Home

SICOMP IMC System

1. Figure 2 3 Location of the networks to be removed view of the configuration side Combination of boards Pure 16 bit I O boards cannot be used with 8 bit bus masters SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 25 SMP16 System 2 7 List of References 1 SMP16 Bus Spezifikation version 1 0 dated 12 02 93 SICOMP IMC System Manual 2 26 J31069 D2001 U001 A0 7618 AMS System 3 Table of Contents 3 1 System Overview sssulssessl hn 3 2 Function Descriptlon i sssssssde kb RE p Rd RREREE ERE E Rd 3 2 1 Bus Elements os osse xp tne teteetdvet duced RN EEN Sete 3 2 2 Integration of the SMP16 and iPCI System in the AMS System 3 3 General Technical Description 000 0 ccc eee eee eee 3 7 3 4 Signals of the Bus Interfaces 006 c cece eee eens 3 9 3 4 1 Information on Table 3 3 2 0 ects 3 10 3 4 2 Description of the Bus Signals 0 cece eee eens 3 11 3 5 How the AMS Bus Functions 3 5 1 InitiallZatlon i2 eee eee a Rhee debe eee oben 3 5 2 Data Transmission 0 cece ete ees 3 5 3 Interrupt Operation sopena cece eet 3 5 4 Bus Allocation Control 0 00 cece cece enna 3 6 Combination of AMS SMP16 and SMP Components 3 20 SICOMP IMC System Manual J31069 D2001 U001 A0 7618
2. 482 6 19 5 08 20 32 11 T nummuuuguuguuuuu nuuguugguggguuuuyguuuJuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuuiuuuut Hd n H a 2 Oi u m See a Seo Se Se oS 426 72 84 TE 465 1 Figure 8 2 Dimensions of an 84 TE width subrack of type ES902C 8 2 Receptacles Receptacles such as housings frames and cabinets are not included in the prod uct family of SICOMP IMC microcomputer board systems For information on the physical dimensions of receptacles see the catalogs of the Automation and Drives division for SIPAC layout systems and power supplies of Siemens AG and contact your local Siemens office SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 3 System Layout 8 3 8 3 1 Subracks Subracks are used to physically hold the boards and their electrical connections Guide rails are used to hold the boards while plug in connectors are used to hold the electrical connections Note For details not covered here see the ET1 catalog concerning the inch layout sys tem ES902C of the Automation and Drives division of SIPAC layout systems and power supplies of Siemens AG and contact your local Siemens office The subracks included in the product family of the SICOMP IMC microcomputer board systems are based on the ES902C system They are available in various versions i e fully mounted with wiring and tier shi
3. 1 Check accordingly Notes on installation remarks on customer specific or other software SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Assembling Center Board settings Type Slot Top middle bottom Address range s From hex to hex Address area PC IO SMP IO MEM MMIO Other settings different from plant presettings Type Slot Top middle bottom Address range s From hex to hex Address area PC IO SMP IO MEM MMIO Other settings different from plant presettings 1 Cross out what does not apply SICOMP IMC System Manual J31069 D2001 U001 A0 7618 6 5 Assembling Center Special wiring Slot Pin No Slot Pin No TITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITITIT T 1 Specify if necessary o top m middle u bottom SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Power Supplies 7 Table of Contents 7 1 Connecting Plug Connector 0 00 cee eee eee eee 7 2 7 2 Electrical Characteristics 000 cece eee eee 7 2 1 Electrical Operational Characteristics 000 eee e eee 7 2 2 Indications and Operation 0 0 cece eee 7 2 3 Definition o
4. SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Crimping other contact elements Flat plug connectors plug in sleeves contact sockets pins and core sleeves are usually handled in accordance with DIN 41 611 In individual cases they are also handled as line cross sections of under 10 mm e g core end sleeves in accor dance with DIN 46 228 and also in accordance with VDE 0220 T1 2 Table 8 7 Possible crimp contact elements Designation DIN Standard or Drawing Crimp Type Manufacturer Plug in sleeve DIN 46 245 Closed with insulation sleeve without encompassing the in sulation Max of 1 mm Plug in sleeve DIN 46 247 Open shape B Epo encompassing insulation Max of 1 mm Flat plug connector DIN 46 248 Open shape B e B A encompassing insulation Max of 1 mm Socket AMP company Open shape B module 4 m p encompassing insulation Pin AMP company Open shape B Mate N Lock CE encompassing insulation SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 39 System Layout 8 8 6 Insulation Displacement Connector Technique With this technique an insulated conductor i e flexible lead or solid conductor is pressed into a fork shaped contact with a special tool The sharp corners of the contact edges cut through the insulation and together with the force of insertion create a gas tight contact between conductor and fork c
5. AC DC Bus backplane 1 with higher OV e 9V gurrentconsump pem tion at 5 V 12 V e 12 V 12 V Sg 12V OV V OV OVF s NS OVF 45 VE c Np 5 VF PF lt N BER DC DC o 9V Bus backplane 2 d zu p HEY Een i PE p tion at 5 V NETS 5 OV NENA M A o 5 VF P 9v o 3 3V No EE d o 8 3 VF PES o yE o OVF Alterning current power network Figure 8 22 Power supply wiring for a system with two backplanes broken lines optional SICOMP IMC System Manual 8 46 J31069 D2001 U001 A0 7618 System Layout 8 8 10 ZN Line Installation The following points concerning cable installation require special attention e Lines should be installed so that connection points have pull relief and are easy to access e Lines may not be subjected to the following Be led through metal plate leadthroughs without rubber sleeves Touch components such as transformers heat dissipaters and so on Beinstalled so that they can be pinched Be damaged by moving parts e g fans Cable binders must be made of non conductive materials The insulation sleeve of cables may not be cut into when the cable binders are tightened e Clamps or cable binders must be used to provide the ends of bundles of lines with pull relief on the ends so that forces cannot affect the connection points Warning Cables must be installed saf
6. Correct wiring Wrong wiring Figure 8 21 Wiring of multiple connections With systems with more than one bus backplane the power supply lines must be connected in a star to the power supply board See figure 8 22 SICOMP IMC System Manual 8 44 J31069 D2001 U001 A0 7618 System Layout Signal and sensor lines The voltage drop on the load lines of high voltage outputs can be compensated for up to a maximum value by using sensor lines See chapter 7 The applicable voltage is taken as close as possible on the consumer flat plug connector of the bus backplanes and connected via the sensor lines with the ap propriate connections of the H15 socket terminal strip The respective sensor line pair e g 0 V 5 V should be installed as twisted pair or close parallel and as separate as possible from other wiring Note With systems with two or more bus backplanes the sensor lines must be con nected to the bus backplane with the greatest power requirements The bus backplanes may not be circuited in series In an environment with much interference a 0 V line should also be installed in addition to the lines of the error signals of the power packs For details on the signal and sensor lines see the product documentation of the power supplies used SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 45 System Layout Example of wiring for the power supply
7. 000 cee eects 12 2 Electrical Requirements 2 000 c eee eens 12 3 Electro Magnetic Compatibility 0 eee eee 12 9 1 Requirements sce eei Recent feret one Aad ei het ede ta 12 3 2 Possible Sources of Interference sssssluselellssessss 12 3 8 Measures for Suppression of Interference 12 4 Climatic Requirements 0 000 cece cence tenes 12 5 Physical Requirements 00 drent PETEERE ees 12 6 Electrical Safety ce aissy sormiani cece cece teen eene 12 6 14 Requirements at the System Level 000 cece eee eee ee 12 6 2 Notes on System Integration 00 cece eee eee 12 7 EG Statement of Conformity cessi croite 0 cee eee SICOMP IMC System Manual J31069 D2001 U001 A0 7618 12 1 Environmental Requirements 12 1 General Information Adherence to the specifications in this chapter will be documented with a type test during development of the product A product from a pilot lot or preliminary run will be checked for adherence to the technical requirements contained in the specification requirements or the technical specifications To ensure that products fulfill the particular tasks required individual SICOMP IMC boards are tested in a complete SICOMP IMC system typical for the application Ideally this system consists of high end CPUs and additional digital and or analog components which handle indication measuring or control tasks In add
8. SIMATIC S5 SICOMP IMC Figure 10 7 SICOMP IMC SIMATIC link via PROFIBUS PROFIBUS The right network for every task 10 18 PROFIBUS permits both flexible network configurations and use under extremely rugged industrial conditions Profiles with various grades of performance have proven to be very advantageous since they permit optimum adjustment at field and cell levels A few examples e PROFIBUS FMS Fieldbus Message Specification Ideal for communication between programmable controllers in cell networks with a small number of stations e PROFIBUS DP Decentral Periphery This protocol profile for connection of decentralized I O e g SIMATIC ET 200 offers very fast reaction times e PROFIBUS PA Process Automation This powerful protocol profile is based on PROFIBUS DP with intrinsically safe transmission technology in accordance with international standard IEC 1158 2 The SEND RECEIVE interface has been optimized for communication between SICOMP IMC and S5 S7 controllers A wide variety of devices are available to make implementation of PROFIBUS quick and inexpensive for the user For manufacturers of field devices Siemens offers ASICs for connection of the systems Thanks to the openness of PROFIBUS standardized components of different manufacturers can also be connected of course Configuration commissioning and trouble shooting can be conveniently carried out from any point This makes the freely select
9. Memory Mapped I O This signal can be used to address slave boards via an ad dress window in the 1 Mbyte memory address area of the SMP16 bus When direct input output accesses are used its status can be active LOW or inactive HIGH During memory accesses of the primary bus master DMA or normal accesses its status is always active in the selected address area and inactive outside the selected address area If the secondary bus master has control over the bus the pri mary bus master must generate this signal from the waiting address signals or if this is not possible deactivate it SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System Table 2 6 Control signals of the SMP16 bus continued Signal Signal Direction Characteri stic Function RDYIN P gt Z OC Ready input Control signal for adaptation of the CPU and DMA controller to slow I O boards Although the SMP16 bus is a synchronous bus the master board can be forced by the RDYIN signal from the addressed slave board to leave the current command valid until the slave board is ready for conclusion of this command RESET Z gt P TP Reset Control signal to reset I O boards by the CPU RESIN P gt Z OC Reset input This signal can be used to reset a CPU The reset CPU then activates the RESET signal It can be activated e g during system startup b
10. 20 08 ET1 2166 FK 2 socket strip FK 2 multi point strip Figure 8 15 Dimensional drawing of the FK 2 front plug in connector SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 21 System Layout Accessories for plug in connectors Electronic 8 22 Counterparts for the multi point female pin and socket strips etc and housing covering caps etc used on the SICOMP IMC boards are available with order numbers in various Siemens publications Some examples are listed below e SBS Siemens component service Passive components and tubes and electro mechanical components The catalog offers you an extensive customer friendly immediate delivery source including direct contact with fast service warehouses immediate infor mation and direct booking e Plug connector data book Delivery directory e Electro mechanical components Siemens data books e Plug connectors for PC 612 printed circuits in accordance with DIN 41 612 Delivery program e SBM 383 subminiature plug connector Delivery program DC plug connector with BK MOD 421 422 module scale Delivery program This information is intended to make it easier to obtain accessories Other manufacturers or suppliers which are not listed here exist for the individual parts No guarantee is assumed for the correctness of this information We recommend always first obtaining information on delivery conditions current status of the deliv
11. The prewarning signal must fulfill important time conditions for the startup and dropping of the output voltages based on the input voltage The following values are binding for all power supplies Table 7 2 Time conditions for power failure prewarning signal Time Condition Typical Value Buffer time for data saving Min of 10 msec Startup time Max of 0 1 sec PF delay time 0 3 to 0 6 sec For the exact values of these time conditions see the product documentation of the individual products Power failure prewarning signal PF The power pack uses the TTL signal PF power failure to indicate the function status of the power supply Table 7 3 Meaning and characteristics of the power failure prewarning signal PF Signal State Characteristic Meaning Inactive high Ipp 5 mA source Input voltages within tolerance range Upf 2 2 4 V Active low Ipp 50 mA drop Input voltages outside the tolerance range Upp lt 0 4 V Remember time conditions SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Power Supplies O 5V PF 4k7 BC327 2k7 e O OV Figure 7 1 Internal circuiting of the PF signal output Power failure without PF Power failure with PF U D S G gt U S i 6 PF 1 Power failure buffering time 3 Buffering time 5 Booting ti
12. Pay careful attention to connecting the guide rails when installing boards power packs and so on Asshownin figure 8 16 the shoulders of the rail point to the right both top and bottom The pin of the first rail must be inserted into the second hole of the left hand side of the system frame The pin of the next rail must be inserted into the fourth consecutive rail and so on SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 25 System Layout 8 7 2 8 7 3 Mounting the Wiring Shield Plate The wiring shield plate is permanently mounted when the system module is deliv ered After the screws have been disconnected the wiring shield plate can be re moved from the back Care save the screws After the bus backplane has been wired replace the wiring shield plate Bus Backplanes The bus backplanes are screwed from the back to the profile rails of the SICOMP IMC subrack Adjusting the bus backplanes 8 26 Bus backplanes must always be adjusted so that the guide rails are exactly aligned with the socket terminal strips of the bus backplane This is particularly important for multiple row subracks 1 Secure the bus backplanes with a few screws so that they can still be moved easily 2 Insert two boards in the guide rails of two slots which are as far apart as pos sible 3 Press the boards into the socket terminal strips of the bus backplanes To make this easier you should move the bus backpl
13. Tolerance of the output voltage on delivery The deviation of the output voltage on delivery from the nominal voltage Uan The output voltage is measured directly on the H15 counter plug Any sen Sor lines are also connected there Measuring requirements Ue x Uen s fe fen la 20 1 X lan for all outputs Static regulation deviation of the output voltage Load regulation deviation for change in load on the output to be measured The deviation of the output voltage from the value of Ua at Ig 0 1 x lan when the output current is varied from lamin to lan The other outputs of the device are loaded with nominal current Measurement is performed directly on the H15 counter plug at Uen and fen Network regulation deviation for change in the input voltage The deviation of the output voltage from the value at Uen when the input voltage is varied between Uemin and Ugmax Measurement is performed directly on the H15 counter plug for sinusoidal alternating voltage Ue with fen Any sensor lines are also connected there All outputs of the device are loaded with nominal current Dynamic overswings of the output voltage dU Dynamic overswings take place when load jumps occur on the output This is characterized by the amplitude of the voltage drop dU or excess volt age dU during a jump from the lower to the higher value of the load cur rent or vice versa Measurement is performed directly on the H15 counter
14. CE seal Basis is the generic standards EN 50081 2 1993 and EN 50082 2 1995 CE conformity in accordance with EMC guidelines 89 336 EWG exists when the CE related measures described in EG statements of conformity have been inte grated Table 12 3 Test values for electro magnetic compatibility Specification Testing in Accordance with Interference immunity against discharge of static electricity ESD EN 61000 4 2 1995 Signal cables input output and bus cables Discharge through the air 8kV 1 Discharge on contact 4kV 1 Interference immunity against fast transient interference bursts EN 61000 4 4 1995 e Power supply cables for 120 230 V AC 2 kV 2 kV 2 Interference immunity against surge voltages 3 e Power supply cables for 120 230 V AC EN 61000 4 5 1995 1 kV symmetric 4 2 kV asymmetric 4 Interference immunity against electro magnetic fields 1 e Amplitude modulated HF 80 to 1000 MHz ENV 50140 1993 10 V m 5 80 AM 1 kHz Interference immunity against electro magnetic fields 1 e Pulse modulated HF 900 MHz ENV 50204 1995 10 V m 9 50 ED 200 Hz repetition frequency Interference immunity against cable conducted interference induced by high frequency fields e 0 15 to 80 MHz ENV 50141 1993 10 V9 80 AM 1 kHz Source impedance 150 Q Interference emission e Emission via the field e Interference emission via power cable EN 55022 1994 Limit va
15. Cabling Components of other product families can also be used if necessary A wiring and startup test is performed on the finished system Other tests are also available on request Forms The following forms should be used for duplication They are also available from your Siemens office SICOMP IMC System Manual J31069 D2001 U001 A0 7618 6 1 Assembling Center Selection 3HE subrack as system basis See also KT51 or KT1 catalog System Fan Backplane Prepared for Prepared for Switch board SMP 16 SMP 16 SMP16 SMP16 SYS562 SYS403 SV531 SV430 SMP16 SYS500 X None X SMP16 SYS501 X 16 EP X X SMP16 SYS502 21 EP SMP16 SYS503 X 18 EP X SMP16 SYS504 None X X Other 1 Check accordingly Bus backplanes Enter type and slot area 1 2 3 4l5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Configuration Enter board or position on piece list 1 2 3 4 5 6 7 8 9 10 11 12 13 14 20 21 Dummy covers Check empty slots to be covered 1 2 3 4 5 6 7 8 9 10 11 12 13 14 20 21 Locking Enter S for total locking and E for individual locking 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 20 2
16. Figure 8 19 Use of cable binders SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 35 System Layout 8 8 5 ZN Crimping With crimping multiple core conductors i e flexible leads are usually inserted with a bared end into a connection sleeve and crimped with a crimping or pneu matic tool The pressure created by this procedure is so great that a gas tight con nection between reshaped sleeve and conductor is created Warning Make sure that conductor insulation and contact piece are suitable for each other in accordance with paragraph 10 part 3 of DIN 41 611 For non standardized connection elements follow the directions of the manufacturer Only multiple core conductors e g flexible leads in accordance with DIN 41281 or DIN 51 881 are always suitable for crimping In exceptional cases copper or alu minum conductors may be used The tools i e crimping tool and hydraulic tools with inserts must be selected based on the conductor cross section the insulation diameter and the contact ele ments and may only be used for the contact elements specified by the manufac turer of the tool Warning Never add extra tin plating to multiple core conductors i e flexible leads before crimping Crimp connection shapes 8 36 Table 8 4 Crimp connection shapes Shape A Shape B W p e t e e SICOMP IMC System Manual J31069 D2001 U001 A0 7618
17. SICOMP IMC System Manual 7 2 J31069 D2001 U001 A0 7618 Power Supplies 7 2 Electrical Characteristics 7 2 1 Electrical Operational Characteristics Parallel and series circuitry Parallel and series circuiting of the PS outputs is only possible with a few older types Since these operating modes are no longer supported by all other types see respective product documentation we will not discuss them here Sensor line For high current outputs the voltage drop caused by load current on the resistor of the load lines and the connection terminals can be offset by connecting sensor lines up to a value of 0 25 V typical i e a total of up to 0 5 V typical For wiring see chapter 8 System Layout Shutdown For any shutdown or switchoff functions see the product documentation of the in dividual power supplies Overvoltage protection Input and outputs of the power supplies are provided with overvoltage protection On the input side a varistor between phase and directly grounded conductor offers protection against brief overvoltages The outputs are protected against internally caused device overvoltages at approx 125 of the nominal output voltage Uan by self recovering switchoff of the switch ing controller Outputs with small voltages are equipped with protective diodes SICOMP IMC System Manual J31069 D2001 U001 A0 7618 7 3 Power Supplies Protection against excessive temperatures With
18. Siemens Aktiengesellschaft Order no 6AR1950 7AA00 2CA0 Table of Contents SICOMP IMC System eeueeeeeeeeeeeee nnn nn nnn 2 SMP16 System iion vermieden Ferte Brie hodic made tme Je m a dated 2 1 System Overview 0 ccc ehh 2 2 Function Description siib ruepet it RRRG RS P SOEUR CURE es 2 2 1 Bus Elermients oo obs sh epe ERR ERE P ERRERETPEERAURAP ERE ES 2 2 2 System Architecture ssssssssssssssesss eh 2 3 General Technical Description 2 4 Signals of the Bus Interface 0 0 cece eee 2 4 1 Explanation of Table 2 4 2 0 ees 2 4 2 Description of the Bus Signals 2 5 Data Transmission on the BUS 0 c eee eee 2 5 1 General Description 0 0 cee cece eee eee 2 5 2 Data Bus Length riu ransreinsis ade eL sae dna aded e dod d eee e 2 5 3 Control of the Data Bus length with IOCS16 and MEMCS16 2 5 4 Read Operations sis esses isi e ee hee ace edle d eode a 2 5 5 Write Operations sssssssssssess III III 2 5 6 Slave Master Synchronization with RDYIN sssllesessses 2 5 7 Command Delays and Wait Cycles 0 cece eee 2 6 Combination of SMP16 and SMP Components ssuu 2 7 List of References sssssusssssslesess eee eee 3 AMS System 21 2 eI cued teen x em E UE EN RUNEE EN ERE 3 1 System Overview ssssssssssseses nn 3 2 Function Description ai sesuais eud aaiae giaa a aa di a eee 3 2 1 Bus Ele
19. number of slots and 1 slot 20 32 mm Figure 8 5 Length of a bus backplane SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 7 System Layout 8 3 3 Bus Coupling Boards Bus coupling boards are used to connect individual SMP16 bus systems with each other There are two types of coupling Coupling of two SMP16 bus system located underneath each other Master row with CPU board i Bus coupler Slave row with I O i Figure 8 6 Example of coupling two SMP16 bus systems located underneath each other Coupling of two SMP16 bus system located next to each other SMP16 system 1 SMP16 system 2 with CPU board with CPU board Bus coupler Figure 8 7 Example of coupling two SMP16 bus systems located next to each other e g dual port RAM coupling SICOMP IMC System Manual 8 8 J31069 D2001 U001 A0 7618 System Layout zs Caution Single wires may not be used to connect bus systems Coupling must be per formed via appropriate bus coupling boards The interrupt lines are an exception to this rule Twisted pair wiring i e interrupt signal and GND must be used for the interrupt
20. the data of the higher layers are inserted TCP protocol In addition to the UDP protocol the TCP protocol is the most used protocol of layer 4 Its primary task is to protect the data transmission of the IP layer For the spec ifications of the TCP protocol see RFC 793 In contrast to the IP protocol the TCP protocol is connection oriented and handles error monitoring and correction When errors in the data are detected at the re ceiver it requests the erroneous datagram again This procedure is repeated until the transmission is correct Double datagrams are also detected and eliminated in this way A slow computer is able to slow down the data flow when it cannot keep up with receipt TCP numbers the individual datagrams in sequence and as sembles them correctly again for the receiver TCP permits several services to use one connection simultaneously This is achieved with a two octet port number which addresses the individual services Fixed ports have been defined for stan dard applications SICOMP IMC System Manual 10 12 J31069 D2001 U001 A0 7618 Communication 10 1 3 HTTP Protocol In addition to TCP IP HTTP i e Hyper Text Transfer Protocol is one of the wid est used protocols of the Internet HTTP was especially developed for the trans mission of text graphics sound and video On the Internet it is used for commu nication between client and server The client requires a browser for communication Micr
21. 15 V outputs with other voltages is no longer SMP E427 A2 placed part of our product program SMP E427 A3 SMP E428 A1 SMP E432 A8 For 12 V only 0 5 A instead of 1 2 A Eos Change installation geometry Requires 3 slots instead of 2 not with SMP E428 A3 SMP E429 A3 Cannot be re 24 V outputs are no longer part of our product program placed SMP E430 A1 SMP E430 A6 Change installation geometry SMP E430 A2 SMP E431 A1 SMP E431 A6 No SD open pin 4 no more 12 V sensor SMP E431 A2 SMP E431 A3 Additional 2 slot front plate required Change installation geometry SMP E431 A5 SMP E431 A6 No more 12 V sensor Different pin allocation See table 7 5 Change installation geometry 7 10 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Power Supplies Table 7 4 Replacement boards continued Board Replacement Restrictions Conditions Board SMP E431 A6 SMP E431 A6 Change installation geometry to KS 5 from KS 6 SMP E431 A61 SMP E431 A6 Change installation geometry from KS 6 SMP E432 A5 SMP E432 A8 Additional power failure monitoring and sensors 0 V 5 V Change installation geometry Move guide rails H15 connec tor stays the same SMP E432 A6 SMP E432 A8 Additional power failure monitoring ohn Essen Change installation geometry Move guide rails H15 connec tor stays the same SMP E433 A6 Cannot be replaced SMP E434 A6 Cannot be 12 V outputs with 6 A are no longer
22. Climatic Requirements Requirements This chapter covers the climatic requirements for operation transportation and storage of the boards of the SICOMP IMC product family Requirements are spe cified for standard products Table 12 6 Climatic requirements for standard SICOMP IMC products Factor Operation Transportation and Storage Ambient temperature 0 C to 55 C 40 C to 70 C Relative humidity 10 to 90 10 to 90 Permissible air pressure 795 hPa to 1080 hPa 1 660 hPa to 1080 hPa Permissible temperature fluctua 0 5 K min no condensation tion but not to exceed 10 K in 30 minutes 1 At higher altitudes i e gt 2000 m reduced ventilation may make it necessary to reduce the maximum operating temperature and use a fan Ventilation When in operation electronic components convert part of the power fed to them into heat which must then be dispersed Depending on the type number and installation density of the components power loss may be substantial To dissipate this heat surrounding the housing and cabinet the following require ments must be met Free space of at least 5 cm below and above a system frame or fan module e If the permissible ambient temperature cannot be maintained with free convec tion forced ventilation must be used Air throughput of at least 3 x 75 m3 h per system frame with 21 slots Air current from bottom to top SICOMP IMC System Manual J31069 D20
23. OWS Pez OC 0 wait states This signal is activated by PC compatible SMP16 slave boards It tells the bus master that the current bus cycle can be performed without the permanently set wait cycles OSC Z gt P TP Oscillator The 14 31818 oscillator clock pulse for PC compatible SMP16 slave boards is supplied by the primary bus master SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System 2 5 Data Transmission on the Bus 2 5 1 General Description A data transmission on the SMP16 bus begins with the SMP16 bus master putting the address on the SMP16 bus It then activates the desired command During MMIO accesses by the primary bus master the MMIO signal must be activated before the command to prevent a misinterpretation by the slave board During write accesses the bus master places the data on the bus with the com mand During read accesses the slave board must supply the data as quickly as possible after detecting the active command The access is concluded when the command is deactivated by the bus master and the addresses are removed a short time later A slave board can use the RDYIN signal to stop the bus master during the access i e extend the access 2 5 2 Data Bus Length The master on the SMP16 bus generates either 8 or 16 bit accesses The desired data bus length is indicated to the slave with the BHEN signal The slave can react with the IOCS16 or MEMCS16 signals to tel
24. SICOMP IMC offers the right network for complex communication tasks at all lev els of automation The latest information from the factory floor reaches the office immediately and the office is able to modify manufacturing sequences without delays Industrial Ethernet Industrial Ethernet is a powerful cell network based on the IEEE 802 3 standard ETHERNET This open communication network was especially designed for the economical solution of demanding communication tasks in rugged industrial environments Key to its success are its impressive features such as speed 10 Mbit sec easy expansion openness high availability and worldwide use PROFIBUS Valves actuators and drives the field area contains a wide variety of compo nents Many of these components are located far away from computers or control lers An automation system must provide for all these factors Decentral I O de vices are used for this purpose in the field area today This area requires powerful open and rugged bus systems to ensure smooth com munication while keeping cabling costs low PROFIBUS is such a system In addition PROFIBUS can be used to establish cell networks with a small number of stations SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 3 Communication CAN Originally developed for the automotive industry CAN is increasingly being used today in automation applications Extensive error handling and high effective t
25. Special signal inputs on primary bus masters or interrupt con troller boards outputs of the interrupt requesting I O Used to interrupt the running program ICASO bis ICAS2 Z lt gt P P lt gt P TP Interrupt cascaded address During INTA cycles the interrupt master uses lines ICASO to ICAS2 to select the cascaded interrupt slave which is to sup ply the interrupt vector during an INTA cycle Lines ICASO to ICAS2 are used like addresses SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System Special signals Table 2 10 This group contains signals which do not fit into the other signal groups and are not part of the standard SMP16 bus They can be used by the user as necessary The special signals which are actually used by the boards are specified in the re spective product documentation Special signals of the SMP16 bus Signal Signal Direction Characteri stic Function NMI P gt Z OC Non maskable interrupt Usually the highest priority interrupt used for safety require ments DACKn DREQn Z P P gt Z TP TP DMA acknowledge n DMA request n These signals are special signal inputs outputs on primary bus masters or DMA master boards An SMP16 slave board with DMA capability activates the DREQn signal to request a data transfer using DMA mode The DMA master selects a requesting DMA slave board by activating
26. System Layout Evaluating the crimp connection Crimp connections must meet the requirements of DIN 41 611 part 3 for line cross sections less than 10 mm Note The crimping procedure must be performed so that the correct position of the con ductor can be examined on the finished crimp connection Table 8 5 Evaluating a crimp connection Drawing Evaluation 1 mm max Good crimp connection conductor and insulation vis ible Bad crimp connection insulation crimped too Bad crimp connection flexible lead spread apart SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 37 System Layout Crimping of cable shoes and connection sleeves Cable shoes DIN 46 225 46 234 and 46 235 and connection sleeves DIN 46 341 must be adapted to the conductor cross section 8 38 Several conductors may be crimped simultaneously in cable shoes or connection sleeves if the total of the individual cross sections is approximately the same as the nominal cross section of the cable shoe or connection sleeve Warning A space of 1 5 to 2 mm must be provided between insulation and the crimp area Insulation remains may not protrude into the crimp area Table 8 6 Crimping of cable shoes Cable Shoe Drawing Based on DIN 46 235 Hi E Based on DIN 46 234 Pin cable shoe in acc w DIN 46 230 is treated accordingly 1 3 mm Based on DIN 46 225
27. The device system may only be set up and operated in conjunction with this manual Only qualified personnel should be allowed to install and work on this equipment Qualified persons are defined as persons who are autho rized to commission to ground and to tag circuits equipment and systems in accordance with established safety practices and standards Trademarks SICOMP is a registered trademark of SIEMENS AG Some of the other designations used in this publication may also be registered trademarks the owner s rights may be violated if they are used by third parties for their own purposes Copyright Siemens AG 1998 All rights reserved The reproduction transmission or use of this document or its contents is not permitted without express written authority Offenders will be liable for damages All rights including rights created by patent grant or registration of a utility model or design are reserved Siemens AG Automation and Drive Technology Combination technology P O Box 2355 D 90713 Fuerth Disclaimer of Liability We have checked the contents of this manual for agreement with the hard ware and software described Since deviations cannot be precluded entirely we cannot guarantee full agreement However the data in this manual are reviewed regularly and any necessary corrections included in subsequent editions Suggestions for improvement are welcomed Siemens AG 1998 Subject to change without prior notice
28. lt p 24 V iD Reference rail HI Cabinet Figure 12 1 Power supply for encoders and control devices with the fuses and terminations located outside the electronics cabinet If a separate power supply is not provided for the encoders and control devices the supply voltage must be led out of the electronics cabinet via a feedthrough ca pacitor Fuses must be provided depending on the cable used SICOMP IMC System Manual 12 8 J31069 D2001 U001 A0 7618 Environmental Requirements Input ports Output ports V HV KR Front plug connector cabel 424V P 424 V NS Ci EXE ow a a d Reference rail Figure 12 2 Power supply for encoders and control devices with the fuses and terminations located inside the electronics cabinet a Locate input and output terminals or connections near the reference rail Route 24 V DC to power the circuit breakers to the reference rail via leadthrough capacitor c Separate cabinet area in which the circuit breakers and terminals are located from the elec tronics system e g with a punched plate d Connect separation plate with reference rail e Shield external cables depending on their length and ground on both sides f When unshielded external cables are used at least one grounding cable must be provided SI
29. 1 Mbit sec although when the transmission speed is re duced to 50 kbit sec the network may have a length of up to 1000 m Networks based on fiber optic conductors play a subordinate role since the maximum net work length is hardly increased by use of such networks SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Communication 10 4 2 Features of the Protocol CAN is a multi master network in which messages of different priorities are trans ferred via Broadcasting The arbitrating system is the key concept When the bus is free any station can begin to send a message by sending the telegram header The header contains the identifier which is specifically assigned to this message The arbitration procedure concerns this identifier During arbitra tion recessive identifier bits 1 are overwritten by dominant identifier bits 0 of another node which is attempting a bus access at the same time Each sender monitors the bus simultaneously and immediately switches from sending to receiv ing when it reads a dominant bit while sending a recessive bit The sending node with the highest identifier priority wins the arbitration i e bus access rights Its message is sent without delay i e arbitration is not destructive After the arbitra tion is lost another attempt to access the bus is automatically made ISO 11 898 only specifies CAN up to ISO OSI layer 2 Messages including identifi ers are exchanged between controller and
