Sony E01X23A41 User's Manual
Contents
1. c 5 5 O 3 LV SV D 606 9 SSVIN TVIHalviN GV31 ONILW 1d 0109 LNAWIVAYL QV31 3OvMOVd 5 ADVMOVd 5 I 9v 0 N Xepu Uld la SZ 0 7092 A gt lt GO EDGE Geo 01 L e2ueJejeu 0 0 00 9 g V Onah 7 c 2205 09 606 0T 072 VOTOIE 2 auljino2. V1 Light Strobe light timing Signal output 350mV Vlag lag Output i 1 u 11 ICX423AL SONY 1NO 499 lt V LO LO vVOOVYZ LO Vecv 3001 AEE 46 9 6 6 100 2 6 AS2 NI Li INS9CLOXO T LO 0 A0c c T O A9 od cH ALL SAX SSX VAX 12 LOSX LAX AS A6 5 ASI AOE ICX423AL SONY Spectral Sensitivity Characteristics includes lens characteristics excludes light source characteristics 1 0 dI NOEL 0 9 e esuodsay 0 8 0 7 0 6 0 4 0 3 0 2 0 1 1000 900 800 700 600 500 400 Wave Length nm Sensor Readout Clock Timing Chart V1 V2 V3 V4 Odd Field V1 V2 V3 V4 Even Field Unit us 13 ICX423AL SONY L T 111 4 felel Gee oee Goce
3. seg os majros to t20 i25130 i351140 45150 55 160 165 179 17510085 o0 Example 5K 2 0V Vsus 12 0V 3 This must no exceed the Vv voltage of the vertical clock waveform 4 1 Ourrent to each pin when 20V is applied to Vpp RD Vour Vss HIS and SUB pins while pins that are not tested are grounded 2 Current to each pin when 20V is applied sequentially to Vo1 Vo2 Vos and pins while pins that are not tested are grounded However 20V is applied to SUB pin 3 Current to each pin when 15V is applied sequentially to Hj RG and pins while pins that are not tested are grounded However 15V is applied to SUB pin 4 Current to VL pin when 30V is applied to Vo1 Vos HIS Voo RD and Vour pins or when 24V is applied to RG pin or when 20V is applied to Voz Vac Vss Hoi and Hee pins while VL pin is grounded However GND and SUB pins are left open 5 Current to SUB pin when 55V is applied to SUB pin while pins that are not tested are grounded SONY ICX423AL Clock Voltage Conditions Waveform yaa DEN Vvu2 2 VvL1 VVL2 E VvH1 0 2 Vertical transfer clock 0 aaa We o Me 98 vwu 98 V 2 loei Wes ro so v 4 1 The reset gate clock voltage need not be adjusted when the reset gate clock is driven when the specifications are as given
4. 5 clock duty factor lt 0 1 lt lt lt lt lt Bias Conditions OupaampiW edanwta v 150 v _ Ouputamplifergatevotage Ve a2 V OOupurampi erssune ves Ground wih 7500 resistor a Susrete acjusinentrange vas eive _ Subsmaevatageadsmenpenson ave __ Reset gate clock voltage adustment range 0 V _ Reset gate cock voltage adjustment precision efa Protective transistor bias Horizontal register input source bias SONY ICX423AL DC Characteristics tem Wm Max Uni dain euvent w 6 mA _ mutent s input current m _ 2 Indications of substrate voltage Vsus and reset gate clock voltage setting value The setting value of the substrate voltage and reset gate clock voltage are indicated on the back of the image sensor by a special code Adjust the substrate voltage VsuB and reset gate clock voltage VRGL to the indicated voltage The adjustment precision is 3 VsUB code one character indication LI VRGL code one character indication T T VrRGL code Vsus code Code and optimal setting correspond to each other as follows veer 1 2 8 4 5 6 7 ovina sting 05 0 15 20 25 30 D E f G h J N PIO R SI T U V W X Y Z
5. Oct GLE 016 Ge sjel ste i 0 GL Ol 289 ino aoo vA ZA st LA n2 NO gt 91 Heyg ICX423AL SONY LA 4 8 L 15 oy 0 01 0 01 S 0 0 01 S 097 Sr ou S J ejuozuop 11245 SONY ICX423AL Notes on Handling 1 Static charge prevention CCD image sensors are easily damaged by static discharge Before handling be sure to take the following protective measures a Either handle bare handed or use non chargeable gloves clothes or material Also use conductive shoes b When handling directly use an earth band c Install a conductive mat on the floor or working table to prevent the generation of static electricity d lonized air is recommended for discharge when handling CCD image sensor e For the shipment of mounted substrates use boxes treated for the prevention of static charges Soldering a Make sure the package temperature does not exceed 80 C b Solder dipping in a mounting furnace causes damage to the glass and other defects Use a 30W soldering iron with a ground wire and solder each pin in less than 2 seconds For repairs and remount cool sufficiently c To dismount an image sensor do not use a solder suction equipment
