IBM 300GB High IOPS MLC
Contents
1. B w N m Te N a x 90Y4361 A3MZ IBM 300GB High IOPS MLC Modular NJN Adapter 90Y4365 A3N0 IBM 600GB High IOPS MLC Modular NJN Adapter 90Y4369 A3N1 IBM 800GB High IOPS MLC Modular NJN Adapter 90Y4373 A3N2 IBM 300GB High IOPS SLC Modular NJN Adapter Table 3 Supported System x and iDataPlex servers Part 2 N co w y lt 3 Part Feature number code Product description x lt 90Y4361 A3MZ IBM 300GB High IOPS MLC N Modular Adapter 90Y4365 A3N0 IBM 600GB High IOPS MLC N Modular Adapter 90Y4369 A3N1 IBM 800GB High IOPS MLC N Modular Adapter 90Y4373 A3N2 IBM 300GB High lOPS SLC N Modular Adapter Support is planned for 1Q 2013 z z z z x3250 M4 2583 z z z z x3300 M4 7382 EREE x3500 M4 7383 IBM High IOPS Modular Adapters aka eae ee x3530 M4 7160 pee assem eee GERE x3620 M3 7376 x3650 M4 7915 Ze EE x3550 M4 7914 z z z z x3630 M4 7158 ee ee a le z x3630 M3 7377 Zz z z z z x3690 X5 7147 C e e peon e e ers el n sarcoma era dx360 M4 7912 Table 4 Supported BladeCenter and Flex System servers Feature number code Product description re moe ee ofa Po svar an iasian ore ic moserne n fete Ln fw fo t The HS23 supports these adapters with the addition of the IBM BladeCenter PCI Express Gen 2 Expansion Blade Il part number 68Y7484 pao wom b 2 HS22V 7871 HRE HS23 7875 B2. when installed in a supported IBM server these adapters assume your system s base warranty IBM High IOPS Modular Adapters 1 Part number information Table 1 lists the information for ordering part numbers and feature codes Table 1 Ordering part numbers and feature codes IBM 300GB High lOPS MLC Modular Adapter 90Y4361 A3MZ IBM 600GB High lOPS MLC Modular Adapter 90Y4365 A3NO IBM 800GB High lOPS MLC Modular Adapter 90Y4369 A3N1 IBM 300GB High lOPS SLC Modular Adapter 90Y4373 A3N2 The part numbers for the adapters include the following items IBM High lOPS MLC Modular or SLC Modular Adapter with full height 3U bracket attached Low profile 2U bracket USB Key with the documentation and drivers Quick Install Guide Important Notices Warranty Flyer IBM Safety Information Technical Update Flyer IBM High IOPS Modular Adapters Features The IBM High lOPS Modular Adapters use NAND flash memory as the basic building block of solid state storage and contain no moving parts thus are less sensitive to issues associated with vibration noise and mechanical failure These adapters are built as block devices on a PCle bus with advanced wear leveling ECC and chip level redundancy providing unparalleled reliability and efficiency Based on the standard PCle architecture coupled with the modular NAND SLC and eMLC storage technologies the High IOPS Modular Adapters are optimized for System x rack servers and can be deployed in bl
3. 365 90Y4369 90Y4373 Penman E N 2 0 x8 PCle 2 0 x8 PCle 2 0 x8 o 2 0 x8 x8 wired x8 wired x8 wired x8 wired Form factor factor Full height Full height Full height Full height Full height Full height 11 5 PB TBW 23 PB TBW 30 7 PB TBW 76 8 PB TBW Low profile bracket is also included with the adapter The TBW value assigned to a solid state device is the total bytes of written data based on the number of P E cycles that a device can be guaranteed to complete the percentage of remaining P E cycles is equal to the percentage of remaining TBW The IBM warranty for the solid state storage is limited to devices that have not reached the maximum guaranteed number of program erase cycles Solid state storage that reaches this limit might fail to operate according to its specifications Because of such behavior by these devices careful planning must be done to use solid state storage in the application environments to ensure that the TBW of the device is not exceeded before the end of the required life expectancy IBM High IOPS Modular Adapters 4 Supported servers The IBM High lOPS Modular Adapters can be installed in the System x and IBM iDataPlex servers identified in Table 3 and the BladeCenter and Flex System servers identified in Table 4 Table 3 Supported System x and iDataPlex servers Part 1 _ co N 0 as K N 0 amp Oe S Part Feature N number code Product description x lt S iN N lt
4. F ANY KIND EITHER EXPRESS OR IMPLIED INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF NON INFRINGEMENT MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE Some states do not allow disclaimer of express or implied warranties in certain transactions therefore this statement may not apply to you This information could include technical inaccuracies or typographical errors Changes are periodically made to the information herein these changes will be incorporated in new editions of the publication IBM may make improvements and or changes in the product s and or the program s described in this publication at any time without notice Any references in this information to non IBM Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites The materials at those Web sites are not part of the materials for this IBM product and use of those Web sites is at your own risk IBM may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you Information concerning non IBM products was obtained from the suppliers of those products their published announcements or other publicly available sources IBM has not tested those products and cannot confirm the accuracy of performance compatibility or any other claims related to non IBM products Questions on the capabilities of non IBM products should be addressed to the suppliers of those prod
