TQMa35 User`s Manual - TQ
Contents
1. Power DGND P __ FLASH_RESET zw NC NOR Flash CTRL eae NC P DGND Power Power Management VSTBY 1 1 WDOG_RST Timer PWM I JTAG_RESET Power DGND I RESET_IN 551 vo O POR m 551 RXD vo P DGND Power 591 TXC vo 100 SSI_TXFS vo Power DGND 102 LD3 104 LD5 DGND Power 107 6 109 Lbs Power DGND P LD10 LD11 1012 1013 DGND Power 1015 1014 1017 1016 Power DGND 1018 1019 1020 LD21 2 DGND Power 1023 1022 LD_DRDY LD SPL Power DGND P LD REV LD_HSYNC LD_VSYNC P Power Power DGND O LD_CONTRAST IPU LCD IPU LCD LD_CLK USBHS_OC DGND P USBHS_PSW USB Host Hi Speed USB Host Hi Speed USBHS_UID 1 USBHS VBUS DGND DGND Power USBHS UDP 1 0 USB OC USB Host Hi Speed USBHS_UDM O USB_OTG PWR Power DGND USB_OTG_UID USB OTG DM USB VBUS Ht Speed USB_OTG_DP P DGND Power Power DGND VO SD1_DATO 50 1 501 CLK vo 501 Y Power DGND VO SD1_DAT2 SD card 1 SD1 CMD vo 501 DAT3 CSI D1 2 DGND Power IPU CSI CSI 03 cs _Do CSI D5 cs p2 Power 1 CSI 04 CSI_D7 06 CSI D9 P DGND Power cs _D112. 10 Module 4 9 lt lt A Module connector X1 Module connector X2 u eesscssecssecsssscssecssecsseccssecsseesuccsusecssecsueesuceesecsucssuceessecsuecsucesacecseeesueseaterssesseees Module connector ee TT eT TTT Module connector X1 Module connector X2 Module connector Electrical characteristics MEALS TACOS ss assessccacarccencssscssccacsscasscasscasszeasscusctasszessscusccasszecsscusstasscacss0asstasstassseusscssstasszeusseucticte System 5 PIOCOSSO Memory 4 00000 Pin multiplexing Page ii User s Manual TQMa35 UM 103 2013 by TQ Group Table of contents continued 4 3 2 4 3 2 1 4 3 2 2 4 3 2 3 4 3 2 4 4 3 3 4 3 4 4 3 5 4 3 6 4 3 7 4 3 7 1 4 3 7 2 4 3 8 4
3. 91010 oJ 010 EBO NC NC Bus CTRL Bus CTRL owe Reserve User s Manual TQMa35 103 2013 by TQ Group Page 15 4 1 3 Pin description The pins of the module connectors are described in detail in the following tables External and internal pull up or down wirings as well as the references to I O voltage and processor pin characteristics are listed in addition to direction pin name and pin number The processor pin in parentheses means there is no direct connection between processor and connector e g via level converter or that connector and processor are connected to the output simultaneously The entries in Table 8 to Table 10 for direction internal pull keeper slew rate and drive strength are values for the standard BSP of TQ Systems GmbH and can also be configured differently 16 User s Manual TQMa35 UM 103 2013 by TQ Group 4 1 3 1 Module connector X1 Table 8 Pin description X1 i MX35 Parameter Pinname Remark 5 3 Q gt U 1 VIN 2 3 4 5 6 7 8 9 _ See section 4 3 18 on page 48 10 DGND 11 DGND 12 DGND 13 5 V
4. User s Manual TQMa35 UM 103 2013 by TQ Group Page 33 4 3 1 2 Memory management Different types of memory which share the address bus are assembled on the TQMa35 On a carrier board additional devices can also be addressed The memory allocation of the 5 is shown in the following table Table 17 External Memory allocation Address range Chip select Function 0 000 0000 OxA7FF FFFF CSO NOR flash max 128 MiB 0000 OXAFFF FFFF 51 Module connector max 128 0x8000 0000 Ox8FFF FFFF CSDO mDDR SDRAM max 256 MiB 0x9000 0000 9 FFFF CSD1 mDDR SDRAM max 256 MiB 0xB400 0000 OxBSFF FFFF 54 Module connector max 32 MiB 0xB600 0000 OxB7FF FFFF CS5 Module connector X3 max 32 MiB 4 3 1 3 Pin multiplexing Depending on the configuration the pin multiplexing enables different pins to have different functions Many of the CPU pins can be used in several different ways Please notice the notes about the wiring of these pins in the Reference Manual of the i MX35 before integration start up of your carrier board Starterkit 4 3 14 CPU Errata Please pay attention to the current errata of the Freescale CPU Fixed configured as DTACK signal CS4 cannot be used 34 User s Manual TQMa35 UM 103 2013 by TQ Group 4 3 2 Memory 4321 mDDR SDRAM The m
5. 5 T1 Slow Nom 88 FEC_RXDO 5 2 100 Slow 5 Pull up only assembled when is assembled User s Manual TQMa35 UM 103 2013 by TQ Group Page 19 Table 8 Pin description X1 continued i MX35 Parameter Remark nternal pull 89 FEC RXD1 5 2 100kQ Slow 90 2 1 5 M3 100kO Slow Nom 91 DGND P 92 DGND P 93 FEC RXD3 5 1 100 Slow 94 5 R2 100kQ Slow 95 FEC_RX_ER 5 N3 100 Slow 96 DGND P 97 FEC RX DV 5 T2 100kQ Slow Nom 98 FEC MDIO 1 5 5 1 22 Slow 99 5 R1 Slow Nom 100 FEC_CRS 5 5 100 Slow Nom 101 DGND 102 FEC_COL 5 100 Slow 103 2 1 0 Vias J3 100kO Slow 104 2 RX 5 H4 100kO Slow Nom 105 1 TX 1 0 5 V4 100kQ Slow Nom 106 DGND 107 1_ 1 0 5 100 Slow 108 UART3_RTS 5 04 100 Slow 109 UART3 CTS W15 100 Slow 110 UART3_TXD 5 Y2 100kO Slow
6. 52 User s Manual TQMa35 UM 103 2013 by TQ Group 6 5 Requirements for the higher level system 6 5 1 Protection against external effects As an embedded module it is not protected against dust external impact and contact an adequate form of protection has to be guaranteed by the surrounding system 6 5 2 Thermal management Depending on the size of memory up to 3 3 W have to be dissipated to cool the TQMa35 The power dissipation originates primarily in the processor and in the mDDR SDRAM The user is responsible for the removal of this power dissipation in his application In most cases a passive cooling should be sufficient In a warm environment above approx 40 it can be necessary to install the TOMa35 on end module connectors vertical to enable a flow of air on both sides of the module for passive cooling The CPU belongs to a performance category with which in certain applications cooling can become necessary It is the task of the user to define a heat sink suitable for the specific case of operation e g by clock frequency stack height and airflow 6 5 3 Structural requirements 5 is held in the module socket by the retention force of the pins total of 240 resp 320 For high requirements with respect to vibration and shock firmness an additional plastic module holder has to be provided in the final product to hold the module in its position For this purpos
7. Input voltage High level Vin 0 7 x VIN VIN 0 4 V Input voltage Low level Vi 0 5 0 8 V 28 User s Manual TQMa35 103 2013 by TQ Group Table 12 Electrical characteristics of the physical signals Parameter Description Vuss Type of media USB 2 0 Hi Speed Host OTG Interface module USB Host resp OTG physical Signal characteristic Compatible to Universal Serial Bus specification Rev 2 0 ESD protection 2 kV Human Body Model Vns232 8 Transfer rate Up to 120 Kbit s Interface CPU UART1 Handshake None Signal characteristic Compatible to EIA TIA 232 standard ESD protection 15 kV Human Body Model 4 2 User s interfaces On the 5 a red LED indicates the reset condition Table 13 State of the Reset LED State LED Level POR Description ON Low Module is in Reset OFF High Normal operation 4 3 System components 4 3 1 Processor The Freescale processor i MX35 MCIMX35 based on the ARM1136JF S core is manufactured 90 nm technology It provides a wide range of functions Illustration 2 gives an overview The CPU is available in two revisions Tape Outs On the TQMa35 Rev 2 1 is used because the SDRAM interface in Rev 2 0 can cause errors Additional termination must be provided for some control signals of Rev 2 0 Depending on placement option one of the two pin compatible derivatives i MX353 and i
8. 5 J1 100kO Slow 40 GPIO3 4 y o Viwas Y13 0 1100 Nom 41 DGND P 42 GPIO3 5 y o Vimxs W12 1100 Nom 43 OWDAT y o T11 Keeper Slow 44 SPI2 SSO yo 5 K2 100kQ Slow High 45 5 1 550 1 0 5 Y8 100kO Slow Nom 46 DGND P 47 5 1 551 5 08 100kQ Slow 48 5 2 1 0 5 15 100 Slow 49 SPI1 553 1 0 5 V7 Slow Nom 50 SPI2 MISO 1 0 5 K4 100kQ Slow 51 DGND P 52 SPI2 MOSI 1 0 5 K1 100kO Slow 53 SPI1_CLK 1 0 5 W8 100kO Slow 54 SPI2 RDY Vimxss J6 100 Slow 55 SPI1 MISO 5 v9 100 Slow 56 DGND 57 SPI1 MOSI 1 0 5 w9 100 Slow 58 12C1_SCL 1 2 Vimxss 20 100 Slow 59 SPI1_RDY 5 8 100kQ Slow 60 12C1_SDA 1 2 5 N17 100 Slow 61 DGND 62 2 2 SCL 1 2 5 L3 100kQ Slow Nom 63 CAPIN1 5 V12 100kQ Slow Nom 64 12 2 SDA 1 2 5 1 100 Slow 65 TIM_CMPOUT1 5 T12 100 Slow 18 User s Manual TQMa35 103 2013 by TQ Group Table 8 Pin description X1 continued i MX35 Parameter Pin name 2 R
