Intel 8mb User's Manual
Contents
1. ck H314V 318vd 7 F 8603 SLNOY ON 11422170 WRIWIXVIW L3SNI NYO 5 NOLSSIOUd STONY CHHL AdYNIdd NO 9 1391008 WTI HO 026123 OL 83438 8 3003 SH3NHOO AHLSINWAS V ONY SNOIGNSNG Bu OINYNAG 553009 5530039 ATHINdSSV S3ONVH3101 3215 HO S3ONVMOTIV 131015315 HLIM 03211111 38 OL S1n0 d333 TVOINVHO3MW ALIAVO 133908 40 H31N39 2 NI SNOISN3MIG T 00 56 S310N 0052 Ss NOILISOd GAMOOHNN 5 int BOR 5 8 S 2 ZZ BR aS 5558 5 22588 858688 XR 3 1 1 0617 7 LLL 22 106s y f 222 N d Late 4 fees 0006 b c M 09262. 31 16 Socket Processor ILM Keep out Zone Primary Side 32 17 Socket Processor ILM Keep out Zone Secondary Side 33 18 Heatsink Back Plate Keep in 2 hh hanh a RR RARE ARA RR 35 19 Heatsink Back Plate aes dane ee ke LO x DA 36 LGA1150 Socket Application Guide September 2013 4 Order No 328999 002 Tables LGA1150 Socket n tel Tables 1 Related o ierit ene toda EU RM iere p X DRE UM 7 2 Terms and Descriptions aues eer ien A pina REIR EA RR RA LR RE 7 3 Socket Component M ss deren ate see chides E ca tates RE REA EN a 24 4 1150 land Package and LGA1150 Socket Stackup 24 5 Socket and ILM Mechanical Specifications 1 emen 25 6 Electrical Requirements for LGA1150 Socket 26 7 LGA1150 Socket ILM 6 4 emen 28 8 Supplier Contact InformoaltiOn sefer cnn neve etes dec u
3. 2418 R T oo o D 6 4594 o o 6 o 0 0584 E 9 D 0 00000004 TIONS A 900000 5 29 33 35 30 32 3i 16 18 20 22 24 26 28 Dimensions in mm Attachment to Motherboard The socket is attached to the motherboard by 1150 solder balls There are no additional external methods that is screw extra solder adhesive and so on to attach the socket As indicated in Figure 1 on page 9 the Independent Loading Mechanism ILM is not present during the attach reflow process September 2013 Order No 328999 002 m 1641150 Socket LGA1150 Socket n tel Figure 3 2 3 September 2013 Attachment to Motherboard Socket Components The socket has two main components the socket body and Pick and Place PnP cover and is delivered as a single integral assembly Refer to Socket Mechanical Drawings for detailed drawings Socket Body Housing The housing material is thermoplastic or equivalent with UL 94 V 0 flame rating capable of withstanding 260 9 for 40 seconds which is compatible with typical reflow rework profiles The socket coefficient of thermal expansion in the XY plane and creep propert
4. 1 7 G3H91VINn 5 62 81 001 i SA Lord G 2 5 056 gle om p 8 6 Bt NOLLOW r4 i zs Lee ae 18 ONINAdO 31V d QVO 1 ea 48 I 055 0629 5 a Ms RII M 5 COS 1 1 7 092 He 1 et 4 Y 5282 iy 1504 1 3016 5 plo 1N3NOdMOO 301S 0061 1 929 9276 926 re 9 9 SONVYVS1O ul i GLE 1 gt 4 549 he 8 b OL Loup 00 X gt 1 i orst 2 18698 4 1 9019 H3A3101 i dais dOL 30VdS NOILOW LGA1150 Socket September 2013 Order No 328999 002 Application Guide 32 intel Mechanical Drawings LGA1150 Socket Socket Processor ILM Keep out Zone Secondary Side Bottom Figure 17 23901388 31 25 LON ANON MBIA 4 1 24 1 1 V 8211 O3HOLV IND 1862 NM
5. 88300 H39NIJ AHVONnOS LN3NOdAOO 8 n 9 008908 INL 1Sd NI SNOISN3NIGY NOESY OIE Henn OL NOISSG TIVHS SH3dO TIHA3Q 114905 SNIOHVIA NI 134005 40 IHL OL TIYHS TWOINVHOSW WWHSHL SHONVHSIOL IZIS 5 ANY WNIWON 135005 3HL SSVdWOON3 3NnTOA NI d333 13320876 WTI OL 30 SSONVHO 3dVHS IWNOISNANIG 133909 LI 034901 183905 A1HW3SSY ONY 9 9 NOILO3S 1332058 5 153 LHOI3H TVOLLH3A AWN IOA NI d333 134905 Z osz 1 SNI d333 LN3NOdWOO WD VO PP 06 0 69 ALIAVO ONISNOH 183208 JO YILNI _ 863 994 0060 S3NVTd H31N39 133008 rds 051 S310N J Lj
6. dawdd REN ag ARR EN FEAR 15 2 9 5 vn 15 3 0 Independent Loading Mechanism 11 16 3 1 DESIGN CONCEP UE 16 3 2 Assembly of Independent Loading Mechanism ILM to Motherboard 19 3 3 Independent Loading Mechanism ILM 21 3 4 21 3 5 Independent Loading Mechanism ILM 21 4 0 LGA1150 Socket and ILM 24 4 1 Mechanical Specifications iiie re eris x steed RR 24 4 2 Electrical Requiremehts ease pent exe prec Rankin e ase sunu e DUCERE EE ilr Rex S 25 4 3 Environmental esee nnne hun t RARE REN RAE ERE REN AER 26 Appendix A Component 28 Appendix B Mechanical 29 Appendix C Heatsink Back Plate na na nnn nana nn 34 LGA1150
7. As indicated in Figure 11 on page 22 the pick and place cover should remain installed during ILM assembly to the motherboard After assembly the pick and place cover is removed the ILM Cover installed and the ILM mechanism closed The ILM Cover is designed to pop off if the pick and place cover is accidentally left in place and the ILM closed with the ILM Cover installed This is shown in Figure 12 on page 23 LGA1150 Socket Application Guide September 2013 22 Order No 328999 002 Independent Loading Mechanism ILM LGA1150 Socket n tel Figure 12 ILM Cover and PnP Cover Interference As indicated in Figure 12 on page 23 the pick and place cover cannot remain in place and used in conjunction with the ILM Cover The ILM Cover is designed to interfere and pop off if the pick and place cover is unintentionally left in place The ILM cover will also interfere and pop off if the ILM is closed with a processor in place in the socket LGA1150 Socket September 2013 Application Guide Order No 328999 002 23 4 1 Table 3 Table 4 LGA1150 Socket Application Guide 24 LGA1150 Socket LGA1150 Socket and ILM Specifications LGA1150 Socket and ILM Specifications This chapter describes the following specifications and requirements Mechanical Specifications on page 24 e Electrical Requirements page 25 e Environmental Requirements on page 26 Mechanical Specifications Component Mass Socket Co
