Samsung 2GB, DDR III SDRAM, 1066MHz, CL7
Contents
1. lt gt 131 35 lt gt P 128 95 2 4 00 928 40441885 32 40 4 189 4 9 74 5 Y H 5 I 8 1 30 00 8 2 q 1 0 max 2 50 gt O 1 27 0 10 lt 8 2x 2 10 0 15 lt 5 1 0 80 0 05 j i JE 3 80 0 2 0 15 23 1 50 0 10 1 00 Detail Detail 09 010 011 017 013 014 015 pie E 5 UL d 1 1 DO D1 D2 D3 D8 2 04 05 06 07 A Address Command and Control lin2. 133 35 lt gt 5 I 128 95 9 x lt gt 2 o E d for x64 SPD e gt 4 EJ E II 1 8 Q A Q 4 2 50 E gt e A B 4 00 P 47 00 N 71 00 A O 2 for x64 D ESS C 1 270 0 10 1 lt 8 2x 2 10 0 15 gt s 0 80 0 05 e eu d 3 80 0 2 0 15 ER en T 100 1 500 10 gt lt 1 00 Detail A Detail B December 2008 ELECTRONICS General Information DDR3 SDRAM x64 204pin DDR3 SDRAM Unbuffered SODIMM Units Millimeters 67 60 lt 3 8
3. n j C e E E E 5 e Q 8 O O f 2X 21 80 U 420 10 O OPTIONAL HOLES 2X 4 00 me 0 10 0 60 lt lt 0 45 0 03 Y 4 00 0 10 2 55 1 1 4 1 00 0 10 0 25 MAX Detail A Detail B December 2008 ELECTRONICS General Information DDR3 SDRAM x72 240pin DDR3 SDRAM Registered DIMM 133 35 Units Millimeters
4. 0 80 be 5 OOOOOOQOOOOO 0 35 0 05 78 20 45 Solder ball Post Reflow 20 50 0 05 912 02 1 90 MOLDING AREA 1 10 0 10 VIEW VIEW 9 FBGA for 2Gb B die x16 9 00 0 10 IA 5 A1 INDEX MARK 0 80 1 60 3 60 m 9 00 0 10 q lt n lt 987654321 B N A n o f Datum A B ooo D D E 8 DatumB E P F ooo ooo ooo 3 2 h E A J 8 000 els L ooo 000 5 ooo N 5 ooo kooo ls R 0 28 T i nds Y Y 0 35 0 05 96 20 45 Solder ball Post Reflow 20 50 W lt MOLDING AREA 1 10 0 10 6 2 0 2 A B 1 90 BOTTOM VIEW TOP VIEW December 2008 ELECTRONICS General Information DDR3 SDRAM x64 x72 240pin DDR3 SDRAM Unbuffered DIMM Units Millimeters
5. 1 RCD Identification in JEDEC Description in Module Label 2 Label Example X G AGB2RXAPC3 108XR 09 10 E1 P0 3 RCD Information Example Vendor Revision Module P N JEDEC Description On Label Inphi B2 M393B5170EH1 CH9 4GB 2Rx4 PC3 10600R 09 10 E1 P0 IDT BO M393B5170EH1 CH9 4GB 2Rx4 PC3 10600R 09 10 E1 D2 December 2008 ELECTRONICS General Information DDR3 SDRAM 78 4Ball FBGA for 1Gb D die x4 x8 gt 9 00 0 10 MN 9 0 80 x 10 8 00 5 1 INDEX MARK 5 Datum A 0 80 160 400 4 lt gt E 9 00 0 10 11 109 8 7 6 5 4 3 2 1 B N ooo L 9 B 2 ooo 000 i D ooo ooo ooo OOO B F ooo 3 5 6 4 7 N H H ooo gt 8 J ooo K ooo L M ooo N ooo 0009 1 0 35 0 05 82 20 45 Solder ball 7751099 o Post Reflow 20 05 0 05 4 gt 1 10 0 10 2 0 2 1 90
6. Bottom Top e Support Ball 96 4Ball FBGA for 1Gb D die x16 5 9 00 0 10 M 0 80 x 10 8 00 5 A1 INDEX MARK 1 0 80 160 400 M 9 00 0 10 Y 11 10987654321 i a oococ o Datum A B 000 ooo ooo D DatumB E 665 ooo i 9 5 ooo ooo 8 2 2 H ooo m ooo S B 5 g 5 5 5 J 8 9 L ooo ooo E M ooo ooo N 000 5 R T ooog OSO O Q4 100 20 45 Solder ball 0 95 HOLDING AREA SIE Post Reflow 20 05 0 05 5 1 10 0 10 6 2 0 2 1 90 Bottom Top o Support Ball December 2008 ELECTRONICS General Information 78 Ball FBGA for 1Gb E die x4 x8 DDR3 SDRAM 7 50 0 1 P 50 0 10 NE 0 80 x 8 6 40 A1 INDEX MARK 5 Datum A 80 1 60 3 20 0 m 7 50 0 10 98765432 B N A 2 Cc ooo Datum B 8 OOO OOO 8 o 5 al Halooo 009 8 8 Jjo
