Hardware User Manual TCM-BF537 V1.4
Contents
1. ___ RREF aus 5 V 2k43 oo Oae oe RPU 5 64 BEAZADR 228 2 a a Hyp er VBUS _s ses eee Nia A Azk NG Tio USBB anf a sl alle u GND GND GND gt 3V3 2V5 3 2V5A 220Z wla Vin Vout _ c14 Cis c16 CIF C18 c19 C20 C23 CIL 3 2 10n 10n 100n 10u 10u 10n 100n rap 10n 100n tu gt GND iL ill XC6204 2V5 GND FT ar 2202 a u GND GND gt Figure 5 2 Configuration with USB 2 0 Chip R5u R6u MC 0 0654W 0603 1 39R RIOU 1M MC 0 063W 0603 MC 0 063W 0603 1 1M 1M Resistor 000 NET2272REV1A LF USB 2 0 Peripheral a eae KT wu f oso aooo p a o oo n Ytu 30 0 4Xx532 12 10 20 Crystal Oscillator Table 5 2 Bill of Material of Sample Schematic Blackfin TCM BF537 Hardware User Manual Page 26 BLUE ECHNIX u maximum performance at minimum size 6 Software Support 6 1 BLACKSheep The Core Module s delivered with a pre flashed bas c version of the BLACKSheep VDK multithreaded framework It contains a boot loader for flashing the Core Module via the serial port Please consult the software development documents 6 2 uClinux The Core Module s fully supported by the open source platform at http blackfin uclinux org Since the Core Modules are pre flashed with BLACKSheep you have to flash uBoot first To flash uBoot you can use the BLACKSheep boot loader To use the Ethernet functionality of the TCM BF537 Core Modules you need the EXT BF5xx ETH USB Blackfin Extension Board2. Figure 4 4 Border Pad Footprint for the Base Board top view Note Conducting paths and vias within the footprint must be solder resistant Do not place any component within the footprint either Blackfin TCM BF537 Hardware User Manual Page 14 BLUE ECHNIX_ Tinyboards maximum performance at minimum size 4 3 Schematic Symbol of Border Pad Version SPORTO CAN TWI GPIO Power PPI SPORT1 UARTs SPI JTAG i euspena sekaa apakah e b pasepan kab nahen pasah U VV VY Vy Vy yy vy yy yy yy AY Vy yyy yey yey ev yy yyy yy yy N V Oo Nn A V m UO 00 6 vv 19 T CM BF537 TFT I Ua aaa Ethernet GPIO IN Figure 4 5 Schematics of the Border Pad Version of the TCM BF537BP Blackfin TCM BF537 Hardware User Manual Page 15 BLUE ECHNIX 4 4 Border Pad Pin Assignment Pin No Tinyboards maximum performance at minimum size O CON DWM BP WN FR gt A A A A A A ww ww WW WWwWWwWNN NN NN NY NN NK PRP RP RP RP RP RP RP RP RP PB UT A U N Be O WO WON DMN BW NO WO WON DMN BW NO UO WAN DUM RA WYNY FP O Signal CLKBUF MDC SDA SCL RFSO TACLK3 RSCLKO TACLK2 DROSEC TACIO CAN_Rx DROPRI TACLK4 VDD RTC not available TFSO SPI_SSEL3 TSCLKO TACLK1 DTOSEC SPI_SSEL7 CAN_Tx DTOPRI SPI_SSEL2 RESET MDIO BMODE2 BMODE1 BMODEO TCK TDO TDI TMS TRST EMU PFO DMARO TxO PF1 DMA
3. Figure 3 2 Mechanical Outline bottom view Blackfin TCM BF537 Hardware User Manual Page 7 BLUE TECHNIX ln maximum performance at minimum size Figure 3 3 shows a side view of the Core Module with mounted connectors Figure 3 3 Side View with Connectors mounted The total minimum mounting height including receptacle at the motherboard is 5 8mm 3 2 Footprint For the Connector version 2x Hirose 0 6mm pitch the footprint for the base board looks like that as shown in Figure 3 4 For the baseboard the following connectors have to be used Baseboard Part Manufacturer Manufacturer Part No X1 X2 Hirose FX8 60S SV Table 3 1 Baseboard connector types The Connectors on the TCM BF537 are of the following type Part Manufacturer Manufacturer Part No X1 X2 Hirose 3mm height FX8 60P SV Table 3 2 Core Module connector types 2 60 lt gt lt ui ET ANAN AN 0 50 R 0 35 s POLL 22 20 Oo N 19 00 N 0 6 30 Blackfin TCM BF537 Hardware User Manual Page 8 BLUE ECHNIX u maximum performance at minimum size Figure 3 4 Recommended Footprint for Base Board top view 3 3 Schematic Symbol of Connector Version Ng 1 61 60 120 2 62 a 63 CAN 7 Sr 117 Zu 5 65 u 56 116 6 66 TWI O Sol 115 M 2 Adar GPIO a M 68 Bus 3 113 m 69 52 112 Power 10 70 51 111 71 D 10 7 12 72 49 109 13 7 48
4. Hardware User Manual TCM BF537 V1 4 BGA and Border Pad Versions Tinyboards from Bluetechnix www bluetechnix com Contact Bluetechnix Mechatronische Systeme GmbH Waidhausenstr 3 19 A 1140 Vienna AUSTRIA EUROPE office bluetechnix at http www bluetechnix com Document No 100 1225 1 4 Document Revision 17 Date 2009 05 25 Blackfin TCM BF537 Hardware User Manual 1 Introduction PEE a Were ae ee ga Bae aan E L2 NEL ee aa ang anaa ee E RR Re aab ana anan d aa aan aa aaa a ee LA Tas APP ee een 1 5 Peter TNO AGO aaa nangani pakah aa n ah aaa jana pa Ts DEE AON a anasi gak Kg ea ab cap aa ee ee 2 1 Functional Speciation u nn aaa 22 OE INNO 2er er 2 5 Gore Module Memory MAP saksa aaa aaa ngana ae 2 3 1 Asynchronous Memory Banks usssssssssseeeennennneeennn ZA Electrical Specincahon uunen aan 2 4 Supply VOU aradan anaa ee 242 SUPPI Volas Ole akasa akan aa aia raa ga aa rue 243 Input Clock Freuen an 2 4 4 Real Time Clock Crystal x ssissesiessecisnsns scissubseseanctornstasveensacenevassenatons 243 UDO CUI CNL nee ee 2 5 Environmental Specification ernawa sawanan aana nega a nagane anane gt gt Tepe rer 232 Dom ee erneuern 3 TCM BF537C Connector Version cccccceccceeccceesccescceeesceeescesesseesseunes Sok Mechanical Outer a u 32 TOO reise ep 3 3 Schematic Symbol of Connector Version ucessssseesesseeeesesnneeseeeeeenennen 3 4 Connectors PIN Assishment
