CM-BF537E
Contents
1. seng 25 7 3 2 LabVIEW o 25 7 3 3 mel c 25 7 4 Blackfin Design Services ssssssssssssssssssssssssssssssssssesssssssesssssssssssssnsesessescsssssssnsssssnsesessessesssssssssssssnassesssseesessssansssssnsseessesesss 25 7 4 1 Upcoming Products and Software Releases ee eeeseeeenttenn tenni ttnn ttti nost tassi 25 8 Ordering Information 422 M 26 8 1 Predefined mounting options for CM BF537 cssssscssssscssssscsssecsssseccsseecssuesscsseesssseccssseessseccuscessaseessasecsssceeceseecenseeess 26 9 Dependability MEME 27 LAE AAEE EEEE EEEE EE EEE EEEE EEE 27 10 ikele Ten E EI OLS aan AA IAN a ATA E AA 10 1 Version Information 10 1 1 CM BF537 C C Q25S32F4 CM BF537E sssssssssssssssssssessscesecssrsssnsnnsessssecesecesssssnsnsssseseeeesseearsssnsnmmseseseeeeset 28 10 1 2 CM BF537 C 1 Q25S32F4 CM BF537E ssssssssssssssssssseesececssrsssnsnsnsessssesceseeesrsssnsnssesseseesesserarassnsnmeseseseesenee 28 10 1 3 CM BF537 C C Q25S64FA CM BF537E 64SD eerte nnt ttt ttt nnns ttetttteten 28 10 2 Anomali s snot am NGAGE 29 11 Document REVISION TIS TONY UR den 30 12 list of Abbreviations anna M 31 A List of Figures and BEL C 32 CM BF532. CUM Et D TVS USB2 0 Core Module Figure 5 2 Schematic for RJ45 Connection Designator X1 C1 R8 R9 V1 V2 Value Description Quantity RJLBC 060TC1 RJ45 with transformer 1 1 1 10uF Capacitor 1 220R Resistor 2 USBLC6 2P6 TSV Diode 2 Table 5 1 Parts List RJ45 5 4 Sample Schematic In this minimum configuration the CM BF537 is used as a high performance network connected processor module CM BF537 HUM V3 2 docx 19 Designator Sy TY ha n j a n AN ARA SDA PF10 SPI CS1 PF4 TMRS SPI CS6 or OPEN cs4 el w a yf No in O ul V Vin 3V3 GND QD CM BF537E D Ej 8 as a sn AA t edel es d d BE E PGS PPIIDS DRISEC PG9 PPIID9 DTISEC PGI0 PPIIDI0 RSCLK1 PGI1 PPIIDI1 RESI PG12 PPIID12 DRIPRI PGI3 PPIIDI3 TSCLK1 SGH PIC PG14 PPIID14 TES PG15 PPIID1S DTIPRI PPILSy3 PF7 TMR2 PPIISy2 PFS TMR1 PPIISyl PF9 TMRO PPIICK PF15 TMRCLK PPIISyl PF9 TMRO PF2 Tel TMR7 l PF3 Rx TMR6 TACI6 RESET BS Ehe CASA EA PAY vu ja V Ux i AA AA 33VO Es n e AES Figure 5 3 Configuration with Ethernet and JTAG Connector GND 10uF RIAS 1 1 LED Quantity C1 C2 C4 C3 C5 CM1 X1 X2 X3 R3 R8 R9 S1 U1 Value Description 1uF Capacitor 10uF Capacitor CM BF537 DC 8 Power connector DC 8 RJLBC 060TC1 RJ45 with transf
3. u w bad 2100 fielen Jamon poles em EET Be AUS f ns mm tes fla aL mA X u EO MD ES IGD47 E a di NY J Hardware User Manual CM BF537 V3 x maximum performance at minimum space Contact Bluetechnix Mechatronische Systeme GmbH Waidhausenstra e 3 19 A 1140 Vienna AUSTRIA EUROPE office bluetechnix at http www bluetechnix com Document No 100 1221 3 9 Date 2012 05 24 CM BF537_HUM_V3 2 docx Table of Contents Blackfin Core Modules nee 5 Blackfin Development Boards ulanan 7 UM reip 8 1 1 B SEES 8 1 2 Key Features AA aiar eadaas ANA niN Adap Aiia GAANA bai paea aa tasaa PAR AAAAEEE S N A A ARAAS AAA 9 3 Applications seenen ee a E e a E 9 2 Gener l Description t P 10 2 1 Functional Description 10 2 2 BOO fas me 10 2 3 Memo Mile r 2 3 1 Core Module Memory 2 3 2 Externally Addressable Memory on connector e ees eeset tenete ttes totos tonos 12 EMETOI Teli e Motm RR 13 3 1 Electrical Specifications ssscsssssccssssesssseccsssccssssccssssccsssscesnseessnsecessecsssscessseccssucccssuscsssscessuscessusccsssscessscesssceessseesssseesnseeste 13 3 1 1 Operating Conditions Rm 13 3 1 2
4. 2 docx 25 8 Ordering Information CM BF537 C C I Q25 S32 64 FA CM BF537E Product Family Former name CM Core Module Special SBC Single Board Computer Custom Core Modules or specials CPU Type uC uclinux Equals the name of CPU Extra controllers mounted Connection Type E Ethernet A BGA U USB B Border pad Flash MB C Connector F NOR Flash MB S Special N NAND Flash MB Operating Temperature Range RAM A Automotive S SDRAM MB C Commercial Industry Crystal Frequency Notation QXX MHz 8 1 Predefined mounting options for CM BF537 Article Number Name Temperature Range 100 1221 3 CM BF537 C C Q25S32F4 CM BF537E Commercial 100 1229 3 CM BF537 C 1 Q25532F4 CM BF537E I Industrial 100 1273 3 CM BF537 C C Q25S64F4 CM BF537E 64SD Commercial Table 8 1 Ordering information NOTE Custom Core Modules are available on request Please contact Bluetechnix office bluetechnix com if you are interested in custom Core Modules The mount options of the Core Module CM BF537 are shown in Table 8 2 Mount Option Flash Comment MO1 2MB PF4 available on pin 7 on connector X1 MO2 4MB default MO3 8MB PF5 not available on connector X1 Table 8 2 Mount options CM BF537_HUM_V3 2 docx 26 9 Dependability 9 1 MTBF Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results because MTBF numbers just repr
