BT730 Hardware Integration Guide
Contents
1. 88 on or TT BT 700 29 7 16 345 275 277 10mmC60P Figure 11 BT730 shipping tray details Americas 1 800 492 2320 Option 2 23 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 7 3 Reflow Parameters Laird surface mount modules are designed to be easily manufactured including reflow soldering to a PCB It is ultimately the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste Laird Technologies surface mount modules conform to J STD 020D1 standards for reflow temperatures Important During reflow modules should not be above 260 and not for more than 30 seconds 300 250 eee Target Profile 200 Soak Min Soak Max 150 Liquidous 100 Lower Target Upper Target Absolute Peak O 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 Figure 12 Recommended reflow temperature Temperatures should not exceed the minimums or maximums presented in Table 5 3 2 1 Table 5 3 2 1 Recommended Maximum and minimum temperatures Temperature Inc Dec Rate max 1 3 C Sec Temperature Decrease rate goal 2 4 C Sec Soak Temp Increase rate goal 5 1 C Sec Fl2. Laird gt Class 1 Bluetooth v2 0 Module HARDWARE INTEGRATION GUIDE VERSION 1 4 Part BT730 SA BT730 SC Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide REVISION HISTORY 1 0 19 June 2013 Initial Release Replaced PCB Land Pattern and Antenna Keep out for BT730 SA 1 1 23 June 2013 Made Fixed incorrect text Updated table captions Removal of OBEX Client Updated Bluetooth SIG Approvals 1 3 30 September 2013 Updated BT730 SA placement on host PCB image 1 4 06 Feb 2014 Updated Bluetooth SIG Qualification section 1 2 30 August 2013 Americas 1 800 492 2320 Option 2 2 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide CONTENTS REVISION HIS TONY oi scated occa cece ese Avi bases etase eege Data rade ibn eee nant ieee een niet en a cette eegen 2 CONTENTS asrina a aeae AR deeg ee Panne A SN in ANNE Nan ass antenne eke 3 Overview and Key Features EEN 4 Features amp Renette Teens mi eanan EE sites adeleg SEENEN SERGE 4 NET E e 5 1 1 Detailed Sp cifications sssesissdesdeccnsenecanndsvcasied anne cas cansaaitbenhed E aaea aa R AEE R aiaia 5 2 Hardware Specifications iii 7 2 1 Block Diagram and GL E E 7 2 2 le Et 8 2 3 Electrical Specifications iscsscit
3. Table 2 3 2 7 Miscellaneous nRESET 5 l V max 1 0V Active LOW The Reset input Vamin 2 3V contains a 10 kQ pull up resistor internal to module Americas 1 800 492 2320 Option 2 11 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 3 IO CHARACTERISTICS 3 1 Power Consumption The current drain from the VCC power input line is dependent on various factors The three most significant factors are the voltage level at VCC UART baud rate and the operating mode The hardware specification for the module allows for a voltage range of 3 3 to 5 0 at VCC The unit includes a linear regulator and tests have shown that there is no significant difference in current draw when VCC changes within the operating limits Tests have shown that where power dissipation is an issue it is best to keep VCC at the lower end of the range The UART baud rate has a bearing on power dissipation because as is normal for digital electronics the power requirements increase linearly with increasing clocking frequencies Because of this higher baud rates result in a higher current drain Finally the significant operating modes are idle waiting for a connection inquiring initiating a connection sniff and connected With connected mode it is also relevant to differentiate between no data being transferred and when data is being transferred at the maxim
4. further information on this topic To reduce potential radio interference to other users the antenna type and gain should be chosen so that the equivalent isotropic radiated power EIRP is not more than that permitted for successful communication 8 2 Power Exposure Information In general there are two agency classifications for RF radiation exposure in wireless applications portable and mobile Mobile A mobile device is defined as a transmitting device designed to be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter s radiating structures and the body of the user or nearby persons The BT730 is fully modular approved for mobile and fixed applications Reference FCC Part 2 1091 for further details on mobile devices This transmitter must not be co located or operating in conjunction with any other antenna or transmitter Portable Portable is a classification of equipment where the user in general will be within 20 cm of the transmitting antenna Portable equipment is further broken down into two classes within 2 5 cm of human contact and beyond 2 5 cm The BT730 does not hold a portable approval classification due to its peak output power and modular approval restrictions Further RF evaluation is required by customers who want to use the BT730 in portable applications Contact a qualified test house or a Laird Technologies representative for further information
5. 800 492 2320 Option 2 30 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 10 BLUETOOTH SIG QUALIFICATION The BT730 module is listed on the Bluetooth SIG website as qualified End Products BT730 Laird BO20652 https Awww bluetooth org tpg QLI_viewQDL cfm qgid 20652 Technologies It is a mandatory requirement of the Bluetooth Special Interest Group SIG that every product implementing Bluetooth technology has a Declaration ID Every Bluetooth design is required to go through the qualification process even when referencing a Bluetooth Design that already has its own Declaration ID The Qualification Process requires each company to registered as a member of the Bluetooth SIG www bluetooth org The following link provides a link to the Bluetooth Registration page https Awww bluetooth org login register For each Bluetooth Design it is necessary to purchase a Declaration ID This can be done before starting the new qualification either through invoicing or credit card payment The fees for the Declaration ID will depend on your membership status please refer to the following webpage https Awww bluetooth org en us test qualification qualification overview fees For a detailed procedure of how to obtain a new Declaration ID for your design please refer to the following SIG document https Awww bluetooth org DocMan handlers Dow
