initial temperature of iteration The temperature of the approaching air for an open system For a closed system this is the temperature that the board temperature iteration will start from It is desirable to have this initial value close to the averaged temperature of the board after analysis that high accuracy is ensured This could be set through a couple of iteration of analysis This value is expressed in degrees Centigrade The minimum recommended value is 20 C Incoming Air Velocity Velocity of the incoming forced air generally expressed in ft min If there is no induced airflow i e natural convection the value for this parameter is zero For reliable results conventional values not far beyond 900 ft min are recommended Initial temperature of iteration or incoming air temperature See Incoming Air Temperature or initial temperature of iteration Junction Temperature Limit The limiting temperature set for the junctions of a component If th
39. all Card Guide Width The width of the card guide if any attached to the bottom and top edges of the board If no such crossbar exists set this value to the thickness of the board HyperLynx Thermal User Manual V9 0 89 Glossary of Terms Casing Temperature Limit The limiting temperature of the component casing beyond which the Temperature Excess Display will show the warning colors Class The class refers to the specific configuration of a type of package DIP Through hole is made up of components whose pins are located at two opposite sides and go through the thickness of the board Any component with pins which appear on all four sides or on the bottom of the component belongs to one of the next several SMD classes SMD Long Leads is for components with pins on four sides with these long pins stop on the surface of the board and these pins are exposed to air convection For SMD classes if the component is rectangular in shape the longer sides are normally set as the North South sides SMD Medium leads is for components similar to SMD Long Leads but whose pin surfaces are only partially exposed to the air convection This includes surface mount components with short leads SMD Leadless is made up of components whose pins are along the four side but not exposed or are only slightly exposed to air convection This includes leadless surface mount components and metal capped vertically oriented components whose pins are locate
40. alue will be a default Note You can not specify different power dissipation values for the same type of part Each instance of a particular part may have a different power dissipation To modify the power dissipation for an instance of a part enter an Input power scaling factor for the part The actual power dissipation for an instance of a part is equal to the power dissipation assigned in the part library multiplied by the input power scaling factor that is assigned for a specific instance of that part HyperLynx Thermal User Manual V9 0 79 HyperLynx Thermal Dialog Boxes Edit Part Dialog Box 80 Table 11 6 Edit Part Dialog Box Contents Parameter Junction to casing thermal resistance Description Also known as THETAjc value this is the thermal resistance between the IC junction and the component casing in degC Watt This value is very dependent upon the testing method used The present THETAjc values in the library are derived from the Semi Therm Proceedings TI and Signetics DataBooks etc If unknown set to 0 0 This is not the junction to ambient resistance Sink to air thermal resistance Q 3ft s The heat sink to air thermal resistance measured in C Watt This value is a function of heat sink design and of air speed Enter the value at 3 ft s air velocities In the analysis the adequate values at local air velocity will be evaluated automatically Sink to air thermal resistance 10ft s
41. ance requires access and who are under obligations of confidentiality You shall take appropriate action to protect the confidentiality of Software and ensure that any person permitted access to Software does not disclose it or use it except as permitted by this Agreement Except as otherwise permitted for purposes of interoperability as specified by applicable and mandatory local law you shall not reverse assemble reverse compile reverse engineer or in any way derive from Software any source code You may not sublicense assign or otherwise transfer Software this Agreement or the rights under it whether by operation of law or otherwise attempted transfer without Mentor Graphics prior written consent and payment of Mentor Graphics then current applicable transfer charges Any attempted transfer without Mentor Graphics prior written consent shall be a material breach of this Agreement and may at Mentor Graphics option result in the immediate termination of the Agreement and licenses granted under this Agreement The terms of this Agreement including without limitation the licensing and assignment provisions shall be binding upon your successors in interest and assigns The provisions of this section 4 shall survive the termination or expiration of this Agreement LIMITED WARRANTY 5 1 Mentor Graphics warrants that during the warranty period Software when properly installed will substantially conform to the functional specifications set for
42. and conductivities of many commonly used components The library can be expanded infinitely Table 11 5 Edit Material Library Contents Parameter Description This command allows you to add a material to the material library When selected you will be prompted for the name of the new material and the conductivity of that material Then select OK Any new materials will only be saved if Save to library Disk is selected This library can be expanded indefinitely This command allows you to edit any material that already exists in the material library Highlight the material that you would like to make changes to and select Edit Make the desired changes and select OK The changes will only be saved if Save to library Disk is selected The Remove command allows you to eliminate any entry from the material library Highlight the material that you wish to delete and select Remove You will be asked to confirm that you wish to remove that item Click OK and the material will be deleted The material will only be permanently deleted if you choose the Save to library Disk command Save to library DISK HyperLynx Thermal User Manual V9 0 This command saves any changes that you have made in the material library If you wish to make any changes that you made permanent you must use this command before you close HyperLynx Thermal This command is initiated by clicking on Save to library Disk The material library
43. ant Parameters are HyperLynx Thermal User Manual V9 0 15 Getting Started with HyperLynx Thermal Preparing a Board for Thermal Analysis Incoming Air Temperature open or Initial Temperature of Iteration close For an open system this is the incoming air temperature For closed system this is the initial temperature of the iteration If an analysis gives a result the averaged temperature of board can be estimated To ensure a better result user should set the initial iteration temperature the same as the evaluated average board temperature such that effective convergence will occur e Air Pressure amp Gravity usually default value are sufficient e Accuracy control should always be set to 01 or lower 001 e Air comes from direction the airflow is coming from e Board Location In rack with boards on both sides single board casing walls on both sides or right left of rack board on one side and case wall on the other e Board Placed Horizontal or Vertical orientation e System either open air flow or closed no air flow e Board Spacing spacing to adjacent board or case wall on either side of the board e Adjacent board emissivities the emissivities of the adjacent boards or walls are important for radiation heat transfer Low values 0 1 0 3 for polished metals higher values 0 6 0 9 for organic surfaces and the oxidized metal surface is close to organic materials e Adjacent board power
44. ard file and a library file See Importing a Design on page 19 Select Power and Th Resist to import a text file that specifies power dissipation of each component See Importing a Power file on page 21 Select to print the screen Print Preview Exit Select to close HyperLynx Thermal 56 HyperLynx Thermal User Manual V9 0 View Menu HyperLynx Thermal Menus View Menu Table 10 2 View Menu Contents Menu Item Side e Select Front to view and define properties for the front side of the board Select Back to view and define properties for the back side of the board Select Layer move to the right and select a Layer number This lets you choose which layer you are currently viewing and defining properties for This command is mainly used when you work on the Board Local Property menu After using the Local Property menu you may click the layer to reset the display or press the ESC key to reset Redraw Select to refresh the screen and clean things up Reset Select to return to the last saved view Select to zoom in or out To zoom in click the mouse on the lower right corner of the area that you would like to zoom into then drag to the upper left corner and release You can zoom in as many times as you wish To zoom out click the mouse on the upper left corner of the area that you would like to zoom out of then drag to the lower right corner and release
45. at pipe menu Select a heat pipe from the pull down working library on the tool bar Drag your mouse to the area on the board where you would you re your heat pipe to be placed A window will pop up allowing you to assign a reference designator name up to 5 characters long To place a heat pipe on the Back Side of the board you must first go to View Back side then place the heat pipe in the same manner described above Modeling a heat pipe For a heat pipe the most important parameters are the physical size of the heat pipe and the air gap amp gap conductivity Our program assumes the heat pipe to be similar to a perfect conductor The part should be built in the library then placed in the correct location on the board The heat pipe will easily carry the heat to another location Parameter definitions the bold parameters are most critical Notice that many of the parameters are not used and grayed out 38 HyperLynx Thermal User Manual V9 0 Advanced Modeling Decreasing the Thermal Output of a Component Class Must select heatpipe which is the part definition 2 Length Length or dimension in X direction 3 Width Width or dimension in Y direction 4 Height The total height of the heatpipe when attached to the board 5 Air gap The distance between the heatpipe and the board usually there if a filler material thermal epoxy or adhesive used to attach the heatpipe to the board 6 Power Usually set
46. at you created and click Open 8 The power dissipations should be entered to update each component 22 HyperLynx Thermal User Manual V9 0 Chapter 3 Library Names Units and Files This section contains the following topics Component Naming Guidelines on page 23 Units on page 26 Files on page 27 Component Naming Guidelines The total capacity of the Master library is unlimited and there are already 2 500 components provided Notice all names are not Case sensitive All Upper Cases Followings are the standard naming guidelines Typical JDEC name are used in Library Package Types Although there could be thousands of components used in your design there are only a few hundred component shapes DEFAULT The default shape geometry CBGA The ceramic Ball Grid Array CDIP Ceramic Dual In line Package CLCC Ceramic Leadless Chip Carrier CLDCC Ceramic Leaded Chip Carrier CPGA Ceramic Pin Grid Array PDIP Plastic Dual In line Package HyperLynx Thermal User Manual V9 0 23 Library Names Units and Files Component Naming Guidelines PLCC Plastic Leadless Chip Carrier PPGA Plastic Pin Grid Array PQFP Plastic Quad Flat Pack Rxxx Resistor through hole xxx Watt SIP Single In line Package SO Small Outline package TO xxx TO package of metal caps Part Name Suffixes JDEC names are used generally Component names have all upper case letters no differentiation of upper o
47. ay from the board eventually The coordinates of the boundary condition sink temperature and the thermal resistance all need to be set here For more information see Specifying Boundary Conditions on page 72 If you are modeling an open system you may not need to specify boundary conditions Performing Thermal Analysis and Reviewing the Results 1 Toanalyze the board choose Analyze Run or click al After the analysis completes the board becomes colored to show board temperature and a color scale displays on the left hand side of the screen To manually display the temperature at each location on the board choose View gt Board Temperature or click 14 2 To display the power of each component choose View Power or click m The color scale will change to reflect Power 3 To view the temperature for each component choose View Component Temperature 4 To view the numerical analysis results choose Analyze Numerical output Note 9 For a complete list of analysis options see View Menu on page 57 For a list of modeling techniques that you can apply to decrease the thermal output of your board see Advanced Modeling on page 33 Tips on using HyperLynx Thermal 1 Be sure to look through the HyperLynx Thermal Menus HyperLynx Thermal Dialog Boxes and Critical Parameters chapters in the documentation if you have any trouble 2 Pay attention to the critical parameters such as Power Dissipation THE
