Samsung 4GB DDR3-1333MHz
Contents
1. 133 35 0 15 lt gt k 128 95 gt 4 0 9 76 10 9 18 92 32 40 18 93 9 74 gt gt lt m gt l gt e Z N L E2. 133 35 0 15 lt gt 5 I 128 95 gt 1 Y LO ES N A b r1 for x64 SPD m pr oy ECC m z for 72 n H M 2 9 2 50 N 54 675 A B 47 00 71 00 4 0 gt 64 J _ C 1 270 0 10 gt lt a 5 00 S 0 80 0 05 2 2 10 0 15 gt lt 0 80 005_ lt 3 80 0 2 0 15 1 50 0 10 xi 1 00 2 50 Detail Detail ELECTRONICS October 2009 General Information DDR3 SDRAM x64 204pin DDR3 SDRAM Unbuffered SODIMM Units Millimeters
3. 67 60 10 10 P 63 60 1 _ 3 8 S I En 8 o N M 1 00 0 10 24 80 m 21 00 39 00 gt 2X 2 1 80 20 10 OPTIONAL HOLES 2X 4 00 E A B 20 10 0 60 MX gt lt 0 45 0 03 i 4 00 0 10 Tess 0 1 00 0 40 0 25 MAX Detail A Detail B October 2009 ELECTRONICS General Information DDR3 SDRAM x72 240pin DDR3 SDRAM Registered DIMM Units Millimeters
4. 7 50 0 10 x 0 80 8 6 40 5 A1 INDEX MARK 5 Datum 0 80 1 60 3 20 q A1 E 7 50 0 10 9 765432 B Y B o o o gt Datum 8 OOO 3 5 E Hlooo 0064 x Jjooo Klooo OOO M OOO o e NSS SN 0 35 0 05 78 20 45 Solder ball Post Reflow 20 05 0 05 gt 1 10 0 10 6 2 0 2 WJAJB 1 90 Bottom Top 96Ball FBGA for 1Gb E die x16 7 50 0 10 pm E 0 80 x 8 6 40 E 0 80 1 60 3 20 ATLINDEX MARK 7 50 0 10 4 epe A1 9 7654321 666 loog i D Datum Blooo ooo ooo ooo Datum B E 5 2 F o c D ooo 2 5 _ R b E ooe 4s e looo 2 3 5 ooo 1 ooo 000 D B oof 0 35 0 05 96 20 45 Solder ball ree 0 95 m Post Reflow 20 05 0 05 MOLDING AREA 1 10 0 10 2 02 1 90 Bottom Top ELECTRONICS October 2009 General Information DDR3 SDRAM 78Ball FB
5. Note 1 35 product is 1 5 operatable October 2009 ELECTRONICS General Information DDR3 SDRAM 5 RDIMM RCD Information 5 1 RCD Identification in JEDEC Description in Module Label 5 2 Label Example 4GB 2Rx4 PC3 10600R 09 10 E1 Made Korea M393B5170EH1 CH9 0920 5 3 RCD Information Example Voltage Vendor Revision Module P N JEDEC Description On Label Inphi GS04 B2 M393B5170EH1 CH9 4 2Rx4 PC3 10600R 09 10 E1 PO 1 5V IDT LV DDR3 BO M393B5170EH1 CH9 4 2Rx4 PC3 10600R 09 10 E1 D2 Inphi LV GS02 CO M393B5170EH1 YF8 4 2Rx4 PC3L 8500R 07 10 E1 P1 1 35V IDT LV DDR3 BO M393B5170EH1 YF8 4 2Rx4 PC3L 8500R 07 10 E1 D2 October 2009 ELECTRONICS General Information DDR3 SDRAM 78 FBGA for 1Gb D die x4 x8 P 9 00 0 10 5 0 80 x 10 8 00 5 A1 INDEX MARK 5 Datum 0 80 1 60 4 00 E q aat gt 1 l 9 00 0 10 N11 10987654321 B N ooo 9 B OOO 7 1 Datume ooo D OOO OOO gt 2 x