6. Authorized Person Andrew Dobbing Engineering Manager Signature el i Americas 1 800 492 2320 Option 2 29 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 9 2 BT730 SC Manufacturer Laird Technologies Product BT730 SC EU Directive RTTE 1995 5 EC Conformity Assessment Annex IV Reference standards used for presumption of conformity 3 1a Health and Safety EN 60950 1 2006 3 1b Protection requirements with EN 301 489 1 V1 8 1 respect to electromagnetic EN 301 489 17 V2 1 1 compatibility Emissions EN55022 2006 A1 2000 A2 2006 ClassB Immunity EN61000 4 2 1995 A1 1998 A2 2001 EN61000 4 3 2002 A1 2002 3 2 Means of the efficient use of the EN 300 328 V1 8 1 2012 06 radio frequency spectrum Declaration We Laird Technologies declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995 5 EC when used for its intended purpose Place of Issue Laird Technologies Saturn House Mercury Park Wooburn Green HP100HH United Kingdom tel 44 0 1628 858 940 fax 44 0 1628 528 382 Date of Issue June 2013 Name of Authorized Person Andrew Dobbing Engineering Manager lt St Signature STs Americas 1
7. GPIO pins are at VCC_3V3 _monitor voltage levels Ensure ADC pin maximum input voltage 1 8 V for damage is not violated UART Is required Add connector to allow UART to be interfaced to PC via UART RS232 or UART USB UART_RX and UART_CTS Add a 10 k pull up to the host PCB on the UART_RX otherwise the module remains in deep sleep if not driven to high The pull up prevents the module from going into deep sleep when UART_RX line is idling Add a 10 k pull down to the host PCB on the UART_CTS that if it is not connected which we do not recommend then the default state for UART_CTS input will be asserted which means can send data out of UART_TX line e nRESET pin active low Hardware reset Wire out to push button or drive by host If used external reset must be exerted for a minimum of 5 mS By default the module is out of reset when power is applied to the VCC pin PCM All four PCM signals are routed directly from chipset to external BT730 Sx module pins It is then up to customer to configure appropriately A 4 7 k pull down resistor to ground on PCM_OUT may help resolve audio noise problems when chipset PCM_OUT line tristates 5 2 PCB Layout on Host PCB General Checklist for PCB MUST locate the BT730 SA module close to the edge of PCB mandatory for BT730 SA for on board chips antenna to radiate properly Use solid GND plane on inner layer for best EMC and RF performance Place GND vias as close to modul
8. ORDERING INFORMATION BT730 SA Class 1 Bluetooth V2 0 Module internal antenna BT730 SC Class 1 Bluetooth v2 0 Module uFL for external antenna DVK BT730 SA Development board with BT730 SA module soldered in place DVK BT730 SC Development board with BT730 SC module soldered in place 11 1 General Comments This is a preliminary datasheet Please check with Laird Technologies for the latest information before commencing a design If in doubt ask Americas 1 800 492 2320 Option 2 32 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide Laird Smart Technology Delivered Laird Technologies is the world leader in the design and manufacture of customized performance critical products for wireless and other advanced electronics applications Laird Technologies partners with its customers to find solutions for applications in various industries such as Network Equipment Telecommunications Data Communications Automotive Electronics Computers Aerospace Military Medical Equipment Consumer Electronics Laird Technologies offers its customers unique product solutions dedication to research and development as well as a seamless network of manufacturing and customer support facilities across the globe globalsolutions local support USA 1 800 492 2320 Europe 44 1628 858 94
9. on this topic Reference FCC Part 2 1093 for further details on portable devices Maximum Permissible Exposure report has been created which shows the minimum distances for Public and Occupational use of the BT730 Americas 1 800 492 2320 Option 2 25 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide Note Occupational Limit Minimum Distance 1 5 cm Public Limit Minimum Distance 3 cm Note This equipment was tested and found to comply with the limits for a Class B digital device pursuant to Part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference does not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to correct the interference by one or more of the following measures e Reorient or relocate the receiving antenna Increase the separation between the equipment and the receiver Connect the equipment to an outlet on a circuit that is different from
10. 0 Asia 852 2923 0610 wirelessinfo lairdtech com www lairdtech com wireless CONN HIG BT730 Copyright 2014 Laird Technologies Inc All rights reserved The information contained in this manual and the accompanying software programs are copyrighted and all rights are reserved by Laird Technologies Inc Laird Technologies Inc reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision Copying duplicating selling or otherwise distributing any part of this product or accompanying documentation software without the prior consent of an authorized representative of Laird Technologies Inc is strictly prohibited All brands and product names in this publication are registered trademarks or trademarks of their respective holders This material is preliminary Information furnished by Laird Technologies in this specification is believed to be accurate Devices sold by Laird Technologies are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only Laird Technologies makes no warranty express statutory and implied or by description regarding the information set forth herein Laird Technologies reserves the right to change specifications at any time and without notice Laird Technologies products are intended for use in normal commercial and industrial applications Applications requiring unusual environmental requirements such as mi
11. 15 29 x 28 71 mm the modules deliver maximum range with minimum size Another integration advantage is the inclusion of a complete Bluetooth v2 0 protocol stack with support for multi point connections and numerous Bluetooth profiles including Serial Port Profile SPP Dial Up Networking DUN FTP Client plus partial support for Headset HSP and HandsFree HFP BT730 modules are fully qualified as Bluetooth end products enabling designers to integrate the modules in devices without the need for further Bluetooth qualification An integrated AT command processor interfaces to the host system over a serial port using an extensive range of AT commands The AT command set abstracts the Bluetooth protocol from the host application saving many months of programming and integration time It provides extremely short integration times for data oriented Bluetooth applications The included firmware provides programming support for multi point applications that use up to three simultaneous data connections to and from the robust BT730 module A low cost developer s kit makes it easy for an OEM to integrate the module and guarantees the fastest route to prototype and then mass production Features amp Benefits rons Application Areas Bluetooth v2 0 Medical devices External or internal antennas ePOS terminals Comprehensive AT command set Automotive diagnostic equipment Bluetooth EPL Barcode scanners Compact footprint Industrial cable
