Sanyo EP92H User's Manual
Contents
1. we oa High side switches and condenser J5 T1 i ip PicoLogic microphones for cell phones High side switches Low voltage VGsS 4V drive Year Low VF IR Schottky barrier diodes for power management 4 Low Ve IR Schottky barrier diode development roadmap New generation P Low Vf Low Ip High J 3rd Generation N Miniature thin form performance ee peer package 2nd Generation w Vp high de ow VF Low WV Low V Ti barrier sub Ti barrier Low forward voltage Tst Generation Low Ip high density panne 3 sub MO barrier 130 guarahteed Contributes to Performance Parallel Twin SBD Compound Multi Function a gt MOS SBD product TR SBD deployment increased efficiency miniaturization and thinner form factors 2006 in end products Year 2003 2004 a lF A 44 VF I comparison data for earlier and low VF devices Schottky barrier diodes IF VF Comparison with earlier SANYO products E C A a SB10 015C i m a g SANYO supplies high performance GaAs switching ICs that feature the industry s smallest package size and smallest number SANYO S Li neu p of H e h Rel la bi i ity of external components SANYO discrete devices have been always leading the cell phone and mobile equipment markets SANYO is also developing devices that support the need for higher speeds and larger data capacities for image and video data D e2. mW typ dB typ dB otes Nch 30 0 9 1 15 o 30 11 2 4 70 100 15 6 SCH2602 Pch SCH6 1 6 x 1 6 12 0 31 0 47 0 67 1 5 160 Pch Nch Nch 30 o7 5 2 0 35 7 10 5 4 80 100 1 5 5 3LP03M MCP 21x20 30 1 9 2 8 250m 40 Pch 25 4 5 26 100 1 1 17 3LN03M MCP 21x20 30 0 9 1 15 350m 30 Nch 29 4 5 80 100 0 9 8 5 MCH3411 MCPH6 21x20 30 90m 118m 3 270 Nch lee 4 70 100 1 6 MCH6305 MCPH6 21x20 20 65m 98m 4 680 Pch 10 5 4 80 100 1 5 5 MCH6307 MCPH6 21x20 12 46m 66m 98m 5 940 Pch 12 5 4 30 100 1 5 10 5 CPH6311 CPH6 2 8 x 2 9 20 42m 60m 5 1230 Pch 12 5 4 40 100 1 3 8 5 ECH8603 ECH8 2 8x2 9 20 54m 87m 4 800 Pch Dual 10 4 30 100 1 5 9 5 ECH8611 ECH8 2 8x2 9 12 40m 65m 5 1230 Pch Dual 12 5 4 40 100 13 8 5 VEC2302 VEC8 2 8 x2 9 30 168m 3 510 Pch Dual 12 5 4 30 100 1 5 10 5 2SC5645 VEC2303 VEC8 2 8 x 2 9 12 49m 75m 107m 4 940 Pch Dual 25 4 5 35 100 1a i7 SBFP420 VGS 4V OVGS 1 8V 125 4 30 100 1 5 10 5 2SC5645 12 4 70 100 1 5 8 5 2SC5781 125 4 40 100 T3 10 5 2SC5782 Size VcEo Ic Pc hre Vce sat i 11 2 4 70 100 15 8 5 28C5781 aks eee mm V A w Min to Max Max mV orally 15C01S SMCP 1 6 x 1 6 15 0 6 0 2 300 to 800 300 NPN 30C02S SMCP 1 6 x 1 6 15 0 8 0 2 300 to 800 280 NPN H2101 i i 240 Conio Isolation Insertion Loss PinidB za TORTE oe oa 300 to 800 ane Voltage typ dB typ 4B typ dBm Notes V Mis YP p SCH2201 SCH6 16X16 15 0 8 0 4 300 to 800 280 NPN NPN k k k k NPN SCH6 1 6 x 1 6 30 0 6 ae ae
3. Package ECSP ECSP ECSP ECSP SSFP SSFP ECSP ECSP SSFP SSFP ECSP ECSP ECSP Package ECSP ECSP ECSP MCPH6 MCPH6 MCPH6 MCPH6 SPM3211 Reverse control IC of SPM3212 SPM3215 Single control IC SPM3226 Reverse control IC of SPM3227 MCH5801 MCH5815 CPH5802 CPH5811 Package Size VDSS mm V MCPH5 20 20 20 MCPH5 Zeal 20 12 CPH5 2 8 X 2 9 20 CPH5 2 8 X 2 9 20 SANYO s Lineup of High Reliability Discrete Devices Size mm 1 0 x 0 6 1 0 x 0 6 1 0 x 0 6 1 0 x 0 6 1 4x0 8 1 4 x 0 8 1 0 x 0 6 1 0 x O86 1 4 x 0 8 1 4 x 0 8 dec 08 1 2x0 8 1 2x0 8 Size mm 1 2 x 0 8 1 2 x 0 8 1 2x0 8 22 0 21x 2 0 2 1 x 2 0 2l X 20 As miniaturization and efficiency advance and improve in portable equipment the needs for further miniaturization and lower power consumption in discrete devices are increasing even faster SANYO responds to these needs by providing an extensive line of products that contribute to reduced mounting areas and reduced parts counts in application circuits Ultralow on resintance Power MOSFETs for RF and logic block Si y Ros on Ros on Ros on l Ci Type No Package e ete VGs 4 5V VGs 2 5V VGs 1 5V p ms Polarity mm V Max 2 Max Q Max 2 A typ PF SCH1302 SCH6 1 6 x 1 6 20 0 165 0 22 0 39 2 410 Pch SCH2601 Pch SCH6 1 6 x 1 6 30 9 2 8 0 4 40 Pch Nch ne Vceo Ic Pc Ne s21e Not Ga GHz V mA
4. V gt O Output voltage Vout V Vop 3 3V lout 50 mA loutr 50 mA At lout 50 mA efficiency 80 6 At Vov 2 9 V Ver 7 78 V i At Vop 2 9 V Viv 7 44 V 10 At lour 100 mA efficiency 72 0 At Voo 3 3 V Vrr 9 03 V At Voo 3 3 V Voo 8 71 V Maximum efficiency 80 8 At Voo 3 7 V Ver 10 26 V At Vov 3 7 V Vop 9 96 V 0 z 0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100 Output current lout mA N Output current lout mA Output current lout mA This IC is based on a unique SANYO idea and is a high efficiency charge pump IC that was newly developed taking advantage of CMOS technologies that fuse SANYO s circuit and process technologies This IC is optimal for power supplies in portable electronic equipment This IC introduces technologies that completely overturn the previous common knowledge that although charge pump circuits were low noise they suffered from poor efficiency gt i a S ao a Sei T A e N d amp gt E A d 4 1 b g m T ee o a e ol Sn TF Ss K ul d I we WW Xe ey Uo s Y The ability to provide a stepped up voltage with low noise makes this circuit optimal for embedding in modules 3V 4 5 V 100 mA 15 V 10 mA av B Sven 7 V 500 uA av B fear CCD Power Supply IC for Camera Cell Phones P NS711EN lt I Regulates a 3 3 to 4 5 V
5. ISB Solo ISB Duo and IS the application ee In addition to standard products customer specified circuit blocks can also be converted optimal process thus creating a new module device in a short time Noise suppression effect measured Reasons noise can be reduced by Integrated Sysytem in Board Reduced wiring area due to implementation as miniature modules Integration of noise reducing components Supply voltage stabilization by using dedicated layers for power supply and ground EdC COM pOnenis Wiring on board Integration of noise reducing components Dedicated power supply ground layer Surface scan using a field probe Noise is reduced significantly ISB Duo 2 layer ISB Separate microcontroller Ca iji CE Aer 10 mm x 10 mm Lenva FERIRA oo Lens RRS Joon Integrated System in E THROES z taroh z eTNED Soo taroh z L n suey os j 7 wane ox jp DE Board stack structure La T p F to F208 Y 6600 gt f F UTNE Y 8600 gt i wo oe i M EADAILT O na dBu M EADAR na dauv high density mounting me 1 L 4 Berets RB 2 aen 8B a Integration of noise co Maia i ARE Sf IE a SRAM reducing components i E Evaluation results using a microcontroller and SRAM Surface probe method 30 MHz to 1 GHz Heat dissipation effect simulation Typical BGA Analysis conditions Chip heat generat
6. hardwired structure to implement LC99807 DSP the MP3 and WMA decode These modules are optimal for ens these me achieve P22 sub camera of video conferencing DTI ME STRINGING NICs Terrestrial Broadcast One Segment Terrestrial Broadcast One Segment cell phone products MP3 AAC AAC Decoder OFDM Demodulator IC Frequency Conversion IC LC82335 LC74112 LA8107 The adoption of diversity synthesis The adoption of direct conversion technology makes stable reception technology obviates the need for a possible SAW filter and supports miniaturization Integrated System in Board A separate coil is required for applications that include an AM radio High image quality ultraminiature size and low power makes these devices optimal for use in cell phones Frame Transfer Full Color CCD Sensors Frame Transfer CCD Achieves the industry s smallest optical size class by using the frame transfer CCD which makes it possible to reduce feature sizes while maintaining sensitivity Sensitivity was increased by adopting a simple single layer gate gap structure and thin film polysilicon FT CCD Device Density Comparison IL CCD Comparison of chip sizes required to acquire the same imaging device area TE High sensitivity MO iO E E i E E E X direction register PD Photo Diode storage 1 3 compression Type Y Cross Section Comparison T