6. Inside Green Line TIM Attatch Line y ad B October 2009 ELECTRONICS DDR3 SDRAM General Information DDR3 SDRAM 3 CLIP PART 39 3 0 2 2917 gt 01 03 ri B e 51 gt 4 1 4 DDR3 ASS Y View Reference thickness total Maximum Mono Package 7 55mm DDP Package 7 71mm With Clip thickness 132 95 133 45 1 27 1 05 39 3 0 2 19 0 1 K text mark B or K punch press_stamp E Clip open size Dimension Index Mono DDP Note Min Typ Max Min Typ Max A 43 9 44 4 B 6 7 6 8 6 9 7 2 7 3 7 4 C 5 8 6 3 D 6 7 6 8 6 9 7 2 7 3 7 4 E Clip open size 2 5 3 6 2 6 3 8 October 2009 ELECTRONICS
7. 3 6 o z H ooo ooe 8 J OOO OOO L O O O Q 4 Y T 0 35 0 05 82 20 45 Solder ball 0 95 MOLDING AREA Post Reflow 20 05 0 05 1 10 0 10 e 0 2 190 Bottom Top e Support Ball 96 4Ball FBGA for 1Gb D die x16 9 00 0 10 x 0 80 x 10 8 00 2 A1 INDEX MARK 0 80 160 4 00 1 a 9 00 0 10 0 11 10987654321 NI t Datum A B ooo ooo DatumB 2 F o ONN ooo e 5 5 OOO 4 d gt H ooo 5 ooo S 5 8 ooo 5 i 2 3 L OOO OOO OOO OOO N OOO OOO OOO OOO e T u ONDO Y i 100 20 45 Solder ball 0 95 C Post Reflow 20 05 0 05 MOLDING AREA 4 10 0 40 6 2 0 2 A B 1 90 Bottom Top Support Ball ELECTRONICS October 2009 General Infor mation DDR3 SDRAM 78Ball FBGA 1Gb E die x4 x8 1Gb F die x4 x8 2Gb C die x4 x8
8. Internal n Org Density Part Number Speed Raw Card Composition Version Banks Rank Height Avail Note MA71B2873EH1 YF8 H9 1 8 128M x8 8pcs 166 Edie 8 1 128 64 1GB M471B2874EH1 YF8 H9 1 16 64M 16 8 1Gb E die 8 2 96 ball 30mm Now M471B2873FHS YF8 H9 1 8 128M x8 8pcs 1Gb F die 8 1 s M471B5673EH1 YF8 H9 128M x8 16 1Gb E die F 2Rx8 8 2 78 ball 256 64 208 M471B5673FHO0 YF8 H9 128M x8 16 1Gb F die FBGA Now M471B5773CHS YF8 H9 1 8 256M x8 8pcs 2Gb C die 8 1 M471B5273BH1 YF8 H9 256M x8 16pcs 2Gb B die 78 ball 512 64 4GB F 2Rx8 8 2 FBGA 30mm Now M471B5273CH0 YF8 H9 256M x8 16pcs 2Gb C die Note 1 35V product is 1 5V operatable October 2009 ELECTRONICS General Information DDR3 SDRAM 4 5 240Pin DDR3 Registered DIMM 1 5V Product 240Pin DDR3 Registered DIMM Org Density Part Number Speed Raw Card Composition n Rank PKG Height Note M393B2873DZ1 CF8 H9 128M x8 9pcs 1Gb D die 128 72 1GB M393B2873EH1 CF8 H9 ACRX8 128M 9pcs 1Gb E de Now M393B2873FH0 CF8 H9 128M x8 9pcs 1Gb F die FBGA
