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After Sales Technical Documentation

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5. R320 B v2 y 2 VL1 bupass capacitors VL2 bupass capacitors 100 DEEN TO RF Place near MCM2 Place near MCM2 WM gt seNat FROM RXQ TI 1 1 T fF 1 BAS70 07 RF RXI Me C4309P cC43P ca cap c434P 095 P CHRDET 33 33n 33n 33n 335 33n 3n Bop GND on GND GND GNDE GND Sg Pin 66 Pin 87 Pin 103 DEIN es VA2 VA2 SCLK 1 1 SDATA Place near amp RXPWR ace near c 1 XPWR vit am
6. Page 10 20 Amendment 1 04 97 RAK 1N Figure 19 PCN Component Layout Top
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8. Figure 6 RF TX Circuit Diagram EL UHFLO 8 VHLO VREF D ade T AAA AA L T a mp 5 084 a _ ey o BEI E y SR 1000 at H T v802 SMS d L MER M R80 L1 BFRS2AU a Mo 0821 8 2 ER TRF lt zi E g E s T Ind T E _ Wl g D 4k alle 8 8 Nes h 4 8 b Dere 7 C020 S 820 r l VHFLO 220R 1000 Sa 0822 UNA 1018 Sia 0830 330 V84 290 z e ejo 29 e el als jh 840 BFR93 AU 8 8 Sia R820 2821 569 LL PAST LOCK gp o 18k 1000 F
9. R823 SCLKL 47 R824 SDATAL 3 wun AT uc VREH gt R825 384 R847 e SENAIL gt HI T E C806 allo 1u_10V a T T ok ok S S c SE vgo2 mA oe AL D E pre BFROSAW S ER LNX2331TMX 835 S z S 47k gv R308 ji ni ee 5 4n7 FINES a 2 e 220R les alla 20 i af 0e2 l sz lag VHFLO y x eta SN 2 SS Sim 18k g 8 82 SIIR Sta R321 R828 e Mal C805 2 BFROSAW 3200 g d 0851 18k Td s ven rH 8 ger R802 SE ti 8 AFcl gt hl A37 fin RF fin IF
10. R145 V 7 g 23 ere 277 2 EE z E GIS GR Re ci gu xS Eo H 095 o R1121 N C157 ema S lg Es o ERA mm m o ES 3 00 gt mM q Aji DO er rg 5235 RIS 2 SE o BE B Be Esta EN m LO em 39 X110 o o R908 33 1 C88 J C87 P hm d 20 RH E ROC CO o EE El UJ S Si mee ERES REA fS Sls SDDS BBs 888388 V89 Zb oS 1N81 o amp ERN 0000000 000 es ume E 1 000 raBBga e o Ba Sane 5 N c m S BEBGSTZ GUS me O Oeleleles D130 LO ES m t QUE E REEERE 220 aa ES ol m A c mS az SS ar ves 80 S SU g amp V
11. Figure 1 PDA Block Diagram Edit 82 for layout 13a PWRU T PROCU 182 IS205 Ju vss A8 b lvsys LIDOPEN SIRU Leovecon LCDVCE Ai IS LGDVEEON ZUM LCDVEEON LCDVEE e VLI LCDPWM Vers H VBACK Don ot PHRGOOD VBACK XPWRON RXD RSRXD RBUSTXD RBUSRXD RSTXD TXD 30 08 95 RSTXD RSRXD 08 05 95 B bs e TESTMODEX RSENX RSENX Erin vidi RSSHDX RSSHDX HD 0 O NS IRSHD ae et Za Elo J103 JTAGTMS LP PADS UNDER BATTERY E POLK une PADS UNDER BATTERY ES I atk LCDD 3 0 En lo KEYD 2 0 g ROTA R987 PADS UNDER BATTERY gs 22k 820 SND vg 1 E112 i T 2 4 R984 R985 gt ghe tor o Sn z C972 ug CND 1000 om BND d i o BACKLIGHTI BACKLIGHTO DHEMIEN 2e KEYDI 2
12. R504 R509 R506 10k 5k6 22R eps c 5 220 3n3 s N a ma POATACL gt dis s zm J NS S e T T2 alla i f L542 S M Be H gv 89 i d L544 I V503 alle ge 3300 s in 00 ke ZE wa 808481 sy Jin ala a 2 l c ls 7 BN 8 B2 2 s iZ 2g 2 2 fa Eh 8 8 T 4 5 10 11 12 0N0 MHZ L _ C504 S BFR93AM x a ix alla 22p DTC114EE GE lo pl gt LO to w c ae Ple Slip e et 6 d vn wo 9 8 0543 253 E V502 R509 e i S 1 342 zu D a C521 D A ke Mo a 568 88 L511 26 S co 10k ll TU SE E t T Sr Sa 120n 2501 S V501 3 opus Em a d Se 8 L 12 Moy BrP 182 Ems el vi VPLL wa pa 72 C501 2 Zei IL ae a ae in H V 0 28 W 0 20 L 10 6 V 8 20 R513 R514 r sa 3
13. 02 Lota 020 2028 6024 cn 9078 EE a C200 L202 S ae e KEN Res 0021 e o N o O E N C5 8 S y O E Q D I Le 9 270 0074 0325 FS vu 0201 R330 d v3 22 0324 O 0437 oP Qu ic i ww Fe ES Zs 0182 t e oo Bd 2 8958 mu DA uad C556 EUN 2R 9080 1458 oe 22 la tig 4 io ccc 954 E DM L S _ e rou i ea ap pa g gues i Get CDI 500 BUUS 2E e LSS aR EJ E CL H k I GZLY Sek 6 6 EN s 2 x N pa 866 E E 218 ma 6 50 E pac 5 SE i apes z xu n US 2 9212 S lt s 4 S le o up 34018 Sl bel Y 2 SS 3 Le 5 a RS 3 U D plas S gp evs 6099 a et 1865 S 09 cada 609 28 be H a GPS 5 Om T S 3 zeam Selz amp Tg E Se Hie ta u ES 5 a ld E Vetted e a tO uy a eo ius a 33 me 1585 me EBD geca zeo E 6789 aN B 120 z SS 8 F ca o 7099 2 5 ugi 2 6085 SI OZN ale 20 3 ES aR EN o o c3 c5 o 3 Sl rel a 3 a 3 B 190 ES o WE Ej P OSLA 6067 E _ DR AN e 18 9 3 9 3 2 5 us
14. BS is HE HE HE HE uus HE HE uus BS Fi Help F2 Saue to EEPROM F3 Calculate Inc Dec Power ESC Exit When PDA Functions is selected the serial port must be chosen but before doing this disconnect the power supply see note 1 GSM SERVICE LOCALS RARE 1 1 Program Setup 2 Initialize CMT 3 CMT Testing and Adjustments 4 CMT ME Memory Functions gt 5 CMT Pouer up Self tests 6 7 E T CMT SW and _ SA Phone M 9 E D Q Quit Which port to use O Noney1 C0M1 2 C0M2 O O MoxaCard or JTAG 1 COM1 2 core Select either 1 or 2 see note 2 and press enter to display the Pinging Target message as shown overleaf Amendment 1 04 97 Page 7 47 RAE RAK 1N After Sales Service Software Technical Documentation GSM SERVICE LOCALS RAE_1 Program Setup
15. RAK 1N VBATT VLI HINGE _FLEX_ CONNECTOR VLI WI x001 04 05 C6 c7 ce 1 m vn 2 4In Di 4In An 4 n V fol 3 C C10 vif a R2 2 ees E ain 100184 cy ae 5 ae 9 It 1 GND R6 82k BE c 94 12k 12k 33k 12k 12k R7 82 2 Kee steal T 4Tn 3 See uif5 8 m 4 V1 uir6 3 SIE SE GND 14 V3 cold y 8 ya co 2 13 3 V5CUT col2 14 10 C Col 3 15 W el backl ight 12 gt C tier c2 VCI C 11 4u7_16V 13 vCC cao e e RS Lcddi 19 IB R W 20 16 E L cdd2 gt TT a Ledd3 5 DO tp E TR 19 Ge L al H A D o 25 4 SL D4 dispof E 7 5 Ge ledvec 5q e 59 D6 Ledvee 59 t 25 Br keudO o keud 22 26 keud 2 VBATT VLI Es keusO 33 keus1 GND LSND er lez les e4 les les lez les leo eto len PHONE CD CONNECTOR o
16. Edit 24 for layout 13a SR aa a alle m a ja sie sila dis a 8lla E IS al S zxlN ul IN alls zx IN alls alls al l s alls KEYS 9 0 R112 560R 4 R113 4 560R R114 560R 4 n 5 R115 l 560R R116 560R R117 R118 560R 560R R119 560R CONTROL BUTTON Le Le L Le y 7 5101 amp Cy 102 103 104 105 106 107 108 109 110 Bull de Ed 112 113 114 b 115 S116 SHIT 118 119 120 121 H 122 123 L L S124 125 126 127 Co S129 133 134 135 LI Ld 4 LI ENTER KEY DOUBLE CONTA C 136 45 146 147 157 158 168 4 D c E 138 138 140 p141 142 144 S 49 150 S151 152 153 9 URS SPACE KEY TRIPLE CONTACT EL 16 e E 8 m SR 2 ay E 2 E 162 o 166 GC PO EI E E 9 E Original 05 97 Page 10 8 RAE 1N Figure 7 PDA Memory Edit 28 for layout 13a A C21 DES MAADES MAA1 D162_15 D162_15 D163_9 D163_15 vecs vecs vsys vecs MA 9 2 RASO ces ITEM cer 106n 100n 106n LSND Leno XIP FLASH 2 XIP FLASH 1 FLASH FIL E odo D160 1 D160 6
17. D 96 p QU v bQUUUUUUU JUUUU VU U v 8 PDR Functi 9 Fa oq Target responding a 0 BIOS testnode zl Use any key to continue SS En ER a a p 0 po poo 0 a Hd EH ESC Exit NOTE This procedure is necessary in order for Pinging to function correctly 2 If the default None is chosen only the Flash Utilities Flash Several Targets and JTAG Flashing menus are enabled for use Page 7 48 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 1 Initialisation This menu provides functions to direct the target either to the BIOS or to the DOS testmode The speed of the communications channel may be changed and verification of communications channel validity is also possible 1 Initialization Test Peripherials 3 Flash Utilities 4 DR M Utilities 5 L Space Functions 6 d Product Information Complete Test Fi Help t tove by Line This menu has the following Sub menus 2 Set Serial Speed 3 Boot Operating System 4 Reset Target 5 Exit DOS Testmode 1 1 Ping Target This menu item verifies the validity of the communications channel by sending a test message to the target If the channel is fully functional the target responds to the message request Amendment 1 04 97 Page 7 49 RAE RAK 1N After Sales Service Software Technical Documentation Note Any user options become highlighted once the men
18. 1 3 EE yd fid justments Ge E e rine gt Gei a 5 CMT eu Self tests s ZU cue aa E 9 Faultlog E Q Quit Pinging Target Please Wait Eo E oo _ i V jd i i At this point re connect the power supply and a Target responding message should be displayed as shown below
19. 6 Calculate CheckSum 7 Target DOSshell Fi Help tl tove by Line ESC Previous Menu 5 1 Get Post CheckPoint With this menu it is possible to read the last checkpoint written by BIOS during POST The output from the target shows the following the last POST checkpoint 5 2 Read UO Port This menu allows the user to read any I O port byte or wordwise User options are Port Address default none Range 0000h FFFFh Notation default Byte Range Byte Word The output from the target shows the following Byte Word in the enquired I O port Amendment 1 04 97 Page 7 55 RAE RAK 1N After Sales Service Software Technical Documentation 5 3 Write I O Port This menu allows the user to write any I O port byte or wordwise User options are Port Address default none Range 0000h FFFFh Notation default Byte Range Byte word Byte default none Range 00h FFh Word default none Range 0000h FFFFh The output from the target shows the following Byte Word in the enquired UO port after writing it
20. 6 19 Figure 4 CMT power states from PDA point of view 6 20 Figure 5 Discharge voltage curve of battery two Li lon cells in stadby 6 22 Figure 6 PROCU memory Map part 1 Lsssuuss 6 30 Figure 7 PROCU memory map part da E Ee RE Ree RE ERAS 6 31 Figure 8 PROCU memory mappart 2 eee eee eee 6 32 Figure 9 PDAPWRU block scsi RE RE RE RE EE ED QUEE ERE 6 39 Original 08 96 Page 6 3 RAE RAK 1N After Sales PDA Hardware Technical Documentation This page intentionally left blank Page 6 4 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware Introduction This chapter describes the PDA system hardware used in the NOKIA 9000 communicator The PDA module is used to run all applications that utilise the bigger 640x200 LCD screen Technical Summary Table 1 List of functional blocks on PDA module Name of functional block Execution and interface unit for PDA Power supply unit Serial communication and Infrared Unit EMI supressing Unit Most of the engine functionality is integrated on a chip that combines a CPU core and all needed peripherals this chip and all other PDA module circuitry are mounted on a single multilayer printed circuit board The chassis of the NOKIA 9000 communicator separates the CMT and PDA modules and also protects PDA circuits from EMI The components of the PDA system hardware are surface mounted soldered usin
21. Dei D162 Des vsYS II E29F0166V 120 E28F 0 16SV E28F 0 16SV FLASHM 1Mx16 FLASHM 1Mx16 FLASHM 1Mx16 0 C160 CIS CND 100n 100n Leno Lem D160 KM416 V1200AT L T AA 0 f 0 f 9 DRAM 1Mx16 A A 1048575 1048575 1048575 a Rar 1048575 ko 00 JW o o a eo o 3387 W is vsYs R192 SES m VSYS VSYS VSYS VSYS 1 6 22 VSYS 23 39 44 CND 9 31 43 VSYS 15 VCC5 21 42 48 ND 9 31 43 VSYS 15 VCCS 21 42 48 GND 9 31 43 VSYS 15 VCCS 21 42 48 GND FLASHPD2XL FLASHWP2XE gt FLASHPD1XE gt FLASHWP1X gt D 15 0 lt gt Original 05 97 Page 10 9 RAE 1N Figure 8 PDA Component Layout 13a
22. Q Telephone directory Call Aaltonen Jukka ABC Design Co Anstaedter Jens 7 6 M Bankers Enter Bayer Anna number Carr John Research Ltd Telephone JE 0000 B n Chaung Carl Business Plc ee Dekkert Manfred Travel agent A Search Settings Selection Frame Figure 8 Telephone Directory Making a Call From The Directory Select the contact you want to call by moving the selection frame over the contacts name and press Call If the contact has only one phone number the number is called directly If the contact has more than one phone number a pop up box opens listing the phone numbers Choose the correct number from the list and press Call Making a Call Manually Press Enter number Key in a phone number and press Call Answering Calls You can answer a call either from the phone interface or from the communicator interface To answer a call from the communicator interface Activate the Telephone application by pressing the Tel application button Press Answer Note If you answer a call from the phone interface but later choose to switch to the communicator interface note that the audio is off to turn audio on press Audio On If you do not want to answer the call press End call Original 08 96 Page 17 RAE RAK 1N After Sales Quick Guide Technical Documentation Fax CO co Faxes are received automatically to activate press the Fax button on the communicator i
23. Table 12 Test pads under the battery pack SignalName Pad Notes Serial bidirectional data and control between the handphone and accessories VF Flash programming voltage DCLK DBUS data clock DSYNC DBUS data bit sync clock RDA DBUS received data from the accessories TDA DBUS transmit data to the accessories RBUS receive OMT PDA or test RBUS transmit CMT PDA or test Page 6 16 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware Internal Signals and Connections Table 13 Signals Between PROCU and power supply unit LCDPWM PWM signal for LCD voltage control LCD contrast control LCDVCCON LCD Vcc on off LCDVEEON LCD Vee on off PWRGOOD Reset signal for CPU VSYS valid VBACK Backup battery voltage to RTC 5VPDX 5V regulator powerdown Original 08 96 Page 6 17 RAE RAK 1N PDA Hardware Functional Description Introduction After Sales Technical Documentation Intel E3G is 386 based core with all needed peripherals on same chip E3G is used to execute all applications GEOS DOS BIOS and TFFS Clocking Scheme Actual clock signals are not routed to any other chip than previously mentioned E3G All clocks are generated from a 32 768 kHz chrystal with PLL s integrated to the E3G CPU chip System clock rates are as follows CPU core 23 96 MHz UART s 1 84MHz 8254 Timer 1 198MHz RTC 32 768kHz Reset and Power Managemen
24. 100 Reference noise bandwidth kHz 270 270 Sensitivity dBm 102 S N ratio gt 8 dB 100 S N ratio gt 8 dB Bn 135 kHz By 2135 kHz BF food gan cre aga 9 1 M i 06 8 A Gain relative accuracy in receiving 1 5 1 5 band dB Gain relative accuracy on channel 0 4 0 4 dB Duplex filter The duplex filter consists of two functional parts RX and TX filters The TX filter rejects the noise power at the RX frequency band and TX harmonic signals The RX filter rejects blocking and spurious signals coming from the antenna In PCN there is a lowpass filter between the duplexer and RF connector which further improves the spurious response rejection above 2 GHz Pre amplifier The bipolar pre amplifier amplifies the received signal coming from the antenna In the strong field conditions the gain of the amplifier is reduced 36 dB in GSM and 24 dB in PCN typically Amendment 1 04 97 Page 3 13 RAE RAK 1N After Sales RF Technical Documentation Table 4 Pre amplifier specifications Parameter Typical Maximum Unit Notes Nominal Frequency band GSM 935 960 MHz PCN 1805 1880 MHz Current consumption GSM PCN Insertion gain GSM PCN Gain flatness Noise figure GSM PCN Reverse isolation Gain reduction GSM PCN IIP3 GSM PCN Input VSWR Zo 50 ohms Output VSWR Zo 50 ohms RX Interstage Filter The RX interstage
25. 7 64 CMT Upgrading Software Gen 7 71 PDA Upgrading Software Setup nannan rr rnnr 7 72 Tuning setup with covers on 7 75 Tuning setup with covers Off ux o px RR ERRARE RR RE ER 7 76 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Introduction The Nokia 9000 service software is a dual purpose package designed to test all CMT and PDA functions by means of menu driven user interfaces itis also used to download new flash images The software requires that a dongle PKD 1 be fitted to the PC parallel in order to enable software functionality This chapter details both service and flash downloading functions in separate sections Required Servicing Equipment Computer IBM PC AT or compatible with at least one unused serial port COM1 or COM see note below one parallel port LPT1 hard disk recommended DOS Version 3 2 or later Display Any 80 character text display Service software program LSD 1 for 3 5 disk product code 0774057 Note Two ports are preferable A number of PC s of an older generation use the Intel National Semiconductor or United Microelectronics IC 8250 as the serial port UART This is a comparatively inefficient circuit for current purposes and does not necessarily support the M2BUS adapter at 9600 baud The newer UART s NS16450 and NS16550AF of National Semiconductor offer solutions for these problems A list of service tools acce
26. UIF module Mechanics 57 170 11 Battery pack BLK 4S 52 61 19 Environmental Conditions Temperature Conditions Extreme operation condi tions Table 10 Allowed Ambient Temperatures Environmental condition Ambient temperature degrees Celcius Normal operation conditions 15 C 35 C Office environment 20 C 55 C GSM Specifications fullfilled Reduced performance conditions 30 C 20 C Operation possible after warm up LCD s might oper ate slowly or cessate operat ing 65 C Connection can be estab lished 75 C Intermittent operation condi 40 C 30 C dions 75 C 485 C Operational only for a short period Operation not possible but attempt to operate will not damage the device Cessation of operation lt 40 C or gt 85 C No storage or operation pos sible without permanent damage Storage conditions 40 C 70 C Charging Page 1 18 0 C 45 C Li lon charging recommen dation by the vendor ex ceeding these limits will re sult in reduced capacity and longer charging times Original 08 96 After Sales RAE RAK 1N Technical Documentation Overview Vibration and Free Fall The transceiver meets the module phase error requirements which equates to a total RMS vibration in the range 10 Hz to 150 Hz of 0 5 g The transceiver has been drop tested to withstand
27. 4lk 47k LEY e l alls 5308 BEROSAW n fin RF Fin IF 2 le 2 2 ella 2 C803 VCCPLL o amp S rom ceo 8 A x gg 25 I ne a Be SCH SC El ate 8 C865 1 VCCPLL e Sa eT ella 353 1009 20 VCCPLL o 5 ge g 2 4 1 9 14 11 GND g x e 7 Lea e os v y S Ll 2 8 caog D 25mm VS E u 10V amp 2 BEROAW S e 8 x SE S L di S 2 ofl E y SAT D 3n3 S Bi g gt D El Rp g a g a H g Sa al eh ua 8 39R ty efc le a D gt UHFLO ER g 8 R860 4V5_TX T TXOUT 2 E DO S UI i Bzxe4cev2 R742 Te C783 vote A 27 R791 He VIS Sp VBATT a 2P SS 08 R707 47R A 86 3 g 9 i R739 C784 alls 2 1508 VHLO ICL7660SIBA 10k 3 S fs a XC C elle Ge Via S EUR E elle BC858N 2738 T gL Sg 330u_10V 330u_10V 330u_10V 330u_10V EE A Ma oo fll CIS Pa I C798 0798 C199 C763 Uo M S M ER 10k m a gila 3 MES MS C194 T EINE a 676 2u2 6 3V R R743 25mh 3mm E R781 W 2 es alle 22 DETO lt a z s gu 330R BAS70 07 8 9 amp Er Sel J BCPG9 25 z la 5s C701 R E Ca 80 Tm T ls 100 a sa 9 o alla WE v xd S R702 em 1k2 Qi H 5 D dE D I e e 47 sje SEE XP D 808481 BEI 1 z 10k C738 E 1009 al 3 de i i 1ko s g Sei EE n Kei N ae A s Y a l SES R757 So R767 BOB e lg cra e afle 4 z F Se d d 1k2 aa 220R 100R L700 SA ls Z26R 100MHz ep gl lg al o SIE 2 r SS nn E He 10p O 4 020 IER GC A cm L 5 1 8 S la 1 ed be E EIN aS
28. LCDDO 3 0 PDA LCD Data LCMCON LCDD 3 0 DISPONO PDA LCD Display on control signal LCMCON DISPON PDA LCD Frame Pulse LCMCON FP PDA LCD Pixel Clock LCMCON PCLK PDA LCD Line Pulse i ES PHFMICNO Negative Hands Free MIC input MICCON 1 PHFMICPO Positive Hands Free MIC input MICCON 2 COL 3 0 O Lines for keypad write LCDMCON LCDMCOL 3 0 UIF 3 0 O Lines for keypad read and LCD controller data LCDMCON LCDMUIF 3 0 UIF4O Line for keypad read and LCD controller read write strobe LCDMCON LCDMUIF4 UIF5O Line for keypad read and LCD controller data insruction register LCDMCON selection LCDMUIF5 UIF6O LCD controller enable srobe LCDMCON LCDMUIF6 MBUSO Serial bidirectional data and control between the handphone and SC SYSM accesseries BUS EXTMICO External audio input from accessories or handsfree microphone SC SY Multiplexed with junction box connection indication 16 8k pull SEXTMIC down in HP EXTEARO External audio output to accessories or handsfree speaker SC SY 100k pull down in HP to turn on the junction box SEXTEAR Page 6 24 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware PROCU The Processing unit contains integrated Intel E3G CPU CPU and peripherals on the same chip two types of memory circuits DRAM FLASH a 22 bit address bus 26 bit internally and a 16 bit data bus PROCU functions
29. R35 R36 Co CA a Li EZ C24 040 RAE 1N Page 10 19 After Sales Technical Documentation RAE RAK 1N Series Accessories Original 08 96 RAE RAK 1N After Sales Accessories Technical Documentation AMENDMENT RECORD SHEET After Sales RAE RAK 1N Technical Documentation Accessories CONTENTS Page No Non Serviceable Accessories 5 Battery Pack BLK 4S 10670153 EE 5 Universal Fast Charger ACH xxx 000 c cece ee eee eee eee 5 Power Adapter Module PAR 1 0680028 0 05 6 RS232 Adapter Cable DLR 1 073077 0 0 ccc eee eee 7 COMMECI N MMC 7 Cigarette Lighter Charger LCH 2 0675005 8 Serviceable Accessories 9 Spare Battery Charger DCH 4 0675107 0 0 00 eee 9 EE aues ke ue bua Ud Ada DE RENNES EE Ee 10 Charging indication geed papas paro aria 10 Charge Control MR 10 Different Charging Voltages 2 cece eee eee eee 11 DC Characteristics veraces RR E Ud a Re Re Rui ER RA 11 External Signals and Connections 5 5 caros bh nn 12 Mechanical Characteristics 12 Environmental Conditions usse A d Ee EN nn dor DAC RE ACA 12 Assembly 2 4202 13 CARK60 Hands Free Car Kit 0086052 oooocooccococcooo 14 Original 08 96 Page 3 RAE RAK 1N After Sales Accessories Technical Documentation List of Figures Figure 1 Battery pack BLK 4
30. 1 2 Page 8 4 Remove 4 stick on screw caps A and 4 Torx screws B Gently remove the module sub assy by pushing the keypad down Note The right lower screw tower is the most difficult one to release Disconnect flexi connectors D then C by releasing connector clips Connector C will open by lifting the clip up Unplug the coaxial antenna wire E Remove EMC flex not shown from the reverse side of the UI module card and then remove the module assembly F Remove PDA LCD module assy H Unclip screen frame G from the LCD module Note LCD module is attached to the frame by double sided tape Re assemble in reverse order ensuring the following e correct orientation of PCB in frame i e connector D should be in line with the scroll keymat Coaxial antenna cable E does not go under the Ul module or it will disable the function keys Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly Figure 1 LCD UI Module disassembly Original 05 97 Page 8 5 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation System Module Disassembly see fig 2 1 Ce E m Remove Battery A Remove 2 Torx screws B Gently lift off C cover C starting from the battery hole Note be aware that the speaker gasket on the SIM flex might stick to the C cover buzzer gasket Remove 7 torx screws D do not undo screws marked with an S on the dia
31. Figure 15 Mail main view Sending Mail Press Write mail Write the contents of the mail message Press Recipient the Mail directory view opens select a contact or press Enter address to open the Mail envelope BZ CS Mail envelope Send 5 To Anstaedter Jens x anstagdt Qzmbk nl z I C Mail gatr research gan oan Send gt Cc russel RAtSONS CheM GOK cceccseeseeseeeeeeseeeee options v y 15 20 Add SE olini recipient o 0 m use Cancel C_D Figure 16 Mail envelope In the Mail envelope you can check the sending information and add more recipients press Add recipient or enter addresses manually Press Send to send the message Reading Mail In the Mail main view screen move the selection frame over the Remote mailbox folder and press Connect All mail is listed and unread messages have unopened envelope icons attached to them You can get all new mail by selecting a message and pressing Fetch selected Fetched mail goes to the Received mail folder where it can be opened and read Pressing Fetch new puts all new mail to the Received mail folder Original 08 96 Page 23 RAE RAK 1N After Sales Quick Guide Technical Documentation World Wide Web The World Wide Web application allows your communicator to become an internet browser and access Internet sites via hypertext links see the User Guide for information on setting up these links Hotlist The
32. GEOS DOS BIOS TFFS and GEOS application platform user interface functions external interfaces IrDA and RS232 power management self test production testing and maintenance Technical specifications Table 16 External Signals and Connections Inputs RBUSTXD RBUS transmit of CMT B2B RBUSTXD RSRXD Serial data to PDA module SIRU TESTMODEX PDA test SW activation Test pad E113 JTAGTDI JTAG data in Test pad E100 JTAGTCK JTAG clock Test pad E101 JTAGTMS JTAG mode control Test pad E102 KEYS 1 0 Keymatrix sense lines EMIU Table 17 External Signals and Connections Outputs Signal Name Signal description LIDOPEN Lid status for CMT module B2B LIDO PEN LCDVCCON LCD Vcc on off PDAPWRU LCDVEEON LCD Vee on off PDAPWRU LCDPWM PWM signal for LCD voltage control PDAPWRU Original 08 96 Page 6 25 RAE RAK 1N After Sales PDA Hardware Technical Documentation Table 17 External Signals and Connections Outputs continued Signal Name Signal description To 5VPDX 5V regulator powerdown PDAPWRU XPWRON Power key active low B2B XPOWER ON LCMCON LCMXPOW ERON RBUSRXD RBUS receive of CMT CMT lt PDA B2B RBUSRXD JTAGTDO JTAG data out Test pad E103 BUZZEROUT Buzzer signal to buzzer on SIM module B2B BUZZER OUT FP PDA LCD Frame Pulse EMIU PDA LCD Data EMIU DISPON PDA display on control signal EMIU KEYD 2 0 Keymatrix driv
33. Start Testing Choosing this choice the automatic test sequence is started using the enabled tests These tests can be carried out individually by disabling all tests except the one required and then selecting Start Testing The output from the target shows the following whether the tests are O K or have failed Page 7 62 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Flash Downloading GP1 PDA module Flash image can be downloaded two ways The most common way is to use RS232 cable DLR 1 and a modified Power Adapter module This Flash downloading can be done either one communicator at a time or simultaneously for eight communicators The JTAG method is required if the uppermost flash device in the memory map D163 schematic reference is changed to a blank flash device In this method a special adapter card is connected to the dummy test battery GE8 CMT module Flash image is downloaded using Flash Programming Set FPS 3 The dummy test battery is needed in addition to ordinary FPS 3 hardware and software Flash image download setups for both modules is illustrated overleaf Amendment 1 04 97 Page 7 63 RAE RAK 1N After Sales Service Software Technical Documentation Dummy test battery 19 1818 d xIUOJJU9o 4 uuoo pui Power Supply 5 8V min 8 5V max Figure 3 GE8 and GP1 FLASH Dow
34. Testing and Adjustment Testing and Adjustments 1 RF Controls 2 Adjustments 3 Call Simulation 4 Internal Audio Loop 5 External Audio Loop 6 Logic Controls 7 Run MCU Selftests 8 Set MCU Start up Self tests Amendment 1 04 97 RF Controls 1 Actie Unit TX RX 2 TX Power Level 3 Operation Mode Burst Continuous Burst 4 TX Data Type 0 1 RND 5 Continuous Mode Channel 6 Channel Adjustments 1 Continuous Mode Channel 2 TX Power Tuning 3 TX 1 Q Tuning 4 RSSI Calibration 5 AFC Diagram 6 Noise Sensitivity 7 Charge Voltage Adjustment 8 Battery Voltage Adjustment Call Simulation 1 TX Power Level 2 Channel 3 Monitoring Channel 1 1 4 Monitoring Channel 2 1 5 Monitoring Channel 3 1 6 Monitoring Channel 4 1 7 Monitoring Channel 5 1 8 Monitoring Channel 6 1 Internal Audio Loop 1 Input Int Ext Phf Int 2 Output Int Ext Phf Int 3 Loop On Off External Audio Loop 1 Interface HS HF PHF HS 2 Make a Measurement FREQUENCY Hz 300 1000 3000 RECEIVED LEVEL Logic Controls 1 Read A D Converters 2 LCD test display 1 2 Set MCU Start up Self tests 1 ASIC BUS tests On Off 2 ASIC Timer amp IRQX Test On Off 3 ASIC Timer amp NMI Test On Off Off 4 Audio Codec Test On Off Off Page 7 11 RAE RAK 1N After Sales Service Software Technical Documentation CMT Menu Structure ME Short Code Memory User Setting and Values T EGCK A 35317 2
35. 0 SRAM page 14 EEPROM page 1 De C A86 age 15 X X FLASH pages 2 3 320K x 16 bit area x x FLASH pages 4 7 X X FLASH pages 8 11 X X FLASH pages 12 13 64K x 16 bit area paged with FPAGE 1 0 Table 28 FLASH address generation on pages 12 13 highest bits mo ars a17 men FPAGEO lt lt ae fifi fo o o 1 o riastipageo 0 0 alolalalalalalol 00 a a a sch IC X XxX x x jojojojoj XIXI X X KX A Kx XxX x lt x lt x lt x lt e mo EE ES KE Pi fol o 1 1 0 1 0 0 0 FLASH page 2 1 0 1 1 0 0 1 Reset SCL clk divider NEVER USE THIS Flash programming In flash programming a special flash programming box and a PC is needed Loading is done through a test connector of PDA module using the same serial channel as RBUS PDA module should not use RBUS during flash loading First MCU goes to minimum mode MBUS command from PC or if MBUS is connected to EXTMIC JCONN line in power up Then the flash software is loaded from PC to flash loading box After the loading is complete the flash loading from box to CMT can be started by MBUS command from PC to the MCU After that the MCU asks the test box to start flash loading to baseband The box supplies 12 V programming voltage for flash and starts to send 250 bytes data blocks to the MCU via RBUSRxD line The baud rate is 406 kbit s The MCU calculat