9. CSI 013 10 Power 1 CSI 012 CSI 015 014 CSI_VSYNC P Power CSI HSYNC IPU CSI CSI PIXCLK VO Power DGND O CPU JTAG TCK MOD CPU JTAG TMS P DGND Power TDO Power DGND 1 TRST CPIHITAG 14 4123 Module connector Table 7 16 bit data bus 16 bit data bus 26 bit address bus 26 bit address bus User s Manual TQMa35 UM 103 2013 by TQ Group Pin assignment module connector X3 D1 1 0 D3 1 0 D5 1 0 D7 D9 1 0 1 0 D11 1 0 D13 1 0 D15 D D 1 5 A7 D D A9 11 A13 A15 26 bit address bus 26 bit address bus D D A17 A19 A21 A23 D D A25 Bus CTRL DTACK Powe Bus CTRL Bus CTRL D D BUS CLK D D 51 55 1 0 DO 1 0 1 0 D2 1 0 D6 1 0 D8 lt 010 012 014 16 bit data bus 16 bit data bus 16 bit data bus AO A2 26 bit address bus 4 6 A8 A10 A12 A14 A16 A18 A20 A22 A24 26 bit address bus 26 bit address bus owe 26 bit address bus LBA RW ECB
10. 80 NC Not connected User s Manual TQMa35 UM 103 2013 by TQ Group Page 27 4 1 4 Electrical characteristics Table 11 Electrical characteristics of digital 1 05 Parameter Min Typ Unit Remark 5 Drive strength Output voltage High level Vou 0 8 x VIN V nominal high resp max Drive strength Output voltage Low level Vo 0 2 x VIN V nominal high resp max Output current High level lou 220 Nominal drive slew rate slow Von 0 8 x VIN mA High drive 8 0 drive Output current High level 28 slew rate fast 0 8 VIN oe 8 0 Max drive Output current Low level lo 20 Nominal drive slew rate slow 0 2 x VIN 0 High drive 8 0 Max drive Output current Low level lo jo Nominal drive slew rate fast Vor 0 2 x VIN 60 me High drive 8 0 Max drive Input voltage High level Vin 0 7 x VIN VIN V Input voltage Low level Vi 0 3 0 3 x VIN V Vaur Output voltage High level 24 VIN V lou 12 mA Output voltage Low level Vo 0 8 V lo 12 mA Output current High level lou 12 mA Output current Low level lo 12 mA Input voltage High level Viu 2 0 3 6 V Input voltage Low level Vi 0 8 V Input voltage High level 2 0 5 5 V Input voltage Low level Vi 0 8 V Vpon Output voltage Low level Vo 03 V open drain
11. sees 32 External Memory 33 Memory models mDDR SDRAM 34 Memory model NOR flash 2 34 Memory model flash 2 35 Memory model 36 Parameter 32 768 kHz crystal 37 Transfer modes SD 37 device RUE 44 Technical parameters module SUPPLY sessssecssecsessssecseecsecsseecssecseesucesatecseecseceseeeesseess 47 Trigger levels 53801 01 2 2 2 4 21 0 2 4 0 0 00400000400004204000000660 8 48 Technical parameters backup 48 Height 50 Further applicable COCUMENMS sssssssessssssessssssessssscssssscssessscsssssscssesssccssssscesssssceseesseesesase 55 Illustration directory Illustration 1 Illustration 2 Illustration 3 Illustration 4 Illustration 5 Illustration 6 Illustration 7 Illustration 8 Illustration 9 Illustration 10 Illustration 11 Illustration 12 Illustration 13 Illustration 14 Illustration 15 Illustration 16 Illustration 17 Illustration 18 Illustration 19 Illustration 2
12. CSI_D10 10 V16 Keeper Nom 101 DGND 102 CSI D12 10 Viwas 16 Keeper Fast Nom 103 CSI 015 Vimx3s Y16 Keeper Fast Nom 104 CSI_D14 10 Viwas 014 Keeper Fast Nom 105 CSI VSYNC 10 5 T14 Keeper Fast Nom 106 DGND 107 CSI HSYNC 10 5 V14 Keeper Fast Nom 108 CSI MCLK W15 Fast Nom 109 CSI_PIXCLK 5 Y15 Keeper Fast Nom 110 DE 1 0 5 19 100 Slow Nom 111 DGND 112 RTCK Vimx3s U18 100 Fast High 113 5 R17 100 Slow Nom 114 Vimxss 017 100 Slow Nom 115 5 10 Viwas R16 100 Slow Nom 116 e 117 TDI 10 5 P15 100 Slow Nom 118 TDO 10 Vimss R15 100 Fast High 119 DGND e 120 TRST 10 Viwas T16 100 Slow Nom 24 User s Manual TQMa35 103 2013 by TQ Group 4 1 3 3 Module connector X37 Table 10 Pin description i MX35 Parameter Pin name c 9 m m 8 Q gt UO 1 DGND P 2 DO 1 0 Viwas A2 Keeper Fast High 3 D1 yo Viwas D4
13. and Standby added Table 25 Reference 11 added Table 29 102 24 05 2012 Petz Section 5 Link to Wiki added 103 28 03 2013 Petz All Typo User s Manual TQMa35 UM 103 2013 by TQ Group Page 1 1 ABOUT THIS MANUAL 1 1 Copyright Copyright protected 2013 by TQ Systems GmbH This User s Manual may not be copied reproduced translated changed or distributed completely or partially in electronic machine readable or in any other form without the written consent of TQ Systems GmbH 1 2 safety Improper or incorrect handling of the product can substantially reduce its life span 1 3 Symbols and Typographic Conventions Table 1 Terms and conventions Symbol Visual Cue Meaning This symbol represents the handling of electrostatic sensitive modules and or components These components are often damaged destroyed by the transmission of a voltage higher than about 50 V A human body usually only experiences electrostatic discharges above approximately 3 000 V This symbol indicates the possible use of voltages higher than 24 V Please note the relevant statutory regulations in this regard Non compliance with these regulations can lead to serious damage to your health and cause damage destruction of the component This symbol indicates a possible source of danger Acting against the procedure described can lead to possible damage to your health and
14. or cause damage destruction of the material used This symbol represents important details or aspects for working with TQ products PP This specification is used to state the complete file name with its Command corresponding extension 2 User s Manual TQMa35 UM 103 2013 by TQ Group 14 Handling and ESD tips General handling of your TQ products The TQ product may only be used and serviced by certified personnel who have taken note of the information the safety regulations in this document and all related rules and regulations A general rule is do not touch the TQ product during operation This is especially important when switching on changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off Violation of this guideline may result in damage destruction of the module and be dangerous to your health Improper handling of your TQ product would render the guarantee invalid Proper ESD handling The electronic components of your TQ product are sensitive to electrostatic discharge ESD Always wear antistatic clothing use ESD safe tools packing materials etc and operate your TQ product in an ESD safe environment Especially when you switch modules on change jumper settings or connect other devices 1 5 Registered trademarks TQ Systems GmbH aims to adhere to the cop
15. 3 8 1 4 3 8 2 4 3 9 4 3 10 4 3 10 1 4 3 10 2 4 3 10 3 4 3 10 4 4 3 10 5 4 3 10 6 4 3 10 7 4 3 10 8 4 3 10 9 4 3 11 4 3 12 4 3 13 4 3 14 4 3 15 4 3 16 4 3 17 4 3 18 Graphics interfaces LCD SENS ONINtE ICE SESSE USB liS AE USB E o AEA A AAAA USB Host Ethernet Serial interfaces Power management Voltage 5 48 Backup 48 User s Manual TQMa35 UM 103 2013 by TQ Group Page iii Table of contents continued 6 1 6 2 6 3 6 4 6 5 6 5 1 6 5 2 6 5 3 7 1 7 2 7 3 74 7 5 7 6 7 6 1 7 6 2 7 6 3 8 1 SOFTWARE SPECIFICATION 49 MECHANICS SPECIFICATION 49 General information 49 Dimensions and stacks 5 49 Notesof treatment een 50 Component placement 51 Requirements for the higher level system Protection against external effects Thermal 222 Structural requirements SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS 2253 EMC requiremelts 53 50 53 Operational safety and personal security 53 Climatic and operational 5 53 Relia