8. The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology SMT manufacturing line The cover remains on the socket during reflow to help prevent contamination during reflow The cover can withstand 260 C for 40 seconds typical reflow rework profile and the conditions listed in LGA1150 Socket and ILM Specifications on page 24 without degrading As indicated in Figure 4 on page 13 the cover remains on the socket during ILM installation and should remain on whenever possible to help prevent damage to the Socket contacts Cover retention must be sufficient to support the socket weight during lifting translation and placement board manufacturing and during board and system shipping and handling PnP Cover should only be removed with tools to prevent the cover from falling into the contacts The socket vendors have a common interface on the socket body where the PnP cover attaches to the socket body This should allow the PnP covers to be compatible between socket suppliers As indicated in Figure 4 on page 13 a Pin 1 indicator on the cover provides a visual reference for proper orientation with the socket September 2013 Order No 328999 002 m 1641150 Socket LGA1150 Socket n tel Figure 4 Pick and Place Cover Pick amp Place Cover ILM Installation 2 4 Package Installation Removal As indicated in Figure 5 on page 14 access is provided t
9. 7 1962 918 0092 0252 rtc 008 NMOHS SY ee Adis NO 2 9 9 Naasosynis 006 TV 5 Z 28 FA XE E ON 9 83015 9 AMA 0010 0 0 i 0090 202 0090 xe sre 500 zoe 00 Lo y 0 orsz 13 xz emm 0025 7 8062 1962 2 ev ve d x xz 06 19 96 6 m f r ON 200 0090 0880 68858 3 88 ass HINOS HLdN xv 00 HIdN XE 1sva 1 3016 HIHON intel Figure 14 September 2013 Order No 328999 002 LGA1150 Socket Application Guide 30 intel Socket Heatsink ILM Keep out Zone Secondary Side Bottom 770 61536 owwwuaswosiowon 00019193 vo VINS 1 TARY QUL Thanuawaaa LHOI3H LN3NOdMWOO 1 OZELZ3 Nd TALNI Nrd33 OSM 10A 1 3132008 2 Sle 4292 000 2 4
10. compatibility with the reference thermal mechanical components LGA1150 Socket September 2013 Application Guide Order No 328999 002 15 a n tel LGA1150 Socket Independent Loading Mechanism ILM Note 3 1 LGA1150 Socket Application Guide 16 Independent Loading Mechanism ILM The ILM has two critical functions deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints The mechanical design of the ILM is integral to the overall functionality of the LGA1150 socket Intel performs detailed studies on integration of processor package Socket and ILM as a system These studies directly impact the design of the ILM The Intel reference ILM will be build to print from Intel controlled drawings Intel recommends using the Intel Reference ILM Custom non Intel ILM designs do not benefit from Intel s detailed studies and may not incorporate critical design parameters There is a single ILM design for the LGA1150 socket LGA1156 socket and LGA1155 socket Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM assembly and back plate To secure the two assemblies two types of fasteners are required a pair 2 of standard 6 32 thread screws and a custom 6 32 thread shoulder screw The reference design incorporates a T 20 Torx head fastener The To
11. eo Electrical Requirements LGA1150 socket electrical requirements are measured from the socket seating plane of the processor to the component side of the socket PCB to which it is attached All specifications are maximum values unless otherwise stated for a single socket contact but includes effects of adjacent contacts where indicated LGA1150 Socket Application Guide Order No 328999 002 25 n te 1641150 Socket LGA1150 Socket ILM Specifications Table 6 Electrical Requirements for LGA1150 Socket Parameter Value Comment Mated loop inductance Loop The inductance calculated for two contacts lt 3 6nH considering one forward conductor and one return conductor These values must be satisfied at the worst case height of the socket Socket Average Contact Resistance The socket average contact resistance target is EOL calculated from the following equation sum Ni X LLCRi sum Ni e is the chain resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the 19 mOhm daisy chain is the number of contacts within a chain 115 the number of daisy chain ranging from 1 to 119 total number of daisy chains The specification listed is at room temperature and has to be satisfied at all time Max Individual Contact Resistance The specification listed is at room temperature EOL and has to be satisfied at all ti
12. location does not prevent contact between the ILM and the capacitors however it minimizes the load applied by the ILM to the capacitors September 2013 Order No 328999 002 m e Independent Loading Mechanism ILM LGA1150 Socket n tel Figure 6 Note Caution September 2013 The ILM assembly design ensures that once assembled to the back plate the only features touching the board are the shoulder screw and the insulated hinge frame assembly The nominal gap of the load plate to the board is 1 mm When closed the load plate applies two point loads onto the IHS at the dimpled features shown in Figure 6 on page 17 The reaction force from closing the load plate is transmitted to the hinge frame assembly and through the fasteners to the back plate Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints A pin 1 indicator will be marked on the ILM assembly ILM Assembly with Installed Processor Hinge Frame ASSy Fasteners Load Load Lever Plate Pin 1 Indicator Shoulder Screw Independent Loading Mechanism ILM Back Plate Design Overview The back plate is a flat steel back plate with pierced and extruded features for ILM attach A clearance hole is located at the center of the plate to allow access to test points and backside capacitors if required An insulator is pre applied A notch is placed in one corner to assist in orientin