7. the brightness to be adjusted with an external PWM input Generates the optimal voltages for white LEDs with a high efficiency charge pump type step up circuit Can provide a constant current output up to a total of 140 mA MT oe 4 channels Main LED 4 Charge pump power supply technique Can provide up to 104 mA output Supports brightness adjustment over a serial data input 10 steps Power saving mode Soft start function Input voltage 2 7 to 5 5 V Ultraminiature package VQFN16 4 0x4 0x0 85 mm Charge pump 3 wire ae 104 mA Serial Two groups for a total of 7 channels Main LED 4 Sub LED 3 Charge pump power supply technique Can provide up to 140 mA output Supports brightness adjustment using an external PWM input input for each group Automatic switching between 1x and 0 5x step up modes Power saving mode Soft start function Input voltage 2 7 to 5 5 V Ultraminiature package VQFN16 4 0x4 0x0 85 mm Ch ASSN mA Support for High Resolution CCDs New Charge Pump ICs CCD image sensors require a high drive voltage of 10 to 20 V This 10 to 20 V level is created by stepping up the 3 V power supply level Since conventional charge pump voltage step up technologies suffer from increased power loss when used to step up the original voltage by over three times their use in cell phones was problematic SANYO has however discovered a way of f
8. the same instant A great depth of field that makes focusing unnecessary Even if the camera is only a cell phone cameras the instant captured is for the user still an important instant in their life This is why SANYO is committed to providing products that make no compromises This is a truly easy to use camera since it has a wide range from close at hand to far away over which subjects are in focus and thus it is difficult to accidentally create blurred out of focus images Far ZFM Ivy RIL tayy yg CC OAOxOADX maS When used in applications such as cell phones this 7123 4567 KA ROAD camera can easily take photographs such as the one TEL 0123 45 6789 shown above since the user can check a preview image 0123 45 9876 while shooting FAx 0123 45 6798 e mail codcameraQAD sar Smear does not occur during still imaging when used in a module that includes a mechanical shuiter Module that includes a 2 stage f 3 5 and f 7 0 optical aperture 3 1 i IGT99268GC ST1 IGT99268C ST1 IGT99267J ST IGT99267J SUB Mechanical shutter VGA 30 fps VGA 15 fps _ 7 Connector on board An FM radio can be easily included in a limited space in a small product System on chip FM Radio ICs for Miniature Cell Phones FM Radio IC LV24000 Series A The LV24000 family devices are FM radio ICs that require absolutely no external components These devices include not only the FM radi
9. 0 100 1 000 10 000 100 000 Illumination Lux The output current is proportiona Flexible pattern geometries and sizes to the illumination These devices support designs with sizes and Since the output current changes proportionally to shapes that correspond to the target application the light striking the sensor these devices provide sensitivity to essentially the same wavelengths precise detection they provide sensing that is close to that of the human eye These sensors can be used to sense the ambient illumination level and automatically turn off these lamps in bright operating environments This reduces unnecessary power consumption and creates LCD screen display that is easy to see whatever the ambient lighting Increased operating time for portable electronic equipment due to reduced power consumption LCD backlight level automatically adjusted to just the right level for viewing according to the ambient illumination level Bright environments Dark er LCD backlight OFF Automatic brightness adjustment Button lamps Bright environments LCD backlight OFF LCD backlight ON LCD backlight ON About 3Lx Button lamps OFF 5 to 20mA Button lamps OFF Button lamps ON 55 to 70mA 95 to 110mA Bright environments Dark e LCD backlight ON LCD backlight ON Button lamps ON Button lamps ON 95 to 110mA 95 to 110mA Button lamps ON 95 to 110mA Lik
10. 010 a A Single Transducer Full Duplex codec and a speaker amplifier IC A2990 13 ch 11 LED driver FM RDS SANYO has developed a chip that in a single package using ISB ITAA developmen AE iki ie supports communication with just an technology The mounting area can The cell phone display can easily LV5204P 7 LV24003 ma A earphone l l S oo E be connected to a TV for viewing 13 ch 11 LED driver FM source selectors oe aia variety of input data rates ITU dreh Low Saturation 3 ch RGB LED driver A yp even in noisy environments Ho LC822971 includes 16 a of DRAM and allows the CPU to eee High Efficiency Charge Pump Type FM AM draw graphics without concern for 2 Phase Excitation Motor Driver Pero These revolutionary devices are the TV display rate self contained FM radio ICs that Video Driver P22 Constant Current Driving Motor Driver with Headphone P LA73074CL MA 1 ch H Bridge and Thermal Shutdown Curcuit require no external components Arge pump 7 LEDs For main LCD backlights 2 ch stepping 1 ch Constant Current P20 Forward Reverse Motor Driver IC 64 or 128 Voice Polyphony Sound Generator IC Series These ICs can generate up to 128 sounds at the same time and include 3D Audio functions This is the latest sound generator IC that even supports new melody formats such as Mobile XMF and provides the highest functionality in the series as an independent sound generator product Soun
11. 22 starting with the chip size package CSP A NTSC PAL Video Encoder eere resesesserseseesnennene 23 Furthermore SANYO continues to contribute to the development P l l 3 Earphone Mic Solutions E A A A E A 24 of the cell phone market with efforts such as developing SANYO s unique Integrated System ae Board module technology LED Driver ICs slerehereuererercuereietellelersveretersretetereyelevehedeielersietetetels elsreverelersreteteveneverensverere rere 26 that achieves even higher densities and thinner form factors New Charge Pump s veveveneseteernrnetnntn 28 developing QVGA OLED displays Motor Drivers for Cell Phones Ea E R stelorete E A 30 the Easy Radio IC series that makes it easy N ATOT US ORIOA CETO TEA e a U ee 30 to include a radio receiver in portable equipment Cell Phone Discrete Devices Broleneroteletcroletsreteveterctcreleterenerelererereetelctetcrenetsrete tere 34 providing an extensive lineup of motor drivers for zoom l ME OTEO l n SANYO s Lineup of High Reliability Discrete Devices 38 autofocus and other functions in cell phone cameras and developing power supply ICs for high pixel count CCDs E Any and all SANYO products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability such as life support systems aircraft s control systems or other applications whose failure can be reasonably expected to result in serious physical and or m
