RC-S966 Series Data Sheet
Contents
1. Command Parameter Value Polling Request Code 00h No request 01h System Code request 02h Communication performance request PMm 00F1000000014300h Request data when Request code RC S9660 Service 0083h 212kbps communication is possible 424kbps communication is possible Communication rate automatic detection compliant Read Without Encryption The maximum number of Blocks that can be read simultaneously 4 Blocks Write Without Encryption The maximum number of Blocks that can be written simultaneously 1 Block 2 Blocks in case of Write with MAC Page 16 RC S966 Series Data Sheet FeliCa 5 Security RC S966 has the following security functions e Mutual authentication Internal Authentication External Authentication e MAC generation addition and verification functions e Tamper resistance function Page 17 RC S966 Series Data Sheet F e i C da 6 Die geometry This chapter describes mechanical dimensions of RC S966 Details of pads of the RC S966 1C bumps of the RC S966 1A and RC S966 1S and specifications common to RC S966 1A RC S966 1C and RC S966 1S are described in section 6 1 Pads 6 2 Bumps and 6 3 Passivation layer and following sections respectively 6 1 Pads This section describes pads of the RC S966 1C 6 1 1 Number of pads Antenna pads 2 6 1 2 Pad material All pads are made of aluminum 6 1 3 Pad positions Figure 6 1 shows a schem2. H m jaju Figure 7 6 Identification label example Page 28 RC S966 Series Data Sheet FeliCa 7 1 3 Outer carton package Outer carton package specification is as follows See Figure 7 7 1 Each outer carton package contains one inner carton Inner carton is protected with foam polystyrene cushion boards 2 Outgoing inspection report that stipulates the shipping lot number see Figure 7 8 is attached on top surface of the outer carton package 3 EIAJ C 3 label See Figure 7 5 is attached to the side of the outer carton package Inner carton Cushioning materials Outgoing inspection report EIAJ C 3 label Label 1 managed by Sony Label 2 managed by Sony Figure 7 7 Outer carton package Page 29 RC S966 Series Data Sheet FeliCa Company name Bats Control No 00000000 838 No 00000000 Outgoing Inspection Report HARRA This is to certify that the following product has satisfied the delivery inspection standard as shown below Product name R RC S966 1A WW Quantity Hike XXXXXpcs Shipping lot number Hf Lot No XXXXXXXX Inspection detail GEPA Inspection item BED Inspection sampling size Pass criteria RAD GE Appearance SHER ANSI ASQC 21 4 Acceptable Quality Inspection level Il Level Normal inspection AQL ANSI ASQC 21 4 3 f 0 65 de RERE NHD Electrical characteristics Total sample Pass all test items ARRE HIRE CHARH Ze 7322
3. Test results StERfE 1 Appearance GH 2 Electrical characteristics ESI JEPPERSH Judgment Approved Checked Sony Storage Media and Devices Corp Figure 7 8 Outgoing inspection report example Page 30 RC S966 Series Data Sheet FeliCa 7 1 4 Identification of defective dies Defective dies are indicated by an ink mark specified below to identify them e Size Diameter 350 um 100 um e Color Black e Height 30 um or less Identification of defective dies on each wafer is also possible by using electronic data map data conforming to SEMI G85 specifications For more information about the map data contact Sony sales representative 7 1 5 Maximum quantity of dies on a wafer Maximum quantity of dies on a wafer differs by presence or absence of bump on pad Maximum quantity of dies on a wafer of RC S966 1A bump on pad is 23 908 dies and Maximum quantity of dies on a wafer RC 8966 1C pad is 23 912 dies The number of the good dies differs in each wafer 7 1 6 Yield of wafer For wafers a yield rate of more than 50 will be maintained Page 31 RC S966 Series Data Sheet FeliCa 7 2 Packing specifications for unsawn wafers This section describes packing specifications applied to RC S966 1S 7 2 4 Wafer External appearance of a wafer is shown in Figure 7 9 Wafer mark abcde fg abcde Control no 00001 ZZZZZ fg Wafer no 01725 Notch Unit mm NOTE Please use this
4. Outgoing inspection report example Page 37 RC S966 Series Data Sheet Felica 7 2 4 Identification of defective dies Identification of defective dies on each wafer is possible by using electronic data map data conforming to SEMI G85 specifications For more information about the map data contact Sony sales representative 7 2 5 Maximum quantity of dies on a wafer Maximum quantity of dies on a wafer differs by presence or absence of bump on pad Maximum quantity of dies on a wafer of RC S966 18 is 23 908 dies The number of the good dies differs in each wafer 7 2 6 Yield of wafer For wafers a yield rate of more than 50 will be maintained Page 38 RC S966 Series Data Sheet FeliCa 8 Precautions Unlike packaged devices RC S966 is small and easily susceptible to damage They must be handled with special care with the following precautions kept in mind 8 1 Storage precautions After unpacking the carton make sure to protect the dies from any electrical physical and mechanical effects caused by extreme temperature excessive moisture and or contaminated air It is recommended that you use desiccators for the storage of unpacked dies 8 1 1 Shelf life of die The storage period of the chip is as follows counting from the initial date of reckoning storage life printed on the wafer container label EIAJ C 3 label and Identification label 1 Before opening the package 6 months at ambient temperature of 15 C