30. 3 1 AMS System 3 1 System Overview The SICOMP AMS system Products SICOMP AMS Advanced Microcomputer System is an open 16 bit board system with multiprocessor capability It conforms to the Multibus Specification and has worldwide standardization by the International Electrotechnical Commission IEC under the title IEC 796 Physically AMS offers the advantages of the established concept of the double Europa card format and indirect connection The AMS bus architecture is based on a hierarchy with the following levels System bus parallel AMS bus Local expansion bus parallel SMP16 bus e Local expansion bus parallel iPCI Serial bus Pins are reserved for this for future requirements The specifications of the AMS bus permit the operation of up to 16 CPU boards on the system bus Prioritization logic controls access rights The local bus concept ensures compatibility with the 16 bit SMP16 system Of particular importance is the capability of using an AT subsystem to integrate the PC functions in the SICOMP AMS industrial microcomputer system This subsys tem provides an all purpose hardware platform The following types of products are available for SICOMP AMS e Boards e Operating system software Board software board support packages Setup components and accessories Depending on the particular application area boards are delivered with or without firmware Board support packages cont
31. Bared ends of wires may not protrude from the wrap pin To prevent already installed wires from being damaged by a wrap or the wrap tool a minimum distance of 0 1 mm must be maintained in the first layer between the insulation body and the beginning of the wrap SICOMP IMC System Manual 8 32 J31069 D2001 U001 A0 7618 System Layout Evaluating a wrap connection Figure 8 18 Evaluating a wrap connection 1 Correctly modified wire winding The end of the wire does not have to hug the wrap pin and may protrude some what in a tangential direction Dimension a may not exceed the diameter of the conductor Insulation does not extend over at least three edges of the wrap pin Spiral shaped winding when counter pressure is too low Open winding when counter pressure is not uniform a fF OO I Over winding when counter pressure is too great or winding is unsuitable Wiring modification 8 8 4 Wire ends which have already been used and bent may not be used again A wrap winding may not be applied more than 20 times to the same location on a wrap pin Wiring Cable Harnesses Cable harnesses permit fast and reliable connection of components i e identical arrangement and easy to recognize for mass production manufacturing Cable harnesses consist of single insulated wires which are bundled into master cables and branches Depending on construction specifications the bared ends can be provided
32. DIN 41 612 e Subminiature plug in connectors in acc w DIN 41 652 e IDC plug in connectors BK MOD 421 422 in acc w DIN 41 651 e Other plug in connectors e g miniature coaxial sockets front connector K and front connector K 2 SICOMP IMC System Manual 8 12 J31069 D2001 U001 A0 7618 System Layout Multi point and socket terminal strips in acc w DIN 41 612 Multi point terminal strips and socket terminal strips in accordance with DIN 41 612 are used as bus plug in connectors For electrical and physical features see the table below Dimensional drawings follow Table 8 1 Electrical and physical characteristic values of the multi point and socket terminal strips in acc w DIN 41 612 Models in Acc w B C M Q R D EG DIN 41 612 B 2 C 2 M 2 Q 2 R 2 B 3 C 3 M 3 Q 3 R 3 Requirement stages 2 3 2 3 1 2 2 3 2 3 2 3 1 2 3 in acc w DIN 41 612 Temperature range 55 C to 125 C Current load at 70 C 1A 4A Voltage strength 1000 V 1550 V Creepage distance 1 2 mm 3 mm contact contact Clearance in air 1 2 mm 1 6 mm contact contact Throughput resistance lt 20 MQ lt 15mQ Isolation resistance gt 106 MQ Connection models for e Soldering on PCBs X x e Wrap connections x X x e Insert technique X Insulation material Thermoplastic synthetic material glass fiber reinforcement Contact surface Au over Pd over Ni Au over Au over Pd over Ni Au over Au over Ni or A
33. IRQ3 22 DB4 V1 R1 DB8 V1 R1 A8 V1 R1 23 INTA V1 R1 DB9 V1 R1 IRQ4 24 DB5 V1 R1 DB10 V1 R1 A9 V1 R1 25 UBAT V1 DB11 V1 R1 IRQ5 m 26 DB6 V1 R1 DB12 V1 R1 A10 V1 R1 27 OWS V1 DB13 V1 R1 IRQ6 28 DB7 V1 R1 DB14 V1 R1 A11 V1 R1 29 TC EOP V1 DB15 V1 R1 IRQ7 30 low V1 R1 Z1 BHEN V1 R1 IOR V1 R1 Z1 31 15V V2 A18 V1 R1 GND V3 32 5V V3 A19 V1 R1 12 V V2 1 Is supplied by some CPUs as special signal OSC 2 Reserved for special signals ACEN b11 and ACDONE b13 See chapter 2 6 3 Bus lines can also be used for DACK and DREQ signals or for DMA cascading 4 Can be used to cascade interrupts alternate to footnote 3 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 9 SMP16 System 2 4 1 Explanation of Table 2 4 Signal columns If names are specified here the connections are allocated with these bus signals An asterisk after the name indicates a low active signal A dash means that boards can allocate special signals to the connection Reserved connections are provided for future or special applications and may not be allocated with special signals Circuiting columns The left hand columns show the links established by the bus backplane The right hand columns show the connection circuiting on the bus backplane Connection Meaning V1 Narrow cable on the bus backplane which connects connections with the same connection row an
34. Industrial Ethernet Network Configurations 2 000eee eae 10 3 PROFIBUS 1 bn Reap aha bake deat e d a d pad Oak roD P LEER 10 3 2 PROFIBUS Network Configurations 000 e eee ee 10 4 Controller Area Network CAN 00 0 e cece eee eee eens 10 4 4 Physical Structure 0 0 cece eens 10 4 2 Features of the Protocol 0 c eee 1043 Sumimary iius everndde arii sii anda aud urat 48064 eee A eens 10 5 Remote Maintenance and Remote Diagnosis Via Internet SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Hl Table of Contents 11 Commissioning Testing and Debugging ieeeeeeeeeeeeee 11 1 Commissioning ssssssssssssss aa i 11 2 Commissioning the Hardware 0 0c cece eee eee eee 11 3 Installing the Operating System 000 cece eee eee eee TSH IRMOS roses iatea et daaa ia RREe a be uM ESO aa Eaa d a e a DEAE MS DOS rossian iE E E E E RE E EEE ES T1 9 9 MindOWS aans i irea a r beak dee roaa AEDE RESA 11 4 Parameterizing the Boards 11 amp 41 Software Settings 0 0 ccc teens 11 4 2 Hardware Settings 0 0 ccc teens 11 4 8 Testing the Set Boards 0 0 c cece nee eee 11 5 Commissioning an Application 11 5 4 Generating New Applications 11 5 2 System Expansions 000 cece eee 11 6 Test and Debugging under RMOS 000000 cece eee eee es 12 Environmenta
35. System 3 4 Signals of the Bus Interfaces Table 3 3 Signal allocation of the AMS bus Pin Pin Row A Pin Row B Pin Row C l Signal Circuiting l Signal Circuiting l Signal Circuiting 1 MRDC vi R10 BCLK Vi RT ioRc Vi R10 2 mwtc vi R10 GND v3 l IOWC Vi R10 3 BPR J Busv vi Rio IN vi R10 4 BPRO CBRQ Vi R10 BREG 5 Auxo aux AUX2 6 Reserved vi GND v3 Reserved vi 7 INTO Vi R10 INTI Vi R10 INT2 Vi R10 8 INT3 v1 R10 INT4 vi Rto INTS v1 R10 9 INT6 Vi R10 GND v3 l INT7 Vi R10 10 AUX3 XACK Vi R5 Nr Vi R22 11 5v v3 AUX4 AUX5 12 5V v ax v ew v 13 SDAT vi cnND va scue v l 14 5V v ww v az v 15 5V v Nir Vi R0 INH2 Vi R10 16 Ao Vi R2 Ar V1 R22 a V1 R22 17 A3 Vi R22 GND V3 as Vi R22 18 A5 v1 R22 Ae vi R2 ar Vi R22 19 A8 Vi R22 Ae Vi R22 A10 Vi R22 20 At1 Vi R22 GND V3 A127 Vi R22 21 A13 Vi R2 A14 Vi R22 Ais Vi R22 22 A16 Vi R22 A17 Vi R22 as Vi R22 23 A19 v1 R22 GND v3 A20 v1 R22 24 A21 V1 R22 A22 Vi R22 5V v3 l 25 A23 Vi R22 BHEN Vi R22 5V v3 l 26 Lock vi Rio GND v3 cek Vi RT 27 Do vi m2 Dr vi m2 oz Vi R22 28 D3 v1 R22 bp4 vi R22 bs v1 R22 29 De Vi R
36. U001 A0 7618 System Layout 8 8 9 Wiring the Power Supply on the Subrack The H15 socket terminal strips for power packs mounted on the subrack must be connected to connections 28 30 and 32 with the high voltage power network and to the other connections with the consumer e g the bus backplane Insulated flexible copper leads should be used for this purpose The conductor cross section must be sufficient for the particular current 1 5 mm flexible copper leads which correspond to the H15 plug in connection with respect to maximum current load ability can be recommended for both input and output voltages The rule of thumb is 10 A at temperatures up to 55 C If the current load is greater the load must be distributed over several lines Signal and sensor lines may have a smaller cross section 0 5 mm is recommended Table 8 9 Insulation colors for alternating current lines Function of the Line Color Protective conductor Green yellow Directly grounded conduc Blue tor Exterior conductor phase Black Table 8 10 Insulation colors for direct current lines Function of the Line Color 0 V GND Black 5 V Red 3 3 V Orange 12 V Brown 12V Violet 15 V Pink 15 V White Two colored flexible leads should be used for other types of wiring Power connection Power network voltage is supplied via a solid state plug connector This connector is mounted on the
37. VF 5 VF U3 24 V 0 4 A 12 45V 45V 14 15 V 12 V 15 V 12 V U1 24 V 0 8 A 16 OV OV OV OV U1 18 OV OV OV OV U2 24 V 0 4A 20 5 VF 5 VF U2 22 15V 12 V 15V 12 V U4 24 15 VF U4 24 V 0 2 A 26 15 VF 28 Power Power Power Power Power 30 Power Power Power Power Power 32 PE PE PE PE PE SICOMP IMC System Manual 7 12 J31069 D2001 U001 A0 7618 Power Supplies Pin SMP E430 Ax SMP E431 A5 SMP E431 A6 SMP E432 A5 SMP E432 A8 4 5 V 6 PF PF PF 8 0 VF 0 VF 0 VF 0 VF 10 5 VF 5 VF 5 VF 5 VF 12 4 5V 5 V 5 V 5 V 14 15 V 12 V 12 V 12 V 12 V 16 OV OV OV OV OV 18 OV OV OV OV OV 20 22 15V 12V 12V 12V 12V 24 26 12 VF 28 Power Power Power Power Power 30 Power Power Power Power Power 32 PE PE PE PE PE Pin SMP E433 A6 SMP E434 A6 SMP E435 A6 SMP E436 A6 SMP E440 Ax 4 5 V PF 5 V 6 PF 5 VF 5 V 8 0 VF 0 VF 5 V 10 5 VF 5 V 5 V 12 5 V 45V 12 V 14 12 V 5 V 12 V 15 V 16 OV OV 5 V 12 V OV 18 OV OV OV 12 V OV 20 OV 22 OV PE 15V 24 OV 26 28 Power Power Power Power Ue 24 VDC 30 Power Power Power Power Ue 0 VDC 32 PE PE PE PE PE SICOMP IMC System Manual J31
38. actuator bus sys tems Mobile systems SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 5 Communication 10 1 1 10 6 ISO Layer Model When data communication between programmable controllers takes place over a bus system it is important to define the transmission system and the access pro cedure Other information must also be specified e g on the establishment of the connection For this reason the International Standardization Organization i e ISO defined a 7 layer model Table 10 2 ISO 7 layer model Layer Designation Function Features 7 Application layer Application functions Read write Start stop File transfer 6 Presentation layer Data presentation Common language 5 Session layer Synchronization Coordination of the con Communication control nection e g opening end 4 Transport layer Connection establishment Protected transmission of and disconnection raw information Acknowledgments Segmentation 3 Network layer Addressing of other net Communication between works network connec two networks tions 2 Data link layer Access procedures CRC check Protected transmission CSMA CD token 1 Physical layer Physical transmission Coaxial triaxial cable rights Fiber optic conductor ca ble Industrial twisted pair The declarations of the layers are called protocols This model is divided into two areas SICOMP IMC System Manual J31069 D2001 U001
39. aisean E deforme a eue duke laxe dd ed ds SICOMP IMC System Manual J31069 D2001 U001 A0 7618 9 1 Software 9 1 9 1 1 General Demands on Operating Systems With microelectronics the hardware components of a system are becoming in creasingly faster and more compact and these components are being used in in creasingly powerful computers Operating systems handle the task of making eco nomical use of the resources of such computers and simplifying communication between man and machine The characteristics which an operating system must have are determined by the environment in which it is used Typical demands on an operating system Management of computer resources e g time memory and so on Management of computer devices e g monitor screen printer keyboard and So on and when necessary allocation of these devices to the user programs Support of the so called parallel running of the user programs Communication between computer and user i e man machine interface Reaction to user program demands on the computer Protection of data and program areas Other important criteria A certain independence from hardware Ability to be scaled i e to minimize memory requirements only those modules required by an application are linked to the system Portability i e retention of hardware dependent coding in separate modules and adjustment of only these modules when moved Support of PC compatible ha
40. application with this interface The CAL CAN Application Layer specification was prepared by CiA CAN in Automation association as the first open specification of the application layer In addition to a wide variety of services for data communication this specification contains service groups for network management and identifier assignment A profile family for in dustrial real time applications consisting of communication and device profiles CANopen is based on CAL For performance reasons CANopen only uses one subset of CAL but provides the user with standardized interfaces for device com munications In addition to CAL CANopen the layer 7 specifications of Allen Bradley Device Net and Honeywell SDS play an important role in their respective market seg ments DeviceNet enjoys strong popularity on the American market while SDS Smart Distributed System is primarily designed for sensor networking I O level Founded in April 1995 in the USA ODVA Open DeviceNet Vendor Association is also planning to develop device profiles SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 25 Communication 10 4 3 10 26 Summary The CAN protocol permits efficient transmission of both digital input output data and data of higher communication e g parameters It offers extensive error han dling and has a highly effective transmission speed i e telegrams do not abso lutely have to be poled by a logical master Howev
41. back of the subrack in the vicinity of the power packs and con nected to the power connections of the H15 multi point strips Keep this connec tion as short as possible SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 43 System Layout Warning Make sure insulation is good and use contraction sleeves in addition on the con nections The protective conductor connection of the solid state plug connector must be connected to the metal frame of the subrack with a separate line e g via Screw spring washer toothed washer and two nuts The power connection lines may not cross the low voltage lines and may not be installed parallel to these The low voltage guidelines must be adhered to e g double insulation of the power side With greater power connection current e g for 120 V operation or higher connec tion power a permanent connection with pull relief is recommended Power con nector solid state connector and power switch must have sufficient loadability Output voltages With power supplies with multiple connections i e several connections for one output voltage or for 0 V all connections must be connected if required for the load with the load via lines of the same length and same cross section AC DC Bus backplane AC DC Bus backplane 45V 45V 45V 45V 45V 5V 45V 5V 5 V 2 45V R OV o OV OV a OV OV OV gt oV oV oV OV
42. cece eee ee 11 5 2 System Expansions 00 cece sse 11 6 Test and Debugging under RMOS SICOMP IMC System Manual J31069 D2001 U001 A0 7618 11 1 Commissioning Testing and Debugging 11 1 Commissioning Commissioning a SICOMP IMC system involves the following general steps 1 Commission the hardware Check voltage supply Check special wiring Install the boards 2 Install the operating system Set up a software base for the actual application software 3 Parameterize the boards The boards required for the application must be adjusted i e address and type of function to the specific requirements 4 Commission an application The software required for the application must be tested in stages 11 2 Commissioning the Hardware Checking the voltage supply After the physical components e g system frame bus backplanes guide rails power supply and so on have been assembled and wired we recommend check ing the voltages which are fed in Connect the complete power supply of the system but no other boards with the bus backplane s After the SICOMP IMC power supply supplies is are turned on and all LEDs on their front plates go on the system voltages can be checked with a voltage mea suring instrument on the bus backplanes on the pins of the bus socket terminal strips or the connections of the voltage supplies Caution If one or more LEDs do not light up the wiring of the system
43. eee ee ees 9 1 2 Operating System Classes 0 0 0 cece cnet eee eee 9 1 3 Automation Tasks asus ras he eR canna Ges pe RE eR Ra mr Res 9 1 4 Principles of Multitasking 0 00 cece eee eee m 9 1 5 Task Communication and Coordination 2 0c eee ee eee ee 9 2 Operating Systems Which Can Be Used 00 cee eee eeee 9 2 1 RMOSS iisensrssteesenz dk n RRESU RIO ARR UE AERE eae Rae sane eee 9 2 2 Other Operating Systems 00 c eee eee 9 3 RMOS Operating System 9 3 1 Features of RHMOSS j4cccinccsar dbi le boxe Lo eee dee dae 9 3 2 Components of RMOS sssssssssssssssse nn 9 3 3 Management of Tasks 0 00 cece eee nee 9 3 4 Configuration sssssssssssssss hs 9 3 5 Development Tools 0 002 nee 9 4 Standard Software epini anamnese aaa ia a E a eens 9 4 1 SMPIGAKO coe cgadeod ond nini aeie a a user n a ees 9 4 2 Board Support Packages BSPs 9 4 3 RMOSJ PLC 4222s ges cre Re RRRR ROLE e a a Eds 9 4 4 eulg 10 COMMUNICATION sci Re IR rrr raa rrr eamm eee eee 10 1 Introduction and System Design 10 1 4 ISO Layer Model usseseeusesssssees n 10 1 2 TCP IP Protocol 22actcaet sauce Risa RE P REA RUE UE Pee 10 1 8 HATIP Protocol i224 6dreabewte ket RRREEAleuRRER T ER RE Rd bem s 10 2 Industrial Ethernet ersa airar ar EAIA AAAA EAEAN 1020k Ea8yOUL esses herres nie ekte RE ped a a RE REG e ER ED 10 2 2
44. ery program and the minimum ordering quantities components Electronic components e g arithmetic coprocessors may be used on some boards to expand functions Capacity can be modified by replacing chips e g by using EPROMs of different capacities Caution When installing components make sure that component and receptacle match For more information see Package Information in the component description Caution Adhere to the ESD guidelines when handling the boards See chapter 8 7 4 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout 8 6 Placement of the Boards in the System Caution Remember the following points when planning your system Placement of drives Magnetic memory mediums must always be placed as far away as possible from power supplies High currents may affect drives electro magnetically Continuous heat emission from the power supply decreases the MTBF of the drives SICOMP IMC drive inserts may only be connected to the CPU with the included connection cables Two CPU solution Place the shorter of the two bus segments further away from the power supply For both bus segments adhere to the notes on drive placement See above Analog input output boards To completely preclude possible measuring errors with high resolution converters these boards should not be operated in the immediate vicinity of potential interfer ence sources e g switching p
45. foreign bodes IP 2X Protection against water IP XO When installed Protection against foreign bodes IP 1X Protection against water IP XO Board level Air and creepage paths in acc w IEC 1131 Overvoltage category II For boards with nominal voltages up to max of 50 V Overvoltage category Ill For boards with nominal voltages starting at 50 V Degree of soil 2 PCB material IIl a For all boards Isolation test in acc w IEC 1131 2 500 V DC For boards with nominal voltages up to max of 50 V 1 2 x GUN 1000 V x 1 414 DC For boards with nominal voltages starting at 50 V Fire resistance for open type controllers in acc w IEC 1131 2 At least UL94 HB For housing parts At least UL94 V 2 For holders for voltage carrying parts At least UL94 V 1 For PCB material Manufacturing material in acc w SN 36350 Environmentally compatible disposal of used devices e Avoidance of environmentally endangering substances and mate rials Increased repairs due to easy disassembly e No materials emitting silicon or teflon SICOMP IMC System Manual J31069 D2001 U001 A0 7618 12 17 Environmental Requirements CE seal The CE seal is based on the harmonized European standard EN 60950 CE con formance in accordance with guidelines 73 23 EWG on low voltages exists if the notes included in the appropriate EG statements of conf
46. front plate iPCI and newer AMS boards are equipped with a pull tilt lever which makes it eas ier to remove the board SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout 8 7 6 8 7 7 Mounting the Cabinets and Housings Depending on the application both fully mounted cabinets and housings are avail able in various models as well as easy to use mounting kits Note When selecting cabinets and housings remember that boards with front plug con nectors require a distance of at least 60 mm between the front plate and the front door The Assembling Center offers implementation of customized solutions Multiple Row Systems Special Systems and Cable Fabrication Most of the multiple row SICOMP IMC systems consist of a 6HE system frame configured with AMS SMP16 and or iPCI bus backplanes Since AMS CPU boards use the AMS bus to communicate with each other and locally are able to handle one SMP16 iPCI bus each possible configurations are almost unlimited The SICOMP IMC Assembling Center can handle the task of setting up and com missioning such a system See chapter 6 This also applies when your application does not permit exclusive use of the SICOMP IMC family of products and you require other subracks i e height more than 6 HE width other than 84 TE or a special operating system and software solution for example Cable fabrication Due to the wide variety of possible cables they can
47. guidelines Your address Name Company Department Street City State Country Phone Date What errors in content did you notice Which situations were described incorrectly or not in sufficient detail Do you have suggestions for improvement Please send us a copy ofthis sheet with your remarks Thank you very much for your trouble With best regards Your documentation department Page Remarks on the description Siemens AG Automation and Drive Technology Systems Engineering P O Box 2355 D 90713 Fuerth Subject to change without prior notice Siemens Aktiengesellschaft Order no 6AR1950 7AA00 2CA0 Printed in the Fed Rep of Germany Excellence i Automaton amp Drives Siamens
48. hetero geneous networks and independence from specific computers The TCP IP proto col is intended for levels three and four and does not affect OSI layers one and two Web FTP Telnet TFTP 7 Application layer TCP UDP 4 Transport layer ICMP 4 IP IGMP 3 Network layer RARP MY Hardware control ARP W BOOTP 2 Network layer 1 Physical layer Transmission cable Figure 10 1 Arrangement of TCP IP in the layer model The decisive advantage of this protocol is its simple implementation and the un complicated and quick standardization procedure Its development follows two simple rules Anyone can say anything Nothing is official The current guidelines are published in the RFC i e Request For Comment These guidelines are divided into three phases i e proposal draft and finally in ternational standard The Internet Activities Board IAB decides which phase is applicable At the moment approximately 2300 RFCs are open for view on the Internet They can be obtained from there via the Internet 1 Address http dxcoms cern ch wwwcs public ip internetdoc html 10 8 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Communication The Internet protocol family not only standardizes data transmission but also de fines sta
49. lines The GND line of the power supply must be connected to both backplanes See figure 8 22 8 3 4 Backup Battery There are two ways to supply SICOMP IMC systems with battery power to buffer the backup functions real time clock and CMOS RAM e Accessory Battery module with protective circuit diode against charge reversal currents and resistor for current limitation if diode fails This accessory can be secured to the system frame and is connected to the system bus backplane with two connection cables Board On an SMP16 board the voltages required by the system are provided directly via the system bus The maximum lifespan of a lithium battery is 10 years The load shortens its life accordingly Remember this when designing cyclic communication SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 9 System Layout 8 3 5 Mechanical Accessories Utilization and combination of the system modules is enhanced by available acces sory kits These accessory kits permit the setup of mixed systems i e AMS SMP16 and iPCI systems in multiple row system modules Total and individual locking is pro vided for the boards The accessory kits divide an AMS slot double Europa format into two SMP16 or iPCI slots single Europa format They can be installed on any slots in multiple row SICOMP IMC system frames LL p eMe i eS Upper connection rail with guides Middle connection rail Lowe
50. memory blocks data transmission to and from input output blocks direct addressing or MMIO and the control of I O devices e g acknowledgment signals for interrupts and DMA Table 2 6 Control signals of the SMP16 bus Signal Signal Characteri Function Direction stic ALE Z gt P TP Address latch enable The ALE signal was used on slave boards for latching of address lines AO to A19 It is usually activated at the beginning of an SMP16 bus cycle Since some bus masters do not or do not always support it it may no longer be used by new slave boards Due to compatibility the signal line of the ALE must remain reserved SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 11 SMP16 System Table 2 6 Control signals of the SMP16 bus continued Signal Signal Characteri Function Direction stic BHEN Z gt P TS TP Byte high enable Control signals to enable information communication on the more significant part of the data bus DB8 to DB15 The BHEN signal indicates a real 16 bit access to an even address A0 0 of the memory or the input output area This signal is always inactive for 8 bit accesses BUSEN Z gt P TP Bus enable Control signal to distinguish between CPU and special ac cesses The inactive BUSEN signal prevents slave boards from de coding the address lines directly in the input output area In this case these boards can be selected via special si
51. modified With the modified wrap connection there is less danger of a wire break in comparison to the standard wrap connection For this reason the modified wrap connection is partic ularly recommended when wires are subjected to greater stress e g vibration SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Standard Wrap Connection Modified Wrap Connection RENE Insulated wire Insulated or uninsulated bare wire Reference edge Reference edge Counting the wire windings Starting with the reference edge at the first contact point of the wrap pin with the bare wire only complete windings which encircle the wrap pin by 360 are counted At least four windings are required for wrap connections on SMP16 or AMS bus backplanes and boards Wrap tools Electrical air pressure and manually operated tools are available For detailed information see the product documentation of the respective manufacturer Elec trical wrap tools are sold by the following company for example CooperTools Karl Benz Str 2 74354 Besigheim Note Adhere to the user s instructions for the wrap tool Wrap wire Choosing the correct wire quality i e conductor and insulation is decisive to the reliability of wrap connections Only wire which is suitable for the wrap technique may be used Only wire with easily adhering insulation may be used for wrap connections with self baring wrap tools S
52. on an operator panel Bya software command Data Transmission During data transmission the bus master board first places the memory or input output address on the address lines and only for write operations the data on the data lines It then uses one of the signals MRDC MWTC IORC or IOWC to gen erate a command with which the appropriate slave is activated During a write operation the slave accepts the information from the data lines During a read operation it places the requested data on the bus It then activates the transmission acknowledgment XACK The bus master concludes the cycle by deactivating the command signal and then the address and data lines Data bus size Control signal BHEN and the status of address bit AO can be used to perform an 8 bit or a 16 bit access Slave boards have no effect on the data bus size Table 3 11 Resulting bus size for data transmission operations AO BHEN Bus Size HIGH 8 bits low byte on DO to D7 HIGH 8 bits high byte on DO to D7 byte swap LOW 16 bits low byte on DO to D7 high byte on D8 to D15 LOW Not permitted O O SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System Inhibiting of memory accesses Inhibiting signals INH1 and INH2 can be used to block memory accesses of the bus master for the slave module actually addressed by the memory addresses The inhibiting signals can be activated by another slave module for acc
53. other bus systems than PCI four signals have been defined which indicate the type of bus signals The BUSMODE signals 4 3 and 2 are permanently set to 001bin for PCI mod ules The BUSMODE 1 signal tells the CPU that module exists and is active The module only activates its interface blocks when the correct identifier is speci fied by the CPU SICOMP IMC System Manual J31069 D2001 U001 A0 7618 PCI System 4 3 2 Signals of the PMC Module Interface Table 4 7 Signals of the PMC module interface Connection X8 Connection X9 Pin Signal Pin Signal Pin Signal Pin Signal 1 l 2 12V 1 2v 2 3 GND 4 INTA amp 3 l 4 5 INTB R 6 INTC l5 l 6 GND 7 BUSMODE1 8 5V 7 GND 8 Reserved 9 INTD 10 Reserved 9 Reserved 10 Reserved 11 GND 12 Reserved 11 BUSMODE2 12 43 3V 13 CLK 14 GND 13 RST 14 BUSMODE3 15 GND 16 GNT 15 3 3V 16 BUSMODE4 17 REQ 18 5 V 17 Reserved 18 GND 19 V VO 20 AD31 19 AD30 20 AD29 21 AD28 22 AD27 21 GND 22 AD26 23 AD25 24 GND 23 AD24 24 43 3V 25 GND 26 C BES 25 IDSEL 26 AD23 27 AD22 28 AD21 27 33V 28 AD20 29 AD19 30 5V 29 AD18 30 GND 31 V O 32 AD17 31 AD16 32 C BE2 33 FRAME 34 GND 33 GND 34 Reserved 35 GND 36 IRDY 35 TRDY 36 3 3V 37 DEVSEL 38
54. part of our product pro replaced gram SMP E435 A6 Cannot be 5 V outputs with 35 A are no longer part of our product pro replaced gram SMP E440 A2 Cannot be 24 V inputs are no longer part of our product program replaced SMP E441 A2 Cannot be 24 V inputs are no longer part of our product program replaced SMP16 SV431 SMP16 SV431 Change installation geometry KS 1 from KS 2 1 Move left hand guide rails to the right The right hand guide rails are no longer needed SICOMP IMC System Manual J31069 D2001 U001 A0 7618 7 11 Power Supplies 7 4 2 Connection Compatibility The following tables list the connection allocations of all power supplies Unallo cated connections may not be circuited Remove any circuiting if necessary Table 7 5 Connection allocation of the H15 multi point terminal strips Pin AMS M431 A5 SMP E423 A30 SMP E424 A3 Top Bottom 4 45V SD SD 6 45V PF PF PF 8 45V 0 VF 0 VF 10 45V x 45 VF 12 45V 45V 14 45 VF 45V 12 V 16 12V OV OV 18 OV OV OV 20 OV Syn A 22 OV Syn E 12V 24 OV Mas A 12 VF 26 OV Sla E 12 VF 28 12 V Power Power Power 30 12 V Power Power Power 32 0 VF PE PE PE Pin SMP E425 A3 SMP E426 A3 SMP E427 A3 SMP E428 Ax SMP E429 4 SD SD SD 6 Pe PF PF 8 0 VF 0 VF 0 VF U3 10 5
55. probably has a short circuit If so turn off the power supplies immediately to avoid damaging the system SICOMP IMC System Manual 11 2 J31069 D2001 U001 A0 7618 Commissioning Testing and Debugging Checking the special wiring In addition to visually checking all wrap connections and other extra wiring we rec ommend performing a check with a continuity tester For this the power supply of the entire system must be turned off to avoid a short circuit or false interpretation during measurement Installing the boards Before installing the boards in the SICOMP IMC system we recommend perform ing the following steps Check the address areas occupied by the boards Graphic representation of the individual address areas and the location of the individual boards helps to locate overlapping quickly e Check the settings which have been made on the board with short circuit jump ers DIP switches or wrap connections Warning Boards may only be installed or removed when the system frame is electrically free of voltage The notes in the product documentation of the boards must be adhered to e g notes on ESD When installing the boards proceed with extreme care The guide rails must be parallel to each other to prevent tension on the boards in the system The boards must not be stuck in the front plates since this would prevent cor rect contact with the bus backplane The bottom of a board to be
56. product documentation of the bus master boards To ensure an uninterrupted sequence of bus cycles control of the AMS bus is not given to another bus master while the interrupt is being processed Non bus vectored interrupts These interrupts do not require data transmission via the AMS bus to determine the jump address for the interrupt routine The bus master performs all required operations itself The interrupt triggering modules are also able to locate themselves on the bus master board SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System 3 5 4 Bus Allocation Control If necessary the bus master boards circuited together in an AMS system can ob tain control over the AMS bus in order to perform the required transmission opera tions Two priority procedures can be implemented using a series of bus allocation signals Serial priority resolution There is a highest priority and a lowest priority bus master board In between no two bus masters have the same priority The priorities are assigned by wir ing on the bus backplane Parallel priority resolution Bus allocation is performed by an external circuit which knows the priorities of the individual bus master boards Generation and evaluation of the bus allocation signals is synchronized by the bus clock pulse signal BCLK Serial priority resolution The bus master boards are daisy chained together A signal which is not con nected through to the
57. protective collar steel nickel plated contacts Cu alloy punched rolled nickel plating in plug in area and hard gold plated connections tin plated Technical specifications Stress measuring and test procedures in acc w IEC publ 68 and IEC publ 512 DIN 40 046 and 41 640 Characteristic values and dimensions in acc w IEC 48 B Germany 99 DIN 41 652 and MIL C 24308 Electrical Characteristic Value Current loadability per contact for ambi ent temperature 20 C 70 C 100 C 5A 3A 1 5A Operational voltage Depends on safety regulations for the device Air and creepage distance Values Contact contact 1mm Contact ground 2 2mm Voltage strength test stand for air pres sure 860 to1060 hPa 1000 V 50 Hz 300 hPa 8500 m over sea level 350 V 50 Hz Partial discharge voltage gt 1000 V Throughput resistance lt 10 mQ Isolation resistance 25x 103 MQ Physical Climatic Characteristic 9 Pin 15 Pin 25 Pin 37 Pin 50 Pin Lifespan For requirement stage 2 For requirement stage 3 gt 400 plugging cycles gt 50 plugging cycles Flammability Selfextinguishing after lt 10 sec UL 94 VO Limit temperature range 55 C to 125 C Plugging strength lt 30N lt 50N lt 83 N lt 123N lt 167 N Pulling strength lt 20 N lt 33 N lt 56 N lt 82 N lt 111 N Approx pin strip weights 5g 8g 11g 16g 18g Approx socket strip weights
58. replacement parts Repair service Repairs are handled as Naemlichkeit repairs If repairable the same board is returned to you The column labeled Repair Identifier in the price lists shows which service can be used Repair Identifier Meaning R1 R4 Board can be repaired Replacement via replacement parts service possible Repair flat rates based on table RO Board can be repaired Replacement via replacement parts service not possible Repair only as Naemlichkeit N Board cannot be repaired e g bus backplanes Replacement via replacement parts service not possible 1 Pickup and delivery service SICOMP IMC System Manual 13 4 J31069 D2001 U001 A0 7618 Service System Consulting Training 13 2 2 Delivery Dates for Replacement Parts Service The flat rate for repairs is invoiced at the amount shown in the table plus any addi tional charges System standstill highest priority When the order arrives at your Siemens office by 3 00 PM the replacement parts ordered are returned to the delivery point on the next working day following the date of ordering Orders received after 3 00 PM are accepted under the following telefax number 49 911 750 2299 Orders received after normal working hours i e Monday to Friday after 6 00 PM and Saturday and Sunday are accepted under the following telefax number with the remark system standstill 4 49 911 750 2585 The delivery point is