48. brary The material library is also accessible from several screens that require conductivity information of materials To close the working library click OK Choose Board Property This opens the Board Property Definition Dialog Box The Board Property Definition dialog box allows you to change layer thicknesses and conductivities of your board Choosing Board Local Property lets you create areas of greater metal volume such as with thermal vias on a per layer basis Choosing Board Cut out or Trim corner let you change the shape of the board Click OK Click the Placement menu You will notice that this allows for the placement of components on the board as well as heat sinks heat pipes and screws which can be selected from the drop down box in the toolbar To move a placed component click on the component hold down the mouse button and drag the component to a new location Right click a component in the board This opens the Component Properties Dialog Box The component reference designator part name location power and temperature are all listed in the component information You can edit the part model for a component on the fly in the component info section by clicking Edit this part From the Component Properties dialog box click Edit this part In the Edit part dialog box all the dimensions and thermal properties of the component are listed and can be edited To close both dialog boxes click OK Cho
49. ce at Edge 3 2 Boundary Condition Mixed Units Cin W Units SI Units Cmm W Temp of Sink Conversion of Units 1F NF mm m s m s mHg mHg W m W m 1 W mC 1 W mC 26 E 5 0 9 0 C N 32 0 5 0 9 0 C 0 03937 inch 1000 mm s 196 8 ft min 1000 mmHg 1 32 atm 0 001 W mm 1 0403 BTU hrft 0 001 W mmC 0 0254 W inC C HyperLynx Thermal User Manual V9 0 Library Names Units and Files Files Files For you to check or maintain your files the following are the suffixes to your file names HLT output file for HyperLynx Thermal HYP input file for importing stackup and board copper traces and planes information optional INP input file of component placement optional old format GRF output file of graphical output OUT output file of numerical output for records PWR power import text file optional LOC output file of Refined components if exists RVW output file that displays the iterations of the analysis This file is useful in reading the error message should your analysis crash Note For backwards compatibility HyperLynx Thermal supports the INP INL INB and ANT file formats HyperLynx Thermal User Manual V9 0 27 Library Names Units and Files Files 28 HyperLynx Thermal User Manual V9 0 Chapter 4 Critical Parameters There are several parameters that can drastically effect results please g
50. checkbox Tip When the analysis is run you may look into the numerical output to view detailed information regarding the daughter board 5 Enter the following parameter values in the Component Properties dialog box a Class Must select Daughter Board when modeling a daughter board b Length Length or dimension of daughter board in X direction c Width Width or dimension of daughter board in Y direction d Number of pins depends on how the daughter board is attached e Air gap distance from top of mother board to bottom of daughter board f Power The sum of the powers of each component on the daughter board g Sink to air thermal resistance 3ft s set to zero h Sink to air thermal resistance 2 10ft s set to zero 40 HyperLynx Thermal User Manual V9 0 Advanced Modeling Metal Core or Thick Ground Plane in Boards i Gap conductivity set to zero Modeling Perpendicular Daughter Boards Daughter boards consisting of many components and attached to the mother board perpendicularly can first be modeled as one component The size of the daughter board including component heights and total power will be used for this representative component The number of pins and pin dimensions will represent how the daughter board is attached to the mother board Also the Refined option will be used The analysis will produce a report in LOC file for the local environment of this component Finally the daughter board is analyzed
51. cific refined output in the oc file Click ua This shows the component temperature Click Fal This shows the excess component temperature the amount by which the component is exceeding its maximum temperature Click qj This shows a thermal map of the temperature of the board Click 52 This shows the thermal gradients on the board This view is especially useful for locating stress points in the board which can lead to board warpage or cracking Choose Library Master This opens the Master Library The master library contains thousands of components with their pertinent parameters You can add new components by parameter The Copy command allows you to copy a component under a different name while keeping the same parameters and Edit lets you change the parameters Save to disk saves your updated library on the hard drive To close the Master Library click OK Choose Library Working HyperLynx Thermal User Manual V9 0 11 Getting Started with HyperLynx Thermal HyperLynx Thermal Basics 12 17 18 19 20 21 22 23 24 25 The working library contains the components on your board and operates like the master library They fully interact together and you can shuffle components back and forth between them Update from Master matches your board s components with similar ones in the master library and sets their parameters accordingly The conductivity of most materials is stored in the material li
52. d gravity are specified in the Environment Condition Definition Dialog Box Environment gt Condition menu For a space board the air pressure and gravity should both be set to 0 Air should come from the Bottom Component Details The emissivities of components the air gap use of conduction pads and pin dimensions must be set carefully in the Working Library It is very important to set the correct pin geometries and conductivity when dealing with closed systems Board Structure The emissivity of the board is specified in the Environment Condition Definition Dialog Box Environment gt Condition menu If the board has a sandwiched aluminum core please consider it as the 2nd layers in the Board Property menu Usually the Aluminum core can be the layer 2 If there are metal strips at particular locations on the board use the Board Local Property menu to set it Others The critical parameters stated before Metal Volume Fraction in Boards Power THETAjc Junction to Casing Thermal Resistance etc should also be specified carefully Computer Instrumentation Applications The computer and instrumentation industries deal mainly with high power and tight packaging Considerations are Heat Sink or Chip Fan on page 44 Adjacent Boards Walls on page 45 Short Cut for Large Boards on page 45 Heat Sink or Chip Fan For a few very high power components heat sink or chip fan can be installed Heat
53. d on the bottom of the component This class also includes all surface mount resistors and capacitors SMD Small Outline is made up of surface mount components whose leads are located on two opposite sides only BGA is for all ball grid array or pin grid array components whose pins are in the area under the components Screw is for thermal screws which are attached to the board and a heat sink Heat sink is for heat sinks mounted on a component with convective air coolings Heat pipe is for all heat pipes Daughter Board is for all parallel or perpendicular daughter boards Components at front channel This parameter indicates if the airflow channel at the front side has packages on only one wall or both walls If it is One Side the front side of the board faces the backside of the adjacent board which has no components Otherwise this parameter is Both Sides which means that components are also present on the backside of the left adjacent board Conductivity of metal at a layer This is the thermal conductivity of the metals in the wires or ground power planes on the board at this layer When there are 3 layers this value is either for layer 1 and 3 or for layer 2 For copper a good value for this parameter is 227 Btu hrftF or 393 W mC For Aluminum it is 125 Btu hrftF or 216 W mC Please see the Material Library for more conductivity values 90 HyperLynx Thermal User Manual V9 0 Glossary of Terms Conductivity of non metals at
54. e Working Library and click gt gt to bring them over to the working library e To add your own components click Add by parameters and enter the parameters directly 4 You have a board and components now the components need to be placed on the board To place a component pick a component from working library toolbar choose Placement Component and place with the left mouse button or by entering coordinates directly N te eee You can add components heat sinks thermal screws and heat pipes from the Placement Menu You can place the object anywhere you like or as many times as you like 5 To add components to the back side of the board from the View Menu choose Side gt Back Side and add components 6 When finished choose File gt SAVE AS and name your board Related Topics Preparing a Board for Thermal Analysis on page 15 Performing Thermal Analysis and Reviewing the Results on page 17 14 HyperLynx Thermal User Manual V9 0 Getting Started with HyperLynx Thermal Preparing a Board for Thermal Analysis Preparing a Board for Thermal Analysis To prepare you board for thermal analysis you must specify board properties setup the operating environment specify boundary conditions and review components in the working library for correct powers and other properties To configure a board for thermal analysis 1 Open the board 2 Set your Units and temperature Scale from the File menu For more
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56. ective height of heat sink is only used to evaluate its influence to the airflow Effective Height This is the effective height of heat sink to the airflow The value will be a percent in decimal form with 1 being total blockage and 0 being no blockage For extruded fins set perpendicular to the airflow that all the air is blocked this is the total height The value will be 100 If the extruded fins are parallel to airflow this value is usually about 5096 if wide spacing of fins occurs For example in a pin fin with a staggered array this is close to 100 For an in line array and parallel to flow 8096 15 a good approximation Em This is the surface emissivity of this component a value between 0 0 and 1 0 Emissivity of this board The emissivity of the board surface not considering the components For organic boards it is usually between 0 5 and 0 9 Gap See Air Gap Gap Conductivity When conduction pads or paste are inserted into the gap beneath the component this is the conductivity of the conduction pads or paste Gravity Gravity at this location a value between 0 and 20 can be considered For space it is 0 For rocket launching it could be as high as 20 Gravity is assumed in vertical downward direction in the program Grid The screen in which the intersections of mesh lines are identified Heat pipe Classification for all heat pipes Heat sink Classification for all heat sinks mounted on a component with convective
57. ermal Modeling Reliability Background Reliability Background Two major objectives of electronic designs are the functionality of the system and the reliability of the operations Electronic reliability depends upon various factors but the most influential one is the I C temperature The component failure rate increases exponentially with the increase of junction temperatures Reliability is a statistical quantity Its measurements are based upon the failure rate number of failures per million hours for components or mean time between failure hours for a board or a system analysis indicates where the reliability is a problem however thermal analysis reveals the means to reduce the temperature at the problem locations You need both to do good design work For further details please review the MIL HDBK 217E Handbook Interfacing a HyperLynx Thermal file into RELEX Reliability Software RELEX Reliability software has the ability to bring in junction temperatures from a HyperLynx Thermal output file To begin a RELEX project and a HyperLynx Thermal project should be created both of which having the same reference designator names 1 Run the HyperLynx Thermal analysis so that temperature results are achieved 2 Open Windows Explorer and go to the directory in which your HyperLynx Thermal file resides 3 Double click on XXXXX out where XXXXX is your HyperLynx Thermal filename Anyone using RELEX version 7 5 or earlier
