KIDI R450A english manual
Contents
1. pe IDIse ag ze a BGA Hot Air BGA Rework Station Model No KIDI R450A USER MANUAL V1 0 shenzhen W KIDI Technology Co Ltd PDF HEH pdfFactory Pro wWWAHARA est www fineprint cn Directory IT Instructions on Installation and Operating precautions soan cc vec eu cece eee eee IT Introduction of Rework Station KID R450A aaa J IM BGA Operating PLOCOLUTOS ira aria citada cia EEEE LOS rindo rs io Powe ro alto ao eee AN eee es ALEM DOGTAS erari aa arcas pisada aii 6 Je AMY EA cee Aker end od den E d ear cad cede bee id ad H ee Lae se cares aid ge ita aa EE es 9 e BO T EE 10 ls BOA reball SOLU crt ced ean risti PrE cede Ad ade eee Bee ea Ea 13 le OY SOMO FTI EE RAO Ae EE deb ea 14 Ge IIS so o as E io ae si ee eae pn a ee 14 Oy UR EE 14 IV iMromreiiar 01 Toten Sereen CONT cst ccd rar ona add btt ida a ki 15 Ve EE Anne eons een ca ee eu ae nee canada ee 20 Vl T stallation of Supporting Clamp Tor Laptop PCB asus seca een esate deere eee SE Ee 24 Vi Alarm Me Tuc On and SOLUTIONS 4 cies sr E ondo pde Odea ara de o iia 26 CI A e o o II ee eee eee eek os 27 IX KIDI R450A Technical ParaMel OC Sconisc in veo EE eee ER de EE ees Eero 28 PDF 4E pdfFactory Pro PIR AkOlSE www fineprint cn I Instructions on Installation and Operating precautions Assembling Site To ensure security and avoid possible damages the Rework Station should be located where it complies with following conditions Away from inflammables Fr2. time is settable after desoldering removing process completes PDF cee ERY pdfFactory Pro AMARA www fineprint co IV Introduction of Touch Screen Control 1 Main Menu Picture 1 Peak Temp display the highest temperature the 1 thermocouple detected during heating process clear away the latest record value when restart heating Vacuum vacuum start switch click it vacuum on button color becomes brown Reset it vacuum off button color becomes white Cool start or stop cooling fan by hand Remarks forbid starting it during the heating and stopping it during the cooling time Hold hold the current segment temperature during the heating process Solder click it and soldering action starts with the temperature profile currently selected Desolder click it and desoldering action starts with the temperature profile currently selected Segldx the current segment No the upper temperature profile runs to Upper the actual temperature of upper heater Lower the actual temperature of lower heater Bottom the actual temperature of bottom IR panels 1 TC display the actual temperature of thermocouple 1 on the port 2 TO display the actual temperature of thermocouple 2 can expand to two way thermocouple ports Remaining time the remaining time for the upper heater in the current stage Lo PDF SEH pdfFactory Pro 9H
3. to make BGA s diagonal and the reball kit s diagonal match together only in this case the BGA is located in the center of the reball kit finally lock the four Locating block locating block it fix it ee a ur E hi ie Ce Apply solder flux Screw adjusting the gap Reball kit s diagonal between BGA and stencil 5 3 Put the cover with stencil inside over the kit then move the stencil lightly to make its holes match the BGA pins In case this method is not good enough to make stencil s holes and BGA pins match each other pay attention to the deviation place remove the cover frame release the screw readjust BGA and repeat all those actions only to make sure the stencil s holes match the BGA pins finally lock otherwise you have to fine adjust the stencil PDF HEH pdfFactory Pro wWWAHARA est www fineprint cn Final lock ds ad be CCE SN CEET CC SST A Adjust stencil to make RE its holes match the BGA pins 5 4 Adjust the gap between BGA and stencil By adjusting the Screw to make the gap between BGA and the stencil 2 3 3 4 of the ball diameter Make sure one hole for one ball going through only and it is convenient to take out the stencil 5 5 First exam if the solder ball size matches the chip and stencil second put it on the stencil as the following picture shows then shake the whole kit lightly to let the ball drop to the BGA land through the stencil s holes F
