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QUALCOMM ASIC PRODUCTS CDMA ASIC PRODUCTS

1. The M SM 2300 is offered in 176 pin T QFP 196 ball provides the basic package di mensions for the 176 pin PBGA and 208 pin PQFP pre production use only TQFP package Figures 10 and 11 provide the basic packages package dimensions for the 196 ball PBGA package The 176 pin TQFP and 196 ball PBGA packages are Figure 9 MSM2300 176 pin TQFP Package Dimensions 26 00 BSC 24 00 BSC 12 00 13 00 13 00 24 00 BSC 26 00 BSC 12 00 4X4TPS s 14 1 60 D i MAX 0 50 BSC See Detail A 172 PLCS X AA ws SEATING PLANE 0 22 0 05 i 1 40 0 05 0 10 0 05 ma a Ps 176 PLCS ee 12 0 MIN RH Detail A R 0 08 MIN R 0 08 MIN 0 20 0 20 MAX GAGE PLANE E MIN D 0 25 12 0 60 40 15 3 52 3 5 1 1 00 REF 3 18 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 10 MSM2300 196 ball PBGA Package Dimensions Top View 15 0 20 13 0 25 10 57 REF 0 85 0 05 30 1 61
2. Figure 2 CSM1 0 Block diagram gt Searcher Demodulation Deinterleaver RX Data W Processor amp Packets RXQ Viterbi Decoder L3 y Four Fingers P N Sequence Generator TX Data Encoder ioii Tansmt TW Packets Summer TXQ Interleaver Cascade 1 Q Inputs CSM FUNCTIONAL OVERVIEW SEARCHER After selecting an antenna set for a search and programming the positi on and size of the search window the searcher initiates the search and finds the largest multipath peaks within the search parameter set Normally the searcher operates continuously while the results from a search are read the next search is already underway For acquisition searches the searcher results can be used to detect the presence of a mobile attempting to access the CDMA network For demodulator multi path searches fingers may be assi gned to the reported paths to improvethe demodulator performance of the rake receiver FOUR FINGERS The four fingers make up a front end interface to the demodulator The fingers provide timing Walsh chip accumulation and Walsh chip storage for the demodulation process Thefingers may be programmed to accept data from the same or differing antenna Sources 52 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject
3. and Q Tx Data MSM2 2 and Q Rx Data FMLIREX Deia Rx PCM Data DFM Vocoder RXIF gt Subsystem DFM Mode from RF Subsystem BBA2 WBD SAT CODEC TXIF 4 DIME PD to RF VOX Subsystem FM TX Data Tx PCM Data QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 2 9 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 186 MICROPROCESSOR AND PERIPHERALS The MSM 2 2 contains an embedded Intel 80C 186EC microprocessor and supporting peripherals including some QUALCOM M specific circuits such as the QUALCOMM Peripheral Control Unit QPCU The QPCU includes e A QUALCOMM Bus Interface Unit QBIU e A QUALCOMM Chip Select Unit QCSU e A QUALCOMM Wait State Generator QWSG Other related peri pherals include the Interrupt Subsystem Watchdog Timer and Universal Asynchronous Receiver Transmitter UART These peri pherals shown in Figure 7 extend the functionality of the MSM 2 2 The Interrupt Subsystem includes MSM2 2 Interrupt Controller Microprocessor internal interrupt controller The MSM 2 2 Interrupt Controller handles interrupt from various subsystems then performs a Bitwise OR to pass the interru
4. R5 VCONTROL 4 7K 1 R1 L5 Se 2 2U0H ee 500 50 OHMS 1000PF C5500 Inqdervertaticn Notes L 2 Inats oud aways be Choked Qipis re qanrdletr An FE dhea Figavelusd indutor is nadto poide DC Haestotheougr prs Bea _retheatnisaehbaadtoy aDXcHoda rg camita must be usadif the ne stage sint hsa BC pethtogord The inp opt intefae nay reoLire naichirg newarks However thisregLirerert isvery s4temdeperckrt The Kas incite istydicilly irccrperetedinthe rating newer betwesnthe ouput ard net sage VG inouss aid be bypassed to gound with abot a QOU F pedto keepirgtracecemredioaretoa nririmumlexn ILWIS SAL 00660 OT ANGH Q5505 ABSOLUTE MAXIMUM RATINGS beyond the min max ranges indicated in the Stresses above those listed under Absolute M aximum operational sections of this specification is not implied Ratings may cause permanent and functional damage Exposure exceeding absol ute maxi mum rating to the device Thisisastress rating only Functional conditions for extended periods may affect device operation of the device at these or any other conditions reliability Table 7 Q5505 Absolute Maximum Ratings PARAMETER SYMBOL MIN MAX UNIT NOTES Storage Temperature d To 30 sms oC Junction Temperature T3 3 ems vC w Seso Continuous RF Input Power o 45 Latchup insensitivity S e feo Esp Protein eT NOTES
5. 8 9 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Rx FM RB At25C e NL 80C dk At 30C pee fuo 3 11 10 8 10 6 0 0 6 1l 16 21 2 6 31 Vcontrol V e Supply Current vs Control Voltage 8 10 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 5a e Typical Q5500 Performance Characteristics Over Supply Voltage Range CDMA Mode Rx CDMA B At3 60V e i 3 18V he M 342 V 6 4 2 0 30 40 60 01 06 1 16 211 26 3l Vcontrol V a Gain vs Control Voltage Rx CDMA B At 3 60 V e it 3 18 V he i 342 V 70 l Gain dB b Gain Slope vs Gain Compression Linear Operating Operating Region Region 10 0 6 40 20 0 20 40 60 415 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 8 11
6. IIP3 ca 30 40 4 HO 5 35 25 15 5 0 5 15 25 35 d 9 Gain dB IIP3 gt 23 45 lt G lt 35 IIP3 gt 12 G 35 lt G lt 40 8 36 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Table 11a e Description of Q5505 Pin Functions a Hi Gain Digital Mode Differential Input Pin Functions SYMBOL PINS I O Type FUNCTION Differential Input Positive Differential Input N 2 DifferentialInput Negative Differential Input b Analog Gain Control Input Pin Functions SYMBOL PINS I O Type FUNCTION Vcoumo Analog Gain Control Input ERE Veowro 0 1 V Low Gain Rail Vua 3 0 V High Gain Rail c Analog Differential Output Pin Functions SYMBOL PINS I O Type FUNCTION Differential Output Analog Positive Differential Output ou 9 Differential Output Analog Negative Differential Output d Unconnected Pin Functions SYMBOL PINS I O Type FUNCTION PN unonededPin e Voltage Supply Pin Functions SYMBOL PINS I O Type FUNCTION 13 14 15 Voc Power Supply 3 4 5 6 7 11 12 Ground Connection 8 37 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard
7. TXVCO Tl TXVCO_T2 PD_OUT LOCK ADCIN TXD 7 0 TXCLK TXCLK SLEEP IDLE FM PD ISET ADCENA ADCDATA ADCCLK 44 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 630 kHz from the transmit IF center frequency of 130 38 MHz The analog and Q baseband components from the CDMA low pass filters are mixed in quadrature with unmodulated and Q signals at 130 38 MHz After mixing thel and Q IF components are summed and output differentially The 130 38 MHz I and Q LO signals are generated on the BBA2 Thetransmit VCO is set to 260 76 M Hz by an external varactor tuned resonant tank circuit An internal phase lock loop and external loop filter network provides the feedback to the varactors that tune the VCO precisely to 260 76 MHz A master slave divide by two circuit generates and Q signals in precise quadrature for the mi xers FM TRANSMIT SIGNAL PATH An analog FM modulation signal is constructed from 8 bit digital data supplied by the MSM Only the Q channel DAC is used in the BBA2 in FM Mode All other CDMA circuits are disabled The DAC output is filtered by alow pass anti aliasingfilter The filtered DAC output is the analog FM modulation signal
8. 619 658 5005 Fax 619 658 1556 POWER CONSUMPTION These values are an esti mation of maximum operating currents for a nominal Vpp 3 3 V This information should be used as a general guidelinefor system design CDMA Modes assume that the subscriber unit is operating in compliance with the CDMA specifications of IS 95 A FM Modes assume that the subscriber unit is operatingin compliance with the AM PS specifications of S 95 A Estimates for maximum power suppl y current are under the following conditions Vpp 3 3 V and Ta 25 C Table 5 shows the Power Supply Currents for M SM 2 2 operating modes Table 5 Power Supply Currents for MSM2 2 Operating Modes CDMA Rx Tx active full duplex operation M Rx Tx active full duplex operation Notes CDMA Rx idle CDMA Rx processor some buffering active all else shut down CDMA Sleep CDMA processor in Standby Mode some buffering active M Rx idle receive channel active transmit channel off 80 110 60 All of the above currents are highly software dependent They also depend upon vocoding rate microprocessor dock frequency and digital I O load characteristics 2 16 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephon
9. 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 The Viterbi decoder optimally decodes the convolutional coding from the base station The Viterbi decoder operates by finding the most likely path through the encoder trellis that produced the transmitted symbol stream In this way many modulation symbols that have been corrupted by noise can be recovered Quality bits and Cyclic Redundancy Code CRC bits are used to verify the quality of the decoded data CONVOLUTIONAL ENCODER AND INTERLEAV ER The encoder convolutionally encodes reverse link data frames The convolutional encoder block automatically inserts CRC bits for the reverse link frames The interleaver scrambles the reverse link data to protect the data against transmissi on fades and burst errors Thereverse link datais unscrambled by the base station s deinterl eaver MODULATOR The modulator performs the orthogonal modulation long code PN spreading and quadrature spreading The resulting data stream is then bandlimited with FIR filters and sent to the Analog Baseband Processor DIGITAL FM PROCESSOR The M SM 2 2 also supports Advanced M obile Phone System AM PS cellular operations The Digital FM DFM processor performs digital signal processing op
10. Figure 22 05500 and 05505 J 16 pin SSOP Packaging H H H H m H H m T 9 i se 1 rao o Note All dimensions in inches y Se oOo HH e ID 1 8 Yt NS N l P ul H H B di i oO o o 193 004 m gt 1 008 amp d a z 016 X 15 9 6 o i d EL f 2 H E S fo Sails AS J 7s 004 x H t H E 5 SEATING PLANE Y 025 010 L Led 026 REF REF g 9 8 44 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Q0500 RX AGC EVALUATION BOARD Q0505 TX AGC EVALUATION BOARD USER S GUIDE CONTENTS LO INTRODUCTION RR REA 9 1 2 0 GETTING STARTED 5etettet ita tees 9 2 2 1 Equipment Required 9 4 2 2 Q0500 and Q0505 Evaluation Board SetUp ctetu taire Ee 9 4 3 0 EVALUATION BOARD OPERATION 9 4 3L INPUTS 522 mie a 9 6 3 2 OUEDUES ri cr E EE EE ER 9 7 4 0 DESIGN HINTS eere 9 11 4 1 Power Supply Considerations and Decoupling eterne ee 9 11 4 2 RF Filtering and Isolation 9 12 4 3 Specific
11. Microprocessor Data Bus Read Write Chip Selects Interrupts General Purpose Input Output The MSM2300 offers 30 General Purpose Input Output pins GPIO for user definable features UART A UART is available for external access to subscriber unit RAM and ROM manufacturing test convenience User Interface The User Interface of the MSM2300 includes signals to and from the keypad ringer and LCD display of the subscriber unit eU e MSM2300 can directly interface with several industry standard CODECs The MSM2300 offers two CODEC interfaces for DECANE CODEDINISNUR icrophone earpiece interfacing in the subscriber un Digital Controls to from RF Circuits it SM2300 controls the gain of the receive and transmit AGC amplifiers receive and transmit signal path offsets in the Linear Controls to from RF Circuits chip the gain of the system LNA and the fine tuning of the system master frequency reference by way of Pulse Density ated signals A single pole RC low pass filter is used to convert the pulse streams to DC control voltages IEEE 1149 TAG Interface A full J TAG interface conforming with the IEEE 1149 standard is available for test and debug of subscriber unit subassemblies SM2300 interfaces with the general purpose ADC on the BBA2 chip This ADC is generally used for monitoring the General Purpose ADC Interface battery voltage RF power output level or temperature of the subscriber unit e MSM2300 may be ope
12. http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 B At3 60 V 70 Rx CDMA 0 A 3 78 V dk ht 3 42 V 60 50 40 Nose Figure dE 20 20 H1R At3 60 V 0 Gain dB 60 c Noise Figure vs Gain Rx CDMA 0 At3 78V dhk ht 342 V IPS dB a i 3 20 0 Gain dB 60 d Input IP3 vs Gain 8 12 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Rx CDMA E At 3 60 V 9 h 3 78 V k 342 V 11 10 8 10 6 d 104 10 2 10 98 01 0 6 11 16 ral 2 6 31 Vcontrol V e Supply Current vs Control Voltage QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 8 13 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 6a e Typical Q5500 Performance Characteristics Over Operating Temperature Range CDMA Mode 60 40 Gain dE o 20 40 60 0 1 0 6
13. CDMA Modes assume that the subscriber unit is operating in compliance with the CDMA specifications of IS 95 A FM Modes assume that the subscriber unit is operatingin compliance with the AM PS specifications of S 95 A Estimates for maximum power suppl y current are under the following conditions Vpp 3 3 V and TA 25 C Table 5 shows the Power Supply Currents for M SM 2300 operating modes As this is a single chip design the power supply current values include microprocessor DSP and CDMA functional Blocks Table 5 Power Supply Currents for MSM2300 Operating Modes Preliminary Information SYMBOL MODE j TYPKAL UNITS CDMA Rx Tx active full duplex operation 65 80 CDMA Rx idle CDMA Rx processor some buffering active all else shut down CDMA Sleep CDMA processor in Standby Mode some buffering active 35 Notes All of the above currents are highly software dependent They also depend upon vocoding rate microprocessor dock frequency and digital I O load characteristics QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 3 17 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 MSM2300 PACKAGING designed for production release phones Figure 9
14. San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 16 Q5505 Functional Block Diagram Temperature t i IN Compensation Voo IN E Voc Gain Control GND Vc GND Vc GND GND GND GND GND OUT N C OUT 8 38 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 99190 N 1n0U1IM uey 03 Palqns ea L6 6 Z OLEZZ 08 00g e s3onpoud DISV VINGD YSN 6LLZ IZIZ6 WD oberq ues pyene nog ASNT SSVI sinpoJd 2ISV peye4oduo2u WWODTIWNO 51se u2e poJg u05 uuuuo jenb ww d33u UJO2 UJUJ05 Jenb9 s3onpoJd 5ise ieuu 3 6 8 G00S 8S9 619 euoude P L 9SST 899 619 xe4 J3 6PINCON 3 6V_ 5 VCONTROL DAWNA ou ITF OUTPUT Ji SMACON T1 d e 3 458mpT 1024 l11 2T 2 5T C5505 Inqderrertaticon Notes slalla L IrpussPaidawaysbeDX Hod ed 2 Qinisaeqmcletao An F dckea hgradusd v indutor is reec dito poide DCiestotoea iar prs Baa reteaipisaebaadto aD Hoda rg peditor must be wif the next tag sirp r hsa BC pethtogurd A Teini adt inerfacerray ree irenaicthirg re
15. XTAL IN DIV 2 CHIPX8 and GPIO28 each as possible clock sources Both the M SM 2300 s CDMA VOX and DFM VOX have been enhanced over the M SM 2 2 for improved performance 34 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice The UART s Rx and Tx FIFO sizes are double the FIFO sizes of the M SM 2 2 The M SM 2300 s internal 80C 186EC serial port is available for use as a second UART The M SM 2300 M N counter has a larger range than the M N counter provided in the M SM 2 2 The M SM 2300 has improved clock management features over the M SM 2 2 Microprocessor power down during Slotted Paging Mode is now supported The M SM 2300 s electrical specifications mechanical specifications and pin functions are compatible with the M SM2 2 The M SM 2300 has many internal functional enhancements and new debugging features yet the programming requirements have remained as backwardly compatible as possible allowing a smooth migration from the M SM 2 2 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 DEVICE OPERATION This section explains the relationships between each of This section is divided into subsections representing the M SM 2300 subsystems and its internal blocks and the major subsystems Figure 2 shows the subsystems circui
16. incoming Rx data from the DFM subsystem to outgoing Rx PCM data for the CODEC The vocoder s Rx path also has SAT and DT MF detection circuits VOX anda de emphasis filter TheDFM subsystem performs voice and WBD operations for both Rx and Tx signals The DFM subsystem s T x path accepts voice data from the vocoder and interpolates it to a higher outgoing rate for the BBA2 The DFM subsystem s Rx path accepts I Q components from the BBA2 and decimates it to a lower http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 6 DFM Signal Flow from CODEC to BBA2 and Q Tx Data FM TX Data MSM2300 and Q Rx Data FUELS IDE Rx POM Data DFM Vocoder J RXIF Subsystem DFM Mode e from RF TXIF 4 4 DTME to RF VOX Subsystem Tx PCM Data outgoing rate for the vocoder Voice data processing is done independently from the microprocessor 186 MICROPROCESSOR AND PERIPHERALS The M SM 2300 contains an embedded Intel 80C 186EC microprocessor and supporting peripherals including some QUALCOM M specific circuits such as the QUALCOMM Peripheral Control Unit QPCU The QPCU includes e A QUALCOMM Bus Interface Unit QBIU e A QUALCOMM Chip Select Unit QCSU e A QUALCOMM Wait State Generator QWSG Other related peripherals include the In
17. mig e Z6 Ova e N z ps DNI DNI d R11 R3 I e w ES w ES gt e kd I oF gt cj e 9 a 3 e cu z z2 w le w le amp LUE e 2 C1 in 2 R 2 2_ o E m eo EN 10UF 2 opo H o MALA Em z 7 IK z 100UH Ee 9 LOW L2 RSS Slo g i n ere srk C2 m i e 2 C6 m 0 47UF I iHe nr S Sas ee qe C3 um Qz np t k RE g 1000PF 12 rm 8 NAE 15 C2 Y iz 2 v2 3 G2 BVI 1 i 3 0 PF Re e g sms C13 a Si JE z 3 e o 01UF T D5 2 Iw i wr P ST Slo Slo 2 STe T F 7 zo m oo to 4 Y c Ant c zo E cesta Ms o o1 ce no EEN pa ca N jo E QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice v 7o asa 98 0 DN CAT H 100 41 en 9 13 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 5 1 2 Q0505 TX AGC BOARD SCHEMATIC NI 41 c ON IJ 7031N02 NIV9 3 7HW0902 S UU J 63 N 7 td a m NI Ad 3d0001 b 3d000 S S0SS0 n punovg T el S i 3d0001 7HW0802 WAY E b l 7 ZS 3a 0 RT DNI N ay 7 nO ef 100 41XL 9 14 QUALCOMM Inco
18. of the result CDMA TRANSMIT SIGNAL PATH The BBA2 transmit signal path shown in Figure 4 accepts digital and Q baseband data from the MSM and outputs modulated IF centered at 130 38 MHz to the RF transmitter CDMA DIGITAL TO ANALOG CONVERSION AND FILTERS Eight bits of and Q transmit data are multiplexed over an 8 bit input port into the BBA2 CDMA DACs The transmit data rate is twice as fast as the differential transmit clock TXCLK and TXCLK Incoming data that is valid during the rising edge of the transmit clock is registered into the DAC Incoming data that is valid during the falling edge of the transmit clock is registered into the Q DAC and Q transmit data values have been compensated in the MSM to account for their 2 clock cycle time difference The frequency spectrum at the output of the CDMA DACs contains unwanted frequency components due to DAC output transition edges and transients The transmit clock frequency and harmonics are found in the spectrum and are also undesirable Each CDMA DAC is followed by an anti aliasing low pass filter with a bandwidth of 630 kHz that reduces unwanted frequency components Unlike the low pass filters in the receive signal path these low pass filters do not require offset controls UP CONVERTING TO IF The BBA2 transmit path outputs a differential IF signal with CDMA spread spectrum modulation extendi ng Figure 4 BBA2 Transmit Section Block Diagram FM MOD TXIF TXIF
19. 0 19 E Ball 1A corner Ball 1A identifier 1 0 Dia 15 0 20 13 0 25 10 57 REF 45 Chamfer 4 places L 0 36 0 04 Seating Plane 0 40 0 10 Coplanarity 0 15 0 006 inches Solderball Material is 63 Sn 37 Pb 3 19 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 11 MSM2300 196 ball PBGA Package Dimensions Bottom View Ball AB CDEFGH JK LMN P 1A corner OOoOOOOOO0O000000 OOOOOOO0O0O000000 OOOOOOOO0O000000 OOOOOOO0O0O000000 OOOOOOOO0O000000 OOoOOOOO0O0O000000 OOOOOOOO0O000000 OOoOOOOO0O0O000000 OOOOOO0O0O0O000000 OOOOOO0O0O0O000000 OoOooooooooooooo OOOOOOOOO0O00000 o0000000000000 0poooooooooooo nae UE 0 4 min BOTTOM VIEW R 1 0 3 places 320 QUALCOM M Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Q5312 ANALOG BASEBAND PROCESSOR BBA2 OVERVIEW APPLICATION DESCRIPTION The QUALCOMM Analog Baseband Processor BBA 2 also known as Q5312 is designed for u
20. 1 25 dBm 25 lt Gain lt 45 dB 8 22 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Table 6a g Description of Q5500 Pin Functions a Hi Gain Digital Mode Differential Input Pin Functions SYMBOL PINS I O Type FUNCTION Differential Input Positive Differential Input N 2 Differentialinput Negative Differential Input b Low Gain Analog Mode Single Ended Input Pin Functions SYMBOL PINS I O Type FUNCTION FM IN Single Ended AC Input Single Ended Analog Input c Analog Gain Control Input Pin Functions SYMBOL PINS I O Type FUNCTION Vcoumo Analog Gain Control Input ias Veo 0 1 V Low Gain Rail Veowrpo 3 0 V High Gain Rail d Analog Digital Mode Select Input Pin Functions SYMBOL PINS J I O Type FUNCTION Vsuga 2 3 4 V Digital Mode Select e Analog Differential Output Pin Functions SYMBOL PINS J I O Type FUNCTION Differential Output Analog Positive Differential Output ouT 9 Differential Output Analog Negative Differential Output f Unconnected Pin Functions SYMBOL PINS J WOType FUNCTION Lo NC uUnonededPin g Voltage Supply Pin Functions SYMBOL PINS J WOType FUNCTION 13
21. 14 15 Voc Power Supply 3 6 11 12 Ground Connection ACGND AC Ground Analog Ground Connection 8 23 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 9 Q5500 Functional Block Diagram Temperature V Compensation CONTROL Gain Va Control Ve Vc GND GND OUT OUT 8 24 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 39 30 N 3nou1IM e6ueu o1 efqns eq L6 6 Z OLEZZ 08 00g e s3onpoud DISV VINGD YSN 6LLZ IZIZ6 WD oberq ues pyene nog ASNT SSVI sinpoJd 2ISV peye4oduo2u WWODTIWNO 51se u2e poJg u405 uuuuoo jenb ww d33u UJ02 UJUJ0 Jenb9 s3onpoJd 5ise ieuu 3 GC8 G00S 8S9 619 euoude P L 9SST 899 619 xe4 EJgd 6PINCON 3 2 3 6V 3 Ca 5 MODE 6 J2 c2 t3 6V O1Ur cs 1000PF SMACON BALUN 2 t 50 500 OH J4 T2 SMACON BALUN_2 L3 2 7UH R2 5500 c5 1000PF y oe BALUN_2