58. esignator The ability to locate a particular component on a board by its unique reference designator Shift all Components in a direction To Shift all the current components on the board in the x or y direction by a specified amount Positive value means moving in the positive x or y direction SI Standard International Units similar to Metric Units Sink to Air Thermal Resistance The heat sink to air thermal resistance measured in C Watt This value is a function of heat sink design and of air speed Usually users enter the values at 3 ft s and 10 ft sec air velocities In the analysis the adequate values at local air velocity will be evaluated automatically SMD Long Leads Classification for components with pins on four sides with the surfaces of these pins exposed to air convection For SMD classes if the component is rectangular in shape the longer sides are normally set as the North South sides SMD Medium leads Classification for components similar to SMD Long Leads but whose pin surfaces are only partially exposed to the air convection This includes surface mount components with short leads HyperLynx Thermal User Manual 95 Glossary of Terms SMD Leadless Classification for components whose pins are not exposed or are only slightly exposed to air convection This includes BGA PGA leadless surface mount components and metal capped vertically oriented components whose pins are located on the bottom of the component Th
59. g means 1 Conduction through the pins legs of the component and the air gap between the component and the board 2 Convection to the air from the surfaces of component and the pins and 3 Radiative transfer to adjacent boards if they are colder than the component An equilibrium temperature of the component is eventually reached such that the rate of heat generation equals the overall rate at which heat leaves the component Heat is conducted in an electronic board through the mixture of metal wire and material of which the board is made When many components are found on a board the heat transfer interaction between them becomes very complicated For example a component with little power dissipation which is located near a very hot component may receive conducted heat from the hot component through the board and may release this heat to the air through convection In analyzing heat transfer and interaction in PCB s it is important to realize that the board also eventually releases this heat to the air by convection On a board the heat convection of a component is very dependent upon the thermal characteristics of the components near it and in its upstream area of airflow If the upstream components are tall and hot any components located in the hot wake of that component will be difficult to cool Three dimensional effects such as these have been fully modeled in this program 48 HyperLynx Thermal User Manual V9 0 Background on Th
60. h to define 84 HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Dialog Boxes Thermal Via Definition Dialog Box 4 Move the mouse to the lower right corner of the local property to complete the area 5 Click the mouse again a window will pop up asking for the local metal volume fraction this value will override the nominal metal volume fraction specified in the Board gt Property menu for the whole board and the Kx Ky ratio of conductivity You may also specify if the local area is round in this area If you have multiple local properties on top of one another the uppermost local property will always prevail If there are locally embedded thermal vias see the Thermal Via Definition Dialog Box on page 85 To exit the Local Property command click ESC on the keyboard or go to View Layer and choose the layer you are viewing Thermal Via Definition Dialog Box Calculates the metal volume fraction in an area containing thermal vias Access by selecting Board Thermal Via and selecting an area on the board Table 11 10 Thermal Via Definition Dialog Box Contents Parameter Location X Description Left point of selected area X 0 at left edge of the board X Bottom point of selected area Y 0 at bottom of the board Local property is round Select to specify a round region and then enter the diameter of the region Length DX Width DY If you did not select Local property is ro
61. iative emissivity a value between 0 0 and 1 0 for the adjacent board Low values 0 1 0 3 for polished metal surface higher values 0 6 0 9 for organic surfaces and the oxidized metal surface is close to the organic materials Conformal coating is an organic surface Adjacent Board Power Dissipation If the adjacent is a board its power dissipation in watt should be given Air Comes From The convective air coming from a side of board Air Gap The gap between the bottom of the package and the board Air Pressure The air pressure based on a pressure of 1 atmosphere at sea level This value is expressed in terms of atmospheres atm For satellite use p is 0 0 A small value can be assigned at high elevations for avionic electronics Analysis Accuracy Control This is the iteration accuracy in degrees Celsius BGA Classification for all ball grid array or pin grid array components Board Location To identify if a board is inside of a rack in which both sides face other boards or at the left of the rack where the left side faces a wall and the right side faces a board or at the right of a rack single board which faces walls at both sides Board Placed The board is placed horizontally or vertically with respect to the gravity The gravity is vertically down Board Spacing The distance between this board and the adjacent boards or walls This is measured from the surface of this board to the surface of the adjacent board w
62. ich is the input in this dialog box HyperLynx Thermal User Manual V9 0 73 HyperLynx Thermal Dialog Boxes Component Properties Dialog Box Component Properties Dialog Box Access Right click component and choose Properties Use to view and modify component information See also Analysis of Components Placed Outside the Board Outline on page 75 Table 11 3 Component Properties Dialog Box Contents Parameter Description General Information Reference designator Enter a unique ID for the part Part name Select the name of the part you want to use Edit this part Opens the Edit Part Dialog Box Placement and Visualization Left point of component X 0 at left edge of the board Bottom point of component Y 0 at bottom of the board On Front Side On Back Side Select to specify which side of the board the component is placed on Refined output Select to create additional output data For refined components the data that will appear in the xxxx loc file is as follows local temperatures of the gas component and board the air gap and the heat transfer coefficients for each side of this component Angle Specify a rotation angle in degrees 0 is equivalent to no rotation Thermal characteristics Component temperature Displays the temperature of the component Junction temperature Displays the temperature at the junction Default
63. iew HyperLynx Thermal performs a detailed analysis of the air convection from the pins and the thermal conduction through component sides pins and the bottom air gap to the board Flow conditions used can be forced or can be by natural convection The natural convective flow is always calculated In all cases the total flow velocity is the combined result of natural convective flow and the forced flow The board is very important in conducting heat among components and to the air The heat transfer properties of the board are evaluated by considering all of the layers of materials across the board thickness The layers considered are the copper wires and the base board material which may be epoxy or some other similar material Environment conditions must be controlled to perform an accurate thermal analysis of a PCB design The air velocity air inlet temperature and board to board spacing all influence the thermal performance of a designed board significantly You may change these environment conditions to achieve the desired results Stand Alone Use HyperLynx Thermal can be used without an imported board You can make your own board and place your own components about the board Boards with 20 to 30 components take very little time at all For some more in depth explanation and hands on demonstrations see Creating a New Board on page 14 Use With Interfaced File You can import a board from an external interface from the File
64. ile 15 of a free format 2 Power can be imported using the component partname and or the reference designator The first line of the text document should read Component Click Enter or you can leave a space then put your own note following the word Component on this first line 3 Thelines following the Component line should have the component partname followed by the power dissipation in watts Each component should have its own line After you have entered every component click Enter The power of these components will come into the Working Library of this board when the file is imported Note Components of the same part type must have the same power dissipation 4 You may now enter power by reference designator The first line following the partnames should read Reference Again you may add your own comments on the remainder of this line 5 Each line after that should contain the reference designator followed by its power in watts This information will come into the power factor of each component with respect to the nominal power stated in the Working Library Here is an example of how your text file should look Component 4077B 100 74150DW 5 7476 2 R1 4W 50 Reference B1 100 Gl 100 Kl 100 MI 100 HyperLynx Thermal User Manual V9 0 21 Importing and Setting up a Board Importing a Power file RI 100 100 6 Once the text file is complete choose File Import Power read in 7 Locate the file th
65. imension in Y direction Height The total height of the heat sink alone Number of Pins Not a relevant number but use a high number to ensure good contact Pin thermal conductivity Pin thickness Pin width pin Length Leave as defaults pL og eA oe ps Air gap should be set to about zero with a conductive material between the heat sink and the component 99 Power should be set to Zero 9 Sink to air thermal resistance 3ft s Value taken from heatsink data sheet in degree C W 10 Sink to air thermal resistance 10ft s Taken from data sheet in degree C W 1 Radiative Emissivity Not important leave as default or use 1 for polished metal Effective height fraction of DZ A value between 0 0 amp 1 0 based upon what type of heatsink is used This value estimates the amount of blockage the heatsink will have on the air stream A minimum number of 0 5 should be assigned For full blockage in the airflow direction set this to 1 0 For extruded fins aligned with the air flow set to 0 5 HyperLynx Thermal User Manual V9 0 35 Advanced Modeling Decreasing the Thermal Output of a Component Heat sink standing alone or with components mounted on the sink When several components are mounted on one large heat sink it is usually true that the heat sink will have a rather uniform temperature due to its effective heat spreading capability In this situation you will model this with in terms of one heat sink The
66. in depth information see the File Menu on page 55 Note ______________________________________________________________ The bottom right of the screen shows the x and y coordinates for the location at the tip of the arrow the number of components on that side of the board and the total power dissipation for this side of the board 3 Choose Board Property or right click anywhere on the board This opens the Board Property Definition Dialog Box Define the following e Maximum board dimensions e Thickness of layers e Conductivity of layers Metal volume fraction see Metal Volume Fraction in Boards on page 29 e Default component casing limit e Default component junction limit OEE ae You can also specify board information for each layer by choosing a layer from the View menu View gt Layer gt Layer and choosing Board gt Property Then choose the layer you are defining properties for from the Layer pull down menu in the Board Property Definition Dialog Box 4 For each component right click to open the Component Properties Dialog Box and specify component properties Note that to modify the power dissipation for a placed component you must specify an Input power scaling factor 5 To setup the operating environment choose Environment gt Condition or click E This opens the Environment Condition Definition Dialog Box There are many different set up options for the environment conditions The import
