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BT740 Hardware Integration Guide
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1. Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Plaque signal tique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l antenne peut tre install e de telle sorte qu une distance de 20cm peut tre maintenue entre l antenne et les utilisateurs Le produit final doit tre tiquet dans un endroit visible avec l inscription suivante Contient des IC Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user s manual of the end product which integrates this module The end user manual shall include all required regulatory information warning as show in this manual Manuel d information l utilisateur final L int grateur OEM doit tre conscient de ne pas fournir des informations l utilisateur final quant la facon d installer ou de supprimer ce module RF dans le manuel de l utilisateur du produit final qui int gre ce module Le manuel de l utilisateur final doit inclure toutes les informations r glementaires requises et avertissements comme indiqu dans ce manuel 9 4 CE Regulatory The BT740 has been tested for compliance with relevant standards for the EU market The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their
2. 3 0 5 0V On board regulators and brown out detection GPIO voltages are 3 3V logic CONN HIG BT740 Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Power Consumption Various Modes Idle mode 1 25 mA Typical values Discoverable 2 7 mA to 55 mA e pd T Inquiry mode 65 mA section for test conditions i 66 mA Connected mode A no data transfer on Connected mode 35 mA max data transfer Sniff mode 1 8 mA Antenna Options Internal Multilayer ceramic BT740 SA External Connection via u FL BT740 SC Physical Connections Surface Mount Pads 1 2mm pitch Dimensions 15 29 mm x 28 71 mm x 2 5 mm Weight 1 5g Environmental Operating 40 C to 85 C Storage 40 C to 85 C Miscellaneous Lead Free Lead free and RoHS compliant Warranty 5 Year Limited Lifetime Development Tools Development Kit Development kit DVK BT740 and software tools Approvals Bluetooth End Product Listing EPL FCC IC CE All BT740 Series 1 DSR DTR RI and DCD are configurable either as GPIO or as modem control lines Americas 1 800 492 2320 Option 2 6 CONN HlG BT 40 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 3 HARDWARE SPECIFICATIONS 3 1 Hardware Specifications Tx Rx Control PA Gain Y M prO 225225858998 OGHOsz 0 05 OHMS ST Woo O ZA xl Oo OOo 200 A SA O A a VCC 3V3 monitor Analogue1 GND UART_DSR Y UART DCD
3. GPIO9 Li GPIO8 N 0 a c TO YD AnalogueO M 1 I IS 1 xt D g HE OOOO Y yX pu qxxO00q15 A 235227Z727509000 N CO st 10 OR D DO NL OL QV QE QV QNL QV QI OOOO Figure 3 2 BT740 Sx module pin out Top View Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth GND Tx Rx Switch SPI MISO CONN HIG BT740 Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 3 2 Pin Definitions Table 3 1 Pin Definitions 1 GND 2 SPI MOSI SPI bus serial I P See Note 2 3 GPIO6 I O for host 4 GPIO7 I O for host D nRESET Module reset I P See Note 3 6 SPI CLK SPI bus clock I P See Note 2 7 NC PCM CLK PCM clock I P See Note 6 8 NC PCM SYNC PCM sync I P See Note 6 9 NC PCM IN PCM data I P See Note 6 10 NC PCM OUT PCM Data O P See Note 6 11 VCC IN 3 3 V lt VCC IN lt 5 0 V See Note 4 12 GND 13 VCC 3V3 monitor 3 3 V Monitor do not connect See Note 5 14 Analogue 1 1 8 V max 15 GND 16 UART DSR UART DSR I P 17 UART DCD UART DCD I P or O P 18 GPIO 9 I O for host 19 GPIO 8 I O for host 20 GND 21 Analogue O 1 8 V max 22 UART_RX Receive data P See Note 7 23 UART TX Transmit data O P 24 UART RTS Request to Send O P 25 UART CTS Clear to Send I P See Note 7 26 NC Reserved USB D Not used for AT module variants 27 NC Reserved USB D Not used for AT module variants 28 UART RI Ring Input or Output 29 GPIO_3 UART_D
4. Hardware Integration Guide 1 OVERVIEW AND KEY FEATURES Every BT740 series Bluetooth module from Laird is designed to add robust long range Bluetooth data connectivity to any device Based on the market leading Cambridge Silicon Radio CSR BCO4 chipset BT740 modules provide exceptionally low power consumption with outstanding Class 1 range via 18 dBm of transmit power The modules support the latest Bluetooth Version 2 1 specification including Secure Simple Pairing SSP which improves security and enhances the ease of use for end customers A broad range of Bluetooth profiles such as Serial Port Profile SPP and other vital features make BT740 modules superior to other Bluetooth modules With a compact footprint of 15 29 x 28 71 mm the modules deliver maximum range with a minimum size To ease integration the modules are designed to support a separate power supply for I O Another integration advantage is the inclusion of a complete Bluetooth protocol stack with support for multi point connections and numerous Bluetooth profiles including SPP Human Interface Device HID profile and Health Device Profile HDP BT740 modules fully qualify as a Bluetooth End Products enabling designers to integrate the modules in devices without the need for further Bluetooth qualification An integrated AT command processor interfaces to the host system over a serial port using an extensive range of AT commands The AT command set abstracts the Bluetoot
5. be connected to the DTR output of the host When the BTM740 module is in high speed mode see S Register in AT mode in the Firmware User manual this pin should be asserted by the host to ensure that the connection is maintained A deassertion means that the connection should be dropped or an online command mode is being requested 13 Pin 13 VCC_3V3 monitor may only be used for monitoring purposes It must not be used as a current source 14 The GPIO pins can be accessed using S Registers in AT mode and a special command in MP mode See the Firmware User manual for S register required 15 GPIO3 is also used for DTR output active low See the Firmware User manual for S register required 16 Analogue 0 and 1 should not exceed 1 8 V and see the Firmware User manual for S register used to access them Americas 1 800 492 2320 Option 2 9 CONN HIG BT 740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 3 3 Electrical Specifications 3 3 1 Absolute Maximum Ratings Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below WARNING AARE pick psp MM NISI L the following values causes permanent damage to the device Peak current of power supply 0 200 mA Voltage at digital pins 0 4 3 7 V Voltage at POWER pin 297 6 0 V 3 3 2 Recommended Operating Pa