7. 3 DIMM 4 SODIMM 3 Data Bits 71 x64 78 x64 91 x72 92 x72 93 x72 204pin Unbuffered SODIMM 240pin Unbuffered DIMM 240pin ECC unbuffered DIMM 240pin VLP Registered DIMM 240pin Registered DIMM A DRAM Component Type B DDR3 SDRAM 1 5V VDD 5 Depth 32 32M 33 32M for 128Mb 512Mb 64 64M 65 64M for 128Mb 512Mb 28 128M 29 128M for 128Mb 512Mb 56 256M 57 256M for 512Mb 2Gb 51 512M 52 512M for 512Mb 2Gb 1G 1K 1G for 2Gb 2G 2K 2G for 2Gb 6 of Banks in comp 4 Interface 7 8Banks amp SSTL 1 5V 7 Bit Organization 0 x4 3 8 4 x16 ELECTRONICS 8 Component Revision M 1stGen A 2nd Gen B 3rd Gen C 4th Gen D 5 E 6th Gen F 7th Gen G 8th Gen 9 Package 2 FBGA Lead free H FBGA Lead free amp Halogen free J FBGA Lead free DDP M FBGA Lead free amp Halogen free DDP 10 PCB Revision 0 None 1 1st Rev 2 2nd Rev 3 3rd Rev 4 4th Rev 11 Temp amp Power C Commercial Temp 0 C 85 amp Normal Power L Commercial Temp 0 C 85 amp Low Power Y Commercial Temp 0 C 85 C amp Low VDD 1 35V 12 Speed F7 DDR3 800 F8 DDR3 1066 H9 DDR3 1333 DDR3 1600 400MHz CL 6 tRCD 6 tRP 6 533MHz CL 7 tRCD 7 tRP 7 667MHz CL 9 tRCD 9 tRP 9 800MHz CL 11 tRCD 11 tRP 11 E Note PC3 6400 DDR3 800 PC3 8500 DDR3 1066 PC3 10600 DDR3 1333 PC3 12800 DDR3
8. 1600 December 2008 General Information DDR3 SDRAM 4 DDR3 SDRAM Module Product Guide 240Pin DDR3 Unbuffered DIMM Comp Internal n Org Density Part Number Speed Composition Version Banks Rank PKG Height Avail Note M378B2873DZ1 F8 H9 128M x8 8pcs 1Gb D die 5 Now 128Mx 64 1GB M378B2873EH1 F8 H9 K0 128M x8 8pcs 1Gb E die Now 1 M391B2873DZ1 F8 H9 128M x8 9pcs 1Gb D die RT Now 128Mx 72 1GB M391B2873EH1 F8 H9 KO 128M x8 9pcs 1Gb E die Now M378B5673DZ1 F8 H9 128M x8 16 1Gb D die accru Now 256Mx 64 2GB 8 30mm M378B5673EH1 9 128M x8 i6pcs 1Gb E die TODA Now M391B5673DZ1 F8 H9 128M x8 18pcs 1Gb D die Now 256Mx 72 2GB 2 M391B5673EH1 F8 H9 K0 128M x8 18 166 E die Now 512Mx 64 4GB M378B5273BH1 F8 H9 256M x8 16 2Gb B die Now 512Mx 72 4GB M391B5273BH1 F8 H9 256M x8 18 5 2Gb B die Now 204Pin DDR3 SODIMM f Internal 1 Org Density Part Number Speed Composition Version Banks Rank PKG Height Avail Note M471B2874DZ1 CF7 F8 H9 64M x16 8 pcs 1Gb D die 2 z Now 128Mx 64 1GB M471B2873EH1 CF7 F8 H9 128M x8 8pcs 1Gb E die 1 HOA Now 78 4 ball M471B5673DZ1 CF7 F8 H9 128M x8 16 pcs 1Gb D di
9. 3 0 2 19 x0 1 K A text mark or K punch press stamp Clip open size December 2008 ELECTRONICS
