Philips TDA7050 User's Manual
Contents
1. Zil 1 MQ Input bias current li 40 nA Stereo application see Fig 5 Output power note 1 Vp 3 0 V diot 10 P 35 mW Vp 4 5 V diot 10 Po 75 mW Voltage gain Gy 24 5 26 27 5 dB Noise output voltage r m s value Rs 5 kQ f 1 kHz Vho rms 100 uV Rs 0 Q f 500 kHz B 5 kHz Vho rms tbf uV Channel separation Rs 0 Q f 1 kHz a 30 40 dB Input impedance at Rg Zil 2 MQ Input bias current li 20 nA Note 1 Output power is measured directly at the output pins of the IC It is shown as a function of the supply voltage in Fig 2 BTL application and Fig 3 stereo application June 1989 4 Philips Semiconductors Product specification Low voltage mono stereo power amplifier TDA7050 7291366 Fig 2 Output power across the load impedance R as a function of supply voltage Vp in BTL application Measurements were made at f 1 KHz diot 10 Tamp 25 C 7291367 Fig 3 Output power across the load impedance R as a function of supply voltage Vp in stereo application Measurements were made at f 1 KHZ diot 10 Tamp 25 C June 1989 5 Philips Semiconductors Product specification Low voltage mono stereo power amplifier TDA7050 APPLICATION INFORMATION input x 7291364 left channel input 22 kQ 1 right channel input 22 kQ A 7291363 Fig 5 Application diagram stereo also used a2. Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Where application information is given it is advisory and does not form part of the specification LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale June 1989
3. typ 35 mW typ 75 mW typ 40 dB typ 100 uV PACKAGE OUTLINE 8 lead DIL plastic SOT97 SOT97 1 1996 July 23 June 1989 2 Product specification Philips Semiconductors Low voltage mono stereo power amplifier RATINGS Limiting values in accordance with the Absolute Maximum System IEC 134 Supply voltage Peak output current Total power dissipation Storage temperature range Crystal temperature A C and d c short circuit duration at Vp 3 0 V during mishandling THERMAL RESISTANCE From junction to ambient June 1989 TDA7050 Vp max 6V lom max 150 mA see derating curve Fig 1 T stg 55 to 150 C Te max 100 C tsc max 5s 400 Ptot mW 300 200 100 0 Fig 1 Power derating curve Riha 110 K W Philips Semiconductors Product specification Low voltage mono stereo power amplifier TDA7050 CHARACTERISTICS Vp 3 V f 1 kHz R 32 Q Tamp 25 C unless otherwise specified PARAMETER SYMBOL MIN TYP MAX UNIT Supply Supply voltage Vp 1 6 6 0 V Total quiescent current liot 3 2 4 mA Bridge tied load application BTL see Fig 4 Output power note 1 Vp 3 0 V diot 10 Po 140 mW Vp 4 5 V diot 10 R 64 Q Po 150 mW Voltage gain Gy 32 dB Noise output voltage r m s value Rg 5 kQ f 1 kHz Vno tms 140 uV Rs 0 Q f 500 kHz B 5 kHz Vho rms tbf uV D C output offset voltage at Rs 5 kQ JAV 70 mV Input impedance at Rg
4. INTEGRATED CIRCUITS DATA SHEET TDA7050 Low voltage mono stereo power amplifier Product specification June 1989 File under Integrated Circuits IC01 Philips PHILIPS Semiconductors DH LI p Philips Semiconductors Low voltage mono stereo power amplifier GENERAL DESCRIPTION The TDA7050 is a low voltage audio amplifier for small radios with headphones such as watch pen and pocket radios in mono bridge tied load or stereo applications Features Limited to battery supply application only typ 3 and 4 V Operates with supply voltage down to 1 6 V No external components required Very low quiescent current Fixed integrated gain of 26 dB floating differential input Flexibility in use mono BTL as well as stereo Small dimension of encapsulation see package design example QUICK REFERENCE DATA Product specification Nee eee a eee eee eee eT TDA7050 Supply voltage range Vp Total quiescent current at Vp 3 V liot Bridge tied load application BTL Output power at R 32 Q Vp 3 V diot 10 Po D C output offset voltage between the outputs AV Noise output voltage r m s value at f 1 kHz Rg 5 kQ Vho rms Stereo application Output power at RL 32 Q diot 10 Vp 3V Po dtot 10 Vp 4 5 V Py Channel separation at Rg 0 Q f 1 kHz a Noise output voltage r m s value atf 1 kHz Rg 5 kQ Vho rms 1 6 to 6 0 V typ 3 2 mA typ 140 mW max 70 mV typ 140 pV
5. de 9398 652 90011 Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C solder at this temperature must not be in contact with the joint for more than 5 seconds The total contact time of successive solder waves must not exceed 5 seconds DEFINITIONS Product specification TDA7050 The device may be mounted up to the seating plane but the temperature of the plastic body must not exceed the specified maximum storage temperature T stg max If the printed circuit board has been pre heated forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit Repairing soldered joints Apply a low voltage soldering iron less than 24 V to the lead s of the package below the seating plane or not more than 2 mm above it If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds If the bit temperature is between 300 and 400 C contact may be up to 5 seconds Data sheet status Objective specification Preliminary specification This data sheet contains target or goal specifications for product development This data sheet contains preliminary data supplementary data may be published later Product specification Limiting values This data sheet contains final product specifications Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134
6. s test circuit June 1989 6 Philips Semiconductors Product specification Low voltage mono stereo power amplifier TDA7050 PACKAGE OUTLINE DIP8 plastic dual in line package 8 leads 300 mil SOT97 1 seating plane scale DIMENSIONS inch dimensions are derived from the original mm dimensions Be AT ene a ew UNIT max min max b by b2 c D E 9 8 6 48 1 14 9 2 6 20 0 39 0 26 0 36 0 24 mm 4 2 0 51 3 2 inches 0 17 0 020 0 13 Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC EIAJ PROJECTION SOT97 1 050G01 MO 001AN E sane A ISSUE DATE June 1989 7 Philips Semiconductors Low voltage mono stereo power amplifier SOLDERING Introduction There is no soldering method that is ideal for all IC packages Wave soldering is often preferred when through hole and surface mounted components are mixed on one printed circuit board However wave soldering is not always suitable for surface mounted ICs or for printed circuits with high population densities In these situations reflow soldering is often used This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our IC Package Databook order co
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