9. o E bz s 2 f E o x S I 2 50 el 1 0 max _______ 54 675 A B 47 00 Y 71 00 1 27 0 10 19 J J r a 5 00 0 80 0 05 I 3 80 0 2 0 15 10 9 0 4 gt k M J 12 50 i 1 50 0 10 1400 Detail Detail Detail IU C 2x 2 10 0 15 D j L gt J U O Address Command and Control lines October 2009 ELECTRONICS General Information Registered DIMM Heat Spreader Design 1 FRONT PART Outside 133 15 0 2 gt 130 45 0 15 0 65 0 2 9 26 2977 gt bu 31 4 F z sr xU W o T 3 S s 0 LO N N N B t M 127 0 12 il m N 1 3 5 S I 1 k Inside Green Line TIM Attatch Line L j Peg pedestal line J 4 y Br E 80 78 119 29 lt 128 5 l 2 BACK PART Outside EI E
10. OOO C OOO OOO Datum D 8 5 OOO OOO el o OOO OOO 5 el 5 b G eO O Nj h H OOO 6 m5 2 D J D K lg L OOO OOO M OOO O O D N OO Y 410 35 0 05 78 0 45 Solder ball Post Reflow 20 50 0 05 612 0 2 1 40 0 10 Bottom Top ELECTRONICS October 2009 General Information DDR3 SDRAM 78Ball for 2Gb B die x4 x8 10 00 0 10 x 0 80 x 8 6 40 s Datum A 0 80 1 60 3 20 MAPK gt gt lt gt 1 10 00 0 10 4 98765432 ooo Y B OOO C OOO OOO Datum B D 8 b OOO OOO el o i F 3 el 5 b G S0 O Nj H OO6 r 8 2 D J z K OOO OOO e D L OOO OOO OOO O O b N OO Y 0 35 0 05 78 20 45 Solder ball J Post Reflow 20 50 0 05 12 02 1 40 0 10 Bottom Top October 2009 ELECTRONICS General Information DDR3 SDRAM 64 72 240pin DDR3 SDRAM Unbuffered DIMM Units Millimeters
11. R 222 e s T 1000 Y Y J 0 35 0 05 96 0 45 Solder ball 0 95 S Post Reflow 20 50 0 05 lt gt MOLDING AREA 4 10 0 10 02 1 90 BOTTOM VIEW TOP VIEW ELECTRONICS October 2009 General Information DDR3 SDRAM 78Ball for 1Gb D die x4 i 10 50 0 10 cm x 0 80 x 8 5 40 5 A1 INDEX MARK Datum A 0 80 1 60 4 00 HAT 10 50 0 10 q 987654321 B O00 d 4 2 B OOO OOO C OOO OOO Datum B D OOO OOO e el o OOO OOO 3 eis 6 gt 0 Oo eo s a H OOO 2 b K L OOO OOO D M O o b SEE 299 z 0 35 0 05 82 0 45 Solder ball Es w Post Reflow 20 50 0 05 2 0 2 1 40 0 10 Bottom Top 78Ball DDP for 1Gb E die 4 8 la 9 00 0 10 RE x 0 80 x 8 6 40 UI A1 INDEX MARK Datum 0 80 1 60 3 20 e 1 9 00 0 10 q 987654321 N ood G
12. 36 2Gb B die 26 72 16GB F 4Rx4 8 4 30mm M393B2K70CM0 CF7 F8 gu x4 36 5 2Gb C die October 2009 ELECTRONICS General Information DDR3 SDRAM 4 6 240Pin DDR3 Registered DIMM 1 35V Product 240Pin DDR3 Registered DIMM mh Comp Internal Org Density Part Number Speed Raw Card Composition Version Banks Rank PKG Height Note M393B2873EH1 YF8 H9 128M x8 9pcs 1Gb E die 78 ball 128Mx 72 1GB A 1Rx8 8 1 FBGA 30mm Now M393B2873FH0 YF8 H9 128M x8 9pcs 1Gb F die M393B5673EH1 YF8 H9 128M x8 18pcs 1Gb E die B 2Rx8 8 2 M393B5673FH0 YF8 H9 128M x8 18pcs 1Gb F die 256Mx 72 2GB M393B5670EH1 YF8 H9 256M x4 18 1Gb