HP Intel Xeon W3550
Contents
1. 2X 0 640 03 LORE DDI Thermal Mechanical Design Guide ntel Mechanical Drawings Figure B 10 Reference Fastener Sheet 4 of 4 068867 011237044 Taw MOILANEN ECEAT 030108 NQIIOSTNI 3115914 7482 200 0682621 401 5810 34 SN 50843 130 01048 01 SLINA 134 WOES 43111219 30 WORS LIMA LAINI 53881911 3199 535508 814 3011236 1413001 903 8011909419402 WOL OL 1 141038 51431681 21100 OMY 281199 212504 814 NOIL NOLAN 04 unb 6 8129 433213 01 104 HOIVNGIN IMI 281 1814 01 ESMI SHUM 12 45 381483810 553181 5 t 56323 3179 0 NIA UT WHINE 20138 04 0 OL 03108 14 31138 80 4 DATOS 0 WAT 180302 9 2 801 198 8 8 1 19 0 1309300 1 29 1 412 LII ini TAOS Lard 180438 Go 183138 1 11111 NOISIATE 1504 1100 soom n EL HN 1500739 41 30815514434 LOM HIYA SGM X 61 Thermal Mechanical Design Guide Mechanical Drawings intel F2. kak nemen 48 A Component Suppliers ted aa ea Deen band 49 B Mechanical Drawings 51 Socket Mechanical 5 65 D Processor Installation Tool 71 Figures 1 1 Processor Thermal Solution amp LGA1366 Socket Stack 7 2 1 LGA1366 Socket with Pick and Place Cover Removed 11 2 2 LGA1366 Socket Contact Numbering Top View of Socket 12 2 3 LGA1366 Socket Land Pattern Top View of Board 13 2 4 Attachment to Motherboard aka kk aa kala arka ad kk a kara aa ese sn 14 2 5 Pick and Place E A A xa 15 2 6 Package Installation Removal Features 16 2 7 EGAT366 NCTF Solde r Joints t hme nsan X Reik EC na kwa Doe reas 18 3 1 ILM Cover Assembly ce evs bees vies RERO P eee i vet Kec 20 3 2 1EM ASSeImbly x xasa Sira n nanan ey a en Reka nite nated dn eens RUE Yad 2
3. TAMBIENT DTS pr esc E 43 2 0 190 N A 0 190 N A 42 0 0 206 N A 0 199 N A 41 0 0 219 N A 0 207 N A 40 0 0 232 3250 0 215 N A 39 0 0 245 2600 0 222 3500 38 0 0 258 2200 0 230 3150 37 0 0 271 1900 0 238 2400 36 0 0 284 1700 0 245 2500 35 0 0 297 1450 0 253 2500 34 0 0 310 1300 0 261 2100 33 0 0 323 1200 0 268 1900 32 0 0 336 1100 0 276 1700 31 0 0 349 1000 0 284 1650 30 0 0 362 900 0 292 1550 29 0 0 375 850 0 299 1450 28 0 0 388 800 0 307 1350 27 0 0 401 700 0 315 1250 26 0 0 414 700 0 322 1200 25 0 0 427 650 0 330 1100 24 0 0 440 600 0 338 1050 23 0 0 453 600 0 345 1000 22 0 0 466 600 0 353 950 21 0 0 479 600 0 361 900 20 0 0 492 600 0 368 900 19 0 0 505 600 0 376 850 18 0 0 519 600 0 384 800 Notes 1 The ambient temperature is measured at the inlet to the processor thermal solution 2 This column can be expressed as a function of by the following equation 0 19 43 2 0 013 3 This column be expressed as a function of by the following equation 0 19 43 2 TAMBIENT 0 0077 4 This table is provided as a reference please consult the product specification for current values 5 Based on the testing performed a curve was fit to the data in the form Psi 1 a RPM b c RPM where a 0 000762 b 0 667637 c 004402 Thermal Mechanical Design Guide 37 38 Sensor Based Thermal
4. heel ben nen Vane s 17 2 00 17 2 7 Component Insertion 5 17 2 8 Socket Sil Z sa E A wana W k T ra E 17 2 9 LGA1366 Socket NCTF Solder 1 18 3 Independent Loading Mechanism 19 3 4 DESIGN Concept ln terere dies DIE DA Ma 19 3 1 1 ILM Cover Assembly Design Overview 19 3 1 2 ILM Back Plate Design 20 3 2 Assembly of ILM to a 20 4 LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications 23 41 Component MaS ariin arnei eni dieses ka OR ka ER RR GO RO Rn X CRDI KD NEUE ORARE ER 23 4 2 Package Socket Stackup Height 23 4 3 Socket Maximum 1 6 23 4 4 Loading certe rr rette eek Mia a R na Ra E KB a A AD AWAR nak ka E h an RR Mara 24 4 5 Electrical
5. 2 4 6 6 n ra ka Danana 24 4 6 Environmental Requirements 1 ee ak yaka kak kk kaka ke 25 5 Sensor Based Thermal Specification Design 27 5 1 Sensor Based Specification Overview 27 5 2 Sensor Based Thermal Specification sss nne 28 5 2 L Thermal Profil is WA aT bi wae 28 5 2 2 Specification When DTS value is Greater than TCONTROL 29 5 3 Thermal Solution 55 Riza Aa nan k para R AA RA RA WA W 30 5 3 1 Boundary Condition Definition sss 30 5 3 2 Thermal Design and 31 5 3 3 Thermal Solution Validation sss mmm 32 5 4 Fan Speed Control FSC Design Process 33 5 4 1 Fan Speed Control Algorithm without TAMBIENT Data 34 5 4 2 Speed Control Algorithm with TAMBIENT 35 5 5 System Validation cerei rera eter Wel n oos Pe Pe e ea be ba s EHE 36 5 6 Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL 37 6 ATX Reference Thermal 5
6. LNOHLIM YO 035010514 LON AVN SLNALNOO SLI 39N3GIJNOO NI 035010519 SI NOLLVINHOJNI TVILN3OIJNOO 09 TALNI SNIVLNOO 9NIMVMHO SIHL FOISH VO 892080 NA A z e 9 1 8 Thermal Mechanical Design Guide 52 intel Socket Heatsink 11 Keepout Zone Secondary Side Bottom v D 5 9 1 8 Pepe enan ayas koro 0071744 ve aas 91183991100 NOISSIN 0077 1HOI3H LN3NOdWOO WW 752 1 0 IN3NOdWOO 1 0 LN3NOdWOO QN3931 gl 2 8 8 8 TALNI ____ ORMLAIWMIOA 55 4 81 34905 2 1 i 05 2 Lu gt 0025 1 f 00 08 owl 000 2 0096 m j 3 1 f i T 1 05 2 4 j 0096 x 02 5 133005 0906 09 06 91 fae 2
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8. Input Output Hub a component of the chipset that provides I O connections to PCle drives and other peripherals LGA1366 socket The processor mates with the system board through this surface mount 1366 contact socket The Platform Environment Control Interface PECI is a one wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices Case to ambient thermal characterization parameter psi A measure of thermal solution performance using total package power Defined as Total Package Power Heat source should always be specified for measurements Yes Case to sink thermal characterization parameter A measure of thermal interface material performance using total package power Defined as Tease Ts Total Package Power Ysa Sink to ambient thermal characterization parameter A measure of heatsink thermal performance using total package power Defined as Ts Total Package Power TcASE The case temperature of the TTV measured at the geometric center of the topside of the IHS TCASE MAX The maximum case temperature as specified in a component specification TCC Thermal Control Circuit Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and or operating frequency and input voltage adjustment when the die temperature is very near its operating li
9. Mechanical Drawings ntel Reference Fastener Sheet 1 of 4 Figure B 7 35V8 H3N31SV INRA iw ko era 30 1390 OR 11 143 10 OII 29 6007316171 5 rem 1 16 13 002 o Thermal Mechanical Design Guide 58 Mechanical Drawings Figure B 8 Reference Fastener Sheet 2 of 4 1 840 05 1 41 4 91 0 f CLARA 0017 2k 4 4944 85 intel 1 SECTION 11340031 3 44 1 OETAIL 8 SCALE Thermal Mechanical Design Guide Figure B 9 Reference Fastener Sheet 3 of 4 60 intel Mechanical Drawings 1 1491 42 110821 9 2X 0 TIED 03 1113140011 2X 3 3240 05 0551 2 0 8140 03 9 U 03244411 DATE 0011 RI 26 03 D30 DDI SECTION E E SECTION 2X 0 7140 03 1 0284 0011 po 48 SECTION 6 6 ajeje L 2024 4431 2X 5 1440 1 2 54 0 05 1002 0011
10. 39 6 1 Operating Environment Waw bAn EA MER ERE B 39 6 2 Heatsink Thermal Solution 1 1 kk keke 40 6 3 Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design 41 6 4 Reference Design lt eee kak eene 42 Thermal and Mechanical Design Guide 3 intel 6 4 1 42 opa EGIT 43 6 4 3 ETT 44 6 5 Mechanical Interface to the Reference Attach Mechanism 44 6 6 Heatsink Mass and Center of Gravity 1 46 6 7 Thermal Interface 0 00 0 1 sese e kk 46 6 8 Absolute Processor 46 7 Thermal Solution Quality and Reliability Requirements 47 7 1 Reference Heatsink Thermal Verification mme 47 7 2 Mechanical Environmental lt cece kak kk kk emen 47 7 2 1 Recommended Test Sequence 47 7 2 2 Post test Pass 48 7 2 3 Recommended BIOS Processor Memory Test Procedures 48 7 3 Material and Recycling
11. 00 06 N 06 26 2 IN3NOdWOO 46 1 Lee ot 1982 0092 1 j 1 WW Z N 2 IN3NOdWOO XV WW 522 j 9 s ava No j 2 LN3NOdWOO 01 01 334400 0 0 90 0 96 9 0 A SINOY ON 0090 j he IN3NOdWOO 0 ff J Z 0 sklis 292529554 00010 ji 1A A A ovo 2 0008 H31N30 134005 01 3ALLV T3 j 1 QN3931 170 NOLLV9O1 i H 814 00 96 0 0 j 3 HLAN doo 08 Xv j 0081 00 82 00 08 ka v9 6z wez 8276 00 01 2686 4 Y 000 s 000 1 2189 109 XZ 901v 9969 XZ 1 88885 58558 55 0090 88889 8 9 ss 9 H31N3O 13005 01 3ALLv 13H yd NOLLISOd 170 000i 0 0 isioAs L 60 62 20 213100 CENO HLAN goo 20990 XY 0009 7481 OL INOZ WW8 G3S V3HONI 1 LN3NOdWOO i 00 09 608 0 WN 9 294 INOZ WIZZ SdVO SHSNLSV4 31015 AYVWNIYd H 303 H 80 52 70 A38 3Sv3r38 NOILVHOdMOO TALNI 40 1495 9
12. s 16 Noo 22 5 7 11 CORR rmm eem 0 9 8 QOQQOQOQOOOD QOCCOCOCQ OOOOOO OOOOO OOOQOOOOOOOOOO 7 QQQQOQOQQQQQOQQQQOQQOQQOQOQQOQQOQQQOQQOQOQQOQOQOOQQOQ 6 00000000000000000000000000000000000 00 5 5526226260525062 062605252502 ROO RR 88588888 4 5 3 100010600 lecce eei G J L R U W AG AL AN AR AU AW B D H MP T V Y AB AD AF AT AV AY Thermal Mechanical Design Guide intel NEW Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls There are no additional external methods that is screw extra solder adhesive and so on to attach the socket As indicated in Figure 2 4 the Independent Loading Mechanism ILM is not present during the attach reflow process Figure 2 4 Attachment to Motherboard 2 3 2 3 1 2 3 2 14 LGA 1366 Socket Socket Components The socket has two main components the socket body and Pick and Place PnP cover and is delivered as a single integral assembly Refer to Appendix C for detailed drawings Socket Body Housing The housing material is