36. 0770078 SIM Flex Insertion Pliers LCD Flex Insertion Pliers 0770077 0770079 Modified Power Adapter Modular power Connector SCF 6 0770036 RS232 cable Software Protection Key Flash Programming Set Audio cable DLR 1 PKD 1 FPS 3 ADS 1 0770073 Used to activate test mode 0730077 0270074 For GE8 Flash download 0730011 The following tools are not illustrated LCD Flex Insertion Tweezers 0770080 JTAG Flash download Set FDS 1 Multi Responder Flash downl RDS 1 BNC MINI UHF adapter 0198551 B2B Measurement adapter RBM 1 0775068 0775069 B2B Hinge flex measure adapter Original 08 96 RBM 2 Page9 3 RAE RAK 1N After Sales Service Toos Technical Documentation Table 2 Service Kit 9000 Service Kit PFT 1K 0067041 Contents Hinge Flex Insertion Pliers PFH 1 SIM Flex Insertion Pliers PFS 1 LCD Flex Insertion Pliers PFL 1 LCD Flex Insertion Tweezers TWL 1 Table 3 Service Software configurations RAE 1N Software Service 0774057 1 x 3 disk CMT MCU 0775063 1 x 3 disk English PDA MCU 40775064 2x3 disk German PDAMCU 200775065 2x3 disk French PDA MCU 0775066 2 x 3 disk Scandinavian PDA MCU 0775067 2 x 3 disk Page9 4 Original 08 96 After Sales RAE RAK 1N Technical Documentation Service Tools BTD 1 Battery Test Dummy Material Code 0770071 Original 08 96 Page9 5 RAE R
37. 22 5 96 0 063 W 0402 R541 1430710 Chip resistor 22 5 0 063 W 0402 R542 1430734 Chip resistor 220 5 0 063 W 0402 R543 1430754 Chip resistor 1 0k 5 0 063 W 0402 R544 1430762 Chip resistor 2 2k 5 0 063 W 0402 R545 1430758 Chip resistor 1 5k 5 0 063 W 0402 R546 1430724 Chip resistor 82 5 96 0 063 W 0402 R547 1430744 Chip resistor 470 5 96 0 063 W 0402 R551 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 R552 1430788 Chip resistor 22k 5 0 063 W 0402 H553 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 R554 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 H555 1430788 Chip resistor 22k 5 96 0 063 W 0402 R556 1430770 Chip resistor 4 7 k 5 0 063 W 0402 R557 1430730 Chip resistor 150 5 0 063 W 0402 R558 1430732 Chip resistor 180 5 0 063 W 0402 R559 1430740 Chip resistor 330 5 0 063 W 0402 R560 1430764 Chip resistor 3 3k 5 0 063 W 0402 R562 1430754 Chip resistor 1 0k 5 0 063 W 0402 R563 1430728 Chip resistor 120 5 0 063 W 0402 R564 1430738 Chip resistor 270 5 0 063 W 0402 R565 1430754 Chip resistor 1 0k 5 0 063 W 0402 R566 1430754 Chip resistor 1 0k 5 0 063 W 0402 R567 1430728 Chip resistor 120 5 0 063 W 0402 R568 1430734 Chip resistor 220 5 0 063 W 0402 R569 1430754 Chip resistor 1 0k 5 0 063 W 0402 R570 1430726 Chip resistor 100 5 0 063 W 0402 R571 1430762 Chip resistor 2 2k 5 0 063 W 0402 R572 1430276 Chip resistor 47 k 2 0 063 W 0603 R573 1430778 Chip resistor 10k 5 0 063 W 0402 R574 1430778 Chip re
38. 3 are used as 4 bit parallel data bus for the driver UIF4 is used as read write strobe UIF5 to select data or instruction register and UIF6 as enable strobe Amendment 1 04 97 Page 4 11 RAE RAK 1N After Sales UIF Technical Documentation Keypad and display illumination The keypad illumination is achieved by using two transistors wired as simple constant current sinks Each transistor supplies eight leds The bases of the transistors are all wired together and supplied by emitter follower V40 The led current is fixed by the values of R33 and R34 and the ratio of R30 to R31 The current is about 5 mA each LED The display illumination operates in a similar way to the keypad drivers two transistors are used to drive eight leds The current in this case is defined by the value of R35 R36 and the ratio of R30 to R31 It is about 10 mA each LED CMT LCD Module Interface The LCD module includes the LCD and the display driver The driver TAB is connected with heat seal connection to the LCD The LCD is FSTN type The duty ratio is 1 32 and the bias ratio 1 6 7 Viewing direction is 6 o clock The display driver is NJU6406 02 from JRC It has internal clock oscillator and negative voltage generator It has 9600 bit character generator ROM and 64 8 bits character generator RAM The display module is connected to the UIF module with 24 pin soldered connection The display module contains an oscillator to generate a negative vol
39. Technical Documentation Quick Guide Figure 21 shows an example of a day view page with icons attached to various entries These are as follows Attached memo amp Alarm e Repeating event daily weekly monthly 8 Annual event To add events move the selection frame over the starting time of the event and enter on the dotted line To delete events select the event and press Delete If you delete or edit repeating events you will be asked if you want to apply the changes to all or only to the current event To do List The To do list is accessed by pressing the To do list command button in the Month view The To do list is a list of tasks not connected to any specific time or day After a calendar alarm has occurred you have the opportunity to move the message contents of the alarm to the To do list by pressing Move to To do list command button Hp V i Y To do list Mark asi C_D hs E Pay electricity SN BE m Reserve a table at Restaurantll Calendar CDEN New CD Y 4 Call Freddie sss 16 10 96 Delete CD Close Figure 22 Calendar to do list The entries in the To do list are numbered and can be given high priority denoted by a star icon or ticked as completed High priority entries are always shown at the top of the list Original 08 96 Page 27 RAE RAK 1N After Sales Quick Guide Technical Documentation System
40. VBATT RS RW EN D4 D3 D D PAD LCD CONNECTOR BACKLIGHT VL ou X010 GND 1 dispoff 2 fp 3 lo 1 4 7 A 4 oclk VLI 5 L cdd i 10k t ted S i e RIO C27 C26 Ledd3 si 82 83 84 BIS 220 220 Dom i l N C OND CND 1 cdvee 2 5 8 0 100 112 VBATT VBATT VBATT VBATT C C l T 95 36 87 s8 RM t scroll up scroll down 4 i 4 AU vie 7 emt em v20 V38 ei ei e v33 v31 3 6 9 it 100k S mI m m m mI m m mI mI m m mI EL E17 SS L L 10k v13 via vis NG v21 v22 V26 v24 v29 v30 V34 v32 30 31 le S SS Y Y Y Y Y Ey Ey ECT m m EN ah m m NS DN m m m DN 59 10 st st2 BIT x v40 CL190Y6 CL190YG CL190Y6 soft1 soft 2 i 1 peu 808490 SEND END ALPHA TS ella em E EI2 E13 T cli oa E 333 028 Ey L Ey DE On d dr du d r 220 eS SS a TE Sa a BCXI9 BCXI9 BCXI9 BCXIS RIS bes softs soft 4 GND Ju Par L 0 alo alo s a lo le i UP DOWN SOFTRIGHT EIN Ig lg a Ig a amp 3 35 L L lok Lon GND GND GND CIR 318 318 20 a Sat CLEAR SOFTLEFT 109k p e i R21 R22 ono 7 17 813 SCH AT E Ee 4 2mm pda led support ing holes ag i SES are 9629 El92 Onn dome sheet supporting holes X040 X035 LI Lo 8 4 POWER i a LCD foil holes D OFF ON EN E tle ke dai E a Ja L lz mm Lightguide holes c a P Leno CND Amendment 1 04 97 1 DEET 119 120 H aE ela EC AEN el CC Zei 28 aE ES 130g E131 el 3e 133 Page 10 24 Figure 23 UIF Component Lay
41. Y QD CN Qe Gems Qu C eI E e C Security The main view shows a list of applications that can be launched scroll to an application and press Select System Select Security H User data tm Fax modem lt 2 File Transfer Install Remove software E Backup Restore Import Export contacts Y Data removal Settings 000 0 Figure 23 System main view The following applications require connection to a PC and the supplied Nokia connect programme to be running File transfer Install Remove software Backup Restore Import Export contacts The software requires Microsoft Windows 3 1 or later and requires connection to an available serial or infrared IrDA compatible port Press Select and then Settings to define the locking codes passwords etc If the time out locking feature has already been activated the Lock System command in the Security main view will lock the communicator immediately User Data This shows your own contact sheet which is used in fax cover pages Fax Modem Page 28 The communicator can function as a normal 9600 bps fax modem and be utilised by any stand alone PC To change the communicator to a fax modem press Activate Press Disable to disconnect the mode You can connect the communicator to a PC either by infrared or cable connection PC connectivity software not needed Press Settings and then Change When the communicator is used as
42. d iod DU 4 2mm oda lcd support ing holes 5 E28 E29 El92 Omm dome sheet supporting holes E 2 am X040 X035 SN LI a 3 4 POWER e LCD foil holes A le OFF ON II E22 E23 ka sl e 466 2 4mm Lightguide holes 9 323 c p GND GND 100 Original 08 96 Page 10 18 Figure 2 Component Layout Uif Original 08 96 RI V40 R3 KR VI5 VIl VI V38 V17 v18 VI6 Vi VIA v22 LA sD x001 55 R22 R21 R20 RIS RI4 RIB RIO Ril R16 R15 R13 R17 R12 V28 V33 v27 WEI V29 X020 V34 v30 V32 C4 05 C6 C7 C8 Ee e mv ea me E gt N lt SR E ES a 625 O gt E adq ll C 2 EE o CH O al n B IN Y m ea bal ES le ES 20 ko fry C pc PM
43. 0 063 W 0402 R806 1430774 Chip resistor 68k 5 0 063 W 0402 R807 1430762 Chip resistor 2 2k 5 0 063 W 0402 R808 1430734 Chip resistor 220 5 0 063 W 0402 R809 1820024 NTC resistor 47k 5 96 0 2 W 0805 R811 1430774 Chip resistor 6 8 k 5 96 0 063 W 0402 R820 1430762 Chip resistor 2 2k 5 96 0 063 W 0402 R821 1430762 Chip resistor 2 2k 5 0 063 W 0402 R822 1430798 Chip resistor 56k 5 0 063 W 0402 R823 1430770 Chip resistor 4 7 k 5 0 063 W 0402 R824 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 R825 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 R826 1430780 Chip resistor 12k 5 0 063 W 0402 R827 1430774 Chip resistor 6 8 k 5 96 0 063 W 0402 R828 1430786 Chip resistor 18k 5 0 063 W 0402 R829 1430718 Chip resistor 47 5 0 063 W 0402 R830 1430718 Chip resistor 47 5 0 063 W 0402 R840 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 R841 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 R842 1430844 Chip resistor 3 9 k 1 96 0 063 W 0402 R843 1430832 Chip resistor 2 7 k 5 96 0 063 W 0402 R844 1430734 Chip resistor 220 5 0 063 W 0402 R845 1430700 Chip resistor 10 5 0 063 W 0402 R846 1430726 Chip resistor 100 5 0 063 W 0402 R847 1430718 Chip resistor 47 5 0 063 W 0402 R860 1430716 Chip resistor 39 5 96 0 063 W 0402 C200 2310336 Ceramic cap 18p 5 96 50 V 0805 C201 2320544 Ceramic cap 22p 5 96 50 V 0402 C202 2320744 Ceramic cap 1 0n 10 96 50 V 0402 C203 2320744 Ceramic cap 1 0n 10 96 50 V 0402 C204 2320778 Ceramic cap 10n 10 96 16 V 040
44. 1 Dummy Test Battery 9 5 BTD 1C Dummy Test Battery Car Kit 9 6 AJS 1 Assembly Jig 9 7 PFH 1 Hinge Flex Insertion Pliers 9 8 PFS 1 SIM Flex Insertion Pliers ups bas bb naa 9 8 PFL 1 LCD Flex Insertion Pers 9 8 PAS 1 Modified Power Adapter 9 9 HCR 1 Carkit Te EEN 9 9 MJS 1 Module Jig cese eer rrr rte Re eem xm nem tx 9 10 ADS 1 Audio cable Ae e AE ee E e EE RARE EE 9 11 SCF 6 Modular power connector 9 11 D9 D25 RS232 Adapter A lt co sie e e E ERR eee di e eh ds 9 12 E Programmer ee re AE EE RE RP E d IN eds EA 9 12 DAU 2 2T PC link adapter 9 13 Modular T adapter 0 lt ccsatncekcasenovansdendannednubitandaeainas 9 13 PKD 1 Dongle software protection key 9 13 XCM 1 connector cable iiis Ae DN AE NS ENNEN Re d de a Rem as 9 14 DEFEST RS232 9000 cable EE 9 14 Page 9 2 Original 08 96 After Sales Technical Documentation Introduction RAE RAK 1N Service Tools This chapter outlines the service tools and accessories required for the Nokia 9000 Communicator Table 1 Service Tools and Accessories Dummy Test Battery Type code Material code 0770071 Notes reference to mate rial list Without actual battery and with sense lines Module Jig Carkit Jig 0770076 0770074 Carkit Dummy Test Battery 0770072 Assembly jig 0770075 Hinge Flex Insertion Pliers
45. 1 3 Boot Operating System 1 4 Reset Tage 1 5 Exit DOS Testmode 2 Test Peripherals o o o 2 1 TeerCDbanel anaana aaaa nnna Amendment 1 04 97 RAE RAK 1N Service Software RAE RAK 1N After Sales Service Software Technical Documentation 2 2 Test Buzzer 7 51 2 3 Test Power Management Inputs 7 52 24 Test QWERTY Keyboard ode REN SEELEN Ee 7 52 2 5 Test IR Communications 0 0 ccc eens 7 52 26 Test Serial PONS uu ness Gene nap m i Dos modo e Dit SN or t 7 53 3 Flash Utilities see next section Flash Downloading 7 58 4 DRAM Utilities NN NN sels e E ede d RR Gees RR DERE 7 54 AA Test DRAM coc pi xar ei mes Reduce SR EX DR ER d oa ees 7 54 42 Read DRAM E usu reser ex nobi REVERSE RE 7 54 4 3 Write DRAM ge cunda mE dua ah xr RR E 7 55 5 WOSpace Functions 7 55 5 1 Get Post CheckPoint 0 00 c cece cee eee 7 55 5 2 Read VO Port usce Nd eer A EE ee Aa EN EE E 7 55 5 9 Wate VO Port bai corwddd err be Sorores 7 56 5 4 Get Date amp Time ee NEEN chan NEE EE AN EUER IRE 7 56 5 5 Set Date amp Time 0 cnn lees 7 56 5 6 Calculate CheckSum 00 cc eee eee eee eas 7 56 5 7 Target DOSS ell ee e ge eet dE See 7 57 6 Product Information x2 2 d e NES cede R ER Be a d EEN 7 58 6 1 Get Target Info e Ada meu cete ERE EE
46. 3 Testing and Adjustments L Testing and Adjustments 1 1 RF Controls Ad justments Call Simulation Internal fiudio Loop External fiudio Loop Logic Controls Run MCU Self tests Set MCU Start up Self tests p When testing and adjustment menu is selected the phone mode must be set to the Local value If the local mode is not set an error message is shown 3 1 RF Controls C RF Controls 1 Operation Mode Burst Cont TX Data Type 0 1 RND Continuous Mode Channel Klee Monitoring Channel 2 3 4 5 6 8 9 Fi Help tli Move by Line Enter Select GSM Version Page 7 18 ESC Exit Amendment 1 04 97 After Sales Technical Documentation narat ian Mode lt Burst Con TX Data Type 1 RND gt Continuous Mode Channel Channel 2 3 4 5 6 7 8 fi 9 PCN Version RF Control Information Window RAE RAK 1N Service Software When RF controls menu is activated the information window is generated and updated when information is changed This window closes when exiting the RF controls menu The next table shows the information window display on different situations Active Unit 2 TX Operation mode Operation mode BURST CONT TX Data Type Updated AGC Values Removed TX Power Level Updated Continuos Mode Chan Removed nel Updated Channel Updated Monitor
47. 3 66V or the current consumption differs from the normal then check the PDA power unit Check PDA Power Unit The following picture illustrates the troubleshooting diagram that can be used with the PDA power unit malfunctions As a rough check it is good to glance through the power section of PDA module and check that there are no short circuits by alien particles and that no component has burning signs especially tantalum capacitors If yes the fault is most probably cured by replacing that component In such a case it is recommended that the complete power unit check is done after replacing the faulty component If power unit check is not solving the problem there is a possibility that battery line or some regulator output has a short circuit somewhere Vsys is distributed all over the board and it may be difficult to find possible short circuit cause There are test strips going to the edge of PCB in middle layers The strips are cut when the module is cut from the panel in production If the device is used in high moisture environment it is possible that those copper strip ends corrode and form some ohmic short circuit to neighbouring strips Use of glass fibre brush to test strip necks on the edge of PCB is recommended Current supplying capabilities of different regulators are Vsys 500mA VCC5 50mA LCDVEE 5mA Each current is for the specific regulator output voltage VCC5 is linear regulator VSYS and LCDVEE are made by switch
48. 5 4 Get Date amp Time This menu reads the current date and time stored in the RTC CMOS memory The output from the target shows the following Current date and time stored in the RTC 5 5 Set Date amp Time This menu allows the user to set the date and the time to the RTC CMOS memory User options are Date default none Range formatted DD MM YYYY Time default none Range formatted HH MM SS The output from the target shows the following Current date and time stored in the RTC 5 6 Calculate CheckSum By choosing this menu the target calculates a 32 bit checksum of the ROM between given physical addresses If a ready calculated checksum is given as a input it is compared to the one to be calculated If the input checksum equals to zero no comparison is made Page 7 56 Amendment 1 04 97 After Sales Technical Documentation User options are Start Physical Address default 3700000h Start Relative Address default 000000h End Physical Address default 3E00000h End Relative Address default 1FFBFFh Checksum to compare default 00000000h The output from the target shows the following Calculated 32 bit checksum whether the checksums are equal 5 7 Target DOSshell RAE RAK 1N Service Software Range Range Range Range Range 3A00000h 3C00000h 3E00000h 000000h 1FFFFFh 3A00000h 3C00000h 3E00000h 000000h 1FFFFFh 00000000h FFFFFFFFh By cho
49. C080 2610009 Tantalum cap 1 5 t 20 96 C081 2604431 Tantalum cap 10u 20 96 16 V 6 0x3 2x2 5 C082 2310495 Ceramic cap 390 p 5 96 50 V 0805 C083 2610103 Tantalum cap 100u 20 96 16 V 7 3x4 3x4 1 C084 2610105 Tantalum cap 100u 20 96 10 V 7 3x4 3x2 9 C085 2320120 Ceramic cap 22n 10 96 25 V 0603 C086 2310784 Ceramic cap 100n 10 25 V 0805 C087 2310784 Ceramic cap 100n 10 96 25 V 0805 C088 2310784 Ceramic cap 100n 10 96 25 V 0805 C089 2610109 Tantalum cap 22 u 20 96 25 V 7 3x4 3x2 9 C090 2320107 Ceramic cap 10n 5 96 50 V 0603 C091 2320584 Ceramic cap 1 0n 5 96 50 V 0402 C093 2320107 Ceramic cap 10n 5 96 50 V 0603 C094 2320107 Ceramic cap 10n 5 96 50 V 0603 C095 2320107 Ceramic cap 10n 5 96 50 V 0603 C096 2310784 Ceramic cap 100n 10 96 25 V 0805 C097 2320107 Ceramic cap 10n 5 96 50 V 0603 C098 2320584 Ceramic cap 1 0n 5 96 50 V 0402 C099 2320584 Ceramic cap 1 0n 5 96 50 V 0402 Page 38 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists C130 2310784 Ceramic cap 100n 10 96 25 V 0805 C131 2310784 Ceramic cap 100n 10 25 V 0805 C132 2310784 Ceramic cap 100 n 10 25 V 0805 C133 2310784 Ceramic cap 100 n 10 25 V 0805 C134 2310784 Ceramic cap 100 n 10 25 V 0805 C135 2310784 Ceramic cap 100 n 10 25 V 0805 C136 2320131 Ceramic cap 33 n 10 16 V 0603 C137 2320131 Ceramic cap 33 n 10 16 V 0603 C139 2320560 Ceramic cap 100 p 5 50 V 0402 C140 2320131 Ceramic cap 33 n 10 16 V 0
50. DEC MCU amplifier VF Figure 2 Power Distribution Diagram Original 08 96 Page 2 17 RAE RAK 1N Baseband After Sales Technical Documentation Clocking scheme DSP Clock 60 2 MHz differential sine wave RF System Clock 26 MHz RFI Clock 13 MHz Sleep Mode 135 4kHz enable OSCILLATOR AUDIO TENES SIMCLK 3 25 1 625 MHz MCU Clock 26 MHz Codec Sync Clock Codec Main Clock 8 kHz and data Transfer MCU Clock clock 13 MHz 512kHz DBUSCLK 512kHz DBUSSYNC 8kHz lt Figure 3 Clocking Scheme Most of the clocks are generated from the 26 MHz VCXO frequency by the ASIC Page 2 18 26 MHz clock for the MCU SCL divides this by two and supplies a 13 MHz clock to the MCU 13 MHz for the RFI The ASIC also generates 135 4 kHz sleep mode clock for the RFI 3 25 MHz clock for SIM When there is no data transfer between the SIM card and the baseband the clock can be reduced to 1 625 MHz Some SIM cards also allows the clock to be stopped in that mode 512 kHz main clock for the codec and for the data transfer between the DSP and the codec 8 kHz synchronisation clock for data transfer between the DSP and the codec 512 kHz clock and 8 kHz sync clock for the DBUS data transfer Original 08 96 After Sales RAE RAK 1N Technical Documenta
51. EMI over LOD S Slsiels QWERTY keypad gt Soe EE Oooo mesue LILILIES CMT e O PU beh one get Figure 1 PDA Interconnection diagram Modes of Operation In principle there are four different operation modes fully on mode CPU core off mode NAP SUSPEND mode power supply off Battery removed The PDA module is always powered when a battery with adequate charge level is connected Power saving in different modes is achieved by disabling clocks from functional blocks in an advanced manner In the FULLY ON mode all circuits are clocked in the NAP mode the CPU core is not clocked but all other circuits are clocked normally In SUSPEND mode only the Real Time Clock RTC is clocked DRAM is in self refresh mode when the system is in SUSPEND mode Asynchronous events e g key presses and the lid being opened closed are able to wakeup the system from NAP and SUSPEND modes RTC is powered from the main battery as long as possible in power supply OFF mode RTC is powered from the primary type of the backup battery Page 6 6 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware DC Characteristics Table 2 Supply Voltages and Power Consumption Line Symbol Typical Maximum Unit Notes Nominal EET 8 7 0 34 CMT Hardware limit 5 5V 7 2V 7 6 0 3V CMT Hardware limit during a call 4 49V 5 0V 5 1V PDA Hardware limit 5 EM PDA Hardware limit cancel remo
52. Maximum Unit Notes Nominal Supply current Transmit Frequency Input m Maximum Unit Notes Nominal omues 1 92 Is LOinputresisence w 39 Is LOinputeapactance 4 Je Modulator Inputs UO Typical Maximum Unit Notes Nominal Input ae range Input GE balanced Page 3 18 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation HF Table 11 CRFRT TX part specifications continued Modulator Inputs UO Typical Maximum Unit Notes Nominal Available linear RF power O ao S dBm ZiL 50 ohms Available saturated RF pow Rae A dBm ZiL 50 ohms er Suppression of 3rd order 35 prods Carter suppression 3 e Single sideband suppression dB Noise floor Pout 18 dBm dBm Hz avg Noise floor Pout 24 dBm dBm Hz avg Noise floor Pout 30 dBm dBm Hz avg Noise floor Pout 40 dBm dBm Hz avg TX 1 Q phase balance deg Tolerance over temp range deg TX 1 Q amplitude balance o dB Tolerance over temp range dB Upconversion mixer The upconversion mixer is a single balanced passive diode mixer The local signal is balanced by a printed circuit transformer The mixer upconverts the modulated IF signal coming from quadrature modulator to HF signal Parameter Typical Maximum Unit Notes Nominal RX frequency range LO frequency range IF frequency Conversion loss 6 0 7 0 IIP3 GSM 0 0 dBm PCN 0
53. Operation quick charge lt 0 5 2 5 h trickle charge Protection input fused output current limit Connectors output 3 8 mm standard DC plug input D 21 23 mm Weight 120g Cable 2 m curly cable NOTE The current version of LCH 2 does not indicate led illumination in a correct way what is the status of the charging with Li batteries For quick car installation the user can utilise the Cigarette Lighter Charger LCH 2 Power Adapter PAR 1 and RS232 serial cable DLR 1 Mobile Holder MBR 1 cannot be used in this context After Sales RAE RAK 1N Technical Documentation Accessories Serviceable Accessories Spare Battery Charger DCH 4 0675107 Purpose BLK 4S stand alone charger for spare batteries Charger type Linear mode power supply Operation quick charge 2 5 h DC connector DC jack thr hole for DC connector 3 8 mm in ACP 3 HEC2781 010010 Battery connector 4 pin spring Oper input voltage 12 Vdc 1V Weight 61g Input current 800 mA 80mA Charging temp 0 45 C The DCH 4 Desktop Charger is designed for standalone charging of a spare battery which is only the Lithium type specified for the phone There is no battery type detection in the desktop charger In a standard configuration rapid charging is possible by connecting the desktop charger to an ac power outlet via a suitable constant current ac adapter ACH 4 ACP 3 This is connected to the dc connector X130 Figure 6 Spare battery Charger DCH 4 Ori
54. PDALCD KEYD 2 0 KEYS 1 0 Output low Output high Output low Output high Input low Input high PDA Dis play on control signal Keymatrix drive lines Keymatrix sense lines AC Characteristics Table 7 Audio Signals Pin Type Line Symbol Minimum 1 2 3 B2B PHFMICN 4 B2B PHFMICP Typical Nominal D MVims Maximum Unit Notes 19MVims Differential 200 MVims 530 MV ms p Heron Joes L tze ie Hsc SYSEXTMI 200 Vine ie uersc svsextEAR 180 mano 500g Note 1 B2B Board to board connector between PDA and CMT modules Note 2 SC System Connector Original 08 96 Page 6 13 RAE RAK 1N PDA Hardware Connectors Connectors Inside Transceiver Unit After Sales Technical Documentation Table 8 PDA board to board connector Signal Name Pin ote V 1 44 B GND 2 5 7 10 13 21 22 23 37 39 40 PHFMICN Battery voltage PHF microphone negative node PHFMICP PHF microphone positive node BACKLIGHT Backlights on off RBUSRxD RBUS receive CMT lt PDA or test RBUSTxD VL1 11 RBUS transmit CMT PDA or test Logic supply voltage 4 75 5V XPWRON 12 Power key active low VCHAR 14 31 Battery charging voltage 2 pins needed BUZZEROUT 15 Buzzer signal to buzzer on SIM module VF 16 Programming voltage for flash Lines for keypad wr
55. R552 1430788 CHIPRES OW06 22K J 0402 R553 1430770 CHIPRES 0WO06 4K7 J 0402 R554 1430770 CHIPRES OWOG 4K7 J 0402 R555 1430788 CHIPRES OW06 22K J 0402 R556 1430770 CHIPRES 0WO06 4K7 J 0402 R557 1430730 CHIPRES 0W06 150R J 0402 R558 1430732 CHIPRES 0W06 180R J 0402 R559 1430740 CHIPRES OW06 330R J 0402 R560 1430764 CHIPRES OW06 3K3 J 0402 R561 1430792 CHIPRES 0W06 33K J 0402 R562 1430754 CHIPRES 0WO06 1K0 J 0402 R563 1430728 CHIPRES OWOG 120R J 0402 R564 1430738 CHIPRES OW06 270R J 0402 R565 1430754 CHIPRES 0WO06 1K0 J 0402 R566 1430754 CHIPRES 0WO06 1KO J 0402 R567 1430728 CHIPRES 0WO06 120R J 0402 R568 1430734 CHIPRES 0W06 220R J 0402 R569 1430754 CHIPRES OW06 1KO J 0402 R570 1430726 CHIPRES 0W06 100R J 0402 Amendment 1 04 97 Page 21 After Sales RAE RAK 1N Parts Lists Technical Documentation R571 1430762 CHIPRES OW06 2K2 J 0402 R572 1430276 CHIPRES 0W06 47K G 0603 R573 1430778 CHIPRES OW06 10K J 0402 R574 1430778 CHIPRES OW06 10K J 0402 R576 1430770 CHIPRES OWOG 4K7 J 0402 R577 1430792 CHIPRES 0W06 33K J 0402 R578 1430794 CHIPRES OW06 39K J 0402 R579 1430778 CHIPRES OW06 10K J 0402 R580 1430790 CHIPRES 0W06 27K J 0402 R584 1430310 CHIPRES OW06 75K G 0603 R601 1430762 CHIPRES OW06 2K2 J 0402 R602 1430762 CHIPRES OW06 2K2 J 0402 R603 1430762 CHIPRES OW06 2K2 J 0402 R701 1430832 CHIPRES OW06 2K7 J 0402 R702 1430770 CHIPRES 0WO06 4K7 J 0402 R703 1430710 CHIPRES OW06 22R J 0402 R704 1430740 CHIPRES 0W06 330R J 0402 R705 1430730 CHIPR
56. RS Buffer Fault In the case that the signals seem to stop to the buffer D130 although the buffer control signals are set OK then the buffer is likely to be defective Page 8 22 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 1 7 3 Activity in CPU TxD0 If the CPU receives the pings then it should send acknowledgements through the RS buffer to the service software If the RSTXD line is not toggling but the RSRXD is then proceed to 1 7 1 1 If the RSTXD line is toggling but the TXD is not then go to 1 7 2 1 2 Troubleshooting Diagram of the POST Code If the communications channel between the PDA and the service software can be established the last checkpoint passed during POST can be retrieved from the PDA The list of the POST codes is in appendix B 2 1 Read POST Checkpoint In order to read the POST checkpoint choose the Get POST Checkpoint menu in the PC Locals 2 2 POST code OK If the checkpoint is right i e equal to the one last in the list the POST has completed successfully and there are no bad errors in the internal parts of the CPU and none in the DRAM If the checkpoint differs from the one that is expected then refer to the checkpoint list The possible errors can be divided mainly into two groups CPU and DRAM related errors 1 Read POST checkpoint 2 POST code OK YES POST Code OK Refer to the Checkpoint list Original 05 97 P