16. Keeper Fast High 4 D2 1 0 5 B2 Keeper Fast High 5 D3 y o 5 E5 Keeper Fast High 6 DGND P 7 DS y o Viwss B1 Keeper Fast High 8 D4 1 0 Viwas Keeper Fast High 9 D7 1 0 Viwas C2 Keeper Fast High 10 06 y o 5 D3 Keeper Fast High 11 DGND P 12 D8 y o 5 C1 Keeper Fast High 13 09 1 0 Viwas E4 Keeper Fast High 14 D10 1 0 Vimxs D2 Keeper Fast High 15 D11 yo Keeper Fast High 16 DGND P 17 D13 y o 35 F5 Keeper Fast High 18 D12 y o Keeper Fast High 19 D15 y o Viwas E2 Keeper Fast High 20 D14 y o Viwss 01 Keeper Fast High 21 DGND P 22 ADDRO Veur A5 23 1 07 24 ADDR2 Veur E7 25 ADDR3 Veur C6 26 DGND 27 5 5 7 Depends on placement option User s Manual TQMa35 UM 103 2013 by TQ Group Page 25 Table 10 Pin description X3 continued i MX35 Parameter Pin name 5 E Remark 28 ADDR4 Veur D6 29 ADDR7 Veur A4 30 ADDR6 Veur C5 31 DGND 32 ADDR8 4 33 ADDR9 Vaur A3 34 ADDR10 Veur 15 35 ADDR11 Veur
17. MX357 is used The i MX357 contains an additional OpenVG 1 1 hardware acceleration for 2D vector and bit mapped graphics In the following table the i MX35 CPUs of Rev 2 1 are listed Depends on placement option UART1 used as RS232 User s Manual TQMa35 UM 103 2013 by TQ Group Page 29 Table 14 Processor derivatives Manufacturer Part number Temperature range Housing Silicon revision Freescale MCIMX353DJQ5C 20 to 85 C BGA400 2 1 Freescale MCIMX357DJQ5C 20 to 85 C BGA400 2 1 Freescale MCIMX353CJQ5C 40 to 85 C BGA400 2 1 Freescale MCIMX357CJO5C 40 to 85 C BGA400 2 1 i MX35 Multimedia Applications Processor External Memory A Not available on i MX353 Illustration 2 i MX35 block diagram Source Freescale 30 User s Manual TQMa35 103 2013 by TQ Group Key functionalities 1 136 CPU D Cache L2 Cache e Integrated SRAM Jazelle Java Acceleration VFP Vector Floating Point Co processor only i MX357 e CPU clock 532 MHz ESDRAMC enhanced synchronous dynamic RAM controller e SDRAM 16 32 bit m DDR 16 32 bit e DDR2 limited support WEIM Wireless External Interface Module e NORFlash e Flash PSRAM CellularRAM Multimedia e Image Processing Unit CMOS CCD Sensor Interface LCDController up to 24 bit per pixel WVGA Interfaces USB OTG High Sp
18. Nom 111 DGND 112 UART3_RXD 5 v3 100kQ Slow Nom 113 UART2_RTS 5 G1 100kO Slow 114 UART2_CTS 5 G5 Slow Nom 115 2 5 H2 Slow Nom 116 DGND 117 UART2_RXD 5 H3 100kO Slow Nom 118 RS232_TXD Vns232 R6 Optionally UART1_TxD 119 DGND 120 RS232_RXD Vni U2 Optionally UART1_RxD 5 depends on placement option if UART1 is used instead of RS232 then VCCIO Vi MX35 20 User s Manual TQMa35 103 2013 by TQ Group 4 1 3 2 Module connector X2 Table 9 Pin description X2 i MX35 Parameter i 8 T E 3 ale Zl gt E a 1 P 2 FLASH_RESET 18 3 NC Not connected 4 WP _ACC 10 5 NC Not connected 6 DGND P 7 VSTBY Vims T9 Slow Nom 8 WDOG RST 10 Viwas Y12 100 Slow Nom 9 PWM 11 Keeper Slow Nom 10 JTAG_RESET 10 910 11 DGND 12 RESET_IN 10 910 13 551 TXD y o Viwas 2 100 Slow Nom 14 POR 10 Veor 11 15 551 RXD Viwas L1 100 Slow Nom 16 DGND 17 551 y o Viwas 14 10
19. and licence expenses The drivers and utilities for the used components as well as the BIOS are subject to the copyrights of the respective manufacturers The licence conditions of the respective manufacturer are to be adhered to Bootloader licence expenses are paid by TQ and are included in the price Licence expenses for the operating system and applications are not taken into consideration and must be separately calculated declared 4 1 9 User s Manual TQMa35 UM 103 2013 by TQ Group Further applicable documents presumed knowledge Specifications and manual of the used modules These documents describe the service functionality and special characteristics of the used module incl BIOS Specifications of the used components The manufacturer s specifications of the used components for example Compact Flash cards are to be taken note of They contain if applicable additional information that must be taken note of for safe and reliable operation These documents are stored at TQ Chip errata It is the user s responsibility to make sure all errata published by the manufacturer of each component are taken note of The manufacturer s advice should be followed Software behaviour No warranty can be given nor responsibility taken for any unexpected software behaviour due to deficient components General expertise Expertise in electrical engineering computer engineering is required for the installa
20. is assembled by default Detailed information concerning the l C address configuration can be found in section 4 3 10 4 The write protection WP of the EEPROM is not available Table 21 Memory model EEPROM Manufacturer Part number ST Microelectronics M24C64 WDW6TP 4 3 3 WEIM bus 19 Depending on the assembly option the 16 bit wide external interface is available at the additional module connector X3 All 26 address signals as well as all usable control signals are routed via line drivers to raise the I O voltage from 1 8 V to Vin The chip selects CSO CS2 CS3 and CS4 are not available For more information see Table 17 on page 33 VIN x YYY VYVYY y Illustration 3 Interface WEIM bus The pull up resistor at ECB is only assembled on versions with NOR Flash 1 Depends on placement option User s Manual TQMa35 103 2013 by TQ Group Page 37 4 3 4 RTC On the TOMa35 RTC Dallas DS1339U 33 is available The connection of the RTC is shown in section 4 3 10 4 The output SQW INT of the RTC is available at the module connector as well as at the processor pin J2 as a placement option A 32 768 kHz crystal oscillator clocks the RTC The parameters of the crystal oscillator are shown in the following table Table 22 Parameter 32 768 kHz crystal oscillator Parameter Value Unit Remark 20 25
21. mm should be kept free on the carrier board along the longitudinal edges on both sides of the module for the extraction tool MOZI8XXL User s Manual TQMa35 UM 103 2013 by TQ Group 64 Component placement amp RET 6110 C144 R76 C142 0137 1 5 vii RTIBR74 0010 L1 C48 D2 20 C16 0155 R68 3 lt N R 2 8 01481126 12486122 R37 E 8 R 012 R101R104 Ri 8 8 8 5 084 MP17 MP3MP5 15 18 16 D1 0 D11 1022 9 059 039 cm 62 a Illustration 19 Component placement top X2 01080117 C46 R72 BE C72 0116 052 C118 105 C107 2 amp 2 8 844 845 R63R62 RETIRSO REORBI 85385203 33 RS4R55 5 5 R43 864865 R82 R59R58 57 a 3 8 R42 RE 2 RAG 67 66 C13 P10 154 69 R126 R92 R91R122 695 R88 R87R124 C111 R90 R89R125 439 0114 R70R120R129 12 D1 C91 R26 R71 N TP9 R109R27 R14 119 LISST m RI3R17 17 TP2 R33 0129 588 8 R12R2 8 R95 C7 66 821 65 Bom rh RIS C68 127 1 C26 C28 D3 RN2 811781122109 TP7S 8 ortgRagnra7 CZL RTP16 0122 Ras PBS 105 1040108 5 2018 682 0131 R35 C70 RI6R11 C54 R R 044 Illustration 20 Component placement bottom 51
22. of up to 1024 x 1024 pixels can be connected to the TQMa35 The parallel data interface can be up to 24 bits wide To connect an LCD the display 3 interface of the CPU is used The LCD bus is directly routed to the module connector LD 0 23 D3_FPSHIFT D3_HSYNC D3 VSYNC D3 DRDY CONTRAST Illustration 4 Interface LCD 4 3 7 2 Sensor interface Sensor data can be fed directly via the module connectors to the Camera Sensor Interface of the i MX35 see Illustration 5 CSI D 0 15 CSI HSYNC CSI VSYNC CSI PIXCLK CSI MCLK Illustration 5 Interface CSI User s Manual TQMa35 UM 103 2013 by TQ Group Page 39 4 3 8 USB Hi Speed 4 3 8 1 USB On The Go The CPU internal transceiver of the i MX35 is used for the USB On The Go interface The 5 V supply for the USB ports has to be implemented on the carrier board USBPHY 1_ USBPHY 1_DM USBPHY 1_ VBUS USBPHY 1_UID AA USB_OTG_OC USB_OTG_ PWR Illustration 6 Interface USB OTG Filtering and EMC protection for the USB signals has to be provided on the carrier board Notes are to be found in the USB standard For the use of the USB UTMI PHY a workaround is shown in the errata of the i MX35 see Illustration 7 This workaround is provided on the TOMa35 This ensures that at certain voltage levels the
