Thermaltake CL-P0486
Contents
1. Intel LGA1366 Server Thermaltake he 1 SPECIFICATION P N CL P0486 Dimension 990 0 90 0 iH a Base Material Copper ss i i sSCisdS Application for Intel LGA1366 2U Server Weight J4909 eee Thermal Resistance At 30 CFM 0 188 C W Type of Fixing Thermal Interface Dow corning TC 5026 aterial FEATURES Aluminum fin embedded with two heat pipes and copper base Back plate amp spring screw mounting method ensure safe installation when shipping O High density aluminum thin fin more surface area gives good heat dissipation Heat pipe technology provides excellent thermal conduction CL PO456 Performance Curve 7 Psi_ca dP 4 Top View Pressure Drop ineh H O a 5 10 15 YW Side View Spring Screw DIMENSION j 5 i T ji P a E WLLL MUIN Ti il i Ni i SM mme o a nit mm www thermaltake com REVISION A 2008 05
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