5. 400 MHz 70 mA late Verc Current 20 HA fux Core clock frequency a 600 MHz Table 3 1 Electrical characteristics US Voon 1 10V T 25C Commercial grade Average load 25 C ambient temperature 3 1 2 Maximum Ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device These are stress ratings only Operation of the device at these or any other conditions greater than those indicated in the operating sections of this specification is not implied Exposure to absolute maximum rating conditions for extended periods may affect device reliability Symbol Parameter Min Max Unit Vio Input or output voltage 0 5 3 6 V Vin Input supply voltage 3 0 5 5 V lon loL Current per pin 0 10 mA Tame Ambient temperature 40 85 C lero Storage temperature 55 150 i Tap Solder temperature for 10 seconds 260 C ame Relative ambient humidity 90 Table 3 2 Absolute maximum ratings CM BF537_HUM_V3 2 docx 13 3 1 3 ESD Sensitivity ESD electrostatic discharge sensitive device Charged devices and circuit boards can discharge without detection Although this product features patented or proprietary protection circuitry damage may occur on devices subjected to high energy ESD Therefore proper ESD precautions should be taken to avoid performance degradation or loss of functionality CM BF537_HUM_V3 2 docx 14 4 Connector Description 4 1 Pin N
6. D1 1 0 Data Bus 99 RESET see chapter 5 2 100 AOE O 101 ARE O 102 AMS2 O 103 VDD RTC PWR 104 BGH O 105 BR 10k pull up 106 VA33 PWR Ethernet transformer voltage reference 107 TX O 47R pull up to 3V3 Ethernet transmit 108 TX O 47R pull up to 3V3 Ethernet transmit 109 NC 110 LED_SPEED O Full duplex LED High Full duplex active Low inactive 111 ABEO SDQMO O 112 A18 O Address Bus 113 A16 O Address Bus 114 A14 O Address Bus 115 A12 O Address Bus 116 A10 O Address Bus 117 A8 O Address Bus 118 A6 O Address Bus 119 A4 O Address Bus 120 A2 O Address Bus Table 4 2 Connector description X2 Note Please mind the mounted pull up and pull down resistors on the Core Module CM BF537 HUM V3 2 docx 17 5 Application Information 5 1 Supply Voltage Decoupling For a better stability we recommend to add a 100nF capacitor for each power supply pin and a 47uF tantalum capacitor to the Vn voltage rail next to the module 5 2 Reset circuit The reset of the flash and the processor are connected to a power monitoring IC The output can be used as power on reset for external devices see Figure 5 1 33M lt RESET of Flash TCM809SENB713 lt RESET of ADSP BF5xx GND Core Module c a External AN RESET Figure 5 1 Schematic of reset circuit on the Core Module CM BF537_HUM_V3 2 docx 18 5 3 Application Example Schematics 5 3 1 RJ45 schematic
7. Maximum Ratings ces KAG KGG GA 13 3 1 3 ESD Sensitivity sscsciiesiscnsesctsssivscnssssdecustusdestveebdecbuseaisenuvdscveavdeabvnesdecussctuevti RNN N NARRET 14 4 Connector Description PM 15 4 1 EONMECLO 0 ES 15 4 2 Connector X2 ANAREN AAN AAAA AANA ARGAN 16 5 Application Information essssssssscssssssssssecsssseccsssccsssceesssscessscsessecsssceesssecesnscessuscessuccsssuecesanecsssseessusecssaceccssecessseesnatecsnseeesnasees 18 5 1 Supply Voltage Decoupling 5 2 RESET e ol N i mm 5 3 X Application Example SchematiGS u s mnsan 19 5 3 1 RJ45 schem tie ana maana KARAGATANG eL eese benennen QU KA 19 54 Sample Te TTE E 19 5 5 Stand alone Ethernet based MPEG webcam uusssssesenmnsssesesenmnssssssssennnssssssssennunssssssennunsssssssennnnsssssssennunssssssennnnnne 20 6 Mechanical Outline ma NA AANGAL 22 6 1 POP WS W namana NANGKA ANING AN GANANG GANA AA P 22 6 2 Bottom A Hen 22 Sk AA sek abb d SE be 23 6 4 kola e AO AA AA AA 24 6 5 Connectors CM BF537 HUM V3 2 docx 7 2 Board Support Packages aiiscssecssessssessacscuvsssccausssicscnsssnzeauseatuscvennsscensetssoscontssscensseasesstetavavesuesbesinintiverttedwsaeviatisvidiewestioanreed 25 7 3 Blackfin Software Support u ceecssssscsssssccssscccsssccssssccssssecssseessssccesusecsssccesusccssuscessuscsssssessusceesssccesuscessuscectssecsnscecstscesnseeests 25 7 3 1 BLACKS CS POS aicas m