13. withstand 20 cycles of processor insertion and removal The maximum chain contact resistance from Table 6 on page 26 must be met when mated in the ist and 20th cycles The socket Pick and Place cover must withstand 15 cycles of insertion and removal Markings There are three markings on the socket LGA1150 Font type is Helvetica Bold minimum 6 point 2 125 mm This mark will also appear on the pick and place cap e Manufacturer s insignia font size at supplier discretion e Lot identification code allows traceability of manufacturing date and location markings must withstand 260 9 for 40 seconds typical reflow rework profile without degrading and must be visible after the socket is mounted on the motherboard LGA1150 and the manufacturer s insignia are molded or laser marked on the side wall September 2013 Order No 328999 002 1641150 Socket LGA1150 Socket n tel 2 7 Component Insertion Forces Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Table R2 7 Maximum Grip Forces The socket must be designed so that it requires no force to insert the package into the socket 2 8 Socket Size Socket information needed for motherboard design is given in Appendix C This information should be used in conjunction with the reference motherboard keep out drawings provided in Appendix B to ensure
14. 0 Socket Introduction Term Description FSC Fan Speed Control IHS Integrated Heat Spreader a component of the processor package used to enhance the thermal performance of the package Component thermal solutions interface with the processor at the IHS surface ILM Independent Loading Mechanism provides the force needed to seat the LGA1150 land package onto the socket contacts MD Metal Defined pad is one where a pad is individually etched into the PCB with a minimum width trace exiting it PCH Platform Controller Hub The PCH is connected to the processor using the Direct Media Interface DMI and Intel Flexible Display Interface Intel FDI LGA1150 socket The processor mates with the system board through this surface mount 1150 land socket PECI The Platform Environment Control Interface PECI is a one wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices Case to ambient thermal characterization parameter psi A measure of thermal solution performance using total package power Defined as Tcase Total Package Power The heat source should always be specified for Y measurements VU cs Case to sink thermal characterization parameter A measure of thermal interface material performance using total package power Defined as Ts Total Package Power U sa Sink to am
15. 3 m LGA1150 Socket Application Guide September 2013 Order No 328999 002 INFORMATION IN THIS DOCUMENT IS PROVIDED CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT A Mission Critical Application is any application in which failure of the Intel Product could result directly or indirectly in personal injury or death SHOULD YOU PURCHASE OR USE INTEL S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES SUBCONTRACTORS AND AFFILIATES AND THE DIRECTORS OFFICERS AND EMPLOYEES OF EACH HARMLESS AGAINST ALL CLAIMS COSTS DAMAGES AND EXPENSES AND REASONABLE ATTORNEYS FEES ARISING OUT OF DIRECTLY OR INDIRECTLY ANY CLAIM OF PRODUCT LIABILITY PERSONAL INJURY OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN MANUFACTURE OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS Intel may make changes to specifi
16. 38 DCA HSK 144 FT1002 B CD with screws 002 01 30 2 09 10 Backplate with E66807 PT44P18 64 N A N A DCA HSK 157 NA screws 001 01 Y03 Notes 1 The 1U Back Plate is a point solution for uP servers This has not been validated for desktop design This should be used only were the clearance between the back of the motherboard and chassis is limited such as 1U rack servers 2 Individual ILM covers are made available for post sales support Table 8 Supplier Contact Information Supplier Contact Phone Email Foxconn Eric Ling 1 503 693 3509 x225 eric ling foxconn com ITW Fastex Chak Chakir 1 512 989 7771 Chak chakir itweba com Lotes Co Ltd Windy Wang 1 604 721 1259 windy lotestech com Molex Carol Liang 86 21 504 80889 x3301 carol liang molex com Tyco Alex Yeh primary 886 2 21715280 alex yeh te com contact Stanley Yen 886 2 21715291 stanley yen te com secondary contact The enabled components may not be currently available from all suppliers Contact the supplier directly to verify time of component availability LGA1150 Socket Application Guide September 2013 28 Order No 328999 002 Mechanical Drawings LGA1150 Socket Appendix B Mechanical Drawings The following table lists the mechanical drawings included in this appendix Table 9 Mechanical Drawing List Drawing Description Figure Number Location Socket Heatsink ILM Keep out Zone Primary Side Top Figure 1
17. 4 on page 30 Socket Heatsink ILM Keep out Zone Secondary Side Bottom Figure 15 on page 31 Socket Processor ILM Keep out Zone Primary Side Top Figure 16 on page 32 Socket Processor ILM Keep out Zone Secondary Side Bottom Figure 17 on page 33 September 2013 Order No 328999 002 LGA1150 Socket Application Guide 29 wings LGA1150 Socket Mechanical Dra Socket Heatsink ILM Keep out Zone Primary Side Top Fees 1 6119 I aaanewvaa XLV 133005 95 1 9 99 6118 29095 VO TO VINYS 203 109 0022 sanw 4 1HOI3H LNANOdWOO 9c 2 1N3NOdWOO WW sz LN3NOdIAOO 102 1 JOVAYNS 2 22 1nO d333 ONILNOY QHVOS LN3NOdMWOO WIN Z AHSISH LN3NOdWOO WIN 9 IN3NOdMWOO WIN 01 0 LNANOdWOO TVOINVHO3W TVIWNH3HI L349O0S QN3931 T ASH 618123
18. 92 ese 1408 0092 7 i 008i i 2 0801 2 966 02 xil 1 000 c 00 25 SNITLNO XE 5 0096 22 E 00 2 2 S 00792 AD 15 3 1S3M 0098 d 2 2019 Hinas 0001 8 Xp 5 5 SNId333 1 LN3NOdWOO 5282 Adis AHVONOO3S SNILOOH 1 z saul Mechanical Drawings LGA1150 Socket Figure 15 31 LGA1150 Socket Application Guide Order No 328999 002 September 2013 wings LGA1150 Socket Mechanical Dra intel Socket Processor ILM Keep out Zone Primary Side Top Figure 16 23911334 LON 0001 374 r 026 23 EET Nid333 40551204449 144905 SSLL 8 9811 91 Em BLLEZS056 VO Vll TO VINVS N3dO NnNININ alvid QvO1N3dO STONY N3dO WARWIXVIN NI d333 LNANOdWOS