59. set tings are not restored 13 2 5 Handling Replacement parts Table 13 1 Handling of the replacement parts procedure Step 1 The customer submits a replacement parts order to his her Siemens office via telefax or undocumented and provides the following information Customer order identifier Urgency Product designation exact specifications construction release Amount Delivery address Type of shipping Warranty claim The Siemens office issues an order identifier AKZ The replacement part is delivered within the applicable delivery time based on the degree of urgency SICOMP IMC System Manual J31069 D2001 U001 A0 7618 13 7 Service System Consulting Training Repairs Prices 13 8 The customer sends the defective part with the remark replacement already delivered with delivery slip number dated and a description of the mal function within four weeks to the address for returns and naemlichkeit re pairs Siemens AG A amp D SE B9 Wuerzburger Str 121 90766 Fuerth If the customer does not return the part within four weeks or the part cannot be repaired the new part price plus any extra charges is invoiced After receipt at the plant and inspection the repair flat rate based on the table is invoiced plus any extra charges Table 13 2 Handling of the repair procedure Step 1 The customer submits a repair order t
60. system are defined for the AMS bus Read and write accesses to the bus are performed with out multiplexing i e neither address nor data signals must be latched Control signals of the AMS bus Character Signal Direction istic Function CCLK M gt S TP Constant clock Cyclic clock pulse signal with constant frequency can be used by bus master and slave boards as the system clock pulse Every bus master must be able to generate this signal Ina multimaster system the system clock pulse is always pro vided to the bus by a bus master only INH1 INH2 S lt gt S OC Inhibit Blocking signal of a slave module to disable memory ac cesses of the system for another slave INIT M gt S OC Initialize Initialization signal to put the entire system into a defined state can be triggered by every bus master or by an external source e g debounced button IORC M gt S TS I O read command Control signal of the CPU to read information from the input output address area IOWC M gt S TS I O write command Control signal of the CPU to write information in the input out put address area LOCK M gt S TS Lock Lock signal for accesses of other bus masters to the system bus is generated by the active bus master LOCK also disables the second interface of the dual port RAM to prevent accesses foreign to the bus MRDC M gt S TS Me
61. the SMP16 bus are available individually and as a ready to use industrial system from the Assembling Center SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 3 SMP16 System Innovations of the SMP16 system in comparison to the SMP system Data bus was expanded to 16 bits In comparison to the SICOMP SMP bus performance has been increased by a factor of 3 to 5 with the SICOMP SMP16 Prepared for the new generation of integrated circuits which require a 3 3 V voltage supply Bus timing was revised and made uniform Any PC compatible SMP16 CPU can handle any SMP16 board PC compatible I O functions on the SMP16 bus must adhere to the SMP16 timing specifica tions These boards graphics and LAN can also be operated on non PC systems Some of the slower I O boards can be handled by the CPU via wait cycles and command delays which can be set Gross bus transfer speed was increased to up to 10 Mbyte sec Special signal allocation was made uniform PC timing was integrated so that powerful real time PCs can be generated on an SMP16 basis The SMP16 bus is compatible with the SMP bus i e with few exceptions existing SMP components can continue to be used with the SMP16 bus See chapter 2 6 EMC compatibility was increased All SMP16 boards have CE certification Metal front facings are equipped with single locking Guaranteed adherence to bus timing for modern SMP16 I O boards with the ASIC ASBIC bus interface Usi
62. the bus cable with a pull up resistor of 2 2 KQ against 5 V RT Termination of the bus cable with a voltage scaler with 220 Q against 5 V and 330 Q against GND No circuiting SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System 3 4 2 BDescription of the us Signals The following tables use the abbreviations and symbols shown below Table 3 4 Explanation of the abbreviations and symbols Signal Direction Meaning M gt S From active bus master to the slave boards S gt M From the slave boards to the active bus master M lt gt S Bi directional signal flow between active bus master and slave boards S lt gt S Bi directional signal flow between slave boards M lt gt M Bi directional signal flow between two bus master boards or between slave boards Characteristic Requirements on Outputs for This Signal OC Open collector OC outputs can assume two signal states LOW or high ohmic TP Totem pole TP outputs can assume two signal states LOW or HIGH TS Tri state TS outputs can assume three signal states LOW HIGH or high ohmic Note Here active bus master means the bus master board which has control of the AMS bus now SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System Control signals of the AMS bus Table 3 5 Signal All control signals required for control and coordination of a multimaster
63. to change the priority while programs are running The priority of a set starting prior ity is incremented cyclically up to a specified end priority This increases the chances of a task to receive CPU time the longer it waits This mechanism pre vents higher priority tasks from continuously snatching away the CPU from a task with a relatively low start priority of the CPU by the scheduler The scheduler is part of the nucleus of the operating system kernel Its job is to allocate CPU computing time to the individual tasks so that they can be executed The priority of the tasks is used as the decision criterion Only tasks which are in ready status can be assigned CPU time i e these are the only tasks which can be executed anyway based on priority The scheduler allocates the task with the currently highest priority to the CPU The task retains the CPU until a task with a higher priority becomes ready for execution and is granted the CPU Round robin 9 6 If the scheduler finds several tasks with the same priority a clear decision is im possible These tasks are then executed using the round robin procedure With the round robin procedure tasks of the same priority are granted CPU time for a certain interval Processor allocation changes cyclically This procedure requires that the interval of CPU allocation i e the round robin time interval be specified Selection of the round robin time interval e f selecte
64. to expire Deblock Similar to the block change in state the operating system executes this change in state when the waiting condition stated before is con cluded Conclude A task is concluded after it has fulfilled its purpose i e has been executed completely The computing task can initiate this change in state with the system call conclude task or conclude task and start again after expiration of a time interval SICOMP IMC System Manual J31069 D2001 U001 A0 7618 9 15 Software 9 3 4 Configuration Configuration is the adjustment of the RMOS operating system to different com puter systems and application requirements To adapt to a hardware interface the hardware dependent software parts of the operating system e g the drivers can be modified or have already been specified as configuration files Drivers can be removed or added To adapt to the application requirements memory and code requirements can be optimized by adjusting the software interface i e leave out unnecessary SVCs RMOS is adapted to different hardware interfaces by editing configuration files Comprehensive adjustment of the operating system to an application is shown in the figure below RMOS MOS RMOS User tasks con d Drivers nucleus I I I Editing assem bling or compil ing Assembling or compiling Assembling or compiling
65. to the support braces over a large surface good conductivity using toothed contact washers The support braces must also be connected to the cabinet housing over a large surface good conductivity If the devices are mounted on a wall the de vice housing must be connected to the grounding potential e g protective con ductor rail with a minimum cross section of 10 mm f Use of galvanically isolated boards 12 10 Use of galvanically isolated boards is preferred for SICOMP IMC systems SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Environmental Requirements g Restriction of cable lengths To limit the effects of interference the cables should be kept as short as possible The lengths specified below may not be exceeded Table 12 4 Permissible cable lengths for digital signal cables when installed in a com mon cable Type of Signal Cable Length Cable Length Unshielded Shielded Outputs 400 m 1000 m Inputs 24 V DC 600 m 1000 m Inputs 200 V AC 600 m 1000 m Table 12 5 Permissible cable lengths for analog signal cables when installed in a com mon cable Type of Signal Cable Length Permissible Difference Shielded in Potential For Ug 50 mV 50m 1 0V For Ug 500 mV 200 m 1 0V Note For information on the required minimum cross section of signal cables and other specifications see the product documentation of the boards h Shielding of the wi
66. using these sample systems to link the system expansion to the customer system This prevents programming errors and any wiring or hardware errors can be located more easily The sample applications included with the board support packages are also helpful If you do not have a board support package memory or input output accesses must be performed based on the type of board During an initial function test a debugger e g MS DOS or RMOS Low Level Debugger can be used to access the board During commissioning a terminal should also be used connection to serial inter face so that you can view the error messages output by the operating system This is helpful when localizing the cause of an error In addition all return values of the RMOS calls should be evaluated so that you can detect faulty functions from the start SICOMP IMC System Manual J31069 D2001 U001 A0 7618 11 9 Commissioning Testing and Debugging 11 6 Testand Debugging under RMOS The following testing resources are available for testing RMOS user tasks and driv ers e High level language debugging High level language debugger XDB386 from the CAD UL company Hardware emulator ICE operating system independent testing resource Testing resources of the operating system As a supplement to high level language debugging the operating system offers the following resources RMOS debugger for low level debugging at the Assembler level Resour
67. usually sub D technology Color of the outside Ergo gray Mounting dimensions In acc w internal specifications Labeling In acc w internal specifications Accessories Short front plate for installation in systems with total locking Front system Flat front plate with fixed pull handle 2 8 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System 2 4 Signals of the Bus Interface Table 2 4 Signal assignment for the SMP16 bus Pin Pin Row A Pin Row B Pin Row C Signal Circuiting Signal Circuiting Signal Circuiting 1 15V V2 A16 V1 R1 12V V2 2 3 3 V V3 A17 V1 R1 GND V3 3 AEN 5 V V3 4 CLK V1 R1 MMIO V1 R1 5 MEMCS16 V1 R1 DREQO A12 V1 R1 6 RESET V1 R1 DREQ1 AO V1 R1 7 ALE V1 R1 DACKO A13 V1 R1 8 MEMR V1 R1 Z1 DACK1 1 Al V1 R1 9 RESIN V1 A14 V1 R1 10 MEMW V1 R1 Z1 A2 V1 R1 11 Reserved A15 V1 R1 12 RDYIN V1 R1 PWFAIL A3 V1 R1 13 BUSEN V1 R1 Reserved R1 NMI 14 DBO V1 R1 3 3 V V3 A4 V1 R1 15 HOLDA 3 V1 R1 5V V3 IRQO 16 DB1 V1 R1 GND V3 A5 V1 R1 17 HOLD 9 V1 R1 GND V3 IRQ1 18 DB2 V1 R1 3 A6 V1 R1 19 INT V1 R1 ICASO 8 4 IRQ2 20 DB3 V1 R1 ICAS194 A7 V1 R1 21 lOCS16 V1 R1 ICAS2394
68. 01 U001 A0 7618 12 15 Environmental Requirements 12 5 Physical Requirements This chapter lists the physical environmental requirements for operation trans portation and storage of SMP16 AMS and PMC boards The requirements are specified for standard products Table 12 7 Physical requirements for devices and boards without mass memory Factor Operation Transportation and Storage Oscillation stress in acc w DIN IEC 68 2 6 Fc test 20 cycles on 3 axes 10 to 61 Hz 0 2 mm amplitude 61 to 500 Hz 19 6 m s 10 cycles on 3 axes 5 to 9 Hz 3 5 mm amplitude 9 to 500 Hz 9 8 m s Shock stress in acc w DIN IEC 68 2 27 Ea test half sine 3 each per axis in both directions 300 m s 11 msec Shock stress in acc w DIN IEC 68 2 29 Half sine 1000 shocks per axis 250 m s 6 msec Requirements on devices and boards with mass memory depend on the drives being used For details see the product documentation 12 16 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Environmental Requirements 12 6 12 6 1 Table 12 8 Electrical Safety Requirements at the System Level Requirements for the components of a system Factor Requirement Validity VDE 0106 part 1 IEC 536 Protection class with protective conductor For boards with power supplies Protection against foreign bodes and water in acc w EN 60 529 Protection against
69. 069 D2001 U001 A0 7618 7 13 Power Supplies Pin SMP E441 A2 SMP16 SV330 SMP16 SV430 SMP16 SV431 SMP16 SV531 4 SD ER 5 V 5 V 6 PE PF PE PF 8 0 VF OV 0 VF 0 VF 10 5 VF 5 V 5 VF 5 VF 12 5 V oV 5 V 5 V 14 12 V 5 V 15 V 12 V 12 V 16 OV 0 VF OV OV OV 18 OV 5 V OV OV OV 20 7 OV ER 22 12V 3 3 V 15V 12 V 12 V 24 3 3 VF 26 12 VF 3 3 V 28 Ue 24 VDC Power Power Power 30 Ue 0 VDC 3 3 V Power Power Power 32 PE PE PE PE SICOMP IMC System Manual 7 14 J31069 D2001 U001 A0 7618 System Layout 8 Table of Contents 8 1 8 2 8 3 8 3 1 8 3 2 8 3 3 8 3 4 8 3 5 8 4 8 5 8 6 8 7 8 7 1 8 7 2 8 7 3 8 7 4 8 7 5 8 7 6 8 7 7 8 8 8 8 1 8 8 2 8 8 3 8 8 4 8 8 5 8 8 6 8 8 7 8 8 8 8 8 9 8 8 10 The Inch Layout System 0 c cece tees 8 2 Receptacles aat E EATER RETEN TRR TORTAR Sri cce em System Modules 0000 cece eee eee nes Bus Backplanes 34 codecs edo etra Ohi aaah uae Rb edd Bus Coupling Boards sasesana dias iaee aaien a aii iin doa E aaa Backup Battery 2a cciceitercpeeedoreienideterverdovethenedae dieen Mechanical Accessories Boards soeur tetas arises Seba dnd Gan sa ORAN i Plug In Connectors o sasita wa maada ai pa aa tent ees Placement of the Boards in the System ssseeuuuue Information on
70. 1 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Assembling Center Selection 6HE subrack as system basis See also KT51 or KT1 catalog System Fan Prepared for SMP 16 AMS M431 SYS562 AMS M551 X X Other The following forms show the upper and lower system row of the 6HE subrack Bus backplanes Enter type and slot area 1 2 3 4 5 6 7 8 9 10 1 12 13 14 55 16 17 18 19 20 21 Configuration Enter board or position on piece list Enter retrofit kit AMS SMP16 AMS Z451 or SMP16 ZUB451 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Dummy covers Check empty slots to be covered 4 2 537 47155 56 2 8 9 30 11 12 13 14 15 146 17 i8 19 20 21 Locking Enter S for total locking and E for individual locking 152323 745 5 26 727 138 9 10 11 12 13 14 15 16 17 18 19 20 21 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 6 3 Assembling Center Operating system software Version Installed Included MS DOS MS Windows RMOS Other
71. 22 GND v3 D7 Vi R22 30 D amp Vi R22 D9 Vi R22 D10 Vi R22 31 D11 Vi R22 biz Vi R22 D13 Vi R22 32 D14 Vi R22 GND v3 D15 Vi R22 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 3 9 AMS System 3 4 1 Information on Table LEERER MERKER The signals of the AMS bus are combined into groups to protect against mutual crosstalk The groups are indicated in the table with double lines Signal column An asterisk after a signal name identifies it as a low active signal Reserved connections are provided for future or special applications and may not be used for special signals Circuiting column The left hand columns show the connections established by the bus backplane between the connections of the individual slots The right hand columns show the terminating circuits on the bus backplane Connection Meaning V1 Narrow cable on the bus backplane which connects connections with the same connection row and number for all bus slots V2 Wide cable on the bus backplane which connects connections with the same connection row and number for all bus slots V3 Connection with a through conductor level on the bus backplane Non through connection Termination Meaning R5 Termination of the bus cable with a pull up resistor of 510 Q against 5 V R10 Termination of the bus cable with a pull up resistor of 1 0 KQ against 5 V R22 Termination of
72. 45V 37 GND 38 STOP 39 GND 40 LOCK 39 PERR 40 GND 41 SDONE 42 SBO 41 33V 42 SERR 43 PAR 44 GND 43 C BE1 44 GND 45 V W O 46 AD15 45 AD14 46 AD13 47 AD12 48 AD11 47 GND 48 AD10 49 ADOS 50 5V 49 ADO8 50 433V 51 GND 52 C BEO 51 ADO7 52 Reserved 53 ADO6 54 ADOS 53 3 3 V 54 Reserved 55 ADO4 56 GND 55 Reserved 56 GND 57 V I O 58 ADOS 57 Reserved 58 Reserved 59 ADO2 60 ADOT 59 GND 60 Reserved 61 ADOO 62 45V 61 ACK64 62 43 3V 63 GND 64 REQ64 63 GND 64 Reserved Allocation corresponds to IEEE P1368 1 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 4 15 PCI System 4 4 List of References 1 Industrial PCI IPCI Version 1 4 Technical Specification 2 IEEE P1386 1 draft 1 6 PCI Mezzanine Cards dated 04 04 95 3 IEEE P1386 draft 2 0 Common Mezzanine Card Family dated 04 04 95 SICOMP IMC System Manual 4 16 J31069 D2001 U001 A0 7618 Compact Computer 5 In performance the product line of the SICOMP IMC compact computers repre sents the entrance to the SICOMP IMC world The products included in this prod uct line have the primary features described below Compact hardware layout The primary functions needed in the automation world today are located in a com pact device whose simple installation directly implements the man machine inter face e Closed and open loop control Operator contr
73. 5 0 uses the first 24 bits as network bits i e they repre sent the network address 256 different subnetworks with 256 computers each can be addressed in this way SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 11 Communication 31 0 Version IHL Type of service Total length Identification Flags Fragment offset Time to live Protocol Header checksum Source address Destination address Payload Figure 10 4 IP data format The header field of the IP data format contains the version of the header field the Internet header length IHL the QOS parameters and an identification code seg mentation aid among others With the exception of the absolute length the posi tion of the individual fragments is also specified In addition to the source and des tination address the time to live value TTL is an important field in the header It specifies how long the datagram has to live This is the maximum number of rout ers which the datagram can pass Data which are only intended for the local net work can have a low TTL value while other data which are intended for a wider circle require a higher value This prevents the data from wandering around the network endlessly when an error occurs The protocol field identifies the protocol of the higher level e g TCP in our example The header is protected by a 16 bit checksum The user data are transmitted in the payload field i e
74. 6g 9g 12g 18g 20g SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Pin strip 9 to 37 pin 3 0 15 3 0 15 With crimp connection With insulation displacement connection 11 max 3 5 max _ 4 1 78 max G G 1 5 max 10 8 13 5 max 2 15 9 max 3 For missing dimensions see above For missing dimensions see above Number Strip Dimensions in mm of Pins A B C D E G Pin 0 76 0 25 40 25 0 76 0 3 Socket 0 76 0 25 0 25 0 76 0 25 9 Pin 31 19 16 79 25 0 12 0 13 8 23 12 93 6 12 9 Socket 31 19 16 46 25 0 12 0 13 8 02 12 93 6 3 15 Pin 39 52 25 12 33 3 0 15 0 1 8 23 12 93 6 12 15 Socket 39 52 24 79 33 3 0 15 0 1 8 02 12 93 6 3 25 Pin 53 42 38 84 47 04 0 13 8 23 12 93 5 99 25 Socket 53 42 38 5 47 04 0 13 8 02 12 93 6 3 37 Pin 69 7 55 3 63 5 0 13 8 23 12 93 5 99 37 Socket 69 7 54 96 63 5 0 13 8 02 12 93 6 3 50 Pin 67 31 52 68 61 1 0 14 0 11 10 95 15 75 5 99 50 Socket 67 31 52 55 61 1 0 14 0 11 10 87 15 75 6 3 Figure 8 12 Dimensional drawing of subminiature plug connectors SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Housing side Pin number Dimensions mm B D 1 15 3104 2499 2123 1255 1 VESANGA 3104 2499 2123 1255 2 26 39 4 33 3 21 2 12 5 Figure 8 13 Dimensional drawing of 3 row subminia
75. A0 7618 Communication Transport oriented layers 1 to 4 Layers 1 2 and 4 are an absolute requirement for realistic sufficient and reliable communication Layer 1 specifies the physical conditions e g current and voltage level among others Layer 2 defines the access mechanism and addressing of the station i e only one station can send data via the bus at a time Layer 4 i e the transport layer ensures data security and consistency In addition to transport control the transport layer handles tasks involving flow con trol and blocking and acknowledgment Connections e g channels and commu nication relationships are established to implement these functions User oriented layers 5 to 7 Session layer 5 i e the communication control layer handles the synchronization of communication Layer 6 handles the coding of data in a common language Application layer 7 contains the user services e g FMS SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 7 Communication 10 1 2 TCP IP Protocol The TCP IP protocol is part of the Internet protocol family It is the basis of the increasingly popular worldwide Internet i e a combination of many individual com puter networks which began in the 1970s Currently several million computers are connected in many thousands of networks under Internet This was all first made possible by the uniform TCP IP protocol whose goal is connection of
76. COMP IMC System Manual J31069 D2001 U001 A0 7618 12 9 Environmental Requirements e Equipotential bonding and or grounding When SICOMP IMC is used on machines or in industrial systems a grounded ref erence potential must be used With extensive systems ground fault monitoring may make it necessary to leave the reference potential ungrounded e g in the chemicals industry or for power plants SICOMP IMC systems do not have an internal low ohmic connection between the housing system frame and reference potential 0 V If required this must be established from the outside Remember that certain I O devices e g monitors printers PCs and SIMATIC controllers may create such connections When several such I O devices are used unacceptably high equipotential bonding currents may be created which must be led off via an equipotential bonding cable minimum cross section 10 mm This also applies when shielded devices have been connected to different site grounding points with potential differences A low ohmic equipotential bonding cable is required for two sided grounding of the cable shields of the digital signal cables which provides particularly good deflection of high frequency interference Their resistance may not exceed approximately 1096 of the shield braiding resistance For analog signals see section b Shield ing of data and signal cables To establish a conductive connection the system frames must be secured
77. Carrier Sense Multiple Access Collision Resolve Differential single ended Type of information transmission Differential Transmission via two signal cables The information is indicated by the voltage difference in the signal cables e Single ended Transmission via one signal cable The information is indicated by the voltage level of the signal cable in relation to the generally valid reference potential Ground Potential of grounding mass at the site of a system Grounding Conductive connection of a part of a system belonging to the operational current circuit with the surrounding grounding mass SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Glossary 1 Glossary Abbreviations HF application High frequency currents can be obtained almost without power loss Intrinsically safe area Area in which sparks created by bus stations may not cause an explosion iPCI Industrial Peripheral Component Interconnection Mass ground Designation for freely definable reference potentials in systems MTBF Mean Time Between Failures Statistically determined interval between theoretical occurrence of two faults Open system System for which the system interfaces are available to everyone PAL Equipotential bonding conductor PBB Product release letter Included with boards or software packages on delivery Contains important infor mation on use of the product PCI Peripheral Component Interconnection Prod
78. Communication boards SMP16 COM CPU boards SMP16 CPU I O controller SMP16 CTR Input output boards SMP16 EA Input output modules SMP16 EAM Memory boards SMP16 MEM Special function boards SMP16 SFT Power supplies SMP16 SV Mechanics components SMP16 SYS Rack boards for modules SMP16 TBG Accessories SMP16 ZUB SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 7 SMP16 System 2 9 General Technical Description 160 mm gt I O connections optional Configuration side Q nl 100 mm 1 SIEMENS m Pull handle Plug in direction oles bus connector Figure 2 2 Physical layout of SMP16 boards Table 2 3 Dimensions of SMP16 boards Dimensions of SMP16 Boards Length 160 mm Height 100 mm Thickness of the PCB 1 6 mm 40 2 mm Front plate Aluminium 2 5 mm thick Max height of the components 14mm Length of the connections or thickness of the components on the back of the PCB Max of 2 0 mm At least 2 5 mm free on the upper and lower edge of the PCBs so that the boards can be pushed freely along the guide rails Locking Single locking with screws Pull handle Fixed pull handle with space for labeling e g logo or board designation I O plug connector Connectors suitable for the functions
79. Compling or linking Y Compiled application Loading Building or locating Finished MEME ZZ application Figure 9 6 Configuration of the operating system Hardware configuration Configuration is the adjustment of the operating system to the specific hardware interface i e existing boards and the software interface required by the applica tions The routines for using the hardware are located in the configuration library and are provided to the operating system by appropriate calls during system startup RmInitOS These routines ensure correct handling of the interrupt con troller initialization of the timer block and the output of messages during system startup SICOMP IMC System Manual 9 16 J31069 D2001 U001 A0 7618 Software System startup is specified in the RMCONF C file where all necessary configura tion calls are made Software configuration Software configuration is also performed during system startup using calls of the configuration library This permits certain operating system tasks e g error log ger debugger and resource reporter to be initialized In addition the drivers and units are installed BYT and hard disk Task configuration A task is always managed by two data structures the TCD block Task Control Data and the TCB block dynamic Task Control Block Both structures are contained in a special header file RMTYPES H where they can be r
80. Execu tion of programs i e tasks is handled by only one processor In this environ ment task management means the assignment of the CPU to one task so that the CPU can execute it SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Software Allocation SICOMP IMC J31069 D2001 N dE Real time Want to be operating executed system Coordinates execution of the tasks Figure 9 2 Multitasking operating system The next few sections describe the principles by which a real time operating sys tem manages the tasks and allocates them to the CPU Principles of Multitasking The principles below permit a real time operating system to execute several tasks of priorities Each task is assigned a certain priority The priority indicates the importance of the task to be executed This priority is required to decide which task will be granted CPU time when sev eral tasks want to be executed i e all tasks which are in ready status With a system containing tasks of different priorities frequency of execution in creases with increasing priority i e the execution speed increases in relation to the total system since higher priority tasks are granted more CPU time In addi tion time spent waiting for processor allocation decreases System Manual U001 A0 7618 9 5 Software Allocation Allocation The priority of a task is not static Some real time operating systems are able
81. ICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 31 System Layout Making the wrap connection 1 Make a wire table See example shown below WF 1 1 WF2 1 WF 1 3 WF2 3 WC1 1 WC1 2 L Pin Row Wrap field 2 Prepare wrap wires Cut and bare the required pieces of wire not necessary with self baring wrap tool with wire roll The amount of switching wire to be bared depends on the shape and size of the pin the diameter of the wire and the number of bare wire windings e g in acc w AWG no 30 Pin dimensions 0 6 x 0 6 mm pin diagonal of 0 85 mm Diameter 0 25 mm Number of windings 5 recommended for alloyed wire ex alloy 135 Length to be bared 18 0 41 0 mm 3 Make the wrap connections In the first layer do the short wires first and then the long wires In the second layer do the long wires first and then the short wires The end of the wire does not have to hug the wrap pin closely and can protrude tangentially up to a single diameter of the wire The wrap pins on SMP16 and AMS boards are 6 mm in length and permit a maxi mum of two wiring levels On bus backplanes the wrap pins are approximately 10 mm in length and permit a maximum of three wiring levels Caution The two windings of a short wrap connection must be located in the same wiring level otherwise there is a danger of short circuiting If wrap pins are used as turning points the wrap wire may not hug the corners tightly
82. MET n ed del del es i 1s NET ud qu EN I ed del del des i To NE T l ud eo TUNE O JP ed del del diag i vd Miss T E a tid O I ed del del diag i TT j HI T DET olilo Oji o i l i X t i l i 7 Oo fo O O r r ole teal Wai NS Ot B ne oom nein pebidheb de mal teal CO r i nen fia fied E fran ial T NE ud dens Fr a kenn Drees reed i a s i Wan dde I I Deven Dein c Pod TOR es i S T mal W i i SE M b E E gus e ee a j 44 iPCl backplane Slots for additional Slots for power supplies Slots for additional AMS boards or ifneeded iPCI boards SMP16 bus segments Figure 4 5 Sample configuration for AMS with iPCI and SMP16 bus backplane SICOMP IMC System Manual J31069 D2001 U001 A0 7618 4 9 PCI System 4 2 3 Signals of the Bus Interfaces The following bus connectors are defined in accordance with PCI specification V2 0 e Basic connector for 32 bit PCI different for system slot and I O slots Connector for 64 bit expansion Connector for I O expansion Baseconnector for 32 bit PCI Table 4 3 iPCI base connector for system slot CPU slot Connection a b c d e 1 VCC3 REQ64 ACK64 ADO AD1 2 AD2 AD3 GND AD4 AD5 3 AD6 VCC AD7 C BEO GND 4 GND AD8 AD9 VCC3 M66EN 5 AD10 VCC3 AD11 AD12 GND 6 AD13 AD14 GND AD15 C BE1 7 GND PAR SERR VIO SBO 8 SDONE VCC3 PERR LOCK VCC 9 GND
83. Mounting 0 0 0 eee III Connecting the Guides sssssssssssssssesess esee Mounting the Wiring Shield Plate 0 00 c cece cece eee Bus Backplane erra RR RE bre ac Ree e n ets Installing the Boards 00 cece I Installing and Removing the Boards 0 cece eee eee eee Mounting the Cabinets and Housings 00eee ee eeee ee eee Multiple Row Systems Special Systems and Cable Fabrication WING sete eee dees deen Read eee vawanadeeegadaha REPRE Baring of Cables sarritan 0 0 cece eee een ER Tagging the Cable Ends 2 0 0 cece eee eee eee eee Wrap Connections ssssssssssssssse e n nnas Wiring Cable Harnesses 0000 0c cece eee ee tee eee Grimplng vs esrsst s sade E RU ieee ded CENE RU daa RES Insulation Displacement Connector Technique Screw Connections 00 cece es Plug In Connections sssssssssssesse eee Wiring the Power Supply on the Subrack 0000 eee eee Line Installation 00 0 cee eee eens SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 1 System Layout 8 1 The Inch Layout System The physical layout of SICOMP IMC microcomputer board systems is based on the DIN 41 494 standard covering the layout of electronic systems This standard provides for four levels Level 4 Receptacles Housing frames and cabinets for holding subracks and boards of level 3 an
84. SIEMENS SICOMP IMC Industrial Microcomputer System Manual 6AR1950 7AA00 2CA0 Release 09 98 SICOMP IMC System Compact Computer Assembling Center Power Supplies System Layout CD UU 2 no 1 9 O B ap eo JU o 3 2 2 3 D o LD O 3 D o Oo 3 m 3 3 E o e Co J o Ol Js oO N O o 3 3 5 2 B 5 e Commissioning Testing and gJ D c e e ae um umb Environmental Requirements N Service System Consulting Training C2 Glossary Abbreviations Safety Guidelines This manual contains notices which you should observe to ensure your own personal safety as well as to protect the product and connected equipment These notices are highlighted in the manual by a warning triangle and are marked as follows according to the level of danger Danger proper precautions are not taken indicates that death severe personal injury or substantial property damage will result if Warning gt proper precautions are not taken indicates that death severe personal injury or substantial property damage can result if Caution are not taken indicates that minor personal injury or property damage can result if proper precautions Note draws your attention to particularly important information on the product handling the product or to a particular part of the documentation Qualified Personnel
85. STOP DEVSEL TRDY IRDY 10 FRAME C BE2 GND AD16 AD17 11 AD18 VIO AD19 AD20 GND 12 GND AD21 AD22 VCC AD23 13 VCC VCC3 GND VCC C BE3 14 AD24 VIO AD25 AD26 GND 15 AD27 AD28 GND AD29 AD30 16 GND AD31 X1 REQ1 GNT1 17 REQ2 VCC3 GNT2 REQ3 VCC 18 GND GNT3 REQ4 VIO GNT4 19 CLK1 RST SLEEP X2 X3 20 CLK2 NMI X4 X5 GND 21 GND X6 INTD VCC3 INTC 22 CLK3 VCC INTB INTA N12 23 CLK4 RSTIN VCC ICPEN P12 24 VCC3 USB USB OSC VBATT SICOMP IMC System Manual 4 10 J31069 D2001 U001 A0 7618 PCI System Table 4 4 iPCI basic connector for I O slot Connection a b c d e 1 VCC3 REQ64 ACK64 ADO AD1 2 AD2 AD3 GND AD4 AD5 3 AD6 VCC AD7 C BEO GND 4 GND AD8 AD9 VCC3 M66EN 5 AD10 VCC3 AD11 AD12 GND 6 AD13 AD14 GND AD15 C BE1 7 GND PAR SERR VIO SBO 8 SDONE VCC3 PERR LOCK VCC 9 GND STOP DEVSEL TRDY IRDY 10 FRAME C BE2 GND AD16 AD17 11 AD18 VIO AD19 AD20 GND 12 GND AD21 AD22 VCC AD23 13 VCC VCC3 GND VCC C BE3 14 AD24 VIO AD25 AD26 GND 15 AD27 AD28 GND AD29 AD30 16 GND AD31 X1 REQ GNT 17 IDSELO VCC3 IDSEL1 IDSEL2 VCC 18 GND GND GND VIO GND 19 CLK RST SLEEP X2 X3 20 GND NMI X4 X5 GND 21 GND X6 INTD VCC3 INTC 22 GND VCC INTB INTA N12 23 GND RSTIN VCC ICPEN P12 24 VCC3 USB USB OSC VBATT The entries in bold type differentiate the I O slots from the system slot Both tables show a view of the backpla
86. a CAN and the AS interface in the transparent commu nication environment are all ensured The entire automation task can be implemented on a fully integrated uniform hard ware and software platform The user is totally flexible since products of other manufacturers can also be linked to the open standardized networks via standard ized software interfaces i e an open system The networks form the backbone of the entire automation solution Familiar indus trial standards open the system to all sides Industrial networks 10 2 e Industrial Ethernet IEEE 802 3 The international standard for area and cell networks e PROFIBUS EN 50 170 The international standard for field and cell networks for a small number of sta tions CAN ISO 11 898 The international standard for the actuator sensor area for short distances Special industrial conditions e g electromagnetic fields of interference corrosive fluids and air increased dirt or mechanical stress place a high strain on network components SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Communication SICOMP IMC products were especially developed for industrial use and are found today in a wide variety of sectors Some examples e Automotive industry Chemicals industry Electrical industry Power plant technology Mechanical engineering e Food industry e Paper and printing industry e Traffic engineering e Water and waste water technology
87. a command length of more than 500 nsec A slave board which always uses RDYIN to extend commands must activate RDYIN for at least the amount of time required by the command RDYIN may then only be deactivated by slave boards for a maximum of 8 usec when an address which is valid for the board and an active command are present SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 21 SMP16 System 2 5 7 Command Delays and Wait Cycles To adjust the bus timing of a bus master to the requirements of a slave board and to make the SMP16 bus available to a wide variety of I O blocks and controllers in simple and inexpensive applications it may be necessary to extend bus accesses on the bus master with command delays and additional permanently set wait cycles The length of the command delays and wait cycles is usually derived from an inter nal clock pulse of the bus master and specified by the number of clock pulse cycles set Altogether a bus access by the bus master is increased by the bus master by the command delay times plus the permanently set wait cycles Command delays During command delays activation of the command signals is delayed by a certain amount of time after the address becomes valid The command delay must be set so that the actual command length is not decreased to less than the minimum command length Wait cycles 2 22 The wait cycles permanently set on the bus master can be used to increase the len