12. 44cell inch2 High hFE support ECSP 1st Generation k down Nowe Low resistance MBIT PicoTR surface mounting ackage gt f collectorl Terr D MCPH PCP and TP leads f package deployment High ates a rang avai Rce sat T PO E pannnannam i Package deployment Support for hFE1 ranking EIN UNUE Ee 70MQ High Compound CPH deployment Li performance Feature of MBIT I Beeta aua a 30 E Very low saturation voltage 50mQ D IRE oe ma all a gt i gt Reon 35m ad a pcp Small copy MCPH ECH SCH ECSP SOP WL Before 1998 2000 2002 2004 1997 SS ee eee eee 2006 2007 hFE 100 to 400 Width 300 hpg 200 to 560 Width 360 Year hFE 250 to 400 Width 150 Year FE i ANARE High performance Rce sat mQ ES ima A High switching speed E Small and high power package Performance functionality Miniaturization N VN Low saturation voltage transistor generation map SANYO supplies high performance GaAs switching ICs that feature the industry s smallest package size and smallest number of external components SANYO discrete devices have been always leading the cell phone and mobile equipment markets SANYO is also developing devices that support the need for higher speeds and larger data capacities for image and video data due to the inclusion of high pixel count cameras in this equipment Ultralow on resistance MOS devices for power management 7 Low a
13. 5 2x0 8 mm Speaker amplifier DA Video driver 5 0x5 0x0 8 mms NTSC PAL encoder Video driver Audio codec Speaker amplifier Volume Speer e pa amplifier 2 8x2 8x0 8 mm as module New product 4 Audio Block D A converter signal to noise ratio 98 dB A weighting THD 84 dB at 48 kHz A D converter signal to noise ratio 90 dB A weighting THD 80 dB at 48 kHz Programmable ALC noise gate Stereo monaural microphone interface Built in headphone driver Low power consumption 450 mW output Vcc 3 6 V 1 KHz THD 1 Power saving and standby functions Microphone amplifier Speaker amplifier LA74220C Composit 75 Q Video Driver video output Integrated System in Board 45 mm2 6 0x7 5 mm2 Mounting area Sound I O TV output over 50 SANYO devices support megapixel class cameras and provide extensive functionality LED Driver P16 to P19 Integrated Audio Video ICs 1 Chip FM AM Tuner ICs Salata Microphone 7 LC822964 NTSC PAL Encoder Ultraminiature Package 2 Phase 13 ch 9 Ae d 2 2 ce Stepping Motor Drivers a THI encoder video drivers an audio P LB1906CL d 52 7 LV24
14. BIAS Under development Constant current _ control amplifier circuit Logic circuit Auto Foucus Piezo actuator A LV8071 LG To 7 For Auto Focus Motors Focus PWM H bridge Sequence circuit O ENA STEP M1 Achieving Low Power and Superb Viewability These devices are a type of photodiode that can detect light with about the same sensitivity as the human eye Since these devices flexibly support a wide range of end product designs and sizes they can be used to control the LCD backlight and button lamps in cell phones to implement power saving automatic brightness adjustment Amorphous Optical Sensors Amorphous Silicon Solar Cells hous Optical Sensors Amorphous Optical Sensor Structure 4 These devices are a type of photodiode that can detect the presence absence of ambient light or the intensity of ambient light Visible wavelength amorphous optical sensor Human visual sensitivity Single crystal silicon optical sensors Relative sensitivity 400 500 600 700 800 900 1000 Wavelength nm High sensitivity in the visible region The human eye is sensitive to light with wavelengths from about 400 nm to about 700 nm Since these amorphous optical sensors have Measured at FL for color illuminator 1 to 10 kLx at SS Solar Simulator 10 to 10k Lx 1 E 03 1 E 04 1 E 05 Isc A 1 E 06 1 E 07 1 E 08 AM 30 26 1 1
15. C PAL Encoder pal to yihe adoption of direct conversion technology _ i A mponents such as a SAW filter are not required ON EA LC822961 s is no longer required and at the same ee ap r consumption circuit uit performance y does not R ade over time or g to t temperature fluctuations 5 LC8229 63 Aaa Converts base band processor generated video and provides other functions for TV output This approach achieves antenna diversity Miniature package CSP42 3 3 x 3 78 mm which is effective at improving reception performance 10 bit D A converter with built in 75Q driver Supports a wide variety of input data rates ITU R601 SQ The LC822963 is an MCP package version of the LC822961 audio operational amplifier LA6358N Application examples TV games video players NTSC PAL Encoder with On Chip DRAM LC822971 Data written to memory can be continuously output to a TV without being sequentially updated using the internal Cell Phone Video Drivers A Video driver frame memory O A L A7307 4CL ew Once the data has been written it can be displayed with essentially no load on the microcontroller laats On chip 16 Mbit SDRAM Allows drawing by the CPU without concern for the TV display rate No output coupling capacitors required Built in sixth order low pass filter fc 7 5 MHz Rotation processing at write enlargement processing at display Low voltage drive 2 7 to 3 6 V Sta
16. C3H02B 2805538 2SC5539 etc Schottky barrier diodes EC2D01B SB0203Eu etc y A Bipolar Transistor for LNA Low noise High gain transistors fT 20 GHz SBFP405M SBFP420M etc J Bipolar transistor for VCO Low phase noise transistors EC3H02B EC3HO9B etc GaAs MMIC products for antenna switches and local switches Low insertion loss MMIC High isolation MMIC SPM3211 SPM3212 fo Ss SPM3215 SPM3218 etc Transistors for LCD backlight circuits Precise interface control MOSFETs 5LNO1S 5LP01S MCH6614 2 in 1 etc Complex devices MCH5809 CPH5809 MOS SBD etc L Devices for Li ion batteries Ultralow on resistance MOSFET series ECH8601 FTD2017A etc Schottky barrier diodes SBS804 etc Power management switches Ultralow on resistance MOSFET series i VEC2301 SCH2602 ECH8603 J Junction FETs for ECM gt MCH6307 etc Ultrathin package VTFP 2 7 E TF218TH TF208TH TF202 SSFP etc LCD backlight ultralow saturation voltage transistors WN Ultralow saturation voltage transistor development roadmap 4th Generation High speed SW High performance Ww PE ne MBIT I i Feature of MBIT II High performance y 5 Tet i mamm Cell density Ultra low saturation voltage 65Kcell inch Rce sat pau Narrow width of hFE E High switching speed MBIT II Low cost v MBIT IIs 50 Cell density ies Ae down al 144cell inch MBIT II Cell density High ce low cost 30 nannan 1
17. Cell Phone Devices CONTENTS CONTENTS concanoe son sneveccn sn sobecusenepabascodes beconbnccanpasns5acd 3 SANYO Group Cell Phone Components 4 SANYO Original technology R Integrated System in Board Oa O O O OOO AUAN O OOE 6 D K j edge technologies support Integrated System in Board Application Products SANYO s leadir Standard Products a favevie toraleucvane aralererareievale tcvaceuelaie iererenevevoterevevrcheleereha revere reve eeteterste 8 advances in portable electronic equipment Sia E ey nen i Frame Transfer Full Color CCD Sensors set 12 With the increasingly wide adoption of 3G and later cell phone infrastructure 1 4 Type 3 2 MP CCD Camera Module for Cell Phones 14 cell phones are featuring even more advanced and diverse functionality System on chip FM Radio ICs for Miniature Cell Phones 16 The speed with which multimedia functionality is being adopted is increasing System on chip FM Radio ICs Easy Radio IC Series 18 and that trend is not limited to Japan but is spreading worldwide Sound Generator IC MIDI Golo evorereverelie e ovevececeuecelele E eueiele ciel evsrsvererererere 20 SANYO has for the first time in the industry Audio Compression IC a E a a E A 21 adopted a 1 9 type CCD image sensor for cell phones Terrestrial Digital One Segment Chipset 77 eeens 22 SANYO is moving towards the megapixel age in camera cell phones Cell Phone Video Drivers Aa