22. 2 Sig Path 2 Sig Path 3 GND 4 0 DESIGN HINTS 4 1 POWER SUPPLY CONSIDERATIONS AND DECOUPLING The Q5500 and Q5505 AGC amplifiers are designed for use in battery operated portable phones As such the devices should be powered by regulated 43 6 V power supplies In the Q0500 and Q0505 AGC Evaluation Boards standard vari abl e voltage supplies provide satisfactory operation In battery powered telephone applicati ons use of dedicated voltage regulation is strongly recommended T he voltage regulator used by the AGC should be a linear voltage regulator not a switching regulator to keep power supply noise on the inputs of the AGC amplifiers as low as possible The recommended power supply voltage range of the Q0500 and Q0505 AGC Evaluation Boards is 3 42 V to 3 78 V 3 6 V 596 It is recommended that the voltage regulator have at2 accuracy so the proper output voltage can be maintained over the temperature range of the tel ephone and over the power supply current range of the AGC Power supply decoupling on the Q0500 and Q0505 is accomplished using a 0 01 uF ceramic chip capacitor on the Vcc pins Additional 10 uF 0 47 uF and 1000 pF decoupling capacitors in parallel with the 0 01 uF capacitor and a 100 nH choke inductor are used to further reduce noise on the power supply inputs to the AGC amplifiers On the Q0500 and Q0505 the LC filtering elements just mentioned are arranged in a pi configuration as shown in Figure 14 9 11
23. 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice primary and auxiliary interfaces The primary interface is normally used as the main CODEC interface The auxiliary interface may be used for hands free mobile operation GPIO Interface The General Purpose Input Output Interface includes 31 I O connections and five interrupts The GPIO interface supports communications between the internal microprocessor and external peripherals M ode Select Interface The M ode Select Interface supplies three M SM 2300 176 or four inputs M SM 2300 208 allowingthe user to change the M SM 2300 operating state between M ICE M ode 208 pin devices only NATIVE M ode and high impedance HI Z M ode Keypad Interface The Keypad Interface allows a connection to an external keypad Ringer Interface TheRinger Interface may be programmed to generate a Single Tone or DT MF output M N Counter Interface TheM N Counter Interface produces a programmable frequency programmable duty cycle counter that can be used to switch a supplemental switcher power supply or make a tone UART Interface The UART Interface is a serial communication link that can be used to test debug or upgrade the subscri ber unit s functions JTAG Interface The M SM 2300 complies with AN SI IEEE 1149 1 1990 the Joint Test Action Group JTAG interface TheJTAG interface may be used to te
24. 8 bit or 16 bit external RAM Two spare Pulse Density M odulated PDM outputs for user defi ned analog control One spare general purpose programmable M N counter output One programmable ringer output Internal ringer generation circuitry without driver MSM2300 ENHANCEMENTS OVER MSM2 2 Through integration the M SM 2300 consumes significantly less power and provides more flexibility than QUALCOM M s M SM 2 2 The M SM 2300 searcher engine can operate at rates up to eight times faster than the searcher provided in the M SM 2 2 allowing for faster acquisition and neighbor list search intervals The M SM 2300 searcher reports the best four local maxima peaks per search window reducing microprocessor overhead Also the M SM 2300 33 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 searcher reports the position of the multi path peaks with a higher resolution allowing greater precision than the searcher provided in the M SM 2 2 e The M SM 2300 uses an enhanced Viterbi decoder resultingin a 0 5 0 7 dB improvement in 14 4 kbps rate set operation as compared with the M SM 2 2 TheM SM 2300 s RF subsystem has been enhanced over the M SM 2 2 to improve intermodulation spurious response attenuation as outlined in IS 98 Section 9 4 3 e The MSM 2300 vocoder clock source is more flexible than the M SM 2 2 and now includes XTAL IN DIV 3 GPIO28 DIV 2
25. Engine FHT E offering significant performance advantages as well as a high performance search engine For higher quality communications the searcher connected to a series of antennas identifies optimum multipath peaks The CSM also supports three way softer hand off PERFORMANCE Integrati ng the modulator demodulator Viterbi decoder and their associated components into the CSM reduces the microprocessor overhead requirements eliminates the need for external transmit summer circuitry and allows for greater board density Improvements in the demodulator including an opti mal soft decision combi ning technique provide performance i mprovements of 1796 to 9096 0 7 to 2 8 dB with a minimum 50 1 7 dB average over QUALCOMM s Base Station Chipset These improvements lower the output power requirements of the mobile station resulting in a notable increase in total channel capacity Figure 1 Block Diagram of the CSM1 0 in the Cell Site Microprocessor Backhaul Buffer gt Packets Receive Send f gt CM CSM m CM gt X QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 U SA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 5 1 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556
26. IP3 vs Gain 8 33 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Tx WI A25C 9 AL 80C A amp At 30C 25 20 15 3 10 5 0 01 0 6 11 16 21 2 6 3 1 Vcontrol V e Supply Current vs Control Voltage 8 34 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 14 Q5505 Cascaded NF Model 45 35 21 j E E p qp j j 25 15 5 5 15 Gain dB NF lt 14 5 G 45 lt G lt 20 dB Gain NF lt 24 75 0 4875 G 20 lt G lt 20 dB NF lt 15 20 lt G lt 40 dB 15 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 8 35 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 15 05505 Cascaded IIP3 Model 0 10 20
27. Internal programmable wait state generator Designed to operate with up to 20 MHz microprocessor clock rates MSM2 2 SUPPORTED INTERFACE FEATURES Support for up to two external u Law A Law or linear CODECS from various manufacturers Internal bi directional serial data port with 32 byte RX and 32 byte TX FIFO buffers and hardware handshaking Direct interface to Analog Baseband Processor BBA 2 0 5312 M ore than 30 general purpose I O pins several with interrupt capability Support for an external keypad Support for up to 1 M Byte of external RAM amp ROM and supports up to 1 M Byte of EEPROM with optional bank switching Support for either 8 bit or 16 bit external RAM Two spare Pulse Density M odulated PDM outputs for user defi ned analog control One spare general purpose programmable M N counter output One programmable ringer output Internal ringer generation circuitry without driver 2 3 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 DEVICE OPERATION This section explains the relationships between each of This section is divided into subsections representing the M SM 2 2 subsystems and its internal blocks and the major subsystems Figure 2 shows the subsystems circuits It also describes how the device performs blocks and circuits within the M SM 2 2 and their signal processi ng tasks within the subscriber unit interconnection to areas w
28. Leakage Current level Three State Leakage Current evel Three State Leakage Current with Pull Down evel Three State Leakage Current with Pull Up evel Three State Leakage Current with Keeper W level Three State Leakage Current with Keeper utput Short Circuit Curren gh level Output Voltage CMOS Schmitt evel Output Voltage CMOS Schmitt put Capacitance EE s 5 z T c2 DH NC el ce wN gt o 2 on cer ejr E s cn e 5 n I c gt Y lt e S co oOo e oOo r o z izizix zi I 7 7 al lale gt lt 5 o T lt Oy Notes Vpp Vpp Max at Vpp Vpp Min 1 Pin voltage Vpp Max For keeper pins pin voltage Vpp Max 0 45 Volts 2 Pin voltage Vss and Vpp Vpp Max For keeper pins pin voltage 0 45 Volts and 3 Refer to Tables 3 1 in User Manual for which pins have pull ups pull downs and keepers 4 Refer to Tables 3 1 in User Maunual for lop and lo current capacity for output pins B i ce w Cn c is mm rale w No 99 ce 99 als o c c ro ro S Nje co co co co p QUALCOM M Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 2 15 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone
29. M odes Supervisory Audio Tone SAT transponding in FM M ode nternal Voice Operated Switch VOX MSM2300 MICROPROCESSOR SUBSYSTEM FEATURES Embedded industry standard Intel 80C 186EC microprocessor subsystem nternal watchdog and sleep ti mers nternal interrupt controller with support for both internal and off chip interrupt driven devices nternal DMA controller with support for searcher DMA transfers on chip only QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice Internal chip select circuitry with direct support for RAM ROM FLASH EEPROM an LCD display and two other devices Internal address latches for demultiplexed address data busses Internal programmable wait state generator Designed to operate with up to 20 MHz microprocessor clock rates MSM2300 SUPPORTED INTERFACE FEATURES Support for up to two external u Law A Law or linear CODECS from various manufacturers Internal bi directional serial data port with 64 byte RX and 64 byte T X FIFO buffers and hardware handshaking Direct interface to Analog Baseband Processor BBA 2 Q 5312 More than 30 general purpose I O pins several with interrupt capability Support for an external keypad Support for up to 1 M Byte of external RAM amp ROM and supports up to 1 M Byte of EEPROM with optional bank switching Support for either
30. Q5160I 281 88 gS CD90 10890 1 ESD A 5 g 1DN14 COUNTRY AA 3 SUPPLIER P N is 8 83 88 DATE CODE LOT CODE Pin 1 Index a Mec ot 5 16 eee l m iz 2 55 0 100 min i 3 05 0 120 max a 3 40 0 134 max ecd j a M 50 16 0 65 0 026 BSC Dimensions are in millimeters inches QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 5 7 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Q5165 CELL SITE MODEM CSM1 5 OVERVIEW The Cell Site Modem CSM developed by QUALCOMM Incorporated is a CDMA digital baseband modem incorporating three individual integrated circuits into a single device previously a six device set The CSM integrates the CDMA Modulator CDMA Demodulator and Serial Viterbi Decoder modules to provide reduced costs and improved functionality for the base station The device also improves performance with the CDMA subscriber unit The CSM provides QUALCOM M s CDMA licensees with an IS 95 compliant system and a PCS compliant system at 14 4 kbps on a single device The CSM includes a high precision Fast Hadamard Transform Engine FHT E offering significant performance advantages as well as a high performance search engine For higher quality communications the searcher connected
31. QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 14 Power Supply LC Filtering Configuration E Vc Cl 10 pF Q 0 47 uF 3 1000 pF Lf 0 01 uF 4 2 RF FILTERING AND ISOLATION In order for the Q5500 and Q5505 AGC amplifiers to deliver both positive and negati ve going output signals using asingle power supply the differential AGC output pins must be DC biased to a voltage level allowing full signal swing In the case of the Q0500 and Q0505 Evaluation Boards 3 6 VDC biasing is applied to the amplifier output pins by means of RF filtering 3 3 nH chokes or chip inductors connected between Vcc and the output pins Thesetwo inductors provide an electrical connection for supply voltage to bias the amplifier outputs while isolating them from unwanted RF energy present at the power supply The RF isolation also works to prevent AGC signal energy from contaminating the power supply which may be sourcing power for other circuit blocks 4 3 SPECIFIC FREQUENCY TUNING The Q0500 and Q0505 Evaluation Boards are desi gned to provide maximum flexibility and optimal performance over the entire 10 MHz to 300 M Hz bandwidth of the Q5500 and Q5505 amplifiers Wideband perfor
32. SM 2 2 searcher reports the position of the multipath peak DEMODULATING FINGERS The M SM 2 2 contains three identical demodulating fingers Each demodulating finger performs the following on its assigned signal path Quadrature despreading Walsh uncovering Frequency tracking Timetracking COMBINING BLOCK The combining block is made up of three functional blocks Symbol combiner Carrier frequency error combiner Power combiner The symbol combiner combines the modulation symbols recei ved by each of the demodulating fingers performs long code PN despreading creates mobile station ti ming references and compensates for oscillator drift The carrier frequency error combiner combines and processes the frequency error information provided by each of the three demodulation fingers The power combiner processes the power control bits demodulated by each finger and sends a power control decision to the closed loop AGC circuit DEINTERLEAVER AND VITERBI DECODER The deinterleaver is used to reverse the interleaving performed by the base station Interleaving provides protection against burst errors and fades Figure 5 CDMA Digital Baseband Processor Block Diagram Three Demodulating Fingers Rx and Rx Q Block Tx Data Packets Interleaver Combining Viterbi Decoder Rx Data Deinterleaver Packets TI Modulator and TQ 2 8 QUALCOMM Incorporated ASIC Products
33. Supply Current vs Control Voltage 8 16 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Table 5 Q5500 Noise Figure Standard Deviation X3 Gain FM Mode Standard CDMA Mode Standard dB Deviation X3 Deviation X3 QUALCOM M Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 8 17 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 7a Q5500 CDMA Mode Noise Figure Mean 3xStdev 30C NF dB MEAN 3 Stdev NF Typical 4 039092 e 09 G5 4 1640940 07 G 7 80438e 06 G3 6 321204e 03 G 0 466927 G 15 7323 Figure 7b Q5500 CDMA Mode Noise Figure Mean 3xStdev 25C of LTT ETE ETT ttt tT yi itt iti ttt tt tt tt 45 PT tT TTT TT TT anne E ZZ 0 45 40 35 30 25 20 15 40 5 0 5 10 15 20 25 30 235 40 45 Gain dB MEAN 3 Stdev NF Typical 1 499369e 09xG5 4 156002e 07 G 1 6775156 06 G 6 3550756 03 G 0 454722xG 415 8378 0 18 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego C
34. W At 25C Rx CDMA At 80C 3k At 30C a Gain vs Control Voltage 16 Vcontrol V Rx CDMA 21 2 6 341 Mm At25C At 80C 3k At 30C 60 Compression Linear Operating Operating Region Region 10 0 6 40 2 2 40 60 41 5 Gain dB b Gain Slope vs Gain 8 14 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Rx CDMA WI At 25C At80C k At 30C 6 5 4 bs 2 1 0 60 40 20 0 20 40 60 Gain dB c Noise Figure vs Gain Rx CDMA BI At25C At 80C amp At 30C 0 10 20 30 40 50 60 60 40 20 0 20 40 60 Gain dB d Input IP3 vs Gain 8 15 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Rx CDMA WI A25C At 80 a At 30C 8 6 4 HUE 3 10 9 8 9 6 0 0 6 13i 16 21 26 31 Vcontrol V e
35. Without N otice Fax 619 658 1556 3 1 INPUTS 3 1 1 POWER SUPPLY REQUIREMENTS One dual or two single variable voltage 50 mA capability power supplies are required to operate the Q0500 or Q0505 AGC Evaluation Boards One supply provides 3 6 V to Vcc and the other supplies 0 1 to 3 0 V to the Gain Control pin on the evaluation board There are no visual indications on the evaluation boards showing that power has been applied or that it is at the appropriate voltage level Supply voltage is conditioned by on board inductors and capacitors to filter unwanted noise and to isolatethe signal path from the power supply 3 1 7 POWER TRANSFER TO THE Q0500 Q0505 An RF signal applied to either the Q0500 or Q0505 will experience power loss due to the impedance mismatch between the 50 Q signal source and the 1000 Q input impedance Q0500 FM 850 Q of the AGC amplifiers To minimize power loss due to impedance mismatch a resistive matching network consisting of a transformer and parallel resistor has been designed into the input stage of both the Q0500 and Q0505 The loss due to each transformer is approximately 0 7 dB Resistors R4 and Q0500 R 12 were added in parallel with the input impedance of the AGC amplifier to bringthe equivalent parallel resistance to 200 O When transformed down by means of the 2 to 1 turns ratio transformer the 200 Q impedance is matched to 50 2 Combined power losses due to thetransformer and resistive matching networ
36. automatically ignore those samples 6 3 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 INPUT OUTPUT SIGNALS Figure 3 shows the functions provided by the CSM 1 5 s pins and the size of its 100 pin TQFP package Table 1 provides descriptions of the pin functions Figure 3 Q5165 Cell Site Modem 100 pin Functional Diagram Alpha Sector and Q Tx Outputs Beta Sector and Q Tx Outputs Gamma Sector and Q Tx Outputs 16 mm x 16mm Beta Sector and Q Rx Inputs Gamma Sector and Q Rx Inputs Alpha Sector and Q Cascade Inputs Beta Sector and Q Cascade Inputs Gamma Sector and Q Cascade Inputs Alpha Sector Q5165 CSM1 5 and Q Rx Inputs 100 Lead TQFP Package Microprocessor Address Bus Microprocessor Data Bus ALE WAIT DMA Read Write Chip Selects Interrupt Clock and Synchronizing I O IEEE 1149 JTAG Interface 6 4 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Table 1 CSM 1 5 Pin Functions The CSM1 5 relies upon external microprocessors for initializatio
37. filtered to develop DC voltages for controlling amplifier and oscillator components in the subscriber unit s RF subsystem The RC filtering of PDM signalsis shown in Figure 4 The RC components are located between the M SM 2300 and the analog control voltage input of the controlled component The low pass RC filter produces a low ripple DC control voltage for AGC amplifiers and other analog circuit functions Pulses from PDM outputs have a rate of occurrence density proportional to a corresponding digital PDM value determi ned by or stored in the M SM 2300 The density of the PDM pulse stream is the number of pulses that occur within a given timeinterval For example in Figure 4 pulse densities of 2596 5096 and 7596 are shown from left to right respectively The pulse stream is smoothed using a single pole RC low pass filter The DC component of the filtered pulse stream is directly proportional to the density of the pulse stream multiplied by thelogic high voltage Vou of the M SM 2300 The operating mode DFM or CDM A determines the PDM clock frequency and pulse width In DFM Mode the PDM clock rate is TCXO A 4 92 MHz and the minimum pulse width is 203 ns In CDMA Mode the PDM clock rateis CHIPX8 9 8304 M Hz and the minimum pulse width is 101 7 ns Figure 4 Digital PDM and Filtered Analog Waveforms PDM clock a tpw PDM out 0 0 V Pulse Density 25 100 4 Pulse Density 50 l Ef A g
38. it detects speech coming up it doubles the encoding rate to rate then 12 rate as the intensity increases then full rate during high energy speech while achieving full rate voice quality at all times As speech drops off the process reverses falling first to rate then l4 rate then rate for the background noise In reality the actual average data rate is significantly less than 1 7 of full rate Variable rate vocodi ng cannot help TDMA because it isincapable of providing for variable rate packet sizes in a way that would allow additional sharing of the channel POWER CONTROL One of the keys to the success of CDMA is the power control technology developed by QUALCOMM Through the use of sophisticated open loop and closed loop control circuitry the system constantly monitors and adjusts mobile unit power output to the minimum level required to maintain optimum clarity and quality http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 of voicereception The open loop circuit monitors the transmitted signals from the cell which allows the mobile to predict the transmitter power necessary to reach the cell Theclosed loop circuit evaluates the actual quality of the transmission at the cell station and adjusts each mobile unit s power to the minimum level required to maintain high quality voice performance This breakthrough in power control technology equalizes
39. optimal soft combining of data from the fingers and performs power calculations including lock detection and power control decisions DEINTERLEAVER amp VITERBI DECODER The deinterleaver is used to reverse the interleaving performed by the mobile unit Interleaving provides protection against burst errors and fades The Viterbi decoder using the Viterbi algorithm optimally decodes the convolutional coding from the mobile unit Quality bits and CRC bits are used to verify the quality of the decoded data PN SEQUENCE GENERATORS There are several PN generators within the CSM The PN sequences generated are the channel Q channel and long code sequences for both forward and reverse link processing http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 ENCODER amp INTERLEAV ER The encoder takes forward link data frames convolutionally encodes them and performs symbol repetition for bit rates less than full rate The encoder also automatically generates CRCs for the frames that require them The interleaver is used to provide time diversity in transmitted symbols thereby providing protection from relatively long transmission fades and burst errors The effects of the interleaver are reversed in the mobile unit deinterleaver MODULATOR The modulator contains three individually programmable sections that generate forward link information streams from the int
40. products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 SUPPORTING INTERFACES Several interfaces in the M SM 2 2 support other devices within the subscriber unit and provide connecti ons to external peripheral components These interfaces support board testing and other subscriber unit operations A brief description of each of these interfaces is given below 1 BBA2 Interface The Interface that the M SM 2 2 and the BBA2 share includes a CDM A FM transmit and Q channel data bus separate CDM A FM receive data busses and an interface to the General Purpose ADC on the BBA2 TheM SM 2 2 also receives the BBA2 CHIPX8 and TCXO A clock signals 2 External CODEC Interface The External CODEC interface consists of both primary and auxiliary interfaces The primary interface is normally used as the main CODEC interface The auxiliary interface may be used for hands free mobile operation 3 GPIO Interface The General Purpose Input Output Interface includes 31 I O connections and five interrupts TheGPIO interface supports communications between the internal microprocessor and external peri pherals QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice M ode Select Interface TheM ode Select Interface supplies three M SM 2 2 176 or four inputs M SM 2 2 208 allowingthe user to change the M SM 2 2 ope