6. circumstances should this pin be used to source current 6 Pins 7 8 9 and 10 PCM related are NOT supported in Firmware therefore are NC No Connect pins 7 Adda 10k pull up to the host PCB on the UART_RX otherwise the module will remain in deep sleep if not driven to high Add a 10 k pull down to the host PCB on the UART CTS that if it is not connected which we do not recommend then the default state for UART CTS input will be asserted which means can send data out of UART_TX line 8 GPIO lines can be configured through software to be either inputs or outputs with weak or strong pull ups or pull downs At reset all GPIO lines are configured as inputs with weak pull downs 9 UART RX UART TX UART CTS UART RTS UART RI UART DCD and UART_DSR are 3 3 V level logic For example when RX and TX are idle they sit at 3 3 V Conversely for handshaking pins CTS RTS RI DCD and DSR a O V is treated as an assertion 10 Pin 28 UART RI is active low It is normally 3 3 V When a remote device initiates a connection this pin goes low This means that when this pin is converted to RS232 voltage levels it has the correct voltage level for assertion 11 Pin 17 UART DCD is active low It is normally 3 3 V When a connection is live this pin is low This means that when this pin is converted to RS232 voltage levels it has the correct voltage level for assertion 12 Pin 16 UART DSR is an input with active low logic It should
7. critical to locate the BT740 SA on the edge of the host PCB or corner to allow the antenna to radiate properly Refer to guidelines in the section PCB Land Pattern and Antenna Keep out area for BT740 SA Some of the guidelines are repeated below Ensure there is no copper in the antenna keep out area on any layers of the host PCB Keep all mounting hardware and metal clear of the area to allow proper antenna radiation For best antenna performance place the BT740 SA module on the edge of the host PCB preferably in the corner with the antenna facing the corner An example shown in Figure 6 1 A different host PCB thickness dielectric will have small effect on antenna the BT740 carrier development board used for antenna performance evaluation thickness was 0 78 mm The antenna keep out defined in PCB Land Pattern and Antenna Keep out area for BT740 SA applies when the BT740 SA is placed in the corner of the host PCB When BT740 SA cannot be placed as such you must place it on the edge of the host PCB and use a modified antenna keep out This antenna keep out modification is shown in Figure 6 2 antenna keep out is extended by 8 mm on both sides HIP ANTENNA CHIP ANTENNA NECTOR ANTENNA CONNECTO Figure 6 1 BT740 SA placement in the corner of host PCB O GND in this ares HIP ANTENNA ANTENNA CONNECTOR LLL 222227 2 Figure 6 2 BT740 SA placement in the edge not corner of host PCB with modified antenna
8. for its intended purpose Place of Issue Laird Technologies Saturn House Mercury Park Wooburn Green HP100HH United Kingdom tel 44 0 1628 858 940 fax 44 0 1628 528 382 Date of Issue June 2013 Name of Authorized Person Andrew Dobbing Engineering Manager Signature Americas 1 800 492 2320 Option 2 27 CONN HIG BT 740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 10 2 BT740 SC Manufacturer Laird Product BT740 SC EU Directive RTTE 1995 5 EC Conformity Assessment Annex IV Reference standards used for presumption and conformity 3 1a Health and Safety EN 60950 1 2006 3 1b Protection requirements with respect to EN 301 489 1 V1 8 1 electromagnetic compatibility EN 301 489 17 V2 1 1 Emissions EN55022 2006 A1 2000 A2 2006 ClassB Immunity EN61000 4 2 1995 A1 1998 A2 2001 EN61000 4 3 2002 A1 2002 3 2 Means of the efficient use of the radio EN 300 328 V1 8 1 2012 06 frequency spectrum Declaration We Laird Inc declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995 5 EC when used for its intended purpose Place of Issue Laird Technologies Saturn House Mercury Park Wooburn Green HP100HH
9. not exceed the minimums or maximums presented in Table 8 1 Table 8 1 Recommended Maximum and Minimum Temperatures Temperature Inc Dec Rate max 1 3 C Sec Temperature Decrease rate goal 2 4 C Sec Soak Temp Increase rate goal 5 1 C Sec Flux Soak Period Min 70 Sec Flux Soak Period Max 120 Sec Flux Soak Temp Min 150 eC Flux Soak Temp max 190 C Time Above Liquidous max 70 Sec Time Above Liquidous min 50 Sec Time In Target Reflow Range goal 30 Sec Time At Absolute Peak max 5 Sec Liquidous Temperature SAC305 218 SC Lower Target Reflow Temperature 240 C Upper Target Reflow Temperature 250 C Absolute Peak Temperature 260 C Americas 1 800 492 2320 Option 2 oe CONN HIG BT 40 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 9 FCC REGULATORY STATEMENTS Family US FCC CANADA IC BT7xO SQGBT 00 3147A BT700 BT 740 SA XX Surface Mount 18dBm Ceramic BT 740 SC XX Surface Mount 18dBm U FL Last two slots XX in Part are for production firmware release changes Can be values 01 99 aa zz The BT740 family is designed to operate with the antennas listed below with a maximum gain of 2dBi The required antenna impedance is 50 ohms Table 9 1 Qualified Antennas 1 AT3216 B2R7HAAT ACX Chip 0 5 2 MAF94045 Laird PCB 2 4 WRR2400 IP04 B MAF94019 Laird Dipole 1 5 5 WTC2450 IP04 K MAF94006 Laird