8. a Stand alone Ethernet based MPEG Webcam esee teens notte stt sr tonos 21 Table 6 1 Core Module connector types eese ttts notione nocte 24 Table 8 1 Ordering information 26 Table 8 2 Mount OPTIONS cccssssssssscssecsssesssessssessssesssssessecssecsssccssesessessseesseesseees 26 Table 10 1 Overview CM BF537 C C Q25S32F4 product CHANGES csssscsssscssssecssseecssseccssseccsssecessseessssecsssseccesecsssceessascesssceesnseeessees 28 Table 10 2 Overview CM BF537 C I Q25S32F4 product changes ssssssssscsssssssssscesseccssteccessccsssseccsutecsssceccesecssscecsssecsssceessseecssseessts 28 Table 10 3 Overview CM BF537 C C Q25S64F4 product changes 28 Table 10 4 Overview product anomalies eene 29 Table 11 1 Revision history ms 30 Table 12 1 List of abbreviations RR 31 CM BF537_HUM_V3 2 docx 32
9. view sall Figure 5 1 Schematic of reset circuit on the Core Module 18 Figure 5 2 Schematic for RJ45 Connection sssini 19 Figure 5 3 Configuration with Ethernet and JTAG Connector sssssscssssssseccssssecesnsssecessssceccsnsseecesnsseecssnsseessnsseccesnsseccesnsseesesnsseeseans 20 Figure 5 4 Stand alone Ethernet based MPEG webcam 521 Figure 6 1 Mechanical outline top view sees mas 22 Figure 6 2 Mechanical outline and Bottom Connectors Top View m23 Figure 6 3 Side view with mounted connectors ee eese teen nennt tnnt ttts nott RE ER REAR nott ttts noto teense assent nois ttts nosset 23 Figure 6 4 Recommended footprint for the Core Module top view eterne nnt nnnttts nonne 24 Tables Table 2 1 MeM ry laps soon fanen REE a ae Tessa E VEET EONO Table 2 2 Externally addressable memory E Table 3 1 Electrical characteristics ssssssssssssssscssesssssssssessssssssssessssesssssessssessssseesssscsssssesesseesssnsesssneesssneesssueesssuessssnecsssessssneessssessesneesssess Table 32 Absolute maximumiratings 0 freien Table 4 1 Connector description X1 Table 4 2 Connector description X2 Table 5 1 Parts List RJA5 sss Table 5 2 Bill of Material of sample circuit essssssssessssecsseesssecssscssssssssccssscssssssssessscssssssssccssscsssscessccsnscsssesssscessscsssccsssessccsnscsssesssecssseense Table 5 3 Bill of Materials of
10. 00POZBQO ETH Physical KSZ8041 3 0 2 Processor ADSP BF537BBCZ 5A Rev 0 3 RAM MT48LC16M16A2BG 75IT D Flash PFA8F2000POZBOO ETH Physical KSZ8041 3 2 1 Processor ADSP BF537BBCZ 5A Rev 0 3 RAM MT48LC16M16A2BG 75IT D Flash PF48F3000P0ZBQE ETH Physical KSZ8041 Table 10 2 Overview CM BF537 C I 025532F4 product changes 10 1 3 CM BF537 C C Q25S64F4 CM BF537E 64SD Version Component Type 3 2 1 Processor ADSP BF537KBCZ 6AV Rev 0 3 RAM 1S42S16320B 7BL Flash PF48F3000POZBOE KSZ8041 Table 10 3 Overview CM BF537 C C Q25S64F4 product changes CM BF537_HUM_V3 2 docx 28 10 2 Anomalies Description Version Date 3 2 2011 04 27 3 0 2010 10 12 No anomalies reported yet No anomalies reported yet Table 10 4 Overview product anomalies CM BF537_HUM_V3 2 docx 29 11 Document Revision History Document Revision Version 9 2012 05 24 8 2012 02 07 7 201111 14 6 20111018 5 2011 09 06 4 2011 04 27 3 2010 02 02 2 2009 11 05 1 2009 08 31 Description of Pin 78 and Pin 5 of Core Module corrected Dependability added Memory table update description for PF5 added Pin out and connector description corrected Table 3 1 Electrical characteristics update Pin out and connector description corrected Updated HUM to current design Added industrial version and 64MByte version to this HUM Redesign of Manual Picture 3 7 6 1 6 2 Table 6 1 6 2 updated First release V1 0 of the document copied from CM BF537 V1 2
11. 7 C C Q30S32F4 U CM BF537U The Core Module CM BF537 is powered by Analog Devices single core ADSP BF537 processor up to 600MHz 32MB SDRAM 4MB flash integrated USB 2 0 Device 2x60 pin expansion connectors at a size of 36 5x31 5mm CM BF548 C C Q25S64F8 CM BF548 The Core Module CM BF548 is characterized by its numerous peripheral interfaces its performance in combination with its high speed memory interface DDR Key features are 533MHz 64MB DDR SD RAM 266MHz and 8MB flash CM BF561 C C Q25S64F8 CM BF561 The Core Module CM BF561 is powered by Analog Devices dual core ADSP BF561 processor up to 2x 600MHz 64MB SDRAM 8MB flash 2x60 pin expansion connectors at a size of 36 5x31 5mm eCM BF561 C C Q255S 128F32 eCM BF561 The Core Module CM BF561 is powered by Analog Devices dual core ADSP BF561 processor up to 2x 600MHz 128MB SDRAM 8MB flash 2x100 pin expansion connectors and a size of 44x33mm CM BF537 HUM V3 2 docx 5 Core Module naming information The idea is to put more Core Module specific technical information into the product name New Core Module names will have following technical information covered in their names e Product Family e CPU Type e Connection Type e Operating Temperature Range e Crystal Frequency MHz e RAM MB e Flash MB e External Controllers o Special and or o Former name That expands of course the name but allows the customer to get the
