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IPAQ H3000 SERIES EXPANSION PACK

1. IHVinstall exe The Device Manager identifies this installation executable as a setup program It is executed when the expansion pack is inserted This application is used for installation but could be used to load specific device drivers registry settings or application files It should also start the appropriate application for the expansion pack It must contain the SDK call PPC_InstallCompleted This enables the Device manager to proceed with processing IHVUninstall exe The Device Manager identifies this executable as the opposite of the installation executable It is copied to the main unit It is called automatically upon expansion pack removal It performs the appropriate notifications to device drivers and applications that are using the expansion pack The application is deleted after execution completes Another good use for this application is to remove any unneeded files or registry settings It must contain the SDK call PPC_UninstallCompleted This enables the device manager to perform some necessary housekeeping Diagnostic exe The Device Manager identifies this executable as the diagnostic or self test application When this application is present the Device Manager enables the Diagnostic button on the expansion pack control panel applet The end user could then start this application by tapping on that button This application is also used to display information that is specific to the expansion pack Ther
2. 5 6 iPAQ H3000 Series Expansion Pack Developer Guide Mechanical Interface 6 Mechanical Interface Overview All functional expansion packs consist of four basic structures including E auniquely curved injection molded plastic base part which enables any expansion pack to physically slide up and onto the back of any main unit HM acommon universal connector soldered to a PCB with absolute dimensions as to the position of the connector and of the thickness of the board but with less criteria as to the board area dimensions see Figure 13 PCB Topside Component Limitation E an unknown volume of new electronics that will at minimum communicate through the PCB and the universal connector E an injection molded plastic top cover part of specified shape at its bottom mating edge but of unspecified volume and shape and possibly with unspecified openings throughout its remainder Figure 12 Main Unit Sliding into an Expansion Pack illustrates the principle of a main unit sliding onto an expansion pack in this case a CompactFlash expansion pack The expansion pack and main unit eventually make electrical connection through their respective universal connector plug and receptacle located near the bottoms of the expansion pack and the main unit respectively FIGURE 12 Main Unit Sliding into an Expansion Pack iPAQ H3000 Series Expansion Pack Developer Guide 6 1 Mechanical Interface FIGURE 13
3. not The 3800 will send this command iPAQ H3000 Series Expansion Pack Developer Guide 4 29 Software Interface 4 30 iPAQ H3000 Series Expansion Pack Developer Guide Battery Power Supply and Charging 5 Battery Power Supply and Charging Overview An expansion pack can obtain power for its electronics from two sources The first one is the main unit through the Vpp pins on the interface The other source is to provide its own power from a built in battery Figure 11 Expansion Pack Power Circuit Block Diagram shows a block diagram of a sample power circuitry and distribution scheme The main unit can provide up to 300 mA peak at a regulated 3 3V to the expansion pack When an expansion pack is first connected to the main unit the expansion pack can only draw approximately 10 mA from the Vpp pins to allow the main unit to identify it Once the main unit asserts OPT_ON an expansion pack can draw the full 300 mA from the main unit If an expansion pack requires more than 300 mA peak or requires a voltage other than 3 3V it should include its own power supply and or battery and charging circuit Upon insertion the expansion pack must use power from the main unit while OPT_ON is low to allow the main unit to identify it Typically an expansion pack uses Vpp to supply power for the critical logic EEPROM and the flash memory Once OPT_ON is high the expansion pack can enable its own power supply circuits for
4. Europe CISPR 22 International IEC 60950 International Agency Acceptance Testing The manufacturer of expansion packs for the Compaq iPAQ H3000 Series is responsible for all agency testing iPAQ H3000 Series Expansion Pack Developer s Guide 8 1 Regulatory Requirements and Approvals 8 2 iPAQ H3000 Series Expansion Pack Developer s Guide Environmental Requirements 9 Environmental Requirements The developer is responsible to assure the expansion pack meets all environmental requirements of the customer Some suggested specifications are listed below Operational Environment Temperature Ranges Operating Temperature Independent of altitude 0 C to 40 C Non Operating Temperature Independent of altitude 30 C to 60 C Humidity Operating non condensing 20 to 80 at 25 C Non Operating 38 7 C maximum wet bulb temperature 5 to 85 Altitude Operating 0 to 15 000 feet 4 572 m Equivalent to 14 7 to 8 29 psia Non Operating 0 to 40 000 feet 12 192 m Equivalent to 14 7 to 4 4 psia Environmentally Safe Materials Any plastic casework and the packaging material shall not contain any ozone depleting chemicals such as CFCs PBDE PBDPE or Halon compounds Toxic Materials Materials which produce toxic effects during service usage or due to component failure shall not be used in the expansion pack construction Cadmium and polychlorinated biphenyls may not be used in any form The use o
5. Software Interface PPC_GET_VDD This function returns current state of VDD to the expansion pack Syntax BOOL PPC_GET_VDD HWND hwnd UINT32 bufout Parameters hWnd in Handle of current window Reserved set it to be NULL bufout out Current state of VDD 0 means VDD is on other means VDD is off Return Value Nonzero indicates success Example DWORD dwState read VDD state PPC GET VDD NULL amp dwState if 0 dwState if powering up do something here else if powering down do something here iPAQ H3000 Series Expansion Pack Developer Guide 4 15 Software Interface PPC_EnableFlashWrite This function enables flash memory for write operations Syntax void PPC_EnableFlashWrite void Parameters None Return Value None Example Here we Enable the write function PPC _EnableFlashWrite Do something here e g write files into flash memory Here we disable the write function PPC DisableFlashWrite 4 16 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface PPC_DisableFlashWrite This function enables flash memory for write operations Syntax void PPC_DisableFlashWrite void Parameters None Return Value None Example Here we Enable the write function PPC _EnableFlashWrite Do something here e g write files into flash memory Here we disable the write function PPC DisableFlashWri
6. data on drivers applications configuration and miscellaneous requirements of the expansion pack This identification process allows the expansion pack to store information drivers and applications on the expansion pack so the main unit does not have to use its memory to store information on a large number of expansion packs It also allows the main unit to remove the drivers and applications from memory when the expansion pack is removed Ideally the software application and drivers to run the expansion pack are on the expansion pack Sequence of Events for Insertion The flow chart in Figure 9 Insertion Flow Chart outlines the insertion sequence of events Starting from a power on detection the system boots and detects whether an expansion pack is installed If an expansion pack is inserted the expansion pack detect signals ODET 2 1 interrupt the processor to notify the system The interrupt routine starts a timer to allow the detect signals to debounce Once the timer times out it checks to verify the detect signals are still active If the signals are inactive the sequence starts over If the detect signals are active the interrupt routine starts a device manager that enables the SPI interface and the Vpp pins on the expansion pack In this state the expansion pack can draw only 10 mA for identification purposes The device manager starts downloading information from the SPI EEPROM on the expansion pack The device manager uses the
7. information from the EEPROM to locate drivers and applications enable interrupts determine memory specifications and type power consumption slot configuration etc The device manager loads the expansion pack drivers and applications based on the information in the EEPROM 3 24 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface Once the device manger identifies the expansion pack it determines if it has enough battery life to fully power on the expansion pack Also data in the memory device gives the option to display a message to allow the user to enable power to the expansion pack or decline and enable it at later time Providing the user interface to enable the expansion pack is optional to each individual design Some expansion packs such as an extended battery or a low power devices may not want to burden the user with the question after an insertion When the device manger enables the expansion pack either automatically or through user interaction the main unit powers the remaining buffers for the entire interface into a high impedance state The OPT_ON signal is asserted and notifies the expansion pack to turn on fully At this point the expansion pack can draw up to 300 mA peak and or enable its own battery and power supply circuitry Afterward the device manager installs the application software and drivers typically stored on the expansion pack to main memory If the user does not want to enable the e
8. low and EBAT_ON driven low eee a MEN Max V_ADP o im i Ml VEBAT aa LU V 3 72 for 3600 and 3700 series 3 5 for 3800 series 4 25 3 72 3 20 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface Table 9 Main Unit Output Drive Characteristics Parameter Comments Symbol Units Output Voltage Ion 2 mA 2 75 Signals A 25 0 D 31 0 Io 2 mA 0 4 Output Voltage Ion 18 mA 2 4 Signals See Note 1 lor 16 mA Output Voltage Ion 1 5 mA 2 3 Signals See Note 3 Iot 10 mA Output Voltage Ion 24 mA Signals See Note 4 lor 24 mA Input Voltage Signals D 31 0 2 0 Input Voltage Signals RDY Vum 2 0 Input Voltage Signals See Note 2 Vin 2 5 Input Voltage Signals Signals SPI_DO VIH VIL Tri state Leakage Current Vou Vpop Vor GND loz Input Leakage Current Vin VoD ViL GND iPAQ H3000 Series Expansion Pack Developer Guide 3 21 Electrical Interface Table 11 Signal Conditioning Requirements See Note 5 Signal Main Unit Expansion Pack ODET 2 1 Pull up to Vpp with 100kQ Connected to GND PCM_IRQ 2 1 Pull up to Vpp with 100kQ Buffered from card socket to main unit CD_SCKT 2 1 Pull up to Vpp with 100kQ CD 2 1 from socket OR d to form CD_SCKT signal INT_OP Pull down to GND with 100kQ Pull down to GND with 100kQ SPI_SCK SPI_DI None Pull down to GND with 100kQ RDY Pull up to Vpp with 100kQ None OPT_ON Pull down to GND with 1
9. signal conditioning requirements for the interface Bus State in Idle Mode The buffers between the processor on the main unit and the electrical components on the expansion pack are tri stated during idle mode All digital logic that connects to the interface should have proper signal conditioning to prevent erroneous logic levels and or excessive power consumption Light pull down or pull up resistors e g 100k are a possible solution to keep the bus in a known state during idle mode Variable Latency I O Mode If an expansion pack utilizes the variable latency I O mode special caution is required due to the fact it can hold the system bus for excessive amounts of time If this occurs it can adversely impact the performance of the main unit A_GND Usage A_GND is the ground associated with the analog audio portion of the main unit It is only connected to expansion packs that use the A_OUTR and A_OUTL signals and should route directly to the analog audio section of the expansion pack It is very important not to couple digital noise into A_GND i e connect A_GND to digital ground If the audio signals are not used by an expansion pack A_GND is not connected Battery Signals The battery signals are primarily designed to support a lithium ion or lithium polymer rechargeable battery in the expansion pack If an expansion pack does not include a battery none of the battery signals V_EBAT V_ADP MCHG_EN BATT_FLT EBAT_ON VS_EBA