5. Table 3 4 Connector X2 pin assignment Signal names correspond to those of the Blackfin processor unless otherwise stated Blackfin TCM BF537 Hardware User Manual Page 12 pe TECHNIK Tinyboards maximum performance at minimum size 4 TCM BF537B Border Pad and BGA Versions 4 1 Mechanical Outline The two figures below shows the top and bottom view of the Core Module All dimensions are given in millimeters a BB os EE Di F ee Fae 71 st SE E ee ea HW eeeeesess aa 2 2 zZ ZZ Z z z zZ LE E zu zu u u u EE nn RRR RAST EE fl em Zus Eu u u au EZ us us u u u u Figure 4 1 Mechanical Outline top view Al 11 9 i 76 _ E E E EE EEES EEEE EE SEESE E EE eeeeeseeeseeeeseeeeese 6 24 00 28 00 lt 1 50 8 08 eeeeeeeeee NS 6060000060060606 ULZ 47 49 1 50 Figure 4 2 Mechanical Outline bottom view Blackfin TCM BF537 Hardware User Manual Page 13 BLUE ECHNIX u maximum performance at minimum size Figure 4 3 shows a side view of the Core Module with border pads pl le 18x 1 4 Figure 4 3 Side View of the Border Pads The total minimum mounting height of the Border Pad version is only 3 1mm 4 2 Footprint of Border Pad Baseboard Figure 4 4 shows the pin assignment of the Border Pad Version The pin Numbering 1s clockwise ascending The Pins No 10 and 48 are not present 24 20 11 fal L 25 20
6. susesei nn 3 4 1 Connector AT eV asarana aa Nan aba ei ban aa eaaa anaa aaa aa 342 Connector X2 61 120 ann 4 TCM BF537B Border Pad and BGA Versions ooaeooenon aaa aon eaaa enaa een Al Mechamcal OUTING nee rare 4 2 Footprint of Border Pad Baseboard aeeeeeenaaannnenennanannenenananenene 4 3 Schematic Symbol of Border Pad Version aeaaeeeeeenaaanenenananannene 4 4 Border Pad Pin ASsignment cccccecccccecececeeeeeseeeeeeseceseeeeeeeaeaas 45 BGA PAD Numbering sasa aan adagang naak ra ap naga ana naa aaa D ER aa aa BE agan b Kae Table of Contents Blackfin TCM BF537 Hardware User Manual 4 6 Footprint of BGA Baseboard a een le 18 4 7 Schematic Symbol of BGA Version uesssssssssseseessnnnnnsssnnennnnnnnnnnnnnnnennnnnnnnnnn nennen 19 48 TGA Pin Ass snment esse eu 20 8 MRCS SUC 6 0 11 e VEFEPENTEECEHIECERUELENUEERSUUEUEEFFERELEERRENEUURSEREUERELLIELUN a aapa 23 4 10 Flash Memory Extension PINS 0220000000022000200000000020000n00nn nn nne e eaaa anna 24 4101 PING AZO ang TA ea ee 24 AIO WELING ee ee ee en een 24 5 Application Example Schema 8 nun kurzen 25 5 1 Schematic Example for Connecting a Physical Ethernet Chip 25 5 2 Schematic Example for Connecting a USB 2 0 Chip eneeeen 26 6 DEWA SUPDOL er ae er ee ee a naa aa baa 21 61 BLACE SI Deere een 27 0 2 WEIN ee ee ee ee ee 27 7 Al
7. 108 Ethernet 14 74 15 75 46 106 PPI 16 76 45 105 SPORT 1 On We i gt a O B 103 19 79 2 102 a OI Control Zu Hr a Signals Ss a T g gt 00 UARTs _ B 83 x iz SPI 37 Eu 5 5 36 6 26 86 35 95 5 7 Data 34 94 Bus 28 88 33 93 29 89 JTAG 2 02 30 90 31 1 Figure 3 5 Schematics Symbol of Connector Version of the TCM BF537 BLUE ECHNIX 3 4 Connectors PIN Assignment 3 4 1 Connector X1 1 60 O OO NO u BW NR D A A A ww UUUUUU UUUNNNNNNNNNN FP PRP RP RP RP RP RP RP RR WwW N RF OO O WON DM BW NO WO WON DMN BW NO WO WON DWH BPWwN FPF OO Signal RSCLKO TACLK2 DROPRI SPI_SSEL2 TSCLKO TACLK1 DTOPRI TACLK4 PH15 MIICRS SDA PH7 COL PH6 MIIPHYINT Vin 3 3 V Vin 3 3V PGO PPI1DO PG2 PPI1D2 PG4 PPI1DA PG6 PPI1D6 PG8 PPID8 DR1SEC PG10 PPI1D10 RSCLK1 PG12 PPI1D12 RE1PRI PG14 PPI1D14 TFS1 PPI1SY3 PF7 TMR2 PPI1SY1 PF8 TMRO MDC PF3 Rul TMR6 TACI6 PF1 DMAR1 TACI1 RxO PF11 SPI_MOSI PF13 SPI_SCK BMODEO GND TCK TDI TRST EMU TMS TDO BMODE2 MDIO BMODE1 PF12 SPI_MISO PFO DMARO TxO PF14 SPI_SS PF2 Tx1 TMR7 PPI1Clk PF15 TMRCLK PPI1Sy2 PF8 TMR1 PG15 PPI1D15 DT1PRI Blackfin TCM BF537 Hardware User Manual Signal Type 10k pull down PWR 10k pull up 10k pull up 4k7 pull down O 10k pull up O 10k pull down I O 10k pull u
