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1. Profile Groups Customer Group drs25 Board Group EN Continue File Save drs25 Site Clean Continue File Search 9 Tutor Results C O Site Cleaning O Tutor Masters DRS Profile Name File LEAD FREE 27mm PBGA 093 4 layer board CAProgram FilesVAir ai A LEAD FREE 27mm PBGA on 093 thick board CAProgram Files Airva eae 10 mm LEAD FREE bc 102605 C Program Files Air Veu PCDB 2 mm Lead Free bc 102505 C Program Files Air Var PCDB 6 mm LEAD FREE bc 102605 C Program Files AirVar 1 Tutor Results B ILEAD FREE 27mm on 093 thick board Site Clean D 01 LEAD FREE SITE CLEAN Master WITH IR Senor 060107 DO NOT EDIT DRS25 User Manual 0025 00 901 6 23 Section 6 Profile Tutor Software 6 5 Program Execution DRS Machine Interface Save Save As 2 DRS Co bh 6 7 ea Exit Three new profiles should now be available Desoldering Site Cleaning and Soldering is automatically appended to the file name you created DRS Machine Interface DRS Profile Name File 01 40 mm PBGA LEAD FREE 063 bd bc 102505 Desoldering C Program Files Air Vac Engineerinc 01 40 mm PBGA LEAD FREE 063 bd bc 102505 Site Cleaning C Program Files Air Vac Engineerinc 01 40 mm PBGA LEAD FREE 063 bd bc 102505 Soldering C Program Files Air Vac Engineerinc 01 44 mm SBGA LEAD FREE 092 b2. Cool Event off Event DRS25 User Manual 0025 00 901 6 8 The following is a brief description of each stage Event Section 6 Profile Tutor Software 1 PREHEAT Preheats the entire board to minimize the thermal differential between the reflow site and the rest of the board Preheat minimizes board warpage and reduces the amount of component heating required to achieve reflow 2 PRESOAK Presoak is the period between preheat and soak 3 SOAK Flux is activated during the soak stage Typically significant voiding will occur without proper soak 4 RAMP Quickly takes the solder joints from the end of soak to the beginning of reflow 5 REFLOW 1 Time over liquidus until the heaters are shut off 6 REFLOW 2 Time until the joints fall back below liquidus NOTE Total time over reflow equals the total of Reflow 1 and 2 stages 7 COOL Cools the component and board down to a temperature that allows the reworked assembly to be safely handled The following are typical time temperature targets for each stage Event PREHEAT Topside Board Temp C PRESOAK Temp C Time seconds SOAK joint Temp C Time seconds RAMP joint Temp C Time seconds REFLOW 1 joint Temp C Time seconds REFLOW 2 joint Temp C Time seconds COOL joint Temp C Time seconds e Typical solder liquidus temp C Typical max joint temp C e
3. 901 6 19 Insure that you are looking in the Tutor folder 2 Double click on the thermal profile that you just created to open it DRS Machine Interface 2 DRS25 User Manual 0025 00 901 Thermal Profile Analysis Report Printing O Tutor Cr Documents 2 My Documents ra My Network 123213 2007 005 001 009 035 014 Csv B bctest 2007 005 024 014 001 017 Csv 5 bctestfri 2007 005 018 014 003 022 Csv LEAD FREE 27mm PEGA on 093 thick board 2007 005 024 016 016 007 Csy B test 2000 2007 004 030 012 017 023 Csv B TEST 2000 2007 005 001 008 015 038 Csv B test 2001 2007 005 001 009 013 003 Csv test 3000 2007 005 002 013 040 057 Csy Cancel File name LEAD FREE 27mm PEGA on 093 thick board YW Files of type CSV files v Section 6 Profile Tutor Software 6 20 ee Section 6 Profile Tutor Software Change Time Above box A to 217 Lead Free Preheat Verify that max top side board temperature B did not exceed 190C ok 166C Soak Position first yellow bar C1 where T C 3 is 170C second yellow bar C2 where T C 3 is at 200C Soak stage C3 should be 45 60 seconds ok 46 seconds Reflow Joints D should have time above 217C of 45 75 seconds ok 57 and 58 seconds Confirm max joint temperature E was approximately 235C ok 237C both joints Maximum