6. ICX423AL SONY G SI eui pue 0 SI sse eu Jo SSOUYOIY eu uey ss s uuolloq eui o1 eu JO eu WWG p O F 9t SI Bose 9U 94 1 eu _ 7 ugy SS 51 8 eui eui Jo eu L O 08 A SI 92U919J981 BU 0 5 ease y JO J91uo9 941 5 sjulod 16199 99 S G uuolloq 94 2 JO SIXe 92u9J9J8J y SI g eoin 1 ejou y Jo 191ue2 y sessed 9 aul 1 941 A JEDILIOA JO SIXe 99U9J9J9J y 51 pue ou JO y uBnoiuu sessed eui 1 5 eu y JO 991 SI o LO 20 loH pereBuo 3 0 440 GNVLS LV 601 0 0 007 60 c 0c 1008 did oz
7. below In this case the reset gate clock voltage setting indicated on the back of the image sensor has not significance diagram 2 Reset gate clock 92 02 vi 8 85 95 V 3 SONY ICX423AL Clock Equivalent Circuit Constant Capacitance between vertical transfer Covs ____ 2700 F rss Capacitance between vertical transfer 23 C v Capacitance between horizontal Capacitance between horizontal Capacitance between reset gate clock Cono and GND Capacitance between substrate clock R 2 e Vertical transfer clock series resistor Ri R2 R3 R4 Vertical transfer clock ground resistor Horizontal transfer clock series 0 Covi2 H1 R2 Covi lt gt Covat Cov23 1 4 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit SONY ICX423AL Drive Clock Waveform Conditions 1 Readout clock waveform L 0 f twh otf 2 Vertical transfer clock waveform E VVHL Vvu2 2 VvL4 2 Vov n 1 to 4 Ce SONY ICX423AL 3 Horizontal transfer clock waveform Reset gate clock waveform tr twh tf VoH VORG VRGL sn ERES 4 Substrate clock waveform Clock
8. lens with 5005 t 1 00mm as an IR cut filter and image at F8 The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity luminous intensity E Standard imaging condition II Image a light source color temperature of 3200K with a uniformity of brightness within 296 at all angles Use a testing standard lens with CM500S t 1 00mm as an IR cut filter The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm 1 Sensitivity Set to standard imaging condition I After selecting the electronic shutter mode with a shutter speed of 1 2505 measure the signal output Vs at the center of the screen and substitute the value into the following formula 290 S Vs 50 mV 2 Saturation signal Set to standard imaging condition II After adjusting the luminous intensity to 10 times the intensity with average value of signal output 350mV measure the minimum value of the signal output 10 SONY ICX423AL 3 Smear Set to standard imaging condition II With the lens diaphragm at F5 6 to F8 adjust the luminous intensity to 500 times the intensity with average value of the signal output 350mV When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings measure the maximum value VSm mV of the signal output and substitute the value into the following formula Sm 20
9. x log L y 1 350 500 10 x 100 dB 1 10V method conversion value 4 Video signal shading Set to standard imaging condition II With the lens diaphragm at F5 6 to F8 adjust the luminous intensity so that the average value of the signal output is 350mV Then measure the maximum Vmax mV and minimum Vmin mV values of the signal output and substitute the values into the following formula SH Vmax Vmin 350 x 100 5 Dark signal Measure the average value of the signal output Vdt mV with the device ambient temperature 60 C and the device in the light obstructed state using the horizontal idle transfer level as a reference 6 Dark signal shading After measuring 5 measure the maximum mV and minimum Vdmin mV values of the dark signal output and substitute the values into the following formula AVdt Vdmax Vdmin mV 7 Flicker Set to standard imaging condition II Adjust the luminous intensity so that the average value of the signal output is 350mV and then measure the difference in the signal level between fields AVf mV Then substitute the value into the following formula F AVf 350 x 100 8 Lag Adjust the signal output value generated by strobe light to 350mV After setting the strobe light so that it strobes with the following timing measure the residual signal Vlag Substitute the value into the following formula Lag Vlag 350 x 100 FLD