13. 1 1 1 1 2 2 8 G30NNOYD NON NO x 5 JOV4UNS 814402 60 0 6070 66 50 31008 ON 00790 Yr SATOH 82d 395 01 PET ZN 6 L 55 Thermal Mechanical Design Guide n n tel Mechanical Drawings Figure B 5 Reference Design Heatsink Assembiy 1 of 2 x 5 ui 2 we OS 58 8 19 2 u mc EF 5 5 3 E 2 5 5 4 24 42 S Fey s lt gt ui 3 gt a 58 2 PM o 5 a 2 a i 2 tev amp m 0O22 2 a aor reining Ed 2 lt 56 Thermal Mechanical Design Guide Mechanical Drawings Figure B 6 Reference Design Heatsink Assembly 2 of 2 095135 FOR DEPTH ASSEMBLY INSTALLATION PROCESS RECOMMENDATIONS SECTION A A pesas CA PST PTT Thermal Mechanical Design Guide 57
14. 1 Socket Mechanical Drawing Sheet 1 of 4 66 2 Socket Mechanical Drawing Sheet 2 4 4 4 4 4 4 44444 4 11 67 3 Socket Mechanical Drawing Sheet 3 4 7 1414 444 68 4 Socket Mechanical Drawing Sheet 4 4 1 4 0 0 0 7 44 1 1 1 1 14 69 1 Processor Installation Tool h ar a 72 les 1 Reference cece kk Ime esate kk kaka kaka kaka kaka aka kaka kaka aka ka kaka kaka kaka kak kk aka 8 2 Termsand Descriptions a disala sikan h k la ka dab a SA 8 1 Socket Component Mass nya d nin baban se pense c Bela na Lock 23 2 1366 land Package LGA1366 Socket Stackup 23 3 Socket and ILM Mechanical 5 24 4 Electrical Requirements for LGA1366 5 25 1 Thermal Solution Performance above 4 0 0 0 0 2 2 6 37 1 Processor Thermal Solution Requirements amp Boundary 39 1
15. 5 0724 iic 86 11 E 00 67 1 00 11 RAM uk _ L g 02741 006 1 he amp 1 41 aoe 4 j 1 b N 007698 J j E o 3 827873 2 su Ph 00789 dis PN Wc 027590 5 06 16 A 5 9 ALIAVO 9 1 ONISNOH 138905 9 05 27 TE 9 1 1876 e he 1 4015 Y3N31 01 32 45 NOILOW 43431 395 401 S H 28718 H oi 80 62 70 2 148 35 3118 011200084 ic REEI AUGISH NOISIAM n 972280 2 c 9 8 Figure B 3 Thermal Mechanical Design Guide 54 intel Mechanical Drawings Socket Processor 11 Keepout Zone Secondary Side Bottom Figure B 4 2 302 1328 3195 10N 00 TU n 154 Im 430 305 WOLL 08 000 1995 V vlad 03H21V ND 3437 Mg 992290 o 4125 313342 134208 01 3 11 138 10111504 3nul IWIGVY 0170 011 201 000 31435 00796 01789 1004334 LN3NOdNOD 593224 839814 i 009706 2 r 00070 02719 08701 008706 60 00
16. ALSWd LN3NOdMWOO GIHNISINOO 1 1 12097 804 3SVaHONI OL 434409 9 d SNOISNAWIG 13005 WII O3 OL 8 XLV 8 134905 996 VOT E m 3003 GSNOISNAWIGNN AHL3AWAS 3WnSSV t MONS SNOISHNOXG 553097 55300 ATEWASSY SANTAN 326 IN3A3OV Id SIONVMOTIY 131014315 38 OL 90 9080 ONV THOT S SNOSNONO SU 22011 1NO d33y LNINOdWOD 6 433 LN3NOdWOO QVO semen ONISNOH 135005 OVW 40 2 A SHSLSWITTIW NI SNOISNSIIG T ramos agr NOLLISOd 531 OW 9133205 401 8 s NS x Xx A o Sob N 555 55 288 r 0088 L 1HOI3H LN3NOdWOO WW 92 lt lt XZ 0 87 9 9 1 IN3NOdWOO WW 22 XE 1669 xz 1 000 Z a lt 0 1 1 ONILNOY 1048 77 1 0696
17. Mechanical Drawing List Drawing Description Figure Number Socket Heatsink ILM Keepout Zone Primary Side Top Figure B 1 Socket Heatsink ILM Keepout Zone Secondary Side Bottom Figure B 2 Socket Processor ILM Keepout Zone Primary Side Top Figure B 3 Socket Processor ILM Keepout Zone Secondary Side Bottom Figure B 4 Reference Design Heatsink Assembly 1 of 2 Figure B 5 Reference Design Heatsink Assembly 2 of 2 Figure B 6 Reference Fastener Sheet 1 of 4 Figure B 7 Reference Fastener Sheet 2 of 4 Figure B 8 Reference Fastener Sheet 3 of 4 Figure B 9 Reference Fastener Sheet 4 of 4 Figure B 10 Reference Clip Sheet 1 of 2 Figure B 11 Reference Clip Sheet 2 of 2 Figure B 12 Thermal Mechanical Design Guide 51 Mechanical Drawings intel Socket Heatsink ILM Keepout Zone Primary Side Top Figure B 1 2 v 8 9 1 8 50 EI min ONIGNTONI
18. 0061 OA x h 0222 00 08 7 ONILNOY NOIL VHOdMOO JO LNISNOO 1 035010514 38 LON 51431300 SLI NI 0350710514 SI NOLLVWHOSNI TVILLN3GIJNOO TALNI SNIVLNOO SIHL v0 e ome A z 5 9 1 8 Mechanical Drawings Figure B 2 53 Thermal Mechanical Design Guide Mechanical Drawings intel 2 Y S 9 L 8 J awas 0G 000 1 2 51108 349 53109 115 372280 ss 82d 38838081 Ol 03404 32841808 834402 GIGNNOYD NON 8 v imer anis NGPA SAIS q l NOILIGNOD 011 0719 82711 NOISNJRIO 324383438 Nidaa 40553904 WI 3 TUY 51 31 14 0901 8 312 01 319NV 340 WAWINIW L 8 144905 996 91 NI d33 LNINOdNOD 3015401 QuVOGH3HLON 9 mu dM o 55322 9 3 LN3NO
19. A E J L U W AA AC AE AG AJ AL AN AR AU AW B P T V Y AD AF AK AT AV AY 000 43 82O II eee eee oe eee eee OS SS E 000000000000000000000000000000000000 00 39 38 47 e ee cele e ee e eie e ee ele e mi ZAN 32 660660000 30 36 51 11 an 000000 000 i 27 99900000399 a 22 21 0 19 20 eee eee eee ER 18 19 17 s 16 7000000000000 15 HERDIN 14 922122100010 12 21111020100006 9 8 000000000000000000000000000000000000000 7 000000000000000000 000020000000000000000 00 6 5 4 66000000000000000 000000 OOOO 0000000000006 3 SEER ROO ORR RISO Es J L R U AA AC AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 18 Ther
20. PROCHOT signal from the processor TCC activation in functional application testing is unlikely with a compliant thermal solution Some very high power applications might activate TCC for short intervals this is normal e Verify fan speed response is within expectations actual RPM is consistent with DTS temperature and Verify RPM vs PWM command or voltage output from the FSC device is within expectations Perform sensitivity analysis to asses impact on processor thermal solution performance and acoustics for the following Other fans in the system Other thermal loads in the system In the same system under test run real applications that are representative of the expected end user usage model and verify the following TCC activation is not occurring Verify fan speed response vs expectations as done using Power Thermal Utility SW Validate system boundary condition assumptions Trise venting locations other thermal loads and adjust models design as required Thermal Mechanical Design Guide Sensor Based Thermal Specification Design Guidance intel 5 6 Specification for Operation Where Digital Thermal Sensor Exceeds Table 5 1 is provided as reference for the development of thermal solutions and the fan speed control algorithm Table 5 1 Thermal Solution Performance above TcowrRoL
21. Specification Design Guidance Thermal Mechanical Design Guide ATX Reference Thermal Solution n tel 6 Note 6 1 Table 6 1 ATX Reference Thermal Solution The reference thermal mechanical solution information shown in this document represents the current state of the data and may be subject to modification The information represents design targets not commitments by Intel The design strategy is to use the design concepts from the prior Intel Radial Curved Bifurcated Fin Heatsink Reference Design Intel RCBFH Reference Design designed originally for the Intel Pentium 4 processors This chapter describes the overall requirements for the ATX heatsink reference thermal solution including critical to function dimensions operating environment and validation criteria Operating Environment Table 6 1 provides the target heatsink performance for the ATX heatsink reference thermal solution supporting the processor at several system and ambient conditions The exhaust air flow from the processor thermal solution is the inlet air flow to the reference thermal solution and other components such as the voltage regulator This airstream is assumed to be approaching the heatsink at a 30 angle from the processor thermal solution see the Intel X58 Express Chipset Thermal and Mechanical Design Guide for more details Table 6 1 summarizes the boundary conditions for designing and evaluating the proce
22. TIY SAOWSY P Dai 96801 H j 1asdao 2 80 22 6 10 anoun 3e AUGISH 0 281560 2 6 9 1 8 Thermal Mechanical Design Guide 62 2 v y S 9 1 8 Z 133HSJNIMVG 31905 LON 1 3nvos 281960 x nn intel Teer Tez ge t 99 9 0c 11495 E 5 IVOIdAL y 0L JIVOS 1 1 ZA 860071 4 1 8 500 520 Y ZZA RRE 5 WOIdAL 610 9 0 7 OL AWOS v 48 3NOZ 133HS NO NOISN3WIG IHL 01 5 4400 LNIOd SIHL alv eA i 8 lt alv leool vo c7 NOILO3S Lev 910 9 4 XZ 9704 NS 5 9 1 8 Figure B 12 Reference Clip Sheet 2 of 2 Mechanical Drawings 63 Thermal Mechanical Design Guide 64 Mechanical Drawings Thermal Mechanical Design Guide Socket Mechanical Drawings intel C Socket Mechanical Drawings Table C 1 lists the mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sh
23. maximum design point the fan speed control system FSC will over cool the processor The FSC has no feedback mechanism to detect this over cooling This is shown in the top half of Figure 5 1 The sensor based specification will allow the FSC to be operated at the maximum allowable silicon temperature for the measured ambient This will provide optimal acoustics for operation above See lower half of Figure 5 1 Thermal Mechanical Design Guide 27 n tel Sensor Based Thermal Specification Design Guidance Figure 5 1 Comparison of Case Temperature vs Sensor Based Specification 30 2 0292 1 1 1 1 Tcontrol Power TDP Current Specification Case Temp 0 292 1 1 li 8 Tcontrol Ta 30C Power TDP Sensor Based Specification DTS Temp 5 2 Sensor Based Thermal Specification The sensor based thermal specification consists of two parts The first is a thermal profile that defines the maximum TTV Tease as a function of power dissipation The thermal profile defines the boundary conditions for validation of the thermal solution The second part is a defined thermal solution performance as a function of the DTS value as reported over the bus when DTS is greater than This defines the operational limits for the processor using the TTV
