DCP-1 Assembly Manual
Contents
1. 1 Figure 18 ADC and DAC filter locations 19 DCP 1 Assembly Manual 2005 John B Stephensen There are also pads for 3 and 5 pin header connectors for the ADC and DAC respectively If the PCB is to be mounted in a box with analog circuitry these headers can be installed in place of the USB and RJ 45 connectors If the mini DIN SPI connector and 74AHC14 buffer aren t needed there is a spot for a 7 pin SPI connector at the bottom of the board By default the board is configured for use with the internal boot ROM To boot from flash memory after it is programmed install a jumper or 0 100 ohm resistor at the location labeled FLASH underneath the MCU 4 4 Inspection and Power up Carefully inspect the PCB assembly for solder bridges foreign material and reversed tantalum or aluminum electrolytic capacitors before applying power Then check the power connector with an ohmmeter The resistance should be above 500 ohms for both power supply inputs Then check the 1 3 and 2 5 volts supply distribution The resistance should be above 2000 ohms The 2 5 V supply may be accessed at the tab of the voltage regulator on the connector side of the board The 1 2V supply is accessible near the heat sink on the regulator on the IC side of the board Clear any shorts before applying power Always apply power 3 3V and 5V to the board simultaneously to prevent any damage to the analog ICs Apply power for a short time and check all vo2. 9767ASZ 8 1 SSOP56 CY7C68001 High speed USBSIE 9 1 QFP144 XC3S400 FPGA Spartan 3 DCP 1 Assembly Manual 2005 John B Stephensen Bag 1 Connectors and Heat Sinks Qty Deschpio 1 1 Connector USB type A 2 RJ 45 or both with 2 LEDs ie Connector Mini DIN 8 pin Connector dual 1 8 phone jack 6 1 Connector 5 25 pins 100 mil centers locking ramp Heat sink 2 holes appx 0 75 x 1 5 8 1 Heatsink appx 0 6 square O SS 9 _ _1_ Thermal tape appx 0 5 square _ _ _ _ _ 1 Socket 8 DIP 11 1 Header 20 pin dual row 25 mil square pins 100 mil centers 12 2 Secew 6 32 x 3 8 0 0 00 O Bag 2 Crystals and Thru hole Regulator Qty Descripion O Crystal HC 49 U 24 000 MHz 100 PPM Crystal HC 49 U or SMT 6 000 MHz 100 PPM LDO VR adjustable 3A TO 220 IRU1030 or equiv Insulator HC 49 U Bag 3 Semiconductors tem Oty Pkg Leads Mang 1 1 807 233 5 Small signal diode MMBD4148 or equiv _2 1 SOT 233 39Vzenerdiode 3 1 807 233 74 6 2Vzenerdiode amp m SOT 23 3 3 15 V voltage monitor PL 1 SOT 23 5 9T Dual NPN transistor array XNO121100L eee es SN74LVC2GU04D
3. 001 3 3 4 7uH B47 4 7 3x4 7 EX Figure 12 Capacitor locations Figure 13 0 1 uF capacitor locations 16 DCP 1 Assembly Manual 2005 John B Stephensen 4 3 3 Crystals and Axial Lead Capacitor The 12 and 24 MHz crystals and the 220 470 uF capacitor may now be mounted These are placed on the side of the PCB opposite the ICs as shown below and soldered on the IC side of the PCB Place insulators on the crystal leads before soldering 470 24 Figure 14 Crystal locations 4 3 4 Connectors Finally mount the connectors as shown in figure 15 Include the USB type A RJ 45 and mini DIN connectors shown on the right side of the picture below only if the PCBA is to be mounted in a case with those connectors adjacent to a panel Otherwise header connectors can be mounted in their place Note that the SMB connector shown in the picture is not included in the kit It is normally not connected but could be added to create a sample clock input or output Use the chisel tip to solder these items as they require a lot of heat Be careful to heat the shield pins adequately in order to avoid cold solder joints 17 DCP 1 Assembly Manual 2005 John B Stephensen Figure 15 Connectors mounted to PCB After mounting the connectors add the U shaped heat sink and TO 220 voltage regulator and solder the three pins Use the 6 32 screws lock washers and nuts for mounting amet SE Eppes i or L
