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IBM Intel Xeon E5506

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1. e N O GER gt o N Sg E lt B B z E E S e es 5 T m z Thermal Mechanical Design Guide 71 Mechanical Drawings Figure B 22 1U Reference Heatsink Assembly with TI M Sheet 2 of 2 ntel L THERMAL INTERFACE APPLICATION Thermal Mechanical Design Guide 73 intel Figure B 23 2U Reference Heatsink Assembly with TI M Sheet 1 of 2 2U TALL WITH TIM ASSEMBLY HEAT SINK THURLEY REVISION HISTORY PARTS LIST 74 Thermal Mechanical Design Guide Mechanical Drawings Figure B 24 2U Reference Heatsink Assembly with TI M Sheet 2 of 2 ntel THERMAL INTERFACE APPLICATION Thermal Mechanical Design Guide 75 intel Figure B 25 Tower Reference Heatsink Assembly with TI M Sheet 1 of 2 TOWER WITH TIM ASSEMBLY HEAT SINK THURLEY REVISION HISTORY PARTS LIST 76 Thermal Mechani
2. e o 4 E lt El e m Eo zi N N d N 4 O a E to Ki a S E 8 SS lt 3 3 R YA Ww E e GC aS SS E 1 lt lt z co co A a o T 03 lt Thermal Mechanical Design Guide 65 Figure B 15 2U Collaborative Heatsink Volumetric Sheet 1 of 2 66 intel Mechanical Drawings e AIRFLOW DIRECTION SEE NOTE 8 a Iu TOP VIEW VOLUMETRIC HEAT SINK 2U TALL DI 4 00 12 5201 Thermal Mechanical Design Guide Mechanical Drawings Figure B 16 2U Collaborative Heatsink Volumetric Sheet 2 of 2 1 100 10 LEA HR 0181 0040 50 Ja 80 000 13 1496 Thermal Mechanical Design Guide 67 m n tel Mechanical Drawings Figure B 17 Tower Collaborative Heatsink Assembly Sheet 1 of 2 APPROVED HEAT SINK x PEDESTAL ASSEMBLY HEAT SINK THURLEY TONE o E d
3. RING RETAINING 3 2MM GROOVE DIA a t 2 i p EE i Be i 2 ae A N ra li 1 et j BE E c oom 1 i NJ B s PA ze LN ii E F 62 Thermal Mechanical Design Guide Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower 9 80 10 0321 SEE DETAIL B 0 13 diat 09 10 0001 6 00 10 2361 SECTION A A No 5 cag ALL AROUND CUP SPRING RETENTION Thermal Mechanical Design Guide 63 Figure B 13 2U Collaborative Heatsink Assembly Sheet 1 of 2 Mechanical Drawings NOTES THOUT THE P ZS 2U TALL 093127 1 500 00 WOT SCALE DRAVING SREET 1 OF 2 20 TALL TITE ASSEMBLY HEAT SINK THURLEY v G Ki P asm if 64 Thermal Mechanical Design Guide intel Figure B 14 2U Collaborative Heatsink Assembly Sheet 2 of 2
4. 10 1 2 Definition of Terme 10 2 EGA1366 Socket EE 13 2 1 Board Np 15 2 2 Attachment to Motherboard ccc m meme mememe see e menn nnns 16 2 3 Socket DETRESSE eege Ee dee ge 16 2 3 1 Socket Body Housing iiia ERRAT bin RE ERE ER UN ERR dd 16 Eet Deg UE 16 23 3 CONLACS sachin m 17 2 3 4 Pick and Place COVGr i ueteres iae ERRARE EE AE EEN ei 17 2 4 Package Installation Removal sssssssssee enna e enemies 18 2 4 1 Socket Standoffs and Package Seating blane aucnn 18 P MEE M 19 SEET nie EE 19 2 7 Component Insertion Forces 19 2 8 Socket EE 19 2 9 LGA1366 Socket NCTF Solder J O1NtS 0 memes 20 3 Independent Loading Mechanism 1 naww amu wanzwakumaniwanizununazunanua 21 zl DESIGN Te EE 21 3 1 1 ILM Cover Assembly Design Overview 21 21 3 1 2 ILM Back Plate Design Overvlew 22 3 2 Assembly of ILM toaMotberboard 23 4 LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications 27 41 Component Masi ui ennt eni d RR ENNEN tanga RR EGO RO Run CD KD desu CORRIERE Eai 27 4 2 Package Socket
5. TH MAY 68 Thermal Mechanical Design Guide Mechanical Drawings Figure B 18 Tower Collaborative Heatsink Assembly Sheet 2 of 2 1 E 7 ba fa ot li Ce e V V es VK NI te NS il DES o 4 C x lu E a gE E uo B E a gt lt ASSEMBLY DETAILS Nes DETAIL B pa u j N T NU amp 1 S 1 E MES i 7 SEF DETAIL A Thermal Mechanical Design Guide 69 m n tel Mechanical Drawings Figure B 19 Tower Collaborative Heatsink Volumetric Sheet 1 of 2 APPROVED VOLUMETRIC HEAT SINK PEDESTAL E o u E e 4a e o u T E a d Y 1 O i 1 1 T T E ix EN H N N CJ II 1 n P s eo co A a o m lt 70 Thermal Mechanical Design Guide Mechanical Drawings Figure B 20 Tower Collaborative Heatsink Volumetric Sheet 2 of 2 EET
6. Ny u Captive Fastener 4x Load Plate AS d SC I LM Back Plate Design Overview The unified back plate for 2 socket server and 2 socket Workstation products consists of a flat steel back plate with threaded studs for ILM attach and internally threaded nuts for heatsink attach The threaded studs have a smooth surface feature that provides alignment for the back plate to the motherboard for proper assembly of the ILM around the socket A clearance hole is located at the center of the plate to allow access to test points and backside capacitors An additional cut out on two sides provides clearance for backside voltage regulator components An insulator is pre applied Back plates for processors in 1 socket Workstation platforms are covered in the Intel Xeon Processor 3500 Series Thermal Mechanical Design Guide Thermal Mechanical Design Guide m e Independent Loading Mechanism ILM n te D Figure 3 2 3 2 Back Plate Threaded studs Clearance hole Threaded nuts Assembly of ILM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board In step 1 see Figure 3 3 the back plate is placed in a fixture Holes in the motherboard provide alignment to the threaded studs In step 2 the ILM cover assembly is placed over the socket and threaded studs Using a T20 Torx driver fasten the ILM cover assembly to the back plate with the four captive fasteners
7. The definition of Short Term time is clearly defined for NEBS Level 3 conditions but the key is that it cannot be longer than 360 hours per year Thermal Mechanical Design Guide Embedded Thermal Solutions Figure E 2 E 2 2 NEBS Thermal Profile Thermal Profile 90 Short term Thermal Profile may only be used for short term s 80 excursions to higher ambient temperatures not to exceed 360 hours per year O 70 pui jm Short Term Thermal Profile E Tc 0 302 P 66 9 S Nominal Thermal Profile p 60 Tc 0 302 P 51 9 50 4 40 T T T T T T T T T T T 1 0 5 10 15 20 25 30 35 40 45 50 55 60 Power W Notes 1 The thermal specifications shown in this graph are for reference only See the Intel Xeon Processor 5500 Series Datasheet Volume 1 for the Thermal Profile specifications In case of conflict the data in the datasheet supersedes any data in this figure 2 The Nominal Thermal Profile must be used for all normal operating conditions or for products that do not require NEBS Level 3 compliance 3 The Short Term Thermal Profile may only be used for short term excursions to higher ambient operating temperatures not to exceed 360 hours per year as compliant with NEBS Level 3 4 Implementation of either thermal profile should result in virtually no TCC activation 5 Utilization of a thermal solution that exceeds the Short Term Thermal Profile or which operates at th
8. 14 Thermal Mechanical Design Guide LGA1366 Socket 2 1 Figure 2 3 Board Layout The land pattern for the LGA1366 socket is 40 mils X 40 mils X by Y and the pad size is 18 mils Note that there is no round off conversion error between socket pitch 1 016 mm and board pitch 40 mil as these values are equivalent LGA1366 Socket Land Pattern Top View of Board A C EG J L N R U W AA AC AE AG AJ AL AN AR AU AW BA D n AURA CUR RR Mii UM gu E M OOQOOOQOO0OQ0O0O0O00O00O0000000 OOOOOOOOOQOOO0 39 Ge 38 GE OOOO OOOOOOOOOOOO JO OOOOO OOOOOOOOOOOO OO 35 QOD QOOOOO OOCOCOCOCQ0 QDOOQOOO YAYA OOQQOOOOOOOOOQ 34 QQQOQOQOOOO 000000 OOOO00 OOOO0 OOOOOOOOOOOOO 33 OOOOOOOOOOO 32 F 90009000000 PUEDE QT Es GE 9 OOOOOOO000000 OQOOOOOQOO0QOQO 27 8 QOOOOOOOOOOO0 QOOOOOOOQO0000 26 27 QQQQQQQQQQQQ SA d No EE 24 3 s OOOO000000 OQOOOQOQOOQO 22 2 z 89888938998 3388888 21 OOOO0O0000000 QOOOOO0O000000 19 20 QOOOOOO000000 QOOOOOQOOO0QO0O00 18 19 QOOOQ0O0000000 QOOOOOO0O00000 17 18 OOOOOOOO0O0000 OOO0O0O00000000 16 EE GE Noo SE e e GE 11 CORR rmm eem 10 QOOOQO0QO000C0C0 OOOOOO QOOOOOO O0000040 000000000000 9 OYO OO 0000000 0000010000900 0000000000000 8 QOQQOQOQOOOD QOCCOCOCQ OOOOOO OOOOO OOOQOOOOOOOOOO 7 OO 0909999000 QOOOOOO OOOOO OOOOOOOOOOOO OQ 6 QOQQOOOQOOOO OOOOOO OOOOOO OOOOO OOOOOOOOOOOOO BE HE ES ROO GE 4 OC OOOOOOD QOOOOO OOOO QQQQQQQQ 3 Ge Se ee EE SE A C E G J L N R U W AA AC AE AG AJ AL A
9. Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4 ntel I un _ Thermal Mechanical Design Guide 83 84 Socket Mechanical Drawings Thermal Mechanical Design Guide D Heatsink Load Metrology To ensure compliance to max socket loading value listed in Table 4 3 and to meet the performance targets for Thermal Interface Material in Section 5 3 the Heatsink Static Compressive Load can be assessed using the items listed below HP34970A DAQ Omegadyne load cell 100 Ibf max LCKD 100 Test board 0 062 with ILM amp back plate installed 8 in Ibf pneumatic driver Heatsink Gainestown Load Cell Fixture Figure D 1 Thermal Mechanical Design Guide 85 amp intel EE Figure D 1 Intel Xeon Processor 5500 Series Load Cell Fixture REV 01 01010 3808 67 HISTORY GAINSETOWN LOAD CELL FIXTURE 2 e e 18 3 PT J L IE RELEASE TOR SAWPLES bad TONE REY NOTES Arq CG 46 Sj 1 ESS wo vey E NX T Ei H 00 gt 2 83 amp Em d i Ax o E x E 1 1 m Inl oo E co i es o E E 86 Therma
10. 1 0 power and ground contacts The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead free solder balls for surface mounting on the motherboard The socket has 1366 contacts with 1 016 mm X 1 016 mm pitch X by Y ina 43x41 grid array with 21x17 grid depopulation in the center of the array and selective depopulation elsewhere The socket must be compatible with the package processor and the Independent Loading Mechanism ILM The design includes a back plate which is integral to having a uniform load on the socket solder joints Socket loading specifications are listed in Chapter 4 Figure 2 1 LGA1366 Socket with Pick and Place Cover Removed Thermal Mechanical Design Guide 13 Figure 2 2 LGA1366 Socket Contact Numbering Top View of Socket x ama er eS m SOTO Or 5 6 gt fe eae Lo i T 22222 p e 22222 NE 1 L PPPPPPPPP 00 Sien TT EE ANA IGYSUSSYSSVSSVISIISS 2 vl 91 8 00 00 70 92 80 OF vt 9 BE OW cr GI Li 61 IZ Z G2 L 60 I ce GE LE 66 Ih tr aan Qa AM 2 0 9 80 dr 91 Bl 02 22 ve 92 8 amp OE d C L 6 Il Gl Lt 6l IZ 2 G2 LO 62 I 4 as 4 dussssqaqaqaaqadt Dasecceqaaaeae m 0nmocr sg c xu