8. 49R9 R4 1 gt Tx_CLK REFCLK ERxD 3 0 14 Tx ER TXD4 Vdd CORE 13 2 5V 10u 49R9 v D TVS USB2 0 gt InvNr 10549 12 F E d 6_ idl xRx R5 3V30 11 az ERxD3 3 gt RxD3 PHYAD Rx z R D5V_VAO s A Z GND ne 28 Rd ERDA RxD2 PHYAD2 R e3 A E Ar zo Ri ERDA gt RxDI PHYAD3 FXSD FXEN 7 v2 ZIR gt ERxDO 6 PHY AD4 Tx 40 Tx n 2a 4 xTx 2 Te ERxDV 4 T 2 pees 1 10 Rx_DV CRSDV PCS_LBPK Tx gt GND 1 DF 6 2 5V_VA er 9 Td ERxCLK 0 Rx CLK a d Be 3V30 ERxER IT _37 10 XZ lt i gt Rx_ER ISO REXT lt GND Er D TVS USB2 0 gt InvNr 10549 x 6k49 MII_CRS 22 R9 49R9 CRS RMII_BTB zu a COL 21 COL RMII SPEED 100 EEF 2 LED_SPEED 49R9 plo COLLISION NWAYEN 5 sae 2 gt MDC ACTIVITY TEST LED_ACT AN 100n OND MDIO EDUPLEX 4 u R10 GND nRESET_ETH1 48 RESET 7 sa POR w 30 peen CLKIN KTALI FE R12 220R MII_PHYINT 25 INT R13 3V3 lt 3V3 9 C8 c9 100n 100n CLKBUF GND Figure 5 1 Configuration with Physical Chip Ro hr Tme0 0631 060319 10R Resistor GO R3 R4 R8 R9 49R9 MC 0 063W 0603 1 49R9 o foo 2k43 MULTICOMP U2 KSZ8721BLI LQFP48L 10 100BASE Physical Layer 1 Transceiver V1 V2 USBLC6 2P6 TSV Diode for USB 2 0 X ULB C 060TC1 RJ45 Connector with LEDs Table 5 1 Bill of Material of Sample Schematic Blackfin TCM BF537 Hardware User Manual Page 25 BLUE ECHNIX Mu maximum perform
9. 5x31 5mm will be replaced by CM BF527 Blackfin Processor Module powered by Analog Devices single core ADSP BF537 processor up to SOOMHz 32MB RAM 8MB Flash 28x28mm 120 pin expansion connector Ball Grid Array or Border Pads for reflow soldering industrial temperature range 40 C to 85 C Blackfin Processor Module powered by Analog Devices dual core ADSP BF561 processor up to 2x 600MHz 64MB RAM 8MB Flash 120 pin expansion connector and a size of 36 5x31 5mm The new Blackfin Processor Module is powered by Analog Devices single core ADSP BF527 processor key features are USB OTG 2 0 and Ethernet The 2x60 pin expansion connectors are backwards compatible with other Core Modules The new Blackfin Processor Module is powered by Analog Devices single core ADSP BF548 processor key features are 64MB DDR SD RAM 2x100 pin expansion connectors Low cost Blackfin processor Evaluation Board with one socket for any Bluetechnix Blackfin Core Module Additional peripherals are available such as an SD Card Get ready to program and debug Bluetechnix Core Modules with this tiny development platform including a USB Based Debug Agent The DEV BF5xxDA Lite is a low cost starter development system including VDSP Evaluation Software License Blackfin TCM BF537 Hardware User Manual DEV BF5xx FPGA DEV BF548DA Lite EXT Boards Software Support BLACKSheep LabVIEW uClinux Blackfin Development Board with two sockets for
10. Blackfin TCM BF537 Hardware User Manual Page 27 BLUE ECHNIX u maximum performance at minimum size 7 Anomalles For the latest mformation regarding anomalies for this product please consult the product home page http www bluetechnix com goto tcm bf537 Revisions Description 24 10 2007 V1 1 RTC Problem The Clock accuracy of the RTC is much less than V1 2 specified by the crystal 20ppm Due to layout issues the V1 3 measured inaccuracy is about 7 9 sec Hour The RTC Bug affects both the BGA and Border Pad Versions For accurate time measurements please use the main crystal or an external RTC Table 8 1 Anomalies Blackfin TCM BF537 Hardware User Manual Page 28 BLUE ECHNIX ul maximum performance at minimum size 8 Production Report 8 1 TCM BF537 100 1225 V1 4 Table 9 1 Production Report TCM BF537 8 2 TCM BF537B 100 1226 V1 4 1 RAM_ MTASLCIGMI6A2BG75IT D PRAM JMTMBLCI6MIGA2BG 511p RAM__ JMTMBLCI6MIGA2BG 511p Table 9 2 Production Report TCM BF537B 8 3 TCM BF537B 64 100 1228 V1 1 2 ADSP BF537 BBCZ 5A 1 0 2 MT48LC16M16A2BG 75 IT D FLASH PF48F4400POVBQ Table 9 3 Production Report TCM BF537B 64 with 64MB Flash Blackfin TCM BF537 Hardware User Manual Page 29 BLUE ECHNIX nal maximum performance at minimum size 9 Product Changes For the latest product change information please consult the product web page at http www bluetechnix com goto tcm
11. ETxD1 PHO ETxDO PG13 PPI1D13 TSCLK1 PG11 PPI1D11 RFS1 PG9 PPI1D9 DT1SEC PG7 PPI1D7 PG5 PPI1D5 PG3 PPI1D3 PG1 PPI1D1 Blackfin TCM BF537 Hardware User Manual Tinyboards maximum performance at minimum size I O 10k pull down 10k pull down 10k pull down I O I O 10k pull up O I O I O PWR 10k pull up 10k pull up I O I O 4k7 pull down O I O I O Page 22 BLUE ECHNIX Tinyboards maximum performance at minimum size Vcc Vcc PF7 PPI1SY3 TMR2 PF9 PPI1SY1 TMRO PF14 SPI_SS PF12 SPI_MISO PF10 SPI_SSEL1 PF3 Rul TMR6 TACI6 PG15 PPI1D15 DT1PRI PG14 PPI1D14 TFS1 PG12 PPI1D12 DR1PRI PG10 PPILD10 RSCLK1 PG8 PPI1D8 DR1SEC PG6 PPILD6 PG4 PPI1D4 PG2 PPI1D2 PGO PPILDO Vcc Vcc PF8 PPI1_SY2 TMR1 PF15 PPILCLK TMRCLK PF13 SPI_SCLK PF11 SPI_MOSI PF6 TMR3 SPI_SSELA PF2 Tx1 TMR7 Table 4 2 BGA Version Pin Assignment S gnal names correspond to those of the Blackfin processor unless otherwise stated 4 9 Reset circuit The reset of the flash and the processor are connected to a power monitoring IC The output can be used as power on reset for external devices see Figure 4 9 ye External RESET Figure 4 9 Schematic of reset circuit on the Core Module Blackfin TCM BF537 Hardware User Manual Page 23 BLUE ECHNIX u maximum pe