E die 30mm Now C 1Rx4 M393B5670FH0 YF8 H9 256M x4 18 1Gb F die 8 1 M393B5773CHO0 YF8 H9 A 1Rx8 512M x4 9pcs 2Gb M393B5173EH1 YFT F8 128M x8 36pcs 1Gb E die 48 8 8 4 9 517 YFT F8 128M x8 36pcs 1Gb F die M393B5170EH1 YF8 H9 256M x4 1Gb E die E 2Rx4 8 2 M393B5170FH0 YF8 H9 256M x4 36pcs 1Gb F die 78 ball 512Mx 72 4GB FBGA 30mm Now M393B5273BH1 YF8 H9 256M x8 18pcs 2Gb B die B 2Rx8 8 2 M393B5273CH0 YF8 H9 256M x8 18pcs 2Gb C die M393B5270BH1 YF8 H9 512M x4 18pcs 2Gb B die C 1Rx4 8 1 M393B5
13. 8 18pcs 1Gb F die FBGA 256Mx72 2GB M392B5670DZ1 CF8 H9 256M 4 18 1Gb D die 8 18 75 Now M392B5670EH1 CF8 H9 M RX4 556M x4 18pcs 1Gb E die 1 78 ball M392B5670FHO0 CF8 H9 256M x4 18pcs 1Gb F die FBGA M392B5773CHO CF8 H9 18 8 128M x8 9pcs 1Gb F die 1 DDP M392B5170DJ1 CF8 H9 X4 18 1Gb D die Now M392B5170EM1 CF8 H9 N 2Rx4 x4 18pcs 1Gb E die 2 DDP M392B5170FMO CF8 H9 X4 18 166 F die 09 512 72 4GB 8 78 M392B5173FM0 CF7 F8 V 4Rx8 256 X8 18pcs 1Gb F die 4 FBGA M392B5273BH1 CF8 H9 256M x8 18 2Gb B die L 2Rx8 2 M392B5273CH0 CF8 H9 256M x8 18pcs 266 C die ow M392B5270BH1 CF8 H9 512M x4 18pcs 2Gb B die M 1Rx4 1 M392B5270CH0 CF8 H9 512M x4 18pcs 2Gb C die M392B1K73BM1 x8 18 266 B die V 4Rx8 4 M392B1K73CMO CF7 F8 18 266 C die 16 72 8GB 8 ur 18 75 Now M392B1K70BM1 CF8 H9 pr x4 18pcs 2Gb B die N 2Rx4 2 M392B1K70CMO CF8 H9 DDE x4 18pcs 2Gb C die October 2009 ELECTRONICS General Information DDR3 SDRAM 4 8 240Pin DDR3 VLP Registered DIMM 1 35V Product 240Pin DDR3 VLP Registered DIMM ha Comp Internal
14. 78 4 ball M393B5673DZ1 CF8 H9 128M x8 18 1Gb D die 2 EBGA M393B5673EH1 CF8 H9 B 2Rx8 4128M x8 18pcs 1Gb E die 78 ball M393B5673FH0 CF8 H9 128M x8 18pcs 1Gb F die FBGA 256 72 208 8 M393B5670DZ1 CF8 H9 256M x4 18pcs 166 D die 1 T M393B5670EH1 CF8 H9 556M x4 18pcs 1Gb 78 ball M393B5670FH0 CF8 H9 256M x4 18pcs 1Gb F die FBGA M393B5173DZ1 128M x8 36pcs 1Gb 4 i M393B5173EH1 H 4RX8 128M xg 36 1Gb E die E 78 M393B5173FH0 128M x8 36 1Gb F die FBGA M393B5170DZ1 CF8 H9 256M x4 36pcs 1Gb D die 2 iue 512 72 4GB M393B5170EH1 CF8 H9 E 2Rx4 256M x4 36pcs 1Gb E die 8 Now M393B5170FH0 CF8 H9 256M x4 36pcs 1Gb F die M393B5273BH1 CF8 H9 e 256M x8 18pcs 2Gb B die A 78 ball X M393B5273CH0 CF8 H9 256M 8 18 5 266 C die FBGA M393B5270BH1 CF8 H9 512M x4 18pcs 2Gb B die C 1Rx4 1 M393B5270CHO CF8 H9 512M x4 18pcs 2Gb C die M393B1G70DJ1 36pcs 1Gb D die F 4Rx4 4 M393B1G70EM1 M x4 36pcs 1Gb E die 78 ball 16 72 8GB w393B1K73BH1 7 8 256M x8 36pcs 266 B die 8 FBGA 30mm Now X M393B1K73CHO 256M x8 36pcs 266 M393B1K70BH1 CF8 H9 512M x4 36pcs 2Gb B die E 2Rx4 2 M393B1K70CHO CF8 H9 512M x4 36pcs 2Gb C die M393B2K70BM1 x4