19. Loading Mechanism ILM The ILM design includes a back plate which is integral to having a uniform load on the socket solder joints Socket loading specifications are listed in LGA1150 Socket and ILM Specifications on page 24 LGA1150 Pick and Place Cover A Board Layout The land pattern for the LGA1150 socket is 36 mils X 36 mils X by Y within each of the two L shaped sections There is no round off conversion error between socket pitch 0 9144 mm and board pitch 36 mil as these values are equivalent The two L sections are offset by 0 9144 mm 36 mil in the x direction and 3 114 mm 122 6 mil in the y direction see Figure 2 on page 10 This was to achieve a common package land to PCB land offset that ensures a single PCB layout for socket designs from the multiple vendors LGA1150 Socket Application Guide 9 intel Figure 2 2 2 LGA1150 Socket Application Guide 10 LGA1150 Socket Land Pattern LGA1150 Socket LGA1150 Socket _ 5 M i 990000 AV nt tn i D o D o 5 00000000 a AJ AC 1 8 AD o M 1 1 RE lt _ lt 4t a W ooo
20. O39 S3NY 1d H31N30 13 008 L SALON LGA1150 Socket 5 0 5 5 9 lt 2 9 mo NM 0 Ez LGA1150 Socket Heatsink Back Plate Drawings intel Heatsink Back Plate Figure 19 naday _______ _ 80 50 11 ASSY 31918 XIVE 5193 TH 32 39 5 NOISN3WIC 312 2 541 022 W101 541 SS SI 183SNI Q31V38Hl 1 03010 X04 33803 in HShd JHL 1 5 September 2013 Order No 328999 002 LGA1150 Socket Application Guide 36
21. OHS SV 3015 824 NO 82d Adis dol 08 19 gt LN3NOdWOO SSs3oov I 8 0501 00 HLAN 0862 XE 18 52 8 5 3 ofa amp 3903 ON 30 L3SNI H3ddOO SHJAVIMJHIO TV ON OLE XE 99019 NO ON 00 0095 A 500 1 3dis AYYNI Yd H3ddOO y 841 0 ONILNNOW 89d Adis dol LGA1150 Socket Application Guide 33 Order No 328999 002 September 2013 a n tel LGA1150 Socket Heatsink Back Plate Drawings Appendix C Heatsink Back Plate Drawings This heatsink back plate design is intended to adapt as a reference for OEMs that use threaded fasteners on customized thermal solution to comply with the mechanical and structural requirements for the LGA115x socket The heatsink back plate does not have to provide additional load for socket solder joint protect Structural design strategy for the heatsink is to provide sufficient load for the Thermal Interface Material TIM and to minimize stiffness imp
22. Socket September 2013 Application Guide Order No 328999 002 3 n tel LGA1150 Socket Figures Figures 1 1 150 Pick Place 9 2 LGA1150 Socket Land 10 3 Attachment to oerte enki das Busan End ERR NR 11 4 Pick and Place 13 5 Package Installation Removal 2 2 2 1 nennen 14 6 ILM Assembly with Installed 4 44 1 4 4 41 4121 1 17 7 Back c H 18 8 SHOUIAE FS COW pn 19 9 Independent Loading Mechanism ILM 20 10 Pini and Independent Loading Mechanism ILM 20 11 Independent Loading Mechanism ILM 22 12 Cover and PnP Cover dna a ER ARR ARR RARE ua RE 23 13 Flow Chart of Knowledge Based Reliability Evaluation 27 14 Socket Heatsink ILM Keep out Zone Primary Side 30 15 Socket Heatsink ILM Keep out Zone Secondary Side
23. act on the motherboard Note Design modifications for specific application and manufacturing are the responsibility of OEM and the listed vendors for customized system implementation and validation These vendors and devices are listed by Intel as a convenience to Intel s general customer base but Intel does not make any representations or warranties whatsoever regarding quality reliability functionality or compatibility of these devices Customers are responsible for thermal mechanical and environmental validation of these solutions This list and or these devices may be subject to change without notice Please refer to the motherboard keep out zone listed the LGA1150 Socket Application Guide to ensure compliant with the heatsink back plate implementation Figure 18 on page 35 is the heatsink back plate keep in zone for the design implementation Table 10 on page 34 lists the mechanical drawings included in this appendix Table 11 on page 34 lists the mechanical drawings Table 10 Mechanical Drawing List Drawing Description Figure Number Location Heatsink Back Plate Keep in Zone Figure 18 on page 35 Heatsink Back Plate Figure 19 on page 36 Table 11 Supplier Contact Information Supplier Contact Phone Email Chaun Choung Technology Monica Chih 886 2 29952666 monica_chih ccic com tw Corp x1131 The enabled components may not be currently available from supplier Contact the supplier
24. ading Mechanism ILM LGA1150 Socket n tel 3 3 Note 3 4 3 5 September 2013 Independent Loading Mechanism ILM Interchangeability ILM assembly and ILM back plate built from the Intel controlled drawings are intended to be interchangeable Interchangeability is defined as an ILM from Vendor A will demonstrate acceptable manufacturability and reliability with a socket body from Vendor A B or C ILM assembly and ILM back plate from all vendors are also interchangeable The ILM are an integral part of the socket validation testing ILMs from each vendor will be matrix tested with the socket bodies from each of the current vendors The tests would include manufacturability bake and thermal cycling See Component Suppliers on page 28 for vendor part numbers that were tested ILMs that are not compliant to the Intel controlled ILM drawings can not be assured to be interchangeable Markings There are four markings on the ILM e 115XLM Font type is Helvetica Bold minimum 6 point 2 125 mm e Manufacturer s insignia font size at supplier s discretion Lot identification code allows traceability of manufacturing date and location e Pin 1 indicator on the load plate All markings must be visible after the ILM is assembled on the motherboard 115XLM and the manufacturer s insignia can be ink stamped or laser marked on the side wall Independent Loading Mechanism ILM Cover Intel has developed an ILM Co