4. BV 1117 LT1117 or equiv 1 5x mm CWX815 Oscillator 5 x 7 mm SMT 5V 24 57M 24 576 MHz 25 PPM DCP 1 Assembly Manual 2005 John B Stephensen Bag 4 Capacitors Package Marking 1 3 0805 Capacitor 10 pF 10 50V ceramic NN Capacitor 27 pF 5 50V ceramic 0805 None Capacitor 56 pF 5 50V ceramic Ae Capacitor 470 pF 5 50V ceramic Capacitor 4700 pF 5 50V ceramic 4 8 0808 none Capacitor 0 01 uF 20 80 25V ceramic Capacitor 0 1 uF 80 20 16 V ceramic 6 4 0805 none Capacitor 1 uF 80 20 16 V ceramic Capacitor 4 7 uF 80 20 16 ceramic none or Capacitor 4 7 uF 80 20 16 V ceramic 475 or tantalum aie Tt Capacitor 10 22 uF 80 20 6 V JJ7 tantalum gt ee 220 470 uF Capacitor 220 470 uF 6V aluminum electrolytic Bag 5 Inductors Transformers Item Qty Package Marking Description 1 1 SMT 5 d Transformer 50 ohm to 200 ohm CT L2 0805 Inductor 0 56 uH 5 1210 3R9 Inductor 3 9 or 4 7 uH 20 4R7 DCP 1 Assembly Manual 2005 John B Stephensen cy 6 ATE 0805 Marking _ Resistor 24 ohm 5 24R9 0805 49H9 Resistor 49 9 ohm 5 Td 100R aa 200R wem 300R me 604R 202 Resistor 2 000 ohm 5 2001 0805 4991 Resistor 4 990 ohm 1 Resistor 10 000 ohm 5 Resistor 56 000 ohm 5 Resist
5. DCP 1 Assembly Manual 70 Y fem ie Hea Y k NEL MA M em ye EPA TAN 275 E xao uA DCP 1 Assembly Manual 2005 John B Stephensen 1 Introduction The DCP 1 is a digital communications processor board that contains the hardware necessary to convert signals between analog and digital forms and perform digital signal processing for a radio transceiver It is usually used to interface the radio to a host processor which may be a personal computer 36 864 MSPS RX IF 0 5 kHz P Spartan 3 FPGA 12 amp 480 K TXI amp Q MBPS 0 230 4 T ARM7 TDMI KBPS MCU Figure 1 DCP 1 Block Diagram The board contains the following major components LTC1746 25 Msps ADC AD9767 125 Msps Dual DAC PCM3501 26 ksps Audio CODEC CY7C68001 High speed USB device ML67Q5003 MCU with ARM7 RISC processor 35400 FPGA with 6 144 logic elements 288 k RAM The ADC is capable of digitizing or IF signals between 0 1 and 50 MHz without significant degradation The ADC operates at 24 576 Msps and the typical single tone dynamic range is 94 dB at 5 MHz The DAC is used to generate complex baseband signals with frequencies between 0 and 3 MHz It usually operates at 12 288 per channel but the FPGA may be programmed to multiply or divide the 24 576 MHz clock for other sample rates Output frequencies over 40 MHz are possible A low s
6. between pins so that all solder is heated and flows to the pads After soldering all pins use thin 1 32 solder wick to remove excess solder Then carefully check every pin and the spaces between pads using the magnifier Use the solder wick to clean up any shorts Note If the mini DIN connector is not to be used leave out the 74AHC14 IC There are a lot of pins to solder so take time to do this correctly Solder each package before mounting the next 4 1 2 Other Semiconductors If you have Rev D of the PCB mount a jumper wire between the pads as shown in the diagram This jumper is near the lower left corner of the oscillator item 8 Mount the components in bag 3 as shown in the diagram below The oscillator must be mounted using solder paste but the other components can be attached with wire or paste solder Mount the oscillator first Note that item 7 will be added later to the other side of the PCB Apply paste solder to the four pads and then place the crystal oscillator on the pads observing proper polarity Pin 1 is marked by a cutout on the pad on the bottom of the package or a dot on the top of the package Heat each pad near the oscillator with the soldering iron until the solder bonds to the oscillator Proper bonding is verified by seeing that solder flows into the crevasses above each mounting pad on the oscillator package Now mount the other components All will mount only one way except the 6 pin SOT 23 package Its p
7. h as Contact East or Techni Tool Solder and static free mats are also available from these sources Make sure that adequate lighting is available as more is required as magnification increases Two or more light sources are useful as this minimizes shadows Warning This is not a kit for beginners The assembler should have experience soldering surface mount components Previous experience with a simpler SMT kit is recommended DCP 1 Assembly Manual 2005 John B Stephensen 3 Kit Contents The DCP 1 kit consists of a 4 layer printer circuit board a box containing integrated circuits and 6 bags of surface mount and through hole mounting parts Before starting assembly check to see that