15. 270CH0 YF8 H9 512M x4 18pcs 2Gb C die M393B1G70EM1 YF7 F8 36pcs 1Gb Now F 4Rx4 8 4 M393B1G70FM0 YF7 F8 iM x4 36pcs 1Gb F die Nov 09 78 ball 1 72 8GB M393B1K73BH1 YFT F8 H 4Rx8 256M x8 2Gb B die 3 FBGA 30mm X M393B1K73CHO YFT F8 256M x8 2Gb C die ow M393B1K70BH1 YF8 H9 512M x4 36pcs 2Gb B die E 2Rx4 8 2 M393B1K70CH0 YF8 H9 512M x4 36pcs 2Gb C die M393B2K70BM1 x4 36pcs 2Gb B die Now 2Gx 72 16GB F 4Rx4 8 4 E 30mm M393B2K70CMO x4 36pcs 26b C die Nov 09 Note 1 35V product is 1 5V operatable October 2009 ELECTRONICS General Information DDR3 SDRAM 4 7 240Pin DDR3 VLP Registered DIMM 1 5V Product 240Pin DDR3 VLP Registered DIMM Internal Org Density Part Number Speed Raw Card Composition Vorsion Banks Rank PKG Height Avail Note M392B2873DZ1 CF8 H9 128M x8 9pcs 1Gb D die sss 128 72 1GB M392B2873EH1 CF8 H9 128M x8 9pcs 1Gb 1 Japa S Now M392B2873FH0 CF8 H9 128 x8 9pcs 1Gb F die FBGA M392B5673DZ1 CF8 H9 128M x8 18 1Gb D die L 2Rx8 M392B5673EH1 CF8 H9 128M x8 18 1Gb E die 78 ball M392B5673FH0 CF8 H9 128M
16. 391B5273BH1 YF8 H9 256M x8 18 2Gb B die 78 ball 512Mx 72 468 E 2Rx8 8 2 FBGA 30mm Now M391B5273CHO YF8 H9 256M x8 18pcs 2Gb C die Note 1 35V product is 1 5V operatable October 2009 ELECTRONICS General Information DDR3 SDRAM 4 3 204Pin DDR3 SoDIMM 1 5V Product 204Pin DDR3 SODIMM f T Comp Internal 5 Org Density Part Number Speed Raw Card Composition Version Banks Rank PKG Height Avail Note 96 4 ball M471B2874DZ1 CF8 H9 A 2Rx16 64M x 16 8 1Gb D die 8 2 FBGA 78 ball M471B2873EH1 CF8 H9 B 1Rx8 128M x8 8pcs 1Gb 8 1 128 64 1GB FBGA Now M471B2874EH1 CF8 H9 A 2Rx16 64M x 16 8 1Gb E die 8 2 96 ball M471B2873FHS CF8 H9 B 1Rx8 64M x 16 8pcs 1Gb F die 8 1 Eds M471B5673DZ1 CF8 H9 128M x8 16 1Gb D die 256 64 2GB M471B5673EH1 9 F 2Rx8 128M x8 16 1Gb E de 8 2 ibl xu M471B5673FH0 CF8 H9 128M x8 16 pcs 1Gb F die A M471B5773CHS CF8 H9 B 1Rx8 256M x8 8pcs 2Gb C die 8 1 M471B5273BH1 CF8 H9 256M x8 16 pcs 2Gb B die 78 ball 512 64 4GB F 2Rx8 8 2 Now M471B5273CH0 CF8 H9 256M x8 16 266 C die 4 4 204Pin DDR3 SoDIMM 1 35V Product 204Pin DDR3 SODIMM