5. We Redbooks IBM High IOPS Modular Adapters IBM Redbooks Product Guide The new family of IBM High IOPS Modular Adapters is the ultimate performance solution for embedded direct attached storage for IBM System x IBM BladeCenter and IBM Flex System The offerings include 300 GB 600 GB and 800 GB Multi Level Cell MLC adapters and a 300 GB Single Level Cell SLC adapter Designed to offer high performance with low latency and a low CPU burden these adapters can improve the performance of applications regardless of the mix of reads and writes The IBM High lOPS Modular Adapters are built on the latest enterprise level solid state technologies and include sophisticated advanced features to help deliver consistently high levels of performance endurance and reliability under some of the most demanding conditions The robust technology in these adapters helps optimize the number of program cycles to the flash storage efficiently extending the rated endurance of flash storage The following figure shows an IBM High IOPS Modular Adapter Figure 1 IBM High IOPS Modular Adapter with the low profile bracket Did you know The IBM High IOPS Modular Adapters can be fully re written up to 20 times per day eMLC or up to 140 times per day SLC throughout their entire five year life time expectancy Providing additional peace of mind these adapters are covered under IBM warranty They carry a 1 year limited warranty or
6. ades through the PCle expansion units Typical uses are applications with ultra high performance I O needs such as Web serving Online transaction processing Data warehousing Business intelligence and analytics Decision support High performance computing The IBM High lOPS Modular Adapters have the following features Technology features e _Industry standard PCle form factor e Enterprise grade NAND SLC and eMLC technology e Modular NAND flash architecture e Function as a PCle storage and controller device The operating system sees a block device Performance and reliability features High performance of more than 200 000 read IOPS Access latency as low as 50 us Up to 2 GBps of sustained sequential throughput Enterprise grade SLC and eMLC 55 bit ECC protection per 512 bytes Block level and page level failure protection DuraWrite advanced wear leveling technology Dynamic Overprovisioning Advanced Read Disturb Management Recycler Advanced Garbage Collection Monitoring and management features e Overall health e Thermal information e Flash wear out Note These adapters cannot be used as bootable devices IBM High IOPS Modular Adapters Technical specifications The following table presents the technical specifications for the IBM High IOPS Modular Adapters Table 2 IBM High lOPS Modular Adapter technical specifications 300 GB eMLC 600 GB eMLC 800 GB eMLC 300 GB SLC Partnumber number fsovaset 90Y4
7. e HS23E 8038 Pe HX5 7873 aHa x240 8737 r ase e028 Le 2 HS22 7870 See the IBM ServerProven website for the latest compatibility information for System x BladeCenter iDataPlex and Flex System servers at http ibm com servers eserver serverproven compat us Supported operating systems The IBM High lOPS Modular Adapters support the following operating systems Microsoft Windows Server 2012 Microsoft Windows Server 2008 R2 Microsoft Windows Server 2008 Datacenter x64 Edition Microsoft Windows Server 2008 Enterprise x64 Edition Microsoft Windows Server 2008 Web x64 Edition Red Hat Enterprise Linux 6 Server x64 Edition Red Hat Enterprise Linux 5 Server x64 Edition Red Hat Enterprise Linux 5 Server with Xen x64 Edition SUSE Linux Enterprise Server 11 for AMD64 EM64T SUSE Linux Enterprise Server 11 with Xen for AMD64 EM64T SUSE Linux Enterprise Server 10 for AMD64 EM64T SUSE Linux Enterprise Server 10 with Xen for AMD64 EM64T VMwere vSphere 5 1 VMware vSphere 5 VMware ESX 4 1 VMware ESXi 4 1 See the IBM ServerProven website for the latest information about the specific versions and service packs supported at http ibm com servers eserver serverproven compat us Click System x servers then Disk controllers to see the support matrix Click the check mark that is associated with the System x server in question to see the details of the operating system support Warranty The IBM High IOPS Modular Adap
8. l Business Machines Corporation in the United States other countries or both BladeCenter IBM Flex System IBM iDataPlex Redbooks Redbooks logo ServerProven ServicePac System x The following terms are trademarks of other companies Linux is a trademark of Linus Torvalds in the United States other countries or both Microsoft Windows and the Windows logo are trademarks of Microsoft Corporation in the United States other countries or both Other company product or service names may be trademarks or service marks of others IBM High IOPS Modular Adapters 10