11. 1 03 gRMS 1 hour axis for 3 axes 7 Gravitational Required for heatpipe designs As verified in wind tunnel mean cA 3s 15 Evaluation 3 orientations 0 90 90 offset not to exceed value in Table 5 1 Thermal Mechanical Design Guide 43 intel Quality and Reliability Requirements Table 6 1 Heatsink Test Conditions and Qualification Criteria Sheet 2 of 2 Min Assessment Test Condition Qualification Criteria Sample Size 8 Thermal Using 1U heatsink and 1U airflow from As verified in wind tunnel 5 heatsinks Performance Table 5 1 1 mean cat 3s offset not to exceed X 8 tests by 1 TTV 95W Profile B Note 1 Table 5 1 value for 95W in 1U supplier Using 2U heatsink and 2U airflow from 2 4 mean Yca 3s offset not to exceed Table 5 1 Table 5 1 value for 2U Note 1 30 2 TIV 95W Profile A Note 1 5 8 mean Yca 3s offset not to exceed heatsinks X 3 TIV 80W Table 5 1 value for Tower 3 tests by 4 TTV 60W Intel Using Tower heatsink and Tower airflow from Table 5 1 5 TTV 130W Note 1 6 TTV 95W Profile A 7 TTV 80W 8 TTV 60W 9 Thermal Cycling Required for heatpipe designs As verified in wind tunnel 15 Temperature range at pipe in heatsink Mean ca 3s offset not to exceed assembly 25C to 100C for 500 cycles value in Table 5 1 Cycle time is 30 minutes per full cycle Pressure drop not to exceed value in divided into half cycle in ho
12. Drawings LEGEND THIS SHEET ONLY D THURLEY amp GAINESTOWN ENABLING KEEPIN KEEPOUT 2 AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD 52 Thermal Mechanical Design Guide Mechanical Drawings Figure B 2 Board Keepin Keepout Zones Sheet 2 of 4 gt 10000 000 8 2X 00 LEGEND THIS SHEET ONLY AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD DETAILS Thermal Mechanical Design Guide 53 intel Figure B 3 Board Keepin Keepout Zones Sheet 3 of 4 LEGEND THIS SHEET ONLY AS VIEWED FROM SECONDARY SIDE OF THE MOTHERBOARD DETAILS 00001 0 54 Thermal Mechanical Design Guide Mechanical Drawings Figure B 4 Board Keepin Keepout Zones Sheet 4 of 4 REVISION HISTORY PRIMARY SIDE 3D HEIGHT RESTRICTION ZONES SECONDARY SIDE 3D HEIGHT RESTRICTION ZONES Thermal Mechanical Design Guide 55 Mec
13. Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C Similarly a seating plane on the topside of the socket establishes the minimum package height See Section 4 2 for the calculated IHS height above the motherboard Thermal Mechanical Design Guide 2 5 Durability The socket must withstand 30 cycles of processor insertion and removal The max chain contact resistance from Table 4 4 must be met when mated in the 1st and 30th cycles The socket Pick and Place cover must withstand 15 cycles of insertion and removal 2 6 Markings There are three markings on the socket LGA1366 Font type is Helvetica Bold minimum 6 point 2 125 mm Manufacturer s insignia font size at supplier s discretion Lot identification code allows traceability of manufacturing date and location All markings must withstand 260 C for 40 seconds typical reflow rework profile without degrading and must be visible after the socket is mounted on the motherboard LGA1366 and the manufacturer s insignia are molded or laser marked on the side wall 2 7 Component I nsertion Forces Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Table R2 7 Maximum Grip Forces The socket must be designed so that it requires no force to insert the package into
14. Profile Processors that offer dual thermal profile are specified in the appropriate Datasheet Dual thermal profile helps mitigate limitations in volumetrically constrained form factors and allows trade offs between heatsink cost and TCC activation risk For heatsinks that comply to Profile B yet do not comply to Profile A 1U heatsink in Figure 5 5 the processor has an increased probability of TCC activation and an associated measurable performance loss Measurable performance loss is defined to be any degradation in processor performance greater than 1 596 1 596 is chosen as the baseline since run to run variation in a performance benchmark is typically between 1 and 296 Thermal Mechanical Design Guide 37 intel Figure 5 5 Dual Thermal Profile 5 6 38 Tess MAX EE Er eee IP EE eee A 0 TCASE MAX is a thermal solution design point In actuality units will not significantly exceed TCASE MAX 4A due to TCC activation Thermal Profile B 1U Heatsink TEMPERATURE 40C ow POWER TDP Compliance to Profile A ensures that no measurable performance loss will occur due to TCC activation It is expected that TCC would only be activated for very brief periods of time when running a worst case real world application in a worst case thermal condition A worst case real world application is a commercially available useful application which dissipates power above TDP for a thermally re
15. RR UR RI RR RE RRRRERE A UNITA MREA MIENNE VM A RUD UERE 87 E 2 Thermal Design GUICEIINES 2 88 E 2 1 NEBS Thermal Profile sss Ime emen nenne nnn 88 E 2 2 Custom Heat Sinks For UP ATC 89 E 3 Mechanical Drawings and Supplier Information 92 Processor Installation Tool 97 ures 1 Intel Xeon 5500 Platform Socket Stack 9 1 LGA1366 Socket with Pick and Place Cover Removed sss emen 13 2 LGA1366 Socket Contact Numbering Top View of Socket 14 3 LGA1366 Socket Land Pattern Top View of Board 15 4 Attachment to Motherboard ccccccc ccc c cece IH ee ee hehehe hene eaae aa aen aea ne dan 16 5 Pick and Place Cover 17 6 Package Installation Removal Features 18 7 EGATIS366 NCTE Solder Ke CEET 20 St IEM Gover Assembly iex senden ENEE dE SEENEN E EE P ee ER SEET Eeer e Eed 23 23 EMIASSOMDIY s steve Ee ER OE EES Ee bios FETU US 24 4 PIN and ILM Lever mene ee ener hanh anh a aenea aea ene dan 25 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology sese 30 1U Heatsink Performance Curves n He ehe een enne nha aenea aea en n 32 2 TTV Die Size and Orientation 34 3 1U Reference Heatsink Assembly 2 cette ee
16. Stackup Height ssssssssssssssssseee eee eae teeta nanan 27 4 3 Socket Maximum Temperature 27 4 4 Loading Specifications AI 28 4 5 Electrical Reouirements mme sese se meme see meses ens 28 4 6 Environmental Requirements cece cee nemen sese nien nens 29 5 Thermal Solutions roh estu ee ee te aaa 31 5 1 Performance Targets eere PR Pere bte reed ede OH Des HORA P pP P e Dr Dead 31 5 1 1 25 5 mm Tall Heatsink anenee Essen As ge Zeg SN RER ergo na n fede RER dg a 33 5 2 Heat Pipe Considerations eerte ne rex nee ENEE se XR ex NASA ES ne Kn 34 53 JAssemblyzz io Rex UP EN dM MU UM NE NMERI RIPE RDUM M M IM REUNIR UE 35 5 3 1 Thermal Interface Material IMI nennen 36 5 4 Structural Gonsiderations oec eo c e e e RR UL REA REO RR RENDER ARR ERG DR NER 36 55 cmhermal Le a EE EEN 36 5 5 1 Thermal Characterization Parameter 36 5 5 2 Dual Thermal Profile 37 5 6 Thermal Features ws i ceci recen rediere cde e REPER eer S tenes EXE ETE UE e dE 38 5 6 1 Fan Speed Control eae etta tetra lada t a ex dcr Ke RE nad dd 39 5 6 2 PECI Averaging and Catastrophic Thermal Management 40 5 6 3 Intel Turbo Boost Technology 40 5 7 Thermal Guidance AAH EEN eri edem idea eli qne Dre OEN 40 5 7 1 Thermal Excursion Power for 95 W Processor e 40 5 7 2 Thermal Excursion Power for 80 W Processor e 41 5 7 3 Absolute Processor Temperature 41 Thermal Mechanical Design Guide 3 6 moon D Fi UJ UJ UU UJ U
17. ball material Lead free SAC SnAgCu solder alloy with a silver Ag content between 396 and 496 and a melting temperature of approximately 217 C The alloy must be compatible with immersion silver ImAg motherboard surface finish and a SAC alloy solder paste Thermal Mechanical Design Guide The co planarity profile and true position requirements are defined in Appendix C 2 3 3 Contacts Base material for the contacts is high strength copper alloy For the area on socket contacts where processor lands will mate there is a 0 381 uum 15 pinches minimum gold plating over 1 27 um 50 winches minimum nickel underplate No contamination by solder in the contact area is allowed during solder reflow 2 3 4 Pick and Place Cover The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology SMT manufacturing line The cover remains on the socket during reflow to help prevent contamination during reflow The cover can withstand 260 C for 40 seconds typical reflow rework profile and the conditions listed in the LGA1366 Socket Validation Reports without degrading As indicated in Figure 2 5 the cover remains on the socket during I LM installation and should remain on whenever possible to help prevent damage to the socket contacts Cover retention must be sufficient to support the socket weight during lifting translation and placement board manufacturing and during board and s
18. iq 8 KE Ya Jy xmi m Ne O 1 wild G J eR 7 o e i z Ls z Zi GP g S SJ md P 5 N 5 ya fi a C M GE LO E Er o eo a e a z Thermal Mechanical Design Guide m n tel Mechanical Drawings Figure B 9 Heatsink Shoulder Screw 1U 2U and Tower D89880 DO NOT SCALE ORAWING SHEET OF SCREW SHOULDER M3 X 05 M3 X 0 5 EXTERNAL THREAD SEE NOTES SEE NOTES SCALE T e E T s 5 1 k E 8 El 3 38 SS z3 soc C NE ji HS dms ss es 2X 4 06 i J D E PN Se 1 sg eo E E m 60 Thermal Mechanical Design Guide intel Figure B 10 Heatsink Compression Spring 1U 2U and Tower a o L ca E S 5 3 A E Hi z 2 e E o s D E ig S 3 3 9 s LEM FINISH SEE NOTES SCALE 1 e 5 rey E SOLID KEIGH Lom Ge T Thermal Mechanical Design Guide intel Figure B 11 Heatsink Retaining Ring 1U 2U and Tower Mechanical Drawings
19. not used to generate processor thermal specifications Processor is not downstream from memory in TEB Ducting is utilized to direct airflow 6 Dimensions of heatsink do not include socket or processor 7 The 2U heatsink height 64mm socket processor height 7 729 mm Table 4 2 complies with 76 2 mm max height for EEB monoplanar boards http ssiforum oaktree com 8 Passive heatsinks PCM45F thermal interface material 9 WS Workstation Thermal Mechanical Design Guide 31 n tel Thermal Solutions For 1U reference heatsink see Appendix B for detailed drawings Table 5 1 specifies Vc and pressure drop targets at 9 7 CFM Figure 5 1 shows Vc and pressure drop for the 1U heatsink versus the airflow provided Best fit equations are provided to prevent errors associated with reading the graph Figure 5 1 1U Heatsink Performance Curves AP Test 1 295E 04Q 1 975E 020 Mean Test Y 0 1682 1 6052 0679 c 0 0046 CW For 2U and Tower heatsink see Appendix B for volumetric drawings Table 5 1 specifies Wc and pressure drop targets at 30 CFM At airflows other than 30 CFM Yca and pressure drop will differ between suppliers as their heatpipe and fin geometries will vary 32 Thermal Mechanical Design Guide Thermal Solutions 5 1 1 Table 5 2 25 5 mm Tall Heatsink For the 25 5 mm tall heatsink Table 5 2 provides guidance regarding performance intel expectations These values