12. 3 SPI related are on y for Laird internal production purposes 3 Power on reset power cycling and brown out consideration The reset circuitry within the BT730 module incorporates a brown out detector this may simplify power supply design The BT730 reset line is an active low input Input debounced so must be low for more than 5 ms to cause a reset Upon the application of power the Power On Reset circuit built into the module ensures that the unit starts correctly There is no need for an external power reset monitor 4 Power Supply Consideration The power supply for the module should be a single voltage source of VCC within the VCC_IN range of 3 3 V to 5 0 V It must be able to provide sufficient current in a transmit burst This can rise to 200 mA To limit dissipation it is recommended that you use a voltage at the lower end of the range 5 The module includes regulators to provide internal local 3 3 V This rail is accessible on pin 13 for monitoring purposes only Under no circumstances should this pin be used to source current 2 2 1 COMPATIBILITY NOTE FOR LEGACY DEVICES If Reset compatibility is required with BTM402 and BTM404 Reset logic must be inverted on the host PCB by using suitable BJT MMBT3904 with collector connected to Reset pin BT730 module pin 5 A fixed 10k Ohm pull down resistor to ground BJT input then ensures that the BT730 module is out of reset for the condition when host has yet to control the rese
13. DEC Winbond W681360 13 bit linear CODEC 4 4 General Purpose I O and ADC 4 4 1 GPIO Seven lines of programmable bi directional input outputs I O are provided that can be accessed either via the UART port or Over the Air OTA from a second Bluetooth unit These can be used as data inputs or to control external equipment By using these in OTA mode a BT730 module can be used for control and data acquisition without the need for any additional host processor Each of the GPIO 3 9 ports can be independently configured to be either an input or output A selection of ports can be accessed synchronously The ports are powered from internal VCC_3V3 The mode of these lines can be configured and the lines are accessed via S Registers 623 to 629 Americas 1 800 492 2320 Option 2 14 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 4 4 2 ADC The BT730 provides access to two 8 bit ADCs Analogue 0 and 1 These provide an input range of 0 mV to 1 800 mV which can be read using the S registers 701 and 702 Suitable external scaling and over voltage protection should be incorporated in your design The module provides five samples per second at the UART with a baud rate of 115 200 or above 4 5 BT730 SA On board Chip Antenna Characteristics The BT730 SA on board chip monopole antenna radiated performance depends on the host PCB layo
14. M_OUT Profiles SPP Serial Port Profile DUN Dial Up Networking FTP Client File Transfer Client Profile HFP amp HSP Audio Gateway Hands Free amp Headset Command Interfaces Operation Modes Firmware Upgrade AT Command Set Multi Point API 3 simultaneous connections Firmware Upgrade over UART Audio Support 3 x PCM Channels 64 kpbs SCO Channels SCO and eSCO PCM Interface Configurable as master or slave 8 bit A law 8 bit u law 13 bit linear PCM Clock available when in slave mode Supply Voltage Supply 3 3 50V On board regulators and brown out detection GPIO voltages are 3 3V logic Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth CONN HIG BT730 Class 1 Bluetooth v2 0 Module Hardware Integration Guide Power Consumption Various Modes Idle mode 1 25 mA Typical values Discoverable 2 7 mA to 55 mA see Power Consumption inquiry mode 65 mA section for test conditions Connecting mode 66 mA Connected mode no data transfer oma Connected mode max data transfer cii Sniff mode 1 8 MA Antenna Options Internal Multilayer ceramic chip BT730 SA External Connection via u FL BT730 SC Physical Connections Surface Mount Pads 1 2mm pitch Dimensions 15 29 mm x 28 71 mm x 2 5 mm Weight 1 59 Environmental Operating 40 C to 85 C Storage 40 C to 85 C Miscellaneou
15. aux rayonnements IC tablies pour un environnement non contr l Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps This device is intended only for OEM integrators under the following conditions For module device use 1 The antenna must be installed such that 20 cm is maintained between the antenna and users 2 The transmitter module may not be co located with any other transmitter or antenna As long as 2 conditions above are met further transmitter test will not be required However the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed Cet appareil est con u uniquement pour les int grateurs OEM dans les conditions suivantes Pour utilisation de dispositif module 1 L antenne doit tre install e de telle sorte qu une distance de 20 cm est respect e entre l antenne et les utilisateurs 2 Le module metteur peut ne pas tre coimplant avec un autre metteur ou antenne Tant que les 2 conditions ci dessus sont remplies des essais suppl mentaires sur l metteur ne seront pas n cessaires Toutefois l int grateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit suppl mentaires requis pour ce module install IMPORTANT NOTE In the event that these conditions can not be met for example certa
16. claration of Conformities listed below for a full list of the standards that the modules were tested to Test reports are available upon request Americas 1 800 492 2320 Option 2 28 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 9 EU DECLARATIONS OF CONFORMITY 9 1 BT730 SA Manufacturer Laird Technologies Product BT730 SA EU Directive RTTE 1995 5 EC Conformity Assessment Annex IV Reference standards used for presumption of conformity 3 1a Health and Safety EN 60950 1 2006 3 1b Protection requirements with EN 301 489 1 V1 8 1 respect to electromagnetic EN 301 489 17 V2 1 1 compatibility Emissions EN55022 2006 A1 2000 A2 2006 ClassB Immunity EN61000 4 2 1995 A1 1998 A2 2001 EN61000 4 3 2002 A1 2002 3 2 Means of the efficient use of the EN 300 328 V1 8 1 2012 06 radio frequency spectrum Declaration We Laird Technologies declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995 5 EC when used for its intended purpose Place of Issue Laird Technologies Saturn House Mercury Park Wooburn Green HP100HH United Kingdom tel 44 0 1628 858 940 fax 44 0 1628 528 382 Date of Issue June 2013 Name of