25. bient thermal characterization parameter A measure of heatsink thermal performance using total package power Defined as Ts Total Package Power SMD The Solder Mask Defined pad is typically a pad in a flood plane where the solder mask opening defines the pad size for soldering to the component to the printed circuit board Tcase Tc The case temperature of the processor measured at the geometric center of the topside of the TTV IHS TcASE _ MAX The maximum case temperature as specified in a component specification TCC Thermal Control Circuit Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and or operating frequency and input voltage adjustment when the die temperature is very near its operating limits TCONTROL Tcontrot 15 a static value that is below the TCC activation temperature and used as trigger point for fan speed control When DTS gt the processor must comply to the TTV thermal profile TDP Thermal Design Power Thermal solution should be designed to dissipate this target power level TDP is not the maximum power that the processor can dissipate Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature Thermal Profile Line that defines case temperature specification of the TTV at a given power level TIM Thermal Interface Material The thermally conductive
26. cations and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The information here is subject to change without notice Do not finalize a design with this information The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Copies of documents which have an order number and are referenced in this document or other Intel literature may be obtained by calling 1 800 548 4725 or go to http www intel com design literature htm This document contains information on products in the design phase of development Code Names are only for use by Intel to identify products platforms programs services etc products in development by Intel that have not been made commercially available to the public i e announced launched or shipped They are never to be used as commercial names for products Also they are not intended to function as trademarks Intel Intel Core Pentium Xeon an
27. compound between the heatsink and the processor case This material fills the air gaps and voids and enhances the transfer of the heat from the processor case to the heatsink Thermal Test Vehicle A mechanically equivalent package that contains a resistive heater in the die to evaluate thermal solutions The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink Tsa The system ambient air temperature external to a system chassis This temperature is usually measured at the chassis air inlets LGA1150 Socket Application Guide September 2013 8 Order No 328999 002 m 1641150 Socket LGA1150 Socket n tel 2 0 Figure 1 2 1 September 2013 Order No 328999 002 LGA1150 Socket This chapter describes a surface mount LGA Land Grid Array socket intended for the processors The socket provides I O power and ground contacts The socket contains 1150 contacts arrayed about a cavity in the center of the socket with lead free solder balls for surface mounting on the motherboard The contacts are arranged in two opposing L shaped patterns within the grid array The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and selective depopulation elsewhere The socket must be compatible with the package processor and the Independent
28. cription of this methodology can be found at ftp download intel com technology itj q32000 pdf reliability pdf LGA1150 Socket September 2013 Application Guide Order No 328999 002 27 Appendix Component Suppliers LGA1150 Socket Component Suppliers Note The part numbers listed below identifies the reference components End users are responsible for the verification of the Intel enabled component offerings with the supplier These vendors and devices are listed by Intel as a convenience to Intel s general customer base but Intel does not make any representations or warranties whatsoever regarding quality reliability functionality or compatibility of these devices Customers are responsible for thermal mechanical and environmental validation of these solutions This list and or these devices may be subject to change without notice Table 7 LGA1150 Socket and ILM Components Item Intel PN Foxconn Molex Tyco Lotes ITW LGA1150 Socket G27433 115027 4 4759630 2134930 ACA ZIF 138 NA 002 041 01F 32 1 P01 LGA115X ILM with G11449 PT44L61 64 N A 2013882 ACA ZIF 078 FT1002 A F cover 002 11 8 Y28 LGA115X ILM without E36142 PT44L61 64 4759688 2013882 ACA ZIF 078 FT1002 A cover 002 01 55 3 Y19 LGA115X ILM cover 612451 012 1000 53 1 213450 ACA ZIF 127 FT1002 F only 001 77 3 1 01 Desktop Backplate E36143 PT44P19 64 4759699 20698
29. d by the heatsink and its retention solution to maintain the heatsink to IHS interface This does not imply the Intel reference TIM is validated to these limits 3 Loading limits are for the LGA1150 socket 4 This minimum limit defines the static compressive force required to electrically seat the processor onto the socket contacts The minimum load is a beginning of life load 5 Dynamic loading is defined as a load a 4 3 m s 170 in s minimum velocity change average load superimposed on the static load requirement 6 Test condition used a heatsink mass of 500 gm 1 102 Ib with 50 g acceleration table input and an assumed 2X Dynamic Acceleration Factor DAF The dynamic portion of this specification in the product application can have flexibility in specific values The ultimate product of mass times acceleration plus static heatsink load should not exceed this limit 7 The maximum BOL value and must not be exceeded at any point in the product life The minimum value is a beginning of life loading requirement based on load degradation over time 9 The maximum removal force is the flick up removal upwards thumb force measured at 459 not applicable to SMT operation for system assembly Only the minimum removal force is applicable to vertical removal in SMT operation for system assembly 10 The maximum heatsink mass includes the core extrusion fan and fasteners This mass limit is evaluated using the POR heatsink attach to the PCB