20. the socket 2 8 Socket Size Socket information needed for motherboard design is given in Appendix C This information should be used in conjunction with the reference motherboard keep out drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components Thermal Mechanical Design Guide 19 2 9 Figure 2 7 Note 20 LGA1366 Socket NCTF Solder J oints LGA1366 Socket Intel has defined selected solder joints of the socket as non critical to function NCTF for post environmental testing The processor signals at NCTF locations are typically redundant ground or non critical reserved so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality Figure 2 7 identifies the NCTF solder joints LGA1366 NCTF Solder J oints A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY eeooooooooooooooo oooooooooooooooee LA Et T E Me QOOOOOO0O0O00O000000 OOOOOO OOOOOOOOOOOOOOOOO O08 erie ele eee elec e c eeic ee ee eie eee eee ee eee eee e e ee E AAA E MAAN 32 OOOO OOOOOOO B0000000 OQ ED E SE OOOOOOOOOO0O00 eos E SE E 24 OOOOOOOOOOOO OQOOOO0O0O00000 EE s E 21 OOQOOQ000Q000 QQOOOQOOOOO OO Mon 398898009999 18 _ QOOOOOO000000 QOOOOOOO0O0000 7 QOOOO0O0O000000 OOOOOOOOO0000 M s 999890009999 14 Q BEBE OOOOOOOO00O000 ER EE 9 OOOH OOOOOO OOOOO OOOOOOOOOOOO O 8 YOGA JO JO QOOOOO
21. Intel Xeon Processor 5500 Series Thermal Mechanical Design Guide March 2009 Document Number 321323 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical life saving or life sustaining applications Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Intel Xeon processor 5500 series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or yo
22. Mechanical Drawing Sheet 3 of 4 cece cette ere nn 82 CA Socket Mechanical Drawing Sheet 4 of Al 83 D 1 Intel Xeon Processor 5500 Series Load Cell Fixture 86 E 1 ATCA Heatsink Performance Cunves IH Henne hene nena aea nna dan 88 E 2 NEBS Thermal Profile iicet rx RERO EE FER ER CANCRO VERE ECHTE TUN E CER COE RW RD SNE 89 E 3 UP ATCA Thermal Solution 90 E 4 UP ATCA System Layout eegent iere eterne see reet rae s rev ebb Fen lo ke ce ROT e ERAN 90 E 5 UP ATCA Heat Sink Drawing 91 E 6 ATCA Reference Heat Sink Assembly Sheet 1 of2i eeeeeene mmn 93 E 7 ATCA Reference Heat Sink Assembly Sheet 2 Of 2 cccccccceeee ese ee eee eet eet menm 94 E 8 ATCA Reference Heatsink Fin and Base Sheet Lof h 95 E 9 ATCA Reference Heatsink Fin and Base Sheet 2 Of 2 2 96 F 1 Processor Installation Tool 98 Thermal Mechanical Design Guide 5 Tables 1 1 Reference DOM onere eta eine Sege EE Gees 10 1 2 Tenms and Descriptloris cott Her RE px ERR MAR RC LM EI Ra RM E ENIMNE SEN 10 4 1 Socket Component Mass dore Aaaa 27 4 2 1366 land Package and LGA1366 Socket Stackup Height sssssseeeeene 27 4 3 Socket and ILM Mechanical Specifications wwwwwwnamwanw
23. N AR AU AW BA B D F H KM P T V Y AB AD AF AH AK AM AP AT AV AY Thermal Mechanical Design Guide amp intel nm Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls There are no additional external methods that is screw extra solder adhesive and so on to attach the Socket As indicated in Figure 2 4 the Independent Loading Mechanism ILM is not present during the attach reflow process Figure 2 4 Attachment to Motherboard 2 3 2 3 1 2 3 2 16 LGA 1366 Socket Socket Components The socket has two main components the socket body and Pick and Place PnP cover and is delivered as a single integral assembly Refer to Appendix C for detailed drawings Socket Body Housing The housing material is thermoplastic or equivalent with UL 94 V 0 flame rating capable of withstanding 260 C for 40 seconds typical reflow rework The socket coefficient of thermal expansion in the XY plane and creep properties must be such that the integrity of the socket is maintained for the conditions listed in the LGA1366 Socket Validation Reports The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems Solder Balls A total of 1366 solder balls corresponding to the contacts are on the bottom of the Socket for surface mounting with the motherboard The socket has the following solder
24. OQOOOOOQOOOOOO 7 YO JO YOYYHA QOOOOO OOOOO 0000000000000 6 OOOQOOOOOOOOOO0000 OOOOOO OOOOO QOOOOOOOOOOOO Eisen 3 SEER RRRRBRRRRSRRSBRLOOK e eee ROO ORR hi Es A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H KM P T V Y AB AD AF AH AK AM AP AT AV AY For platforms supporting the DP processor land C3 is CTF un Thermal Mechanical Design Guide a Independent Loading Mechanism ILM n te 3 Note Note 3 1 3 1 1 I ndependent Loading Mechanism ILM The Independent Loading Mechanism ILM provides the force needed to seat the 1366 LGA land package onto the socket contacts The ILM is physically separate from the socket body The assembly of the ILM to the board is expected to occur after wave solder The exact assembly location is dependent on manufacturing preference and test flow The ILM has two critical functions deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints The mechanical design of the ILM is integral to the overall functionality of the LGA1366 socket Intel performs detailed studies on integration of processor package socket and ILM as a system These studies directly impact the design of the ILM The Intel reference ILM will be build to print from Intel controlled drawings Intel recommends using the Intel Reference ILM Custom non Intel ILM designs do not benefit from Inte
25. Supplier Contact I nfo Assembly ATCA ATCA Copper Fujikura Fujikura America Heat Sink Reference Fin Copper Base HSA 7901 Ash Ooe Nehalem EP heatsink a ooeQfujikura com ATCA 408 748 6991 Intel P N E65918 001 Fujikura Taiwan Branch Yao Hsien Huang yeohsien fujikuratw com tw 886 2 8788 4959 Table E 3 Mechanical Drawings List Parameter Value ATCA Reference Heat Sink Assembly Sheet 1 of 2 Figure E 6 ATCA Reference Heat Sink Assembly Sheet 2 of 2 Figure E 7 ATCA Reference Heatsink Fin and Base Sheet 1 of 2 Figure E 8 ATCA Reference Heatsink Fin and Base Sheet 2 of 2 Figure E 9 92 Thermal Mechanical Design Guide Embedded Thermal Solutions Figure E 6 ATCA Reference Heat Sink Assembly Sheet 1 of 2 a e a rO C Q E e VQ Q VN a Kn be Ai AA AN VE DIA ASSEMBLY HEAT SINK Thermal Mechanical Design Guide 93 m e n tel Embedded Thermal Solutions Figure E 7 ATCA Reference Heat Sink Assembly Sheet 2 of 2 sil 4 lt SCALE 6 002 3 d E p E SEF DETAIL m4 94 Thermal Mechanical Design Guide Embedded Thermal Solutions Fi
26. Torque to 8 2 inch pounds The length of the threaded studs accommodate board thicknesses from 0 062 to 0 100 Thermal Mechanical Design Guide 23 m e n tel Independent Loading Mechanism ILM Figure 3 3 ILM Assembly Step 2 With back plate against bottom of Step 1 With socket body reflowed on board align ILM cover assembly to back board and back plate in fixture align plate studs board holes to back plate studs 24 Thermal Mechanical Design Guide m e Independent Loading Mechanism ILM n te D As indicated in Figure 3 4 socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to the socket The result is a specific Pin 1 orientation with respect to the ILM lever Figure 3 4 Pin1 and ILM Lever Thermal Mechanical Design Guide 25 26 Independent Loading Mechanism ILM Thermal Mechanical Design Guide m LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications n tel 4 4 1 Table 4 1 4 2 Table 4 2 4 3 LGA1366 Socket and I LM Electrical Mechanical and Environmental Specifications This chapter describes the electrical mechanical and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism Component Mass Socket Component Mass Component Mass Socket Body Contacts and PnP Cover 15 gm ILM Cover 43 gm ILM Back Plate for dual proces
27. U UJ OY Ut Ui Ul UI Ui UJ UJ UJ QU NJ NJ NJ NJ IN ND N ra Quality and Reliability Requirements ssssssssssssssmem Henn 43 6 1 Test Conditions sse IH hehehe hende ana aede ae aae enn 43 6 2 Intel Reference Component Validation sssssssssssssssenmemen mmm 45 6 2 1 Board Functional Test Sequence emen 45 6 2 2 Post Test Pass Criteria 1 45 6 2 3 Recommended BI OS Processor Memory Test Procedures s sess 46 6 3 Material and Recycling Reouirements 01 46 Component Suppliers RR Er Goad ies ur eee IUUD IIR RAD ees 47 Al Intel Enabled Supplier Information 47 A 1 1 Intel Reference Thermal Solution 47 A 1 2 Intel Collaboration Thermal Solution 47 A 1 3 Alternative Thermal Solution 48 ALA Socket and ILM Components ssssssssssse eene nennen nens 49 Mechanical Drawings 51 Socket Mechanical Drawings ccc ene eterna 79 Heatsink Load Metrology sss eene eene nne 85 Embedded Thermal Soluttons meme enean nna nn 87 E 1 Performance Targets sen dd
28. and it s retention solution to maintain the heatsink to IHS interface This does not imply the Intel reference TIM is validated to these limits 3 Loading limits are for the LGA1366 socket 4 This minimum limit defines the compressive force required to electrically seat the processor onto the socket contacts 5 Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement 6 Test condition used a heatsink mass of 550 gm 1 21 Ib with 50 g acceleration measured at heatsink mass The dynamic portion of this specification in the product application can have flexibility in specific values but the ultimate product of mass times acceleration should not exceed this dynamic load Electrical Requirements LGA1366 socket electrical requirements are measured from the socket seating plane of the processor to the component side of the socket PCB to which it is attached All specifications are maximum values unless otherwise stated for a single socket contact but includes effects of adjacent contacts where indicated Thermal Mechanical Design Guide LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications Table 4 4 4 6 intel Electrical Requirements for LGA1366 Socket Parameter Mated loop inductance Loop Value 3 9nH Comment The inductance calculated for two contacts considering one forward conductor and one return conductor These values must be sa
29. are not used to generate processor thermal specifications Performance Expectations for 25 5 mm Tall Heatsink Parameter Value Altitude system ambient temp Sea level 359C TDP 95W Profile B Tia 50 C 49 C 40 C Pen 0 287 C W 0 337 C W 0 275 C W Airflow 13 3 CFM 0 334 dP 10 CFM 0 210 dP 16 CFM 0 354 dP System height form factor SSI blade 1U EEB 1U TEB Heatsink volumetric Heatsink technology 90 x 90 x 25 5mm 1U Cu base Al fins Notes 1 Local ambient temperature of the air entering the heatsink Max target mean 3 sigma offset for thermal characterization parameter Section 5 5 1 2 3 Airflow through the heatsink fins with zero bypass Max target for pressure drop dP measured in inches H20 4 Reference system configuration Processor is downstream from memory in SSI blade and EEB Entry Level Electronics Bay not in TEB Thin Electronics Bay Ducting is utilized to direct airflow ui height 7 729 mm Table 4 2 complies with 33 5mm max height for SSI blade boards http ssiforum oaktree com 6 Passive heatsinks Dow Corning TC 1996 thermal interface material Thermal Mechanical Design Guide Dimensions of heatsink do not include socket or processor The 25 5 mm heatsink height socket processor 33 m e n tel Thermal Solutions 5 2 Heat Pipe Considerations Figure 5 2 shows the orienta
