Photonic Sintering for Printed Electronics using Pulsed Light
Contents
1. 70 60 16 inch Ellipse 0 K 50 4 2 Spiral of Maximum 40 30 20 10 0 1 1 5 2 2 5 3 3 5 Distance from window inches Model LH 840 Blue curve Model LH 910 Red Curve o POLYTEC GmbH Polytec Platz 1 7 D 76337 Waldbronn GERMANY Tel 49 72 43 604 174 Fax 49 72 43 6 99 44 E Mail ot polytec de www polytec de2. The photo illustrates a 2 00 KV lamp voltage using the Sinteron 2000 LED display Also illustrated is a 5 032 VDC reading on a digital meter attached to the Sinteron 500 BNC connector 5 032 400V 2 KV Step 6 Set the system timer for one pulse 0 2 sec setting single shot mode and expose the material to just one pulse by toggling upward and releasing the TIMER switch Photonic Sintering for Printed Electronics using Pulsed Light Step 9 If excessive blow off of material occurs in a localized area along the axis move the substrate away from the window and repeat steps 1 8 Decrease of energy with distance is shown in Appendix and Appendix J If excessive blow off of material occurs over the entire exposed substrate lower the lamp voltage and repeat the test Step 7 Remove the substrate and examine the material for visual signs of sintering or destruction Step 8 Make a resistive measurement of the exposed area by placing your probes in the same location as used for the pre exposure reference measurement Record the resistive measurement in the data collection form Resistance After Step 10 Continue to change the optical energy level and optical profile distance from lamp window by changing both the lamp voltage and the substrate distance recording all data as you continue to change the settings Note that the material resistance will continue to decrease until excessive energy blows the materi
3. minute If faster feed rate is required additional systems are required Length of cured area must also be coordinated with the width of the conveyor belt or target Photonic Sintering for Printed Electronics using Pulsed Light 5 Ink material and substrate properties Structure and content of ink The ink material structure and thickness have a major influence on the amount of energy required to sinter and achieve low resistance A guide to the degree of difficulty is shown below using a scale from 1 to 5 A rating of 1 indicates a relatively easy ink to sinter A rating of 5 indicates the most difficult ink to sinter i e requires highest pulse energy and longest pulse duration e Material o Silver Ag 1to3 o Gold Au 1 o Copper Cu 1 to 5 e Structure o Flake micro flat 2 o Spherical nano particle 1 e Particle size o Nano size less than 30 nanometers diameter 1 o Micro flakes 2 e State of ink o Dry 1 o Wet 5 e Thickness o lt 10 micron 1 o gt 100 microns B Substrate The substrate has a major influence on the amount of energy required to sinter the conductive ink The degree of difficulty is shown below using a scale from 1 to 5 A rating of 1 indicates a relatively easy ink to sinter A rating of 5 indicates a more difficult ink to sinter i e requires highest pulse energy Substrate examples with sintering difficulty e Paper 1 e PET 2 e PIl 2 e Silicon 5
4. to achieve sintering for a wide range of conductive ink materials on different substrates Users of this procedure should first become familiar with the basic operation of the system See references below SINTERON 2000 and SINTERON 500 Systems Overview e The SINTERON 500 consists of a table top controller separate lamp housing sintering chamber and lamp housing blower The controller provides all power and user control of the flash lamp mounted in an air cooled lamp housing A blower is provided to cool the lamp Two lamp housing options are available model LH 910 with a 107mm diameter spiral flash lamp or model LH 840 with a 16 linear flash lamp e The SINTERON 2000 consists of a 19 electronics rack consisting of four bays that contain the power supply controller and pulse forming networks A blower is provided to cool the lamp Two lamp housing options are available model LH 910 with a 107mm diameter spiral lamp or model LH 840 with a 16 linear flash lamp The key performance features of the SINTERON systems are shown in the table 1 Bets oe LH 910 LAMP HOUSING LH 840 LAMP HOUSING Specification SINTERON 500 SINTERON 2000 SINTERON 500 SINTERON 2000 Pulse Energy Range Joules 465 830 450 2000 290 830 150 2000 l 580 1000 580 1000 Pulse Duration us 520 1500 2000 52 1500 2000 Sintering Area 0 75 x 12 0 75 x12 Table 1 Specifications for SINTERON 500 and SINTERON 2000 Systems Reference Documenta