67. ions of ambient air and affect modeling of air temperature distribution and conductive and convective heat flux to air Analysis Parameters affect the iteration process of the solver and the precision of it s final result Casing Parameters describe two things board placement relative to adjacent boards airflow gravity vector etc and thermal parameters of the board environment power dissipation of adjacent boards temperature of the walls etcetera Table 11 8 Environment Condition Definition Dialog Box Contents Parameter Description Environment Conditions Parameters Incoming Air Temperature open Initial Temp of Iteration closed This is the temperature of the airflow before arriving at the board surface For open system this is the incoming air temperature For closed system this is the initial temperature of the iteration If an analysis gives a result the averaged temperature of board can be estimated To ensure a better result user should set the initial iteration temperature the same as the evaluated average board temperature such that effective convergence will occur Air pressure The air pressure at the location you will use the board At earths surface the default air pressure of latm should be fine Gravity The gravity for the location the board will be placed Humidity ratio The percent humidity of the environment where you will place the board 1 0 means fully saturated a
68. ip Fan sis pcan Dadar a a3 Ab bade 44 Adjacent Boards Walls Pod wags 45 Short Cut for Large Boards alor ee ON RE ex eae ewes 45 Telecom Industrial Control Applications 0 0 cece eee ee 45 Natural Convective Cooling oes dac dae AG RENE 45 Power Supplies Automotive Applications 45 High Current Traces on the Board 25s uses SERE Tet 45 Chapter 7 Background on Thermal Modeling cc ccc cece cece cece cece enhn 47 Heat Transfer Background asp we e aic Ra eae PSE Shee VR hes 47 Conduction eT m 47 oni ci I 47 ERGO d eeu ULP REA eEx D eon RUE E axes aa een betes esce 48 Heat Transfer On Electronic Boards 22s ener RES RR Ree RR 48 Reliability Background 25 0 4 yer ey oak eed RU NAM 49 Interfacing a HyperLynx Thermal file into RELEX Reliability Software 49 Chapter 8 Troubleshooting and Technical Support ccc cece cece 51 Technical Suppor 2464 205 rep dick oes 64555 ee xe d uds Bae eee YER Eee ewe 51 4 HyperLynx Thermal User Manual V9 0 Table of Contents Chapter 9 Program Specifications and Requirements ccc cece cece cece cere eeees 53 Package
69. ir It affects air density and hence affects many aspects of airflow modeling Incoming air velocity Velocity of air before reaching the board surface This parameter is very important in a commercial type of application for open systems cooled with airflow If the systems are sealed closed there will be no airflow and this setting should be 0 0 Air comes from The direction the airflow is coming from Analysis Parameters Analysis accuracy control deg C Set to 01 or lower 001 82 HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Dialog Boxes Environment Condition Definition Dialog Box Table 11 8 Environment Condition Definition Dialog Box Contents Parameter Description Casing Parameters Board location The board location In rack with boards on both sides e Single board casing walls on both sides e Right left of rack board on one side and case wall on the other Card guide width The width of the incoming airflow in the direction orthogonal to board s surface Comp at front channel Specifies how many adjacent boards are have components placed on the side facing your board Board placed The placement orientation of the board Horizontal e Vertical Emissivity of this board The emissivity of the board This parameter is related to the radiative heat flux According to the Stefan Boltzmann law body having a temperature T is radiating follo
70. ir temperature in the Environment Condition Definition Dialog Box A typical ratio of heat flow by direct convection to air conduction to the board and radiation to surroundings is 70 to 25 to 5 When only the natural convection occurs this ratio may typically HyperLynx Thermal User Manual V9 0 29 Critical Parameters Power Dissipation be 40 to 40 to 20 For conduction to board edges the major inputs are the sink temperature and thermal resistance between the sink and the board edge in the Boundary Condition Definition Dialog Box For a closed system if there are no specifications of edge cooling or thermal screw cooling the only heat released will be radiation In this case the board could be excessively hot Therefore it is important to specify the cooling path for a closed system Power Dissipation The power dissipation of two types of components is the most critical They are the ones with high power and those of small sizes The former ones give off much heat and could be very hot the latter ones have high power per surface area and also can be very hot If electronic simulation is made on the board the accurate power can be obtained easily It is desirable to import the power of components through File Import menu with a text file generated by user Otherwise estimated maximum power can be made through the Edit Master Library Dialog Box data book or by experience For large boards it is reasonable to only find accurate powe
71. is class also includes all SMD resistors and capacitors which have their longer sides set to two sides of the component SMD Small Outline Classification for surface mount components whose leads are only located on two opposite sides System This environment parameter indicates whether the system is open to allow for air convection For closed sealed systems you should be aware that some cooling boundary conditions should be set at the edges of the board If no cooling boundary conditions are set the board will have only radiative cooling and will be very hot Temperature at end The temperature set at the other end of the thermal screw Temperature Coefficient On the traces the electric conductivity varies with the temperature Therefore the power is also changed when the temperature is changed The temperature coefficient is the one for the electric resistance or power at constant current as temperature changes Temperature of Casing Wall The temperature of the wall of the system casing Temperature of Sink at Edge The temperature of the heat sink connected by the wedge lock to the edge of the board Thermal Resistance of Wedge Lock The wedge lock applied to the edge of board has a thermal resistance between the edge of the board and the heat sink The typical unit is C mm Watt See Thermal resistance of wedge lock at edge for more details Thickness of Layer This is the thickness of this physical layer of the board Notice that
72. is limit is exceeded it will be displayed in the Excess Temp screen This may be specified in the Board Property menu for default of all components or may be set uniquely to particular components in the Library Working menu Junction to Casing Thermal Resistance Also known as THETAjc value this is the junction to casing thermal resistance for the component or package measured in C Watt This is not the junction to ambient resistance See THETAjc Junction to Casing Thermal Resistance Kair Conductivity of the air Kpin Conductivity of the pin material Kx Ky The ratio of board conductivity in the X direction to that of board conductivity in the Y direction in a local zone You can determine a correct setting for this value by imagining that you are drawing a square on the board at this location For example if two times as many wires run in the East West direction of this imaginary square than run in the North South direction the value could be 2 0 Length The length of the component DX Maximum Board Length Width The maximum length of a board in the x direction or width in the y direction Mixed Mixed units of English and Metric are used However the watt and C are always used in all the cases HyperLynx Thermal User Manual 93 Glossary of Terms Metal Volume Fraction A value of averaged volumetric fraction of metal in the board or at a particular location This is the fraction by volume of the metal in the
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74. letion and destruction of Software including all copies to Mentor Graphics reasonable satisfaction EXPORT Software is subject to regulation by local laws and United States government agencies which prohibit export or diversion of certain products information about the products and direct products of the products to certain countries and certain persons You agree that you will not export any Software or direct product of Software in any manner without first obtaining all necessary approval from appropriate local and United States government agencies RESTRICTED RIGHTS NOTICE Software was developed entirely at private expense and is commercial computer software provided with RESTRICTED RIGHTS Use duplication or disclosure by the U S Government or a U S Government subcontractor is subject to the restrictions set forth in the license agreement under which Software was obtained pursuant to DFARS 227 7202 3 a or as set forth in subparagraphs c 1 and 2 of the Commercial Computer Software Restricted Rights clause at FAR 52 227 19 as applicable Contractor manufacturer is Mentor Graphics Corporation 8005 SW Boeckman Road Wilsonville Oregon 97070 7777 USA THIRD PARTY BENEFICIARY For any Software under this Agreement licensed by Mentor Graphics from Microsoft or other licensors Microsoft or the applicable licensor is a third party beneficiary of this Agreement with the right to enforce the obligations set forth herein AUDIT RIGHTS Yo
75. low related effects are represented in a single factor called the heat transfer coefficient This factor is usually described in very complicated formulations based on conditions or circumstances specific to a particular situation Radiation Radiation transfers heat directly much like the transmission of light Radiating heat transfer increases with the temperature difference between two subjects but transfer is directly related to the fourth power of the absolute value of the temperature For this reason high temperature subjects usually have significantly greater radiating heat transfer rates than room temperature subjects However if all subjects are not very hot and their conductive and convective heat transfer rates are small near room temperature the radiative heat transfer contribution may become relatively significant and must be considered One very important feature of radiative heat transfer in any subject is its strong dependence upon the condition of the surface of the material in question This is known as the emissivity of the surface The emissivity of materials such as plastics or ceramics is close to 0 9 while that of polished metal can be as low as 0 2 On the other hand a fully oxidized metal surface has a high emissivity rating of approximately 0 3 to 0 8 Heat Transfer On Electronic Boards In steady state calculations all of the heat generated in a component per unit of time should leave that component by the followin
76. monly used materials Table 10 3 Library Menu Contents Master Opens the Edit Master Library Dialog Box The master library contains thousands of components along with all their pertinent parameters saved within it Working Opens the Edit Working Library Dialog Box The working library only contains the components of the current board The Components can be updated from the Master to the Working Library or copied from the Working Library to the Master Library Material HyperLynx Thermal User Manual V9 0 Opens the Edit Material Library Dialog Box The Material Library lists the conductivities of many commonly used materials You can add new materials edit the conductivity of existing materials and delete materials 61 HyperLynx Thermal Menus Board Menu Board Menu This menu lets you specify the detailed structure of the board for your applications Table 10 4 Board Menu Contents Menu Item Desciption Property Opens the Board Property Definition Dialog Box which is where you input the general properties of the board Local Property Opens the Local Property Definition Dialog Box The Local Property command allows for a detailed evaluation of a finely described board You can assign non homogeneous or an isotropic local properties to any layer of a board On each layer the local metal volume fraction and the x to y conductivity ratio can be set in arbitrary rectangles Thermal Via Select and
77. naltered release of Software d the use of Software as part of an infringing process e a product that you make use or sell f any Beta Code contained in Software g any Software provided by Mentor Graphics licensors who do not provide such indemnification to Mentor Graphics customers or h infringement by you that is deemed willful In the case of h you shall reimburse Mentor Graphics for its attorney fees and other costs related to the action upon a final judgment 9 4 THIS SECTION IS SUBJECT TO SECTION 6 ABOVE AND STATES THE ENTIRE LIABILITY OF MENTOR GRAPHICS AND ITS LICENSORS AND YOUR SOLE AND EXCLUSIVE REMEDY WITH RESPECT TO ANY ALLEGED PATENT OR COPYRIGHT INFRINGEMENT OR TRADE SECRET MISAPPROPRIATION BY ANY SOFTWARE LICENSED UNDER THIS AGREEMENT TERM This Agreement remains effective until expiration or termination This Agreement will immediately terminate upon notice if you exceed the scope of license granted or otherwise fail to comply with the provisions of Sections 1 2 or 4 For any other material breach under this Agreement Mentor Graphics may terminate this Agreement upon 30 days written notice if you are in material breach and fail to cure such breach within the 30 day notice period If Software was provided for limited term use this Agreement will automatically expire at the end of the authorized term Upon any termination or expiration you agree to cease all use of Software and return it to Mentor Graphics or certify de