5. Production lot no 6 digits Identifier 1 digit Wafer no 2 digits Figure 7 2 Frame ID label example NOTE The barcode is inscribed by using CODE39 without check digits Readability of the barcode depends upon performance of the barcode reader distance between the reader and the barcode and scan angle RC S966 1A and RC S966 1C use Frame ID to take one to one mapping between a wafer and a map data The value on the Frame ID label abcdefMgh matches the name of the map data and the value of Frame ID in the map data Page 25 RC S966 Series Data Sheet F e i C a T 1 2 Inner carton The inner carton specification is as follows See Figure 7 3 1 2 3 4 5 Wafer rings each holding a 200 mm 8 wafer are inserted into groove of the container All wafers face the same direction and the notched edge of the frame comes to the upper position Each container holds up to 25 wafers which fabricated in the same production lot Wafer container label See Figure 7 4 is attached to the side of the wafer container The container is bagged in a moisture resistant bag The bag is then deaerated and sealed Identification label See Figure 7 6 is attached to the sealed bag EIAJ C 3 label See Figure 7 5 is attached to the side of the sealed bag Wafer 25 wafers max Wafer container Wafer container label Identification label Sealed with heat treatment Moisture resistant bag Label 1 managed by So
6. at Tj 85 C RC S966 1A and 1C Sawn wafer on wafer ring 8 RC S966 1S Unsawn wafer 8 25 C to 100 C 55 C to 125 C 500pA max Page 9 RC S966 Series Data Sheet F e i C da A conductive protrusion made on bonding pad for interconnecting die and circuitry by Controlled CollapseChip Connection Complies with ISO IEC 18092 212 424 kbps Passive Communication Mode i Quality and reliability are assured in the temperature range of 25 C 85 C 2 2 Electrical characteristics 2 2 1 Absolute maximum ratings Item Symbol Rated value Unit Remarks Min Typ Max Operating temperature Tj 40 125 C junction Storage temperature Tstg 55 125 C Input voltage Vain 15 Vop Between antenna terminals AC Input current lain 191 mA peak Antenna terminal instantaneous current value lain avg 74 2 mA Antenna terminal average of peak current value 1 Under the condition that carrier signal of 13 56MHz sine wave is inputted 2 2 2 Recommended operating conditions Item Symbol Rated value Unit Remarks Min Typ Max Operating temperature Tj 25 100 C Quality and reliability are junction assured when the operating temperature is within the range of 25 C to 85 C Input current lain avg 0 5 66 mA Antenna terminal average of peak current value Input frequency fc 13 56 MHz 1 Under the condition that carrier signal of
7. 13 56MHz sine wave is inputted Page 10 RC S966 Series Data Sheet 2 2 3 Chip operating characteristics FeliCad These are characteristics of recommended operating conditions when not mentioning them specially Item Symbol Rated value Unit Remarks Min Typ Max Current consumption loc 500 HA Tj 25 C to 85 C Reset start voltage Varsta 2 84 3 19 3 54 Vop Between antenna terminals AC QT 25 C Reset release VARSTN 3 19 3 54 3 89 Vop Between antenna voltage terminals AC Tj 25 C Input capacitance Cin 14 79 17 00 19 21 pF Capacitance value between antenna terminals designed value B Voltage amplitude that resets the chip when the voltage amplitude between antenna terminals is decreased from the chip operating state 2 4 Itis guaranteed that Reset release voltage is always higher than Reset start voltage Voltage amplitude which releases the chip reset when the voltage amplitude between antenna terminals is increased from the chip reset state 2 2 4 NVM cell characteristics Item Symbol Rated value Unit Remarks Data retention period tret 10 Year Tj 25 C 5 Year Tj 85 C Number of rewrite Nena 5 x 10 Cycle Tj 25 C 1x 10 Cycle Tj 85 C 2 2 5 ESD tolerance Item Symbol Rated value Unit Remarks Min Typ Max Electrostatic stress VESDHBM 2000 xx V See JEDEC JESD22 100pF 1 5kQ Page 11 RC S966 Series Data Sheet F