12. any combination of Blackfin Core Modules Additional peripherals are available such as SD Card Ethernet USB host multi port JTAG including a USB based Debug Agent connector for an LCD TFT Display and connector for a digital camera system A large on board SPARTAN 3 FPGA and Soft IPs make this board the most flexible Blackfin development platforms ever developed Get ready to program and debug Bluetechnix CM BF548 Core Module with this tiny development platform including a USB Based Debug Agent The DEV BF548DA Lite is a low cost starter development system including VDSP Evaluation Software License The following Extender Boards are available EXT BF5xx Audio EXT BF5xx Video EXT BF5xx Camera EXT BF5xx Exp EXT BF5xx ETH USB EXT BF5xx AD DA Additional boards based on customer request are also available The BLACKSheep VDK is a multithreaded framework for the Blackfin processor family from Analog Devices that includes driver support for a variety of hardware extensions It is based on the real time VDK kernel included within the VDSP development environment LabVIEW embedded support for the CM BF537E CM BF537U and TCM BF537 Core Modules is based upon the BLACKSheep VDK driver Framework All the Core Modules are fully supported by uClinux The required boot loader and uClinux can be downloaded from http blackfin uClinux org Upcoming Products and Software Releases Keep up to date with all the changes to the Bluetec
13. bf537 V1 1 Border Pad and BGA Versions added with 64MB flash addressing option 28mmx28mm outline Component placement changed connector version Mount option for 64MB flash addressing connector version Correction of RTC inaccurateness Blackfin TCM BF537 Hardware User Manual Page 30 BLUE ECHNIX u maximum performance at minimum size 10 Document Revision History Version Date Document Revision 2009 05 25 Table 4 2 L14 gt J16 Symbol BGA updated 17 16 15 4 2009 03 19 Table 8 2 new version added 2009 01 19 Chapter 5 1 new schematic new part list 2008 12 02 Chapter 4 9 added Pull up down information added Correction of the BGA Pin assignment table English checked for spelling grammar and clarity 2008 03 27 2007 24 10 2007 06 04 2007 04 17 2007 04 04 2007 01 08 Corrected Typo in page 7 Table 2 2 PF5 one time instead of two times PF4 2006 1002 Release V1 1 of TCM Boards Main updates Separate Connector Border and BGA pad version Border Pads 76 Border pads without Data and Address bus pins Connector Version As in version V1 0 BGA Version Additional Processor pins added Flash addressing flexibility Removed limited address range all 8MB addressable Updated anomaly list only 4MB addressable 2006 04 26 Updated document Connector symbol fixed Bug naming of pin 22 and pin 40 connector version Rx and Tx was flipped 2006 03 07 First release V1 0 of the Document Tabl
14. information and document updates are available on the product homepage http www bluetechnix com goto tcm bf537 Blackfin TCM BF537 Hardware User Manual Page 2 BLUE ECHNIX ul maximum performance at minimum size 2 Specification 2 1 Functional Specification Mem Control Boot Mode JTAG Ethernet 16 Bit Data Bus Dynamic Core Voltage Control lt BF537 32 Mbyte SDRam 500MHz 256Mx16 Low Voltage Reset Data amp Address Bus 3V3 Power Reset Clock y Clock out PPI SPORTO UART1 UART2 SPI TWI CAN GPIO 20 Bit Address Bus Figure 2 1 Detailed Block Diagram Figure 2 1 shows a detailed block diagram of the TCM BF537 module Beside the SDRAM and a few other control pins the TCM BF537 has most pins of the Blackfin processor on its two 60 pin connectors or its BGA or its Border Pads Dynamic voltage control allows reducing power consumption to a minimum adjusting the core voltage and the clock frequency dynamically in accordance to the required processing power A low voltage reset circuit guarantees a power on reset and resets the system when the input voltage drops below 2 93V for at least 140ms 2 2 Boot Mode By default the boot mode 000 BMODE2 Low BMODEI Low BMODEO Low All BMODE pins hav
15. of the BGA footprint for your base board 28 00 6 6 6 6 6 0 6 iks Oo ee co lt 6 6 6 6 8 Figure 4 7 Recommended BGA Footprint for the Base Board top view 0 6 REEL 1 50 24 00 Blackfin TCM BF537 Hardware User Manual Page 18 BLUE ECHNIX 4 7 Schematic Symbol of BGA Version Tinyboards maximum performance at minimum size Power Flash Mem Ext mei Al Gl B7 SPORTO Be a gt F2 B8 gt CAN B C8 D3 B9 El C9 id Al0 G2 B10 TWI G3 C10 _TI6 ALL NI Cll Addr UI6 A12 G P IO m gt BID Bus Pl i C12 ALB B13 C13 B6 U9 A6 gt oS T2 Us T e gt D Ethernet U6 M2 GPIO l MI U 2 u Li PPI U M4 SPORT 1 T4 K2 U KI T3 72 UN gt gt U eooo u ole TO 13 U12 B3 T A3 Control UI gt Signals al AS Ul B4 UART Ti A2 S T14 DI RI6_ AIT RI7 BI7 SP U15 C16 T15 C17 Ul4 D16 D17 EI6 7 Data FI6 Bus F17 G16 G17 JTAG HI6 H17 716 17 a O daraa z P ER Figure 4 8 Schematics Symbol of the BGA Version of the TCM BF537BGA Blackfin TCM BF537 Hardware User Manual Page 19 Tinyboards maximum performance at minimum size 4 8 BGA Pin Assignment Pin No Signal CLKBUF MEMCLK AMS3 ARDY AWE ABE1 Al A4 A9 n c n c GND DO WP_Flash BGH AMS