10. unit FIGURE 2 Expansion Pack Interface on Main Unit Power Supply Battery Expansion amp Charging Control ack Connection D 31 15 0 D 30 16 or A 25 11 Processor Micro controller A SPI 7 Memory IO Control 4 7 PCMCIA Control Control Logic Main Unit Memory IO Control PCMCIA Control Expansion Pack The main unit can supply up to 300 mA at 3 3V to an expansion pack If an expansion pack requires more than 300 mA peak or requires a voltage other than 3 3V it must include its own battery power supply and or charging circuit The interface includes various pins to control the charging and power supplies between the main unit and expansion pack 3 2 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface The interface also includes audio line out signals A OUTR and A_OUTL from the main unit These signals correspond directly to the audio signals used for the speaker and headphone outputs of the main unit If an expansion pack uses these signals it must amplify them for an expansion pack audio out function and connect the A_GND signal to the analog ground of the expansion pack The following sections in this document and the Intel StrongARM SA 1110 Microprocessor Advanced Developer s Manual provide more details on the interface iPAQ H3000 Series Expansion Pack Developer Guide 3 3 Electr
11. 00kQ Pull down to GND with 100kQ RESET Pull down to GND with 100kQ Pull down to GND with 100kQ optional PCM_WAIT PCM_WP Pull up to Vpp with 100kQ OR gate each signal separately with CD_SCKT PCM_RESET Pull down to GND with 100kQ Buffered to card socket VS_EBAT None Pull up to extended battery with 1 2kQ CEN_ETM Open Collector Pull up to extended battery with 470kQ BATT_FLT Pull up to Vpp with 100kQ Pull up to VDD with 100kQ min EBAT_ON Pull down to GND with 100kQ None MCHG_EN Pull down to GND with 50kQ Pull down to GND with 100kQ Signals include MCS 4 2 MWE MOE RD WR DQM 3 1 0 PSKTSEL PCM_CE 2 1 PCM_REG PCM_OE PCM_WE PCM_IOR PCM_IOW Signals include INT_OP PCM_IRQ 2 1 CD_SCKT 2 1 PCM_WAIT PCM_WP ODET 2 1 BATT_FLT Signals include SPI_CS SPI_SCK SPI_SI and SPI_SO Signals include OPT_ON RESET PCM_RESET Signal conditioning is required only if the expansion pack connects the respective signals 3 22 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface AC Characteristics Table 12 Interface AC Characteristics See Notes 2 amp 3 Parameter Comments lp eee i Units Signal Delay from Signals A 25 0 A 25 0 Processor to Interface Signal Delay from Signals TpPIC ns Processor to Interface See Note 1 amp 2 Signal Delay from Signals D 31 0 TpPID Interface to Processor Signal Delay from Signal RDY Signal RDY Tors Interface
12. 0J3A 4MB M Intel 64Mbit 28F640J3A 8MB M Intel 128Mbit 28F128J3A 16MB E Fujistzu 8Mbit MBM29LV800 BA 1MB BM AMD 8Mbit Am29LV800B 1MB The expansion pack device manager will automatically detect the flash and will setup a storage device called CPQ_DISK of the appropriate size using the fields in the EEPROM The storage device will look like any other storage device The file is readable by default It can be made writable by calling the appropriate API function to enable writes After writing to the file the disable write function API should be called to lock the write access to the file again The expansion pack drivers software etc can be placed in the flash and automatically loaded when an expansion pack is attached to the iPAQ See the following section Specific Applications Used By Device Manager for details iPAQ H3000 Series Expansion Pack Developer Guide 4 25 Software Interface Specific Applications Used By Device Manager To facilitate insertion removal and control panel information The device manager and associated programs look for and use specific applications from the expansion pack flash The following table briefly identifies these applications Table 23 Specific Applications Used by Device Manager Application Description IHVInstall exe Facilitates Expansion Insertion IHVUninstall exe Facilitates Expansion Removal Diagnostic exe Helps end user gather information about expansion pack
13. 1110 includes registers that control the timing of the I O accesses Please refer to the Intel StrongARM 1110 Microprocessor Advanced Developer s Manual for more details and timing diagrams Serial Bus The expansion pack interface includes pins for the Motorola serial peripheral interface SPD for system management and identification The master SPI device is a micro controller It is an Atmel AT90LS4434 on the main unit of a 3600 3700 and an ASIC on the 3800 series that interfaces to a single slave SPI device on the expansion pack The expansion pack interface includes the four standard SPI signals SPI_DI SPI_DO SPI_CS and SPI_SCK The SPI bus is primarily used to identify expansion packs upon insertion via an EEPROM on the expansion pack The EEPROM contains configuration ID control information and optionally contains bootstrap programs and OEM information The SPI bus is used to communicate to the EEPROM on the expansion pack and possibly to a micro controller to get battery status information The communication over the SPI bus is soley to get EEPROM information and to get battery status information if the expansion pack has a battery The A maximum of two devices is allowed on the SPI bus of an expansion pack The SPI_CS signal goes directly to the EEPROM and an inverted version of SPI_CS goes to the other device Figure 6 SPI Directly to EEPROM and Figure 7 Multiple Devices Communicating on SPI Interface show the two possible imple
14. 8 and 16 bit PC cards and handles common memory I O and attribute memory accesses The processor does not support the PCMCIA DMA protocol or CardBus The PCMCIA memory space Figure 5 is divided into eight partitions the four for each card slot are common memory I O attribute memory and a reserved space The expansion pack interface does not include the VS 1 0 Vrp 2 1 BVD 2 1 and INPACK signals If an expansion pack requires these signals it must implement them on the expansion pack The VS 1 0 and Vrr 2 1 signals are used by the expansion pack power supply to control the power supplied to the PCMCIA CF socket s There is no provision on implementing BVD 2 1 or INPACK on the expansion pack due to the lack of support on the processor Embedded inside the PCMCIA interface are the CompactFlash CF signals Similar to the PCMCIA support the CF implementation does not include VS 1 0 and INPACK It also does not support CSEL which is unique to CF Again if an expansion pack requires these signals it must implement them on the expansion pack The buffers between the processor on the main unit and the electrical components on the expansion pack are tri stated during idle mode If buffers are required to isolate a PCMCIA or CF slot from other component on the expansion pack it is recommended that the buffers are disabled when the slot is not accessed to minimize power consumption One possibility is to enable the buffers to the s
15. BATTERY_CHEMISTRY_UNKNOWN e First byte battery s chemistry e Second byte battery s remaining power percentage e Third byte battery flag e Fourth byte battery s current voltage 0x01 0x02 0x03 0x04 0x05 0x06 OxFF The battery s remaining power percentage is districted as 10 20 30 90 100 4 28 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface The following definition is used on battery flag byte define BATTERY_FLAG_HIGH define BATTERY_FLAG_LOW define BATTERY_FLAG_CRITICAL define BATTERY_FLAG_CHARGING define BATTERY_FLAG_CHARGE_MAIN_BAT define BATTERY_NOT_INSTALLED define BATTERY_FLAG_UNKNOWN iPAQ Voltage Level for EBAT_ON of 3 5 allowed Command 0x3 Direction Main Unit gt Option Jacket Data no data 0x01 0x02 0x04 0x08 0x10 0x20 OxFF iPAQ units that can support a EBAT_ON minimum voltage level or 3 5 volts will send this command to the expansion pack This allows the expansion pack to dynamically set the EBAT_ON minimum voltage level to 3 5 volts versus 3 72 volts This command is sent to the expansion pack when the iPAQ expansion pack manager initializes the expansion pack The expansion pack that supports an external battery which supplies power to the iPAQ should use 3 72 volt threshold if the command is not sent and can use 3 5 if the command is sent This allows better external battery usage on some iPAQs The 3100 3600 3700 iPAQs will
16. C_NVM_AddBin NULL nvm_in blobIntrEnableInfo lpb bs nvm_in blobIntrEnableInfo dwCount write contents into NVRAM if PPC_NVM Write NULL amp nvm_in hwndProgress FALSE 4 20 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface ShowDbgString L WRITE ERROR return 0 PPC_NVM_Write This function writes structure pnvm_in into physical EEPROM sometimes referred to as NVRAM It fills the relevant settings in pnvm_in to EEPROM and frees the memory that may be allocated by both functions of PPC_NVM_AddStr and PPC_NVM_AddBin Syntax BOOL PPC_NVM_Write HWND hWnd PVOID pnvm_in HWND hwndProgress Parameters hWnd in Handle of current window Reserved set it to be NULL pnvm_in in Address of structure SSC_NVM to be written hwndProgress in The handle of the progress bar indicates the progress of a lengthy operation by displaying a colored bar inside a horizontal rectangle Set to NULL if it is not needed Driver may update its parent window with standard API UpdateWindow Return Value It returns a nonzero value if the referred struc ture data has been successfully written into physical EEPROM If the operation fails it returns a FALSE Example write contents into NVRAM if PPC_NVM Write NULL PVOID amp nvm in hwnd Progress FALSE ShowDbgString L WRITE ERROR r n return 0 iPAQ H3000 Series Expansion Pack Developer Guide 4 21 Software Interface P
17. IPAQ H3000 SERIES EXPANSION PACK DEVELOPER GUIDE NOTICE The information in this document is subject to change without notice THE INFORMATION IN THIS PUBLICATION IS PROVIDED AS IS WITHOUT WAR RANTY OF ANY KIND THE ENTIRE RISK ARISING OUT OF THE USE OF THIS INFOR MATION REMAINS WITH RECIPIENT IN NO EVENT SHALL COMPAQ BE LIABLE FOR ANY DIRECT CONSEQUENTIAL INCIDENTAL SPECIAL PUNITIVE OR OTHER DAM AGES WHATSOEVER INCLUDING WITHOUT LIMITATION DAMAGES FOR LOSS OF BUSINESS PROFITS BUSINESS INTERRUPTION OR LOSS OF BUSINESS IFORMA TION EVEN IF COMPAQ HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAM AGES AND WHETHER IN AN ACTION OF CONTRACT OR TORT INCLUDING NEGLIGENCE The limited warranties for Compaq products are exclusively set forth in the documentation accompanying such products Nothing herein should be construed as constituting a further or additional warranty This document contains information protected by copyright No part of this document may be photocopied or reproduced in any form without prior written consent from Compaq Computer Corporation 2002 Compaq Computer Corporation Compaq and the Compaq logo Registered in the U S Patent and Trademark Office iPAQ is a trademark of Compaq Information Technologies Group L P Microsoft ActiveSync Outlook Pocket Outlook Expedia AutoRoute Express MapPoint Windows Windows NT and the Win dows logo are either registered trademarks or trademarks of Microsoft Co