78. ndard This library can be expanded by adding your own components into it Table 11 4 Edit Master Library Dialog Box Contents Parameter Description Add by parameters Opens the Edit Part Dialog Box You can add a new component to the master library with this command You will need to input specific parameters such as size power package type number of pins etc Copy part This command will allow you to copy the parameters of a specific component under another name If the name in the master library isn t the one you use you can copy it to your preferred name Edit part Opens the Edit Part Dialog Box so you can modify parameters for a component Highlight the component in the library column and click Edit Component Any changes that you make to the component will be temporarily saved when you click OK You can permanently save the changes by choosing File gt Save File gt Save As or running an analysis Delete part Click to delete a selected part from the Library You will be asked to confirm that you would like to delete that component from the master library Save to disk Lets you save your current library and updates the old library file on the hard drive The Master library is saved in betasoft mlb 76 HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Dialog Boxes Edit Material Library Dialog Box Edit Material Library Dialog Box Access Library Material The material library lists the names
79. nt and should be provided by the manufacturer of the heat sink The THETAsa value is a function of air velocity 30 HyperLynx Thermal User Manual V9 0 Critical Parameters THETAsa Sink to Air Thermal Resistance usually provided by the manufacturer of the heat sink The values at 3 ft sec and the value at 10 ft sec should be entered in the Working library HyperLynx Thermal does conversions for other air velocities automatically during analysis HyperLynx Thermal User Manual V9 0 31 Critical Parameters THETAsa Sink to Air Thermal Resistance 32 HyperLynx Thermal User Manual V9 0 Chapter 5 Advanced Modeling This section contains the following topics Decreasing the Thermal Output of a Component on page 33 Modeling a Chip or MCM on the Board on page 40 Modeling Daughter Boards on page 40 Metal Core or Thick Ground Plane in Boards on page 41 Metal Strips on the Board on page 41 An isotropic Wiring on page 41 Adjacent Board or Wall Effects on page 42 Decreasing the Thermal Output of a Component The following topics discuss ways to decrease the thermal output of a component on a board Relocating Overheated Components on page 33 Conduction Pads on page 34 Heat Sink on page 34 Thermal Screw on page 37 Heat pipe on page 38 Relocating Overheated Components If you do not intend to add heat sinks or conduction pads an alternative solution is to relocate the very hot c
80. ntransferable nonexclusive license to reproduce and distribute executable files created using ESD compilers including the ESD run time libraries distributed with ESD C and C compiler Software that are linked into a composite program as an integral part of your compiled computer program provided that you distribute these files only in conjunction with your compiled computer program Mentor Graphics does NOT grant you any right to duplicate incorporate or embed copies of Mentor Graphics real time operating systems or other embedded software products into your products or applications without first signing or otherwise agreeing to a separate agreement with Mentor Graphics for such purpose BETA CODE Software may contain code for experimental testing and evaluation Beta Code which may not be used without Mentor Graphics explicit authorization Upon Mentor Graphics authorization Mentor Graphics grants to you a temporary nontransferable nonexclusive license for experimental use to test and evaluate the Beta Code without charge for a limited period of time specified by Mentor Graphics This grant and your use of the Beta Code shall not be construed as marketing or offering to sell a license to the Beta Code which Mentor Graphics may choose not to release commercially in any form If Mentor Graphics authorizes you to use the Beta Code you agree to evaluate and test the Beta Code under normal conditions as directed by Mentor Graphics You wil
81. nx Thermal User Manual V9 0 Chapter 6 Industry Tips Depending upon what type of industry your company deals in the procedure in modeling might vary slightly look over your industry to get a good feel on how to model your case This section contains the following topics Avionic Space Applications on page 43 Computer Instrumentation Applications on page 44 Telecom Industrial Control Applications on page 45 Power Supplies Automotive Applications on page 45 Avionic Space Applications Avionic and space applications deal mainly with closed systems at high elevations with variations in air condition and gravity Specific considerations are Closed System on page 43 Air Conditions on page 44 Component Details on page 44 Board Structure on page 44 Others on page 44 Closed System If the board is in a closed system the only method of heat loss is by conduction and radiation The heat loss at the edge of the board must be specified in the Boundary Condition Definition Dialog Box Environment Boundary If thermal screws are mounted at the board and attached to heat sinks it must be specified in the Working Library Class For closed systems the iteration limit is recommended to set to high in the Environment Condition Definition Dialog Box Environment Condition HyperLynx Thermal User Manual V9 0 43 Industry Tips Computer Instrumentation Applications Air Conditions The pressure of air an
82. o through each and make sure they are set correctly This section contains the following topics Metal Volume Fraction in Boards on page 29 Air Flow Temperature at Boundary on page 29 Power Dissipation on page 30 Pin Dimensions Component Height on page 30 Junction to Casing Thermal Resistance on page 30 THETAsa Sink to Air Thermal Resistance on page 30 Metal Volume Fraction in Boards HyperLynx Thermal requires that the Metal Volume Fraction in your board must be specified in order to facilitate accurate calculations throughout the analysis Approximations will be made especially before the routing is conducted The thermal Conductivity of metal for example copper in the board is 100 times more than that of the non metal for example epoxy For conventional PCB a change of 1 Metal Volume Fraction in the Board Properties menu will affect the results significantly Beyond 1096 MVF the marginal effects are small A typical board of 0 064 inch thickness 1 oz copper is equivalent to about 2 MVF 9 If you import a HYP file with your board HyperLynx Thermal will calculate the MVF for the board based on the actual copper that is in the board Air Flow Temperature at Boundary When air convection is strong heat leaves a component mainly by direct convection to the air The major input parameters are the velocity of forced air approaching the board air direction and incoming a
83. of the pins depends upon whether the pins are in line or staggered with respect to the flow stream For total blockage of air flow set to 1 0 3 To place a heat sink select Placement gt Heat Sink Note 9 You must place your heat sink such that it overlaps at least one component Related Topics Heat Sinks on Top of Components on page 35 Heat sink standing alone or with components mounted on the sink on page 36 34 HyperLynx Thermal User Manual V9 0 Advanced Modeling Decreasing the Thermal Output of a Component One Heat sink on top of several components on page 36 Chip Fan on heat sink on page 37 Heat Sinks on Top of Components Heat Sink Air Cooled pin or fin type Heat Sink For a heat sink the most important input is the Sink to air thermal resistance at the two specified air velocities 3ft s amp 10ft s These values can be obtained from the manufactures data sheet of the heat sink which is a plot of Resistance vs Air Velocity Set these two resistances and HyperLynx PCB Thermal will interpolate or extrapolate for the real operational condition Effective height of the heat sink is also very important because the blockage in the flow stream may affect other parts at surrounding Parameter definitions the bold parameters are most critical 1 Class Must select heat sink when modeling a heat sink this controls the part definition Length Length or dimension in X direction Width Width or d
84. ollows local temperatures of the gas component and board the air gap and the heat transfer coefficients for each side of this component Component Temperature Select to display the component temperatures If you have provide the junction to casing thermal resistance of a component in the Working Library a small rectangle within the component displays the junction temperature To know the exact details of a component including component partname reference designator power location and casing and junction temperature right click the component Excess Temperature This command allows you to monitor the junction and E casing temperatures of your components against their Ci limits Excess will indicate how much each casing and junction temperature has exceeded their respective limits The individual limits are set from the Working Library the general default limits are set in the Board gt Property menu 58 HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Menus View Menu Table 10 2 View Menu Contents Board Temperature a Selecting this command provides a graphical display of the boards temperature map on the screen This display is the average temperature across the board thickness The color values shown on the temperature scale indicate a temperature range The area on the temperature map where the color changes from one to another is the exact value indicated on the temperature
85. omponents To move a hot component 1 Double click on the component and drag the mouse to the new location 2 You may move other components to better locations HyperLynx Thermal User Manual V9 0 33 Advanced Modeling Decreasing the Thermal Output of a Component 3 When you are finished re run the analysis to find the new temperature distribution Conduction Pads One way to help cool a component is to put conduction pads between the component and the board To prepare for this input e Goto the Edit Working Library Dialog Box and enter the conductivity of the material inserted in the gap Heat Sink Another way to help cool a component is to place heat sinks near the component The term heatsink is used very generally in the electronics industry referring to anything from wedgelocks to heat spreaders to finned heatsinks In HyperLynx Thermal the term heatsink refers only to the finned heatsink To add a heat sink to a board 1 Go to the Edit Working Library Dialog Box Library gt Working 2 Enter the heat sink specifications into the Wokring Library a Enter values for THETAsa dimensions and percent of effective height for that particular sink b If an extruded fin heat sink is oriented parallel to the air flow the effective height of the fins should be about 50 to 70 percent of the fin height depending upon whether the fins are spaced densely or loosely c Fora pin fin sink the effective height
86. ose Environment Condition This opens the Environment Condition Definition Dialog Box The Environment Condition window lets you set up the environment in which the board is placed You can set up whether or not the board is placed in a case as well as the surrounding air You can also set up boundary conditions to simulate other edge connected components which might affect the thermal properties of the board such as a wedge lock or sink Click OK HyperLynx Thermal User Manual V9 0 Getting Started with HyperLynx Thermal HyperLynx Thermal Basics You have now been familiarized with all of the required setup for performing a thermal analysis on a board using HyperLynx Thermal Should you wish to perform the analysis at this point you would simply choose Run from the Analyze menu Since the analysis has already been performed on CARD INP HLT that is not necessary HyperLynx Thermal User Manual V9 0 13 Getting Started with HyperLynx Thermal Creating a New Board Creating a New Board 1 From the menu area choose FILE NEW 2 To define the board size and properties choose BOARD Property Enter your board size thickness layer thickness and conductivity The values shown previously are default values 3 Before adding components to a board you must add components to the Working library Choose Library Working this opens the Working Library e From the Master Library area choose the components you wish to add to th