all parts are present The contents of each container are itemized below Figure 2 DCP 1 Kit Contents The integrated circuits used in this project have feature sizes down to 90 nanometers so they are sensitive to static charges The items in the box and bag 3 must be opened only at a static free work area Box Integrated Circuits Qty Pkg Leads Marking Description ss 1 1 SOIC8 ADM348 RS 485 transceiver half duplex SOIC 8 MCP6022 Dual operational amplifier rail to rail I O SOIC 14 AHC14 Hex schmidt inverter LVC14 SOIC 20 5563223 232 dual driver amp dual receiver 75C3223 MAX3223 SSOP 20 PCM3201E Audio CODEC single channel 8 24 ksps 1 QFP 48 9767AST Dual high speed DAC
8. l ngay PT LEE OP SI N 7 5 TERN ilis gs Lc n M QM IE Figure 16 IC side of PCB showing heat sink and voltage regulator 18 DCP 1 Assembly Manual 2005 John B Stephensen Now that all parts are soldered add the square heat sink with an array of fins to the FPGA It is attached with the square adhesive pad included in the same bag as the heat sink Remove the protective paper from one side of the tape and apply it to the bottom of the heat sink then remove the paper on the other side and press the heat sink onto the FPGA This completes the assembly of the basic kit 4 2 5 Options If a sample clock connector is added to the PCBA it can be wired in by adding components to the board as shown below ohms for sample clock output 0 01 uF for external sample clock remove clock oscillator or cut trace to pin 3 Figure 17 External sample clock connector Note that there are unused pads near the ADC and DAC These are for user supplied components to implement low pass filters for a particular application The DAC pads are shorted through so the output is usable external with filters The ADC pads are supplied for implementation of low pass or band pass filters If no user supplied filter is to be used mount two 0 1 uF capacitors where noted below 1
9. l or other conductive material X acto or equivalent knife Probe for positioning components toothpicks or Orange Sticks 1 32 width solder wick no clean flux preferred 0 015 0 020 diameter 63 37 alloy wire solder with no clean flux 63 37 alloy solder paste with no clean flux Solder paste dispenser syringe Two 25 60 W work lights 5 X magnifier A good soldering iron with fine tips that have been recently cleaned is a must Set the temperature to 650 F for 63 37 solder Two irons are useful to avoid tip changes and to remove 0805 0 08 x 0 05 to 1210 0 12 x 0 10 package SMT parts A hot air pencil is useful for mounting the SSOP and QFP ICs but is not mandatory Tweezers are useful for placing small parts and a hand operated or electric vacuum pick up tool is helpful for placing the quad flat packs Pick up tools are available from the same distributors that handle static control mats Orange sticks are wooden sticks orange wood is anti static with a chisel tip at each end They work better than toothpicks for pushing and holding 0805 to 1210 size components As very little solder paste is required purchase a small quantity in a syringe Use a 27 gauge or slightly larger needle Plungers are hard to operate so a gun that takes syringes is a useful investment if more SMT work is anticipated Excellent magnifiers are available from horological watchmaker supply companies or from electronic assembly supply distributors suc
10. ltages to ensure that they are within 5 Then apply power for 10 minutes and check the voltages again If any voltages are low check for abnormal heating of components and clear the problem before proceeding 20 DCP 1 Assembly Manual 2005 John B Stephensen 5 Programming To program the MCU flash memory a program provided by Oki Semiconductor is required This software is only available for Windows It may be download from their web site at wwwz okisemi com by clicking on Oki In System Flash Programming ISFP Utility Download the program and the user manual and follow the installation instructions provided TBD 6 Test TBD 21 DCP 1 Assembly Manual 2005 John B Stephensen Appendix A PCB Modification If you have received a revision D PCB identified by part number 1001800 in the bottom left hand corner the MCU PLL may be changed from x4 to x2 mode by making the following changes This allows use of a 12 MHz crystal instead of the 6 MHz crystal supplied WARNING This must be done before assembly as the cut is under the MCU Cut the trace identified by the X in the following figure with a sharp knife After the MCU is mounted solder together pins 11 and 12 of the MCU 22