18. IS SANYO Easy Radio IC LV24000 A separate coil is required for applications that include an AM radio Including All the Functions FM function LV24020 FM AM function LV24100 FM RDS function LV24010 An adjustment free FM radio function can be included with absolutely no external components Since an ultraminiature 5 0 x 5 0 x 0 8 mm package is used this device is extremely useful for including an FM radio function in cell phones PDAs memory audio players and other portable electronic equipment J Application Example Cell phone 1 LV24000 FM radio function 0 BE oe Head Amp ey a eee E a LV24000 P LV24002 Block diagram LV24002 Quadrature Tuning Oscillator System Source Volume LINE IN L i amp Tone SSS LINE IN R Selector Control Cell phone 2 LV24002 FM radio source selector headphone amplifier functions D n Seige Voume Headamp by pe E l g a sa a el EE p LV24002 Power m g kee Selectivity _ Demodulator a __ Deemphasis LINE OUT L Headphone HEADPHONE L Amplifier HEADPHONE R An FM radio can be easily included in a limited space in a small product System on chip FM Radio ICs Easy Radio IC Series y This is what has changed since the earlier products Function and lineup y Three points about the Easy Radio IC EEE oea a ae Se Supported Supported Supported S
19. SFP VTFP 1 4X1 4X0 6 mm 1 2X1 4X0 46 mm 1 2X1 4X0 34 mm C D MA TD MA IS1 16 s Fame 7 7 2 Tees co 2 g thick 2 Inner antenna ia Ea aaa as Z 7 Ex Low noise amplifier X TZOAN Too m oo 0 50 1 00 1 50 2 00 250 3 00 3 50 4 00 Diversity switches X Res GQ Potential stabilization time s GaAs MMIC Filter switches for TDMA Island frame thickness Aarne SPM3212 AZ i GaAs MMIC Reduced by 50 m SPM3215 OSC NPN BiP RAT d Total reduction 130 m eaa ao A SPM3211 AZ Frame bending process SPM3226 EC3H07B SPM3212 Reduced by 80 m SBFP420B Establishment of and ultrathin wafer process 4 inch Improved signal to noise ratio due to p channel MOSFET development Buffer ampliiers Local switches NPN BiP GaAs MMIC Filter switches for TDMA EC3H10B SPM3212 GaAs MMIC i i i VDD FS303 SPM3220 SPM3212 Introduction of B G plus spin etching process o FS304 SPM3226 SPM3220 Factor workaround Input protection Weccucieetsarssiek E e diode DD P 300 Antenna switch Duplexer SPNE2B O es Target thickness 80 um VIN etching process i i j j rose a Pch MOSFET B G pr thickness 350 Input protection process thickness 390 um saciston L W 3um 1mm 2 2 2 od PA module GND SANYO established an 80 uM ultrathin wafer process by improving the wafer chamfering snape and introducing spin etching I Filter switches for PCS and TDMA SPM3212 SPM3220 SPM3226 Total package height Noise voltage dBV Insertion loss dBV Signal to no
20. al oscillator frequency 16 9344 MHz 44 1 kHz x 384 Sampling frequencies other than 44 1 kHz supported with built in PLL circuit Single Chip Audio The LC82335X ICs support MP3 AAC and AAC By implementing the MP3 AAC and AAC decoding functions in a hardwired structure these ICs achieve an ultralow power consumption that would be impossible in a DSP based structure Hardwired MP3 hardwired AAC and hardwired AAC Ultralow power consumption 10 mW Buffer size 10 KB Built in YY filter SD interface ARM7TDMI gt Stereo output ND NA SD card flash NTSC PAL Video Encoder Miniature reception modules with low power consumption that achieve stable reception under rapidly changing THe keci bl enlay dh iohones LCD screen contents or made data that was taken conditions are required for cell phones and other portable terminals SANYO has established independently we Meee Care i fas Yee te pine Se ee a j e sagan developed diversity synthesis technology and the industry s first direct conversion technology that together meet with the camera and is stored in the camera s memory on a TV video input these requirements LNA Frequency conversion LA8101 ODFM demodulation LSI poe or J UHF Ant 2 o 3 3 9 5 MPEG TS D D tput A D g 5 oe LC822961 LC822971 LPF A D ae a a hae Diversity synthesis technology adopted a ilter i ui i i i further eeo possible 3 Na EEPO PORE 4 NTS
21. applications S T F D Resistant to noise Tympanic The headphone diaphragm catches the weak audio signal emitted from the tympanic Development roadmap For business equipment For PC peripherals For portable accessories Evaluation board verification STFD function confirmation Diaphragm Tvmpanic pnrag Simultaneous transmission and Wey Mle reception at a single diaphragm ve wy ne Vibrations in the air jini 4 Ss Vocalization _ j 3353p m J Lower power consumption ransmission otne H Higher functionality a S ISS O a Te the GECeee o ClCH Functions a sletetetelalalilalalalelelete wai e STFD Reception Vibrations in the air Signal conversion using a DSP STDF evaluation board Poue Signal transmission while maintaining clarity l l 2005 2006 2007 LED Driver ICs These are LED drivers that can provide a high capacity output up to a total of 500 mA using a switching power supply technique and cover applications such as main LCD backlights sub LCD backlights camera flash systems and full color LED indicators Gradation production using full color LEDs is also supported automatic Under development LV5202PL 13 channel 9 lamp LED driver Main LED 4 Sub RGB 1 Lighting LED 3 Singe RGB 1 Supports 3 color backlights appropriate for simply monochrome displays for sub d
22. aterial damage Consult with your SANYO representative nearest you before using any SANYO products described or contained herein in such applications Higher pixel counts further miniaturization and lower power To respond to these market needs vide new areas of added value s products subtle technological arts E SANYO assumes no responsibility for equipment failures that result from using products at values that exceed even momentarily rated values Such as maximum ratings operating condition ranges or other parameters listed in products specifications of any and all SANYO products described or contained herein Specifications of any and all SANYO products described or contained herein stipulate the performance characteristics and functions of the described products in the independent state and are not guarantees of the performance characteristics and functions of the described products as mounted in the customer s products or equipment To verify symptoms and states that cannot be evaluated in an independent device the customer should always evaluate and test devices mounted in the customer s products or equipment E SANYO Electric Co Ltd strives to supply high quality high reliability products However any and all semiconductor products fail with some probability It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fir
23. battery level Y Block diagram to 3 1 V and steps up that level 3x and 6x using a charge pump to provide the two regulated power ree supply levels required by the CCD oa BM ves image sensor Tl J 8 1 uF e VH 15 0 V p aai e mass VL ie a VL 8V on A nn 2 Two independent charge pump f i VBAT4 VDD1 2 3 4 systems are provided for VH and VL BF opt Built in regulators for the analog F t OUTS 11 u system power supply vertical driver vss2 Hoo ooo g wee system and DSP core etn me 40 eT 1 FVREF po 38 VDDX1 a 26 C11B 0 1 uF VDD3 17 7 41 Tio 0 22 uF VSS4 toa A TH VSS5 a Aan 022 ie step up Bandgap mil 047 uF os sales circuit aa T vppxs reference VDDX1 an 1 19 V DIA 0 22 uF 0 47 uF 21 3 times 35 VDDX4 M_L Cosa an Eep up 35 C14B a i circuit 44 eee 5228 C15A 0 22 uF i 34 VDDX5 T 22 F C15B 33 Els VDDx3 14 C23B VL_C24 VSS6 ie A pacts l voDxe STE VL_C25 Fj u 1 uF VH_C17 erpa STBY i uF SLEEP 27 NC Values in parentheses are actual Note Short OUT1 to VDD1 through VDD4 applied voltages to the capacitor Ultraminiature Package Motor Drivers for Cell Phones Motor Driver ICs for Cell Phones y Miniature Driver Series E Camera Cell Phone Driver Lineup shutter ris diaphragm Voice Coil Motor asinine eee 00 mA EE EE Stepping Motor 2
