TOUCHBGA GM330 IR+HR
Contents
1. pa W U touchbga com Rework temperature curve to set examples for HR head 1 LEAD Slope S Numerical Temperature Numerical Temperature Numerical Sn63Pb37 value C oc value C time sec value sec E da JS E dr ilQR E o IB H OO d r 1 0 r 2 0 r 3 0 l 2 LEAD FREE Slope S Numerical Temperature Numerical Temperature Numerical AE a o 6 gt Jo A E des AS 20 a TT qu R 230 a Pro E A 1 2 3 4 5 0 3 XBOX PS3 Slope S Numerical Numerical Temperature Numerical ee 170 id a D po E ECN A AB 0 gt Mas A 7s O qu R 240 nas C O Pc ie 265 E TT 3 Slope S Numerical Numerical Temperature Numerical time sec value sec 4 LEAD FREE REFLOW n96 5Ag3Cu0 5 BOTTOM HEATER TEMP 180 C value C p f 1 2 3 4 1 2 3 4 5 1 2 3 4 5 1 2 3 4 5 62. 1 Operation environment of products Operation temperature 15 45C Operation humidity 5 to 95 non condensing Products should be kept in the air mobility of a smaller environment under the welding operation 2 Conservation environment of products Storage temperature 20 70C Storage humidity 5 to 95 non condensing Notice BGA rework station use as usual production in will produce little strange smell for make sure the comfort operation environment of health and safety please keep indoor outside air to circulate touchbga com 2 1 The parameters of GM330 BGA Rework Station Consumption of upper heating Size of Bottom heating area Consumption of Bottom heating General power IR IR 2250W IR HR 3400W Control mode of Upper Independent temperature control high precision closed loop control precision 0 5 Alarm Control mode of Bottom Independent temperature control high precision closed loop control precision 0 5 NO Alarm BGA Suit for welding remove or repair packaged devices such as BGA PBGA CSP multi layer substrates EMI metallic shield product and solder lead free Rework welding Size of applicable chips lt 80x80mm Size of applicable PCB lt 320x300mm touchbga com 2 2 Hardware description GM330 BGA Rework Station is composed of upper part of Heating Components Bottom Preheat Module Bracket Temperature Control Parts Temperature control table is control the upper and
3. Program parameters setup ES Changes the indication on SV MV TIME display Indicates the step number of program STEP Program monitor indicator During program control is lit when the PV is rising During program control is lit when the PV is constant During program control is lit when the PV is falling Pattern number display Indicates the pattern number 0 9 RUN Program control runing indicator EB Selects the program pattern number emo Starts hold the program changes the mode from fixed value a control to program control touchbga com The LED indicator is lit during program control PV Display Indicates the Process Measured value It is lit when the Setting Value SV is being displayed on the lower display SV MV TIME display TIME It indicates the Setting Value SV Manipulating Value MV 10 MV or Time TIME SV The display content can be changed by the DISP SELECT key It is lit when the Alarm1 output is ON EN Communication indicator COM It flashes when the controller is in active communication with a host computer Program Parameters Setting Ramp Ratel ri A ramp consists of a slope linear gradient and a target setpoint The control setpoint increases or decreases at a linear ramp rate from the actual measured value until a specified target setpoint is reached The relative positions of the actual measured value and the target set
4. emonic Parameter Adjustable Range Program Loop Counter 1 200 cont continuous m m End S EP amp Rate 0 01 99 99 units min sec a Target Setpoint 1 4 a Dwell Time 1 End SEEP sje POMP IAR 0 01 99 99 units min sec 6 liz Target Setpoint 2 7 ga Dwell Time 2 0 9999 min T ramp 1 and dwell 1 ju ramp 2 and dwell 2 output power limit 0 0 100 Time 1st Iteration 2nd Iteration time PV di Measu Ed value Time Time touchbga com BOTTOM Programmer Controller General Description fi G c Oo 0 Set SET key The set value thus changed 1s entered Parameters in the parameter setting mode are selected in due order Can select PV SV display mode SV setting mode and parameter setting modes 2 Setting digit shift key Used when the cursor brightly lit is moved to the digit whose number needs to be changed for set value change 3 Set value decrement key Used when the number needs to be decreased for set value change bh 7 O Set value increment key Used when the number needs to be increased for set value change Measured value PV display unit Green Displays measured value PV Displays a parameter symbol in the parameter setting mode Set value SV display unit Orange Displays set value SV Displays set value corresponding to the parameter symbol displayed on the measured value PV display un