4. AHARA est www fineprint cn BGA chip is covered by upper nozzle completely finally lock the positioning mechanism for clamping As shown in the following diagram PCB put on the stage of clamping Knob for lock Clamping device PCB positioning mechanism for clamping Conclusion A qualified board clamping should be as follows The whole PCB must be inside of the bottom area IR heater so that is can be heated evenly The upper nozzle must properly cover the BGA so that the chip can be heated evenly Besides the cores of BGA chip upper and lower nozzle must be in one line Observe bottom of PCB to make sure the supporting pillar and bottom nozzle can support the surface of the PCB The upper nozzle heating position lowest position is Imm away from the BGA surface 3 Remove Desolder 3 1 Clip PCB to the board supports clamp and fix the PCB as what we introduced as above 3 2 Select or set a suitable profile click Desolder on the touch screen the system will perform desolder process When heating completes it will alarm Meanwhile the vacuum is ready it will buzz when the pen starts vacuum Rotate the knob to lift the upper heater head then immediately plug the hole of the vacuum pen with the thumb and take the red tip of the pen close to the surface of BGA to pick it up from the PCB Release the vacuum pen the BGA will come down from the pen Then the cooling fan starts work Cooling finishes Take th
5. BGA and the thickness of PCB The thicker PCB is the more temperature in lower part we need to increase 3 Profile setting for South Bridge and North Bridge is almost the same But exactly NB North Bridge needs a little more temperature than SB South Bridge usually a few degrees only For the two store VGA on laptop motherboard we need to increase temperature in lower part and decrease temperature in upper part a bit in stage 4 of upper part set 210 220 C The reason why we do so is that high temperature in upper part will damage the small chips on the VGA PDF sce EAI pdfFactory Pro PIR AO www fineprint cn VI Installation of Supporting Clamp for Laptop PCB Usage of clamps for laptop PCB l We offer a set of clamps for laptop PCB along with the machine 6pcs as shown in the following picture Zs The clamps are fixed on the tapped hole of PCB supports according to the PCB size fixed by rotating the knob as shown in the following picture Tapped hole PDF SEH pdfFactory Pro whHheAS GIS www fineprint cn 3 Clamping laptop PCB put PCB on the supports make sure the cores of BGA upper nozzle and lower nozzle are in a line Adjust PCB clamping device move the clamps to the holes on PCB and fit then fit the knob on the supports finally pull the clamps tight before tighten the knob to make the PCB neat Refer to the following picture Locking the PCB PDF HEH pdfFactory Pro wWWAHARA est www fin
6. IWAS GIS www fineprint cn Heating time the total heating time Remaining cool time cooling time countdown when the cooling fan starts the cooling fan stops when counting down to 0 Reflow time to analyze the time when the 1 thermocouple temperature exceeds solder ball melting point during the reflow the temperature rises from ball melting point to the peak temp and then drop from the peak temp to the melting point Main menu as show as picture 1 Advanced menu to manage set and display the temperature profile parameters Assist menu to include auto profile PCB bake and BGA reballing operations 2 Advanced menu Profile No ST 2 S3 4 5 6 Upper Time Lower Time Others Bottom Temp i Reflow Temp i Alarm Temp t Cool Time Upper Air l Lower Air Nozzle size Speed Speed Ion Main Menu Assist Menu Picture 2 Profile No the current profile number Number range 1 49 Save to save the current values to the database of background system permanently Segment No S1 S8 the temperature profile segment number Upper C the set temperature in each segment for the upper part Time S the constant temperature time in each segment Lower C the set temperature in each segment for the lower part Time S the constant temperature time in each segment Bottom Temp the set temperature for the bottom IR panels Reflow Te