24. thermoplastic or equivalent with UL 94 V 0 flame rating capable of withstanding 260 C for 40 seconds typical reflow rework The socket coefficient of thermal expansion in the XY plane and creep properties must be such that the integrity of the socket is maintained for the conditions listed in Chapter 7 The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems Solder Balls A total of 1366 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard The socket has the following solder ball material Lead free SAC SnAgCu solder alloy with a silver Ag content between 3 and 4 a melting temperature of approximately 217 C The alloy must be compatible with immersion silver ImAg motherboard surface finish and a SAC alloy solder paste The co planarity profile and true position requirements are defined in Appendix C Thermal Mechanical Design Guide 2 3 3 Contacts Base material for the contacts is high strength copper alloy For the area on socket contacts where processor lands will mate there is a 0 381 um 15 pinches minimum gold plating over 1 27 um 50 winches minimum nickel underplate No contamination by solder in the contact area is allowed during solder reflow 2 3 4 Pick and Place Cover The cover provides a planar surface for vacuum pick up used to place components i
25. your distributor to obtain the latest specifications and before placing your product order Intel the Intel logo Intel Pentium Core and Core Inside are trademarks of Intel Corporation in the U S and other countries Other brands and names may be claimed as the property of others Copyright 2009 Intel Corporation 2 Thermal and Mechanical Design Guide Contents 1 ____ _ ____ SEA 7 1 1 Referencesu kayan tava ben n densi 8 1 2 8 2 1366 Socket pe eee ta 11 21 B ard NEUEM 13 2 2 Attachment to Motherboard kak 14 2 3 Socket Components saa ss aca te h 14 2 3 1 Socket Body HOUSING sx ERROR wai aA Wa Man b ra Wn 14 2 32 5 ay Mu Ro or Xaka kak wr kr nan kak n a RE PE 14 23 3 GOhESOLS be aad K de bed 15 2 3 4 Pick and Place COVE lis ien n b h n dan kan 15 2 4 Package Installation Removal 4 1 5 2 2 2 6 6 kk nns 16 2 4 1 Socket Standoffs and Package Seating 16 2 5
26. 0 380 0 330 0 280 CAV 0 230 0 180 DTS Tcontrol DTS 1 Thermal Solution Design Process Thermal solution design guidance for this specification is the same as with previous products The initial design must take into account the target market and overall product requirements for the system This can be broken down into several steps Boundary condition definition Thermal design modelling Thermal testing Boundary Condition Definition Using the knowledge of the system boundary conditions e g inlet air temperature acoustic requirements cost design for manufacturing package and socket mechanical specifications and chassis environmental test limits the designer can make informed thermal solution design decisions The thermal boundary conditions for an ATX tower system are as follows TgxrERNAL 35 C This is typical of a maximum system operating environment e Trise 4 C This is typical of a chassis compliant to CAG 1 1 39 TRISE Based on the system boundary conditions the designer can select a and ca to use in thermal modelling The assumption of has a significant impact on the required needed to meet Tcasemax at A system that can deliver lower assumed Tawpient utilize a design with higher which have a lower cost Figure 5 4 s
27. 1 4 2 Table 4 2 4 3 LGA1366 Socket and I LM Electrical Mechanical and Environmental Specifications This chapter describes the electrical mechanical and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism Component Mass Socket Component Mass Component Mass Socket Body Contacts and PnP Cover 15g ILM Cover 43g ILM Back Plate 51g Package Socket Stackup Height Table 4 2 provides the stackup height of a processor in the 1366 land LGA package and LGA1366 socket with the ILM closed and the processor fully seated in the socket 1366 land Package and LGA1366 Socket Stackup Height Integrated Stackup Height mm From Top of Board to Top of IHS feo mM Notes 1 This data is provided for information only and should be derived from the height of the socket seating plane above the motherboard after reflow given in Appendix C b the height of the package from the package seating plane to the top of the IHS and accounting for its nominal variation and tolerances that are given in the corresponding processor datasheet 2 This value is a RSS calculation Socket Maximum Temperature The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance To ensure socket long term reliability Intel defines socket maximum temperature using a via on the underside of the motherboard Exce
28. 1 3 3 Pin and TEM k V k t n na ege Geta da OE GA h nea 22 4 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology 26 5 1 Comparison of Case Temperature vs Sensor Based 28 5 2 Thermal Profile 3ya c hlnl ka Eae PR RE 29 5 3 Thermal solution 1 ka kk 30 5 4 Required for various TAMBI ENT 5 kk kk kya 31 5 5 Thermal Solution Performance vs Fan 33 5 6 Fan Response Without TAMBIENT Da t amp KK K kk kk kk kk meses eene 34 5 7 Fan Response with TAMBI ENT Aware 5 35 6 1 ATX Heatsink Reference Design enne 40 6 2 ATX KOZ 3 D Model Primary Top 1 6 41 6 3 5 Extrusion 42 E HEBES 43 6 5 COM 44 6 6 Clip Core and Extrusion 45 6 7 Critical Parameters for Interface to
29. 10 mm Height places Maximum Component Height 4 places 2 50 mm Maximum Component Height 5 places 1 80 mm Maximum Component Height 1 20 mm Maximum Component Height The maximum height of the reference thermal solution above the motherboard is 71 12 mm 2 8 inches and is compliant with the motherboard primary side height constraints defined in the ATX Specification and the microATX Motherboard Interface Specification found at http www formfactors org The reference solution requires a chassis obstruction height of at least 81 28 mm 3 2 inches measured from the top of the motherboard This allows for appropriate fan inlet airflow to ensure fan performance and therefore overall cooling solution performance This is compliant with the recommendations found in both ATX Specification and microATX Motherboard Interface Specification documents Thermal Mechanical Design Guide 41 n tel ATX Reference Thermal Solution 6 4 Reference Design Components 6 4 1 Extrusion The aluminum extrusion is a 51 fin 102 mm diameter bifurcated fin design The overall height of the extrusion is 38 mm tall To facilitate reuse of the core design the center cylinder ID and wall thickness are the same as RCFH4 Figure 6 3 RCBF5 Extrusion 42 Thermal Mechanical Design Guide n ATX Reference Thermal Solution n tel 6 4 2 Clip Structural design strategy for the clip is to pr
30. Core 2 Duo processors The design uses a copper core with an aluminum extrusion It attaches to the motherboard with a fastener design reused from the RCBFH3 and RCFH4 The clip design is new to span the larger size of the LGA1366 The thermal solution assembly requires no assembly prior to installation on a motherboard Figure 6 1 shows the reference thermal solution assembly in an exploded view The first step in assembling the thermal solution is to verify the fasteners are aligned to the mounting holes on the motherboard The fasteners are pressed firmly to lock the thermal solution to the motherboard Figure 6 1 ATX Heatsink Reference Design Assembly er Wire Guard AT Impeller NA Motor Assy Extrusion Fastener Base 40 Thermal Mechanical Design Guide n ATX Reference Thermal Solution n te 6 3 Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design Figure 6 2 shows a 3 D representation of the board component keep out for the reference ATX thermal solution A fully dimensioned drawing of the keepout information is available at Figure B 1 and Figure B 2 in Appendix B A DXF version of these drawings is available as well as the 3 D model of the board level keep out zone is available Contact your field sales representative for these documents Figure 6 2 ATX KOZ 3 D Model Primary Top Side Socket ILM Keep In Zone 27 0 Maximum Component 10
31. Intel Xeon Processor 3500 Series Thermal Mechanical Design Guide March 2009 Document Number 321461 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical life saving or life sustaining applications Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Intel Xeon Processor 3500 Series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or
32. OE 6 L 6 Il Gl Lt 6l IZ amp 62 7 X2 4 19 gt sg c 12 Thermal Mechanical Design Guide LGA1366 Socket 2 1 Figure 2 3 Board Layout The land pattern for the LGA1366 socket is 40 mils X 40 mils X by Y and the pad size is 18 mils Note that there is no round off conversion error between socket pitch 1 016 mm and board pitch 40 mil as these values are equivalent LGA1366 Socket Land Pattern Top View of Board C E J R U W AA AC AE AG AJ AL AN AR AU AW BA QU n 02012201 gu 2222 M OOQOOOQOO0OQ0O0O0O00O00O0000000 39 12106120200 60 38 0000000000000000000000000000000000000 0 35 QQQOQQOQOQQOQQOOQQQOQOQOQQQOQOQQQQOQQOQQQOQOOQQOQ 34 0000000000 33 32 3i 9 OOOOOOO000000 27 8 26 27 24 3 OOOO000000 22 z 2 OOOO0O0000000 QOOOOO0O000000 19 20 QOOOOOO000000 18 19 QOOOOOO0O00000 17