5. Appendix C Model LH 840 Focal Point All dimensions in inches mm Photonic Sintering for Printed Electronics using Pulsed Light Appendix D Model LH 910 Intensity Distribution NOTES 1 UNIT OF MEASUREMENT FOR INTENSITY IS JOULES CENTIMETER SQUARED BB 2 DISTANCE ONEINCH FROM WINDOW SINGLE PULSE AT 830 ELECTRICAL JOULES 3 INCH DIA INTENSITY UNIFORMITY OVERS INCH DIAMETER SURFACE USING THE107MM SPIRAL LAMP BROAD BAND J CM 2 Model LH 910 intensity uniformity over 5 diameter surface 1 distance from lamp housing window single pulse 830Joules Photonic Sintering for Printed Electronics using Pulsed Light Appendix E Sinteron 2000 with LH 840 Pulse Energy Voltage Pulse Pulse Pulse Pulse Pulse Tulle Pulse PIS K Energy Duration Energy 1 Duration Energy Duration Energy Duration usec Joules usec a EE H Cie e e n e e e e a so soa 1000 so 1500 zez f 200 S 1000 1000 8 N 5 a oa 1000 873 1078 2700 2750 2800 1677 1803 1934 2002 1070 1141 1178 1712 1766 1822 a Jain N 3700 3750 3800 Photonic Sintering for Printed Electronics using Pulsed Light Appendix F Sinteron 2000 with LH 910 Pulse Energy Pulse Pulse Pulse Pulse Pulse Pulse Pulse Pulse vonage Energy Duration Energy Du
6. Appendix D Model LH 910 intensity uniformity at 1 distance from lamp housing window Photonic Sintering for Printed Electronics using Pulsed Light 3 Sintering Procedure Initial testing of nanomaterial is performed by positioning the material under the lamp housing and exposing the material to a single pulse flash This procedure is called static testing After each exposure the resistivity of exposed material is measured along with a visual examination Based on these results energy deposit changes are made by changing the voltage setting and PFN selection Sinteron 2000 only The optical intensity and uniformity can also be modified by changing the distance between the lamp housing and substrate In general greater distance lowers the intensity while giving better uniformity and a wider footprint An example is shown in the graphs located in Appendix C and I A recommended data collection form is shown in Appendix H Step 1 Place the substrate on an alignment fixture This can be as simple as a white piece of paper with a reference line to position the substrate directly under the axis of the flash lamp e LH 840 Lamp Housing 3 5 from the edge of the 7 0 wide housing e LH 910 Lamp Housing 3 9 from the front edge and 3 9 from the right side of the housing Step 2 Measure the resistive properties of the material to be sintered with a digital meter and probes Note the distance between the probes the width of the pote
7. KS Polytec Photonic Sintering for Printed Electronics using Pulsed Light SB206A 10 10 Photonic Sintering for Printed Electronics using Pulsed Light Using SINTERON 500 and SINTERON 2000 Pulsed Light Sintering Systems Roger Williams Xenon Corporation Contents 1 Introduction 2 3 4 5 6 Special Substrates Appendix A Model LH 840 Outline Appendix B Model LH 910 Outline Appendix C Model LH 840 Optical Focal Point Appendix D Model LH 910 Energy Profile Appendix E SINTERON 2000 Pulse Energy specifications Appendix F SINTERON 500 Pulse Energy specifications Appendix G 1 SINTERON 500 Max Pulse Rate Appendix G 2 Sinteron 2000 Max Pulse Rate Appendix H Sintering Data Collection Form Lamp Housings Sintering Procedures Converting static test data Material and substrate properties Appendix Optical Energy of Lamp Housings J oules cm Appendix J Optical Energy of Lamp Housings of maximum Photonic Sintering for Printed Electronics using Pulsed Light 1 Introduction This procedure is designed to assist in the use of Xenon Corporation s SINTERON 500 and SINTERON 2000 photonic curing systems and their application for R amp D work with conductive nanomaterials on heat sensitive flexible substrates These systems feature a high intensity pulsed xenon lamp that delivers a broadband spectrum The user has the ability to select various operating conditions see table below