10. or go to the Purchase Declaration ID page please note that unless the Declaration ID is pre paid or purchased with a credit card it will not be possible to proceed until the SIG invoice is paid Once all the relevant sections of step 1 are complete complete steps 2 3 and 4 as described in the help document Your new Design will be listed on the SIG website and you can print your Certificate and DoC For further information please refer to the following training material https www bluetooth org en us test qualification qualification overview listing process updates 11 3 Additional Assistance Please contact your local sales representative or our support team for further assistance Laird Technologies Connectivity Products Business Unit Support Centre http ews support lairdtech com Email wireless support lairdtech com Phone Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 Web http www lairdtech com bluetooth Americas 1 800 492 2320 Option 2 30 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 12 ORDERING INFORMATION BT 40 SA Enhanced Class 1 Bluetooth V2 1 Module internal antenna BT740 SC Enhanced Class 1 Bluetooth v2 1 Module uFL for external antenna DVK BT740 SA Development board with BT740 SA module soldered in place DVK BT740 SC Development b
11. proximity to metal cover ETAL ETAL p MET AL BOARD BOARD Figure 6 4 Not recommended BT740 SA placement on host PCB and proximity to metal cover 6 4 External Antenna Integration with BT740 SC Refer to the regulatory sections for FCC IC and CE for details of use of BT740 SC with external antennas in each regulatory region The BT740 SC family has been designed to operate with the antennas listed below with a maximum gain of 2 dBi The required antenna impedance is 50 ohms External antennas improve radiation efficiency 1 MAF94045 Laird Internal 2 UFL 2 WRR2400 IPO4 B MAF94019 Laird Dipole 1 5 UFL 3 WTC2450 IPO4 K MAF94006 Laird Dipole 2 UFL 4 S181FL L RMM 2450S Nearson Laird Dipole 2 UFL Americas 1 800 492 2320 Option 2 17 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Note 1 Integral RF co axial cable with UFL connector Antenna manufacturer Laird contact information Email wireless support lairdtech com 7 MECHANICAL DETAILS 7 1 BT740 SC Mechanical Details BT700 SC rev OX FCCID TBC IC TBC ZJ4000001 MAC 0016A4400000 C SCALE 21 Figure 7 1 BT740 SC mechanical details 7 2 BT740 SA Mechanical Details rev OX FCCID TBC IC TBC ZJ4000001 MAC 001 644400000 SCALE 2 1 Figure 7 2 BT740 SA mechanical details Americas 1 800 492 2320 Option 2 1
12. subsystem listing The design may also include a profile subsystem Bluetooth End Product Figure 11 1 Basic subsystem combination of a controller and host subsystem The qualification process requires each company to registered as a member of the Bluetooth SIG www bluetooth org Americas 1 800 492 2320 Option 2 ed CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide The following link provides a link to the Bluetooth Registration page https Awww bluetooth org login register For each Bluetooth Design it is necessary to purchase a Declaration ID This can be done before starting the new qualification either through invoicing or credit card payment The fees for the Declaration ID will depend on your membership status please refer to the following webpage https www bluetooth org en us test qualification qualification overview fees For a detailed procedure of how to obtain a new Declaration ID for your design please refer to the following SIG document https Awww bluetooth org DocMan handlers DownloadDoc ashx doc_id 283698 amp vld 3 17486 To start the listing go to https www bluetooth org tpg QLI SDoc cfm In step 1 select Reference a Qualified Design and enter the Declaration IDs of each subsystem used in the End Product design You can then select your pre paid Declaration ID from the drop down menu
13. than for testing and prototyping If these pins link and the host sends data at the point that the BT740 deasserts its RTS signal there is significant risk that internal receive buffers will overflow and cause an internal processor crash This also leads to a connection drop and may require a power cycle to reset Laird recommends you follow the correct CTS RTS handshaking protocol for proper operation 5 2 SPI Bus The module is a slave device that uses terminals SPI MOSI SPI MISO SPI CLK and SPI CSB This interface is used for program firmware updates ONLY at the factory Laird supplies a PC based utility to allow a firmware upgrade over the UART port Laird highly recommends that customers use this method for updating firmware Note The designer should be aware that no security protection is built into the hardware or firmware associated with this port so the terminals should not permanently connect in a PC application 5 3 PCM Interface PCM is not supported in Firmware PCM interface PCM OUT PCM IN PCM CLK and PCM SYNC exists in HW only 5 4 General Purpose I O and ADC 5 4 1 GPIO Seven lines of programmable bi directional input outputs I O are provided that can be accessed either via the UART port or Over the Air OTA from a second Bluetooth unit These can be used as data inputs or to control external equipment By using these in OTA mode a BT740 module can be used for control and data acquisition without the n
14. 0 and ADC GPIO 3 9 3 4 16 17 18 or O See Recommended 19 29 30 31 Operating Parameters AnalogueO Analogue1 14 21 Range 0 1 8 V 8 bit 3 3 2 7 nhESET nRESET D V maxz1 0V Active LOW The Reset input contains a 10 kQ pull Viamin 2 3V up resistor internal to module Americas 1 800 492 2320 Option 2 11 CONN HIG BT 740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 4 1 0 CHARACTERISTICS 4 1 Power Consumption The current drain from the VCC power input line is dependent on various factors The three most significant factors are the voltage level at VCC UART baud rate and the operating mode The hardware specification for the module allows for a voltage range of 3 3 to 5 0 at VCC The unit includes a linear regulator and tests have shown that there is no significant difference in current draw when VCC changes within the operating limits Tests have shown that where power dissipation is an issue it is best to keep VCC at the lower end of the range The UART baud rate has a bearing on power dissipation because as is normal for digital electronics the power requirements increase linearly with increasing clocking frequencies Because of this higher baud rates result in a higher current drain The significant operating modes are Idle Waiting for a connection Inquiring Initiating a connection Sniff Con