30. ative Heatsink Volumetric Sheet 1 of i 66 B 162U Collaborative Heatsink Volumetric Sheet 2 Of 2 67 B 17Tower Collaborative Heatsink Assembly Sheet 1 Of 2 68 B 18Tower Collaborative Heatsink Assembly Sheet 2 Of 2 69 B 19Tower Collaborative Heatsink Volumetric Sheet Lof i 70 B 20Tower Collaborative Heatsink Volumetric Sheet 2 of Ai 71 B 211U Reference Heatsink Assembly with TIM Sheet Lof 72 B 221U Reference Heatsink Assembly with TIM Sheet 2 Of 2 1 73 B 232U Reference Heatsink Assembly with TIM Sheet Lof 74 B 242U Reference Heatsink Assembly with TIM Sheet 2 Of 2 1 75 B 25Tower Reference Heatsink Assembly with TIM Sheet lof h wanawa 76 B 26Tower Reference Heatsink Assembly with TIM Sheet 2 Of 2 77 C 1 Socket Mechanical Drawing Sheet 1 of 4 oo 80 C 2 Socket Mechanical Drawing Sheet 2 of Al 81 C 3 Socket
31. cal Design Guide Mechanical Drawings Figure B 26 Tower Reference Heatsink Assembly with TIM Sheet 2 of 2 THERMAL INTERFACE APPLICATION Thermal Mechanical Design Guide 77 78 Mechanical Drawings Thermal Mechanical Design Guide Socket Mechanical Drawings intel C Socket Mechanical Drawings Table C 1 lists the mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing Sheet 2 of 4 Figure C 2 Socket Mechanical Drawing Sheet 3 of 4 Figure C 3 Socket Mechanical Drawing Sheet 4 of 4 Figure C 4 Thermal Mechanical Design Guide 79 8 n tel Socket Mechanical Drawings Figure C 1 Socket Mechanical Drawing Sheet 1 of 4 V91 131905 au 9961 V 80 Thermal Mechanical Design Guide Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4 Thermal Mechanical Design Guide 81 Figure C 3 Socket Mechanical Drawing Sheet 3 of 4 p Le S Si 3 gN E f XN 7 We ii N E j 24 N T N 2 4 aN R YAN 1 e 1 2 rb L oN ees ZS ER 2 i fa 2 0 qu LS de ER Thermal Mechanical Design Guide
32. e Short Term Thermal Profile for a duration longer than the limits specified in Note 3 above do not meet the processor thermal specifications and may result in permanent damage to the processor Custom Heat Sinks For UP ATCA The Embedded specific 60W SKU is targeted for NEBS compliant 1U systems and UP ATCA configurations with custom thermal solutions In order to cool this part in a single wide ATCA slot a custom thermal solution will be required Since solutions like this will be very configuration specific this heat sink was not fully designed with retention and keep out definitions In order to cool the additional power of a 60W processor in ATCA the heat sink volume was increased The assumption was that the heat sink could not grow wider because of VR and Memory placement so a Remote Heat Exchanger RHE was used The RHE is attached to the main heat sink with a heat pipe The RHE gives additional convective surface area and gives the thermal solution access to more air Samples of the following design were ordered and tested for thermal performance only Flotherm analysis shows that the following design can cool an LGA1366 TTV in an ATCA blade at 30CFM The heat sink Yca would be 0 50C W at 55C ambient which falls below the thermal profile for the 60W processor Thermal Mechanical Design Guide 89 D e n tel Embedded Thermal Solutions Figure E 3 UP ATCA Thermal Solution Notes Thermal sample only retention not
33. e targets for 1U 2U and Tower heatsinks These values are used to generate processor thermal specifications and to provide guidance for heatsink design Boundary Conditions and Performance Targets Parameter Altitude system ambient temp Value Sea level 35 C TDP 60W 80W 95W Profile B 95W Profile A 130w ws DT 499C 499C 499C 559C 409C Pon 0 335 C W 0 336 C W 0 337 C W 0 201 C W 0 201 C W Airflow 9 7 CFM 9 7 CFM 9 7 CFM e 30 CFM 30 CFM 0 20 dP 0 20 dP 0 20 dP 0 205 dP 0 205 dP System height 1U EEB 1U EEB 1U EEB 2U EEB Pedestal EEB form factor Heatsink 90 x 90 x 27mm 1U 90 x90 x 64mm 90x90 x 99mm volumetric 2U 97 Tower Heatsink technology Cu base Al fins Cu AI base Al fins with heatpipes Notes 1 Local ambient temperature of the air entering the heatsink 2 Max target mean 3 sigma offset for thermal characterization parameter Section 5 5 1 3 Airflow through the heatsink fins with zero bypass Max target for pressure drop dP measured in inches 120 4 Reference system configuration Processor is downstream from memory in EEB Entry Level Electronics Bay Ducting is utilized to direct airflow 5 The 1U heatsink can also meet Profile B for the 95W processor in TEB Thin Electronics Bay under the following conditions TLA 409C YCA 0 2752C W airflow 16 CFM 0 344 dP these TEB values are
34. educed Tcontro Guidance can reduce average fan power and improve acoustics Implementation is optional Alternately the factory configured Tcontro Values can still be used There are no plans to change Intel s specification or the factory configured TcontroL values on individual processors To implement this guidance customers must re write code to set TcontroL to the reduced values provided in the table below Tcontro_ Guidance TDP CONTROL Comment 95W 10 Intel Xeon Processor 5500 Series with 2 93 GHz Max Core Frequency 95W 1 Intel Xeon Processor 5500 Series frequencies lower than 2 93 GHz 80W 1 Intel Xeon Processor 5500 Series 2 53 GHz or lower except Embedded NEBS 60W 1 Intel Xeon Processor 5500 Series 2 26 GHz or lower except Embedded NEBS Implementation of TcontroL Guidance above maintains Intel standards of reliability based on modeling of the Intel Reference Design Implementation of TcontroL Of 1 may increase risk of throttling Thermal Control Circuit activation Increased TCC activation may or may not result in measurable performance loss Thermal Profile still applies If PECI gt Tcontro Guidance then the case temperature must meet the Thermal Profile Tcontro Values for the follow on processor are TBD but expected to be in the range of the factory configured Tcowrno values for Intel Xeon Processor 5500 Series Regardless of Tcontrot Values used in Intel Xe
35. ests to assess performance for specific conditions Board Functional Test Sequence Each test sequence should start with components baseboard heatsink assembly and so on that have not been previously submitted to any reliability testing The test sequence should always start with a visual inspection after assembly and BIOS Processor memory test The stress test should be then followed by a visual inspection and then BIOS Processor memory test Post Test Pass Criteria The post test pass criteria are 1 No significant physical damage to the heatsink and retention hardware Thermal Mechanical Design Guide 45 n tel Quality and Reliability Requirements 6 2 3 6 3 Note 46 2 Heatsink remains seated and its bottom remains mated flat against the IHS surface No visible gap between the heatsink base and processor IHS No visible tilt of the heatsink with respect to the retention hardware No signs of physical damage on baseboard surface due to impact of heatsink No visible physical damage to the processor package Successful BI OS Processor memory test Thermal compliance testing to demonstrate that the case temperature specification can be met OU PS Lu Recommended BIOS Processor Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses with the thermal mechanical enabling components assembled The test shall be conducted on a fully operat
36. gure E 8 ATCA Reference Heatsink Fin and Base Sheet 1 of 2 4x 12 00 0 4121 TOP VIEW pL 0000 Ll MELLI III I x st aa a o i e lt 2 5 E g e Ei o EJ ui z y E lt a a a E d 3 E ss d 5 Was z s EB 5 2 ls e 2 P FA ka E ya 5 _ i 1 4 i mc e E Thermal Mechanical Design Guide 95 m e n tel Embedded Thermal Solutions Figure E 9 ATCA Reference Heatsink Fin and Base Sheet 2 of 2 SET 2 06 2 D NOT SCALE DRAWING ge DETAIL B ALE 6 00 J c y CO Q Oj T N M a uU sch F o A K D i ar B E 3 EB S s 8 ON an Q O qo 27k a e i co a o ES lt 96 Thermal Mechanical Design Guide m Processor Installation Tool n tel Fo Processor TUSIBUSHON 1901 The following optional tool is designed to provide mechanical assistance during processor installation and removal Contact the supplier for availability Billy Hsieh billy hsie
37. h this surface mount 1366 contact socket PECI The Platform Environment Control Interface PECI is a one wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices Ya Case to ambient thermal characterization parameter psi A measure of thermal solution performance using total package power Defined as Tcase 114 Total Package Power Heat source should always be specified for Y measurements Yes Case to sink thermal characterization parameter A measure of thermal interface material performance using total package power Defined as Tease Ts Total Package Power Ysa Sink to ambient thermal characterization parameter A measure of heatsink thermal performance using total package power Defined as Ts T A Total Package Power TcASE The case temperature of the processor measured at the geometric center of the topside of the IHS TCASE MAX The maximum case temperature as specified in a component specification TCC Thermal Control Circuit Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and or operating frequency and input voltage adjustment when the die temperature is very near its operating limits Thermal Mechanical Design Guide Introduction intel Table 1 2 Terms and Descriptions Sheet 2 of 2 Term TCONTROL Description TcontroL iS a static value below TCC activati
38. h tycoelectronics com 81 44 844 8292 Thermal Mechanical Design Guide 97 Processor Installation Tool Laud uc Tos REVISIONS 9 7 Sx e T DESERTON THE A masse 12wY o8 T S SH REF FJ044492 Thermal Mechanical Design Guide w P07 FJ00550 10q A A E i PBX REM YA 8 18512 ui 989 12 B T 2 Ngg SEY Xa 5 2 S SCREW M2 X 0 4 L 6 7 2 SCREW M2 X 0 4 L5 6 6 KSSC CO MATERIAL SWP B 2 INITIAL LENGTH 9 7 COIL SPRING 5 OUTER DIAMETER 4 8 STIFNESS 11 9 N MM 2 PO7 FJO0560 501 SHAFT 4 P07 FJ00560 401 HOOK 3 1 P07 FJ00560 301 HOLDER 2 P07 FJ00580 201 BODY 1 DEM ay PART NO NO THIS DRAWING IS A CONTROLLED DOCUMENT IS 2 E E KSE Tyne Boapegbe Ges GE VET CHEE pem meer mawa wte SO X 0 05 w se SE ees un s ETE aE TREAT TG E PP poor A2 00779 07 rJ00560 100 CUSTOMER DRAWING B te 1 JUR 1471 8 REV SEDO Processor Installation Tool intel Figure F 1 98