33. TS value will be driven by the workload on the processor and the thermal solution will be required to respond to this much more rapidly than the changes in An additional consideration in establishing the fan speed curves is to account for the thermal interface material performance degradation over time Thermal Mechanical Design Guide 33 n tel Sensor Based Thermal Specification Design Guidance 5 4 1 Figure 5 6 34 Fan Speed Control Algorithm without Tamsi enr Data system that does not provide the FSC algorithm with the information the designer must make the following assumption e When the DTS value is greater than the is at boundary condition derived in Section 5 3 1 This is consistent with our previous FSC guidance to accelerate the fan to full speed when the DTS value is greater than AS will be shown below the DTS thermal specification at DTS TcoNTROL Can reduce some of the over cooling of the processor and provide an acoustic noise reduction from the processor thermal solution In this example the following assumptions are made 39 C Thermal Solution designed validated to a 39 C environment e TcontRoL 20 Reference processor thermal solution RCFH5 Below the fan speed is slowed down as in prior products For a processor specification based on Tease thermal profi
34. Use Conditions Board 47 1 Reference Heatsink Enabled Components sse nemen ens 49 2 LGA1366 Socket ILM 2 49 Supplier Contact Informatlon cicius ementi b ka v LEY EATER Lr da ne 49 1 Mechanical Drawing List rh temet et eR Ed eU EE Rx PR RE RA 51 1 Mechanical Drawing Uist orien emu ir eere ec Le erre aor pe Hanan oe Lex o ac be weed E 65 Thermal and Mechanical Design Guide 5 intel Revision History Revision Description Revision Date Number 001 e Initial release March 2009 Thermal and Mechanical Design Guide intel l Introduction This document provides guidelines for the design of thermal and mechanical solutions for the Intel Xeon Processor 3500 Series Unless specifically required for clarity this document will use processor in place of the specific product names The components described in this document include The processor thermal solution heatsink and associated retention hardware The LGA1366 socket and the Independent Loading Mechanism ILM and back plate Figure 1 1 Processor Thermal Solution amp LGA1366 Socket Stack The goals of this document are To assist board and system thermal mechanical designers To assist designers and suppli
35. a should be taken over the operating range of the fan Using the RCHF5 as the example the fan is operational from 600 to 3500 RPM The data was collected at several points and a curve was fit to the data see Figure 5 5 Taking data at 6 evenly distributed fan speeds over the operating range should provide enough data to establish a 3 variable equation By using the equation from the curve fitting a complete set of required fan speeds as a function of be developed The results from the reference thermal solution characterization are provided in Table 5 1 The fan speed control device may modulate the thermal solution fan speed RPM by one of two methods a pulse width modulation PWM signal or varying the voltage to the fan As a result the characterization data needs to also correlate the RPM to PWM or voltage to the thermal solution fan The fan speed algorithm developer needs to associate the output command from the fan speed control device with the required thermal solution performance as stated in Table 5 1 Regardless of which control method is used the term RPM will be used to indicate required fan speed in the rest of this document When selecting a thermal solution from a thermal vendor the characterization data should be requested directly from them as a part of their thermal solution collateral Thermal Mechanical Design Guide Sensor Based Thermal Specification Design Guidance Figure 5 5 Thermal Solution Performance vs Fan Sp
36. ared to a nominally ambient aware thermal solution equipped with a thermistor An example of these thermal solutions are the RCFH5 or the boxed processor thermal solutions This over cooling translates into acoustic margin that can be used in the overall system acoustic budget In this example the following assumptions are made e TAMBIENT 35 C Thermal Solution designed validated to a 39 C environment 20 e FSC device has access to Tawpient Reference processor thermal solution RCFH5 Below the fan speed is slowed down as in prior products For a processor specification based on a thermal profile when the DTS value is equal to or greater than the fan speed is accelerated to maximum fan speed for the Tampient as controlled by the thermistor in thermal solution For the RCFH5 this would be about 2500 RPM at 35 C This is graphically displayed as the dashed line in Figure 5 7 This is an improvement over the ambient unaware system but is not fully optimized for acoustic benefit The DTS thermal specification required and therefore the fan speed in this scenario is 1450 RPM This is less than thermistor controlled speed of 2500 RPM even if the assumption is a 35 C This is graphically displayed in Figure 5 7 The shaded area displayed in Figure 5 7 is where DTS values are less than 1 For simplicity the graph shows a l
37. dHOD ON S Mose oat isha E CoN e MEE ino coz QW iw us JWNTOA 301581 OL 153 TVHS 584340134320 139008 SNIOBYH 32NYUV312 1811 siuvd HLIM 3W 10A NI 4334 133208 40 3015100 381 01 1534 TIWHS 5834013130 IEEE Tava oran 1N3NOdNOO TWOINVHOIW 1WAUSHL S32NYH3101 3215 03 SIONVMOTIV ONY 2141 3 10 805532084 9137205 WII 78 DIS 401 TWNIWON 133205 SSVdWOON3 38010 NI d139 119305 8 QVO1 WTI OL ING S3ONVHD 3dYHS 011231430 ONY q 532 83101 1VNOISN3HIQ 39VWOYd 042 ANY 13208 S3SSYdNOON3 11 10111804 00 039201 134205 JHL NI A18W3SSY 042 ONY one 10111804 139205 30 11811 5385118 163 189138 18211831 380101 NI d333 139205 G3HOLV INA 83431 6841 4339 LNINOdNOD 08 08 804 N3AIO 328383438 WNLYG SNOITV 30 2 4 42 804 ALIAVD ONISNOH 134205 30 YILNI 218134039 032N383138 SINVId 831132 139205 1 395 1108 _ 0672 Y Y 1011238 SALON 2 00717 2 3 5 00 19 AL 4 y 001 A gt E 1 0876 88330181 82d dil BO Aa ema a j g 98671 1 10445 NOILOR 227 9NIN3d0 31914 0901 j j g 2 j P G 4 8871 A 9 no REW New E j 2 3 md 117130 33 1
38. eding the temperature guidance may result in socket body deformation or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure The guidance for socket maximum temperature is listed below Via temperature under socket 96 C Thermal Mechanical Design Guide 23 Table 4 3 4 5 24 n tel LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications Loading Specifications The socket will be tested against the conditions listed in Chapter 7 with heatsink and the ILM attached under the loading conditions outlined in this chapter Table 4 3 provides load specifications for the LGA1366 socket with the installed The maximum limits should not be exceeded during heatsink assembly shipping conditions or standard use condition Exceeding these limits during test may result in component failure The socket body should not be used as a mechanical reference or load bearing surface for thermal solutions Socket and 11 Mechanical Specifications Parameter Min Max Notes Static compressive load from ILM cover to 470 N 106 Ibf 623 N 140 Ibf 3 4 7 processor IHS Heatsink Static Compressive Load 0 N 0 Ibf 266 N 60 Ibf 1 273 Total Static Compressive Load 470 N 106 Ibf 890 N 200 157 3 4 ILM plus Heatsink Dynamic Compressive Load N A 890 N 200 Ibf 1 3 5 6 with heatsink installed Pick and Place Cover Insertion Rem
39. eed Note 5 4 0 50 5 9 5 4 0 40 25 0 30 44 4 39 2 0 20 3 4 0 10 i 24 0 00 1 9 600 1100 1600 2100 2600 3100 3600 RPM Psi ca System This data is taken from the validation of the RCBF5 reference processor thermal solution The vs RPM data is available in Table 5 1 at the end of this chapter Fan Speed Control FSC Design Process The next step is to incorporate the thermal solution characterization data into the algorithms for the device controlling the fans As a reminder the requirements are e When the DTS value is at or below the fans can be slowed down just as with prior processors e When DTS is above FSC algorithms will use knowledge of and VS RPM to achieve the necessary level of cooling This chapter discusses two implementations The first is a FSC system that is not provided the Tawpient information and a FSC system that is provided data on the current Either method will result in a thermally compliant solution and some acoustic benefit by operating the processor closer to the thermal profile But only the TAMBIENT aware FSC system can fully use the specification for optimized acoustic performance the development of the FSC algorithm it should be noted that the is expected to change at significantly slower rate than the DTS value The D
40. eet 1 of 4 Figure C 1 Socket Mechanical Drawing Sheet 2 of 4 Figure C 2 Socket Mechanical Drawing Sheet 3 of 4 Figure C 3 Socket Mechanical Drawing Sheet 4 of 4 Figure C 4 Thermal Mechanical Design Guide 65 n tel Socket Mechanical Drawings Figure C 1 Socket Mechanical Drawing Sheet 1 of 4 V91 144905 996 66 Thermal Mechanical Design Guide Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4 Thermal Mechanical Design Guide 67 Figure C 3 Socket Mechanical Drawing Sheet 3 of 4 5 4 5 N 54 XN EN N _ 1 5 26 N T 5 4 aN ANI 2 5 oN 2 d i 4 4 211 4 all LS ell 68 Thermal Mechanical Design Guide Socket Mechanical Drawings n tel Figure C 4 Socket Mechanical Drawing Sheet 4 of 4 EL m NNN Thermal Mechanical Design Guide 69 70 Socket Mechanical Drawings Thermal Mechanical Design Guide Processor Installation Tool n tel D Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal Contact the supplier for availability Billy Hsieh billy hsieh tyco