24. ce selector Initial product Follow on product Headpone AMP SANYO can provide sample software and algorithms to even further reduce the burden on software developers A Low power LV24000 consumption FM 2004 2005 2006 A separate coil is required for applications that include an AM radio Sound Generator IC MIDI SANYO has developed ICs that in addition to support for even more sounds also include new Uy functions such as support for new standard melody formats and 3D audio Integrates 128 voice polyphony PCM 3D surround 3D positioning and Mobile XMF support A LC823872 product Featurinc Capable of generating up to 128 voice polyphony in a full PCM sound generator 128 GM sounds 47 drum sets 32 sound effects sounds conforms to GM1 Includes a 3D surround function and a 3D positioning function that allows the specification of positioning information that positions the generated sound at an arbitrary position in three dimensional space Supports not only the Mobile XMF new melody format but also a variety of other formats User Customized Sound function that allows the user to register arbitrary sounds Supports up to four songs worth of MIDI data and can play up to four channels of ADPCM PCM data at the same time Includes a 4 band parametric equalizer that can provide optimal equalization for the speakers used Supports karaoke and Java applications JSR135 JSR2348 Su
25. d Generator Audio Compression IC P20 York These ICs can generate up to 64 LC99812 DSP sounds at the same time and i l JJO I 408 fe include 3D Audio functions The extensive depth of field provided This is a combined product that by these camera modules means the integrates ultralow power MP3 and user never has to worry about focus AAC decoder functions and is eae These camera modules are optimal for optimal for use in cell phones for camera cell phones that need to true audio aficionados provide easy and convenient imaging LC823501 waad Charge pump Cell Phone 1 7 Type VGA This model corresponds to a low price i i version of the LC823553 with certain MOS RRL RIS Hiei Chipset functions removed and is a combined Diversity antenna a ee product that integrates an ultralow VIJOI power MP3 decoder with a sound generator IC that supports 64 voice polyphony 1 5 ch Constant Current Forward Reverse Motor Driver IC Auto Foucus Piezo Actuator Autofocus awd m Optical zoom ZA development Cell Phone 1 4 Type 3 2 MP CCD Camera Chipset These camera modules are optimal for low end camera cell phones These ultraminiature camera modules are so small that they do not interfere with the design of cell phone MP3 and WMA Decoder IC P21 Cell Phone 1 9 Type CIF 7 C823231 e segment tuner Resolution CCD Camera Chipset By using dedicated circuits with a C99267 CCD
26. e or that could cause damage to other property When designing equipment adopt safety measures so that these kinds of accidents or events cannot occur Such measures include but are not limited to protective circuits and error prevention circuits for safe design redundant design and structural design E In the event that any or all SANYO products including technical data services described or contained herein are controlled under any of applicable local export control laws and regulations such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law E No part of this publication may be reproduced or transmitted in any form or by any means electronic or mechanical including photocopying and recording or any information storage or retrieval system or otherwise without the prior written permission of SANYO Electric Co Ltd E Any and all information described or contained herein are subject to change without notice due to product technology improvement etc When designing Notes on Package Types and Naming The package names used in this documentation are designed to indicate rough classification of the packages used and do not necessarily indicate the formal name of each individual package Refer to the delivery specifications document for the particular product for the package dimensions figure and the formal name of the package Here we introduce se
27. e amorphous silicon solar cells amorphous optical sensor use the photovoltaic effect in semiconductors When light hits a semiconductor electrons and holes are created the electrons diffuse in the n type semiconductor and the holes diffuse in the p type semiconductor As a result a current will flow when the two semiconductor types are connected externally Amor With an operational amplifier Na S i i O A S NL 2 Amorphous g Optical Sensor AM 30 26 The current output from the amorphous optical sensor is converted to a voltage and signal processing is applied to that voltage Normally an operational amplifier is used for linear amplification Anode Transparent electrode Cathode Electron S Electron hole Metallic electrode J 49AUO09 G Y Amorphous Optical Sensor AM 30 26 The amorphous optical sensor is connected to a resistor and the voltage is input directly to an A D converter for discrimination Amorphous Optical Sensor Product Lineup Type No External dimensions mm 2 1 x 2 0 mm glass thickness 0 4 mm Short circuit current Isc typical Dark current VR 50 mV MAX C2 uA 10 pA 1 at 1000Lux Fluorescent Light for color illuminator Contact your SANYO sales representative for details on these products SANYO s Lineup of High Reliability Discrete Devices fo Devices for CCD camera module Ultrahigh frequency transistors E
28. ensity substrate 2 layers Line 40 um Space 40 um at 25 um thickness copper foil Via diameter 100 um Via land diameter 150 um Thickness of only 0 53 mm 0 73 mm if resistors are included realizes high density mounting Optimal for SiP implementation of high frequency up to 10 GHz blocks blocks that require performance or EMC workarounds based on component placement wiring pattern and blocks that require partial high density mounting E Assembly structure examples E Application example Clock detector block Earlier mounting Integrated System in Board Integrated System in Board oe p5 Top surface Back surface 4 3 x 4 3 x 0 73 mm3 Mounting area reduced by 58 ISB Quad Adopts unique SANYO developed 0 24 mm thickness high density substrate 4 layers Thickness of only 0 6 mm realizes high density mounting Optimal for SiP implementation of high frequency up to 10 GHz blocks blocks that require performance or EMC workarounds based on component placement wiring pattern and subsystems that require high density mounting Chip on Board type E Assembly structure examples ISB Duo Passive components WS CSP Flip Chip resistors and capacitors ISB Quad Integrated System in Board is a type of SiP system in package tec densities and thinner form factors by using SANYO s unique substrate Board lineup consists of three types of process
29. he FT CCD method uses no elements that block the Micro Lens entrance of light and thus AN T ZAN AN a they can capture light from gL Y a praa range of incidence aT VIN NNI N angles Moo Lono e Reducing the device height is possible mE rw TT lt Photo Diode P N N P N N Photo Diode Photo Diode P Sub Y Comparison of Differences in Electronic Shutter Types CMOS sensor 1 4 VGA F In the 1 0 MP CCD SANYO developed a new charge accumulation method ANNES ee Low moire high sensitivity and a high frame rate achieved by pixel addition during preview and spatial filter processing m Egu m Y g H i g h se n S ItiV l ty C Compressed to 1 3 the number of lines by combining 3 pixels WN ST GE N Low moire m TE T h 2R G B 2G FT CCD structure R G and B are extracted by calculations SANYO fabricates frame transfer FT CCD sensors using unique technologies with ultrafine design rules and provides them as modules assembled using advanced leading edge mounting technologies SANYO makes a point of providing fine and delicate semiconductor devices in forms that our customers will find approachable and easy to use CCD drive circuit and image processing implemented in a single package Multifunction DSP chip A charge pump type voltage step up circuit that features minimal noise generation and the supply voltages required for system drive are generated efficiently with just