41. summer adds a parity bit to the output samples and can also do parity checks on the cascade input samples If the samples fail the parity check the transmit summer can automatically ignore those samples 5 3 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 INPUT OUTPUT SIGNALS Figure 3 shows the functions provided by the CSM 1 0 s pins and the size of its 100 pin PQFP package Table 1 provides descriptions of the pin functions Figure 3 Q5160 Cell Site Modem CSM 1 0 100 pin Functional Diagram Microprocessor Address Bus Alpha Sector and Q Tx Outputs Microprocessor Data Bus Beta Sector and Q Tx Outputs Gamma Sector and Q Tx Outputs Alpha Sector and Q Rx Inputs Read Write Chip Selects Beta Sector and Q Rx Inputs Interrupt Gamma Sector and Q Rx Inputs Clock and Synchronizing I O Alpha Sector and Q Cascade Inputs Beta Sector and Q Cascade Inputs IEEE 1149 JTAG Interface Gamma Sector and Q Cascade Inputs 5 4 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com Telephone 619 658 5005 CDMA ASIC Products Data Book 80 22370 2 9 97 Fax 619 658 1556 Data Subject to C
42. the power of each mobile at the cell site regardl ess of how close or far away it is from the tower Equalizing the power level makes each mobile unit look the same to the cell site and minimizes the total interference Minimizing power output also results in significant advantages in battery power conservation QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice CDMA SYSTEM MAINTENANCE Systems engineering will be easier with CDMA than other technologies because unlike other systems CDMA requires very little frequency coordination Thisis dueto the fact that the same frequency band is reused in every cell Additionally as a system grows it will not be necessary to continually re engineer the existing system to coordinate frequencies QUALCOMM and PureVoice are registered trademarks of QUALCOMM Inc 1 3 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 3210 MOBILE STATION M ODEM MSM2 OVERVIEW APPLICATION DESCRIPTION The dual mode Code Division M ultiple A ccess Advanced M obile Phone System CDM A AM PS cellular telephoneis a complex consumer communi cations instrument that relies heavily upon digital signal processing To simplify the design and reduce the production cost of the subscri ber unit QUALCOMM has develo
43. to a series of antennas identifies optimum multipath peaks The CSM also supports three way softer hand off PERFORMANCE Integrating the modulator demodulator Viterbi decoder and their associated components into the CSM reduces the microprocessor overhead requirements eliminates the need for external transmit summer circuitry and allows for greater board density Improvements in the demodulator including an opti mal soft decision combining technique provide performance i mprovements of 1796 to 9096 0 7 to 2 8 dB with a minimum 50 1 7 dB average over QUALCOM M s Base Station Chipset These improvements lower the output power requirements of the mobile station resulting in a notable increase in total channel capacity Figure 1 Block Diagram of the CSM in the Cell Site Microprocessor Backhaul packets Buffer Receive Send gt CM CSM TX CSM f QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 U SA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 6 1 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 2 CSM Block diagram gt Searcher Demodulation Deinte
44. 1 Method meets the intent of J EDEC STD 17 Publication and is the maximum allowable current flow through the input and output protection diodes 2 Method meets the intent of MIL STD 883 Method 3015 Table 8 Q5505 Operating Range PARAMETER SYMBOL MIN MAX UNIT Operating Voltage Relative to GND Table 9 Q5505 DC Electrical Parameter PARAMETER SYMBOL MIN MAX UNIT NOTES Supply Current i 2 imi 0 26 QUALCOM M Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Table 10 Q5505 Electrical Characteristics PARAM ETER VALUE NOTES TX AGC Frequency 130 38 MHz Gain Flatness 630 kHz 0 25 dB TX Power Gain Vcontrot 0 1 V G lt 45 dB 1 Veontrot 3 0 V G gt 40 dB 3 70 dB V Maximum Over Specified Gain Region he 1 4 3 Power Gain Slope 45 to 40 dB i 0 dB V Minimum Over Specified Gain Region 45 to 40 dB Power Gain Slope Linearity Over and 6 dB Gain Segment 3 0 dB V 4 12 4 NF for AGC Input Figure 14 IIP3 Figure 15 IF Input Impedance Differential 1k 3 159 lt 1 pF Capacitive IF Output Impedance gt 10 k Q lt 1 pF Capacitive Gain Control Pin Input Impedance gt 30 KQ lt 50 pF Capacitive O Stabilit Over Full AGC
45. 2 mn p 5 6 QUALCOM M Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 PACKAGING AND MARKING The Q5160 CSM 1 0 is available in a 100 pin PQFP package shown in Figure 4 Figure 4 Q5160 CSM1 0 100 pin PQFP Package Outline 22 95 0 904 min E 23 45 0 923 max 19 90 0 783 min i 20 10 0 791 max T 18 85 0 142 ref CY a a I QUALCOMM TTE I
46. 3 1 to 3 20 Q5312 ANALOG BASEBAND PROCESSOR BBA2 Section 4 4 1 to 4 10 Q5160 CELL SITE MODEM CSM 1 0 Section 5 2s case deus coadacen dina Ee ERE Et RED Ee eed 5 1 to 5 7 O51G5CELLSITE MODEM C SM 1 5 Section 6 ceteri ric tote tete Ete iniii 6 1to 6 7 Q5182 FRAME INTERFACE AND ROUTER MODULE FIRM ASIC Section 7 snm 7 1 to 7 5 Q5500 IF RECEIVE AGC AMPLIFIER Q5505 IF TRAN SMIT AGC AMPLIFIER Gecti Rc MR TU stu oases heaves oiaves Meath A E EN ATONE ENE ENN 8 1 to 8 44 Q0500 RX AGC EVALUATION BOARD Q0505 TX AGC EVALUATION BOARD GectioM 9D issesci ds scete ce5ses5cecuccnace eluasesostageuheesnassheveansuaeveeasueyuensuieseeusuhesSegsuheseeeruneseeweheeeeesshesganscleseearmnsteaneheneaes 9 1 to 9 17 Copyright 1997 QUALCOMM Incorporated All rights reserved QUALCOMM and QCELP are registered trademarks of QUALCOMM Incorporated CDMA on a Chip and Pure Voice are trademarks of QUALCOMM Incorporated QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 INTRODUCTION TO CDMA CDMA OVERVIEW Code Division M ultiple Access CDM A is based on technology originally developed by the Allies during World War II to resist enemy radio jamming It has been signifi cantl y ref
47. 35 30 25 20 15 40 5 0 5 10 15 20 25 30 35 40 45 Gain dB m MEAN 4 3 Stdev NF Typical 1 099614e 08 G 3 103353e 07 G 3 183561e 05 G 6 640703e 03xG 0 489305 G 15 4513 8 20 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA http www qualcomm E mail asic prod com ProdT ech asic t 4 oducts qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 otice Data Subject to Change Without N Fax 619 658 1556 Figure 8a Q5500 IIP3 CDMA Mode 0 20 IIP3 cem 30 40 50 ACCEPTABLE IIP3 CDMA REGION 4 35 4 Gain dB IIP3 gt 7 dBm 45 lt Gain lt 40 dB IP3 gt 0 276923 Gain 18 07692 dBm 40 lt Gain lt 25 dB IIP3 gt 0 95 x Gain 1 25 dBm 25 lt Gain lt 45 dB CIN LN LN 5 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 8 21 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 8b Q5500 IIP3 FM Mode 0 10 ACCEPTABLE IIP3 FM REGION 12 20 30 50 45 35 25 15 5 0 5 15 25 35 45 31 Gain dB 12 lt 5 dBm 45 lt Gain lt 27 dB IIP3 gt 0 25 x Gain 18 75 dBm 27 lt Gain x 25 dB IIP3 gt 0 95 Gain
48. 6 51 Vcontrol V a Gain vs Control Voltage Rx FM B At 3 60 V 9 NE 3 78 V dk ht 342 V gt Compression Linear Operating Operating 2 Region Region 1 0 60 40 20 0 20 40 60 35 Gain dB b Gain Slope vs Gain 8 5 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Rx FM H A380V e H37BV A At342V 6 5 4 g i 3 2 1 0 60 40 20 0 20 40 60 Gain dB c Noise Figure vs Gain Rx FM B At 3 60 V e ht 318 V ae k 342 V 1 2 E 4 5 4 6 40 20 0 20 40 6 Gain dB d Input IP3 vs Gain 8 6 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Rx FM H A360V e A318 V a 342 V 8 J 6 fus EH 4 3 2 01 06 11 16 21 26 3l Vcontrol V e Supply Current vs Control Voltage QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevar
49. 658 1556 INPUT OUTPUT SIGNALS Figure 5 shows the functions provided by the BBA 2 s pins and the size of its 80 pin TQFP package Table 1 provides descriptions of the pin functions Figure 5 Q5312 BBA2 Analog Baseband Processor Functional Diagram Differential Analog Tx IF for CDMA Differential Analog RX IF for CDMA and AMPS Audio Output for Frequency Modulation Rx and Tx VCOs TCXO Frequency Reference Rx and Tx PLL Interface Rx Digital Baseband Data for CDMA and AMPS Tx Digital Baseband Data for CDMA and AMPS and Q Baseband Offset Adjustment Mode Select Clocks General Purpose ADC Interface 4 6 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Table 1 BBA2 Pin Functions PIN FUNCTIONS DESCRIPTION Rx Digital Baseband Data for CDMA The BBA2 chip converts the receive IF signal from the RF subsystem of the subscriber unit to digital baseband data for both and AMPS CDMA and AMPS Tx Digital Baseband Data for CDMA The MSM2300 MSM2 2 generates transmit digital baseband for the BBA2 chip The BBA2 chip converts that data to an and AMPS analog IF frequency of the subscriber unit DC offsets i
50. A 92121 2779 USA oducts qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 http www qualcomm com ProdT ech asi c E mail asic product Figure 7c 05500 CDMA Mode Noise Figure Mean 3xStdev 80C MEAN 3 Stdev NF Typical 4 211023e 10 G 6 6764536 07 G 7 945305e 06 G3 7 236486e 03 G 0 448823xG 16 0300 Figure 7d Q5500 FM Mode Noise Figure Mean 3xStdev 30C LLL LL LLL tT tT TT F PT ttt TTT TTT TT Ty Ty wp i tt gt 0 45 40 35 30 25 20 15 40 5 0 5 10 15 20 25 30 235 40 45 Gain dB uid MEAN 3 Stdev NF Typical 1 765908e 08 G5 1 538293e 07 G 5 645998e 05 G 5 891888e 03 G 0 518637 G 15 3817 8 19 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qual CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 7e Q5500 FM Mode Noise Figure Mean 3xStdev 25C ES MEAN 3 Stdev NF Typical 1 194405e 08 G 2 862301e 07 G 3 824693e 05 G 6 253457 03xG 0 493354 G 15 2345 Figure 7f Q5500 FM Mode Noise Figure Mean 3xStdev 80C SRR yi itt itt ttt tt tt tt 7 SERRE Lf YY ACCEPTABLE MEAN 3 Stdev PER p WAFER FABRICATION LOT EBENE 0 45 40
51. ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 11 Q0500 FM Channel Narrow Band Response CHL Sal lag MAG iD cm REF in za oa i S d Mn ERY dria STOP 380 000 noun wx CHI 27 tog HAG 10 dB REF z2 dB START 1 BUG DUC HHE STOP 2 O00 000 OOD HHE 9 10 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice Telephone 619 658 5005 Fax 619 658 1556 3 2 4 00500 MODE CONTROL The Q0500 Rx AGC Evaluation Board is confi gured with two separate signal paths a differential path for CDMA and a single ended path differential with one side AC grounded for FM The desired CDMA or FM signal path is selected by placing the M ode Control Jumper J2 in either the CDMA or FM position Figure 13 and Table 2 show the Q0500 M ode Control Jumper and setti ng positions for CDM A and FM M odes of operation The Q5505 amplifier and Q0505 Evaluation Board have only one signal path and therefore do not need mode control Figure 13 Q0500 Mode Control Jumper Setting Positions Diagram J2 COMA 1 e e e 3 Fu J2 COMA 1 e e e 3 FM Table 2 Q0500 Mode Control Jumper Setting Positions MODE MODEJUMPER POSITION VOLTAGE LEVEL 1 Veo
52. C Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 CDMA APPLICATIONS The AGC circuits are critical in maintaining consistent power levels with the changing distances between subscri ber handsets and base stations in a cellular network Figure 20 shows the basic distribution of control signals from the M obile Station M odem MSM RF interface to the Analog Baseband Processor BBA and AGC components in the analog and RF sections of the QUALCOMM subscriber unit The RF interface of the MSM is made up of several completely digital circuit blocks that monitor and control analog parameters One of theimportant functions of the RF interface of the MSM is analog signal gain control The RF interface communicates with the BBA and AGC circuits via Pulse Density M odulation PDM PDM signals require only 2 passsi ve components a resi stor and a capacitor to provide a low ripple DC control voltage for the Q5500 Q5505 VGAs and other analog circuit functions The basic structure of the Rx AGC loop lower half of Figure 20 is the same as the architecture of the general AGC loop except that all of the functions such as RSSI esti mation and generation of the VGA control voltage VcowTRoL are done by digital circuits The Rx Signal to
53. CAL SPECIFICATIONS damage to the device This is a stress rating only and ABSOLUTE MAXIMUM RATINGS functional operation of the device at these or any other Table 2 shows the absolute maxi mum ratings and conditions above those indicated in the operation Table 3 shows the recommended operati ng conditions sections of this specification is not implied Exposure of the M SM 2 2 Stresses above those listed under to absolute maximum rating conditi ons for extended Absolute M aximum Ratings may cause permanent periods may affect device reliability Table 2 Absolute Maximum Ratings Vo t05 V m Supply Voltage 03 M6 V Latch up Current 150 m Electrostatic Discharge Voltage HBM MIL 883 3015 ER iiid Table 3 Recommended Operating Conditions 2 14 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice Telephone 619 658 5005 Fax 619 658 1556 DC ELECTRICAL CHARACTERISTICS Table 4 shows the DC electrical characteristics for the M SM 2 2 Table 4 DC Electrical Characteristics gh level Input Voltage CMOS Schmitt ow level Input Voltage CMOS Schmitt put High Leakage Current put Low Leakage Current put High Leakage Current with Pull Down put Low Leakage Current with Pull Up evel Three State
54. D 25 20 15 H 10 5 0 01 06 1l 16 21 26 3l Vcontrol V e Supply Current vs Control Voltage QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 8 31 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Gain dE Figure 13a e Typical Q5505 Performance Characteristics Over Operating Temperature Range Tx W At 25C At 80C A At 30C 0 6 11 16 21 2 6 31 Vcontrol V a Gain vs Control Voltage Tx Mm At25C At80c 3k At 30 40 20 0 20 Gain dB b Gain Slope vs Gain 8 32 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 65 Tx 55 45 35 Noise Figure a gt 15 Wi At 25C At 80C 3k At 30C 50 30 10 10 30 50 Gain dB c Noise Figure vs Gain Tx B AC25C e At 80C dk At 30C 10 20 35 30 IPS dam me em om mm on a 65 45 25 5 15 35 55 Gain dB d Input
55. FP Figure 4 Q5165 CSM 100 pin TQFP Package Outline 16 00 630 BSCSQ 14 00 551 BSC SQ 100 O QUALCOMM Q5165l 1S2 CD90215801 SUPPLIER S P N LOT NUMBER Pin 1 Identifier 1 12 All Around dU UU co ce e or Q gt Detai di a Cc 26 Detail A All dimensions are in millimeters and inches Tin a 0 50 0 020 1 35 0 053 LEA m LL Y A 0 to 7 MAX esa wes wea Ih Detail B QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 6 7 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 9182 FRAME INTERFACE AND ROUTER MODULE FIRM ASIC OVERVIEW Various components of the QUALCOMM base station communicate via the Base Station Communication Network the BCN The link layer protocol of the BCN uses frames that are similar to HDLC frames defi ned by CCITT Q 921 but are constrained in length to a range of 8 to 47 bytes The Frame Interface and Router Module FIRM ASIC provides a highly integrated solution to the task of routing these frames and providing a rate adaptation and buffer
56. Frequency Tuning 9 12 5 0 APPENDIX ense rn rrr n Pen rere aid 9 13 5 1 Appendix A Schematics 9 13 5 2 Appendix B Layout Drawings 9 15 5 3 Appendix C Parts Lists 9 17 1 0 INTRODUCTION The Q0500 Receive and Q0505 Transmit Automatic Gain Control AGC Amplifier Evaluation Boards are compact printed circuit card assemblies designed specifically to demonstrate the performance of the QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice QUALCOMM Q5500 Rx and Q5505 Tx AGC amplifiers These general purpose linear IF Intermediate Frequency AGC amplifiers function in many wireless applications including analog cellular systems cordless telephones specialized mobile radios wireless data systems and digital cellular systems The Q0500 Receive AGC Evaluation Board consists of separate analog and digital differential input signal paths which are selectable via a mode control jumper The Q0505 Transmit AGC Evaluation Board consists of a single differential signal path Amplifier gain for both boards is established by a voltage applied to the Gain Control input The Q0500 and Q0505 are powered by a 43 6 V power supply All IF inputs and outputs are matched to 50 O impedance to maximize power transfer throughout the signal path Minimal equ
57. General Purpose ADC Interface Rx and Tx VCOs 4 7 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Table 2 shows the absolute maximim ratings of the Q5213 BBA2 Operating the BBA 2 under conditions that exceed those in the Absolute M axi mum Ratings table may result in damageto the device Absolute M aximum Ratings are limiting values to be considered individually while all the other parameters are within their specified operating ranges Functional operati on of the BBA2 under any of the conditions in the Absolute M aximum Rating table is not implied Table 2 Absolute Maximum Ratings SYMBOL Von Vooo V 5 Vsc T Vesp ESD Voltage each pin c un uw c PARAMETER Power Supply Voltage Short Crouit Duration toGNDor Voo T Lead Soldering Temperature 10 secMax lt c ce c ou E ui c wn fay O N c c nN co c mm cn c c RECOMMENDED OPERATING CONDITIONS Table 3 shows the recommended operating conditions Operating conditions include power supply voltage and ambient temperature parameters that are under the control of
58. IC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 2 5 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Sleep M ode and monitor the RF subsystem s phase locked loops There are separate CDMA and DFM control loops that generate PDM signals A multiplexer connects the appropriate PDM signal to its corresponding output pin The multiplexer s select input determines the subscriber unit s operating mode DFM or CDMA Digital and Q components from the Rx signal path of the BBA2 are the fundamental inputs to the RF Interface The RF Interface uses these and Q components and digital signal processing functions to calculate control values for the PDM outputs PDM OUTPUT SIGNALS The RF Interface uses PDM output signals to control analog functions in the BBA2 and analog circuits in the subscriber unit s RF subsystem PDM is a method used to convert digital control values into analog control voltages PDM signals are streams of constant width pulses top of Figure 4 that are RC filtered to develop DC voltages for controlling amplifier and oscillator components in the subscriber unit s RF subsystem The RC filtering of PDM signalsis shown in Figure 4 The RC components are located between the M SM 2 2 and the analog control voltage input of the controlled component The
59. MIN MAX UNITS __ junction Temperature f f 230 Table 3 Operating Range SYMBOL PARAMETER MIN MAX UNITS M 5 5 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 ELECTRICAL CHARACTERISTICS Table 4 provides the electrical characteristics of the CSM 1 0 Table 4 Electrical Characteristics SYMBOL High Level INPUT Voltage TTL Low Level INPUT Voltage TTL High Level INPUT Voltage CMOS Low Level INPUT Voltage CMOS High Level OUTPUT Voltage Low Level OUTPUT Voltage l INPUT Leakage Current NPUT High Leakage Current Pull Down NPUT Low Leakage Current Pull Up UTPUT Short Circuit Current INPUT Capacitance Notes 1 The device is sensitive to overshoot and undershoot The INPUT signal must be within the specified limits to guarantee reliable operation 2 These parameters are specified under the maximum allowable OUTPUT current ratings 3 This parameter is measured with 0 Viy Vpp 4 Refer to Table 1 to determine which INPUT pins are equipped with internal pull up or pull down resistors 5 This parameter is measured with only one OUTPUT shorted at a time and for less than one second D c un o lt us F
60. N oise Ratio SN R in the subscriber unit is optimized by controlling the gain of analog RF and IF stages in the receive signal path CDMA receivers must operate over input signal strengths that range from 113 dBm to 25 dBm The Rx AGC loop varies the Q5500 amplifier gain to compensate for the variation in power level of theincoming RF The purpose of the receive AGC loop isto keep the signal amplitude high and power level consistent at the demodulator input without distorting and overdriving the demodulator The Q5500 s gain range of 45 to 445 dB attenuates or amplifies the IF signal so that the power level of thel and Q components at the input to the CDMA demodulator is constant The Q5500 is required to operate in both FM and CDMA Modes The main difference between FM and CDMA M odes is that 8 42 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice the linearity requirement is less stringent for FM than for CDMA Also the FM input is single ended while the CDMA input is balanced The gain control section of the Q5500 processes the gain control voltage VcontTROL SO the overall IF signal gain measured in dB is approximately a linear function of VcontroL and also provides temperature compensati on TheCDMA transmit AGC loopis part of the power control system that distinguishes CDMA from other multiple access te
61. Q signals in precise quadrature for the mixers CDMA LOW PASS FILTERING After mixing the receive signal path splits into CDMA and FM sections For CDMA the baseband signal extends from 1 kHz to 630 kHz Frequency components above 750 kHz are out of band for CDMA operation The mixers and the subsequent CDMA low pass filters combine to form the down converter which outputs the CDMA baseband signals The passband transition band and rejection band characteristics of these low pass filters along with external IF bandpass filtering enable the receiver to select the desired baseband signals from the jamming effects of unwanted signals Controlling the offset at the inputs of the ADCsis critical to the receive signal path and MSM digital signal processing The offset control inputs are provided for this purpose These inputs are normally driven through long time constant RC filters by the MSM which senses the offset of the digital baseband data and creates a Pulse Density M odulated PDM signal for compensation CDMA ANALOG TO DIGITAL CONVERSION Analog and Q baseband components are converted to digital signals by the two identical 4 bit flash parallel ADCs The CDMA ADCs output a new digital value on each rising edge of the ADC clock signal CHIPX8 The CHIPX8 ADC clock frequency of 9 8304 MHz is synthesized from the system crystal oscillator frequency of 19 68 MHz Thesystem crystal oscillator frequency is applied to the TCXO inp