17. 673DZ1 CF8 H9 128M x8 16 pcs 1Gb D die E B 2Rx8 8 2 256 64 2 78 567 1 CF8 H9 KO 2Rx8 128M x8 16 1Gb E die 30mm M378B5673FHO CF8 H9 KO 128M x8 16 1Gb F die M378B5773CHS CF8 H9 KO 1 8 256M x8 8pcs 2Gb C die 8 1 M391B5673DZ1 CF8 H9 128M x8 18 1Gb D die domin E 2Rx8 2 256Mx72 M394B5673EH1 CF8 H9 KO 2Rx8 128M x8 18pcs 1Gb E die 8 30mm M391B5673FHO CF8 H9 KO 128M x8 18 1Gb F die M391B5773CHO CF8 H9 KO 18 8 256M x8 9pcs 2Gb C die 1 M378B5273BH1 CF8 H9 256M x8 16 pcs 2Gb B die 78 ball 512 64 4GB B 2Rx8 8 2 FBGA 0 Now M378B5273CHO CF8 H9 KO 256M x8 16 2Gb C die M391B5273BH1 CF8 H9 256M x8 18 2Gb B die 78 ball 512Mx 72 4GB E 2Rx8 8 2 FBGA 30mm Now M391B5273CHO CF8 H9 K0 256M x8 18pcs 2Gb C die 4 2 240Pin DDR3 Unbuffered DIMM 1 35V Product 240Pin DDR3 Unbuffered DIMM Org Density Part Number Speed Raw Card Composition Rank PKG Height Avail Note M391B2873EH1 YF8 H9 128M x8 9pcs 1Gb E die 78 ball 128 72 1GB D 1Rx8 8 1 Fega 30mm Now M391B2873FH0 YF8 H9 128M x8 9pcs 1Gb M391B5673EH1 YF8 H9 128M x8 18 1Gb E die E 2Rx8 8 2 78 ball 256 72 2GB M391B5673FHO0 YF8 H9 128M x8 18 1Gb F die FBGA 0 Now M391B5773CHO YF8 H9 18 8 256M x8 9pcs 2Gb C die 8 1 M
18. DP 2Gb E die 8Banks 1 5V Now 260846 MC L F7 F8 H9 256M 8 FBGA K4B4G0446B MC L F7 F8 H9 18 x4 78 ball DDP 4Gb B die 8Banks 1 5V EBG Now K4B2G0846B MC L F7 F8 H9 512M x 8 Note 1 35V product is 1 5V operatable October 2009 ELECTRONICS General Information DDR3 SDRAM 3 DDR3 SDRAM Module Ordering Information 4 5 6 7 8 9 10 11 12 Memory Module DIMM Type Data bits Speed DRAM Component Type Temp amp Power Depth PCB Revision of Banks in Comp amp Interface Package Bit Organization Component Revision 1 Memory Module M 8 Component Revision M 1 amp A 2ndGen B 3rd Gen C 4th Gen 2 DIMM D 5th Gen E 6th Gen 3 DIMM F 7th Gen G 8th Gen SODIMM 9 2 FBGA Lead free 3 Data Bits FBGA Lead free amp Halogen free J FBGA Lead free DDP 71 x64 204pin Unbuffered SODIMM 78 x64 240pin Unbuffered DIMM M FBGA Lead free amp Halogen free DDP 91 x72 240pin ECC unbuffered DIMM 92 x72 240pin VLP Registered DIMM 93 x72 240pin Registered DIMM 4 DRAM Component Type B DDR3 SDRAM 1 5V VDD 5 Depth 32 32M 33 32M for 128Mb 512Mb 64 64M 65 64M for 128Mb 512Mb 28 128M 29 128M for 128Mb 512Mb 56 256M 57 256M for 512Mb 2Gb 51 512M 52 512M for 512Mb 2Gb 1G 16 1K 1G for 2Gb 2G 2G 2 2 for 266 6 of Banks amp Interface 7 8Banks amp SST