8. name DATE yyyy mm dd Initial date of reckoning storage life LOT 123456 Production lot no DIFFUSED IN JAPAN Figure 7 11 Wafer container label example Product name Quantity of die Production lot no P N RC S966 1S lt LOT gt 123456 lt QTY gt 500000 3N 1RCS9661S 500000 bil remm p mm T 3N 2 123456 xxxxxx Value managed by Sony sjane mes se mone e 12 DEC 2012 Initial date of reckoning storage life DIFFUSED IN JAPAN Sony ASSEMBLED IN EIAJ C 3 Inscribed by using Code 39 without check digits barcode Figure 7 12 EIAJ C 3 label example NOTE The barcode is inscribed by using Code39 without check digits Readability of the barcode depends upon performance of the barcode reader distance between the reader and the barcode and scan angle Page 34 RC S966 Series Data Sheet FeliCa 7 2 3 Outer carton package Outer carton package specification is as follows See Figure 7 13 1 Each outer carton package contains one inner carton Inner carton is protected with corrugated fiberboards Identification label See Figure 7 14 is enclosed in outer carton package Outgoing inspection report that stipulates the shipping lot number see Figure 7 15 is attached to the top surface of the outer carton package EIAJ C 3 label See Figure 7 12 is attached to the side of the outer carton package Identification label Inner carton Corrugated fiberboards Label 3
9. with that for conventional FeliCa Standard chips Therefore you can use your existing infrastructure including FeliCa ports and development environment without change You can issue and operate RC S966 with only three commands Polling Read Without Encryption and Write Without Encryption Mutual authentication function RC S966 has a mutual authentication function which is different from that in conventional FeliCa Standard chips for authentication with the Reader Writer This function is suited for applications such as ID and Points cards Detection of falsification RC S966 can detect falsification by adding MAC Message Authentication Code to the data read out and written in Compliance with NFC Forum Type 3 Tag RC S966 is compliant with the Type 3 Tag defined by the NFC Forum Therefore they can communicate with any Reader Writer that is compliant with the NFC Forum standard The RC 966 can be used for Handover and Smart Poster applications Reduction in chip size RC S966 has succeeded to achieve smaller chip size 0 99mm x 0 99mm Typ after dicing by adopting a fine process technology and only the command set of the minimum requirement with suppressed memory capacity Communication system The communication system of RC S966 is based on inductive coupling Page 7 RC S966 Series Data Sheet Felica Power saving design RC S966 is a low power consumption designed chip All significant functions of FeliCa con
10. 0um Typ Size of chip pattern Y 1 080um Typ Size of chip pattern L1 B L2 B 410 410 410 410 E Figure 6 2 Bump positions Page 20 RC S966 Series Data Sheet Felica 6 2 2 Bump dimensions Figure 6 3 shows a schematic view and dimensions of bump Topsurface length X e a Bump dimensions um Top surface length X 70 to 85 Top surface width Y Top surface width Y 70 to 85 ails Height 2244 i Height variation 3 or less i within a chip evaluation value PE a S A Cavity depth 1 5 or less Au bump Height AL Insulating layer Figure 6 3 Bump dimensions 6 2 3 Bump material All bumps are made of gold 6 2 4 Bump hardness Hardness of a bump is between 20 and 80 HV Page 21 RC S966 Series Data Sheet F e i C a 6 3 Passivation layer The die surface is protected by a passivation layer the shaded areas in Figure 6 4 except the pads and bumps and the scribed area die edge Thickness of the passivation layer 4 0 um 1 0 um reference value X L2 P RC S966 1A X 990um Typ Y 990um Typ RC S966 1S X 1 080um Typ Size of chip pattern Y 1 080um Typ Size of chip pattern Figure 6 4 Passivation layer on die surface Page 22 RC S966 Series Data Sheet FeliCa 6 4 Die thickness RC S966 1A and RC S966 1C 120 um 15 um After backgrinding RC S966
11. 1S T725yum Typ Before backgrinding 6 5 Die dimensions RC S966 1A and RC S966 1C 0 99mm X x 0 99mm Y Typ After dicing Face 980 50 um x 980 50 um Back 995 50 um x 995 50 um RC S966 1S 1 08mm X x 1 08mm Y Typ Before dicing size of die pattern See Figure 6 1 for XY directions 6 6 Characters on die Following characters are allocated on the die surface see Figure 6 1and Figure 6 2 e Characters on die example SONY 2012 CXD90003 04 Page 23 RC S966 Series Data Sheet F e i C da 7 Packing specifications This chapter focuses on the packing specifications for wafers Section 7 1 Packing specifications for sawn wafers on wafer rings is applied to RC S966 1A and RC S966 1C And section 7 2 Packing specifications for unsawn wafers is applied to RC S966 1S 7 1 Packing specifications for sawn wafers on wafer rings This section describes packing specifications applied to RC S966 1A and RC S966 1C 7 1 1 Wafer ring Ring dimensions are shown in Figure 7 1 A FramelD label see Figure 7 2 is attached on the lower side when the notched edge of the ring is placed on the upper side Ring is made of plastic Unit mm Frame ID label NOTE Please use this size for reference Figure 7 1 Ring dimensional drawing Page 24 RC S966 Series Data Sheet FeliCa 50mm abcdefMgh 10mm a Code39 barcode without check digits Frame ID abcdef M gh