62. QUALCOMM ASIC PRODUCTS QUALCOMM ASIC Products provide complex solutions for a variety of wireless communications applicati ons APPLICATIONS Cellular e Personal Communications Services PCS e Wireless Local Loop WLL Satellite Communications e Direct Broadcast by Satellite DBS e e Very Small Aperture Terminal VSAT RADAR ADVANTAGES Digital Radio M obile Radio Synthesizers Voice Storage Security Instrumentation From high performance building blocks to compl ete systems on a chi p these integrated circuits and modular devices meet the design challenges of today s advanced communi cation companies High Performance s Small Size e e Cost Effective Reliable Competitive Pricing On time Delivery Pre and Post Sales Service CDMA ASIC PRODUCTS DATA BOOK 80 22370 2 9 97 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice l http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 INCLUDED SECTIONS INTRODUCTION TO CDMA Section 1 nennen nennen nnne nnne nnne nnne 1 1to 1 3 Q5270 MOBILE STATION MODEM M SM 22 Section 2 sssseeeeeneeneneneeeneennennnene 2 1 to 2 17 MSM 2300 MOBILE STATION MODEM Section 3 oo eeeeesseeseeeeeeneeeneeeeeeaeeeneeeneeeaeseneeeaeeeaeeeeteeseneeeneeeaes
63. Range With Source and Load VSWR 10 1 All Angles Spurious 70 dBc NOTES 1 Z5 1kQ Zi 500 Q Z1 1 kO see Figures 11a and 11b 2 P3 IMR3 2 Pin dBm where IIP3 is the input third order intercept in dBm IMR3 is the third order intermodulation product rejection in dB and Pin is the total power of the two input tones in dBm 3 Input Power level 38 dBm 4 See Figures 11a and 11b 5 VcoNTRoL Source Impedance must be 3 3 k 5 821 QUALCOM M Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 11a Definition of Source Impedance Z and Input Impedance Zu for Q5505 IF Signal Q5505 Source t Z Z 1kO Zy gt 1kQ Figure 11b Definition of Load Impedance Z and Output Impedance Zo for Q5505 Measurement Reference Plane Vc E Q5505 IF Signal Load I I I l I Z m 1 kQ I m Q I 4 7500 V lub 727 uH I 8 28 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 12
64. SYMBOL MIN MAX UNIT NOTES Storage Temperature d To 55 X0 C Junction Temperature T 55 5 C Supply Voltage Relative toGND wf 90 v Continuous RF Input Power S 30 dim DC Voltage on any Non RF Input Pin Relatveto GND Vw 05 veros v atchup Insenstiviy mw feof m 1 ESD Protection ew eoj V 2 i 1 Method meets the intent of J EDEC STD 17 Publication and is the maximum allowable current flow through the input and output protection diodes 2 Method meets the intent of MIL STD 883 Method 3015 PARAMETER SYMBOL MIN MAX UNIT Operating Temperature Case Operating Voltage Relative to GND 8 2 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Table 3 Q5500 DC Electrical Parameters Supply Current FM Mode Table 4 Q5500 AC Electrical Parameters Desense Change in Small Signal Gain NOTES 2 IP3 IMR3 2 isthe third order See Figures 2a 2 VL 0V V 3 Pout 57 dBm woo CO oI A w PARAMETER SYMBOL MIN MAX UNIT NOTES Select Input High Input Voltage f e 34 V Select Input ow InputVo
65. TAG Interface c CA SS cA co e co co SS SS co SS C cCA S co cA e General Purpose Input Output Linear Controls to RF Circuits User Interface Digital Controls to from RF Circuits CODEC and Aux CODEC Interface 2 12 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Table 1 MSM2 2 Pin Functions The internal 80C186EC microprocessor interfaces to standard peripheral devices such as RAM ROM and EEPROM User Interface The User Interface of the MSM2 2 includes signals to and from the keypad ringer and LCD display of the subscriber unit CODEC and Aux CODEC Interface The MSM2 2 can directly nee with several industry standard CODECs The MSM2 2 offers two CODEC interfaces for microphone earpiece interfacing in the subscriber unit Digital Controls to from RF Circuits Digital control signals are available from the MSM2 2 for controlling the LNA and power amplifier in the RF subsystem The MSM2 2 controls the gain of the receive and transmit AGC amplifiers receive and transmit signal path offsets in the Linear Controls to from RF Circuits BBA2 chip and the
66. TS M 6 5 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 ELECTRICAL CHARACTERISTICS Table 4 provides the electrical characteristics of the CSM 1 5 Table 4 Electrical Characteristics High Level OUTPUT Voltage INPUT Low Leakage Current Pull Up NPUT Capacitance Notes 1 The device is sensitive to overshoot and undershoot The INPUT signal must be within the specified limits to guarantee reliable operation 2 These parameters are specified under the maximum allowable OUTPUT current ratings 3 This parameter is measured with 0 lt Viv lt Vpp 4 This parameter is measured with input Vpp and Vpp Vpp max 5 This parameter is measured with input Vss and Vpp Vpp max Vi Vou VoL lH lu O w w Vo Low Level OUTPUT Voltage d o 6 6 QUALCOM M Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 PACKAGING AND MARKING The Q5165 CSM 1 5 is available package shown in Figure 4 in a 100 pin TQ
67. TS LIST REFERENCE MANUFACTURERS o o 2924421 PWB QUSODEVAUATONBOARD 1 MS82360100 AU015 U CP JUMPER TERMINALBIPIN O Ret MEOPOI00 RES CHIP THICK FILM 210 1 W200PPM C CAP CHIP CERAMIC 01UF 10 X7R 50V IQ 1 THCS30E1H474ZT CAP CHIP CERAMIC 0 47UF 80 20 YSU 50V CAP CHIP CERAMIC 10UF 80 20 YSU 25V 5 3 2 Q0505 EVALUATION BOARD PARTS LIST REFERENCE MANUFACTURERS po S 1 P292401 PINB QOSOS EVALUATION BOARD Ro R738 20332 RES CHIP THICK FILM 3 3K 5 IWE 200PPM C Re MCRIOFK2050_ RES CHIP THICK FILM 205 1 W 200PPM C_ RAT RKT3H242490F RES CHIP THICK FILM 249 1 WE 200PPM C_ cl C0805C103K5RAC CAP CHIP CERAMIC 01UF 10 XTR 50V C THCS30ELHATAZT CAP CHIP CERAMIC 0 47UF 80 20 YSU 50V do THCSSOELEL06ZT CAP CHIP CERAMIC 10UF 80 20 Y5U 25V 9 17 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556
68. TheTx signal path of the BBA2 converts T x digital baseband data into modulated IF The M SM 2300 communicates with the external RF and analog baseband circuitry of the subscri ber unit to control signal gain in the RF Rx and Tx signal paths reduce baseband offset errors and tune the system frequency reference 3 1 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 1 Typical Subscriber Unit Block Digram Antenna RF IF Subsystem Memory amp MSM2300 Peripherals Mobile Station Modem BBA2 Analog Baseband Processor The M SM 2300 performs baseband digital signal processing and executes the subscriber unit system software It is the central interface device in the subscriber unit correlating RF baseband and audio circuits as well as memory and user interface features The user interface of the subscriber unit typically includes the keypad LCD display ringer microphone and earpiece These are either under the direct or indirect control of the M SM 2300 The MSM 2300 also contains complete digital modulation and demodulation systems for both CDMA and AM PS cellular standards as specified in IS 95 A The subscriber unit system software controls most of the functionality and activates the features of the subscriber unit System software is executed by an embedded 80C 186EC microprocessor within the M SM 2300 The CODEC interfa
69. This signal modulates the frequency of the BBA2 transmit VCO using external components when in FM RXTX Mode The modulated VCO frequency is halved by divide by two circuitry and output on the transmit IF outputs OPERATING M ODES The telephone has several modes of operation that determine the circuit block activity level in the BBA2 The CDMA RXTX or FM RXTX Modes are in effect when the telephoneis making a call IDLE Modeisin effect when no call is in progress but the telephone receiver is active ready to answer acall SLEEP Mode is a low power mode in which the telephone cannot receive a call but where the digital processor and keypad are still enabled The telephone has an additional mode called Slotted Paging M ode When in this mode the M SM toggles QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice itself and the BBA2 between SLEEP and IDLE M odes using a programmable timing interval This mode allows the telephone to be contacted by the base station without requiring the telephone to be continuously in IDLE Mode Slotted Paging M ode consumes much less power than IDLE M ode The BBA2 operating modes are defined by the states of three digital inputs that come directly from the MSM Theselogic signals minimize the power consumed by the BBA 2 by disabling unused circuits The selected circuits in BBA2 beco
70. V with power control logic keeping power consumption to a minimum Electrical performance parameters are guaranteed over a 30 C to 85 C range The BBA2 is packaged in an 80 lead Thin Plastic Quad Flat Pack TQFP package With a lead pitch of 0 51 mm and a total above board thickness of 1 7 mm the BBA2 is designed for very dense mechani cal assemblies FEATURES Dual mode for CDMA and FM operation Receivesignal path includes F to baseband down conversion Separate CDMA and FM filters and ADCs Conversion of analog baseband to digital format CDMA sampling clock synthesizer e RxIF VCO for I Q mixer Offset control loop Transmit signal path includes e Conversion of digital I Q data to analog baseband signals Separate CDMA and FM filters and DACs Baseband to IF up conversion TxIF VCO and PLL for I Q mixer Mode Control Logic for RXTX SLEEP and IDLE modes General purpose ADC for system monitoring Low power consumption in all modes 4 1 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 DEVICE APPLICATION The BBA2 bridges the gap between the analog RF processi ng and digital processi ng sections of the cellular telephone Figure 1 shows the general circuit blocks in the portable cellular telephone employing BBA 2 and MSM The analog inputs and outputs of BBA2 interface directly with the IF transmit receive circuitry of the teleph
71. a e Typical Q5505 Performance Characteristics Over Supply Voltage Range Tx B A 3 60 V e it 3 18 V A M 342 V 5 4 3 2 1 g g 1 2 3 4 5 4 01 06 Ll 16 M 26 3l Vcontrol V a Gain vs Control Voltage Tx B A 3 60 V e Nt 3 18 V A M 342 V 7 6 5 s 3 f d 2 1 0 6 50 40 30 30 40 0 10 20 30 40 50 Gain dB b Gain Slope vs Gain QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 8 29 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Tx B At3 60V e0 i 3 18 V A 342 V 7 6 5 4 8 j 3 2 1 0 6 50 40 30 30 40 0 10 20 30 40 50 Gain dB c Noise Figure vs Gain Tx B At 3 60 V e At3 78V A Nt 342 V 0 5 40 i 15 20 25 30 6 50 40 30 20 10 0 10 20 30 40 50 Gain dB d Input IP3 vs Gain 8 30 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Tx H A 3 60 V e 1318 V ABA
72. an 1 7 mm above the seating plane EDEC Publication 95 M S 026 Variation BDD Figure 6 shows the package outline drawing Figure 6 80 pin TQFP Package Outline Draw ing I 14 0 0 551 Nom gt H 12 0 0 472 Nom 0 55 0 022 Max 0 45 0 018 Min 1 7 0 067 Max 0 19 0 008 Max 0 04 0 002 Min Base Plane Seating Plane 0 31 0 012 Max 0 13 0 005 Min Dimensions millimeters inches 4 10 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 9160 CELL SITE MODEM CSM1 0 OVERVIEW The Cell Site Modem CSM developed by QUALCOMM Incorporated is a CDMA digital baseband modem incorporating three indi vi dual integrated circuits into a single device previously a six device set The CSM integrates the CDMA Modulator CDMA Demodulator and Serial Viterbi Decoder modules to provide reduced costs and improved functionality for the base station The device also improves performance with the CDMA subscriber unit The CSM provides QUALCOM M s CDMA licensees with an IS 95 compliant system and a PCS compliant system at 14 4 kbps on asingle device The CSM includes a high precision Fast Hadamard Transform
73. ate Leakage Current with Keeper utput Short Circuit Curren gh level Output Voltage CMOS Schmitt evel Output Voltage CMOS Schmitt put Capacitance EE 5 n Ss gt 7 lt s 5 ei T c2 redo a c wN gt o 2 on ejr ejr s uz 5 o i co oOo e oOo r o z izizix zi I 7 7 al lale gt lt 5 o T lt Oy Notes Vpp Vpp Max at Vpp Vpp Min 1 Pin voltage Vpp Max For keeper pins pin voltage Vpp Max 0 45 Volts 2 Pin voltage Vss and Vpp Vpp Max For keeper pins pin voltage 0 45 Volts and 3 Refer to Tables 3 1 in User Manual for which pins have pull ups pull downs and keepers 4 Refer to Tables 3 1 in User Maunual for lop and lo current capacity for output pins B i ce w Cn c is mm rale w No 99 ce 99 als o c c ro ro S Nje co co co co p 3 16 QUALCOM M Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 POWER CONSUMPTION These values are an esti mation of maximum operating currents for a nominal Vpp 3 3 V This information should be used as a general guidelinefor system design
74. ces directly with the microphone and earpiece converting analog audio signals from the microphone into digital signals for the vocoder The CODEC also converts digital audio data from the vocoder into analog audio for the earpiece The M SM 2300 supports an auxiliary external Pulse Coded Modulation PCM interface The auxiliary CODEC is optional within the subscriber unit 32 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice TheM SM 2300 is available in three package styles A 208 pin Plastic Quad Flat Pack PQFP is available for low volume system development applications The 208 pin version allows connection to an M SM In Circuit Emulator M ICE for software development purposes For high volume subscri ber unit production a 176 pin Thin Quad Flat Pack T QFP and a 196 ball Plastic Ball Grid Array PBGA areavailable These package styles do not allow access to the M ICE M ode The 196 ball PBGA is only onethird the size of the 176 pin TQFP makingit perfect for very dense subscri ber unit applications The M SM 2300 is fabricated in an advanced submicron CM OS process The device operates between 2 7 and 3 6 V for low power consumption and longtalk time Asthe subscriber changes modes the M SM 2300 powers down unused circuits to keep power consumption to a minimum The M SM 2300 s electrical specificati
75. com Telephone 619 658 5005 Fax 619 658 1556 Figure 1 Typical Subscriber Unit Block Digram Antenna RF IF Subsystem Memory amp Peripherals MSM2 2 Mobile Station Modem BBA2 Analog Baseband Processor The M SM 2 2 performs baseband digital signal processing and executes the subscriber unit system software It is the central interface device in the subscriber unit correlating RF baseband and audio circuits as well as memory and user interface features The user interface of the subscriber unit typically includes the keypad LCD display ringer microphone and earpiece These are either under the direct or indirect control of the M SM2 2 The M SM 2 2 also contains complete digital modulation and demodulation systems for both CDMA and AM PS cellular standards as specified in IS 95 A The subscriber unit system software controls most of the functionality and activates the features of the subscriber unit System software is executed by an embedded 80C 186EC microprocessor within the M SM 2 2 The CODEC interfaces directly with the microphone and earpiece converting analog audio signals from the microphone into digital signals for the vocoder The CODEC also converts digital audio data from the vocoder into analog audio for the earpiece The 2 2 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to C
76. ctrum Generator Analyzer GI Ov 9 COMA El E2 Q0500 Rx Evaluation Board 9 CDMA eee FM E3 Gain Control 9 2 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 2 Q0500 Rx AGC Functional Block Diagram FM Mode Signal Spectrum Generator Analyzer De Ov e COMA El E2 Q0500 Rx Evaluation Board C CDMA e ee FM E3 Gain Control Figure 3 Q0505 Tx AGC Functional Block Diagram Signal Spectrum Generator Analyzer Ce 00505 Tx Evaluation Board C E3 Gain Control 9 3 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 2 1 EQUIPM ENT REQUIRED The Q0500 and Q0505 Evaluation Boards come fully configured for operation with minimal assembly The following list of standard test equipment is provided as a baseline If specific equipment is not available equipment with equivalent functionality may be substituted Spectrum Analyzer Advantest R3361B Signal Generator HP8648C Power Supplies 2 L
77. d San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 8 7 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 4a e Typical Q5500 Performance Characteristics Over Operating Temperature Range FM Mode 35 Rx FM W At 25C At 80C 3k At 30C 6 4 2 i 0 20 40 60 0 1 0 6 11 16 21 2 6 31 Vcontrol V a Gain vs Control Voltage Rx FM Wi At 25C At80C amp At 30C 80 l 10 l l l 60 l 50 l l 3 Cm l l i l 30 l E gt Compression Linear Operating Operating 0 Region Region l l 10 l 0 l 6 40 20 0 20 40 60 Gain dB b Gain Slope vs Gain 8 8 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Rx FM B A 25C e At 80C A At 30C 60 50 40 Noise Figure dE w e 20 6 40 20 0 20 40 6 Gain dB c Noise Figure vs Gain Rx FM WiI At 25C At 80C k At 30C 1 2 E 4 5 6 6 40 20 0 20 40 6 Gain dB d Input IP3 vs Gain
78. der may also be bypassed in CDM A M ode allowing an external vocoder to be used In CDMA Mode the vocoder QCELP algorithm uses codebooks to vector quantize the residual speech signal QCELP differs from CELP in that it produces a variable output data rate based on the level of speech activity The QCELP algorithm adjusts the data rate based on the energy in the speech signal Higher data rates are used for active high energy speech segments and lower data rates are used for silent low energy periods Low energy periods occur during natural pauses in speech that occur when listening exhaling or pausing between words and syllables An intermediate rate is used when the input speech signal energy is between thresholds or QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice when transitions between speech and silence occur The vocoder encodes active high energy speech segments at the full rate of 13 kbps for 13k M ode or 8 kbps for 8k M ode producing high quality speech while background noises and pauses in speech are coded at 1 kbps eighth rate creating alow average data rate without affecting speech quality For the reverse link analog speech produced by the microphone is converted to digital PCM samples using the subscriber unit s CODEC ThePCM samples are passed to the vocoder for QCELP encoding to comp
79. e http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 VOCODER SUBSYSTEM The MSM 2 2 has an internal vocoder supporting both 8 kbps and 13 kbps vocoding it also supports an external vocoder The internal vocoder functions in both CDMA and DFM Modes In CDMA Mode the vocoder converts digital PCM samples from the CODEC into compressed packets for transmission The vocoder encodes and decodes packets using QUALCOMM s QCELP speech algorithm When receivi ng the CDMA vocoder takes packet data from the demodulator and produces digital PCM samples for the CODEC In DFM Mode the vocoder acts as a digital signal processor filtering gain control limiting processing digital audio samples during both receive and transmit operation CDMA VOCODER In CDMA M ode digital IS 95 A operation the vocoder performs QCELP encoding of PCM samples into reverse link frames and QCELP decoding of forward link frames into PCM samples The vocoder compresses encodes speech into a low bit rate signal and reconstructs decodes compressed speech from a low bit rate signal all without reducing sound quality Speech is coded using a sophisticated model of human speech reproduction This model includes components relating to spectral pitch and noise characteristics of speech In the M SM 2 2 the vocoder is capable of both 8k and 13k QCELP for embedded voice processing The internal voco
80. e 619 658 5005 Fax 619 658 1556 TQFP PACKAGING The MSM 2 2 is offered in 176 pin T QFP and 208 pin PQFP pre production use only packages The 176 pin TQFP package is designed for production release phones Figure 9 provides the basic package dimensions for the 176 pin T QFP package Figure 9 MSM2 2 176 pin TQFP Package Dimensions 26 00 BSC 24 00 BSC DEREN 12 00 9 13 00 i i 13 00 24 00 BSC 26 00 BSC 12 00 4 X 44 TIPS 1 l 1 60 l 0 50 BSC i PT See Detail A MAX 172 PLCS Pe FAN LB RHBEE UAR HEEL HAUT z SEATING PLANE 1405 0 05 0 10 0 05 mja 0225 UNS 008C i i 176 PLCS i 12 0 MIN Detail A R 0 08 MIN 0 08 MIN 0 20 MAX GAGE PLANE 3 59 3 5 41 1 00 E 5 247 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 MSM2300 MOBILE STATION MODEM OVERVIEW APPLICATION DESCRIPTION The dual mode Code Di vision M ultiple A ccess Advanced M obi
81. e 2 Q5182 FIRM ASIC 160 pin PQFP Package Outline DEDE nn ORC OOO D E T ESD SYMBOLS N e H d n Q5182C 1S1 JAPAN 4 CD90 21855 1 R SUPPLIER S PART NUMBER DATE CODE LOT NUMBER ADDITIONAL MARKINGS SN A Pin 1 Identifier 0 17 0 05 PLANE I 15 TYP 1 6 TYP NY 30 109 0 25 0 5 ane 08502 Dimensions are in millimeters 1 5 QUALCOM M Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Q5500 IF RECEIVE AGC AM PLIFIER Q5505 IF TRANSMIT AGC AM PLIFIER FEATURES Q5500 FEATURES Supports Dual Mode Operation Single 43 6 V Power Supply Enhanced Performance over Temperature and Supply Voltage e 45 to 445 dB Gain Control Range e 10 MHz to 300 MHz Operation Low Power Consumption Silicon BiCM OS Process Q5505 FEATURES Supports Dual Mode Operation Single 43 6 V Power Supply Enhanced Performance over Temperature and Supply Voltage e 45to 440 dB Gain Control Range e 10MHzto 250 MHz Operation e Silicon BiCMOS Process APPLICATIONS e Digital Cellular Systems dual mode CDM A FDM or TDMA FDM e Analog Cellular Systems AM PS TACS Analog and Digital Cordless Telephones Wireless Data Systems WAN LAN Personal Communicators Specialized M
82. eader LPS 152 Digital Multimeter DMM HP34401A Coax cables 2 With SMA connectors and signal generator spectrum analyzer fittings Pair of test leads 3 With banana fittings on one end and grabbers on the other 2 2 Q0500 AND Q0505 EVALUATION BOARD SETUP Power supplies and test equipment should be connected to the appropriate evaluation board as shown in Figures 1 2 or 3 The Q0500 offers a choice of either CDMA or FM input signal paths Figure 1 shows the Q0500 setup using the CDMA signal path while Figure 2 shows a comparable setup using the FM signal path Figure 3 illustrates the setup of the Q0505 One coax cable is connected between the board s input SMA Q0500 J1 or J4 Q0505 J1 and the signal generator The other coax cable is connected between the board s output SMA Q0500 J3 Q0505 J2 and the spectrum analyzer An input signal viathe CDMA signal path is applied to the Q5500 amplifier differentially whereas a signal in the FM signal path is applied single ended differentially with one end AC grounded For the Q0500 the M ode Control Jumper J2 is positioned to the CDMA or FM position corresponding to the CDMA or FM signal path selected A 43 6 V power supply voltage is applied to the turret labeled VCC E2 and 0 1 to 3 0 V to theturret labeled GAIN CONTROL E3 For both Vcc and Gain Control power supplies the ground terminal of each supply should be connected to the turret labeled GN D E1 Before applying power verify