8. Photonic Sintering for Printed Electronics using Pulsed Light 6 Special substrates Conductive transparent films Transmission test before Resistive read before Transmission test after Resistive read after The graph below shows how the transmission of a transparent conductive substrate changes with energy The orange line bottom represents the transmission of a substrate that received the highest energy exposure The result was highest conductivity but lowest transmission The red line top represents the transmission of a substrate that received the lowest energy exposure The result was lowest conductivity with highest transmission The lines going from orange to red show how transmission decreases and conductivity increases as the energy is increased Fine tuning the best energy level for maximum transmission and conductivity is the challenge of Transmission 100 90 80 70 60 50 40 30 20 300 400 500 Wavelength nm Photonic Sintering for Printed Electronics using Pulsed Light Appendix A Model LH 840 Outline 29 88 30 00 ta 6 92 2X 2 00 y 2X 26 00 T 2X 9 29 All dimensions are in inches Photonic Sintering for Printed Electronics using Pulsed Light Appendix B Model LH 910 Outline All dimensions in inches mm Photonic Sintering for Printed Electronics using Pulsed Light
9. al off the substrate when a higher resistive reading will be observed Continue to develop the process window by testing with repeated pulses After determining the best lamp voltage and material position under the lamp housing based on achieving lowest resistivity make note of the optimum distance pulse energy pulse width and length of sintered area Photonic Sintering for Printed Electronics using Pulsed Light Example of sintering copper The picture below illustrates how sequentially changing electrical and optical parameters can influence sintering results Samples were Cu on a Polyimide PI substrate using a single pulse 2 milliseconds duration with energy ranging from 920 1217 joules and distances varying from 1 to 1 7 Varying ink structure and thickness has an influence on success requiring individually tests for different materials and substrates Often the selected pulse duration can be reduced to accomplish similar results at lower energies This would result in lower power consumption when converting to an inline application See converting static test data in section 4 Photonic Sintering for Printed Electronics using Pulsed Light 4 Converting static test data The basic static testing performed in the earlier section can now be applied to moving targets typically found in conveyor or roll to roll applications An example might be to expose a roll of printed metallic circuits that are web fed and moving a
10. intering for Printed Electronics using Pulsed Light Appendix H Data Collection Form SINTERING TEST DATA ATE Sample Material Substrate LS Voltage Setting 3 ulse Energy Housing amp Distance Envelope Type of Pulses Light Read Ref esistance Before esistance After Din KK RZ 2 O l 09 pal fed Q 5 Visual Exam Notes Material enter material type or ref 4 Distrance from target to lamp housing window Substrate enter substrate descriprion of ref 5 Lamp Type A Cerium Lamp Type B Germicil For Sinteron 500 PFN 1 6 Refer to Light Measurements table below LIGHT MEASUREMENTS ioo Ophir Light Dose mJ cm m J cm BB J cm 033 B 240 ACT 5 reading Reading Reference 2 3 4 ee Photos of setup Test Conclusions Photonic Sintering for Printed Electronics using Pulsed Light Appendix Optical Energy Model LH 840 amp LH 910 Distance VS Optical energy J CM 2 16 Inch Lamp Ellipse VS 4 2 inch Spiral inch Ellipse s 4 2 Spiral v 5 2 000 9 LC 2 Distance from window inches Model LH 840 Blue curve Model LH 910 Red Curve Photonic Sintering for Printed Electronics using Pulsed Light Appendix J Optical Energy Model LH 840 amp LH 910 Distance VS Optical energy J CM42 16 Inch Lamp Ellipse VS 4 2 inch Spiral 100 90 80
11. ntial conductive path and the resistance Resistance Before in the data collection form Step 3 Position the top of the substrate below the window of the lamp housing according to the housing e LH 840 Lamp Housing 1 6 o This is 0 6 beyond the focal point e LH 910 Lamp Housing 1 This initial distance should be recorded in the data collection sheet Photonic Sintering for Printed Electronics using Pulsed Light Step 4 Align the substrate at the midpoint of the lamp housing and on axis e LH 840 Lamp Housing 15 from end and 3 5 in from side e LH 910 Lamp Housing 3 9 from front and 3 9 in from side Step 5 Turn ON the Xenon system and set the lamp voltage to the maximum allowed energy level for your PFN selection Follow instructions in the specific user manual for the correct sequence for powering on the system See Appendix E for maximum voltage setting levels for each PFN configuration Record your system PFN selection Sinteron 500 is recorded as PFN 1 Sinteron 2000 is recorded as PFN 1 PFN 1 amp 2 PFN 1 283 or PFN 1 2 3 amp 4 Also record the voltage energy and pulse width settings in the data collection sheet Sinteron 2000 panel is shown in the photo Note that the Sinteron 500 does not have a digital voltage display similar to the Sinteron 2000 and you must use a digital meter for reading voltage 1 volt reading 400 volts on lamp For more information consult the Sinteron 500 User Manual