30. ion Atmospheric temperature Ideal cooling of the solder lower surface 25 C Maximum temperature 92 7 C Temperature difference 38 4 C Temperature difference 52 3 C Cooling conditions Integrated System Board package Analysis model 1 4 model since symmetrical temperature 54 3 C Integrated System Board that dissipates heat temperature 40 4 C Sa T Module technologies that achieve high density and thinner form factors Integrated System in Board Application Products Standard Products Thin Form Miniature 1 or 2 Channel DC DC Converter Power Supplies SRSeries g These products combine a step up DC DC converter n channel power MOSFET and Schottky barrier diode devices in a single module A switching step up power supply can easily be implemented with just the addition of external voltage setting resistor coil and capacitor components E Compared to discrete components with Integrated System in Board E Block Diagram SR10010 Earlier mounting Integrated System in Board Integrated System in Board Top surface Back surface 3 4 x 3 4 x 0 65 mm3 Mounting area peduced by 35 E Product lineup Type No Nu
31. ise ratio dB Signal to noise ratio evaluatio Pch MOSFET 113 to 114 5 0 to 5 5 68 to 68 5 JFET 105 to 107 1 5 to 3 5 62 to 64 SSFP VSFP VTFP Low noise amplifiers ra gt _ gt _2 _ gt EC3H07B EC3H10B Enhancement mode P ch MOSFET Potential stabilization time SBFP405B SBFP420B Local switches Antenna i SBFP540B Baan NPN BiP SPM3212 Buffer anglers SPM3220 ee 3 Diversity switch NPN BiP SPM3226 SANYO achieved extremely thin packages by combining of the above technologies The potential stabilization time becomes under 1 second EC3H07B in enhancement mode p channel MOSFETs FS303 Antenna switches SPM3212 SPM3215 OSC EC3H09B SPM3220 SPM3226 EC3H07B tei SBFP420B Power amplifier Li ion battery O 1 Baseband logic a e CPH3106 PNP Bip CPH3106 PNP Bip MCH3106 PNP Bip MCH3106 PNP Bip MCH6305 Pch MOS MCH6305 Pch MOS MCH6307 Pch MOS Microwave Device Series High frequency silicon transistors for VCO Usage Oscillator Oscillator Buffer GaAs MMIC products for Antenna switches local switches and other switches Usage Type No EC3H09B EC3H11B SPFP420B SPFP540B 2SC5781 2SC5783 EC3H07B EC3H10B 2SC5646 2SC5782 FS301 TR1 Side TR2 Side FS303 TR1 Side TR2 Side FS304 TR1 Side TR2 Side Type No SPM3501 SPM3227 SPM3211 SPM3212 SPM3215
32. isplays Switching power supply technique Can provide up to 500 mA output Supports 1 C bus Ultraminiature package QFN32 4 0x4 0x1 0 mm Switching Automatic blinking color changing in hardware is possible I LV5203FN ap 13 channel 11 lamp LED driver Main LED 4 Sub LED 2 Lighting LED 4 Singe RGB 1 Switching power supply technique Can provide up to 500 mA output Three wire serial bus support Ultraminiature package VQFN32 5 0x5 0x0 85 mm Switching 3 wire TE ey ae ae 13 channel 11 lamp LED driver Main LED 4 Sub LED 2 Lighting LED 4 Singe RGB 1 Switching power supply technique Can provide up to 500 mA output Supports 1 C bus Ultraminiature package VQLP32 4 0x4 0x0 85 mm Baa ome PC SANYO provides LED drivers that support automatic gradation production using full color LEDs and can provide high capacity outputs up to a total of 500 mA using a switching power supply technique as well as white LEDs for backlights using a charge pump method optimal for white LEDs Drivers for 3 color LEDs that have an external control interface ye LV52 1 3 P T e 3 channel 1 lamp LED driver Singe RGB 1 Switching power supply technique Can provide up to 80 mA output Three wire serial bus support Ultraminiature package VCT16 2 6x2 6x0 85 mm Switching 3 wire TI Py ue oes This is a 4 lamp white LED driver for main LCD backlights that allows
33. makes these devices optimal for use in cell phone 1 4 Type 3 2 MP CCD Camera Module for Cell Phones Hyper ye 1 4 Type 3 2 MP CCD Chipset Hyper ye y I2C BUS A Baer CCD driver MCK Analog signal Digital signal YUV output processing processing HREF VREF Mechanical shutter bi Optical Iris 3or4 Charge pump Lens power supply Memory circuit 2 9V single power supply I introducing the Component Devices 3 2 MP Frame Transfer CCD Image Sensor LC99359 product Diagonal 1 4 type 3 2M pixels Effective pixels 2079 x 1554 H x V Square pixels 1 8 x 1 8 um Color filters Primary color RGB Bayer Package CSP High performance DSP for LC99359 LC9981 2 Posie On chip CCD driving timing generator and CCD driver On chip power supply circut for driving charge pump type CCD AGC YUV and RGB output signal Power saving mode Built in smear correction circuit automatic dropout correction circuit Shading correction Noise control circuit Timing generator to drive the mechanical shutter Scaling and zoom functions Timing generator for auto focus control auto exposure control autowhite balance control and mechanical iris control Supply voltage 2 9 V single voltage operation Package BGA128 The stable and reliable image quality provided by CCD image sensors The simultaneity of an image in which the whole image was captured at
34. mber of Type Oscillator Withstand Size Status channels frequency voltage SR10010 1ch Step up type 180 kHz 20 V ES samples MP support SR10020 300 kHz 20 V ES samples MP support SR10030 180 kHz 30 V 3 4 x 3 4 x 0 65 mm ES samples MP support SR10110 100 kHz 20 V In volume production SR10210 100 kHz 20 V In volume production SR103XX i Under development SR20010 2ch EE 180 kHz 20 V 5 0 x 5 0 x 0 65 mm ES samples MP support Earlier mounted Charge control circuit Integrated system in Board 10 0 x 10 0 100 0 mm T j r Regurator IC 3 0 x 3 0 9 0 mm Mounting area reduced by 80 Size 109 0 mm 19 80 mm 4 4 5 x 4 45 19 80 mm Here we introduce examples of ICs used for cell phones implemented LC822964 HVideo Block One output system Low cost version specialized for cell phones Supports a wide variety of input data ITU R601 SQ No output coupling capacitors required High performance Switching noise does not appear on the screen due to the use of charge pump technology Voltage sag does not occur Built in 6th order low pass filter fc 7 5 MHz Standby mode power consumption 0 uA E Block Diagram Audio I O block Audio Codec FS TV output block NTSC PAL Encoder LC822962 Timing CCIR601 Current mounting area 84 88 mm Passive components Q Sound I O Block TV Output Block NTSC PAL encoder can be 5 0x5 0x1 0 mm reduced by Audio codec 5 2x
35. nd medium output MOS device development roadmap Reduced on resistance reduced voltage drive Device A Ultralow on resistance MOS device generation map 100 1998 2000 2002 2004 2005 2006 Cell pitch Trench structure T3 4 deployment High Trench structure T4 gt T5 TO F 3 75 i TS T3 Design rule T3 10 million T4 16 million cells per g Increased speed and further um gt um um 9 um um om Ye inch improved ultralow on resistance 90 1 1 um 0 8 un 0 55 um 0 35 un 0 25 um 0 18 um 270 1 Shallow trench technology established ee a i ai High ESD resistance technology rom 1 5 to 1 RDS on Low capacity x established Shorter turnaround times EE a Fe lp ee U fewer masks rs 80 15 MQ process 240 Miniaturization MOSFET 70 210 MOSFET Miniaturization Deployment to miniature thin form a 60 1 80 E T4 16 million cells per products VEC8 SCH6 ECSP Ci s Lineup covering 12 to 200 V square inch Wireless package technology 50 150 Low on resistance process ECH8 TSSOP WL FlipFET Led established T2 trench process Higher power and lower cost lt 40 120 D gt a Added functionality z ag RDS on an T Wireless package O 20 ae mR RDS on 60 Oo ExPD A K3 Built in driver MOSFETs oc 2 8 MQ ied Trench low side 10 30 x FaN aaa gt Back gate switches for lithium 5 low voltage battery charging and discharging 0 0