83. ed to the input impedance of the device or load receiving the signal in this case the spectrum analyzer Similar to the impedance matching performed at the input to the AGC amplifiers a transformer and resistor in parallel with the amplifier s output impedance have been added to the output of the AGC amplifiers to match to 50 Q at the input to the spectrum analyzer 3 2 7 TUNING VOLTAGE Q5500 and Q5505 AGC amplifier gain is controlled by applying power supply voltage to the GAIN CONTROL turret E3 on the Q0500 and Q0505 Evaluation Boards A control voltage from 0 1 to 3 0 V produces from 45 dB of attenuation to 45 dB of amplification in the Q5500 and from 45 dB of attenuation to 40 dB of amplification in the Q5505 Low pass filtering between the GAIN CONTROL turret and the input pin to the Q5500 Q5505 amplifiers allow pulse density modulated PDM signals to be used in substitution for a supply voltage PDM signals area series of fixed width pulses that vary in density with time Low pass filtering of PDM signals presents an averaged DC voltage level to the gain control input of the amplifier and establishes the amplifier gain setting 3 2 3 TUNE VOLTAGE VERSUS GAIN Both the Q5500 and Q5505 AGC amplifiers have gain response that is nearly linear over the amplifier s published operating frequencies of 10 M Hz to 300 MHz Figures 7 through 12 show the Q0500 Q5500 s and Q0505 Q 5505 s near linear gain response over the full dynamic range of the amplif
84. ent Voy Vpp 3 0 3 6 V ree State Output Leakage Current Voy 7 Vpp 4 5 5 5 V ree State Output Leakage Current Vo 7 Vss Von 3 0 3 6 V ree State Output Leakage Current Vo Vss Vopn 4 5 5 5 V ree State Output Leakage Current Vo Vss 50 KQ Pull Up Vpp 3 0 3 6 V ree State Output Leakage Current Vo Vss 50 KQ Pull Up Vpp 7 4 5 5 5 V ree State Output Leakage Current Voi Vss 3 KQ Pull Up Vpp 3 0 3 6 V ree State Output Leakage Current Vo Vss 3 KQ Pull Up Vpp 4 5 5 5 V Stand By Current Output Open Vi Vss Vin Von 3 0 3 6 V Stand By Current Output Open Vi Vss Vin Vpp 4 5 5 5 V lik s s clic 3 a a a a3 c c f NIN oy P ra ENE e A je z2 ls af eja ee e E D co r o o oe e ilelir elt a ee ee ey inla lno DE D lt S sg mn eie RO PR cec c gt N y Sts ul oo c n A ro ro elvelrmslce leis De uw u 1 4 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 MECHANICAL AND MARKING SPECIFICATION The Q5182 is packaged in a 160 pin Plastic Quad Flat Pack PQFP shown in Figure 2 Figur
85. er unit resets and re initiates when it encounters either hardware or software anomalies TheUART isaserial communication link to external systems for test and debug of the subscriber unit TheUART operates at rates up to 115 2 kbps and includes receive and transmit FIFOs hardware handshaki ng and programmable data sizes The UART s Rx and Tx FIFO sizes are double the FIFO sizes of the M SM2 2 Theinternal 80C 186EC serial port is available for use when using the M SM 2300 The 80C 186EC microprocessor and peri pheral system features 1 M byte of address space 64 kbyte I O space interrupt and DMA controllers and atimer counter The M SM 2300 microprocessor interface has been enhanced over the M SM 2 2 to reduce power consumption SUPPORTING INTERFACES Several interfaces in the M SM 2300 support other devices within the subscriber unit and provide connections to external peripheral components These interfaces support board testing and other subscri ber unit operations A brief description of each of these interfaces is given below 1 BBA2Interface The Interface that the M SM 2300 and the BBA2 share includes a CDM A FM transmit and Q channel data bus separate CDM A FM receive data busses and an interface to the General Purpose ADC on the BBA2 TheM SM 2300 also receives the BBA2 CHIPX8 and TCX0O A clock signals 2 External CODEC Interface The External CODEC interface consists of both 3 12 QUALCOMM Incorporated ASIC Products
86. erations for the subscriber unit using the AM PS cellular standard IS 95A DFM processingis distributed in the M SM 2 2 and involves not just audio signals but also Wideband Data WBD SAT transpond and DTMF tone pairs The microprocessor also processes WBD SAT and DTMF signals Figure 6 shows the DFM signal processing blocks and the DFM signal flow from CODEC through the M SM 2 2 and to the BBA2 The DFM subsystem and the vocoder in DFM M ode perform separate but distinct processes on Rx and Tx DFM data The vocoder performs several functions for DFM The vocoder interpolates incoming T x PCM from the CODEC to ahigher sample rate for the DFM subsystem The vocoder s T x path also includes a SAT transponder DT MF generation circuits the VOX and the pre emphasis filter In the Rx signal path the vocoder deci mates the incoming Rx data from the DFM subsystem to outgoing Rx PCM data for the CODEC The vocoder s Rx path also has SAT and DTMF detection circuits VOX and a de emphasis filter The DFM subsystem performs voice and WBD operations for both Rx and Tx signals The DFM subsystem s T x path accepts voice data from the vocoder and interpolates it to a higher outgoing rate for the BBA2 The DFM subsystem s Rx path accepts I Q components from the BBA2 and decimates it to a lower outgoing rate for the vocoder Voice data processing is done independently from the microprocessor Figure 6 DFM Signal Flow from CODEC to BBA2
87. erleaver output The symbols from the interleaver are scrambled with the long code PN sequence and punctured with power control bits if appropriate The punctured symbols are covered with the proper Walsh code and spread with thel and Q PN sequences The resulting chips are then bandlimited with FIR filters and multiplied by a programmable gain factor Each of the three transmit QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice sectors supported by the CSM can be driven by a particular section of the modulator the sum of all three sections or zero TRANSMIT SUMMER The transmit summer provides a flexible method for cascading several CSMs The outputs from the first CSM in a daisy chain are connected to the cascade inputs of the second The outputs from the second are connected to the cascade inputs of the thi rd and so on Each CSM in the chain can be programmed to do either of these 3 things 1 Pass the samples on its cascade inputs straight through to its outputs 2 Ignore the samples on its cascade inputs and only output the samples it generated 3 Sum the samples it generates with the samples on its cascade inputs The transmit summer adds a parity bit to the output samples and can also do parity checks on the cascade input samples If the samples fail the parity check the transmit summer can
88. fine tuning of the system master frequency reference by way of Pulse Density Modulated signals A single pole RC low pass filter is used to convert the pulse streams to DC control voltages The MSM2 2 interfaces with the general purpose ADC on the BBA2 chip This ADC is generally used for monitoring the battery voltage RF power output level or temperature of the subscriber unit The MSM2 2 may be operated in several modes including NATIVE normal operation MICE for in circuit emulation of the 80C186EC microprocessor or MOUSE using an external microprocessor The MSM2 2 operates with three fundamental docks CHIPX8 runs at 9 8304 MHz and is supplied by the BBA2 chip TCXO 4 is a 7 92 MHz dock supplied by the BBA2 and the microprocessor clock which is input on the XTAL_IN pin The BBA2 chip converts the Receive IF signal from the RF subsystem of the subscriber unit to digital baseband data for both CDMA and AMPS operating modes of the MSM2 2 The MSM2 2 generates transmit digital baseband data for the BBA2 chip The BBA2 chip converts that digital data to an analong IF frequency of the subscriber unit 2 13 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 TECHNI
89. gital output transactions ic Low Output Voltage Vpop 3 47 V loy current 100 uA rger current provided for digital output transactions ic Input Leakage Current Vpp MAX Viy GND to Von put Capacitance Digital Input gital Output Load Capacitance put Resistance RXIF to RXIF Differential put Capacitance RXIF and RXIF to Ground ffset Adjust Input Impedance IOFFSET QOFFSET ad Resistance TXIF to TXIF Different ad Capacitance TXIF TXIF to Ground utput Impedance TXIF TXIF Differential VCO tuning circuit Input Impedance RXV PD OUT Output Impedance Within Compliance Range OCK Output Logic Low Voltage RLD gt 10 KQ to Vpp utput Leakage Current Vout Von Lr gx c r XO Input Impedance eneral Purpose ADC Input Impedance ADCIN neral Purpose ADC Input Signal Range Vpp 7 3 3 V TCXO 4 Output Signal Level Into 10 kQ load in parallel with 10 pF Purpose ADC Source Resistance Connected to ADCIN pin QUALCOM M Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 4 9 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 MECHANICAL SPECIFICATIONS The Q5213 BBA 2 is packaged in an 80 pin Thin Quad Flat Pack TQFP package The TQFP has 20 mil lead pitch and is no greater th
90. hange Without N otice Table 1 CSM 1 0 Pin Functions The CSM1 0 relies upon external microprocessors for initializations and control of operation Controls for operating and synchronizing the CSM1 0 chip with system timing and other CSM1 0 chips in the base station EEE 1149 TAG Interface A full J TAG interface conforming with IEEE 1149 standard is available for test and debug of subscriber unit subassemblies Piha Resell Salle seat Receive and Q digital baseband data inputs from three sectors and Q Rx Inputs Alpha Beta and Gamma Sector T and Q Tx Outputs Transmit and Q digital baseband data outputs for three sectors a sas n Ber Additional and Q digital baseband data from other CSM1 0 chips is summed into the transmit signal path via these inputs ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS stress ratings only and functional operation of the Table 2 provides the absolute maximum ratings for the device at these or any other conditions above those Q5160 CSM 1 0 Table 3 shows the recommended indicated in the operational sections of this operating range conditions of the CSM 1 0 Stresses specification is not implied Exposure to absolute above those listed under Absolute Maximum Ratings maximum rating conditions for extended periods may may cause permanent damage to the device Theseare X affect device reliability Table 2 Absolute Maximum Ratings SYMBOL PARAMETER
91. hange Without N otice M SM 2 2 supports an auxiliary external Pulse Coded Modulation PCM interface The auxiliary CODEC is optional within the subscriber unit The M SM 2 2 is available in two package styles each with 0 5 millimeter pin pitch A 208 pin Plastic Quad Flat Pack PQFP is available for low volume system development applications The 208 pin version allows connection to an M SM In Circuit Emulator MICE for software development purposes For high volume subscri ber unit production a 176 pin Thin Quad Flat Pack T QFP packageis available This package style does not allow access to the MICE Mode The 176 pin package has a maximum thickness above the PC board seating plane of 0 041 for very dense subscri ber unit applications The M SM 2 2 is fabricated in an advanced submicron CM OS process The device operates between 2 7 and 3 6 V for low power consumption and longtalk time As the subscriber changes modes the M SM 2 2 powers down unused circuits to keep power consumption to a minimum http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 MSM2 2 FEATURES MSM2 2 GENERAL FEATURES Supports IS 95 A compliant CDMA and AMPS subscriber units Low 2 7 to 3 6 V DC power consumption during operation Internal DFM subsystem for AM PS operation with BBA2 Software controlled power management features A dvanced submicron CM OS desi gn Two package versi
92. hout N otice protect the data against transmissi on fades and burst errors Thereverse link datais unscrambled by the base station s deinterl eaver MODULATOR The modulator performs the orthogonal modulation long code PN spreading and quadrature spreading The resulting data stream is then bandlimited with FIR filters and sent to the BBA2 The M SM 2300 modulator is enhanced to useless power than the modulator provided in the M SM 2 2 DIGITAL FM PROCESSOR The M SM 2300 also supports Advanced M obile Phone System AM PS cellular operations The Digital FM DFM processor performs digital signal processing operations for the subscriber unit using the AM PS cellular standard IS 95A DFM processingis distributed in the M SM 2300 and involves not just audio signals but also Wideband Data WBD SAT transpond and DTMF tone pairs The microprocessor also processes WBD SAT and DTMF signals Figure 6 shows the DFM signal processing blocks and the DFM signal flow from CODEC through the M SM 2300 and to the BBA2 The DFM subsystem and the vocoder in DFM M ode perform separate but distinct processes on Rx and Tx DFM data The vocoder performs several functions for DFM The vocoder interpolates incoming T x PCM from the CODEC to ahigher sample rate for the DFM subsystem The vocoder s T x path also includes a SAT transponder DT MF generation circuits the VOX and the pre emphasis filter In the Rx signal path the vocoder decimates the
93. hout N otice Fax 619 658 1556 DC ELECTRICAL CHARACTERISTICS Table 3 shows the DC electrical characteristics for the Q5182 FIRM ASIC Table 3 DC Electrical Characteristics High Level Input Voltage TTL Input Vpp 3 0 3 6 V High Level Input Voltage TTL Input Vpp 4 5 5 5 V Schmitt Trigger Input Threshold Voltage Vp 4 5 5 5 V Schmitt Trigger Input Threshold Voltage Vpp 3 0 3 6 V Schmitt Trigger Input Threshold Voltage Vpp 4 5 5 5 V Schmitt Trigger Input Threshold Voltage Vpp 3 0 3 6 V TIL Level Schmitt Trigger Input Threshold Voltage Vpp 4 5 5 5 V High Level Output Voltage loy 7 4 or 8 mA Vpp 3 0 3 6 V High Level Output Voltage loy 7 4 or 8 mA Vpp 4 5 5 5 V M Ve SYMBOL PARAMETER UNITS 2 Vo Low leve Low Leve Output Vo Output Voltage Io 4 or8 mA Vpp 4 5 5 5 V tage lo 4 or8 mA Vpp 3 0 3 6 V High Leve High Leve Low Leve Low Leve Low Leve Low Leve Input Current Viy Vpp 3 0 3 6 V Input Current Viu Vpop 4 5 5 5 V Input Current Vi Vss Vpp 3 0 3 6 V Input Current Vi Vs Vpp 4 5 5 5 V Input Current Vi Vss 50 KQ Pull Up Vpp 3 0 3 6 V Input Current Vii Vss 50 KQ Pull Up Vpp 4 5 5 5 V Low Level Input Current Vi Vss 3 KQ Pull Up Vpp 3 0 3 6 V Low Level Input Current Vj Vss 3 KQ Pull Up Vpp 4 5 5 5 V ree State Output Leakage Curr
94. iers 9 7 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 7 Q0505 Narrow Band Response HTART son O00 MHz STOP 850 000 ODD MHz Figure 8 Q0505 Wide Band Response CHI Bg leg MAD 10 dB REF 22 dB iG dB REF 10 72 dB A I HER S00 Fane BE STOP 2 000 000 000 9 8 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 9 Q0500 CDMA Channel Narrow Band Response CHI Hg leg MAG 10 dB REF i0 72 dB HITIT dab 31 REF r J eae ees ieee ieee Rees START 2300 000 MHz STOP 380 000 O00 HHz Figure 10 Q0500 CDMA Channel Wide Band Response CHI Sgj leg HAG in da REF zz dB o a e a ees NE eism pec DOM ER E n vr Lcd a a a T d UN ll START 4300 000 MHz STOP Z 000 000 Hii 9 9 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA
95. igure 2 Figure 1 Dual Mode CDMA FM Cellular Telephone Block Diagram Figure 2 BBA2 Block Diagram MSM2300 MSM2 2 Mobile Station Modem Q5312 BBA2 Analog Baseband Processor 1 MSM2300 MSM2 2 x 1 Q Modulator Rx 1 Q Demodulator I I 4 2 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 CDMA RECEIVE SIGNAL PATH The receive signal path shown in Figure 3 is designed to accept a differential IF signal with CDMA spread spectrum modulation extending 630 kHz from the IF center frequency of 85 38 MHz This IF center frequency is not fixed by the BBA2 but is set by external components chosen by the designer The incoming IF is demodulated to and Q baseband components by mixing with 85 38 M Hz Local Oscillator LO signalsin quadrature followed by low pass filtering The85 38MHz I and Q LO signals are generated on the BBA2 device Thereceive VCO is set to 170 76 M Hz by an external varactor tuned resonant tank circuit inductor L and capacitor C connected in parallel An external phase lock loop and loop filter network provide feedback to varactors that tune the VCO to 170 76 M Hz A master slave divide by two circuit generates and
96. in the mobile unit deinterleaver MODULATOR The modulator contains three individually programmable sections that generate forward link information streams from the interleaver output The symbols from the interleaver are scrambled with the long code PN sequence and punctured with power control bits if appropriate The punctured symbols are covered with the proper Walsh code and spread with thel and Q PN sequences The resulting chips are then bandlimited with FIR filters and multiplied by a programmable gain factor Each of the three transmit QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice sectors supported by the CSM can be driven by a particular section of the modulator the sum of all three sections or zero TRANSMIT SUMMER The transmit summer provides a flexible method for cascading several CSMs The outputs from the first CSM in a daisy chain are connected to the cascade inputs of the second The outputs from the second are connected to the cascade inputs of the thi rd and so on Each CSM in the chain can be programmed to do either of these 3 things 1 Pass the samples on its cascade inputs straight through to its outputs 2 Ignore the samples on its cascade inputs and only output the samples it generated 3 Sum the samples it generates with the samples on its cascade inputs The transmit
97. ined during the intervening decades and is used today in digital cellular services and Personal Communication Services PCS as well as a variety of military applications The earliest radio transmissions were unintentionally spread across a broad frequency spectrum much like CDMA However the proliferation of uses for radio coupled with the inherent inability to discern the difference between one radio signal and another led to change This change was the division of the radio spectrum into specific bands and frequencies or channels to prevent one transmission from interfering with another This change was made possible by improvements in radio filter technology and the advent of the vacuum tube With CDMA technology we again spread the signal over a broad frequency of spectrum CDMA breaks up a digitized voice transmission into small packets of encoded data which are then transmitted along with other transmissions across a broad band of spectrum Each transmission is spread in bandwidth by its own encoding sequence so that no transmission has the same code Although all transmissions are sent out simultaneously the unique code allows the receiver to separate one transmission from all the others The CDMA technology developed and patented by QUALCOMM enables the receiver to identify and discern the desired signal from all other transmissions and sources of interference on the channel CDMA can be compared to a cocktail party Eve
98. ing capability for them FUNCTIONAL DESCRIPTION Figure 1 illustrates the BCN frame format The full Address field is used to specify the frame destination while the Control field contains only asingle 2 bit subfield of interest to the FIRM This subfield specifies a Frame Loss Priority FLP value of 0 1 2 or 3 for the frame When heavy traffic threatens to overflow its frame buffers the FIRM can selectively discard incoming frames with higher FLP values The Payload field may vary in length from two through 41 bytes to accommodate traffic demand while the two byte Figure 1 BCN Frame Format ADDRESS FIELD CONTROL FIELD 3 Bytes 1 Byte 2 to 41 Bytes 2 Bytes PAYLOAD FIELD FCS FIELD QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 7 1 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Frame Check Sum FCS field protects the entire frame TheFIRM has two 1 bit serial input ports and two 1 bit serial output ports Each of these include data and clock pins utilizing the data format defined by CCITT Q 921 The FIRM also has two 8 bit parallel input ports and two 8 bit parallel output ports with a similar data format except that the data is not bit stuffed and frame boundaries are demarked by additi onal signals rathe
99. ion 8 3 QUALCOM M Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 2a Definition of FM Source Impedance Z and Input Impedance Zu for Q5500 IF Signal Q5500 Source T GND GND Z 850 Q Zn 850 x 1590 Q Figure 2b Definition of CDMA Source Impedance Z and Input Impedance Zu for Q5500 IF Signal Q5500 Source E Z 500 Q Zy 1k 15 Q Figure 2c Definition of Load Impedance Z and Output Impedance Zo for Q5500 Vc Q5500 IF Signal 7 t Load Z gt 5 kQ 4122500 Note X can be a resistor or an inductor If it is an inductor L 2 7 uH If it is a resistor X 250 Q and the 500 Q resistor will not be used 8 4 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice Telephone 619 658 5005 Fax 619 658 1556 Figure 3a e Typical Q5500 Performance Characteristics Over Supply Voltage Range FM Mode Rx FM B At 3 00 V 09 A 3 78 V k ht 342 V Gain d 40 60 0 0 6 11 16 21 2
100. ipment is needed to demonstrate the functionality of the evaluation board and to verify the high degree of linearity of the Q5500 and Q5505 AGC amplifiers over their wide dynamic range The Q0500 and Q0505 Evaluation Boards are useful for measuring and verifying gain versus control voltage performance of the Q5500 Receive and Q5505 Transmit AGC amplifiers Both evaluation boards can be used as functional AGC modules or as daughter boards within a larger phone reference design 9 1 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 2 0 GETTING STARTED It is very simple to demonstrate the performance of the Q0500 and Q0505 Evaluation Boards An IF RF signal is applied to the board s input via a signal generator This signal is either amplified or attenuated by the AGC amplifier by means of a control voltage applied to the board s Gain Control input The amplifier s output signal is then measured by a spectrum analyzer Test signals enter and exit the board via coax cables with SMA connectors Power is supplied to the Vcc and Gain Control pins via separate power supplies Functional block diagrams of the Q0500 Evaluation Board with its associated test equipment are shown in Figures 1 CDMA input and 2 FM input A similar block diagram of the Q0505 Evaluation Board and equipment is shown in Figure 3 Figure 1 Q0500 Rx AGC Functional Block Diagram CDMA Mode Signal Spe