12. ration Energy Duration Energy Duration Volts Joules Joules usec Joules usec Joules usec Photonic Sintering for Printed Electronics using Pulsed Light Appendix G 1 Sinteron 500 max pulse rate SINTERON 500 MAX PULSE RATE x no c Le MM w 2 w R E a 1 Lu Ke q a lu va pe D a Factory a ba ATUT PPD Voltage Setting Volts The SINTERON 500 has a factory set 1 8 pulse second pps flash rate Shown in the graph are allowable pulse rates depending on the lamp voltage setting These settings are made with hardware changes to the SINTERON 500 controller Consult factory for assistance when a change is needed to system pulse rate Photonic Sintering for Printed Electronics using Pulsed Light Appendix G 2 Sinteron 2000 max pulse rate FACTORY SETTING _ x lt o GO Q d b L B 9 a 5 A U v x v L 5 0 2 4 2 6 2 8 3 0 3 2 3 4 3 6 3 8 4 0 Voltage Setting KV The SINTERON 2000 has a factory set 1 8 pulse second pps flash rate for all PFN selections Shown in the graph are allowable pulse rates depending on the lamp voltage setting and PFN selection Pulse rate changes are made with hardware changes to the SINTERON 2000 controller Consult factory for assistance when a change is needed to system pulse rate Photonic S
13. t a specified speed i e linear Ft minute or meters minute The static data taken is used to determine the allowable web speed to insure the pulsed light foot print is applied to the moving target with all areas of the target being exposed In performing this calculation certain parameters must be included web conveyor feed rate optical foot print and flash pulse rate These parameters will be discussed in the procedure below Step 1 Examine static test data and select successful values for the following parameters e Distance from window to substrate e Electrical energy e Width of sintered cured area perpendicular to lamp axis e Length of sintered cured area along the lamp axis Step 2 Select maximum pulse rate for the electrical energy and PFN configuration selected in step 1 refer to Appendix G Step 3 Multiply the width of sintered area by the max pulse rate determine in Step 2 Example if pulse energy of 505 Joules was determined from the static tests and the sintered width was 1 5 the calculation would be 5 5 3 x 1 5 5 5 The maximum conveyor rate for one system would be 5 5 sec 27 5 Ft minute Step 4 To assure that no gaps occur between flashes you must recalculate using a more conservative evaluation based on a smaller width for the optical profile Use 1 25 inches in place of the 1 5 inch width 3 1 25 3 75 Maximum new feed rate to assure no gaps is now 3 75 s 18 75 FT
14. tion e Sinteron 500 data sheet e Sinteron 500 User Manual part number 810 0115 e Sinteron 2000 data sheet e Sinteron 2000 User Manual part number 810 0116 Contact Xenon Corporation for copies documents listed above Photonic Sintering for Printed Electronics using Pulsed Light 2 Lamp Housings Model LH 840 Housing The LH 840 contains a 16 linear arc lamp that focuses the light 1 from the lamp housing window Refer to Appendix A for outline drawing The maximum optical energy is deposited on the target at this distance with an optical foot print of 0 75 x 12 This is shown in Appendix C Substrate Alignments e Substrate alignment to lamp axis occurs 3 5 from either side of the housing e Substrate alignment to lamp midpoint occurs 15 from either end of the housing e Substrate alignment height for focus occurs 1 from the bottom of the housing Model LH 910 Housing The LH 910 contains a 107mm diameter spiral lamp The center of the lamp is 3 9 from the front and 3 9 from side Refer to Appendix B for outline drawings The LH 910 provides an area light source without a focus The maximum energy occurs between 0 5 and 1 from the lamp housing window at the center of the lamp Refer to Appendix D for an intensity profile Optical Specifications e Appendix C Model LH 840 fall off ray trace drawing e Appendix and Appendix J Model LH 840 and LH 910 intensity with distance from lamp window e
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