41. electronics com 81 44 844 8292 Thermal Mechanical Design Guide 71 Processor Installation Tool REVISIONS G En 9 1 BESER TIS THE 1 5 15 1044492 Thermal Mechanical Design Guide PO7 FJ00560 10d A A 5 i PBX REM 8 08317 83 12 8 B ji 8 Ngg Kasay 5 2 8 SCREW M2 X 0 4 L 6 1 2 SCREW M2 0 4 1 6 6 KSSC CO MATERIAL SWP B 2 INITIAL LENGTH 9 7 COIL SPRING 5 OUTER DIAMETER 4 8 STIFNESS 11 9 N MM PO07 FJ00580 501 SHAFT 4 P07 FJ00560 401 HOOK 3 1 P07 FJ00560 301 HOLDER _ 2 P07 FJ00580 201 BODY 1 ay PART NO NO THIS DRAWING 15 A CONTROLLED DOCUMENT E Tas VET CHEE pem Tara T X 0 05 7 54 ETE ES TREAT TG E poor 2 00779 07 00560 100 CUSTOMER DRAWING TE cl TT 1471 8 SEDO Processor Installation Tool intel Figure D 1 72
42. emonstrate that the case temperature specification can be met OU 7 2 3 Recommended OS Processor Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses with the thermal mechanical enabling components assembled The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered Testing setup should include the following components properly assembled and or connected Appropriate system baseboard Processor and memory All enabling components including socket and thermal solution parts The pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors Intel PC Diags is an example of software that can be utilized for this test 7 3 Material and Recycling Requirements Material shall be resistant to fungal growth Examples of non resistant materials include cellulose materials animal and vegetable based adhesives grease oils and many hydrocarbons Synthetic materials such as PVC formulations certain polyurethane compositions e g polyester and some polyethers plastics which contain organic fillers of laminating materials paints and varnishes also are susceptible to fungal growth If materials are not fungal growth resistant then MIL STD 810E Method 508 4 must be performed to d
43. ers of processor heatsinks Thermal profiles and other processor specifications are provided in the appropriate processor Datasheet Thermal Mechanical Design Guide 7 Table 1 1 1 2 Table 1 2 Introduction References Material and concepts available in the following documents may be beneficial when reading this document Reference Documents Document Location Notes Intel Xeon Processor 3500 Series Processor Datasheet 321332 1 Volume 1 Intel Xeon Processor 3500 Series Processor Datasheet 321344 3 Volume 2 Intel Xeon Processor 3500 Series Processor Specification 321333 1 Update Notes 1 Available electronically Definition of Terms Terms and Descriptions Sheet 1 of 2 Term Description Bypass Bypass is the area between a passive heatsink and any object that can act to forma duct For this example it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature FSC Fan Speed Control IHS Integrated Heat Spreader a component of the processor package used to enhance the thermal performance of the package Component thermal solutions interface with the processor at the IHS surface ILM Independent Loading Mechanism provides the force needed to seat the 1366 LGA land package onto the socket contacts
44. et PCB to which it is attached All specifications are maximum values unless otherwise stated for a single socket contact but includes effects of adjacent contacts where indicated Thermal Mechanical Design Guide LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications Table 4 4 4 6 intel Electrical Requirements for LGA1366 Socket Parameter Mated loop inductance Loop Value 3 9nH Comment The inductance calculated for two contacts considering one forward conductor and one return conductor These values must be satisfied at the worst case height of the socket Mated partial mutual inductance L NA The inductance on a contact due to any single neighboring contact Maximum mutual capacitance C 1 pF The capacitance between two contacts Socket Average Contact Resistance EOL 15 2 The socket average contact resistance target is derived from average of every chain contact resistance for each part used in testing with a chain contact resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the daisy chain The specification listed is at room temperature and has to be satisfied at all time Socket Contact Resistance The resistance of the socket contact solderball and interface resistance to the interposer land Max Individual Contact Resistance EOL lt 100 mQ The specificatio
45. etermine material performance Material used shall not have deformation or degradation in a temperature life test Any plastic component exceeding 25 grams should be recyclable per the European Blue Angel recycling standards The following definitions apply to the use of the terms lead free Pb free and RoHS compliant Lead free and Pb free Lead has not been intentionally added but lead may still exist as an impurity below 1000 ppm RoHS compliant Lead and other materials banned in RoHS Directive are either 1 below all applicable substance thresholds as proposed by the EU or 2 an approved pending exemption applies Note RoHS implementation details are not fully defined and may change 8 48 Thermal Mechanical Design Guide Component Suppliers A Note Table A 1 Table A 2 Table A 3 intel Component Suppliers The part numbers listed below identifies the reference components End users are responsible for the verification of the Intel enabled component offerings with the supplier These vendors and devices are listed by Intel as a convenience to Intel s general customer base but Intel does not make any representations or warranties whatsoever regarding quality reliability functionality or compatibility of these devices Customers are responsible for thermal mechanical and environmental validation of these solutions This list and or these devices may be subject to change without notice Reference Hea
46. for proper assembly of the ILM around the socket A clearance hole is located at the center of the plate to allow access to test points and backside capacitors An insulator is pre applied Assembly of I LM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board In step 1 see Figure 3 2 the back plate is placed in a fixture Holes in the motherboard provide alignment to the threaded studs In step 2 the ILM cover assembly is placed over the socket and threaded studs Using T20 Torx driver fasten the ILM cover assembly to the back plate with the four captive fasteners Torque to 8 2 inch pounds The length of the threaded studs accommodate board thicknesses from 0 062 to 0 100 Thermal Mechanical Design Guide Independent Loading Mechanism ILM Figure 3 2 ILM Assembly Socket Body Reflowed on board Step 1 Socket Body with Back Plate on board Step 2 Thermal Mechanical Design Guide 21 22 n n tel Independent Loading Mechanism ILM Figure 3 3 As indicated in Figure 3 3 socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to the socket The result is a specific Pin 1 orientation with respect to the ILM lever Pin1 and ILM Lever Thermal Mechanical Design Guide m LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications n tel 4 4 1 Table 4
47. has two corresponding orientation posts to physically prevent mis orientation of the package These orientation features also provide initial rough alignment of package to socket The socket has alignment walls at the four corners to provide final alignment of the package See Appendix D for information regarding a tool designed to provide mechanical assistance during processor installation and removal Package Installation Removal Features v 4 orientation gt notch Pin1 triangle alignment walls access X orientation post 1 chamfer Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C Similarly a seating plane on the topside of the socket establishes the minimum package height See Section 4 2 for the calculated IHS height above the motherboard Thermal Mechanical Design Guide 2 5 Durability The socket must withstand 30 cycles of processor insertion and removal The max chain contact resistance from Table 4 4 must be met when mated in the 1st and 30th cycles The socket Pick and Place cover must withstand 15 cycles of insertion and removal 2 6 Markings There are three markings on the socket LGA1366 Font type is Helvetica Bold minimum 6 point 2 125 Manufacturer s insignia font size at supplier s discretion Lot identif
48. hows a number of satisfactory solutions for the processor Thermal Mechanical Design Guide Sensor Based Thermal Specification Design Guidance n te D Note Figure 5 4 Note 5 8 2 If the assumed is inappropriate for the intended system environment the thermal solution performance may not be sufficient to meet the product requirements The results may be excessive noise from fans having to operate at a speed higher than intended In the worst case this can lead to performance loss with excessive activation of the Thermal Control Circuit TCC Required for various Conditions 019 W ca 021 W ca 0 25 029 Ta 43 2C Ta 40C Ta 35C Ta 30C 80 T0 AT 30 20 10 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 TTV Power Dissipation If an ambient of greater than 43 2 C is necessary based on the boundary conditions a thermal solution with a c4 lower than 0 19 C W will be required Thermal Design and Modelling Based on the boundary conditions the designer can now make the design selection of the thermal solution components The major components that can be mixed are the fan fin geometry heat pipe or air cooled solid core design There are cost and acoustic trade offs the customer must make To aide in the design process Intel provides TTV thermal models Please consult you