101. ithin the subscriber unit Figure 2 MSM2 2 Functional Block Diagram MSM2 2 Antenna Mobile Station Modem RF and RF Control Signals IF Display etc External System Peripheral Circuits Receive Data CDMA and Status General Processor Purpose Interface BBA2 Analog RINGER Transmit and Q Data RF 80C186EC Circuits Interface Micro Mi B processor RAM ROM Subsystem EEPROM Offset Controls General Purpose Interface Bus Baseband Processor Receive Data DFM PCM Data CODEC and Status Processor JO Vocoder General Receive Data Purpose PCM Data Aux and Status p CODEC ADC Interface MODE Select Interface External Mode Selection lt ANSI IEEE 1149 1 1990 SEITE igital Test Bus JTAG Interface 2 2 4 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice Telephone 619 658 5005 Fax 619 658 1556 RF INTERFACE The RF Interface communicates with the subscri ber unit s external RF IF and analog baseband circuitry Signals to this circuitry control signal gain in the RF Rx and T x signal path reduce baseband offset errors and maintain the system s frequency reference The RF Interface perfo
102. k are calculated to be approximately 7 dB Figure 6 shows the impedance matching network and power loss calculations Figure 6 Impedance Matching Netw ork and Pow er Loss Calculations Vi R Pmax when Rs R When Rs 50 Q Poss Prot Proap 50 1 2 Pro PLoss dB 10 log zr i Ploan 2 Vi V R 1kQ Prot x 2v L L Ploap 1000 La V Poss dB 10 log 22 748 M 250 9 6 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 3 1 3 Q0500 Q0505 CURRENT CONSUMPTION Evaluation board current consumption was measured by connecting ammeters in series with the Vcc and Gain Control power supplies for CDM A and FM M odes of operation Q0505 only IF M ode Maximum current consumed by the Q0500 and Q0505 Evaluation Boards is provided in Table 1 Table 1 Maximum Current for 0 1 to 3 0 V Tuning Voltage DEVICE OPERATION MODE CURRENT DRAWN MAX Q0500 11 0 mA 5 Omt Q0500 11 5 mA 5 Q0505 20 0 mA 5 3 2 OUTPUTS 3 2 1 POWER TRANSFER TO THE OUTPUT Minimum output impedance of the Q5500 and Q5505 amplifiers is 5 kQ and 10 kQ respectively In order to maximize the power transferred to the spectrum analyzer amplifier output impedance must be match
103. l ecommunications protocols TheTx AGC loop upper half of Figure 20 is closed by communication with the base station In CDMA the base station controls the RF power output of all subscriber units The signal strength of the subscriber unit is measured at the base station and varies widely dueto the changing distance from the subscriber unit to the base station multi path fading terrain topology and environmental conditions The purpose of the Tx AGC control loop on the M SM isto provide alinear variable RF output power level to the subscriber unit antenna to compensate for these effects The subscriber unit receives power control information from the base station which increases or decreases the subscriber unit Tx power The base station maintains the Tx power level of each subscriber unit in the cell so that the recei ved power from each subscriber unit is the same For both CDMA and FM Modes in the subscri ber unit the Q5505 is the primary gain control element in the Tx signal path between the BBA and the upconverter The signal which controls the gain of the Q5505 is alowpass filtered PDM signal obtained from theMSM Thelinearity of the VGA used in the path of aCDMA transmit AGC loopistypically depicted with an Adjacent Channel Power Rejection ACPR response to an input CDMA waveform This provides a figure of merit for evaluating a VGA s nonlinearity at various gain settings Figure 21 shows the Q5505 s typical ACPR response at higher o
104. l path reduce baseband offset errors and maintain the system s frequency reference The RF Interface performs the following functions Adjusts thel and Q channel baseband data offsets Tunes the master oscillator frequency and the UHF and IF frequencies Controls IF signal gain in the Rx and Tx signal paths Controls Power Amplifier PA and Low N oise Amplifier LN A characteristics using digital control signals The M SM 2300 s RF subsystem is an enhancement of the M SM 2 2 improving intermodulation spurious response attenuation as outlined in IS 98 section 9 4 3 The RF Interface uses digital circuitry to monitor and control analog parameters in the BBA2 and the subscriber unit s RF subsystem Figure 3 shows the RF Interface control signals to the BBA2 and the subscriber unit s RF subsystem PDM signals are filtered using an RC network to produce analog control voltages These PDM signals include AGC controls and Q offset controls and a frequency adjust for the master frequency and timing reference oscillator Two general purpose PDM signals are available to suppl y user defined control and calibration Figure 3 RF Interface Block Diagram to BBA2 and RF Subsystem C8 C2 Antenna Q5500 Rx AGC Amplifier Q5505 Tx AGC Amplifier Analog RF Processing Digital Processing 1 MSM2300 optional optional I LNA Controls optiona optional General Purpose PDM Rx AGC Control Offset Cont
105. le Phone System CDM A AM PS cellular telephoneis a complex consumer communications instrument that relies heavily upon digital signal processing To simplify the design and reduce the production cost of the subscriber unit QUALCOMM has developed a M obile Station M odem M SM 2300 an Analog Baseband Processor BBA 2 and Automatic Gain Control AGC Amplifiers Q5500 and Q5505 These devices perform all of the signal processing in the subscriber unit from IF to audio TheQUALCOMM MSM 2300 is the fourth generation ASIC in the M SM family The M SM 2300 offers improved functionality lower cost and significant power savings over previous MSM versions TheM SM 2300 integrates functions that support a dual QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice mode CDM A FM subscriber unit Subsystems within the M SM 2300 include a CDMA processor a Digital FM DFM processor a QUALCOMM Codebook Excited Linear Predictive QCELP 8 Vocoder a 80C 186EC microprocessor and assorted peri pheral i nterfaces that are used to support other functions The M SM 2300 Figure 1 demodulates Rx digital baseband data from the BBA2 The BBA2 converts the modulated IF signal from the RF section of the subscriber unit into digital baseband data For transmission the M SM 2300 modulates and sends digital baseband data to the BBA2
106. low pass RC filter produces a low ripple DC control voltage for AGC amplifiers and other analog circuit functions Pulses from PDM outputs have a rate of occurrence density proporti onal to a corresponding digital PDM value determi ned by or stored in the MSM 2 2 The density of the PDM pulse stream is the number of pulses that occur within a given timeinterval For example in Figure 4 pulse densities of 2596 5096 and 7596 are shown from left to right respectively The pulse stream is smoothed using a single pole RC low pass filter The DC component of the filtered pulse stream is directly proportional to the density of the pulse stream multiplied by thelogic high voltage Vou of the M SM 2 2 The operating mode DFM or CDMA determines the PDM clock frequency and pulse width In DFM Mode the PDM clock rateis TCXO 4 4 92 MHz and the minimum pulse width is 203 ns In CDMA Mode the PDM clock rate is CHIPX8 9 8304 MHz and the minimum pulse width is 101 7 ns Figure 4 Digital PDM and Filtered Analog Waveforms PDM clock a tpw PDM out 0 0 V Pulse Density 25 Pulse Density 50 l M Pulse Density 75 At i o 100 4 75 4 Filtered b PDM Vpp 50 4 25 4 0 2 6 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otic
107. ltage wf CT 05 V Select Input High Input Ouret w 00 m 5 Select Input ow Input Ouret 50 f g 6 Supply Current CDMA Mode PARAM ETER VALUE NOTES RX AGC Frequency 85 38 MHz and 210 38 MHz Gain Flatness 630 kHz 30 25 dB O Gain Vcontrot 0 1 V G lt 45 dB 136 VoontroL 3 0 V G gt 45 dB ion 60 dB V Maximum ais 20 dB V Minimum di Gain Slope Linearity Over any 6 dB Gain Segment x 3 0 dB V 8 lt 0 1mA Vono 0 1 3 0 V Gain Control Pin Input Current lt 50 pF Capadiive EN NF For CDMA and FM Figure 7a 7f Table 5 IIP3 For CDMA and FM Figures 8a and 8b Respectively 1 2 3 1 1K Q 15 lt 1 pF Capadtive 3 Stabilit Over Full AGC Range With Source and d Load VSWR 10 1 All Angles Spurious 70dBm 1 Z5 Z 250 Q Manufacturer to recommend Zs and ZL the two input tones Vin Vcc 3 70V Over Specified Gain Range of 45 dB to 45 dB In Linear Operating Range Pin total maximum 23 dBm and Pour total maximum 57 dBm Input Jammer Power 57 dBm Jammer Offset 900 kHz CDMA Mode A G lt 0 75 dB CDMA Input Min Gain G 45 dB 15 5 dBm lt Pigs O FM Input G lt 27 dB 22 0 dBm lt Pigg O Max Gain G 45 dB FM Mode A G lt 0 45 dB a Pin where IIP3 is the input third order intercept in dBm IMR3 intermodulation product rejection in dB and Pin is the sum power of b and 2c 18 V Or Pin MAX 12 dBm if in compress
108. ly encodes a skeleton of the actual word The model for 1 2 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice reconstructing the human speech sounds is contained in the receiver which is able to reconstruct the desired sound when it receives the transmitted code much as a music synthesizer can emulate a saxophone or piano The vocoder in effect characterizes the instrument the human voice as it changes and describes these changes to the speech synthesizer in the receiver allowing very natural speech to be produced Therefore fewer bits of information need to be transmitted per unit time CDMA achieves performance near toll quality through a unique variable rate vocoder devel oped by QUALCOMM which effectively achieves the same voice quality of other vocoders but does so with an average of half the rate of standard vocoders Whilea standard vocoder is either on transmitting background noise as well as blank space at full rate or off QUALCOM M s variable rate vocoder outputs data at various rates between 0 8 kbps V8 rate and 8 55 kbps full rate for the rate set 1 option or various rates between 1 0 kbps rate and 13 3 kbps full rate for the rate set 2 PureVoice option Background noiseis encoded at the lower quality level of rate The vocoder samples speech every 20 milliseconds As soon as
109. mance is accomplished through the use of resistive impedance matchi ng elements but is done so at the expense of power loss through the resistive elements An alternative approach to impedance matching is to use an inductor L1 L5 Q0500 L6 in parallel with the input output impedance of the amplifier in place of the resistor L1 L5 Q0500 R 12 This approach offers improved power transfer by reducing I R losses due to the inductor s lower internal resistance Using an impedance matching inductor also serves to tune the circuit to a specific frequency based upon the inductive value chosen Theresult is an impedance matched circuit which efficiently transfers power but only at the tuned frequency At all frequencies differing from the turned frequency the transmitted or received signal will experience attenuation and loss of power 9 12 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asic 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 5 0 APPENDIX 5 1 APPENDIX A SCHEMATICS 5 1 1 Q0500 RX AGC BOARD SCHEMATIC z P m E m S iq 68 68 E A z DNI DNI e R9 i R1 i
110. me active after the states of the operating mode controls are changed GENERAL PURPOSE ADC The General Purpose GP ADC provides DC measurement capability to the tel ephone during all modes of operation It is alow speed 8 bit resolution ADC It is designed to digitize DC voltages applied to the ADC input pin from battery level temperature and other low frequency control or monitoring sensors TheADC isin a power down state duri ng normal BBA2 operation It is activated by a positive going pulse on the ADC enable pin When this input is driven high the GP ADC powers up and begins a conversion The DC voltage to be measured must be applied to the ADC input for the duration of the conversion The ADC output is available from a serial digital interface Each of the eight data bits is valid M SB first during the rising edge of the ADC clock output When the Least Significant Bit LSB of the conversion has been clocked out the conversion is complete and the ADC returns to a power down condition The ADC clock and data outputs will be low before and after a conversion Conversions can only be started when the ADC is inactive after a conversion has been completed A rising edge of the ADC enable pin during a conversion will be ignored ADC enable must be low and a conversion completed before a new conversion can be started 4 5 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619
111. n the receive signal path are removed by way of analog control signals from the MSM2300 MSM2 2 The and Q Baseband Offset Adjustment MSM2300 MSM2 2 control signals use Pulse Density Modulation PDM which form DC control signals after being filtered with single pole RC low pass filters Digital controls from the MSM2300 MSM2 2 put the BBA2 into CDMA or FM Mode IDLE receive only Mode or SLEEP minimum power consumption Mode Clocks The system frequency reference of 19 68 MHz is used to generate clocks for the MSM2300 MSM2 2 CHIPX8 9 9304 MHz and TCXO 4 a 4 92 MHz are generated on the BBA2 chip The General Purpose ADCis generally used for monitoring the subscriber unit battery voltage RF power output level or temperature The ADC interface is controlled by the MSM2300 MSM2 2 The BBA2 indudes a complete Transit Phase Locked Loop for generating the TX IF frequency The PLL indudes a phase Tx PLL Interface detector and requires a simple external loop filter The BBA2 chip includes all VCO circuits except the resonant tank The VCOs operate differentially reducing common mode noise and improving performance Audio Output for Frequency Modulation i Mode frequency modulation is accomplished by a connection from the BBA2 to the varactor diodes of the transmit Differential Analog Rx IF i oe nU AN nag RC inputs and The receive IF inputs of the BBA2 are differential improving performance and reducing cross coupled noise Mode Select
112. ncodes active high energy speech segments at the full rate of 13 kbps for 13k M ode or 8 kbps for 8k M ode producing high quality speech while background noises and pauses in speech are coded at 1 kbps eighth rate creati ng a low average data rate without affecti ng speech quality For the reverse link analog speech produced by the microphone is converted to digital PCM samples using the subscriber unit s CODEC ThePCM samples are passed to the vocoder for QCELP encoding to compress the speech samples The encoding rate is determi ned by the vocoder which formats the encoded speech samples as data packets A new data packet with data rate information is read by the microprocessor every 20 ms The microprocessor then sends the data packets to the reverse link subsystem wherethe information bits are convolutionally encoded interleaved modulated and passed to the CDMA DACs on the BBA 2 forming the reverse link Tx waveform Vocoder decoding is done near the end of the CDMA Rx signal path just before the subscriber unit CODEC As the subscriber unit receives the forward traffic channel Rx data flows from the BBA2 s CDMA Analog to Digital Converters ADCs to the CDMA demodulator for demodulation and symbol combining After symbol combining the data is passed to the deinterleaver and the Viterbi decoder where deinterleaving and error correction occur The microprocessor moves the recovered information bits packets into the voc
113. ns and control of operation Controls for operating and synchronizing the CSM1 5 chip with system timing and other CSM1 5 chips in the base station EEE 1149 TAG Interface A full J TAG interface conforming with IEEE 1149 standard is available for test and debug of subscriber unit subassemblies Piha Resell Salle seat Receive and Q digital baseband data inputs from three sectors and Q Rx Inputs Alpha Beta and Gamma Sector T and Q Tx Outputs Transmit and Q digital baseband data outputs for three sectors a sas n Ber Additional and Q digital baseband data from other CSM1 5 chips is summed into the transmit signal path via these inputs ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS stress ratings only and functional operation of the Table 2 provides the absolute maximum ratings for the device at these or any other conditions above those Q5165 CSM 1 5 Table 3 shows the recommended indicated in the operational sections of this operating range conditions of the CSM 1 5 Stresses specification is not implied Exposure to absolute above those listed under Absolute M axi mum Ratings maximum rating conditions for extended periods may may cause permanent damage to the device Theseare affect device reliability Table 2 Absolute Maximum Ratings SYMBOL PARAMETER MIN MAX UNITS __ junction Temperature 230 Table 3 Operating Range SYMBOL PARAMETER MIN MAX UNI
114. obile Radios SM R General Purpose Voltage vari abl e Linear IF Amplifier Attenuator QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice GENERAL DESCRIPTION The Q5500 Receive Rx and Q5505 Transmit T x Variable Gain Amplifiers VGA are designed specifically for the receive and transmit section respectively of dual mode CDM A FM cellular applications They provide variable gain control to IF signals with extremely wide dynamic range requirements Noise Figure N F Third Order Intercept IP3 and other specifications are designed to be compatible with the IS 95 Standard for CDMA cellular communications and remain remarkably consistent over temperature and supply voltage fluctuation In such a dual mode system the Rx and Tx VGAs handle a narrowband frequency range for the IF signal processing The Q5500 and Q5505 however are also quite suitable for variable gain operation across a broadband frequency range These devices can provide linear gain control for IF frequencies up to 300 MHz in general purpose Automatic Gain Control AGC amplifier loops The VGAs maintain consistent NF and IP3 performance in an AGC system because these parameters exhibit low sensitivity to temperature variation A generic system implementation for the Q5500 and Q5505 VGAs are shown in Figure 1 The differential inputs and output
115. oder as data packets every 20 ms The vocoder then uses the QCELP algorithm to reconstruct speech from the data packets Along with the data packets the microprocessor sends data rate information to the vocoder Data rate information tells the vocoder which data rate was used to encode the current data After decoding the data packet at the appropriate data rate the vocoder pulse code modulates the resulting speech samples and passes them to the CODEC where they are converted to an analog speech waveform http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 The CDMA vocoder can also perform echo cancellation two stage rate reduction 13k only DTMF tone generation and detection and VOX for hands free operation Both the M SM 2300 s CDMA VOX and DFM VOX have been enhanced over the M SM 2 2 to reduce power consumption Thereis also an audio loop back function for testing the CODEC interface DIGITAL FM DFM VOCODER In DFM M ode analog 1S 95A the vocoder performs digital signal processing of both the transmit and receive audio data streams During an Amps phone call Rx and Tx information is sent directly to the vocoder reducing the need for microprocessor intervention in the signal stream The vocoder then filters and formats the voice data for the external CODEC Handset CODEC voice datais signal processed by the DFM vocoder and transferred to the DFM subsys
116. og speech waveform The CDMA vocoder can also perform echo cancellation two stage rate reduction 13k onl y 2 7 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 DTMF tone generation and detection and VOX for hands free operation There is also an audio loop back function for testing the CODEC interface DIGITAL FM DFM VOCODER In DFM M ode IS 95A the vocoder performs digital signal processing of both the transmit and receive audio data streams During an Amps phone call Rx and Tx information is sent directly to the vocoder reducing the need for microprocessor intervention in the signal stream The vocoder then filters and formats the voi ce data for the external CODEC Handset CODEC voice datais signal processed by the DFM vocoder and transferred to the DFM subsystem In both CDMA and DFM M ode the vocoder provides a direct PCM sample interface CDMA DIGITAL BASEBAND PROCESSOR The CDMA digital baseband processor performs forward link demodulation time tracking and reverse link modulation for CDMA digital baseband signals Figure 5 shows a CDMA Digital Baseband Processor block diagram SEARCHER ENGINE After programming the position and the size of the search window the searcher engine fi nds the largest multipath peak within the search parameter set The M SM 2 2 searcher engine reports the best local maxima peak per search window Also the M
117. one The digital inputs and outputs of BBA2 interface directly with the M SM The RF receive circuitry acquires the low level forward link signal from the base station cell site and down converts the signal to the IF frequency band The RF transmit circuitry takes CDM A or FM modulated analog IF from BBA2 up converts the IF signal to the channel frequency and outputs controlled reverse link power levels to the antenna The M SM performs all digital signal processing in the CDM A FM cellular telephone It includes digital processors for CDM A modulation demodulation digital FM modulation demodulation voice processi ng and a keypad interface The CODEC coder decoder block interfaces the telephone microphone and earpiece to theM SM TheM SM also has direct connections to the RF IF section of the telephone for AGC automatic gain control and calibration of the RF signal paths for receive and transmit The BBA2 receive signal path down converts the acquired IF signal to baseband where it is then converted to digital data The digital baseband signals are sent to the M SM for demodulation When transmitting the MSM sends modulated digital baseband signals to the BBA 2 for up conversion to the analog IF frequency GENERAL DESCRIPTION The BBA2 consists of a receive signal path a transmit signal path clock synthesis and buffering circuits mode control logic and a general purposeADC The transmit and receive signal paths are shown in F