19. GA for 2Gb B die x4 x8 s 9 00 0 10 TE 5 1 INDEX MARK 5 0 80 1 60 3 20 lt 4 gt 1 9 00 0 10 0 987654321 B N 1 A OOd i B Datum D 8 lg zl 5 3 ss 5 6 p H OOO 8 OOO K OOO 39 i M OOO D Q Y 0 35 0 05 78 20 45 Solder ball 0 95 i6 m MOLDING AREA Post Reflow 20 50 0 05 h 1 10 0 10 12 0 2 A B 1 90 BOTTOM VIEW TOP VIEW 96Ball FBGA for 2Gb B die x16 9 00 0 10 5 1 INDEX MARK d 0 80 1 60 320 _ M 9 00 0 10 987654321 006 i Datum L D ooo ooo L DatumB E OOO i F OO ooo e ooo ooo 3 a e z HN r _ _ ooo 0o00 8 f K 5 L OOO OOO i M L N lg h P
20. General Information DDR3 SDRAM DDR3 SDRAM Product Guide October 2009 Memory Division October 2009 ELECTRONICS General Information DDR3 SDRAM 1 DDR3 SDRAM Component Ordering Information 2 3 4 5 6 7 8 11 SAMSUNG Memory Speed DRAM Temp amp Power DRAM Type Package Type Density Revision Bit Organization Interface Internal Banks 1 SAMSUNG Memory 7 Interface VDD VDDQ 6 SSTL 1 5V 1 5V 2 DRAM 4 8 Revision 1 3 2 Gen B DDR3 SDRAM B 3rd Gen C 4th Gen D 5th Gen 4 Density E 6th Gen 51 512Mb sm Gen G 8th Gen 1G 1Gb 26 2Gb 46 406 9 8 Z Lead free 9 Bit Organization H FBGA Halogen free amp Lead free 04 x4 J FBGA Lead free DDP 08 x8 M FBGA Halogen free amp Lead free DDP 16 16 10 Temp amp Power Commercial Temp 0 C 85 amp Normal Power L Commercial Temp 0 C 85 amp Low Power Y Commercial Temp 0 C 85 C amp Low VDD 1 35V 6 of Internal Banks 3 4 Banks 4 8 Banks 11 Speed 5 16 Banks F7 DDR3 800 400MHz CL 6 tRCD 6 tRP 6 F8 DDR3 1066 533MHz CL 7 tRCD 7 tRP 7 H9 DDR3 1333 667MHz CL 9 tRCD 9 tRP 9 K0 DDR3 1600 800MHz CL 11 tRCD 11 tRP 11 October 2009 E
21. L 1 5V T Bit Organization 0 x4 3 8 4 x16 ELECTRONICS 10 PCB Revision 0 None 1 1st Rev 2 2nd Rev 3 3rd Rev 4 4th Rev S Reduced Layer 11 Temp amp Power C Commercial Temp 0 C 85 amp Normal Power Y Commercial Temp 0 C 85 8 Low VDD 1 35V 12 Speed F7 DDR3 800 400MHz CL 6 tRCD 6 tRP 6 F8 DDR3 1066 533MHz 7 tRCD 7 tRP 7 H9 DDR3 1333 667MHz CL 9 9 tRP 9 DDR3 1600 800MHz 1 11 tRCD 11 tRP 11 Note PC3 6400 DDR3 800 PC3 8500 DDR3 1066 PC3 10600 DDR3 1333 PC3 12800 DDR3 1600 October 2009 General Information DDR3 SDRAM 4 DDR3 SDRAM Module Product Guide 4 1 240Pin DDR3 Unbuffered DIMM 1 5V Product 240Pin DDR3 Unbuffered DIMM Org Density Part Number Speed Raw Card Composition LE mema Rank PKG Height Avail Note M378B2873DZ1 CF8 H9 128M x8 8pcs 1Gb D die EA 128Mx64 1GB M378B2873EH1 cre Ho ko 8 428M 8pcs 166 E de 1 CHEAP Now M378B2873FHS CF8 H9 128M x8 8pcs 1Gb F die FBGA M391B2873DZ1 CF8 H9 128M x8 1Gb D die ieu 128Mx72 1GB lw39182873EH1 cre Ho ko 428M 9pcs 166 E de 1 sap UMEN M391B2873FHO CF8 H9 KO 128M x8 9pcs 1Gb F die FBGA M378B5