18. MCIA Memory Address GND P G Main unit ground A01 PCMCIA Memory Address A00 PCMCIA Memory Address P G Analog GND for audio ONLY RO I VDD P G Main unit 3 3V power P G Positive of AC adapter P G Positive of ext battery 3 8 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface Table 2 Expansion Pack Pin Out SPI_DO is So SPI Data Out from expansion pack NOTE Signal type referenced to expansion pack I Input O Output I O Bidirectional P G Power ground bat tery or charging OC Open Collector The symbol denotes active low signal Detailed Pin Description Table 3 PCMCIA CF Memory Pin Description I AI0 A00 CF mode A00 CF mode Re above PCMCIA CF Memory address pins REMC IAICE Memory addiress pins used id address Gard oi to address card or expansion pack in Memory I O and True IDE A25 All PCMCIA or memory address pins used to access devices PCMCIA Memory mode in the expansion pack These pins are shared with D31 D16 D15 DOO 16 bit mode See above Data pins used for 16 bit accesses in standard CF PCM CIA memory or I O modes D31 D16 32 bit mode I O See above Data pins for special accesses 32 bit read and write accesses in PCMCIA or I O modes These pins are shared with A25 A11 PCM_CE1 PCM_CE2 I 59 12 PCMCIA CF card enable for 8 or 16 bit select in memory and I O mode Functions as CSO and CS1 in IDE mode CD_SCKTO 10 62 PCMCIA CF car
19. PAQ PC ABS MEP MB1700 BK 37 Mechanical Interface Table 27 Part List for a CompactFlash Expansion Pack Part 1 iPAQ PHILLIPS SCREW FLAT PAN 1 Nickel HEAD M2 0X4 B TORX SCREW FLAT HEAD 2 M2 0X2 3 BLACK 14 TORX SCREW FLAT HEAD 2 M2 0X5 5 BLACK 11 PHILLIPS SCREW FLAT PAN 3 Nickel HEAD M2 0X2 5 6 4 iPAQ H3000 Series Expansion Pack Developer Guide Mechanical Interface FIGURE 15 Exploded View Example from a CompactFlash Expansion Pack Part 2 Texture MT11010 Texture MT11006 _ A jon N To gli a TWO SCREWS FOR ITEMS 3 amp 7 11 ONE SCREW FOR ITEMS 1 amp 3 gt e FOR LOCATION PIN ONE SCREW FOR ITEMS 1 amp pu Table 28 Part List for a CompactFlash Expansion Pack Part 2 Item Description Qty Material ia PHILLIPS SCREW 3 Nickel FLAT PAN HEAD M2 0x2 5 12 PHILLIPS SCREW 1 Nickel FLAT PAN HEAD M2 0x4 PAQ H3000 Series Expansion Pack Developer Guide 6 5 Mechanical Interface Additional mechanical design highlights that are noted for development of an expansion pack include M The cosmetic texture surface of the expansion pack plastic turtle shell or cover part the developer s responsibility are specified in the figures above to ensure seamless appearance with the expansion pack s sleeve or base plastic textured part E The PC ABS resin manufacturer and type and color of the expansion pack plastic turtle shell or cover part the develope
20. PCB Topside Component Limitation ENTER DCR HA LAA RAMA Fan A as PCB upside component limitation 1 3 mm eh AS x No GE IAL ES PEZZA E z ei CI E F x E RE SS veli N LY SECTION CENTER CENTER 0 80 Certain constraints of form factor in any future development of expansion packs must also be comprehended and these constraints would include that BM the plastic base part or sleeve of the expansion pack which immediately surrounds the main unit has specified dimensions and close tolerance gap with main unit see the following Note BM the lower rear and bottom portions of the expansion pack base part or sleeve have specified dimensions and Industrial Design so as to preserve a reliable fit when inserted into the iPaq Pocket PC docking cradle and E NO future design of an expansion pack s form factor should allow blockage of i e deny access to those user accessible hardware features around the top of the main unit including the headphone jack FIR port microphone openings record button and stylus However please understand that the total stack up thickness of the expansion pack as measured from the rear surface of the main unit is determined by the requirements of each individual expansion pack Q It is recognized that developers may discover certain complications when i
21. PC_NVM_Read This function reads from physical EEPROM sometimes referred to as NVRAM and fills the data into the structure pnvm_out To avoid a memory leak user must manually free the allocated memory with function PPC_NVM_FreeRead Syntax BOOL PPC_NVM_Read HWND hWnd PVOID pnvm_out HWND hwndProgress Parameters hWnd in Handle of current window Reserved set it to be NULL pnvm_out out Address of structure SSC _NVM that is filled with the data read from physical EEPROM hwndProgress in The handle of the progress bar indicates the progress of a lengthy operation by displaying a colored bar inside a horizontal rectangle Set to NULL if a lengthy operation is not needed Driver may update its parent window with the standard API UpdateWindow Return Value It returns a nonzero value if the referred struc ture data has been successfully read and filled from physical EEPROM If failed at physical read or structure filled it returns a FALSE Example read contents from NVRAM if PPC_NVM_Read NULL PVOID nvm_out hwnd Progress PPC_ShowDbgString L Read success r n do something here release extra allocated memory at last PPC NVM FreeRead NULL PVOID pnvm out 4 22 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface PPC_NVM_FreeRead This function releases the allocated memory by PPC_NVM_Read The developer must call this function when it no longer needs the data that w
22. PU ra Pack Current Speer toma 10 mA Er mA max recom Consumption from Vpp mended The expansion pack should use the power ground and OPT_ON signals to detect whether it is connected to the main unit so it can enable the power supply and other functions on the expansion pack A_GND is the ground associated with the analog audio portion of the main unit It EN is connected only to expansion packs that use the A OUTR and A_OUTL signals and should route directly to the analog audio section of the expansion pack It is very important not to couple digital noise into A_GND i e connect A_GND to digi tal ground If the audio signals are not used by an expansion pack A_GND is not connected Miscellaneous Signals The expansion pack interface also includes other signals to provide insertion removal detection reset and interrupt functions INT_OP is an active high signal that allows the expansion pack to interrupt the processor for various functions such as event notification data transfer etc This signal is pulled down on the main unit Please refer to Section 4 Software Interface for more details on the interrupt service routine and support The RESET signal is a general purpose reset signal from the main unit and is an active high signal RESET is asserted only when an expansion pack is first connected to the main unit Its pulse width and duration are controlled by the EEPROM settings Please refer to Chapter 4 Software Interf
23. T CEN_ETM and CC_ETM should not be connected If an expansion pack uses a different battery technology or does not want to share AC adapter charging with the main unit it should not use any of the charging signals on the interface V_ADP and MCHG_EN If an expansion pack includes a battery special attention to the details provided in other sections to ensure safety Please refer to the reference schematics as a guideline discussed in Chapter 7 Reference Schematics iPAQ H3000 Series Expansion Pack Developer Guide 3 19 Electrical Interface DC Characteristics These tables show various DC characteristics between the main unit and expansion pack Table 7 DC Supply to Expansion Pack Vdd Supply Voltage Operating Peak Current Draw OPT_ON Low by Expansion Pack from Voo pins OPT_ON High E EEE mm Table 8 Battery and Charging Specifications Parameter Comments V_ADP Voltage Total Discharge Current Total Charge Current Extended Battery Capacity Extended Battery Voltage EBAT_ON Trip Point 3600 and 3700 Series EBAT_ON Trip Point 3800 Series Trickle Charge from Option Battery to Main Battery MCHG_EN H and OPT_ON H MCHG_EN L or OPT_ON L Only when expansion pack battery used for extended battery of main unit Only when expansion pack battery used for extended battery of main unit Extended Battery Voltage too low and EBAT_ON driven low Extended Battery Voltage too
24. _Init ULONG Identifier enable the interrupt PPC _ SET INTERRUPT ENABLED NULL TRUE iPAQ H3000 Series Expansion Pack Developer Guide 4 9 Software Interface PPC_SET_INTERRUPT_WAKEUP This function enables the option pack interrupt to wakeup the main unit from a suspense state By default the interrupt will not wake up the main unit Syntax BOOL PPC_SET_INTERRUPT_WAKEUP HWND hwnd BOOL bflag Parameters hWnd in Handle of current window Reserved set it to be NULL bflag in TRUE enables WAKEUP and FALSE dis ables the WAKEUP Return Value Nonzero indicates success Example enable WAKEUP PPC_SET_INTERRUPT_WAKEUP NULL TRUE 4 10 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface PPC_SET_POWER This function sets or resets the state of hardware pin OPT_ON Syntax BOOL PPC_SET_POWER HWND hwnd BOOL bflag Parameters hWnd in Handle of current window Reserved set it to be NULL bflag in Set TRUE to power up the expansion pack through OPT_ON Set others to power down Return Value Nonzero indicates success Example reset OPT_ON to power up the expansion pack PPC_SET_ POWER NULL FALSE PAQ H3000 Series Expansion Pack Developer Guide 4 11 Software Interface PPC_GET_POWER This function returns current state of hardware pin OPT_ON Syntax BOOL PPC_GET_POWER HWND hwnd UINT32 pbuf Parameters hWnd in Handle of current w
25. a buses as PCMCIA CE The static memory and I O control signals differentiate the accesses from PCMCIA CF with chip select signals The chip select signals MCS 4 2 correspond directly to the signals from the processor MCS 4 2 support ROM or flash memory with MCS4 also supporting variable latency I O The data bus is 16 bit maximum for MCS3 memory cycles and 32 bit only for variable latency I O using MCS4 In 16 bit designs address bit 0 A 0 is not used d and in 32 bit designs address bits 1 and 0 A 1 0 are not used The variable latency I O interface differs from static memory in that it allows the use of the data ready input signal RDY to insert a variable number of wait states The variable latency T O interface uses DQM 3 1 0 as byte enables where DQM 3 corresponds to the MSB The iPAQ H3000 Series Expansion Pack Developer Guide 3 13 Electrical Interface variable latency portion of the interface allows the main unit to access slower devices such as micro controllers and DSPs A micro controller on the expansion pack can provide functions such as a UART battery monitoring button control etc Caution is required when using the variable latency I O feature due to the fact it EN can hold the system bus for excessive amounts of time If this occurs it can adversely impact the performance of the main unit Other memory signals MWE and MOE are implemented to complete the static memory and I O interface The SA
26. ace for details on programming the length of RESET A_OUTR and A_OUTL are line out signals from the right and left channels of main unit s audio codec The OPT_ON signal notifies the expansion pack that it can turn on and run at full power When an expansion pack is first inserted OPT_ON is low and the expansion pack should draw a minimal amount of current for identification When the OPT_ON signal is asserted the expansion pack can draw the recommended maximum allowed current from the Vpp pins 3 18 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface The ODET 2 1 signals notify the main unit when an expansion pack is inserted or removed These signals are pulled high 3 3V on the main unit and the expansion pack should tie them low Upon insertion the signals interrupt the processor and the routine goes through the process of identifying the expansion pack through the SPI signals Upon removal the signals go high and again interrupt the processor to notify the system The ODET 2 1 pins on the mating connector are 0 5 mm shorter than normal I O pins and 1 0 mm shorter than the power pins This implementation ensures that the expansion pack is fully inserted before the main unit communicates with the expansion pack Summary of Subtle Electrical Points This section summarizes subtle but critical points to the electrical interface into one section Table 11 Signal Conditioning Requirements also shows