17. de telle sorte qu une distance de 20cm peut tre maintenue entre l antenne et les utilisateurs Le produit final doit tre tiquet dans un endroit visible avec l inscription suivante Contient des IC Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user s manual of the end product which integrates this module The end user manual shall include all required regulatory information warning as show in this manual Manuel d information l utilisateur final L int grateur OEM doit tre conscient de ne pas fournir des informations l utilisateur final quant la fa on d installer ou de supprimer ce module RF dans le manuel de l utilisateur du produit final qui int gre ce module Le manuel de l utilisateur final doit inclure toutes les informations r glementaires requises et avertissements comme indiqu dans ce manuel 8 5 CE Regulatory The BT730 has been tested for compliance with relevant standards for the EU market The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their complete device The BT730 was tested with a 2dBi dipole antenna The OEM is free to use any manufacturer s antenna and type of antenna but it must be lt 2dBi to remain in compliance with the Laird reports Reference the De
18. e multiple radio links are active at the same time The complexity and flexibility of configuration are made simple for the design engineer by the integration of a comprehensive set of AT commands supplemented with a range of S registers which are used for non volatile storage of system parameters To provide the widest scope for integration a range of different physical host interfaces are provided 4 1 UART Interface UART_TX UART_RX UART_RTS and UART_CTS form a conventional asynchronous serial data port with handshaking The interface is designed to operate correctly when connected to other UART devices such as the 16550A The signalling levels are nominal 0 V and 3 3 V and are inverted with respect to the signalling on an RS232 cable The interface is programmable over a variety of bitrates no even or odd parity stop bit and hardware flow control The default condition on power up is pre assigned in the external flash Two way hardware flow control is implemented by UART_RTS and UART_CTS UART_RTS is an output and is active low UART_CTS is an input and is active low These signals operate according to normal industry convention UART_RX UART_TX UART_CTS UART_RTS UART_RI UART_DCD and UART_DSR are all 3 3 V level logic For example when RX and TX are idle they sit at 3 3 V Conversely for handshaking pins CTS RTS RI DCD and DSR a 0 V is treated as an assertion By writing different values to the relevant S register
19. e GND pads as possible Unused host PCB area on surface layer can be flooded with copper but place GND vias regularly to connect copper flood to inner GND plane If GND flood copper underside the module then connect with GND vias to inner GND plane Route traces to avoid noise being picked up on VCC_IN supply Analogue and GPIO digital traces Ensure there is no exposed copper on the underside of the module refer to land pattern drawing of BT730 Sx Americas 1 800 492 2320 Option 2 16 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 5 3 PCB Layout on Host PCB for BT730 SA 5 3 1 Antenna keep out on host PCB The BT730 SA has an integrated chip antenna and its performance is sensitive to the host PCB It is critical to locate the BT730 SA on the edge of the host PCB or corner to allow the antenna to radiate properly Refer to guidelines in the section PCB Land Pattern and Antenna Keep out area for BT730 SA Some of the guidelines are repeated below Ensure there is no copper in the antenna keep out area on any layers of the host PCB Keep all mounting hardware and metal clear of the area to allow proper antenna radiation For best antenna performance place the BT730 SA module on the edge of the host PCB preferably in the corner with the antenna facing the corner An example shown in Figure 3 A different host PCB th
20. e distance for metals without seriously compromising the antenna tuning is 40 mm top bottom and 30 mm left or right Metal close to the BT730 SA chip monopole antenna bottom top left right any direction will have degradation on the antenna performance The amount of degradation is entirely system dependent which means some testing by customer is required in their host application Anything metal closer than 20 mm starts to significantly degrade performance S11 gain radiation efficiency It is best that the customer tests the range with a mock up or actual prototype of the product to assess effects of enclosure height and material whether metal or plastic ETAL ANTENNA CONNECTOR d P ANTENNA OTHER BOARD Figure 5 Recommended BT730 SA placement on host PCB and proximity to metal cover ETAL ETAL e ee Figure 6 Not recommended BT730 SA placement on host PCB and proximity to metal cover Americas 1 800 492 2320 Option 2 18 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 5 4 External Antenna Integration with BT730 SC Refer to the regulatory sections for FCC IC and CE for details of use of BT730 SC with external antennas in each regulatory region The BT730 SC family has been designed to operate with the antennas listed below with a maximum gain of 2 dBi The required antenna impedance is 50
21. es A 2 3 25 27 Al 0 5 0 6 0 7 PCB Thickness A2 1 8 1 9 2 0 RF Shield Height b 0 75 0 80 0 85 Global pad width D 15 20 15 30 15 40 E 28 60 28 70 28 80 e 1 2 Global pitch Di 9 6 E1 13 2 F 2 42 Pad Center to board edge G 5 05 Pod Center to board edge H 1 0 Global length of pad to edge of board Units mm Figure 9 BT7xx Mechanical Drawing Americas 1 800 492 2320 Option 2 21 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 6 4 PCB Land Pattern and Antenna Keep out for BT730 SA 7 28 48 H 0 23 Unit is mm S Pin Pitch 10 46 1 2x11 13 2 vo Pad Width RS 0 84 ES ip a a Oo m D S Po e B ta 13 c l D KEEP DUT AREA gt 4 70x15 29mm Pad Length 2 5 76 L 9 1 73 k Oe AE Figure 10 PCB Land Pattern and Antenna Keep out for BT730 SA APPLICATION NOTES 1 Ensure there is no copper in the antenna keep out area on any layers of the host PCB Also keep all mounting hardware or any metal clear of the area to reduce effects of proximity detuning the antenna and to help antenna radiate properly Refer to section 5 3 2 for more information 2 For BT730 SA with on board chip antenna best antenna performance the module BT730 SA must be placed on the edge of the host PCB and preferably in the corner