5. ety 1 Please carefully read the relevant information provided by the manual before starting using this product 2 Make sure the power cord has been properly connected properly before using the products 3 Installed the equipment in stable work platform to use where the air mobility should be small as possible Avoid it closing to air conditioners fans and the other outlet 4 In case of electrical short circuit avoid the products contacting with water 5 Forbid using this equipment in flammable and explosive substances 6 The operators hands or other parts of the body should maintain a safe distance from the heater Forbid touching the heater to avoid scalding 7 If you have any technical questions or suggestions in the course of using this product please contact with our technology department We will try our best to solve 8 If there are metal object or liquid falling into to rework station while working immediately break the power pulled out power cable after machine cooling thoroughly cleared to fell thing dirty mark again If still stays dirty mark may send out strange smell while re switching on to work 9 While BGA rework station to unusually heat or emit smoke immediately break the power and notify that the technique attendant maintains Still continue to use while above mentioned circumstance happening may result in a fire or arouse electric shock 1 1 3 Environmental requirements of operation and conservation
6. it Control output OUT lamp Green Lights up when the control output is turned ON Auto tuning AT lamp Green Flashes during auto tuning First alarm ALM1 lamp Red Lights up when the first alarm is turned ON When a control loop break alarm LBA 1s selected as the first alarm this lamp lights up Second alarm ALM2 lamp Red Lights up when second alarm is turned ON When either a heater break alarm HBA or control loop break alarm LBA is selected as the second alarm this lamp lights up Hold down the SET button of bottom heater temperature control instrumentation for 5 seconds the display will blinking and using up down buttons temperature of bottom heater Using left arrow you can change one of four number positions The factory temperature is set is 180 C Generally the user needn t to change the data touchbga com 2 4 Rework Operation Steps 1 Be all set 1 1 Fixed motherboard 1 3 Adjust the height of heating head with adjustment knob Prompt BGA chip in the middle of heating head heating head distance from BGA IR chip gt 2cm HR chip 3 5cm touchbga com 2 Start heating 2 1 Select the appropriate temperature program segment for top heater SET PROG on ALTEC PC410 set temperature for bottom heater SET on REX C100 and then press the START switch In the operation can press the STOP switch stop operating 2 2 After the program runs automatic alar
7. lease pay attention to The following pictures and tables PV de Start Value fo Measured valu Time to porn RampRaet 2 L TargetSetpoint1 0230 End 3 a well Time 09999sec 4 oo r RampRate2 31 5 L2 TargetSepoint2 0230 End 6 da DwelTime2 f 0 9 9 see TO Pon RampRate2 2 8 513 TargetSetpoint2 0230 End Rework temperature curve to set examples Lead Sn63Pb37 PTN 1 touchbga com 12 6M330 can be managed by dedidated software using RS232 cable fo jo E m jo srl do Eve touchbga com Rework temperature curve to set examples for IR head 1 LEAD Slope S Numerical Temperature Numerical Temperature Numerical Sn63Pb37 value C oc value C time sec value sec Im E GS E 30o O In 2 BS Troco PEO E E r 3 2 LEAD FREE Slope S d 0 d 0 20 d 0 IO E 5 Ir 0 RR RE pi E ISO ta J25 da pjs Numerical Temperature Numerical Temperature Numerical O O O value C C value C time sec value sec 0 3 XBOX PS3 Slope S Numerical Temperature Numerical Temperature Numerical u EC Ad ea EC eA VET B fo Mas WTI la l20 A w B pas i ao E 5 4 LEAD FREE Slope S Numerical Temperature Numerical Temperature Numerical REFLOW time sec value sec Sn96 5Ag3Cu0 5 BOTTOM HEATER TEMP 180 C rc r N P 1 2 3 4 1 2 3 4 5 1 2 3 4 5 Im Ir RR Re RR E IN W U value C NO IS