27. active high signal that notifies the main unit that the expansion pack battery has reached its critical low voltage level typically 3 4V The main unit then proceeds to shutdown the expansion pack by forcing OPT_ON inactive low More details are given in Chapter 5 Battery Power Supply and Charging the DC_ Characteristics and the AC Characteristics on the battery and charging signals iPAQ H3000 Series Expansion Pack Developer Guide 3 17 Electrical Interface Power and Ground Signals The interface includes seven ground signals and two 3 3V signals The recommended maximum current an expansion pack can draw from the Vpp pins is 300 mA fan expansion pack requires more than 300 mA peak or requires a voltage other than 3 3V it should include its own power supply and or battery and charging circuit The power and ground pins protrude 0 5 mm farther than the other signals on the main unit connector This provides power and ground to the expansion pack before the other signals make a connection When an expansion pack is first connected to the main unit the expansion pack is recommended to draw no more than 10 mA from the Vpop pins for identification Once the main unit asserts OPT_ON an expansion pack can draw the full 300 mA from the main unit Table 6 Expansion Pack Current consumption shows the maximum peak current consumption for an expansion pack given each state of OPT_ON Table 6 Expansion Pack Current Consumption
28. aining memory following the bootstrap area Table 20 OEM Area Information Field Type Length Description Size of OEM Area DWORD Size of OEM area in bytes Section Terminator DWORD OxOfOfOfOf PAQ H3000 Series Expansion Pack Developer Guide 4 5 Software Interface Other Software considerations In addition this section addresses the Expansion Pack SDK These functions are provided by Compaq to enable the hardware developer to better control the expansion pack and the Device Manager as it relates to the EEPROM expansion pack insertion and insertion pack removal Expansion Pack SDK Compaq is planning an SDK with some functions that will be useful in creating the software for an expansion pack The following functions are provided as a part of the Expansion Pack SDK BOOL PPC_GET_BATT_LEVEL HWND hwnd UINT32 bufout BOOL PPC_GET_TIME_RESETWIDTH_WAITSTABLE HWND hwnd UINT32 pbuf BOOL PPC_SET_INTERRUPT_ENABLED HWND hwnd BOOL bflag BOOL PPC_SET_POWER HWND hwnd BOOL bflag BOOL PPC_GET_POWER HWND hwnd UINT32 pbuf BOOL PPC_REBOOT HWND hwnd BOOL PPC_SET_VDD HWND hwnd BOOL flag BOOL PPC_GET_VDD HWND hwnd UINT32 bufout BOOL PPC_SET_INTERRUPT_WAKEUP HWND hwnd BOOL flat void PPC_EnableFlashWrite void void PPC_DisableFlashWrite void void PPC_DestroyPartitionWhenRegistered void PBYTE PPC_NVM_AddStr HWND hWnd PBYTE pbuf const char strSource PBYTE PPC_NVM_AddBin HWND hWnd PBYTE pbu
29. al 00x0003 Other controller PCMCIA socket driver will handle OPT_ON signal 0x0000 0x0001 PCMCIA driver will con PAQ H3000 Series Expansion Pack Developer Guide 4 3 b 1b 2b 2b 1b 1b 1b 1b 1b 2b 2b 2b 2b 2b b 3 4 5 i 10 11 12 13 14 15 E Software Interface Table 16 ID Information Type II 18 OPT_ON OPT ON contol BYTE Device manager wii handie OPT ON signal manager will handle OPT_ON signal on jacket insertions 0 NO 1 Yes 19 Terminator integer Marks end of ID information Value OxOfOfOf0f Control Information The control information is mandatory The control information identifies the flash area for the driver that provides disk support for it Table 17 Control Information Field Name Type Length Description Start EFE Control ee Oxbb Occurs once per Control Information block Reserved Reserved Reserved imteger S Location integer di li location im start of flash part in expansion pack Used by flash driver Stop Memory Loca integer Ending memory location of flash part tion Control Information 4b Occurs once per Control Information block Terminator Value OxOfOfOfOf Driver Table The driver table information is optional It represents the information needed to start the drivers dynamically It could be stored on the expansion pack as a way to extend the driver table being maintained in the main unit This information is simila
30. am V_ADP oe Power Power gt Expansion Charger gt Pack gt gt De Switch Supply gt Electronics A A V_ADP gt LED eS Y BATT_FLT MCHG_EN _ gt gt gt DE gt i n Microcontroller Switch SPI lt gt and Logic Level Detect _ gt VS_EBAT and Power gt V_EBAT P Switch Expansion _ gt EBAT_ON CEN_ETM lt gt Trickle Pack Batt CC_ETM lt Charger attery VS_EBAT lt Critical Low Detect Flash Memory gt Buffers etc OPT_ON VDD NVRAM SPI lt gt The V_ADP signals are the positive DC voltage from the AC adapter to charge the batteries The V_ADP signals can be sourced from the main unit or the DC jack on the expansion pack since the AC adapter can be plugged into the main unit or the expansion pack When charging is sourced from the synchronizing cradle through the serial connector the main unit passes the charge to the expansion pack through the V_ADP signals The V_ADP signals feed the charger circuit that includes a power transistor and charge regulator such as the MAX846 to control the current to the expansion pack battery The battery charger is designed to charge the lithium polymer battery with constant current and constant voltage charge modes MCHG_EN is a signal from the main unit to notify the exp
31. ansion pack and indicates if further information is needed to start drivers etc There are currently two different types of tables of EEPROM data Type I and Type II The Type II structure was added to support the Compaq Dual Slot Expansion Pack The Type II table is supported in ROM versions 1 69 and higher in the 3600 and 3700 Series and for all ROM versions of the 3800 Series Table 15 ID Information Type I Field Length EC EN IOMA ELA CI 2 Length of data integer 4b b Version Indicator ui sa 2b 2b variable b Time Wait_stable Bootstrap Address OEM Information integer Address b b b lb 2b 2b 2b Used by the ID API to allow for a block read of identification information The number in this field should include ALL information in the EEPROM including the information stored in the OEM area Used to determine the information s format Currently defaulting to 0x01 Unique vendor ID Compaq assigned Unique per vendor Product ID Text description for display to user Zero delimited Time reset pulse held in milliseconds Time to wait after reset for option pack to be stable in milliseconds Address of the Bootstrap in this EEPROM Address of OEM Information in this EEPROM Marks end of ID information Value OxOfOfOfOf Table 16 ID Information Type II Field Nene tn Start of ID Description 4 2 iPAQ H3000 Series Expansion Pack Developer Guide Sof
32. ansion pack is inserted or removed BATT_FLT 57 Active high signal that notifies the main unit that the expansion pack battery is below its critical low level INT_OP Expansion pack general purpose interrupt used for various functions such as FIFO maintenance polling etc V_ADP P G Positive DC voltage from the AC adapter Power can come from the main unit or expansion pack V_EBAT P G Positive battery voltage from the expansion pack to the main unit VS_EBAT O Positive terminal sense line for the extended battery OPT_ON I Notifies the expansion pack that it can run at full power MCHG_EN I Notifies the expansion pack battery charger to limit its current EBAT_ON Notifies the main unit that the extended battery has sufficient energy to run the main unit CC_ETM P G Charge current source from the expansion pack extended battery to trickle charge the main battery CEN_ETM OC Signal from the expansion pack that enables the extended battery to trickle charge the main battery RESET General purpose reset for the expansion pack PSKTSEL I PCMCIA CF socket select pin for expansion packs with two sockets A_OUTR A_OUTL I Line out right and left channels from the main unit audio output TBD Reserved for future use iPAQ H3000 Series Expansion Pack Developer Guide 3 11 Electrical Interface PCMCIA CF Signals The interface includes PCMCIA support for up to two PCMCIA CF sockets or devices This 16 bit interface supports
33. ansion pack that the main battery is charging and the expansion pack must limit its charging current to prevent blowing the fuse in the AC adapter OPT_ON is also typically used by the charging circuit to limit the charge current when OPT_ON is active iPAQ H3000 Series Expansion Pack Developer Guide 5 3 Battery Power Supply and Charging The charging units are designed for lithium ion or lithium polymer batteries so if an option pack uses another battery technology it should not connect the V_ADP or MCHG_EN signals Also if an expansion pack does not want to share AC adapter charging with the main unit it should not connect the V_ADP and MCHG_EN signals The micro controller is used to monitor the battery and charge conditions It is typically used to monitor charge time battery temperature battery voltage and system power requirements to control the charger The micro controller also controls an LED that notifies the user that the battery is being charged by blinking at 1 Hz If the battery is fully charged and the AC adapter is plugged in the LED is turned on The OVP over voltage protection switch monitors the battery and disconnects the expansion pack battery if the battery voltage exceeds the specification If an expansion pack includes a DC jack the developer may choose to use the same one as the main unit The charging circuits are designed for lithium ion or lithium polymer batteries so if an option pack uses another ba
34. as read via the PC_NVM_Read function Syntax BOOL PPC_NVM_FreeRead HWND hWnd PVOID pnvm_ out Parameters hWnd in Handle of current window Reserved set it to be NULL pnvm_out in The address of SSC_NVM that had been stored the read data Driver will release the extra allocated memory for it Return Value It returns a nonzero value if allocated memory successfully released If it failed at releasing the extra allocated memory it returns a FALSE Example Refer to section PPC_NVM_Read Interrupts The following interrupt is generated as a part of the expansion pack implementation It should be defined as SYSINTR_FIRMWARE 12 PAQ H3000 Series Expansion Pack Developer Guide 4 23 Software Interface Interrupts Table 21 Interrupts SYSINT_OPT This is the interrupt signal generated by the expansion pack It is available for application or driver use Signals Table 22 Signal The ODET 2 1 signals are combined to generate an insertion signal OPT_IND when an expansion pack is inserted When this signal is present the lower level drivers will send an OPT_PLUG message to the device manager Opt_Int This corresponds to the INT_OP signal on the interface Opt_Reset This is the reset signal that is sent to the expansion pack The Device Manager will issue a RESET to the expansion pack device The length of RESET is taken from the Reset Time field of the EEPROM For more details please refer to
35. ble different functions on the expansion pack A portion of the address bus A 25 11 is multiplexed with most of the upper bytes of the data bus D 30 16 to provide a 32 bit data bus interface This is available only with memory accesses using MCS4 The 32 bit interface can perform these accesses only with an 11 bit address The 32 bit data bus capability provides faster access for expansion packs that require high data throughput Typically the interface accesses 16 bit data with a 26 bit address bus The expansion pack interface supports two PCMCIA CF devices in the expansion pack If an expansion pack has two PCMCIA or CF devices it must include buffers and control logic to isolate the signals iPAQ H3000 Series Expansion Pack Developer Guide 3 1 Electrical Interface The interface also supports static memory and I O accesses through the separate control signals The control signals include chip selects to access different memory banks on the expansion packs Each memory bank has specific types of cycles that it supports i e flash ROM I O etc Figure 4 Expansion Pack Memory Map shows the different memory banks the main unit can access on the expansion pack The interface also includes an SPI serial bus that provides serial access for functions on the expansion pack such as identification battery monitoring and charge control Each expansion pack must include an SPI EEPROM to identify itself and its features to the main