16. 2 AOE ARE ABEO A2 A5 A7 Blackfin TCM BF537 Hardware User Manual Signal Type 10k pull up O O O O PWR I O 10k pull up O OC 0000 0 0 O PWR I O 10k pull up O PWR Page 20 ECHNIX D2 D3 Reset NMI DTOPRI SPI_SSEL2 GND D4 D5 DTOSEC CANTX SPI_SSEL7 TSCLKO TACLK1 TFSO SPI_SSEL3 n C D6 D7 DROPRI TACLK4 DROSEC TACIO CANRX RSCLKO TACLK2 n C D8 D9 RFSO TACLK3 SCL SDA GND D10 D11 MDC MDIO VDD RTC FA22 D12 D13 PH15 MIICRS PH14 ERXER GND FA23 D14 D15 PH13 ERXCLK PH12 ERxDV N C GND FA24 n C PH11 ERxD3 Blackfin TCM BF537 Hardware User Manual Tinyboards maximum performance at minimum size see chapter 4 9 10k pull up O PWR I O I O O I O I O I O I O I O I O I O I O I O I O PWR I O I O I O I O 10k pull up PWR 10k pull down I O I O I O I O PWR 10k pull down I O I O I O I O PWR 10k pull down PWR Page 21 BLUE ECHNIX PH10 ERxD2 n c BMODE1 BMODEO BMODE2 PH9 ERxD1 PH8 ERxDO n c N C TCK TDO PH7 COL PH6 MIIPHYINT n c GND TDI TMS PH5 MIITxCLK PH4 ETXEN n c N C TRST EMU PH3 ETxD3 PH2 ETxD2 n c n c n c n c GND GND GND Vcc Vcc GND GND GND n c PF1 DMAR1 TACI1 RxO PFO DMARO TxO PH1
17. I O I O I O I O I O I O PWR I O I O I O I O I O I O I O I O I O Table 4 1 Border pin assignment Signal names correspond to those of the Blackfin processor unless otherwise stated Blackfin TCM BF537 Hardware User Manual Page 17 BLUE ECHNIX Tinyboards maximum performance at minimum size 4 5 BGA PAD Numbering 1 50 Al A2 A3 A4 A5 AB A7 AB A9 A10 A11 A12 A13 A14 A15 A16 A17 B1 B2 B3 B4 B5 B6 B7 B8 BY B10 B11 B12 B13 B14 B15 B16 B17 C1 C2 C3 C4 C5 C6 C7 C8 CI C10 C11 C12 C13 C14 C15 C16 C17 Di D2 D3 D15 D16 D17 E1 E2 E3 E15 E16 E17 F1 F2 F3 F15 Fi6 E17 Gi Q2 G3 G15 G16 G17 H1 H2 H3 H15 H16 H17 J1 J2 J3 J15 J16 J17 K1 K2 K3 K15 K16 K17 L1 L2 L3 L15 L16 L17 M1 M2 M3 M15 M16 M17 N1 N2 N3 N15 N16 N17 P1 P2 PS PIS I Re NP Ri R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 Ti WA e Aah m Ma my e 5790 Jama 712149714122 719182 1414 7952 7191600917 Ui U2 U3 U4 U5 UB U7 U8 U9 U10 U11 U12 U13 U14 U15 U16 U17 Figure 4 6 BGA Pad Numbering top view 4 6 Footprint of BGA Baseboard Figure 4 7 shows the top view
18. R1 TACI1 RxO Vin 3 3V GND PF2 Tx1 TMR7 PF3 Rul TMR6 TACI6 PF6 TMR3 SPI_SSEL4 PF10 SPI_SSEL1 PF11 SPI_MOSI PF12 SPI_MISO PF13 SPI_SCK PF14 SPI_SS PPI1Clk PF15 TMRCLK PPI1Sy3 PF7 TMR2 PPI1Sy2 PF8 TMR1 PPI1Sy1 PF9 TMRO PGO PPI1DO PG1 PPI1D1 PG2 PPI1D2 PG3 PPI1D3 Blackfin TCM BF537 Hardware User Manual I O I O I O I O PWR I O I O O O see chapter 4 9 I O 10k pull up 10k pull down 10k pull down 10k pull down 10k pull up O 10k pull up 10k pull up 4k7 pull down O I O I O PWR PWR I O I O I O I O I O I O I O I O I O I O I O I O I O I O I O I O Page 16 46 PG4 PPI1D4 47 PG5 PPI1D5 48 not present 49 Vin 3 3V 50 PG6 PPI1D6 51 PG7 PPI1D7 52 PG8 PPI1D8 DR1SEC 53 PG9 PPI1D9 DT1SEC 54 PG10 PPI1D10 RSCLK1 55 PG11 PPI1D11 RFS1 56 PG12 PPI1D12 DR1PRI 57 PG13 PPI1D13 TSCLK1 58 PG14 PPI1D14 TFS1 59 PG15 PPI1D15 DT1PRI 60 PHO ETxDO 61 PH1 ETxD1 62 PH2 ETxD2 63 PH3 ETxD3 64 PH4 ETKEN 65 PHS MIITxCLK 66 PH6 MIIPHYINT 67 GND 68 PH7 COL 69 PH8 ERxDO 70 PH9 ERxD1 71 PH10 ERxD2 72 PH11 ERxD3 73 PH12 ERxDV 74 PH13 ERxCLK 75 PH14 ERXER 76 PH15 MIICRS Tinyboards maximum performance at minimum size I O I O PWR I O I O I O I O I O I O I O I O I O I O I O
19. ance at minimum size 5 2 Schematic Example for Connecting a USB 2 0 Chip The following example shows how to connect a USB 2 0 chip to the TCM BF537 core Module A 7 0 2V5 3V3 2V5A 3V3 gt gt GND GND d a A J aadi R14 AO 2 iao 0 er Lpo 2 D0 Os ama uo age geom ag welt AL am LAL A ARAR 52 IDI ahi Ka LA2 gt SS SOQ lt A 1m kj ale a Ha LA3 LD3 lt 53 DREO AG LA4 LD4 ass Bl LDS 2 USB nRESET 58 RESET a 36 D6 ALE gt gt ALE LD7 ol 2 59 Or a TOR LD9 50 LOW LD10 37 DO 34 DMARD LDII 55 DEL sj DMAWR LDI2 lt 7z Biz 351 DACK 1D13 lt D13 gt EOT LDI4 5 D14 aya un o oo LD15 D15 os 40 sr R17 GND 5 TEST Pe TMC2 LCLKO 25 RG 10k DREQ DREQ sekas c10 m IRO USB nIRQ 3V3 0 4 T coe XIN 9 an er gt Ez ES ND M v3 GND C11 c nr _8 39R MES GND 26 XOUT GND ee Tawa oe 2 USBD 30MHz pp 3 H 4 USBD 3 USBD 12 5 R21 A a 4 P R22 13 RSDP aan D TVS USB2 0 gt InvNr 10549 GND q GND GND