12. 40 8 3 Bondirnig precautioris 6 an Dp ere dee ra ote epe caret betaine teat ae ae 41 8 4 Pressure applicable to the chip surface ssssssssssssssssssee eee eene 41 RC S966 Series Data Sheet Felita 8 5 Antenna design RH 41 9 6 Handlirig precautlons ioi e rette eC eet ere be pte EC egit eee Lec bebe ee Ehe ege bud 42 8 7 External appearance of a SAWN wafer nennen ente Enere reenn 42 9 Dicirig an unsawn WAIGE tarnen ipo rS ex Link a tes ERE Ex E Eid Eb x ex EXTR Ya c e FE FUE Fen adidun Fa gU lad 43 Appendix A FeliCa Terminology eeeseeeeeeeeeeeeeeene nennen nennen nnne n nnne nnns 44 woes mE 44 ACIER 44 Page 6 RC S966 Series Data Sheet FeliCa 1 Major functions and features RC S966 is a contactless IC card chip based on Sony s FeliCa technology The features of RC S966 are described below Lower price With simplified security functionality and an optimized file system RC S966 is offered at lower prices than conventional FeliCa chips hereinafter referred to as FeliCa Standard chips RC S966 are suited for embedding in such low cost products as sales promotion articles membership cards points cards game cards gift cards and multi use ticket Use of existing FeliCa infrastructure RC S966 is based on the same wireless communication method as conventional FeliCa Standard compatible products and a command system compatible
13. ICC 1s 5i schist deis aped Os muda vae eue evo idea eu e eo a ER de EE EE gone cease tears 14 Aa Command lists ooi este rtt eee xe Rd a edv e erated REEL aee teta neo de A Lee Rue noa 15 4 4 Command parameters specific to RC S966 sssssssssssssssesseee eene ener rne 16 S SGCUEI V aoa d cec Des De pax banwe CoU D Roo e deca VY Du MAU TN Un Ida DIRE FUE CK DRNOTRUD Ree de R ct oui ac KK LU MEOE Ma E 17 DIS geome iiy E nC 18 6 T PAGS occade stein ea dp Ute abutere tobebesdeutcledia Lohse Mahatybealehihebeael ay eat ete 18 6 1 1 Number OF pads sn abest edet Pa e e E e eta ea 18 6 1 2 PAG Materials 5 am E Ee rca a repo E Et e D a thes p HER 18 6 1 3 Pad POSITIONS crt tai e rae be ab e a eg Dr e e dea 18 REPAS ES eem 20 6 2 1 Bump POSITION i e ti rab e Era e oa Ue etae at ege ee rat 20 6 2 2 BUTI AINON ONS tar te rae e eg a oa te o eL eere 21 6 2 3 Bump material a t Dit ditt AE io dun a edes ede ee rots 21 6 2 4 Bump hardness 2 o mto od ta eem a ida dra dedi e e Pere 21 6 3 Passivation layel x cde d eed a e era b pe o edet neus e eeu rep yu o ee ade 22 60 4 Die thlcKniess one e e e o eeu epe itas ep dae em eue pee a Rep ERE ye Sane eau ad 23 6 5 DIScCIMENSIONS REIP ERR 23 6 6 Characters O die ret i odd en eene te aee ee xta eo nne e 23 T Packing specificati ONS cu d ooxiceciscirecor n EX ea ckx raa dU IIIS Ee Dro Vb X DIR aU CR AR PUS Un RA INEO E rH C CEK IUE 24 7 1 Packing specifications for sawn wafers
14. SONY FeliCa Card IC RC S966 Series Data Sheet Version 1 2 No M751 E01 20 RC S966 Series Data Sheet FeliCa Introduction This document describes major function of RC S966 series i e RC S966 1A RC S966 1C and RC 8966 18 hereinafter referred to as RC S966 a chip for the contactless IC card that uses Sony s FeliCa technology RC S966 supports commands that FeliCa Lite S products need You are advised to read this document if you are responsible for manufacturing of products which uses contactless IC card chip The authors assume that readers of this document are familiar with contactless IC card technology electronic circuit and integrated circuit e FeliCa is a contactless IC card technology developed by Sony Corporation e FeliCa is a trademark of Sony Corporation e All names of companies and products contained herein are trademarks or registered trademarks of the respective companies e No part of this document may be copied or reproduced in any form without the prior consent of Sony Corporation e Information in this document is subject to change without notice e Sony Corporation assumes no liability for damages arising from or in connection with the use of this document Page 3 RC S966 Series Data Sheet FeliCa Cautions e Responsibility for quality assurance defect warranties and other items relating to individual transactions shall conform to these sales contracts and other adjunct contracts con
15. atic view of pad positions The central coordinates of each pad are as follows when the point of origin is set at the die center Other than L1 P and L2 P Pads for bumps parts painted in grey in the Figure 6 1 are allocated Because these pads for bumps of RC S966 1C are processed specially for forming bumps they cannot be used PAD X Y L1 P 424 318 L2 P 424 318 Page 18 RC S966 Series Data Sheet F g i C da chacen jon the die Pads fot bumps Not fot oe Die center 0 0 L1 P L2 P F 424 318 424 318 Pads for bumps NN Not for use X 990um Typ Y 990um Typ Figure 6 1 Pad positions Page 19 RC S966 Series Data Sheet FeliCa 6 2 Bumps RC S966 1A and RC S966 1S have a bump formed on each pad These bumps are formed by means of electroplating The positions of bump for antenna pads differ from antenna pad positions 6 2 1 Bump position Figure 6 2 shows a schematic view of bump positions The central coordinates of each bump are as follows when the point of origin is set at the die center Bump X Y DMY 1 410 410 DMY 2 410 410 L1_B 410 410 L2_B 410 410 NOTE DMY1 DMY2 are not connected to the internal circuits There is no problem to connect DMY1 DMY2 to L1_B L2_B respectively X Ly Characteis on the die El DMY1 i DMY2 410 410 410 410 Die center 0 0 RC S966 1A X 990um Typ Y 990um Typ RC S966 1S X 1 08