12. 7_HUM_V3 2 docx Bluetechnix Mechatronische Systeme GmbH 2012 All Rights Reserved The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics Terms of delivery and rights of technical change reserved We hereby disclaim any warranties including but not limited to warranties of non infringement regarding circuits descriptions and charts stated herein Bluetechnix makes and you receive no warranties or conditions express implied statutory or in any communication with you Bluetechnix specifically disclaims any implied warranty of merchantability or fitness for a particular purpose Bluetechnix takes no liability for any damages and errors causing of the usage of this board The user of this board is responsible by himself for the functionality of his application He is allowed to use the board only if he has the qualification More information is found in the General Terms and Conditions AGB Information For further information on technology delivery terms and conditions and prices please contact Bluetechnix http www bluetechnix com Warning Due to technical requirements components may contain dangerous substances CM BF537_HUM_V3 2 docx 4 Blackfin Core Modules TCM BF518 C C Q25S32F2 TCM BF518 The Tiny Core Module TCM BF518 is powered by Analog Devices single core ADSP BF518 processor up to 400MHz 32MB SDRAM up to 8MB flash Th
13. C o Commercial version see chapter 8 1 ADSP BF537SKBCZ 6AV 0 70 C e SDRAM o 32MByte SDRAM Version see chapter 8 1 SDRAM Clock up to 133MHz MT48LC16M16A2BG 7 16Mx16 256Mbit at 3 3 V o 64MByte SDRAM Version see chapter 8 1 SDRAM Clock up to 143MHz S42516320B 7BL 8M x16x4 512Mbit at 3 3 V e 4 MByte of Addressable Flash o PF48F2000POZBQO 4Mx16 32Mbit at 3 3 V default only 4MByte addressable CM BF537_HUM_V3 2 docx 8 o Additional flash memory can be connected through the expansion board as parallel flash using asynchronous chip select lines or as an SPI flash e Ethernet Physical Transceiver o Micrel KSZ8041NLI e Low Voltage Reset Circuit o Resets module if power supply goes below 2 93 V for at least 140 ms e Dynamic Core Voltage Control o Core voltage is adjustable by setting software registers on the Blackfin processor o Core voltage range 0 8 1 32V e Expansion Connector A o Data Bus o Address Bus o Control Signals o Power Supply o Ethernet Pins e Expansion Connector B o SPORTO JTAG UARTO UARTI CAN TWI C compatible SPI PPI Parallel Port Interface GPIO s O Oo 0O O O O O 1 2 KeyFeatures e The CM BF537 is very compact and measures only 36 5x31 5mm e Allows quick prototyping of product that comes very close to the final design e Reduces development costs faster time to market e Very cost effective for small and medium volumes 1 3 Applications e Ro
14. SEL5 MO1 MO2 NC MO3 PF6 TMR3 SSEL4 PF10 SSEL1 SCL DTOSEC SSEL7 CANTx TFSO SSEL3 DROSEC TACIO RFSO TACLK3 Table 4 1 Connector description X1 For mount option details see chapter 8 1 1 0 y o 1 0 y o 1 0 PWR PWR 1 0 y o y o 1 0 O 1 0 1 0 Note 1 Pin 8 and 53 as well as pin 20 and 21 are identical Function Note 2 Please mind the mounted pull up and pull down resistors on the Core Module 4 2 Connector X2 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 Signal Name A1 A3 A5 A7 A9 A11 A13 A15 A17 A19 ABE1 SDQM1 LED_ACT GND RX RX ADRY BG CLK_OUT GND AMS3 AWE NMI DO D2 D4 oOooo00000000 47R pull up to 3V3 47R pull up to 3V3 10k pull up 10k pull up 1 0 I O 1 0 Function Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Indicates Ethernet activity AGND use as GND for Ethernet Ethernet receive Ethernet receive CLKOUT Pin of Blackfin Data Bus Data Bus Data Bus CM BF537_HUM_V3 2 docx Signal Name Function 86 D6 1 0 Data Bus 87 D8 I O Data Bus 88 D10 1 0 Data Bus 89 D12 1 0 Data Bus 90 D14 I O Data Bus 91 D15 1 0 Data Bus 92 D13 1 0 Data Bus 93 D11 1 0 Data Bus 94 D9 1 0 Data Bus 95 D7 O Data Bus 96 D5 1 0 Data Bus 97 D3 I O Data Bus 98