20. and prices please contact Bluetechnix http www bluetechnix com Warnings Due to technical requirements components may contain dangerous substances The Core Modules and development systems contain ESD electrostatic discharge sensitive devices Electro static charges readily accumulate on the human body and equipment and can discharge without detection Permanent damage may occur on devices subjected to high energy discharges Proper ESD precautions are recommended to avoid performance degradation or loss of functionality Unused Core Modules and Development Boards should be stored in the protective shipping package Blackfin TCM BF537 Hardware User Manual BLACKFIN Products Core Modules CM BF533 CM BF537E CM BF537U TCM BF537 CM BF561 CM BF527 CM BF548 Development Boards EVAL BF5xx DEV BF5xxDA Lite Blackfin Processor Module powered by Analog Devices single core ADSP BF533 processor up to 600MHz 32MB RAM 2MB Flash 120 pin expansion connector and a size of 36 5x31 5mm Blackfin Processor Module powered by Analog Devices single core ADSP BF537 processor up to 600MHz 32MB RAM 4MB Flash integrated TP10 100 Ethernet physical transceiver 120 pin expansion connector and a size of 36 5x31 5mm Blackfin Processor Module powered by Analog Devices single core ADSP BF537 processor up to 600MHz 32MB RAM 4MB Flash integrated USB 2 0 Device 120 pin expansion connector and a size of 36
21. e 10 1 Revision History Blackfin TCM BF537 Hardware User Manual Page 31 BLUE ECHNIX ul maximum performance at minimum size A List of Figures and Tables Figures Figure 1 1 Main Components of the TCM BF537 Core Module cccsssseseceececeeeeeeeeeees 1 Figure 2 1 Detailed Block Diagram sasae ananananenenenenan anana anan an eaaa nenen n nana ne nennen 3 Figure 3 1 Mechanical Outline top view ccccesessesnnecececeeeceeceeeeeeeeeeeeseeenaaaaaeaeeeceeeeeeees 1 Figure 3 2 Mechanical Outline bottom view uusssssessssssssssssnnenennnnnnnnnnnnnnnnnnnnnnnnsnnenn 7 Figure 3 3 Side View with Connectors mounted asarana anane an anana nnanenenenenenene 8 Figure 3 4 Recommended Footprint for Base Board top view uuusesesnssnsnensennennnn 9 Figure 3 5 Schematics Symbol of Connector Version of the TCM BFS537 9 Figure 4 1 Mechanical Outline top view uuuusseeeeeeeeeeeeeeeeeeeeeeenenenenenennnenenennnennnnnnnn nano 13 Figure 4 2 Mechanical Outline bottom VIEW ccccccccccccccecceecceceeeeeeeeeesennaeaecseeeeeeeeeeees 13 Figure 4 5 Side View of the Border Pads une en GK ANANE nE E 14 Figure 4 4 Border Pad Footprint for the Base Board top VieW ssssssesesseseseseseseees 14 Figure 4 5 Schematics of the Border Pad Version of the TCM BF537BP 15 Figure 4 6 BGA Pad Nu
22. e on board pull down resistors Blackfin TCM BF537 Hardware User Manual Page 3 BLUE TECHNIX A ka maximum performance at minimum size Switch Settings Boot Mode Description BM3 BM2 BM1 BMO 0000 0001 0010 0011 0100 0101 0110 0111 1000 oO Execute from16Bit ext mem Bypass ROM Boot from 8Bit or 16Bit EEPROM Flash Reserved Boot from serial SPI Memory Boot from SPI Host slave mode Boot from serial TWI memory Boot from TWI host Boot from UART host slave mode Execute from16Bit ext mem Bypass ROM 1001 Boot from 8Bit or 16Bit EEPROM Flash 1010 Reserved 1011 11 Boot from serial SPI Memory Table 2 1 Boot Mode TCM BF537 L bo b MA kd la Connect BMODEO to Vcc and leave BMODEI BMODE2 pins open for Boot Mode 001 equals to 8 or 16 bit PROM FLASH boot mode This is the default boot mode for the Blacksheep software BMODE3 is tied to low so all bootmodes 1XXX are not possible without hardware modification to the core module 2 3 Core Module Memory MAP Start Address End Address Size Comment 0x20000000 Ox2O1FFFFF of 8MB Flash PF48F2000POZBQO0S 0x20000000 Ox201 FFFFF of 8MB Flash PF48F2000POZBQ0S 0x20000000 Ox201FFFFF ya of 8MB Flash PF48F2000POZBQ0S FLASH 020000000 Ox201FFFFF ya of 8MB Flash PF48F2000POZBQO0S SD RAM 0x00000000 OxO1FFFFFF 16 Bit Bus Micron MT48LC16M16A2FG Table 2 2 Memory Map Be aware that you have to unlock the flash before starting an erase process 2 3 1 Asynchronou
23. gh the expansion board as parallel flash using asynchronous chip select lines or as SPI flash Low Voltage Reset Circuit o Resets module if power supply goes below 2 93V Blackfin TCM BF537 Hardware User Manual Page 1 BLUE ECHNIX Kl maximum performance at minimum size Dynamic Core Voltage Control o Core voltage adjustable by setting software registers on the Blackfin processor o Core voltage range 0 8 1 32V Peripherals available on all Core Module versions Power Supply SPORT 0 JTAG UARTO Uart1 CAN TWI IC compatible SPI Serial Port Interface PPI Parallel Port Interface Boot Mode Pins GPIO s O O O O O O OOOO Peripherals available on the Connector and BGA version only Data Bus Address Bus Further GPIO s Memory Control Signals O O O 0 1 2 Versions TCM BF537 Connector Version 2x60 connector pins TCM BF537BGA 169 BGAs 1 5 mm pitch for volume production TCM BF537BP 76 Border Pads no Data and Address bus on border pads 1 3 Key Features The TCM BF537 measuring only 28x28mm is the smallest core module available An extended temperature range suitable for industrial production Allows integration on a two layer baseboard Reduces development costs fast time to market Very cost effective for small and medium volumes 1 4 Target Applications Generic high performance signal processor module Industrial Automation 1 5 Further Information Further