30. d the Intel logo are trademarks of Intel Corporation in the U S and or other countries Other names and brands may be claimed as the property of others Copyright 9 2013 Intel Corporation All rights reserved LGA1150 Socket Application Guide September 2013 2 Order No 328999 002 Contents LGA1150 Socket n tel Contents Revision History 6 1 0 nini 7 1 1 Related DOCUtments urere hie _ _ ___ 7 1 2 Definition TCIM 852804 esa eese ad 7 2 0 LGA1150 5 9 2 1 CIDBEVIM 9 2 2 Attachment to Motherboard 2 teer rue aan RAW UAR S Eas SEE REF RR URN 10 2 3 Socket Components ex a AMEN RP VEN oii nM ERR ARRA T ads 11 2 4 Package Installation Removal cedi isses hen ke dis a 13 2 5 14 PE ORUEIDnI 14 2 7 Component Insertion
31. directly to verify time of component availability LGA1150 Socket Application Guide September 2013 34 Order No 328999 002 intel Heatsink Back Plate Drawings LGA1150 Socket Heatsink Back Plate Keep in Zone Figure 18 ET 3105 LON OG zv 8 avd 8 68t893 I NI d33y 31V 1dXOV8 SH 9511 9811 VO T 611870006 VO VINYS Od 3937109 NOISSIM 0022 I 6 m 18 52 XC sd m 805 am t 4281 8 91 5069 xv v SNOISN3WIG 8 KINO 39N3H33MH 99 Nid333 8300 9 WII LH 133206 30 3015170 N9IS3Q TIVHS SH3dO T3A3G AN3NOdWOO TVOINVHO3W TVWH3HL 3215 S3ONVMOTIV 3WmOATYNINON 1 JHL SSVvdWOON3 NFd33 31V 1dOV8 SH 9811 9 9611 VOTE SNI d339 IN3NOdWOO VOS 5 ALIAVO ONISNOH 134905 40 H31N39 OIH13W
32. g the back plate during assembly The Server ILM back plate is different from the Desktop design Since Server secondary side clearance of 3 0 mm 0 118 inch is generally available for leads and backside components so Server ILM back plate is designed with 1 8 mm thickness and 2 2 mm entire height including punch protrusion length Intel does NOT recommend using the server back plate for high volume desktop applications at this time as the server back plate test conditions cover a limited envelope Back plates and screws are similar in appearance To prevent mixing different levels of differentiation between server and desktop back plate and screws have been implemented For ILM back plate three levels of differentiation have been implemented e Unique part numbers please refer to part numbers listed in Table 7 on page 28 Desktop ILM back plate to use black lettering for marking versus server ILM back plate to use yellow lettering for marking LGA1150 Socket Application Guide Order No 328999 002 17 a n tel LGA1150 Socket Independent Loading Mechanism ILM Note Figure 7 Note LGA1150 Socket Application Guide 18 e Desktop ILM back plate using marking 115XDBP versus server ILM back plate using marking 115XSBP When reworking a BGA component or the socket that the heatsink battery ILM and ILM back plate are removed prior to rework The ILM back plate should also be removed when reworking thr
33. ies must be such that the integrity of the socket is maintained for the conditions listed in LGA1150 Socket and ILM Specifications on page 24 The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems Solder Balls A total of 1150 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard The socket solder ball has the following characteristics LGA1150 Socket Application Guide Order No 328999 002 11 n tel LGA1150 Socket LGA1150 Socket LGA1150 Socket Application Guide 12 e Lead free SAC SnAgCu 305 solder alloy with a silver Ag content between 3 and 4 and a melting temperature of approximately 217 C The alloy is compatible with immersion silver ImAg and Organic Solderability Protectant OSP motherboard surface finishes and a SAC alloy solder paste e Solder ball diameter 0 6 mm 0 02 mm before attaching to the socket lead The co planarity profile and true position requirements are defined in Socket Mechanical Drawings Contacts Base material for the contacts is high strength copper alloy For the area on socket contacts where processor lands will mate there is a 0 381 15 pinches minimum gold plating over 1 27 um 50 minches minimum nickel underplate No contamination by solder in the contact area is allowed during solder reflow Pick and Place Cover
34. me Socket Contact 100 mOhm Resistance The resistance of the socket contact solderball and interface resistance to the interposer land gaps included Bulk Resistance Increase The bulk resistance increase per contact from seme 25 C to 100 C Dielectric Withstand Voltage 360 Volts RMS Insulation Resistance 800 MQ 4 3 Environmental Requirements Design including materials shall be consistent with the manufacture of units that meet the following environmental reference points The reliability targets in this section are based on the expected field use environment for these products The test sequence for new sockets will be developed using the knowledge based reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 13 on page 27 LGA1150 Socket Application Guide September 2013 26 Order No 328999 002 LGA1150 Socket ILM Specifications LGA1150 Socket n tel Figure 13 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the Develop Speai lative market expected use stress conditions based on environment for the historical data content technology experts and lte rature search Freeze stressing Perform stressing to requirements and perform validate accelerated additional data tums stressing assumptions and determine acceleration factors A detailed des