15. and updated to Revision 3 0 Table 11 1 Revision history CM BF537_HUM_V3 2 docx 30 12 List of Abbreviations Abbreviation Description ADI Analog Devices Inc Al Analog Input AMS Asynchronous Memory Select AO Analog Output CM Core Module DC Direct Current DSP Digital Signal Processor eCM Enhanced Core Module EBI External Bus Interface ESD Electrostatic Discharge GPIO General Purpose Input Output I Input PC Inter Integrated Circuit VO Input Output ISM Image Sensor Module LDO Low Drop Out regulator MTBF Mean Time Between Failure NC Not Connected NFC NAND Flash Controller o Output os Operating System PPI Parallel Peripheral Interface PWR Power RTOS Real Time Operating System RFU Reserved for Future Use SADA Stand Alone Debug Agent SD Secure Digital SoC System on Chip SPI Serial Peripheral Interface SPM Speech Processing Module SPORT Serial Port TFT Thin Film Transistor TISM Tiny Image Sensor Module TSC Touch Screen Controller UART Universal Asynchronous Receiver Transmitter USB Universal Serial Bus USBOTG USB On The Go ZIF Zero Insertion Force Table 12 1 List of abbreviations CM BF537_HUM_V3 2 docx 31 A List of Figures and Tables Figures Figure 1 1 Main components of the CM BF537 Core Module eterne nnt nente nnn ttts naan nnnc er nonni 8 Figure 2 1 Detailed block diagram sss 10 Figure 2 2 Assenbly drowing top
16. botics e Video security e Video surveillance e Industrial distributed control e Industrial factory automation e Remote monitoring devices e Point of sale terminals e VoIP e Biometrics security e Instrumentation e Medical appliances e Consumer appliances CM BF537_HUM_V3 2 docx 2 General Description 2 1 Functional Description Mem Control Boot Mode JTAG Ethernet Ethernet 16 Bit Data Bus Physical Dynamic Core Voltage ADSP Control BF537 up to Low Voltage 600MHZ Reset Data amp Address Bus 3V3 Power Reset Clock 20 Bit Address Bus Y Clock out PPI SPORTO UART1 UART2 SPI TWI CAN GPIO Figure 2 1 Detailed block diagram Figure 2 1 shows a detailed block diagram of the CM BF537 Other than the SDRAM control pins the CM BF537 has all other pins of the Blackfin processor on its two main 60 pin connectors A special feature of the Core Module CM BF537 is the on board physical Ethernet transceiver from Micrel KSZ8041NLI Dynamic voltage control allows reducing power consumption to a minimum adjusting the core voltage and the clock frequency dynamically in accordance to the required processing power A low voltage reset circuit guarantees a power on reset and resets the system when the input voltage drops below 2 93V 2 2 BootMode By default
17. cluding a VDSP Evaluation Software License DEV BF548 Lite Low cost development board with a socket for Bluetechnix CM BF548 Core Module Additional interfaces are available e g an SD Card USB and Ethernet DEV BF548DA Lite Get ready to program and debug Bluetechnix CM BF548 Core Module with this tiny development platform including an USB Based Debug Agent The DEV BF548DA Lite is a low cost starter development system including a VDSP Evaluation Software License eDEV BF5xx Feature rich low cost rapid development platform which provides all interfaces on dedicated connectors and has all Core Module pins routed to solder pads which easily can be accessed by the developers The eDEV BF5xx supports the latest debugging interface from Analog Devices ADI SADA Analog Devices Stand Alone Debug Agent EVAL BF5xx Tiny low cost embedded platform which supports Bluetechnix powerful Blackfin based Core Modules The form factor 75x75mm of the EVAL BF5xx allows easy integration of the board into OEM products Dedicated interfaces such as USB2 0 SD card slot CAN interface connectors and of course Ethernet turn the EVAL BF5xx into a full featured evaluation platform for most embedded applications Extender boards Extender boards EXT BF5xx are expanding the development and evaluation boards by several interfaces and functionalities Targeted application areas are audio video processing security and surveillance Eth