36. ndby mode power consumption 0 uA The NTSC PAL encoder block is the same as that in the LC822961 Voltage sag does not occur The amplifier gain can be selected 6 9 or 12 dB Application examples Photograph album shows business presentation tools ae GAIN_CTL High 12dB Vcc 2 from i o Boae as c it Ho Al a I OOM O composi i A GND 1 GND 5 CLK_OUT P_SAV_CTL Tr a da LC822961 Open Stanby Developing a chip that can support phone conversations with just an earphone Earphone Mic Solutions Under development y What is an earphone mic SANYO is developing a chip that can support phone conversations with just an earphone Conversation is possible without taking off your earphones Wind sounds Higher audio quality Bone conduction Noise is reduced 7 Earphone m STFD single transduce full duplex technology makes a separate microphone unnecessary microphones Increased flexibility in end product design Phone conversions are possible even in crowds or noisy environments Since the sound is picked up directly in the ear wind and other sounds can be reduced Better audio quality than bone conduction microphones Since an even clearer voice sound is possible it is easy to identify the speaker New applications in various other wireless markets Phone conversations are possible without removing one s earphones when listening to music Hands free p g p g There are also new
37. o function but source selector master volume control tone controls headphone amplifier and other functions in the same tiny 5 0 x 5 0 x 0 8 mm VQLP package These ICs are superb for adding new FM radio functionality in the small limited space available in existing products such as cell phones and other portable electronic equipment Absolutely no external components required Absolutely no adjustments required Low IF frequency 110 kHz adopted for improved selectivity No FM detection discriminator required Built in adjacent channel interference function 114 and 190 kHz New tuning technique Ultrahigh sensitivity reception achieved by low noise mixer input circuit Low current standby mode obviates the need for a power supply switch RDS composite output Three wire bus interface adopted clock data and NR W Digital AFC function Soft muting and high blend stereo 3 stage programmable Supports manual search automatic search and auto preset functions Supports reception in all regions worldwide all Japanese European and US bands can be received by changing just the software Master volume control FM 76 to 108 MHz Source selector function LV24001 Headphone amplifier LV24002 Not only reducing the device prices but also reducing the various costs during development m Comparison with earlier products d x y T d 4 a FM amplifier function LV24003 Earr PrOGUC
38. phase excitation baesejel NT PB ASOT GL Nev product Como COMPAN Stepping Motor 1 2 phase excitation LE T3Z00CL L3 300CL Comodo Como Lens Driver IC for Cell Phones F LB 1906CL An Auto Focus Motors Saturated control and 1 2 phase excitation drivers VCC I T 1 uF 7 OQUT1 Stepping motor IN1 ag don OUT2 JOO 60 kQ IN2 Q sk 2 5 8 io 60 kQ sits INS Q _ 5 OUT3 z a 60 kQ E OUT4 IN4 E bag GND Demand for camera cell phones is increasing rapidly not only in Japan but in most markets around the world as well While compact high image quality cameras are in demand in the cell phone market there are also increasing desires for high level camera functions such as mechanical shutters and autofocus SANYO developed even further their motor driver technologies nurtured through years of experience in the digital camera field and provides these technologies for use in camera cell phones as ultraminiature package motor drivers that require few external components Two phase excitation motor drivers 4 d L B 1 801 C L a 7 For autofocus and zoom Supports an FR position detection output Low saturation voltage output Iwo phase excitation driver Low voltage drive Drive is possible from 2 2 V Compact Package Stepping Motor 3 Control block Thermal shutdown circuit 12 pin 2 8 mm _Package COMP
39. pports special effects such as pitch bend vibrato delay reverb chorus Doppler and compression Supply voltage internal 1 5 V I O 1 8 to 2 8 V Package FBGA64 5x5x1 2 mm Integrates 64 voice polyphony PCM 3D surround 3D positioning Mobile XMF support and MP3 AAC decoding Featuring Capable of generating up to 64 voice polyphony in a full PCM sound generator conforms to GM1 Includes a 3D surround function and a 3D positioning function that allows the specification of positioning information that positions the generated sound at an arbitrary position in three dimensional space Supports not only the Mobile XMF new melody format but also a variety of other formats User Customized Sound function that allows the user to register arbitrary sounds Supports up to four songs worth of MIDI data and can play up to four channels of ADPCM PCM data at the same time Includes a 4 band parametric equalizer that can provide optimal equalization for the speakers used Supports karaoke and Java applications JSR135 JSR2348 Includes an MP3 and AAC decoder function The industry s lowest power consumption 8 5 mW for both MP3 and AAC Built in 8 band graphic equalizer Supply voltage internal 1 8 1 3 V I O 2 85 V Package WL CSP64 6 1x6 1x0 9 mm Integrates 64 voice polyphony PCM 3D surround and MP3 AAC decoding Ma New Featuring Capable of generating up to 64 voice polyphony in a full PCM sound generator confo
40. rete DIALA due to the inclusion of high pixel count cameras in this equipment FETs for Cell Digital Cell Phone 0 8 GHz 1 5 GHz Inner antenna Low noise i rs High signal to noise ratio technology Thin form package technology OSC NPN BiP EC3H09B EC3H07B SBFP420B Antenna switches GaAs MMIC Gold loop and new software M loop 7 JFET noise component ra Ae CETO SPM3220 ECSHi0B 7 Local switches i SPM3226 FS303 SPM3212 Gold loop and new software Condenser microphone JFET structure Whipantenna Filter switches FS304 sy SPM3220 Drain GaAs MMIC SPM3226 SPM3212 E NE EE EE EE JFET A p SPM3220 rotective PE diode static Power amplifier SPM3226 Source pad Korroa o20um Gate Earlier software the chip and wire Gold loop 7 Antenna switch X were shorted together Polysilicon resistor l AS Gate sub transient characteristics 7 j7 Baseband WB loop height 150 m maximum reduced to 100 m maximum workaround Source loge a The high resistance polysilicon resistor 1 to 3 GQ used to stabilized the gate source P potential accounts for a large portion of the JFET noise component Pch MOS cm Pch MOS r Pc Battery Thinner island frame and improved frame bending process MCH6305 MCH6307 Poh Mos MCH6305 MCH6307 ECH8603 ECH8601 ECH8603 ECH8603 SSFP V