16. cluded between the Sony Sales Department or Sony agents and customers and this Data Sheet shall not in any way add to or modify the contents of said contracts e Sony makes the utmost efforts to improve the quality and reliability of its products but semiconductor failure of a certain percentage is unavoidable Therefore we request that sufficient care be given to ensuring safe design in customer products such as redundant design anti conflagration design and design for preventing misoperation in order to prevent accidents resulting in injury or death fire or other social damage from occurring as a result of semiconductor failure In addition be sure to consult your Sony sales representative beforehand when there is a chance that customer products manufactured using Sony products may pose a life or injury threatening risk or are highly likely to cause significant property damage in the event of such a failure e Sony reserves the right to change the contents of this Data Sheet without notice Be sure to check the latest information before using Sony semiconductor products e Technical materials shown in this Data Sheet do not convey any license by any implication or otherwise under any Sony or third party patents or other rights and Sony cannot assume responsibility for any problems arising out of the use of this information or for any infringement of patent or other right due to same e Export of products noted in this Data Sheet which fall u
17. d operations or write operations by specifying Block The concept that identifies both the method of access to Block Data and a set of Block Data Page 44 Card IC RC S966 Series Data Sheet Version 1 2 April 2012 First Edition FeliCa Business Division December 2012 Revision Sony Corporation No M751 E01 20 2012 Sony Corporation Printed in Japan
18. e i C a 3 Internal configuration Internal configuration block diagram of RC S966 is shown in Figure 3 1 Rectifier circuit and shunt circuit Regulator circuit Load ASK CLK Power on modulation demodulation extraction reset circuit circuit circuit circuit Wireless communication logic circuit NOTE The diagram illustrates a conceptual image Figure 3 1 Internal configuration block diagram Page 12 RC S966 Series Data Sheet F e i C da 4 File system and command This chapter describes file specification supported Service and supported commands on RC S966 4 1 File specification The number of usable Block and the simultaneously accessible Block are tabulated in the Table 4 1 and Table 4 2 respectively Table 4 1 Number of usable Block Item Max number Remarks Number of usable Block 15 Number of User Block 14 S PAD blocks and 1 REG block Table 4 2 Simultaneously accessible Block Item Command Max number Remarks Read Without Encryption 4 Write Without Encryption 1 2 when Write in with MAC is performed 52 3 Please see FeliCa Lite S User s Manual for description of S PAD blocks REG blocks and Write in with MAC Page 13 RC S966 Series Data Sheet Felica 4 2 Service RC S966 supports the following types of Service Also the relationship between Service and Block is shown in Figure 4 1 Table 4 3 Service Supported by RC S966 Serv
19. he edges of die are located within the area between the dicing lines and the edges of PSG layer after dicing process no metal layers are exposed on the cross sectional surface of the die 3 When the edge of die are located nearby the edge of PSG layer after dicing process the die may have chipped off or cracked L2 B 40um L2 P b 1 From dicingiline to the edge lof PSG layer Width 25m Passivation layer From dicing line to the edge of PSG layer Passivation layer Dicing line Width 80um l Figure 9 1 Dicing lines and around Page 43 RC S966 Series Data Sheet FeliCa Appendix A FeliCa Terminology This appendix contains definitions of important abbreviations and terminology used in this publication A 1 Abbreviation IDm PMm A 2 Glossary Manufacture ID Manufacture Parameter lt B gt Block Block Data lt C gt Chip IDm lt M gt Manufacture ID IDm Manufacture Parameter PMm lt R gt Random Service lt S gt Service The minimum unit of data written to or read from memory 1 Data to be written to or read from Block 2 Data to be stored to Block IDm which is written when the chip is shipped The value that comprises Manufacturer Code and Card Identification Number The Reader Writer uses this value to identify each card with which to communicate Card specific information that is set by the card manufacturer Service that enables rea