57. Transistor BC858B BCW30 pnp 30V 100mA SOT23 Zener diode BZX84 5 4 3V 0 3 W SOT23 MosFet BST82 n ch 80V 175mA SOT23 Transistor BFS17 npn 15V 50mA SOT23 Transistor BFS17 npn 15V 50mA SOT23 Transistor DTA114EE pnp RB V EM3 Transistor BC848W npn 30 V SOT323 Sch diode x 2 BAS70 07 70V 15mA SOT143 Transistor BC848W npn 30 V SOT323 Transistor BC858B BCW30 pnp 30V 100mA SOT23 Transistor BC858W pnp 30V100mA 200MWSOT323 Transistor BC859C pnp 30 V 0 1 A SOT23 Transistor BC849C npn 30 V 0 1 A SOT23 Transistor BC848B BCW32 npn 30V 100 mA SOT23 Precision voltage reference 4 096 4 096 Sch diode x 2 BAS70 07 70V 15mA SOT143 Transistor BFP182 npn 20V 35mA SOT143 Transistor BC858W pnp 30V 100mA 200MWSOT323 Transistor BC848W npn 30 V SOT323 Sch diode x2 4V 30 mA SOT23 Transistor BFR93AW npn12 V35mA SOT323 Transistor BFR93AWnpn 12V 35mA SOT323 Transistor BFR93AWnpn 12V 35mA SOT323 Sch diode x 2 BAS70 04 70V 15mA SERSOT23 Transistor BFR92A npn 15 V 25 mA SOT23 Transistor BFR92A npn 15 V 25 mA SOT23 Amendment 1 04 97 After Sales Technical Documentation V726 V735 V736 V737 V738 V755 V756 V765 V766 V767 V768 V780 V800 V801 V802 V840 V841 V842 D300 D301 N230 N400 N551 N601 N820 X201 X202 X212 X400 X501 X503 MCM1 MCM2 4210102 4210100 4217070 4210102 4210090 4210102 4210133 4210100 4210100 4100285 4210135 4110014 4110081 4210066 4210066 4210066 4210066
58. UCS Flash chip If the device has some functionality then the following components along with the ones above can be tested DRAM chip CS1 and CSO Flash chips RS buffer buzzer IR tranceiver keyboard LCD module Original 05 97 Page 8 9 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation PDA Troubleshooting Diagram The highest level of PDA troubleshooting is shown in the following flow chart All diagrams assume that the unit has been checked for short circuits and loose pins C PDA MODULE CHECK Connect VBatt NO Current See Power On consumption fi i ES malfunctions Respond to PCLocals POST code check See Power On malfunctions Keyboard check InfraRed check OS BOOT GEOS Usage Test Page 8 10 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly The module check begins with connecting the supply voltage to the PDA If the current consumption differs a great deal from the normal limits proceed to the Power On check If current consumption is OK the service software should connect to the PDA If the target PDA does not respond to the pings from the host check the Power On procedure When the PDA responds further tests may be carried out the execution order is not significant and it may be changed After all the functional tests are worki
59. When plus lt gt or minus lt gt key is pressed both values are changed to the same direction If another value is in the limit value it does not change but the other value will change Page 7 26 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Tune Amplitude Difference When this selection is made the user can increase or decrease the amplitude difference within 0 1 dB steps The current amplitude difference is shown on the tuning window with numbers and a bar figure Tune Phase Difference When this selection is made the user can increase or decrease the phase difference within 0 5 steps The current phase difference is shown on the tuning window with numbers and bar figure After each value change the new values are sent to the phone The following is requested when TX Q tuning function is ended Write values to EEPROM y n Amendment 1 04 97 Page 7 27 RAE RAK 1N After Sales Service Software Technical Documentation 3 2 4 RSSI Calibration When function is activated the selected channel is checked If none of the receiving channel numbers from 50 to 70 in GSM mode and 670 to 730 in PCN mode is selected then an error message is shown and the user is asked to change the channel to the valid receiving channel area The following automatic selections are made when this tuning function is activated Active Unit RX Operation Mode Continuous The next w
60. a 6 i 12k 12k 33k 12k 12k R6 9k mo 5 ee dch d dis MI 2 I8 5 v2 GND 185 V3 cole A col 2 13 3 V5OUT col 3 14 10 C1 backl ight 13 Be T xpuron 15 c2 HH VCI CND i 4u7_16V E ie leddd teddi 13 i R W t cdd2 28 i EN l cdd3 24 KS DO D az SES M D D e 26 22 D5 RE A 23 DS cdvee 28 T 24 D7 E 2 Bo keud 90 28 keude 21 VBATT VLI Loy keus0 32s keust e GND E Jo en lee jes Es les es ler lee leo lero en PHONE LCD CONNECTOR l VBATT RS RW EN D4 D3 D DI PAD LCD CONNECTOR BACKLIGHT VL L o X010 GND gt dispoff fp lo 1 4 7 go Ze clk WI 5 cdd 10k E cadi L d T ledde ET C27 C26 8 Ledd3 81 se 3 84 RIS 220 220 3 lcdvcc 1 GND 100k OND CND 11 Ledvee 2 5 8 0 L BE 12 VBATT VBATT VBATT VBATT 10 5 s ei m a 1 Scroll ue scroll down zi i A vii mz v7 VIS vis v20 v38 V23 v27 v28 v33 ve 3 6 o D 100k Z Y mI m Y Y m mI Y a y Y y 45x Po 7 10k y Vis me gy VIS em v22 ID ei ez mi ein em LU SS m m w xt Pu P w Ps S P lt E sg 10 si 12 T 4 Joss CL190YG CL190YG CL190YG soft 1 soft L A A A L E SEND END ALPHA La ul s E12 13 AL b L L CUT vr se so Bag 7 y de ln dv DOE O du 220 BCXI9 BCX19 BCXIS BCXI9 14 15 518 E Jon CND m soft 3 Se soft 4 ono A 5 P DOWN SOFTRIGHT 108 8 12 ES 8 2 8 8 8 34 35 us Lon Lon Lo Lu GND gt g RIA 18 18 820 SN Bag CLEAR SOFTLEFT bu 220 R21 R22 LOND A 47 4 17 313
61. and infra red IR transceiver circuit A simplified functional diagram of the modular structure is illustrated below The figure also includes the unit s external interfaces Original 08 96 Page 1 11 RAE RAK 1N After Sales Overview Technical Documentation KEY Co Axial antenna connection VA Wired Connections GS Wireless connections IrDA SIR LZ External RF connector CMT module GES Figure 3 Modular Structure Product Variants The NOKIA 9000 communicator has the type designator RAE RAK 1N where RAE refers to the GSM version and RAK the PCN version The table below shows the variants that apply to this product these variations only affecting the QWERTY keymat layouts illustrated in Figure 4 overleaf Table 4 NOKIA 9000 communicator Product Variants Type Designation Language Version RAE RAK 1NA UK English RAE RAK 1NB German RAE RAK 1NC French RAE RAK 1NE Scandinavian Page 1 12 Original 08 96 After Sales RAE RAK 1N Technical Documentation Overview U K i l i T 3 813 or ss gx rey ee oo scis FE E gt CIA 049 AE AA CHE poc Cal eas A 8 2534 3 amp 4 0 RE co ICC sow ee Le TO IE 723 Ee 2 ES ED 453 en
62. ono ono v87 R95 80848u 100k rech R65 E CC t C98 zT 560k ino E C99 3 le alg ind 4 GND 8 VPON ono eND Lomp R75 p Im LMCB762BIMK N82 T y us z le sl g z PIRE SRE rel ces d 882 58 Lem Lem Lem Lem Lem Original 05 97 Page 10 4 RAE 1N Figure 3 PDA Serial Interface SIRU Edit 24 for layout 13a VSYS VSYS Yos a N180 a die z a TFDS3000 C180 IRSHDE d i Jm 8 gute i L vers RSTXDL gt f n GND cies 100n D180 CND as E 100n C183 E 100n 0184 TE d 100n e C gt TXD L RSENXC gt L RSRXD RSSHDXL RXxDE gt Original 05 97 Page 10 5 Figure 4 PDA MCU and Memory PROCU Edit 121 for layout 13a RAE 1N LLIDOPEN E Sean an D130 FA80386BXSB 25 DISPD3 DISPD2 DISPD1 DISPDO DISPCLK C gt LCDDCG3 0 LLCLK LFS DISPON PWMOUT LCDVCCON LCDVEEON LE LK P
63. oo Lem Lomp oe Le Lon USTROBEX irox 27 n MCUDAS RESETX 112 Ee MCUDAS PCMCDO 30 MCUDA 10 R421 GND GND GND RSTROBEX d MCUDA11 Wurt 35 8 B 5 S WSTROBEX MCUDA 12 im gt CHRDIS NCUDA13 MCUDACIS 8 MCUDA14 FROM TO CTRLU MCUAD 4 0 MCUDA 15 gt JCONN dee FROM TO E NCUAD Mise R341 MRBUSDET 32 MCUAD3 smeLk 94 KE P 1 PCMCDI MCUAD4 SIMRESET 90 R342 Ke N PCMCLK SINPUR 92 i N XSELPCMC C 6T R360 R361 MCUADC16 gt COAT Wo 68 ae es 3 Si VG FOE MCUAD 18 uir2 69 R344 DED A VLI VLI S NCUAD 19 UIF3 BATDET 38 VA pt T M9 MRBUSDET UIF4 D 2k R345 B C360 P 31 PCMCDI vIFS 72 a 5 220 ony safle 33 PCNCLK ure D R346 opo ON Eil ae XSELPCMC COLO E E i f i BN E BATDETX COL e d 287 Qu coco 64 E gt 2k2 5 BC849C v370 91 65 3 AR cado P cs cod P codo P ca P caso P o b galla 56k we j l 1000 1000 1000 1000 1000 100 1000 gt UIF 6 8 cs a tL 0393 P R373 Lo eenn Lon Le Le CND CND d P EP 180 i 8375 w TEST_IF mp eae E o P o4 gt C390 y Die H C F F er F COLC3 0 GND GND GND 100k Lond d L afie EW INS 1680 1000 cup 12 onn 1000 Tou see R363 dp o 2 2 S Ke eg H C384 um 18 pBUSRDA DBUS DBUSTDA T6 n MET R365 MICP gt gt iid m ceuscLk 15 Dok C385 A ogussywe T m tko R366 R367 gt 33n 23 Jus Ca gt Dm MICN m 24 June AUDIO xXEAR 107 ko o 33n XMICP EARP gt F C386 2 XMICN EARN C361 c C362 E C363 gt o x 28 PHMICP MICEN
64. 0 8V State 0 Original 08 96 Page 6 11 RAE RAK 1N PDA Hardware 6 3 UIF After Sales Technical Documentation Table 6 DC characteristics of LCDM flex connector on PDA module Line Symbol LCMUIF 3 0 LCMUIF4 Output Input low Output Input high Output Input low Output Input high keypad row lines display data lines keypad row read write strobe for LCD driv er 15 UIF 16 UIF LCMUIF5 LCMUIF6 LCMCOL 3 0 BACKLIGHTO LCMXPRON Output Input low keypad row LCD driv 4 80V 4 95V Output Input high Output Input low Output Input high Output Input low Output Input high Output low back lights off Output high back lights on Input low power on off Floating when inac tive A pull up in PSL er register select enable strobe for LCD driv er Display and key pad illu mination control Power ON OFF key 21 18 PDALCD 22 PDALCD 23 PDALCD LCDD 3 0 Page 6 12 Output low PDA Output high Output low Output high Output low LCD Data lines PDA LCD Line pulse PDA Output high LCD Pix el clock Original 08 96 After Sales RAE RAK 1N PDA Hardware Technical Documentation Table 6 DC characteristics of LCDM flex connector on PDA module continued Line Symbol Zot PDALCD Output low Output high PDA LCD Frame Pulse 26 DISPON
65. 0 dBm LO power level GSM 3 0 dBm PCN 3 0 dBm Amendment 1 04 97 Page 3 19 RAE RAK 1N After Sales RF Technical Documentation 1st TX buffer The TX buffer is a bipolar transistor amplifier It amplifies the TX signal coming from the upconversion mixer Table 12 1st TX amplifier specification Parameter Typical Maximum Unit Notes Nominal Operating freq range GSM 890 915 MHz PCN 1710 1785 MHz Supply voltage 4 25 V Current consumption 4 5 i mA GSM PCN Insertion gain GSM 12 dB PCN 11 dB Input VSWR Zo 50 ohms Matched to the mixer Output VSWR Zo 50 ohms TX interstage filters The TX filters reject the spurious signals generated in the upconversion mixer They also reject the local image and IF signal leakage and RX band noise 2nd TX buffer The TX buffer is a bipolar transistor amplifier It amplifies the TX signal coming from the first interstage filter Table 13 2nd TX amplifier specification Parameter Typical Maximum Unit Notes Nominal Operating freq range GSM PON Supply voltage Current consumption GSM PCN Insertion gain GSM PCN Output power Zo 50 ohms GSM PCN Page 3 20 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation RF Power amplifier The power amplifier is a three stage discrete amplifier It amplifies the 0 dBm 2 dBm in PCN TX signal to the desired output level It has been specified for 5 5
66. 0402 R115 1430746 Chip resistor 560 5 0 063 W 0402 R116 1430746 Chip resistor 560 5 0 063 W 0402 R117 1430746 Chip resistor 560 5 0 063 W 0402 R118 1430746 Chip resistor 560 5 0 063 W 0402 R119 1430746 Chip resistor 560 5 0 063 W 0402 R120 1430788 Chip resistor 22k 5 96 0 063 W 0402 R121 1430788 Chip resistor 22k 5 96 0 063 W 0402 R122 1430788 Chip resistor 22k 5 96 0 063 W 0402 R123 1430788 Chip resistor 22k 5 96 0 063 W 0402 Amendment 1 04 97 Page 35 After Sales RAE RAK 1N Parts Lists Technical Documentation H124 1430788 Chip resistor 22k 5 96 0 063 W 0402 R125 1430788 Chip resistor 22k 5 96 0 063 W 0402 R126 1430788 Chip resistor 22k 5 96 0 063 W 0402 R127 1430788 Chip resistor 22k 5 96 0 063 W 0402 R128 1430788 Chip resistor 22 k 5 0 063 W 0402 R129 1430788 Chip resistor 22 k 5 0 063 W 0402 R130 1430800 Chip resistor 68 k 5 0 063 W 0402 R131 1430800 Chip resistor 68 k 5 0 063 W 0402 R132 1430800 Chip resistor 68 k 5 0 063 W 0402 R134 1430788 Chip resistor 22k 5 96 0 063 W 0402 R135 1430804 Chip resistor 100 k 5 0 063 W 0402 R136 1430778 Chip resistor 10k 5 0 063 W 0402 R137 1430760 Chip resistor 1 8k 5 0 063 W 0402 R138 1430804 Chip resistor 100 k 5 0 063 W 0402 R139 1430802 Chip resistor 82 k 5 0 063 W 0402 R140 1430135 Chip resistor 10M 5 0 063 W 0603 R141 1430135 Chip resistor 10M 5 0 063 W 0603 R143 1430788 Chip resistor 22k 5 96 0 063 W 0402 H145 1430804 Chip resistor 100 k 5 96 0 063 W 0402 R
67. 0730077 Spare battery charger DCH 4 0675107 To be used with ACH 4x Original 08 96 Page 1 15 RAE RAK 1N After Sales Overview Technical Documentation Technical Summary The transceiver electronics consist of the following modules PDA PIM amp extended UI control Radio System RF System blocks UIF SIM and audio submodule The UIF Module is connected to the PDA module with a flex cable and a connector The PDA module is connected to the Radio System Module using a 44 pin board to board connector The System block Baseband and RF modules are interconnected with PCB wiring and the transceiver is connected to accessories via a bottom system connector plus an RF connector in the other end of the device An IR eye for wireless data exchange locates to the same end as the external HF connector The PDA module provides the hardware platform for the extended UI with an integrated CPU and peripheral control IC E3G memories DRAM Flash power circuitry SMPS IR electronics and external RS buffering The PDA power supply generates power for Graphical LCD 22V Basic PDA logic 3 3 V Flash programming dynamic 5V The System block contains the MCU and DSP environments System BB IC D2CA memories audio processing and RF interface hardware RFI On board power supply circuitry delivers operating voltages for both System and RF blocks The general purpose microcontroll
68. 08 96 Page 2 27 RAE RAK 1N After Sales Baseband Technical Documentation If the phone is in power off state the PSL will detect the charging voltage and turn on the phone If the battery voltage is high enough the reset will be released and the MCU will start controlling charging If the battery voltage is too low the phone stays in reset state and the charging control circuitry will pass small charging current to the battery When the battery voltage has reached 5 5 V 0 2 V the reset will be removed and the MCU starts controlling charging MCU controls the charging with pulse width modulation output Charging voltage is limited by hardware in normal operation to 8 9 V and during a call to 7 6 V Battery and charging voltages are calibrated in production 6V is fed to the battery and charger pin and the MCU s A D converter values are stored to EEPROM Main components PSL ASIC N230 Generates voltages contains power on switch charger and battery voltage detector and watchdog transistors BCP69 25 V250 BCV27 V253 V254 BCW30 V255 and Schottky STPS340U V251 These components are used for implementing the charging switch transistors BCX51 V231 and BCP69 25 V230 V232 External output transistors for VL1 VL2 and VA3 regulators in PSL DSPU Introduction The DSPU performs of the low level digital signal processing and control tasks required in channel monitoring and speech and data calls Th
69. 1 LOMCON LCD module connector on PDA module Table 25 Electrical characteristics Parameter Typi Units Notes conditions cal Input voltage 11 0V V maximum no harm range of VB voltage of VB line Battery voltage y 7 2 8 8 V max voltage is during charge pulses with cycled battery VSYS shut 5 0 V VB for shutdown operation down 6 0 V VB for cancel of shutdown 3 465 V tolerance over temperature and load range 450 mA output current regulator Imax 500mA efficiency at l5 2200mA VB 6 0V Li efficiency at l5 2200mA VB 8 0V efficiency at lou 10MA VB 8 2V efficiency at loy 10mA VB 5 5V mV output voltage ripple E 3 supply current no load connected 212 5 oscillator frequency LCDVEE 25 depending on temperature typical value at room temperature 3 5 output current regulator Imax 6mA efficiency at lou 2MA VB 7 2V 250 output voltage ripple supply current no load operation frequency Page 6 40 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware Table 25 Electrical characteristics continued Parameter tolerance over temperature and load range dropout voltage at I 50mA regulator Imax 50mA peak current 100mA ground pin current supply current PWRGOOD reset threshold at room temperature power on reset pulse width reset threshold temperature coefficient nominal load when used capacity charging not po
70. 1 otherwise continue to 5 3 2 Disconnect LIDOPEN from the CMT Module In order to isolate the fault to the PDA module disconnect the CMT module Proceed back to 7 1 CPU pin 127 Toggling Check if the CPU pin 127 toggles according to the lid switch The toggling can be checked by moving a magnet on the S170 or just by short circuiting it If the pin does not toggle then proceed to 5 3 3 otherwise go to 5 3 2 1 CPU Fault If the CPU pin 127 PMIO or pin 128 PMI1 is toggling while the PMI test is armed and the PCLocals reports the test to have been unsuccessful then it is likely that the CPU is not working correctly Check S170 R149 R150 R151 C139 If the signal is not toggling change the faulty component Cover Opened and Closed Repeat the test switching the cover to the opposite position i e opened close and closed open Goto 5 5 Start the PMI Test Start the PMI test by choosing the PMI test in the service software Give a reasonable time out value within which the interrupt is likely to occur Page 8 32 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 5 6 5 7 5 7 1 5 7 2 5 7 3 5 7 3 1 5 7 3 2 5 8 Toggle Phone ON OFF In order to generate an interrupt toggle the CMT module ON or OFF NOTE the CMT switches OFF several seconds after the power switch has been pressed PMI Test Successful If the service software reports the PMI
71. 1000 1000 eno Lovo VCHAR pi S L VCHARO 1 gt CHRCDETO 33k V250 US X Duos STP5340U VCHARL gt R263 1 L ve R251 alls 10k S ja D S Gel aks 09 JE el R253 Qul 10k 3k3 Ton V254 V253 D Bev27 LND LO GNL n SIS e 8 R265 B0N30 ei g e D S XREST Dis ver A 10k a 22k BZX84C4V3 R258 GND 180R allg i 9 ig R260 R261 nel PWML gt 5 de 2k2 2k2 R262 y S l R271 180R IBS IL 3 C251 220 cy eno GND GND GND VOLTLIML gt Ka cHeoIsE gt CHRDET Original 08 96 Page 10 13 RAE 1N Figure 4 Baseband Circuit Diagram M
72. 12 2 Troubleshooting Diagram of the POST Code 8 23 3 Troubleshooting Diagram of the LCD Check 8 24 4 Troubleshooting Diagram of the Duzzer o 8 29 5 Troubleshooting Diagram of the PMI Check 8 31 6 Troubleshooting Diagram of the Keyboard 8 34 7 Troubleshooting Diagram of the InfraRed Check 8 37 8 Troubleshooting Diagram of the RS 232 Check 8 40 Appendix A M 8 42 APPS Basis p apr pP rb ERA ode pop 8 43 Figures Figure 1 LCD UI Module disassembly Luussuss 8 5 Figure 2 System Module disassembly Lussuuusuuus 8 7 Page 8 2 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly General The purpose of this document is to provide methods of finding component malfunctions in the PDA module of the Communicator Note Due to the large integration scale used it is not always possible to pinpoint the faulty component However the flow diagrams introduced here should act as a useful guide for these purposes Required servicing equipment PC for the service software power supply RS cable digital multimeter oscilloscope frequency counter optional Original 05 97 Page 8 3 After Sales RAE RAK 1N Faultfinding Disassembly Technical Documentation Disassembly Procedure LCD UI Module Disassembly see fig 1
73. 1N After Sales PDA Hardware Technical Documentation The controller has internal 1 23V bandgap reference and soft start circuitry for power up Overcurrent comparator disconnects the controller in short circuit conditions After this soft start cycle is made in power up Output ripple voltage is determined by output capacitor ESR value which is minimized to reduce EMI Shutdown mode is used when battery voltage decreases down to 5V to prevent battery from overdischarge In shutdown all circuits are in lowest power state LCDVEE regulator LCD bias voltage is made by step up dc dc controller Control scheme is current limited pulse frequency modulation PFM External switch transistor and current sense resistor are required Maximum inductor current goes through current sense resistor Because required regulator output current is small 3mA resistor value is selected so that current through inductor is low to reduce EMI Also switch transistor ON resistance need not be lowest possible Pulse frequency control is made without oscillator maximum on time and minimum off time are used in pulse control When output voltage is out of regulation the switch turns on and it stays on until maximum on time turns it off or inductor current reaches its maximum value set by current sense resistor When the switch turns off minimum off time is waited After this the switch stays off until output voltage drops out of regulation This control results curr
74. 2 8154 Sl 9058 e 08L2 Ell gos a NI O gt 8 T Se ag o o AF ED o Rei EE G D ZU tog D 062 CJ BDS 6863 Page 10 12 Original 08 96 Figure 3 Baseband Circuit Diagram PWRU RAE 1N Gah On N230 NMP75588 Lon XPWRON T XPHROFF ES XRES al VBATT D gt gd on S i 3 v230 vBATTC 1 BCP9 25 NN E 1230 3 8 17 t Di INE 226R 100MHz 16 e lg 2 E Al X co Fer i S Jl SL C231 C030 C233 M l u7 p l n ITV w 23 OND OND FE 15 SIS 14 v231 SM 13 B051 i n i L231 GND GND z O gt n Lon e Z26R 100MHz SIS mga al S 0250 AL C234 ol oe 237 0238 233 10n 0243 pa i 447 101 OND CHRGDET IL Ind dn 100 MIO 47 10 4u7_10 BCPG9 25 joo enn Lo Lon oo Lon ve r L5 va3 Z26R 1 00MHz C044 024 alu al 8 8 3 SE LU OND GND t L5 VM D ve R232 gt VREF 100k l gt VBATDET R233 004 ES D l n oui 0248
75. 2 7 Acting Dead MOS iiec dede dh ugue REESE E PEE DEAE Rea 2 7 Power Off EE 2 7 Performance Specifications 0 cece ee eee eee eee 2 7 Bere cocil a PT 2 7 AC Clialactensies cme cuadin d nod abe ha eet erg ree alas bese 2 11 CONMGCIONS x x sees EEN ee E NEE el EEN Ee SE 2 14 Connectors to other modules of the product 2 14 Connectors out of Transceiver Unit 2 16 Internal Signals and Connections 2000 cece eee eee 2 16 Circuit Descriptions si bebes rr e bb ERES RR ERES 2 17 POWer DISIIDUNOR s 253 2e aua dep Rue EE DURER RE DESDE rd DRE Es 2 17 Gl cking SCHEME Pur 2 18 Reset and power control 2 19 Watchdog system EE 2 20 CTRL ta O EE 2 21 ig AA A FU Rei ERE a 2 21 Technical specifications 2 2 24 ue e repa RR ER Rh daege aus 2 21 BIDEK d scNphoN sos coorrisis puros cies obs edi 2 23 Memory Map setos proble is etre bu e 2 23 Main components aeuum e RARE Ee FRATFEETEFDL BK CREE xn 2 26 PWRU P etna rd 2 26 IMMOGUCUION esas cede oua dte eei RE RINSASERRERIAW E E EARN 2 26 Technical description uu duce urat e dune ura mnis tere dass n p Paga 2 26 Block descripllOnt uso ches cade porter br RE Reel Sis 2 27 Mam COMPONCHIS sree griei ori RUE NEU Fan a aid 2 28 Bus MCCP 2 28 leide deco EE 2 28 Technical description iau sodes desQeRE eR REESE a S 2 30 Block deserit cea
76. 2 Dies 9162 6092 Ss LYS G4G2 M3 e E Las 0 58 Se a cay Es DS 2 BS PF 724 mm TC bh 6768 E al eS zl T gros S C959 Sl E 338 esT S S ccr METTI o XL 1788 E x E ER 6092 5 178 EA Sr e rs f cc co pes a e eis c S amp Ee 3 RS E ND ES a 9 lel pamik Sb eo Hor RR 2 8062 65 2 E YESO 69 2 Bo SS Ges 5 o e c LOS XI EX 2 6982 E 7082 S E z 2280 x gane Se ra SGH D Sn 299 HUE 8 9L Sl yzo ded CH E Ig le eo go a 9119 x id BLA SES n S al m x i 2 UE 6619 Ta 2819 gt 3 PE 3m 642 1629 3 i 185 Lou ven GOGY y8Ly o gt gt X IS 18 2 El S ll om 6L2 9088 8050 o 1069 e
77. 22 p 22 p 14 tu tu tu 33 n tu 33n 33n 33n 33n 33n 33m 33 n 33 n 2 7 p 100 p 100 p 22p 22 p 3 9p 8 2p RAE RAK 1N Parts Lists 20 96 10 V 2 0x1 3x1 2 20 Y5 V 1210 5 50 V 0402 5 50 V 0402 5 50 V 0402 20 3 5x2 8x1 9 10 25 V 0805 20 16 V 3 2x1 6x1 6 10 25 V 0805 5 50 V 0402 5 50 V 0402 5 50 V 0402 5 50 V 0402 20 3 2x1 6x1 6 5 96 16 V 0402 5 96 16 V 0402 10 96 50 V 0402 10 96 50 V 0402 5 96 50 V 0402 5 96 50 V 0402 5 50 V 0402 20 96 10 V 2 0x1 3x1 2 20 96 10 V 2 0x1 3x1 2 20 96 10 V 2 0x1 3x1 2 20 96 10 V 2 0x1 3x1 2 10 96 16 V 0603 20 96 10 V 2 0x1 3x1 2 10 96 16 V 0603 10 96 16 V 0603 10 96 16 V 0603 20 96 50 V 0805 20 96 50 V 0805 20 50 V 0805 10 96 16 V 0603 10 96 16 V 0603 0 25 96 50 V 0402 5 96 50 V 0402 5 96 50 V 0402 5 50 V 0402 5 96 50 V 0402 0 25 96 50 V 0402 0 25 96 50 V 0402 Page 11 After Sales RAE RAK 1N Parts Lists Technical Documentation C512 2320550 Ceramic cap 39p 5 96 50 V 0402 0513 2320518 Ceramic cap 1 8p 0 25 96 50 V 0402 C514 2320520 Ceramic cap 2 2p 0 25 96 50 V 0402 C515 2320756 Ceramic cap 3 3n 10 50 V 0402 C516 2320560 Ceramic cap 100p 5 96 50 V 0402 C517 2320550 Ceramic cap 39p 5 96 50 V 0402 C521 2320554 Ceramic cap 56p 5 96 50 V 0402 C536 2320560 Ceramic cap 100p 5 96 50 V 0402 C541 2320756 Ceramic cap 3 3n 10 96 50 V 0402 C542 2320744 Ceramic cap 1 0n 10 96 50 V 0402 C543 232
78. 2320602 C863 2320522 L200 3641262 L201 3606946 L202 3641262 L203 3641548 L230 3606946 L231 3606946 L232 3606946 L300 3641302 L511 3641550 L532 3641550 L541 3641550 L542 3608326 L543 3641560 L544 3641560 L545 3608326 L546 3608326 L551 3641538 L700 3606946 L705 3640013 L710 3641622 L711 3641542 L800 3641206 L801 3641206 L840 3641574 L841 3641538 B800 4510071 G001 4352933 G300 4510044 Z500 4512046 Z505 4511016 Z541 4511026 Z551 4510009 Z713 4550101 T300 3640402 Amendment 1 04 97 RAE RAK 1N Parts Lists 0 25 50 V 0402 0 25 50 V 0402 5 96 50 V 0402 10 50 V 0402 Ceramic cap 8 2p Ceramic cap 4 7 p Ceramic cap 100p Ceramic cap 1 0n Ceramic cap 18p 5 50 V 0402 Ceramic cap 39p 5 96 50 V 0402 Ceramic cap 4 7p 0 25 96 50 V 0402 Ceramic cap 2 7p 0 25 96 50 V 0402 Ferrite bead 30r 100mhz 2a 1206 Ferrite bead 0 2r 26r 100mhz 1206 Ferrite bead 30r 100mhz 2a 1206 Chip coil 100 n 10 Q 40 150 MHz Ferrite bead 0 2r 26r 100mhz 1206 Ferrite bead 0 2r 26r 100mhz 1206 Ferrite bead 0 2r 26r 100mhz 1206 Chip coil 470n 5 Q 30 25 MHz 1008 Chip coil 120n 10 Q 35 150 MHz Chip coil 120 n 10 96 Q 35 150 MHz Chip coil 120n 10 96 Q 35 150 MHz Chip coil 330n 5 Q 33 50 MHz 1206 Chip coil 220n 10 Q 30 100 MHz Chip coil 220n 10 Q 30 100 MHz Chip coil 330n 5 Q 33 50 MHz 1206 Chip coil 330 n 5 Q 33 50 MHz 1206 Chip coil 39n 20 96 Q 40 250 MHz Ferrite bead 0 2r 26r 100mhz 1206 Chip coil 8n 5 96 Q 50
79. 3 24 UHF VCO e ss sopa role 3 25 PUESICU aso cea alo aa RE 3 25 BA TIR TOT ET OTT A AA 3 26 AMENNA EEN 3 26 Amendment 1 04 97 Page 3 3 RAE RAK 1N RF List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Page 3 4 GSM Frequency Map PCN Frequency Map Power Distribution Diagram RF Functional Block Diagram After Sales Technical Documentation Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation RF Introduction The RF module for Responder is taken from the HD841 project with only minor modifications in the built in and external antenna interfaces Otherwise the circuitry and layout are almost completely the same as in HD841 GSM and PCN versions Technical Summary The RF module carries out all the RF functions of the transceiver The GSM and PCN systems use different RF modules The mechanical size of both modules is the same EMI leakage is prevented with magnesium shield B on side one and metallised plastic shield A on side two Shield B conducts also heat out of the inner parts of the phone thus preventing excessive temperature rise External Signals and Connections Table 1 List of Connectors Built in antenna connector 5429003 SMD coaxial connector for 50 Q 2 0 W Whip or Helix antenna External antenna connec 5420460 Includes antenna switch 50 2 2 0W tor Amendment 1 04 97 Page 3 5 RAE RAK 1N After Sales RF Technical Documentation Main Technic
80. 3 2 5 AFO DIAGN iaa 2e bib phscerPeS ERE PRA bare 7 29 3 2 6 Noise Gens 7 30 3 2 7 Charge Voltage Adjustment Lssuuussuss 7 31 3 2 8 Battery Voltage Adjustment 7 32 3 9 Call SI al sissi uates dr adora a 7 33 Page 7 2 Amendment 1 04 97 After Sales Technical Documentation 3 3 1 TX Power Level A ee ada s hu d neu dE 3 3 3 Monitoring Channels 3 4 Internal Audio Loop o 3 5 External Audio Loop sed ene 3 6 Logic Controls A seg E eic I m S 3 6 1 Read A D Converters 3 6 3 LCD Test Display ae ar RR 3 7 MCU Selftests L 3 8 Set MCU Start up Self tests 4 ME Memory Functions 4 1 User Settings and Values 4 1 1 Lock AA 4 1 2 Master Code 4 1 3 Wake Up Message 4 1 4 No Service Power 4 2 Product Profile Settings 4 3 Write HW Version LL 4 4 IMEI Edit EN Ad x RR det Ee Ee ees 4 5 IMEI Transfer 00 cece eens 4 6 Set Ul factory Values 4 7 Set Factory Values 5 Power up Selftests 6 SW and HW Versions Luussusuus ingenii PTT 1 Initialisation coa 1 1 Ping NR e EE 1 2 Set Serial Speed