23. shielding connected well to ground housing on both ends e Supply voltages Protection by suppressor diode s e Slowsignallines RC filtering perhaps Zener diode e Fast signal lines Integrated protective devices suppressor diode arrays 7 3 Operational safety and personal security Due to the occurring voltages lt 3 3 V DC tests with respect to the operational and personal safety have not been carried out 7 4 Climatic and operational conditions Permitted component temperature 0 C to 70 C Commercial 30 C to 85 C Standard Module with eMMC 25 C to 85 C 40 C to 85 C on request Permitted storage temperature 40 C to 100 C Relative air humidity operation storing 10 to 90 not condensing Protection class IPOO Depends on placement option 54 User s Manual TQMa35 103 2013 by TQ Group 7 5 Reliability and service life No detailed MTBF calculation has been done for the TQMa35 It was designed to be insensitive to vibration and impact Middle grade connectors which guarantee at least 100 mating cycles were used for the module 7 6 Environment protection 7 6 1 RoHS compliance The TOMa35 is manufactured RoHS compliant e Allused components and assemblies are RoHS compliant RoHS compliant soldering processes are used 7 6 2 WEEE regulation The company placing the product on the market is responsible for the observance of the WEEE regulation To b
24. to the European Waste Directory as at 1 12 01 source of information BGBI 2001 3379 This information is to be seen as notes Tests or certifications regarding this were not carried out User s Manual TQMa35 UM 103 2013 by TQ Group 55 8 APPENDIX 8 1 References Table 29 Further applicable documents No Name Date Company 1 i MX35 MCIMX Reference Manual IMX35RM 3 2009 Rev 2 Freescale 2 i MX35 Data Sheet MCIMX35SR2CEC 4 2010 Rev 8 Freescale 3 Errata to i MX35 Reference Manual Rev 2 IMX35RMAD 5 2010 Rev 2 4 Freescale 4 Chip Errata for the 1 5 IMX35CE 7 2010 Rev 2 Freescale 5 Numonyx Axcell M29EW Data sheet 5 2010 Numonyx 6 SN74AVCH16T245 Data sheet SCES587B 4 2005 Texas Instruments 7 DS1339 Data sheet Rev 100108 Maxim 8 STM6905 Data sheet 1 2008 Rev 3 ST Microelectronics 9 TPS3801 xx Data sheet SLVS219C 7 2003 Texas Instruments 10 LM26480 Data sheet 12 2008 National 11 TQMa35 Powermodes 100 pdf Technote 10 06 2011 TQ Systems TQ Systems GmbH MuhlstraBe 2 Gut Delling 82229 Seefeld info tq group com www tq group com Technology in Quality
25. y o Vus N19 Nom 74 USB VBUS I O Vus P18 75 USB_OTG_DP y o Vus P19 76 DGND P 77 DGND P 78 SD1_DATO y o Viwas RIA 47 Fast High 79 501 V18 47 Fast High 80 SD1_DAT1 y o Viwas U16 47 Fast High 81 DGND P 82 SD1 DAT2 y o W18 47 Fast High 83 SD1 CMD y o Viwas 19 47 Fast High 84 SD1_DAT3 y o Viwas V17 100 Fast High 85 CSI D1 Vimx3s Slow Nom 86 DGND P 87 CSI D3 5 5 Slow Nom 88 CSI_DO Viwas 01 100 Slow Nom 89 CSI D5 35 4 Slow Nom 90 CSI_D2 5 V2 100kQ Slow Nom 91 DGND 92 CSI_D4 Viwas 100 Slow Nom 93 CSI 07 5 5 Slow Nom 94 CSI_D6 5 V1 Slow Nom User s Manual TQMa35 UM 103 2013 by TQ Group Page 23 Table 9 Pin description X2 continued i MX35 Parameter FE E 45 95 CSI D9 10 5 17 Keeper Fast 96 DGND 97 CSI_D11 10 T15 Keeper Fast Nom 98 CSI D8 10 Viwas U15 Keeper Fast Nom 99 CSI_D13 1 10 V15 Keeper Fast Nom 100
26. 0 Slow Nom 18 LDO Vimx3s F20 100 Fast 19 SSI_TXFS Viwas L2 100 Slow Nom 20 LD1 5 618 100 Fast 21 DGND P 22 LD2 Vimx3s G17 100 Fast 23 LD3 G16 100 Fast 24 LD4 5 G19 100 Fast 25 LDS Viwas H16 100 Fast 26 DGND 27 LD7 620 100 Fast 28 LD6 18 100 Fast 29 LD9 Vimx3s H19 100 Fast 30 LD8 Vimx3s H17 100 Fast Nom 31 DGND P User s Manual TQMa35 UM 103 2013 by TQ Group Page 21 Table 9 Pin description X2 continued i MX35 Parameter FE 35 Remark Ee 32 1010 Vimx3s H20 100 Fast 33 1011 Viwas 218 100 Fast Nom 34 LD12 5 J16 100 Fast 35 LD13 5 J19 100 Fast 36 DGND 37 LD15 Vimx3s 220 100 Fast Nom 38 LD14 5 J17 100 Fast Nom 39 LD17 5 K19 100kQ Fast 40 LD16 Vimx3s K14 100 Fast Nom 41 DGND P 42 LD18 5 K18 100 Fast Nom 4
27. 0 User s Manual TQMa35 UM 103 2013 by TQ Group Page v TOMas5 block diagram zes 8 1 35 block diagtam 29 MSHA OW EMMIS 36 Interface 38 Interface ER 38 Interface USB 39 USB Hi Speed OTG workaround 2 39 Interface USB host 2 40 Interface Ethernet Interface UART1 5232 Interface UART2 2 43 Iiterface UARTS 43 Interface 44 Interface AE 45 Timing diagram of a GPIO wakeup interrupt sese 46 gt amm RR 47 Overall dimensions top view through 49 Stacks heights not to scale 49 Component placement top 51 Component placement bottom 51 User s Manual TQMa35 103 2013 by TQ Group 9 Revision history Date Name Pos Modification 100 30 03 2011 Petz Document created 2 All Power consumption corrected 4 3 10 2 USB signal names corrected 4 3 10 3 Syntax of signals RTS and CTS corrected Syntax of signals RTS and CTS corrected 101 06 12 2011 Petz Information about gold plating corrected Table 4 Values for current consumption updated 4 3 16 Values for current consumption updated Table 25 values for current consumption Idle
28. 1 eee 80 0 76 um Gold 7mm tyco 3 5177986 3 80 0 2 um Gold 8mm tyco 6123001 3 80 0 76 um Gold 8mm 4 1 2 Pin assignment When using the processor signals the multiple pin configurations by different processor internal function units must be taken note of The pins assignment listed in sections 4 1 2 1 to 4 1 2 3 refer to the corresponding standard BSP of TQ Systems GmbH User s Manual TQMa35 103 2013 by TQ Group 4 1 2 1 Table 5 Pin assignment module connector X1 Group 1 0 Power P Power VCC3V3 Power Power DGND General clock Power DGND GPIO1 4 HO GPIO1 5 Power DGND GPIO2 7 GPIO2 18 1 0 SPIO GPIO2_23 GPIO2_25 Power DGND ROWO ROW1 1 0 4x4 keypad ROW2 ROW3 Power DGND 1 Wire OWDAT 5 1 550 1 0 SPI 1 5 1 551 1 0 5 1 553 Power DGND SPI1_CLK SPI1_MISO se 5 1 MOSI SPI1_RDY Timer TIM_CAPIN1 TIM_CMPOUT1 503 1 0 SD card 3 503 Power DGND SD3_DAT4 503 5 1 0 SP cinis SD3 DAT6 vo SD3_DAT7 Vo FEC TXD3 Ethernet FEC EN FEC_RXD1 1 Power DGND FEC_RXD3 1 FEC_RX_ER 1 Ethernet FEC_RX_DV Power DGND 2 2_ 1 CANT CAN1_RX 1 UART 3 UART3_CTS Power DGND UART2_RTS 1 UART2 UART2_TXD U
29. 10 Fast Max 14 DGND P 15 DGND 16 DGND 17 GPIO1 4 5 K3 100kQ Slow Nom 18 DGND 19 GPIO1_5 1 0 5 5 100 Slow 20 GPIO1 12 1 0 5 12 100kQ Slow Optional interrupt signal of RTC 21 DGND P Optional overtemperature 22 GPIO1 22 1 0 Vi mx35 G3 Fast Nom signal of temperature sensor 23 GPIO2 7 5 7 Slow Nom 24 2 0 5 011 Keeper Slow Nom 25 2 18 1 0 Vi mx35 W4 100kQ Slow 26 DGND P 27 GPIO2 23 y o 5 100 Fast 28 COLO 1 0 Vi mx35 H5 100kO Slow 29 2 25 1 0 5 U3 100kO Slow Nom 30 5 1 100kQ Slow 31 User s Manual TQMa35 UM 103 2013 by TQ Group Page 17 Table 8 Pin description X1 continued i MX35 Parameter Remark Direction Internal pull 32 COL2 1 0 5 G4 100kQ Slow 33 ROWO 1 0 5 W1 100kO Slow 34 COL3 5 15 100 High 35 ROW1 1 0 5 4 100 Slow 36 DGND P 37 ROW2 1 0 5 24 100 Slow 38 3 yo 5 W13 1100 Nom 39 ROW3 1 0
30. 19 Memory model NOR flash Manufacturer 32 MiB 128 MiB Numonyx PC28F256M29EWL PC28F512M29EWL PC28FOOAM29EWL In the version with WEIM bus all signals of the NOR flash except BYTE are additionally available directly at the module connector User s Manual TQMa35 UM 103 2013 by TQ Group Page 35 4 3 2 3 eMMC Depending on the version of the TOMa35 an eMMC Flash is assembled It is controlled by one of the SD card controllers of the i MX35 The processor has an SD host interface according to specification 4 2 To be able to use the interface with not equipped eMMC flash the signals are additionally routed to the module connector via short branch lines Table 20 Memory model eMMC flash 2 GiB Manufacturer Part number MMCA Rev Temperature Toshiba THGBM1G4D1EBAI7DTH 43 25 C to 85 C The SD3 bus is available on the module connectors It may however only be used if the eMMC flash is not equipped Only Micron offers eMMC memory for the temperature range of 40 to 85 C When using the Toshiba memory the temperature range of the module is limited to 25 to 85 C 36 User s Manual TQMa35 103 2013 by TQ Group 4 3 2 4 EEPROM Depending on the assembly option a serial 64 Kibit EEPROM is available for permanent storage of e g module characteristics or customers parameters The EEPROM is controlled via bus 2 of the processor An EEPROM with a size of 64 Kibit