87. out express or implied warranty End User License Agreement The latest version of the End User License Agreement is available on line at www mentor com terms conditions enduser cfm IMPORTANT INFORMATION USE OF THIS SOFTWARE IS SUBJECT TO LICENSE RESTRICTIONS CAREFULLY READ THIS LICENSE AGREEMENT BEFORE USING THE SOFTWARE USE OF SOFTWARE INDICATES YOUR COMPLETE AND UNCONDITIONAL ACCEPTANCE OF THE TERMS AND CONDITIONS SET FORTH IN THIS AGREEMENT ANY ADDITIONAL OR DIFFERENT PURCHASE ORDER TERMS AND CONDITIONS SHALL NOT APPLY END USER LICENSE AGREEMENT Agreement This is a legal agreement concerning the use of Software between you the end user as an authorized representative of the company acquiring the license and Mentor Graphics Corporation and Mentor Graphics Ireland Limited acting directly or through their subsidiaries collectively Mentor Graphics Except for license agreements related to the subject matter of this license agreement which are physically signed by you and an authorized representative of Mentor Graphics this Agreement and the applicable quotation contain the parties entire understanding relating to the subject matter and supersede all prior or contemporaneous agreements If you do not agree to these terms and conditions promptly return or if received electronically certify destruction of Software and all accompanying items within five days after receipt of Software and receive a full refund of any licens
88. r of components in areas showing high temperatures through first cut analysis Pin Dimensions Component Height For those components whose temperatures are high after the first analysis it is suggested to review their pin dimensions and conductivity in the Working library for better accuracy Also the air gap under the component may be checked The less the convective cooling the more the importance of these parameters due to the significant conduction to the board The component height is important when strong convection occurs because the air from the free stream will likely hit on the tall component In this situation the heat transfer coefficient is high and the free stream temperature is low THETAjc Junction to Casing Thermal Resistance To get a correct junction temperature you need a correct power and THETAjc THETAjc means the thermal resistance between the component junction to casing This value can be obtained from the manufacturer of the component This is dependent on the particular package shapes of a component Also plastic and ceramic packages make a significant difference Notice that the accuracy of THETAjc will affect the junction temperature but will not affect the calculated Casing temperature of component THETAsa Sink to Air Thermal Resistance This input is necessary if a heat sink is added to component THETAsa is the thermal resistance between a heat sink and the air when the heat sink is applied to a compone
89. r lower case names Suffixes are usually only applied to surface mount components The suffix is not used if the component is of a conventional DIP component The typical suffixes are e DorDW e Small Outline FK e Chip Carrier Flat Pack e FN e PLCC Prefixes The names of logic devices all begin with the number 74 To insure uniformity 74 always substitutes a prefix of 54 24 HyperLynx Thermal User Manual V9 0 Library Names Units and Files Component Naming Guidelines A single entry represents both the military and commercial versions of each component or package This is because both military and commercial packages share the same dimensions and power dissipation rates For standard CMOS components the symbols are named 4081 without using manufacturer specific prefix names Microprocessors For microprocessors or microcomputers the starting prefix of the component is frequently 68 80 etc This is enough information to identify specific microprocessors HyperLynx Thermal User Manual V9 0 25 Library Names Units and Files Units Units The parameters in the HyperLynx Thermal can be Mixed or SI units at your option Watts and degree C are always used even though the English units are used elsewhere in the Mixed Unit situation Table 3 1 Parameter Units Parameter Length Mixed Units SI Units Velocity Pressure Comp Power THETA Table Parameter Thermal Resistan
90. rature of the heatsink This will be the casing temperature of each individual component that is touching the heatsink The junction temperatures of each original components under the sink can be evaluated from junction to casing temperature difference which is the power multiply the THETAjc Chip Fan on heat sink Modeling a fan on top of a heatsink The heatsink and fan combination will be modeled as a single heatsink 2 The manufacturer should provide a new THETAsa for the fan fin combination Use this value for the Sink to air thermal resistance when defining the heatsink Add the height of the fan to the height of the original heatsink and input that value under the height of the heatsink Thermal Screw Thermal Screws can be added to the board with the other end links to external heat sinks The screws specifications such as size and sink temperature must first be entered into the Working Library To place a screw 1 Go to the Placement menu and choose Screw 2 Move the screw to the desired location and press the left mouse button to place it This opens the Component Properties Dialog Box 3 Enter the properties for your screw Modeling a thermal screw For a Thermal Screw the most important inputs are the class temperature at end and thermal resistance across the screw You should specify the size of the screw and leave a few pins so that the thermal screw has good contact to the board The pin dimensions
91. rcuit board that you want to translate to HyperLynx Thermal 2 Select Analysis Export to HyperLynx Thermal This opens HyperLynx Thermal and loads the exported design The interface will create a HLT file in the PCB folder for that particular design You can open the HLT file from the File gt Open menu in HyperLynx Thermal Importing a Design This section explains how to import a design using the File Import IDF Interface menu in HyperLynx Thermal The IDF Interface into HyperLynx Thermal This interface is compatible with any ECAD MCAD placement software that will export two IDF files a board file and a library file For example Expedition Board Station OrCAD Allegro Pro E and CR 5000 all have an IDF output available HyperLynx Thermal User Manual V9 0 19 Importing and Setting up a Board Preparing an Interfaced Case for Analysis 1 To initiate the import select File gt Import gt IDF Interface This opens the Import dialog box IDF Board Browse IDF Lib Browse HYP File lt 6 Browse Defaults C hlthermalinstall March26 DEFAULTS IDF Browse Project Cancel 2 Enter the path for or browse to you IDF Board the library will be added automatically This imports the board information 3 Optionally select a HYP File This imports the stackup trace and plane information for the board This option al
92. rection The value may be recorded in inches or millimeters Maximum board width Ymax This value is the measurement of the board width in the Y direction The value may be recorded in inches or millimeters Layer Type Select the board layer that you are defining properties for Displays the layer type for the selected layer Thickness Specify the thickness of the selected layer Conductivity This value is the conductivity of the board material in the specified layer The conductivity can be determined using the material library by clicking Specify conductivity by select material and selecting the material Specify conductivity by select material Clicking this button opens the Select Material dialog box To specify the conductivity for the selected layer select a material and click OK Use constant volume fraction of metal 70 If you select this the software will compute the metal volume fraction for the board HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Dialog Boxes Board Property Definition Dialog Box Table 11 1 Board Property Definition Dialog Box Contents Parameter Description Volume fraction of metal This value is the nominal or default percent in decimal form of metal traces in the board Please do not include any local ground planes thermal vias etc They should be specified in the Local Property menu Note _____ If the ground or power planes
93. resolved by arbitration in Singapore before a single arbitrator to be appointed by the Chairman of the Singapore International Arbitration Centre SIAC to be conducted in the English language in accordance with the Arbitration Rules of the SIAC in effect at the time of the dispute which rules are deemed to be incorporated by reference in this section 15 This section shall not restrict Mentor Graphics right to bring an action against you in the jurisdiction where your place of business is located The United Nations Convention on Contracts for the International Sale of Goods does not apply to this Agreement SEVERABILITY If any provision of this Agreement is held by a court of competent jurisdiction to be void invalid unenforceable or illegal such provision shall be severed from this Agreement and the remaining provisions will remain in full force and effect PAYMENT TERMS AND MISCELLANEOUS You will pay amounts invoiced in the currency specified on the applicable invoice within 30 days from the date of such invoice Any past due invoices will be subject to the imposition of interest charges in the amount of one and one half percent per month or the applicable legal rate currently in effect whichever is lower Some Software may contain code distributed under a third party license agreement that may provide additional rights to you Please see the applicable Software documentation for details This Agreement may only be modified in writing by
94. s If an individual component has its own limits those limits will apply to that component only and can be entered in the working library DIP DIP is a through hole component which is made up of components whose pins are located at two opposite sides and go through the thickness of the board Any component with pins which appear on all four sides or on the bottom of the component belongs to one of the other SMD classes DX The dimensions of the package in the X direction are measured in inches or millimeters The dimension does not include the leads For DIP or SMD Leadless packages the DX is measured on the edge where pins are located This is usually the longer side of a DIP package If the shape of SMD packages is rectangular the longer side is used For round components this location of input will become the diameter DY The dimensions of the package in the Y direction are measured in inches or millimeters This dimension does not include the leads For a round component this value is grayed DZ This is the dimension of the package in the Z direction This is the final height of the package after mounted on the board If a socket is used under a component you must add the height of the socket to this parameter for the component in the Working library If a heat sink is added on top HyperLynx Thermal User Manual 91 Glossary of Terms of this component the extra height of the sink is specified in Working Lib separately The eff
95. scale For example if light green is the temperature range from 58 6 to 65 2 and yellow is the temperature range from 65 2 to 71 7 then the area on the temperature map that changes from green to yellow is actually 65 2 degrees Component temperatures can also be viewed at the same time as the board temperatures if the Component gt Temperature command is also selected Board Temp Gradient Trace Power Select to display a local maximum slope of the temperature distribution at any particular point on the board The value indicated is the temperature variation per unit length C per inch or per mm This is very helpful in indicating areas of thermal stress concentrations which may result in board cracks Select to display the power of hot traces Trace Temperature HyperLynx Thermal User Manual V9 0 Select to display the temperature of hot traces Hot traces are traces that you add from the Board gt Add Trace menu 59 HyperLynx Thermal Menus View Menu Table 10 2 View Menu Contents Search Component This command allows you to search for components by part name or reference designator 1 Choose View Search Component and select the partname that you wish to identify from the list 2 Click OK AII of the components of that particular partname or reference designator will be marked with an X If you then press the Delete key you may be allowed to delete all components of this particular partname