88. able communication relationships very flexible simple to use in actual practice and easy to change SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Communication Bus cables for PROFIBUS See table 10 1 Protocol profiles for all applications in the field area Protocol profiles in accordance with EN 50 170 volume 2 PROFIBUS PROFIBUS FMS Fieldbus Message Specification PROFIBUS FMS is suitable for communication of programmable controllers within small cell networks and for communication with field devices with FMS interfaces PROFIBUS DP Decentral Periphery PROFIBUS DP is the protocol profile for connection of decentralized I O e g ET 200 with very fast reaction times PROFIBUS PA Process Automation PROFIBUS PA is the communication compatible expansion of PROFIBUS DP with a transmission technique which can be used in explosion proof areas The transmission technique used by PROFIBUS PA conforms to international standard IEC 1158 2 SEND RECEIVE FDL interface All protocol profiles can be used together on one cable RS 485 or fiber optic con ductor Possible connections Simple cabling using electrical and optical transmission technology Long distances can be implemented Possible connection of a wide variety of Siemens field devices automation sys tems and systems of other manufacturers for implementation of small cell net works Mixed use of programmable controllers and field devices possibl
89. acks a total or single locking mechanism is provided for the board front plates on the subrack SICOMP IMC System Manual J31069 D2001 U001 A0 7618 3 7 AMS System End piece with level End piecefor for single locking totallocking conductive coating Contact spring for groundconnection CY f P an f lever AMS metal fornt plate Pulling eye AMS metal front plate AMS metal front plate Figure 3 3 Previous design of front plate end pieces for total and single locking mechanism AMS boards can be adjusted for total or individual locking by changing the end pieces The required accessories are available with detailed instructions See fig ure LEERER MERKER With end pieces for total locking the grounding connec tion of the front plate to the subrack is achieved by placing the contact springs in the end pieces With end pieces for individual locking the conductive coating of the end pieces is used Front plates for total locking are equipped with pull eyes into which pull levers are snapped These can be used to detach boards installed in the frame from the ba sic plug connectors The front edge of AMS front plates is located at the front level The front plates are designed for use in ES902C subracks They are screwed to the subrack Figure 3 4 New design of the front plate U profile front plate with ejector lever SICOMP IMC System Manual 3 8 J31069 D2001 U001 A0 7618 AMS
90. ain board related software firmware in the form of EPROM blocks and or installation and driver software on floppy disk In addition these packages include commissioning documentation SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System Table 3 1 AMS system data AMS System Data System configuration Multimaster system max of 16 bus master boards possible System bus Asynchronous separate data and address bus Transfer speed 10 Mbyte sec Slots Max of 21 per 19 inch system row Data width 16 bits Address areas 16 Mbytes of memory addresses 64 Kbytes of input output addresses Interrupt system Depends on the bus master board used Communication between bus Via onboard dual port RAM masters Board configuration With wrap jumpers with local registers Ability to be coupled to other buses SMP16 iPCI Plug in system Indirect 96 pin in acc w DIN 41612 EMC and environmental compati CE conformance See chapter 12 bility Ventilation No fan Exception High performance CPUs See chapter 12 4 Backup battery See chapter 8 Supply voltages 5 V 5 96 43 3 V 5 96 optional 1 12 V 5 optional 15 V 3 optional 1 Requirements may differ for specific boards SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System 3 2 3 2 1 Function Description Bus Elements Bus master A bus m
91. akes it easy for the user to switch to CAD UL tools CAD UL CC386 The CC386 is a powerful C and C compiler It generates ROM capability pro tected mode code for the conventional memory models i e FLAT SMALL COM PACT and LARGE The compiler contains many settable optimization methods regarding runtime and resource requirements as well as intrinsic functions e g for direct hardware access from C This makes the CC386 particularly suitable for real time and embedded applications It generates output in OMF format Gener ation of Assembler output can also be set CAD UL AS386 Structure Macro Cross Assembler The CAD UL AS386 is a cross assembler with extensive macro functionality and control structures It was developed as an assembler tool for programmers who work close to the hardware Provision of clearly organized listing files in addition to cross reference capabilities and the symbol map make the CAD UL AS386 a pow erful cross development tool for program requirements close to the hardware SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Software CAD UL LINK386 CAD UL LINK386 links the input modules linkable OMF386 format to an output module One of the following formats can also be generated instead as the output format Intel linkable OMF386 loadable OMF386 or boot loadable OMF386 LINK386 provides the compiler and builder functionality of a tool If desired only the compiler can be called to support
92. al J31069 D2001 U001 A0 7618 Communication 1 0 Table of Contents 10 1 Introduction and System Design 10 1 1 ISO Layer Model 0 ccc onnen ne a iiai 10 1 2 TCP IP Protocol ispisna a aaa dan ipa a a OE aa m 10 1 8 AT TP Protocol uc enmt dadi em tte etd ets 10 2 Industrial Ethernet serc arr taera tor Aer EEE EEDE E EA RA ek EWOU eoar E ATA bre dk t RU ke een ese aa uda 10 2 2 Industrial Ethernet Network Configurations 00eeee eae 10 16 10 3 PROFIBUS 2 sso nee RRa edu ek RED eme x id oae needs 10 17 TOS Layout insu eddie ee pede ee eae eee evade eevee 10 20 10 3 2 PROFIBUS Network Configurations 00 cece eee eee 10 22 10 4 Controller Area Network CAN 10 4 14 Physical Structure 0 0 cece 10 4 2 Features of the Protocol llssssieseeeseeeee ee 10 4 3 S mimlary cinese Re he px EE URESUERE CREE RR Rd Reads 10 5 Remote Maintenance and Remote Diagnosis Via Internet 10 27 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 1 Communication 10 1 Introduction and System Design Fully integrated automation Fully integrated automation with SICOMP IMC means that all automation tasks can be solved with a single completely integrated and transparent system SICOMP IMC networks provide uniform communication from the control level down to the field level Openness to office networks via TCP IP integration of the actuator and sensor level vi
93. al clause external customer Export of contractual objects and documents may be subject to authorization e g due to their type or their purpose Precedence is given to the export identifiers specified in order confirmations deliv ery slips and invoices SICOMP IMC System Manual 13 10 J31069 D2001 U001 A0 7618 Service System Consulting Training 13 4 Training Service Courses are available in German for the SICOMP IMC product family i e hard ware software operating systems and communication Other versions are also possible on request These courses are only held when needed and after coor dination If desired the courses can also be held on site Points of emphasis of these courses which are offered for developers and system personnel include the following topics System architecture Multi computer operation Networking Software tools Memory and input output addressing Interrupt management PC kernel and expansions Mass memory Operating modes Practical exercises Compact computers SICOMP IMC System Manual J31069 D2001 U001 A0 7618 13 11 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Glossary Abbreviations Area network Combination of several cell networks into a higher level system Broadcasting Simultaneous sending of a message to all bus stations Cell network Closed control unit cf area network CSMA CD Carrier Sense Multiple Access Collision Detect CSMA CR
94. and signal cables Data and signal cables must be shielded Regarding HF the shields must be firmly applied on both sides to the plug connector housing or to special shielding rails Meaning of shielding with regard to HF Large surface bare contact points Keep HF braided tapes as short as possible Do not use interconnecting wires Use metal cable clamps which encircle the cable shield e Use only metallized or metal plug connector housings With equipotential bonding make sure that no equalizing currents are flowing over shields Supplementary notes and information applicable especially to the respec tive boards are found in the EG statements of conformity Adherence is impera tive Note Coaxial cables are not considered shielded cables Triaxial cables must be used for cables longer than 10 m Braided shields should be used instead of foil shields When cables with foil shield are used the shield wire contact to the shield rail must be kept as short as pos sible approximately 3 cm The shield rail must be well connected good conduc tivity to the support brace the cabinet s housing and the central grounding point in the cabinet Cable shields must be applied in the cabinet to a shield rail near the cable lead in Braided shields must be secured to the shield rail over as large a surface as pos sible e g with metal tube binders which encircle the shield or PUK cable clamps Cable shields must be firmly appl
95. anes slightly 4 Insert the remaining screws and tighten all Generally it is sufficient to use a screw for every second slot Note Adjustment is particularly important when two bus backplanes are to be connected with a bus coupler See chapter 8 3 3 The bus coupler should also be included in the adjustment Caution Adhere to the ESD guidelines when handling the boards See chapter 8 7 4 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout 8 7 4 Installing the Boards Safety notes for SICOMP IMC boards ESD protective measures Adhere to the ESD guidelines Electrostatic Sensitive Device when handling the boards Never touch the boards unless required work makes this absolutely necessary When working with the boards use a conductive and grounded work surface Wear a grounding bracelet Never touch the pins connections or printed circuits of the boards Never permit the boards or components to be touched by chargeable objects e g synthetic materials Keep the boards or components at least 10 cm away from CRT units and televi sion sets Leave the boards in their special packaging until they are needed When regis tering boards etc do not remove the boards from their packaging or touch them Boards may only be installed or removed when the voltage is off Adhere to the ESD protection guidelines when this warning label is affixed to Siemens products ACHTUNG ATTENTION N
96. aster in a multimaster system must be able to generate this signal The bus clock pulse is always provided to the bus by a bus master only BPRN M gt M TP Bus priority in bus priority out BEBO Priority signals to prevent mutual blocking i e deadlock if several bus masters request the bus at the same time BREQ M lt gt M TP Bus request Bus request signal of a bus master board BUSY M gt S OC Bus busy Generated by the active bus master As long as the signal is active no other bus master can assume control CBRQ M gt M OC Common bus request Request signal of a bus master to the active bus master to enable control over the bus SICOMP IMC System Manual 3 14 J31069 D2001 U001 A0 7618 AMS System Special signals of the AMS bus Signals are grouped here which do not belong to the standard signals of the AMS bus and which can be used by the user if desired Bus connections AUXO to AUX5 are available for these signals The special signals which are actually used by the boards are listed in the respective product documentation Table 3 9 Special signals of the AMS bus Signal Signal Character Function Direction istic BERR M gt S OC Board error Failure signal e g of the failsafe timer or the watchdog DREQO S gt M OC DMA request DREQI Request for DMA transfer EXTO M gt S OC DMA exterminate EA Control signal to abort a DMA cycle MPRO S gt M OC Memory protect Disable signal for memory a
97. aster is the board which controls the bus The bus master performs this control function by using the bus allocation controller to assume control over the bus and then generating appropriate control and address signals or memory and input output addresses To perform these tasks the master is equipped with a CPU or a special controller with which the data can be transferred via the bus to and from other bus stations AMS bus architecture supports the use of several bus masters in one system A bus allocation controller ensures that each bus master can obtain control over the bus A bus master can work with the following operating modes Operating mode 1 The bus master may only execute one bus transfer per bus allocation When all bus masters are using this operating mode time behavior of the system is determined by the maximum duration of the BUSY interval Operating mode 2 The bus master has unrestricted control over the bus The bus can be disabled override for other bus masters and the regular duration of bus cycles can be exceeded bus timeout The length of the BUSY interval must not be consid ered here Operating mode 1 permits the user to estimate the total performance of his her system without having to think of unplanned time parameters e g bus timeout Operating mode 2 supports a wide range of applications and gives the user a large amount of room in which to implement his her applications Bus masters which are o
98. bility of tasks provi sion of necessary resources for execution and so on The following changes in state exist for individual task states SICOMP IMC System Manual 9 14 J31069 D2001 U001 A0 7618 Software Delete b Non existent lt Computing Conclud A Block Dormant Displace Allocate i Waiting Make available Deblock v Ready Figure 9 5 Change in task states Table 9 2 Change in task states State Meaning Create delete While the system is running tasks are redefined or deleted by al ready running tasks Make available For example the make available change in state is executed for an automatic start of the specified initialization task the start task sys tem call or the start request due to an interrupt Allocate displace The CPU is allocated to one of the ready tasks so that this task can be executed This task then assumes the computing state During its execution the task which is currently computing can be removed from the CPU i e displaced Execution of an interrupted task can be continued later Block The circumstances surrounding the wait state provide the reason for this change in state e g resources required for execution are not available Typical reasons for this change in state include system calls of the computing task with a wait condition e g wait for an input output function to be concluded or wait for a pause
99. ble gives it its own rigidity Use of double sided adhesive tape between the halves of the fold prevents unfolding Conductor 1 Direction of work Beg of cable Figure 8 23 Folding of ribbon cables Note Make sure that ribbon cables on or between boards do not rub on pins or other sharp edges SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Folding down to left I PE 7 2 Conductor 1 Folding down jl mm to right Ml Wis Orientation fold IUA with folding up ee and down u 7 Bending radius f 1mm Orientation fold with folding up Bending line Bending line r1 Conductor 1 Coordinate dim EMI Beg of cable Direction of work Figure 8 24 Example of folding for installation of ribbon cables Adhesive mounting AN Self adhesive mounting is mainly used to affix cable harnesses to metallic sur faces Warning Adhesives may not be used on vibration proof housings on cabinets outside closed rooms on unbaked paint on silicon treated or curved surfaces and under extreme operating temperatures For details see the specifications of the manufacturer Application of adhesives requires very careful attention Dirt and moisture cause poor adhesive connections Use alcohol or other agents to remove grease from the points of the device to which adhesive is to be applied Make the adhesiv
100. bus is led from one bus master to the next Output BPRO of the highest priority bus master is connected to input BPRN of the bus master with the next lower priority and so on The active level of this signal tells a bus master that no bus master with a higher priority requires the bus BPRN of the highest priority bus master must be connected to GND Parallel priority resolution This procedure is used for large systems with more than two bus masters and for rotating priority The external bus allocation circuit evaluates the BREQ bus requests of the bus master boards and gives the next bus access to the currently highest priority bus master via the BPRN priority input Using the common CBRQ request signal the bus master which is currently in control of the bus can determine whether other bus masters require the bus and give them control temporarily SICOMP IMC System Manual J31069 D2001 U001 A0 7618 3 19 AMS System 3 6 Combination of AMS SMP16 and SMP Components When AMS components are combined with SMP16 and SMP components re member to adhere the notes in chapter 2 6 Table 3 12 Compatibility of AMS backplanes Backplane Features Conditions Remarks AMS M401 Soldered e With AMS Z402 accessory Adjustment of the XACK bus signal e For ES902A system frames Not compatible with ES902C system frames AMS M402 A5 A18 A21 Insertion e With AMS Z402 accessory version 1 Adjustment of the XACK
101. bus signal e For ES902C system frames AMS M402 A5 A18 A21 Insertion e Active driver for adjustment of the XACK bus sig version 2 and remaining nal is integrated on the backplane types For ES902C system frames SICOMP IMC System Manual 3 20 J31069 D2001 U001 A0 7618 PCI System 4 Table of Contents 4 1 System Overview 0 aaa Eaa a a ea a a Aa alaa aa E tees 4 1 1 Bachplane Bus System 4 1 2 Located Expansion Bus 4 1 3 Nomenclature 0 0 0 4 2 IPCI System ssssecute Ia rep vns ved eas PUDE aaa n Res pd ws 4 2 1 General Technical Description 0000000 cece eee eee 4 2 2 Implementation on SICOMP IMC 4 2 3 Signals of the Bus Interfaces 000 cece eee eee 4 3 Local PCI Expansion BUS 000000 cece eee een eee 4 3 1 General 2 vae eU ERR RERQAR UNE EC RESCUE Ras 4 3 2 Signals of the PMC Module Interface 0 00 cece eee eee ee 4 4 List of References 0 00 cece cece tenet eee SICOMP IMC System Manual J31069 D2001 U001 A0 7618 4 1 PCI System 4 1 4 1 1 System Overview Backplane Bus System Introduction of PCI technology in industrial systems brought with it a demand for a PCI expansion which could be used in industrial environments Almost simulta neously the two specifications CPCI i e Compact PCI and iPCI i e Industrial PCI were developed in America and Europe respectively With membership in the SIPS e V came the intr
102. cal Link Modules with fiber optic conductors of glass or plastic OLMs permit an optical network to be set up with linear ring and star structures Simple plastic single fiber rings can be im plemented with OLPs Optical Link Plugs Terminals are directly connected to OLMs or OLPs Terminals are only connected to OLPs with passive PROFIBUS stations i e DP FMS slaves Single fiber rings cost optimized or two fiber rings increased network availability can be used for the optical rings Mixed network Structures of electrical and optical PROFIBUS networks can be mixed The transition between the two mediums is provided by the OLM During commu nication between stations on the bus there is no difference in electrical and optical transmission technology Up to 127 stations can be connected to one PROFIBUS network SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 21 Communication 10 3 2 PROFIBUS Network Configurations Electrical network 10 22 The electrical network can be configured with a linear or tree structure Features Physically and electrically high quality bus cable RS 485 transmission procedure in acc w EIA Bus structure with bus terminals and bus connection plugs for connection of the PROFIBUS stations IEC 1158 2 transmission procedure for intrinsically safe areas Bus structure with screw terminals powering via the bus possible Simple uniform mounting and grounding Simple insta
103. ccess the mailbox and read the first message in the waiting queue Shared memory Data communication via a common memory area i e shared memory is recom mended for situations in which fast access to current data is important The re quired information is written by a task to a particular memory location and is then read by another task Information previously contained in this memory location is overwritten This means that the current data record is always accessed How ever the user must design his her program so that two or more tasks cannot ac cess this memory at the same time Otherwise incorrect or disconnected data might be introduced to the system SICOMP IMC System Manual J31069 D2001 U001 A0 7618 9 7 Software Semaphores Tasks must be coordinated to prevent them from colliding This particularly applies to accesses to a common memory area i e shared memory or accesses to com mon resources Semaphores are available for coordination of the individual tasks When a semaphore is set access to a certain device or shared memory is re served for one task Not until the semaphore is released can another task access this device or memory area If a task requests a reserved semaphore this task is put into the wait state until the semaphore is released SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Software 9 2 Operating Systems Which Can Be Used 9 2 1 RMOS3 SICOMP RMOS3 is an operating syste
104. ccesses PAUX Power auxiliary Auxiliary input for additional supply voltage PFIN S gt M OC Power failure interrupt Indication of the power pack of a failure of the primary voltage supply After the signal becomes active 10 msec remain to save the system state PFSN S gt M OC Power failure status Indicates whether a warm or cold start has been performed after return of power RESET S gt M OC Reset Control signal for resetting one or more boards WDOGO M gt S OC Watchdog DOCI Individual watchdog signals on the bus Signals of the serial bus The serial bus of the AMS system consists of two lines which are connected through and shielded This bus is provided for the serial transmission of additional information which is not subject to the bus timing of the parallel bus Table 3 10 Signals of the serial bus Signal Signal Character Function Direction istic SDAT M lt gt M Serial data serial clock SCLK S lt gt S SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System 3 5 3 5 1 3 5 2 How the AMS Bus Functions Initialization Before transmission on the bus can be started all bus master and slave modules must be reset to a defined state This is achieved with the INIT initialization signal which can be generated by various sources Byan RC element which activates the signal when the power is turned on e By a debounced switch or button available to the user
105. ce reporter RMOS testing and error message facilities RMOS low level debugger Sequence control e g start and status check of all tasks being run under RMOS Check and modification of memory contents Setting breakpoints in user tasks Check and modification of register contents of an interrupted task e Reloading tasks from mass memory or via serial interface Resource reporter The resource reporter is a task which supplements the debugger The resource reporter can be used to indicate inventories of RMOS data structures and re sources on the monitor screen or to write this information to a data medium It in cludes evaluations for tasks device drivers memory pools semaphores global event flags programs with monitored access and mailboxes RMOS testing and error message facilities RMOS has several testing and error message facilities which are active during the entire runtime of an application When the system boots messages are output after each important initialization procedure within the system This provides the first indication that a configuration is correct RMOS can register all SVCs which were issued without correct parameters with a message on a configurable terminal This message is separate from any error evaluation of the SVC in the coding of the calling task SICOMP IMC System Manual 11 10 J31069 D2001 U001 A0 7618 Environmental Requirements 1 2 Table of Contents 12 1 General Information
106. d 2 e Level 3 Subracks For holding boards of level 2 Level2 Boards Connection plates connection blocks and cassettes consisting of level 1 com ponents Level 1 Components and elements PCBs front plates plug in connectors and components on front plates Level4 Holders Level 3 19 front plate To front plat Subtracbks E 5 a LAE E 482 ee 482 6 mm s Level 2 Boards Le eee AKG Figure 8 1 Physical design SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Scaling dimensions All system dimensions are derived from the basic dimension 1 10 inch i e 2 54 mm Scaling unit 1 TE 2 10 inch i e 5 08 mm Much used conventional definition of the mounting width i e corresponds to the positioning of the holes on the connection rails and the wiring grid for plug in connections Slot 1 EP 8 10 inch i e 20 32 mm Unit for the slot width in the subracks Example A 19 inch subrack offers 21 slots i e space for 21 single width boards Height unit 1 HE 1 3 4 inches i e 44 45 mm Unit of height for subracks in acc w IEC and DIN Example 3 HE i e 5 1 4 inches corresponds to the height of a subrack row for single height boards with 100 mm height PCBs e g SMP16 6 HE for boards with double Europa format e g AMS The following figure illustrates the use of these scaling units
107. d data format Types of settings The following types of settings are used for SICOMP IMC boards e Software settings Auto configuration of I O boards and BIOS Setup of CPU boards Hardware settings Wrap connections and plug in jumpers 11 4 1 Software Settings Auto configuration With SMP16 boards equipped with the ASBIC chip application related settings are performed with the SMP16 AKO auto configuration software For the settings required to operate a board see the product documentation BIOS Setup Most of the settings required to operate a CPU board with a SICOMP IMC system are performed in its BIOS Setup and stored on a CMOS RAM safe from power failures For more information see the product documentation of the CPU board SICOMP IMC System Manual J31069 D2001 U001 A0 7618 11 7 Commissioning Testing and Debugging 11 4 2 Hardware Settings Wrap connections and plug in jumpers are used for the following purposes e Settings on boards without auto configuration capability e g older SICOMP IMC boards e Settings which exceed auto configuration capability e g signal level adjust ments for interface boards 11 4 3 Testing the Set Boards A special debugger for the operating system being used e g DEBUG EXE for MS DOS can be used for test access to the SICOMP IMC boards The product documentation of a board describes the scope of read or write ac cesses to the board e g read status register ad
108. d high the wait time for other tasks or processes may exceed legal limits On the other hand system throughput is increased e f selected low the real time behavior of the system is improved On the other hand management time is increased SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Software 9 1 5 Task Communication and Coordination Selection of a suitable medium of communication depends on the application This decision must be made by the programmer The following are available methods for communication of information between individual tasks Event flags Event flags involve the setting or resetting of an individual bit which tells other tasks that a certain condition has been fulfilled or an interrupt has occurred for example The flags are combined into event flag groups A task can set reset or query a flag or wait for a bit or bit pattern Use of flag groups provides a fast way to exchange information but as explained above is limited to binary information Message queues With this type of communication a FIFO memory to which other tasks can copy messages is set up for each task This permits even large data packets to be ex changed Message queues are permanently assigned to the receiver task Mailbox A mailbox can be used by various tasks to store and receive messages The indi vidual messages are assigned a priority and arranged in a waiting queue based on this priority Another task can now a
109. d number for all bus slots V2 Wide cable on the bus backplane which connects connections with the same connection row and number for all bus slots V3 Connection with a through conductor level on the bus backplane Non through connection Termination Meaning R1 Termination of the cable on the bus backplane located at this connec tion with a pull up resistor of 3 3 k Q against 5 V Z1 Termination of the cable on the bus backplane located at this connec tion with an RC element No circuiting SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System 2 4 2 Description of the Bus Signals The following tables use the abbreviations and symbols shown below Table 2 5 Explanation of the abbreviations and symbols Signal Direction Meaning Z gt P From CPU to I O P gt Z From I O to CPU Z lt gt P Bi directional signal flow between CPU and I O P lt gt P Bi directional signal flow between I O boards Characteristic Requirements on Outputs for This Signal OC Open collector OC outputs can assume two signal states LOW or high ohmic TP Totem pole TP outputs can assume two signal states LOW or HIGH TS Tri state TS outputs can assume three signal states LOW HIGH or high ohmic 1 Primary or secondary bus master Control signals of the SMP16 bus Control signals are all signals required for correct handling of data communication Control signals permit activation of
110. d with the SMP E402 AMS M390 A1 Can only be used with the SMP E402 SMP E18 A8 Can only be used with the SMP E402 SMP E20 Can only be used with the SMP E402 Required e DB8 to DB15 3 3 KQ pull up resistors in CPU slot e Wrap connections for the BHEN and MMIO signals if these sig nals are used e 16 bit access Additional wrap connections for DB8 to DB15 SMP E224 Can only be used with the SMP E402 SMP E302 A11 Can only be used with the SMP E402 For use with the SMP E18 E20 See above SMP E303 A1 Can only be used with the SMP E402 For use with the SMP E18 E20 See above Deactivation of the termination of the command signals Use of the CPU boards listed in table 2 13 with the SMP16 SYS403 bus back planes requires that their termination RC elements be deactivated To do this carefully pull out the resistor networks shown in figure 2 3 from their sockets with a 2 24 pair of flat pliers The SMP16 SYS403 backplanes with three or five slots have only one resistor net work Caution Be careful not to damage the components next to these resistor networks SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System Resistor networks to be removed zm ef cen fees ee LJ Sea ey non nan non nan D uuuu o0 o0 hon oo oo o0 hon oo EEEE o0 o0 hon oo uuu o0 00 hoo oo co oo hoon oo
111. dress SICOMP IMC IP uses a 32 bit address which is divided into four octets of 8 bits each The first portion is a network address and the second portion is a computer address Ad dressing is globally valid i e to prevent problems each address in the world may only exist once on the public Internet Assignment of IP addresses is handled by the Network Information Center in the USA2 If you are not connected to the public Internet you can select your addresses as desired There are three different classes of addressing These classes specify how many address bits the network number contains and how many address bits the com puter number contains http rs internic net http nic ddn mil System Manual J31069 D2001 U001 A0 7618 10 9 Communication 10 10 ClassA 0 Network Computer ClassB 1 0 Network gt lt Computer Class C 1 100 Network Computer Figure 10 2 Classes of addressing The classes are distinguished between by their initial bits A class A network only uses the first seven bits to distinguish between the networks i e only 126 class A networks exist worldwide but these can contain all 22 computers Class B net works can still address 65 536 different computers A total of 16 384 class B net works are possible Clas
112. dress dual port RAM address indication LEDs and so on The read or write accesses can be used to determine whether the addressed board reacts To localize possible errors right at the beginning of a system test each board should first be tested separately All boards should then be installed and tested again in the same manner If a system without operator interface is being generated a CPU which can per form a test interactively should be used for commissioning This may already re quire special preparation at the system planning stage e g empty slots for test adapters or testing with hard disk and so on SICOMP IMC System Manual 11 8 J31069 D2001 U001 A0 7618 Commissioning Testing and Debugging 11 5 11 5 1 11 5 2 Commissioning an Application Generating New Applications The development environment of RMOS provides a variety of sample applications which can be used to test RMOS functions and even interfaces These sample applications can be used as the basis for customer applications Various testing strategies are described in the RMOS user s manual System Expansions Board support packages which provide customer specific system expansions hardware and software are available for a variety of SICOMP IMC boards These packages contain preconfigured examples of the generation of a standard system with the appropriate system expansion e g LAN card or PROFIBUS DP interface board We recommend
113. e Table 10 5 Systems which can be connected to PROFIBUS Systems Which Can Be Connected Automation systems SICOMP IMC SIMATIC S5 S7 M7 C7 SIMATIC HMI operator control and monitoring devices or sys tems SIMATIC PG PC SINUMERIK CNC controllers MOBY identification systems SICLIMAT COMPAS compact automation station Field devices ET 200 decentral I O system SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 19 Communication Table 10 5 Systems which can be connected to PROFIBUS continued Systems Which Can Be Connected Process control systems SIPART industrial process controller TELEPERM M SIMATIC PCS 7 SIWAREX Drive systems SIMODRIVE sensor SIMOVERT master drives SIMADYN digital control system SIMOREG Micro midi master Power reversal actuator SIPOS actuating drives Functions The PROFIBUS access procedure is based on the token passing procedure with subordinate master slave in accordance with EN 50 170 volume 2 PROFIBUS A distinction is made between active and passive network stations Only active stations receive the token i e sending rights which are passed from one active station to the next within a specified period of time Failure of a station or addition of a new station is detected automatically All sta tions in the network must be set to the same transmission speed 10 3 1 Layout PROFIBUS offers an extensive selection of network co
114. e 64 bit expansion of the PCI bus optional e A 60 pin expansion connector for I O expansions optional Imaging the functionality of a standard motherboard with its PCI expansion slots on the iPCI bus backplane requires a special system slot This slot contains the CPU supplies the I O slots with the PCI clock pulse and is the sink for the interrupt and arbitrating signals SICOMP IMC System Manual J31069 D2001 U001 A0 7618 PCI System 4 1 2 Located Expansion Bus In addition to the iPCI backplane bus a local PCI bus expansion is sometimes also provided for CPUs without iPCI bus interface Here expansion is limited to only one card Physical and electrical design is based on PMC specifications 2 3 for example 4 1 3 Nomenclature The nomenclature is based on that of the SMP16 system See table 2 2 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 4 3 PCI System 4 2 IPCI System 4 2 1 General Technical Description Board layout Due to the dimensions of the bus connector a somewhat longer PCB is required i e 163 mm The defined free space of 2 5 mm for the plug in rails must be re duced to 2 mm in the area around the bus connector A single Europa card is shown here as an example _ if 163 mm 1E fii 4 H Expansion connector 64 bit PCI bus Base connector 3 32 bit PCI bus S 9 1E Expansion connector UNI I O bus