81. ACH type Fast Charger Power Adapter Module PAR 1 0680028 Purpose Connects ACP 3 and DLR 1 to RAE 1N system connector DC connector DC jack thr hole for DC connector 3 8 mm in ACP 3 HEC2781 010010 RS connector Stereo jack for stereo plug 2 5 mm in DLR 1 HSJ2080 01 01 0 Syst con socket Pin probe 6 pin thr hole Weight 8g Volume 10 cm Figure 3 PAR 1 left view ACP 3 connector right view System connector socket After Sales RAE RAK 1N Technical Documentation Accessories RS232 Adapter Cable DLR 1 073077 Purpose Connects an external computer with RAE 1N via PAR 1 see below Cable length 950mm 25 mm 3 wire 23 5 mm D connector D9 connector female Stereo connector Stereo plug 2 5 mm with 23 5 mm strain relief Figure 4 DLR 1 Connection The connection of DLR 1 cable is shown below The signals are routed directly from end to end of the cable The shield of the cable is connected only in the PC connector side directly to the shield pin of the D connector The connection to the communicator side is soldered PC NOKIA 9000 Connector connector Cable shield A Link Link gd Figure 5 Circuit diagram of DLR 1 cable Original 08 96 Page 7 RAE RAK 1N After Sales Accessories Technical Documentation Cigarette Lighter Charger LCH 2 0675005 Purpose charging adapter for car environment input voltage 9 32 Y Charger type Switching mode power supply
82. Chip resistor 47k 5 0 063 W 0402 R211 1430700 Chip resistor 10 5 0 063 W 0402 R212 1430804 Chip resistor 100 k 5 0 063 W 0402 R213 1430726 Chip resistor 100 5 0 063 W 0402 R216 1430778 Chip resistor 10k 5 0 063 W 0402 R220 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 R222 1430726 Chip resistor 100 5 0 063 W 0402 R224 1430079 Chip resistor 47k 5 0 063 W 0603 R230 1430842 Chip resistor 680k 1 96 0 063 W 0402 R231 1430840 Chip resistor 220k 1 96 0 063 W 0402 R232 1430804 Chip resistor 100 k 5 0 063 W 0402 R233 1430804 Chip resistor 100 k 5 0 063 W 0402 R250 1430792 Chip resistor 33k 5 0 063 W 0402 R251 1430764 Chip resistor 3 3k 5 0 063 W 0402 R252 1430115 Chip resistor 2 2k 1 96 0 063 W 0402 R253 1430764 Chip resistor 3 3k 5 0 063 W 0402 R254 1430734 Chip resistor 220 5 0 063 W 0402 R255 1430788 Chip resistor 22k 5 96 0 063 W 0402 R256 1430764 Chip resistor 3 3k 5 0 063 W 0402 R257 1430778 Chip resistor 10k 5 0 063 W 0402 R258 1430732 Chip resistor 180 5 0 063 W 0402 R259 1430804 Chip resistor 100 k 5 0 063 W 0402 R260 1430762 Chip resistor 2 2 k 5 0 063 W 0402 R261 1430762 Chip resistor 2 2k 5 0 063 W 0402 R262 1430732 Chip resistor 180 5 0 063 W 0402 R263 1430778 Chip resistor 10k 5 0 063 W 0402 R264 1430778 Chip resistor 10k 5 0 063 W 0402 R265 1430045 Chip resistor 2 7 k 5 0 063 W 0603 R266 1430045 Chip resistor 2 7 k 5 96 0 063 W 0603 Amendment 1 04 97 Page 3 After Sales RAE RAK 1N Parts
83. ENABLED LCD Test Enable Disable ENABLED Buzzer Test Enable Disable ENABLED PMI Test Enable Disable ENABLED RTC Read Enable Disable ENABLED Serial Test Enable Disable ENABLED Checksun ROM Enable Disable ENABLED 16 Start Testing E ii H Bund Hs num Hs BE Et Hs num E BH 2 HE E SE ZE E E E E d Hs un be ii iE SES ES HE hie HI Hs CER iu Miu Hk iE ii d Hn HE E
84. En e eos epee EH EH Cat 4 wo E gt R T a L T CA 93 poc C us SCH E I c ed E T c K lt gt a a RR Cor ote Caas Y ap GERMAN a i a HEAT zo u gt C gt rig SH eos amp ST ECH E gt gt E FU gt KI Li y DECHE EECH ETS MIA oe Cm Ce EO f p LCE e FRENCH O ESE E LES E 3 d HET JE J LETS cm w m E i Dn ij UY i d i S p SC Cel gt Cr T P EO qi ci Ft 4 LJ 5 3 D 87 Aas EM 3 ch v a0 HE E CS 3 E J E gt E HI uL C2 ED EO E Cat a SIE eo E LI L K L3 nre dd ETA 4 g 3 de mos ceo Ya Figure 4 PDA QWERTY keypads g i is d B Original 08 96 Page 1 13 After Sales RAE RAK 1N Overview Technical Documentation Sales Packages The NOKIA 9000 product family is a first generation GSM PCN handportable The family contains a basic sales package for portable use and optional accessories for office and mobile use There is only one Nokia design version of the transceiver However product variation is done by changing the QWERTY keymat according to the target country The basic sales package consists of the following products NOKIA 9000 communicator tra
85. FAX E mail E mail 8 VAS Access Internet apps using TCP IP WWW Telnet SMTP IMAP VT100 terminal emulator System user profile data applied by SMS business card sending amp FAX cover page security PIN lock code network password code control contact manager information visibility control Original 08 96 Page 1 7 After Sales RAE RAK 1N Overview Technical Documentation Table 1 List of NOKIA 9000 applications continued PC connectivity AT commands PC backup new app installation document amp file transfer contact manager contents exchange in ASCII Calendar month day view link to notes possible to do lists event based alarms Extras basic calculator world time clock ringing tone composer other small applications loaded from PC Table 2 Basic GSM services Rate iss Tee GSM Speech 13k Full rate GSM Data Non transparent 9 6k 4 8k 2 4k Full rate GSM Teleservices Facsimile Grp 3 Cell broadcast SMS Cell Broad transparent fax cast GSM Supplemen Selected sub set tary Services Table 3 Other communication protocols formats supported PC Connectivity RS232 IrDA Module intercon RBUS nection Ext serial i f MBUS Page 1 8 Original 08 96 After Sales RAE RAK 1N Technical Documentation Overview Figure 1 Basic Kit The NOKIA 9000 communicator integrates the functionality of the Nokia DTP 2 GSM PCN data adapter card on its
86. H E 8 Zu I af ae un Ca 85 S ow E a eir LB om Ll TL e wx R749 22 E g J D nn 2167 7168 oe A 220 E 100 eg Rd 180R ZZ Q GE Wad S f Ak 2n De Su N C766 11 imm n ad E J SC C7137 arr 7 L 6 5 LN R735 1000 S0n 28 Ek 2157 VI s des m e OR L710 L711 R716 58 A vito l 95 of lg s C172 0778 BFP192 Ting ag ig 2k 7755 E 53 a 4 ES IE e rie L 1 0 30 bes R710 33n 33n 10R Ha fe 2713 g n NE g tl gt ES j zm NUT a S ial 12 7135 s M 2 207 alig Cn o um a C140 T 100 5 L ga 2 de E 2 em Pa SIS D 20 i ge v15 C0 Tes 0 g LIS 20mm iS BFP420 BOIS fob L 11 09 ES f a W 0 25 I E 0128 Tena p E 802 Fe D 20mm Amendment 1 04 97 Page 10 22 RAK 1N Figure 21 PCN RF RX
87. IMD TR BFG540 X N 15V 129MA 9G SOT143 TR BC848W N 30V 0 1A100MHZ SOT323 TR BCP69 25 P 20V 1A gt 160 SOT223 TRX2 IMZ1 N amp P ISOLATED IMD TR BC858W P 30V 100MA 200MWSOT323 TR BC848W N 30V 0 1A100MHZ SOT323 TR BC858W P 30V 100MA 200MWSOT323 FET GAAS CLY2 9V 0 6A 3GHZ MW6 FET GAAS N 6V2A 1 8GHZ33DBM SOT89 TRX2 UMT1 P 40V 0 1A140MHZ SOT363 SCHDIX2 BAS70 07 70V 15MA SOT143 DIX2 BAV99 70V 200MA IN SER SOT23 TR BC858W P 30V 100MA 200MWSOT323 ZDI BZX84 6 2V 5 0 3W SOT23 CAP DI BB640 3 62PF 28 1V SOD323 TR BFR93AW N 12V 35MA 5GHZ SOT323 TR BFR93AW N 12V 35MA 5GHZ SOT323 TR BFR93AW N 12V 35MA 5GHZ SOT323 TR BFR93AW N 12V 35MA 5GHZ SOT323 CAP DI BB135 30V 2 1 21PF SOD323 SM CONN 2X22 F P0 8 PCB PCB 9 0MM SM CONN BATTERY 4POL P2 54 SM FLEX CONN 12POL P0 5 U CONTACT SM CONN CHP2502 0101 1X2 M P1 25 SM COAX CONN RECEP 50R 3GHZ 5X4 5 COAX CONN FEMALE 500HM SWITCH IMS Page 33 RAE RAK 1N Parts Lists Z500 Z505 Z541 Z551 Z713 Z127 MCM1 MCM2 Page 34 4512047 4550105 4511028 4510009 4550103 4550103 9854163 4510071 0200865 0200726 After Sales Technical Documentation DUPL 1710 1785 1805 1880MHZ 31X12 CER FILT 1842 5 37 5MHZ 8 9X4 8 SAW FILT 87 0 12MHZ 13DB14 2X8 4 CER FILT 134 0 09MHZ 330R 7 3X3 3 CER FILT 1747 5 37 5MHZ 8 9X5 CER FILT 1747 5 37 5MHZ 8 9X5 PCB GE9 121 0X55 0X1 0 M6 2 PA SMCRYST 26 000MHZ 7 TSTAB 10PPM SUBMODULE SUBMODULE Amendment 1 04 97 After Sales RAE RAK 1N Technica
88. Lines for keypad read and LCD controller data LCMUIF4 Line for keypad read and LCD controller read write strobe LCMUIF5 Line for keypad read and LCD controller data instruction register selection LCMUIF6 9 LCD controller enable strobe LCMCOL 3 0 14 13 12 11 Lines for keypad write LCMXPRON 16 Power ON OFF key LCDD 3 0 21 20 19 18 LP 22 KEYD 2 0 31 30 29 PDA LCD Data lines PDA LCD Line pulse PDA LCD Bias voltage 21V BACKLIGHTO 15 Backlights on off controll KEYS 1 0 33 32 Original 08 96 Keymatrix drive lines Keymatrix sense lines Page 6 15 RAE RAK 1N After Sales PDA Hardware Technical Documentation Connectors Out of Transceiver Unit Table 11 System Connector Signal Name Pin motes VCHARGER 1 2 Battery charging voltage SYSMBUS 3 Serial bidirectional data and control between the handphone and accessories TESTMODEX 4 Test SW activation SYSEXTMIC 6 External audio input from accessories or handsfree microphone Multiplexed with junc tion box connection indication 16 8k pull down in CMT SYSEXTEAR 7 External audio output to accessories or hands free speaker 100kQ pull down in CMT to turn on the junc tion box 8 External serial data from the 9000 SYSRXD 9 External serial data to 9000 AGND 10 Analog ground for accessories Connected directly to digital ground on the PCB GND 5 11 12 Charger and digital ground
89. Lists Technical Documentation R267 1430087 Chip resistor 100 k 5 0 063 W 0603 R268 1430087 Chip resistor 100 k 5 0 063 W 0603 R270 1430760 Chip resistor 1 8k 5 0 063 W 0402 R271 1430812 Chip resistor 220k 5 96 0 063 W 0402 R300 1430762 Chip resistor 2 2 k 5 96 0 063 W 0402 R301 1430804 Chip resistor 100 k 5 96 0 063 W 0402 R302 1430804 Chip resistor 100 k 5 96 0 063 W 0402 R303 1430754 Chip resistor 1 0k 5 0 063 W 0402 R304 1430730 Chip resistor 150 5 0 063 W 0402 R305 1430804 Chip resistor 100 k 5 0 063 W 0402 R306 1430788 Chip resistor 22k 5 96 0 063 W 0402 R307 1430794 Chip resistor 39k 5 0 063 W 0402 R308 1430804 Chip resistor 100 k 5 0 063 W 0402 R309 1430796 Chip resistor 47k 5 0 063 W 0402 R310 1430764 Chip resistor 3 3k 5 0 063 W 0402 R311 1430744 Chip resistor 470 5 0 063 W 0402 R312 1430796 Chip resistor 47k 5 0 063 W 0402 R313 1430115 Chip resistor 2 2k 1 96 0 063 W 0402 R314 1430115 Chip resistor 2 2k 1 96 0 063 W 0402 R320 1430804 Chip resistor 100 k 5 0 063 W 0402 R330 1430722 Chip resistor 68 5 0 063 W 0402 R331 1430726 Chip resistor 100 5 0 063 W 0402 R332 1430804 Chip resistor 100 k 5 0 063 W 0402 H333 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 R334 1430760 Chip resistor 1 8k 5 0 063 W 0402 R335 1430804 Chip resistor 100 k 5 0 063 W 0402 R336 1430792 Chip resistor 33k 5 96 0 063 W 0402 R337 1430778 Chip resistor 10k 5 0 063 W 0402 R338 1430726 Chip resistor 100 5 0 063 W 0402 R340 1
90. OK 2 Input filter fault 6 7 8 Check Vsys Is N81 pin 7 Vsys controller regulator toggling fault 9 Check V88 L82 C84 NO 14 Is on Ged eis LCDVEE on YES 15 NO po Is OV applied to Check N82 N83 pin 4 R75 R76 R96 YES E 18 a NO Is N83 pin 1 LCDVEE toggling controller fault YES 19 20 NO Is V89 anode Check L81 V81 voltage toggling R77 R74 R85 YES 21 22 Is there valid bias NO Check V89 C89 voltage at C89 plus and feedback terminal resistors YES 23 Check V87 V82 R95 R98 R94 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 1 1 1 3 1 1 1 4 1 1 1 5 1 1 1 6 1 1 1 7 1 1 1 8 1 1 1 9 Undervoltage lockout removed This UVLO is made as hardware limit to shut down Vsys if battery voltage drops below 5 0V When the N82 comparator controlling N81 has worked the shutdown of Vsys is cancelled only after battery voltage rises over 6 0V Itis possible to test PDA module at voltages between 5 0V and 6 0V but wakeup of Vsys requires voltage higher than 6 0V This hysteresis is put to design to prevent oscillation at low battery voltages after battery cutoff limit is reached and battery voltage rises after its load is removed If battery voltage is higher than 6 0V battery voltage nearly should be seen at
91. PC compatible DRAM controller F300h F323h E3G Specific Original 08 96 Page 6 35 RAE RAK 1N After Sales PDAHardware Technical Documentation Table 21 UO Map continued Beie J Aem Nw E3G Chip Configuration Regis F820h F825h E3G Specific ters E3G EMS Registers FC10h FC1Bh E3G Specific E3G Power Management FCAOh FCB3h E3G Specific Interrupt map The interrupt control unit inside the E3G contains two 8259A modules connected in a cascade mode Table 22 Interrupt map ro ANN AN hex 2 NW 8 PMUNT ParityEror IO Check 9 m 24 KeyScanlogic 8042 Keyboard IRQ2 E cascade vector same A B COM RBUS C COM1 RS232 RTC Timer 1 Not used but available Page 6 36 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware Main components E3G CPU 80386 based CPU Static design Using external clock source maximum clock rate 33MHz With internal PLL s 23 96MHz All needed peripherals are integrated to the same chip Peripherals are as follows Two cascaded Interrupt Controllers 8259A DOS compatible Three programmable Timer Counters 8254 standard DRAM bus controller no external buffers or multiplexers needed Chip select unit Real time clock RTC Two 16550 UART s with 16 byte FIFO s IrDA signal conditioning and RS232 IrDA select LCD controller 640 x200 8 actual grey scal
92. PC if available this is for testing the PDA module For PCs without COM2 leave disconnected until CMT testing is completed or use p option to start the program RAE 1 without CMT testing Note from version 1 3 p option starts RAE 1 program directly for PDA usage When complete switch on the communicator Note PAS 1 has a minimum mode switch This switch should normally be left in the off state switch pulled out It is only used when a CMT flash download fails Page 7 8 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Minimum mode switch to power Supply COM1 COM2 LPT 1 DAU 2 2T Figure 2 Servicing setup Loading the Software The program is delivered on a diskette and can also be installed on the hard disk which is recommendable to obtain maximum data access rate Do not lose your original diskette It will be needed when upgrading the program To start the program on diskette proceed as follows Insert Service software diskette into drive A of your PC Log into drive A type A press Enter To run software type rae 1 press Enter To start the program on hard disk if installed proceed as follows Log into drive C type C and press Enter 2 Torun software type rae 1 and press Enter Amendment 1 04 97 Page 7 9 RAE RAK 1N Service Software Complete Menu Structure MAIN 1 Program setup 2 Initialize CMT 3 CMT Testin
93. PCN 450 GSM PCN Sidebands offset from carrier 200 kHz 400 kHz 600 kHz 1 4 MHz 3 0 MHz gt 3 0 MHz UHF VCO The UHF VCO uses a bipolar transistor as a active element and a combination of a chip coil and a varactor diode as a resonance circuit Page 3 24 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation HF UHF VCO buffers The UHF VCO output signal is divided into the 1st mixer of the receiver and the upconversion mixer of the transmitter The UHF VCO signal is amplified after division There is one buffer for TX and one for RX Table 20 UHF VCO buffer specification Parameter Typical Maximum Unit Notes Nominal Supply voltage Supply current mA Frequency range See UHF VCO specification MHz Input power dBm Harmonics dBc Output amplitude mVrms 1 kohm PLL Circuit The PLL is Philips UMA1018 in GSM and National LMX2331 in PCN The circuit is a dual frequency synthesizer including both the UHF and VHF synthesizers Table 21 PLL UMA1018 UMA1020 specification Parameter Typical Maximum Unit Notes Nominal Supply voltage 2 7 a V Supply current GSM 8 5 mA PCN 12 1 mA Principal input freq GSM 500 MHz Vdd 4 5 V PCN 200 MHz Vdd 3 0 V Auxiliary input freq GSM 20 300 MHz Vdd 4 5 V PCN 20 510 MHz Vdd 3 0V Input reference frequency ae NE 40 MHz Vdd 4 5 V Input signal level mVrms dBm main
94. RF connector Select adjustment menu option TX UO Tuning and press Enter Check that TX power level is level 10 Cont mode channel is 60 and TX data type is 1 Adjust spectrum analyzer centre frequency to 902 MHz Span 200 kHz Res BW 10 kHz Video BW 1 kHz and Sweep time 0 5 s CHF 67 71 kHz 67 71 kHz gt lt D C offset tunings Set this value to minimum Amplitude amp phase difference Set this value to minimum Select option TX d c offset and press lt Enter gt Adjust the level of centre frequency CHF signal to minimum by varying D A converter value with lt gt and lt gt keys When value is OK press Esc Select option TX Q d c offset and press lt Enter gt Adjust the level of signal CHF to minimum by varying D A converter value with lt gt and lt gt keys When value is OK press Esc Page 7 78 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Select option TX and Q d c offset and press Enter Adjust the level of signal CHF to minimum by varying D A converter value with lt gt and lt gt keys The amplitude difference between CHF 67 7 kHz and CHF should be gt 30 dB When value is OK press Esc Select option Tune Amplitude Difference and press Enter Adjust the level of signal CHF 67 7 kHz 902 06771 MHz to minimum by varying D A converter
95. RF frequency plan a uua cede uox x ue on Exe pa REPE ERE RS 3 6 MAXIMUN Ratings ee ee EE EPSQEE RPSARE RE REPiqE cow eu dua 3 7 Power Distribution Diagram i e siu RE RE ERR ERA RR mas 3 7 uir d C 3 7 Control Zagreb ee ebe 3 9 Funcional DeSCIIDIOD aces lencia Mins DURER RED is diee 3 10 A TT 3 10 Frequency Synthesizers 0 0 c cece eee ees 3 12 Jum 3 12 mie i re MOM 3 13 aces amc rcr NET 3 13 Duplex filter P 3 13 EE P ori ab 3 13 RX interstage Filter ausu ee ari alas as 3 14 PS MING MMC HR 3 14 First IF amplifier ces onu ups a Ge EA a 3 15 First ENEE Ae EDT d 15 2nd mixer only in PON ge qure Pb uq Ee ale u 3 16 2nd IF amplifier only in PON 0 0 0c eee eee eee 3 16 2nd JP filter only Mi PON cerradas 3 16 Receiver IF circuit RX part of CRERT o 3 17 Last e nn 3 17 rur 3 18 Modulator Circuit TX part of GREAT iiia hh nu 3 18 Upconversion TDI us gn Ae TEE oe 3 19 E A 3 20 TXinterstage Mets cocaina 3 20 i TA DUME ETT 3 20 Power amplifier ae EEN Eau rap SEENEN Aal EEN ENEE e 3 21 Power control circuitry A1 d cies ceed Ge ANE d at e 3 22 EE quaa RARE EPRAREERPREMASE RR bU eee eee eee 3 22 Page 3 2 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation HF Reference oscillator 3 22 bins REC CTMCV c E T 3 23 VHF VCO buffer EE 3 23 URE BM RM 3 24 DONE VO qM LI
96. SPEAKER 9460075 MICROPHONE RUBBER 5140037 HF MICROPHONE 9480258 TESTPAD COVER 9430110 COVERING LABEL 9540000 CHASSIS 9380115 CONTINUOUS SHEET 0200712 GE8 GSM CMT MODULE 9510353 CLIP 9480248 RF DUST GASKET 9460171 SHIELD 6290060 SCREW M2X5 3 PCS 0200713 GEM1 SIM FLEX SUBMODULE 6290037 PT SCREW 18X12 7 PCS l Mu H 9510323 ESD NETTING 2 xx _ 9480280 GASKET HS MIC xx 9480291 ACOUSTIC FOAM xx e A 9480251 BUZZER GASKET xx OLD COVER KIT 1 13 9480134 SPEAKER GASKET xx NEW COVER KIT 1 15 9450666 C COVER xx Ee Mechanical Assy Parts RAE 1N Page 48 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists 9450687 WINDOW 9450731 LENS ADHESIVE xx 9450712 A COVER xx 9450679 LATCH xx 0660136 ANTENNA PCN Se 7318647 GROUNDING TAPE xx i E S 9790182 POWER KEY 9480079 WINDOW GASKET xx 9480268 ADHESIVE 2PCS x 6340005 ANTENNA INSERT xx 9790181 MAIN KEYPAD 0201034 GK2 1 UI MODULE 4850015 LCD MODULE 9790209 SCROLL KEYPAD 9790203 FUNCTION KEYMAT 9480253 MAGNET x 9380596 STICKER 4 PCS 9450713 SCREEN FRAME x ES oS D EMILIO UM ES 9560037 SPRING 2 PCS xx poo 9460188 HINGE LOCK PIN 2 PCS box 9510291 HINGE PIN xx SEN e 7130007 33 PIN HINGE FLEX 5420007 COAX CABLE be SS Olr e r 9855034 PCB FLEX EMC FLEX TAPES 6290023 PT SCREW 1 8X4 4 PCS 9450681 HINGE CENTER PART xx 9450678 B COVE
97. Update reads the image file sends it to the target in blocks erases the needed blocks of the Flash programs them and locks them After the image is programmed the updated memory area is check summed and the result is compared to the one given in the header file The memory area between SFFFCOOh 3FFFFFFh is not included to the area where the checksumming is done The output from the target shows the following whether the buffer filling was successful whether the Flash erasing was successful whether the Flash programming was successful whether the Flash locking was successful whether the Flash check summing was successful Amendment 1 04 97 Page 7 65 RAE RAK 1N After Sales Service Software Technical Documentation 83 2 Program Flash from File This menu provides means to program the PDA Flash memory from a file on the disk in the host Start Physical Address default 3C00000h range 3A00000h 3C00000h 3E00000h Start Relative Address default 000000h range 000000h 1FFFFFh If the Start Physical Address is set to 3E00000h the maximum Start Relative Address may not be greater than 1FFBFFh The output from the target shows the following whether the buffer filling was successful whether the Flash programming was successful 3 3 Save Flash to File This menu provides means to read contents of Flash memory and to save it to a file in the host service software PC User options are Start Physical Address def
98. X7R 1NO J 50V 0402 C740 2320524 CHIPCAP NPO 3P3 C 50V 0402 C741 2320544 CHIPCAP NPO 22P J 50V 0402 C755 2320524 CHIPCAP NPO 3P3 C 50V 0402 Amendment 1 04 97 Page 29 RAE RAK 1N Parts Lists Technical Documentation C756 2320584 CHIPCAP X7R 1NO J 50V 0402 C758 2320560 CHIPCAP NPO 100P J 50V 0402 C759 2320584 CHIPCAP X7R 1NO J 50V 0402 C760 2320544 CHIPCAP NPO 22P J 50V 0402 C761 2320522 CHIPCAP NPO 2P7 C 50V 0402 C763 2610011 CHIPTCAP 330U K 10V 6 9X6X3 5 C765 2320584 CHIPCAP X7R 1NO J 50V 0402 C766 2320522 CHIPCAP NPO 2P7 C 50V 0402 C767 2320578 CHIPCAP X7R 560P J 50V 0402 C768 2320554 CHIPCAP NPO 56P J 50V 0402 C769 2320584 CHIPCAP X7R 1NO J 50V 0402 C770 2320584 CHIPCAP X7R 1NO J 50V 0402 C771 2320536 CHIPCAP NPO 10P J 50V 0402 C772 2320524 CHIPCAP NPO 3P3 C 50V 0402 C774 2320530 CHIPCAP NPO 5P6 C 50V 0402 C775 2320518 CHIPCAP NPO 1P8 C 50V 0402 C776 2320508 CHIPCAP NPO 1P0 C 50V 0402 C780 2320536 CHIPCAP NPO 10P J 50V 0402 C781 2320536 CHIPCAP NPO 10P J 50V 0402 C782 2320546 CHIPCAP NPO 27P J 50V 0402 C783 2320546 CHIPCAP NPO 27P J 50V 0402 C784 2320756 CHIPCAP X7R 3N3 K 50V 0402 C791 2610200 CHIPTCAP 2U2M 6V3 2 0X1 3X1 2 C793 2610200 CHIPTCAP 2U2 M 6V3 2 0X1 3X1 2 C794 2610200 CHIPTCAP 2U2M 6V3 2 0X1 3X1 2 C795 2610100 CHIPTCAP 1U M 10V 2 0X1 3X1 2 C796 2610011 CHIPTCAP 330U K 10V 6 9X6X3 5 C797 2610011 CHIPTCAP 330U K 10V 6 9X6X3 5 C798 2610011 CHIPTCAP 330U K 10V 6 9X6X3 5 C799 2610011 CHIPTCAP 330U K 10V 6 9X6X3 5 C800 2604079
99. all messages from CMT are discarded When PDA is in PDA ON it wakes up immediately max few microseconds and messages are not discarded CMT is never able to be ON when PDA is not able to wakeup because CMT is switched OFF before PDA when battery level is falling See Figure 5 that depicts battery charge levels and its effects to PDA and CMT modules Note 1 On A 3 CPU version startup time in low temperatures is up to 20s Message from CMT CMT power on or other PDA activity PDA SUSPEND Figure 3 PDA power states from CMT point of view PDA software The PDA knows whether CMT is on or off by monitoring VL1 It gets information about battery level by asking for battery level from the CMT The PDA is able to switch CMT to the CMT PDA REQUEST SERVICE state Original 08 96 Page 6 19 RAE RAK 1N After Sales PDA Hardware Technical Documentation CMT power management principle The goal is that existing power management scheme of CMT in HD841 is changed as little as possible CMT module has power switch that works as on normal DCT1 cellular phones The CMT PDA REQUEST SERVICE state is implemented to support requests from PDA even when CMT is switched off RF is not activated when CMT is on the CMT PDA REQUEST SERVICE state If CMT PDA REQUEST SERVICE state is activated by PDA CMT switches itself off after requested action is done CMT power states are illustrated in Figure 4 CMT OFF CMT software 5s from last RBUS
100. are received the A D converter values 10 bits decimal numbers are displayed and read again The exit is made with lt Esc gt 3 6 3 LCD Test Display The LCD display is changed by using the number or lt Enter gt key Two different test displays can be selected When Logic Controls menu is selected the display is controlled to the state shown in the menu n test display 1 all indicators are displayed and the display is filled with chessboard letters n test display 2 none of the indicators are displayed and the display is filled with inverse chessboard letters Page 7 36 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 3 7 MCU Selftests 1 2 3 4 5 6 8 E A B C D E F G When this selection is used the user is informed The phone will be set to the minimum mode Y will run the special test mode and a reset will occur making MCU SW run only inside the MCU ROM code 2minimum mode Also the test results that have been executed after last power up will be asked from the phone N and ESC keys cancels the selection SC e EXECUTED ASIC Timer amp IRQX Test EXECUTED ASIC Timer amp NMI Test S EXECUTED Audio Codec Test EXECUTED RAM Component Test EXECUTED Ext ROM Checksum Tes 8 EXECUTED Display Driver Test EXECUTED ASIC Type Test c lt EXECUTED EEPROM Component Test EXECUTED EEPROM BUS Test EXECUTED Software Res
101. cap 10n 20 96 50 V 0805 C971 2320544 Ceramic cap 22p 5 96 50 V 0402 C972 2320560 Ceramic cap 100 p 5 96 50 V 0402 L080 3640025 Chip coil 20 500 mA Q 30 1M 1812 L081 3640019 Chip coil 56u 10 96 200 mA Q 35 1812 L082 3640027 Chip coil 22u 20 96 0 81 A 6 2x6 6x3 L970 3606946 Ferrite bead 0 2r 26r 100mhz 1206 B130 4510003 Crystal 32 768 k 20PPM 8x3 8 G087 4700029 Battery cr2320 li 3v 130mah d23x2 Z130 3640021 Filt z260r 100m Or2max 0 5a 0603 Z131 3640021 Filt z gt 60r 100m Or2max 0 5a 0603 V080 4211264 MosFet 2SJ16 SOT23 V081 4202671 MosFet BST82 n ch 80 V 175 mA SOT23 V082 4211264 MosFet 2SJ16 SOT23 Page 40 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists V084 V085 V086 V087 V088 V089 V130 V131 V135 V970 D080 D130 D160 D161 D162 D163 D180 NO80 N081 N082 NO083 N180 170 X101 X102 X110 X121 4117998 4100189 4210100 4210100 4110063 4111853 4200226 4110078 4200226 4110028 4340121 4370135 4340111 4340207 4340205 4340205 4340091 4340113 4340129 4340123 4340109 4860013 5308940 5449506 5469207 5469019 5469017 9854108 Precision voltage reference 4 096 Schottky diode BAS 70 05 70V 15mA SOT23 TransistorBC848W npn 30V SOT323 TransistorBC848W npn 30V SOT323 Schottky diode MBRS140 DO214AA Diode LS4150 50V 600mA 4 ns QMELF Darl transistor BCV27 npn 30V 300mA SOT23 Schdix2 bas70 05w 70v 70ma sot323 SOT323 Darl transistor BCV27 npn 30V 300mA SOT23
102. charge is started again and correct indication is given only after measured current value settles down Charge Control Charge current for the battery is supplied through a series pass transistor in desktop charger This transistor is fully on when voltage of the battery is under maximum value 8 4V or 8 2V depending on battery chemistry During this condition charger is supplying a constant current to the battery After voltage rises to maximum value pass transistor controller IC N115 limits the voltage so that current to battery begins to decrease This is the same action as in linear regulators Energy equal to voltage difference over pass transistor times current through it transforms to heat This requires big PCB area to dissipate the heat Current begins to fall rapidly after highest battery voltage is reached so heat load comes in intensive transient Large copper area in PCB is required to absorb the peak heat energy Some energy losses are also transformed to heat in diode and current measuring resistor after pass transistor Battery voltage feedback to controller is taken from battery terminal so that there is no voltage drops of series elements Current to battery is measured by instrumentation amplifier which outputs absolute voltage proportional to voltage difference of its inputs After Sales RAE RAK 1N Technical Documentation Accessories Small resistor R112 is put to make this little voltage difference in main current p
103. clock cycles DSP reset release time from DSP clock activation can be selected from 0 to 255 13MHz clock cycles In our case it is 255 SIM reset release time is according to GSM SIM specifications To turn off power for the phone the user presses the PWR key The MCU detects this The MCU cuts off any ongoing call exits all tasks acts inoperative to the user and leaves the PSL watchdog without resets After power down delay the PSL cuts off the supply from all circuitry In the acting dead state the phone looks to the user like it is off lights are off and the display is blank but internally the baseband is powered and communication via RBUS is possible The RF is not powered in acting dead state If charger is connected in the off state the phone enters the acting dead state but the charging indicator in the UI module shows to the user that reset DSP the phone is being charged Watchdog system ge 5 1 POWER 3 PSL s XPWROFF Figure 5 Watchdog system Normal operation 1 MCU tests DSP 2 MCU updates ASIC watchdog timer gt 2Hz 3 MCU pulses the XPWROFF input on the PSL about 2Hz Page 2 20 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Failed operation 4 ASIC resets MCU and DSP after about 0 5 s failure 5 PSL switches power off about 5 s after the previous XPWROFF pulse CTRLU Introduction The Control block contains a microcomputer uni