35. mponent Mass Component Mass Socket Body Contacts and PnP Cover 10g ILM Cover 29g ILM Back Plate 38g Package Socket Stackup Height The following table provides the stackup height of a processor in the 1150 land LGA package and LGA1150 socket with the ILM closed and the processor fully seated in the socket 1150 land Package and LGA1150 Socket Stackup Height Component Stackup Height Note Integrated Stackup Height mm From Top of Board to Top of IHS 7 781 0 335 mm 2 Socket Nominal Seating Plane Height 3 4 0 2 mm 1 Package Nominal Thickness lands to top of IHS 4 381 0 269 mm 1 Note 1 This data is provided for information only and should be derived from a the height of the socket seating plane above the motherboard after reflow given in Socket Mechanical Drawings b the height of the package from the package seating plane to the top of the IHS and accounting for its nominal variation and tolerances that are given in the corresponding processor datasheet 2 The integrated stackup height value is a RSS calculation based on current and planned processors that will use the ILM design Loading Specifications The socket will be tested against the conditions listed in Thermal Solution Quality and Reliability Requirements Chapter of the Processor Thermal Mechanical Design Guidelines see Related Documents section with heatsink and the ILM attached under the loading c
36. o facilitate manual installation and removal of the package To assist in package orientation and alignment with the socket e The package Pin 1 triangle and the socket Pin 1 chamfer provide visual reference for proper orientation e The package substrate has orientation notches along two opposing edges of the package offset from the centerline The socket has two corresponding orientation posts to physically prevent mis orientation of the package These orientation features also provide initial rough alignment of package to socket e socket has alignment walls at the four corners to provide final alignment of the package LGA1150 Socket September 2013 Application Guide Order No 328999 002 13 n tel LGA1150 Socket LGA1150 Socket Figure 5 2 5 2 6 LGA1150 Socket Application Guide 14 Package Installation Removal Features Package Orientation Pin 1 FN Notch Indicator gt 2 Places Finger Tool Access 2 Places Alignment Post Pin 1 2 Places Chamfer Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Socket Mechanical Drawings Similarly a seating plane on the topside of the socket establishes the minimum package height See Package Socket Stackup Height on page 24 for the calculated IHS height above the motherboard Durability The socket must
37. onditions outlined in this section September 2013 Order No 328999 002 LGA1150 Socket ILM Specifications LGA1150 Socket Table 5 4 2 September 2013 intel Table 5 on page 25 provides load specifications for the LGA1150 socket with the ILM installed The maximum limits should not be exceeded during heatsink assembly shipping conditions or standard use condition Exceeding these limits during test may result in component failure The socket body should not be used as a mechanical reference or load bearing surface for thermal solutions Socket and ILM Mechanical Specifications Parameter Minimum Maximum Notes static compressive load on processor 311 N 70 Ibf 600 N 135 Ibf 3 4 7 8 Heatsink static compressive load 0 Ibf 222 N 50 Ibf 1 2 3 Total static compressive Load ILM plus 311 N 70 Ibf 822 N 185 Ibf 3 4 7 8 Heatsink Dynamic Compressive Load with heatsink N A 712 N 160 Ibf 1 3 5 6 installed Pick amp Place cover insertion force N A 10 2 N 2 3 Ibf Pick amp Place cover removal force 2 2N 0 5 Ibf 7 56 N 1 7 Ibf 9 Load lever actuation force 20 9N 4 716 in the vertical N A direction 10 2 N 2 3 Ibf in the lateral direction Maximum heatsink mass N A 500g 10 Notes 1 These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface 2 This is the minimum and maximum static force that can be applie
38. ough hole mounted components in a mini wave or solder pot The maximum temperature for the pre applied insulator on the ILM is approximately 106 C Back Plate Die Cut Insulator Assembly Orientation Feature Pierced amp Extruded Thread Features Shoulder Screw and Fasteners Design Overview The shoulder screw is fabricated from carbonized steel rod The shoulder height and diameter are integral to the mechanical performance of the ILM The diameter provides alignment of the load plate The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts The design assumes the shoulder screw has a minimum yield strength of 235 MPa The screws for Server ILM are different from Desktop design The length of Server ILM screws are shorter than the Desktop screw length to satisfy Server secondary side clearance limitation Server ILM back plate to use black nickel plated screws whereas desktop ILM back plate to use clear plated screws Unique part numbers please refer to Table 7 on page 28 The reference design incorporates a T 20 Torx head fastener The Torx head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM September 2013 Order No 328999 002 m Independent Loading Mechanism ILM LGA1150 Socket n tel Figure 8 Shoulder Screw Cap 6 32 thread Shoulder 3 2 A
