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Goodram 512MB PC-3200

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1. AM Device 0x04 4 18 SDRAM Device Attributes CAS Latency 0x1C 28 19 SDRAM Device Attributes CS Latency 0x01 1 20 SDRAM Device Attributes Write Latency DIMM Type Information 0x02 2 21 SDRAM Module Attributes 0x20 32 22 SDRAM Device Attributes General 0x00 0 23 Minimum Clock Cycle at CL X 0 5 0x60 96 24 Maximum Data Access Time tAC from Clock at CL X 0 5 0x70 112 25 Minimum Clock Cycle at CL X 1 0x75 117 26 Maximum Data Access Time tAC from Clock at CL X 1 0x75 117 27 Minimum Row Precharge Time tRP 0x48 72 28 Minimum Row Active to Row Active delay tRRD 0x28 40 29 Minimum RAS to CAS delay tRCD 0x48 72 30 Minimum Active to Precharge Time tRAS 0x28 40 31 Module Bank Density 0x40 64 32 Address and Command Input Setup Time Before Clock 0x60 96 33 Address and Command Input Hold Time After Clock 0x60 96 34 Data Input Setup Time Before Clock 0x40 64 35 Data Input Hold Time After Clock 0x40 64 36 Write recovery time tWR 0x00 0 37 Internal write to read command delay tWTR 0x00 0 38 Internal read to precharge command delay tRTP 0x00 0 39 Memory Analysis Probe Characteristics 0x00 0 40 Extension of Byte 41 tRC and Byte 42 tRFC 0x00 0 4 SDRAM Device Minimum Active to Active Auto Refresh Time tRC 0x3C 60 42 SDRAM Device Minimum Auto Refresh to Active Auto Refresh tRFC 0x46 70 43 SDRAM Device Maximum device cycle time tCKmax 0x28 40 44 SDRAM Device Maximum skew between DQS and DQ signals tDQSQ 0x28 40 45 DDR SDRAM D
2. Wwww goodram com GR 400 S GOODRAM SPEED DATATRANSFER 400MHz PC 3200 MODULETYPE DDR SO DIMM MODULE DATA WIDTH 64 CAS LATENCY 3 MODULE DENSITY 512MB 64 L3 572 FEATURES PART NUMBER MODULETYPE MODULE DENSITY MODULE DATA WIDTH DRAM CHIP ORAGNIZATION NUMBER OF DRAM CHIPS NUMBER OF MODULE RANKS NUMBER OF MODULE SIDES REGISTERED ECC SUPPORT PIN COUNT SUPPLY VOLTAGE SSTL 2 COMPATIBLE PROGRAMMED SPD MEMORY MAX AVG PERIODIC REFRESH INTERVAL OPERATING FREQUENCY GR400S64L3 512 DDR SDRAM SODIMM 512MB 64 32Mx16 8 2 2 NO NO 200 PIN 2 6V YES 128 BYTES 7 8 us CAS Latency 400MHz 2x200MHz PC 3200 333MHz 2x166MHz PC 2700 266MHz 2x133MHz PC 2100 2 5 2 DYNAMIC PARAMETERS FOR 400MHz RAS TO CAS DELAY tRCD ROW PRECHARGE TIME tRP ROW ACTIVE TO ROW ACTIVE DELAY tRRD ACTIVE TO PRECHARGE TIME tRAS ACTIVE TO ACTIVE AUTO REFRESH TIME tRC AUTO REFRESH TO ACTIVE AUTO REFRESH tRFC DEVICE CYCLE TIME tCK MAX 18 ns 18 ns 10 ns 40 ns 60 ns 0 ns 10 PCB DETAILS PCB TYPE BOARD DIMENSIONS BOARD THICKNESS DRAM PACKAGE INFORMATION CONTACT PADS PIN DDR SDRAM SODIMM 67 56x 31 5mm 0 1mm 1 02mm 0 1mm TSOP x16bit GOLD PLATED GOODRAM logo and GOODDRIVE logo are registered trademarks of Wilk Elektronik S A All other trademarks and logos are the property of their respective owners All products and specifications are subject to change withou
3. evice Maximum Read Data Hold Skew Factor tQHS 0x50 80 46 Reserved for future use 0x00 0 47 SDRAM Device Attributes DDR SDRAM DIMM Height 0x00 0 48 Reserved for future use 0x00 0 49 Reserved for future use 0x00 0 50 Reserved for future use 0x00 0 5 Reserved for future use 0x00 0 52 Reserved for future use 0x00 0 53 Reserved for future use 0x00 0 54 Reserved for future use 0x00 0 55 Reserved for future use 0x00 0 56 Reserved for future use 0x00 0 57 Reserved for future use 0x00 0 58 Reserved for future use 0x00 0 59 Reserved for future use 0x00 0 60 Reserved for future use 0x00 0 61 Reserved for future use 0x00 0 62 SPD Revision 0x11 17 63 Checksum for Bytes 0 62 0xD5 213 64 255 Manufacturer s specific data GOODRAM logo and GOODDRIVE logo are registered trademarks of Wilk Elektronik S A Wilk Elektronik S A All other trademarks and logos are the property of their respective owners Poland 43 174 aziska G rne ul Mikolowska 42 WILK All products and specifications are subject to change without notice tel 0 32 736 90 00 fax 0 32 736 90 01 EET RIESA TT M www Wilk com pl www goodram com Rev 04 12 2007 Wilk Elektronik S A 2007
4. t notice Rev 04 12 2007 DDR MODULE PART NUMBERING SYSTEM SEST Wilk Elektronik S A Poland 43 174 aziska G rne ul Miko owska 42 tel 0 32 736 90 00 fax 0 32 736 90 01 www wilk com pl e www goodram com Wilk Elektronik S A 2007 MEMORY MODULE SPECIFICATION professional memory for everyone Tt NId I Nid 007 NId 661 Nid 96 9 WILK ELEKTRONIK SA p EET Wwww goodram com MEMORY MODULE SPECIFICATION SPD CONFIGURATION GOOD a BYTE DESCRIPTION HEX DEC PAN vA professional memory for everyone 0 Number of Serial PD Bytes written during module production 0x80 128 1 Total number of Bytes in Serial PD device 0x08 8 2 Fundamental Memory Type FPM EDO SDRAM 0x07 7 3 Number of Row Addresses on this assembly 0x0D 13 4 Number of Column Addresses on this assembly 0x0A 10 5 Number of DIMM Banks 0x02 2 6 Data Width of this assembly 0x40 64 7 Data Width of this assembly 0x00 0 8 Voltage Interface Level of this assembly 0x04 4 9 SDRAM Cycle time at Maximum Supported CAS Latency CL CL X 0x50 80 10 SDRAM Access from Clock 0x70 112 11 DIMM configuration type Non parity Parity or ECC 0x00 0 12 Refresh Rate Type 0x82 130 13 Primary SDRAM Width 0x08 8 14 Error Checking SDRAM Width 0x00 0 15 SDRAM Device Attributes Minimum Clock Delay Back to Back RCA 0x01 1 16 SDRAM Device Attributes Burst Lengths Supported Ox0E 14 17 SDRAM Device Attributes Number of Banks on SDR

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