104. conn sfv 12pol p0 5 loc LOCK X035 5429003 SM coax conn recep 50r 3ghz 5x4 5x4 5 X040 9510168 Antenna contact b11114 4850038 IC Icd 42dotm 3x7sgm 57ind DSL 12 EU 9457468 Lightguide rae 1 dmc00310 9795025 Keydome diam 5 6x20 sheet rae 1 RAE 1 9854109 PCB GK2 165X51X0 6 M4 2 PA 9854109 PC board GK2 165x51x0 6 m4 2 pa Page 44 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists User Interface GK2 1 EDMS pn 0201034 issue 2 1 Item Code Description Value Type R031 1430043 Chip resistor 2 2 k 5 0 063 W 0603 R030 1430045 Chip resistor 2 7 k 5 0 063 W 0603 R021 1430051 Chip resistor 4 7 k 5 0 063 W 0603 R022 1430051 Chip resistor 4 7 K 5 0 063 W 0603 R007 1430057 Chip resistor 8 2 k 5 0 063 W 0603 R001 1430063 Chip resistor 12k 5 0 063 W 0603 R002 1430063 Chip resistor 12k 5 0 063 W 0603 R004 1430063 Chip resistor 12k 5 0 063 W 0603 R005 1430063 Chip resistor 12k 5 0 063 W 0603 R010 1430065 Chip resistor 10k 5 0 063 W 0603 R011 1430065 Chip resistor 10k 5 0 063 W 0603 R012 1430065 Chip resistor 10k 5 96 0 063 W 0603 R013 1430065 Chip resistor 10k 5 0 063 W 0603 R014 1430065 Chip resistor 10k 5 0 063 W 0603 R003 1430075 Chip resistor 33 k 5 0 063 W 0603 R008 1430076 Chip resistor 36 k 5 0 063 W 0603 R006 1430085 Chip resistor 82 k 5 96 0 063 W 0603 R015 1430087 Chip resistor 100 k 5 96 0 063 W 0603 R016 1430087 Chip resistor 100 k 5 0 063 W 0603 R017 1430087 Chip resisto
105. du dum The Calendar has two views the Month view shows a month at a time and the Day view shows the calendar events of a day The Calendar is also used to link memos to events and also incorporates a daily To do list November 1994 Wed 02 11 94 Open C_D 9 00 Meeting with Ed N 12 00 Lunch ext 16 00 Get kids fromk month up Previous month CD To do list C 2 Figure 20 Calendar main view Month View The Month view shows the days of the current month in columns according to the number of the week on the top row In the Month view days that have scheduled events are indicated by an icon Nov 2 and 19 in the figure above If the selected day contains scheduled events they are shown in a separate daily events list on the right side of the display The schedule can be edited in the Day view press Open To view next months appointments press Next month To view the previous months appointments press Previous month To write yourself reminders of important matters press To do list Day View Day view displays the events of the selected day The first event of the day is always shown when the list opens event entries are freely editable 02 11 94 Select C_D day gt a 8 00 ene erie E 9 00 10 00 Meeting with Edi C 1034 Details C_D Gy Delete C gt Close C_D Figure 21 Calendar day view Page 26 Original 08 96 After Sales RAE RAK 1N
106. e MA020 MA021 MA2 MA3 MA4 MAS MAG MAT MAS MAS MEMU 1 205 MAIO MAT MA130 MA131 RASO1x MA 9 2 CASHOx AIS GND CS 1 0 XTALO ETx IST SPKR AC2t 1 HAAG MAA1 MA 9 2 RASO1X CASHOX CASLOX WEX D 15 0 MEMWX MEMRX CS1X CSOX UCSX AC21 1 FLASHPD1X FLASHPD2X FLASHWP 1X FLASHWP2X 28 02 96 R134 R135 22k 100k v130 BCV27 DND LO XPWRON E gt JTAGTDO R143 KEYBU 18424 SUSPENDx 1R012 1R014 KYSCN 10x KYSCNI1x KYSCN 12x KYSCNI3x KYSCN 14x KYSCNI5x KYSCN I6x KYSCNITx KYSCN 18x KYSCN 19x KYSCNOOx KYSCNO1x KYSCNO2x KYSCNO3x KYSCNO4x KYSCNO5x KYSCNO6x KYSCNOTx 112 VSYS 176 GND KEYD 7 0 KEYSC9 0 02 01 95 vsyS VSYS VSYS V A A A A vsYS Vers CI35 C136 C137 C149 CIS 33 100n 33n 33n 33n Di vsys Riso mg i T 7 128 170 100R 1008 130 ei 131 GND olen alle s S E ND x 8 HE EI 112 TESTMODEX ds 114 RSRXD 113 120 116 1T 91 162 103 RBUST XD i 105 100 101 GND JUR s 114 vsys 21 21 vn Ph I 4 Bs Be map BASTO 054 ST 147 C149 i e vsys alles T 2130 al Ss TT a as R138 82k ci oa 2131 LUE SIS L fe e de A te eu SEI CI4 0142 cis3 c
107. filter is a three pole ceramic filter in PCN In GSM there is a SAW filter The filter rejects spurious and blocking signals coming from the antenna It also rejects the local oscillator signal leakage First mixer The first mixer is a single balanced passive diode mixer The local signal is balanced by a printed circuit transformer The mixer down converts the received RF signal to the first IF signal Table 5 Mixer Specification Parameter Typical Maximum Unit Notes Nominal RX frequency range GSM 935 960 MHz PCN 1805 1880 MHz LO frequency range 1006 1492 IF frequency 71 313 Conversion loss 5 6 Page 3 14 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation RF Parameter Typical Maximum Unit Notes Nominal IIP3 GSM 2 5 dBm PCN 2 5 dBm First IF amplifier The first IF amplifier is a bipolar transistor amplifier Table 6 1st IF amplifier specification Parameter Typical Maximum Unit Notes Nominal Operation frequency GSM MHz MHz Supply voltage d V Current consumption GSM mA mA Insertion gain GSM dB PCN dB Noise figure GSM i dB PCN dB IIP3 GSM 5 3 dBm PCN 5 3 dBm Input impedance A matched to the mixer Output impedance GSM matched to the filter PCN matched to the mixer First IF filter The first IF filter is a microstripline filter in PCN In GSM the first IF filter is a SAW filter The IF filter rejects some spurious and blocking signal com
108. hotlist is where your pe defined links to the WWW pages are stored these are retrieved by pressing Fetch If the WWW page has been recently downloaded the page is retrieved from memory if not the page is downloaded from the Internet by making a GSM data call to your Internet Access Point Hotlist Fetch E Club Nokia 19 06 96 12 00 Define Nokia Telecoms 19 06 96 11 45 Ea Netcsape search engine 19 06 96 13 56 Settings OD http www nmp nokia com Close EN d Figure 17 WWW Hotlist The World Wide Web facilities on the communicator are quite extensive see the User Guide for full explanations Telnet and Terminal Allows connection to mainframe computers providing terminal services through the Internet both applications emulate the VT100 terminal display Once a connection is established a login name and password are normally required in order to be able to use the services provided by the host computer Username JOHN Password Keys C 2 SSPSLESESEES SFEETLE SESS TEE SEEN VOLESEES SVE CELT O D OME TO RESEACH LTD D H CHE 2 4000 90 VAS 5 5 2 COMPUTER H CoD f A SURREY KNIGHTSBRIDGE Texts E H NODE PRSSUR s H UNAUTHORIZED USE IS PROHIBITED Zoom v Preset ititii titi rir EEEERR RE EEERR EE ERR EE RAI EFFE TEE ERR d in Last interactive login on friday l15 SEP 335 12 4b t mint ti 2 login on Friday 15 SEP 1994 12 3 WARNING Your password expires on Friday 22 SEP 19 L 1
109. low Original 05 97 Page 8 25 After Sales RAE RAK 1N Faultfinding Disassembly Technical Documentation logic level voltage 0 0 3V If not replace N82 Otherwise check V87 and V82 Voltage at gate pin of V82 should be one third of the voltage seen at plus terminal of C89 Voltages at LCDVEE line and C89 plus terminal must be practically equal Page 8 26 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 3 1 4 1 3 1 5 1 3 1 5 2 3 2 3 3 3 3 1 Check UI Flex In a case that the LCDVCC and the LCDVEE are within their voltage limits the fault is likely in the other controlling signals But first it is good to check the UI flex If the UI flex is OK proceed to 3 1 5 otherwise go to 3 1 4 1 UI Flex Fault Change the UI Flex Check PCLK LP FP DISPON If the CPU does control the PCLK LP FP and the DISPON in a reasonable manner then proceed to 3 1 5 1 If one of the synchronizing signals PCLK LP FP remain still all the time or if the DISPON is inactive low then go to 3 1 5 2 LCD Module Fault If all the control signals are OK at the end of UI flex then the possible fault is either in the LCD module or in the UI module CPU Fault If the CPU does not control all the signals as it should it is likely to be defective Change LCD Contrast To check the functionality of the contrast controlling circuitry choose the LCD test from the service software
110. memory When values to ME memory are saved it asks for confirmation If Y key is used values are saved to the memory If N or ESC key is used the values are not saved to the memory 4 1 User Settings and Values After this selection a new window is displayed 1 Lock ID 2 Master 7533100380 3 Wake up Message 4 No Service Power Save ON Amendment 1 04 97 Page 7 39 RAE RAK 1N After Sales Service Software Technical Documentation 4 1 1 Lock ID When this function is activated the code can be edited note that code is saved to the ME memory together with other user settings and values Only digits are accepted for Security lock 4 1 2 Master Code The master code cannot be edited 4 1 3 Wake Up Message Examine the old Wakeup Message read from the phone or enter the new one 4 1 4 No Service Power OFF No Service Power Save is not used ON No Service Power is used 4 2 Product Profile Settings When Product Profile Settings selection is activated the Product Profile information is read from EEPROM If the information is not received within 2 seconds an error message is shown and the ME Memory Functions menu is displayed Otherwise the Product Profile Settings menu is displayed where the user can select features L Product Profile Settings 1 1 CMT language English German French English 2 Keyboard layout Normal AT amp T ITU T Normal 3 fi5b72 Algorithm On O
111. mode regulators Input filter OK Between board to board connector battery line and regulators there is LC filter to reduce interference conducting through battery line from CMT to PDA module and visa versa Overcurrent and overvoltage may damage filter components If battery voltage is not seen in equal value at positive terminal of C83 and at board to board connector battery line then check that L80 is not open circuited If not check that C81 and C83 are not short circuited to a finite resistance 100 ohm and there is no visible damage in capacitors If fault is still not found check also bypass capacitors C93 C94 C96 C87 and C97 Input filter fault Replace faulty component If fault is not focused try to change tantalum capacitors first If that is not helping there is a possibility that one of the IC s N80 N81 N82 or N83 has internal short circuit Original 05 97 Page 8 13 RAE RAK 1N Faultfinding Disassembly PDA Power Unit Check UVLO fault 11 Replace D80 25 Check V80 V86 27 Check N80 C80 29 Check G87 V85 Page 8 14 NO Undervoltage lockout removed YES y YES NO Reset OK YES i YES 24 LCDVCC OK NO YES NO V YES 28 VBACK OK NO YES Power Unit OK YES NO After Sales Technical Documentation Input filter NO
112. numbers will precede letters Speed Dial Search Speed Dial Key in the number of the memory location of the stored phone number Press eg or Note Speed dialling is not possible during a call Recalling information Press Memory Key in the name or its first letter s Press Find The name closest to the keyed in characters will ap pear You can move to the next name containing the same characters by pressing the scroll keys Speed Search Press Find The first matching name ap pears with the cursor blinking under the last matching character you keyed in If the found name was not the one you searched for scroll to view the next matching name When the name of the contact you want to call is shown on display press e Press ABC to view the associated phone number If the phone number has been designated a speed dial number the location number of the name and phone number is shown in the upper right corner of the dis play Page 10 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Using the Menus The phone interface offers a set of menu functions which allow you to tailor the phone interface to your particular use In each menu and submenu you can check and alter the setting of any particular function The menus and sub menus can be entered by scrolling the menu or using appropriate menu shortcuts Menu functions are accessible even during a call The following menu struct
113. o C951 cr II FOUT VCTR 4 2 CPPF AQ 824 R828 o g KINSEKI 8E SR Ge j 1 3 lope o E 2200 C963 C962 A ES 8 de I RES RES dol 1 AUK LJ R302 8 d BV D E PRI IST N R800 en E B ron T i e AFC V Lux d gs 3 Jan DATA 8 e ell 10k 41k 41k 3 er SA ST 10 pouT v g jg EE g g i Jis C807 8 8 o 2 S 9 0302 3nd i A Ox d o 1 a m C80 ooo 4 7 07 5 CND 3 0900 801 ZA Xm H HH 200 35V 33n 8 Set t 7 t 8 S s af 4 832 ela diio EN 889 u ol t vo gls 3 Hi ak lw lov ER g j cus n 9t C 1 een Ms A Lo SL la zm be ge as e Ts ik L SIIS coo 2823 eR B Sete Ea g L a ini SCLKL gt i a 47 at XOUT Tat E L gf c X SDATA xi VLL EE as EAREN 282 gt 41 L 45 TX T R795 Tug T T 2lo T x nM a BE sl ally Be IS E Sl SE alle ls s 7 A o iM Ek a S o 12M 2m 3 Ei Ca S mr gt VBATT 100 d u D D ICT en zm aam a allg 8 8 a E Cre R705 2 100 2 alo al a IIS al Z g 2 Ton E S i M aiig g G H HE e 0190 cre RE 793 763 ce 9 amp ge 390 10 330 10 330u_10 330x107 330u 10V IQ LU S R701 R702 23 X JL L d L ells E M p CA Y T Gei DE R765 me A 308481 A JL HIE ap lg ella I 1 83 Lm 5 j alj amp ers g 8 Bd ra ou Ta 9 S ind gt fe 59 l l l j gt a ell L ale q o 1H R768 I E Cra Sl tz 16 Se LI Ze ind Te awe em Ba um 9 o 0 Lo E ot 86 Y 14 EE 93 ee Lj B 4 R736 sal Lh amp I ol
114. of antenna is also assembled in this module Additional layers will improve shielding against RF radiation We do not need Flexible Printed Circuit As used in HD841 because we do not have side keys PCBis easier to assembly than FPC PCB is cheaper than FPC Amendment 1 04 97 Page 4 5 RAE RAK 1N After Sales UIF Technical Documentation The major parts on the module assembly include the following CMT Display module Same module as used in HD841 including LCD Heat seal LCD driver TAB circuit and Light guide CMT keydome assembly Adhesive film holding 20 metal domes Soft keys on the other side of PCB four domes on the other end and two domes on the other end 33 pin flex connector for hinge flex 12 pin flex connector for GK1 display module Coaxial cable connector for antenna cable Antenna clips 11 test pads Figure 2 shows the UIF mechanical shape and part placement Note For RAK 1 GK2 1module the antenna circuit is different from the one shown in this dia gram See the UIF Component Layout in section 10 for details PDA scroll keys UIF Flexes CMT LCD foil pattern PDA softkeys CMT Keypad Antenna circuit Figure 2 UIF Board There is two flexes that are connected to the UIF module and go through the hinge The other one is 33 pin flex It has all active signals for the UIF module and three ground pins It is connected to the 33 pin flex connector The other one ha
115. progress EF indicates an SMS message fax or written mail has been received D and bar Indicates how much charge there is left in the battery D I indicates an SMS message fax or mail has been received QO Indicates a voice mail message has been received Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Getting Started Switch on off Press and hold D key Make a call Key in the number include area code if necessary Press e key Answer a call Press e or any other key except or If you do not wish to answer the call pressing em will send out a busy tone to the caller End a call Press em key Clear digit Press C key Clear display Press and hold C key Last number redial Press eg and the rocker keys A or V to recall last number dialled Adjust audio volume When in a call or there is a call on hold press A or V on the rocker key Activate keyguard Press Menu soft key then press within 3 seconds the phone must be switched on The display will show the message Keypad Locked and respond with help text if any key is pressed De activate keyguard Press the Menu soft key and then again The display shows Keypad activated Calling the emergency Hold C key to clear display ensure phone is in number services entry mode If in doubt press ABC Enter emergency number Press the e key Using Memory Phone numbers and names you store are normally located in
116. regulator N81 pin 1 If not go to 1 1 1 4 UVLO fault First check that 4 1V can be measured from reference V84 cathode If not replace V84 and check R88 Next check that voltage between R87 and R89 is higher than voltage across V84 This voltage should be reduced to V84 voltage level if battery voltage is reduces to 5 0V If not check R87 R89 and R65 If above mentioned is OK check R80 If OK replace N82 Vsys OK Measure Vsys voltage for example from C84 positive terminal It should be between 3 135V and 3 465V If not go to 1 1 1 6 Check Vsys regulator First check that battery voltage is seen at N81 pins 3 and 8 If pin 3 is low regulator does not exit from soft start state Is N81 pin 7 toggling If measured with oscilloscope there should be seen voltage level toggling between OV and VBatt at frequency of about 200kHz If not go to 1 1 1 8 Otherwise go to 1 1 1 9 If the regulator has dropped to a shutdown state the pulse frequency is lower and pulses appear at irregular time intervals Vsys controller fault Replace N81 Check V88 L82 C84 If the controller N81 tries to alternate pin 7 level even at reduced voltage magnitude the fault is very likely found from V88 L82 or C84 If the problem is still unsolved check that Vsys current consumption is less than 500mA Reasonable value is about 200mA when CPU is fully on If not there must be a short circuit in Vsys line Original 05 97 Page 8 15 RAE RAK 1N After
117. shunt inductor in PCN The antenna matching circuit has its own ground area connected to the braid of the antenna cable Antenna ground and digital ground are not connected together at the UIF Module Amendment 1 04 97 Page 4 13 RAE RAK 1N After Sales UIF Technical Documentation This page intentionally left blank Page 4 14 Amendment 1 04 97 After Sales Technical Documentation RAE RAK 1N Series Chapter 5 Transceiver GES GE9 SIM Flex Module Original 08 96 RAE RAK 1N After Sales SIM Flex Technical Documentation CONTENTS SIM flex Page No REENEN ws be ea ee e SE e ee 5 9 Technical Specification coopera 5 9 DG GharasterisllbS scorer oap 2255 a ob bebe eet ag eed 5 9 External Signals and Connections 5 4 AC Characteristics EE 5 5 Functional Description 5 5 Main Components x ud uos miedo a schie le Ar oor d i coe eir ai r eei as 5 5 PNGIOCOMPONGING acom ecese aien i AEN 5 5 espe CM PT rC E 5 5 Mecanical components 9 ag hehe RR Rer mE EE a alo 5 5 SIM interface usen oper che S hdd eati Soke cha dee ERR Ed sb E 5 5 List of Figures Figure 1 SIM Flex components A vie BENENNEN Mee dn M e 5 3 Page 5 2 Original 08 96 After Sales RAE RAK 1N Technical Documentation SIM Flex Introduction The purpose of the SIM flex is basically to connect ancillary parts to the CMT It has no active electronics and the main parts are the audio components mic low profile buzzer and s
118. test to been successful proceed to 5 8 otherwise go to 5 7 1 CPU pin 128 Toggling Check if the CPU pin 128 toggles according to the power ON OFF switch of the CMT If the pin does not toggle then proceed to 5 7 2 otherwise go to 5 3 2 1 Check R130 R146 If the signal is not toggling check the resistors Discrete Components and the Connections OK If the resistors and the connections to the CMT module are OK proceed to 5 7 3 1 otherwise go to 5 7 3 2 Check CMT If the resistors and the connections to the CMT module are OK then the fault is in the CMT module Change the Corresponding Component Change the bad resistor Phone Powered ON and OFF Do the test using both transitions phone OFF gt switch the phone ON phone ON gt switch the phone OFF If both transitions were successful the PMI test can be considered to have been successful Original 05 97 Page 8 33 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 6 Troubleshooting Diagram of the Keyboard The following picture illustrates the troubleshooting diagram of the keyboard Once the keyboard test is started all the keys of the PDA can be tested Start 331 Check keyboard matrix 1 Start the keybord test 3 3 2 YES Do senses go lo 2 Press a QWERTY CPU fault if driven and key s pressed SoftKey 3 Key press regognized 3 1 Sense li
119. the UART s local loop 1 Test COMI in local loop 3 Test COM2 in local loop 7 1 1 Change resistor 4 Test successful 2 1 CPU fail 6 Connect Test COM2 in RS 232 Check RBUSRXD and external loop OK RBUSTXD together 8 1 Test COM1 in Local Loop Choose the serial test in the service software and select COM1 to be tested in a local loop The test is ran at the same baud rate that is used in the communications to the host PC 8 2 Test Successful If the test passes successfully proceed to 8 3 otherwise branch to 8 2 1 Page 8 40 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 8 2 1 8 3 8 4 8 5 8 6 8 7 8 7 1 8 7 1 1 CPU Fault If either of the tests in the local loop mode fails then the CPU is defective Test COM2 in Local Loop Select the COM to be tested in the local loop The test is ran at 9600 baud by default Test Successful If the test passes successfully proceed to 8 5 otherwise branch to 8 2 1 Connect RBUSRXD and RBUSTXD Together In order to test the external lines of the COM2 the RBUSRXD and RBUSTXD may be connected together e g in the board to board connector When testing the COM2 in this external loop the bytes are received via this connection Test COM2 in External Loop Choose in the service software the COM2 test in external loop Test Succes
120. to browse through the memory contents When a call is active pressing scroll keys adjusts the volume level Lamm Dials a phone number and answers a call Ends an active call C ABC Switches between alpha mode and numeric mode In the menu facility this key produces a help text on the current function to 9 0to9 Number and alpha keys Used for special purposes and certain functions Deletes characters or exits the menu facility and memory functions Original 08 96 Page 7 RAE RAK 1N After Sales Quick Guide Technical Documentation Pressing Menu the selection key under the text Menu gains access to the menu functions and Memory selection key under the text Memory to the memory functions The functions change according to the situation and previous selection eu EA De eo Figure 3 Selection Keys Display Indicators Page 8 AB DAREgOot2Ig Sg e 0 Figure 4 Display Indicators AB Indicates which memory is currently selected A refers to the SIM card memory and B to the communicator s memory gt Indicates that there is a list of options to select from Indicates that a voice call is in progress IER Indicates either memory location menu submenu or setting option A Roaming when used in networks other than your subscribed one ABC The phone interface is in alpha mode Y and bar Indicates that the current signal strength D A data or fax call is in
121. to controller resulting 8 4V charging If V147 is off voltage dividor makes battery voltage 8 2V DC Characteristics Table 1 Battery type sense resistor values inside battery pack Notes Typical Nominal Operating input voltage 12 Vdc 1V Max input current 800 mA 4 70 mA Charge voltage type sense resistor 100k Charge voltage type sense resistor 68k Typical power consumption Table 2 Supply Voltages and Power Consumption Operating input voltage 12 Vdc 1V Max input current 800mA 70mA Original 08 96 Page 11 RAE RAK 1N After Sales Accessories Technical Documentation External Signals and Connections Table 3 List of connectors Fast charger ac adapter connector X130 2 pole DC jack Spare battery connector X120 To the flex cable of 4 pin spare battery Table 4 Fast charger ac adapter connector X130 VDC 1 supply voltage input GND 2 common ground 3 mechanical support pin connected to ground Table 5 Spare battery connector Signal Name Pin Conn Pin Conn Outlook con tacts VBAT X153 battery positive terminal BTYPE X152 battery type sensing terminal SPARE PIN X151 not connected GND X150 4 Outlook contacts are referred so that 1 is nearest to edge of desktop charger and 4 is most inner pin Mechanical Characteristics W x L x H etc colour DCH 4 71 0 x 91 5 x 27 0 Material ABS PC AAA 8 63 9 x 83 6 x 1 0 DC jack X130 for ACH 4 3
122. value with lt gt and lt gt keys When value is OK press Esc Select option Tune Phase Difference and press lt Enter gt Adjust the level of signal CHF 67 7 kHz to minimum by varying D A converter value with lt gt and lt gt keys The amplitude difference between CHF 67 7 kHz and CHF 67 kHz should be gt 35 dB When value is OK press Esc Press Esc key and store new values with lt Y gt key 4 Tuning of Transmitter Power Levels This adjustment loads the power levels of the phone transmitter into the EEPROM When doing this a pulse power meter or spectrum analyzer must be used Note The cable loss of HCH 1 is about 1 0 dB Power levels programming Set power supply voltage to 7 2 V Connect pulse power meter or spectrum analyzer to external RF connector Check that channel 60 Select adjustments menu option TX Power Tuning and press Enter Press Y Adjust the power level levels Base 5 13 and 15 with lt gt and lt gt keys and change levels with Up and Down keys Amendment 1 04 97 Page 7 79 RAE RAK 1N After Sales Service Software Technical Documentation level VB 7 2 V CH60 Bp BE AAA 27 SS 17108 E Press lt F3 gt to calculate all other levels Once all TX levels are OK press Esc and store readings in phone EEPROM with pressing lt Y gt 5 Charge Voltage Adjustment A reference value for charge voltage is s
123. van C8824 Ur els d C ES z GN EE gt Cash Z yp 269 za 274d 5 1580 ogg g 80 BELY ZE 2 E 610 SOLIS U gt ELA o e a0 B m E A Genf 0088 ns ast So N Mza KE e S B 1008 Ld E l DOBA Sua SNE OU SOR rosy im 2 i DATS Saggy el a UZ D E 02 097 Gop S 2 apple pis JE z L r ng z id Ao one LE ne cozy 1029 120 108 58 ES 1184 Oley U a 0421 i e z BPO PCS ESCH E Se 9249 AS a 9829 E 2 SES si Sa r mn e ED Is S B amp Sg C347 SEH gw S 3 Bu B E Ri Sei E AH 2029 O Lau Fo O au E fa Osea i 8 855 2 071 0602 3 SR 2 m Ss Eo z SS E C B LOZX z C225 Es a S 22 UI n d 6 EG RED ZI YY S c G ame ujjees Ea BUS 3 a gt c ES Obed 5 E sig 1809 amp m 8 25 GK FE Vir iy S i S zo m EI gom pns Ka ed gt oe R a B a Sm LB cory och 82 oon O 2 g S 2 9 Byl elas gt amp x D 22 alegr B ET S e LLL 3 gt S gt le UE S Xs LL IJ g n 5 E 25 SUS 0179 e e SCH V es 1199 Y a a C400 TTT ane MS e U z 6268 C439 Bai 3 S 3928 1256 yy en Com TS OEZN Ee 113 122 R233 lt ES R330 E 6073 Lees 36023 Mi 5 GOZA PARE Ki RS N 5 SIS ak S m R4 R262 jd E le Sen s ne Um ve a me amp eos 63 2 Ey JERIA S 3 SJE RL M 330 z gU LE me wi ae E 0573 R230 zozy 129808 Lum Le amp Tg S X V230 BER E Rm EIS ES S IRISO gt Seq aA gs Y O EU SER m 2 ER CN gt CG S zi SS lt 5 WO
124. zz sms P Edomes 1 0 0 0 Wri rite a gt SMS C Received messages message ES Gy TT Standard messages 15 20 i i erit O Business cards Settings C_D uma Document outbox O Figure 12 SMS Main View Sending messages To create a new short message Press Write message in the main view to open the SMS editor and write message When the message is ready to be sent press Recipient select and send to the desired contact To send a previously created document Select the Own texts Standard messages or Business cards folder and press Open Select a document and press Open Only texts no longer than 160 characters can be opened When the message is ready to be sent press Recipient select and send to the desired contact Page 20 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Receiving messages When a new short message has arrived a beep will sound unless the system is set to silent service mode and an information note is shown on the display The note appears even if the SMS application is not active Received short messages go automatically in the Received messages folder A received short message can be a normal short message business card service card or notification of a voice message in your voice mailbox Unread received messages are marked with a postcard icon To read new short messages start the SMS application if it is not already active open the Rec
