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Transcend MMCmobile 256MB

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1. S Power Supply I Input O Output PP Push Pull OD Open Drain NC Not Connected Transcend Information Inc l TS256MRMMC4 256MB MMCmobile MultiMediaCard Architecture interface controller Power on detection reset i Memory core interface reset Memory Core Transcend Information Inc 2 TS256MRMMC4 256MB MMCmobile Temperature Characteristics Parameter Min Max Unit Operating temperature 25 85 C Storage temperature 40 85 C Junction temperature 95 Electrical Characteristics Absolute Maximum Ratings Parameter Symbol Rating Unit Power Supply Voltage Vec 0 6 4 6 V Input Voltage Vin 0 6 4 6 V Input Output Voltage Vio 0 6 4 6 V Recommended Operation Conditions Parameter Symbol Min Typ Max Unit Power Supply Voltage High Voltage Range VoppH 2 7 3 3 3 6 V Power Supply Voltage Low Voltage Range VppL 1 65 1 8 1 95 V Transcend Information Inc TS256MRMMC4 DC Characteristics High Voltage Power Supply 256MB MMCmobile Ta 25 C to 85 C VppHz2 V t03 6V Parameter Symbol Min Typ Max Unit Condition Output Low Voltage OD Vopot 0 3 V lo 2mMA Output High Voltage PP Von 0 75 Vppu V lon 100UA Output Low Voltage PP VoL 0 125 VopH V lo 100UA Input High Voltage
2. TS256MRMMC4 256MB MMCmobile Description Features TS256MRMMC4 is a 256MB MMCmobile memory card Its a fastest low power highly integration memory card TS256MRMMC4 is designed to Storage Capacity 256MB Support Dual Operating Voltage 2 7 3 6V 1 65 1 95V Support clock frequencies 0 52MHz provide an inexpensive mechanically robust storage Support different Bus width x1 x4 x8 Operating Temperature 25 C 85 C Storage Temperature 40 C 85 C medium in card form for multimedia consumer applications and mobile devices handheld PCs digital cameras MP3 players etc to store copy e Data access mode Byte mode and move data at high speed transfer rate Data Transfer Rate Maximum Read 11MB sec Write 10MB sec Placement Fully compatible with MultiMediaCard system specification version 4 0 and backwards compatibility with previous specification Transcend bal sls e Form Factor 18mm x 24mm x 1 4mm MB e Endurance 1 000 000 Program Erase cycles e MTBF 1 000 000 hours Front Pin Definition MMC Mode SPI Mode Pin No Description Name Data cs Chipseleci Command Response DI 3 vss s Ground VSS 4 wp s Powersuppiy VDD 5 cK ft Clock sctk Cok Ground vSS2 Data DO Data Not used Dara oP Data Not used Cd DAT4 VOPP Data Not used oo DATS VO PP Data Not used oo DAT6 VOPP Data Not used Data Not used sd
3. hum 500h Salt Water Spray 3 NaCl 35C 24h acc MIL STD Method 1009 ESD protection Contact Pads 4kV Human body model according to ANSI EOS ESD S5 1 1998 Non Contact Pads area 8kV coupling plane discharge 15kV air discharge Human body model according to IEC61000 4 2 Durability 10 000 mating cycles test procedure t b d Bending t b d Torgue t b d Drop test 1 5m free fall UV light exposure UV 200nm 15Ws cm according to ISO 7816 1 Visual inspection Shape and form No warp page no mold skin complete form no cavities surface smoothness sigma 0 1 mm cm within contour no cracks no pollution fat oil dust etc Above technical information is based on MMC4 0 standard specification and tested to be reliable However Transcend makes no warranty either expressed or implied as to its accuracy and assumes no liability in connection with the use of this product Transcend reserves the right to make changes in specifications at any time without prior notice Transcend Information Inc 1