4. NOT EDIT C Program Files Air Vac Engineering DRS 2513ProfilesX85290004 DRS s Profile Tutor Graph Process Status Save Tutor Results Short Name 8580002 DRS Long LEAD FREE 27mm PBGA on 093 thick board Confirmation of save NOTE If you exit Tutor without saving the graph the process information will be lost 01 LEAD FREE Master WITH IR SENSOR 060107 DO NOT EDIT C Program Files Air Vac Engineering DRS 25 P rofiles 85290004 DRS s Profile Tutor Graph Process Status Options Save Tutor Results Short Name 8580002 0 5 Long Name LEAD FREE 27mm PBGA on 093 thick board Results Information Saved 8 Click Thumbs Up icon to exit Profile Tutor DRS25 User Manual 0025 00 901 6 17 Section 6 Profile Tutor Software 6 3 Thermal Profile Analysis Teach ne Events Run Process Thermal Profile Analysis Printing Load Process Link File Profile Tutor Tutor Profile Build A Sf KA e N S LEAD FREE REWORK REPAIR amp DRS25 User Manual 0025 00 901 6 18 Section 6 Profile Tutor Software After a new thermal profile is created the Thermal Profile Analysis tool is used to analyze the profile 1 Click on the green icon DRS Machine Interface Thermal Profile Analysis Report Printing eunjeueduue 49 98 148 197 247 296 346 385 445 494 544 692 742 791 Time sec Summary Analysis DRS25 User Manual 0025 00
5. 901 6 4 Section 6 Profile Tutor Software with two 003 gauge thermocouple s slid underneath BGA One TC attached to top of device with copper tape then covered with Kapton tape TC 1 IR Sensor Board TC 2 Top of Device TC 3 Joint 1 TC 4 Joint 2 4 X DRS25 User Manual 0025 00 901 6 5 Section 6 Profile Tutor Software 6 2 Profile Tutor Profile Tutor is the process whereby a Thermal Profile for a new application is created DES Machine Interface Control History Setup Teach Process Events Run Process Thermal Profile Analysis Printing Load Process Link File Profile Tutor Tutor Profile Build LEAD FREE REWORK REPAIR The user selects one of the Thermal Profile Master Templates that most closely matches the new application 1 Select double click the master DRS Machine Interface Process Status DRS Profile Name 00 TIN LEAD Master WITH IR SENSOR 080107 DO NOT EDIT 04 SMALL DEVICE TIN LEAD Master WITH IR SENSOR 060107 DO NOT EDIT 04 SMALL DEVICE LEAD FREE Master WITH IR SENSOR 060107 DO NOT EDIT gt LEAD FREE Master WITH IR SENSOR 060107 DO NOT EDIT RR DRS25 User Manual 0025 00 901 6 6 Section 6 Profile Tutor Software Profile Tutor screen shown blank 01 LEAD FREE Master WITH IR SENSOR 06010 7 DO NOT EDIT C Program Files Air Vac Engineering DRS 25 Profiles 85290004 DRS Profile Tutor Gra
6. D RS25 A R VAC PROCESS DEVELOPMENT GUIDE WWW air vac eng com Section 6 Profile Tutor Software Table Of Contents 6 Process Development OU a nn de ie 3 6 0 e y EAEE E E E RE 4 6 1 PHYSICA SCD nn aa aa a aaa 4 6 2 aui M irri ERP a EEE E ENE E E 6 6 3 Thermal UD Analysis siennes cintre AAE REE 18 6 4 AUTO epigr Bec E 22 6 5 PROSE AML EF XCCUGION m 24 DRS25 User Manual 0025 00 901 6 1 Section 6 Profile Tutor Software DRS25 User Manual 0025 00 901 6 2 Section 6 Profile Tutor Software 6 Process Development Guide Run Process Thermal Profile Analysis Printing Load Process Link File Profile Tutor Tutor Profile Build py m LAA em DRS25 User Manual 0025 00 901 6 3 Section 6 Profile Tutor Software 6 0 Overview The DRS25 Process Development Guide is designed to allow novice users to create and run new processes There are five 5 steps to creating and running a new process Physical Setup Profile Tutor Thermal Profile Analysis Auto Profile Build Program Execution E i i Each of the five steps is documented in detail in this Process Development Guide Please contact Air Vac with any questions 203 888 9900 request DRS25 Process Assistance 6 1 Physical Setup TC 1 Board If you purchased the IR Sensor Option