10. CA Now M393B1G70EM1 7 M x4 36pcs 1Gb E die 4 1009 19 72 868 M393B1K73BH1 CF7 F8 256M x8 36pcs 2Gb B die 4 Now M393B1K70BH1 CF7 F8 H9 512M x4 36pcs 2Gb B die 2 Now 2Gx72 16GB M393B2K70BM1 CF7 F8 x4 36pcs 2Gb B die 4 A 1009 240Pin DDR3 VLP Registered DIMM Org Density Part Number Speed Composition Height Avail Note M392B2873DZ1 CF7 F8 H9 128 x8 9pcs 166 D die Now 128 72 1GB 1 M392B2873EH1 CF7 F8 H9 128 x8 9pcs 166 E die Now M392B5673DZ1 CF7 F8 H9 128M x8 18 1Gb D die 5 Now 2 M392B5673bEH1 CF7 F8 H9 128M x8 18 1Gb E die Now 256 72 2GB 78 4 ball M392B5670DZ1 CF7 F8 H9 256M x4 18 1Gb D die Now 1 392 5670 1 CF7 F8 H9 256M x4 18pcs 166 E die dese Now DDP 8 78 ball M392B5170DJ1 9 4 166 D die id Now DDP 78 ball M392B5170EM1 CFT F8 H9 X4 18 166 1009 512 72 4GB M392B5273BH1 CF7 F8 H9 256M x8 18pcs 2Gb B die 2 Now M392B5270BH1 CF7 F8 H9 512M x4 18pcs 2Gb B die 1 2 Now DDP N 78 ball M392B1K73BM1 CF7 F8 Ao 8 18 266 4 E 1009 19 72 8 M392B1K70BM1 CF7 F8 H9 16 X4 18 2Gb 2 1009 December 2008 ELECTRONICS General Information DDR3 SDRAM 5 RDIMM RCD Information
11. General Information 0083 SDRAM DDR3 SDRAM Product Guide December 2008 Memory Division December 2008 ELECTRONICS General Information DDR3 SDRAM 1 DDR3 SDRAM Component Ordering Information 1 2 3 4 5 6 7 8 9 10 11 SAMSUNG Memory Speed DRAM Temp amp Power DRAM Type Package Type Density Revision Bit Organization Interface Vpp Vppo of Internal Banks 1 SAMSUNG Memory K 7 Interface Vpp Vppo 6 SSTL 1 5V 1 5V 2 4 8 Revision M 1st 3 DRAM Type A 2 Gen B DDR3 SDRAM B 3rd Gen C 4th Gen D 5th Gen 4 Density E 6th Gen 51 512Mb F 7th Gen G 8th Gen 18 1Gb H 9th G 2Gb Us Gen 4G 4Gb 9 Package Type 5 Bit Organization Z T FBGA Lead free H FBGA Halogen free amp Lead free 04 x4 J FBGA Lead free DDP 08 x8 M FBGA Halogen free amp Lead free DDP 16 x16 10 Temp amp Power C Commercial Temp 0 C 85 C amp Normal Power L Commercial Temp 0 C 85 amp Low Power Y Commercial Temp 0 C 85 amp Low VDD 1 35V 6 of Internal Banks 3 4 Banks 11 Speed 4 8 Banks F7 DDR3 800 400MHz CL 6 tRCD 6 tRP 6 5 16 Banks F8 DDR3 1066 533MHz CL 7 tRCD 7 tRP 7 H9 DDR3 1333 K0 DDR3 1600 667MHz CL 9 tRCD 9 tRP 9 800MHz CL 11 tRCD 11 tRP 11 December 2008 ELECTRONICS General Inf
12. e 8 2 FBGA 30mm Now 256Mx 64 2GB M471B5673EH1 CF7 F8 H9 128M x8 16 5 1Gb E die 2 Now 512Mx 64 4GB M471B5273BH1 CF7 F8 H9 256M x8 16pcs 2Gb B die 2 Now December 2008 ELECTRONICS General Information DDR3 SDRAM 240Pin DDR3 Registered DIMM Org Density Part Number Speed Composition Rank PKG Height Avail Note M393B2873DZ1 CF7 F8 H9 128 x8 9pcs 1Gb D die UNE Now 128 72 1GB M393B2873EH1 CF7 F8 H9 128 x8 9pcs 1Gb 1 Now M393B5673DZ1 CF7 F8 H9 128M x8 18pcs 1Gb D die 2 DOA Now M393B5673EH1 CF7 F8 H9 128 x8 18pcs 166 E die 2 Now 256 72 2GB M393B5670DZ1 CF7 F8 H9 256M x4 18pcs 1Gb D die 1 Now M393B5670EH1 CF7 F8 H9 256M x4 i8pcs 166 E die 1 Now M393B5173DZ1 CF7 F8 128M x8 36pcs 1Gb D die 4 icr Now M393B5173EH1 7 128M x8 36pcs 166 E die 8 4 30mm Now 512 72 4GB 78 4 M393B5170DZ1 CF7 F8 H9 256M x4 36pcs 166 D die 2 Now M393B5170EH1 CF7 F8H9 256M x4 36pcs 1Gb 2 Tod Now DDP 78 ball M393B1G70DJ1 CF7 F8 Ao 36pos 166 D die 4