15. 8 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 7 3 BT740 Pad Definitions Mechanical Drawing Orientaion Mark on RF Shield Antenna RF Shield c8 3 1 21 A D Al TOP VIEW SIDE VIEW BULIUM VIEW COMPONENT SIDE SMT PADS BT 700 __Demension Minimum Tipicol Maximum A 2 3 2 5 2 7 PCB Thickness RF Shield Height Global pad width Global pitch Pad Center to board edge Pad Center to board edge Global length of pad to edge of board rOom 9 eoemocopw xrx RI SPILMISO SPL_CSB GPIO_4 0 GPIO_S GPIO_3 UART_OTR UART_RTS UART UART 0 40 Analogue 00 GND 14 16 0 40 3 2 42 Figure 7 3 BT7xx Mechanical Drawing Americas 1 800 492 2320 Option 2 19 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 7 4 PCB Land Pattern and Antenna Keep out for BT740 SA A E m TU E ojo x C Note Units are in mm un ro i gt DA i484 4 0 225 S i E E om Ul g M U Lad G2 ge d od Ur oO 2 o 3 X T am eO U 1 2 D e m c x co G2 1 D D e 35 J 3 G3 c at gt DU Pad Width Pad Length w 0 84 o0 491 50 Pin Pitch 2x8 9 60 dam y Figure 7 4 PCB La
16. BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 2 SPECIFICATIONS 2 1 Detailed Specifications Table 2 1 Detailed Specifications Wireless Specification Bluetooth Frequency Bluetooth Transmitter Class Max Transmit Power Min Transmit Power Receive Sensitivity Range Data Rates UART Data Transfer Rate Host Interface UART GPIO ADC PCM Profiles SPP HID HDP Command Interfaces Operation Modes Firmware Upgrade Audio Support SCO Channels PCM Interface Supply Voltage supply Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth V2 0 2 402 2 480 GHz Class 1 Basic Rate BT 18 dBm into integrated antenna BT740 SA 16 dBm into UFL antenna connector BT740 SC 9 dBm into integrated antenna 9 dBm into UFL antenna connector Better than 87 dBm at 25 C gt 1000m Line of Sight Up to 1 0 Mbps over the air Circa 350 kbps One UART TX RX DCD RI DTR DSR CTS RTS Default 9600 n 8 1 From 1 200 to 921 600 bps 8 configurable lines Two ADC channels 8 bit resolution Not Supported in Firmware One PCM interface Serial Port Profile Human Interface Device Health Device Profile AT Command Set Multi Point API seven simultaneous connections Firmware Upgrade over UART Not Supported in Firmware
17. Dipole 2 6 181FL L RMM 2450S Nearson Laird Dipole 2 Note The OEM is free to choose another vendor s antenna of like type and equal or lesser gain as an antenna appearing in the table and still maintain compliance Reference FCC Part 15 204 c 4 for further information on this topic To reduce potential radio interference to other users the antenna type and gain should be chosen so that the equivalent isotropic radiated power EIRP is not more than that permitted for successful communication 9 1 Power Exposure Information In general there are two agency classifications for RF radiation exposure in wireless applications mobile and portable Mobile A mobile device is a transmitting device designed in such a way that a separation distance of at least 20 cm is normally maintained between the transmitter s radiating structures and the body of the user or nearby persons The BT740O is fully modular approved for mobile and fixed applications reference FCC Part 2 1091 for further details on mobile devices This transmitter must not be co located or operating in conjunction with any other antenna or transmitter Portable Portable is a classification of equipment where the user in general is within 20 cm of the transmitting antenna Portable equipment is further broken down into two classes within 2 5 cm of human contact and beyond 2 5 cm The BT740 does not hold a portable approval classification due to its peak output power
18. Laird gt Smart Technology Delivered Enhanced Class 1 Bluetooth v2 1 Module HARDWARE INTEGRATION GUIDE VERSION 1 3 Part BT740 SA BT740 SC Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Revision History 1 0 30 July 2013 Initial Release 1 1 30 Sept 2013 Removed yellow highlights 1 2 19 Dec 2013 Fixed typo 1 3 06 Feb 2014 Updated Bluetooth SIG Qualification section Americas 1 800 492 2320 Option 2 2 CONN HlG BT 40 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Contents 1 Overview and Key F AUUR S ns tests UU Um 4 DSC COINS c 5 OS SD E 7 DE WG PAPAS a a a a ans 12 ACROSS E ANE EER 13 6 Hardware Integrati n SUG qo om 15 7 Mechanical Detalls ne an ae nn miens 18 S SUN aCe Moum Modules ee E eenean 21 T FCC RECU ON Pru MI I OTT mm 23 10 EU Declarations of Conformity ssssssssssssssssssseeennn e RII mnn n HnnI nnn nn inh hn nennen nass EErEE Erenn 27 11_Bluetooth SIG ose TM T 29 TZ POS qa O OEM Om 30 Americas 1 800 492 2320 Option 2 B CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module
19. TR I O for host UART_DTR 30 GPIO_5 I O for host 31 GPIO 4 I O for host 32 SPI CSB SPI bus chip select I P See Note 2 33 SPI MISO SPI bus serial O P See Note 2 Notes Unused pins may have internal connections and must not be connected Pins 2 6 32 and 33 SPI related are on y for Laird internal production purposes Power on reset power cycling and brown out consideration The reset circuitry within the BT740 module incorporates a brown out detector this may simplify power supply design The BT430 reset line is an active low input Input debounced so must be low for more than 5 ms to cause a reset Upon the application of power the Power On Reset circuit built into the module ensures that the unit starts correctly There is no need for an external power reset monitor Americas 1 800 492 2320 Option 2 8 CONN HIG BT 740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 4 Power Supply Consideration The power supply for the module should be a single voltage source of VCC within the VCC IN range of 3 3 V to 5 0 V It must be able to provide sufficient current in a transmit burst This can rise to 200 mA To limit dissipation it is recommended that you use a voltage at the lower end of the range 5 The module includes regulators to provide internal local 3 3 V This rail is accessible on pin 13 for monitoring purposes only Under no