7. e PCB out from the supports PDF SEH pdfFactory Pro 9HIWAS GIS www fineprint cn Distance 1 2mm between nozzle and BGA Cover the hole with thumb Pick up the BGA after desoldering Vacuum pen s hole 4 Clean Land The PCB land and BGA land must be cleaned in a short time after desoldering Because the damage to the land is small while the PCB or BGA haven t cooled down completely Please refer to the following steps Cleaning PCB is the same As shown as following diagram 4 1 Prepare a soldering iron with temperature 370 C for lead free chip and 320 C for leaded chip 4 2 Apply a little layer solder flux to BGA equally 4 3 Mop the chip with the soldering iron to clean it 4 4 Take a wick to clean the land until it is neat 4 5 Wipe pad To ensure the reliability of BGA soldering wipe the pad with some volatile solvent such as industrial alcohol PDF HEH pdfFactory Pro wWAHARA ENE www fineprint cn Apply solder flux with Mop the pad with brush soldering iron 5 BGA Reball 5 1 Choose a stencil a reballing kit and proper solder ball that match the BGA put the stencil between the kit s frame and cover then screw up to lock the stencil But please do not lock it tight so that 1t can be fine adjusted and moved a PDF HEH pdfFactory Pro IATA est www fineprint cn 5 2 Apply solder flux to BGA equally then place BGA as the picture showing below adjust the locating block
8. eck if the BGA melted with nipper when the measured temp up to 190 C It is leaded BGA if the ball melt It is lead free BGA if the ball melt when 217 C 2 Select proper profile based on BGA size and PCB thickness We need to increase the 18 PDF sce EAI pdfFactory Pro iwWHIWeA Gt www fineprint cn bottom temp 1f the PCB is too thick 3 For usual computer board the temp setting are similar The temp for north bridge is several degrees higher than south bridge In case the notebook PCB the lower temp setting is high with the upper temp at 210 220 C for the display card If the upper temp setting 1s high the balls on video memory will melt that will result in failed soldering PDF x4 pdfFactory Pro AMARA www fineprint cn V Creating a Profile To set BGA temp profile insert the wire sensor into BGA to check 1f the profiles meet the requirements Our company provide with lead free and leaded profile for reference Entry parameter setting screen set the profile parameters as per various BGA types as following Time Time Gud Tire AA Advanced Menu Assiat Mena Leadfree profile setting Fig 1 During the whole heating process there are 8 stages from preheating to cooling but usually only 5 stages are enough and available 1 PRE Stage 1 preheating the board in this stage temperature is low usually below 100 C 2 RISE Stage 2 temperature rising in this stage we want temp
9. ee from splashing of water or other liquids Free from the direct airflow impact from air conditioner heater or ventilator With good ventilation dry and free from excessive dust 9 4 0509 Stable and flat location that is free from vibration and shock Power Supply Power and voltage should meet the below requirements Use the power supply with little voltage fluctuation Voltage fluctuation AC220V 10 Frequency fluctuation 50 60Hz 0 3 Space requirements To facilitate operation and maintenance when we have to move the machine forward backward and turn it it is required to reserve a room that is gt 300mm far from the back Operation Precautions While operating the rework station pls follow the following precautions 1 After switching on the power supply firstly check 1f there is airflow blowing from the PDF SARA pdfFactory Pro PIR Gt wm fineprint cn upper lower hot air nozzle If not it is prohibited to start heating Otherwise the heater will get burnt 2 Set different profiles for various BGA The maximum temperature setting of any segment of the profile shall be less than 300 C Refer to the BGA tin bead welding profile while using the lead free rework 3 Check the PCB land and BGA tin bead one by one before mounting BGA After mounting check the appearance one by one If any abnormal symptom occurs stop mounting and check the temperature immediately The soldering can be continuously performed
10. eprint cn VI Alarm Malfunction and Solutions pa Upper part heating abnormal 1 1 Reason a After starts heating with the power consumption of more than 99 1f the practically sensed temperature is below 150 C the upper heater should heat up at a speed of more than twice of the it s normal b If the practically sensed temperature is over 150 C the upper heater should heat up at the speed of 0 1 C S c If any of the above two situations can not be qualified the system will give alarm keck 2 Troubleshooting a make sure the temperature parameter setting 1s correct b check whether the blast blower upper heating coil and upper temperature sensing wire is working No Lower part heating abnormal 2 1 Reason After starts heating with the power consumption of more than 99 if the practically sensed temperature is below 150 C the lower heater should heat up at a speed of more than twice of the it s normal speed If 1t can not reach that temperature standard continuously for 5s the system will give alarm 2 2 Troubleshooting a make sure the temperature parameter setting is correct b check whether the blast blower lower heating coil and lower temperature sensing wire is working PDF sce EAI pdfFactory Pro iwWHIWeA Gt www fineprint cn Vil Maintenance In order to guarantee the machine function and prolong service life of the machine during usage we have to do some maintenance o