7. Soak Event will continue until T C 3 and 4 average reaches 200 C Lead Free profile Time in Soak Stage is automatically recorded Event Trigger Thermocouples Events Preheat Event Presoak Event 3 gt 5727 4 Ramp Event Reflow 1 Event Reflow 2 Event s Cool Event Event Event will continue until T C 3 and 4 average reaches 216 C Lead Free profile Time Ramp stage is automatically recorded Event Trigger Thermocouples Events Preheat Event Presoak Event vies soak Event ax 9 Reflow 1 Event 9 Reflow 2 Event Cool Event off Event DRS25 User Manual 0025 00 901 6 13 Section 6 Profile Tutor Software The Reflow 1 Event will continue until T C 3 and 4 average reaches 235 C Lead Free profile Time in Reflow 1 stage is automatically recorded Event Trigger Thermocouples Events Preheat Event Tit Average O T C 1 quie Soak Event T C 4 Ramp Event o Tic 2 Presoak Event EJ 0 B Reflow 2 Event J CI TIC 7 Cool Event L Tc 8 off Event The Reflow 2 Event will continue until T C 3 and 4 drop down below 217 C Lead Free profile NOTE Total time over reflow is the sum of Reflow 1 Reflow 2 Time in Reflow 2 stage is automatically recorded Event Trigger Thermocouples Events TC Average ote Preheat Event EH o OTC P
8. Typical max package temp C DRS25 User Manual 0025 00 901 Tin Lead 90 100 101 139 15 30 140 170 45 60 171 182 15 30 183 205 30 45 205 183 15 30 100 60 180 183 210 250 Lead Free 140 150 141 169 15 30 170 200 45 60 201 216 15 30 217 235 30 45 235 217 15 30 150 60 180 217 235 260 6 9 Parameter Adjustments Prior to starting the cycle the user should assess the following Section 6 Profile Tutor Software 1 Should any of the T C based trigger temperature for any event in the master profile be adjusted If you know specific information about the new application adjust temperature targets if not leave as is 2 Does the nozzle flow rate need to be adjusted for the new application The default nozzle heater flow rate in the template is 55 50 of 2 75 scfm 1 5 scfm Change the nozzle flow rate based on the nozzle you are using as shown below Nozzle Size mm Less than 10mm 10 15mm 16 26mm 2 30mm 31 34mm 35 40mm 40 mm NMX Nozzles Nozzle Heater Flow 96 30 40 50 55 65 75 85 60 Be sure to change the flow all events except Preheat click each event radio button to access the event flow rate DRS25 User Manual 0025 00 901 Section 6 Profile Tutor Software 6 Click on the Cycle Start icon A to start the Thermal Profiling process e f any of the T C s are above 60C the board cooling system and nozzle cool down wil
9. d bc 102605 Desoldering C Program Files Air Vac Engineerinc 01 44 mm SBGA LEAD FREE 092 bd bc 102605 Site Cleaning C Program Files Air Vac Engineerinc Z mm 093 01 44 mm SBGA LEAD FREE 092 bd bc 102605 Soldering C Program Files Air Vac Engineerinc 01018 Program FIIeS AIr V ac Engineerincg rte men si _ sip PR gt Tata Pee PR Du mn E A mm 095 board Site Cleaning Program riles Alr V ac Enqgineerinc 4 1 LEAU FREE PBGA 2 mm di 09 3 board f Solc enng M am Files Air Vac Engineering z Practical Demo Board 6 mm LEAD FREE bc 102605 Desoldering C Program Files Air Vac Engineerinc 2 Practical Demo Board 6 mm LEAD FREE bc 102605 FLUX DIP AND Soldering C Program Files Air Vac Engineerinc z Practical Demo Board 6 mm LEAD FREE bc 102605 Site Cleaning C Program Files Air Vac Engineerinc 2 Practical Demo Board 10 mm LEAD FREE bc 102605 Desoldering C Program Files Air Vac Engineerinc gt v 1 Double click on the Desoldering profile to open it DRS25 User Manual 0025 00 901 6 24 Section 6 Profile Tutor Software The process notes page is then displayed for the operator 2 Click Thumbs Up to continue to the Run screen after reviewing the setup notes LEAD FREE PBGA 27mm on 093 board Des
10. good thermal profile has been created and saved for the new application the Automatic Profile Build function is used to integrate the new thermal profile into a complete rework process that enables the user to remove site clean and replace the new application DRS Mac nterfac Teach roses ES Run Process Thermal Profile Analysis Printing Load Process Link File gt Profile Tutor Tutor Profile Build AA 1 7 _ LA N S LEAD FREE REWORK REPAIR 6 DRS25 User Manual 0025 00 901 6 22 Section 6 Profile Tutor Software 1 Select double click the thermal profile that you created A saved and analyzed The thermal profile will be shown in the Tutor Results box B Click on the site cleaning radio button C Select the appropriate