115. e confirmation within a period of 48 24 or 8 working hours after receipt at the plant AZS repairs pickup and delivery service The boards are repaired after service confirmation within a period of 8 working hours after receipt at the plant Note Immediate and AZS repairs must be handled by your Siemens office 13 2 4 Delivery Releases Replacement parts It is ensured that a functionally compatible construction release is delivered The replacement parts warehouse carries the current construction release The Prod uct Description column of the price list indicates which other construction releases are compatible with the latest release Construction releases which are not listed and construction releases listed with additional letters e g 2A 2C and so on cannot be replaced They must be handled as Naemlichkeit repairs SICOMP IMC System Manual 13 6 J31069 D2001 U001 A0 7618 Service System Consulting Training Since special customer boards are not carried by the replacement parts ware house they are not available for the replacement parts service Repairs If technically possible the board is upgraded to the current construction release Otherwise an upgrade is made to a release which is functionally identical to the current construction release The construction release is given an extra letter e g 3A Note The board is always returned with a default presetting i e customer specific
116. e connection at room temperature mmediately after removing the protective foil press the adhesive strips on the appropriate points The better the adhesive connection the greater the pressure used SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 49 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Software 9 Table of Contents 9 1 Genetal EEFE TPE eee pente ean eae de dva eet Oeo d aed ee 9 1 1 Demands on Operating Systems 00 eee eee ee 9 1 2 Operating System Classes 0 cece eee eee eee eee 9 1 3 Automation Tasks 000 c cece cece eee ee 9 1 4 Principles of Multitasking 0 00 eee e eee eee eee es 9 1 5 Task Communication and Coordination 0 0 0 cece ee eee 9 2 Operating Systems Which Can Be Used 0 cece eee 9 2 1 RMOSS c ETT 9 2 2 Other Operating Systems 0 cece eee esses 9 3 RMOS Operating System 9 3 1 Features of RMOSS amp uissoder ese dese Ras he m eR dad e wa 9 3 2 Components of RMOS sssssssssssesssse eens 9 3 3 Management of Tasks 000 c eee eee eens 9 3 4 COnfIQUIALION seiis ai neira aa Ri Ghd eu bed Bh dee hehe 9 3 5 Development Tools 0 cece cece ete eese 9 4 Standard Software 0c cect es 9 4 1 SMP T6 AIO osse drei eD oe tai ces teras M Babe Chaat g 9 4 2 Board Support Packages BSPs 9 4 3 RMOSS PEG wae tee eee etd aud VOR Lug Leni Aa Y GU Aa ER t Roe 9 4 4 OITIGE
117. e via dual port RAM memory on the assigned CPUS via the AMS bus system bus AMS bus multibus l 16 bit AMS AMS AMS AMS CPU board I O board CPU board mass memory Y iPCI bus 32 bit SMP16 bus 16 bit PY iPCI I O SMP16 SMP16 input output mass memory Figure 3 1 SMP16 bus iPCl bus as local bus on AMS system SICOMP IMC System Manual 3 6 J31069 D2001 U001 A0 7618 AMS System 3 3 General Technical Description e 60 r r I O connection I O connection SMP16 iPCI AMS bus connector Configuration side 233 35 1 L bus connector Direction of connection Figure 3 2 Physical layout of AMS boards Table 3 2 Dimensions of AMS boards Dimensions of AMS Boards Length 160 mm Height 233 35 mm Thickness of the PCB 1 6 mm 0 2 mm Height of the components Max of 14 mm Length of the connections or thickness of the components on the back of the PCB Max of 2 0 mm Leave at least 2 5 mm of free space to the configura tion and printed circuits on the upper and lower edge of the PCBs so that the boards can be pushed into the guide rails Front system To prevent boards or connectors from accidentally falling out of subr
118. ead These data structures are set up during system startup Priority at start Start parameters Round robin counter Current priority Figure 9 7 Task configuration Other specifications for configuration include the number of mailboxes event flag groups semaphores and similar These are set up by the SVC RmCreateOS SICOMP IMC System Manual J31069 D2001 U001 A0 7618 9 17 Software Driver configuration 9 3 5 To adapt themselves to the hardware each driver and unit data structure has a parameter section whose size is specified by RMOS but whose contents pertain to the specific driver For example port addresses or block types are initialized here See the product documentation for this information The location of interrupt rou tines is also specified in the configuration Development Tools Development of RMOS user software is performed on a PC with third party compil ers and tools The tools from the CAD UL company have been optimized for RMOSS These are cross tools which can be run under DOS and Windows 95 The cross development system consists of the ANSI C Cross Optimizing Compiler the Structured Macro Cross Assembler the Cross Linker and System Builder and the optional High Level Language Remote Debugger Within the system all tools use the Intel object model format OMF386 both for code and for symbol and de bugging information All popular memory models have been implemented This m
119. ectors eser oii betee i bek e be ker tasdbenrme bae bs 8 6 Placement of the Boards in the System 8 7 Information on Mounting lisse III 8 7 1 Connecting the Guides ssssssssssssssseeess sees 8 7 2 Mounting the Wiring Shield Plate ssseliseeseelesessss 8 7 3 Bus Backplanes sadora bet RO Eus deeds bana dati 8 7 4 Installing the Boards 2 cece ees 8 7 5 Installing and Removing the Boards 0 0 eee e eee eee ee 8 7 6 Mounting the Cabinets and Housings SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Table of Contents 8 7 7 Multiple Row Systems Special Systems and Cable Fabrication 8 8 WIIG 2 24 PC UTTTMUTUTTUMTTT 8 8 1 Baring of Cables ics seda Ee RAP gi oraaa e RE WRPRPTY Ru 8 8 2 Tagging the Cable Ends 2 000 cece eee tee esee 8 8 3 Wrap Connections se si maaadaaa aod a deaa a me 8 8 4 Wiring Cable Harnesses 0 00000 cece eee eee eh 8 8 5 GUIDING x death att lag ch de aaa bcd aden delis debui odes 8 8 6 Insulation Displacement Connector Technique 8 8 7 Screw Connections ss sasenenge E i aaa DAA E eens 8 8 8 Plug In Connections ssssssssssssssse a aA iai 8 8 9 Wiring the Power Supply on the Subrack seuuuuesssue 8 8 0 Line Installation 1 2 22 be eek E EAS 9 SOMWANG 2h CD 9 1 General scese ede ed eh o ed e Ded UR a e Red s 9 1 1 Demands on Operating Systems 00 cece
120. ee teh aces Wee ea ave dew oles ad ad des 4 3 2 Signals of the PMC Module Interface 4 4 List of References i i 02 cdccreeldenvkesetadsibensne dee AUS RE Compact COMPUTER vei ace ce te deena t Em rex eR pes Rhen re RR Assembling Center uueeeeeeeeeeee nnn nnn Power Supplies 2 lnc ree erbe reed chet eee Run eaae ais 7 1 Connecting Plug Connector 00 cee eee eee 7 2 Electrical Characteristics 0 0 c cece eee 7 2 1 Electrical Operational Characteristics 7 2 2 Indications and Operation 0 00 c cece eee eee eae 7 2 3 Definition of Terms ort a asd atoi aan aa dipem eee eens 7 3 Power Failure Signaling 7 4 Gompatibilily i e za e sue ni inad fea tie dad aa e E Dra TE a E E 7 4 1 Replacement Boards 0 0 e cece eee eens 7 4 2 Connection Compatibility System AV OUU T etl wae tated caro eal dae kam ge aye em ered bare tice lee 8 1 The Inch Layout System 0 0 cece eee eee eee 8 2 FROCEDIACIOS zs beta e bbb Rb EE A Ld dad R biu Rs 8 3 SUDIACKS est dos eode edes LA etd d elu pa dc a dene 8 3 1 System Modules 00 0 cece cece eet en 8 3 2 Bus Backplanes sai 0ci ony aisn ini exse de gb ter verde nah nt aad 8 3 3 Bus Coupling Boards 0 0 aae cece ete 8 3 4 Backup Banery 2 020 estiov o estuve RE kati EN kEi E NEREDSe PESE 8 3 5 Mechanical Accessories lllleesleeesse eee 8 4 Boards riseire eot da tedio XOT e Ku dente dua date eur Raed 8 5 Plug In Conn
121. eld plates and partially config ured with bus backplanes and or switch boards which are also available sepa rately In addition to bus coupling boards see chapter 8 3 3 mechanical accessory kits see chapter 8 3 5 enhance possible use and combination of the system modules See also chapter 6 on the Assembling Center System Modules Listed below is a summary of the characteristic values of currently available prod ucts For details see the respective product documentation Characteristic values of SICOMP IMC system modules Available system modules offer all the advantages of the ES902C layout system e Metallic front system for shielded setups Boards with front plates for single and total locking in acc w DIN 41 494 Single locking For AMS SMP16 and iPCI boards Total locking For AMS boards e Symmetrical layout i e same type connection rails side pieces and guide rails Plug connector single mounting and backplane technology combinable in one subrack Side pieces of high quality extruded aluminum alloy SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Low impedance transition points between aluminum parts ensures extremely interference immune layout meets EMC requirements with system parts such as tier and wiring shield plates These parts are connected conductively to the frame with EMC contact springs and screws The surfaces of the aluminum subrack parts have bee
122. ely in accordance with VDE regulations This means that cables which carry different voltages may only be installed together under cer tain conditions See VDE 0804 and chapter 8 8 9 Cable installation with swivel frames The physical stress caused when the swivel frame is turned must be kept as low as possible for wire connections between subracks and cabinet This is achieved by bundling as many wire connections as possible and installing them in reliable radiuses See DIN 57 298 or VDE 0891 We recommend using a PVC protective sleeve which is secured with end sleeves and clamps Table 8 11 Cable installation with swivel frames Right Installation Wrong Installation Cabinet RE Gabinet Swivel frame SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 47 System Layout Cable harness installation Adhere to the following points when installing cable harnesses e Before actual connection the wire ends should already be pointed toward and shaped to the physical location of the connection point To decrease the danger of wire breaks the wire ends must be bent so that the bent does not start until the insulated part of the wire Ribbon cable installation 8 48 Pay particular attention to correct insertion pull relief and the correct position of the individual conductors i e cores If necessary ribbon cables must be bent or folded to achieve the correct position Folding the ribbon ca
123. ence is caused by switching procedures in the power network for example e Interference signals which are generated when magnetic electrical and electro magnetic fields are brought in through the air This interference is caused by radio systems and mobile telephones for example Measures for Suppression of Interference The following measures can be used to suppress the interference stated in chapter 12 3 2 a Use of switching cabinets b Shielding of data and signal cables C Filtering of voltage supply cables d Separate power supplies for encoder and output components e Equipotential bonding and or grounding f Use of galvanically isolated boards g Restriction of cable lengths h Shielding of the wiring i Cable installation j System frame layout k Protection against lightning strikes Differential interfaces SICOMP IMC System Manual J31069 D2001 U001 A0 7618 12 5 Environmental Requirements a Use of switching cabinets AMS and SMP systems may only be operated in suitable industrial cabinets e g 8MC or 8MF using shield retention rails The switching cabinets must be connected together with good conductivity SMP16 systems are also suitable for open layout i e without switching cabinets However the system must have good HF grounding In addition empty slots must be covered with dummy covers and secured tightly with screws For more details see i cable guides b Shielding of data
124. ends on the version of the operating system desired Table 11 2 Initial installation of an RMOS runtime system Operating System Initial Installation of the Runtime System Version RMOS DOS system The RMOS installation floppy disks contain a preconfigured RMOS DOS system This system is installed on the hard disk of the target system with the selection menu of the installation floppy disks After the CPU is started again the RMOS DOS system is loaded and started RMOS PC1 system The RMOS installation floppy disks include a bootable floppy disk with which a preconfigured RMOS PC1 system can be started After a warm or cold start the RMOS PC1 system is booted from the floppy disk Both operating system versions are standard systems and can be executed on a SICOMP IMC system with a minimum layout i e PC AT compatible CPU graph ics card and HD and FD mass memory SICOMP IMC System Manual J31069 D2001 U001 A0 7618 11 5 Commissioning Testing and Debugging 11 3 2 MS DOS Prerequisite for installation A PC AT compatible CPU board with hard disk and floppy disk drive Both must be entered in BIOS Setup and the hard disk must also be partitioned The system is started with the first floppy disk Follow the instructions of the instal lation menu 11 3 3 Windows Prerequisite for installation and use of one of the Windows versions CPU board which meets system requirements 11 4 Parameterizing
125. er large real time systems do place relatively high demands on configura tion e g identifier assignment to ensure real time capability This can be avoided by using the CANopen DeviceNet and SDS protocol specifications which have just become available Due to the decentral bus access regulation CAN offers short reaction times al though the data speed which can be achieved is very restricted when large net works are involved When carefully configured CAN is partiqulary suitable for geographically small real time systems with distributed intelligence and high demands on reliability In addition a wide variety of possible applications exists for systems in which the special protocol features play an important role SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Communication 10 5 Remote Maintenance and Remote Diagnosis Via Internet Description While we usually think of remote maintenance as the updating of software compo nents remote diagnosis offers the capability of scanning the internal states of a system or a machine from a remote location Using the capabilities provided by the Internet and the Intranet there are no restrictions whatsoever on the location of the system with respect to function scope In the future SICOMP IMC will be offering an http server written in Java for the RMOS operating system This server will make it possible to provide customer specific HTML pages over the Internet It will also p
126. erformance Dynamic management of task priorities by scheduler Task communication via priority controlled mailboxes and messages Resource management via binary semaphores e Symbolic resource management Hooks for nucleus expansion e MS DOS format compatible hierarchical file management system network ca pability RAM disk User interface similar to MS DOS command line interpreter Code with ROM capability e ANSI C runtime library Memory protection mechanisms between tasks and operating system and be tween tasks via segmented memory model and 32 bit protected mode of micro processor Cross software development under DOS Windows with CAD UL development tools e High level language debugging with CAD UL XDB RMOS debugger Integrated development environment Workbench for CAD UL tools available under Windows 95 e Optional support of non segmented memory models flat model for Borland C SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Software 9 3 2 Components of RMOS The RMOS operating system is divided into the nucleus driver interrupt handler and system processes User tasks Service tasks User and system software Software interface Operating software Interrupt handler Hardware interface CPU boards I O boards mass memory and server boards Hardware Figure 9 3 Components of RMOS Nukleus The nucleus represents the so called operating system ker
127. ermit auto configuration data to be scanned and the information of the I O boards to be accessed Applets for customer applications can also be downloaded from this server to an Internet browser How it functions Remote maintenance and diagnosis takes advantage of Internet technology Both are based on the client server principle This means that a provider i e server can make data and services available which a customer i e client can call up In additional to normal functionality e g login and data transfer other demands are placed on a server which supports remote maintenance and diagnosis These re quirements include access to process variables processing of external interrupts and the conclusion of a task which has crashed for example Special programs i e Java servlets which handle these tasks are stored on the server A request from the customer i e client causes the server to call the re lated program This creates a standardized document HTML page and so on which is sent to the customer via the Internet The customer uses an Internet browser as an application to evaluate the received document SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 27 Communication Advantages Remote maintenance and diagnosis of SICOMP IMC is available worldwide through the Internet This ensures quick and direct access to current process and machine data even from inaccessible systems Platform independent proce
128. es with the system slot to the right Implementation with SMP16 The following figure shows a sample configuration for the layout of a SMP16 sys tem frame iPCI backplane Slot for iPCI CPU ee i O O O i O Oo O Oo o o i T i iri ag i e se Aoo a NEM A A N N Y O O O Slots for additional Slots for additional Slots for power iPCl boards SMP16 boards supplies if needed Figure 4 4 Sample configuration for SMP16 with iPCI bus backplane SICOMP IMC System Manual J31069 D2001 U001 A0 7618 PCI System Implementation with AMS The following figure shows a sample configuration for the layout of an AMS system frame Slot for Slots for additional iPCI CPU AMS boards re A AO o o S o iro SE AE o o O r d dep db deb ipe fed ie pe TUN CH d ded qued ped ihe GE a de e dul O tit INI tit ti i tid Lar g LET ttt tit E r edo qe dep dep ipe Jes i l o T
129. ess A0 0 This signal is always inactive for 8 bit accesses DO to D15 M lt gt S S lt gt S TS Data Inverted bi directional signals to transmit information write to a slave board or to receive read information from there D15 is the most significant bit and DO is the least significant Interrupt signals The AMS bus has eight interrupt request lines Table 3 7 Interrupt signals Signal Signal Character Function Direction istics INTO to S gt M OC Interrupt request INT Control signals to trigger interruptions of the running program When several interrupts are involved INTO has the highest priority and INT7 has the lowest priority INTA M gt S TS Interrupt acknowledge Response signal to an interrupt request This signal is generated by the bus master if bus vectored interrupts are used to request output of an interrupt vector on the data lines SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System Bus allocation signals To be able to use the AMS bus in a multimaster system arbitrating signals are de fined which can be used to allocate control over the bus Table 3 8 Bus allocation signals Signal Signal Character Function Direction istic BCLK M gt S TP Bus clock Cyclic clock pulse signal for synchronization of bus allocation can be slowed down stopped or operated in single steps Each bus m
130. esses to any areas of the AMS memory even for individual bytes The slave modules are divided into three priority classes regarding inhibiting Lowest priority These slaves can be blocked by inhibiting signals INH1 and INH2 but cannot activate blocking themselves Example Read write memory Medium priority These slaves can activate inhibiting signal INH1 i e block slaves of the low est priority but can be blocked themselves with INH2 Example Memory input output module Highest priority These slaves can activate inhibiting signals INH1 and INH2 to block slaves of the lowest and medium priorities Example Initial program loading or boot ROM A slave module which is inhibited in this way blocks its drivers for all address data and acknowledgment signals of the AMS bus The XACK acknowledgment signal for concluding the access is activated by the blocking slave Blocking signals acti vated during input output accesses or INTA cycles have no effect Blocking during memory read accesses may not create disadvantages for the blocked slave In particular this must have no effect on its data or its status regis ters Blocking during memory write accesses may only have an effect on the addressed byte or word for the blocked slave It may not affect other data SICOMP IMC System Manual J31069 D2001 U001 A0 7618 3 17 AMS System 3 5 3 Interrupt Operation The AMS bus is equipped with eight interrupt requ
131. est lines of various priorities When arriving interrupts are processed by the CPU a distinction is made between the following types e Bus vectored interrupts BV The vector required as the start address of the interrupt routine is supplied by the interrupt requesting module via the AMS bus e Interrupts without vector non bus vectored NBV The jump address for the interrupt routine is stored on the bus master board and is not supplied via the AMS bus Interrupts are usually triggered by edge Several interrupt sources can be circuited in parallel via open collector outputs on a request line Level triggering can also be programmed An AMS system can be configured for mixed use of BV and NBV interrupts Bus vectored interrupts When an interrupt request arrives at the bus master board via control signals INTO to INT7 the interrupt controller interrupts the program sequence and acti vates the INTA response signal At the same time it places the number of the highest priority interrupt on the address lines i e INTO has the highest priority and INT7 the lowest If interrupts are cascaded this procedure is repeated if necessary The module which requested the interrupt now places an 8 bit word on the data lines These data represent the offset in a fixed interrupt vector table stored on the bus master The start address of the interrupt routine is taken from this table For more information on this procedure see the respective
132. f Terms cuisse penne ere REPRE RE Red 7 3 Power Failure Signaling 7 4 Compatibility ost cand Jace carcino dk ero ken ond MARE E cedo abate 7 4 1 Replacement Boards ssssssssesssseess sees 7 4 2 Connection Compatibility SICOMP IMC System Manual J31069 D2001 U001 A0 7618 7 1 Power Supplies General Power supplies PS for microcomputer systems must meet the following primary requirements The power supplies must be able to be installed in 19 inch subracks e Microcomputer systems generally permit an operational voltage tolerance of 5 This represents the upper limit of permissible deviation of the PS out put voltage from its nominal value under permissible operational conditions Interference voltages on the outputs of the power supplies must be so small that they do not affect the interference immunity of the system 7 1 Connecting Plug Connector Fifteen pin multi point terminal strips DIN 41612 model H15 tin plated are used as the base plug connectors for SICOMP IMC power supplies Remember that the socket terminal strips must also be tin plated For boards with low voltages and currents multi point terminal strips DIN 41612 model C may also be used For power supplies with power network operation the power network voltage is present on connections 28 and 30 of the H15 multi point terminal strip The pro tective conductor is present on connection 32 The related contact point leads
133. few exceptions the power supplies are protected against excessive tempera tures by a thermo sensor After this protective circuit is triggered the device must cool down first before it starts up again automatically i e hysteresis A latched switchoff is also possible After cooling off the device is put back into operation with a power off on With the switchoff and switchon procedure normal power failure signaling is per formed See chapter 7 3 For type of procedure see the product documentation of the individual power supplies Dimensioning When selecting the power supply make sure that the total nominal performance is not completely utilized continuously i e system reserve 7 2 2 Indications and Operation Indications LEDs on the front plate indicate the operational state of the device Each output is equipped with a yellow LED with a series resistor between 0 V and Ug This LED goes on when the related output voltage reaches a certain value With some power supplies a green LED labeled EIN ON goes on if the input voltage is greater than the startup voltage For exceptions see the product documentation of the individual power supplies Selection of the input voltages for power packs The supply voltages of the power packs are the power pack voltages 120 110 V AC or 230 220 V AC Switching between these two voltages can be performed in two ways For older power supplies Manual adjustment of the voltage sw
134. for Germany and EU Customer as per delivery address or Siemens office Other countries Responsible customs office An additional fee of 596 of the list price is charged for use of fast service Note Occasionally it may happen that a replacement part cannot be delivered despite all efforts In such cases the customer is informed immediately and if desired can have an immediate or AZS repair made It is very important that the system standstill urgency label remains reserved for actual emergencies Misuse puts a great strain on the replacement parts service Zero inventory filling next highest priority Delivery is made within five working days of the order s receipt Normal order for replacement parts next highest priority Delivery of small quantities one or two pieces is made within five working days of the order s receipt SICOMP IMC System Manual J31069 D2001 U001 A0 7618 13 5 Service System Consulting Training 13 2 3 Delivery Dates for Repair Service Naemlichkeit Repairs The repair flat rate is invoiced in accordance with the table plus applicable extra fees Normal repairs The boards are repaired within a period of ten working days after receipt at the plant Fast repairs The boards are repaired within a period of five working days after receipt at the plant Immediate repairs Immediate repairs are divided into three classes of urgency The boards are repaired after servic
135. from high voltage cables exceeding 1 kV AC by a distance of 30 cm SICOMP IMC System Manual 12 12 J31069 D2001 U001 A0 7618 Environmental Requirements j System frame layout The subrack of smaller systems is set up so that it can also handle the shielding of external interference signals It is equipped with upper and lower tier shield plates and a wiring shield plate over the wiring field so that an external shield is created The construction of the system frames of the SICOMP IMC product family are the same as that of the ES902C layout system With the exception of the visual align ments of the front plates all parts are surface treated and electrically conductive Use of wiring and tier shield plates and shielding plates on the back ensures a lay out which is immune to interference Use of metal front plates ensures reliable shielding of the front k Protection against lightning strikes When cables and lines are installed for systems outside buildings shielded cables must always be used The shield must be able to carry current and be connected on both sides to ground Double shielded cables must be used for analog signal cables and the inner shield may only be grounded on one side See chapter 12 3 3 section b shielding of data and signal cables In addition the signal cables must be circuited with protective elements against overvoltages e g varistors and overvoltage conductors filled with nonflammable gas
136. gnals e g DACK for DMA transfer The BUSEN signal can be disregarded for memory or MMIO accesses CLK Z gt P TP Clock System clock pulse on the CPU This signal is generated by the primary bus master and may not exceed 12 MHz HOLDA Z gt P TP Hold acknowledge HOLD P gt Z TP Hold These signals are used to transfer the SMP16 bus from the primary bus master to a secondary bus master i e to a DMA controller on a slave board The secondary bus master requests bus rights by activating the HOLD signal If the primary bus master supports this function it transfers rights to the secondary bus master by activating the HOLDA signal For DMA function see also DREQ DACK in table LEERER MERKER IlOCS16 P gt Z OC Input output chip select 16 This signal tells the bus master whether the slave board ad dressed via address lines AO to A15 in the input output ad dress area is able to perform a 16 bit access IOR Z P TS TP I O read Control signal of the CPU to read information using the direct input output procedure The input output address area con tains 64 Kbytes IOW Z gt P TS TP I O write Control signal of the CPU to write information using the direct input output procedure The input output address area con tains 64 Kbytes SICOMP IMC System Manual 2 12 J31069 D2001 U001 A0 7618 SMP16 System Table 2 6 Control signals of the SMP16 b
137. gth of a command for each access of the primary bus master by a certain amount of time Altogether a bus master must be able to generate a command length of at least 500 nsec using wait cycles This also applies when command delays are set Slave boards which require an even longer command length in addition must generate this themselves by deactivating the RDYIN signal Bus masters may perform wait cycles separately by type of bus access e g for memory accesses input output accesses or INTA accesses Distinction accord ing to certain address areas for flexible adjustment to existing slave boards is also permitted SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System 2 6 Combination of SMP16 and SMP Components Bus backplanes Different types of bus backplanes can be used for the SMP and SMP16 bus sys tems Table 2 12 Bus backplanes for the SMP SMP16 system Type Bus System Features SMP S401 SMP bus Only for ES902A system frames Cannot be used for ES902C system frames Discontinued SMP E402 SMP bus Only for old systems SMP16 SYS402 SMP16 bus Discontinued SMP16 SYS403 SMP16 bus Termination of the command signals Auto configuration daisy chain Due to different signal driver design and different allocation of special signals some older boards cannot be used with the SMP16 SYS403 or can only be used with restrictions See below Boards with restricted use The following b
138. h en den ca el fea a teal He fed dene pen de fea af dn ip de pep ina eu ie ep de ie en ihe pep eu ie dp ud ihe Hn Sal tall qu il deu qul de Jul sed id ed pup es ipud qe bol du iu e LN o o o o o o o o o o o o o o o o o o HOSUSSUSSUSUSSUSDUSSUUUUSUSSUSUSUUSUUSOSUUSUSSSSUUSTUUUNUSUUSUUIUTTUUSUUUUU USCUGUUU Figure 8 3 3 HE system frame view of the front SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 5 System Layout Oo Oo 2 ie Oo o00000000000000000000000000000000000000000000000000000000000000000000000000000000000 z HH H H WH WH H H H H H H W S r H W WH o e I o Oo Oo Ti ry i Oo u h hk m m mM u m H u u m m M hm hM hM M o000000000000000000000000000000000000000000000000000000000000000000000000000000000000 Figure 8 4 6 HE system frame view of the front 8 3 2 8 6 Whether a system requires convection or forced ventilation depends on the boards being used See also chapter 12 on environmental requirement Buttons and power switches are provided by a fan module or a switch board Bus Backplanes Connection of the bus signals of the individual boards is handled by the bus sys tems SMP16 AMS and iPCI Special bus backplanes are available for each bus system For detailed information on the characteristics and requirements of the individual bus systems see chap
139. ich support the IOCS16 and MEMCS 16 signals only perform 16 bit bus cycles when the appropriate signal has been activated by the slave board If the appropriate signal is not activated for 16 bit accesses triggered by the software such bus masters automatically perform this access as two consecutive 8 bit bus cycles This also means that a 16 bit slave board which does not generate an IOCS16 or MEMCS16 signal is only pro cessed with 8 bit accesses by a 16 bit bus master which supports the IOCS16 or MEMCS16 signal Master boards ignore IOCS16 when performing a memory access and ignore MEMCS16 when performing an input output access Bus masters which do not support IOCS16 or MEMCS16 ignore this signal and perform their bus cycles as initiated by the software The following table shows the relationship between the AO address bit the BHEN IOCS16 and MEMCS16 signals and the data transmission Data transmission Z gt P P gt Z Executed Data Transfer AO BHEN IOCS16 MEMCS16 Resulting Data Length Data Bits Used Remarks 1 8 bits DBO to DB7 Even byte access to 8 bit slave 8 bits DBO to DB7 Odd byte access to 8 bit slave 8 bits DBO to DB7 Even byte access to 16 bit slave 16 bits DBO to DB15 Word access to 16 bit slave Invalid Slave may never use CS16 for A0 1 0 0 0 2 o 2 olo x xlololo Invalid Never
140. ied HF in the sub D plug connector housings of the board connection cable Shield rails for analog signal cables can be insulated and connected at a central point with reference potential or ground Power supply cables power voltage or 24 V do not require shielding SICOMP IMC System Manual 12 6 J31069 D2001 U001 A0 7618 Environmental Requirements Only the measures listed below may be used to shield analog signal cables e For isolated operation preferred use Shield applied on both ends Equipotential bonding conductor required par allel to the signal cable For non isolated operation Shield galvanically applied on one side and open on the other end How ever shield must be continued as far as possible to the end of the cable Shield galvanically applied on one side and capacitively on the other end of the cable Ensure voltage strength in accordance with IEC 1131 2 500 V DC for Uy lt 50 V See isolation test under chapter 12 6 1 Adhere to the following for non isolated operation Galvanic application on one side Galvanically on the side on which the reference potential e g GND is con nected with the housing If necessary the best side of the system must be determined The length of the unshielded cable may not exceed 3 cm c Filtering of voltage supply cables Switching processes in the power network cause the power supply to be superim posed with interference voltages The higher freq
141. ies and fuse buttons must always remain active These protective facil ities must take direct effect on the control devices in the power pack When the emergency off facility is activated a state must be ensured during which persons and systems are not endangered Control devices and drives which can create dangerous states e g main spindle drives of machine tools must be turned off n contrast control devices and drives which when switched off can endan ger persons or systems e g work holding fixtures may not be permitted to be switched off by the emergency off facility e Activation of the emergency off facility must also be recorded by the program mable controller and evaluated by the user program Safety functions of SICOMP IMC products Some SICOMP IMC products are equipped with special safety functions Voltage monitoring Battery backup for powering real time clocks and CMOS RAMs Watchdog for monitoring program processing Keyboard lock e Password protection e Temperature check SICOMP IMC System Manual J31069 D2001 U001 A0 7618 12 19 Environmental Requirements 12 7 EGStatement of Conformity The EG council has decided that industrial products covered by the technical harmonization guidelines may not be sold until the manufacturer has affixed the CE seal to them The CE seal must be accompanied by an EG statement of conformity signed by a legally authorized person The EG state
142. in automation technology are primarily met by real time operating systems e Deterministic sequence of functions as reaction to external events With prioritization of tasks the sequence of reactions to external events can be predicted and reproduced e Deterministic reaction times A process must be able to react to an external event within a specified maxi mum reaction time SICOMP IMC System Manual J31069 D2001 U001 A0 7618 9 3 Software 9 1 3 Automation Tasks The following primary automation tasks are created by the division of technical pro cesses into several mutually linked parallel subprocesses Measuring e Open loop control e Closed loop control Visualization e Operator control Demands of these subprocesses on reaction times execution times memory re quirements resources used and so on differ greatly These jobs are implemented by executing the appropriate programs i e tasks The job of a multitasking operating system is to manage these individual tasks and execute them in accordance with the demands above AWL FUP Ua Task nz U Et1 ELt amp IET Ug EH A35 E1 7 A3 5 Operator control and monitoring Closed loop control Open loop control H M Task 1 Task2 Taskn Man machi Closed l o ess H W Programmable controller Figure 9 1 Tasks of automation Many operating systems are designed for a mono processor environment