20. United Kingdom tel 44 0 1628 858 940 fax 44 0 1628 528 382 Date of Issue June 2013 Name of Authorized Person Andrew Dobbing Engineering Manager Signature Americas 1 800 492 2320 Option 2 28 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 11 BLUETOOTH SIG APPROVALS 11 1 Subsystem Combinations This application note covers the procedure for generating a new Declaration ID for a Subsystem combination on the Bluetooth SIG website In the instance of subsystems a member can combine two or more subsystems to create a complete Bluetooth End Product solution Subsystem listings referenced as an example BT 740 Laird BO20701 https Awww bluetooth org tpg QLI_viewQDL ctm gid 20701 Interface Cambridge B017578 https Awww bluetooth org tpg QLI viewQDL cfm qidz 17578 Express Consultants subsystem Ltd 11 2 Assumptions This procedure assumes that the member is simply combining two subsystems to create a new design without any modification to the existing qualified subsystems This is achieved by using the listing interface on the Bluetooth SIG website Figure 11 1 shows the basic subsystem combination of a controller and host subsystem The controller provides the RF BB LM and HCI layers with the host providing L2CAP SDP GAP RFCOMM SPP and any other specific protocols and profiles existing in the host
21. and modular approval restrictions Customers who want to use the BT740 in portable applications require further RF evaluation Contact a qualified test house or a Laird representative for further information on this topic reference FCC Part 2 1093 for further details on portable devices Maximum Permissible Exposure report was created and shows the minimum distances for Public and Occupational use of the BT740 Americas 1 800 492 2320 Option 2 23 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Note Occupational Limit Minimum Distance 1 5 cm Public Limit Minimum Distance 3 cm Note This equipment was tested and found to comply with the limits for a Class B digital device pursuant to Part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference does not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to correct the interference by one or mor
22. complete device The BT740 was tested with a 2dBi dipole antenna The OEM is free to use any manufacturer s antenna and type of antenna but it must be lt 2dBi to remain in compliance with the Laird reports Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to Test reports are available upon request Americas 1 800 492 2320 Option 2 26 CONN HIG BT 740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 10 EU DECLARATIONS OF CONFORMITY 10 1 BT740 SA Manufacturer Laird Product BT740 SA EU Directive RTTE 1995 5 EC Conformity Assessment Annex IV Reference standards used for presumption of conformity 3 1a Health and Safety EN 60950 1 2006 3 1b Protection requirements with respect to EN 301 489 1 V1 8 1 electromagnetic compatibility EN 301 489 17 V2 1 1 Emissions EN55022 2006 A1 2000 A2 2006 ClassB Immunity EN61000 4 2 1995 A1 1998 A2 2001 EN61000 4 3 2002 A1 2002 3 2 Means of the efficient use of the radio EN 300 328 V1 8 1 2012 06 frequency spectrum Declaration We Laird Inc declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995 5 EC when used
23. e of the following measures Reorient or relocate the receiving antenna Increase the separation between the equipment and the receiver Connect the equipment to an outlet on a circuit that is different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help CAUTION THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES AND INDUSTRY CANADA LICENSE EXEMPT RSS STANDARD S OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS 1 THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE AND 2 THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION CAUTION The OEM should have the device incorporating with the BT740 tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators CAUTION Any changes or modifications not expressly approved by Laird could void the user s authority to operate the equipment 9 2 OEM Responsibilities This device is intended only for OEM integrators under the following conditions 1 The antenna must be installed such that 20 cm Is maintained between the antenna and users and 2 The transmitter module may not be co located with any other transmitter or antenna As long as 2 conditions above are met further transmitter test will not be required However the OEM integrator is still responsible for testing their end product for any additional compliance requ
24. eed for any additional host processor Each of the GPIO 3 9 ports can be independently configured to be either an input or output A selection of ports can be accessed synchronously The ports are powered from internal VCC_3V3 The mode of these lines can be configured and the lines are accessed via S Registers see the Firmware User manual 5 4 2 ADC The BT740 provides access to two 8 bit ADCs Analogue 0 and 1 These provide an input range of 0 mV to 1 800 mV which are read using the S registers see the Firmware User manual Suitable external scaling and over voltage protection should be incorporated in your design The module provides five samples per second at the UART with a baud rate of 115 200 or above 5 5 BT740 SA On board Chip Antenna Characteristics The BT740 SA on board chip monopole antenna radiated performance depends on the host PCB layout Americas 1 800 492 2320 Option 2 14 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide BT740 carrier board was used for BT740 SA development and antenna performance evaluation To obtain similar performance follow the guidelines in PCB Layout on Host PCB for BT 40 SA to allow the on board antenna to radiate and reduce proximity effects due to nearby host PCB GND copper or metal covers BT740 SA on board antenna datasheet can be accessed from the following link htt
25. environment This equipment should be installed and operated with minimum distance 20cm between the radiator amp your body D claration d exposition aux radiations Cet quipement est conforme aux limites d exposition aux rayonnements IC tablies pour un environnement non contr l Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps This device is intended only for OEM integrators under the following conditions For module device use 1 The antenna must be installed such that 20 cm is maintained between the antenna and users 2 The transmitter module may not be co located with any other transmitter or antenna As long as 2 conditions above are met further transmitter test will not be required However the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed Cet appareil est concu uniquement pour les int grateurs OEM dans les conditions suivantes Pour utilisation de dispositif module 1 L antenne doit tre install e de telle sorte qu une distance de 20 cm est respect e entre l antenne et les utilisateurs 2 Le module metteur peut ne pas tre coimplant avec un autre metteur ou antenne Tant que les 2 conditions ci dessus sont remplies des essais suppl mentaires sur l metteur ne seront pas n cessaires Toutefois l int grateur OEM est toujo