31. 3 LD19 K20 100 Fast 4411020 5 K16 100 Fast Nom 45 LD21 Vimx3s 17 100 Fast 46 DGND 47 1023 5 119 100 Fast 48 LD22 Viwas K15 100 Fast 49 LD_DRDY 5 120 Fast Nom 50 LD_SPL 5 M18 Fast Nom 51 DGND P 52 LD REV 5 M17 Fast Nom 53 LD_HSYNC 5 118 Fast Nom 54 LD_CLS Viwas 117 Fast Nom 55 LD_VSYNC 5 M19 Fast Nom 56 DGND P 57 DGND P 58 LD_CONTRAST 0 Vimx3s L16 Fast Nom 59 LD_CLK Viwas 115 Fast Nom 60 USBHS_OC E 61 DGND P 62 USBHS_PSW 100 22 User s Manual TQMa35 103 2013 by TQ Group Table 9 Pin description X2 continued i MX35 Parameter pull Pin name 5 5 E E 5 Remark 44 B ES 63 USBHS_UID 00 Configured as Host 64 USBHS_VBUS 100kQ 65 DGND 66 DGND 67 USBHS_UDP y o 68 USB_OTG_OC 07 100 Slow Nom 69 USBHS_UDM 70 USB_OTG_PWR Vus W7 Slow Nom 71 DGND P 72 USB OTG UID Vus N18 Nom 73 USB OTG DM
32. ART2_RXD 1 Power DGND vo Signal VCC3V3 Group Power Power Power v Power Power Power Power Power 1 0 GPIO Power eo 4x4 keypad Power GPIO3 3 GPIO3 4 GPIO GPIO3 5 SPI2 SSO SPI2 DGND Power 5 2 1 0 5 2 5 SPI2_MOSI SPI2_RDY Power I2C1 SCL 2 1 0 12C1_SDA 12C2_SCL 2 I2C2 SDA ier SD3 DATO 1 0 SD3_DAT1 vo SD3_DAT2 3D cada SD3 DAT3 2 FEC_TXDO 5 FEC TX Ethernet 1 DGND Power EC RXD2 Ethernet MII DGND Power 1 Ethernet DGND Power FEC_MDIO 1 FEC_CRS Ethernet 1 FEC_COL 1 2_ 2 DGND Power 1 UART3_RTS UART3_TXD UART 3 1 UART3_RXD UART2_CTS UART 2 DGND Power RS232_TXD 1 RS232_RXD User s Manual TQMa35 UM 103 2013 by TQ Group Page 13 4 1 2 2 Module connector X2 Pin assignment module connector X2 Group Signal 1 0 Signal Group
33. D5 36 DGND e 37 ADDR13 Veur B3 38 ADDR12 Veur F6 39 ADDR15 Veur 015 40 ADDR14 Veur D14 41 DGND 42 ADDR16 Veur 13 43 ADDR17 Veur 13 44 ADDR18 012 45 ADDR19 D11 46 DGND 47 ADDR21 Veur 010 48 ADDR20 Veur C10 49 ADDR23 Veur C7 50 ADDR22 09 51 DGND 52 ADDR24 Veur D8 53 ADDR25 8 54 LBA Veur 020 55 DTACK Veur E18 56 DGND 57 DGND 58 RW Veur C20 26 User s Manual TQMa35 UM 103 2013 by TQ Group Table 10 Pin description X3 continued i MX35 Parameter Pin name El Remark E E 5 a 59 BUS Veur E15 60 OE Veur E20 61 DGND 62 10 Veur 1 019 63 1 Veur F16 64 EBO Veur 18 65 CSI Veur 19 66 DGND 67 55 Veur 19 68 DNC Do not connect 69 DNC Do not connect 70 DNC 71 DGND 72 DNC Do not connect 73 DNC Do not connect 74 DNC Do not connect 75 DNC Do not connect 76 DGND 77 DNC Do not connect 78 NC Not connected 79 DGND P
34. NC BT USB SRC 1 selection R51 R50 114 CSI VSYNC BT BUS WIDTH NAND R44 R45 bus width 32 User s Manual TQMa35 103 2013 by TQ Group As shown in Table 16 different modes can be configured on the TQMa35 Pre configured standard boot mode is NOR flash WEIM bus To boot from e g an SD card or eMMC flash the configuration of the resistors on the module has to be changed Table 16 shows the configurations possible on the TQMa35 Should the module be booted from the SD3 interface instead of the SD1 interface the eFuse BT_SDMMC_SRC 1 must be burnt Therefore Fuse_VDD must be connected to 3 3 V during the writing process Table 16 Possible boot mode configurations for the TQMa35 Boot pins o o 9 Bootmode gt gt gt Ta Se SMS gt S Ss E z n n V2 V2 n 0 0 0 0 0 0 x x 0 Internal Boot mode NOR flash 0 0 1 1 0 0 x x x Internal Boot mode SD 1 0 0 1 1 0 1 x Internal Boot mode serial ROM 1 Internal Boot mode serial ROM via SPI1 2 byte address Internal Boot mode serial ROM via SPI1 3 byte address External direct Boot mode NOR flash default 1 1 x x x x x x X Serial boot loader UART1 1 1 x x x x 0 0 X Serial boot loader UTMI PHY 1 1 x x x x 1 0 X Serial boot loader ULPI PHY
35. Q Group Table 2 Acronyms continued Acronym Multimedia Card MMCA MultiMediaCard Association Module extractor Modulzieher MSB Most Significant Bit MTBF Mean operating Time Between Failures NAND Not and NC Not Connected NOR Not or OTG On The Go PATA Parallel ATA PCB Printed Circuit Board PHY Physical Interface Ppm Parts Per Million PSRAM CellularRAM PWM Pulse Width Modulation RAM Random Access Memory RF Radio Frequency RoHS Restriction of the use of certain Hazardous Substances ROM Read Only Memory RTC Real Time Clock SD Secure Digital SDIO Secure Digital Input Output SDRAM Synchronous Dynamic Random Access Memory SMD Surface Mounted Device SPI Serial Peripheral Interface SRAM Static Random Access Memory SSI Synchronous Serial Interface UART Universal Asynchronous Receiver Transmitter UL Underwriters Laboratories Inc ULPI UTMI Low Pin Interface USB Universal Serial Bus USB HS Universal Serial Bus High Speed UTMI USB 2 0 Transceiver Macrocell Interface WEEE Waste Electrical and Electronic Equipment WEIM Wireless External Interface Module WP Write Protection WVGA Wide Video Graphics Array 800 x 480 User s Manual TQMa35 UM 103 2013 by TQ Group Page 7 2 BRIEF DESCRIPTION The TOMa35 is a universal Minimodule with a Freescale A
36. RM CPU MCIMX35 i MX35 The ARM1136 core works with up to 532 MHz The module extends the TQC product range and offers a well balanced ratio between computing performance and graphics power The module offers the following key functions and characteristics e Freescale 353 ARM11 architecture 532 MHz e Integrated hardware acceleration for IPU and GPU e All functional CPU pins are routed to module connectors e Upto 128 MiB NOR Flash e Up to 512 mDDR SDRAM e eMMC flash option e 1x USB 2 0 Hi Speed Host interface e 1x USB 2 0 Hi Speed Temperature sensor e RTC e EEPROM RS232 Transceiver on board e Single power supply 3 3 V Low power consumption typical 1 1 5 W e Dimensions 54 x 44 mm and cost efficient carrier board development e Longterm available Since almost all functional pins of the processor except SDRAM interface are routed to the module connectors there is a wide range of possible applications for the TOMa35 8 User s Manual TQMa35 UM 103 2013 by TQ Group 3 TECHNICAL DATA 3 1 System architecture and functionality 3 14 TOMa35 block diagram USB CONFIG SD1 LCD Sensor IPU 5514 JTAG PWM 1 Wire Timer GPIOs ETH MII SPI 142 CAN 1 2 1201 UART2 3 4x4 iS Flash gt max 4 GiB THGBM1 G4D1EBAI7 Illustration 1 TQMa35 block diagr
37. TQMa35 UM 103 28 03 2013 E dich A PT ure User s Manual TQMa35 UM 103 2013 by TQ Group Pagei Table of contents 1 1 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 1 10 3 1 3 1 1 3 1 2 3 1 2 1 3 1 2 2 3 1 2 3 4 1 4 1 1 4 1 2 4 1 2 1 4 1 2 2 4 1 2 3 4 1 3 4 1 3 1 4 1 3 2 4 1 3 3 4 1 4 4 2 4 3 4 3 1 4 3 1 1 4 3 1 2 4 3 1 3 4 3 1 4 ABOUT THIS MANUAL TESES 1 eE ud MM 1 INOS OM Safety ES 1 Symbols and Typographic 1 Handling and ana 2 Registered 2 Imprint 1 Further applicable documents presumed knowledge Acronyms and definitions sse BRIEF DESCRIPTION nee na 7 TECHNICAEDATA 8 System architecture and 8 TOMa35 block diagram 8 Systemif nctionality aaa deeded a mu 9 System COMPONENTS 9 Interfaces 29 Diagnosis LED 49 ELECTRONICS SPECIFICATION 2 10 Interfaces to other systems and