22. esss ee e a EE EE Ee E EAE EEE RE 23 T2 SIND e EE 23 AS lR TIOW TE 24 8 Regulatory Statements sioria istun aranaren aan annaa rakaa EES aeaa aparioa nairean ranica iais 25 BPM e EE 25 8 2 Power Exposure INFOFMAtION ssena EE E E E EAE EE E RA EEO EEE aaa aSa 25 8 3 QEM ReSbonsibiliti s 3 25824 Aucessvennced cesvseesaseddccdvedesennananddedavavdansaxeaacdaawsnnden anseddctuwesaecaasesavaiendradssessetcbart 26 8 4 Industry Canada IC Warnings isipin inadai aiaiai dogenedecdendcs 27 8 5 CEIRGSUALORY E 28 9 EU Declarations of Conformity iii 29 ET Cu 29 GER Cu 30 10 Bluetooth SIG Qualification iii 31 10 1 Additional ET 31 11 Ordering Information sisi 32 LL General om pense gie fis ceases vc tendent ine lee Rn detente mn re deeg EEEE GS 32 Americas 1 800 492 2320 Option 2 3 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide OVERVIEW AND KEY FEATURES Every BT730 series Bluetooth module from Laird Technologies is designed to add robust long range Bluetooth data connectivity to any device Based on the market leading Cambridge Silicon Radio CSR BCO4 chipset BT730 modules provide exceptionally low power consumption with outstanding Class 1 range via 18 dBm of transmit power A broad range of Bluetooth profiles and other vital features make BT730 modules superior to other Bluetooth modules With a compact footprint of
23. essssececssesvsuaicasecssoaiwesanadstacsuveaweaan aaah aaskwaxvesdaaeahecaubeanehsndaskasauacahescascavecdisecssovansesaes 10 3 et ger 12 31 Power CONSUMPTION sss oz eaii AE AER nn etes nee entendent sente abd geed gek 12 3 2 Typical Current CopnsumptionInm ceeeccesescececececseseeaesecececsesusseseeececseseeaeseescscseseeaesececscseseaaeaeeeescseeaaees 12 4 FUNCtiOnal DeSCriPtlOM EE AT MART e EN CT D LR D ang kash Eege AS PCM UME ET 4 4 General Purpose I O and ADC 4 5 BT730 SA On board Chip Antenna Characteristics ss 15 5 Hardware Integration Suggestions iii 16 CW ele TEE 16 5 2 PCB Layout om Host PCB GeMefalivescsssscsaccesoesvesacadesssscvenwscanadendassbsencecandaausedbeasedsasdasessh candeuasdavecaieessessendend c 16 5 3 PCB Layout on Host PCB for BT730 SA cccccsessccececsesesseeesececseseesaeseescscsesesaeseescscsesesaesesececseseaaeseeeceeseeaaees 17 5 4 External Antenna Integration With BT730 SC inner 19 6 Mechanical Details iii 20 6 1 BT730 SCMechanicalIDetails 3 43 e88sessnet nue sen n en EERSTEN 20 6 2 BT 30 SA Mechanical Detallls cscccccssscesesccsncsdnenivests cccunsssentccsncenesecs cus cesuaccsunecdentesetecounedeeniueseaensenacventecsenaaeees 20 6 3 BT730 Pad Definitions Mechanical Drawing iii 21 6 4 PCB Land Pattern and Antenna Keep out for BT730 SA nn 22 7 Application Note for Surface Mount Modules is 23 KE INRETO GU CUIOM is cusnwiuccatenestsuleucessacasecachaxshedancucesvanlcesentacuslactentesnunceta
24. ickness dielectric will have small effect on antenna the BT730 carrier development board used for antenna performance evaluation thickness was 0 78 mm The antenna keep out defined in PCB Land Pattern and Antenna Keep out area for BT730 SA applies when the BT730 SA is placed in the corner of the host PCB When BT730 SA cannot be placed as such it must be placed on the edge of the host PCB and a modified antenna keep out must be observed This antenna keep out modification is shown in Figure 4 antenna keep out is extended by 8 mm on both sides HIP ANTENNA ANTENNA CONNECTOR Figure 3 BT730 SA placement in the corner of host PCB O GND in this ares HIP ANTENNA ANTENNA CONNECTOR Figure 4 BT730 SA placement in the edge not corner of host PCB with modified antenna keep out Americas 1 800 492 2320 Option 2 17 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide Note Copper cut away on all layers in antenna keep out area under BT730 SA module on host PCB Refer to antenna keep out defined in section 6 4 PCB Land Pattern and Antenna Keep out for BT730 SA 5 3 2 Antenna Keep out and Proximity to Metal or Plastic Checklist for metal plastic enclosure Figure 12A and 12B shows recommended and not recommended locations for metal with respect to a BT730 SA module on board antenna Minimum saf
25. ide 2 2 Pin Definitions Table 2 2 1 1 Pin definitions 1 GND 2 SPI_MOSI SPI bus serial I P See Note 2 3 GPIO6 VO for host 4 GPIO7 VO for host 5 nRESET Module reset I P See Note 3 6 SPI_CLK SPI bus clock I P See Note 2 7 PCM_CLK PCM clock I P 8 PCM_SYNC PCM sync I P 9 PCM_IN PCM data I P 10 PCM_OUT PCM Data O P 11 VCC_IN 3 3V lt VCC_IN lt 5 0V See Note 4 12 GND 13 VCC_3V3_monitor 3 3 V Monitor do not connect See Note 5 14 Analogue 1 1 8 V max 15 GND 16 UART_DSR UART_DSR I P 17 UART_DCD UART_DCD I P or O P 18 GPIO_9 VO for host 19 GPIO_8 VO for host 20 GND 21 Analogue 0 1 8 V max 22 UART_RX Receive data I P 23 UART_TX Transmit data O P 24 UART_RTS Request to Send O P 25 UART_CTS Clear to Send I P 26 NC Reserved USB_D Not used for AT module variants 27 NC Reserved USB_D Not used for AT module variants 28 UART_RI Ring Input or Output 29 GPIO_3 UART_DTR VO for host UART_DTR 30 GPIO_5 VO for host 31 GPIO_4 VO for host 32 SPI_CSB SPI bus chip select I P See Note 2 33 SPI_LMISO SPI bus serial O P See Note 2 Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth CONN HIG BT730 Class 1 Bluetooth v2 0 Module Hardware Integration Guide Notes 1 Unused pins may have internal connections and must not be connected 2 Pins 2 6 32 and 3
26. in laptop configurations or co location with another transmitter then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product In these circumstances the OEM integrator will be responsible for re evaluating the end product including the transmitter and obtaining a separate Canada authorization NOTE IMPORTANTE Dans le cas o ces conditions ne peuvent tre satisfaites par exemple pour certaines configurations d ordinateur portable ou de certaines co localisation avec un autre metteur l autorisation du Canada n est plus consid r comme valide et l ID IC ne peut pas tre utilis sur le produit final Dans ces circonstances l int grateur OEM sera charg de r valuer le produit final y compris l metteur et l obtention d une autorisation distincte au Canada Americas 1 800 492 2320 Option 2 27 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users The final end product must be labeled in a visible area with the following Contains IC Plaque signal tique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l antenne peut tre install e