11. olarity is determined by the printing on the package Pin 1 is in the lower left hand corner when the printing is right side up DCP 1 Assembly Manual 2005 John B Stephensen a gt Figure 4 Semiconductor locations 4 2 2 Bypass and Coupling Capacitors The bypass capacitors can now be mounted Prepare the board by placing a little solder on one mounting pad for each capacitor Then place the capacitor on the pads and heat the pad with solder until it flows onto the capacitor Hold the capacitor down with a toothpick or Orange Stick or it will stand up After the first end is soldered apply wire solder and heat to the opposite pad to complete the connections Inspect the connections and reheat if either appears to be a cold joint Use the same procedure for the resistors and inductors when they are mounted Mount the fourteen 0 1 uF capacitors first then the four 4 7 uF capacitors and the three 10 or 22 uF capacitors as shown in figures 5 and 6 10 DCP 1 Assembly Manual 2005 John B Stephensen 2 nHz Ue m ad U dics MES 000000000 _ TCK TOG SRST Salli a E T CODEC SUL 7 at S Ie d N REDE 7 Jo ey KG Figure 6 Mount three 22 uF five 4 7 uF 1210 and one 4 7 uF FUN capacitors DCP 1 Assembly Manual 2005 John B Stephensen 4 2 3 Other Capacitors Ne
12. or 100 000 ohms 5 Note that the integrated circuits and resistors are marked as shown in the parts list above The capacitors are unmarked so be careful to keep the different values separated Some of the inductors are marked and some aren t but they can be differentiated based on size DCP 1 Assembly Manual 2005 John B Stephensen 4 Assembly We recommend doing hand assembly of this kit in the steps outlines below to ensure that all parts are placed in the proper locations and that soldering is eased Be very careful to place parts in the correct location and observe polarities on the surface mount parts It is difficult to remove and remount parts without damaging the PCB so take time to ensure that assembly is correct the first time Always inspect work for solder bridges and cold solder joints during assembly as this minimizes problems later 4 1 IC Side of PCB The board is wired for use of a 6 MHz crystal to regulate the MCU clock This causes no problems in applications such as the UHF OFDM modem where the ADC is sampling at 12 288 Msps as it is hear a Nyquist frequency If your application requires sampling at 24 576 MHz and signals present at 6 MHz could be a problem see appendix A before proceeding 4 1 1 Integrated Circuits Mount the ten ICs contained in the black box first These are the most difficult to solder and the process would be hindered by the presence of other components Start with the 144 pin package
13. or Side Now that the IC side is complete turn the PCB over and start on the connector side of the board It will be necessary to use a board holder or to mount spacers in the holes in the 4 corners of the board to prevent it from wobbling during assembly If you are using preheating during assembly a hot air bath is required as a hot plate will not conduct enough heat to the proper side of the PCB 14 DCP 1 Assembly Manual 2005 John B Stephensen 4 3 1 Resistors There are a few resistors on this side of the board and they should be mounted first as shown in the diagram below Also attach the SOT 223 regulator at this time 1002 SOT 223 VR 100 100 B I 10K ual 10K KE 10K E mok 10K 100 8 8100 E 4990 m 4990 lk 499 499 20008 N 499 m 499 Figure 11 Locations of resistors on connector side of PCB 4 3 2 Bypass Capacitors The majority of the components on this side are bypass capacitors for the ICs on the other side These are shown in figure 12 Mount all but the 0 1 uF capacitors first There are eight 0 01 uF eight 1 uF six 4 7 uF and four 10 22 uF capacitors Observe polarity on the 10 22 uF capacitors Also mount the single 3 9 4 7 UH inductor After the other capacitors are mounted install the 47 0 1 uF capacitors as shown in figure 13 15 DCP 1 Assembly Manual 2005 John B Stephensen 0 01 0 01 0 01 Jii E o 1m 1 m a Ln 22 ES 22 gat 0013