49. ication code allows traceability of manufacturing date and location All markings must withstand 260 C for 40 seconds typical reflow rework profile without degrading and must be visible after the socket is mounted on the motherboard LGA1366 and the manufacturer s insignia are molded or laser marked on the side wall 2 7 Component Insertion Forces Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Table R2 7 Maximum Grip Forces The socket must be designed so that it requires no force to insert the package into the socket 2 8 Socket Size Socket information needed for motherboard design is given in Appendix C This information should be used in conjunction with the reference motherboard keep out drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components Thermal Mechanical Design Guide 17 2 9 LGA1366 Socket LGA1366 Socket NCTF Solder J oints Intel has defined selected solder joints of the socket as non critical to function NCTF for post environmental testing The processor signals at NCTF locations are typically redundant ground or non critical reserved so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality Figure 2 7 identifies the NCTF solder joints Figure 2 7 LGA1366 NCTF Solder J oints
50. igure B 11 Reference Clip Sheet 1 of 2 2 0 1 SALON 33ST 53104 33S 10 damen NOSRHOF d gt 4 20 91 80 9102 SH 93804 201900 TONY 11002 zer EUM 4 9 10SUEO _ 1428 avann ones PINN 07 vee 6118 29096 VO VLNYS VG PIA SV HEWL SONVONOOON 4 LI ik REN NI 09 bereya oi ON NORN AMY nma i 181181 4 Lava Jon weau uo 1 1331S 00 251 dol 200 620 cote 0q 440 OL WOYS 38 GINOHS S3ONVHSTOL AHVONOO3S 6 31512395 SV GAYINDIY ONINIOD NOISN3MWIQ SYYN SH3NHOO dHVHS 9 NOLLO3MIQ 3 NMOHS SNOISNAWIC TIV QHIn033 FLV 1d HSINI v SNOLLVH3dO AHVONOO3S 333 Svo 986 SSVI 0 163141 lt ecoa WLSV 5 3TISN3 NIN 155 006621 4 8 902 lt SNINGOW 5 NOLLO3 T3S TWIMALWW 1
51. inear acceleration of the fans from 10 to TcoNTROL as has been Intel s guidance for simple fan speed control algorithms As the processor workload continues to increase the DTS value will increase and the FSC algorithm will linearly increase the fan speed from the 1450 RPM at DTS 20 to 2250 RPM at DTS value 1 Figure 5 7 Fan Response with Aware FSC 3500 3000 2 5 2500 J n u u um mn u m mn u um u 2 2000 1500 4 n 5 1000 4 500 4 0 T 40 30 20 10 0 DTS Thermal Mechanical Design Guide 35 n tel Sensor Based Thermal Specification Design Guidance 5 5 36 System Validation System validation should focus on ensuring the fan speed control algorithm is responding appropriately to the DTS values and data as well as any other device being monitored for thermal compliance Since the processor thermal solution has already been validated using the TTV to the thermal specifications at the predicted additional TTV based testing in the chassis is not expected to be necessary Once the heatsink has been demonstrated to meet the TTV Thermal Profile it should be evaluated on a functional system at the boundary conditions In the system under test and Power Thermal Utility Software set to dissipate the TDP workload confirm the following item Verify if there is TCC activity by instrumenting the
52. le when the DTS value is equal to or greater than Tcontro_ the fan speed must be accelerated to full speed For the reference thermal solution full speed is 3500 RPM dashed line in Figure 5 6 The DTS thermal specification defines a required and therefore the fan speed is 2500 RPM This is much less than full speed even if the assumption is a TamBIENT 39 C solid line in Figure 5 6 The shaded area displayed in Figure 5 6 is where DTS values are less than Tconrno For simplicity the graph shows a linear acceleration of the fans from 10 to as has been Intel s guidance for simple fan speed control algorithms As the processor workload continues to increase the DTS value will increase and the FSC algorithm will linearly increase the fan speed from the 2500 RPM at DTS 20 to full speed at DTS value 1 Fan Response Without Data 3500 3000 5 2500 2000 1500 1000 500 Fan RPM Required 40 30 20 10 0 Thermal Mechanical Design Guide m Sensor Based Thermal Specification Design Guidance n te D 5 4 2 Fan Speed Control Algorithm with Data In a system where the FSC algorithm has access to the Tampient information and is capable of using the data the benefits of the DTS thermal specification become more striking As will be demonstrated below there is still over cooling of the processor even when comp
53. le of values at DTS TcoNTROL and DTS 1 as a function of inlet to heatsink Between these two defined points a linear interpolation can be done for any DTS value reported by the processor A copy of the specification is provided as a reference in Table 5 1 of Section 5 6 The fan speed control algorithm has enough information using only the DTS value and TAMBIENT to command the thermal solution to provide just enough cooling to keep the part on the thermal profile As an example the data in Table 5 1 has been plotted in Figure 5 3 to show the required at 25 30 35 and 39 C The lower the ambient the higher the required which means lower fan speeds and reduced acoustics from the processor thermal solution In the prior thermal specifications this region DTS values greater than Was defined by the processor thermal profile This required the user to estimate the processor power and case temperature Neither of these two data points are accessible in real time for the fan speed control system As a result the designer had to assume the worst case Tampient and drive the fans to accommodate that boundary condition Thermal Mechanical Design Guide 29 n tel Sensor Based Thermal Specification Design Guidance Figure 5 3 Thermal solution Performance 5 3 5 3 1 30 Ta 39 C 35 Ta 30 C Ta 25 C 0 430
54. leration factors A detailed description of this methodology can be found at ftp download intel com technology itj q32000 pdf reliability pdf 26 Thermal Mechanical Design Guide Sensor Based Thermal Specification Design Guidance 5 5 1 Sensor Based Thermal Specification Design Guidance The introduction of the sensor based thermal specification presents opportunities for the system designer to optimize the acoustics and simplify thermal validation The sensor based specification utilizes the Digital Thermal Sensor information accessed using the PECI interface This chapter will review thermal solution design options fan speed control design guidance amp implementation options and suggestions on validation both with the TTV and the live die in a shipping system Sensor Based Specification Overview Create a thermal specification that meets the following requirements Use Digital Thermal Sensor DTS for real time thermal specification compliance Single point of reference for thermal specification compliance over all operating conditions Does not required measuring processor power amp case temperature during functional system thermal validation e Opportunity for acoustic benefits for DTS values between and 1 The current specification based on the processor case temperature has some notable gaps to optimal acoustic design When the ambient temperature is less than the intel
55. mal Mechanical Design Guide Independent Loading Mechanism ILM n te 3 Note Note 3 1 3 1 1 Independent Loading Mechanism ILM The Independent Loading Mechanism ILM provides the force needed to seat the 1366 LGA land package onto the socket contacts The ILM is physically separate from the socket body The assembly of the ILM to the board is expected to occur after wave solder The exact assembly location is dependent on manufacturing preference and test flow The ILM has two critical functions deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints The mechanical design of the ILM is integral to the overall functionality of the LGA1366 Socket Intel performs detailed studies on integration of processor package socket and ILM as a system These studies directly impact the design of the ILM The Intel reference ILM will be build to print from Intel controlled drawings Intel recommends using the Intel Reference ILM Custom non Intel ILM designs do not benefit from Intel s detailed studies and may not incorporate critical design parameters Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM cover assembly and back plate I LM Cover Assembly Design Overview The ILM Cover assembly consists of four major pieces load lever load
56. mish during clip assembly Recommend 0 3 mm min 1 00 0 10 mm 1 00 mm min R 0 40 mm max R 0 40 mm max 2 45 0 10 mm Heatsink Mass and Center of Gravity Total assembly mass lt 550 gm grams excluding clip and fasteners Total mass including clip and fasteners lt 595 g e Assembly center of gravity lt 25 4 mm measured from the top of the IHS Thermal I nterface Material A thermal interface material TIM provides conductivity between the IHS and heat sink The reference thermal solution uses Shin Etsu G751 The TIM application is 0 25 g which will be a nominal 26 mm diameter 1 0 inches Absolute Processor Temperature Intel does not test any third party software that reports absolute processor temperature As such Intel cannot recommend the use of software that claims this capability Since there is part to part variation in the TCC thermal control circuit activation temperature use of software that reports absolute temperature can be misleading See the processor datasheet for details regarding use of 32 TEMPERATURE TARGET register to determine the minimum absolute temperature at which the TCC will be activated and PROCHOT will be asserted 8 Thermal Mechanical Design Guide m Thermal Solution Quality and Reliability Requirements n te D 7 7 1 7 2 Table 7 1 7 2 1 Thermal Solution Quality and Reliability Requirements Refere