39. hanical Design Guide Thermal Mechanical Design Guide intel l Introduction This document provides guidelines for the design of thermal and mechanical solutions for 2 socket server and 2 socket Workstation processors in the Intel Xeon 5500 Platform The processors covered include those listed in the Intel Xeon Processor 5500 Series Datasheet Volume 1 and the follow on processors The design guidelines apply to the follow on processors in their current stage of development and are not expected to change as they mature The components described in this document include The processor thermal solution heatsink and associated retention hardware The LGA1366 socket and the Independent Loading Mechanism ILM and back plate Processors in 1 socket Workstation platforms are covered in the Intel Xeon Processor 3500 Series Thermal Mechanical Design Guide Figure 1 1 Intel Xeon 5500 Platform Socket Stack Heatsink Socket and ILM Back Plate e i The goals of this document are To assist board and system thermal mechanical designers To assist designers and suppliers of processor heatsinks Thermal profiles and other processor specifications are provided in the Datasheet Thermal Mechanical Design Guide 9 Table 1 1 1 2 Table 1 2 10 Introduction References Material and concepts available in the following documents may be beneficial when reading this documen
40. hanical Drawings Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 Thermal Mechanical Design Guide Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 es gt i cs 3 m ls N d m lt 3 m 8 a B m gt E ps m N a z gt lu 3 a s di g Lex Bei B A pa 1 e e e S o 27 m es 5 ER r Thermal Mechanical Design Guide 57 Mechanical Drawings il 11111 i THIS DRAW CONTAINS INTEL C MAY NOT BE DISCLOSED REPRODUCED D YA Nc C B uM mi oseti i TOP VIEW Thermal Mechanical Design Guide intel Figure B 8 1U Reference Heatsink Fin and Base Sheet 2 of 2 a o ES lt
41. ical Mechanical and Environmental Specifications Loading Specifications The socket will be tested against the conditions listed in the LGA1366 Socket Validation Reports with heatsink and the ILM attached under the loading conditions outlined in this chapter Table 4 3 provides load specifications for the LGA1366 socket with the ILM installed The maximum limits should not be exceeded during heatsink assembly shipping conditions or standard use condition Exceeding these limits during test may result in component failure The socket body should not be used as a mechanical reference or load bearing surface for thermal solutions Socket and I LM Mechanical Specifications Parameter Min Max Notes Static compressive load from ILM cover to 470 N 106 Ibf 623 N 140 Ibf 3 4 processor IHS Heatsink Static Compressive Load ON 0 Ibf 266 N 60 Ibf 1 2 3 Total Static Compressive Load 470 N 106 Ibf 890 N 200 Ibf 3 4 ILM plus Heatsink Dynamic Compressive Load N A 890 N 200 Ibf 1 3 5 6 with heatsink installed Pick and Place Cover Insertion Removal force N A 10 2 N 2 3 Ibf Load Lever actuation force N A 38 3N 8 6 Ibf in the vertical direction 10 2 N 2 3 Ibf in the lateral direction Notes 1 These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface 2 This is the minimum and maximum static force that can be applied by the heatsink
42. ier Designed Chaun Choung Chaun Choung Technology Corp CCI Heatsink Solution with Technology Corp Monica Chih monica chih ccic com tw 886 2 2995 2666 x1131 Harry Lin hlinack aol com 714 739 5797 A 1 3 Alternative Thermal Solution The alternative thermal solutions are preliminary and are not verified by Intel to meet the criteria outlined in Table 6 1 Customers can purchase the alternative thermal solutions from the suppliers listed in Table A 3 Table A 3 Suppliers for the Alternative Thermal Solution Assembly Component Description Supplier PN Supplier Contact I nfo Assembly Heat 1U SSI Blade Supplier Designed TaiSol Corporation TaiSol Corporation Intel Xeon Processor 5500 Series 1U Al fins includes TIM 95W capable Sink 1U Alternative URS Solution Cu base 141 9031000960 A Janice Chiu Heatsink Al fins 95W JD A janice chiu taisol com tw capable 866 2 2656 2658 Supplier Designed Thermaltake Thermaltake Solution Cu base CL P0484 Sean Li Al fins includes TIM 95W capable sean thermaltake com tw 886 2 26626501 EXT 235 Assembly 1U Alternative URS Supplier Designed CoolerMaster CoolerMaster Heatsink Heatsink Solution Cu base S1N PJFCS 07 GP Isaac Chu isaac_chu coolermaster com tw 886 2 32340050 x11182 Supplier Designed Solution Cu base Al fins includes TIM 95W capable Aavid Thermalloy 050073 Aavid Thermalloy Chris Chapman chapman aavid c
43. in RoHS Directive are either 1 below all applicable substance thresholds as proposed by the EU or 2 an approved pending exemption applies RoHS implementation details are not fully defined and may change Thermal Mechanical Design Guide Component Suppliers n tel A Component Suppliers Various suppliers have developed support components for processors in the Intel Xeon 5500 Platform These suppliers and components are listed as a convenience to customers Intel does not guarantee quality reliability functionality or compatibility of these components The supplier list and or the components may be subject to change without notice Customers are responsible for the thermal mechanical and environmental verification of the components with the supplier A 1 I ntel Enabled Supplier I nformation Performance targets for heatsinks are described in Section 5 1 Mechanical drawings are provided in Appendix B Mechanical models are listed in Table 1 1 Heatsinks assemble to server back plate Table A 4 A 1 1 Intel Reference Thermal Solution The Intel reference thermal solutions has been verified to meet the criteria outlined in Table 6 1 Customers can purchase the Intel reference thermal solutions from the suppliers listed in Table A 1 Table A 1 Suppliers for the I ntel Reference Thermal Solution Assembly Component Description Supplier PN Supplier Contact I nfo Assembly Heat 1U URS Intel 27 mm 1U Aluminu
44. ional baseboard that has not been exposed to any battery of tests prior to the test being considered The testing setup should include the following components properly assembled and or connected Appropriate system baseboard Processor and memory All enabling components including socket and thermal solution parts The pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors Material and Recycling Requirements Material shall be resistant to fungal growth Examples of non resistant materials include cellulose materials animal and vegetable based adhesives grease oils and many hydrocarbons Synthetic materials such as PVC formulations certain polyurethane compositions for example polyester and some polyethers plastics which contain organic fillers of laminating materials paints and varnishes also are susceptible to fungal growth If materials are not fungal growth resistant then MIL STD 810E Method 508 4 must be performed to determine material performance Any plastic component exceeding 25 gm should be recyclable per the European Blue Angel recycling standards The following definitions apply to the use of the terms lead free Pb free and RoHS compliant Lead free and Pb free Lead has not been intentionally added but lead may still exist as an impurity below 1000 ppm RoHS compliant Lead and other materials banned
45. ket solder ball stress Customers need to assess shock for their designs as their heatsink retention back plate heatsink mass and chassis mounting holes may vary Thermal Design Thermal Characterization Parameter The case to local ambient Thermal Characterization Parameter Yca is defined by Equation 5 1 Yca TcasE Tia TDP Where Tcasp Processor case temperature C For Tease specification see the appropriate Datasheet Tila Local ambient temperature in chassis at processor C TDP TDP W assumes all power dissipates through the integrated heat spreader This inexact assumption is convenient for heatsink design TTVs are often used to dissipate TDP Correction offsets account for differences in temperature distribution between processor and TTV Equation 5 2 cA Yes Ysa 36 Where Yes Thermal characterization parameter of the TIM C W is dependent on the thermal conductivity and thickness of the TIM Ysa Thermal characterization parameter from heatsink to local ambient C W is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins Figure 5 4 illustrates the thermal characterization parameters Thermal Mechanical Design Guide intel Figure 5 4 Processor Thermal Characterization Parameter Relationships 5 5 2 ml 1 m ho ya T PROCESSOR Dual Thermal
46. l Mechanical Design Guide Embedded Thermal Solutions intel E Embedded Thermal Solutions This section describes the LV processors and Embedded reference heatsinks for NEBS Network Equipment Building Systems compliant ATCA Advanced Telecommunications Computing Architecture systems These LV processors are good for any form factor that needs to meet NEBS requirements E 1 Performance Targets Table E 1 provides boundary conditions and performance targets for 1U and ATCA heatsinks These values are used to generate processor thermal specifications and to provide guidance for heatsink design Table E 1 Boundary Conditions and Performance Targets Parameter Value Value Altitude system ambient temp Nominal Short term Sea level 40 C 55C Sea level 40 C 55C TDP 60 W 38 W Wat 51 9 66 99 C 50 65 C Pon 0 302 C W 0 532 C W System height form factor 1U EEB or ATCA ATCA Heatsink volumetric 1U 90 x 90 x 27 or Custom ATCA 90 x 90 x 13mm heat exchanger ATCA 90 x 90 x 13 mm Notes Heatsink technology Cu base Cu fins 1 Local ambient temperature of the air entering the heatsink 2 Max target mean 3 sigma offset for thermal characterization parameter Section 5 5 1 3 Reference system configuration In a single wide ATCA blade the 60 W processor should be used in single Socket only and the 38 W processor can be used in dual socket 4 Local Ambient Te