24. hnix product line and software updates at www bluetechnix com BLACKFIN Design Service Based on more than five years of experience with Blackfin Bluetechnix offers development assistance as well as custom design services and software development Blackfin TCM BF537 Hardware User Manual BLUE ECHNIX u maximum performance at minimum size 1 Introduction The TCM BF537 is a chip size Core Module designed for industrial temperature range and volume production It combines power supply RAM and FLASH into a module as small as a chip package Different connector options Ball Grid Array BGA Border Pads BP and Connectors provides solutions for all possible requirements 1 1 Overview The Core Module TCM BF537 consists of the following components shown in Figure 1 1 2x Expansion Connector or BGA or Border Pads Dynamic Core Voltage ADSP Control BF537 32 Mbyte SDRam 256Mx16 500 MHz Low Voltage Reset Extended Temperature Range 40 C 85 Figure 1 1 Main Components of the TCM BF537 Core Module Analog Devices Blackfin Processor BF537 o ADSP BF537BBCZ 5A 500MHz 40 85 C 32 MB SDRAM o SDRAM Clock up to 133MHz o MT48LCI6M16A2BG 7 16Mx16 256Mbit at 3 3 V 8 MB of Byte Addressable Flash o PF48F2000POZBQOS 32Mx16 at 3 3V all 8MByte addressable bottom boot o Additional flash memory upon request It can be connected throu
25. mbering top View 222uuussssesesnnnnnnnnnnnnnnsnnnnnnnenennennnnnnnnnnnnnnnnnnn 18 Figure 4 7 Recommended BGA Footprint for the Base Board top view 18 Figure 4 8 Schematics Symbol of the BGA Version of the TCM BF537BGA 19 Figure 4 9 Schematic of reset circuit on the Core Module cccccccccccsscsessstessseeeeeeeeeees 23 Figure 5 1 Configuration with Physical Chip nennen 25 Figure 5 2 Configuration with USB 2 0 ChIp cccccessssssecccceceeeececeeeesesesessnnaeaeeseeeeeeeeeeees 26 Tables Table 2 1 Boot Mode TEM BES 7 sun nuesnne Er 4 Table 2 22 Memory Map arora da na mk a ana aapa esd sce a gka na daa De nal aaa e tng kaa bea a AENG daa een 4 Table 3 1 Baseboard connector 19 DES u une een 8 Table 3 2 Core Module connector Ty DES ana a 8 Table 3 3 Connector Al pin assignment cc ceeecccccccccceseeseeeececeeceeaesseeeceeesesaeeeeseeeeeeeaaenens 11 Table 3 4 Connector X2 pin assignment aaa enenananneneananan nane anana nn nean nane n nean aane e nane 12 Table 4 1 Border pin assignment cccccccccccssessseeecececceaeeesesccceeeeaseeseeeceeesesaeeeeseeeeeeseaaegens 17 Table 4 2 BGA Version Pin Ass gnment ussssssssssseesesnnnnnnnnsnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnn 23 Table 5 1 Bill of Material of Sample Schematic 0 ka Aa aa NGA KEDIK KANG oN aiar PAN 25 Table 5 2 Bill of Material of Sample Schematic esess
26. oe aas a saa panan an aas aaa baa aaa Sa aka aga nana E 28 amp Produ 00 0 ROPO NE NT fever natn ome NA entre one rena ee nnn rn cuneate ite 29 8 1 TENEBEIT IND TD einer er 29 6 2 TEMBE ITB 100 1220 een een 29 83 TCNM BES3 IB 641 TUN ZAH asasaran daa aa a ae 29 9 Produ AGS ee ee E 30 10 Document Revision History a nr 31 A EMO FE STD ren a een 32 Blackfin TCM BF537 Hardware User Manual Edition 2007 02 Bluetechnix Mechatronische Systeme GmbH 2007 All Rights Reserved The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics Terms of delivery and rights of technical change reserved We hereby disclaim any warranties including but not limited to warranties of non infringement regarding circuits descriptions and charts stated herein Bluetechnix makes and you receive no warranties or conditions express implied statutory or in any communication with you Bluetechnix specifically disclaims any implied warranty of merchantability or fitness for a particular purpose Bluetechnix takes no liability for any damages and errors causing of the usage of this board The user of this board is responsible by himself for the functionality of his application He is allowed to use the board only if he has the qualification More information is found in the General Terms and Conditions AGB Information For further information on technology delivery terms and conditions
27. p 10k pull down I O I O I O I O I O I O I O Tinyboards maximum performance at minimum size Page 10 Tinyboards maximum performance at minimum size PG13 PPI1D13 TSCLK1 PG11 PPI1D11 RFS1 PG9 PPI1D9 TD1SEC PG7 PPI1D7 PGS PPI1D5 PG3 PPI1D3 PG1 PPI1D1 GND GND PH5 MIITxCLK PF6 TMR3 SPI_SSEL4 PF10 SPI_SSEL1 SCL DTOSEC CANTX SPI_SSEL7 TFSO DROSEC TACIO CANRX RFSO TACLK3 Table 3 3 Connector X1 pin assignment S gnal names correspond to those of the Blackfin processor unless otherwise stated NOTE The processor pins PF4 and PF5 are used for flash addressing on the Core Module They are not available on the connectors 3 4 2 Connector X2 61 120 PinNo Signal Signal Type Al A3 A5 A7 A9 A11 A13 A15 A17 A19 ABE1 SDQM1 PH1 ETxD1 PH3 ETxD3 PH8 ERxDO PH10 ERxD2 I O ADRY 10k pull up PH13 ERxCLK CLKBUF GND AMS3 AWE O Baa O Bee Oo Bea O Be O 10 O O O Blackfin TCM BF537 Hardware User Manual Page 11 Tinyboards maximum performance at minimum size CLKOUT SCLK DO I O D2 I O D4 I O D6 I O D8 I O I O I O I O I O I O D11 I O D9 I O D7 I O D5 I O D3 I O D1 I O Reset see chapter 4 9 AOE O ARE O AMS2 O VDD RTC PH14 ERXER I O PH12 ERxDV PH11 ERxD3 PH9 ERxD1 PHA ETXEN PH2 ETxD2 PHO ETxDO ABE0 SDQMO A18 A16 A14 A12 A10 A8 A6 A4 A2 O Baa O Bay O FOJ O Ba O pe