39. rx head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM The Torx head fastener is also less susceptible to driver slippage Once assembled the ILM is not required to be removed to install remove the motherboard from a chassis ILM Assembly Design Overview The ILM assembly consists of 4 major pieces ILM cover load lever load plate and the hinge frame assembly All of the pieces in the ILM assembly except the hinge frame and the screws used to attach the back plate are fabricated from stainless steel The hinge frame is plated The frame provides the hinge locations for the load lever and load plate An insulator is pre applied to the bottom surface of the hinge frame Figure 14 on page 30 through Figure 17 on page 33 list the applicable keep out zones of the socket and ILM Figure 14 on page 30 describes recommended maximum heights of neighboring components on the primary side of the board to avoid interference with the Intel reference thermal solution The keep out zone in Figure 14 on page 30 does not prevent incidental contact with the ILM load plate and ILM cover while it is open for insertion removal of the processor In designs requiring no cosmetic marks to be made on capacitors along the hinge side of the ILM the recommendation is for the location of the capacitors to be against the keep out zone boundary closest to the hinge of the ILM This
40. sar anaes EA 28 9 Mechanical Drawing List i unc ni ebd erlaubt n ERR RR ERR A Pr RR KK a RE 29 10 Mechanical Drawing Visti coi era cea ena 34 11 Supplier Contact InforratiOD debe p eR E Kn HR Ein a uaa rna 34 LGA1150 Socket September 2013 Application Guide Order No 328999 002 5 n tel LGA1150 Socket Revision History Revision History Revision Number Description Revision Date 001 Initial release June 2013 002 Added Desktop Intel Pentium processor family September 2013 LGA1150 Socket Application Guide September 2013 6 Order No 328999 002 Introduction LGA1150 Socket n tel 1 0 1 1 Table 1 1 2 Table 2 September 2013 Introduction This document covers the LGA1150 socket for Desktop systems using the Desktop 4th Generation Intel Core processor family Desktop Intel Pentium processor family and for UP Server Workstation systems using the Intel Xeon processor E3 1200 v3 product family The information in this document include e The thermal and mechanical specifications for the socket The mechanical interface requirements to properly integrate the socket into a board design Related Documents Material and concepts available in the following documents ma
41. ssembly of Independent Loading Mechanism ILM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board See Figure 9 on page 20 for step by step assembly sequence 1 Place the back plate in a fixture The motherboard is aligned with the fixture 2 Install the shoulder screw in the single hole near Pin 1 of the socket Torque to a minimum and recommended 8 inch pounds but not to exceed 10 inch pounds 3 Install two 2 6 32 fasteners Torque to a minimum and recommended 8 inch pounds but not to exceed 10 inch pounds 4 Remove pick and place cover and close ILM leaving the ILM cover in place The thread length of the shoulder screw accommodates a nominal board thicknesses of 0 062 LGA1150 Socket September 2013 Application Guide Order No 328999 002 19 n tel LGA1150 Socket Independent Loading Mechanism ILM Figure 9 Independent Loading Mechanism ILM Assembly Step 1 As indicated in Figure 10 on page 20 the shoulder screw socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket The result is a specific Pin 1 orientation with respect to ILM lever Figure 10 Pini and Independent Loading Mechanism ILM Lever Alignment Features Shoulder Screw shown for clarity Load Lever LGA1150 Socket Application Guide September 2013 20 Order No 328999 002 Independent Lo
42. ver that will snap onto the ILM for the LGA115x socket family The ILM cover is intended to reduce the potential for socket contact damage from operator and customer fingers being close to the socket contacts to remove or install the pick and place cap The ILM Cover concept is shown in Figure 11 on page 22 The ILM Cover is intended to be used in place of the pick and place cover once the ILM is assembled to the motherboard The ILM will be offered with the ILM Cover pre assembled as well as offered as a discrete component ILM Cover features Pre assembled by the ILM vendors to the ILM load plate It will also be offered as a discrete component e cover will pop off if a processor is installed the socket and the ILM Cover and ILM are from the same manufacturer Cover be installed while the ILM is open Maintain inter changeability between validated ILM vendors for LGA115x socket with the exception noted below LGA1150 Socket Application Guide Order No 328999 002 21 n tel LGA1150 Socket Independent Loading Mechanism ILM e The ILM cover for the LGA115x socket will have a flammability rating of V 2 per UL 60950 1 Note The ILM Cover pop off feature is not supported if the ILM Covers are interchanged on different vendor s ILMs Figure 11 Independent Loading Mechanism ILM Cover Step 1 PnP Cover installed during ILM assembly Step 2 Remove PnP Cover
43. y be beneficial when reading this document Related Documents Title Document Number Location Desktop 4th Generation Intel Core Processor Family and Desktop Intel 328897 Pentium Processor Family Datasheet Volume 1 of 2 Desktop 4th Generation Intel Core Processor Family and Desktop Intel 328898 Pentium Processor Family Datasheet Volume 2 of 2 Intel Xeon Processor E3 1200 v3 Product Family Datasheet Volume 1 of 2 328907 Intel Xeon Processor E3 1200 v3 Product Family Datasheet Volume 2 of 2 329000 Desktop 4th Generation Intel Core Processor Family and Intel Xeon 328900 Processor E3 1200 v3 Product Family Thermal Mechanical Design Guidelines Intel 8 Series C220 Series Chipset Family Platform Controller Hub PCH 328906 Thermal Mechanical Specifications and Design Guidelines Definition of Terms Terms and Descriptions Term Description Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct For this example it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface CTE Coefficient of Thermal Expansion The relative rate a material expands during a thermal event DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature continued LGA1150 Socket Application Guide Order No 328999 002 7 LGA115
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