27. ization is no longer considered valid and the FCC ID can not be used on the final product In these circumstances the OEM integrator will be responsible for re evaluating the end product including the transmitter and obtaining a separate FCC authorization End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users The final end product must be labeled in a visible area with the following Contains FCC ID SQGBT700 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user s manual of the end product which integrates this module Americas 1 800 492 2320 Option 2 26 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide The end user manual shall include all required regulatory information warning as show in this manual 8 4 Industry Canada IC Warning Radiation Exposure Statement This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment This equipment should be installed and operated with minimum distance 20cm between the radiator amp your body D claration d exposition aux radiations Cet quipement est conforme aux limites d exposition
28. litary medical life support or life sustaining equipment are specifically not recommended without additional testing for such application Limited Warranty Disclaimer Limitation of Liability Americas 1 800 492 2320 Option 2 33 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth
29. nloadDoc ashx doc_id 2836988vld 3 17486 To start the listing go to https Avww bluetooth org tpg QLI_SDoc cfm In step 1 select Reference a Qualified Design and enter 20652 in the End Product table entry You can then select your pre paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page please note that unless the Declaration ID is pre paid or purchased with a credit card it will not be possible to proceed until the SIG invoice is paid Once all the relevant sections of step 1 are finished complete steps 2 3 and 4 as described in the help document Your new Design will be listed on the SIG website and you can print your Certificate and DoC For further information please refer to the following training material https Awww bluetooth org en us test qualification qualification overview listing process updates 10 1 Additional Assistance Please contact your local sales representative or our support team for further assistance Laird Technologies Connectivity Products Business Unit Support Centre http ews support lairdtech com Email wireless support lairdtech com Phone Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 Web http Awww lairdtech com bluetooth Americas 1 800 492 2320 Option 2 31 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 11
30. nternal receive buffers will overflow this could lead to an internal processor crash This also leads to a drop in connection and may require a power cycle to reset the module Laird recommends that the correct CTS RTS handshaking protocol be followed for proper operation 4 2 SPI Bus The module is a slave device that uses terminals SPILMOSI SPILMISO SPI_CLK and SPI_CSB This interface is used for program firmware updates ONLY at the factory Laird supplies a PC based utility to allow a firmware upgrade over the UART port It is highly recommended that customers use the UART method for updating firmware Note The designer should be aware that no security protection is built into the hardware or firmware associated with this port so the terminals should not be permanently connected in a PC application 4 3 PCM Interface PCM_OUT PCM_IN PCM_CLK and PCM_SYNC carry up to three bi directional channels of voice data each at 8 k samples s The format of the PCM samples can be 8 bit A law 8 bit u law 13 bit linear or16 bit linear The PCM_CLK and PCM_SYNC terminals can be configured as inputs or outputs depending on whether the module is the master or slave of the PCM interface Please contact a Laird FAE for further details The module is compatible with the Motorola SSI TM interface and interfaces directly to PCM audio codec chips including the following 4 3 1 Compatible Codec Chips OKI 7702 single channel A law and p law CO
31. ohms External antennas improve radiation efficiency 1 MAF94045 Laird Internal 2 UFL 2 WRR2400 IPO4 B MAF94019 Laird Dipole 1 5 UFL 3 WTC2450 IP04 K MAF94006 Laird Dipole 2 UFL 4 S181FL L RMM 2450S Nearson Laird Dipole 2 UFL Note 1 Integral RF co axial cable with UFL connector Antenna manufacturer Laird contact information Email wireless support lairdtech com Americas 1 800 492 2320 Option 2 19 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 6 MECHANICAL DETAILS 6 1 BT730 SC Mechanical Details BT700 SC rev OX FCCID TBC IC TBC ZJ4000001 MAC 0015A4400000 Figure 7 BT730 SC mechanical details 6 2 BT730 SA Mechanical Details BT700 SA rev OX FCCID TBC iC TBC ZJ4000001 MAC 001 6A4400000 SCALE 2 1 Figure 8 BT730 SA mechanical details Americas 1 800 492 2320 Option 2 20 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth CONN HIG BT730 Class 1 Bluetooth v2 0 Module Hardware Integration Guide 6 3 BT730 Pad Definitions Mechanical Drawing Orientaion Mark on RF Shield Antenna RF Shield HCH ud Q TORDEN MESE ii D u si i 2 OI vi e 13 21 A D AL fe Description BT 700 Size 15 3 x 28 7 x 2 5 mm Pitch 1 2 mm Demension Minimum Typical Maximum Not
32. replacement Class 1 output 18dBm UART interface with GPIO Bluetooth Profiles Support PCM and ADC lines Industrial temperature range Held proven firmware used on Serial Port Profile SPP Dial Up Networking DUN BTM40x and BISM II product ranges PIP Client partial support for Headset HSP and Hands Free HFP Americas 1 800 492 2320 Option 2 V CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 1 SPECIFICATIONS 1 1 Detailed Specifications Table 2 2 1 1 Detailed specifications Wireless Specification Bluetooth V2 0 Frequency 2 402 2 480 GHz Bluetooth Transmitter Class Class 1 Basic Rate BT Max Transmit Power 18 dBm into integrated antenna BT730 SA 16 dBm into UFL antenna connector BT730 SC Min Transmit Power 9 dBm into integrated antenna 9 dBm into UFL antenna connector Receive Sensitivity Better than 87 dBm at 25 C Range Up to 1000m Line of Sight Data Rates Up to 1 0 Mbps over the air UART Data Transfer Rate Circa 300 kbps Host Interface UART One UART TX RX DCD RI DTR DSR CTS RTS Default 9600 n 8 1 From 1 200 to 921 600 bps GPIO 8 configurable lines ADC Two ADC channels 8 bit resolution PCM One PCM interface see Audio section PCM_CLK PCM_IN PCM_SYNC PC