36. chnology or does not want to share AC adapter charging with the main unit it should not use any of the charging signals on the interface V_ADP and MCHG_EN Please read the following paragraphs Chapter 5 Battery Power Supply and Charging and the DC Characteristics and AC Characteristics carefully for guidelines When using a lithium ion or lithium polymer battery in the expansion pack the battery signals provide the ability to charge the expansion pack battery simultaneously with the main unit battery and optionally extend the battery life of the main unit The batteries in the main unit and the expansion pack are charged from multiple sources The user can charge the batteries from the DC jack on the main unit 3600 or 3700 only the DC jack on the expansion pack if provided or through the synchronizing serial connector on the main unit This allows the main unit and the expansion pack to charge their respective batteries separately or at the same time The V_ADP signals are the positive DC voltage from the AC adapter to charge the batteries The V_ADP signals can be sourced from the main unit or the expansion pack since the AC adapter can be plugged into either one When charging is sourced from the cradle through the serial connector the main unit passes the charge to the expansion pack The charging circuits are designed for lithium ion or lithium polymer batteries so if an expansion pack uses another battery technology it should not
37. connect the V_ADP signals Also if an expansion pack does not want to share AC adapter charging with the main unit it should not connect the V_ADP signals MCHG_EN is an active high signal from the main unit to notify the expansion pack that the main battery is charging and it should limit its charging current to prevent blowing the fuse in the AC adapter Typically the expansion pack should limit its charging current by one third If MCHG_EN is low then the expansion pack can charge its battery at the full charge current Again MCHG_EN is used only with lithium ion or lithium polymer batteries If an expansion pack uses another battery technology or does not use the V_ADP signals it should not connect MCHG_EN The V_EBAT signals are the positive DC voltages from the expansion pack battery to the main unit power supply that provide extended battery life Generally the only case the V_EBAT pins are connected is for an expansion pack that is specifically designed as an extended battery The CC_ETM and CEN_ETM signals provide a mechanism for the expansion pack battery to provide a trickle charge to the main battery It is optional for an expansion pack to implement the trickle charge feature If the feature is not implemented an expansion pack should not connect CC_ETM and CEN_ETM The CC_ETM signal provides trickle charge 3 16 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface from the expansion pack battery to th
38. d UINT32 pbuf Parameters hWnd in Handle of current window Reserved set it to be NULL pbuf out HIWORD Width to reset expansion pack measured in ms LOWORD Time to wait for the hardware to become Stable after reset measured in ms NOTE Set to OxFFFF if you don t need to reset expansion pack or wait until the hardware is stable Return Value Nonzero indicates success iPAQ H3000 Series Expansion Pack Developer Guide 4 7 Software Interface Example DWORD dwWidth if PPC GET TIME RESETWIDTH WAITSTABLE NULL amp dwWidth WORD wRwidth wWwidth ShowDbg String L PPC GET TIME RESETWIDTH WAITSTABLE OK r n wRwidth dwWidth gt gt 16 amp Oxffff wWwidth dwWidth amp Oxffff ShowDbgString L reset width d wait stable d r n wRwidth wWwidth 4 8 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface PPC_SET_INTERRUPT_ENABLED This function sets the interrupt enabled bit for expansion pack in the HAL layer When the expansion pack is designed to interrupt the main unit for event handling this function is used to enable the interrupt By default the interrupt is disabled Syntax BOOL PPC_SET_INTERRUPT_ENABLED HWND hwnd BOOL bflag Parameters hWnd in Handle of current window Reserved set it to be NULL bflag in TRUE enables the interrupt and FALSE disables the interrupt Return Value Nonzero indicates success Example HANDLE XXX
39. d detects pins for devices slots O and 1 CD_SCKT1 CD_SCKTO represents logical OR of CD1 and CD2 of PCMCIA CF pins for device slot 0 PCM_IORD I 13 PCMCIA CF pin used in I O and IDE modes as a read strobe PCM_IOWR PCMCIA CF pin used in I O and IDE modes as a write strobe PCM_OE ade PCMCIA CF pin used as an output enable strobe PCM_IRQ 0 PCM_IRQ 1 58 63 PCMCIA CF pins used in memory mode to determine the card status for transfers Used as an interrupt signal in I O and IDE modes IRQ 0 is for device slot 0 RESET Li Ppewciacresipin PCM_REG PCMCIA CF pin used to distinguish between common and register memory in memory mode PCM_WAIT PCMCIA CF pin to insert wait states in memory and I O mode Used as JORDY in True IDE mode If there are two sockets in an expansion pack the expansion pack must logically OR the WAIT signals from each socket PCM_WE I 61 PCMCIA CF pin used for write strobing into the CF card in memory and I O modes iPAQ H3000 Series Expansion Pack Developer Guide 3 9 Electrical Interface Table 3 PCMCIA CF Memory Pin Description I PeMWwP_ WP POMCIAIGE pin used as Awite PORGE in memory mode pin used as a write protect in memory mode Used as IOIS16 in I O and IDE modes for 16 bit opera tion If there are two sockets in an expansion pack the expansion pack must logically OR the WP IOIS16 sig nals from each socket Ready signal for slow expansion pack devices to insert wait states o
40. d of dynamic operation EEPROM Data Structure After an expansion pack is inserted the device manager interrogates the expansion pack to identify its features This occurs over the SPI bus to an EEPROM on the expansion pack that contains data on drivers applications configuration and requirements of the expansion pack Every expansion pack is required to have EEPROM on the SPI bus for identification The first version of software only supports 256 bytes or less of EEPROM The following table shows the data structure in the EEPROM Table 14 EEPROM Data Structure Expansion Pack Information Description ID Information Mandatory information that identifies the expansion pack Control Information Mandatory information that identifies where the flash mem ory is located Driver Table Used to identify the drivers that might not have been present in the original unit Configuration Specific configuration information on the option such as power consumption battery capacity etc Bootstrap Program If needed an OEM may store a bootstrap program in this region Optional OEM Information This is a free form area It is the OEM s responsibility to lay out this area It could be used to store software keys expan sion pack parameters etc iPAQ H3000 Series Expansion Pack Developer Guide 4 1 Software Interface ID Information The ID information is mandatory for all expansion packs This information is used to identify the exp
41. e are no specific requirements for this application Compaq recommends that the application be compliant with the guidelines for Windows CE logo certification 4 26 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface Expansion Pack SPI Protocol Protocol between Main Unit and Expansion Pack for Battery Status Information over SPI Table 24 Protocol Format STX Command amp Data Stream CHKSUM Length 1 byte 1 byte variable 1 byte length STX ASCII OxA1 Length LSB 4 bits Data Stream defined by each command CHKSUM Bytes summation of Command amp Length and Data Stream Limitation Support only 16 commands type Data length range in 0 to 15 iPAQ H3000 Series Expansion Pack Developer Guide 4 27 Software Interface Functional description Support functions such as Version ID and Battery Status Command Direction Data Version ID Request 0x1 Main Unit gt Option Jacket no data Version ID 0x1 Option Jacket gt 3 bytes data Main Unit stand for x xx Battery Status 0x2 Main Unit gt no data Request Option Jacket Battery Status 0x2 Option Jacket gt 4 bytes data Report Main Unit The following definition is used on battery chemistry byte define BATTERY_CHEMISTRY_ALKALINE define BATTERY_CHEMISTRY_NICD define BATTERY_CHEMISTRY_NIMH define BATTERY_CHEMISTRY_LION define BATTERY_CHEMISTRY_LIPOLY define BATTERY_NOT_INSTALLED define
42. e main battery The CEN_ETM is an active high open collector signal that enables the trickle charge from the expansion pack battery to the main battery The expansion pack must pull this signal up to the extended battery voltage through a resistor 220kQ to 470kQ The expansion pack should pull CEN_ETM low when the AC adapter is plugged in or when the expansion pack battery charge is too low A current limiter such as MAX890L or MAX893L must exist on the expansion pack between its battery and the CC_ETM pin to limit the trickle charge VS_EBAT is the positive terminal sense line for the battery in the expansion pack The main unit uses it to determine if it should trickle charge the main battery with the extended battery If VS_EBAT has a higher voltage than the main battery CEN_ETM is driven by the expansion pack to determine if the trickle charge is provided If VS_EBAT has a lower voltage than the main battery the main unit pulls CEN_ETM open collector low and disables the trickle charge EBAT_ON is an active high signal driven by the expansion pack to notify the main unit that the expansion pack battery has sufficient charge to power the main unit The expansion pack battery voltage should be greater than 3 72V on the 3600 and 3700 series and greater than 3 5 V on the 3800 series before EBAT_ON is driven true It is only connected when the expansion pack battery is designed to provide extended battery life to the main unit BATT_FLT is an
43. f const char strSource UINT32 size BOOL PPC_NVM_Write HWND hWnd PVOID pnvm_in HWND hwndProgress BOOL PPC_NVM_Read HWND hWnd PVOID pnvm_out HWND hwndProgress BOOL PPC_NVM_FreeRead HWND hWnd PVOID pv PPC_GET_BATT_LEVEL This function reports remaining charge for the main and extended battery as a percentage range from 0 to 100 in increments of 10 It reports BATTERY_PERCENTAGE_ UNKNOWN if the percentage of battery life is unknown Syntax BOOL PPC_GET_BATT_LEVEL HWND hwnd UINT32 bufout Parameters hWnd in Handle of current window Reserved set it to be NULL bufout out 4 6 PAQ H3000 Series Expansion Pack Developer Guide Software Interface HIWORD Reserved LOWORD HIBYTE Percentage remaining of the main battery charge LOBYTE Percentage remaining of the extended bat tery charge Return Value Nonzero indicates success Example DWORD dwResult Read percentage of full battery charge remaining if PPC GET BATT LEVEL NULL amp dwResult ShowDbgString L PPC GET BATT LEVEL success r n ShowDbgString L Main d Extended d r n dwResult gt gt 8 amp Oxf f dwResult amp Oxff PPC_GET_TIME_RESETWIDTH_WAITSTABLE This function provides the width of the RESET signal This data is provided in the EEPROM The Device Manager only resets the expansion pack the first time it is inserted Syntax BOOL PPC_GET_TIME_RESETWIDTH_WAITSTABLE HWND hwn