8. lower heating can simultaneously heated or first preheat then the upper part of heating 3 e B Vacuum Cool ing Light Stert Stop M330 www touchbga p 10 13 14 2 9 8 7 1112 15 PCB Table Highly Sensitive K temperature sensor Upper Heater IR HR X Y Z Lifting Regulators LED Auxiliary Lighting Bottom Heater Pre Heater Lighting Switch Upper cross fan Switch Vacuum suction pen Switch 10 Vacuum suction pen 11 Start Switch 12 Stop Switch 13 Upper Programmable Temperature Controller 14 Bottom Temperature Controller 15 Power Switch 16 Irregular PCB holders O CON DWM BWN e touchbga com 17 RS232 port for PC comunnication 18 Main power switch touchbga com 2 3 Temperature controlled meter Operation instructions TOP Programmer Controller General Description The programmable controller contains an in built setpoint generator in addition to the controller function This setpoint generator can produce a temperature time profile with 10 16 segments 0 9 10 Sets of Curves When the program is running the current setpoint from the setpoint generator is fed to the control algorithm The current setpoint is continuously shown on the lower display The sixteen segments are defined in the order Ramp 1 Dwell period 1 Ramp 2 Dwell period 2 and are executed in succession SN Item Functions Parameters setting key a Up key Increase value Es Down key Decrease value E
9. m 8sec and automatically cut off the heating power this time you can check the following solder ball is completely liquefied BGA chips should be subject to settlement floating state pepy grms ep AA ata voo o RR Taa 3 Rework completed 3 1 Moving Heating head and Sensor open the Upper fan Switch 3 2 Remove motherboard Clear insulating tape 3 3 BGA Rework Station Cooled Then close Total Power Warning 1 1f BGA Rework Station NO Cooling Do not close the Total Power 2 When the temperature is not cooled do not touch heating module touchbga com Prompt 1 Keep the equipment at a steady working environment where the air mobility should be as small as possible Avoid it closing to air conditioners fans and the other outlet 2 IR 6000 Rework Station sensor is directly contacted with motherboards So the display temperature is Actual temperature 3 In order to avoid damages to the motherboard capacitor please use insulation tape After Maintenance is completed Remove the insulation tape to prevent from short circuit 4 After removal of BGA chip PCB bonding pad needs to be cleaned up Avoid cold solder joint See BGA chip tin completely liquefied then move the BGA chip to avoid Bonding Pad Damage 5 During the reflow of the new ball in a typical tin lead Sn63 Pb37 com position there are self alignment properties that are quite forgiving According to IPC Spec landing on 75 of the pad is acce
10. point determine whether the slope of the ramp is positive or negative Parameters R1 R2 R3 express the ramping rate in unites per minute 0 01 99 99 parameters L1 L2 L3 the appropriate target setpoint in display units If R1 END the program will be ended when the program runs to the slope Target Setpoint 1 Li The target value to which the setpoint ramps when the programmer has been placed into RVN ot Dwell period 1 In a Dwell period the target setpoint which has been attained remains unchanged for a fixed period All the dwell periods are defined by their duration in minutes with parameters D1 D2 D3 0 9999 When the program is running these parameter display the time remaining in the active dwell period If the parameter equals zero the dwell period is skipped When the controller runs in the PV displaying status 1 Select the target program pattern number with the PTN key 2 press SET PROG key the first program parameter appears in the upper display The value associated with this parameter will be shown in the lower display 3 Use A and W key to modify the value 4 Press the PAR SET key the next parameter appears At the same time the modification has been saved in the memory Use A and Y key to modify the value Repeat this procedure till all the parameters are set Or if there is no key operation within 16 seconds the menu times out automatically touchbga com Program Parameter List SN Mn