10. Switching Characteristics ow w w FRescouicock vr os ma mu maar weve e os us e me e 5 9 tn ie Horizontal transfer clock 538 001 ju During ransfer cloc parallel serial CN mmm ep pa conversion Reset gate charge SONY ICX423AL Image Sensor Characteristics 25 Sensitivity zo 1000 11 J Saturation signal _ Vsat 1000 mV 2 60 Smear Sm _ 180 120 dB 3 Video signal shading SH 25 2 Dark signal Vat Dark signal shading Lag Image Sensor Characteristics Measurement Method O Measurement conditions 1 In the following measurements the substrate voltage and the reset gate clock voltage are set to the values indicated on the device and the device drive conditions are at the typical values of the bias and clock voltage conditions 2 In the following measurements spot blemishes are excluded and unless otherwise specified the optical black OB level is used as the reference for the signal output and the value measured at point A in the drive circuit example is used O Definition of standard imaging conditions 1 Standard imaging condition I Use a pattern box luminance 706cd m color temperature of 3200K halogen source as a subject Pattern for evaluation is not applicable Use a testing standard
11. When using an electric desoldering tool use a thermal controller of the zero cross On Off type and connect it to ground Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt Clean glass plates with the following operation as required and use them a Operate in clean environments around class 1000 is appropriate b Do not either touch glass plates by hand or have any object come in contact with glass surfaces Should dirt stick to a glass surface blow it off with an air blower For dirt stuck through static electricity ionized air is recommended Clean with a cotton bud and ethyl alcohol if the grease stained Be careful not to scratch the glass d Keep in a case to protect from dust and dirt To prevent dew condensation preheat or precool when moving to a room with great temperature differences e When a protective tape is applied before shipping just before use remove the tape applied for electrostatic protection Do not reuse the tape Do not expose to strong light Sun rays for long periods For continuous using under cruel condition exceeding the normal using condition consult our company Exposure to high temperature or humidity will affect the characteristics Accordingly avoid storage or usage in such conditions CCD image sensors are precise optical equipment that should not be subject to too much mechanical shocks 16
12. lock Diagram and Pin Configuration Top view 2 O D gt Output Unit Vor Horizontal Register RD RG VL Hj H2 HIS Note Photo sensor Pin Description ve GG Output amplifier gate bias 55 Output amplifier source e w No V V RD RG Reset gate clock Protective transistor bias V 0 V Protective transistor bias Horizontal register transfer clock GND GND O o Horizontal register transfer clock v EUM Vies EM NN SUB _14 GND Je Vor EM V NU No _ NM NM Veo Output amplifier drain power 20 HIS Horizontal register input source bias 11 12 13 14 15 16 17 18 19 20 SONY ICX423AL Absolute Maximum Ratings Substrate voltage SUB GND 03t0455 V f r HIS oo RD Vor Ves GND v Supply voltage HS Vo RD Vor Ves SUB V Votage diference between vertical ctockinput pins V a _ Voltage difference between horizontal clock inputpins ____ v _ p pc V s s lt lt lt lt lt lt lt lt lt Ho1 RG Vac GND 100045 RG Vac SUB 550410 V V 1 Vos HIS RD Vout V 0 3t0480 V Vos Vac Vss Ho VL 03t0420 V Storage temperature Operating temperature 1 27V Max when clock width lt 10
13. me ICX423AL Diagonal 11mm Type 2 3 CCD Image Sensor for CCIR B W Video Cameras Description The ICX423AL is an interline CCD solid state image 20 pin DIP Ceramic sensor suitable for CCIR B W video cameras with a diagonal 11mm Type 2 3 system Compared with the current product ICX083AL basic characteristics such as sensitivity and smear are improved drastically and high saturation characteristics are realized This chip features a field period readout system and an electronic shutter with variable charge storage time This chip is compatible with the pins of the ICX083AL and has the same drive conditions Features High sensitivity 3 0dB compared with the ICX083AL e Low smear 10 0dB compared with the ICX083AL High saturation signal 2 0dB compared with the ICX083AL High resolution and Low dark current Excellent antiblooming characteristics Continuous variable speed shutter Optical black position Device Structure Top View Interline CCD image sensor Optical size Diagonal 11mm Type 2 3 Number of effective pixels 752 H x 582 V approx 440K pixels Total number of pixels 795 H x 596 V approx 470K pixels Chip size 10 25mm H x 8 5mm V Unit cell size 11 6um H x 11 2um V Optical black Horizontal H direction Front 3 pixels rear 40 pixels Vertical V direction Front 12 pixels rear 2 pixels Number of dummy bits Horizontal 22 Ver