96. should be sufficient to let heat pass from the board The thermal resistance across the screw should calculated by L kA where L is length of screw k is screw conductivity and A is the cross sectional area The end temperature of the screw is the sink temperature attached to the end Parameter definitions the bold parameters are most critical HyperLynx Thermal User Manual V9 0 37 Advanced Modeling Decreasing the Thermal Output of a Component 1 9 10 Class Must select screw when modeling a thermal screw this is the part definition Length Length or dimension in X direction 2 3 4 5 Width Width or dimension in Y direction Height The total height of the thermal screw above the board surface Number of Pins Not a critical number but use a high number to ensure good contact with board Pin thermal conductivity Pin thickness Pin width pin Length should ensure good conduction with board occurs Power should be set to Zero Thermal resistance across the screw The thermal resistance of the screw as calculated by L kA Radiative Emissivity Not important leave as default or use 1 for polished metal Temperature at end The sink temperature that the screw is attached to Heat pipe To place a heat pipe on the board the heat pipe must first be defined in the working library The setting of heat pipe properties is shown at the next section l d 3 Select the Placement gt He
97. sidered to be isotropic 1 the same conductivity in any direction which is generally a good assumption considering the traces in the x direction and in the y direction are of similar amount Table 11 9 Local Property Definition Dialog Box Contents Parameter Location X Description Left point of selected area X 0 at left edge of the board Location Y Bottom point of selected area Y 0 at bottom of the board Local property is round Select this if the area you are defining is round Length Width Diameter If you did not select Local property is round enter the length and width of the region If you select Local property is round enter the diameter of the region Length DX Width DY Metal volume fraction If you did not select Local property is round enter the length and width of the region If you import a HYP file with your design HyperLynx Thermal automatically computes the percentage of metal on your board To manually specify the fmetal volume fraction for your board select the Use constant volume fraction of Metal checkbox and enter the Metal Volume Fraction for the selected area Kx Ky ratio of conductivity Specifying a local property To specify a local property Enter the ratio of conductivity see Kx Ky 1 Select the View Layer menu and select a layer 2 Select Board Local Property 3 Click the upper left corner of the area you wis
98. sink is specified in the Working Library menu with a proper Class The effective height and THETAsa are needed The heat sink is placed on top of regular components in the Placement gt Heat Sink menu The Chip Fan is handled the same as the heat sink The proper equivalent THET Asa provided by manufacturer needs to be specified 44 HyperLynx Thermal User Manual V9 0 Industry Tips Telecom Industrial Control Applications Adjacent Boards Walls The spacing needs to be specified For an adjacent board the power needs to be specified For an adjacent wall the temperature and emissivity need to be specified the inputs are in the Environment Condition Short Cut for Large Boards If user prepared the text file of component powers from Simulation the power of all components could be interfaced from File Import Power and Th Resist menu But if such power import is not available and the board is large with lots of components after interfaced from ECAD the estimated power should be given to major components that are either high power or sensitive to temperature The result of first cut analysis reveals the problem areas on this board which have high temperatures Then those components in the problem areas are examined in detail with careful inputs Telecom Industrial Control Applications Telecom and industrial control deal with large component numbers on boards and closed or open systems You need to consider natural convecti
99. so enables the tool to automatically calculate the Metal Volume Fraction based on the actual copper that is in the board 4 Click OK 5 The design will open in HyperLynx Thermal and HLT file will be created in the directory where HyperLynx Thermal resides Preparing an Interfaced Case for Analysis Once you are in HyperLynx Thermal you want to check briefly for any possible overlapping of the components due to any possible imperfection of the CAD Interface Some parameters needed for thermal analysis but not available in the ECAD placement file may be still at the default values Go to Library Working to review each component and set their powers or import the power from ASCII file as shown in the next section of help before you run the ANALYSIS for preliminary thermal results You may edit the thermal resistance and other parameters such as height pin dimensions and air gaps etc at the same time 20 HyperLynx Thermal User Manual V9 0 Importing and Setting up a Board Importing a Power file Importing a Power file Once a file is imported from the CAD interface the power dissipation of each component can be entered manually in the working library or it can be imported using a text file This section describes the format of the text file that may import power dissipation into HyperLynx Thermal as well as the import procedure 1 Create a file using DOS Edit Word WordPad or another software that generates text files This f
100. specifying how the board dissipates heat The coordinates of the boundary condition sink temperature and the thermal resistance all need to be set here The wedge lock is usually connecting between the board edge and the heat sink which could be a chase wall or cooling fins etc This heat sink temperature must be specified The wedge lock usually has a thermal resistance The value of the total thermal resistance of a wedge lock Rtotal could be presented in the form of DT Q x Rtotal The DT is the temperature difference between the edge of the board to the sink the Q 15 the total heat flow rate Therefore the Rtotal shall have a unit of C Watt 72 HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Dialog Boxes Boundary Condition Definition Dialog Box The wedge lock may cover a length along the edge of board for example S mm For each unit length mm the thermal resistance shall be higher than the total thermal resistance This is because the longer the wedge lock the larger the cross section of the heat flow and the less the total thermal resistance Resistance is inversely proportional to the cross section but proportional to the length of heat flow path Therefore the thermal resistance per unit length Rlength is related with the Rtotal as Rtotal Rlength L Where the L is the length of the wedge lock along the edge of the board Finally the unit of thermal resistance per unit length along the board is C mm Watt wh
101. ss the delete key You can use number of overlapped cutouts to form a special shape of cutout Trim Corner The Trim Corner command allows you to round off the corners of your board 1 Select Board Trim corner 2 Click the corner of the board 3 Move the mouse till you are satisfied 4 Click the mouse to finalize it You may click a trimmed corner to see its specification and then press the delete key to restore it Trace Properties Opens the Trace Properties Dialog Box Assign the properties of the trace in terms of thickness conductivities of trace and non trace and temperature coefficient of trace conductivity etc HyperLynx Thermal User Manual V9 0 63 HyperLynx Thermal Menus Board Menu Table 10 4 Board Menu Contents Menu Item Desciption Add Trace Add a trace to the board You may assign the traces on the board at front and back sides respectively You may also assign the power density in this menu Notice that the trace is considered as an extra thin layer on top of the front and back surface of the board They are not one of the Layers of a board To assign trace 1 Select Board gt Add Trace The Trace Power Density dialog box opens 2 Enter the Trace power density for power per unit area on the trace and click OK 3 A grid over the entire board will appear Click the squares to add trace Note LLL The traces that are added will turn red in color You can remove traces by right clicking on
102. starts the thermal analysis of your board For a closed system or for one which uses natural convection a high number of iterations are appropriate The analysis terminates automatically when the difference between the results of the current iteration and a previous iteration is less than a pre set limit or when the iteration number reaches the limit you specified in the Environment Condition Definition Dialog Box Review This option allows you to view the iterations of the most recent analysis This is all the text that appeared in the DOS file as the analysis ran including any error message that was received at the end Numerical Output HyperLynx Thermal User Manual V9 0 The numerical output represents the results of your analysis It is located in the file with the extension OUT for your board This file lists the following in ASCII form the operational conditions details of the components on the board and of their temperatures and the board s IC junction temperatures The temperatures on the board along the vertical center line are also listed as a reference You must exit HyperLynx PCB Thermal and view the numerical output using Windows Explorer Some special items in the numerical output file need specific explanation Boundary conditions are listed on each side of the board for each of its edges and are displayed in terms of the mesh number which corresponds to their locations The natural air draft
103. tal strip The conductivity that you assign in the Board Local Property menu will override that default nominal value assigned in the Board Property menu in that area You may assign other metal strips in a similar manner An isotropic Wiring In a region where most wires are in one direction you may use the Board Local Property menu to set the rectangle for this region If the wires along the x direction are twice as many as those in the y direction set the Kx to Ky ratio to 2 to model the an isotropic heat conduction To determine the wire ratio you may draw a square on a location of the board and count how many wire go East West versus North South HyperLynx Thermal User Manual V9 0 41 Advanced Modeling Adjacent Board or Wall Effects Adjacent Board or Wall Effects The effects of an adjacent wall or board are set at the Environment Condition menu First you should indicate the position of the board in the rack such as in rack or end of a rack or simply a single board Then the input is made to the adjacent wall or board For a board the power is needed For a wall the wall temperature and emissivity are required If you know the temperature of an adjacent board and would like to use that value instead of the power dissipation choose as end of rack and enter the temperature as if you were using a wall You may also set different air velocities at each side of the board and the respective board to board spacing 42 HyperLy
104. th in the applicable user manual Mentor Graphics does not warrant that Software will meet your requirements or that operation of Software will be uninterrupted or error free The warranty period is 90 days starting on the 15th day after delivery or upon installation whichever first occurs You must notify Mentor Graphics in writing of any nonconformity within the warranty period This warranty shall not be valid if Software has been subject to misuse unauthorized modification or improper installation MENTOR GRAPHICS ENTIRE LIABILITY AND YOUR EXCLUSIVE REMEDY SHALL BE AT MENTOR GRAPHICS OPTION EITHER A REFUND OF THE PRICE PAID UPON RETURN OF SOFTWARE TO MENTOR GRAPHICS OR B MODIFICATION OR REPLACEMENT OF SOFTWARE THAT DOES NOT MEET THIS LIMITED WARRANTY PROVIDED YOU HAVE OTHERWISE COMPLIED WITH THIS AGREEMENT MENTOR GRAPHICS MAKES NO WARRANTIES WITH RESPECT TO A SERVICES B SOFTWARE WHICH IS LICENSED TO YOU FOR A LIMITED TERM OR LICENSED AT NO COST OR C EXPERIMENTAL BETA CODE ALL OF WHICH ARE PROVIDED 5 IS 5 2 THE WARRANTIES SET FORTH IN THIS SECTION 5 ARE EXCLUSIVE NEITHER MENTOR GRAPHICS NOR ITS LICENSORS MAKE ANY OTHER WARRANTIES EXPRESS IMPLIED OR STATUTORY WITH RESPECT TO SOFTWARE OR OTHER MATERIAL PROVIDED UNDER THIS AGREEMENT MENTOR GRAPHICS AND ITS LICENSORS SPECIFICALLY DISCLAIM ALL IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE AND NON INFRINGEMENT OF INTELLECTUAL PROPERTY LIMITATI
105. the trace that you wish to remove Trace Power Density After the Add Trace command is initiated you may change to a new power density of trace to assign on the board 64 HyperLynx Thermal User Manual V9 0 Placement Menu HyperLynx Thermal Menus Placement Menu Use this menu to place components heat sinks screws and heat pipes on the board Note 9 To place an object on the board you must define the object in the working library Note To place an object on the back side of the board change the view so you are looking at the back side of the board View Back Side Table 10 5 Placement Menu Contents Menu Item Component Desciption Select to place a component on the board To place a component 1 Select the Placement Component menu 2 Select a component from the pull down working library on the tool bar 3 Drag your mouse to the area on the board where you want your component to be placed 4 Click to place it 5 A window will pop up allowing you to assign a reference designator name up to 5 characters long You can also modify the specifications Heat Sink Select to place a heat sink on the board Note You must place heat sinks so they overlap at least part of one component See Heat Sink on page 34 Select to place a thermal screw on the board See Thermal Screw on page 37 Heat Pipe HyperLynx Thermal User Manual V9 0 Select to place