57. mits TcoNTROL Tcontro_ S a static value below TCC activation used as a trigger point for fan speed control Thermal Mechanical Design Guide Introduction intel Table 1 2 Terms and Descriptions Sheet 2 of 2 Term TDP Description Thermal Design Power Thermal solution should be designed to dissipate this target power level TDP is not the maximum power that the processor can dissipate Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature Thermal Profile Line that defines case temperature specification of the TTV at a given power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids and enhances the transfer of the heat from the processor case to the heatsink TAMBIENT The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink Tsa The system ambient air temperature external to a system chassis This temperature is usually measured at the chassis air inlets Thermal Mechanical Design Guide 10 Introduction Thermal Mechanical Design Guide LGA1366 Socket intel 2 LGA1366 Socket This chapter describes a surface mount LGA Land G
58. n the Surface Mount Technology SMT manufacturing line The cover remains on the socket during reflow to help prevent contamination during reflow The cover can withstand 260 C for 40 seconds typical reflow rework profile and the conditions listed in Chapter 7 without degrading As indicated in Figure 2 5 the cover remains on the socket during ILM installation and should remain on whenever possible to help prevent damage to the socket contacts Cover retention must be sufficient to support the socket weight during lifting translation and placement board manufacturing and during board and system shipping and handling The covers are designed to be interchangeable between socket suppliers As indicated in Figure 2 5 a 1 indicator on the cover provides a visual reference for proper orientation with the socket Figure 2 5 Pick and Place Cover ILM Installation Pick and Place Cover Thermal Mechanical Design Guide 15 n intel OE Figure 2 6 2 4 1 16 Package Installation Removal As indicated in Figure 2 6 access is provided to facilitate manual installation and removal of the package To assist in package orientation and alignment with the socket e The package Pin1 triangle and the socket 1 chamfer provide visual reference for proper orientation The package substrate has orientation notches along two opposing edges of the package offset from the centerline The socket
59. n listed is at room temperature and has to be satisfied at all time Socket Contact Resistance The resistance of the socket contact solderball and interface resistance to the interposer land gaps included Bulk Resistance Increase lt 3me The bulk resistance increase per contact from 24 C to 107 C Dielectric Withstand Voltage 360 Volts RMS Insulation Resistance 800 MQ Environmental Requirements Design including materials shall be consistent with the manufacture of units that meet the following environmental reference points The reliability targets in this chapter are based on the expected field use environment for these products The test sequence for new sockets will be developed using the knowledge based reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 4 1 Thermal Mechanical Design Guide 25 n tel LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications Figure 4 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the Develop Speculative market expected use stress conditions based on environment for the historical data content technology experts and literature search Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acce
60. nce Heatsink Thermal Verification Each motherboard heatsink and attach combination may vary the mechanical loading of the component Based on the end user environment the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume The Intel reference thermal solution will be evaluated to the boundary conditions in Table 7 1 The test results for a number of samples are reported in terms of a worst case mean 3c value for thermal characterization parameter using real processors based on the TTV correction offset Mechanical Environmental Testing The Intel reference heatsinks will be tested in an assembled condition along with the LGA1366 Details of the Environmental Requirements and associated stress tests can be found in Table 7 based on speculative use condition assumptions and are provided as examples only Use Conditions Board Level Test 1 Requirement Pass Fail Criteria 2 Mechanical Shock 3 drops each for and directions in each of 3 Visual Check and Electrical perpendicular axes i e total 18 drops Functional Test Profile 50 g Trapezoidal waveform 4 3 m s 170 in s minimum velocity change Random Vibration Duration 10 min axis 3 axes Visual Check and Electrical Frequency Range 5 Hz to 500 Hz Functional Test Power Spectral Density PSD Profile 3 13 g RMS Notes 1 Itis recommended that the above
61. ons The attach mechanism consists of A metal attach clip that interfaces with the heatsink core see Figure B 11 and Figure B 12 for the clip drawings Four plastic fasteners see Figure B 7 Figure B 8 Figure B 9 and Figure B 10 for the component drawings Figure 6 6 shows the reference attach mechanism clip core and extrusion portion of the Intel RCBF5 Reference Design The clip is assembled to the heatsink during copper core insertion and is meant to be trapped between the core shoulder and the extrusion as shown in Figure 6 7 The critical to function mechanical interface dimensions are shown in Figure 6 7 and Figure 6 8 Complying with the mechanical interface parameters is critical to generating a heatsink preload compliant with the minimum preload requirement for the selected TIM and to not exceed the socket design limits Thermal Mechanical Design Guide n ATX Reference Thermal Solution n te Figure 6 6 Figure 6 7 Clip Core and Extrusion Assembly a Clip shoulder traps clip in place Critical Parameters for Interface to the Reference Clip 28 er See Detail A Clip Fin Array Detail A Thermal Mechanical Design Guide 45 n tel ATX Reference Thermal Solution Figure 6 8 Critical Core Dimensions 6 6 6 7 6 8 46 Dia 38 68 0 30mm Dia 36 14 0 10 mm Gap required to avoid p core surface ble
62. oval force N A 10 2 N 2 3 Ibf Load Lever actuation force N A 38 3 8 6 Ibf in the vertical direction 10 2 N 2 3 Ibf in the lateral direction Notes 1 These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface 2 This is the minimum and maximum static force that can be applied by the heatsink and it s retention solution to maintain the heatsink to IHS interface This does not imply the Intel reference TIM is validated to these limits 3 Loading limits are for the LGA1366 socket 4 This minimum limit defines the compressive force required to electrically seat the processor onto the socket contacts 5 Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement 6 Test condition used a heatsink mass of 550 gm 1 21 Ib with 50 g acceleration measured at heatsink mass The dynamic portion of this specification in the product application can have flexibility in specific values but the ultimate product of mass times acceleration should not exceed this dynamic load 7 Conditions must be satisfied at the beginning of life and the loading system stiffness for non reference designs need to meet a specific stiffness range to satisfy end of life loading requirements Electrical Requirements LGA1366 socket electrical requirements are measured from the socket seating plane of the processor to the component side of the sock
63. ovide sufficient load for the Thermal Interface Material TIM The clip is formed from 1 6 mm carbon steel the same material as used in previous clip designs The target metal clip nominal stiffness is 376 N mm 2150 Ib in The combined target for reference clip and fasteners nominal stiffness is 260 N mm 1489 Ib in The nominal preload provided by the reference design is 191 N 42 43 Ib 10 Ib Note Intel reserves the right to make changes and modifications to the design as necessary to the Intel RCBF5 reference design in particular the clip Figure 6 4 RCBF5 Clip Thermal Mechanical Design Guide 43 n tel ATX Reference Thermal Solution 6 4 3 Core The core is the same forged design used in RCFH4 This allows the reuse of the fan attach and if desired the same extrusion as used in RCFH4 The machined flange height has been reduced from the RCFH4 design to match the IHS height for the Intel Xeon Processor 3500 Series when installed in the LGA1366 socket The final height of the flange will be an output of the design validation and could be varied to adjust the preload See Section 6 5 for additional information on the critical to function interfaces between the core and clip Figure 6 5 Core 6 5 44 Mechanical I nterface to the Reference Attach Mechanism The attach mechanism component from the Intel RCBF5 Reference Design can be used by other 3rd party cooling soluti