20. ice Attribute Random Service Read Write Access authentication not required Read Only Access authentication not required NOTE Necessity for authentication can be set by another way every each Block Please see FeliCa Lite S User s Manual for details Necessity for authentication can be set for each Block Random service Read Only Access unnecessary to authenticate 000Bh block s set to be Read Only Random service Read Write Access unnecessary to block s set to be Read Write authenticate 0009h Figure 4 1 Service and Block Page 14 RC S966 Series Data Sheet F e i C da 4 3 Command list Table 4 4 provides a list of commands supported by RC S966 and a brief description of each For more details see the FeliCa Lite S User s Manual Table 4 4 Command list Command name Function overview Common commands Polling Use this command to acquire and identify a card Read Without Encryption Use this command to read Block Data from Service Write Without Encryption Use this command to write Block Data to Service Page 15 RC S966 Series Data Sheet FeliCad 4 4 Command parameters specific to RC S966 Table 4 5 provides a list of parameters specific to RC S966 which is used in Command Packet Data and Response Packet Data supported by RC S966 Table 4 5 Parameters specific to RC S966
21. keeping the following precautions in mind 1 Make sure not to cause any chemical or physical damage 2 Use adequate assembly techniques so that optimum electrical thermal and mechanical characteristics can be obtained Do not expose the chip surface to a contaminated environment or material Ground all workers bodies as well as jigs workbenches and machines to protect the chips from electrostatic charges 8 7 External appearance of a sawn wafer When RC S966 is shipped as sawn wafer on wafer ring it is possible that chips located on the outermost portion of a wafer which have been excluded from any outgoing inspection are missing when the package is shipped Page 42 RC S966 Series Data Sheet F e i C a 9 Dicing an unsawn wafer RC S966 18 is shipped as unsawn wafer When wafer dicing process is executed it must be handled carefully keeping the following precautions in mind 1 After dicing RC S966 1S GND substrate level will appear on the cross sectional surface of the die To avoid causing die defect by forming short circuit which will occur when conductive material touching both pads bumps and the cross sectional surface of the die make sure no dicing dust remains 2 Metal layers of the die are located on the inside of the PSG layer edge but some elements are located on the dicing line see Figure 9 1 To avoid occurrence of edge touch make sure dicing lines are completely removed by the dicing process When t
22. managed by Sony EIAJ C 3 label X 351mm Y 384mm Label 2 managed by Sony Z 344mm Figure 7 13 Outer carton package Page 35 RC S966 Series Data Sheet FeliCa Identification Label i an Se PRODUCT RC S966 1S Product name LOT NUMBER 123456 Production lot no WAFER QUANTITY 25Wf Quantity of wafer WAFER TOTAL QUANTITY 500000pcs Quantity of die DATE yyyy mm dd Initial date of reckoning storage life Quantity of die per wafer a 2 N TOTAL QUANTITY 500000 PCS gt m Figure 7 14 Identification label example Page 36 RC S966 Series Data Sheet FeliCa Company name Bats Control No 00000000 838 No 00000000 Outgoing Inspection Report HARRA This is to certify that the following product has satisfied the delivery inspection standard as shown below Product name R RC S966 1S WW Quantity Hike XXXXXpcs Shipping lot number Hf Lot No XXXXXXXX Inspection detail GEPA Inspection item BED Inspection sampling size Pass criteria RAD GE Appearance SHER ANSI ASQC 21 4 Acceptable Quality Inspection level Il Level Normal inspection AQL ANSI ASQC 21 4 3 f 0 65 de RERE NHD Electrical characteristics Total sample Pass all test items ARRE HIRE CHARH Ze 7322 Test results StERfE 1 Appearance GH 2 Electrical characteristics ESI JEPPERSH Judgment Approved Checked Sony Storage Media and Devices Corp Figure 7 15
23. nder the category of regulated commodities as prescribed by the Foreign Exchange and Foreign Trade Control Act requires approval under said Act e The contents of this Data Sheet may not be reproduced or transferred in any form in part or in their entirety without the express written permission of Sony Corporation Page 4 RC S966 Series Data Sheet FeliCa Contents 1 Major functions and features 1 reed auae nizu deans nudas du ua nva Rai nn EE Rv VV NN nda Sas Sea 7 PAD rfj ste 9 2 1 General specifications sssssssssssssssssssseseseeeeeneeneneme nennen nnne emen sn nn en nen nentr snnt nennen nnns 9 2 2 Electrical characteristics n etd ee ore Ee x HR DUO RR XH HERR x Er Eee OD ee a 10 2 2 1 Absolute maximum ratings esses esee EEN EE TR nennen nnns eset renes nnne nen nnne 10 2 2 2 Recommended operating conditions eese ener nnns 10 2 2 3 Chip operating characteristics sessi sisse esee enin einn th nennt enn nnns 11 2 2 4 NVM Cell characteristics 2 on n ro n E t ER ES SERA ERE ER ets 11 22 5 ESD tolerance i i OR ERR e ERR ERR reta Re E E E A 11 3 Internal configuration eina nn cr rnnt nn n eia x ns a an idR Fa aas Pus na Rd 12 4 File system and command 55 acies enun aan toan ac bre EX YRLR ua ED a na Zt pL a Ra R an aS EE E DES OL A XY RT Enn RM Ea CERE 13 4 1 File SPECICATION M LE 13 4 2 SOIV