143. incremental linking This makes it possible to generate applications for the RMOS3 operating system LINK386 and embedded systems The CAD UL cross linker generates the Intel OMF386 object format for code sym bol and debugging information which means that existing in circuit emulators can continue to be used Intel build files can be read in and processed without modifi cation This makes it easy to switch to CAD UL tools CAD UL XDB386 RMOS XDB386 provides user support during debugging RMOSS systems which were created with CAD UL CC386 Since it uses the breakpoint registers of the proces sor and breakpoints or watch points can also be set on the ROM real time debug ging can also be performed on code located on the ROM The XDB RMOS offers easy and effective testing of an RMOS system XDB can evaluate complex expressions CAST operations are permitted The dynamic call hierarchy can be indicated The local stack variables of any function in the call hierarchy can even be indicated Of course functions such as indication and mod ification of variables registers or memory contents Single Step of programs and So on are available 9 4 Standard Software 9 4 1 SMP16 AKO For auto configuration of SMP16 boards see chapter 11 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 9 19 Software 9 4 2 9 4 3 9 4 4 9 20 Board Support Packages BSPs BSPs are add on software packages for RMOS which contain a user
144. installed must not touch the electronic and me chanical components of the adjacent physical components e g insertion in the guide rails at an angle SICOMP IMC System Manual J31069 D2001 U001 A0 7618 11 3 Commissioning Testing and Debugging 11 3 11 3 1 Installing the Operating System Applications are usually based on a software platform which provides certain basic functions e g interface to input output components and so on These basic functions may include the following among others Interface to hard disk and floppy disk drive e Interface to input output components Graphical outputs and keyboard input In general this basic software is called the operating system SICOMP IMC offers three types of operating systems e RMOS Real time operating system which ensures defined reaction times to external events e MS DOS e Windows Graphics oriented user environment in various versions For information on using other operating systems contact the particular manufac turer or distributor RMOS To develop an application and create a customer specific RMOS runtime system the required software must be installed on the generating system After the RMOS runtime system has been transferred to the target system it can be booted from there Generating system 11 4 The generation system may be any PC AT platform with 7 Mbytes of free mass memory space for the RMOS development environment and addit
145. interface to the SICOMP IMC I O boards or for SICOMP IMC compact computers The BSPs contain the specific hardware characteristics of a device They provide an inter face to RMOS user tasks BSPs perform communication related tasks e g direct hardware access data consistency data blocking synchronization and so on BSPs are hardware related i e a special RMOS board support package is avail able for every intelligent SICOMP IMC I O board The contents of the package are listed below e Menu prompted installation program for the BSP Interface driver Hardware specific utilities e g positioning and location control software RMOS3 PLC RMOS3 PLC is a software module with the function scope of a programmable con troller It can execute user programs in STEP5 In addition STEP5 function blocks can be programmed as high level language blocks in C and can be called from STEP5 Together with RMOS RMOS3 PLC provides the following functions in a real time environment on a single CPU Control with STEP5 PLC programs command set almost like S5 CPU 944 Visualization with standard software packages Free programming in high level language Other Additional software packages are available which handle tasks related to visualiza tion axis control data processing and communication For additional information see the applicable catalogs which can be obtained from your Siemens office SICOMP IMC System Manu
146. ion of new products and solutions e Workshops Training with special exercises also customer specific SICOMP IMC on the Internet Current product support data of SICOMP IMC support are available on the Internet under the following address http www ad siemens de sicomp Questions and answers Tips and tricks User information e Downloads SICOMP IMC hotline The hotline for the SICOMP IMC product family is available under the following numbers Monday to Friday from 8 00 AM to 5 00 PM Telephone 49 911 750 2727 Telefax 49 911 750 4888 E mail sicomp support scn de Service manuals Special service manuals are not available for SICOMP IMC You will find the infor mation required for service in the product documentations SICOMP IMC System Manual J31069 D2001 U001 A0 7618 13 3 Service System Consulting Training 13 2 Replacement Parts and Repairs The repair procedure described below applies to SICOMP IMC products from the catalogs of the combination technology division Returns covered by or not covered by the warranties are always handled in the same way If the customer was not at fault returns covered by the warranty are handled free of charge Additional charges for immediate and AZS repairs are always invoiced 13 2 1 Replacement Parts and Repair Service Two different services are always available Replacement parts service A board is delivered with the current release status using
147. ional memory for the compilers and their development environment The generation system must have MS DOS version 3 3 or later and a floppy disk drive to transfer the RMOS system to the target computer SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Commissioning Testing and Debugging Table 11 1 Installation of the generation system Development environment For installation of the development environment of RMOS on of RMOS the generation system see the instructions of the RMOS user s manual Based on examples for the RMOS PC1 and RMOS DOS op erating system versions your own hardware adjustments and System expansions can be performed Compiler A development tool from Intel or CAD UL is required to gener ate a customer specific operating system Applications can also be created with a Borland C compiler For exact designations and versions see the RMOS user s manual To install proceed as described in the compiler manuals Board support packages BSPs can be used to adapt the RMOS operating system to BSPs customer specific requirements Each BSP contains sample generations for a standard operat ing system version with expansions for the hardware This makes it easy to reconstruct the expansion functions To install proceed as described in the applicable product do cumentation SICOMP IMC target system Initial installation of an RMOS runtime system on the target computer dep
148. itch or replace ment of an appropriate fuse e For newer power supplies Automatic adjustment when the supply voltage is applied Operation outside the specified voltage ranges is not permitted For details see the product documentation of the individual power supplies SICOMP IMC System Manual 7 4 J31069 D2001 U001 A0 7618 Power Supplies Adjustment of the output voltage for power packs With many power supplies the output voltages can be adjusted with trimmers The setting range is between Uan 59 6 and Uan 5 The trimmers can be used without having to demount them The access openings are labeled Normally the output voltage does not have to be set For details see the product documentation of the individual power supplies 7 2 3 Table 7 1 Definition of Terms Definition of terms Term Definition Input voltage Ue The voltage with which the power supply is to operate on the primary side It is supplied by the nominal voltage Uen with its tolerance range e g for power network supply 230 V AC 15 The input voltage can be a sinusoidal alternating voltage a direct voltage for DC DC converters and primary pulsed power packs or a square wave voltage for primary pulsed power packs Frequency fe of the input voltage Nominal frequencies 50 60 Hz and a permissible frequency range 47 to 63 Hz are specified for power packs which operate with sinusoidal or square wave alternating vol
149. ition quality assurance measures included in serial production ensure constant quality of the products However this high standard of quality can only be utilized when the system or the plant is set up in accordance with specifications The system concept is particu larly important Information on this is primarily found in the following sections Make absolutely sure that these specifications are adhered to 12 3 2 to 12 3 3 electro magnetic compatibility 12 4 climatic requirements 12 6 2 system integration and electrical safety SICOMP IMC System Manual 12 2 J31069 D2001 U001 A0 7618 Environmental Requirements 12 2 Electrical Requirements Alternating current supply Table 12 1 Demands placed on the alternating current supply Nominal voltage Un 120 230 V Lower limit 85 170 V Upper limit 132 264 V Nominal frequency 50 60 50 60 Hz Lower limit 47 47 Hz Upper limit 63 63 Hz Direct current supply Table 12 2 Demands placed on the direct current supply Nominal voltage 24 V Lower limit static 20 4 average value V Lower limit dynamic 1 18 5 V Upper limit static 28 8 average value V Upper limit dynamic 1 30 2 V 1 In accordance with DIN 19 240 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 12 3 Environmental Requirements 12 3 Electro Magnetic Compatibility 12 3 1 Requirements
150. l Requirements 00 cece eee eee eee 12 1 General Information 000 cece eee eh 12 2 Electrical Requirements 0022 c eee ees 12 3 Electro Magnetic Compatibility 0 0 0 eee cee eee 12 3 1 Requirements 0 0 eee 12 3 2 Possible Sources of Interference 00 cece eee eee eee 12 8 3 Measures for Suppression of Interference 12 4 Climatic Requirements 00000 c cece eee eh 12 5 Physical Requirements 0c cece e eect eee tenes 12 6 Electrical Safety zoe rentrera niria ei nnna pide bd areeeesdeadess 12 6 1 Requirements at the System Level 0 000 cece eee eee 12 6 2 Notes on System Integration 0 0 cece eee 12 7 EG Statement of Conformity 0 00 cee eee ees 13 Service System Consulting Training eene 13 1 Shu AM MT 13 2 Replacement Parts and Repairs 00 cece eee eee es 13 2 1 Replacement Parts and Repair Service 00 eee 13 2 2 Delivery Dates for Replacement Parts Service 005 13 2 3 Delivery Dates for Repair Service Naemlichkeit Repairs 13 24 Delivery Releases 00 ccc eee eee 13 25 Handling 2 ons cieavaed oad aden SERE UESTRE maa dena mu eed 13 2 6 Warranty TIImes i222 a22se eiduebereleueveled Gv reesei auevetedaes 13 2 7 PACKING sexo uh Est E UE dex aaa oan tede metus 13 3 Export Regulations 0c cece cette ee
151. l the master the possible data bus length for the bus access just triggered To ensure compatibility between 8 bit boards and 16 bit boards 8 bit accesses are always used for even and odd addresses on the lower half of the data bus DBO to DB7 For this reason 8 bit boards do not have to consider the BHEN signal Six teen bit accesses can only be performed on even addresses AO 0 whereby the BHEN signal is then activated If 16 bit slave boards are to be able to be written with 8 bit values by byte they require a so called byte swap logic which transfers the data internally from DBO DB7 to LDB8 LDB15 write operation L stands for local during odd 8 bit accesses to the board or from LDB8 LDB15 to DBO DB7 read operation SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 19 SMP16 System 2 5 3 Table 2 11 Control of the Data Bus length with IOCS16 and MEMCS16 Slave boards use the IOCS16 and MEMCS16 signal lines to tell the bus master that they are able to perform 16 bit cycles However 16 bit cycles are only per formed when they have been initiated by the bus master as 16 bit cycles IOCS16 and MEMCS16 are generated when the slave board recognizes its ad dress on the bus and an even bus access AO 0 is involved Slave boards which use the memory oriented input output procedure also consider the MMIO signal in addition to the addresses Bus masters with a 16 bit bus interface wh
152. lash memory 128 Kbyte SRAM 2 serial interfaces for programming and for use as desired Digital I O 12 inputs 8 outputs Analog I O 2 inputs 1 output Link to process control technology via PROFIBUS DP Graphic LC display with 320 x 240 pix els Sealed keyboard IP54 with 38 keys 7 status LEDs on the function keys 80386EX with co processor 2 Mbyte flash memory 1 Mbyte SRAM Real time clock battery buffered 2 serial interfaces for programming and for use as desired Digital I O 64 inputs 48 outputs Analog I O 2 inputs 4 outputs 3 encoder inputs and 2 handwheel in puts for positioning applications Link to process control technology via CAN bus interface Customer specific system solutions In sufficient numbers customer specific standard systems can be converted to compact computers SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Assembling Center 6 The combination of existing SICOMP IMC components based on specific cus tomer requirements is offered within the scope of manufacturing A ready to run device can be created based on customer needs Just select the appropriate components from the SICOMP IMC product family and provide us with the necessary wiring and setting documentation For example this service includes the following Setting up a customer related system frame Installation of the boards Wiring of the bus backplane Setting the board addresses Installing the software
153. les the distance of the cables from each other and the use of large surface grounding systems e g in the wiring field We recommend using divider plates to separate the portion of the cabinet in which the inductivities e g transformers and contactors in particular are mounted Additional measures are required to ensure protection against dangerous body cur rents and protection against indirect touching The cabinet must be connected with a protective conductor 10 mm to the pro tective conductor of the power distribution to which the 230 V AC power supplies of the devices are connected in the cabinet With the 24 V DC power supply the device must be connected with the central grounding point or with the protective conductor of the power distribution 10 mm The protective conductor of the feeder cables must be connected indi vidually to the protective conductor terminal Several adjacent cabinets must be connected with each other with screw type connections which provide good con ductivity or a protective conductor 10 mm must be connected to each cabinet The measures described above will ensure that the cabinet and the resources installed there are included in a protective measure against dangerous body cur rents i e protection against indirect touching Cables installed outside the cabinet Warning Signal cables must be separated from high voltage cables exceeding 500 V AC by a distance of at least 10 cm and
154. llation PROFIBUS PA Intrinsically safe area Bus connection R Terminating resistor SK RS 485 repeater Segment coupler Figure 10 8 Electrical PROFIBUS network linear and tree structure mixed SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Communication Optical network The optical network is configured with OLMs Optical Link Modules in a linear ring or star structure OLPs Optical Link Plugs are used to connect PROFIBUS slave stations to OLMs for fiber optic conductors of plastic via an optical single fiber ring Features Long distances Cascading of OLMs or OLPs Not sensitive to electro magnetic interference Galvanic isolation Choice of fiber optic conductors of glass or plastic Great adaptability to local conditions High availability with redundant optical ring with OLMs Inexpensive optical connection of PROFIBUS slaves via OLPs Mixed network The electrical PROFIBUS network can be mixed with the optical network so that the advantages of both types of networks can be utilized OLP OLP M EEG O O O E L L E M M M M M OLP OLP U Two wire cable Bus connection plug Fiber optic conductor with one fiber a Bus termination Fiber optic conductor with tw
155. lue class A Limit value class A 1 Installed on SICOMP IMC system frame 2 Signal cables which are not used for process control e g cables to external printers 1 kV 3 The interference immunity on DC power cables and data signal cables must be ensured by appropriate external measures 4 Only applies to components with 120 230 V power e g power supply boards 5 For permissible deviation of analog input and output variables during interference input see EG statement of conformity 12 4 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Environmental Requirements 12 3 2 Possible Sources of Interference When setting up interference immune microcomputer systems the interference from the system itself and the interference outside the system and related interfer ence suppression measures must be considered separately Interference from the system itself This interference is caused when signal changes on internal cables affect adjacent cables capacitively or inductively Another source of interference is that signal changes on the outputs of switching circuits are accompanied by very high peak currents among others on the power supply cables to the switching circuits Interference outside the system 12 3 3 This interference can be caused by the following interference signals e Interference signals which are brought in via the power supply cables and the input and output cables This interfer
156. m designed for the special requirements of machine controllers Since real time capabilities multitasking and operational reli ability are the primary requirements of this application area and RMOS meets these requirements RMOS3 is an excellent operating system for many automation solutions based on SICOMP IMC RMOS can be configured to the technological requirements For details see chapter 9 3 9 2 2 Other Operating Systems Depending on the particular application operating systems of other manufacturers which can be run on PC compatible hardware platforms can also be used with PC compatible SICOMP IMC systems Examples are listed below e Windows NT Windows CE Windows 95 or 3 11 e DOS e QNX e RMX e Other For further details on possible use performance functionality driver support and other information on these operating systems contact the manufacturer or distribu tor Applications for these operating systems can be written with their conventional pro gramming languages In the future JAVA will also be able to be used SICOMP IMC System Manual J31069 D2001 U001 A0 7618 9 9 Software 9 3 9 3 1 RMOS Operating System Features of RMOS3 e Freely configurable hardware 80386 and above Higher speed compact nucleus Defined reaction times way below 100 usec depends on processor e 4 Gbyte address area e Deterministic behavior e Priority controlled multitasking e Scaleable scope of p
157. me 2 Reserve time 4 Startup time 6 PF delay time Figure 7 2 Time behavior of the PF signal output SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Power Supplies 7 4 Compatibility 7 4 1 Replacement Boards The following table shows which old power supply boards can be replaced by new boards and the conditions which must be fulfilled Table 7 4 Replacement boards Board Replacement Restrictions Conditions Board SMP E423 A1 SMP E431 A6 At 5 V 20 A only with fan SMP E423 A2 SMP E423 A3 Open pins 4 SD 14 12 V 22 12 V Additional 2 slot front plate required Change installation geometry SMP E423 A30 Cannot be re Master slave boards are no longer part of our product pro placed gram SMP E424 Ax Cannot be re 12 V outputs with 4 A are no longer part of our product pro placed gram SMP E425 A1 SMP E430 A6 At 15 V only 1 5 A instead of 3 2 A SMP E425 A2 SMP E425 A3 No SD no PF no sensors available anymore Change installation geometry Additional 4 slot front plate required SMP E426 A1 Can be replaced 5 V outputs are no longer part of our product program SMP E426 A2 under certain con SMP E426 A3 ditions Only if no 5 V required At 12 V only 0 5 A instead of 2 A SMP E431 A6 Open pin 4 SD Additional 2 slot front plate required Change installation geometry SMP E427 A1 Cannot be re Combination of
158. men S srann erdan ERRARE RERO A E NEP LENERESSP TENES 3 2 2 Integration of the SMP16 and iPCI System in the AMS System 3 3 General Technical Description 00000 ccc eee eee eee eee 3 4 Signals of the Bus Interfaces 006 cece eee eee 3 4 1 Information on Table LEERER MERKER esee 3 4 2 BDescription of the us Signals 00 eee 3 5 How the AMS Bus Functions 00 cece eee eee eee 3 5 1 InitialiZatlOn oo saetas a d a RE RURO ssh oak ed bea aa bade baud ERO dake hdd 3 5 2 Data TranSMISSION ssuscesceseuectave t9 erster 9 eR Y ADARRA 3 5 3 Interrupt Operation 2 III 3 5 4 Bus Allocation Control 000 senat airain eens 3 6 Combination of AMS SMP16 and SMP Components SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Table of Contents aeu 4 1 System Overview wo iame adai ima itai iaa ia Ea nnn 4 1 1 Backplane Bus System 000 cece eee tenes 4 1 2 Located Expansion Bus 000 ee cece e teens 4 1 3 Norienclat re cetera hea eine ede deka ena teo bb ee E 4 2 IPOLSySEOITI ied edendo Tad edet eain ee cad e Ra ap aiia 4 2 1 General Technical Description 0000 0 cece cece eee 4 2 2 Implementation on SICOMP IMC 00s 4 2 3 Signals of the Bus Interfaces 0000 c cece eee eee 4 3 Local PCI Expansion BuS 0000 cece cette eens 4 3 1 General ae cise sateen 2 tot ta vad
159. ment of conformity for SICOMP IMC products usually consists of three parts 1 Cover sheet with specification of manufacturer product designation applicable EG guidelines and legally binding signatures 2 Appendix to the EG statement of conformity with specification of the harmo nized European standards used In addition it contains a list of the boards to which the statement applies 3 Notes on the CE seal of SICOMP IMC This part includes special notes on ap plication area and installation and setup guidelines Information and test values for electro magnetic compatibility are also found here CE conformity requires that these notes be adhered to The summarized EG statements of conformity for SICOMP IMC product groups can be obtained from your local Siemens office SICOMP IMC System Manual 12 20 J31069 D2001 U001 A0 7618 Service System Consulting Training 1 3 Table of Contents 13 1 Service 13 2 Replacement Parts and Repairs 0 c cece 13 2 1 Replacement Parts and Repair Service lsliiieiliuueess 13 2 2 Delivery Dates for Replacement Parts Service s 13 2 3 Delivery Dates for Repair Service Naemlichkeit Repairs 13 2 4 Delivery Releases 19 2 5 Handling uini iE ee On dee t Ra denuke dep d ada oed 13 2 6 Warranty Times 13 2 7 Packing 13 3 Export Regulations 13 4 Training Service SICOMP IMC System Manual J31069 D2001 U001 A0 7618 13 1 Service System Cons
160. mory read command Control signal of the CPU to read information from the memory address area MWTC M gt S TS Memory write command Control signal of the CPU to write information to the memory address area XACK S gt M TS Transfer acknowledge Transmission acknowledgment of slave modules signals the bus master that the operation to be executed by the slave has been executed and that the appropriate data have been read or output on the data lines SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System Address and data signals The AMS bus has 24 address lines This permits up to 16 Mbytes to be addressed directly Eight bit and 16 bit accesses can be performed over 16 data lines Table 3 6 Signal Address and data signals Signal Direction Character istic Function AO to A23 M gt S TS Address Inverted signals for selection of individual memory locations or input output channels Memory accesses can be made to an up to 16 Mbyte memory area AO to A23 Input output accesses can be made to up to 64k input output channels AO to A15 Input output mod ules must be able to react only to address lines AO to A7 and to ignore A8 to A15 BHEN M gt S TS Byte high enable Control signal for enabling information exchange on the more significant part of the data bus D8 to D15 This signal indicates a real 16 bit access to an even addr
161. mponents for electrical and optical transmission technologies Electrical network As its transmission medium the electrical network uses a shielded twisted pair cable Since the RS 485 interface works with voltage differences it is less sensi tive to interference than a voltage or current interface With PROFIBUS the sta tions are connected to the bus via a bus terminal or a bus plug connector maxi mum of 32 stations per segment The individual segments are linked via repeaters The transmission speed can be set in stages from 9 6 kbit sec to 12 Mbit sec in accordance with PROFIBUS The maximum segment length depends on the transmission speed SICOMP IMC System Manual 10 20 J31069 D2001 U001 A0 7618 Communication PROFIBUS PA electrical network The PROFIBUS PA transmission technology is based on IEC 1158 2 The trans mission speed is 31 25 kbit sec Optical network The optical PROFIBUS network uses fiber optic conductors as its transmission medium The fiber optic conductor version is not sensitive to electro magnetic in terference and potential differences It is suitable for long distances and uses fiber optic conductors of either plastic or glass Transmission speeds between 9 6 kbit sec and 12 Mbit sec can be used With the optical PROFIBUS the maximum segment length is not dependent on the trans mission speed exception redundant optical rings Fiber optic conductor networks are set up with OLMs Opti
162. n accordance with the IEEE 802 3 standardized ac cess procedure CSMA CD i e Carrier Sense Multiple Access with Collision Detection Industrial Ethernet offers an extensive range of network components for electrical and optical transmission technology Protocol profile e SEND RECEIVE The SEND RECEIVE interface has been optimized for communication between SICOMP IMC and S5 or S7 controllers TCP IP See chapter 10 1 2 Systems which can be connected 10 14 Communication interfaces are available for many terminals Table 10 3 Application areas of industrial Ethernet protocols Protocol Application Area User Interface SEND RECEIVE SICOMP IMC Simple functionality SIMATIC S5 S7 PC PG HMI S7 functions SICOMP IMC High functionality optimized for SIMATIC S7 PC PG HMI communication with SIMATIC S7 TCP IP SICOMP IMC General communication SIMATIC S7 PC PG HMI SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Communication PC PG PC PG i eee Ne S7 functions el ID ERI BITTE T MI BT TTG SICOMP IMC SICOMP IMC Figure 10 6 SIMATIC S7 migration with industrial Ethernet Networking capabilities available worldwide The ISO and TCP IP protocols are available as transport protocols The user in terface for SEND RECEIVE is not dependent on the transport protocol used Use of TCP IP permits
163. n floppy disk In addition documentation on commissioning is included SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System Advantages of the SMP16 bus system Further development of the familiar and reliable SMP bus industrial standard Its simple functions provide powerful bus interfaces with low bus interface costs The timing of the SMP16 bus increases bus performance without compromising compatibility with existing components Physically the SMP16 offers the advantages of the well known concept of the single Europa card format and indirect connection The layout of very powerful Systems is compact and an optimized price performance ratio is maintained at the same time Since bus pins which can be wired as desired permit flexible use of special functions e g large interrupt systems the SMP16 bus is very suited to indus trial real time applications with very short reaction times Using coupling modules two separate SMP16 systems can be connected In addition a bus coupler can be used to increase the number of slots for slave boards The SMP16 bus offers efficient methods of process visualization and utilization of a wide variety of software based on MS DOS or RMOS It can be used as a stand alone unit I O expansion and together with a second SMP16 CPU via a coupler module In addition it can be used as a universal hardware platform on which various operating systems can be run The components of
164. n treated chemically or mechanically so that they are not sensitive to touch but still have good electrical conductivity Guide rails of plastic 160 mm in length The frame which extends back over the bus backplane protects the connections of the bus socket terminal strips and backplane wiring from physical damage Electromagnetic compatibility EMC EMC requirements are becoming increasingly important for devices and systems See also chapter 12 on environment requirements The primary reasons for this are listed below Processing speeds of the systems are increasing e Systems are becoming larger Different systems converge in one plant One plant contains different performance levels External interference level is increasing Examples of SICOMP IMC system frames o e o EI e o00000000000000000000000000000000000000000000000000000000000000000000000000000000000 1 1 L 1 L I o o o o o o o o o o o o o o o o o o e al hal p ie Hl a de a enl i a ea en fall qe hal Shah in e ip de dee teal Se Sel el a en en ead ee Seu See deep a Sel Sf i dd dp e eal e ed heal Sea ee ih deu en ab eel e ie na INE MN pn EE LAE Ing We We wi EE IERI Inn INN NN In We ipt ian iue f
165. ndard applications such as telnet ftp and mail This makes it easier to work with different computers since the basic applications already exist The TCP IP protocol is divided into two separate protocols the Internet Protocol IP and the Transmission Control Protocol TCP The Internet Protokoll IP Standardized in RFC 791 IP is the protocol of level three It is responsible for the connectionless data transmission in the network The data are segmented into so called datagrams and sent to the network with destination and source address There the datagrams find their destination via various routers There is no proce dure to determine whether the data arrived safely not to mention whether the des tination computer is even part of the network The security of the data transmis sion must be ensured at a higher level by other protocols Since the transmission is connectionless any errors must be reported explicitly to the sender The ICMP Internet Control Message Protocol auxiliary protocol is used for this purpose The best known command from this protocol is the ping command which can be used to determine whether a computer is present in the network A test packet is sent to the destination computer which must then react with a response If this occurs within a certain period of time usually 20 msec the computer is reported as accessible The ping command only includes level three but not the higher levels Addressing 2 Ad
166. ne Routing of the interrupts requests and clock pulse supply is described in the iPCI specification 1 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 4 11 PCI System Special signals of the iPCI bus Table 4 5 Special signals of the iPCI bus Signal Signal Character Function Direction istic ACK64 Z gt P OC Request and acknowledgment for 64 bit transfers BEGG P gt Z The pull up resistor required for REQ64 is integrated on the CPU board in the system slot X1 to X6 These signals are connected through on the bus backplane and may not be used M66EN P gt Z OC This signal indicates whether the bus can be clock pulsed with 66 MHz in anticipation of PCI specification V2 1 Expansion cards which do not support this clock pulse fre quency must apply the signal to GND or connect with VIO via pull up resistor 4 7 KQ OSC Z gt P TP TTL compatible signal with 14 3180 MHz driven from the sys tem slot RSTIN P gt Z OC Open collector signal low active of a watchdog or RESET button The input of the RESET circuit of the CPU board in the system slot requires a pull up resistor 330 Q and ap propriate decoupling Only for the RESET generator system slot is the RSTIN signal an input For all expansion cards the RSTIN signal is an output VBAT Z gt P An additional battery can be connected here Ps7Z See chapter 8 3 4 SCLK Z gt P TS TP Signals of the serial bus 12C are no
167. needed an appropriate bus coupler PCI2PCI bridge must be used The bridge occupies the system slot of the second bus backplane The geometrical dimensions of the bus backplane and the position of the con nectors must comply with Europa format definitions SICOMP IMC System Manual J31069 D2001 U001 A0 7618 PCI System O O O O O g g ea g g q a a a t t t e cS 9 77 E 2 N eo z 2 2 9 9 o o o o o o o o o o z z z z z 2 2 D D OQ O O O O Additional iPCI backplane Additional backplane pum Figure 4 2 Principal layout of an iPCI bus backplane view of back An iPCI bus backplane with five slots is located in the middle The left hand slot is the system slot Additional backplanes are shown to the left and right of this bus backplane These permit integration of existing bus systems The iPCI bus can also be expanded with a PCI2PCI bridge The UNI I O expansion can be used to decouple the expansion bus from the back and wire it to the SMP16 bus backplane e g via a backplane connection Coding of the slots The slots of the bus backplane are coded as system slot or I O slots However the SICOMP IMC CPUs do not have coding since their layout makes incorrect installation on the iPCI bus impossible SICOMP IMC System Manual 4 6 J31069 D2001 U001 A0 7618 PCI System P
168. nel Its job is to man age the individual tasks The nucleus contains all procedures required to handle the multitasking functions The scheduler has a central function It allocates computing time to the tasks based on their priority In addition to memory and time management the mechanisms for communication and synchronization of user tasks are handled by the nucleus The nucleus also handles the operating system calls SVCs of the software interface SICOMP IMC System Manual J31069 D2001 U001 A0 7618 9 11 Software Drivers A device driver usually consists of several programs written in C or Assembler i e processing sequences and system processes which control and manage one or more I O devices of the same type or their controllers For example I O devices of the same type could be several terminals which are addressed via V 24 interfaces Drivers have a standardized interface to the RMOS nucleus containing data struc tures and procedure jumps All tasks can issue jobs to a driver using an operating system call SuperVisor Call SVC The nucleus checks the SVC copies the parameters to an internal data structure and calls the appropriate program of the driver At the same time other programs of the driver provide the interface between the device hardware and the RMOS nucleus This interface is implemented by inter rupt handlers All programs of one driver use the same data structures The pro grams of the drivers
169. ng the ASBIC wrap wiring on the I O boards was largely replaced by soft ware settings For automatic configuration see chapter 11 High computer performance due to latest CPU boards SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System 2 2 Function Description 2 2 1 Bus Elements Primary bus master CPUs Master boards CPUs also are boards which are able to actively initiate or execute a data transfer to or from the slave boards The user activates the control signals of the system and provides a valid address Primary bus masters usually always have control over the bus However bus con trol can be temporarily turned over to a secondary bus master for DMA cycles While the secondary bus master has control of the bus the primary bus master remains passive on the bus The SMP16 bus only permits one primary bus master i e mono master bus Secondary bus master Secondary bus masters are controllers which are not located with the primary mas ter on one board but whose functions sometimes require control of the SMP16 bus e g DMA controller boards The user requests bus control from the primary bus master The secondary bus master cannot begin data transfer operations until the primary bus master releases the bus If several secondary bus masters exist they themselves must provide for arbitra tion of conflicting accesses The SMP16 bus does not provide arbitration If this mode is desired make su
170. nly able to use operating mode 2 must be marked as only operating mode 2 for bus master SICOMP IMC System Manual J31069 D2001 U001 A0 7618 AMS System Slaves A slave decodes the address signals on the bus and reacts to the control signals of the respective bus master A slave cannot assume bus control AMS bus signals The bus signals can be subdivided into the following groups based on their func tions Control signals Address and data signals Interrupt signals Bus allocation signals Special signals Signals of the serial bus The individual signals of these groups are described in more detail in chapter 3 4 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 3 5 AMS System 3 2 2 Integration of the SMP16 and iPCI System in the AMS System The entire periphery of the SICOMP SMP16 and iPCI family can be utilized in the 16 bit AMS system to add powerful CPUs to SMP16 or iPCI applications to meet rising demands on computer performance and greater data throughput Physical integration The 6HE slots in an AMS system frame can be divided into 3HE slots for SMP16 and iPCl with accessory kits SMP16 bus or iPCI bus as local bus on SICOMP AMS system The multimaster AMS structure permits the setup of logically structured process oriented subsystems in which the SMP16 bus or the iPCI bus assumes the role of the input output bus See figure below Communication between the individual subsystems takes plac