14. nder the said laws or regulations You should be responsible for compliance with the said laws or regulations No License Implied he technical information shown in this specifications book is for your reference purposes only The availability of this specifications book shall not be construed as giving any indication that Sony and its licensors will license any intellectual property rights in such information by any implication or otherwise Sony will not assume responsibility for any problems in connection with your use of such information or for any infringement of third party rights due to the same It is therefore your sole legal and financial responsibility to resolve any such problems and infringement Governing Law This Notice shall be governed by and construed in accordance with the laws of Japan without reference to principles of conflict of laws or choice of laws All controversies and disputes arising out of or relating to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the court of first instance Other Applicable Terms and Conditions The terms and conditions in the Sony additional specifications which will be made available to you when you order the Products shall also be applicable to your use of the Products as well as to this specifications book You should review those terms and conditions when you consider purchasing and or using the Products SONY ICX423AL B
15. tical 1 even fields only Substrate material Silicon Sony reserves the right to change products and specifications without prior notice This information does not convey any license by any implication or otherwise under any patents or other right Application circuits shown if any are typical examples illustrating the operation of the devices Sony cannot assume responsibility for any problems arising out of the use of these circuits des E01X23A41 SONY ICX423AL USE RESTRICTION NOTICE December 1 2003 ver This USE RESTHICTION NOTICE Notice is for customers who are considering or currently using the CCD products Products set forth in this specifications book Sony Corporation Sony may at any time modify this Notice which will be available to you in the latest specifications book for the Products You should abide by the latest version of this Notice If a Sony subsidiary or distributor has its own use restriction notice on the Products such a use restriction notice will additionally apply between you and the subsidiary or distributor You should consult a sales representative of the subsidiary or distributor of Sony on such a use restriction notice when you consider using the Products Use Restrictions The Products are intended for incorporation into such general electronic equipment as office products communication products measurement products and home electronics products in accordance with the terms and condi
16. tions set forth in this specifications book and otherwise notified by Sony from time to time You should not use the Products for critical applications which may pose a life or injury threatening risk or are highly likely to cause significant property damage in the event of failure of the Products You should consult your Sony sales representative beforehand when you consider using the Products for such critical applications In addition you should not use the Products in weapon or military equipment Sony disclaims and does not assume any liability and damages arising out of misuse improper use modification use of the Products for the above mentioned critical applications weapon and military equipment or any deviation from the requirements set forth in this specifications book Design for Safety Sony is making continuous efforts to further improve the quality and reliability of the Products however failure of a certain percentage of the Products is inevitable Therefore you should take sufficient care to ensure the safe design of your products such as component redundancy anti conflagration features and features to prevent mis operation in order to avoid accidents resulting in injury or death fire or other social damage as a result of such failure Export Control f the Products are controlled items under the export control laws or regulations of various countries approval may be required for the export of the Products u
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