11. ptable for BGA rework 6 To improve success rate of Rework PCB and chips need drying and processing in principle PCB board or chip moist heat process will occur in the burst phenomenon the Rework process may hear the blasting sound of a minor According to actual situation Please self control 7 PCB board heating time is too long or repeated several times the surface heating will lead to discoloration 8 Users from modifying temperature parameters Please use scrap PCB tested heating whole time about 10 seconds before the end of solder balls should be fully liquefied f the liquefaction advanced or delayed should be regulating up down the temperature setting To prevent heat damage to your chips or low temperature sealing off 9 Common setting of temperature Bottom heating Upper Heating Rework type temperature temperature Normal Solder 160 C 185 C Sn63 Pb37 Lead free 200 C 230 C Sn96 5 Ag3 Cu0 5 Reball NO 185 C Sn63 Pb37 Reflow temp Sn63Pb37 185 190C Reflow time 10sec Reflow temp Sn96 5Ag3Cu0 5 220 225C Reflow time 15sec touchbga com 10 The meaning of Hb Hb means the max heating temperature of the upper heating We set the max temperature at 230 C according to the max temperatrue of lead free Reweork and other technical reasons The data needn t to be changed 11 The meaning of r1 L1 d1 r2 L2 d2 r3 L3 d3 P
12. touchbga com TOUCHBGA BGA Rework Station GM330 IR HR User Manual touchbga com Table of contents 1 GM330 BGA rework station features 1 1 Safety Instrouctions 1 1 1 Electric Safety 1 1 1 Operation Safety 1 1 3 Environmental requirements of operation and conservation 2 The operation and conservation condition of products 2 1 The parameters of GM330 BGA Rework Station 2 2 Hardware description and Self help install 2 3 Temperature controlled meter Operation instructions 2 4 BGA Rework operation steps 2 5 Prompt touchbga com 1 GM330 BGA rework stations features GM330 BGA Rework Station is designed to meet the ever changing demands of today s fast BGA Rework manufacturing environments This model have following characteristics 1 Rework station for laptop motherboards desktop computer motherboards server boards industrial computer boards all kinds of game boards communications equipment motherboards LCD TVs and other large circuit board BGA rework 2 Innovative designs An effective solution to general of infrared rework station vulnerable to the impact of air flow Will lead an inaccurate of temperature control Maximum temperature up to 400C Can easily deal with lead free soldering rework 3 Can set up 8 rising temperature segments and 8 constant temperature segments to control It can save 10 groups of temperature curves at one time 4 Can be connected to a computer to be controlled more conveniently with a b
13. uilt in PC RS232 port and proprietary software attached to it Programmable 5 Can easily rework the variety of CPU s seat all kinds of shielding enclosures replacement of various components slot Can easily deal with lead free soldering rework 6 Sensitive temperature measurement sensor to obtain an accurate and instantaneous temperature reading and monitoring 7 BGA rework station the technology of closed loop temperature control ensures accurate temperature process and even heat distribution 8 Machine overall system integration design Rework station more integrated workbench area occupied by smaller Didn t mixed and disorderly of cables 9 Linear guide type Bracket for BGA Reworks can be locking adjusted by rotating the handle Can be very easily fixed PCB board effectively prevent the deformation of PCB board 10 Detachable K type thermocouple 11 Taiwan FOTEK SSR s inside Popular programmers inside 1 1 Safety Instrouctions 1 1 1 Electric Safety 1 Make sure the supply power voltage accord with the standards 220V 250V 50hz alternating current before installing 2 To avoid possible electric shock caused serious damage please disconnect the power cord from the outlet temporary before moving machines 3 If the machine damages please contact us for maintenance If the damage caused by the users when they dismantle or repair independently they should take on the loss by themselves touchbga com 1 1 2 0peration Saf
Download Pdf Manuals
Related Search