171. nnected to one bus segment If the length of the segment is not sufficient additional seg ments can be added via repeaters ELMs Electrical Link Modules can be used to link bus stations terminals to the bus system via industrial twisted pair cables Optical network The optical network can be set up with a star linear or ring structure OLMs Opti cal Link Modules can be combined with the appropriate interface cards of a star coupler The data packets received from a bus station terminal are distributed simulta neously to all other systems via the star coupler The redundant optical ring struc ture increases the availability of a network since communication can be maintained even after a fiber optic conductor breaks Terminals can be directly connected to the interface cards of the star coupler via the 727 1 stub line or industrial twisted pair or to the OLM via ITP The MINI OTDE optical bus coupler can be used if the optical network is to be im plemented as far as possible up to the terminal Mixed network The electrical and the optical networks can be mixed SICOMP IMC System Manual 10 16 J31069 D2001 U001 A0 7618 Communication 10 3 PROFIBUS PROFIBUS is the bus system for cell networks with a small number of stations typically ten It is based on the European standard EN 50 170 volume 2 PRO FIBUS By meeting these requirements PROFIBUS ensures openness for connection of the standardized compone
172. not be stocked For ready to use cables or cable hamesses contact the SICOMP IMC Assembling Center SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 29 System Layout 8 8 8 8 1 8 8 2 8 8 3 8 30 Wiring Baring of Cables Cables can be bared mechanically or thermally by hand or automatically The type of tool to be used depends on the type and quantity of cables to be bared The length of be bared depends on the particular connection technique being used Warning When baring the cables do not nick or otherwise damage the individual conduc tors Use the correct baring tool for the particular type and cross section of cable Tagging the Cable Ends Permanent identification of the individual cables is desirable It simplifies mounting and trouble shooting Plastic markers ID sleeves or different colored cables are suitable for example Wrap Connections The term wrap connection is derived from Wire Wrap a registered trademark of the Gardner amp Denver company Wrap connections in accordance with DIN 41 b11 are solder free wire connections with a very high degree of reliability Using a wrap tool several windings of bared wrap wire are applied to a four corner wrap pin The high pressure creates friction locked gas tight connections on the edges of the wrap pin which ensure an age proof and very low ohmic connection There are two types of wrap connections i e standard and
173. ns 13 4 Training Service 2 0 0 14 Glossary Abbreviations sseeeeseeeee e In nn 15 Notes SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SICOMP IMC System 1 Foreword The open PC compatible SICOMP IMC system has been developed for industrial ap plications e g measuring and open and closed loop control Due to its sturdiness and universality it is also being used increasingly for many other tasks Tasks for which microcomputers are used are continuously increasing in scope and complexity The demands placed on such a system are listed below Deterministic behavior and short reaction times Precise and fast acquisition and evaluation of measuring data High working speed Extensive controller functions Interfaces to positioning systems and drives Unlimited communication capability e g point to point fieldbus or LAN WAN High degree of reliability and sturdiness Easy to use Open to PC operating systems e g Windows NT Windows CE and so on SICOMP IMC offers a wide variety of products and is the optimal basis for the ap plications and requirements listed below Real time applications using standard boards Visualization of processes Very high computation capability Highest demands on transparency of the logical structures Easy to expand The hardware components of the SICOMP IMC include powerful future oriented and inexpensive compact devices board systems SMP16 in single Eu
174. nsional drawing of a 96 pin bus socket terminal strip dimensions in mm SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout iPCI bus plug in connectors o090 90060e009009000n0092 900 o0000000020990900000900020 Contact surface 0 50 17 00 43 Figure 8 10 Dimensional drawing of an iPCI bus pin strip A B 1 5 x 6 pos CP NBI I e arm TE d AEAEE amarem E 3r 13 30 LL 0 40 5 x 24 pos 244 m 7 m n m ET EST EST eT eT Ee ef ff Ee Ee eT Ee s E Ce E ET Ee armenia armen DN Cd Fe EE Ee EST Ee Ee EE Ee EST Ee EE EE Cd EST Ee C Ee HIFI LII UHT Lii OF Li CHEN Lil VH Figure 8 11 Dimensional drawing of an iPCI bus socket strip SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Subminiature plug in connectors in acc w DIN 41 651 Subminiature plug in connectors in accordance with DIN 41 651 as socket and pin strips e g SBM 383 are used as I O plug in connectors e With 2 row strip body 9 15 25 and 37 pin e With 3 row strip body 15 26 and 50 pin Table 8 2 Electrical and physical characteristic values of subminiature plug in connectors General Specifications Explanation Certification for Siemens plug in connec tors UL file E 92320 project 85 ME 3872 Materials Insulation body thermoplastic synthetic material glass fiber reinforcement metal
175. nts of other manufacturers PROFIBUS the fieldbus standard for production and process automation con sists of the following Specification of the standards for the physical bus structure and access proce dures layers 1 and 2 of the ISO layer model e Specification of the user protocol and the PROFIBUS FMS user interface layer 7 for communication between programmable controllers and field devices e PROFIBUS DP for high speed cyclic data communication with field devices e PROFIBUS PA for applications in process automation which are intrinsically safe PROFIBUS Fully standardized and a good investment for the future Worldwide far more than 500 manufacturers offer a wide variety of products for field use with suitable interface Siemens itself offers a complete family of prod ucts including the required network components Table 10 4 Application areas for PROFIBUS protocols Protocol Application User Interface FMS SICOMP IMC High functionality SIMATIC S5 S7 PG PC HMI DP Intelligent binary and analog field Optimized for communication devices with field devices SEND RECEIVE SICOMP IMC Simple functionality SIMATIC S5 S7 PC PG HMI SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 17 Communication PC PG HMI PC PG HMI FMS DP SEND RECEIVE mi E Hm d l ETNE S7
176. o fibers Figure 10 9 Network configuration combined from electrical and optical PROFIBUS network SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 23 Communication 10 4 10 4 1 10 24 Controller Area Network CAN Since CAN Controller Area Network was originally developed for the automotive industry the primary goals were reliability and low cost In the meantime many of the big automotive manufacturers are using CAN net works or are preparing them The association of US truck manufacturers has se lected CAN as its fieldbus standard Several user associations have been founded in the field of automation As the umbrella organization for CAN the CiA association i e CAN in Automation does not just support CAN applications of classical automation technology Presently the CiA association has approximately 150 members including not only companies but also other organizations which support CAN in special fields of use e g CANTUG as the CAN Textiles Users Group for textile machine manufactur ers Within these groups various protocols of layer 7 have currently been stan dardized or included in standardization procedures Physical Structure CAN uses linear architecture Twisted pair cables with electric levels in accor dance with ISO 11 898 or modified RS 485 standard cables are primarily used as the transmission medium This permits a maximum distance of 40 m at a maxi mum transfer speed of
177. o his her Siemens office by telefax or undocumented and provides the information stated in table 13 1 The fol lowing additional information is important A precise fault description of the board A note as to whether special treatment e g more thorough inspec tion is required The Siemens office issues an order identifier AKZ The customer sends the defective part to the address for returns and naem lichkeit repairs Siemens AG A amp D SE B9 Wuerzburger Str 121 90766 Fuerth After receipt at the plant the defective part is repaired and returned to the customer within the following period of time e Normal repair 10 working days Fastrepair 5 working days e Immediate repair 48 24 or 8 working hours e AZS repair 8 working hours The repair flat rate is invoiced based on the table plus any extra charges For valid prices for repair flat rates and extra charges see the applicable price list Shipping charges are invoiced extra SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Service System Consulting Training 13 2 6 Warranty Times Table 13 8 Warranty times Service Duration New parts 12 months Naemlichkeit repairs and replacement parts 6 months Inspection flat rate Current warranty remains un changed 13 2 7 Packing The following points must be adhered to when packaging return shipments e Use the original packaging in which
178. oards can only be used with the SMP16 SYS403 under certain conditions Table 2 13 Boards with limited use with the SMP16 SYS403 Board Condition Restriction AMS M18 A160 Connector X6 for the KSP S18 plug in module may not be used since this might cause data collisions of the signals leading to the plug in module Termination on the SMP16 SYS403 must be deactivated AMS M44 Axx Wrap connections for the DACK 1 and DREQ 1 lines are required on the backplane if these signals are used Termination on the SMP16 SYS403 must be deactivated 1 SMP E14 Axx Termination on the SMP16 SYS403 must be deactivated SMP E591 Wrap connections for the DACK 3 and DREQ 3 lines are required SMP E592 on the backplane if these signals are used SMP16 CPUO24 Termination on the SMP16 SYS403 must be deactivated SMP16 CPU035 SMP16 CPU045 Only boards with MLFB no Xxxxxx xxxxx OAAO exception SMP16 CPU 045 100 Termination on the SMP16 SYS403 must be deactivated 1 See Deactivation of the termination of the command signals SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 23 SMP16 System Unsuitable boards The following boards may not be used with the SMP16 SYS403 Table 2 14 Boards not suited for the SMP16 SYS403 Board Explanation AMS M17 A8 Can only be used with the SMP E402 AMS M36 A251 Can only be used with the SMP E402 AMS M360 A3 Can only be use
179. occurs on the bus 2 20 Eight bit and 8 16 bit slave boards can be mixed in an SMP16 system In addi tion 8 bit slave boards can be used with 8 16 bit master boards and vice versa For details see chapter 2 6 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System 2 5 4 2 5 5 2 5 6 Read Operations During read operations 8 or 16 bit data words are transferred from a slave board to the bus master The slave board must place the data on the bus within a defined amount of time before the rising edge of the MEMR or IOR signal The access is concluded with the rising edge of the command Write Operations During write operations 8 or 16 bit data words are transferred from the bus master to one of the slave boards The bus master must place the data on the bus within a defined amount of time after the falling edge of the MEMW or IOW command The data can then be ac cepted with the rising edge of the command Slave Master Synchronization with RDYIN SMP16 bus cycles are normally ready cycles i e the bus master assumes that a slave board usually does not require individual wait cycles and the normal com mand length of the bus master is sufficient However there are certain situations in which the command length must be ad justed with RDYIN This may be true for example for certain accesses during which other processes must be waited for or the addressed slave board always requires
180. oduction of the iPCI as PCI expan sion bus for SICOMP IMC The PCI bus is designed in accordance with the iPCI specifications 1 All technical details are included in these specifications Motivation goals 4 2 Although plug in systems with passive bus backplanes are ideal for industrial sys tems PCI specification 2 0 had to be expanded to include several important sig nals for industrial applications Below are the primary foundations on which the iPCI specification is based e The existing board format is designed for 19 subracks Comparable electrical data are required to be able to easily link in existing PCI blocks in accordance with PCI specification 2 0 The geometry of all important signals was designed precisely as described in PCI specifications but with plug in connectors with industrial capability Passive bus with up to 5 PCI slots each has master capability More slots cannot be implemented at this time since the driver blocks are able to drive a maximum of 10 loads Each plug connector and each PCI block count as one load Use of fewer slots is also permitted This configuration corresponds to a standard motherboard with four PCI slots To obtain maximum flexibility when designing an iPCI system the plug in connec tor is divided into three separate parts A 120 pin base connector with all 32 bit PCI signals This connector is always required e A 60 pin expansion connector with the signals for th
181. ol and monitoring Implementation of the above functions is provided by the following types of core hardware components in the various performance levels of compact computers x86 processor core with memory architecture Digital and analog input output Serial interface s Encoder inputs Keyboard connection Display Businterface Uniform software structure A uniform software structure is provided by using the RMOSS real time operating system as a platform All other applications e g applications written by the cus tomer can then be linked in as tasks under RMOS This is supported by an included Basic IO System i e BIOS which is linked in as a library under RMOS All other programs must also be linked in at the task level Software packages are available for the various compact computers For more information contact your Siemens office SICOMP IMC System Manual J31069 D2001 U001 A0 7618 5 1 Compact Computer Transparency on software basis Examples Table 5 1 Sample configurations The method described above ensures transparency of the compact computer level both to the SMP16 system and the AMS system at operating system and program levels Compact computers may be provided with the following performance features for example Example 1 Example 2 Text LC display with 4 x 40 characters Sealed keyboard IP54 with 22 keys 9 status LEDs on the function keys 80386EX 512 Kbyte f
182. ontact The insulation dis placement contact technique is primary used for ribbon cables Ribbon cables Ribbon cables are multiple core mutually insulated conductors whose individual cores are located in one level This type of cable is primarily used for the parallel transmission of digital signals Note Division of the conductors must correspond to the division of the plug connector Use only those cables which meet the specifications of the manufacturer of the plug connector Location of the conductor Does not differ from the plug connector The plug connector must be completely closed Use only the tools of the manufacturer of the plug connector or those recom mended by that company Examples of insulation displacement connectors IDC plug connector in module scale BK MOD 421 422 Pin and socket terminal strips in accordance with DIN 41 651 6 10 14 16 20 26 34 40 50 60 and 64 pin Figure 8 20 IDC plug connectors SICOMP IMC System Manual 8 40 J31069 D2001 U001 A0 7618 System Layout 8 8 7 ZN Screw Connections With screw type connections connection is established by the pressure of the screw Caution Be sure to leave air and creepage distances as long as possible during installation Screw connection with cable shoe The cable shoe is squeezed onto wires or flexible leads See chapter 8 8 5 Direct screw connection 8 8 8 Single wire cables are connected di
183. or IOW becomes active Data signals The SMP16 bus transfers 8 bit data words DBO to DB7 and 16 bit data words DBO to DB15 You can choose between word and byte accesses Table 2 8 Data signals of the SMP16 bus Signal Signal Character Function Direction istic DBO to Z lt gt P TS Data Bit n DB15 P lt gt P Signals for exchange of information between bus master boards e g the CPU and slave boards DB15 is the most significant bit and DBO the least significant SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System Interrupt signals Table 2 9 The SMP16 bus provides an interrupt interface INT INTA for interrupt cascading via the SMP16 bus Additional interrupt inputs are available as special signals IRQn Interrupt signals of the SMP16 bus Signal Signal Direction Character istic Function INT P gt Z OC Interrupt Master input of the interrupt system for interruption of the run ning program on the primary bus master if requested If INT was activated by an external interrupt controller the primary bus master can determine the interrupt source via the INTA control signal INTA Z gt P TP Interrupt acknowledge Control signal of the primary bus master to external interrupt controllers to read the interrupt number i e determine the source IRQO bis IRQ7 P gt Z OC Interrupt request n
184. ormity have been adhered to Note The CE seal guidelines 73 23 EWG on low voltages is only required for boards which are operated with a nominal supply voltage of more than 50 V DC or 75 V AC e g system frames and power supplies However all boards must al ways meet the required safety standards applicable to today s state of technology SICOMP IMC System Manual 12 18 J31069 D2001 U001 A0 7618 Environmental Requirements 12 6 2 Notes on System Integration Although at least the same requirements must be met as for the system level ad herence to additional guidelines may also be necessary e g guidelines 89 392 EWG on machines Additional standards may also have to be adhered to However such standards can only be determined in individual cases and must be considered when planning the system Safety measures when configuring systems When configuring microcomputer board systems the dame VDE regulations must be adhered to as for safety controllers e g VDE 0100 and VDE 0113 This in cludes the following measures which are particularly important to the prevention of danger Dangerous states during which persons can be endangered or machines and material can be damaged must be prevented e After return of power or release of the emergency off facility machines may not be permitted to start up automatically again When the programmable controller malfunctions commands of the emergency off facilit
185. osoft and Netscape for example provide one free of charge Although HTTP has already been specified by the W3C a standardization commit tee in version 1 1 most browsers support version 1 0 More information on HTTP is available from the Internet under http w3c org Protocols rfc1945 rfc1 945 Function principle HTTP is a protocol without states i e server and client do not store data on the status of the connection Request Nr un Response Client Server Figure 10 5 Data communication with HTTP The client sends a request to the server The server evaluates this request exe cutes a certain function and returns a response to the client SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 13 Communication 10 2 Industrial Ethernet Functions Cell network based on international standard IEEE 802 3 Ethernet designed for industrial applications Connection of automation systems with each other and with PCs and worksta tions for homogeneous and heterogeneous communication Possible implementation of extensive open network solutions High transmission performance e Various transmission mediums e g triaxial cable industrial twisted pair and fiber optic conductors Industrial Ethernet is the industrial standard tested and accepted around the world Industrial Ethernet functions i
186. ower Supply The supply voltages 5 V 43 3 V and 12 V must be applied to the iPCI bus back plane based on the boards used The VIO potential depends on the requirement of the iPCI boards used and must be connected to 5 V or 3 3 V There is only one GND potential on the bus back plane Table 4 2 Power supply and current consumption in accordance with specifications Supply Voltage Connections per Consumption per Total Consump Slot Slot tion 5 Slots 5 Volts 5 8 Max of 7A Max of 20 A 3 3 Volts 5 7 Max of 7A Max of 20 A 12 Volts 5 1 Max of 1A Max of 2A 12 Volts 5 1 Max of 0 5 A Max of 1A VIO 4 Max of 1A Max of 2A VBAT 3 0 to 3 6 V 1 Max of 0 01 A Max of 0 05 A GND 22 Total power Max of 40 W Max of 100 W Front system Figure 4 3 U profile front plate 2 slots wide with ejection lever SICOMP IMC System Manual J31069 D2001 U001 A0 7618 PCI System 4 2 2 Implementation on SICOMP IMC In contrast to the conventional implementation on iPCI decoupling of the bus sig nals via UNI I O and wiring on the bus backplane the iPCI CPUs of the SICOMP IMC product family supply up to two with SMP16 or three with AMS backplane bus systems These CPUs always contact the iPCI bus from the left as seen from the front and the SMP16 bus from the right This means that SICOMP IMC CPUs may only be used on iPCI backplan
187. ower packs and graphics cards Single Europa format boards in multi row system frames To prevent unnecessary warming of other system components boards with high heat emission e g CPU boards and power supplies must always be placed in the top system row in multi row system frames SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 23 System Layout Heat pockets To prevent heat pockets from forming boards with high heat emission should not be placed directly next to each other Mixed AMS SMP16 system When several AMS bus masters are used make sure that the SMP16 buses are separated from each other i e no continuous SMP16 bus backplane SICOMP IMC System Manual 8 24 J31069 D2001 U001 A0 7618 System Layout 8 7 ZN 8 7 1 Information on Mounting This chapter contains information on mounting and installation of individual compo nents of the product family of SICOMP IMC board systems Warning When mounting be careful not to damage the protective conductor Do not dis connect the screw connection marked with the grounding symbol protective con ductor Connecting the Guides When plugging in the guide rails adhere to the scaling dimensions of the front plates For SMP16 or AMS boards this is 20 32 mm or a multiple thereof The currently available system frames always include guide rails 6XB9623 1BE00 Figure 8 16 Connecting guide rails 6XB9623 1BE00
188. pends on safety regulations of the device Voltage strength Depends on type of cable used Test voltage contact contact 940 V AC Isolation resistance gt 105 MQ Physical and Climatic Pin Strip Socket Strip Plugging frequency Requirement stage 2 Requirement stage 3 gt 200 plugging cycles gt 50 plugging cycles Flammability of insulation materials without cable Self extinguishing after lt 10 sec UL 94 VO Temperature range 55 C to 125 C remember cable insulation Creepage and air distances contact contact 0 7 mm SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Socket strip with pregridded press plate max 3 7 r ze ui s r Press plate zA a can be hinged d zT o N bx on both sides 4 oe Number 2 pec s of pins gt te NL A r Nor Direction of winding Adhesive tape Marking of first contact Figure 8 14 Dimensional drawing of IDC plug connectors SICOMP IMC System Manual 8 20 J31069 D2001 U001 A0 7618 System Layout Other plug in connectors Siemens front FK 2 plug in connectors with LED indication Section A B r3 o G Section A B Lu c COOL Ei 0 mune Y A eA BH S 2 C MA 4Bi 2032 22 AN d us ans ior BS 7 og 222 25 262 208 6 2558 395 08 198 12 2218 e oc e I 3 w x e
189. plug under nominal conditions and a load jump from 0 5 x lan to 0 7 x lan or vice versa Settling time t4 for a load jump The time from the beginning of the deviation until the final return of the out put voltage to the tolerance range of 2 5 as related to the final value of Ug after the jump Total interference voltage The maximum value peak peak of the interference voltage on the output direct voltage containing the three components ripple spikes and hum volt age Interference voltages are measured directly on the H15 counter plug at nom inal conditions and pure ohmic load with an oscilloscope whose band width is limited to 20 MHz Ripple Uy The approximately toothed shaped main portion of the interference voltage whose frequency corresponds to the switching frequency of the device Hum voltage Up Low frequency portion approx 100 Hz of the interference voltage coming from the rectification of the network voltage Effectivity The ratio of emitted and absorbed active power at nominal conditions Uen fen and lan Startup time The time between device switchon or return of input voltage after a power failure and the time at which all output voltages reach their tolerance range of 5 of their static end values Puffer time The prewarning time between the activation of the PF signal during failure of the input voltage and dropping of the output voltage to Uan 5 SICOMP IMC Sys
190. ptional plug connector provides an interface to another bus system or to an I O connector which can be defined as desired different for each slot A distinc tion can be made with coding Currently defined bus expansions on the UNI I O are listed below e SMP16 e ISA ISA96 AT96 PC104 e ECB e FD IDE e SCSI e VME SICOMP IMC System Manual J31069 D2001 U001 A0 7618 4 13 PCI System 4 3 4 3 1 Local PCI Expansion Bus General Mezzanine expansion modules have been defined in acc w 2 for VME sys tems This standard combines the electrical elements of the PCI bus with the physical form factors for CMC Common Mezzanine Card 3 Some SICOMP IMC CPUS are equipped with an interface for single PMC cards The component side of the cards points to the basic board The standard then de fines the component heights shown next The total height shown 10 mm 10 mm conventional distance greater distances due to connector on the board possible is binding See 2 and 3 Front plate PMC module on the component side 3 5 mm 4 3 mm Component heignt Component height 4 7 mm T j Connector area 31 mm Support point Connector PCB basic board Figure 4 6 PMC cards available component heights Bus mode signals 4 14 Since the PMC interface may also have been allocated for
191. r connection rail with guides Figure 8 8 Example of the accessory kit mounted on any slots view of back SICOMP IMC System Manual 8 10 J31069 D2001 U001 A0 7618 System Layout 8 4 Boards In accordance with part 5 of DIN 41 494 the board is considered the overall term for printed card PCB sub unit plug in module and expansion module and cas sette insert and module Detailed product documentation is available on some of the boards of SICOMP IMC microcomputer board systems The boards are delivered with default settings to support commissioning When I O boards are involved remember that their use may require firmware EPROMs and software floppy disks which you can order as BSP Board Sup port Package from your local Siemens office SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 11 System Layout 8 5 Plug In Connectors If they can be connected to bus systems SMP16 AMS and iPCI boards are equipped with bus plug in connectors Connections to the I O are implemented with I O plug in connectors Power and operational voltages are transmitted via H15 power connectors Plug in connectors and board specific accessories are specified in the chapters on interfaces and recommended accessories in the respective product documenta tion The types of connectors most frequently used for SMP16 and AMS boards will now be described e Multi point terminal strips and socket terminal strips in acc w
192. ransmission speed make this network particularly suitable for use in geographi cally small real time systems Transmission mediums 10 4 Because requirements are so different the cell and area network is also available in two basically different models i e in copper or glass fiber technology Copper is recommended when low cabling costs and easy expansion are desired A coaxial cable with additional shielding triaxial cable is used as the electrical transmission medium which guarantees high interference immunity The industrial twisted pair cabling system is ideal for structured cabling on the fac tory floor Twisted pair copper wires with double foil and braid shielding ensure reliable data transmission Easy installation flexible expansion and stationary wir ing using connection components are the outstanding characteristics of industrial twisted pair wiring However if galvanic isolation and EMC protection are the important factors glass fiber wiring is the optimal technology Never outdated fiber optic conductor cables represent a transmission medium which is totally insensitive to electro magnetic interference In addition this type of cable is completely isolated from the poten tial Absolutely no investment for expensive equipotential bonding is required SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Communication Criteria for selecting a network Table 10 1 Criteria for selecting a netwo
193. rdware architectures SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Software 9 1 2 Operating System Classes Operating systems can be divided into the following classes based on the applica tion area Time sharing operating systems The applications i e programs share computer time via these operating systems A quantity of time is allocated to each program During this time the program is processed by the microprocessor Allocation and management of these time frames can be static or dynamic Each program which is processed during the time allocated to it thinks that it has exclusive use of all computer and system resources Batch operating systems These operating systems use the stacking principle Each program is entered indi vidually or only called by a user in the dialog with the computer Real time operating systems With real time operating systems the individual programs i e tasks are assigned priorities The individual tasks are processed by priority i e the task with the highest priority is always granted computing time by the processor This task is granted comput ing time until it has concluded its job or is interrupted by a higher priority task or puts itself into waiting status e g waiting for flags mails semaphores expiration of a selected wait time and so on Computing time then becomes available for lower priority tasks The following demands which are particularly important
194. re address MAC Ethernet address to a known IP address and vice versa A diskless client can use a Broadcast message announcing its MAC address to fetch its IP address from SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Communication another computer Every computer in the network sets up a dynamic ARP table containing the computer name the MAC address and the path to the computer This table can be used to find the quickest route to the destination computer Subnet masks Subnet masks are required for the further structuring of a network which has al ready received an address Since routers must be able to recognize the different subnetworks part of the computer number is defined by the subnet mask as the network number The subnet mask helps to save on IP addresses since no new addresses must be requested The subnet mask specifies which of the address bits represent a network number The subnet mask is created by converting the binary format of the network bits to the decimal value Eight set network bits are the same as a subnet value of 255 The example below illustrates this Class B d 185 2 0 0 9 11101 00000010 Network gt lt Computer gt Class B EN Subnet mask 1 0 11101 00000010 255 255 255 0 A Network Subnet Computer Figure 10 3 Subnet mask Subnet mask 255 255 25
195. re that the primary bus master also supports this mode SMP16 slave boards SMP16 slave boards evaluate the address signals supplied by the master and react to its control signals SMP16 slave boards cannot be bus masters SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 5 SMP16 System PC compatible SMP16 slave boards PC compatible SMP16 slave boards support special PC compatible input output bus cycles marked by an inactive BUSEN signal and the status of the AEN signal These boards permit conventional PC I O functions such as PC compatible net works graphics e g VGA and so on These boards can also be configured so that they can be used with non PC compatible bus masters When PC compatible SMP16 slave boards are also to be used with standard SMP16 bus masters they must meet valid SMP16 specifications 1 2 2 2 System Architecture Memory Interfaces RAM Ethernet static dynamic PROFIBUS V 24 DMA EEPROM SimoLink EPROM SINEC L1 H1 CMOS Bit bus CPU Memory card i iem Coprozessor Digita SMP16 bus Additional y o Special Software system functions controllers system functions Driver Counters timers Floppy disk hard disk Coupling boards Monitors Interrupt control CRT Dual port RAM DEA fan Calendar clock SCSI PC compatible acad B Power failure IEC l subsystem operating system Graphics Po
196. rectly without core end sleeves With flexible leads the bare ends must be protected against splicing with core end sleeves Double connections of fine wire cables with same or different cross sections must be provided with a core end sleeve which is squeezed on with a suitable tool See chapter 8 8 5 With double connections of single wire conductors make sure that both conduc tors are positioned parallel to each other on the terminal With conductors with different cross sections use only suitable connection elements e g in accordance with DIN 46 288 Plug In Connections With plug in connections contact is established by joining two connection elements e g single plug connector elements sleeves and flat connectors multiple pin plug in connections or by direct insertion e g socket terminal connections SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 41 System Layout Insertion of plug in sleeves and flat plug connectors Multiple connections i e with several plug in sleeves on one plug connector are not recommended since they require greater socket strength See table 8 8 Caution To avoid damaging the plug in connection use the tools of the manufacturer or special insertion removal aids when establishing or disconnecting the connection Table 8 8 Standardized plug in sleeves and suitable flat connectors Plug In Element Plug Con Flexible Lead Can Be Used with nector Cro
197. ring The relatively low supply voltage and the high speed of modern integrated circuits make it necessary to protect the wiring between the boards from interference of high current cables When smaller systems are involved the wiring can be shielded with a wiring shield plate shielding hood mounted directly on the subrack via the bus backplane When larger systems are involved the cabinet in which the subracks are installed can be used to shield the wiring SICOMP IMC system frames provide full shielding in conformance with EMC re quirements SICOMP IMC System Manual J31069 D2001 U001 A0 7618 12 11 Environmental Requirements i Cable Installation Signal and data cables must always be installed with shielded cables separately from power supply cables and control cables of contactors frequency converters and control units Separate cable ducts should be used whenever possible mini mum of 10 cm separation There should always be space between control current circuits and load current circuits In addition analog signal cables should not be installed in the vicinity of sources of interference e g transformers inverters motors contactors high volt age cables and so on and should be kept as short as possible Interference within the system itself is primarily caused by capacitive cross feed i e it depends on the strength of the capacitive coupling Capacitive coupling can be affected by the length of parallel cab
198. rk Feature Industrial Ethernet PROFIBUS CAN Standard Ethernet in acc w PROFIBUS in acc w EN Specifications in acc w IEEE 802 3 50 170 volume 2 PROFI DIN ISO 11 898 BUS Access procedure CSMA CD Token passing with lower CSMA CR level master slave Transmission 10 Mbit sec 9 6 to 1500 kbit sec ad 9 6 to 1000 kbit sec speed justable max of 12 Mbit sec Transmission me dium Electrical network Triaxial cable e Double shielded twisted pair cable Optical network Fiber optic conductor glass Electrical network e Shielded two wire cable Optical network Fiber optic conductor glass or plastic Shielded twisted pair cable Max number of stations 1024 127 64 masters Approx network size Electrical network 1 5 km Optical network Up to 200 km Electrical network 9 6 km Optical network Up to 90 km Cable length 40 m to max of 1000 m Link to PLC PC WS Link to technical office Networking via WAN Cell networks with small number of stations typi cally up to 10 PLCs or PCs Use also in intrinsically safe areas Topology Line tree ring star Line tree ring star Line tree star Protocols MAP PROFIBUS FMS CAL TF PROFIBUS DP SDS SEND RECEIVE SEND RECEIVE DeviceNet S7 functions S7 functions Applications Cell network Networking of field de Networking of field de area of use vices e g decentral l O vices Sensor
