Kingston Technology HyperX KHX16C10B1RK2/16X
Contents
1. Posted CAS Programmable Additive Latency 0 CL 2 or CL 1 clock Programmable CAS Write Latency CWL 7 DDR38 1333 8 bit pre fetch Burst Length 8 Interleave without any limit sequential with starting address 000 only 4 with tCCD 4 which does not allow seamless read or write either on the fly using A12 or MRS Bi directional Differential Data Strobe Internal self calibration Internal self calibration through ZQ pin RZQ 240 ohm 1 On Die Termination using ODT pin Average Refresh Period 7 8us at lower than TCASE 85 C 3 9us at 85 C lt TCASE lt 95 C Asynchronous Reset PCB Height 1 180 30 00mm double sided component Continued gt gt Document No 4806495 001 A00 08 16 12 Page 1 continued MODULE DIMENSIONS its milli 133 35 30 00 Units millimeters 18 80 15 80 11 00 8 00 0 00 0 00 54 70 MODULE WITH HEAT SPREADER FOR MORE INFORMATION GO TO WWW KINGSTON COM All Kingston products are tested to meet our published specifications Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings Kingston does not recommend that any user attempt to run their computers faster than the published speed Overclocking or modifying your system timing may result in damage to computer components kingston com Document No 4806495 001 A00 Page 22. Memory Module Specifications Kingston KHX16C10B1RK2 16X 16GB 8GB 1G x 64 Bit x 2 pcs DDR3 1600 CL10 240 Pin DIMM Kit DESCRIPTION Kingston s KHX16C10B1RK2 16X is a kit of two 1G x 64 bit 8GB DDR8 1600 CL10 SDRAM Synchronous DRAM 2Rx8 memory modules based on sixteen 512M x 8 bit DDR3 FBGA components per module Each module kit supports Intel XMP Extreme Memory Profiles Total kit capacity is 16GB Each module kit has been tested to run at DDR3 1600 at a low latency timing of 10 10 10 at 1 5V The SPDs are programmed to JEDEC standard latency DDR3 1333 timing of 9 9 9 at 1 5V Each 240 pin DIMM uses gold contact fingers and requires 1 5V The JEDEC standard electrical and mechanical specifi cations are as follows XMP TIMING PARAMETERS e JEDEC DDR3 1333 CL9 9 9 1 5V e XMP Profile 1 D3 1600 CL10 10 10 1 5V kingston com Core inside SPECIFICATIONS CL IDD 9 cycles Row Cycle Time tRCmin 49 5ns min Refresh to Active Refresh 260ns min Command Time tRFCmin Row Active Time tRASmin 36ns min Maximum Operating Power 2 460 W per module _ UL Rating 94V 0 Operating Temperature 0 C to 85 C Storage Temperature 55 C to 100 C Power will vary depending on the SDRAM used FEATURES JEDEC standard 1 5V 1 425V 1 575V Power Supply e VDDQ 1 5V 1 425V 1 575V 667MHz fCK for 13833Mb sec pin 8 independent internal bank Programmable CAS Latency 9 8 7 6
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