118. ons mechanical specifications and pin functions are compatible with the M SM 2 2 The M SM 2300 has many internal functional enhancements and new debugging features yet the programming requirements have remained as backwardl y compatible as possible allowing a smooth migration from the M SM 2 2 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 MSM2300 FEATURES MSM2300 GENERAL FEATURES e Supports 1S 95 A compliant CDM A and AMPS subscriber units Low 2 7 to 3 6 V DC power consumption during operation nternal DFM subsystem for AM PS operation with BBA2 Software controlled power management features Advanced submicron CM OS design Three package versions available A 176 pin TQFP and a 196 ball PBGA for high volume production and a 208 pin PQFP development version The 208 pin version supports MICE for System Development ANSI IEEE 1149 1 Testability MSM2300 AUDIO PROCESSING FEATURES nternal 8 kbps vocoder nternal 13 kbps vocoder Support for an independent external vocoder clock source Support for 9600 bps and 14 4 kbps data rates Support for an external user supplied vocoder e Internal Dual Tone MultipleFrequency DTMF generation e Internal DTMF detection CDM A Mode only nternal Earseal Echo Cancellation ESEC CDMA M ode onl y Programmable digital filters for audio signal path compensati on in both CDMA and AM PS
119. ons available A 176 pin version for high volume production and a 208 pin development version The 208 pin version supports M ICE for System Development ANSI IEEE 1149 1 Testability MSM2 2 AUDIO PROCESSING FEATURES Internal 8 kbps vocoder Internal 13 kbps vocoder Support for an independent external vocoder clock source Support for 9600 bps and 14 4 kbps data rates Support for an external user supplied vocoder Internal Dual Tone M ultiple Frequency DTMF generation Internal DTMF detection CDM A Mode only Internal Earseal Echo Cancellation ESEC CDMA M ode onl y Programmable digital filters for audio signal path compensati on in both CDMA and AM PS M odes Supervisory Audio Tone SAT transponding in FM M ode Internal Voice Operated Switch VOX MSM2 2 MICROPROCESSOR SUBSYSTEM FEATURES Embedded industry standard Intel 80C 186EC microprocessor subsystem QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice Internal watchdog and sleep ti mers Internal interrupt controller with support for both internal and off chip interrupt driven devices Internal DMA controller with support for searcher DMA transfers on chip only Internal chip select circuitry with direct support for RAM ROM FLASH EEPROM an LCD display and two other devices Internal address latches for demultiplexed address data busses
120. ovided by each of the four demodulation fingers The power combiner processes the power control bits demodulated by each finger and sends a power control decision to the closed loop AGC circuit The M SM 2300 combining block has been enhanced over the M SM 2 2 adding programming flexibility DEINTERLEAV ER AND VITERBI DECODER The deinterleaver is used to reverse the interleaving performed by the base station Interleaving provides protection against burst errors and fades The M SM 2300 uses an enhanced Viterbi decoder resulting in a 0 5 0 7 dB improvement in 14 4 kbps rateset operation as compared with the M SM2 2 The Viterbi decoder optimally decodes the convolutional coding from the base station The Viterbi decoder operates by finding the most likely path through the encoder trellis that produced the transmitted symbol stream In this way many modulation symbols that have been corrupted by noise can be recovered Quality bits and Cyclic Redundancy Code CRC bits are used to verify the quality of the decoded data CONVOLUTIONAL ENCODER AND INTERLEAV ER The encoder convolutionally encodes reverse link data frames The convolutional encoder block automatically inserts CRC bits for the reverse link frames The interleaver scrambles the reverse link data to 310 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Wit
121. ows only athree fold expansion of utilization Even with the new innovations in voice encoding the architecture of the currently proposed systems in the U S is limited to a maximum expansion of six times current analog cellular capacity much less than the capacity of CDMA With CDMA there are no regular time slots for the bits of data When a caller stops talking his or her transmitter instantly reduces power When the caller resumes talking the power is immediately increased Because all other signals on the frequency are seen as noise just like any other source of interference the reduction in power reduces the i nterference to all other calls In this way alarge number of messages can be spread across a wide channel without significantly interfering with each other The capacity of the system 1 1 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 is limited only by the signal to noise ratio and the corresponding ability to differenti ate the transmission from all other noise on the channel Because CDMA does not allocate a tangible and limited resource such as time or frequency the capacity limit is soft On any given frequency the capacity is only reached when the noiselevel makes it impossible to clearly differentiate a transmission from surrounding noi se ENHANCED CDMA SECURITY CDMA provides greater pri vacy through its unique enhanced security fea
122. ped a M obile Station M odem M SM 2 2 an Analog Baseband Processor BBA 2 and AGC Amplifiers Q5500 and Q5505 These devices perform all of the signal processing in the subscri ber unit from IF to audio TheQUALCOMM MSM2 2isthethird generation ASIC in the M SM family The M SM 2 2 integrates functions that support a dual mode CDM A FM subscriber unit Subsystems within the M SM 2 2 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice include a CDMA processor a Digital FM DFM processor a QUALCOM M Codebook Excited Linear Predictive QCELP amp Vocoder a 80C 186EC microprocessor and assorted peri pheral i nterfaces that are used to support other functions The M SM 2 2 Figure 1 demodulates Rx digital baseband data from the BBA2 The BBA2 converts the modulated IF signal from the RF section of the subscriber unit into digital baseband data For transmission the M SM 2 2 modulates and sends digital baseband data to the BBA2 TheTx signal path of the BBA2 converts T x digital baseband data into modulated IF TheMSM 2 2 communicates with the external RF and analog baseband circuitry of the subscriber unit to control signal gain in the RF Rx and Tx signal paths reduce baseband offset errors and tunethe system frequency reference 2 1 http www qualcomm com ProdT ech asi c E mail asic products qualcomm
123. perati ng gains where device linearity is stressed the most http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 20 CDMA Subscriber Unit Simplified Block Diagram QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 8 43 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 EA qd sag Hen mer 3M p 4p SY 4h ipi TrA rog MEME T we m i iss a ZEHTEH 139 3B e BPG 4 Bap Hed WEE B 3g ke VHW AP kb mar zp P ese a CDMA Input to Q5500 FEH A SAT EHI HP 17 0 UH amp 42 TR OM bM ai Ly T T CENTER 32 38B sr mH B gA nr ER BH OW aH WEH WB Hi FH Ad B sasi c ACPR Response G 35 dB VCC Supply 3 6 V Figure 21a d Adjacent Channel Power Rejection ACPR Response of Q5505 to CDMA Waveform T MAA L BTE kha REF r F d m bh a d mr 4 L pre oat J EEHT H XH mij HH KEW pud Hha el Hw ad BH WH Wi kRHI ee 3H d maai b ACPR Response G 20 dB E WA 4 BT abr REF siB BH cide 38 53 nd mis Lol E aay E CENTER IW MH iir Sean ESSEN dir AMI D W kiir sp W kiir BP ng g me Test Conditions Input Power 42 2 dBm d ACPR Response G 39 dB
124. pts onto the microprocessor s internal interrupt controller The Interrupt Subsystem frees the microprocessor from such time consuming operations as polling Each interrupt has its own status flag and mask for enabling disabling Several levels of interrupt masking are available along the path from the originating source through the microprocessor s internal interrupt controller The Watchdog Timer ensures that the subscri ber unit resets and re initiates when it encounters either hardware or software anomalies TheUART isaserial communication link to external systems for test and debug of the subscriber unit TheUART operates at rates up to 115 2 kbps and includes receive and transmit FIFOs hardware handshaki ng and programmable data sizes The 80C 186EC microprocessor and peri pheral system features 1 M byte of address space 64 kbyte I O space interrupt and DMA controllers and atimer counter Figure 7 MSM2 2 Microprocessor Block Diagram MSM2 2 Microprocessor Subsystem CLKOUT AD 19 0 ALE DEN DT R_ WR BHE RD S 0 2 PCS or GCS 6 0 SRDY 186 Microprocessor A 0 19 D 0 15 LWR amp HWR ROM CS RAM CS EEPROM CS LCD CS 2 10 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asic E mail asic
125. qualcomm com Telephone 619 658 5005 Fax 619 658 1556 TECHNICAL SPECIFICATIONS the device This is a stress rating only and functional ABSOLUTE MAXIMUM RATINGS operation of the device at these or any other conditions Table 1 shows the absolute maxi mum ratings and above those indicated in the operational sections of this Table 2 shows the operating ranges of the Q5182 FIRM specification is not implied Exposure to absolute ASIC Stresses above those listed under Absolute maximum rati ng conditions for extended periods may M aximum Ratings may cause permanent damage to affect device reliability Table 1 Absolute Maximum Ratings Notes 1 These values apply to both 4 mA and 8 mA output drivers Also they apply to to both when Vono 3 3 V or when Vono 5 V 2 Method meets the intent of MIL STD 883 method 3015 3 Method meets the intent of J EDECSTD 17 publication This is the maximum allowable current flow through the input and output protection devices Table 2 Operating Range Supply Voltage for Core Logic Supply Voltage for I O Buffers Supply Voltage to O Translators Ambient Operating Temperature Package Thermal Impedance in Still Air 133 QUALCOM M Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Wit
126. r than by sync flags in the data stream M ost frequently a serial input and a serial output port are paired to create a full duplex serial port M eanwhile a parallel input port and a parallel output port are paired to create a full duplex parallel port The two full duplex ports thus formed are then connected through buffers to provide a full duplex path between the serial and parallel ports The FIRM supports two such full duplex paths With this configuration BCN frames arriving at a parallel input port are subject to address filtering plus various error checks and those that pass are put into a buffer other frames are discarded Each whole frameis then driven onto the serial output port at a rate determined by its clock line In the opposite direction BCN frames arriving at a serial input port are also subject to address filtering plus various error checks and those that pass are put into another buffer When at least one whole frame has been accumulated a request is made for the bus connected to the parallel output port When a grant is recei ved one frame is driven onto the parallel output port at a high rate of speed relative to the speed of the serial ports The FIRM data paths can be configured in other ways as well For example a parallel input port can be connected through a buffer to a parallel output port 12 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Prod
127. rated in several modes including NATIVE Mode Select 80C186EC microprocessor or MOUSE using an external microprocessor 5 at 9 8304 MHz and is supplied by the BBA2 chip Clocks 2300 operates with three fundamental clocks CHIPX8 run isa 7 92 MHz dock supplied by the BBA2 and the microprocessor clock which is input on the XTAL_IN pin v The BBA2 chip converts the Receive IF signal from the RF subsystem as Digital asebandiData CDMA and AMPS operating modes of the MSM2300 Tx Digital Baseband Data The MSM2300 generates transmit digital baseband data for the BBA2 chip The BBA2 chip converts that digital data to an analong IF frequency of the subscriber unit normal operation MICE for in circuit emulation of the of the Subscriber Unit to digital baseband data for both 3 14 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 TECHNICAL SPECIFICATIONS damage to the device This is a stress rating only and ABSOLUTE MAXIMUM RATINGS functional operation of the device at these or any other Table 2 shows the absolute maximum ratings and conditions above those indicated in the operation Table 3 shows the recommended operating conditions sections of this specification is not implied Expo
128. rating state between M ICE M ode 208 pin devices onl y NATIVE Mode and High Impedance HI Z M ode Keypad Interface The Keypad Interface allows a connection to an external keypad Ringer Interface TheRinger Interface may be programmed to generate a single tone or DTMF output M N Counter Interface TheM N Counter Interface produces a programmable frequency programmable duty cycle counter that can be used to switch a supplemental switcher power supply or make a tone UART Interface TheUART Interface is a serial communication link that can be used to test debug or upgrade the subscri ber unit s functions JTAG Interface The M SM 2 2 complies with AN SI IEEE 1149 1 1990 the Joint Test Action Group JTAG interface TheJTAG interface may be used to test digital interconnects within the subscriber unit during manufacture 2 11 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 INPUT OUTPUT SIGNALS Figure 8 shows the functions provided by the M SM 2 2 s pins and the size of the 176 pin TQFP package Table 1 provides descriptions of the pin functions Figure 8 MSM2 2 176 pin Functional Diagram Tx Digital Baseband Data Microprocessor Address Bus Rx Digital Baseband Data Microprocessor Data Bus Mode Select Read Write Chip Selects General Purpose ADC Interface Interrupts IEEE 1149 J
129. reception than the fingers provided in the M SM 2 2 The M SM 2300 pilot RSSI and time tracking loop filters have enhanced bandwidth programmability over the fingers provided in the M SM2 2 Thetime tracking capability of each M SM 2300 demodulating finger has been enhanced A Finger Disable M ode has been added Figure 5 CDMA Digital Baseband Processor Block Diagram Searcher Rx and Rx Q Tx Data Packets Interleaver F Combining our Block Demodulating M Fingers Viterbi Decoder Rx Data Packets Deinterleaver TI Modulator and XQ QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 3 9 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 to each M SM 2300 demodulati ng finger to decrease power when the demodulating finger is not in use COMBINING BLOCK The combining block is made up of three functi onal blocks Symbol combiner Carrier frequency error combiner Power combiner The symbol combiner combines the modulation symbols received by each of the demodulating fingers performs long code PN despreading creates mobile station ti ming references and compensates for oscillator drift The carrier frequency error combiner combines and processes the frequency error information pr
130. ress the speech samples The encoding rate is determined by the vocoder which formats the encoded speech samples as data packets A new data packet with data rate information is read by the microprocessor every 20 ms The microprocessor then sends the data packets to the reverse link subsystem where the information bits are convolutionally encoded interleaved modulated and passed to the CDMA DACs on the BBA 2 forming the reverse link Tx waveform Vocoder decoding is done near the end of the CDMA Rx signal path just before the subscriber unit CODEC As the subscriber unit receives the forward traffic channel Rx data flows from the BBA2 s CDMA Analog to Digital Converters ADCs to the CDMA demodulator for demodulation and symbol combining After symbol combining the data is passed to the deinterleaver and the Viterbi decoder where deinterleaving and error correction occur The microprocessor moves the recovered information bits packets into the vocoder as data packets every 20 ms The vocoder then uses the QCELP algorithm to reconstruct speech from the data packets Along with the data packets the microprocessor sends data rate information to the vocoder Data rate information tells the vocoder which data rate was used to encode the current data After decoding the data packet at the appropriate data rate the vocoder pulse code modulates the resulting speech samples and passes them to the CODEC where they are converted to an anal
131. rleaver RX Data W Processor amp Packets RXQ Viterbi Decoder gt gt y Four Fingers P N Sequence Generator T Data Encoder Transmit TII Packets Summer TXQ Interleaver Cascade 1 Q Inputs CSM FUNCTIONAL OVERVIEW SEARCHER After selecting an antenna set for a search and programming the positi on and size of the search window the searcher initiates the search and finds the largest multipath peaks within the search parameter set Normally the searcher operates continuously while the results from a search are read the next search is already underway For acquisition searches the searcher results can be used to detect the presence of a mobile attempting to access the CDMA network For demodulator multi path searches fingers may be assi gned to the reported paths to improvethe demodulator performance of the rake receiver FOUR FINGERS The four fingers make up a front end interface to the demodulator The fingers provide timing Walsh chip accumulation and Walsh chip storage for the demodulation process The fingers may be programmed to accept data from the same or differing antenna Sources 6 2 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice DEMODULATION PROCESSOR The demodulation processor performs Fast Hadamard Transforms for the searcher and the four fingers It also performs
132. rms the following functions Adjusts thel and Q channel baseband data offsets Tunes the master oscillator frequency and the UHF and IF frequencies e Controls IF signal gain in the Rx and Tx signal paths Controls Power Amplifier PA and Low N oise Amplifier LN A characteristics using digital control signals The RF Interface uses digital circuitry to monitor and control analog parameters in the BBA2 and the subscriber unit s RF subsystem Figure 3 shows the RF Interface control signals to the BBA2 and the subscriber unit s RF subsystem PDM signals are filtered using an RC network to produce analog control voltages These PDM signals include AGC controls and Q offset controls anda frequency adjust for the master frequency and timing reference oscillator Two general purpose PDM signals are available to suppl y user defined control and calibration In addition to PDM signals the RF Interface has several digital control signals These signals are used to configure and program the LNA and PA save power in Figure 3 RF Interface Block Diagram to BBA2 and RF Subsystem C2 Antenna Q5500 Rx AGC Amplifier Q5505 Tx AGC Amplifier Analog RF Processing Digital Processing MSM2 2 optional LNA Control optional General Purpose PDM Rx AGC Control Offset Controls Frequency Control Tx AGC Control optional l op General Purpose PDM optional PA Control QUALCOMM Incorporated AS
133. rols Frequency Control Tx AGC Control optional l op General Purpose PDM optional PA Control 3 6 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 In addition to PDM signals the RF Interface has several digital control signals These signals are used to configure and program the LNA and PA save power in Sleep M ode and monitor the RF subsystem s phase locked loops There are separate CDM A and DFM control loops that generate PDM signals A multiplexer connects the appropriate PDM signal to its corresponding output pin The multiplexer s select input determines the subscriber unit s operating mode DFM or CDMA Digital and Q components from the Rx signal path of the BBA2 are thefundamental inputs to the RF Interface The RF Interface uses thesel and Q components and digital signal processing functions to calculate control values for the PDM outputs PDM OUTPUT SIGNALS The RF Interface uses PDM output signals to control analog functions in the BBA2 and analog circuits in the subscriber unit s RF subsystem PDM is a method used to convert digital control values into analog control voltages PDM signals are streams of constant width pulses top of Figure 4 that are RC
134. rporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 5 2 APPENDIX B LAYOUT DRAWINGS 5 2 10 Q0500 RX AGC BOARD LAYOUT DRAWINGS Q0500 Rx AGC Top Silk Layout onsen EVALUAT IGH BOAPD E MADE M L Gh B E Can r CONTROL Tg c tr ar BR FID gr at JIMAS H2 Fl iM ES 5 Gall eed Ti ES IF OUT 9 15 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 5 2 2 Q0505 TX AGC BOARD LAYOUT DRAWINGS Q0505 Tx AGC Top Silk Layout Kr wee a O we NF n vit Q0506 EVALUATION BOARD G WADE IH USA a BB i po EHE fe tres oa ees TH IF peut moon Vom gm DH 1445524 HJ 9 16 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 5 3 APPENDIX C PARTS LISTS 5 3 1 Q0500 EVALUATION BOARD PAR
135. ryone at the party is in the same room like being on the same frequency channel and talking at the same time You can imagine that if all of the conversations in the room were in a language you didn t understand they would all sound like noise However if just one QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice conversati on was in your native language you could discern that conversation above all therest Thisis analogous to the concept of code division if you know the code you can discriminate one conversation from another DIFFERENCES BETW EEN CDMA AND TDMA Time Division Multiple Access TDMA divides a channel into a number of discrete time slots assigned to each call The use of a vocoder and digital technology allows the speech to be broken up into packets of data which can be interleaved with other voice packets and distributed over timein aregular sequence Each voice signal is digitized by the system and then sent out in short bursts The transmission happens so quickly that several conversations can occur at the same time but none will be transmitted in exactly the same time slot as any other However since TDMA utilizes narrow frequency bands it is inherently limited by the number of channels and the number of time slots that can be put into each channel The planned implementation of TDMA all