11. erature rise quickly so we usually set 205 C for lead free and 190 C for leaded 3 Cons Stage 3 keeping temperature constant in this stage we keep a constant temperature of 20 30 C lower than stage 2 so as to wipe off the impurity on the board because during this period the flux is volatilizing which does good for wiping off the impurity 4 REF Stage 4 ball melting and reflowing in this stage the ball begins to melt and reaches to the peak so the temperature should be high usually is highest and time should be long 5 REF Stage 5 reflowing from the peak to ball s melting point in this stage temperature must be lower than Stage 4 and time usually is 5 10S in upper heater PDF EH pdfFactory Pro wha SIS www fineprint cn Insert the wire sensor into the BGA to test the temp of balls Testing temperature Fig 2 6 Check the PCB to be repaired and confirm it is leaded or leadfree E g PCB is leadfree of course BGA also leadfree First of all we choose a leadfree profile and check the settings as in shown Fig 1 Second clamp the PCB to the supports and insert wire sensor into BGA for testing temperature Third start desoldering as in shown Fig 2 When heating completes look over the Analyze column to check the preheat time reflow time and max temperature peak whether they meet the requirement of leadfree technology as in shown Fig 1 7 If every parameter in Fig 1 meets
12. fter adjusting lock the forward backward handle and fix the heater not moving forward backward Then lift the upper heater If need to rotate upper heater loosen the upper heater rotate lock If not tighten it PDF HEH pdfFactory Pro IATA GS www fineprint cn Knob for locking the upper heater from Diagram moving forward backward Knob adjust Knob for locki Adjust the position of nozzles OD acJusung Upper AS ne pper heater up down heater from rotating 2 4 Adjust PCB clamping device and PCB support bar close up the clamping device and support bar both sizes before putting PCB on it then lift the PCB support pillar which can be adjusted to a proper position according to PCB size and make it be in line with the stage of the PCB clamping device which prevents the PCB from getting deformed As shown in the following picture PCB support pillar Hole for putting Ca support pillar 2 5 Put PCB onto the support bar then align BGA chip with the upper and lower nozzles PCB clamping device make their cores in one line Adjust PCB clamping device till the board 1s in the stage of the clamp device As shown in the following diagram 2 6 Lower the upper heater head adjust PCB forward amp backward make sure the upper nozzle can cover the whole BGA chip then lock the positioning mechanism for clamping Meanwhile adjust PCB clamping device left amp right make sure the whole PDF HEH pdfFactory Pro wWW
13. inally check whether every pin has been reballed make sure no pin missing then we can put the spare balls aside and take out the cover note that tilt the kit while taking out the cover in case that the reballed balls go out from the holes of the stencil After that the qualifiedly reballed BGA can be taken out At this time if some pins found missing not yet reballed we can make it up by a right tweezers After reballing completely recollect the spare balls 5 6 When change for other BGA chip of different size as well as solder ball please repeat steps 1 4 PDF HEH pdfFactory Pro wWWAHARA est www fineprint cn Put solder ball on stencil Tilt the kit Put the spare balls aside 6 BGA reball soldering 6 1 Put the BGA with the balls on the heating area and then solder the balls on the BGA land Setting the soldering temp 230 C for leaded 250 C for lead free 6 2 After setting temperature start the soldering station and wait for the temperature going up to the required value and keep constant temp 6 3 When constant temp put the reballed BGA onto the soldering station with a high temperature paper underlaid to heat meanwhile use a hot air gun as a assistant heating from the upper surface 6 4 When the balls are melted they become shining liquid and line up Then move the BGA to cooling station to cool down Soldering finishes MMP HR A PDF HEH pdfFactory Pro wWWAHARA est www fineprint cn 7 Apply so