14. peed 10 bit ADC is also available Signals may be processed by a combination of the 400 000 gate FPGA and the 48 MIPS CPU Analog I O is provided by the audio CODEC that typically operates at 8 12 ksps for a 3 or 5 kHz bandwidth Digital I O is provided by the UART on the MCU that supports RS 232 or RS 485 communication at up to 230 4 kbps and the USB SIE that supports data rates of 12 or 480 Mbps A SPI port may be used to control external devices or it may be programmed for parallel digital I O DCP 1 Assembly Manual 2005 John B Stephensen 2 Required Tools Assembly of PC boards with surface mount technology requires special tools The first requirement is static free workstation This can be a static dissipative mat on the top of a desk with a wrist strap connecting the user to the mat 3M and other companies make inexpensive mats and straps intended for field service These are available through distributors such as Mouser and Digi Key and orders may be placed via the Internet The mat should be connected to ground Use the third wire of the AC outlet powering the soldering iron after you have tested that it is wired correctly Required tools are Static dissipative work surface Wrist strap for grounding user Temperature controlled soldering iron with grounded tip 0 01 0 015 diameter soldering tip 1 16 1 8 chisel shaped soldering tip ooldering tip cleaner Hot air pencil optional Vacuum pick up tool Tweezers meta
15. s MCU and FPGA and then mount the other ICs in any order Double check the alignment on each part carefully before soldering Pin 1 must line up with the number 1 on the PCB as shown in the photograph below Note that the USB SIE label shows pin 1 aU ta Elec S XR A x d ilii 3l in 9 NH dL LLL py 906 i H p ae a e ae E 5 9 i ze pr mic Figure 3 Mounting Integrated Circuits 8 DCP 1 Assembly Manual 2005 John B Stephensen The components with 0 5 0 65 mm lead spacing FPGA MCU ADC DAC and CODEC should be mounted using solder paste Dispense the paste in a thin 5 10 mil strip across the PCB mounting pads for each package before it is mounted Then place the part and align it with the pads If the paste is spread out past the pad ends wipe off the solder with a swab and reapply Use a 5 7 magnifier to check the alignment of the pins with the pads and then solder the four corner pins using a soldering iron with a 0 01 0 02 diameter tip Recheck the alignment after each soldering operation and reheat the joint and move the part if necessary After the corner pins are soldered solder the remaining pins A hot air pencil is the easiest but a soldering iron will do When using the iron it is best to place it
16. xt mount the remaining capacitors on the IC side of the PCB These consists of a 470 three 10 and two 56 pF capacitors near the ADC 2 each 27 pF capacitors near the USB SIE and MCU and a 470 pF and three 4700 pF capacitors near the CODEC as shown below 4700 m 470 470088 H Bio 470 i 10 2m x EE 56 56 27 27 Figure 7 Locations of remaining capacitors 4 2 4 Resistors There are a number of resistors on the IC side of the board and these are mounted in two steps as shown in the figures 8 and 9 Note If the mini DIN SPI connector is not used don t mount the six 100 ohm resistors in the lower left hand corner 12 DCP 1 Assembly Manual 2005 John B Stephensen HEELS E j en z Tas je 4 Figure 9 24 49 9 200 300 620 4 99 8 2 56 resistor locations 13 DCP 1 Assembly Manual 2005 John B Stephensen 4 2 5 Inductors There are 4 inductors and one transformer to mount on the IC side of the PCB The two 0 56 uH inductors are the smallest and are not marked The 2 larger 3 9 or 4 7 UH inductors should be marked bur are distinguishable by size The transformer is a surface mount device with 5 solder pads on the bottom Be careful to orient it correctly on the PCB The side with 3 pads is oriented towards the upper part of the drawing This matches the mounting pads 3947 MN 0 56 E 0 56 3 9 4 7 n Figure 10 Locations of inductors and transformer 4 3 Connect
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