13. es December 2008 ELECTRONICS General Information 0083 SDRAM Registered DIMM Heat Spreader Design 1 FRONT PART Outside 133 15 022 130 45 0 15 0 65 0 2 9 26 29 77 e 31 4 r 2 1 U D i5 9 s 5 g HI iB 1 NI a EN 127 0 12 1 al N 1 3 I d 2 1 4 1 Inside Green Line TIM Attatch Line L 2959 pedestal line J A m D N 80 78 119 29 128 5 lt gt 2 BACK PART Outside E TE Y gt L 3 J i 17 Inside Green Line TIM Attatch Line December 2008 ELECTRONICS General Information DDR3 SDRAM 3 CLIP PART 39 3 0 2 Upper Bending Tilting Gap gt 0 1 0 3 29 77 Z 7 4 DDR3 RDIMM ASS Y View Reference thickness total nominal Mono Package 7 55mm DDP Package 7 71mm With Clip thickness 132 95 133 45 1 27 I 1 05 39
14. oo lt KlOOO OOO M OOO Oo 4 SN E Y Y 0 35 0 05 78 20 45 Solder ball Post Reflow 20 05 0 05 MOLDING AREA 1 10 0 10 e 02 1 90 Bottom Top 96 Ball FBGA for 1Gb E die x16 7 50 0 10 E P z 0 80 x 8 6 40 5 5 80 750 350 A1 INDEX MARK q 9 7654321 B A o i 1 Daum BlOOO k Datum B E 0 5 DOO _ i 5 8 s 2 2 Ds 9 EE S 5 8 0001 OOO 8 g 2 S M OOO OOO OOO PIOOO OOO 8 4 T 99 1 0 36 0 05 96 0 45 Solder ball Post Reflow 20 05 0 05 42 32 MOLDING AREA 1 10 0 10 12 0 2 1 90 ELECTRONICS December 2008 General Information DDR3 SDRAM 78Ball FBGA for 2Gb B die x4 x8 9 00 0 10 gt A 1 INDEX MARK 1 9 00 0 10 Datum 0 80 A 0 10 1 19 Y o 4 1 0 gt 4 80 gt 0 80 12 49 60 11 50 0 10 Datum 11 50 0 10
15. ormation DDR3 SDRAM 2 DDR3 SDRAM Component Product Guide Density Banks Part Number Package amp Power Temp C L amp Speed Org PKG Avail Note K4B1G0446D HC L F7 F8 H9 256M x 4 78 4 ball FBGA T iid K4B1G0846D HC L F7 F8 H9 128M x 8 iod K4B1G1646D HC L F7 F8 H9 64M x 16 uo K4B1G0446E HC L F7 F8 H9 KO 256M x 4 78 bal FBGA Sind Bani 4 160846 HC L F7 F8 H9 K0 128M x 8 T 4 101646 HC L F7 F8 H9 K0 64M x 16 K4B2G0446B HC L F7 F8 H9 512M x 4 78 bal FBGA K4B2G0846B HC L F7 F8 H9 256M x 8 NOM 4 201646 HC L F7 F8 H9 128M x 16 K4B2G0446D MC L F7 F8 H9 512M x 4 78 bal DDP 2Gb D die 8Banks FBGA Now K4B2G0846D MC L F7 F8 H9 256M x 8 200446 MC L F7 F8 H9 512M x 4 78 bal DDP 2Gb E die 8Banks 20709 4 200846 MC L F7 F8 H9 256M x 8 K4B4G0446B MC L F7 F8 H9 18 4 78 bal 406 B die 8Banks FBGA 1Q 09 KAB2G0846B MC L F7 F8 H9 512M x 8 December 2008 ELECTRONICS General Information DDR3 SDRAM 3 DDR3 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 M X X X B X X X X X X X X X X Memory Module DIMM Type Data bits Speed DRAM Component Type Temp amp Power Depth PCB Revision of Banks in Comp amp Interface Package Bit Organization Component Revision 1 Memory Module M 2 DIMM Type
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