199. ropa format and AMS in double Europa format for 19 inch layout technology SICOMP IMC System Manual J31069 D2001 U001 A0 7618 1 1 SICOMP IMC System The bus systems have been optimally adapted to the requirements e SMP16 8 16 bit is an open interference immune and sturdy bus for I O with a defined bus performance of up to 10 Mbyte sec e AMS 16 bit is a multi master bus in accordance with Multibus specifications e iPCI 32 64 bit is an embedded standard PCI bus for highest data speeds up to 132 Mbyte sec e PMC is a local bus for standardized PCI Mezzanine Cards The board systems have been coordinated to permit the advantages of the com pact SMP16 boards and multiprocessor capable AMS boards to be combined in one frame With the AMS the transparent local bus concept based on SMP16 or iPCI permits integration of two or more bus systems in one frame PMC modules can be integrated in both the SMP16 and AMS systems SICOMP IMC is also flexible when it comes to operating systems It can handle Windows NT Windows CE the RMOS real time operating system and any other operating systems based on the PC platform SICOMP IMC ensures an unusual amount of freedom from full PC compatibility to optimized embedded solutions SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System 2 Table of Contents 2 1 System Overview sssuussessee hn 2 2 2 2 Function Description slseeseeeseee
200. s C networks are the smallest networks They can con tain a maximum of 256 computers but can be addressed in very great numbers i e 221 In addition special Multicast addresses are reserved These are identified by the first bits 1110 Addresses with the bit sequence 1111 are reserved for future ap plications Originally it was assumed that a 32 bit address area would be sufficient However the enormous popularity of the Internet caught everyone by surprise Already now class A addresses are no longer available Class B addresses are only assigned after rigorous examination However class C addresses are easy to obtain Cur rently strong initiatives to expand this address area are making the rounds The draft with the greatest chance of success is called IPng i e IP next generation It defines an address area of 16 octets IP addresses are noted in decimal format in groups of four For example a valid IP address is 201 1 212 1 This is a class C address The initial number indicates this since C class networks are located in the area from 192 to 223 The last num ber specifies the computer in the network In our example this is the computer with the address 1 The numbers 0 and 255 should not be used in the address since they have special functions e g zero is used for network addresses The ARP i e Address Resolution Protocol is used to announce IP addresses on the Internet This protocol can be used to assign a hardwa
201. seeee ees 2 2 1 Bus Eleirients voces eee RE RRELEROZEEE RENE ahead EFE EA 2 2 2 System Architecture ssssssssssssssesss eh 2 3 General Technical Description 0000 0 cece eee eee 2 4 Signals of the Bus Interface 000 e eee eee 2 4 1 Explanation of Table 2 4 1 0 tees 2 4 2 Description of the Bus Signals 0 cece eee eee eee ees 2 5 Data Transmission on the BUS 0 cece eee eee 2 5 1 General Description sassis iapa sia aada a h a re 2 5 2 Data Bus Length ee irsi esses irmi oet eem eod dod ee a 2 5 3 Control of the Data Bus Length with IOCS16 and MEMCS16 2 5 4 Read Operations 000 eee d nienia oni eE a eens 2 5 5 Write Operations ainnean na cc eee ren 2 5 6 Slave Master Synchronization with RDYIN 0000eeeeeee 2 5 7 Command Delays and Wait Cycles 000 cece eee eee eee 2 6 Combination of SMP16 and SMP Components 2 7 List f References ozcesv ense idt ke RERBA pOPPERe d RR SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 1 SMP16 System 2 1 System Overview The SICOMP SMP16 system Products The SICOMP SMP16 system is a further development of the modular SMP board system which has proven itself in long years of industrial use Like the original sys tem this system offers reliability continuity and constant innovative further deve lopment The SICOMP SMP16 bus is compatible with the o
202. sition control Stepper motor control Figure 2 1 2 6 System architecture of the SICOMP SMP SMP16 bus SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System Table 2 1 SMP16 system data SMP16 System Data System configuration Mono master system with DMA capability System bus Synchronous bus separate address data lines Transfer speed lt 10 Mbyte sec Slots Max of 21 per 19 inch system subrack Data size 8 or 16 bits Address areas 1 Mbyte memory address area 64 Kbyte input output address area 4 Kbyte memory input output address area MMIO Interrupt system Depends on CPU used Multiple computer configuration Dual port RAM coupling in a system frame with sepa rate backplanes Methods of bus coupling SMP16 SMP16 See chapter 8 Board configuration Via ASBIC per software via local registers or wrap Settings Plug connection system Indirect 96 pin in acc w DIN 41612 EMC and environment compati bility CE conformance See chapter 12 Fan No fan Exception High performance CPUs See chapter 12 4 Backup battery See chapter 8 Supply voltages 5 V 5 96 3 3 V 5 96 optional 1 12 V 5 optional 15 V 3 optional 1 Specific boards may have different requirements Table 2 2 Nomenclature Nomenclature
203. ss Section Width in mm2 in mm Plug in sleeves with insu 2 8 0 5 to 1 0 Flat plug connector in acc w DIN 46 342 lating sleeve in acc w straight and bent D 1 N40 ado 4 8 0 5 to 2 5 Multi point terminal strip in acc w 6 3 0 5 to 6 0 De Ee Flat plug connector in acc w DIN 46 244 Plug in sleeves with insu 2 8 0 5 to 1 0 Flat plug connector in acc w DIN 46 342 lating sleeve in acc w straight and bent DIN 46 247 4 8 1 0 to 2 5 Multi point terminal strip in acc w 6 3 1 0 to 6 0 PUN dH Ede 95 6 0 Flat plug connector in acc w DIN 46 244 Flat plug connector with 6 3 1 0 to 6 0 out insulating sleeve in acc w DIN 46 2481 1 Several conductors can also be crimped in the plug in sleeve The ends of flexible leads may not be sol dered Color IDs in accordance with DIN 47 002 Plug connectors with protection against disconnection i e locking clip are avail able from the AMP company for plug in connection of signal lines to the wrap pins of the bus backplanes Insertion of ribbon cables and lines with multiple plug connectors Generally no special tools are required for this connection If necessary make sure that the coding of both parts of the plug in connection match Snap in locks locks and screws must be snapped in or tightened Note Adhere to the specifications of the manufacturer for current loadability and plug ging frequency SICOMP IMC System Manual 8 42 J31069 D2001
204. ss visualizations via HTML pages or Java applets can be easily created with standard tools e g Frontpage and JDK Access and pre sentation of this information is provided by standard Internet browsers e g Netscape and Internet Explorer regardless of the location No special pro grams are required for presentation of the information This method permits quick diagnosis i e low standstill times for the systems Similarly you receive correct and current system data for trouble shooting This cuts down travel time for ser vice personnel Remote maintenance and remote diagnosis are under preparation SICOMP IMC System Manual 10 28 J31069 D2001 U001 A0 7618 Commissioning Testing and Debugging 1 1 Table of Contents 11 1 COMMISSIONING 2 x aure d rina sede e e bivep erbreerskuewd vaqdyes 11 2 Commissioning the Hardware 00 60 c cece eee eee eens 11 3 Installing the Operating System 00 0 cece eee eens bL Prec TL32 MS DOS iiceentbesieubeldeenbeR perde a REM Gee d ipe d ded diodes TESS WINDOWS oe iie cx ecce descen t irent a oi eee RUE RU A cee 11 4 Parameterizing the Boards sssleslssslselessleesseess 11 4 1 Software Settings llisslssiusssseslesssessl esee 11 4 2 Hardware Settings 0 0 cece eee 11 4 3 Testing the Set Boards 00 eee eee eee 11 5 Commissioning an Application 00600 c cece eee 11 5 1 Generating New Applications 0 0
205. t used by SICOMP IMC SDAT and require one pull up resistor 4 7 kQ each on the CPU P gt Z OC board NMI Z gt P OC Non maskable interrupt low active All I O cards can acti vate NMI separately USB Z gt P TS TP Universal serial bus If not used one pull up resistor 4 7 kQ USB each is required on the CPU board VIO The voltage level on the VIO depends on the level of the PCI signals 5 V or 3 3 V The 32 bit bus and the 64 bit expan sion must have the same level X7 to X12 These signals may not be used They are reserved for future expansions of the PCI bus 4 12 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 PCI System 64 bit expansion All signals for the 64 bit expansion must be terminated on the CPU with resistors in accordance with PCI specification 2 0 2 7 kO for 5 V signals and 8 2 kO for 3 3 V signals The 64 bit expansion is planned for the bus backplane but is not configured cur rently Table 4 6 Signal allocation of the iPCI bus I O slot Connectin a b c d e 1 GND X7 X8 X9 GND 2 X10 GND AD32 AD33 AD34 3 AD35 AD36 GND AD37 VIO 4 AD38 AD39 AD40 GND AD41 5 AD42 AD43 AD44 AD45 GND 6 VIO AD46 GND AD47 AD48 7 VIO AD49 GND AD50 AD51 8 AD52 AD53 AD54 AD55 GND 9 AD56 AD57 AD58 GND AD59 10 AD60 AD61 GND AD62 VIO 11 AD63 GND PAR64 C BE4 C BE5 12 GND C BE6 C BE7 X11 X12 I O bus expansion This o
206. tage Current consumption le The effective value of the input current at nominal input voltage and nominal load on all outputs of the device The value of the input current shown on the nameplate is the maximum occurring le at Ue min and overload on the outputs The specified value is approximately 20 to 3096 over the typical measured value Fuses For the type of fuse see the product documentation of the individual power supplies Output nominal voltage Uan The direct voltage for which an output is designed e g 5 V DC or 12 V DC Output nominal current lan The current for which an output is designed i e the maximum continuous current with which an output may be loaded under the following conditions e Ue within permissible range e Ua z Uan e Ambient temperature within specified operational temperature range e All other parameters for nominal conditions Output limit current lag All outputs are provided with continuous short circuit immunity by current limitation The output limit current lag is the value of the output current at which the internal device current limitation is triggered Ua drops below 0 95 x Uan It is usually 1 10 to 1 20 x lan Output short circuit current lak The value of la for short circuited output 0 Q SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Power Supplies Table 7 1 Definition of terms continued Term Definition
207. tem Manual J31069 D2001 U001 A0 7618 Power Supplies Table 7 1 Definition of terms continued Term Definition PF delay time The waiting time until deactivation of the prewarning signal PF during switchon or restart It begins at the time at which the output voltage 5 V reaches its lower tolerance limit and ensures that for multiple voltage de vices the other voltages will have reached their tolerance limits before deac tivation of PF Reserve time Time before failure of the input voltage calculated from the last voltage zero crossing to the dropping of the output voltage to Uan 5 The reserve time depends on the input voltage Ue and the load la Standard values for the reserve time at la lan e For Ug Uemin Reserve time gt minimum buffer time e For Ug gt Uen Reserve time gt 20 msec Power failure backup time The maximum permissible duration for a failure of the input voltage without activation of the PF signal Minimum backup time gt minimum buffer time SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Power Supplies 7 3 Power Failure Signaling To ensure data saving and later restart of the microcomputer system when a failure occurs or the supply voltage drops below the tolerance limit the power pack sup plying the 5 V supply voltage must generate a power failure prewarning signal This must be connected to an interrupt input of the CPU for evaluation
208. ters 2 to 4 The bus backplanes consist of an approximately 3 2 mm thick PCB with slots for up to 21 boards SMP16 and AMS systems and up to 5 boards iPCI systems The slots of the SMP16 and AMS systems use 96 pin socket terminal strips while the slots of the iPCI system use 120 pin socket terminal strips Design uses inser tion technology The backs of the contacts of the bus socket terminal strips for SMP16 and AMS bus backplanes are equipped with approximately 10 mm long wrap pins which can be used for special wiring For detailed information on power electrical shielding and so on see the respec tive product documentation For notes on mounting see chapter 8 6 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout The following figure shows the calculation of the total length of a bus backplane using the SMP16 bus backplane with five slots as an example 20 32 i A Oo O O O O LLL D a a a D Y Fi Y Y Boo D00 200 gon 500 e io N N poo D00 cog 000 D00 poo D00 200 gag D00 D T D Y O O O O O O y Approx 10 BI 3 2 lt 11 6 E he Length a n 1 x 20 32 10 36 whereby n
209. the Boards SICOMP IMC boards are delivered with default settings which ensure principal functionality Since these default settings only represent the basis of an applica tion they must be adjusted to the particular application Addressing the boards The first adjustment concerns the type of addressing and the address area under which a board is to be addressed To prevent incorrect or double addressing within the system assignment of the addresses and address areas should be performed with utmost care Errors in address assignment may cause errors in operation later on which can be very time consuming to correct We recommend setting up a graphic overview in which the address areas of the individual boards are entered for the various types of addressing In addition make sure that address mirroring particularly by older SICOMP IMC boards which are linked to the system does not cause address overlapping The reason for this is that since older boards sometimes only decode 8 to 12 ad dress lines they can be addressed several times in the applicable address area SICOMP IMC System Manual 11 6 J31069 D2001 U001 A0 7618 Commissioning Testing and Debugging Other settings Other settings are board related See product documentation Examples of addi tional settings are listed below e Output input voltage range of an A D converter board e Interrupt source s used e Clock pulse frequency and scaling factors e Baud rate an
210. the appropriate DACKn signal PWFAIL Pz OC Power failure Indication of the power pack that the primary power supply has failed After PWFAIL becomes active a certain amount of time remains during which the system state is saved while system power remains stable See chapter 7 UBAT P gt Z P Battery voltage External voltage input for battery powering of buffered SRAM CMOS clock blocks and so on See chapter 8 ACEN ACDONE PsP P gt P OC Auto configuration enable Auto configuration done Daisy chain signals for initialization of the ASBIC blocks on SMP16 boards The ACEN input tells a board that it has been selected for configuration of the ASBIC block The board uses the AC DONE output to announce that its configuration has been completed and the next board can be configured See chap ter 11 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 2 17 SMP16 System Table 2 10 Special signals of the SMP16 bus continued Signal Signal Characteri Function Direction stic AEN Z gt P TP Address enable Control signal for PC compatible bus accesses This PC compatible bus signal is activated when a one cycle DMA transfer or an input output access occurs on PC com patible SMP16 slave boards AEN may only be deactivated if the BUSEN signal of the SMP16 bus is also deactivated This signal can be disregarded for memory accesses
211. the new part was delivered e Ifthe original packaging is not available electronic switching circuits and boards may only be shipped transported and stored in special ESD packaging Note The sender is responsible for transportation risks Improperly packaged return shipments will be rejected SICOMP IMC System Manual J31069 D2001 U001 A0 7618 13 9 Service System Consulting Training 13 3 Export Regulations Current regulations require that the following export regulations be adhered to for all products Table 13 4 Meaning of the export identifier Identifier Meaning AL Number of the German export list Products with identifiers other than N require export authorization With software products the export identifiers of the data medium must also always be adhered to ECCN Number of the US export list i e export control classification num ber Products with identifiers other than N require re export authorization With software products the export identifiers of the data medium must also always be adhered to Note Goods marked with ALzN are subject to European or German export authoriza tion when exported from the EU Goods marked with ECCN N are subject to US re export authorization Authorization may still be required when no identifier exists or identifiers AL N and or ECCN N are used e g due to final destination and purpose of the goods Domestic condition
212. ture plug connectors socket terminal strip SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout IDC plug in connectors BK MOD 421 422 in acc w DIN 41 651 These plug in connectors are 2 row insulation displacement connectors in accor dance with DIN 41 651 for flat lines IDC Insulation Displacement Connector Table 8 3 Electrical and physical characteristic values for the BK MOD 421 422 IDC plug connectors Material Pin Strip Socket Strip Insulating materials Thermoplastic synthetic material glass fiber reinforcement flammability protected in acc w UL VO pebble gray RAL 7032 or black locking compact header RAL 9005 Contact carrier Copper alloy Copper alloy Contact surface Contact pin Au Pd Plugging area Double con nect Au Pd Soldered pin Tin over nickel Insulation displacement Tin over nickel Technical specifications Model in acc w DIN 41 651 compatible with Great Britain GB PPO SPEC D 2632 connector France F UTEC C93 428 Mod le HE 10 01 Europe EUR CECC 75 101 IDC technology In acc w DIN 41 611 part 6 Stress measuring and testing procedures in acc w IEC publ 68 and IEC publ 512 DIN 40 046 and 41 640 Characteristic Values Electrical Characteristic Values Pin Strip Socket Strip Current loadability per contact at ambient temperature 20 C 1 5A 70 C 1 0 A 100 C 0 5A Operational voltage De
213. u Ni Pd over over Pd Ni over Ni Plugging frequency 1 Requirement state 1 2 500 plugging cycles and industrial conditions in acc w part 5 of Requirement state 2 DIN 41 612 Requirement state 3 gt 400 plugging cycles and industrial conditions in acc w part 5 of DIN 41 612 gt 400 plugging cycles 50 plugging cycles High current and coaxial con Yes x tacts Approval for UL listed File E 92329 project 84 ME 9787 Siemens plug in connector CECC 75 101 801 1 Industrial climate test SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Bus plug in connectors 96 pin multi point terminal strip in acc w DIN 41 612 model C 3 row strip body rows a b and c configured 3E 10 6 14 24 5 cba 289 13 2x2 54 E D 1 ooo nun o IS 000 2 non ao ano 000 ooo z c D ao a aug x d 3 ooa D ooo 29 ooo oa E m 1 000 xX gung g ceo N ao aug nun C ooo ooo ooo ooo aug o ooo 000 D ooo 000 D 4 E 34 32 E J He Figure 8 9 Dime
214. uct documentation Technical description and or product release letter SICOMP IMC System Manual Glossary 2 J31069 D2001 U001 A0 7618 Glossary Abbreviations Protective ground The conductive connection to ground of a conductive part of a resource which does not belong to the operational current circuit Reference potential Basis of voltage interpretation Shield Protective measure for systems cabinets or cables against interference from the surroundings Shield retainer rail Group line for all shield cables in a switching cabinet or system TB Technical description SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Glossary 3 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Notes SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Notes SICOMP IMC System Manual II J31069 D2001 U001 A0 7618 Notes SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Hl Notes SICOMP IMC System Manual IV J31069 D2001 U001 A0 7618 Siemens AG Automation and Drive Technology A amp D SE V32 Postfach 2355 D 90713 F rth Bay Dear Reader We hope that this documentation provided you with extensive support while using our products Our goal is to imporve technical documenta tion particularly with respect to your informa tion needs and requirements Plaes help us to achieve this goal by sending us your criticisms and ideas The following questions are provided as
215. uency portions of this interfer ence cannot even be suppressed by regulated power packs Special power net work filters are required which are positioned directly on the subrack for smaller systems or at the point where power is fed into the cabinet No overvoltages may occur in the cabinet on the 24 V power cables and the signal cables The following measures are recommended to avoid overvoltage peaks Take measures against inductivity built into the same cabinet e g with RC ele ments Fluorescent tubes should not be used to illuminate the cabinet since these may interfere with the devices LINESTRA or incandescent filament bulbs are bet ter If fluorescent tubes must be used the following measures must be taken Power network filter or shielded power network feeder cable Metal encapsulated switch Completely shielded cable Shielding mesh over the light in exceptional cases e g close to the control ler SICOMP IMC System Manual J31069 D2001 U001 A0 7618 12 7 Environmental Requirements d Separate power supplies for encoders and output components The power supplies of encoders and output components must be provided with fuses and their interference must be suppressed The following figures provide information on the procedures to follow depending on the location of the circuit breakers or fuses Input ports Output ports d P V OT Front plug connector cable 24 V
216. ulting Training 13 1 Service The following services are available Consulting service Support service Replacement parts service Applications service Training service Consulting and support are provided free of charge for SICOMP IMC products The other services are available on request and are invoiced at a flat rate or based on time and cost Services invoiced by time and cost are performed during your region s regular working hours with start of work at a conventional time Your contact partners for services are the sales representatives and specialized consultants of VReg or LG Consulting service Includes all questions on the subject of automation technology Support service Hotline Central point for customer service by telephone e Applications support Service during project implementation Documentation Requests for technical descriptions and manuals Replacement parts service e Fast service Storage and quick delivery of replacement parts e Fast service Naemlichkeit repairs fast service and emergency service Handling of returns Reliable procedure for handling returns Applications service Consulting Support during configuration e Application support during design in SICOMP IMC System Manual 13 2 J31069 D2001 U001 A0 7618 Service System Consulting Training Training service Customer training Training for service also possible on site Presentations Seminars with presentat
217. upt handler SICOMP IMC System Manual J31069 D2001 U001 A0 7618 9 13 Software 9 3 3 Management of Tasks Task management is one of the primary jobs of the operating system kernel i e nucleus For example RMOS defines five different states which a task can as sume To ensure transparency a task must always be in one of the following states under RMOS Table 9 1 Possible states of tasks State Meaning Computing Computing is the task which has been granted CPU time and is exe cuting its code Ready The task which has all resources except for the CPU required to execute the task is in the ready state Waiting If the resources required to execute a task are not free or the task is waiting for an event this task must assume the wait state before it can become ready again Dormant The task is in standby It is no longer involved in processing but is still known to the operating system via its structures Non existent The operating system is not aware of the existence of the task The coding of this task may already exist in memory or be reloaded from mass memory When allocating CPU rights the scheduler only considers the tasks which are in ready status Change in state Each task is in one of the possible task states However a task is not assigned a certain state at the outset A task assumes certain states and changes states These changes in state are determined by the required availa
218. ur geschultes Personal Observe Precautions darf die Verpackung ffnen for Handling Elektrostatisch gefahrdete Bauelemente EGB A Electrostatic Sensitive Au Devices ESD Figure 8 17 ESD warning label SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 27 System Layout Notes on installation With a SICOMP IMC microcomputer system additional settings can be used to adjust the individual components e g with regard to address assignment inter rupts or timing to each other and the application For possible settings see the chapter on commissioning of the product documen tation of a board Software settings are covered in the chapter on programming notes Empty slots 8 28 Slots which are not configured with a board must be closed for the following rea sons e Protection against touch and foreign bodies e EMC compatibility Assurance of defined air circulation e g for forced ventilation See also chap ter 12 Suitable front plates i e dummy covers are available as accessories Installing and Removing the Boards Caution Make sure that the bus backplanes are positioned as described in chapter 8 7 3 Otherwise boards or bus backplanes may be damaged Caution Adhere to the ESD guidelines when handling the boards See chapter 8 7 4 To remove a board gently move it up and down while pulling it to the front and out of the subrack The board should only be touched on the
219. us continued Signal Signal Direction Characteri stic Function MEMCS16 P gt Z OC Memory chip select 16 This signal tells the bus master whether the slave board ad dressed via address lines AO to A19 or via AO to A11 together with MMIO in the memory address area is able to perform a 16 bit access Bus masters which support the IOCS16 and MEMCS16 signals automatically divide the 16 bit access triggered by the SW into two byte accesses when the addressed slave board does not activate any of the signals appropriate to the type of access as soon as it recognizes its address IOCS16 and MEMCS16 may only be activated by slave boards at even addresses A0 0 The IOCS16 and MEMCS16 signals are required for a 16 bit transfer between SMP16 slave boards and PC compatible SMP16 bus masters MEMR Z gt P TS TP Memory read Control signal of the CPU to read information from a 1 Mbyte memory address area of the SMP16 bus If the MMIO signal is active at the same time input output boards which use the so called memory input output proce dure are addressed MEMW Z gt P TS TP Memory write Control signal of the CPU to write information to a 1 Mbyte memory address area of the SMP16 bus If the MMIO signal is active at the same time input output boards which use the so called memory input output proce dure are addressed MMIO Z gt P TP
220. usually access these data structures independently of one another All programs of a drive are components of RMOS and implicitly have a higher priority than the user tasks The following parts of a driver can be implemented as separate programs e Initialize hardware and some data structures e Handle requests by a task RmIO SVC Handle interrupts Handle timeouts e Conclude a request A driver must control and manage several devices of the same type or their con trollers Adjustment of the driver to the controller is performed via initialized data structures DCD and UCD tables in the configuration SICOMP IMC System Manual J31069 D2001 U001 A0 7618 Software The interrupt handler An interrupt handler is a procedure which is jumped to and executed immediately after a hardware or software interrupt occurs on the processor Under RMOS an interrupt handler can always be tailored to special hardware con ditions Interrupt handlers can be configured enabled and disabled from tasks that are run ning If necessary an interrupt handler can branch to a system process for which task communication resources are available for event flags local mailboxes and task starts by calling subprograms Tasks Job for driver via SVC i Nucleus Call driver program Y Dri Interrupt ve SVC check Copy parameters Management Interrupt handler control A Interrupt I O devices Figure 9 4 Interr
221. v Figure 4 1 Physical layout of the iPCI boards SICOMP IMC System Manual 4 4 J31069 D2001 U001 A0 7618 PCI System Table 4 1 Specification for iPCI boards Length 163 mm Height 100 mm PCB thickness 1 6 mm 40 2 mm Front plate Aluminum 2 5 mm thick U profile EMC springs pos sible Height of the components Max of 14 mm Length of the connections or thickness of the components on the back of the PCB Max of 2 0 mm Locking Individual locking with screws Pull lever Tip lever with space for labeling e g logo or board designation I O connector Connectors appropriate for the functions primarily sub D technology Color of the outside No color anodized Mounting dimensions In acc w internal specifications Labeling In acc w internal specifications Backup battery See chapter 8 Supply voltages 5 V 5 96 43 3 V 5 96 optional 1 12 V 5 optional 15 V 3 optional 1 Other requirements may pertain to specific boards Bus backplane The following prerequisites apply to the iPCI bus backplane of the SICOMP IMC system The bus backplane consists of one system slot and a maximum of four expan sion slots If fewer expansion slots are needed the bus backplane may be shorter The system slot is always located on the right as seen from the front e f more than four expansion slots are
222. ver 150 SICOMP SMP boards on the market today Use of the SICOMP SMP16 boards permits flexible automation systems to be set up quickly This provides extra time to write the application software The SMP16 bus is a synchronous mono master bus with 16 bit data bus 20 bit address bus and various signal lines These control the memory and input output accesses The memory area which can be addressed by the SMP16 bus can con tain up to 1 Mbytes In addition for applications which make extensive use of in puts outputs there are 64 Kbytes for direct inputs outputs and 4 Kbytes for memory input output MMIO Depending on the board used a choice of 8 bit or 16 bit data transfers is available The SMP16 bus supports one and two cycle DMA transfers for high speed data transmission This permits specific data transfers with minimum system load at the time of the transfer Another feature of the SMP16 bus is its flexible support of interrupts Its open structure permits interrupts to be handled as simple point to point connections or cascaded in master slave operation The following types of products are available with SICOMP SMP16 e Boards e Operating system software e Board support packages Additional parts and accessories Boards are delivered with or without firmware depending on the application area Board support packages contain board specific software firmware in the form of EPROM blocks and or installation and driver software o
223. which must be installed at the point the cable enters the building if at all pos sible or the cabinet at the latest Multiple stage measures are listed below Basic protection Medium protection Fine protection A complete lightning protection concept must be individually prepared after careful analysis of the plant SICOMP IMC System Manual J31069 D2001 U001 A0 7618 12 13 Environmental Requirements I Differential interfaces for analog signal cables A differential interface must be selected for the analog connections if the effects of fault voltages created by asymmetric reverse currents are to be eliminated Figure 12 3 Differential interfaces of signal cables Twisting the signal cables also reduces the effects of interference Note If only a single ended interface is possible each analog signal cable must be as signed its own reference line For permissible potential difference see chapter 12 3 3 section g restriction of cable lengths Differential interfaces for digital signal cables With digital signal cables e g RS 485 the differential interface with twisted signal cables should be used instead of other interfaces For permissible potential difference see chapter 12 3 3 section g restriction of cable lengths SICOMP IMC System Manual 12 14 J31069 D2001 U001 A0 7618 Environmental Requirements 12 4
224. with various contact elements and connected with screws inser tion or soldering SICOMP IMC System Manual J31069 D2001 U001 A0 7618 8 33 System Layout Making cable harnesses 8 34 First the hook up wires or cables are measured in accordance with the diagrams and a sample cabinet and installed and positioned on a harness board made for this purpose The bundles of wires are tied off cut and bared There are several ways to tie off bundles Classical method Yarn is knotted around the individual lines to create a well orga nized and closed wiring picture inside the cabinet This method is no longer used today Alternatives to yarn A variety of methods is available e g cable binders and plastic spiral tubing or binder and mounting systems for which special tools can be used to perform bundling and mounting in one step SICOMP IMC System Manual J31069 D2001 U001 A0 7618 System Layout Cable binders cable holding tape Cable binders are tapes made of flexible plastic which are placed around cable bundles and pulled tight with a pair of flat pliers or special tools They are available in various lengths widths and with various locking systems Cable binders are self locking and together with special mounting anchors make securing of cable bundles simple and quick Secure master cable or bundle to mounting plate only with mounting anchor Mounting anchor glued or screwed down
225. worldwide networking of industrial Ethernet via WAN Wide Area Network examples ISDN X 25 ATM and so on 10 2 1 Layout Electrical network The electrical network can be set up with the classical bus structure with triaxial cable as the transmission medium ELM Electrical Link Modules or ITP Industrial Twisted Pair offer supplements and alternatives to conventional bus cabling for the connection of terminals Inex pensive star shaped networks can be set up in accordance with IEEE 802 3 SICOMP IMC System Manual J31069 D2001 U001 A0 7618 10 15 Communication Optical network Optical industrial Ethernet can be set up in a linear ring or start shaped structure The structure is set up with OLMs Optical Link Modules and or ASGE star cou plers Fiber optic conductors are used as the transmission medium Network configura tions of up to 4 5 km are possible Mixed network The electrical and optical networks can be mixed The advantages and configura tion capabilities of both types of networks can be utilized By linking several net works with switches e g MultiLAN switch MR 8 03 even greater distances can be achieved i e up to 42 km A WAN link via the ISDN network is also possible 10 2 2 Industrial Ethernet Network Configurations Electrical Network The electrical network consists of individual bus segments with a maximum seg ment length of 500 m each Up to 100 bus couplers transceivers are co
226. y the power pack or by the operator with a button make contact against 0 V The signal does not have to be debounced TC EOP Z lt gt P TP OC End of process Control signal for DMA operation It applies to the DMA func tionality of the primary bus master or the DMA board secon dary bus master In individual cases compatibility of DMA functionality of the boards used in a system must be checked with respect to the TC EOP bus line SICOMP IMC System Manual J31069 D2001 U001 A0 7618 SMP16 System Address signals Since the SMP16 bus transfers addresses with a length of up to 20 bits AO to A19 1 Mbyte of memory space can be addressed Table 2 7 Address signals of the SMP16 bus Signal Signal Character Function Direction istic AO to A19 Z gt P TS TP Address n These lines are used to select up to 1 Mbyte of SMP16 memory AO to A19 64 Kbytes of the input output area AO to A15 or 4 Kbytes of the MMIO area A0 to A11 A19 is the most significant bit of the address bus and AO the least signifi cant Each slave board is assigned an unambiguous address area before a SMP16 system is commissioned or via automatic configuration During operation each slave board compares its address area with the address lines of the SMP16 bus to determine whether it is being addressed However an access does not become valid until one of the command lines MEMR MEMW IOR

SICOMP IMC System

Contents

Download Pdf Manuals

Related Search

Related Contents