24. ny EIAJ C 3 label Figure 7 3 Inner carton Page 26 RC S966 Series Data Sheet FeliCa Q TY Quantity of die quantity of wafer P N Product name DATE yyyy mm dd Initial date of reckoning storage life LOT 123456 Production lot no DIFFUSED IN JAPAN Figure 7 4 Wafer container label example Product name Production lot no Quantity of die P N RC S966 1A LOT 123456 lt QTY gt 23000 3N 1RCS9661A 23000 danja nesse se 23000 3N 2 123456 xxxxxx lt value managed by Sony ESSET SEE Eq E 02 JUN 2012 Initial date of reckoning storage life DIFFUSED IN JAPAN Sony ASSEMBLED IN EIAJ C 3 fal Inscribed by using Code 39 without check digits barcode Figure 7 5 EIAJ C 3 label example NOTE The barcode is inscribed by using Code39 without check digits Readability of the barcode depends upon performance of the barcode reader distance between the reader and the barcode and scan angle Page 27 RC S966 Series Data Sheet FeliCa Identification Label iF an PRODUCT RC S966 1A Product name LOT NUMBER 123456 Production lot no WAFER QUANTITY 13Wf Quantity of wafer WAFER TOTAL QUANTITY 300000pcs Quantity of die DATE yyyy mm dd Initial date of reckoning storage life Quantity of die per wafer e e e m N TOTAL QUANTITY 300000 PCS
25. on wafer rings sssssessee eem 24 FV T Wafer Inge ete ph otros n C eet n e EE e PE dete 24 ZA 2 Inner cartons iniit drei enr ed I rai ee eMe t Pie ee toi e Itn 26 7 1 3 Outer carton PACKAGE n iie n t ee ie De ere Edad cet Be Et eee EBD DERE ener 29 7 1 4 Identification of defective dies esses siis einen rnnt etn ennnns 31 7 1 5 Maximum quantity of dies on a wafer sisse sisse einen rnnt entente nnns 31 1 6 Yield Of Wafer eae d Ue em bei rn leder DEI 31 7 2 Packing specifications for unsawn wafers sssssssssseeeeen nennen nens 32 VASE EET 32 742 2 Inner canons iiic hei REI e rU od aden ee rre eed 33 7 2 3 Outer carton package ei Dh t e d Ee ELE DURER Ee ER Behan islets 35 7 2 4 Identification of defective dies sss sisse einen rnnt nnns 38 7 2 5 Maximum quantity of dies on a wafer sss einen enhn 38 2 6 Yield of Wafer tee en pa oe Re Her D pega er HP eed 38 9 PrecautlOns aorin hairis a aran Karade a iera Cr Le E oL EE a a kaaa daren arani aaaea ee e esi rS INR nsii 39 8 1 Storage precautions ai iiio oie ae eae eee eA tee ee a ep da 39 6 1 Shelf life Of dle due dh tetigi adi aa fa dares eif i e o oda e dey 39 61 2 UVtape adhesivIly o staged ee dodi Lehr dis arent re c ti ro Pe e eo adu euo o Pede 39 8 2 Temperature prollle ou oce faces ose ded lure ex odes ean lantit daadaa hag tte e tne ERR RR RA E
26. size for reference Figure 7 9 External appearance of a wafer RC S966 1S uses wafer mark to take one to one mapping between a wafer and a map data Wafer mark will correspond to the WaferlD the value in the map data by replacing to M Example Wafer mark 00001 01 Control no 00001 Waferno 01 WaferlD 00001M01 Page 32 RC S966 Series Data Sheet F e i C a 7 2 2 Inner carton The inner carton specification is as follows See Figure 7 10 1 Wafers are inserted into groove of the container All wafers face the same direction Wafer no corresponds to the number displayed on wafer container Each container holds up to 25 wafers which fabricated in the same production lot 2 Wafer container label See Figure 7 11 is attached to the top surface of the wafer container 3 The container is bagged in a polyethylene bag The bag is then deaerated and sealed 4 EIAJ C 3 label See Figure 7 12 is attached to the top surface of the sealed bag 234 6 ras pea 14 129 pra rar ri rrr arra AT Detail Wafer container Numbers displayed on the lid of container Wafer 25 wafers max Numbers displayed Wafer container label on the side of groove Odd numbers only Detail 096 Ge Sealed with heat treatment EIAJ C 3 label Label 1 managed by Sony Polyethylene bag Figure 7 10 Inner carton Page 33 RC S966 Series Data Sheet FeliCa m i Quantity of die quantity of wafer Product