18. e 2x60 pin expansion connectors are backwards compatible with other Core Modules ACM BF525C C C Q25S64F4N1024 The Core Module ACM BF525C is optimized for audio applications and performance It is based on the high performance ADSPBF525Cfrom Analog Devices It addresses 64MByte SDRAM via its 16bit wide SDRAM bus has an onboard NOR flash of 4MByte and a NAND flash with 1024MByte CM BF527 C C Q50S32F8 CM BF527 The Core Module CM BF527 is powered by Analog Devices single core ADSP BF527 processor key features are USB OTG 2 0 and Ethernet The 2x60 pin expansion connectors are backwards compatible with other Core Modules CM BF533 C C Q25S32F2 CM BF533 The Core Module CM BF533 is powered by Analog Devices single core ADSP BF533 processor up to 600MHz 32MB SDRAM 2MB flash 2x60 pin expansion connectors at a size of 36 5x31 5mm TCM BF537 C 1 Q25S32F8 TCM BF537 The Tiny Core Module TCM BF537 is powered by Analog Devices single core ADSP BF537 processor up to 500MHz 32MB SDRAM 8MB flash a size of 28x28mm 2x60 pin expansion connectors Ball Grid Array or Border Pads for reflow soldering industrial temperature range 40 C to 85 C CM BF537 C C Q25S32F4 CM BF537E The Core Module CM BF537 is powered by Analog Devices single core ADSP BF537 processor up to 600MHz 32MB SDRAM 4MB flash integrated TP10 100 Ethernet physical transceiver 2x60 pin expansion connectors at a size of 36 5x31 5mm CM BF53
19. ernet access positioning automation and control experimental development and measuring Note Bluetechnix is offering tailored board developments as well CM BF537 HUM V3 2 docx 7 1 Introduction The Core Module CM BF537 is characterized by its field of application performance and configuration possibility The module integrates processor RAM flash external peripheral controllers and power supply at a size of 31 5x36 5mml It is based at the high performance ADSP BF537 from Analog Devices The Core Module is designed for commercial and industrial usage depending on temperature range It addresses up to 64MByte SDRAM via its 16bit wide SDRAM bus has an onboard NOR flash of 4MByte and offers a CAN interface In addition there is an extra Ethernet physical transceiver 10 100Mbit onboard 1 1 Overview The current hardware version see Version Information of Core Module CM BF537 C C Q25S32F4 CM BF537E consists of the following components Parts of mounting options of CM BF537 are listed in addition 60 Pin Expansion Connector B Dynamic Up to Core Voltage ADSP 8MByte Control Up to Flash DE S37 64MByte up to SDRam Low Voltage 600 MHz Ethernet Reset Physical 60 Pin Expansion Connector A Figure 1 1 Main components of the CM BF537 Core Module e Analog Devices Blackfin Processor BF537 o Industrial version see chapter 8 1 ADSP BF537SBBCZ 5A 40 85
20. esent a statistical approximation of how long a set of devices should last before failure Nevertheless we can calculate an MTBF of the Core Module using the bill of material We take all the components into account The PCB and solder connections are excluded from this estimation For test conditions we assume an ambient temperature of 30 C of all Core Module components except the Blackfin processor 80 C and the memories 70 C We use the MTBF Calculator from ALD http www aldservice com and use the reliability prediction MIL 217F2 Part Stress standard This method resulted in a MTBF of 439232 hours for the CM BF537E CM BF537_HUM_V3 2 docx 27 10 Product History 10 1 Version Information 10 1 1 CM BF537 C C Q25S32F4 CM BF537E Version Component Type 3 0 1 Processor ADSP BF537KBCZ 6AV Rev 0 3 RAM MT48LC16M16A2BG 75IT D Flash PFA8F2000POZBQO ETH Physical KSZ8041 3 0 2 Processor ADSP BF537KBCZ 6AV Rev 0 3 RAM 1S42S16160D 7BL Flash PFA48F2000POZBOO ETH Physical KSZ8041 3 0 3 Processor ADSP BF537KBCZ 6AV Rev 0 3 RAM 1S42S16160D 7BL Flash PF48F3000POZBQ0A ETH Physical KSZ8041 3 2 1 Processor ADSP BF537KBCZ 6AV Rev 0 3 RAM MT48LC16M16A2BG 75IT D Flash PF48F3000P0ZBQE ETH Physical KSZ8041 Table 10 1 Overview CM BF537 C C 025532F4 product changes 10 1 2 CM BF537 C I Q25S32F4 CM BF537E I Version Component Type 3 0 1 Processor ADSP BF537BBCZ 5A Rev 0 2 RAM MT48LC16M16A2BG 75IT D Flash PFA8F20