28. rformance at minimum size 4 10 Flash Memory Extension PINS 4 10 1 PINS FA20 and FA21 These pins are the Address lines A20 PF4 and A21 PF5 of the Intel P30 Flash and are pulled down by default 4 10 2WP FLASH Is pulled high by default so flash is unprotected To write protect the flash connect this pin to GND Blackfin TCM BF537 Hardware User Manual Page 24 BLUE ECHNIX u maximum performance at minimum size 5 Application Example Schematics In the following two examples connection of a Physical Ethernet chip and a USB 2 0 chip to the Core Module are provided 5 1 Schematic Example for Connecting a Physical Ethernet Chip Since the ADSP BF537 Blackfin Chip from Analog Devices already has Ethernet functionality only a physical Ethernet chip needs to be connected to the TCM BF537 Core Module in order to make use of this feature W oz w 2 5V_VA C4 ETxD 3 0 a 6 j U2 KS872 2 5V_VA ETxD3 20 Ben 38 600Z 11 Y ETxD2 19 nee 33 kn 31 c5 25V VA ETxD1 18 42 10u 2 R2 GND gt TxD1 VddTX 4 GND 4 ETxDO 17 TxDO 10R ETXEN Tx EN VdgPLL 7 2 5V_PLL L2 R3 2 RAASDE MII_TxCLK 15 600 c6
29. s Memory Banks The maximum amount of memory addressable by a single asynchronous memory bank of the Blackfin processor is IMB On this module each 2MB segment of Flash is addressed over 2 asynchronous memory banks In order to be able to use more than 2MB without using more than 2 banks 2 GPIOs PF4 PF5 are used to select which 2MB section of the FLASH is visible in the memory window of the Blackfin processor This frees up the remaining banks for the user Blackfin TCM BF537 Hardware User Manual Page 4 BLUE ECHNIX A maximum performance at minimum size Aside from the first 2 async memory banks which are used for FLASH addressing the core module has 2 banks of the Asynchronous Memory interface available these can be addressed through the following addresses Bank Start Address End Address Size Comment 0 0x20000000 Ox200FFFFF 1MB Addresses FLASH 1 0x20100000 Ox201FFFFF 1MB Addresses FLASH 2 0x20200000 Ox202FFFFF 1MB Use nAMS 1 3 0x20300000 0x203FFFFF 1MB Use nAMS 2 These memory banks can be used to access various memory mapped devices or peripherals There are 19 address lines Al to A19 The AO signal is produced through addressing logic on ABEO and ABE1 this allows the entire 1MB to be addressable See section 5 6 Flash Memory Extension PINS 2 4 Electrical Specification 2 4 1 Supply Voltage 3 3V DC 10 2 4 2 Supply Voltage Ripple 100mV peak to peak 0 20 MHz 2 4 3 Input Clock Frequency 25MH
30. sessssssnssssssssseneneneenenennnnnnnnnnn 26 Table 821 Soma ee ern 28 Table 9 1 Production Report TEM BEI Tannen aan a a 29 Table 9 2 Production Report TCM BF537B 222cceeeeseenenesnansnanannannannnnenennennnnnnnnennenenen 29 Table 9 3 Production Report TCM BF537B 64 with 64MB Flash 222000000 29 Table 10 1 Revision HIStory nee een ish 31 Blackfin TCM BF537 Hardware User Manual Page 32
31. z The Blackfin Processor Input Clock frequency is 25 MHz this frequency is derived from the on board crystal oscillator and drives the Blackfin Processor s Clock generator This frequency is also provided on the connector as pin 78 CLKBUF 2 4 4 Real Time Clock Crystal 32 768kHz 2 4 5 Supply Current Maximum current 200mA at 3 3V Typical operating conditions at 25 C environment temperature o Processor running at 500MHz Core Voltage 1 2V SDRAM 50 bandwidth utilization at 125MHz 150mA at 3 3V o Processor running at 250MHz Core Voltage 0 85V SDRAM 50 bandwidth utilization at 83 3MHz Ethernet Idle 85mA at 3 3V o Processor running at 600MHz Core Voltage 1 2V SDRAM 50 bandwidth utilization at 120MHz 160mA at 3 3V Blackfin TCM BF537 Hardware User Manual Page 5 BLUE ECHNIX Kl maximum performance at minimum size 2 5 Environmental Specification 2 5 1 Temperature Operating at full SOOMHz 40 to 85 C 2 5 2 Humidity Operating 10 to 90 non condensing Blackfin TCM BF537 Hardware User Manual Page 6 BLUE ECHNIX u maximum performance at minimum size 3 TCM BF537C Connector Version 3 1 Mechanical Outline Figure 3 1 shows the top view of the Core Module All dimensions are given in millimeters a Figure 3 1 Mechanical Outline top view Figure 3 2 shows the bottom view of the Core Module connector version TTT TEE N asa MG I2 S48 WIL su LL TTTE L
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