125. 0 KEYDOC2 0 GND So KEYSE 1 0 KEYSOCT 0 BACKLIGHT 3 LCDDI 3 0 LCDDOCS 0 al CL ST E e RBUSRXD 2 sii EIU sed RBUSTXD 9 tl VB QD e LPI LPO AE yB vit 1f 3 LCMUIFO XPOWERON 12 Har PHFMICPO Ou GND 13 m 3 5o CCMUIF2 VCHAR 14 l 63 LCMUIF3 M ie Gu e o A az au u COL 19 Ge SC 1b CMCOLO COLS 202 COST RM 2 Coli GND 25 Ge Ge 132 LOMCOL2 GND 222 F Wl 14 LCMCOL3 GND 22 UTD UTEDO Te BACKLICHTO N a UIF10 o UIFB 24 F F 16 LCMXPOWERON 8 UI UIF20 o Ta Sie UIFS UIF30 tee Dos F o UIF UIF 40 o L HES Ze UIFS UIFSO ZS LOI 1 2x UIF6 UIF6O E E VCHAR 3 i 08 05 95 2 Pe DCLK 32 ella RF IS GND D DK 32 I 2 215 ze DISPON DA Es MBUS MBUSO Eiere Le 27 LCDVEC MBUS 3 amp e x S S 285 LCDVEE GND 3 O e lg E elle E 29 KEYDO LIDOPEN 3 211 ath 2 19 y 305 KEYDI END TH EXTMICI EXTMICO 2 2 3b KEYD2 eee at EXTEARI EXTEARO GND GND xt KEYS EXTEAR 42 Le De S AGND Lo 181962 VB Se GND E104 E E105 8 Mel L VCHARGER i m m BENE ei PADS UNDER BATTERY r E 4 TESTMODE E108 SHS coop 62 SYSEXTMIC GND Le SYSRXD E110 T GND c JL GND GND El MET 1561 18gE 17E 18gE 19E1209E121gE122gE1239E124gE1209E1269E1279E 128gE 12945 1304E 131451 329E133gE 19 4E 135481 364513795 138gE1399E1 4098 14198 142451 ASE 14495145 iMG GEN ATE TAG SETA ETSQETSTAETSAAETSS SE S AE TS EISE LETS AE TSS E 159 E 160 E 161 E 1624 1634 1649 IGS E TG E 167 5 16
126. 036 G0730021 Original 08 96 Page 9 11 RAE RAK 1N After Sales Service Tools Technical Documentation D9 D25 RS232 Adapter Material Code 4626170 4626170 FPS 3 Programmer Material Code 0270074 G0770017 Page 9 12 Original 08 96 After Sales RAE RAK 1N Technical Documentation Service Tools DAU 2 2T PC Link Adapter Material Code 0750006 0750006 Modular T adapter Branch Connector Material Code 4626134 PKD 1 Dongle Software Protection Key Material Code 0750018 G0750018 Original 08 96 Page 9 13 RAE RAK 1N After Sales Service Tools Technical Documentation XCM 1 Connector Cable Material Code 4626131 4626131 DLR 1 RS232 9000 Connector Material Code 0730077 Page 9 14 Original 08 96 After Sales Technical Documentation RAE 1N Series Chapter 10 Schematics Original 04 97 RAE 1N After Sales Schematics Technical Documentation CONTENTS Schematics Page No PDA version 13a Figure 1 PDA Block Diagram e cc cntehs wan SEIN EE beans eines 10 3 Figure 2 PDA Power Unit CPWRU eseeeeeeee 10 4 Figure 3 PDA Serial Interface SIRU Lussuuussuss 10 5 Figure 4 PDA MCU and Memory PROCU nrnna 10 6 Figure S PDA EMIL ss i erani aren enone on don akon whan D c Rit 10 7 Figure 6 Keyboard matrix uz osa cese duae eS EROS ERR E ERR RR ERE 10 8 Figure 7 PDA Memory EE 10 9 Figure 8 PDA Component La
127. 0560 Ceramic cap 100 p 5 96 50 V 0402 Amendment 1 04 97 Page 39 After Sales RAE RAK 1N Parts Lists Technical Documentation C901 2320560 Ceramic cap 100 p 5 96 50 V 0402 C902 2320560 Ceramic cap 100 p 5 96 50 V 0402 C903 2320560 Ceramic cap 100 p 5 96 50 V 0402 C904 2320560 Ceramic cap 100 p 5 96 50 V 0402 C905 2320560 Ceramic cap 100 p 5 96 50 V 0402 C906 2320560 Ceramic cap 100 p 5 96 50 V 0402 C907 2320560 Ceramic cap 100 p 5 96 50 V 0402 C908 2320560 Ceramic cap 100 p 5 96 50 V 0402 C911 2320560 Ceramic cap 100 p 5 96 50 V 0402 C912 2320560 Ceramic cap 100 p 5 96 50 V 0402 C913 2320560 Ceramic cap 100 p 5 96 50 V 0402 C914 2320560 Ceramic cap 100 p 5 96 50 V 0402 C915 2320560 Ceramic cap 100 p 5 96 50 V 0402 C916 2320560 Ceramic cap 100 p 5 96 50 V 0402 C917 2320560 Ceramic cap 100 p 5 96 50 V 0402 C918 2320560 Ceramic cap 100 p 5 96 50 V 0402 C920 2320560 Ceramic cap 100 p 5 96 50 V 0402 C921 2320560 Ceramic cap 100 p 5 96 50 V 0402 C922 2320560 Ceramic cap 100 p 5 96 50 V 0402 C923 2320560 Ceramic cap 100 p 5 96 50 V 0402 C924 2320560 Ceramic cap 100 p 5 96 50 V 0402 C926 2320560 Ceramic cap 100 p 5 96 50 V 0402 C927 2320560 Ceramic cap 100 p 5 96 50 V 0402 C928 2320560 Ceramic cap 100 p 5 96 50 V 0402 C929 2320560 Ceramic cap 100 p 5 96 50 V 0402 C930 2320560 Ceramic cap 100 p 5 96 50 V 0402 C931 2320560 Ceramic cap 100 p 5 96 50 V 0402 C933 2320560 Ceramic cap 100 p 5 96 50 V 0402 C970 2310752 Ceramic
128. 063 W 0402 R944 1430726 Chip resistor 100 5 0 063 W 0402 R945 1430726 Chip resistor 100 5 0 063 W 0402 R948 1430726 Chip resistor 100 5 0 063 W 0402 R949 1430726 Chip resistor 100 5 0 063 W 0402 R950 1430726 Chip resistor 100 5 0 063 W 0402 Amendment 1 04 97 Page 37 After Sales RAE RAK 1N Parts Lists Technical Documentation R951 1430726 Chip resistor 100 5 0 063 W 0402 R952 1430726 Chip resistor 100 5 0 063 W 0402 R953 1430726 Chip resistor 100 5 0 063 W 0402 R954 1430726 Chip resistor 100 5 0 063 W 0402 R955 1430726 Chip resistor 100 5 0 063 W 0402 R956 1430726 Chip resistor 100 5 0 063 W 0402 R970 1430726 Chip resistor 100 5 0 063 W 0402 R971 1430726 Chip resistor 100 5 0 063 W 0402 R972 1430726 Chip resistor 100 5 0 063 W 0402 R973 1430726 Chip resistor 100 5 0 063 W 0402 R974 1430788 Chip resistor 22k 5 96 0 063 W 0402 R975 1825001 Chip varistor vvm18v vc40v 0603 0603 R976 1825001 Chip varistor vvm18v vc40v 0603 0603 R980 1825001 Chip varistor vwm18v vc40v 0603 0603 R982 1825001 Chip varistor vvm18v vc40v 0603 0603 R983 1825001 Chip varistor vwwm18v vc40v 0603 0603 R984 1430726 Chip resistor 100 5 0 063 W 0402 R985 1430726 Chip resistor 100 5 0 063 W 0402 R986 1825001 Chip varistor vwm18v vc40v 0603 0603 R987 1430752 Chip resistor 820 5 0 063 W 0402 C068 2320544 Ceramic cap 22p 5 96 50 V 0402 C069 2320544 Ceramic cap 22p 5 96 50 V 0402 C079 2320544 Ceramic cap 22p 5 96 50 V 0402
129. 0756 Ceramic cap 3 3n 10 96 50 V 0402 C544 2320744 Ceramic cap 1 0n 10 96 50 V 0402 C545 2320728 Ceramic cap 220p 10 96 50 V 0402 C546 2320728 Ceramic cap 220p 10 96 50 V 0402 655 2320536 Ceramic cap 10p 5 96 50 V 0402 C552 2320560 Ceramic cap 100p 5 96 50 V 0402 G553 2320560 Ceramic cap 100p 5 96 50 V 0402 C554 2320564 Ceramic cap 150p 5 96 50 V 0402 C555 2320564 Ceramic cap 150p 5 96 50 V 0402 C556 2320752 Ceramic cap 2 2n 10 96 50 V 0402 C557 2320560 Ceramic cap 100p 5 96 50 V 0402 C558 2320560 Ceramic cap 100p 5 96 50 V 0402 C559 2320752 Ceramic cap 2 2n 10 96 50 V 0402 C560 2320752 Ceramic cap 2 2n 10 96 50 V 0402 C561 2320560 Ceramic cap 100p 5 96 50 V 0402 C562 2320075 Ceramic cap 470 p 5 96 50 V 0603 C563 2320578 Ceramic cap 560p 5 96 50 V 0402 C564 2320560 Ceramic cap 100p 5 96 50 V 0402 C565 2310470 Ceramic cap 270p 5 96 50 V 0805 C566 2320558 Ceramic cap 82p 5 96 50 V 0402 C567 2310470 Ceramic cap 270p 5 96 50 V 0805 C569 2320756 Ceramic cap 3 3n 10 96 50 V 0402 C570 2320756 Ceramic cap 3 3n 10 96 50 V 0402 65 1 2320756 Ceramic cap 3 3n 10 96 50 V 0402 C572 2310791 Ceramic cap 33n 20 96 50 V 0805 C573 2320560 Ceramic cap 100p 5 96 50 V 0402 C574 2320560 Ceramic cap 100p 5 96 50 V 0402 C575 2320530 Ceramic cap 5 6p 0 25 50 V 0402 C580 2320584 Ceramic cap 1 0n 5 96 50 V 0402 C601 2310784 Ceramic cap 100n 10 25 V 0805 C602 2312410 Ceramic cap 1 0u 10 96 16 V 1206 C603 2312410 Ceramic cap
130. 1 04 97 After Sales RAE RAK 1N Technical Documentation UIF Table 6 RF Connectors IRF X05 RF Signal to from CMT module a q xig RF Clips connector to from An tenna UIF Mechanical Characteristics Table 7 UIF Mechanical Characteristics Weight 23g Typical Dimensions 165 0x50 8x4 0mm Typical Functional Description UIF Circuit Description The module is connected with 33 pin flex connector to the PDA Module 24 pin soldered connection to the CMT LCD module and 12 pin connector to the PDALCD The module includes following main blocks CMT keypad and PDA Soft keypad illumination CMT LCD Module interface PDA LCD connector Hinge flex connector Antenna impedance matching circuit Test pads for CMT LCD and LED testing Antenna connector and antenna clips Keypad scanning and display driver control COL 0 3 are used as column lines in keypad UIF 0 5 are used as row lines They are also multiplexed with display driver control signals When a key is pressed the ASIC gets an interrupt from a row and the MCU starts scanning One column at a time is written to low and rows are used to read which key it was The power off detection is multiplexed with one row when all keys on the row seems to be pressed the ASIC knows that power key is pressed The power key is also connected to PSL to switch the power on Row lines and UIF6 are used for display driver control UIF 0
131. 1 0u 10 96 16 V 1206 Page 12 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists C604 2310784 Ceramic cap 100n 10 96 25 V 0805 C605 2312410 Ceramic cap 1 0u 10 96 16 V 1206 C606 2310752 Ceramic cap 10n 20 96 50 V 0805 C607 2310784 Ceramic cap 100n 10 96 25 V 0805 C608 2310784 Ceramic cap 100n 10 96 25 V 0805 C609 2310784 Ceramic cap 100n 10 96 25 V 0805 C701 2320548 Ceramic cap 33p 5 96 50 V 0402 C702 2320560 Ceramic cap 100p 5 96 50 V 0402 C703 2320756 Ceramic cap 3 3n 10 96 50 V 0402 C704 2320518 Ceramic cap 1 8p 0 25 96 50 V 0402 C705 2320520 Ceramic cap 2 2p 0 25 96 50 V 0402 C710 2320534 Ceramic cap 8 2p 0 25 50 V 0402 C711 2320558 Ceramic cap 82p 5 96 50 V 0402 C712 2320530 Ceramic cap 5 6p 0 25 96 50 V 0402 C713 2320516 Ceramic cap 1 5p 0 25 96 50 V 0402 C716 2320530 Ceramic cap 5 6p 0 25 96 50 V 0402 C720 2320552 Ceramic cap 47 p 5 96 50 V 0402 C721 2320744 Ceramic cap 1 0n 10 96 50 V 0402 C722 2320524 Ceramic cap 3 3p 0 25 50 V 0402 C723 2320518 Ceramic cap 1 8p 0 25 96 50 V 0402 C725 2320552 Ceramic cap 47 p 5 96 50 V 0402 C726 2320524 Ceramic cap 3 3p 0 25 96 50 V 0402 C728 2320524 Ceramic cap 3 3p 0 25 50 V 0402 C729 2320516 Ceramic cap 1 5p 0 25 96 50 V 0402 C730 2320552 Ceramic cap 47p 5 96 50 V 0402 C731 2320522 Ceramic cap 2 7p 0 25 96 50 V 0402 C732 2320534 Ceramic cap 8 2p 0 25 50 V 0402 C735 2320584 Ceramic cap 1 0n 5 96 50 V 0402 C736 2320584 C
132. 1 Ceramic cap 33n 10 96 16 V 0603 C395 2320620 Ceramic cap 10n 5 96 16 V 0402 Page 10 Amendment 1 04 97 After Sales Technical Documentation C396 2610100 C400 2312292 C401 2320598 C402 2320584 C403 2320544 C404 2610128 C405 2310784 C406 2604209 C407 2310784 C408 2320544 C409 2320544 C410 2320544 C411 2320544 C412 2604199 C413 2320620 C414 2320620 C415 2320744 C416 2320744 C417 2320544 C418 2320544 C420 2320544 C421 2610100 C422 2610100 C423 2610100 C424 2610100 C425 2320131 C426 2610100 C430 2320131 C431 2320131 C432 2320131 C433 2310791 C434 2310791 C435 2310791 C436 2320131 C437 2320131 C501 2320522 C502 2320560 C503 2320560 C504 2320544 C505 2320544 C506 2320526 C511 2320534 Amendment 1 04 97 Tantalum cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Tantalum cap Ceramic cap Tantalum cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Tantalum cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Tantalum cap Tantalum cap Tantalum cap Tantalum cap Ceramic cap Tantalum cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap Ceramic cap tu 470n 3 9 n 1 0n 22p 10u 100 n 1 0u 100n 22 p 22 p 22 p 22 p 2 2 u 10n 10n 1 0 n 1 0 n 22 p
133. 146 1430135 Chip resistor 10M 5 0 063 W 0603 R147 1430834 Chip resistor 3 3 M 5 0 063 W 0402 R148 1430804 Chip resistor 100 k 5 0 063 W 0402 R150 1430726 Chip resistor 100 5 0 063 W 0402 R151 1430726 Chip resistor 100 5 0 063 W 0402 R175 1430015 Chip resistor 470 5 0 063 W 0603 R176 1411282 Chip resistor 4 7 5 96 0 12 W 1206 R177 1430762 Chip resistor 2 2 k 5 0 063 W 0402 R180 1430714 Chip resistor 33 5 0 063 W 0402 R181 1430714 Chip resistor 33 5 0 063 W 0402 R182 1430714 Chip resistor 33 5 0 063 W 0402 R183 1430714 Chip resistor 33 5 0 063 W 0402 R184 1430714 Chip resistor 33 5 0 063 W 0402 R185 1430714 Chip resistor 33 5 0 063 W 0402 R186 1430714 Chip resistor 33 5 0 063 W 0402 R187 1430714 Chip resistor 33 5 0 063 W 0402 R188 1430714 Chip resistor 33 5 0 063 W 0402 R189 1430714 Chip resistor 33 5 0 063 W 0402 R192 1430714 Chip resistor 33 5 0 063 W 0402 R193 1430714 Chip resistor 33 5 0 063 W 0402 R194 1430714 Chip resistor 33 5 0 063 W 0402 R195 1430714 Chip resistor 33 5 0 063 W 0402 R900 1430726 Chip resistor 100 5 0 063 W 0402 Page 36 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists R901 1430722 Chip resistor 68 5 0 063 W 0402 R902 1430726 Chip resistor 100 5 0 063 W 0402 R903 1430722 Chip resistor 68 5 0 063 W 0402 R904 1430726 Chip resistor 100 5 0 063 W 0402 R905 1430722 Chip resistor 68 5 0 063 W 0402 R906 1430726 Chip resistor 100 5 0 063 W 040
134. 155 C156 around it It is also possible that the actual CPU chip is defective If the XTALI signal is OK but PLLDIV24 signal is not available LPLLI components R136 C151 C152 and IREFL R138 must be checked V131 C147 and C149 are also crucial for PLL functionality If all these seem to be OK the actual CPU chip is probably defective Bus Activity in Address Data Read Write and Chip Selects If the PLL is functional then the CPU system clock should be running and should try to fetch code from the Flash that is controlled by the UCSX Analyzing the code fetching cycles is beyond the scope of this document and is not needed during normal troubleshooting The main idea of this is just to check the signal levels and to see that there is something happening i e the CPU is not totally dead If there is some bus activity in all data lines and the signal levels are adequate the data bus can be considered to be functional If there is some bus activity in the lower address lines and the signal levels are adequate the address bus can be considered to be functional The CPU should also try to read data from and to the memories also the UCSX line should toggle within normal voltage limits If there are illegal signal levels the faulty component can be isolated by disconnecting each component in the signal line one by one The cycles vary according to the code in the D163 Flash and therefore there is not necessarily no activity in MEMWX an
135. 2 C205 2320778 Ceramic cap 10n 10 96 16 V 0402 C206 2320560 Ceramic cap 100p 5 96 50 V 0402 C207 2320560 Ceramic cap 100p 5 96 50 V 0402 C210 2320131 Ceramic cap 33n 10 96 16 V 0603 C211 2320131 Ceramic cap 33n 10 96 16 V 0603 C212 2320131 Ceramic cap 33n 10 96 16 V 0603 C213 2320131 Ceramic cap 33n 10 96 16 V 0603 Page 8 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists C214 2320131 Ceramic cap 33n 10 96 16 V 0603 0215 2320131 Ceramic cap 33n 10 16 V 0603 C216 2320131 Ceramic cap 33n 10 96 16 V 0603 C217 2320131 Ceramic cap 33n 10 96 16 V 0603 C218 2320131 Ceramic cap 33n 10 96 16 V 0603 C219 2320131 Ceramic cap 33n 10 96 16 V 0603 C220 2320744 Ceramic cap 1 0n 10 96 50 V 0402 C221 2320544 Ceramic cap 22p 5 96 50 V 0402 C225 2320107 Ceramic cap 10n 5 96 50 V 0603 C230 2320560 Ceramic cap 100p 5 96 50 V 0402 C231 2320620 Ceramic cap 10n 5 96 16 V 0402 C232 2604209 Tantalum cap 1 0u 20 16 V 3 2x1 6x1 6 C233 2604209 Tantalum cap 1 0u 20 16 V 3 2x1 6x1 6 C234 2320744 Ceramic cap 1 0n 10 96 50 V 0402 C235 2310791 Ceramic cap 33n 20 50 V 0805 C236 2320620 Ceramic cap 10n 5 96 16 V 0402 C237 2604329 Tantalum cap 4 7u 20 96 10 V 3 5x2 8x1 9 C238 2604329 Tantalum cap 4 7 u 20 96 10 V 3 5x2 8x1 9 C239 2604329 Tantalum cap 4 7 u 20 96 10 V 3 5x2 8x1 9 C240 2320778 Ceramic cap 10n 10 96 16 V 0402 C241 2604329 Tantalum cap 4 7u 20 96 10 V 3 5x2 8x1 9 C242 2320560 Ceramic
136. 2 CHIPCAP NPO 5P6 C 50V 0402 CHIPTCAP 1U M 10V 2 0X1 3X1 2 CHIPCAP X7R 1NO J 50V 0402 CHIPCAP NPO 22P J 50V 0402 CHIPCAP NPO 10P J 50V 0402 CHIPCAP NPO 10P J 50V 0402 CHIPCAP NPO 10P J 50V 0402 CHIPCAP NPO 2P2 C 50V 0402 CHIPCAP NPO 100P J 50V 0402 CHIPCAP X7R 1NO K 50V 0402 CHIPCAP NPO 8P2 C 50V 0402 CHIPCAP NPO 8P2 C 50V 0402 CHIPCAP NPO 4P7 C 50V 0402 CHIPCAP NPO 100P J 50V 0402 CHIPCAP NPO 100P J 50V 0402 TC7S00F 1XNAND 2INPUT CMOS SSO5 TC7S00F 1XNAND 2INPUT CMOS SSO5 SMCRYST 60 2MHZ 50PPM7 3X4 9X1 1 FERRITE BEAD 30R 100MHZ 2A 1206 FERRITE BEAD 0 2R 26R 100MHZ 1206 FERRITE BEAD 30R 100MHZ 2A 1206 CHIP COIL 100N K Q40 150MHZ 0805 FERRITE BEAD 0 2R 26R 100MHZ 1206 FERRITE BEAD 0 2R 26R 100MHZ 1206 FERRITE BEAD 0 2R 26R 100MHZ 1206 CHIP COIL 470NH J Q30 25MHZ 1008 CHIP COIL 82N K Q40 150MHZ 0805 CHIP COIL 33N M Q40 250MHZ 0805 CHIP COIL 560NH J 1206 CHIP COIL 220N K Q30 100MHZ 0805 CHIP COIL 120N K Q35 150MHZ 0805 CHIP COIL 180NH K 1206 CHIP COIL 270NH K 1206 CHIP COIL 270NH K 1206 Page 31 RAE RAK 1N Parts Lists L545 L551 L700 L710 L711 L800 L801 L840 L841 N230 N400 N551 N601 N790 N820 T300 V200 V201 V202 V230 V231 V232 V250 V251 V253 V254 V255 V256 V257 V300 V301 V302 V303 V320 V330 V331 V370 V380 V381 V400 V420 V460 Page 32 3608238 3641522 3606946 3641536 3641536 3641206 3641206 3641572 3641522 4375588 4340303 4370091 4370095 4349576 4340021 3640402 411182
137. 2 R907 1430722 Chip resistor 68 5 0 063 W 0402 R908 1430726 Chip resistor 100 5 0 063 W 0402 R909 1430722 Chip resistor 68 5 0 063 W 0402 R910 1430726 Chip resistor 100 5 0 063 W 0402 R911 1430722 Chip resistor 68 5 0 063 W 0402 R912 1430726 Chip resistor 100 5 0 063 W 0402 R913 1430722 Chip resistor 68 5 0 063 W 0402 R914 1430726 Chip resistor 100 5 0 063 W 0402 R915 1430722 Chip resistor 68 5 0 063 W 0402 R916 1430726 Chip resistor 100 5 0 063 W 0402 R917 1430722 Chip resistor 68 5 0 063 W 0402 R922 1430726 Chip resistor 100 5 0 063 W 0402 R923 1430726 Chip resistor 100 5 0 063 W 0402 R924 1430726 Chip resistor 100 5 0 063 W 0402 R925 1430726 Chip resistor 100 5 0 063 W 0402 R926 1430726 Chip resistor 100 5 0 063 W 0402 R927 1430722 Chip resistor 68 5 96 0 063 W 0402 R928 1430726 Chip resistor 100 5 0 063 W 0402 R929 1430726 Chip resistor 100 5 0 063 W 0402 R930 1430726 Chip resistor 100 5 0 063 W 0402 R931 1430726 Chip resistor 100 5 0 063 W 0402 R932 1430726 Chip resistor 100 5 0 063 W 0402 R933 1430722 Chip resistor 68 5 0 063 W 0402 R936 1430714 Chip resistor 33 5 0 063 W 0402 R937 1430714 Chip resistor 33 5 0 063 W 0402 R938 1430726 Chip resistor 100 5 0 063 W 0402 R939 1430726 Chip resistor 100 5 0 063 W 0402 R940 1430726 Chip resistor 100 5 0 063 W 0402 R941 1430722 Chip resistor 68 5 0 063 W 0402 R942 1430726 Chip resistor 100 5 0 063 W 0402 R943 1430726 Chip resistor 100 5 0
138. 2320530 CHIPCAP NPO 5P6 C 50V 0402 C580 2320744 CHIPCAP X7R 1NO K 50V 0402 C581 2320516 CHIPCAP NPO 1P5 C 50V 0402 C582 2320516 CHIPCAP NPO 1P5 C 50V 0402 C601 2310784 CHIPCAP X7R 100N K 25V 0805 C602 2312410 CHIPCAP X5R 1U0 K 16V 1206 C603 2312410 CHIPCAP X5R 1U0 K 16V 1206 C604 2310784 CHIPCAP X7R 100N K 25V 0805 C605 2312410 CHIPCAP X5R 1U0 K 16V 1206 C606 2310791 CHIPCAP X7R 33N M 50V 0805 C607 2310784 CHIPCAP X7R 100N K 25V 0805 C608 2310784 CHIPCAP X7R 100N K 25V 0805 C609 2310784 CHIPCAP X7R 100N K 25V 0805 C701 2320548 CHIPCAP NPO 33P J 50V 0402 C702 2320560 CHIPCAP NPO 100P J 50V 0402 C703 2320756 CHIPCAP X7R 3N3 K 50V 0402 C704 2320516 CHIPCAP NPO 1P5 C 50V 0402 C705 2320514 CHIPCAP NPO 1P2 C 50V 0402 C710 2320744 CHIPCAP X7R 1NO K 50V 0402 C711 2320536 CHIPCAP NPO 10P J 50V 0402 C712 2320522 CHIPCAP NPO 2P7 C 50V 0402 C714 2320534 CHIPCAP NPO 8P2 C 50V 0402 C715 2320522 CHIPCAP NPO 2P7 C 50V 0402 C717 2320524 CHIPCAP NPO 3P3 C 50V 0402 C718 2320518 CHIPCAP NPO 1P8 C 50V 0402 C720 2320544 CHIPCAP NPO 22P J 50V 0402 C721 2320744 CHIPCAP X7R 1NO K 50V 0402 0725 2320544 CHIPCAP NPO 22P J 50V 0402 C726 2320516 CHIPCAP NPO 1P5 C 50V 0402 C727 2320560 CHIPCAP NPO 100P J 50V 0402 C729 2320524 CHIPCAP NPO 3P3 C 50V 0402 C730 2320544 CHIPCAP NPO 22P J 50V 0402 C735 2320526 CHIPCAP NPO 3P9 C 50V 0402 C736 2320516 CHIPCAP NPO 1P5 C 50V 0402 C737 2320560 CHIPCAP NPO 100P J 50V 0402 C738 2320560 CHIPCAP NPO 100P J 50V 0402 C739 2320584 CHIPCAP
139. 250 MHz Chip coil 220n 5 96 Q 30 100 MHz Chip coil 56 n 10 Q 40 200 MHz Chip coil 10 Q 25 7 96 MHz Chip coil 10 Q 25 7 96 MHz Chip coil 68 n 5 Q 40 200 MHz Chip coil 39 n 20 Q 40 250 MHz Crystal 26 000 M Vco 1006 1031mhz4 5v 15ma Crystal 60 2 M Dupl 890 915 935 960mhz Saw filter 947 54 12 5 M Saw filter 714 0 08 M Cer filt 13 0 09mhz 330r Cer filt 902 5 12 5mhz Transformer 4 1 balun 800mhz smd Page 15 RAE RAK 1N Parts Lists V200 V201 V202 V230 V231 V232 V250 V251 V253 V254 V255 V256 V257 V300 V301 V302 V303 V320 V330 V331 V370 V380 V381 V400 V420 V460 V501 V502 V503 V511 V512 V541 V701 V702 V710 V725 Page 16 4111824 4111824 4100285 4210020 4200877 4210020 4210020 4110074 4200226 4200226 4200909 4110126 4202671 4210079 4210079 4210050 4210100 4110014 4210100 4200909 4210102 4200829 4200811 4200917 4117998 4110014 4210046 4210102 4210100 4115802 4210066 4210066 4210066 4100567 4200755 4200755 After Sales Technical Documentation Diode BAS16 75V 250 mA 6 ns SOT23 Diode BAS16 75V 250 mA 6 ns SOT23 Diode x 2 BAV99 70V200mASER SOT23 Transistor BCP69 25pnp 20 V 1 A SOT223 Transistor BCX51 16pnp 45 V 1 5 A SOT89 Transistor BCP69 25pnp 20 V 1 A SOT223 Transistor BCP69 25pnp 20 V 1 A SOT223 Schottky diode STPS340U40 V 3 A SOD6 Darl transistor BCV27npn 30 V 300 mA SOT23 Darl transistor BCV27 npn 30 V 300 mA SOT23
140. 2K2 J 0402 R360 1430726 CHIPRES 0W06 100R J 0402 R361 1430754 CHIPRES OW06 1KO J 0402 R362 1430754 CHIPRES OW06 1KO J 0402 R363 1430754 CHIPRES 0WO06 1KO J 0402 R364 1430754 CHIPRES OW06 1KO J 0402 R365 1430754 CHIPRES OW06 1KO J 0402 R366 1430754 CHIPRES OW06 1KO J 0402 R367 1430754 CHIPRES OW06 1KO J 0402 Amendment 1 04 97 Page 19 After Sales RAE RAK 1N Parts Lists Technical Documentation R370 1430796 CHIPRES 0WO06 47K J 0402 R372 1430798 CHIPRES OW06 56K J 0402 R373 1430804 CHIPRES 0W06 100K J 0402 R374 1430826 CHIPRES 0W06 680K J 0402 R375 1430804 CHIPRES 0W06 100K J 0402 R380 1430804 CHIPRES 0W06 100K J 0402 R381 1430804 CHIPRES 0W06 100K J 0402 R382 1430778 CHIPRES OW06 10K J 0402 R383 1430792 CHIPRES 0W06 33K J 0402 R384 1430754 CHIPRES OW06 1KO J 0402 R385 1430754 CHIPRES OW06 1KO J 0402 R386 1430726 CHIPRES 0W06 100R J 0402 R387 1430784 CHIPRES OW06 15K J 0402 R388 1430778 CHIPRES OW06 10K J 0402 R389 1430754 CHIPRES OW06 1KO J 0402 R390 1430754 CHIPRES OW06 1KO J 0402 R391 1430760 CHIPRES 0W06 1K8 J 0402 R400 1430796 CHIPRES 0WO06 47K J 0402 R401 1430778 CHIPRES OW06 10K J 0402 R402 1430778 CHIPRES OW06 10K J 0402 R403 1430778 CHIPRES OW06 10K J 0402 R404 1430778 CHIPRES OW06 10K J 0402 R405 1430700 CHIPRES OW06 10R J 0402 R406 1430700 CHIPRES OW06 10R J 0402 R407 1430804 CHIPRES 0W06 100K J 0402 R408 1430726 CHIPRES 0W06 100R J 0402 R420 1430752 CHIPRES 0W06 820R J 0402 R421 1430726 CHIPRES 0W06 100R J 0402 R462 14307
141. 30R 22R 3 ez 8 C515 C516 X503 5 z E x 3n3 100p a Oz f 1 3837 0 JAPN ID CC 0 7 0 719 0 1 std S essg NIK R559 Sly F UHFLOD gt GEN eet 5m E 180R 1 330R mn S e D a o a i x T lr 2551 Z mee R564 8 8 L LKOY PU 0561 pe BE ES pn 2 1S 190p 13MHz Se a 2 eet 120R 2T0R D P TXO TI 4501 T 2n2 4109 inet Si 2 c564 g 2 gt 2n2 056 i 2 1000 O C559 1 A16BF44T 3k3 b EE 1 IN OUTP rx L7 3 ge 2 INP OUTM_rxif 12 8 2568 RX RTIA RTIS X502 ge 188p 4 Jus om cart 13 s ll e LC 7 0558 5 ec OUTP t 28 I PEs ET GND 2 r u F 2 IN f Lp S 31 OR EI IR 21 e a Xi OWC m n w En S ER s um XE VHFLOL gt ue ne 10 INP rxif o OUT omo 2 is By iS EJIIS SIE me 11 VB2_rxif 15 LO l For product ion test ing only 16 LO ch 0551 18 Lo o 19 ef MODO o R551 S fio D TXIN 1 IL As C569 p C554 22 NP i_tx EM R601 gx a Nat x a AA E P 65 SYNTHP DST NE N 1580 z y atx V prot VREF S 2k2 A TXIP L 3 XA puc VRX 5 i A 3 XP puc vex 14 1 ee 2554 21 constantzowc ei 44 i C a 35 pET D PWC UEKI 20FS28T VBATT XQ A7 e 36 VB ext VIX 29 a C60T well C555 38 XC puc ut 29 A 1 28 in X 7 39 21 VRF VR1 R602 OIN 1500 GC_rx VTX 2 owrvRa oe 27 lt R556 2118 7 B GE lacas 3 cvrvR cNTVRG 26 Se TXPWR TXQ IRC ee 4 ES 42 opaout owe VDX stow 32 4 VHLO VPLL p Y nd GNDE2S j R603 ar l T tu ftu m P RU vrs 24 lt RXPWR Da g 2 8 17 29
142. 33 43 GND 0 311 0 918 0 00 0 7 0 49 0 1 std 0 SJ VR4 VRF 23 2x2 bo Sa 0580 1 VRF veg 22 i n Ind i VR Baseves 21 gt so L 3 6ND GND 28 y Es 18 VR5 vR7 18 gue ell 11 VRF VRF 18 S 8 L y 12 CNTBIAS CNTVRT 1T C609 d R579 C604 ta 13 VBIAS CNTVR8 16 100n 100n 14 VR3 CNTVR3 5 l Z 10k Lond Lo oh m e R576 0606 C 10n ll a loco Cell Elie ae gael es x e GE rell zi amp is C DET b Original 08 96 Page 10 17 RAK 1N Figure 18 PCN Component Layout Bottom 079 OZY 029 8078 5078 ES ggg CO 8024 2027 OO amp DES 8 ZE ST 0071 E CO ko O CN O Li xr Y C L 053 La 2269 1020 0208 l y vun Cu Da Dez 1200 2 Qo 22 2S oS 3 c2 x e d LOL SS won 8 S FEES 1268 2a o o m 9080 8923 3 7 666M N fe s SC A SN S IS wm EU Lm E E 87L 029 F la ERE a e Ka oco A e 1958 JET 1 8 Me lt ve CIA COLA lie CLS Gog S e SE 5 KI PGS S129 Er C p7 SY G6 C968 z ul s i HERCHEN 12699 e 719 SUL e Doc 1866 i Z E 60 8 re S side S Tec E 6 62 amp i D S eles Que z S 3 E ES E Oo s918 eene el E S 2 1598 E ac Ess 2 m c S B
143. 4 8 bit MCU and User Interface keyboard and display communication is controlled through the ASIC COL 3 0 are used as column lines in keyboard UIF 5 0 are used as row lines They are also multiplexed with display driver control signals When a key is pressed the ASIC gets a reset from row and starts scanning One column at the time is written to low and rows are used to read which key it was Row lines and UIF6 are used for display driver control UIF 3 0 are used as 4 bit parallel data bus for the LCD driver UIF4 is used as read write strobe UIF5 to select data or instruction register and UIF6 as enable strobe The SIM interface is the electrical interface between the SIM the smart card used in the GSM and PCN applications and the MCU via the ASIC ASIC converts the serial data received from the SIM to parallel data for MCU and converts parallel data from MCU to serial mode for the card The SIM interface also takes care of the power up and down procedure to the card in addition to frame and parity error checking The communication between card and ASIC is asyncronous and half duplex Four signals are used between the ASIC and the SIM card SIMDATA SIMCLK SIMRESET and VSIM The nominal clock frequency is 3 25 MHz When there is no data transfer between the SIM card and the CMT the clock can be reduced to 1 625 MHz Some SIM cards also allow the clock to be stopped in that mode Supply voltage VSIM can be switched off by the ASIC The s
144. 4 4111824 4100285 4210020 4200877 4210020 4210020 4110074 4200226 4200226 4200909 4110126 4202671 4210079 4210079 4210050 4210100 4110014 4210100 4200909 4210102 4200829 4200811 4200917 4117998 4110014 After Sales Technical Documentation CHIP COIL 180NH K 1206 CHIP COIL 6N8 M Q50 250MHZ 0805 FERRITE BEAD 0 2R 26R 100MHZ 1206 CHIP COIL 33N M Q40 250MHZ 0805 CHIP COIL 33N M Q40 250MHZ 0805 CHIP COIL 3U3 K Q25 7 96MHZ 1008 CHIP COIL 3U3 K Q25 7 96MHZ 1008 CHIP COIL 22N J Q45 250MHZ 0805 CHIP COIL 6N8 M Q50 250MHZ 0805 PSL POWER SUPPLY VERSION D SO24W LM4861 AF AMP 0 5W 2 7 5 5V SO8S CRFRT_ST TX MOD RXIF PWC SQFP44 CRFCONTF 8XREG4 5V VREF2V5 VSOP28 ICL7660 V CONV 1 5 12VTO NEG SO8 LMX2331 2XSYNTH 2G 510MHZ SSO20 TRANSFORMER 4 1 BALUN 800MHZ SMD DI BAS16 75V 250MA 6NS SOT23 DI BAS16 75V 250MA6NS SOT23 DIX2 BAV99 70V 200MA IN SER SOT23 TR BCP69 25 P 20V 1A gt 160 SOT223 TR BCX51 16 P 45V 1 5A 1W SOT89 TR BCP69 25 P 20V 1A gt 160 SOT223 TR BCP69 25 P 20V 1A gt 160 SOT223 SCH DI STPS340U 40V 3A SOD6 TR BCV27 N 30V 300MA DARL SOT23 TR BCV27 N 30V 300MA DARL SOT23 TR BC858B BCW30 P 30V 100MA SOT23 ZDI BZX84 4 3V 596 0 3W SOT23 FET BST82 N 80V 175MA 7R SOT23 TR BFS17 N 15V 50MA 1 3GHZ SOT23 TR BFS17 N 15V 50MA 1 3GHZ SOT23 TR DTA114EE P RB RBE 10K EMS3 TR BC848W N 30V 0 1A100MHZ SOT323 SCHDIX2 BAS70 07 70V 15MA SOT143 TR BC848W N 30V 0 1A100MHZ SOT323 TR BC858B BCW30 P 30V 100MA SOT23 TR BC858W
145. 402 C325 2320560 CHIPCAP NPO 100P J 50V 0402 C326 2320560 CHIPCAP NPO 100P J 50V 0402 C330 2320560 CHIPCAP NPO 100P J 50V 0402 C331 2320536 CHIPCAP NPO 10P J 50V 0402 C332 2320620 CHIPCAP X7R 10N J 16V 0402 C333 2320536 CHIPCAP NPO 10P J 50V 0402 C340 2320560 CHIPCAP NPO 100P J 50V 0402 Amendment 1 04 97 Page 25 After Sales RAE RAK 1N Parts Lists Technical Documentation C341 2320560 CHIPCAP NPO 100P J 50V 0402 C342 2320560 CHIPCAP NPO 100P J 50V 0402 C343 2320560 CHIPCAP NPO 100P J 50V 0402 C345 2320560 CHIPCAP NPO 100P J 50V 0402 C346 2320552 CHIPCAP NPO 47P J 50V 0402 C347 2320560 CHIPCAP NPO 100P J 50V 0402 C348 2320560 CHIPCAP NPO 100P J 50V 0402 C349 2320560 CHIPCAP NPO 100P J 50V 0402 C350 2320560 CHIPCAP NPO 100P J 50V 0402 C360 2320544 CHIPCAP NPO 22P J 50V 0402 C361 2320560 CHIPCAP NPO 100P J 50V 0402 C362 2320560 CHIPCAP NPO 100P J 50V 0402 C363 2320560 CHIPCAP NPO 100P J 50V 0402 C380 2320560 CHIPCAP NPO 100P J 50V 0402 C381 2604209 CHIPTCAP 1U0 M 16V 3 2X1 6X1 6 C382 2320604 CHIPCAP NPO 18P J 50V 0402 C383 2320604 CHIPCAP NPO 18P J 50V 0402 C384 2320131 CHIPCAP X7R 33N K 16V 0603 C385 2320131 CHIPCAP X7R 33N K 16V 0603 C386 2320131 CHIPCAP X7R 33N K 16V 0603 C387 2320131 CHIPCAP X7R 33N K 16V 0603 C388 2320131 CHIPCAP X7R 33N K 16V 0603 C389 2320560 CHIPCAP NPO 100P J 50V 0402 C390 2320560 CHIPCAP NPO 100P J 50V 0402 C391 2320560 CHIPCAP NPO 100P J 50V 0402 C392 2320560 CHIPCAP NPO 100P J 50V 0402 C393 2320560 CHIPCAP