44. f beryllium is only allowed in semi conductors and shall not be exposed upon failure iPAQ H3000 Series Expanison Pack Developer Guide 9 1 Environmental Requirements 9 2 iPAQ H3000 Series Expanison Pack Developer Guide
45. ical Interface FIGURE 3 Expansion Pack Interface on Expansion Pack possible implementation Expansion Power Supply Connection Battery amp Charging Control Battery Monitor amp A 25 0 Control Flash or ROM D 15 0 Memory A 25 0 Memory Control 1 0 or DSP MARL f l Device Buttons etc EEPROM SPI i gt To other devices A 25 0 SO_A 25 0 CF PCMCIA Slot PCMCIA Control Socket 0 st pris CF PCMCIA Slot Buffer Control Control Logic 3 4 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface FIGURE 4 Expansion Pack Memory Map o Reserved 896MB 0h CODO 0000 DRAM Bank 0 128MB Oh 4800 0000 Reserved 1920MB Oh 4000 0000 Static Bank 4 128MB mesa CF PCMCIA Socket 1 256MB CF PCMCIA Socket 0 pene Oh 2000 0000 256M B 0h 1800 0000 Static Bank 3 128MB debian Static Bank 2 128MB mesas Oh 0800 0000 Reserved 128MB Ox 0000 0000 System ROM 128MB Signals and Descriptions The following table defines the signal names and pin out for the electrical interface between the main unit and any expansion pack Table 2 Expansion Pack Pin Out Pink Name Type Description CC_ETM Trickle charge current pin DE e SOI ECC e or CI CEIC PAQ H3000 Series Expansion Pack Developer Guide 3 5 Electrical Interface Table 2 Expansion Pack Pin Out GP reset for expan
46. indow Reserved set it to be NULL pbuf out Current state of OPT_ON 0 means expansion pack is powering up other mean it s powering down Return Value Nonzero indicates success Example DWORD dwState read OPT_ON state PPC_GET POWER NULL amp dwState if 0 dwState if powering up do something here else if powering down do something here 4 12 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface PPC_REBOOT This function provides an interface to reboot the main device by software Syntax BOOL PPC_REBOOT HWND hwnd Parameters hWnd in Handle of current window Reserved set it to be NULL Return Value Nonzero indicates success Example Switch LOWORD wParam case IDC BTN RESET if button clicked if BN CLICKED HIWORD wParam PPC_REBOOT NULL reboot main device return TRUE iPAQ H3000 Series Expansion Pack Developer Guide 4 13 Software Interface PPC_SET_VDD This function turns on or off VDD to the expansion pack Syntax BOOL PPC_SET_VDD HWND hwnd BOOL bflag Parameters hWnd in Handle of current window Reserved set it to be NULL bflag in Set TRUE to turn on VDD to the expan Sion pack Set FALSE to turn off VDD Return Value Nonzero indicates success Example Turn on VDD to expansion pack PPC SET VDD NULL TRUE 4 14 iPAQ H3000 Series Expansion Pack Developer Guide
47. k that wraps around the main unit is called a sleeve or base part The plastic portion of the expansion pack that protrudes from the back is called a turtle shell or cover part 2 2 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface 3 Electrical Interface Overview The 100 pin electrical connection between the main unit and the expansion pack includes pins for two PCMCIA CF devices a 16 32 bit static memory I O interface battery expansion an SPI serial bus and other miscellaneous functions The interface leverages the capability of the processor in the main unit Figure 2 Expansion Pack Interface on Main Unit and Figure 3 Expansion Pack Interface on Expansion Pack show block diagrams of the interface on the main unit and a possible implementation of an expansion pack respectively The address data and control signals from the processor are connected to the expansion pack through isolation buffers The isolation buffers are tri stated when the system is in idle mode or not accessing the expansion pack It is recommended that the expansion pack handle the tri stating bus without excessive current draw one recommendation is to include light pull down or pull up resistors on the signals The address bus A 25 0 and data bus D 31 0 are used for parallel interfacing to PCMCIA CF static memory and I O devices The various control signals for PCMICA CE static memory and I O ena
48. lot with the PCM_CE 2 1 from the processor and the CD 2 1 signals from the PCMCIA or CF slot 3 12 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface FIGURE 5 PCMCIA Memory Space Socket 1 Memory Space 0h3C00 0000 Socket 1 Attribute Space 0h3800 0000 Reserved 0h3400 0000 Socket 1 I O Space 0h3000 0000 0h2C00 0000 Socket 0 Attribute Space Reserved 0h2800 0000 Socket 0 Memory Space 0h2400 0000 Socket 0 I O Space 0h2000 0000 If an expansion pack includes more than one PCMCIA or CF socket additional logic is required on the expansion pack for certain signals please refer to the Intel StrongARM 1110 Microprocessor Advanced Developer s Manual The signals PCM_WAIT and PCM_WP are outputs from each PCMCIA CF socket and are logically connected to form one signal for the expansion pack interface In similar fashion the CD 2 1 signals from each socket are logically connected to form one CD signal CD_SCKTO and CD_SCKT1 for each socket on the expansion pack interface The interface includes the PSKTSEL signal from the processor to determine which PCMCIA CF socket is accessed All programming registers and other information about the PCMCIA CF interface are found in the Intel StrongARM 1110 Microprocessor Advanced Developer s Manual Memory and I O Signals The expansion pack interface includes a static memory and I O interface that uses the same address and dat
49. m _in ssc nvm id info strTextDesc PPC_NVM_AddStr NULL nvm _in ssc nvm id info strTextDesc Compaq PC Card Expansion write contents into NVRAM if PPC_NVM Write NULL amp nvm_in hwndProgress FALSE ShowDbgString L WRITE ERROR return 0 iPAQ H3000 Series Expansion Pack Developer Guide 4 19 Software Interface PPC_NVM_AddBin This function provides an entry to add a binary data into a BLOB type of variable into EEPROM sometimes referred to as NVRAM structure It allocates a memory block to store the source binary data and returns the address Syntax PBYTE PPC_NVM_AddBin HWND hWnd PBYTE pbuf const char strSource UINT32 size Parameters hWnd in Handle of current window Reserved set it to be NULL pbuf out Destination to be stored the binary data It should always be the field of the EEPROM structure which has the CEBLOB type strSourcelin Address of a source binary data which will be filled into EEPROM structure with Sizelin Specifies the size in bytes of the BLOB It also means the memory size that will be allocated for pbuf Return Value Return NULL if function failed e g insufficient memory It returns the start address of allocated memory block which is the same as destination address i e pbuf Example fake binary data char bs 0x0 0x1 0x2 0x3 0x4 0x5 nvm_in blobIntrEnableInfo dwCount sizeof Binl sizeof char nvm_in blobIntrEnableInfo lpb PP
50. mentations of the SPI interface on the expansion pack The Software Interface Chapter 4 portion of this specification provides more details on the EEPROM contents communication over the SPI bus and the protocol to get battery status information 3 14 PAQ H3000 Series Expansion Pack Developer Guide Electrical Interface FIGURE 6 SPI Directly to EEPROM Processor UART Atmel Serial Port 1 AT90LS8535 SPI EEPROM Processor gt Atmel Serial AT90LS8535 Port 1 Main Unit Expansion Pack Expansion Pack Interface FIGURE 7 Communicating on SPI Interface to EEPROM and Battery EEPROM SPI DI DO CLK Microcontroller Main Unit Information Expansion Pack Interface SPI_CS DO i Buttons Other Functions etc Battery P S Charger etc Expansion Pack iPAQ H3000 Series Expansion Pack Developer Guide 3 15 Electrical Interface Battery Signals The battery signals are primarily designed to support a lithium ion or lithium polymer rechargeable battery in the expansion pack If an expansion pack does not include a battery it should not connect the folloiwng battery signals V_EBAT V_ADP MCHG_EN EBAT_ON VS_EBAT CEN_ETM E CC_ETM The BATT_FLT signal however should be pulled down If an expansion pack uses a different battery te
51. n the variable latency I O port RD WR Read Write pin for the variable latency I O port MCS2 I 42 Memory bank chip select from the processor to use address and data pins for memory or I O cycles 16 bit data cycles only MCS4 I 94 Memory bank chip select from the processor to use address and data pins for memory or I O cycles 32 bit data cycles only DQM 3 1 0 I 53 56 54 Byte enables for the 32 bit data bus of the static memory and variable latency I O port MOE I 44 Memory bank output enable from the processor to use address and data pins for high bandwidth across the expan sion pack MWE I 43 Memory bank write enable from the processor to use address and data pins for high bandwidth across the expan sion pack Table 4 Serial Bus Interface Pin Description SPI_SCK EI EA A E Clock pin for the SPI interface Data input for the SPI interface The pin is driven by the main unit for data written to the expansion pack SPI_DO Data output pin for the SPI interface the pin is driven by the expansion pack for data written to the main unit sPLes CS Po spLes 1 4 Chip select pin for the SPI interface Chip select pin Chip select pin for the SPT interface the SPI interface 3 10 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface Table 5 Miscellaneous Signal Pin Descriptions ODET1 ODET2 Expansion pack detect signals These signals generate an interrupt when the exp
52. nactive 3 26 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface FIGURE 10 Removal Flow Chart Start from insertion flow chart Detect Signals Inactive Disable Control Buffers via HW Stop Application Debounce timer for detect signals Detect Signals Inactive Remove Application Go to Expansion Pack Insertion Flow Chart iPAQ H3000 Series Expansion Pack Developer Guide 3 27 Electrical Interface 3 28 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface 4 Software Interface Overview Upon insertion of an expansion pack a device manager type driver on the main unit interrogates the expansion pack and starts the appropriate drivers The drivers and application software are ideally stored on the expansion pack in ROM or flash memory The drivers are responsible for communicating with the various pieces of hardware available on the expansion pack The device manager is NOT involved in any of the interactions between the device drivers and the devices on the expansion packs The mechanism to load the device drivers is dynamic and dependent on the expansion pack This requires that the device manager is more data driven The device manager loads the appropriate drivers based on the available information on the expansion pack identification EEPROM The next sections describe some of the key data elements that are needed to facilitate this kin
53. ntel Corporation Microprocessor Advanced http developer intel com design strong manuals Developer s Manual CF and CompactFlash Speci http www compactflash org fication Revision 1 4 PC Card Standard http www pc card com Revision 2 1 Microsoft OEM Adaptation Kit Programming Windows CE Douglas Boling Essential Windows CE Robert Burdick Application Programming Software Tools Needed BM Microsoft Embedded Tools BM Microsoft Pocket PC 2002 SDK E Development Machine including A Pentium II processor 1 Windows NT SP5 Windows 2000 or Windows XP I CD ROM drive PAQ H3000 Series Expansion Pack Developer Guide 2 1 Reference Documents Definition of Terms This document describes Compaq s iPAQ H3000 series of products and expansion pack options The term main unit refers to the iPAQ H3000 series product This document describes the batteries in the main unit and the expansion pack The term main battery refers to the battery in the main unit The term extended battery refers to the battery in the expansion pack In some parts of the text the terms EEPROM and NVRAM are used interchangeably Although technically not the same type of IC both terms refer to the EEPROM on the SPI bus of the expansion pack The expansion pack connectors that electrically mate the main unit and the expansion pack are sometimes referred to as universal connectors The plastic portion of the expansion pac