26. h protocol from the host application saving many months of programming and integration time It provides extremely short integration times for data oriented Bluetooth applications Included firmware provides programming support for multi point applications that use up to seven simultaneous data connections to and from the robust BT740 module A low cost developer s kit makes it easy for an OEM to integrate the module and guarantees the fastest route to prototype and then mass production Features amp Benefits us Application Areas Bluetooth v2 1 EDR Medical devices External or internal antennas ePOS terminals Comprehensive AT interface for simple Automotive diagnostic equipment programming Barcode scanners Alternate packet based interface for complex Industrial cable replacement programming and up to seven simultaneous connections Bluetooth amp Profiles Supported Bluetooth EPL Compact footprint Class 1 output 18 dBm UART interface with GPIO and ADC lines Industrial temperature range Field proven firmware used on BTM44x series Serial Port Profile SPP Human Interface Device HID profile host and device supported Health Device Profile HDP Agent supported EEE Device Specialization OORE 11073 10415 Weight Scale EEE Device Specialization 11073 10408 Thermometer EEE Device Specialization 11073 10417 Glucose Americas 1 800 492 2320 Option 2 4 CONN HIG
27. irements required with this module installed IMPORTANT NOTE In the event that these conditions can not be met for example certain laptop configurations or co location with another transmitter then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product In these circumstances the OEM integrator will be responsible for re evaluating the end product including the transmitter and obtaining a separate FCC authorization End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users The final end product must be labeled in a visible area with the following Contains FCC ID SQGBT700 Manual Information To the End User Americas 1 800 492 2320 Option 2 24 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user s manual of the end product which integrates this module The end user manual shall include all required regulatory information warning as show in this manual 9 3 Industry Canada IC Warning Radiation Exposure Statement This equipment complies with IC radiation exposure limits set forth for an uncontrolled
28. keep out Americas 1 800 492 2320 Option 2 16 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Note Copper cut away on all layers in antenna keep out area under BT740 SA module on host PCB Refer to antenna keep out defined in 7 4 PCB Land Pattern and Antenna Keep out for BT740 SA 6 3 2 Antenna Keep out and Proximity to Metal or Plastic Checklist for metal plastic enclosure Figure 12A and 12B shows recommended and not recommended locations for metal with respect to a BT740 SA module on board antenna Minimum safe distance for metals without seriously compromising the antenna tuning is 40 mm top bottom and 30 mm left or right Metal close to the BT740 SA chip monopole antenna bottom top left right any direction will have degradation on the antenna performance The amount of degradation is entirely system dependent which means some testing by customer is required in their host application Anything metal closer than 20 mm starts to significantly degrade performance S11 gain radiation efficiency tis best that the customer tests the range with a mock up or actual prototype of the product to assess effects of enclosure height and material whether metal or plastic ETAL ANTENNA CONNECTOR HIP ANTENNA OTHER BOARD Figure 6 3 Recommended BT740 SA placement on host PCB and
29. ly for handshaking pins CTS RTS RI DCD and DSR a O V is treated as an assertion By writing different values to the relevant S register the UART RI can continuously poll to detect incoming communication The UART RI signal serves to indicate incoming calls UART DSRis an active low input It should connect to the DTR output of the host When the module runs in high speed mode see definition of the required S register in the Firmware User manual this pin should assert by the host to ensure a connection maintains A de assertion means that the connection should be dropped or an online command mode is being requested The module communicates with the customer application using the following signals Port TXD of the application sends data to the module s UART_RX signal line Port RXD of the application receives data from the module s UART_TX signal line Application Host UART TX UART_RX UART_CTS UART_RTS UART_DSR UART_DTR UART_RI UART_DCD Americas 1 800 492 2320 Option 2 13 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Note The serial module output is at 3 3 V CMOS logic levels Level conversion must be added to interface with an RS232 level compliant interface Some serial applications link CTS and RTS to remove the need for handshaking Laird doesn t recommend linking CTS and RTS other