146. 402 R737 1430812 Chip resistor 220 k 5 0 063 W 0402 R738 1430780 Chip resistor 12k 5 0 063 W 0402 R739 1430762 Chip resistor 2 2 k 5 0 063 W 0402 R740 1430115 Chip resistor 2 2 k 1 96 0 063 W 0402 R741 1430746 Chip resistor 560 5 0 063 W 0402 R742 1430754 Chip resistor 1 0k 5 0 063 W 0402 R743 1430700 Chip resistor 10 5 0 063 W 0402 R755 1430754 Chip resistor 1 0k 5 0 063 W 0402 R756 1412279 Chip resistor 2 2 5 96 0 1 W 0805 R765 1430754 Chip resistor 1 0k 5 0 063 W 0402 R766 1430748 Chip resistor 680 5 0 063 W 0402 R767 1430732 Chip resistor 180 5 0 063 W 0402 R768 1430752 Chip resistor 820 5 0 063 W 0402 R769 1430693 Chip resistor 5 6 5 0 063 W 0402 R774 1430712 Chip resistor 27 5 0 063 W 0402 R775 1430712 Chip resistor 27 5 0 063 W 0402 R776 1430714 Chip resistor 33 5 0 063 W 0402 R780 1430762 Chip resistor 2 2 k 5 0 063 W 0402 R781 1430740 Chip resistor 330 5 0 063 W 0402 R782 1430726 Chip resistor 100 5 0 063 W 0402 R783 1430690 Chip jumper 0402 R784 1430726 Chip resistor 100 5 0 063 W 0402 R785 1430762 Chip resistor 2 2 k 5 0 063 W 0402 R800 1430778 Chip resistor 10k 5 0 063 W 0402 Amendment 1 04 97 Page 7 After Sales RAE RAK 1N Parts Lists Technical Documentation R801 1430796 Chip resistor 47k 5 96 0 063 W 0402 R802 1430796 Chip resistor 47k 5 0 063 W 0402 R803 1430754 Chip resistor 1 0k 5 0 063 W 0402 R804 1430788 Chip resistor 22k 5 96 0 063 W 0402 R805 1430786 Chip resistor 18k 5
147. 41 ES aam ale S 5 R802 R809 E Ese Es Ze R420 C293 a is gS L x S ag C80 Re46 841 S amp Y C304 R343 R402 S N sl S BIRSA 123A 2 05 R344 idi eg eS 7 8s am CN Y o Lo n wo MA ZULUSI L300 R345 3 R62 C412 C408 8277 H mm S R31 R346 S m AE R220 3 ER 3 E 3 pes ke i wo e ex vao B CX de e ei c 3 EE 3 ES ER 2S 2 UE je 2 gs aL S ol ge 80 ies C821 s n LNO N o o gt lt oo ES o 130 ss ULT Lea BI 3 R508 R800 1541 F R511 2505 V303 SE e 3 L545 R822 seent Al R372 3 z 0405 0404 3 V312 Siet a SIE 223 R370 R375 ee E E E 2551 5 L542 ele 228 3 ppl C432 Cal IF 17 S SO R514 T s Ea Us i 0422 0423 2 67 5 E oly R374 Gs R400 amp 3 Amendment 1 04 97 Page 10 21 Figure 20 PCN RF TX RAK 1N
148. 4110018 4340126 4340126 4375588 4340303 4370091 4370095 4340005 5469203 5409041 5469037 5469031 5429003 5420460 0200725 0200726 9854110 Amendment 1 04 97 RAE RAK 1N Parts Lists Transistor BC858W pnp 30V 100mA 200MWSOT323 Transistor BC848W npn 30V SOT323 Transistor x 2 IMD Transistor BC858W pnp 30V 100mA 200MWSOT323 Transistor BFG540 X npn 15V 129mA SOT143 Transistor BC858W pnp 30V 100mA 200MWSOT323 Transistor BFG10W X npn 10V 0 25A SOT343 Transistor BC848W npn 30 V SOT323 Transistor BC848W npn 30 V SOT323 Diode x 2 BAV99 70V 200mA SER SOT23 Transistor BLT82 npn 10 V SO8S Sch diode x2 BAS70 07 70V 15mA SOT143 Cap diode BB640 28 1 V SOD323 Transistor BFR93AW npn12V 35mA SOT323 Transistor BFR93AW npn12V 35mA SOT323 Transistor BFR93AW npn12V 35mA SOT323 Transistor BFR93AW npn12V 35mA SOT323 Cap diode BB135 30 V SOD323 IC 1xnand 2input cmos ss TC7SOOFSSO5 IC 1xnand 2input cmos ssTC7SOOFSSO5 IC PSL power supply SO24W IC af amp 0 5w 2 7 5 5v soLM4861 SO8S Crfrt st tx mod rxif pwc sqfp44 SQFP44 Crfcontf 8xreg4 5v vref2v5 vsop28 VSOP28 IC 2xsynth 1 2ghz 3v sso UMA1018MSS0O20 SM conn 2x22 f p0 8 pcb pcb 9 0 9 0MM SM conn battery 4pol p2 54 SM flex conn 12pol p0 5 u conta LL CONTACT SM conn chp2502 0101 1x2 m p1 2 SM coax conn recep 50r 3ghz 5x4 Coax conn female 50ohm switch ims Submodule Submodule PCB GE8 121X55X1 0 M6 2 PA Page 17 RAE RAK 1N After Sales Parts Lists Technical Docu
149. 412279 CHIPRES 0W1 2R2 J 0805 R765 1430762 CHIPRES OW06 2K2 J 0402 R766 1430754 CHIPRES OW06 1KO J 0402 R767 1430726 CHIPRES 0W06 100R J 0402 R768 1411123 MELFRES 0W25 0R22 J 0204 R774 1430712 CHIPRES 0W06 27R J 0402 R775 1430712 CHIPRES 0W06 27R J 0402 R776 1430714 CHIPRES 0W06 33R J 0402 R780 1430770 CHIPRES OW06 4K7 J 0402 R781 1430740 CHIPRES 0W06 330R J 0402 R782 1430726 CHIPRES 0W06 100R J 0402 R783 1430722 CHIPRES 0WO06 68R J 0402 R784 1430726 CHIPRES 0W06 100R J 0402 R785 1430762 CHIPRES OW06 2K2 J 0402 R790 1430700 CHIPRES OW06 10R J 0402 R791 1430718 CHIPRES OWOG 47R J 0402 R792 1430770 CHIPRES OWOG 4K7 J 0402 R800 1430778 CHIPRES OW06 10K J 0402 R801 1430796 CHIPRES OW06 47K J 0402 R802 1430796 CHIPRES 0WO06 47K J 0402 R803 1430762 CHIPRES OW06 2K2 J 0402 R804 1430788 CHIPRES 0W06 22K J 0402 R805 1430786 CHIPRES 0W06 18K J 0402 R806 1430774 CHIPRES 0W06 6K8 J 0402 R807 1430758 CHIPRES 0W06 1K5 J 0402 R808 1430734 CHIPRES OW06 220R J 0402 R809 1820024 NTC RES 0W2 47K J B240504 396 0805 R820 1430778 CHIPRES 0W06 10K J 0402 R821 1430786 CHIPRES OW06 18K J 0402 R822 1430778 CHIPRES OW06 10K J 0402 Amendment 1 04 97 Page 23 After Sales RAE RAK 1N Parts Lists Technical Documentation R823 1430770 CHIPRES OWOG 4K7 J 0402 R824 1430770 CHIPRES OWOG 4K7 J 0402 R825 1430770 CHIPRES OWOG 4K7 J 0402 R827 1430766 CHIPRES OW06 3K9 J 0402 R828 1430786 CHIPRES 0W06 18K J 0402 R829 1430718 CHIPRES OWOG 47R J 0402 R830 1430718 CHIPRES 0
150. 430762 Chip resistor 2 2k 5 0 063 W 0402 R341 1430762 Chip resistor 2 2k 5 0 063 W 0402 R342 1430762 Chip resistor 2 2k 5 0 063 W 0402 R343 1430762 Chip resistor 2 2k 5 0 063 W 0402 R344 1430762 Chip resistor 2 2k 5 0 063 W 0402 R345 1430762 Chip resistor 2 2k 5 0 063 W 0402 R346 1430762 Chip resistor 2 2k 5 0 063 W 0402 R360 1430726 Chip resistor 100 5 0 063 W 0402 R361 1430754 Chip resistor 1 0k 5 0 063 W 0402 R362 1430754 Chip resistor 1 0k 5 0 063 W 0402 R363 1430754 Chip resistor 1 0k 5 0 063 W 0402 R364 1430754 Chip resistor 1 0k 5 0 063 W 0402 R365 1430754 Chip resistor 1 0k 5 0 063 W 0402 Page 4 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists R366 1430754 Chip resistor 1 0k 5 0 063 W 0402 R367 1430754 Chip resistor 1 0k 5 0 063 W 0402 R370 1430796 Chip resistor 47k 5 0 063 W 0402 R372 1430798 Chip resistor 56k 5 96 0 063 W 0402 R373 1430804 Chip resistor 100 k 5 96 0 063 W 0402 R374 1430826 Chip resistor 680k 5 0 063 W 0402 R375 1430804 Chip resistor 100 k 5 0 063 W 0402 R380 1430804 Chip resistor 100 k 5 0 063 W 0402 R381 1430804 Chip resistor 100 k 5 0 063 W 0402 R382 1430778 Chip resistor 10k 5 0 063 W 0402 R383 1430792 Chip resistor 33k 5 0 063 W 0402 R384 1430754 Chip resistor 1 0k 5 0 063 W 0402 R385 1430754 Chip resistor 1 0k 5 0 063 W 0402 R386 1430726 Chip resistor 100 5 0 063 W 0402 R387 1430784 Chip resistor 15k 5 0 063 W 0402 R388 14307
151. 434 2310791 CHIPCAP X7R 33N M 50V 0805 C435 2310791 CHIPCAP X7R 33N M 50V 0805 C436 2320131 CHIPCAP X7R 33N K 16V 0603 C437 2320131 CHIPCAP X7R 33N K 16V 0603 C501 2320518 CHIPCAP NPO 1P8 C 50V 0402 C502 2320532 CHIPCAP NPO 6P8 C 50V 0402 C503 2320560 CHIPCAP NPO 100P J 50V 0402 C504 2320536 CHIPCAP NPO 10P J 50V 0402 C505 2320544 CHIPCAP NPO 22P J 50V 0402 C506 2320516 CHIPCAP NPO 1P5 C 50V 0402 C508 2320756 CHIPCAP X7R 3N3 K 50V 0402 C509 2320544 CHIPCAP NPO 22P J 50V 0402 C510 2320544 CHIPCAP NPO 22P J 50V 0402 C511 2320604 CHIPCAP NPO 18P J 50V 0402 C512 2320518 CHIPCAP NPO 1P8 C 50V 0402 6513 2320516 CHIPCAP NPO 1P5 C 50V 0402 C514 2320516 CHIPCAP NPO 1P5 C 50V 0402 C515 2320756 CHIPCAP X7R 3N3 K 50V 0402 C516 2320560 CHIPCAP NPO 100P J 50V 0402 C517 2320548 CHIPCAP NPO 33P J 50V 0402 C521 2320524 CHIPCAP NPO 3P3 C 50V 0402 C522 2320744 CHIPCAP X7R 1NO K 50V 0402 C523 2320550 CHIPCAP NPO 39P J 50V 0402 C524 2320544 CHIPCAP NPO 22P J 50V 0402 Amendment 1 04 97 Page 27 After Sales RAE RAK 1N Parts Lists Technical Documentation C525 2320544 CHIPCAP NPO 22P J 50V 0402 C526 2320604 CHIPCAP NPO 18P J 50V 0402 C527 2320544 CHIPCAP NPO 22P J 50V 0402 C528 2320526 CHIPCAP NPO 3P9 C 50V 0402 C529 2320532 CHIPCAP NPO 6P8 C 50V 0402 C530 2320604 CHIPCAP NPO 18P J 50V 0402 C531 2320520 CHIPCAP NPO 2P2 C 50V 0402 C532 2320540 CHIPCAP NPO 15P J 50V 0402 C533 2320744 CHIPCAP X7R 1NO K 50V 0402 C534 2320756 CHIPCAP X7R 3N3 K 50V 0402 C535 2320
152. 50 9X0 6 M4 2 PA Simflex Sub module GEM1 EDMS pn 0200713 issue 2 10 Item Code Description B001 5140576 Dynamic receiver 32r B002 5140458 Mic wire 61 5 2db1khz 2k 3v d6x3 B003 5140029 SM d buzzer 94db 5vdc40r X002 5409039 SM sim card conn 2x3 fix hole 7310007 Esd tape dmd00741 9460100 Mic boot b10538 9480103 Speaker pad2 9854120 FLEX PCB GEM1 Amendment 1 04 97 Page 47 RAE RAK 1N After Sales Parts Lists Technical Documentation 9450687 WINDOW 9450731 LENS ADHESIVE xx 9450712 A COVER xx 9450679 LATCH xx 6340001 ANTENNA INSERT xx 9790181 MAIN KEYPAD 0660124 ANTENNA GSM 0200708 GK2 CMT UI MODULE 9790182 POWER KEY 9480079 WINDOW GASKET xx 9480268 ADHESIVE 2PCS x 4850015 LCD MODULE 9790209 SCROLL KEYPAD 9790203 FUNCTION KEYMAT 9480253 MAGNET x 9450713 SCREEN mae 14 9510291 HINGE PIN xx 5420007 COAX CABLE xx 6290023 PT SCREW 1 8X4 4 PCS 9380596 STICKER 4 PCS 9560037 SPRING 2 PCS xx 9460188 HINGE LOCK PIN 2 PCS xx 7130007 33 PIN HINGE FLEX 9855034 PCB FLEX EMC NEW FLEX TAPES 9855035 PCB FLEX EMC OLD FLEX TAPES 9450681 HINGE CENTER PART xx 9450678 B COVER xx 9790177 KEYPAD ENGLISH 9790178 KEYPAD GERMAN 9790179 KEYPAD FRENCH 9790180 KEYPAD SCANDINAVIAN 9450680 IR WINDOW xx 0200709 GP1 PDA MODULE 9510324 ESD NETTING 1 xx 9480254 GASKET HF MIC xx 9510354 CLIP 5140039 HF SPEAKER 9480252 GASKET HF
153. 532 CHIPCAP NPO 6P8 C 50V 0402 C536 2320554 CHIPCAP NPO 56P J 50V 0402 C537 2320604 CHIPCAP NPO 18P J 50V 0402 C538 2320534 CHIPCAP NPO 8P2 C 50V 0402 C544 2320756 CHIPCAP X7R 3N3 K 50V 0402 C542 2320744 CHIPCAP X7R 1NO K 50V 0402 C543 2320756 CHIPCAP X7R 3N3 K 50V 0402 C544 2320744 CHIPCAP X7R 1NO K 50V 0402 C545 2320560 CHIPCAP NPO 100P J 50V 0402 C546 2320560 CHIPCAP NPO 100P J 50V 0402 C547 2320544 CHIPCAP NPO 22P J 50V 0402 C551 2320534 CHIPCAP NPO 8P2 C 50V 0402 C552 2320560 CHIPCAP NPO 100P J 50V 0402 C553 2320560 CHIPCAP NPO 100P J 50V 0402 C554 2320564 CHIPCAP NPO 150P J 50V 0402 C555 2320564 CHIPCAP NPO 150P J 50V 0402 C556 2320752 CHIPCAP X7R 2N2 K 50V 0402 C557 2320560 CHIPCAP NPO 100P J 50V 0402 C558 2320560 CHIPCAP NPO 100P J 50V 0402 C559 2320752 CHIPCAP X7R 2N2 K 50V 0402 C560 2320752 CHIPCAP X7R 2N2 K 50V 0402 C561 2320560 CHIPCAP NPO 100P J 50V 0402 C562 2320075 CHIPCAP X7R 470P J 50V 0603 C563 2320578 CHIPCAP X7R 560P J 50V 0402 C564 2320560 CHIPCAP NPO 100P J 50V 0402 C565 2310470 CHIPCAP NPO 270P J 50V 0805 C566 2320558 CHIPCAP NPO 82P J 50V 0402 C567 2310470 CHIPCAP NPO 270P J 50V 0805 C569 2320756 CHIPCAP X7R 3N3 K 50V 0402 C570 2320756 CHIPCAP X7R 3N3 K 50V 0402 C571 2320756 CHIPCAP X7R 3N3 K 50V 0402 C572 2310791 CHIPCAP X7R 33N M 50V 0805 Page 28 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists C573 2320560 CHIPCAP NPO 100P J 50V 0402 C574 2320560 CHIPCAP NPO 100P J 50V 0402 C575
154. 54 CHIPRES OW06 1KO J 0402 R500 1430690 CHIPRES JUMPER ORO 0402 R501 1430770 CHIPRES OW06 4K7 J 0402 R502 1430732 CHIPRES 0W06 180R J 0402 R503 1430728 CHIPRES OW06 120R J 0402 R504 1430778 CHIPRES OW06 10K J 0402 R505 1430772 CHIPRES OW06 5K6 J 0402 R506 1430710 CHIPRES 0W06 22R J 0402 R507 1430804 CHIPRES 0W06 100K J 0402 R508 1430804 CHIPRES 0W06 100K J 0402 R509 1430774 CHIPRES 0W06 6K8 J 0402 R510 1430762 CHIPRES OW06 2K2 J 0402 R511 1430770 CHIPRES OWOG 4K7 J 0402 R512 1430832 CHIPRES 0W06 2K7 J 0402 Page 20 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists R513 1430744 CHIPRES 0W06 470R J 0402 R514 1430710 CHIPRES 0W06 22R J 0402 R518 1430778 CHIPRES OW06 10K J 0402 R521 1430754 CHIPRES OW06 1KO J 0402 R522 1430762 CHIPRES OW06 2K2 J 0402 R523 1430756 CHIPRES 0W06 1K2 J 0402 R524 1430734 CHIPRES OW06 220R J 0402 R525 1430734 CHIPRES OW06 220R J 0402 R531 1430710 CHIPRES OWOG 22R J 0402 R532 1430740 CHIPRES OW06 330R J 0402 R533 1430770 CHIPRES 0WO06 4K7 J 0402 R534 1430832 CHIPRES OW06 2K7 J 0402 R535 1430710 CHIPRES 0W06 22R J 0402 R541 1430710 CHIPRES 0W06 22R J 0402 R543 1430740 CHIPRES 0W06 330R J 0402 R544 1430762 CHIPRES 0W06 2K2 J 0402 R545 1430758 CHIPRES 0W06 1K5 J 0402 R546 1430724 CHIPRES 0W06 82R J 0402 R547 1430744 CHIPRES 0W06 470R J 0402 R548 1430734 CHIPRES OW06 220R J 0402 R549 1430778 CHIPRES OW06 10K J 0402 R550 1430778 CHIPRES OW06 10K J 0402 R551 1430770 CHIPRES OWOG 4K7 J 0402
155. 603 C026 2320043 Ceramic cap 22p 5 96 50 V 0603 C027 2320043 Ceramic cap 22p 5 96 50 V 0603 C028 2320043 Ceramic cap 22p 5 96 50 V 0603 C029 2310375 Ceramic cap 39 p 5 96 50 V 0805 L001 3641520 Chip coil 3n 20 96 Q 50 250 MHz 0805 L002 3640013 Chip coil 8n 5 96 Q 50 250 MHz 0805 V011 4864388 Led Green 0603 V012 4864388 Led Green 0603 V013 4864388 Led Green 0603 V014 4864388 Led Green 0603 V015 4864388 Led Green 0603 V016 4864388 Led Green 0603 V017 4864388 Led Green 0603 V018 4864388 Led Green 0603 V019 4864388 Led Green 0603 V020 4864388 Led Green 0603 V021 4864388 Led Green 0603 V022 4864388 Led Green 0603 V023 4864388 Led Green 0603 V024 4864388 Led Green 0603 V026 4864388 Led Green 0603 V027 4864388 Led Green 0603 V028 4864388 Led Green 0603 V029 4864388 Led Green 0603 V030 4864388 Led Green 0603 V031 4864388 Led Green 0603 V032 4864388 Led Green 0603 V033 4864388 Led Green 0603 V034 4864388 Led Green 0603 V036 4111824 Diode BAS16 75 V 250 mA 6 ns SOT23 V038 4864388 Led Green 0603 V040 4200811 TransistorBC849C npn 30 V 0 1 A SOT23 V041 4200836 TransistorBCX19 npn 50 V 0 5 A SOT23 V042 4200836 TransistorBCX19 npn 50 V 0 5 A SOT23 V043 4200836 TransistorBCX19 npn 50 V 0 5 A SOT23 V044 4200836 TransistorBCX19 npn 50 V 0 5 A SOT23 036 5200120 Push button switch 6 4x5 2 smd X001 5469021 SM flex conn Amendment 1 04 97 Page 43 After Sales RAE RAK 1N Parts Lists Technical Documentation X010 5469015 SM flex
156. 603 C141 2310784 Ceramic cap 100 n 10 25 V 0805 C142 2320107 Ceramic cap 10n 5 50 V 0603 C143 2310784 Ceramic cap 100n 10 96 25 V 0805 C144 2320107 Ceramic cap 10n 5 96 50 V 0603 C147 2610200 Tantalum cap 2 2 u 20 2 0x1 3x1 2 C148 2610200 Tantalum cap 2 2 u 20 2 0x1 3x1 2 C149 2610200 Tantalum cap 2 2 u 20 2 0x1 3x1 2 C150 2320592 Ceramic cap 2 2 N 5 50 V 0402 C151 2320588 Ceramic cap 1 5n 5 96 50 V 0402 C152 2320120 Ceramic cap 22n 10 96 25 V 0603 C153 2320588 Ceramic cap 1 51 5 96 50 V 0402 C154 2320120 Ceramic cap 22n 10 96 25 V 0603 C155 2320544 Ceramic cap 22p 5 96 50 V 0402 C156 2320544 Ceramic cap 22p 5 96 50 V 0402 C157 2320131 Ceramic cap 33 n 10 96 16 V 0603 C158 2320131 Ceramic cap 33 n 10 16 V 0603 C159 2310784 Ceramic cap 100 n 10 25 V 0805 C160 2310784 Ceramic cap 100 n 10 25 V 0805 C161 2310784 Ceramic cap 100 n 10 25 V 0805 C162 2310784 Ceramic cap 100 n 10 25 V 0805 C163 2310784 Ceramic cap 100 n 10 25 V 0805 C164 2310784 Ceramic cap 100 n 10 25 V 0805 C165 2310784 Ceramic cap 100 n 10 25 V 0805 C166 2310784 Ceramic cap 100 n 10 25 V 0805 C167 2310784 Ceramic cap 100 n 10 25 V 0805 C180 2610100 Tantalum cap 1u 20 10 V 2 0x1 3x1 2 C181 2310784 Ceramic cap 100 n 10 25 V 0805 C182 2310784 Ceramic cap 100 n 10 25 V 0805 C183 2310784 Ceramic cap 100 n 10 25 V 0805 C184 2310784 Ceramic cap 100 n 10 25 V 0805 C185 2310784 Ceramic cap 100 n 10 25 V 0805 C900 232
157. 610011 Tantalum cap 330u 10 96 10 V 6 9x6x3 5 C800 2604079 Tantalum cap 0 22u 20 35 V 3 2x1 6x1 6 C801 2310791 Ceramic cap 33n 20 96 50 V 0805 C803 2320564 Ceramic cap 150p 5 96 50 V 0402 C804 2320552 Ceramic cap 47p 5 96 50 V 0402 C805 2320728 Ceramic cap 220p 10 96 50 V 0402 C806 2610100 Tantalum cap 1u 20 96 10 V 2 0x1 3x1 2 C807 2320756 Ceramic cap 3 3n 10 96 50 V 0402 C808 2320756 Ceramic cap 3 3n 10 96 50 V 0402 C809 2320744 Ceramic cap 1 0n 10 96 50 V 0402 C810 2320728 Ceramic cap 220p 10 96 50 V 0402 C820 2320560 Ceramic cap 100p 5 96 50 V 0402 C821 2310167 Ceramic cap 1 0n 5 96 50 V 1206 C822 2320053 Ceramic cap 56p 5 96 50 V 0603 C823 2310248 Ceramic cap 4 7 n 5 96 50 V 1206 C824 2320560 Ceramic cap 100p 5 96 50 V 0402 C828 2610100 Tantalum cap 1u 20 96 10 V 2 0x1 3x1 2 C829 2320756 Ceramic cap 3 3n 10 96 50 V 0402 C830 2320560 Ceramic cap 100p 5 96 50 V 0402 C831 2610100 Tantalum cap 1u 20 10 V 2 0x1 3x1 2 C832 2320756 Ceramic cap 3 3n 10 96 50 V 0402 C840 2320548 Ceramic cap 33p 5 96 50 V 0402 C841 2610100 Tantalum cap 1u 20 96 10 V 2 0x1 3x1 2 C842 2320560 Ceramic cap 100p 5 96 50 V 0402 C843 2320546 Ceramic cap 27p 5 96 50 V 0402 C844 2320538 Ceramic cap 12p 5 96 50 V 0402 C845 2320604 Ceramic cap 18p 5 96 50 V 0402 Page 14 Amendment 1 04 97 After Sales Technical Documentation C846 2320534 C847 2320602 C848 2320560 C849 2320744 C850 2320604 C851 2320550 C862
158. 7 00 Hang tmapiant disks surusersD1 john X ls la up C J Figure 18 Telnet VT100 emulation Press Connect in the Terminal connections screen Press Hang up to disconnect Page 24 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Notes QD QR Qu QD Co E GED GED Gud Notes is used for writing notes and managing various documents stored on the communicator All folders and the Document outbox are shown in the Notes main view Open C D D UD Notes TT Received faxes Write note TH Received messages Y y 15 20 Received mail i 16 10 96 Settings C_D TH Downloaded files Dag T Document outbox pem bed Figure 19 Notes main view Reading Documents Select a folder and press Open Select a document from the folder s document list and press Open Creating Documents Press Write note in the Notes main view A new document is created in the Own texts folder Enter text in the note editor Deleting Documents Select a folder and press Open Select a document from the folder s document list and press Delete Sending Documents From the editor Press Print Send a pop up box listing printing and sending options opens these are Print Send as a fax Send as short message Send as mail Select contact from the corresponding directory and send Original 08 96 Page 25 RAE RAK 1N After Sales Quick Guide Technical Documentation Calendar GD
159. 78 Chip resistor 10k 5 0 063 W 0402 R389 1430754 Chip resistor 1 0k 5 0 063 W 0402 R390 1430754 Chip resistor 1 0k 5 0 063 W 0402 R391 1430760 Chip resistor 1 8k 5 0 063 W 0402 R400 1430796 Chip resistor 47 k 5 0 063 W 0402 R401 1430778 Chip resistor 10k 5 0 063 W 0402 R402 1430778 Chip resistor 10k 5 0 063 W 0402 R403 1430778 Chip resistor 10k 5 0 063 W 0402 R404 1430778 Chip resistor 10k 5 0 063 W 0402 R405 1430700 Chip resistor 10 5 0 063 W 0402 R406 1430700 Chip resistor 10 5 0 063 W 0402 R407 1430804 Chip resistor 100 k 5 0 063 W 0402 R408 1430726 Chip resistor 100 5 0 063 W 0402 R420 1430752 Chip resistor 820 5 0 063 W 0402 R421 1430726 Chip resistor 100 5 0 063 W 0402 R462 1430754 Chip resistor 1 0k 5 0 063 W 0402 R501 1430754 Chip resistor 1 0k 5 0 063 W 0402 R502 1430732 Chip resistor 180 5 0 063 W 0402 R503 1430732 Chip resistor 180 5 0 063 W 0402 R504 1430778 Chip resistor 10k 5 0 063 W 0402 R505 1430772 Chip resistor 5 6k 5 0 063 W 0402 R506 1430710 Chip resistor 22 5 0 063 W 0402 R507 1430804 Chip resistor 100 k 5 0 063 W 0402 R508 1430804 Chip resistor 100 k 5 0 063 W 0402 R509 1430778 Chip resistor 10k 5 0 063 W 0402 R511 1430770 Chip resistor 4 7 k 5 0 063 W 0402 R512 1430832 Chip resistor 2 7 k 5 0 063 W 0402 Amendment 1 04 97 Page 5 After Sales RAE RAK 1N Parts Lists Technical Documentation R513 1430740 Chip resistor 330 5 96 0 063 W 0402 R514 1430710 Chip resistor
160. 8 1 1 1 29 LCDVCC OK Command LCDVCC on by PCLocals Measure voltage from LCDVCC line If the voltage differs from Vsys value go to 1 1 1 25 When LCD module is not connected verify also LCDVCC off state by toggling the control by PCLocals Check V80 V86 Transistor V80 gate is pulled down by transistor V86 to enable LCDVCC Identify and replace the faulty transistor If not helping then check also R81 R72 and C91 VCC5 OK Command VCC5 on by PCLocals Measure voltage from VCC5 line If the voltage is other than 5 00V 50mV go to 1 1 1 27 The delay between regulator enable and valid voltage at output should be less than 0 1ms Check N80 C80 Check that CPU enable signal comes to regulator pin 3 If yes try to disconnect VCC5 load by bending up N80 pin 5 and attaching output capacitor to the pin If regulator works after that there is failed ohmic connection in VCC5 line or in FLASH memories Otherwise check and replace N80 C80 VBACK OK Measure backup battery voltage from battery terminals If that is less than 2 8V backup battery is about to be empty in near future 8096 used Then itis reasonable to change the battery in order to save customer from inconvenience in near future In order to do complete test disconnect main battery from the module If voltage in VBACK line is under 2 6V go to 1 1 1 29 With PC Locals it is possible to check whether the VBACK voltage has been on illegal level before boot This can be ch
161. 8 5 volts operation There are 5 x 330 uF capacitors in the near vicinity of the power amplifier to alleviate supply voltage degradation during TX burst Table 14 Power amplifier specification Parameter Typical Maximum Unit Notes Nominal Operating frequency range GSM 890 1710 Operating case temp range da deg C deg C Max Output power GSM 34 5 35 dBm normal cond PCN 31 5 33 E 5 dBm normal cond Max Output power 33 5 34 dBm extreme cond 31 32 5 Vcc 5 4V Ta 55 C Input power dBm PCN dBm Gain GSM Ze 5 mm dB normal cond PON 29 5 31 5 5 dB normal cond Efficiency GSM Pout 35 dBm PCN 96 Pout 32 dBm Input VSWR Zo 50 ohms Output VSWR Zo 50 ohms Ir 2 0 Harmonics dBc Pout 35 dBm S d 4 fo 5 fg dBc Pout 32 dBm Noise power GSM 114 dBm Hz at RX band PON 114 dBm Hz at RX band Ruggedness VBATT GSM VSWR 7 Pout 4W T B D VBATT PCN Stability load VSWR 8 1 60 dBc all spurious Amendment 1 04 97 Page 3 21 RAE RAK 1N After Sales RF Technical Documentation Power control circuitry The power control loop consists of a power detector and a differential control circuit The power detector is a combination of a directional coupler and a diode rectifier The differential control circuit compares the detected voltage and the control voltage TXC and controls voltage controlled amplifier in CRFRT or the power amplifier The control circuit is a part of CRFRT Table 15 Power contro
162. 8 la ds E NES la L g 0529 87 87 270 ga SCHER 0528 e S at Los ells Ello i S Bang 390 e Deg Dia Sa SIE 1 E m 2 I 2541 alla iE C504 o 1 Doi g of 4 5 10 11 12 CND GIE E ye Il IC v4 Re 2 L alle os alles lo ER ag SE EE ZS 3 SA BFRIZAN SIS 3 S M c p a 2 9S8 Iq gt o 5 5 i 2 9 le SN uS MEE gra 0528 C526 5 lo Ce 99 i Sr E ello gl le roa Ha ES V521 o Moo E p 3 2 8 ce ce sume E v502 BFR9ZAN D b ER b E A a SNL ma GR n I E alla 40 UP E 8 8 L l l 10k l T I GIE 20mm p 20n 153i 1532 d y mm ER T rt m i 2 82 e 23 82n Sp L 10 9 SS Geer 9 S Mos gt gt er 63 7533 0 20 a Wes y 0530 pe C537 1 35 Inm N FP182 2505 LL in Ts gl K ez VPLL VHLO 180 18 5 180 20 n ltb 41g EE Ge B 2Omn E R53I R52 108 4V5_TX e e L pod JL ght Al R509 7 22R 330R a H a zo T em d s l BFR93AU o e 7 i 0533 0534 0 20 51 514 5 W 0 20 Ind 3n3 V532 afle Deeg BFROSAW a le L 5 5 xu co E EEN gp a cs R513 R514 DE 22R e m lr E t alle em 7535 E gs 8 L 1000 PIEN SONJA i IT T 7 V512 a R558 R559 Mou es L UHF LOI I BFRS3 AW E EN B 581 0582 a S ef E SOR 330R 105 0 in no ola to 5 og L TEES S SS BI IS LLL 2551 5d Pe R564 j L5 i m D 120R 270R Tga SR a ee C ao TXOUTL T prs 7o RD afls E alle Es X501 ies ese T ge dk GER 8 ee x Jp b Ds Gol m gei STTATGBFA4T 3 i l _ 2 l INN rx OUTP_rx 1 8 2 sym ae T 2 Impe OUT
163. 8 x 1 3 centre contact positive Environmental Conditions Table 6 Allowed Ambient Temperature charging Low air temperature C 0 High air temperature C 45 After Sales RAE RAK 1N Technical Documentation Accessories Table 7 Allowed Ambient Temperature transportation and storage Environmetal parameter Umit Use 40 85 40 Low air temperature C High air temperature in unventilated enclosures 1 C e au High air temperature in ventilated enclosures or outdoor air L Se 4 Assembly Figure 7 Exploded view DCH 4 Original 08 96 Page 13 RAE RAK 1N After Sales Accessories Technical Documentation CARK60 Hands Free Car Kit 0086052 Information on this package is covered in the Vehicle Installation Guide P N 0275190 This is a similar document adapted for the service manual to the one included with the actual sales package Page 14 Original 08 96 After Sales Technical Documentation RAE RAK 1N Series CARK60 Installation Guide MM y EU E a i 3 We ex Um CR Original 08 96 RAE RAK 1N After Sales CARKO0 Installation Guide Technical Documentation AMENDMENT RECORD SHEET Amendment Inserted By Comments Number After Sales Technical Documentation RAE RAK 1N Series CARK60 INSTALLATION GUIDE CONTENTS dude re AAA o Unpacking EE Component Parts 2 eut ANEN EAR e rs ds bh E REX bx EEN NN c
164. 84 c Bee td E 068 RBZ a em m bah en eses Dan me la ES 5 N ens seg L 8 m R90 O Re g IER C94 ggg 00 R974 O Ka v3 I BPO L80 c E S 002 3 x cn E i 58 irme NE ceu E S Es LS R930 c re te mp ou Cc es SIE Bj un e ENS LA eL DE IP C Gm S RU D 1 60 C182 R125 RI25 3 C970 o 8980 R970 B 5 875 Spix c3 L WE ng RISI jJ GIG i ZE DE cg EIR 15074 C135 C132 C181 sjel le gt E 170 E Si Original 05 97 Page 10 10 Figure 1 UIF Schematic RAE 1N VBATT vut HINGE _FLEX_CONNECTOR VLI VLI 0 iL iL iL i 1 I I 1 T vani 2 4In 4ln 4In b 4In T d al 3 2 c9 cio ul 2 3 de RI R2 R3 e R4 ii R5 45 ou fel fe X000 DAE J 5 KE 1 GND
165. 845169451 704E1714E1727E173 E174pE1 789617606177 END Original 05 97 Page 10 3 Figure 2 PDA Power Unit PWRU Edit 108 for layout 13a RAE 1N 5VPDX D vPOW T N90 3 1 5 VB D t po r gt t r 4 C vees x c ss EL Ll i C88 C93 C94 C83 10n 1us_10V 10u 16V ion Ton Ion GV Lem GND Lem al ond GND b gt ce2 3900 3 13 1 8 N81 L82 g 3 ax H 4393 O gt VSYS LV 3 763aesa 4 22u es a EES S E TS c sie Dog ces T ceo 100u_10Y 2 C PURGOOD 100n 22n 100n one wegen ono ap an Lew GND an veo 8 R81 v86 LCDVCCON D gt Q TE 808484 T Ei Ing N82 pe LMCGTG2BINX LCDVEEON D ai 47k gt N N 56u i Re C LCDVCC C87 166n i C gt LCDVEE b e e e L94150 C908 aj GND 03 v82 3 E S ells al ens R77 vet alle e 3 8 vix 1 Cc BST82 P T E g s 77 sa s ter C88 095 ms 22u 25V 10n S po cee t i 166n E p gt VBACK GND GND GND GND lla SIE 67024 L L L L 8 BASTO 05 S 8 D e R83 LCDPWM D 100k 560k e er t s se snis 10n 22p 3 g elle gla MI 2 2 o ono ono
166. A 108 ss 100p CND 109p CND 100p CND PHFMICP C387 21 PuNICN BENA 98 Raos FS S 33n 3 A I e EXTEAR PHFMICN gt 36 50 106 VLI 1008 DE R400 33n 66 19 81 95 10342 v E C388 4 a e R386 R387 esa 10 L vi i 220 Y 28 2 EXTMIC gt pT j E Eeer n 5 amp 1 100R 15k Cu 33n d d d E SEET AE 0404 3 Tess 1 MOD zl le x E 10u_6 3V 4 00n LM4861 x m 5 5 GND Lob Lon EF wer er POT CEP T i Tar Lem lan GND fend Le end Leno e SEN a R388 Pin 24 Pin 23 Pin 25 Pin 26 Pin 28 Pin 27 cm Lio d 10k 10k ses R492 3 voo 8 1 at 1 PHFEARN WE LA HP A x LI Vot Ai PHFEARP me l BCW32 I II 9 8 e 8 a EN dl m 10k 22p P22p G VAS P22o Peep J2 J 2 Pala AF l l C410 C411 7 CND C409 C408 C395 C396 taja P C43 P e Lm ji 16 oup Io JI om 10n 10n i cae i fl END Jm Leno on Lon GND ono 99 93 ony Ds ono Leon EAR CONN e 2 5 gt EARP R406 10R 1 1 gt gt EARN AMP_PWR gt gt L 10R cais P cate oP cas P VA yan bupass capacitors 1nd ME 220 220 Place near MCM2 Loun GND LEND Low pere Original 08 96 Page 10 15 RAE 1N
167. AK 1N After Sales Service Tools Technical Documentation BTD 1C Battery Test Dummy Car kit Material Code 0770072 Original 08 96 Page9 6 After Sales RAE RAK 1N Technical Documentation Service Tools AJS 1 Assembly Jig Material Code 0770075 Original 08 96 Page9 7 RAE RAK 1N After Sales Service Tools Technical Documentation PFH 1 Hinge Flex Insertion Pliers Material Code 0770078 PFS 1 SIM Flex Insertion Pliers Material Code 0770077 PFL 1 LCD Flex Insertion Pliers Material Code 0770079 Page 9 8 Original 08 96 After Sales RAE RAK 1N Technical Documentation Service Tools PAS 1 Modified Power Adapter Material Code 0770073 Push to force CMT in Minimum mode Pull to activate in normal mode HCR 1 Carkit Jig Material Code 0770074 Push backwards to de activate testmode Pull forward to activate testmode Original 08 96 Page9 9 RAE RAK 1N After Sales Service Tools Technical Documentation MJS 1 Module Jig Material Code 0770076 Pull SW 2 to activate PDA testmode Push SW 2 to de activate PDA testmode Pull SW 1 towards you to activate charging Push SW 1 away from you to de activate charging Page 9 10 Original 08 96 After Sales RAE RAK 1N Technical Documentation Service Tools ADS 1 Audio Cable Material Code 0730011 0730011 SCF 6 Modular Power Connector Material Code 0770