9. nfiguration and Options Guide http www ibm com support docview wss uid psg1SCOD 3ZVQ5W e IBM ServerProven http ibm com servers eserver serverproven compat us IBM High IOPS Modular Adapters Notices This information was developed for products and services offered in the U S A IBM may not offer the products services or features discussed in this document in other countries Consult your local IBM representative for information on the products and services currently available in your area Any reference to an IBM product program or service is not intended to state or imply that only that IBM product program or service may be used Any functionally equivalent product program or service that does not infringe any IBM intellectual property right may be used instead However it is the user s responsibility to evaluate and verify the operation of any non IBM product program or service IBM may have patents or pending patent applications covering subject matter described in this document The furnishing of this document does not give you any license to these patents You can send license inquiries in writing to IBM Director of Licensing IBM Corporation North Castle Drive Armonk NY 10504 1785 U S A The following paragraph does not apply to the United Kingdom or any other country where such provisions are inconsistent with local law INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION AS IS WITHOUT WARRANTY O
10. ters carry a 1 year customer replaceable unit CRU limited warranty When installed in a supported IBM server these adapters assume your system s base warranty and any IBM ServicePac upgrade IBM High IOPS Modular Adapters Physical specifications The IBM High lOPS Modular Adapters have the following physical specifications Dimensions and weight approximate Height 16 mm 0 6 in Width 68 mm 2 7 in Depth 168 mm 6 6 in Weight 227 g 0 5 Ib Shipping dimensions and weight approximate Height 114 mm 4 5 in Width 241 mm 9 5 in Depth 318 mm 12 5 in Weight 648 g 1 4 Ib Operating environment The IBM High lOPS Modular Adapters are supported in the following environment Temperature operational 5 40 C 41 104 F at 0 3 048 m 0 10 000 ft Temperature non operational 40 60 C 40 140 F at 0 10 700 m 0 35 105 ft Relative humidity 8 85 non condensing Maximum altitude operational 3 048 m 10 000 ft Agency approvals The IBM High IOPS Modular Adapters have the following agency approvals UL cUL IEC60950 EMC FCC TUV VDE CE VCCI BSMI C tick MIC KCC IBM High IOPS Modular Adapters Related publications For more information see the following documents e IBM US Announcement Letter for the IBM High IOPS Modular Adapters http ibm com common ssi cgi bin ssialias infotype dd amp subtype ca amp amp htmifid 897 ENUS 112 213 e BM System x Co
11. ucts This information contains examples of data and reports used in daily business operations To illustrate them as completely as possible the examples include the names of individuals companies brands and products All of these names are fictitious and any similarity to the names and addresses used by an actual business enterprise is entirely coincidental Any performance data contained herein was determined in a controlled environment Therefore the results obtained in other operating environments may vary significantly Some measurements may have been made on development level systems and there is no guarantee that these measurements will be the same on generally available systems Furthermore some measurement may have been estimated through extrapolation Actual results may vary Users of this document should verify the applicable data for their specific environment COPYRIGHT LICENSE This information contains sample application programs in source language which illustrate programming techniques on various operating platforms You may copy modify and distribute these sample programs in any form without payment to IBM for the purposes of developing using marketing or distributing application programs conforming to the application programming interface for the operating platform for which the sample programs are written These examples have not been thoroughly tested under all conditions IBM therefore cannot guarantee or imply reliabilit
12. y serviceability or function of these programs Copyright International Business Machines Corporation 2012 All rights reserved Note to U S Government Users Restricted Rights Use duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp IBM High IOPS Modular Adapters 9 This document was created or updated on November 20 2012 Send us your comments in one of the following ways e Use the online Contact us review form found at ibm com redbooks e Send your comments in an e mail to redbook us ibm com e Mail your comments to IBM Corporation International Technical Support Organization Dept HYTD Mail Station P099 2455 South Road Poughkeepsie NY 12601 5400 U S A This document is available online at http www ibm com redbooks abstracts tips0937 html Trademarks IBM the IBM logo and ibm com are trademarks or registered trademarks of International Business Machines Corporation in the United States other countries or both These and other IBM trademarked terms are marked on their first occurrence in this information with the appropriate symbol or indicating US registered or common law trademarks owned by IBM at the time this information was published Such trademarks may also be registered or common law trademarks in other countries A current list of IBM trademarks is available on the Web at http www ibm com legal copytrade shtml The following terms are trademarks of the Internationa
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