21. m view of the CM BF537 All dimensions are given in millimeters pO NN NN NN BNG 6 66 hb 6 5 6 08 o E E E a E E SE E EE E n LA NEE EE RE RE 66 6 6 8 bb O 8 0G SALA SE EE E E EK o 5G bh 6 8 bh NN 08O 31 00 29 00 Eg B Ge 34 00 36 00 Figure 6 1 Mechanical outline top view 6 2 Bottom View Figure 6 2 shows the bottom view of the CM BF537 All dimensions are given in millimeters CM BF537_HUM_V3 2 docx 26 53 28 80 Figure 6 2 Mechanical outline and Bottom Connectors Top View 6 3 Side View Figure 6 3 shows the side view of the CM BF537 All dimensions are given in millimeters Figure 6 3 Side view with mounted connectors The total minimum mounting height including receptacle at the motherboard is 6 1mm CM BF537_HUM_V3 2 docx 23 6 4 Footprint 36 00 Figure 6 4 Recommended footprint for the Core Module top view The footprint of the CM BF537 is available on request The used connectors can be found in Table 6 1 For detailed dimensions of the connectors please see the datasheet from the manufacturer s website 6 5 Connectors The Core Module features a Hirose 0 6mm pitch connectors The base board has to use the complementary connector Designator Manufacturer Manufacturer Part No Core Module X1 X2 Hirose FX8 60P SV Base board X1 X2 Hirose FX8 60S SV Table 6 1 Core Module connector types CM BF537_HUM_V3 2 docx 24 7 S
22. most important Core Module specific information at the first sight Have a look at the example below to get an idea of the new Core Module names Example CM BF537 C C Q25S32F4 CM BF537E CM BF537 C C 025 S32 Product Family CM Core Module SBC Single Board Computer CPU Type Equals the name of CPU Connection Type A BGA B Border pad C Connector S Special Operating Temperature Range A Automotive 40 to 125 C Commercial 0 to 70 Industry 40 to 85 Crystal Frequency Notation QXX MHz CM BF537E Former name Special Custom Core Modules or specials uC uclinux Extra controllers mounted E Ethernet U USB Flash MB F NOR Flash MB N NAND Flash MB RAM S SDRAM MB CM BF537_HUM_V3 2 docx Blackfin Development Boards ADEV BF52xC Feature rich low cost embedded audio development platform which supports Audio Core Modules ACM The form factor of the ADEV BF52xC allows easy integration of the board into OEM products Dedicated interfaces such as USB2 0 Line In Out headphone out and an onboard silicon microphone turn the ADEV BF52xC into a full featured development platform for most embedded audio applications in commercial areas DEV BF5xxDA Lite Get ready to program and debug Bluetechnix Core Modules with this tiny development platform including an USB Based Debug Agent The DEV BF5xxDA Lite is a low cost starter development system in
23. o 1 2 3 4 5 6 7 eo 43 44 45 Connector X1 Signal Name RSCLKO TACLK2 DROPRI TACLK4 TSCLKO TACLK1 DTOPRI SSEL2 CLKBUF SDA PF4 TMR5 SSEL6 MO1 NC MO2 MO3 PF5 TMR4 SSEL5 MO1 MO2 NC MO3 Vin 3V3 Vin 3V3 PGO PPI1DO PG2 PPI1D2 PG4 PPI1D4 PG6 PPI1D6 PG8 PPI1D8 DR1SEC PG10 PPI1D10 RSCLK1 PG12 PPI1D12 DR1PRI PG14 PPI1D14 TFS1 PPI1SY3 PF7 TMR2 PPI1SY1 PF9 TMRO PPI1SY1 PF9 TMRO PF3 Rx1 TMR6 TACI6 PF1 DMAR1 TACIT RxO PF11 MOSI PF13 SCK BMODEO GND TCK TDI TRST EMU TMS TDO BMODE2 N C BMODE1 PF12 MISO PFO DMARO TxO PF14 SPI SS PF2 Tx1 TMR7 PPI1Clk PF15 TMRCLK PPI1Sy2 PF8 TMR1 PG15 PPI1D15 DT1PRI PG13 PPI1D13 TSCLK1 PG11 PPI1D11 RFS1 Type Function 1 0 O O O 25MHz buffered clock output 1 0 1 0 1 0 PWR 3V3 10 500mA peak for supply PWR 3V3 10 500mA peak for supply I O 1 0 I O 1 0 I O 1 0 I O 1 0 I O 1 0 1 0 1 0 I O 1 0 I O 10k pull down PWR 10k pull up 10k pull up 4k7 pull down O 10k pull up O 10k pull down NC 10k pull down 1 0 I O 1 0 I O 1 0 1 0 1 0 1 0 I O CM BF537 HUM V3 2 docx 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Signal Name PG9 PPI1D9 DT1SEC PG7 PPI1D7 PGS PPI1D5 PG3 PPI1D3 PG1 PPI1D1 GND GND PF5 TMRA S
24. ormer Header 7 Pin dual row 4k7 Resistor 220R Resistor Switch ADP3338 N mr Ww Low dropout regulator Table 5 2 Bill of Material of sample circuit 5 5 Stand alone Ethernet based MPEG webcam The CM BF537 module can be used as a stand alone module for a camera system requiring only power supply and the direct attachment of a compatible video camera An extender board including a camera is available at Bluetechnix EXT BF5xx CAM CM BF537_HUM_V3 2 docx 20 EET BEBE pei TMRO 533 st 33V0 SW SMD 2 EEbkLERTEEE REEREE gees Tm TEAS AAA ARR dade gouge URUICO y Figure 5 4 Stand alone Ethernet based MPEG webcam Designator Description Quantity C3 C4 C5 C6 C8 1uF C7 C9 10uF Cam1 OV7660FSx CM1 DS1 green x1 DC 8 x2 HFJ11 2250E R1 R3 10k R7 R8 R9 220R S1 S2 U1 ADP3338 U2 XC6204B252MR U3 XC6204B182MR Capacitor Capacitor Camera module CM BF537 SMD LED Power connector DC 8 RJ45 with transformer Resistor Resistor Switch Low dropout regulator XC6204 high speed LDO XC6204 high speed LDO Table 5 3 Bill of Materials of a Stand alone Ethernet based MPEG Webcam Have a look at our DEV BF5xxDA lite schematics which can be found at http www bluetechnix com goto dev bf5xxda lite to get application examples A N W A 0 CM BF537 HUM V3 2 docx 21 6 Mechanical Outline 6 1 Top View Figure 6 1 shows the botto