41. rms to GM1 Integrated 3D surround function that creates a rich feeling of spaciousness Includes an MP3 decoder function The industry s lowest power consumption 8 5 mW for MP3 User Customized Sound function that allows the user to register arbitrary sounds Supports up to four songs worth of MIDI data and can play up to four channels of ADPCM PCM data at the same time Includes a 4 band parametric equalizer that can provide optimal equalization for the speakers used Supports karaoke and Java applications JSR135 Supply voltage internal 1 8 1 3 V I O 2 85 V Package PFBGA89 6 0x6 0x0 8 mm 3D positioning function Function that can create a realistic impression of space even from cell phones that cannot provide an adequate speaker separation O e O O XN D 0803031 P L C82335X Support for 24 hours of playback Audio Compression IC Although previous audio playback periods have been largely limited to 3 to 5 hours it is now possible to achieve playing times of 24 hours or longer by adopting SANYO audio compression ICs MP3 WMA Decoder Featuring Ultralow power MP3 10 mW WMA 15 mW Supported formats MPEG1 MPEG2 MPEG2 5 all sampling frequencies all bit rates WMA Digital volume and tone control circuits Digital equalizer and audio leakage prevention functions D A converter based A D A converter and class D amplifier PCM I O interface Sleep mode Cryst
42. sae PNP NPN 2 4 to 5 18 Urs 22 2 8V 0 4 to 2 5 GHz Use l MCH3106 MCPH3 21x20 12 S 0 8 200 to 560 165 PNP 2 4to5 AE T035 22 2 8V 0 4 to 2 5 GHz Use Monso MCH3206 MCPH3 21x20 15 3 0 8 150 NPN 3 16 0 55 28 0 4 to 2 5 GHz Use Mcts206 SA CPH3109 CPH3 2 8 x 2 9 30 3 0 9 200 to 560 230 PNP 3 tie 0 55 28 0 4 to 2 5 GHz Use popustog CPH3209 CPH3 2 8 x 2 9 30 3 0 9 200 to 560 180 NPN 3 13 1 1 26 0 4 to 2 5 GHz Use S Wis mi o 20 Up to 6 GHz Use Measured frequency 2 5 GHz Measured frequency 1 to 2 5 GHz W Measured frequency 5 8 GHz _ Measured frequency 5 to 6 GHz Package aa eh P is a V ane Notes SS1003EJ ECSP 1 6x 0 8 30 1 5 0 45 360 SB1003EJ ECSP 1 6x 0 8 30 1 5 0 55 15 ID Pp ee omy Varm lo VF IR A W max Q V A max V max uA S 0503SH SCH6 1 6 x 1 6 30 0 5 5 0 47 120 les 0 8 280m 15 0 5 0 45 200 S1003M MCPH6 220 30 1 5 0 45 15 1 5 0 8 450m 15 0 5 0 45 200 SB1003M MCPH6 21x20 30 1 5 0 55 15 2 0 9 200m 15 1 0 4 500 SBS004M MCPH3 2 1x 2 0 15 1 10 0 4 500 3 0 9 82m 15 1 0 4 500 SBS808M MCPH5 2 1 x 2 0 15 1 10 0 43 90 Parallel type Ordering Number EP92H SANYO SANYO Electric Co Ltd www global sanyo com Semiconductor Company Tokyo office Tokyo Bldg 1 10 1 Chome Ueno Taito ku TOKYO 110 8534 JAPAN Telephone 81 0 3 3837 6339 6340 6342 Facsimile 81 0 3 3837 6377 SANYO Electric Co Ltd Semiconductor Company Homepage URL http www
43. semic sanyo co jp index_e htm This catalog provides information as of April 2006 Specifications and information herein are subject to change without notice Printed in Japan April 2006 2d OTE
44. the supply of a single 2 9 V power supply This design is also effective at achieving reduced power consumption SANYO implemented in a single package the timing generator circuit required for system drive and all the analog and digital processing required to accept the CCD output by taking advantage of the SANYO CMOS analog digital hybrid process and MCP multi chip package technologies S z 2005 2006 LC99359 l High image quality Megapixel Dynamic range of CCD chipset VGA motion picture chipse and 3 2 MP still picture 1 0 has expanded LC99268G 30 fps LC99268FL High reliability z VGA CCD Lc99268 chipset Lc99808 CIF CCD chipset L99807 Near infrared CCD chipset Lc99704 l Inproved stability at high temperature 85 C LC99117 Near infrared Coexistance between near infrared sensitivity and olor or OF Y CCD Module Basic Structure Example CLK 2 9 V Single power supply Registers for picture arrangement Output mode etc RGB YUV output Digital color signal processor HREF VREF P CCD module Multifunction DSP EFE C arge pump a isa A ney IC bus ee Power supply circuit ae Storage area Horizontal shift Output Cone ee a eet oer oe Correlated double pap 8 bit register amplifier sampling AGC ADC X Analog front end processor High image quality ultraminiature size and low power
45. upported Supported Supported Supported _ ua AmW The analog circuit design technology know how based on long experience that has been necessary up to now at 320 is no longer required Although even more time will be required to create the initialization block during software development this block Supported _ will be able to correct product sample to sample variations radically reducing the testing and adjustment during f SHA Supported the manufacturing process and as a result reduce total costs Furthermore since software once developed can be reused in later products this effort is not wasted 3 wire 3 wire 3 wire 3 wire 3 wire 3 wire I C SP1 s 3 WIRE Comparison of software development costs fico zo Itemized comparison of software ___ Available Available Available Available Available Available Available development costs Supported can corect for product EEE Oade Supported TBD TBD TBD TBD Hae VY 10mW at 320 Cost difference D 4 Cost difference AE No external sh eadphone xe TCC SSS conto Y n a S Lv24003 components required Cen sate e e design Circuit SANYO Easy Radio IC Road Map Creu Under Mass production Circuit design Under Development A AM FM Power SANYO Other company low poet IC price IC price IC price Under Planning SSN ea SANYO Other company SANYO Other company Power output level up Sour
46. using their high level analog circuit and device technologies to overcome this problem This new charge pump technology can step up a regulated voltage by a factor of three or higher with an efficiency as high as 70 Furthermore it can provide an output current of several tens of mA SANYO was the first in the industry to develop a high performance charge pump This new charge pump technology can provide both positive and negative stepped up levels can be combined into multiple stages and can provide multiple output levels Thus this circuit technology is optimal for use in future camera cell phones that include a megapixel class CCD image sensor High efficiency P IiPBlock diagram Prior to the regulator 90 to 95 Coilless low noise Supports high output current designs The only external components are thin form capacitors no coils or diodes required Can provide both positive and negative stepped up outputs Supports fine step up step sizes 0 5xnx Vop 0 5 x n x Vpp n integer Optimal for use as the power supply in portable equipment aa aaa fe i Output voltages from positive and negative step up operation Plus step up Minus step up r Positive step up voltage vs output current me Negative step up voltage vs output current Dependency of efficiency on the supply voltage 90 Ny oO s O D co lt oo re lt wo N lt op oO Efficiency Output voltage Vout
47. veral technologies that SANYO has pushed to the limits SANYO Group Cell Phone Components d Mega Pixel CCD Small discrete Camera Module devices FEM Amorphous Sound Generator Front End Module IC POSCAP Optical Sensor yyy Yy w v e ASM Die Electric Filter SAW Filer Antena Switch g LED Driver Module Duplexer meee ae E A n S ii Dupiexo RGB Chip LED SANYO soni IMAGING Battery Speaker DEVICES CORPORATION SU UA Module technologies that achieve high density and thinner form factors Integrated System in Board Thickness of only 0 45 mm 0 65 mm if resistors are included realizes excellent thermal radiation and short development TAT Optimal for SiP implementation of small scale block that includes semi power semiconductors E Application example Cell phone charger circuit block Earlier mounting Integrated System in Board Integrated System in Board Top surface Back surface 4 45 x 4 45 x 0 65 mm Mounting area reduced by 80 ISB Duo Adopts unique SANYO developed 0 2 mm thickness high d
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