54. nterfacing their designs with the unusual shape and the close mating tolerances of the expansion pack s plastic base part or sleeve Therefore it is possible to procure sample and production volumes of certain common parts from the original vendors Nevertheless the injection molded cover part or turtle shell is the responsibility of the developer of the new expansion pack 6 2 iPAQ H3000 Series Expansion Pack Developer Guide Mechanical Interface Figure 14 Exploded View Example from a CompactFlash Expansion Pack Part 1 and Figure 15 Exploded View Example from a CompactFlash Expansion Pack Part 2 show exploded views of an expansion pack using the example of a CompactFlash expansion pack These figures are intended to only provide a general understanding of how the mechanical structures fit together They are not intended for actual mechanical design FIGURE 14 Exploded View Example of a CompactFlash Expansion Pack Part 1 Texture MT11006 13 TWO SCREWS FOR ITEMS 1 amp 2 Table 27 Part List for a CompactFlash Expansion Pack Part 1 Description Qty Material OPTION PACK BASE iPAQ PC ABS MEP MB1700 BK 37 OPTION PACK COVER iPAQ PC ABS MEP MB1700 BK 37 3 PCB ASSY CF CARD iPAQ 1 PCB THICKNESS 0 8 mm Example only LOCK BUTTON SPRING iPAQ PC ABS MEP MB1700 BK 37 UNIVERSAL CONNECTOR 1 Foxcon QL11503 C608 OPTION PACK iPAQ iPAQ H3000 Series Expansion Pack Developer Guide 6 3 LOCK BUTTON i
55. pansion Pack Developer Guide 1 1 Overview FIGURE 1 Main Unit Sliding into an Expansion Pack The intent of this document is to provide technical guidelines for all expansion packs to result in a consistent and compatible interface to the end user It is not the intent of this document to dictate all possible specifications and requirements Specifications are given throughout the document but some are omitted to allow flexibility for each expansion pack Symbols and Conventions Some or all of the following format conventions may be used in this guide to distinguish elements of text e Names of menus commands and icons are shown in bold type as they appear on the display for example Settings Power Text set off in this manner indicates that failure to follow directions could result in AN bodily harm or loss of life Text set off in this manner indicates that failure to follow directions could result in NM damage to equipment or loss of information NOTE Text set off in this manner presents commentary sidelights or interesting points of information 1 2 PAQ H3000 Series Expansion Pack Developer Guide Reference Documents 2 Reference Documents Order of Precedence In the event of a conflict between this specification and references cited herein this specification shall take precedence Reference Materials Table 1 Reference Materials Reference Title Location Author Intel StrongARM SA 1110 I
56. r s responsibility is specified in the figures above to ensure seamless cosmetic and material appearance with the expansion pack s sleeve or base plastic part M The format for all mechanical drawings is Pro Engineer Version 20 The drawings are available at http csa compag com CSA For iPAQ Developers shtml E Itis possible to procure the following components from the original vendors Expansion Pack Sleeve Plastic resin PC ABS MEP MB 1700 BK 37 Expansion Pack Connector or Universal Connector Lock Button Lock Button Spring Ooccuocoo Expansion Pack Connector plastic support part 6 6 iPAQ H3000 Series Expansion Pack Developer Guide Mechanical Interface Interface Universal Connector The interface between the expansion pack and the main unit is a 100 pin plug receptacle connection with the plug connector on the main unit and the receptacle connector on the expansion packs The connectors mate 180 from each Each connector solders to the respective PCB with a mixture of through hole and surface mount pins on a 0 8mm pitch See the following figure for a view of the two connectors fully mated Some of the pins on each connector protrude out at different lengths to ensure certain events happen sequentially Table 29 Interface Universal Connector shows the various lengths for each of the plugs and receptacles on the connectors Table 29 Interface Universal Connector Plug Distance Receptacle Di
57. r Supply 0 0 0 cee cece cece eee eee nee 5 2 Battery Charger Implementation 5 3 Extended Battery Implementation 0 cece eee eee eee 5 4 Mechanical Interface QOVELVIEW ile eo pe aaa o br dana 6 1 Contents 3 Contents Interface Universal Connector Reference Schematics Regulatory Requirements and Approvals Suggested Agency Approvals 002000 Agency Acceptance Testing 000008 Environmental Requirements Operational Environment Environmentally Safe Materials Toxic Materials Contents Overview 1 Overview Welcome This document describes the technical requirements for expansion packs on the Compaq iPAQ H3000 Series Pocket PCs The expansion pack includes an interface to the main unit Possible expansion packs include wireless communication extended battery life high end audio playback PCMCIA CF interface GPS video recorder and many non functional expansion packs to personalize the main unit Figure 1 Main Unit Sliding into an Expansion Pack illustrates the principle of a main unit sliding onto an expansion pack in this case a CompactFlash expansion pack The expansion pack and main unit eventually make electrical connection through their respective universal connector plug and receptical located near the bottoms of the expansion pack and the main unit respectively iPAQ H3000 Series Ex
58. r to the information stored in the registry This is a list of the drivers that can be found in the expansion pack flash Multiple drivers are allowed in this section Only the drivers that are included in the Control information that are loaded from the expansion pack flash are included The Vendor ID and Driver ID can be combined to create a unique key for the Device manager to use when looking up the driver Table 18 Driver Information aa Vendor ID gi gi cc Vendor identifier Oxffffffff means the end of driver table 4 4 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface Table 18 Driver Information Field 4 Name Type Length Description Display Name Display name of driver Identifies the prefix for the Stream interface i e COM ICO EEC ECC I CN Section Terminator 4b Occurs once per Driver Table block Value OxOfOfOfOf Bootstrap Program This is a binary program in an exe format to bootstrap expansion packs that do not have a dedicated ROM memory bank It is copied into the main unit s file system for execution While resident drivers may be started it is assumed that the bootstrap program is responsible for loading and starting the necessary drivers and applications Table 19 Bootstrap Program Information i OEM Area The OEM area is an optional field Some examples include part numbers serial numbers revision history manufacturing date etc The field contains all rem
59. rporation in the United States and or other countries Intel and StrongARM are trademarks of Intel Corporation Microsoft products are licensed to OEMs by Microsoft Licensing Inc a wholly owned subsid iary of Microsoft Corporation All other product names mentioned herein are may be trademarks and or registered trademarks of their respective companies iPAQ H3000 Series Expansion Pack Developer Guide iPAQ H3000 Series Pocket PCs Third Edition 5 16 2002 213235 003 TABLE OF CONTENTS Overview Welcome 2a il OX hee tad doi hd dd ee oh 1 1 Symbols and Conventions LL 1 2 Reference Documents Order of Precedence cid hearth see aA unary Bear a alae gies OT Ae rection Sata on hea A 2 1 Reference Materials sica a A Winnie BSW a AL aS ac abate 2 1 Software Tools Need dl ib ic ie pla a elias bic 2 1 Definition Of TETAS A TA eo AN ata eel AAA e eee atk aed 2 2 Electrical Interface OVERVIEW decina ela oleole ea eat 3 1 Signals and Descriptions LL 3 5 Detailed Pin Description 3 9 Summary of Subtle Electrical Points 0 0 cece eee eee 3 19 DE Characteristics prfta til ds Wack wk ha wh as Nice Re ala 3 20 AC Characters is iaia dea e ecc 3 23 Insertion REmOVall tii ii AA A a Sta GRR ia we 3 24 Software Interface OVErView Lot eri era A A tt at 4 1 EEPROM Data Structure 4 1 Other Software considerations o o ooo ooo ooooooo eee 4 6 Battery Power Supply and Charging A A A AT de ii 5 1 Battery and Powe
60. sconnects the expansion pack battery from the power supply and the AC adapter supplies the power to the power supply If the AC adapter is not plugged in and the battery has sufficient charge the power switch enables the battery to supply the power The critical low detect circuit monitors the voltage level of the battery to verify it does not go below the critical voltage level specified by the battery typically 3 4V This circuit also generates the BATT_FLT signal to notify the main unit if the battery has reached this point The power switch is controlled by OPT_ON which enables the expansion pack to run at full power If OPT_ON is inactive the power switch is disabled and no power is supplied to the expansion pack power supply The micro controller monitors the battery voltage temperature and charging It typically includes A D converters to monitor the battery parameters and communicates to the main unit through the SPI bus Battery status can be displayed on the main unit via the SPI bus and APIs provided in the Software Interface section Chapter 4 5 2 iPAQ H3000 Series Expansion Pack Developer Guide Battery Power Supply and Charging Battery Charger Implementation Figure 11 also includes a block diagram of the charging circuit The signals V_ADP and MCHG_EN signals provide the ability to charge the expansion pack battery simultaneously with the main unit battery FIGURE 11 Expansion Pack Power Circuit Block Diagr
61. sion pack D11 I O PCMCIA Memory Data D12 T O PCMCIA Memory Data D13 T O PCMCIA Memory Data D14 PCMCIA Memory Data D15 PCMCIA Memory Data PCM Mem Address Data GND Main unit ground PCM Mem Address Data PCM Mem Address Data PCM Mem Address Data PCM Mem Address Data PCM Mem Address Data PCM Mem Address Data PCM Mem Address Data PCM Mem Address Data D08 PCMCIA Memory Data GND Main unit ground PCMCIA Memory Data PCMCIA Memory Data PCMCIA Memory Data PCMCIA Memory Data 3 6 iPAQ H3000 Series Expansion Pack Developer Guide Electrical Interface Table 2 Expansion Pack Pin Out recware 6 renna GND P G Main unit ground P G Positive of AC adapter P G Positive of ext battery RT I IENNNNS VDD P G Main unit 3 3V power D03 T O PCMCIA Memory Data D04 T O PCMCIA Memory Data GND P G Main unit ground D05 T O PCMCIA Memory Data iPAQ H3000 Series Expansion Pack Developer Guide 3 7 Electrical Interface Table 2 Expansion Pack Pin Out Pre Name te CT D07 T O PCMCIA Memory Data A10 PCMCIA Memory Address I O PCM Mem Address Data A09 PCMCIA Memory Address A08 PCMCIA Memory Address I O PCM Mem Address Data I O PCM Mem Address Data GND P G Main unit ground I O PCM Memory Address Data I O PCM Mem Address Data I O PCM Mem Address Data A07 PCMCIA Memory Address A06 PCMCIA Memory Address A05 PCMCIA Memory Address A04 PCMCIA Memory Address A03 PCMCIA Memory Address A02 PC
62. stance from Front from Front Shorten Receptacle 10 47 10 47 50 51 92 51 92 T 090mm 90 mm 2 mm 82 mm Pins i 5 21 31 45 49 55 0 40 mm 1 32 mm FIGURE 16 Expansion Pack Connectors Mated iPAQ H3000 Series Expansion Pack Developer Guide 6 7 Mechanical Interface 6 8 iPAQ H3000 Series Expansion Pack Developer Guide Reference Schematics 7 Reference Schematics As available reference schematics for expansion packs are planned to coincide with this specification Future schematics are listed below Please refer to http csa compag com CSA For iPAQ Developers shtml for updates Lithium Polymer Battery support circuitry UART connection CF Expansion Pack CF Expansion Pack Plus PCMCIA Expansion Pack PCMCIA Expansion Pack Plus PAQ H3000 Series Expansion Pack Developer Guide 7 1 Reference Schematics 7 2 iPAQ H3000 Series Expansion Pack Developer Guide Regulatory Requirements and Approvals 8 Regulatory Requirements and Approvals Suggested Agency Approvals It is the responsibility of the manufacturer to obtain the necessary regulatory certifications for their product Certifications that should be considered include but are not limited to the following FAA US FCC Part 15 US UL 1950 US FCC Part 68 US ICES 003 Canada CSA 950 Canada CS 03 Canada RSP100 Canada RSS210 Canada CE Europe ETS300328 Europe ETS300826 Europe CTR21