14. lacing the heater for free for the previous mentioned reason PDF sce EAI pdfFactory Pro iwWHIWeA Gt www fineprint cn II Introduction of Rework Station KID R450A BGA Rework Station KID R450A made by W KIDI has 3 heaters Upper Heater Lower Heater and Bottom IR Heater The upper and lower heaters heat directly towards BGA part to ensure BGA gets enough heat to reach the melting point to come to good welding quality The bottom heating zone is large area IR heating board for preheating the whole PCB board to insure even heating and prevent the PCB get deformed KID R450A Diagram R 4 E E E A E 14 ee x el I NE ees WT e SS Ge ii I gt E EE ma z e a rn A j Pa e z P a tin pa PDF HEH pdfFactory Pro IAF ARAS UNE www fineprint cn Parts name 1 Knob for fine adjusting the height of the upper heater 2 Knob for locking the upper heater from moving forward backward 3 Handle for locking upper heater from rotating 4 Knob for adjusting upper heater up down 5 Upper heater 6 Upper nozzle 7 Lower nozzle 8 Lower heater 9 Knob for adjusting the lower heater up down 10 Vacuum pen 11 USB port 12 Temperature sensor joint 13 Touch screen 14 Knob for locking PCB jig 15 Knob for positioning PCB 16 LED lamp 17 PCB supporting bar 18 PCB clamping device 19 Bottom IR heating board 20 Cooling fan 21 Powe
15. lder flux 7 1 To guarantee soldering quality make sure that the PCB land is free of dust before applying solder flux The best way is to wipe the land before applying solder flux every time 7 2 Apply a layer of soldering flux on the PCB solder land with a brush pen Excessive flux may result in the balls shorted in reverse it easily causes missing solder So the soldering flux coating shall be even with a proper amount so as to remove the dust and foreign materials from the BGA balls and improve the welding effect Applying solder flux to BGA is the same 8 Mounting Fix the PCB on the station Mount the reballed BGA on the PCB in right position When positioning align BGA land with PCB land by referring to the silk screen frame Note that the direction sign on BGA should be corresponding with the one on PCB 9 Solder 9 1 Clip the PCB with renewed BGA placed to the supports exam the alignment of BGA and PCB adjust the supports 9 2 Set or choose an appropriate profile according to the PCB type press Solder button on touch screen it will perform soldering process When finish it buzzes to alarm meanwhile cooling starts as well The cooling time can be set in the profile Then lift upper heater and put it aside When cooling completes take PCB out of the machine Notes The difference between Solder and Desolder process is the way of cooling i e cooling starts right after soldering completes but cooling starts 8 seconds
16. mp to analyze the 1 thermocouple over the melting point temperature time 16 PDF sce ERY pdfFactory Pro PIR AO www fineprint cn of soldering ball Alarm Temp the high temperature alarm when system reaches this alarm temperature value Cool time the running time of the cooling fan after heating finishes Upper air speed control the air speed for the upper heater input range 1 3 1 2 3 is corresponding to low speed intermediate speed high speed Lower air speed control the air speed for the lower heater input range 1 3 1 2 3 is corresponding to low speed intermediate speed high speed Nozzle Size the corresponding nozzle size for the current profile used 3 Assist Menu SOE ease Profile Standard 7 BRA Soldering Parameter LU Picture 3 Auto generate Profile Standard mode suitable for most of common PCB boards and BGA without special requirements in this mode lower temperature is a little higher than upper temperature High Temp Top Mainly for BGA with heat sink itself and good heat resistance or some BGAs under which there are some heat reactive components In this mode upper temperature is higher than lower temperature Desoldering and soldering mainly depends on the upper heating and lower heating is as an adjunctive one High Temp Bottom mainly for Crystal bare BGA and double layer BGA In this mode lower temperature is higher than upper temperature De