4. Vin 0 625 VppH Vpn 0 3 V Input Low Voltage Vit 0 3 0 25 Vppu V Operating Current loc 20 TBD mA lycce OMA Stand by Current sg 400 TBD uA Input Leakage Current lu 10 10 UA Vin 0 to Vppu Output Leakage Current lLo 10 10 uA Vout 0 to Vppu Pin Capacitance Cp 7 pF Power Output Voltage Ve 1 50 1 8 1 95 V k lt 240mA e Low Voltage Power Supply Ta 25 C to 85 C Vpp_ 1 65V to 1 95V Parameter Symbol Min Typ Max Unit Condition Output High Voltage Vou Vpop 0 2 V low 100UA Output Low Voltage VoL 0 2 V lo 100UA Input High Voltage Vin 0 7 Vppi VppL 0 3 V Input Low Voltage Vit 0 3 0 3 Vppi V Operating Current loc 20 TBD mA lvecr OMA Stand by Current Isp 400 TBD uA Input Leakage Current lu 10 10 uA Vin 0 to Vppi Output Leakage Current lLo 10 10 uA Voyr 0 to Vppi Pin Capacitance Cp 7 pF Transcend Information Inc TS256M RMMC4 256MB MMCmobile AC Characteristics e High Speed Card Interface Timing Ta 25 C to 85 C Vppy 2 7V to3 6V Parameter Symbol Min Max Unit Notes Clock Frequency Data Transfer Mode fpp 26 52 MHz Clock Frequency Identification Mode fop 0 400 KHz Clock Low Time tw 6 5 ns Clock Rise Time TLH 3 ns Clock Fall Time TAL 3 ns Input Set up Time tisu 3 ns Input Hold Time tin 3 ns Output Delay Time toy 5 14 ns C lt 30pF Signal Rise Time trise 3 ns C lt 30pF Signal Fall Time tral 3 n
5. h twp2 45 ns Cr lt 80pF WE High Hold Time tw 105 ns C lt 80pF Data Setup Time tps2 90 ns C lt 80pF Data Hold Time tpH2 30 ns C lt 80pF CLE Transcend Information Inc 8 TS256MRMMC4 256MB MMCmobile Parameter Symbol Min Unit Remark CLE Hold Time tcLE3 285 ns C lt 80pF CE Hold Time tcH3 195 ns C lt 80pF ALE Setup Time tALS3 90 ns Cr lt 80pF Write Cycle Time twc3 60 ns _ C1 lt 80pF WE Pulse Width twp3 4S ns _ C_ lt 80pF WE High Hold Time twm 15 ns C lt 80pF Data Setup Time tps3 30 ns _ C lt 80pF Data Hold Time DE3 30 ns C lt z80pF Transcend Information Inc TS256MRMMC4 256MB MMCmobile e Serial Access Cycle after Read Symbol Transcend Information Inc 10 Parameter Min Unit Remark CE Access Time tcpas 285 ns C lt 80pF Read Cycle Time RCA 60 ns Cr lt 80pF RE Pulse Width RPA 45 ns C lt 80pF RE High Hold Time REHA 15 ns C lt 80pF Data Setup Time tpsa TBD ns C lt 80pF Data Hold Time topa TBD ns C lt 80pF Ready to RE Low RRA 285 ns C lt 80pF TS256M RMMCA 256MB MMCmobile Reliability and Durability Temperature Operation 25 C 85 C Storage 40 C 168h 85 C 500h Junction temperature max 95 C Moisture and corrosion Operation 25 C 95 rel humidity Stress 40 C 93 rel
6. s C lt 30pF Bee re tiote GarctirterterceFirrt Transcend Information Inc 5 TS256MRMMC4 256MB MMCmobile Ta 25 C to 85 C VppH 2 7V to3 6V Parameter Symbol Min Max Unit Notes Clock Frequency Data Transfer Mode fpp 0 20 MHz Clock Frequency Identification Mode fop 0 400 KHz Clock Low Time tw 10 ns Clock Rise Time troy 10 ns Clock Fall Time TAL 10 ns Input Set up Time tisu ns Input Hold Time tin ns Output Delay Time toLy 9 7 35 ns C lt 30pF A a YY 1 7 a 7 Transcend Information Inc TS256MRMMC4 256MB MMCmobile Parameter Symbol Min Unit Notes CLE Setup Time tcLs 30 ns C lt 80pF CLE Hold Time tcLH1 15 ns C lt 80pF CE Setup Time tcs 40 ns C lt 80pF CE Hold Time tCHI 90 ns Cr lt 80pF ALE Setup Time taLsi 90 ns C lt 80pF ALE Hold Time tALHI 75 ns C lt 80pF WE Pulse Width tw 45 ns C lt 80pF Data Setup Time tps1 90 ns C lt 80pF Data Hold Time DHI 30 ns C lt 80pF CLE e Address Latch Cycle Transcend Information Inc TS256M RMMC4 256MB MMCmobile Parameter Symbol Min Unit Remark CLE Setup Time tcLs2 90 ns C lt 80pF CE Setup Time tcs2 195 ns C lt 80pF ALE Setup Time tats 30 ns C lt 80pF ALE Hold Time ALM 15 ns C lt 80pF Write Cycle Time twc2 150 ns C lt 80pF WE Pulse Widt

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