38. UART 2 RXD UART 2_RTS Illustration 11 Interface UART2 4 3 10 3 UART3 The UART3 interface is available directly at the module connector Beside RxD and TxD the handshake signals RTS and CTS are also provided UART 3_RTS UART 3_CTS Illustration 12 Interface UART3 Page 43 44 10 User s Manual TQMa35 UM 103 2013 by TQ Group 4 3 104 lC bus The bus 1 is routed to the module connectors and not used on the TQMa35 Three devices are connected to bus 2 on the module Temperature sensor EEPROM e The following table shows the associated address ranges Table 24 device configuration Device address Device Binary Temperature sensor 0x48 1 0 0 1 0 A2 O A1 EEPROM 0x50 1 0 1 0 0 2 O A1 0 0 0x68 1 1 0 1 0 0 0 VIN A a 12C2_SDA 1 2k 1 2k 1 2k 1 2k gt gt 12C2_SCL 12C1_SDA 12C1_SCL Illustration 13 Interface buses All pull up resistors for the busses are already assembled on the module and must therefore not be equipped on the carrier board If more devices are connected the bus load has to be estimated If necessary the overall resistance has to be reduced by additional parallel resi
39. am 2 1 2 3 1 2 1 3 1 2 2 User s Manual TQMa35 UM 103 2013 by TQ Group Page 9 System functionality System components Processor Freescale MCIMX35 ARM1136JF S 532 MHz IPU and GPU Crystal oscillators for the CPU 24 MHz and 24 576 MHz mDDR SDRAM 32 Bit 133 MHz up to 2 devices parallel with 256 MiB each NOR flash 16 Bit up to 128 MiB eMMC flash up to 4 503 interface at X1 not usable EEPROM up to 64 Kibit Temperature sensor via Separate RTC battery buffering possible Crystal oscillator for RTC 32 768 kHz RS232 driver at UART1 RxD and TxD USB ULPI PHY Hi Speed Level converter 3 3 V VCCI O for all signals at the module connectors Power Management Power Up sequencing voltage supervision Boot mode configuration Reset Interfaces 2 x 120 pin module connector 1 x 80 pin module connector A detailed overview of all available user interfaces can be found in section 4 1 on page 10 3 1 23 Diagnosis LED Indication of reset condition 1 Size of mDDR SDRAM depends on placement option 2 Size of NOR Flash depends on placement option 3 Depends placement option 10 User s Manual TQMa35 103 2013 by TQ Group 9 4 ELECTRONICS SPECIFICATION 4 1 Interfaces to other systems and devices TOMa35 is connected to the carrier board with 240 pins on two module connectors optionally with 320 pins on three conn
40. bility andi Service If 54 Environment protectiOn 54 RoHS compliance 2 54 WEEE regulation E Other entries 54 55 55 User s Manual TQMa35 103 2013 by TQ Group Table directory Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Table 11 Table 12 Table 13 Table 14 Table 15 Table 16 Table 17 Table 18 Table 19 Table 20 Table 21 Table 22 Table 23 Table 24 Table 25 Table 26 Table 27 Table 28 Table 29 Terms and 1 eraut 5 Module connectors used the 35 10 Suitable carrier board mating connectors eerte 11 Pin assignment module connector 12 Pin assignment module 2 13 Pin assignment module connector 14 Pin description X1 16 Pin description X2 2 20 Pin description 2 24 Electrical characteristics of digital I Os 2 27 Electrical characteristics of the physical signals sees 28 28 Processor derivatives essent 29 Configurable boot pins on the 35 31 Possible boot mode configurations for the TOMa35
41. can be fed via the pin of the module connector 1 kQ resistor is switched in series between backup input of the RTC and the module connector to limit the current To meet UL requirements a diode in series is not necessary In connection with a lithium battery the used RTC is UL listed The voltage VBAT supplies no other components except the RTC Table 27 Technical parameters backup input Parameter Max Unit Remark Supply voltage 2 97 3 30 5 50 V Trigger level Vin 2 70 2 85 2 97 V Concerns Vcc of the RTC Vear Input current SQW INT activated 400 700 nA Oscillator active SQW INT deactivated 600 1000 nA leakage current 25 100 nA Sample calculation of battery service life If a battery with a capacity of 220 mAh is used and one counts on a usable capacity of it results in the following worst case bridging period fmin 45 85 _ gt 16 This shows that the bridging period will exceed the service life of the battery Furthermore the backup supply is only activated when required User s Manual TQMa35 UM 103 2013 by TQ Group Page 49 5 SOFTWARE SPECIFICATION TOMa35 is supplied with a boot loader and a BSP for the Starterkit STK MBa35 More information can be found in the Support Wiki for the TQMa35 6 MECHANICS SPECIFICATION 6 1 General information Dimensions W x D 54x 44 mm Mounting
42. e BDM JTAG The TQMa35 works with a supply voltage of 3 3 4 that must be provided by the carrier board In the following table the data of the supply voltage is shown The calculated current consumption worst case is at most 0 8 A In average the current consumption will be approximately 0 2 to 0 4 A The current consumption strongly depends on component placement software and wiring options Table 25 Technical parameters module supply Parameter Min Typ Max Unit Remark Vin is limited by the electrical parameters of the Supply voltage vi 247 a2 e i MX35 analog voltage of the USB PHY1 Current consumption 0 28 0 8 Value depends i e on the size of memory Current consumption Idle Mode 0 14 For more information see 11 Consumption 20 For more information see 11 Standby 48 User s Manual TQMa35 103 2013 by TQ Group 4 3 17 Voltage supervision The switching regulators work down to a voltage of 2 8 V A supervisor is used which monitors the module voltage Vin to avoid that 3 3 V drops too far and some components work beyond their operation ranges while all the other voltages are still correct Table 26 Trigger levels TPS3801 01 Parameter Min Max Unit Remark Trigger level falling 2 909 3 005 3 105 V 40 to 85 C Hysteresis 15 mV 4 3 18 Backup supply An additional battery buffering for the RTC
43. e TQ Systems offers a standard solution As no heavy and big components are used no further requirements are given User s Manual TQMa35 UM 103 2013 by TQ Group Page 53 7 SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS 7 1 EMC requirements The module was developed according to the requirements of electromagnetic compatibility EMC Depending on the target system anti interference measures may still be necessary to guarantee the adherence to the limits for the overall system Following measures are recommended e Robust ground planes adequate ground planes on the printed circuit board e Asufficient number of blocking capacitors in all supply voltages Fast or permanent clocked lines e g clock should be kept short avoid interference of other signals by distance and or shielding besides notice not only the frequency but also the signal rise times Filtering of all signals which can be connected externally also slow signals and DC can radiate RF indirectly 7 2 ESD requirements In order to avoid interspersion on the signal path from the input to the protection circuit in the system the protection against electrostatic discharge should be arranged directly at the inputs of a system As these measures always have to be implemented on the carrier board no special preventive measures were planned on the TOMa35 Following measures are recommended for a carrier board Generally applicable Shielding of the inputs
44. e able to reuse the product it is produced in such a way a modular construction that it can be easily repaired and disassembled 7 6 3 Other entries By environmentally friendly processes production equipment and products we contribute to the protection of our environment To be able to reuse the product it is produced in such a way a modular construction that it can be easily repaired and disassembled The energy consumption of this subassembly is minimised by suitable measures Printed pc boards are delivered in reusable packaging Modules and devices are delivered in an outer packaging of paper cardboard or other recyclable material Due to the fact that at present there is still no technical equivalent alternative for printed circuit boards with bromine containing flame protection FR 4 material such printed circuit boards are still used No use of PCB containing capacitors and transformers polychlorinated biphenyls These points are an essential part of the following laws law to encourage the circular flow economy and assurance of the environmentally acceptable removal of waste as at 27 9 94 source of information BGBI 1994 2705 e Regulation with respect to the utilization and proof of removal as at 1 9 96 source of information BGBI 1996 1382 1997 2860 e Regulation with respect to the avoidance and utilization of packaging waste as at 21 8 98 source of information BGBI 1998 2379 e Regulation with respect