30. nd Pattern and Antenna Keep out for BT740 SA APPLICATION NOTES 1 Ensure there is no copper in the antenna keep out area on any layers of the host PCB Also keep all mounting hardware or any metal clear of the area to reduce effects of proximity detuning the antenna and to help antenna radiate properly Refer to section 6 3 2 for more information 2 ForBT740 SA with on board chip antenna best antenna performance the module BT740 SA must be placed on the edge of the host PCB preferably in the corner with the antenna facing the corner see Figure 6 1 The module is placed in the corner of host PCB above the keep out area If the BT740 SA is placed on the edge instead the keep out area must be modified see Figure 6 2 in section 6 3 1 3 Ensure that there is no exposed copper under the module on the host PCB 4 The user may modify the PCB land pattern dimensions based on their experience and capability Americas 1 800 492 2320 Option 2 20 CONN HIG BT 740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 8 SURFACE MOUNT MODULES 8 1 Introduction Laird surface mount modules are designed to conform to all major manufacturing guidelines This section provides additional guidance for mounting the module This section is considered a living document and is updated as new information is presented The modules are designed to meet
31. nected With connected mode it is also relevant to differentiate between no data being transferred and when data is being transferred at the maximum rate possible The AT command set document describes how to configure the module for optimal power performance 4 2 Typical Current Consumption in mA Table 4 1 Current Consumption VCC IN 3 8 V Baudrate 9600 bps Typical Average Current mA Separation Distance 15 meters two BT740 SA Idle Mode 512 1 1 25 mA Wait for Connection Or Discoverable Mode 55 mA AT BTP S 508 S510 640 509 S511 320 Wait for Connection Or Discoverable Mode 2 7 MA AT BTP 508 S510 1000 509 S511 11 Inquiry Mode AT BTI 65 mA Connecting Mode ATDxxx 66 mA Connected Mode No Data Transfer 6 mA Connected Mode Max Data Transfer 35 mA Sniff Mode 1 8 mA 556421000 55632500 S562 50 561 10 Americas 1 800 492 2320 Option 2 la CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 5 FUNCTIONAL DESCRIPTION The BT740 Bluetooth module is a self contained Bluetooth product and requires only power to implement full Bluetooth communication The integrated high performance antenna together with the RF and base band circuitry provides the Bluetooth link and the UART interface provides a connection to the host system The variety of interfaces and the AT command set allow the BT740 module
32. oard with BT740 SC module soldered in place 12 1 General Comments This is a preliminary datasheet Please check with Laird for the latest information before commencing a design If in doubt ask Americas 1 800 492 2320 Option 2 31 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Laird Smart Technology Delivered Laird Ltd is the world leader in the design and manufacture of customized performance critical products for wireless and other advanced electronics applications Laird partners with its customers to find solutions for applications in various industries such as Network Equipment Telecommunications Data Communications Automotive Electronics Computers Aerospace Military Medical Equipment Consumer Electronics Laird offers its customers unique product solutions dedication to research and development as well as a seamless network of manufacturing and customer support facilities across the globe globalsolutions local support USA 1 800 492 2320 Europe 44 1628 858 940 Asia 852 2923 0610 wireless support lairdtech com CONN HIG BT740 Copyright O 2014 Laird Inc All rights reserved The information contained in this manual and the accompanying software programs are copyrighted and all rights are reserved by Laird Inc Laird Inc reserves the right to make
33. or UART CTS input will be asserted which means can send data out of UART TX line nRESET pin active low Hardware reset Wire out to push button or drive by host If used the external reset must be exerted for a minimum of 5 mS By default the module is out of reset when power is applied to the VCC IN pin 6 2 PCB Layout on Host PCB General Checklist for PCB MUST locate the BT740 SA module close to the edge of PCB mandatory for BT740 SA for on board chips antenna to radiate properly Use solid GND plane on inner layer for best EMC and RF performance Place GND vias as close to module GND pads as possible Unused host PCB area on surface layer can be flooded with copper but place GND vias regularly to connect copper flood to inner GND plane If GND flood copper underside the module then connect with GND vias to inner GND plane Route traces to avoid noise being picked up on VCC_IN supply Analogue and GPIO digital traces Americas 1 800 492 2320 Option 2 15 CONN HIG BT 740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide Ensure there is no exposed copper on the underside of the module refer to land pattern drawing of BT740 Sx 6 3 PCB Layout on Host PCB for BT740 SA 6 3 1 Antenna keep out on host PCB The BT740 SA has an integrated chip antenna and its performance is sensitive to the host PCB It is
34. p www acxc com tw product at32 16 AT3216 B2R7HAA 071204 pdf 6 HARDWARE INTEGRATION SUGGESTIONS 6 1 Circuit The BT740 series module is easy to integrate requiring no external components on the customer s board apart from those required by customer for development and in customers end application Checklist for the schematic VCC IN External power source within the operating range specification of BT740 Sx Add decoupling or bulk capacitors for filtering or reservoir the external source Power on reset circuitry within BT740 Sx series module incorporates brown out detector thus simplifying power supply design Upon application of power the internal power on reset ensures module starts correctly AIN ADC and GPIO or UART pin IO voltage levels BT73 Sx GPIO voltage levels are at 3 3V see Notes Electrical Specifications Ensure input voltage levels into GPIO pins are at 3 3V voltage levels Ensure ADC pin maximum input voltage 1 8 V for damage is not violated UART Required Add connector to allow UART to be interfaced to PC via UART RS232 or UART USB UART RX and UART CTS Add a 10 k pull up to the host PCB on the UART_RX otherwise the module remains in deep sleep if not driven to high The pull up prevents the module from going into deep sleep when UART_RX line is idling Adda 10 k pull down to the host PCB on the UART CTS that if it is not connected which we do not recommend then the default state f