25. r of the Core Module Nevertheless this pin can be used to select bank2 3 of the flash memory To the Core Module In this realize this the 00 resistor R18 must be removed and a 00 resistor R19 must be soldered to case PF5 is routed to the flash memory instead to the connector au R t2 Jena a E EG T go fag D EJ 8 Ria os ea ur C43 C42 r C23 as c35 H N s a e as t NM m Elek ga Son oo Mo 99 Figure 2 2 Assembly drawing top view CM BF537_HUM_V3 2 docx 2 3 2 Externally Addressable Memory on connector The Blackfins External Bus Interface EBI allows connecting devices via an asynchronous memory interface AMS Line Start Address End Address Max Size nAMS2 0x20200000 0x202FFFFF 1MB nAMS3 0x20300000 0x203FFFFF 1MB Table 2 2 Externally addressable memory CM BF537 HUM V3 2 docx 12 3 Specifications 3 1 Electrical Specifications 3 1 1 Operating Conditions Symbol Parameter Min Typical Max Unit Vin Input supply voltage 3 0 3 3 3 6 V leis 3 3V current 350 mA Vou High level output voltage 2 8 V Vor Low level output voltage 0 5 V In IO input current 5 5 10 HA loz Three state leakage current 10 HA aman V current in deep sleep mode 5 16 S mA Isteep V current in sleep mode 19 5 mA IBYE V current in idle mode 24 5 mA lye Vi Current in with core running at 400 MHz 138 mA FESTE Vi current in hibernate state at
26. the boot mode 000 BMODE2 low BMODE1 low BMODEO low All BMODE pins have internal pull down resistors Connect BMODEO to Vcc and leave BMODE1 BMODE2 pins open for boot mode 001 equals to 8 or 16 bit PROM FLASH boot mode this is the default boot mode of BLACKSheep OS See Blackfin Datasheets or Eval DevBoard manuals for more details CM BF537 HUM V3 2 docx 10 2 3 Memory Map 2 3 1 Memory Type FLASH Banko PF4 Flag low FLASH Bank1 PF4 Flag high FLASH Bank2 PF5 Flag low FLASH Bank3 PF5 Flag high SD RAM SD RAM Core Module Memory Start Address End Address Size Comment 0x20000000 0x201FFFFF 2MB 1 8 of 16MB Micron Flash PFA8F3000P0ZBQ 0x20000000 Ox201FFFFF 2MB 1 8 of 16MB Micron Flash PF48F3000P0ZBQ 0x20000000 0x201FFFFF 2MB 1 8 of 16MB Micron Flash PFA8F3000P0ZBQ 0x20000000 Ox201FFFFF 2MB 1 8 of 16MB Micron Flash PFA8F3000POZBQ 0x00000000 0x01FFFFFF 32MB 16Bit Bus Micron MT48LC16M16A2FG 0x00000000 Ox1FFFFFFF 64MB 16Bit Bus ISSI 1S42S16320B 7BL Table 2 1 Memory map The maximum amount of addressable memory by a single asynchronous memory bank is 2MByte In order to be able to use more than 2MByte on a single bank 2 GPIOs are used to select which 2MB section of flash is active in the memory window of the Blackfin processor This frees up the remaining banks for the user The maximum amount of memory addressable by the processor is BMByte PF5 is routed by default to the connecto
27. upport 7 1 General Support General support for products can be found at Bluetechnix support site https support bluetechnix at wiki 7 2 Board Support Packages Board support packages and software downloads are for registered customers only https support bluetechnix at software 7 3 Blackfin Software Support 7 3 1 BLACKSheep OS BLACKSheep OS stands for a powerfully and multithreaded real time operating system RTOS originally designed for digital signal processing application development on Analog Devices Blackfin embedded processors This high performance OS is based on the reliable and stable real time VDK kernel from Analog Devices that comes with VDSP IDE Of course BLACKSheep OS is fully supported by all Bluetechnix Core Modules and development hardware 7 3 0 LabVIEW You can get LabVIEW embedded support for Bluetechnix Core Modules by Schmid Engineering AG http www schmid engineering ch 7 8 3 uClinux You can get uClinux support boot loader and uClinux for Bluetechnix Core Modules at http blackfin uClinux org 7 4 Blackfin Design Services Based on more than seven years of experience with Blackfin Bluetechnix offers development assistance as well as custom design services and software development 7 4 1 Upcoming Products and Software Releases Keep up to date with all product changes releases and software updates of Bluetechnix at http www bluetechnix com CM BF537 HUM V3
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