33. s Lead Free Lead free and RoHS compliant Warranty 5 Year Limited Lifetime Development Tools Development Kit Development kit DVK BT730 and software tools Approvals Bluetooth End Product Listing EPL FCC IC CE All BT730 Series 1 DSR DTR RI and DCD are configurable either as GPIO or as modem control lines Americas 1 800 492 2320 Option 2 6 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 2 HARDWARE SPECIFICATIONS 2 1 Block Diagram and Pin out Tx Rx Control UART CSR In _ RF 6 _ Matching BC04 Ps UO PA Gain RX Tx Rx x jt Switch PCM ADC GPIO S DTR can be configured as a seventh GPIO Figure 1 Functional Block Diagram SE mett ee Rem iee Nie ag Kl E OO ca EE OGOs gt O0 2056 Lel Hl Ss HI oo QZY Jet O00 z00 D gt a OO a 13 14 VCC_3V3_monitor 15 Analogue1 16 GND 17 UART_DSR D 18 UART_DCD 5 49 GPIO9 20 GPIO8 on D o 211 DEE Yael AnalogueO _ WS BOO O02 EES Edel 53455225000009 LR AE TE nl NATO OMNO QOT NOM NNN NN NN NMM Figure 2 BT730 Sx module pin out Top View Americas 1 800 492 2320 Option 2 7 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Gu
34. t line Add a 10 k pull up to the host PCB on the UART_RX otherwise the module will remain in deep sleep if not driven to high Add a 10 k pull down to the host PCB on the UART_CTS that if it is not connected which we do not recommend then the default state for UART_CTS input will be asserted which means can send data out of UART_TX line GPIO lines can be configured through software to be either inputs or outputs with weak or strong pull ups or pull downs At reset all GPIO lines are configured as inputs with weak pull downs UART_RX UART_TX UART_CTS UART_RTS UART_RI UART_DCD and UART_DSR are 3 3 V level logic For example when RX and TX are idle they sit at 3 3 V Conversely for handshaking pins CTS RTS RI DCD and DSR a O V is treated as an assertion Pin 28 UART_RI is active low It is normally 3 3 V When a remote device initiates a connection this pin goes low This means that when this pin is converted to RS232 voltage levels it has the correct voltage level for assertion Pin 17 UART_DCD is active low It is normally 3 3 V When a connection is live this pin is low This means that when this pin is converted to RS232 voltage levels it has the correct voltage level for assertion Pin 16 UART_DSR is an input with active low logic It should be connected to the DTR output of the host When the BTM730 module is in high speed mode see S Register 507 in the Firmware User manual this pin should be asserted b
35. that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help CAUTION THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES AND INDUSTRY CANADA LICENSE EXEMPT RSS STANDARD S OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS 1 THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE AND 2 THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION CAUTION The OEM should have the device incorporating with the BT740 tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators CAUTION Any changes or modifications not expressly approved by Laird could void the user s authority to operate the equipment 8 3 OEM Responsibilities This device is intended only for OEM integrators under the following conditions 1 The antenna must be installed such that 20 cm is maintained between the antenna and users 2 The transmitter module may not be co located with any other transmitter or antenna As long as 2 conditions above are met further transmitter test will not be required However the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed IMPORTANT NOTE In the event that these conditions can not be met for example certain laptop configurations or co location with another transmitter then the FCC author
36. the LDO inside the module which is typically 3 3 V So to achieve 3 3 V for VCC_3V3_monitor at Max Tx Power requires VCC_IN of 3 5 V IO voltage levels follows VCC_3V3_monitor At minimum VCC_VIN of 3 3 V the internal LDO generates 3 3 V but when Radio Tx at max Tx power VCC_3V3_monitor drops a little to 3 15 V Table 2 3 2 2 Signal Levels for Interface PCM SPI and GPIO ViLmin 0 4 V ibut ViLmax 0 8 V j VIHmin 2 3 V VIHmax 3 7 V VOLmax 0 2 V EE VOHmin 3 1 V Americas 1 800 492 2320 Option 2 10 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide Table 2 3 2 3 UART Interface UART_TX 23 O UART_RX 22 l UART_CTS 25 l UART_RTS 24 O UART_DSR 16 UART_DTR 29 O Shared with GPIO3 UART_RI 28 lor O Direction may be programmed UART_DCD 17 lor O Direction may be programmed Table 2 3 2 4 SPI Bus SPI_MOSI 2 SPI_MISO 33 O Laird INTERNAL USE ONLY Used to reprogram Flash in Laird SPI_CSB 32 l production SPI_CLK 6 Table 2 3 2 5 PCM Interface PCM_CLK 7 lor O If unused keep pins open a PCM output signals are tri stated when there is not an active u i eve 3 E SCO or eSCO connection PCM_OUT 10 Table 2 3 2 6 General Purpose VO and ADC GPIO_3 9 3 4 16 lorO See 3 3 2 2 17 18 19 29 30 31 AnalogueO Analogue1 14 21 Range 0 1 8V 8 bit
37. the UART_RI can be continuously polled to detect incoming communication The UART_RI signal serves to indicate incoming calls UART_DSR is an active low input It should be connected to DTR output of the host When the module is running in high speed mode see definition for S Reg 507 in the Firmware User manual this pin should be asserted by the host to ensure connection is maintained A de assertion means that the connection should be dropped or an online command mode is being requested The module communicates with the customer application using the following signals Port TXD of the application sends data to the module s UART_RX signal line Port RXD of the application receives data from the modules UART_TX signal line BT730 Application Host Nt Americas 1 800 492 2320 Option 2 13 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide Note The serial module output is at 3 3 V CMOS logic levels Level conversion must be added to interface with an RS 232 level compliant interface Some serial implementations link CTS and RTS to remove the need for handshaking Laird does not recommend linking CTS and RTS other than for testing and prototyping If these pins are linked and the host sends data at the point that the BT730 deasserts its RTS signal then there is a significant risk that i