45. ectors The module is held in the connectors with a considerable retention force To avoid damaging the modules connectors as well as the carrier board connectors while removing the module the use of an extraction tool is strongly recommended For more information see section 6 3 on page 50 4 1 1 Module connectors Table 3 Module connectors used the TOMa35 Manufacturer Part No Description 120 pin connector 0 8mm pitch tyco 5353999 5 vertical 40 10 85 80 pin connector 0 8 pitch tyco 5177985 3 vertical 40 Cto 85 C The following table shows suitable mating connectors for the carrier board Depends on placement option User s Manual TQMa35 UM 103 2013 by TQ Group Page 11 Table 4 Suitable carrier board mating connectors Board to board distance Manufacturer Part No of pins Plating see Illustration 18 tyco 5177986 5 120 0 2 um Gold 5mm tyco 5 5177986 5 120 0 76 um Gold 5mm tyco 1 5177986 5 120 0 2 um Gold 6 mm tyco 6 5177986 5 120 0 76 um Gold 6 mm tyco 2 5177986 5 120 0 2 um Gold 7mm tyco 120 0 76 um Gold 7mm tyco 3 5177986 5 120 0 2 um Gold 8mm tyco 6123001 5 120 0 76 um Gold 8mm tyco 5177986 3 80 0 2 um Gold 5mm tyco 5 5177986 3 80 0 76 um Gold 5mm tyco 1 5177986 3 80 0 2 um Gold 6mm tyco 6 5177986 3 80 0 76 um Gold 6mm tyco 2 5177986 3 80 0 2 um Gold 7mm
46. eed host and device PATA CE ATA 2 x modules e Configurable SPI x 2 SSI I2S x 2 UART x 3 MMC SDIO x 3 Package Temperature range 40 C to 85 C BGA 400 0 8 mm grid Temperature range 20 C to 70 C BGA 400 0 8 mm grid Further functionality of the processor shown in the block diagram can be looked up in the Reference Manual All essential pins of the processor except the DDR SDRAM interface are routed to the module connectors User s Manual TQMa35 UM 103 2013 by TQ Group Page 31 4 3 1 1 Boot modes The boot mode of the i MX35 is configured by default in a boot sequence after the reset by reading the voltage levels of the dedicated boot mode pins The following table shows the relevant pins as well as the assignment of the matching resistors for the TQMa35 Table 15 Configurable boot pins on the TQMa35 Configuration resistors eFuse name Function Pull up Pull down W10 BOOT MODEO Boot mode R47 R49 U9 BOOT_MODE1 select pins R46 R48 U15 CSI_D8 BT_MEM_CTL 0 Boot R53 R52 memory W17 CSI_D9 BT MEM CTL 1 device R54 R55 V16 CSI 010 BT MEM TYPE 0 Boot R59 R58 memory T15 CSI 011 BT MEM type R56 R57 yp W16 CSI D12 BT PAGE SIZE O NAND Flash R67 R66 V15 CSI D13 BT PAGE Page size R64 R65 Define U14 CSI 014 BT ECC SEL A 8 bit ECC R63 R62 Y16 CSI D15 BT USB SRC O USB PHY R60 R61 V14 CSI HSY
47. emark 75 e 9 8 U S 5 66 DGND 67 5 3 10kO5 vimas Y4 100k0 Slow POnotconnect when eMMC is assembled Do not connect when 5 68 SD3 DATO 10kQ Vimss Y6 Slow INE eMMC is assembled Do not connect when 69 SD3 CLK U5 100 Slow is assembled Do not connect when 5 70 503 1 10 5 W6 Slow Nom eMMC is assembled 71 DGND 72 SD3_DAT2 10 10kQ5 6 Slow Nom DO Not connect when eMMC is assembled Do not connect when eMMC is assembled Do not connect when eMMC is assembled Do not connect when eMMC is assembled 73 SD3 DAT4 10kO 5 06 100kQ Slow 74 503 DAT3 VO 10kQ Viuxss T6 Slow Nom 75 503 DAT5 10kQ 5 100 Slow 76 DGND P Do not connect when 5 y 77 SD3 DAT6 Vimxss W5 100kQ Slow eMMC is assembled 78 FEC TXDO 5 5 Slow Nom Do not connect when 5 y 79 SD3 DAT7 10 Vimxss 5 100 Slow Nom eMMC is assembled 80 FEC_TXD1 Vi mx35 M4 Slow Nom 81 DGND 82 2 5 5 Slow Nom 83 FEC TXD3 5 16 Slow Nom 84 FEC 5 4 100 Slow 85 FEC 5 Slow Nom 86 DGND 87 FEC TX EN
48. et interface is completed by a PHY on the carrier board VIN A 15 FEC_RDATA 0 3 FEC_RX_ERR FEC_RX_CLK FEC_RX_DV FEC_TDATA O 3 FEC_TX_ERR FEC_TX_CLK FEC_TX_EN FEC_CRS FEC_COL FEC_MDC FEC_MDIO Illustration 9 Interface Ethernet 42 User s Manual TQMa35 103 2013 by TQ Group 4 3 10 Serial interfaces TOMa35 provides three UART interfaces 4 3 10 1 UARTI 5232 To provide a communication without external hardware especially during the start up the voltage levels on the module are adapted by a transceiver If the RS232 interface is not used the signals UART1_TxD and UART1_RxD can also be routed to the module connectors as LVTTL signals Therefore two 0 resistors are provided in the layout under the RS232 driver These resistors can be assembled instead of the driver The handshake signals RTS and CTS for the UARTI are not available as they are used by other multiplexed signals VIN 10k UART1_TXD UART1_RXD 4 Illustration 10 Interface UART1 RS232 User s Manual TQMa35 UM 103 2013 by TQ Group 4 3 10 2 UART2 UART2 interface is available directly at the module connector Beside RxD and TxD the handshake signals RTS and CTS are also provided UART2 TXD
49. holes None Maximum stack height See Illustration 18 Component placement Double sided SMD component placement Connection with the carrier board SMD connector pitch 0 8 mm Board to board distance Selectable by different mating plugs standard 5 0 mm 6 2 Dimensions and stacks heights i 11 i 2 2 120 1 Y 1 1 II 2 80 9 ilo e d 119 Y 7 Innnnnnnnnnnnnnnnnnnomngnnnng 1100000 oo 1 In i jl X1 Y Y Y TIT 1 a 19 N i 27 5430 1 Illustration 17 Overall dimensions top view through board Illustration 18 Stacks heights not to scale 50 User s Manual TQMa35 UM 103 2013 by TQ Group Table 28 Height dimensions Dim Value mm Remark Combination module connector with mating plug a 5 00 0 20 6 7 and 8 mm also possible with different connectors on carrier board b 1 34 PC board Max 2 54 Crystal oscillator G2 d Max 1 99 RS232 Interface converter D3 e2 Max 1 60 Processor D10 6 3 Notes of treatment To avoid damage caused by mechanical stress the TQMa35 may only be extracted from the carrier board by using the extraction tool MOZI8XXL that can also be obtained separately 2 5
50. input impedance of VBUS does not become too low To achieve this an external voltage divider reduces the voltage at the VBUS pin to 25 An 8 2 V Zener diode is switched in parallel to Ri te tion i Session Vaid u Session End ext Vbus div b Illustration 7 USB Hi Speed OTG workaround Source IMX35CE Rev 3 40 User s Manual TQMa35 103 2013 by TQ Group 4 3 8 2 USB Host On the TQMa35 the USB High Speed Host is implemented with an STEricsson ULPI PHY ISP1715AETTM The connection is displayed in the following illustration The 5 V supply for the USB port has to be implemented on the carrier board The ULPI PHY is supplied with a 26 MHz clock USBH2_DATA 0 7 gt DATAQ 7 DIR USBH2_DIR USBH2_STP STP NXT AAAA USBH2_CLK GPIO2_26 OR 100k Illustration 8 Interface USB host Filtering and EMC protection for the USB signals has to be provided on the carrier board Notes are to be found in the USB standard User s Manual TQMa35 UM 103 2013 TQ Group Page 41 4 3 9 Ethernet The i MX35 offers a built in Fast Ethernet controller which is designed for 10 and 100 Mbps The provided MIl interface is available to the user directly at the module connectors The Ethern