106. the starting and ending points for the boundary you are defining The Boundary Condition Definition dialog box opens In the numerical output boundary conditions are listed on each side of the board for each of its edges and are displayed in terms of the mesh number which corresponds to their locations Table 11 2 Boundary Condition Definition Dialog Box Contents Parameter Description Begin coordinate Starting coordinate for the boundary End coordinate Ending coordinate for the boundary Thermal resistance of wedge lock The wedge lock applied to the edge of board has a at edge thermal resistance between the edge of the board and the heat sink The typical unit is C mm Watt See Thermal resistance of wedge lock at edge for more details Temperature of sink at edge The temperature of the heat sink connected by the wedge lock to the edge of the board The wedge lock usually connects the board edge and the heat sink You must specify the temperature of this heat sink Specifying Boundary Conditions Boundary conditions may not be important in cases of strong air convection but they are critical when a sealed closed system is being analyzed For a sealed system cooling is usually provided at the edges of the board Without some mechanism for dissipating heat the board will usually reach unacceptably high temperatures due to ineffective thermal radiation This frequently happens when you model a closed system without
107. to Zero 7 Emissivity dependent on outer material use 1 for a polished metal 8 Gap Conductivity The conductivity of the material used to attach the heatpipe to the board HyperLynx Thermal User Manual V9 0 39 Advanced Modeling Modeling a Chip or MCM on the Board Modeling a Chip or MCM on the Board HyperLynx Thermal can model such a board without a cover because its structure 15 similar to a board Chips soldered onto the boards are considered a single component but with conduction pads underneath If a MCM is attached to a board treat the whole MCM as one component first on the mother board with the total power of MCM assigned to this single representative component Then the local thermal environment can be obtained through the Refine command This local environment will then be used for the environment of this MCM Modeling Daughter Boards The following sections describe how to model either a parallel or perpendicular daughter board in HyperLynx Thermal Modeling Parallel Daughter Boards A daughter board should be entered in the Working library To place a daughter board 1 Select the name of your daughter board from the Component pull down menu 2 Go to the Placement menu and select Component 3 Drag the daughter board to the desired location on the mother board and left click the mouse this opens the Component Properties dialog box 4 In the Component Properties dialog box you must select the Refined output
108. u will monitor access to location and use of Software With reasonable prior notice and during your normal business hours Mentor Graphics shall have the right to review your software monitoring system and reasonably relevant records to confirm your compliance with the terms of this Agreement an addendum to this Agreement or U S or other local export laws Such review may include FLEXIm or FLEXnet report log files that you shall capture and provide at Mentor Graphics request Mentor Graphics shall treat as confidential information all of your information gained as a result of any request or review and shall only use or disclose such information as required by law or to enforce its rights under this Agreement or addendum to this Agreement The provisions of this section 14 shall survive the expiration or termination of this Agreement 15 16 17 CONTROLLING LAW JURISDICTION AND DISPUTE RESOLUTION THIS AGREEMENT SHALL BE GOVERNED BY AND CONSTRUED UNDER THE LAWS OF THE STATE OF OREGON USA IF YOU ARE LOCATED IN NORTH OR SOUTH AMERICA AND THE LAWS OF IRELAND IF YOU ARE LOCATED OUTSIDE OF NORTH OR SOUTH AMERICA disputes arising out of or in relation to this Agreement shall be submitted to the exclusive jurisdiction of Portland Oregon when the laws of Oregon apply or Dublin Ireland when the laws of Ireland apply Notwithstanding the foregoing all disputes in Asia except for Japan arising out of or in relation to this Agreement shall be
109. ual V9 0 53 Program Specifications and Requirements Types of air flow supported 54 HyperLynx Thermal User Manual V9 0 Chapter 10 HyperLynx Thermal Menus The following menus are available from the HyperLynx Thermal application e Analyze Menu Board Menu Environment Menu File Menu File Menu e Library Menu e Placement Menu e View Menu From the file menu you can load files save files import files and set the scale of displays and the units You also can print from this menu Table 10 1 File Menu Contents Menu Item Description Select to create a new HyperLynx Thermal design Open we Select to open an existing HyperLynx Thermal HLT design Save as a Select to save a design You can choose to have your values in Mixed units or in Standard International SI units Mixed units are generally in American units except for quantities such as C and Watts while SI units are essentially Metric units HyperLynx Thermal User Manual V9 0 Opens the Display Scale Setting dialog box Set the current maximum and minimum limits on the displayed color bars for Temperature scale Gradient scale Excess temperature scale Power display scale Trace power scale 55 HyperLynx Thermal Menus File Menu Table 10 1 File Menu Contents Menu Item Description Select IDF Interface to import a board from any ECAD MCAD placement software that exports two IDF files a bo
110. und enter the length and width of the region Diameter If you select Local property is round enter the diameter of the region Total number of thermal vias in this area The number of thermal vias within this local area Outside diameter of the via The outside diameter of the via is the total diameter including the outer rim and the filler Thickness of the plating near the outside diameter of via The thickness of the plating near the outside diameter of the via is the thickness of the plating on only one side The relation is diameter of the filler 2x thickness of the plating total outside diameter of the thermal via Thermal conductivity of the plating material HyperLynx Thermal User Manual V9 0 The thermal conductivities of the plating material and of the filler can be determined by accessing the material library by clicking on Specify by select material 85 HyperLynx Thermal Dialog Boxes Thermal Via Definition Dialog Box 86 Table 11 10 Thermal Via Definition Dialog Box Contents Parameter Thermal Conductivity of the material filling the via holes Description Enter a value or click Specify by select material to enter based on the material From layer Starting layer for the vias To layer Ending layer for the vias HyperLynx Thermal User Manual V9 0 HyperLynx Thermal Dialog Boxes Trace Power Density Dialog Box Trace Power Densit
111. ve cooling Natural Convective Cooling At natural convective cooling the input of incoming air velocity in the Environment Condition Definition Dialog Box Environment Condition menu should be set to 0 0 The Analysis will calculate the final natural convective temperature due to the chimney effects automatically For any forced flow with fan the analysis will calculate the combined forced and natural flow velocity automatically In this situation the board orientation of vertical or horizontal should be specified correctly and the forced flow is zero The incoming air temperature is also the ambient air temperature which induces the natural draft Power Supplies Automotive Applications Power supply and automotive industries deal with high power and thus high heat They also incorporate high power traces in some designs You need to consider high current traces on the board High Current Traces on the Board For high currents on traces you need to consider the heat generation of the traces HyperLynx Thermal User Manual V9 0 45 Industry Tips Power Supplies Automotive Applications 46 HyperLynx Thermal User Manual V9 0 Chapter 7 Background on Thermal Modeling This section contains the following topics Heat Transfer Background on page 47 Heat Transfer On Electronic Boards on page 48 Reliability Background on page 49 Heat Transfer Background There are three mechanisms which determine the transfer
112. wing amount of power per unit of it s area J e xo T Where is this emissivity coefficient between 0 and 1 For an ideal black body is 1 for any real body it is less than 1 is a dimensionless parameter System Either open air flow or closed no air flow Board spacing Spacing to adjacent board or case wall on either side of the board Adjacent board emissivity The emissivities of the adjacent boards or walls are important for radiation heat transfer Low values 0 1 0 3 for polished metals higher values 0 6 0 9 for organic surfaces and the oxidized metal surface is close to organic materials Adjacent board power dissipation If In rack Right or Left of Rack input adjacent board power Temperature of casing wall HyperLynx Thermal User Manual V9 0 The adjacent wall temperatures This parameter can also be used in place of Adjacent board power dissipation if the temperature of the adjacent board s is known 83 HyperLynx Thermal Dialog Boxes Local Property Definition Dialog Box Local Property Definition Dialog Box The Local Property command allows for a detailed evaluation of a finely described board You can assign non homogeneous or an isotropic local properties to any layer of a board On each layer the local metal volume fraction and the x to y conductivity ratio can be set in arbitrary rectangles As default conditions the properties of a board are con
113. y Dialog Box Access Board Trace Power Density Table 11 11 Trace Power Density Dialog Box Contents Parameter Description Trace Power Density The power per unit area on the trace watt in Trace Properties Dialog Box Access Board Trace Properties Assign the properties for a trace Table 11 12 Trace Properties Dialog Box Contents Parameter Description Mesh Multiplier Displays the value of the mesh multiplier Trace thickness front side The thickness of the trace The trace is not a layer it is an extra skin on the board Trace thickness back side The thickness of the trace The trace is not a layer it is an extra skin on the board Conductivity of trace Specify the conductivity of the trace The trace is considered as on the outside of a board on top of the skin which does not belong to any of the 3 layers Conductivity of non trace Specify the conductivity of the non trace Temperature coefficient of On the traces the electric conductivity varies with the resistance 1 degC temperature Therefore the power is also changed when the temperature is changed The temperature coefficient is the one for the electric resistance or power at constant current as temperature changes HyperLynx Thermal User Manual V9 0 87 HyperLynx Thermal Dialog Boxes Trace Properties Dialog Box 88 HyperLynx Thermal User Manual V9 0 Glossary of Terms Adjacent Board Emissivity The average rad
114. you don t have a board select Help Sample Design 131141111 mia s duas adn E per 1 4 ys L li andi n E a 2 rereset The Y EE rj 3 Perel Front Note 9 You can also change Units and Temperature Scale from the File Menu 3 Choose View Side Back Side Notice that there is another set of components on the back side of the board Note 9 The View Menu also lets you select different layers in the design 4 Choose View Side Front Side to return to the front view of the board You can also click 10 HyperLynx Thermal User Manual V9 0 5 10 11 12 13 14 15 16 Getting Started with HyperLynx Thermal HyperLynx Thermal Basics Click As you move your mouse around the viewing window the board will rotate around in 3 dimensions Right click on the board to lock the board in place Choose View Reset to set the board back to its original position Notice the bottom of the screen shows the x and y coordinates on the location at the tip of the arrow the number of components on that side of the board and the total power dissipation for this side of the board Choose View gt Power or click Ea This view shows the power of each component All of the analysis output views are available from the View Menu and the toolbar Click RE This highlights the components that will have a spe

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