site clean profile It will be displayed in the site clean box D Select create the profile groups E where you want the profile to be saved to Name the new profile F Select Thumbs Up icon G to save Click OK H to continue file save DUUM DRS Machine Interface Name and Link Control Tutor Build Profile Use IR Sensor v Replacement Removal Site Clean Profile Name FF LEAD FREE PBGA 27mm on 093 board Soldering LEAD FREE PBGA 27mm on 093 board Soldering 8580003 DRS Desoldering LEAD FREE PBGA 2 mm on 093 board Desoldering 8580004 DRS Site Cleaning LEAD FREE PBGA 27mm on 093 board Site Cleaning 8580005 DRS
11. l come on automatically and remain on until all T C s are below 60C he graph will begin to plot temperatures for the top heater bottom heater and all thermocouples temperature is also digitally displayed B e During all events except Preheat Nozzle Temperature recommended or flow can be adjusted on the fly if required to help achieve the event trigger target or the desired event time f an on the fly adjustment is made an additional event will be automatically creqted and displayed Process Status Options Preheat Event Presoak Event 9 Soak Event Ramp Event Reflow 1 Event Reflow 2 Event Cool Event e 9 off Event DRS25 User Manual 0025 00 901 6 11 Section 6 Profile Tutor Software The Preheat Event will continue until T C 1 IR probe reaches 140 C Lead Free profile Event Trigger Thermacguples Events gt Preheat Event Presoak Event Soak Event Ramp Event Reflow 1 Event PN Reflow 2 Event Cool Event off Event The Presoak Event will continue until T C 3 and 4 average reaches 169 C Lead Free profile Time in Presoak stage is automatically recorded Event Trigger Thermocouples Events 2 Preheat Event E gt es Soak Event TiC 4 Ramp Event Reflow 1 Event O Reflow 2 Event O Cool Event 6 off Event DRS25 User Manual 0025 00 901 6 12 Section 6 Profile Tutor Software The
12. oldering C Program Files Air Vac Engineering DRS 253Profiles8580004 DRS Application Notes Description COMPONENT REMOVAL Component Location Flux Type Nozzle Notes PLEASE NOTE NOZZLE MUST BE LOADED BEFORE RUNNING PROCESS THE FIRST TIME INSTALL BOARD IN CARRIER USING BOTTOM SUPPORTS PLUG THERMOCOUPLE OR NON CONTACT SENSOR INTO CHANNEL 1 Default Reflow DRS25 User Manual 0025 00 901 6 25 Section 6 Profile Tutor Software The profile name A will be displayed at the top of the page 3 Select Cycle Start B to start the profile Follow all prompts 4 After the component is removed select Load Process Link File C for site cleaning Execute and reiterate for soldering A LEAD FREE PBGA 27mm on 093 board Desoldering C Program Files Air Vac Engineering DRS 25 P rofiles 8580004 DRS Process Status Thermocouple System Force System Nozzle EA 80 5 Let 82 Site Clean System Tool Height MESA 89 tie 11 TIC 4 89 TIC 8 2 Board Level D 70 D al D 9 Time sec zd Run Board DRS25 User Manual 0025 00 901 6 26 Section 6 Profile Tutor Software DRS25 User Manual 0025 00 901 6 27
13. package temperature F should not exceed 260 ok 248C Reposition the first yellow bar at the end of the preheat stage G1 Reposition the second yellow slide bar at the end of the Reflow 1 heating stage as shown G2 Slowly move G1 toward G2 and verify that the maximum heating slope for T C s 3 amp 4 is 3C per second ok 0 7 degrees per second Position the first blue bar H1 at the end of Reflow 1 heating stage as shown Position the second blue bar H2 near the end of the graph and verify that the maximum cooling slope is less than 5C per second ok 1 58 degrees per second 10 The thermal profile can be printed I for permanent record keeping If the thermal profile meets your requirements proceed to Tutor Profile Build If not repeat Profile Tutor Make changes as necessary to achieve targets Thermal Profile Analysis Report Printing 73 184 218 243 287 Time sec Summary Analysis Minimum C Maximum C Slopel Slopel C sec Time Above sec Seconds Nozzle 069 286 0 30 2 23 106 Left Preheater 2 099 2 0 02 0 24 260 Right Preheater 3 oe 0 02 0 24 260 Center Prelieater i 099 22 0 02 0 24 TC 21 j 6 0 02 0 60 000 2 0 64 1 77 83 0 60 1 58 TC 4 i 0 62 1 58 85 0 00 0 00 86 0 00 0 00 TC 7 0 00 0 00 TC 8 0 0 0 00 0 00 DRS25 User Manual 0025 00 901 6 21 Section 6 Profile Tutor Software 6 4 Auto Profile Build Now that a