47. l s detailed studies and may not incorporate critical design parameters Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM cover assembly and back plate ILM Cover Assembly Design Overview The ILM Cover assembly consists of four major pieces load lever load plate frame and the captive fasteners The load lever and load plate are stainless steel The frame and fasteners are high carbon steel with appropriate plating The fasteners are fabricated from a high carbon steel The frame provides the hinge locations for the load lever and load plate The cover assembly design ensures that once assembled to the back plate and the load lever is closed the only features touching the board are the captive fasteners The nominal gap of the frame to the board is 1 mm when the load plate is closed on the empty socket or when closed on the processor package When closed the load plate applies two point loads onto the IHS at the dimpled features shown in Figure 3 1 The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints Thermal Mechanical Design Guide 21 E n tel Independent Loading Mechanism ILM Figure 3 1 3 1 2 22 ILM Cover Assembly Load Lever
48. le a shut down in an attempt to prevent permanent damage to the processor Thermal Test Vehicle TTV may be used to check anomalous thermal excursion Thermal Mechanical Design Guide intel 5 7 2 5 7 3 compliance by ensuring that the processor Tcase value as measured on the TTV does not exceed Tcase max B at the anomalous power level for the environmental condition of interest This anomalous power level is equal to 7596 of the TDP limit Thermal Excursion Power for 80 W Processor Under fan failure or other anomalous thermal excursions Tcase may exceed the thermal profile for a duration totaling less than 360 hours per year without affecting long term reliability life of the processor For more typical thermal excursions Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit TCC activation initially occurred Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation then data integrity is not assured At some higher threshold THERMTRIP will enable a shut down in an attempt to prevent permanent damage to the processor Thermal Test Vehicle TTV may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value as measured on the TTV does not exceed Tcase max at the anomalous power level for
49. levant timeframe One example of a worst case thermal condition is when the processor local ambient temperature is above the y axis intercept for Profile A Thermal Features More information regarding processor thermal features is contained in the appropriate Datasheet Thermal Mechanical Design Guide m Thermal Solutions n tel 5 6 1 Table 5 3 5 6 1 1 Table 5 4 Fan Speed Control There are many ways to implement fan speed control Using processor ambient temperature in addition to Digital Thermal Sensor to scale fan speed can improve acoustics when DTS gt TCONTROL Fan Speed Control TcontroL and DTS Relationship Condition FSC Scheme DTS lt TcontroL FSC can adjust fan speed to maintain DTS lt TconrtroL low acoustic region DTS gt TcontROL FSC should adjust fan speed to keep Tease at or below the Thermal Profile specification increased acoustic region TcontroL Guidance Factory configured Tcontrot values are available in the appropriate Dear Customer Letter or may be extracted by issuing a Mailbox or an RDMSR instruction See the Intel Xeon Processor 5500 Series Datasheet Volume 1 for more information Due to increased thermal headroom based on thermal characterization on the latest stepping of Intel Xeon Processor 5500 Series production processors customers have the option to reduce Tcontrot to values lower than the factory configured values In some situations use of r
50. m Fin Fujikura Fujikura America Sink 1U Reference Copper Base includes HSA 8078 Rev A Yuji Yasuda Heatsink p n TIM 95W capable yuji fujikura com E32409 001 408 748 6991 1U URS SSI Blade 25 5mm 1U Aluminum Fujikur Fujikura Taiwan Branch Reference Fin Copper Base piven Yao Hsien Huang eoa e f includes TIM and Snap Hoe 80836 yeohsien fujikuratw com tw 5 rerers Cover 95W capable E to E22056 Rev 02 P 886 2 8788 4959 Snap Cover A 1 2 I ntel Collaboration Thermal Solution The Intel collaboration thermal solutions are preliminary and may not be verified to meet the criteria outlined in Table 6 1 Customers can purchase the Intel collaboration thermal solutions from the suppliers listed in Table A 2 Thermal Mechanical Design Guide 47 intel Component Suppliers Table A 2 Suppliers for the I ntel Collaboration Thermal Solution Assembly Component Description Supplier PN Supplier Contact I nfo Assembly 2U URS Heatsink Supplier Designed Foxconn Foxconn Heatsink Solution with pn 1A016500 Intel Xeon Processor 5500 Intel Collaboration Heatsink p n Intel specified retention includes Wanchi Chen worldwide Intel Xeon Processor 5500 Series Pedestal Intel Collaboration Heatsink p n E32412 001 Intel specified retention includes TIM 130W capable CCI pn 0007029401 Series 2U TIM 95W capable wanchi chen foxconn com E32410 001 408 919 6135 Assembly Tower URS Heatsink Suppl
51. mbly Sheet 1 of 2 Figure B 5 1U Reference Heatsink Assembly Sheet 2 of 2 Figure B 6 1U Reference Heatsink Fin and Base Sheet 1 of 2 Figure B 7 1U Reference Heatsink Fin and Base Sheet 2 of 2 Figure B 8 Heatsink Shoulder Screw 1U 2U and Tower Figure B 9 Heatsink Compression Spring 1U 2U and Tower Figure B 10 Heatsink Retaining Ring 1U 2U and Tower Figure B 11 Heatsink Load Cup 1U 2U and Tower Figure B 12 2U Collaborative Heatsink Assembly Sheet 1 of 2 Figure B 13 2U Collaborative Heatsink Assembly Sheet 2 of 2 Figure B 14 2U Collaborative Heatsink Volumetric Sheet 1 of 2 Figure B 15 2U Collaborative Heatsink Volumetric Sheet 2 of 2 Figure B 16 Tower Collaborative Heatsink Assembly Sheet 1 of 2 Figure B 17 Tower Collaborative Heatsink Assembly Sheet 2 of 2 Figure B 18 Tower Collaborative Heatsink Volumetric Sheet 1 of 2 Figure B 19 Tower Collaborative Heatsink Volumetric Sheet 2 of 2 Figure B 20 1U Reference Heatsink Assembly with TIM Sheet 1 of 2 Figure B 21 1U Reference Heatsink Assembly with TIM Sheet 2 of 2 Figure B 22 2U Reference Heatsink Assembly with TIM Sheet 1 of 2 Figure B 23 2U Reference Heatsink Assembly with TIM Sheet 2 of 2 Figure B 24 Tower Reference Heatsink Assembly with TIM Sheet 1 of 2 Figure B 25 Tower Reference Heatsink Assembly with TIM Sheet 2 of 2 Figure B 26 Thermal Mechanical Design Guide 51 intel Figure B 1 Board Keepin Keepout Zones Sheet 1 of 4 Mechanical
52. mperature written 50 65 C means 50 C under Nominal conditions but 65 C is allowed for Short Term NEBS excursions Passive heatsinks with TIM See Section 5 1 for standard 1U solutions that do not need to meet NEBS an Thermal Mechanical Design Guide 87 D n tel Embedded Thermal Solutions Figure E 1 E 2 E 2 1 88 Detailed drawings for the ATCA reference heatsink can be found in Section E 3 Table E 1 above specifies Yc and pressure drop targets and Figure E 1 below shows ca and pressure drop for the ATCA heatsink versus the airflow provided Best fit equations are provided to prevent errors associated with reading the graph ATCA Heatsink Performance Curves 2 5 AP 1 3e 04CFM2 1 1e 02CFM 2 1 6 E 315 1 22 o E S 1 0 8 e lt 0 5 0 4 N Mean Y a 0 337 1 625 CFM 2 939 0 5 10 15 20 25 30 35 CFM Through Fins Other LGA1366 compatible thermal solutions may work with the same retention Thermal Design Guidelines NEBS Thermal Profile Processors that offer a NEBS compliant thermal profile are specified in the Intel Xeon Processor 5500 Series Datasheet Volume 1 NEBS thermal profiles help relieve thermal constraints for Short Term NEBS conditions To help reliability processors must meet the nominal thermal profile under standard operating conditions and can only rise up to the Short Term spec for NEBS excursions see Figure E 2
53. ne ee nene 35 4 Processor Thermal Characterization Parameter Relationships c cceceeeeeeeeeee eee eee eaee 37 5 Dual Thermal Profile 38 1 Example Thermal Cycle Actual profile will var 45 1 Board Keepin Keepout Zones Sheet LofAi cece cere eee ee eee eee ee senna eeaeen nnns 52 2 Board Keepin Keepout Zones Sheet 2 of Ai 53 3 Board Keepin Keepout Zones Sheet 3 of Ai 54 4 Board Keepin Keepout Zones Sheet 4 of Ai 55 5 1U Reference Heatsink Assembly Sheet Lof2t wana 56 6 1U Reference Heatsink Assembly Sheet 2 of 2 10 0 cece e eee mene 57 Thermal Mechanical Design Guide B 7 1U Reference Heatsink Fin and Base Sheet 1 Of i 58 B 8 1U Reference Heatsink Fin and Base Sheet 2 Of 2 59 BO Heatsink Shoulder Screw 1U 2U and Tower 60 B 10Heatsink Compression Spring 1U 2U and Tower 61 B 11Heatsink Retaining Ring LU 2U and Tower 62 B 12Heatsink Load Cup 1U 2U ANd Tower 63 B 132U Collaborative Heatsink Assembly Sheet 1 Of 2 2 64 B 142U Collaborative Heatsink Assembly Sheet 2 of 2 65 B 152U Collabor
54. nice Chiu Intel Xeon heatpipes 130W janice chiu taisol com tw Processor 5500 capable 3 i Series Tower 886 2 2656 3658 Supplier Designed Thermaltake Thermaltake Solution Al fins CLP0485 Sean Li ne d sean githermaltake com tw 886 2 26626501 EXT 235 A LA Socket and ILM Components The LGA1366 Socket and ILM Components are described in Chapter 2 and Chapter 3 respectively Socket mechanical drawings are provided in Appendix C Mechanical models are listed in Table 1 1 Table A 4 LGA1366 Socket and ILM Components Item I ntel PN Foxconn Tyco ILM Cover Assembly D92428 002 PT44L12 4101 1939738 1 Server Back Plate D92433 002 PT44P12 4101 1981467 1 LGA1366 Socket D86205 002 PE136627 4371 01F 1939737 1 Julia Jiang Billy Hsieh Supplier Contact I nfo juliaj foxconn com 408 919 6178 billy hsieh tycoelectronics com 81 44 844 8292 Thermal Mechanical Design Guide 49 50 Component Suppliers Thermal Mechanical Design Guide Mechanical Drawings Table B 1 Mechanical Drawings Mechanical Drawing List Description Figure Board Keepin Keepout Zones Sheet 1 of 4 Figure B 1 Board Keepin Keepout Zones Sheet 2 of 4 Figure B 2 Board Keepin Keepout Zones Sheet 3 of 4 Figure B 3 Board Keepin Keepout Zones Sheet 4 of 4 Figure B 4 1U Reference Heatsink Asse
55. om 603 223 1728 George Lee george lee aavid com tw 886 2 2698 9888 x603 48 Thermal Mechanical Design Guide Component Suppliers intel Table A 3 Suppliers for the Alternative Thermal Solution Assembly Component Description Supplier PN Supplier Contact I nfo Assembly 2U Alternative URS Supplier Designed Asia Vital Asia Vital Components AVC Heatsink Heatsink Solution Components AVC Intel Xeon Aluminum base SR40400001 1 Processor 5500 Cu insert Al fins David Chao Series 2U heatpipes david_chao avc com tw includes TIM 95W 886 2 2299 6930 x7619 capable Supplier Designed Thermaltake Thermaltake Solution Cu base CL P0486 Sean Li IE sean thermaltake com tw capable 886 2 26626501 EXT 235 Supplier Designed CoolerMaster CoolerMaster el Sr base S2N PJMHS 07 GP Isaac Chu ins heatpipes includes TIM 95W isaac_chu coolermaster com tw capable 886 2 32340050 x11182 Supplier Designed TaiSol Corporation TaiSol Corporation SE base 1A0 9041000960 A Janice Chiu ins heatpipes ME includes TIM 95W janice chiu taisol com tw capable 886 2 2656 3658 Supplier Designed Dynatron Dynatron Corporation Solution Corporation lan Lee Aluminum G520 Extrusion ian dynatron corp com includes TIM 80W 510 498 8888 x137 capable Assembly Tower Alternative Supplier Designed TaiSol Corporation TaiSol Corporation Heatsink URS Heatsink Solution Al fins 1A0 9051000960 A Ja