17. n the system regularly as follows Components name Upper heater Up amp Down Drive mechanism on upper heater Electronic box Forward amp Backward Driver on upper heater Rotating part of upper heater Bottom IR heating panel PCB clamps Maintenance Maintenance method period Open the cover clean the fan with high pressure air 1 month Apply some butter on lead rail rack gear and other drive month mechanism Open the front cover of the machine use vacuum cleaner to 3 months suck the dust and dirt and check whether the components fixed well Apply some butter on lead rail rack gear and other drive 1 month mechanism Apply some butter on lead rail rack 1 month gear and other drive mechanism Clean the heating tube with dry 1 day cloth do not use wet one Apply some lubricant to the PCB supports and shaft of support 1 month guiding axle Al PDF sce ERY pdfFactory Pro PIR AO wm fineprint cn IX KIDI R450A Technical Parameters Technical Parameters Applicable PCB Workable area 460X370mm Max PCB thickness 3mm Max size 60mmX60mm l6sections of Temperature control programmable temperature control setting Power consumption Dimension LxWxH 620 600 650mm System Parameters Power Input voltage AC 220V 4KW for requirement PDF x4 pdfFactory Pro iwWHIWeA Gt www fineprint cn Shenzhen W KIDI Technology CO LTD FRUIT POLI RA A Please kindly understa
18. nd we will not keep you informed if there are some revised parameters due to we have been developing and improving the technology always SHENZHEN W KIDI CO LTD E mail bgastore rocketmail com 29 PDF EH pdfFactory Pro whHheAS GIS www fineprint cn
19. oes not meet requirement 10 1 The solution is to prolong time in stage 4 or 5 The same as point 9 2 i e to prolong how much seconds it misses in the reflow time reflow time must be between 40 90s 10 2 Suppose the preheat time and reflow time are too long preheat time over 60 90s reflow time over 40 90s we can take a reverse method of the above 10 3 After changing the setting we get a new profile Also we have to test this new profile again The method of testing is the same as what we mentioned in Fig 2 Even this profile is still not qualified we have to change and readjust setting again and again until it is qualified then save in the machine ert Ma Te EE Advanced Menu Assist Mena Leaded profile setting The method worked on leaded BGA chip is the same as lead free one Rework Skills 1 If we are not sure the BGA is leaded or leadfree for safety concerns we take a leaded profile to test To test means to desolder a BGA with the wire sensing inserted During heating when TC on the touch screen goes to 190 C flip the BGA with a tweezers 22 PDF sce EAI pdfFactory Pro wHIWRA Gt www fineprint cn Here if the balls are already melted we can say it is leaded In reverse we can say it is leadfree Only when TC goes to 217 C can the BGA balls be melted we might know it is leadfree 2 Usually we select or make an appropriate profile according to the size of
20. only after the proper adjusting Otherwise it may damage the BGA or PCB plate 4 Regularly clean the surface of the machine In particular keep the IR heating board surface clean Prevent the dirt drops on it The dirt may affect the proper heat radiation and result in poor welding quality as well as considerably reduce the lifetime of the IR heater 5 Untrained operator can t change any set parameters 6 Avoid electric fans or other equipments blowing toward to the rework station while it is working or it may cause the heater s abnormal temperature rise and the work piece will get burnt 7 While it is working don t put any stuff on the heating area Otherwise the stuff will get burnt The PCB should be put on the supporting frame 8 Itis prohibited to touch the heating area to avoid burn while working 9 While working keep the rework station away from the flammable sprays liquid or gas 10 Don t remove the front panel or cover of the electric cabinet that is with HV high voltage components in that may cause electric shock 11 In case the metal or liquid falls into the station while it s working Shut off power and pull out the plug Clean away all the dirt after the machine cools down It will give out bad smell if there is dirt when it restarts Note Never clean the IR heater heating board with liquid Use fine sand paper to rub away the stubborn dirt on the IR heating board We will be irresponsible for rep