22. LECTRONICS General Information DDR3 SDRAM 2 DDR3 SDRAM Component Product Guide G Package amp Power Dens Banks Part Number Org VDD Voltage PKG Avail Note ity i Temp C L amp Speed g K4B1G0446D HC L F7 F8 H9 256M x 4 78 4 ball FBGA banks K4B1G0846D HC L F7 F8 H9 128M x 8 Now K4B1G1646D HC L F7 F8 H9 64 x 16 PRA K4B1G0446E HC L F7 F8 H9 K0 256M 4 78 ball 4 1 0846 HC L F7 F8 H9 K0 128M x 8 FBGA 1Gb E die 8Banks K4B1G1646E HC L F7 F8 H9 KO 64M x 16 E Now K4B1G0446E HYFT F8 H9 KO 256M x 4 VM 78 ball 4 1 0846 HYF7 F8 H9 K0 128M x 8 FBGA K4B1G0446F HC L F8 H9 256M 4 A K4B1G0846F HC L F8 H9 128M x 8 78 1Gb F die 8Banks FBGA Now K4B1G0446F HY L F8 H9 256 x 4 K4B1G0846F HY L F8 H9 128M x 8 K4B2G0446B HC L F7 F8 H9 512M x 4 78 ball KA4B2G0846B HC L F7 F8 H9 256M x 8 159 FBGA 2Gb B die 8Banks K4B2G1646B HC L F7 F8 H9 128M x 16 REA Now K4B2G0446B HYFT F8 H9 512M x 4 78 ball KA4B2G0846B HYFT F8 H9 256M x 8 FBGA K4B2G0446C HC L F8 H9 512M x 4 m K4B2G0846C HC L F8 H9 256M x 8 78 2Gb C die 8Banks Now K4B2G0446C HY L F8 H9 512M x4 FBGA 1 85V K4B2G0846C HY L F8 H9 256M x 8 K4B2G0446D MC L F7 F8 H9 512M x 4 78 ball DDP 2Gb D die 8Banks 1 5V Now KA4B2G0846D MC L F7 F8 H9 256M x 8 FBGA K4B2G0446E MC L F7 F8 H9 512M x 4 78 ball D
23. n Org Density Part Number Speed Raw Card Composition Version Banks Rank PKG Height Avail Note M392B2873EH1 YF8 H9 128M x8 9pcs 1Gb E die 28 bali 128 72 1GB K 1Rx8 8 1 1875mm Now M392B2873FHO YF8 H9 128M x8 9pcs 1Gb M392B5673EH1 YF8 H9 128M x8 18pcs 1Gb E die L 2Rx8 8 2 M392B5673FHO YF8 H9 128M x8 18pcs 1Gb 256 72 2GB M392B5670EH1 YF8 H9 256M x4 18 1Gb E die 78 ball 18 75mm M 1Rx4 M392B5670FHO YF8 H9 256M x4 18pcs 1Gb F die 8 1 M392B5773CH0 YF8 H9 512M x4 9pcs 2Gb C die M392B5170EM1 YF8 H9 209 x4 18 166 8 2 Now M392B5173FMO V 4Rx8 256M x8 18 1Gb F die 8 4 5 M392B5170FMO YF8 HO NQRx4 512M x4 18 1Gb 512 72 4GB 78 ball 15 75 reo 256 x8 18 26b E die 8 2 18 X M392B5273CHO YF8 H9 256M x8 18 206 C die 1 ow M392B5270BH1 YF8 H9 512M x4 18 2Gb B die M 1Rx4 8 1 M392B5270CHO YF8 H9 512M 4 18 206 C die M392B1K73BM1 YF7 F8 Pi x8 18 2Gb B die Now V 4Rx8 8 4 M392B1K73CMO YF7 F8 DDF 18 2Gb C die Nov 09 16 72 8GB 78 ball 48 75mm M392B1K70BM4 YF8 H9 BRE x4 18 2Gb B die Now N 2Rx4 8 2 M392B1K70CMO YF8 H9 DDE 18 266 09
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