35. periodic modifications of this product without obligation to notify any person or entity of such revision Copying duplicating selling or otherwise distributing any part of this product or accompanying documentation software without the prior consent of an authorized representative of Laird Inc is strictly prohibited All brands and product names in this publication are registered trademarks or trademarks of their respective holders This material is preliminary Information furnished by Laird in this specification is believed to be accurate Devices sold by Laird are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only Laird makes no warranty express statutory and implied or by description regarding the information set forth herein Laird reserves the right to change specifications at any time and without notice Laird products are intended for use in normal commercial and industrial applications Applications requiring unusual environmental requirements such as military medical life support or life sustaining equipment are specifically not recommended without additional testing for such application Limited Warranty Disclaimer Limitation of Liability Americas 1 800 492 2320 Option 2 34 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth
36. rameters 3 3 2 1 Power Supply 3 0 V to 5 0 V VCC_IN Typ 3 5 V ly 115 mA GND 1 12 15 20 Four 4 ground terminals to be attached Note VCC 3V3 monitor refers to internal voltage generated by the LDO inside the module which is typically 3 3 V So to achieve 3 3 V for VCC 3V3 monitor at Max Tx Power requires VCC IN of 3 5 V IO voltage levels follows VCC 3V3 monitor At minimum VCC VIN of 3 3 V the internal LDO generates 3 3 V but when Radio Tx at max Tx power VCC 3V3 monitor drops a little to 3 15 V 3 3 2 2 Signal Levels for Interface GPIO and SPI ViLmin 0 4V ViLmax 0 8V P VIHmin 2 3V ViHmax 3 V VOLmax 0 2V Surpa VOHmin 3 1V 3 3 2 3 UART Interface UARTIX 23 0 0 0 0 004 UART RX KUARTRX 22 o UART CTS 25 UART_RTS 24 O UART_DSR 16 Americas 1 800 492 2320 Option 2 10 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide UART DTR Shared with GPIO3 UART RI 28 lor O Direction may be programmed UART DCD 17 or O Direction may be programmed 3 3 2 4 SPI Bus SPI MOSI COC E INTERNAL USE ONLY Used to reprogram Flash in Laird SPECSB 32 ST Ne production SPI_CLK 6 33 25 PCM Interface PCM CLK lor O PCM IN 9 These pins are NO CONNECT as they are not supported in the PCM_SYNC 8 or O Firmware PCM_OUT 10 O 3 3 26 General Purpose I
37. the needs of a number of commercial and industrial applications The modules are designed to be easily manufactured and conform to current automated manufacturing processes 8 2 Shipping Modules ship in Electrostatic Discharge ESD sate trays that can load into most manufacturers pick and place machines Layouts of the trays are provided in Figure 8 1 NEN EE m J F g e m AD n Figure 8 1 BT740 Shipping Tray Details Americas 1 800 492 2320 Option 2 21 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Enhanced Class 1 Bluetooth v2 1 Module Hardware Integration Guide 8 3 Reflow Parameters Laird surface mount modules are designed to be easily manufactured including reflow soldering to a PCB Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste Laird s surface mount modules conform to J STD 020D1 standards for reflow temperatures Important During reflow modules should not be above 260 and not for more than 30 seconds 300 250 4 Target Profile 200 Soak Min Soak Max 150 Liquidous 100 Lower Target Upper Target 50 Absolute Peak 0 20 40 60 80 100 120 140 160180 200 220 240 260 280 300 320 340 360 Figure 8 2 Recommended Reflow Temperature Temperatures should
38. to be used for a wide number of long range wireless applications from simple cable replacement to complex multipoint applications where multiple radio links are active at the same time The complexity and flexibility of configuration are made simple for the design engineer by the integration of an extremely comprehensive set of AT commands supplemented with a range of S registers which are used for non volatile storage of system parameters To provide the widest scope for integration a range of different physical host interfaces are provided 5 1 UART Interface UART TX UART RX UART RTS and UART CTS form a conventional asynchronous serial data port with handshaking The interface is designed to operate correctly when connected to other UART devices such as the 16550A The signalling levels are nominal O V and 3 3 V and are inverted with respect to the signalling on an RS232 cable The interface is programmable over a variety of bitrates no even or odd parity stop bit and hardware flow control The default condition on power up is pre assigned in the external flash UART RTS and UART CTS implement two way hardware flow control UART RTS is an output and is active low UART CTS is an input and is active low These signals operate according to normal industry convention UART RX UART TX UART CTS UART_RTS UART RI UART DCD and UART_DSR are all 3 3 V level logic For example when RX and TX idle they sit at 3 3 V Converse
39. urs responsable des essais sur son produit final pour toutes exigences de conformit suppl mentaires requis pour ce module install IMPORTANT NOTE In the event that these conditions can not be met for example certain laptop configurations or co location with another transmitter then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product In these circumstances the OEM integrator will be responsible for re evaluating the end product including the transmitter and obtaining a separate Canada authorization NOTE IMPORTANTE Dans le cas o ces conditions ne peuvent tre satisfaites par exemple pour certaines configurations d ordinateur portable ou de certaines co localisation avec un autre metteur l autorisation du Canada n est plus consid r comme valide et l ID IC ne peut pas tre utilis sur le produit final Dans ces circonstances l int grateur OEM sera charg de r valuer le produit final y compris l metteur et l obtention d une autorisation distincte au Canada End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users The final end product must be labeled in a visible area with the following Contains IC Americas 1 800 492 2320 Option 2 25 CONN HIG BT740 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth
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