51. odule can be equipped with 128 MiB 256 MiB or 512 MiB For the size of 128 MiB only one memory device is required For 256 MiB as well as 512 MiB two devices are required Two 32 bit wide RAM chips work parallel at the chip selects CSDO and CSD1 in the maximum expansion stage 512 MiB Both chips selects can address up to 256 MiB Both memory chips share all signals except chip select and clock enable signals The memory controller of the i MX35 supports clock frequencies of up to 133 MHz Table 18 gives an overview of the possible alternatives As a standard component placement the memory of Hynix is assembled Table 18 Memory models mDDR SDRAM Manu 128 MiB 256 MiB facturer Part Number Temperature Part Number Temperature Hynix H5MS1G22MFP J3M 30 to 85 H5MS2G22MFR J3M 30 to 85 C Micron MT46H32M32LFCM 6 IT 40 85 MT46H64M32LFCM 6 IT 40 to 85 C Only Micron offers mDDR memory for the temperature range of 40 to 85 C The temperature range of the module is limited to 30 to 85 C respective 25 to 85 C when the alternative memory is used 4 3 2 2 NOR flash The module can be assembled with 32 MiB 64 MiB or 128 MiB of NOR flash The functions WP and RST can be controlled directly via the carrier board when required Defined states are configured on the module for both signals In the following table the version is shown which can be assembled Table
52. requency tolerance versus temperature 50 40 to 85 Frequency ageing 3 max ppm per year 25 It is possible to buffer the RTC via the module connector with a battery When power is switched off the RTC circuit automatically switches to the backup supply For more information regarding buffering the RTC see paragraph 4 3 18 on page 48 4 3 5 Temperature sensor A National Semiconductor LM75 temperature sensor is present The sensor is placed on the bottom side of the module see D15 in Illustration 20 The connection of the sensor is shown in section 4 3 10 4 The OS output over temperature shutdown of the sensor including a 10 pull up at the processor pin G3 is optionally available at the module connector 4 3 6 SD card 5 offers two SD card controllers which are available at the module connectors The first controller SD1 is always available the second controller SD3 cannot be used on module versions with eMMC flash Table 23 Transfer modes SD interfaces Supported data transfer modes CPU interface One Bit Four Bit Eight Bit 501 Yes Yes No SD3 Yes Yes Yes The pull up resistors which are required for the operation of the SD interfaces must be implemented on the carrier board 38 User s Manual TQMa35 103 2013 by TQ Group 4 3 7 Graphics interfaces 43 71 LCD bus Parallel displays with a maximum frame size
53. stors User s Manual TQMa35 UM 103 2013 by TQ Group Page 45 4 3 10 5 CAN Both CPU internal FlexCAN controllers of the i MX35 with data rates up to 1 Mbit s according to CAN 2 0B protocol are used as CAN interfaces The signals are routed to the module connectors The corresponding drivers have to be provided on the carrier board 4 3 10 6 SPI1 Up to three devices can be connected to the SPI 1 bus Chip selects 550 551 and 553 are used for addressing 552 however is not available in the standard BSP It is routed to the module connector in another multiplexed function 4 3 10 7 SPI2 One device be connected to the SPI 2 bus Chip Select 550 is used for addressing SS1 to 553 are however not available in the standard BSP They are routed to the module connector in other multiplexed functions 4 3 10 8 SSI Synchronous modes with a common clock and sync signal for transmitter and receiver can be implemented via the available 4 5514 of the i MX35 The clock and sync signals for the implementation of asynchronous modes used by the 2 interface AUD4_TXD AUD4 AUD4 TXC AUD4_TXFS AAAA Illustration 14 Interface SSI 46 User s Manual TQMa35 103 2013 by TQ Group 4 3 10 9 1 Wire The 1 Wire interface of the i MX35 is directly routed to a module connector 4 3 11 PWM The PWM output of the i MX35 is directly accessible a
54. t a module connector pin 4 3 12 Keypad In the standard BSP the TOMa35 supports 16 keys in a 4x4 matrix Therefore four of the eight ROW or COL signals are available at a module connector 4 3 13 The i MX35 processor offers GPIO ports as a second or multiple configurations with other function units The configuration can be taken from the Freescale Reference Manual Some of the GPIOs are directly named as GPIO and routed directly to the module connector GPIOs are interrupt and wakeup capable A sequence for a wakeup triggered by a GPIO interrupt is displayed in the following illustration GPIO wakeup event VSTBY CCMLPMstate Sms condon anme System Clocks Run mode Illustration 15 Timing diagram of a GPIO wakeup interrupt Source i MX35 Reference Manual Rev 3 4 3 14 Timer One capture and one compare channel of the CPU s general purpose timer is available at the module connector 4 3 15 BDM JTAG User s Manual TQMa35 UM 103 2013 by TQ Group Page 47 The BDM JTAG signals are directly routed from the CPU to the module connector All necessary pull up and pull down resistors are present on the TOMa35 SJC MOD VIN 10k 10k 10k 10k 1k 1k Illustration 16 4 3 16 Power management Interfac
55. tion and the use of the device User s Manual TQMa35 UM 103 2013 by TQ Group Page 5 1 10 Acronyms and definitions The following acronyms and abbreviations are used in this document Table 2 Acronyms Acronym Advanced RISC Machine ATA Advanced Technology Attachment BDM Background Debug Mode BGA Ball Grid Array BSP Board Support Package CAN Controller Area Network CCD Charge Coupled Device CE ATA Consumer Electronics Advanced Technology Attachment CMOS Complementary Metal Oxide Semiconductor CPU Central Processing Unit DDR Double Data Rate DNC Do Not Connect ECC Error Checking and Correction EEPROM Electrically Erasable Programmable Read only Memory EMC Electromagnetic Compatibility eMMC embedded MultiMediaCard Flash ESD Electrostatic Discharge FEC Fast Ethernet Controller FR 4 Flame Retardant 4 GPIO General Purpose Input Output GPU Graphics Processor Unit Vo Input Output IPOO Ingress Protection 00 IPU Image Processing Unit Inter Integrated Circuit Joint Test Action Group LCD Liquid Crystal Display LED Light Emitting Diode LSB Least Significant Bit LVTTL Low Voltage Transistor Transistor Logic Mbps Megabit per second mDDR mobile Double Data Rate MIC Microphone MII Media Independent Interface 6 User s Manual TQMa35 103 2013 by T
56. yrights of all the used graphics and texts in all publications and strives to use original or license free graphics and texts All the brand names and trademarks mentioned in the publication including those protected by a third party unless specified otherwise in writing are subjected to the specifications of the current copyright laws and the proprietary laws of the present registered proprietor without any limitation One should conclude that brands and trademarks are protected through the rights of a third party User s Manual TQMa35 UM 103 2013 by TQ Group Page 3 1 6 Imprint TQ Systems GmbH Gut Delling M hlstra e 2 82229 Seefeld Tel 49 0 8153 9308 0 Fax 49 0 8153 9308 134 Email info tqs de Web http www tg group com 1 7 Disclaimer TQ Systems GmbH does not guarantee that the information in this manual is up to date correct complete or of good quality Nor does TQ Systems assume guarantee for further usage of the information Liability claims against TQ Systems GmbH referring to material or non material related damages caused due to usage or non usage of the information given in the manual or caused due to usage of erroneous or incomplete information are exempted as long as there is no proven intentional or negligent fault of TQ Systems GmbH TQ Systems GmbH explicitly reserves the rights to change or add to the contents of this manual or parts of it without special notification 1 8 Copyright
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