21. r switch 22 Lamp on off 23 Laser light on off PDF x4 pdfFactory Pro iwWHIWeA Gt www fineprint cn Ill BGA Operating Procedures BGA rework on PCB should comply with the following procedures 1 Bakeout Both PCB and BGA must be baked in a constant temperature oven at a temperature range from 80 C 100 C for 8h 20h The purpose of baking is to dehumidify the PCB and BGA in case blowout during rework Table 1 Moisture sensibility grade Context Saving Grade Time l o RH relative humidity e aen 48hs lt 30 C 60 RH 5a 24hs lt 30 BOC RH RH eee time Table 2 Baking time Seal Humidity l Baking time thickness sensitivity grade O e poo 14hs 31hs Cp p 37hs PDF SARA pdfFactory Pro PIR Gt wm fineprint cn 2 Clamping board 1 1 To select proper upper nozzle and lower nozzle suitable for BGA sizes 1 2 Upper nozzle is fixed on the upper heater head Tighten the screw to fix the nozzle that can be adjusted as per BGA position and angle Lower nozzle is fixed on the lower heater Rotate the up down fine adjusting knob to lift the nozzle and then tighten the screw to fix the nozzle Diagram Screw for fixing upper nozzle Knob for up down adjusting lower nozzle Screw for fixing lower nozzle 2 3 Adjust upper and lower nozzle positions rotate the knob to lower the upper heater by moving upper heater backward forward make the centre of upper nozzle and lower nozzle align A
22. requirement that means this profile is suitable for this BGA then we can save 1t as LF BGA model number Next time we repair the same BGA chip as this no need to test the profile any more but use it directly In reverse we havetochangesettingsthensave 8 If the max temperature peak TC is lower or higher than the standard required temperature 245 leadfree we can take LU a method as follows e g The tested Max temperature is 220 C 245 220 x1 2 30 e g The tested Max temperature is 260 C 245 260 x1 2 18 We put 30 or 18 to offset then we can get a suitable profile 9 If the preheat time is too short which doesn t meet requirement 60 90s leadfree there are two solutions to make a suitable profile 9 1 When the profile running finishes stage 2 with a temperature TC below 150 C we can increase the set temperature or prolong the time in this stage on both upper and PDF SEH pdfFactory Pro 9HIWAS GIS www fineprint cn lower parts The standard requirement is that TC wire sensed temperature must up to 150 C when stage 2 ends 9 2 The profile running finishes stage 2 with a temperature TC of 150 C or more In this case we should prolong the time in stage 3 The prolonged time must be the number missing in preheat time 1 e We prolong how much seconds it misses in the preheat time preheat time must be between 60 90s 10 If reflow time is too short below 40 90s which also d
23. soldering and soldering 17 PDF SEH pdfFactory Pro whHheAS GIS www fineprint cn mainly depends on lower heating and upper heating is as adjunctive one Special mode Mainly designed for desoldering of glued boards and some boards with requirements for low peak temperature leaded leadfree to integrate the process change for leaded and leadfree profiles internally Auto calculate to click it to perform desoldering while heating system auto calculates and changes target profiles PCB Bake Setting Temp the set temperature for bottom IR Actual Temp the actual temperature of bottom IR in current Output limit the Max output power of bottom IR input range 0 32000 32000 corresponds to 100 power Setting time to set the bake time system will stop heating automatically when time is up Remaining time the time countdown of the whole baking process Run start button for baking BGA Reballing Setting Temp the set temperature for lower heater Actual Temp the actual temperature of lower heater Air speed input range 1 4 Setting time the required heating time for the reballing Remaining time the countdown of reballing Run start button for reballing Ak Maintenance skill 1 When we are not sure 1f the BGA is lead free or leaded for safety we had better treat the BGA as leaded Enter the leaded temp profile insert the wire sensor into BGA start desoldering on the touch screen Ch
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