14. ph Process Status Options Temperature vs Time 2 sak REL 463 596 5229 504 ESTIN 92 305 450 4909 5237 556 59 Time sec Nozzle Temp Nozzle Flow Cooling Air Event Trigger Thermocouples Events po Fm Preheat Event O Nozzle ByPass Air 0 Presoak Event 2 Soak Event Ramp Event Reflow 1 Event C Beard Cooling 0 Reflow 2 Event Cool Event PED Preheater Temp Signal i DRS25 User Manual 0025 00 901 6 7 Section 6 Profile Tutor Software The master profile name will be displayed at the top of the page 01 LEAD FREE Master WITH IR SENSOR 060107 DO HOT EDIT C Program FilesAir Yac Engineerine DRS 25 P rofiles 65 790004 DRS Profile Tutor Graph Events All master profiles typically have seven 7 stages Events Preheat Presoak Soak Ramp Reflow 1 Reflow 2 Cool Presoak Event j Soak Event Ramp Event Reflow 1 Event Reflow 2 Event Cool Event off Event Process Status Under OPTIONS click to depower Z Axis box turns red Position nozzle over component Lightly touch component with nozzle o ring then retract approximately 100 5 Click to repower Z Axis box turns green Events Preheat Event Presoak Event Soak Event Ramp Event e Reflow 1 Event e 9 Reflow 2 Event k
15. plug it into TC Channel 1 If you do not have the IR Sensor use Kapton tape to attach a TC to the board Position the IR Sensor TC on an open area of the board 2 3 inches away from the rework site TC 2 Top of Package Attach a fine gauge TC to the top of the device with copper tape Cover the copper tape with Kapton tape Kapton tape alone can be used but will not provide the same thermal accuracy Air Vac uses 003 gauge K type TC s 1 888 TC OMEGA Part 5 SRTC TT K 40 36 Plug this TC into Channel 2 TC 3 amp 4 Joints Slide two 2 TC s underneath the BGA If possible slide 1 as far into the center of the as possible and position the second TC near the edge of the device Apply Kapton tape to hold the TC s in place If desired x ray will show the exact positioning of the TC head however this is not critical otudies have shown that TC s underneath the BGA that are not in direct contact with a solder joint are typically within 5 to O degrees of the joint temperature This approach will work in 90 of the cases If the standoff height or ball density does not allow a TC to be slid underneath it a scrap board should be drilled from the bottom TC s installed into the joints and then epoxied in place If this is not possible reflow of the device can be visually observed through the microscope The major advantage of this approach is that it is non destructive yet still highly accurate DRS25 User Manual 0025 00
16. resoak Event 17 TIC 3 Soak Event T C 4 Ramp Event Time Ove 5 Reflow 1 Event gt A UC s Cool Event LI Tic off Event DRS25 User Manual 0025 00 901 6 14 Section 6 Profile Tutor Software Cool Down Event 45 seconds Event Trigger Thermocouples Events TIC Average Preheat Event EN o Presoak Event Ramp Event Retlov 1 Event Reflow 2 Event DRS25 User Manual 0025 00 901 6 15 Section 6 Profile Tutor Software Completed new Thermal Profle LEAD FREE Master WITH SENSOR 6 60107 DO NOT EDIT C Program FilesMAir Vac EngineeringXDRS 2513ProfilesX85290004 DRS s Profile Tutor Graph Process Status Temperature vs Time a 9 95 114 133 152 171 190 209 28 27 266 3285 304 323 34 Time sec Cool Nozzle Temp Nozzle Flow Cooling Air Event Trigger Thermocouples Events EJ i Tie re i Presoak Event Nozzle ByPass Air EN o Soak Event J Soak Event Preheater Temp Ramp Event Time F Reflow 1 Event E Board Cooling 19 Reflow 1 Event Li aucune DRS25 User Manual 0025 00 901 6 16 Section 6 Profile Tutor Software Automatic prompt to name and save new thermal profile 7 Click on red green icon to save 01 LEAD FREE Master WITH SENSOR 06010 7 DO
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