56. on Processor 5500 Series BIOS needs to identify the processor type For the follow on processor the fan speed control algorithm needs to use the follow on processor s factory configured TcontroL values Thermal Mechanical Design Guide 39 intel 5 6 2 5 6 3 5 7 5 7 1 40 PECI Averaging and Catastrophic Thermal Management By averaging DTS over PECI thermal solution failure can be detected and a soft shutdown can be initiated to help prevent loss of data Thermal data is averaged over a rolling window of 256mS by default X28 AVGy AVGy 3 1 1 2X Temperature 1 2 Using a smaller averaging constant could cause premature detection of failure The Critical Temperature threshold generally triggers somewhere between PECI of 0 75 and 0 50 To avoid false shutdowns initiate soft shutdown at 0 25 Since customer designs boundary conditions and failure scenarios differ above guidance should be tested in the customer s system to prevent loss of data during shutdown Intel Turbo Boost Technology Intel Turbo Boost Technology Intel TBT is a new feature available on certain processor SKUs that opportunistically and automatically allows the processor to run faster than the marked frequency if the part is operating below its power temperature and current limits Heatsink performance lower ca as described in Section 5 5 1 is one of several factors that can impact the amount of Intel TBT fre
57. on used as a trigger point for fan speed control TDP Thermal Design Power Thermal solution should be designed to dissipate this target power level TDP is not the maximum power that the processor can dissipate Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature Thermal Profile Line that defines case temperature specification of a processor at a given power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids and enhances the transfer of the heat from the processor case to the heatsink Tu The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink The system ambient air temperature external to a system chassis This temperature is usually measured at the chassis air inlets A unit of measure used to define server rack spacing height 1U is equal to 1 75 in 2U equals 3 50 in etc Thermal Mechanical Design Guide 11 12 Introduction Thermal Mechanical Design Guide LGA1366 Socket intel 2 LGA1366 Socket This chapter describes a surface mount LGA Land Grid Array socket intended for processors in the Intel Xeon 5500 Platform The socket provides
58. production ready Figure E 4 UP ATCA System Layout Notes Heat sink should be optimized for the layout 90 Thermal Mechanical Design Guide intel Embedded Thermal Solutions UP ATCA Heat Sink Drawing Figure E 5 d bei H2 N SH df WHN 33600 ONIMVYG NN S3HONI NI 3 S8313A TL TTIW N 30 L33HS 9NINVUC 31V2 LON oc L 0 31V28 X 3002 3972 6118 26066 VO g 6 L o 0418 3937109 N Jdid 1v3H WNO 9D Z YY SNOISN3AIQ 031342089 38 SNOISN3AIQ AuvWIUud I SALON Wav 12 VINVS fou 96 XOG Ke OISSIN 0022 A1N3AIUYd30 01 1 62 dv 0907 09 dv9 2101 0 SS3N921H 2107 0 SS3NX2IHL 9 INNOD 06 NNOD SNI4 ENT 02 G j i S Sri 7661 06 1 O V 027 i DS S WuOdNOD 131 S012810 38 NOD 511 QNY 32 VINOD NIMY E E df MN ON ou 91 Thermal Mechanical Design Guide n tel Embedded Thermal Solutions E 3 Mechanical Drawings and Supplier I nformation See Appendix B for retention and keep out drawings The part number below represent Intel reference designs for a DP ATCA heatsink Customer implementation of these components may be unique and require validation by the customer Customers can obtain these components directly from the supplier below Table E 2 Embedded Heatsink Component Suppliers Assembly Component Description Supplier PN
59. quency benefit Intel TBT performance is also constrained by ICC and VCC limits Increased IMON accuracy may provide more Intel amp TBT benefit on TDP limited applications as compared to lower Yca as temperature is not typically the limiter for these workloads With Intel TBT enabled the processor may run more consistently at higher power levels but still within TDP and be more likely to operate above TcontroL as compared to when Intel TBT is disabled This may result in higher acoustics With Intel TBT enabled processors with dual thermal profiles described in Section 5 5 2 have greater potential for performance delta between Profile A and Profile B platforms as compared to previous platforms Thermal Guidance Thermal Excursion Power for 95 W Processor Under fan failure or other anomalous thermal excursions Tcase may exceed Thermal Profile B for a duration totaling less than 360 hours per year without affecting long term reliability life of the processor For more typical thermal excursions Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit TCC activation initially occurred Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation then data integrity is not assured At some higher threshold THERMTRIP will enab
60. r s unique heatsink with very little static load as little as 0 Ibf is acceptable from a socket loading perspective as long as the TcAse specification is met Compliance to Board Keepout Zones in Appendix B is assumed for this assembly process Thermal Mechanical Design Guide 35 m e intel 5 5 5 5 1 Thermal I nterface Material TI M TI M should be verified to be within its recommended shelf life before use Surfaces should be free of foreign materials prior to application of TIM Use isopropyl alcohol and a lint free cloth to remove old TIM before applying new TIM Structural Considerations Mass of the 1U reference heatsink and the target mass for 2U and Tower heatsinks does not exceed 500 gm From Table 4 3 the Dynamic Compressive Load of 200 Ibf max allows for designs that exceed 500 gm as long as the mathematical product does not exceed 200 Ibf Example A heatsink of 2 Ib mass 908 gm x 50 g acceleration x 2 0 Dynamic Amplification Factor 200 Ibf The Total Static Compressive Load Table 4 3 should also be considered in dynamic assessments The heatsink limit of 500 gm and use of back plate have eliminated the need for Direct Chassis Attach retention as used previously with the Intel Xeon processor 5000 sequence Direct contact between back plate and chassis pan will help minimize board deflection during shock Placement of board to chassis mounting holes also impacts board deflection and resultant soc
61. s The reliability targets in this chapter are based on the expected field use environment for these products The test sequence for new sockets will be developed using the knowledge based reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 4 1 Thermal Mechanical Design Guide 29 m n tel LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications Figure 4 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the Develop Speculative market expected use stress conditions based on environment for the historical data content technology experts and literature search Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acceleration factors A detailed description of this methodology can be found at ftp download intel com technology itj q32000 pdf reliability pdf 30 Thermal Mechanical Design Guide Thermal Solutions 5 5 1 Table 5 1 Thermal Solutions This section describes a 1U reference heatsink design targets for 2U and Tower heatsinks performance expectations for a 25 5 mm tall heatsink and thermal design guidelines for Intel Xeon Processor 5500 Series and the follow on processors Performance Targets Table 5 1 provides boundary conditions and performanc
62. s 85 C and 85 No visual defects 15 R H As verified in wind tunnel Mean Yea 3s offset not to exceed value in Table 5 1 Pressure drop not to exceed value in Table 5 1 2 Board Level 50G 10 170 10 in sec 3 drops No damage to heatsink base or pipe 15 UnPackaged Shock per face 6 faces No visual defects As verified in wind tunnel e Mean ca 2 54s offset not to exceed value in Table 5 1 Pressure drop not to exceed value in Table 5 1 3 Board Level 5 Hz 0 01 g2 Hz to 20 Hz 0 02 g2 Hz No damage to heatsink base or pipe 15 UnPackaged Vibration slope up No visual defects 20 Hz to 500 Hz 0 02 g2 Hz flat As verified in wind tunnel Input acceleration is 3 13 g RMS Mean Yca 2 54s offset not to 10 minutes axis for all 3 axes on all exceed value in Table 5 1 samples a Pressure drop not to exceed value in Random control limit tolerance is 3 dB Table 5 1 4 First Article Not Applicable Meet all dimensions on 5 samples 37 Inspection Meet all CTF dimensions on 32 additional samples with 1 33 Cpk mean 4s If samples are soft tooled a hard tool plan must be defined 5 Shipping Media Drop height determined by weight and may No visual defects 1 box Packaged Shock vary by customer Intel requirement in General Supplier Packaging Spec 10 drops 6 sides 3 edges 1 corner 6 Shipping Media 0 015 g2 Hz 10 40 Hz sloping to No visual defects 1 box Packaged Vibration 0 0015 g2 Hz 500 Hz
63. sor server products 100 gm Package Socket Stackup Height Table 4 2 provides the stackup height of a processor in the 1366 land LGA package and LGA1366 socket with the ILM closed and the processor fully seated in the socket 1366 land Package and LGA1366 Socket Stackup Height Integrated Stackup Height mm From Top of Board to Top of IHS 7 729 0 282 mm Notes 1 This data is provided for information only and should be derived from a the height of the socket seating plane above the motherboard after reflow given in Appendix C b the height of the package from the package seating plane to the top of the IHS and accounting for its nominal variation and tolerances that are given in the corresponding processor EMTS 2 This value is a RSS calculation Socket Maximum Temperature The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance To ensure socket long term reliability Intel defines socket maximum temperature using a via on the underside of the motherboard Exceeding the temperature guidance may result in socket body deformation or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure The guidance for socket maximum temperature is listed below Via temperature under socket 96 C Thermal Mechanical Design Guide 27 Table 4 3 4 5 28 LGA1366 Socket and ILM Electr