38. um rate possible The AT command set document describes how to configure the module for optimal power performance 3 2 Typical Current Consumption in mA Table 4 2 Current Consumption VCC_IN 3 8 V Baudrate 9600 bps Typical Average Current mA Separation Distance 15 meters Idle Mode 512 1 1 25 mA Wait for Connection Or Discoverable Mode 55 mA AT BTP S508 S510 640 509 S511 320 Wait for Connection Or Discoverable Mode 2 7 mA AT BTP S508 S510 1000 S509 S511 11 Inquiry Mode AT BTI 65 mA Connecting Mode ATDxxx 66 mA Connected Mode No Data Transfer 6 mA Connected Mode Max Data Transfer 35 mA Sniff Mode 1 8 mA S564 1000 S563 500 S562 50 561 10 Americas 1 800 492 2320 Option 2 12 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 4 FUNCTIONAL DESCRIPTION The BT730 Bluetooth module is a self contained Bluetooth product and requires only power to implement full Bluetooth communication The integrated high performance antenna together with the RF and base band circuitry provides the Bluetooth wireless link the UART interface provides a connection to the host system The variety of interfaces and the AT command set allow the BT730 module to be used for a wide variety of long range wireless applications from simple cable replacement to complex multipoint applications wher
39. ut BT730 carrier board was used for BT730 SA development and antenna performance evaluation To obtain similar performance follow the guidelines in PCB Layout on Host PCB for BT730 SA to allow the on board antenna to radiate and reduce proximity effects due to nearby host PCB GND copper or metal covers BT730 SA on board antenna datasheet can be accessed from the following link http Awww acxc com tw product at32 16 AT3216 B2R7HAA_071204 pdf Americas 1 800 492 2320 Option 2 15 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 5 HARDWARE INTEGRATION SUGGESTIONS 5 1 Circuit The BT730 series module is easy to integrate requiring no external components on the customer s board apart from those required by customer for development and in customers end application Checklist for the schematic VCC_IN External power source within the operating range specification of BT730 Sx Add decoupling or bulk capacitors for filtering or reservoir the external source Power on reset circuitry within BT730 Sx series module incorporates brown out detector thus simplifying power supply design Upon application of power the internal power on reset ensures module starts correctly AIN ADC and GPIO or UART pin IO voltage levels BT73 Sx GPIO voltage levels are at VCC_3V3_monitor pin see section 2 3 Ensure input voltage levels into
40. ux Soak Period Min 70 Sec Flux Soak Period Max 120 Sec Flux Soak Temp Min 150 C Flux Soak Temp max 190 C Time Above Liquidous max 70 Sec Time Above Liquidous min 50 Sec Time In Target Reflow Range goal 30 Sec Time At Absolute Peak max 5 Sec Liquidous Temperature SAC305 218 E Lower Target Reflow Temperature 240 C Upper Target Reflow Temperature 250 C Absolute Peak Temperature 260 C Americas 1 800 492 2320 Option 2 24 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 8 REGULATORY STATEMENTS 8 1 FCC Family US FCC CANADAVIC BT x0 SQGBT700 3147A BT700 BT730 SA XX Surface Mount 18 dBm Ceramic BT730 SC XX Surface Mount 16 dBm U FL Last two slots XX in Part are used for production firmware release changes Can be values 01 99 aa zz The BT730 family has been designed to operate with the antennas listed below with a maximum gain of 2dBi The required antenna impedance is 50 ohms 1 AT3216 B2R7HAAT ACX Chip 0 5 2 MAF94045 Laird Internal 2 3 WRR2400 IPO4 B MAF94019 Laird Dipole 15 4 WTC2450 IP04 K MAF94006 Laird Dipole 2 5 S181FL L RMM 24505S Nearson Laird Dipole 2 Note The OEM is free to choose another vendor s antenna of like type and equal or lesser gain as an antenna appearing in the table and still maintain compliance Reference FCC Part 15 204 c 4 for
41. with the antenna facing the corner see Figure 3 in section 5 3 1 The module is placed in the corner of host PCB above the keep out area If the BT730 SA is not placed in corner but on edge of host PCB the antenna keep out area must be modified see Figure 4 in section 5 3 1 3 Ensure that there is no exposed copper under the module on the host PCB 4 The user may modify the PCB land pattern dimensions based on their experience and capability Americas 1 800 492 2320 Option 2 22 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide 7 APPLICATION NOTE FOR SURFACE MOUNT MODULES 7 1 Introduction Laird surface mount modules are designed to conform to all major manufacturing guidelines This application note is intended to provide additional guidance beyond the information that is presented in the user manual This application note is considered a living document and will be updated as new information is presented The modules are designed to meet the needs of a number of commercial and industrial applications The modules are designed to be easily manufactured and conform to current automated manufacturing processes 7 2 Shipping Modules are shipped in ESD Electrostatic Discharge safe trays that can be loaded into most manufacturers pick and place machines Layouts of the trays are provided in Figure 11
42. y the host to ensure that the connection is maintained A deassertion means that the connection should be dropped or an online command mode is being requested Pin 13 VCC_3V3 monitor may only be used for monitoring purposes It must not be used as a current source Americas 1 800 492 2320 Option 2 9 CONN HIG BT730 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Class 1 Bluetooth v2 0 Module Hardware Integration Guide The GPIO pins can be accessed using S Registers 623 to 629 GPIO3 is also used for DTR output active low See S Register 552 and 553 in the Firmware User manual Analogue 0 and 1 should not exceed 1 8 V and S Registers 701 and 702 are used to access them 2 3 Electrical Specifications 2 3 1 Absolute Maximum ratings Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below exceeding these values will cause permanent damage Table 2 3 1 1 Absolute Maximum Ratings Peak current of power supply 0 200 mA Voltage at digital pins 0 4 3 7 V Voltage at POWER pin 2 9 6 0 V 2 3 2 Recommended Operating Parameters Table 2 3 2 1 Power Supply 3 3 V to 5 0 V VCC_IN 11 lyo 115 mA cc Typ 3 5 V S d GND 1 12 15 20 Four 4 ground terminals to be attached in parallel VCC_3V3_monitor 13 O 3 3 V typical For monitoring only No current source Note VCC_3V3_monitor refers to internal voltage generated by
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