136. s of the Q5500 and Q5505 allow a direct connection to differential downconverters upconverters and discrete or SAW bandpass filters Differential signals in these circuit elements reduce the effects of common mode noise The Q5500 and Q5505 are fabricated using a silicon BiCMOS process operate from a single 43 6 VDC supply and come packaged in a standard 16 pin Shrink Small Outline Package SSOP 8 1 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 1a Generic Receive AGC Block Diagram with Q5500 5500 Rx AGC Amp BPF gt Analog land Q Baseband Signals SEL Vcormot Mode Select Figure 1b Generic Transmit AGC Block Diagram with Q5505 V imo 5505 Tx AGC Amp ae REF Level Integrate Analog landQ Baseband Signals Q5500 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under Absolute M aximum Ratings may cause permanent and functional damage to the device Thisisastress rating only Functional operation of the device at these or any other conditions beyond the min max ranges indicated in the operational sections of this specification is not implied Exposure exceeding absol ute maxi mum rating conditions for extended periods may affect device reliability Table 1 Q5500 Absolute Maximum Ratings NOTES Table 2 Q5500 Operating Range PARAMETER
137. s include temperature compensated input biasing circuits that maintain the DC input level of the IN IN FM and FM inputs The application circuit should AC couple the IF signals into the AGC amplifiers No DC biasing circuits are required OUTPUT IMPEDANCE MATCHING The output devices of the Q5500 and Q5505 OUT and OUT pins are open collectors of NPN transistors This allows the differential output impedance the impedance between the OUT and OUT pins of the 8 40 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice amplifier to be set to various levels and controlled by external components The open collector outputs requireaDC path to VCC TheDC path requirement is Satisfied by connecting either a resistor or an inductor between the OUT pin and VCC Resistive collector loads on the OUT and OUT pins set the differential output impedance to the sum of the two load resistors For example if 250 Q resistors are used for developing the output signal the differential output impedance of the circuit will be 250 250 500 Q Resistive loads on the open collector outputs have disadvantages Current flowing through the resistors carries with it acomponent at the IF frequency This high frequency component can add to power supply noise and require a more complex power supply decoupling network Additionally noi
138. se already on the power suppy voltage may be injected into the IF output signal through the collector load resistors An alternate method for loading the open collector outputs of the AGC amplifiers is to employ relatively high inductance chokes instead of resistors see Figures 18 and 19 An inductor between the OUT and VCC pins meets the DC path requirement but blocks the IF frequency from the power supply voltage and blocks power supply noise from the amplifier s output signal Inductor values on the order of 2 7 uH work well here Inductiveloads do not significantly contri bute to the differential output impedance because their reactance at IF frequencies is high When using inductive loads the differential output impedance is set by connecting a resistor between the OUT and OUT pins The value of the resistor becomes the differential output impedance http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 Figure 18 Application Schematic for the Q5500 Rx AGC Amplifier 3 6 Volts 3 6 Volts OQ O CDMA IF Source BBA Optional RXIF gt OU Pador BPF RXIF FM IF Source Signals from CDMA FM e Figure 19 Application Schematic for the Q5505 Tx AGC Amplifier 3 6 Volts O 3 6 Volts Tx AGC Amp Q5505 Optional Pad or BPF BPF Ld B Gain Control TX AGC ADJ from MSM 8 41 QUALCOMM Incorporated ASI
139. se in dual mode Code Division Multiple Access CDM A and FM portable cellular telephones The BBA2 interfaces between the RF and the digital processing circuitry of the telephone The BBA2 receive path circuitry converts analog IF intermediate frequency signals to the baseband frequency range then converts the analog baseband signals into digital signals The transmit path circuitry converts digital data into analog baseband signals which are then up converted to the IF frequency range The BBA2 includes receive and transmit Voltage Controlled Oscillators VCOs and other clock synthesis and processing circuits There is also a general purpose Analog to Digital Converter ADC included for battery and signal strength monitoring The BBA2 is designed to interface directl y with QUALCOMM s Mobile Station Modem M SM family of devices TheMSM isa CMOS VLSI Application Specific Integrated Circuit ASIC that performs all of the digital processing in the telephone The M SM along with the BBA2 form the core of the portable CDMA FM cellular telephone The BBA2 is fabricated on an advanced Bi CMOS process which accommodates both precision analog circuitry and low power CMOS functions The device has been designed to operate from nominal power QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice supply voltage of 3 3
140. st digital interconnects within the subscriber unit during manufacture http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 INPUT OUTPUT SIGNALS Figure 8 shows the functions provided by the M SM 2300 s pins and the relative sizes of the 176 pin TQFP and the 196 ball PBGA package options Table 1 provides descriptions of the pin functions Figure 8 MSM2300 176 pin and 196 ball Functional Diagram Tx Digital Baseband Data Microprocessor Address Bus Rx Digital Microprocessor Baseband Data os Data Bus Clocks SART Read Write Mode Select Chip Selects General Purpose ADC Interface lt Interrupts General Purpose Input Output IEEE 1149 JTAG Interface Linear Controls to RF Circuits User Interface Digital Controls CODEC and Aux CODEC to from RF Circuits Interface 3 13 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Table 1 MSM2300 Pin Functions PIN FUNCTIONS DESCRIPTION Microprocessor Address Bus The internal 80C186EC microprocessor interfaces to standard peripheral devices such as RAM ROM and EEPROM
141. sure of the M SM 2300 Stresses above those listed under to absolute maximum rating conditions for extended Absolute M axi mum Ratings may cause permanent periods may affect device reliability Table 2 Absolute Maximum Ratings Junction Temperature Voltage on any INPUT or OUTPUT Pin V Supply Voltage 0 Latch up Current Electrostatic Discharge Voltage N HBM MIL 883 3015 ea 2000 V Table 3 Recommended Operating Conditions Vpp Supply Voltage 7 Operating Temperature 176 pin and 196 ball package 40 i Operating Temperature 208 pin package 0 3 15 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 DC ELECTRICAL CHARACTERISTICS Table 4 shows the DC electrical characteristics for the M SM 2300 Table 4 DC Electrical Characteristics gh level Input Voltage CMOS Schmitt ow level Input Voltage CMOS Schmitt put High Leakage Current put Low Leakage Current put High Leakage Current with Pull Down put Low Leakage Current with Pull Up evel Three State Leakage Current level Three State Leakage Current evel Three State Leakage Current with Pull Down evel Three State Leakage Current with Pull Up evel Three State Leakage Current with Keeper W level Three St
142. t Pulse Density 75 75 4 Filtered 50 4 b PDM Vpp 25 4 s QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 3 7 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 VOCODER SUBSYSTEM The M SM 2300 has an internal vocoder supporting both 8 kbps and 13 kbps vocoding it also supports an external vocoder Theinternal vocoder functions in both CDMA and DFM Modes In CDMA Mode the vocoder converts digital PCM samples from the CODEC into compressed packets for transmission The vocoder encodes and decodes packets using QUALCOMM s QCELP speech algorithm When receivi ng the CDMA vocoder takes packet data from the demodulator and produces digital PCM samples for the CODEC In DFM Mode the vocoder acts as a digital signal processor filtering gain control limiting processing digital audio samples during both receive and transmit operation CDMA VOCODER In CDMA M ode digital IS 95 A operation the vocoder performs QCELP encoding of PCM samples into reverse link frames and QCELP decoding of forward link frames into PCM samples The vocoder compresses encodes speech into a low bit rate signal and reconstructs decodes compressed speech from a low bit rate signal all without red
143. tem In both CDMA and DFM M ode the vocoder provides a direct PCM sample interface CDMA DIGITAL BASEBAND PROCESSOR The CDMA digital baseband processor performs forward link demodulation time tracking and reverse link modulation for CDMA digital baseband signals TheM SM 2300 CDMA digital baseband processor has been enhanced to provide more integrati on and functionality than the CDMA processor in the M SM 2 2 Figure 5 shows the M SM 2300 CDMA Digital Baseband Processor block diagram SEARCHER ENGINE After programming the position and the size of the search window the searcher engine finds the largest multipath peak within the search parameter set The M SM 2300 searcher engine can operate at rates up to eight times faster than the searcher provided in the M SM 2 2 allowing for faster acquisition and neighbor list search intervals The M SM 2300 searcher engine reports the best four local maxima peaks per search window reducing microprocessor overhead Also the M SM 2300 searcher reports the position of the multipath peaks with a higher resolution allowing greater precision than the searcher provided in the M SM 2 2 DEMODULATING FINGERS The M SM 2300 contains four identical demodulating fingers Each demodulating finger performs the following on its assigned signal path Quadrature despreading Walsh uncovering Frequency tracking Timetracking The M SM 2300 s four demodulating fingers provide better multi path
144. terrupt Subsystem Watchdog Timer and Uni versal Asynchronous Receiver Transmitter UART These peri pherals shown in Figure 7 extend the functionality of the M SM 2300 The Interrupt Subsystem includes MSM 2300 Interrupt Controller Microprocessor internal interrupt controller The M SM 2300 Interrupt Controller handles interrupt from various subsystems then performs a Bitwise OR to pass the interrupts onto the microprocessor s internal interrupt controller The Interrupt Subsystem frees the microprocessor from such time consuming operations as polling Each interrupt has its own status flag and mask for enabling disabling Several levels of Figure 7 MSM2300 Microprocessor Block Diagram MSM2300 Microprocessor Subsystem CLKOUT AD 19 0 ALE DEN DT R_ WR BHE RD S 0 2 PCS or GCS 6 0 SRDY 186 Microprocessor A O 19 D 0 15 LWR amp HWR ROM CS RAM CS EEPROM CS LCD CS QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 3 11 http www qualcomm com ProdT ech asic E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 interrupt masking are available along the path from the originating source through the microprocessor s internal interrupt controller The Watchdog Timer ensures that the subscri b
145. that Vcc is set at 43 6 V and that the Gain Control voltage is set to less than 3 0 V The spectrum analyzer and signal generator yield more accurate measurements if they have temperature stabilized 3 0 EVALUATION BOARD OPERATION Figures 4 and 5 show the Q0500 and Q0505 Evaluation Board block diagrams The following paragraphs describe the function and operation of the circuit elements of each board Unless otherwise specified the functionality operation and pin designation of individual circuit elements are identical for both the Q0500 and Q0505 Evaluation Boards 94 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 Figure 4 Q0500 Rx AGC Evaluation Board Block Diagram IMPEDANCE MATCHING IOUT FM IN 0 1 3 0V GAIN CONTROL Figure 5 Q0505 Tx AGC Evaluation Board Block Diagram E 36V VOLTAGE CONDITIONING Jl 2 G IMPEDANCE Q5505 IMPEDANCE Ee FR MATCHING TX AGC MATCHING IF OUT d E3 0 1 3 0 V GAIN CONTROL 9 5 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change
146. the user The BBA2 meets all electrical switching and system performance limits when operated in compliance with the recommended operating conditions Table 3 Recommended Operating Conditions SYMBOL PARAMETER MIN MAX UNITS Power Supply Voltage 333 38 Ambient Operating Temperature 30 85 4 8 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 ELECTRICAL CHARACTERISTICS Table 4 shows the electrical characteristics Electrical characteristics include both physical characteristics characteristics such as digital I O levels reference such as capacitance resistance and impedance and DC supply voltages and power supply current In Table 4 values in the Typical column are based on a 25 C 3 3 V power Table 4 Electrical Characteristics 0 0 r Yw 6 eo Power Supp Power Supp Power Supp ower Supp ower Supp CHigh Input Voltage c Lo Lo OCK 0 Genera c r o o c ic Low In y Current CDMA RXTX Mode y Current CDMA IDLE Mode y Current CDMA SLEEP Mode y Current FM RXTX Mode y Current FM IDLE Mode put Voltage ic High Output Voltage Vpp 3 13 V loy current 300 uA ided for di
147. to Change Without N otice DEMODULATION PROCESSOR The demodulation processor performs Fast H adamard Transforms for the searcher and the four fingers It also performs optimal soft combining of data from the fingers and performs power calculations including lock detection and power control decisions DEINTERLEAVER amp VITERBI DECODER The deinterleaver is used to reverse the interleaving performed by the mobile unit Interleaving provides protection against burst errors and fades The Viterbi decoder using the Viterbi algorithm optimally decodes the convolutional coding from the mobile unit Quality bits and CRC bits are used to verify the quality of the decoded data PN SEQUENCE GENERATORS There are several PN generators within the CSM The PN sequences generated are the channel Q channel and long code sequences for both forward and reverse link processing http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 ENCODER amp INTERLEAV ER The encoder takes forward link data frames convolutionally encodes them and performs symbol repetition for bit rates less than full rate The encoder also automatically generates CRCs for the frames that require them The interleaver is used to provide time diversity in transmitted symbols thereby providing protection from relatively long transmission fades and burst errors The effects of the interleaver are reversed
148. ts It also describes how the device performs blocks and circuits within the M SM 2300 and their signal processi ng tasks within the subscriber unit interconnection to areas within the subscriber unit Figure 2 MSM2300 Functional Block Diagram MSM2300 Antenna Mobile Station Modem External UART System RF and IF Ae 80C1 86EC Peripheral Circuits eee ie Microprocessor Bus Circuits processor RAM ROM Subsystem EEPROM Display etc Offset Controls it General Purpose Interface Bus Receive Data and Status CDMA Processor General Purpose Interface BBA2 f RINGER Transmit and Q Data Analog Baseband Processor D and Status Nin LO Vocoder ride C PowDas y Aux Receive Data C PCMData Y Data and Status Purpose CODEC ADC Interface MODE Select Interface Select Interface MODE Select Interface External Mode Selection ANSI IEEE 1149 1 1990 JTAG Interface ELA 3 5 QUALCOMM Incorporated ASIC Products http www qualcomm com ProdT ech asi c 6455 Lusk Boulevard San Diego CA 92121 2779 USA E mail asic products qualcomm com CDMA ASIC Products Data Book 80 22370 2 9 97 Telephone 619 658 5005 Data Subject to Change Without N otice Fax 619 658 1556 RF INTERFACE The RF Interface communicates with the subscri ber unit s external RF IF and analog baseband circuitry Signals to this circuitry control signal gain in the RF Rx and T x signa
149. tures CDMA utilizes digital encoding for every telephone call or data transmission One of 4 4 trillion unique codes are assigned to every communi cation which disti nguish it from the multitude of calls simultaneously transmitted over the same broadcast spectrum Only your CDMA phone has the right code to receive your conversation With CDMA digital encoding even your phone number remains private that means no more cloning CDMA SOFT HANDOFFS A handoff occurs when a call has to be transferred from one cell to another as the user moves between cells In atraditional cellular or TDMA handoff the connection to the current cell is broken and then the connection to the new cell is made This is known as a break before make or hard handoff Since all cellsin CDMA use the same frequency it is possible to make the connection to the new cell before leaving the current cell This is known as a make before break or soft handoff Soft handoffs allow for fewer dropped calls and better sound quality TDMA systems are not capable of performing soft handoffs VARIABLE RATE VOCODER The key to efficiency in digital voice transmission is the conversion of an audio signal into binary numbers This allows the digital signal to be compressed and grouped into packets of information The increased spectral efficiency of digital cellular is partly dueto the use of a vocoder to convert speech into digital code The vocoder samples the spoken word but on
150. ucing sound quality Speech is coded using a sophisticated model of human speech reproduction This model includes components relating to spectral pitch and noise characteristics of speech In the M SM 2300 the vocoder is capable of both 8k and 13k QCELP for embedded voice processing Theinternal vocoder may also be bypassed in CDMA M ode allowing an external vocoder to be used The M SM 2300 vocoder clock source is more flexible than the M SM 2 2 and now includes XTAL IN DIV 3 GPIO28 DIV 2 XTAL IN DIV2 CHIPX8 and GPIO28 each as possible clock sources In CDMA Mode the vocoder QCELP algorithm uses codebooks to vector quantize the residual speech signal QCELP differs from CELP in that it produces a variable output data rate based on the level of speech activity The QCELP algorithm adjusts the data rate based on the energy in the speech signal Higher data rates are used for active high energy speech segments and lower data rates are used for silent low energy periods Low energy periods occur during natural pauses in speech 3 8 QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice that occur when listening exhaling or pausing between words and syllables An intermediate rate is used when the input speech signal energy is between thresholds or when transitions between speech and sil ence occur The vocoder e
151. ucts Data Book 80 22370 2 9 97 Data Subject to Change Without N otice TheFIRM has a microprocessor interface with an 8 bit wide data port and a separate address port The microprocessor interface is used to configure the FIRM For example Set up specific BCN paths through the FIRM e Set the address filter parameters for each BCN path through the FIRM Specify the clock source to be used for each serial port Specify which events will activate the interrupt line Readregisters reporting errors and performance data In addition BCN data can beinserted through the microprocessor interface to any of the path buffers This datais then driven onto the output port connected to the buffer Similarly the contents of any of the path buffers can be extracted through the microprocessor port thus obtaining the data stream from the input port connected to that buffer FEATURES Maximum frequency of main array clock 20 MHz Maximum speed of each parallel port One byte per cycle of main array clock Maximum speed of each serial port 17 M bps Maximum speed of microprocessor port One byte per 4 cycles of main array clock EEE 1149 1 Test Access Port for boundary scan Four general purpose I O pins Package 160 pin PQFP Core power requirement 3 0 V to 3 6 V O power requirement 3 0 V to 5 25 V Power dissipation 1 2 W at maximum frequency http www qualcomm com ProdT ech asi c E mail asic products
152. ut of BBA2 Figure 3 BBA2 Receive Section Block Diagram DIMDE 4 2mu if LPF E QOFFSET OFFSET TXO RXIF RXIF RXVCO_ TI RXVCO T2 TCO 4 RXID 3 0 CHIPX8 RXQD 3 0 RXIFMDATA FMCLK RXQFMDATA RXVCO_ OUT RXFMSTB QUALCOMM Incorporated ASIC Products 6455 Lusk Boulevard San Diego CA 92121 2779 USA CDMA ASIC Products Data Book 80 22370 2 9 97 Data Subject to Change Without N otice 4 3 http www qualcomm com ProdT ech asi c E mail asic products qualcomm com Telephone 619 658 5005 Fax 619 658 1556 FM RECEIVE SIGNAL PATH Thereceive signal path for FM operation is similar to that for CDMA operation There are differences in the characteristics of the and Q low pass filters and the ADCs ThelF frequency is the sameas in CDMA 85 38 MHz but the modulation can only extend 15 kHz from the IF center frequency to form a 30 kHz wide channel Thelow pass filters for FM operation have a much lower bandwidth than those used in CDMA The offset of the FM low pass filters is controlled just like the CDMA low pass filters by the offset control input pins Thelower bandwidth of the FM baseband signal allows very low power 8 bit ADCs to be used The FM and Q analog baseband signals are sampled and held during the analogto digital A D conversion process The A D conversion is initiated with a strobe from the MSM A serial data stream is output beginning with the Most Significant Bit M SB
153. waks however this reouirervert isvery stemmed gperclrt The Hiesirr rcr istydelly incopoeaded intrenatcthirg rework bebnesn the o tp E and next sage 4 iris mide bypesedto go rd with abor a OOllLF mito keqdirgtae2 ca matiostoanirinumegh 3 6V_4 5 RI 3 3K 2e VCONTROL ca O1LUF l T2 458PT 1024 Z2 5T lld 2v JIeuieups SAL S0GGO LT N IF INPUT J2 SMACON 2 INPUT IMPEDANCE MATCHING As with all active and passive components in the signal paths of the RF subsystem the impedance levels in the signal path should be controlled and matched to minimizelosses Theinput impedance of the CDMA inputs to the Q5500 and Q5505 is specified as 1000 Q 15 When driving the Q5500 from a 500 Q differential source impedance a 1000 Ohm resister should be connected between the IN and IN inputs This will set the effective input impedance to 500 Q 8 assuming a stable and accurate 1000 Q external resi ster The FM inputs of the Q5500 are differential but may be used with a single ended input signal In the single ended case pin 5 should be connected to ground through a 0 01 uF capacitor This causes pin 5 to bean AC ground pin The single ended input impedance for the FM input is 850 Ohms 15 If driven from a 500 Q source an external resistor of 1 2 kQ connected between the FM input and ground will set the effective singl e ended FM input impedance to 500 Q 10 The Q5500 and Q5505 amplifier

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