64. t Reference Documents Document Location Notes European Blue Angel Recycling Standards 2 Intel Xeon Processor 5500 Series Datasheet Volume 1 321321 1 Intel Xeon Processor 5500 Series Mechanical Model 321326 1 Intel Xeon Processor 5500 Series Thermal Model 321327 1 Entry level Electronics Bay Specification 3 Notes 1 Document numbers indicated in Location column are subject to change See the appropriate Electronic Design Kit EDK for the most up to date Document number 2 Available at http www blauer engel de 3 Available at http ssiforum oaktree com Definition of Terms Terms and Descriptions Sheet 1 of 2 Term Description Bypass Bypass is the area between a passive heatsink and any object that can act to forma duct For this example it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature FSC Fan Speed Control IHS Integrated Heat Spreader a component of the processor package used to enhance the thermal performance of the package Component thermal solutions interface with the processor at the IHS surface ILM Independent Loading Mechanism provides the force needed to seat the 1366 LGA land package onto the socket contacts LGA1366 socket The processor mates with the system board throug
65. t zone and half Table 5 1 in cold zone with minimum 1min soak at each temperature extreme for each cycle See Figure 6 1 for example profile 10 Heat Pipe Burst Continuously raise oven temperature and No failures at minimum of 300C 20 32 pipes record the burst leak temperatures of fully a minutes assembled heatsinks 11 Heatsink Mass Design Target 500 g All samples lt 550 g 30 12 Heatsink Load Design Targets 30 0 062 board 38 7 7 2 Ibf Fmin 31 5 Ibf 0 100 board 51 4 7 9 Ibf Fmax 59 3 Ibf No samples lt 30 Ibf on 0 062 board 5 highest load samples from 0 062 test 60 Ibf on 0 100 board 44 Thermal Mechanical Design Guide Quality and Reliability Requirements n te Figure 6 1 6 2 6 2 1 6 2 2 Example Thermal Cycle Actual profile will vary 120 100 80 60 Monitor 1 Monitor 2 40 20 I ntel Reference Component Validation Intel tests reference components both individually and as an assembly on mechanical test boards and assesses performance to the envelopes specified in previous sections by varying boundary conditions While component validation shows that a reference design is tenable for a limited range of conditions customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions Intel reference components are also used in board functional t
66. the environmental condition of interest This anomalous power level is equal to 7596 of the TDP limit Absolute Processor Temperature Intel does not test any third party software that reports absolute processor temperature As such Intel cannot recommend the use of software that claims this capability Since there is part to part variation in the TCC thermal control circuit activation temperature use of software that reports absolute temperature can be misleading See the Intel Xeon Processor 5500 Series Datasheet Volume 1 for details regarding use of 1A32 TEMPERATURE TARGET register to determine the minimum absolute temperature at which the TCC will be activated and PROCHOT will be asserted Thermal Mechanical Design Guide 41 42 Thermal Solutions Thermal Mechanical Design Guide Quality and Reliability Requirements 6 Requirements 6 1 Test Conditions The Test Conditions provided in Table 6 1 address processor heatsink failure Quality and Reliability mechanisms only Test Conditions Qualification and Visual Criteria vary by customer Table 6 1 applies to Intel requirements Socket Test Conditions are provided in the LGA1366 Socket Validation Reports available from socket suppliers listed in Appendix A Table 6 1 Heatsink Test Conditions and Qualification Criteria Sheet 1 of 2 Min Assessment Test Condition Qualification Criteria Sample Size 1 Humidity Non operating 500 hour
67. tion and position of the TTV die The TTV die is sized and positioned similarly to the processor die Figure 5 2 TTV Die Size and Orientation 42 5 PN 19 3 NOT TO SCALE All Dimensions in mm 34 Thermal Mechanical Design Guide intel 5 3 Assembly Figure 5 3 1U Reference Heatsink Assembly 1U Reference Heatsink RR Captive Screw H Thermal I nterface Material Honeywell PCM45F IHS Integrated Heat Spreader Threaded Nut inm Reference Back Plate Unified Back Plate 7 The assembly process for the 1U reference heatsink begins with application of Honeywell PCM45F thermal interface material to improve conduction from the IHS Tape and roll format is recommended Pad size is 35 x 35mm thickness is 0 25mm Next position the heatsink such that the heatsink fins are parallel to system airflow While lowering the heatsink onto the I HS align the four captive screws of the heatsink to the four threaded nuts of the back plate Using a 2 Phillips driver torque the four captive screws to 8 inch pounds This assembly process is designed to produce a static load of 39 51 Ibf for 0 062 0 100 board thickness respectively Honeywell PCM45F is expected to meet the performance targets in Table 5 1 from 30 60 Ibf From Table 4 3 the Heatsink Static Compressive Load of 0 60 Ibf allows for designs that vary from the 1U reference heatsink Example A custome
68. tisfied at the worst case height of the socket Mated partial mutual inductance L NA The inductance on a contact due to any single neighboring contact Maximum mutual capacitance C 1 pF The capacitance between two contacts Socket Average Contact Resistance EOL 15 2 ma The socket average contact resistance target is derived from average of every chain contact resistance for each part used in testing with a chain contact resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the daisy chain The specification listed is at room temperature and has to be satisfied at all time Socket Contact Resistance The resistance of the socket contact solderball and interface resistance to the interposer land Max Individual Contact Resistance EOL 100 mo The specification listed is at room temperature and has to be satisfied at all time Socket Contact Resistance The resistance of the socket contact solderball and interface resistance to the interposer land gaps included Bulk Resistance Increase 3mQo The bulk resistance increase per contact from 24 C to 107 C Dielectric Withstand Voltage 360 Volts RMS Insulation Resistance 800 MO Environmental Requirements Design including materials shall be consistent with the manufacture of units that meet the following environmental reference point
69. ur distributor to obtain the latest specifications and before placing your product order Intel processor numbers are not a measure of performance Processor numbers differentiate features within each processor family not across different processor families See http www intel com products processor_number for details Over time processor numbers will increment based on changes in clock speed cache FSB or other features and increments are not intended to represent proportional or quantitative increases in any particular feature Current roadmap processor number progression is not necessarily representative of future roadmaps See www intel com products processor number for details Intel Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability Intel Turbo Boost Technology performance varies depending on hardware software and overall system configuration Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology For more information see www intel com Intel and the Intel logo are trademarks of Intel Corporation in the U S and other countries Other brands and names may be claimed as the property of others Copyright 2009 Intel Corporation 2 Thermal Mechanical Design Guide Contents 1 I ntrod ction rete e Rr re nk CAE XR AR ERKE samen LAE RUE depleted pUE TES EbnEF KART MEN E Ur CAEDE 9 Ti Referees unirsi
70. wanwwawu meme 28 4 4 Electrical Requirements for LGA1366 Socket csse meme 29 5 1 Boundary Conditions and Performance Targers nmm 31 5 2 Performance Expectations for 25 5 mm Tall Heatsink sss 33 5 3 Fan Speed Control TCONTROL and DTS Relationship ssssssem me 39 5 4 TcoNTROL G ldance ec E N ect Verr e a or rade Umen da Cra ter o bride Pr Kc REPAS EE 39 6 1 Heatsink Test Conditions and Qualification Criterla nuna 43 A 1 Suppliers for the Intel Reference Thermal Solution 47 A 2 Suppliers for the Intel Collaboration Thermal Solution 48 A 3 Suppliers for the Alternative Thermal Solution 48 A 4 LGA1366 Socket and ILM Components 1 49 B L Mechanical Drawing List eiit nth Ia 51 Gel Mechanical Drawing LISE ocho thi Ee ERREUR CURE ARR KR Zeen RR RON GU ERG EXER EXER R RM aaa 79 E 1 Boundary Conditions and Performance Targets 87 E 2 Embedded Heatsink Component Suppliers sss meme 92 E 3 Mechanical Drawings Ust 0 memes e ese eee senes emen nen 92 6 Thermal Mechanical Design Guide Revision History Document Number Revision Number Description Revision Date 321323 001 Public Release March 2009 Thermal Mec
71. ystem shipping and handling The covers are designed to be interchangeable between socket suppliers As indicated in Figure 2 5 a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket Figure 2 5 Pick and Place Cover ILM Installation Pick and Place Cover Thermal Mechanical Design Guide 17 m e intel OE Figure 2 6 2 4 1 18 Package Installation Removal As indicated in Figure 2 6 access is provided to facilitate manual installation and removal of the package To assist in package orientation and alignment with the socket e The package Pin1 triangle and the socket Pin chamfer provide visual reference for proper orientation The package substrate has orientation notches along two opposing edges of the package offset from the centerline The socket has two corresponding orientation posts to physically prevent mis orientation of the package These orientation features also provide initial rough alignment of package to socket The socket has alignment walls at the four corners to provide final alignment of the package See Appendix F for information regarding a tool designed to provide mechanical assistance during processor installation and removal Package Installation Removal Features v YA orientation gt notch Pinl triangle alignment walls access X orientation post Pini chamfer Socket Standoffs and

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