64. plate frame and the captive fasteners The load lever and load plate are stainless steel The frame and fasteners are high carbon steel with appropriate plating The fasteners are fabricated from a high carbon steel The frame provides the hinge locations for the load lever and load plate The cover assembly design ensures that once assembled to the back plate and the load lever is closed the only features touching the board are the captive fasteners The nominal gap of the frame to the board is 1 mm when the load plate is closed on the empty socket or when closed on the processor package When closed the load plate applies two point loads onto the IHS at the dimpled features shown in Figure 3 1 The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints Thermal Mechanical Design Guide 19 tel Independent Loading Mechanism ILM Figure 3 1 3 1 2 3 2 20 ILM Cover Assembly Load Lever lt nn Captive Fastener 4x LoadPlate 7 ae N ILM Back Plate Design Overview The back plate for single processor workstation products consists of a flat steel back plate with threaded studs for ILM attach The threaded studs have a smooth surface feature that provides alignment for the back plate to the motherboard
65. r Intel Field Sales Engineer for these tools Thermal Mechanical Design Guide 31 n tel 1 Sensor Based Thermal Specification Design Guidance 5 3 3 5 3 3 1 5 3 3 2 Note 32 Thermal Solution Validation Test for Compliance to the TTV Thermal Profile This step is the same as previously suggested for prior products The thermal solution is mounted on a test fixture with the TTV and tested at the following conditions TTV is powered to the TDP condition Thermal solution fan operating at full speed e at the boundary condition from Section 5 3 1 The following data is collected TTV power and and used to calculate which is defined as Tease Power This testing is best conducted on a bench to eliminate as many variables as possible when assessing the thermal solution performance The boundary condition analysis as described in Section 5 3 1 should help in making the bench test simpler to perform Thermal Solution Characterization for Fan Speed Control The final step in thermal solution validation is to establish the thermal solution performance and acoustics as a function of fan speed This data is necessary to allow the fan speed control algorithm developer to program the device It also is needed to asses the expected acoustic impact of the processor thermal solution in the system The characterization dat
66. rid Array socket intended for Intel Xeon Processor 3500 Series The socket provides I O power and ground contacts The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead free solder balls for surface mounting on the motherboard The socket has 1366 contacts with 1 016 mm X 1 016 mm pitch X by Y in a 43x41 grid array with 21x17 grid depopulation in the center of the array and selective depopulation elsewhere The socket must be compatible with the package processor and the Independent Loading Mechanism ILM The design includes a back plate which is integral to having a uniform load on the socket solder joints Socket loading specifications are listed in Chapter 4 Figure 2 1 LGA1366 Socket with Pick and Place Cover Removed Thermal Mechanical Design Guide 11 Figure 2 2 LGA1366 Socket Contact Numbering Top View of Socket T ama eS m Lo 7777777 7 5 J gt NE S ANA 59999595 95 9959 959 9995 2 vl 9 8 OZ cc be 92 82 OF vt 9 BE OW I GI LI 6l IZ Z 60 I ce GE LE aan 0 9 80 UP Bl 02 22 92 8 amp
67. ssor thermal solution addition to the power dissipation a set of three system level boundary conditions for the local ambient TA and external ambient will be used Low external ambient 25 C idle power for the components Case 3 This covers the system idle acoustic condition Low external ambient 25 C TDP for the components Case 2 The processor thermal solution fan speed is limited by the thermistor in the fan hub High ambient 35 C TDP for the components Case 1 This covers the maximum fan speed condition of the processor thermal solution Processor Thermal Solution Requirements amp Boundary Conditions case power power iro 1 35 39 0 23 C W 756 LFM 3 8 m S 2 25 30 0 30 C W 420 LFM 2 1 m S 3 25 Idle Idle 30 1 54 C W 163 LFM 0 83 m S Notes 1 The values in Table 6 1 are preliminary and subject to change 2 Output airflow targets are the minimum inlet requirements for the 3 For Case 3 the minimum fan speed is projected to deliver 0 54 C W 4 All measurements will be evaluated at sea level Thermal Mechanical Design Guide 39 n tel ATX Reference Thermal Solution 6 2 Heatsink Thermal Solution Assembly The reference thermal solution for the processor is an active fan solution similar to the prior designs for the Intel Pentium 4 and Intel
68. tests be performed a sample size of at least ten assemblies from multiple lots of material 2 Additional pass fail criteria may be added at the discretion of the user Recommended Test Sequence Each test sequence should start with components i e baseboard heatsink assembly etc that have not been previously submitted to any reliability testing Prior to the mechanical shock amp vibration test the units under test should be preconditioned for 72 hours at 45 9C The purpose is to account for load relaxation during burn in stage The test sequence should always start with a visual inspection after assembly and BI OS Processor memory test The stress test should be then followed by a visual inspection and then BI OS Processor memory test Thermal Mechanical Design Guide 47 n tel Thermal Solution Quality and Reliability Requirements 7 2 2 Post Test Pass Criteria The post test pass criteria are 1 No significant physical damage to the heatsink and retention hardware 2 Heatsink remains seated and its bottom remains mated flatly against the IHS surface No visible gap between the heatsink base and processor IHS No visible tilt of the heatsink with respect to the retention hardware No signs of physical damage on baseboard surface due to impact of heatsink No visible physical damage to the processor package Successful BIOS Processor memory test of post test samples Thermal compliance testing to d
69. the Reference 45 6 8 Critical Core Dimensions memes esee ee eene nee memes 46 B 1 Socket Heatsink ILM Keepout Zone Primary Side 52 B 2 Socket Heatsink ILM Keepout Zone Secondary Side Bottom 53 B 3 Socket Processor ILM Keepout Zone Primary Side 54 B 4 Socket Processor ILM Keepout Zone Secondary Side Bottom 55 B 5 Reference Design Heatsink Assembly 1 072 kk kk kk kk kk nnn 56 4 Thermal and Mechanical Design Guide go O O O 0 UU UU U ty OWPPrPrPNOAUBPH Arere 6 Reference Design Heatsink Assembly 2 012 57 7 Reference Fastener Sheet 1 Of 4 58 8 Reference Fastener Sheet 2 Of 4 59 9 Reference Fastener Sheet 3 Of 4 60 10 Reference Fastener Sheet 4 Of 4 61 11 Reference Clip Sheet 1 Of 2 0 0 0 eee tenet kak kaka kak ak 62 12 Reference Clip Sheet 2 Of 2 sis la selka san b na 63
70. tsink Enabled Components Item Intel PN AVC Delta Nidec ITW Heatsink Assembly RCBF5 Core Fan D95135 005 Z1ML005001 N A N A N A Extrusion TIM Heatsink Assembly DBX A E31964 001 N A E31964 001 N A N A Heatsink Assembly 29477 002 29477 002 29477 002 N A DBA A Clip D94152 002 A208000308 N A N A N A Base C33389 Base C33389 Fast N A N A N A oa C33390 Cap C33390 LGA1366 Socket and ILM Components Item Intel PN Foxconn Tyco ILM D92428 002 PT44L12 4101 1939738 1 Back Plate D92430 001 PT44P11 4101 1939739 1 LGA1366 D86205 002 PE136627 4371 01F 1939737 1 Supplier Contact Information Supplier Contact Phone Email Ya David Chao 886 2 2299 6930 ext 7619 david_chao avc com tw Corporation Rachel Hsu 886 2 2299 6930 ext 7630 raichel_hsi avc com tw ITW Fastex Roger Knell 773 307 9035 rknell itwfastex com Foxconn Julia Jiang 408 919 6178 juliaj foxconn com Tyco Billy Hsieh 81 44 844 8292 billy hsieh tycoelectronics com The enabled components may not be currently available from all suppliers Contact the supplier directly to verify time of component availability Thermal Mechanical Design Guide 49 50 Component Suppliers Thermal Mechanical Design Guide Mechanical Drawings B Mechanical Drawings Table B 1 lists the mechanical drawings included in this appendix Table B 1
71. validated thermal solution 5 2 1 TTV Thermal Profile For the sensor based specification the only reference made to a case temperature measurement is on the TTV Functional thermal validation will not require the user to apply a thermocouple to the processor package or measure processor power Note All functional compliance testing will be based on fan speed response to the reported DTS values above Tcowrnor AS a result no conversion of TTV to processor will be necessary 28 Thermal Mechanical Design Guide Sensor Based Thermal Specification Design Guidance n te D As in previous product specifications a knowledge of the system boundary conditions is necessary to perform the heatsink validation Section 5 3 1 will provide more detail on defining the boundary conditions The TTV is placed in the socket and powered to the recommended value to simulate the TDP condition See Figure 5 2 for an example of the processor TTV thermal profile Figure 5 2 Thermal Profile 70 0 4 y 43 2 0 19 P 65 0 60 0 8 55 0 gt 50 0 45 0 40 0 r r r r r r r r r r r r 1 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Power W Note This graph is provided as a reference Please refer to the appropriate processor datasheet for the specification 5 2 2 Specification When DTS value is Greater than TcoNTROL The product specification provides a tab
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