63. te iPAQ H3000 Series Expansion Pack Developer Guide 4 17 Software Interface PPC_DestroyPartitionWhenRegistered This function allows you to format the flash memory in the expansion pack as a disk Syntax void PPC_DestroyPartitionWhenRegistered void Parameters None Return Value None Example Here we enable the flag to perform a destroy par tition table of flash disk to get an opportunity to re format the flash disk when it has been registered PPC DestroyPartitionWhenRegistered 4 18 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface PPC_NVM_AddStr This function provides an entry to add a string type of variable into EEPROM sometimes referred to as NVRAM structure It allocates a memory block to store the source string and returns the address Syntax PBYTE PPC_NVM_AddStr HWND hWnd PBYTE pbuf const char strSource Parameters hWnd in Handle of current window Reserved set it to be NULL pbuf out Destination stored in the string It is always in the field of the EEPROM structure which has string type strSource in Address of a source string which is filled into EEPROM structure with Return Value Return NULL if function failed e g insufficient memory It returns the start address of allocated memory block which is the same as destination address i e pbuf inat Example ill Compaq PC Card Expansion as the text description to user nv
64. the ID information section description earlier in this chapter Opt_Pwr_On This signal controls the expansion pack power VDD This signal must be turned on before the expansion pack can be enabled For more details please refer to the power handling routine description earlier in this chapter Note Before reading or writing to the EEPROM this signal will be turned ON with a 5 ms delay before reading the EEPROM The developer needs to maintain the pin state while device is been powered on or down The Device Manager maintains the setting of Opt_Pwr_On 4 24 iPAQ H3000 Series Expansion Pack Developer Guide Software Interface Table 22 Signal Opt_On is used to notify the expansion pack that it can turn on all the electronics Note This signal is not required to read the EEPROM The card detection of CF PCMCIA signals are controlled by this signal Before this signal is turned on the main unit cannot receive card detect notification The device driver must maintain the pin state while device has been powered on The Device Manager maintains the setting The device driver should use the appropriate functions to affect the state in power handling routines Expansion Pack flash Memory Support The expansion pack can have flash memory on board that can be used to store drivers and software This flash must be decoded using MCS2 Only the following flash chips are supported M Intel 32Mbit 28F32
65. the expansion pack battery to the main battery The CEN_ETM is an active high open collector signal that enables the trickle charge from the expansion pack battery to the main battery The expansion pack must pull this signal up to the extended battery voltage The expansion pack should pull CEN_ETM low when the AC adapter is plugged in or when the expansion pack battery charge is too low A current limiter such as MAX890L or MAX893L must exist on the expansion pack between its battery and the CC_ETM pin to limit the trickle charge VS_EBAT is the positive terminal sense line for the battery in the expansion pack The main unit uses it to determine if it should trickle charge the main battery with the extended battery If VS_EBAT has a lower voltage than the main battery the main unit pulls CEN_ETM open collector low and disables the trickle charge If VS_EBAT has a higher voltage than the main battery CEN_ETM is pulled high by the expansion pack If the AC adapter is plugged in or the expansion pack battery is too low typically 3 65V then the expansion pack must pull CEN_ETM low and disable the trickle charge 5 4 iPAQ H3000 Series Expansion Pack Developer Guide Battery Power Supply and Charging If an expansion pack does not provide a trickle charge to the main unit the CC_ETM CEN_ETM and VS_EBAT signals should not be connected iPAQ H3000 Series Expansion Pack Developer Guide 5 5 Battery Power Supply and Charging
66. the remaining circuitry The batteries in the main unit and the expansion pack are charged from multiple sources The user can charge the batteries from the DC jack on the main unit 3600 or 3700 only the DC jack on the expansion pack if provided or through the synchronizing serial connector on the main unit This allows the main unit and the expansion pack to charge their respective batteries separately or at the same time iPAQ H3000 Series Expansion Pack Developer Guide 5 1 Battery Power Supply and Charging It is optional for the expansion pack to provide extended battery life to the main unit The implementation depends on the total peak current consumption of the expansion pack and the main unit The user therefore needs to choose the appropriate battery capacity to meet his needs If the expansion pack includes a battery specific requirements must be met to ensure proper operation and safety The following sections and Chapter 7 Reference Schematics give more details on a possible implementation Battery and Power Supply Figure 11 Expansion Pack Power Circuit Block Diagram shows a block diagram of the battery charger safety circuit and power supply The expansion pack battery supplies power to the expansion pack power supply through the power switch on top of Figure 11 The power switch also can supply power to the power supply from the AC adapter signal V_ADP If the AC adapter is plugged in the power switch di
67. to Processor Signals PCM_WAIT a Bal RESET Active time after T ms OPT_ON asserted Signals include MCS 4 2 MWE MOE RD WR DQM 3 1 0 PSKTSEL PCM_CE 2 1 PCM_REG PCM_OE PCM_WE PCM_IOR PCM_IOW Signal waveforms and timing requirements are found in the Intel StrongARM 1110 Microprocessor Advanced Developer s Manual PC Card Standard Release 7 0 and CF and CompactFlash Specification Revision 1 4 This specification provides the delay of the buffers between the processor and interface Times are specified with a 30 pF equivalent load FIGURE 8 RESET Timing Waveform PT_ON Q 9 Trst RESET iPAQ H3000 Series Expansion Pack Developer Guide 3 23 Electrical Interface Table 13 Audio Specifications See Notes 1 amp 2 Total Harmonic 3dB FS f 1 kHz THD N 78 dBr Distortion Plus Noise RL 10kQ 1 Audio specifications refer to ALOUTR and A_OUTL 2 Specifications assume A_GND is properly isolated from digital noise on the expansion pack Insertion Removal Overview One of the key features of the expansion packs is the ability to exchange them on the fly with power on or off The user can remove one expansion pack and insert another without significant interaction with the system Upon insertion the hardware interface invokes a device manager on the main unit that interrogates the expansion pack on its features without significantly impacting battery life The interrogation includes
68. ttery technology it should not connect the V_ADP signals Also if an expansion pack does not want to share AC adapter charging with the main unit it should not connect the V_ADP signals Extended Battery Implementation An expansion pack can provide extended battery life to the main unit in two ways First it can connect the V_EBAT and EBAT_ON signals when the expansion pack battery is used to run the main unit Second it can connect the CC_ETM CEN_ETM and VS_EBAT signals with a current limiter to provide a trickle charge to the main unit battery The trickle charge keeps the main battery at a sufficient level to power the main unit in the event the expansion pack is removed while the unit is on The V_EBAT signals are the positive DC voltages from the expansion pack battery to the main unit power supply The V_EBAT signals are connected to the expansion pack battery through a power switch A voltage level detect circuit is used to enable the power switch and EBAT_ON signal when the battery has sufficient charge to supply power to the main unit EBAT_ON is driven low level when extended battery voltage is lower than 3 72V If an expansion pack does not function as an extended battery to the main unit the V_EBAT and EBAT_ON signals should not be connected The CC_ETM CEN_ETM and VS_EBAT signals provide a mechanism for the expansion pack battery to provide a trickle charge to the main battery The CC_ETM signal provides the trickle charge from
69. tware Interface Table 16 ID Information Type II 2 Length of data integer 4 Used by the ID API to allow for a block read of identification information The number in this field should include ALL information in the EEPROM including the information stored in the OEM area Used to determine the information s format Currently defaulting to 0x01 Version Indicator Vendor ID Unique vendor ID Compaq assigned ID Number integer 260 Unique per vendor Product ID PEN EE Hi eee delimited RE O EL I EEN ICI CI CI IC IEA Ea a Esa ES ETA Extended Battery BYTE Time Reset Width Time reset pulse held in milliseconds Time Wait_stable integer Time to wait after reset for option pack to be stable in milliseconds Bootstrap Address integer 26 Address of the Bootstrap in this EEPROM trol OPT_ON signal 0x0002 LinkUPL110 controller used for PCMCIA socket PCMCIA driver will not handle OPT_ON signal OEM Information integer Address of OEM Information in this Address EEPROM 00x0003 Other controller PCMCIA socket 16 PCMCIA socket 0 integer Indicates which kind of PCMCIA controller controller type is being used driver will handle OPT_ON signal 1 PCMCIA socket 1 integer 2 Indicates which kind of PCMCIA controller controller type is being used 0x0000 0x0001 PCMCIA driver will con trol OPT_ON signal 0x0002 LinkUPL110 controller used for PCMCIA socket PCMCIA driver will not handle OPT_ON sign
70. xpansion pack or the device manger determines there is not sufficient power upon insertion the main unit removes power to the Vpp pins and disables the SPI interface Sequence of Events for Removal If the expansion pack is removed while the system is on or in hibernation the expansion pack detect signals ODET 2 1 interrupt the processor to notify the system The device manger starts a timer to allow the detect signals to debounce Once the timer times out it checks to verify the detect signals are still inactive If the signals are active expansion pack still installed the sequence starts over If the detect signals are inactive the device manager subsequently deasserts OPT_ON disables the buffers and removes power to the Vpp pins If the drivers and application were loaded from the EEPROM driver table the device manager then unloads the drivers and application After inserting the expansion pack the device manager starts IH VInstall and copies HVUninstall into RAM Upon removal of the expansion pack this application is run and subsequently is removed from memory iPAQ H3000 Series Expansion Pack Developer Guide 3 25 Electrical Interface FIGURE 9 Insertion Flow Chart From Removal Flow Chart Debounce Timer Detect Pins Active Y Power Expansion Pack and Detect Type Sufficient Power or User Enabled Y Load SW and Start Application To Expansion Pack Removal Flow Chart Detect Pins I

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