27. tactless IC card are implemented into RC S966 except antenna circuitry Because RC S966 can operate at a low electromagnetic field density you can use RC S966 for stickers smart posters and other non card media that have miniaturized antennas High data reliability RC S966 has highly reliable NVM Non Volatile Memory inside the chip Write cycle endurance of memory cells is 50 000 when chip is used at Tj 25 C or 10 000 when used at Tj 85 C Tj stands for Junction temperature IDm RC S966 has chip unique IDm written in its NVM which is written at the time of shipment Data transfer rate RC S966 supports automatic data transfer rate switching between fc 64 approx 212kbps hereinafter referred to as 212kbps and fc 32 approx 424kbps hereinafter referred to as A24kbps fc stands for frequency of carrier signal 13 56MHz Simple file system Data can be written in block 16 byte units into the on chip memory of RC S966 The adaption of a non hierarchical file system enables access to blocks using only a single service Each block can be set o to be write protected o Whether or not authentication is necessary when the data is written in to read out of the block o whether or not MAC is necessary when the data is written in to the block Data protection function against power interruption anti tearing In RC S966 the function to guarantee the data integrity at the command level is implemented If data wri
28. te to NVM is interrupted due to power failure the data is replaced by the previously stored data See FeliCa Lite S User s Manual for detailed descriptions Page 8 RC S966 Series Data Sheet FeliCad 2 Specifications This chapter describes general specifications and electrical characteristics of RC S966 2 1 General specifications General specifications of RC S966 are listed below Model name Application External dimensions Thickness Communication system Modulation system Data transfer rate User memory NVM cell performance Shipping form Operating temperature Storage temperature Minimum operating current Model name Shipping form Pad or bump RC S966 1A Sawn wafer on wafer ring Bump on pad RC S966 1C Sawn wafer on wafer ring Pad RC S966 1S Unsawn wafer Bump on pad Contactless IC card based on FeliCa technology RC S966 1A and 1C 0 99mm x 0 99mm Typ After dicing Face 980 50 um x 980 50 um Back 995 50 um x 995 50 um RC S966 1S 1 08mm x 1 08mm Typ Before dicing Size of die pattern RC S966 1A and 1C 120 x15 um After backgrinding RC S966 1S 725 um Typ Before backgrinding Wireless communication based on inductive coupling ASK modulation 212kbps 424kbps automatically switchable 14 Blocks 1 Block 16 Bytes Data retention period 10 years at Tj 25 C 5 years at Tj 85 C Rewriting durability 50 000 times at Tj 25 C 10 000 times
29. time x temperature must be below the heating condition illustrated in Figure 8 1 Constant temperature The chip surface temperature must be held at below 250 C including Cooling rate temperature variations Conditions for presetting the temperature are shown in Figure 8 2 The drop in heat time x temperature must be below the cooling condition illustrated in Figure 8 1 Page 40 RC S966 Series Data Sheet FeliCa Chip surface temperature C 3600000 85 10 100 1000 10000 100000 1000000 10000000 100000000 Process time sec Figure 8 2 Constant Temperature 8 3 Bonding precautions The antenna must be assembled so that it does not touch the cross sectional surface of the chip edge 8 4 Pressure applicable to the chip surface It depends on the bonding method and equipment Determine the optimum conditions for your system by performing pressure tests in advance The following data represents the mechanical characteristics from the test results e Bump shear strength Over 40MPa 0 20N 8 5 Antenna design RC S966 may generate heat when placed in a strong magnetic field after assembled with antenna When designing an antenna with RC S966 chip s operational temperature including the generated heat has to be taken into consideration Page 41 RC S966 Series Data Sheet Felica 8 6 Handling precautions RC S966 must be handled carefully
30. to 35 C and relative humidity of 45 to 75 2 After unpacking the package 20 days in dry air or dry nitrogen dew point of below 30 C 3 After unpacked or removed from the dry air or dry nitrogen environment 7 days at ambient temperature of 15 C to 35 C and relative humidity of 45 to 75 8 1 2 UV tape adhesivity When RC S966 is shipped as sawn wafer on wafer ring UV tape is used to adhere and secure dies The shelf life of UV tape depends on the die detaching method and environment For more information contact your Sony sales representative While the quality is not affected in any way some chips may differ in color from other chips when observing the wafer from the back side We have confirmed that this will not result in any issues when picking up the chips Page 39 RC S966 Series Data Sheet FeliCa 8 2 Temperature profile Figure 8 1 shows the temperature profile for bonding RC S966 250 C Chip surface temperature C A gt Process time sec Figure 8 1 Temperature profile for bonding Item Description Value Unit 1 Heating rate Allowable maximum rise speed of chip surface 200 C s temperature during chip bonding 2 Constant temperature Allowable temperature of chip surface See Figure 8 2 including temperature variation during chip bonding 3 Cooling rate Allowable maximum fall speed of chip surface 200 C s temperature during chip bonding Heating rate Heat quantity
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