168. After Sales Technical Documentation SERVICE MANUAL NMP Part No 0275188 RAE RAK 1 SERIES CELLULAR PHONE PERSONAL DIGITAL ASSISTANT a NOKIA MOBILE PHONES After Sales Technical Documentation AMENDMENT RECORD SHEET Number e mmm mm Number 0275188 08 95 RW Orgia ps Rw Update Original 05 97 After Sales Technical Documentation Warnings and Cautions This manual is intended for use by qualified service personnel only Please refer to the phone s user guide for instructions relating to operation care and maintenance including important safety information Note also the following Warnings e CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI SKID BRAKING SYSTEMS UNDER CERTAIN FAULT CONDITIONS EMITTED RF ENERGY CAN AFFECT THEIR OPERATION IF NECESSARY CONSULT THE VEHICLE DEALER MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY THEHANDPORTABLE TELEPHONE MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG PETROL STATIONS SERVICE STATIONS BLASTING AREAS ETC OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT INCLUDING CELLULAR TELEPHONES MAY INTERFERE WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES CONSULT A PHYSICIAN OR THE MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS OTHER ELECTRONIC EQUIPMENT MAY ALSOBE SUBJECT TO INTERFERENCE Cautio
169. Bac c fiD offset 41 AD offset 53 DECHE ECKE ECKER AD stop 87 AD stop 27 Elapsed time 1 87 sec Step t ime 24 60 13 90 RF Generator level is 92 0 dBm Fi Help F2 Signal F3 Noise ESC Exit Clipping distance is the difference to the signal clipping value SNR is measured in the A D converter Clipping distance clipping level 66 signal value comp factor SNR signal value noise value comp factor1 Sensitivity 90 dBm 8 dB comp factor2 SNR The last value on the display is signal power difference between and Q branch The numbers are shown in 0 1 dB accuracy The error messages OUT OF RANGE are shown only if the SNR and or amplitude difference values are not acceptable SNR lt 18 dB comp factor2 0 5 dB accuracy Sensitivity gt 100 dBm 0 5 dB Si Sq gt 1dB When F2 or F3 is pressed the RX I and Q burst data is asked for and SIGNAL MEASURING or NOISE MEASURING is displayed The power level value should be 90 dBm during signal measurement Only the lt Esc gt key is accepted during measurement Esc breaks the measurement routine in the PC and returns the program to the state before F2 or F3 was pressed Normally Esc is not needed Page 7 30 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software When signal data is received the distance to clipping signal level is shown as dBs on the di
170. Baud rate 9600 bits s or double Test SW activation External serial data from Re sponder External serial data to re sponder Table 5 DC characteristics of signals on test pads under the battery pack Line Symbol JTAGTDI State 1 State 0 JTAG data in State 1 JTAGTCK State 0 JTAG clock JTAGTMS State 1 State 0 Page 6 10 JTAG mode con trol Original 08 96 After Sales Technical Documentation fa Line Symbol RAE RAK 1N PDA Hardware JTAG data out E103 JTAGTDO 2 735 State 1 V 0 4V State 0 m 50V Input high level Output low level V Isink lt 5mA Baud rate 9600 bits s or double DBUS clock 512 kHz DBUS E106 DCLK 5 0V State 1 ov o2v 0 7v State 0 E107 DSYNC 3 60V 4 85V 5 0V State t ov o2V 0 7v State 0 E108 RDA 4 85V 5 0V TDA State 1 State 0 3 6V 4 85V 5 0V State 1 1 mA load Sync 8 kHz DBUS re ceived data to HP DBUS trans mitted data from HP RBUSRxD RBUS re ceived data to CMT OV 0 2V 0 7M State 0 2 735 State 1 V 0 4V State 0 3 6V 4 85V 5 0V State 1 n 3 6V 4 85V 5 0V State 1 1 mA load RBUSTxD RBUS re ceived data to CMT Dur ing CMT FLASH download RBUS trans mitted data from CMT TESTMODEX Test SW activation OV 0 2V 0 7V State 0 2 0V 3 635 State 1 V 0 5V
171. C241 N es 3 3 Ge a r3 Do o E X505 ES fon o o R380 R385 E e z _ B x EI o et z 0248 C 3 R389 R36 D 0247 R232 R216 Cie le D e eo LO Ea R265 R267 amp amp SE R745 gu4 o RII Ss 0238 gt C383 2 0730 sera oe TM C245 lla Se z R5 ia Fisard E gp Ll e IS S R731 Z727 I mais gt E al V230 S S 2 le C729 E S pel 46 v55 E x a ef 8 se IN OUT 3 gt R746 R748 X gt a A Pm E an Us lt ind E a5 LAG B gt a a 232 miu 0760 0232 2 BARH D MS 2 o 2 E o e V765 ME C233 sl E S gs X00 N Ber h S 0235 C349 o e V756 C2400 a c NN pee 2713 n GARE ue RBI COL C250 R C07 SEH pow C348 S Be Le an El m 5 R256L 3 C217 Y ig Sj C323 SL C76 zs go a Ei _ e LU cup 7 C701 C702 R703 E V231 al x Ca E S B X wow CH Sl e R701 S 5 o S S69 OG 0343 E C300 Ree E e ARAS ac EY EI e o e t amp lg V253 GH al RS ls E x m R58 e we C344 CH V801 P iun e 1201 B af Sg ue G z e S e 1840 Bp gt uD rel d EU H alas EB 12 erg us E 3 5so0 C i S 19 BU 29A OND 100 44 ce gt e r r J oc E DEC E HIM 0243 R307 ia LI R407 LOS R367 g 2808 E gt MEE RB42 13 R306 ii R261 Ed R259 A R366 S LIB Benz E CEA T TS res 2 R253 ia A 0407 E R213 ou g sS 2 020 v840 US 23 pel R340 amp R263 Gel E Jos 23 ko 9029 5 r3 2 H 6244 7848 RE C1 m Lt a Ca E EN bd V802 o 6300 z R3
172. CHIPTCAP 0U22 M 35V 3 2X1 6X1 6 C801 2310791 CHIPCAP X7R 33N M 50V 0805 C803 2320568 CHIPCAP X7R 220P J 50V 0402 C804 2320552 CHIPCAP NPO 47P J 50V 0402 C805 2320728 CHIPCAP X7R 220P K 50V 0402 C806 2610100 CHIPTCAP 1UM 10V 2 0X1 3X1 2 C807 2320756 CHIPCAP X7R 3N3 K 50V 0402 C808 2320756 CHIPCAP X7R 3N3 K 50V 0402 C809 2320744 CHIPCAP X7R 1NO K 50V 0402 C810 2320728 CHIPCAP X7R 220P K 50V 0402 C820 2320560 CHIPCAP NPO 100P J 50V 0402 C821 2310248 CHIPCAP NPO 4N7 J 50V 1206 Page 30 After Sales Amendment 1 04 97 After Sales Technical Documentation C822 C823 C824 C828 C829 C830 C831 C832 C840 C841 C842 C843 C844 C845 C846 C847 C848 C849 C850 C851 C862 C864 C865 D300 D301 G300 L200 L201 L202 L203 L230 L231 L232 L300 L511 L530 L531 L532 L541 L542 L543 L544 2320466 2310248 2320564 2610100 2320756 2320560 2610100 2320756 2320530 2610100 2320584 2320544 2320536 2320536 2320536 2320520 2320560 2320744 2320534 2320534 2320602 2320560 2320560 4340126 4340126 4510044 3641262 3606946 3641262 3641548 3606946 3606946 3606946 3641302 3641546 3641536 3608414 3641560 3641550 3608238 3608319 3608319 Amendment 1 04 97 RAE RAK 1N Parts Lists CHIPCAP NPO 220P J 50V 0603 CHIPCAP NPO 4N7 J 50V 1206 CHIPCAP NPO 150P J 50V 0402 CHIPTCAP 1U M 10V 2 0X1 3X1 2 CHIPCAP X7R 3N3 K 50V 0402 CHIPCAP NPO 100P J 50V 0402 CHIPTCAP 1U M 10V 2 0X1 3X1 2 CHIPCAP X7R 3N3 K 50V 040
173. CM1 C wn FLEX CONNECTOR PWRU VLI VL2 VAI VAZ VAS VREF 181538 MICP op MICP XPWRON MICN Wee D 4 MICN XRES a y 10 _ AS smi SO ER 308 100M4z Pu VM gor ty 8 SIMRESET 7 VCHAR D SIMGLK s SIMCLK ua VOLTLIM Ie 1 1 95 GN P VREF EARP EARP Dr oo aget MCMI pin 45 EARN 3 4 D ER VBATDET E E dd H ay P of VBA XREST CHRDET D V200 CHRGDETI VCHARO p ins 33 15 h X212 CHRD EK CHRDIS CHRGDETO 3 dL X 3 BASIS ON TP 35 16 si 65 m TT gt veer TO RF HAE gt MCUADC4 0 ARES e 69 CHRDET gt o PCMCDO 1 T ak a5 RESETX 56 El S 25 MI 65 Ale S 64 MCUCLK 63 TROX MCUADCIS Wee S MCUAD 17 gt A18 30 o A19 afla 7 WSTROBEX Fl le 22 RSTROBEX f PN CUDA 15 8 FROM RF ert f vu 19 18 DE ER 90 7 5 lem E 93 T T aS om H i Sla SR 83 T2 i BATTERY CONNECTOR T E 3 E ye 202 F06Mz cop P 3 21 ep PUR BGND T R208 R207 158 cp E ul POMCLK T 2 ws 1 ai 52 89 Bi PCMCDI BINE EE 1002 1008 R208 R209 DH LEO e A g t00R i A3 1008 1008 T T op P 0201 P 31 aL ES ES 9 5 a 28 al n MRBUSDET 4 caos P c207 P i Io Bir enn JCONN gt 5 18 19 29 40 41 47 54 55 59 70 84 91 92 VL1 48 58VFF 42 45 VREF 1 8 11120 24 27 34 39 43 44 48 49 58 57 61 71 88 94 95 96 97 GND BATDET 1201 d wi wu po 11 IV lc OK le PHFMICN 1 ERE d VII 4 JR 4 IE PHEMICP or SE f EI Ae 6 Ji BACKLIGHT 7 S 8 iq RBUSRXD e ER RBUSTXO se Tap 2 pou TO BE CHECKED x la COL 3 0 dE V fne yum HI
174. CO J MM A CO A E 8 479 4 10 8 456 Base 9 408 Test 6 615 real base level 8 347 PCN Version Amendment 1 04 97 Page 7 23 RAE RAK 1N After Sales Service Software Technical Documentation There is one selection which is used for power coefficient calculation Only three power coefficients biggest third smallest and smallest are needed for tuning the rest are calculated The calculation is activated with F3 key The power coefficients which are calculated from the tuned coefficients are displayed on the different columns than the others All values can be tuned if needed The following automatic selections are made when this tuning function is activated if transmission data is neither O nor 1 then continuous 1 data is selected Active Unit TX the base power level is selected Operation mode Burst Channel 60 lt gt and lt gt keys will cause power changing by 0 25 dB steps D A converter control value ratio is 1 0292 When these keys are used the coefficient value is updated on the tuning window When save F2 or exit lt ESC gt selection is used the power value checking is made and if it is not successful an error message is shown The test checks if all power coefficient values are in the same numerical order as Power Levels in the table When TX Power Tuning is ended and if the power values are not acceptable the error message is displayed and the user is aske
175. Charging voltage B2B conn VOLTLIM Charging voltage limitation during call affects HW voltage limit CTRLU Table 30 External Signals and Connections Outputs Signal Name Signal description To Master reset ASIC Logic supply voltage Max 150 mA CTRLU ASIC RFI UIF Logic supply voltage Max 150 mA DSPU CNN Analog supply voltage for AUDIO block Max 40 mA AUDIO aa ros sup votage or Weg Jm Reference voltage 4 65V 7 295 Max 5mA CTRLU RF Block description The PSL IC produces the following supply voltages VL1 150 mA for logic VL2 150 mA for logic VA1 40 mA for audios VA2 80 mA for RFI VA3 200 mA for PHF booster VREF 5mA reference In addition it has internal watchdog voltage detection and charger detection functions The watchdog will cut off output voltages if it is not reset once in every 5 1 seconds The voltage detector resets the phone if the battery voltage falls below 4 8 V 0 2V The charger detection starts the phone if it is in power off state when the charging voltage is applied The charging electronics is controlled by the MCU When the charging voltage is applied to the phone and the phone is powered up the MCU detects it and starts controlling charging If MCU detects too high charging voltage over 10 volts or current over 78 A D bit difference between VC and VBATDET it will cut off the charging The phone will accept charging voltages from 5 to 13 volts Original
176. Choose any test picture and then the desired contrast value 0 255 where 0 is the darkest and the 255 the lightest Contrast Change OK Test if the contrast changing works at least with two different contrast values If the contrast seems to be good in the middle low and high of the tunable range then proceed to 3 4 If the contrast does not change or if the range bad then proceed to 3 3 1 LCDPWM OK Test if the duty factor of the PWM output of the CPU D130 pin1 34 is changing according to the value given in the LCD test with the service software If the level of the LCDPWM is OK and the duty factor is changing from 1 255 to 254 255 then proceed to 3 3 1 2 otherwise go to 3 3 1 1 Original 05 97 Page 8 27 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 3 3 1 1 3 3 1 2 3 4 3 5 CPU Fault If the CPU does control the PWMOUT signal correctly even though the signal is disconnected from the PDA power unit then it is likely that the CPU is at fault Check PDA Power Unit The LCDVEE output of the PDA power unit should change within the legal limits according to the PWMOUT signal duty factor If the PWMOUT signal is controlled OK but the LCDVEE voltage doesn t change then check the PDA power unit Check components R86 C90 and R83 Check LCD Test Patterns In order to check the functionality of every pixel on the LCD various test patterns can be produced by selecting the LCD test in t
177. E SE S B HH HER SHE BH Hn EHE HER ERR SH RUE Hi E EIE EE i HER m HE E m Hi dc mr i m a HE de v po d d SE SE SE SE HE ud HR SE ui ii us SE d Fi Help ti Moue by Line ENTER Enable Disable Test ESC Preuious Menu 7 1 Memory Test Enabling this choice adds the memory test to be included to the test sequence The test is performed with default parameters The default parameters used Test type default chessboard Start address default 000000h End address default OAFFFFh The output from the target shows the following whether the command was parsed succesfully whether the test was succesful 7 2 Get POST Code Enabling this choice adds the POST code read to be included to the test sequence The test is performed with default parameters The default parameters used none The output from the target shows the following whether the command was parsed successfully whether the test was successful Amendment 1 04 97 Page 7 59 RAE RAK 1N After Sales Service Software Technical Documentation 7 3 Test Flash Enabling this choice adds the Flash test to be included to the test sequence The first block of each Flash device is checksummed then it s read and saved on a disk in the service software After the block is saved the physical block is erased and then programmed from the file where the contents was saved After programming the block is checksummed and the result is compared to the original one If the checksu
178. ENDED PERIODS WITHOUT RUNNING THE VEHICLE S ENGINE FAILURE TO 4 COMPLY COULD DRAIN THE VEHICLE S BATTERY Original 08 96 RAE RAK 1N After Sales CARK60 Installation Guide Technical Documentation Unpacking Carefully unpack the equipment and ensure that the following items are present Charging Holder MBR 1 Junction Box to be mounted with MKE 1 HFJ 3 Mounting Plate w 12 screws 4 nuts 4 washers MKE 1 Swivel Mounting Plate incl mounting plates amp screws MKR 1 Flat Mouning Kit incl mounting plates amp screws MKK 1 Hands Free Microphone HFM 10 Hands Free Speaker w 2 screws HFS 6 Power Cable w 2 fused connectors amp wire ends PCH 4 MBR 1 Communicator not included MOBILE ANTENNA optional 27 DLRA optional j HSU 1 optional Fiaure 1 CARK60 Kit and options Component Parts Charging Holder MBR 1 The Charging Holder unit offers your Communicator an external antenna connection hands free function and firm attachment to the vehicle The installation of the Holder can be done in two different ways either 1 using Swivel adjustable angles or 2 using Flat Mounting Kit fixed position Mounting Plate MKE 1 Flat Mounting Kit MKK 1 and Swivel MKR 1 The Mounting Plate is used to mount the Hands Free Junction Box Screw the Mounting Plate to the appropriate place and slide on to the Junction Box Page 6 Original 08 96 After Sales Technical Documentation RAE RAK 1N Seri
179. ERE REQUE Br REA 7 58 b 2 Read Version issus lice Een EE RERO Shue oR ER ER 7 58 6 3 Read Production Number 7 58 7 Complete TES decas ssi uesuPh E E ERE LEE EAE EE EE 7 59 7 1 Memory Test 7 59 7 2 Get POST Code eet euer RR mE ntn x xx x RR S 7 59 f TeSt Flash Lsr ruxadckk reos X rax kii esas 7 60 7 4 LCD ER 7 60 7D D Buzzer EE t eier Ae tt se Okaasan EE E amissa nte p bens 7 61 TO UR PERMIT 7 61 NIS B IESU rmm 7 61 AAN A 7 61 9 Checksum ROM AA wt EN aer a ex xau ERE ad 7 62 7 10 Start Testing serca e QE eU FW RO ER EU 7 62 Page 7 4 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Flash Downloading 7 63 9 Flas i r ch wee See A EE RE ee e an SE at 7 65 3 1 Software Update ees pee e wees EN rr vee ed RS 7 65 8 3 2 Program Flash from File Luuseuuus 7 66 2 9 Save Flash t Elle uiae Seius hipxefeessd medii boss 7 66 3 4 Erase EE 7 67 3 5 Lock NET 7 67 3 6 Flash RE e EEN 7 68 3 6 1 PFing TAIels cucremo certam mex ent mao acere ss 7 68 3 6 2 Software Update oco Suse Rui REX NE RR bed us fedis 7 68 3 6 3 Erase Flash Lsuuueelseelsllees 7 69 3 64 e Lock Flash EE 7 69 3 6 5 Program Flash From Files sce KR re EEN NEEN 7 70 3 6 6 Calculate Checksum 7 70 3 7 JTAG Flashing estres dados s dam chance ra
180. ES 0W06 150R J 0402 R706 1430693 CHIPRES 0W06 5R6 J 0402 R707 1430730 CHIPRES 0W06 150R J 0402 R710 1430690 CHIPRES JUMPER ORO 0402 R711 1430758 CHIPRES OW06 1K5 J 0402 R712 1430832 CHIPRES OW06 2K7 J 0402 R713 1430744 CHIPRES OWOG 470R J 0402 R714 1430700 CHIPRES OW06 10R J 0402 R715 1430730 CHIPRES 0W06 150R J 0402 R716 1430700 CHIPRES 0W06 10R J 0402 R725 1430784 CHIPRES 0W06 15K J 0402 R726 1430788 CHIPRES 0W06 22K J 0402 R727 1430762 CHIPRES OW06 2K2 J 0402 R728 1430728 CHIPRES 0W06 120R J 0402 R729 1430730 CHIPRES 0W06 150R J 0402 R730 1430700 CHIPRES OW06 10R J 0402 R731 1430728 CHIPRES OWOG 120R J 0402 R732 1430700 CHIPRES OW06 10R J 0402 R735 1430762 CHIPRES 0WO06 2K2 J 0402 R737 1430756 CHIPRES OW06 1K2 J 0402 R738 1430778 CHIPRES OW06 10K J 0402 R739 1430778 CHIPRES OW06 10K J 0402 R740 1430774 CHIPRES OWOG 6K8 J 0402 R741 1430764 CHIPRES OW06 3K3 J 0402 R742 1430774 CHIPRES OWOG 6K8 J 0402 Page 22 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists R743 1430762 CHIPRES OW06 2K2 J 0402 R744 1430762 CHIPRES OW06 2K2 J 0402 R745 1430762 CHIPRES OW06 2K2 J 0402 R746 1430756 CHIPRES 0WO06 1K2 J 0402 R747 1430712 CHIPRES 0W06 27R J 0402 R748 1430754 CHIPRES 0WO06 1KO J 0402 R749 1430732 CHIPRES 0W06 180R J 0402 R750 1430754 CHIPRES OW06 1KO J 0402 R751 1430778 CHIPRES OW06 10K J 0402 R755 1430762 CHIPRES OW06 2K2 J 0402 R756 1430754 CHIPRES OW06 1KO J 0402 R757 1430734 CHIPRES OW06 220R J 0402 R758 1
181. I NTC PC PCB PCN PDA PHF PIO PLL PWM PWRU RAM RBUS RF RFI RLP ROM RPE LTP LPC RX SCL SIM SIO SMD SRAM TDMA TX UHF UIF VAD VCXO VHF Original 08 96 RAE RAK 1N Overview Non Maskable Interrupt Negative Temperature Coefficient Personal Computer Printed Circuit Board Personal Communication Network Personal Digital Assistant Personal Hands Free Parallel Input Output Phase Locked Loop Pulse Width Modulation PoWeR Unit Random Access Memory Responder BUS Radio Frequency Radio Frequency Interface Radio Link Protocol Read Only Memory Regular Pulse Excitation Long Term Prediction Linear Predictive Coding Receiver Small Custom Logic Subscriber Identification Module Serial Input Output Surface Mount Device Static Random Access Memory Time Division Multiple Access Transmitter Ultra High Frequency 300MHz 3GHz User InterFace Voice Activity Detection Voltage Controlled Crystal Xtal Oscillator Very High Frequency 30 MHz 300 MHz Page 1 5 RAE RAK 1N After Sales Overview Technical Documentation This page intentionally left blank Page 1 6 Original 08 96 After Sales RAE RAK 1N Technical Documentation Overview Introduction The NOKIA 9000 communicator is a functional Cellular Mobile Telephone CMT extended to incorporate a Personal Digital Assistant PDA The unit is of a modular design incorporating the following ACMT providing
182. If no defect can be found suspect a defective CPU chip If the device beeps during POST CPU related error beeps then it s likely that the CPU is defective Page 8 20 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 1 4 1 5 1 5 1 2 1 6 1 7 1 7 1 Check Buzzer Connections In the case of POST found error the PDA can beep an error code The list of the possibly error codes can be found in the appendix A In order to hear the possible beeps the connection from the CPU D130 pin124 to the buzzer must be functional i e the SIM flex should be connected to the CMT and the PDA CMT connection must carry a BUZZEROUT signal The beeps can be also seen using a scope connected to the CPU pin 124 where the beeps generate a square wave If the signal can be seen but no sound is heard then check the circuitry R142 R148 V132 V135 C138 and the SIM flex etc Error Beeps If there are some error beeps then make the difference between CPU and DRAM related errors and proceed to the CPU DRAM fault If no beeps are generated then proceed to 1 6 DRAM Fault If DRAM related error beeps can be heard then check the resistors R180 R195 If they are OK then the fault can be either in the CPU D130 or in the DRAM itself D160 As the DRAM is easier to change it is better to try that first Reboot and PING from the PC Locals while in Testmode Next try to establish a connecti
183. M rxif 12 58 i ll ae R568 to ne i p TXGX 4 ve2rx om al 12 la Cp R774 R775 T 6n8 we E LS Iert QUTP tx 28 I Se pen e 9 INN raf TXI_oue 37 o fla o lor ER eg mi VHFLOC op ag SEH O INP xit OUT pwe 4l E 2 28 gl 20 cw 3 GE Wo jugo exit ET a Ed 15 DN nx S E 16 LOP_rx lll E IS LO tx D 19 m R551 LOP tx n TX IPI 2l i_tx ges L M0D0 A 22 itx m R60 T ag ja_tx C569 8570 S to C554 a tx V_prot 3 4 8 C SYNTHPWR 1500 6 VB2_tx VRX VREF i 28 1 2k C R553 30 Yi 6 100R ji T _OWC X sl a XI PT l 31 TP owe WE WM l j E R554 I constant_puo VRX 4 eo N60 C607 IBAI TOPE 0556 85 DET ouc a WFK120F8281 f rs a E 36 wg ext m 20 i i 4V5_TX 19 ak m 38 XC ouc vk 28 ED gt gt RS02 x 35 39 DE rs ml a d mo 3 lt 1 IXPWR R556 p L 0573 40 C602 rem E 2k2 rom 0572 E 4 opaout ouc VIX slow 32 4 yi VHLO VPLL 2603 A 33n Ga 1009 E 5 o2 d ES 6 RXPWR 3 g x 9 1 29 33 2 CND 1 2k amp amp S S S 0580 gt t ind Be R 10 e E z ONO z I T H gt ella un 12 C609 ga g Sl ef 2 8579 ean E 108n BE yv E 8576 WR E S TERN Dee Ji D rani e LS 4k7 phi e N Cum CH alla X x R578 HBE ella ry iy 39k 8 iQ XC DETO TXP RF IREF S Amendment 1 04 97 Page 10 23 Figure 22 UIF Schematic PCN
184. Master Code 5535021967 3 Wake up Message 4 No Service Power Save No CMT ME Memory Functions 1 User Settings and Values 2 Product Profile Settings 3 Write HW Version 4 IMEI Edit 5 IMEI Transfer 6 Set UI Factory Values 7 Set Factory Values Product Profile Settings 1 CMT language English German French English 2 Keyboard layout Normal AT amp T ITU T Normal 3 A5 2 Algorithm On Off Off 4 SS Screen indicator 1 2 ecards phase 1 Using Menus You can select a function from a menu in two different ways The first way is to press the key on the PC keyboard corresponding to the first character of the line The other way is to move the cursor from line to line using arrow keys and make the selection with the Enter key When you have made your selection the new menu or window will appear Every menu and window carries its name on the topmost line this is the same as the selection in the previous menu or window When the new menu is activated the old one will disappear When a window is activated the selectable keys are seen in the window Windows may have a scrolling or a constant display The Esc key quits the previous menu and returns the previous screen it has no effect if used with the main menu When editing data the lt Esc gt key can be used as an interrupt key and the Enter used as an exit key Page 7 12 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Servi
185. Mode is set to Output the target sends the Output Byte via the target s IR transceiver The same byte is expected to be able to be read via the the IR tranceiver connected to the service software PC If the IR transceiver receives the Output byte the test is considered successful Page 7 52 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software If the Mode is set to Input the target is commanded to wait for the Output Byte from the tranceiver connected to the service software If the Output byte is received in the target the test is considered successful 2 6 Test Serial Ports This menu provides a test for the serial ports of the PDA One of two methods to test one of the two COM ports can be chosen The enquired input parameters from the user are Mode default Local loop Range Local loop External loop Port default COM2 Range COM COM2 If the Mode is set to Local loop bytes from FFh to Oh are sent internally in the target s UART in a specific UART Local loop mode If the same characters are received internally the test is considered to been successful If the Mode is set to External loop bytes from FFh to Oh are sent via the chosen COM Port of the target The test expects the same bytes back via an external loop connected between RxD TxD lines Since the COM1 is used to the communications to the host service software PC this mode cannot be used with the COM1 3 Flash Utilities
186. N A Ra L201 Lo Seed V e a Z26R 100MHz COLI er alo d COL2 ay 8 la 2 4 20 og P con P U qoe i 00 3 5f Tap SL 0 an olli i E 3 UIF G 0 MCMI pin 58 MCMI pin 4 un ES mei UIFL 2 LITTTIMELLE VARATTU 430 449 UIF2 2 VLI BAV99 gl Del 27 v202 S s U A Ze y R222 UIF INE 1 urre 99 ur T ib we J ND DELK SE fio DSYNC 34 22 D n ono GRR ag X RDA Qn 36 MBS lt TOA eu 7 38 LID e VLI tors to be pl Be 4 LI Bypass capacitors to be placed near Mul la ExTMIC 7 gt EXTMIC i EXTEAR Z Bmg o ___4 Cop c214 P c215 P C216 P car P cog P C219 4 VB gp AGND iB Du Ly tio D Ei Zu ed Se bag bes CMTBTOB FEMALE Pin 5 Pin 18 Pin 29 Pin 40 Pin 54 Pin 70 Pin 91 RAE 1N Figure 5 Baseband Circuit Diagram MCM2
187. NPO 100P J 50V 0402 C394 2320131 CHIPCAP X7R 33N K 16V 0603 C395 2320620 CHIPCAP X7R 10N J 16V 0402 C396 2610100 CHIPTCAP 1U M 10V 2 0X1 3X1 2 C400 2312292 CHIPCAP Y5V 470N M 50V 1210 C401 2320598 CHIPCAP X7R 3N9 J 50V 0402 C402 2320584 CHIPCAP X7R 1NO J 50V 0402 C403 2320544 CHIPCAP NPO 22P J 50V 0402 C404 2610128 CHIPTCAP 10U M 6V3 3 5X2 8X1 9 C405 2310784 CHIPCAP X7R 100N K 25V 0805 C406 2604209 CHIPTCAP 1U0 M 16V 3 2X1 6X1 6 C407 2310784 CHIPCAP X7R 100N K 25V 0805 C408 2320544 CHIPCAP NPO 22P J 50V 0402 C409 2320544 CHIPCAP NPO 22P J 50V 0402 C410 2320544 CHIPCAP NPO 22P J 50V 0402 C411 2320544 CHIPCAP NPO 22P J 50V 0402 Page 26 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists C412 2604199 CHIPTCAP 2U2M 6V3 3 3 2X1 6X1 6 C413 2320620 CHIPCAP X7R 10N J 16V 0402 C414 2320620 CHIPCAP X7R 10N J 16V 0402 C415 2320744 CHIPCAP X7R 1NO K 50V 0402 C416 2320744 CHIPCAP X7R 1NO K 50V 0402 C417 2320544 CHIPCAP NPO 22P J 50V 0402 C418 2320544 CHIPCAP NPO 22P J 50V 0402 C420 2320544 CHIPCAP NPO 22P J 50V 0402 C421 2610100 CHIPTCAP 1U M 10V 2 0X1 3X1 2 C422 2610100 CHIPTCAP 1UM 10V 2 0X1 3X1 2 C423 2610100 CHIPTCAP 1UM 10V 2 0X1 3X1 2 C424 2610100 CHIPTCAP 1UM 10V 2 0X1 3X1 2 C425 2320131 CHIPCAP X7R 33N K 16V 0603 C426 2610100 CHIPTCAP 1UM 10V 2 0X1 3X1 2 C430 2320131 CHIPCAP X7R 33N K 16V 0603 C431 2320131 CHIPCAP X7R 33N K 16V 0603 C432 2320131 CHIPCAP X7R 33N K 16V 0603 C433 2310791 CHIPCAP X7R 33N M 50V 0805 C
188. P 30V 100MA 200MWSOT323 TR BC859C P 30V 0 1A SOT23 TR BC849C N 30V 0 1A SOT23 TR BC848B BCW32 N 30V 100MA SOT23 PRECISION VOLTAGE REFERENCE 4 096 SCHDIX2 BAS70 07 70V 15MA SOT143 Amendment 1 04 97 After Sales Technical Documentation V501 V502 V503 V504 V511 V512 V521 V531 V532 V541 V701 V702 V710 V725 V726 V735 V736 V737 V738 V739 V740 V741 V755 V756 V765 V766 V780 V790 V791 V792 V800 V801 V802 V840 V841 V842 X201 X202 X212 X400 X501 X503 4210046 4210102 4210100 4210066 4115802 4210066 4210066 4100567 4210066 4210066 4210058 4100567 4210046 4210074 4210102 4217070 4210090 4210100 4210020 4217070 4210102 4210100 4210102 4210343 4211485 4219908 4110014 4100285 4210102 4107040 4110081 4210066 4210066 4210066 4210066 4110018 5469203 5409041 5469037 5469031 5429003 5420460 Amendment 1 04 97 RAE RAK 1N Parts Lists TR BFP182 N 20V 35MA 8GHZ SOT143 TR BC858W P 30V 100MA 200MWSOT323 TR BC848W N 30V 0 1A100MHZ SOT323 TR BFR93AW N 12V 35MA 5GHZ SOT323 SCH DIX2 4V 30MA 1PF SER SOT23 TR BFR93AW N 12V 35MA 5GHZ SOT323 TR BFR93AW N 12V 35MA 5GHZ SOT323 SCHDIX2 BAS70 04 70V15MA SERSOT23 TR BFR93AW N 12V 35MA 5GHZ SOT323 TR BFR93AW N 12V 35MA 5GHZ SOT323 TR MRF947 N 10V 50MA 8GHZ SOT323 SCHDIX2 BAS70 04 70V15MA SERSOT23 TR BFP182 N 20V 35MA 8GHZ SOT143 TR BFP420 N 4 5V35MA 20GHZ SOT343 TR BC858W P 30V 100MA 200MWSOT323 TRX2 IMZ1 N amp P ISOLATED
189. QuQ8 in E 22 fj ux COLI L230 6729 KEN TA e T OSZA g ES OEA nm on C oa mes IT oan 5 b c3 a 2 zit ES m LS rm S R309 S 2 d a Le hia i i 8052131 E ES R ez ZOZX am gt E e soe YE 80 gt S 5029 JUUU Page 10 11 iginal 08 96 Or RAE 1N Figure 2 Component Layout Top
190. R xx 9790177 KEYPAD ENGLISH 9790178 KEYPAD GERMAN 9790179 KEYPAD FRENCH 9790180 KEYPAD SCANDINAVIAN 9450680 IR WINDOW xx 0200709 GP1 PDA MODULE 9510324 ESD NETTING 1 xx 9480254 GASKET HF MIC xx 9510354 CLIP 5140039 HF SPEAKER 9480252 GASKET HF SPEAKER 9460075 MICROPHONE RUBBER 514 0037 HF MICROPHONE 9480258 TESTPAD COVER 9430110 COVERING LABEL 9540000 CHASSIS 9380115 CONTINUOUS SHEET 9510353 CLIP 9460171 SHIELD 0200713 GEM1 SIM FLEX SUBMODULE 9510323 ESD NETTING 2 xx l 9480280 GASKET HS MIC xx 9480134 SPEAKER GASKET xx 9450666 C COVER xx Mechanical Assy Parts RAK 1N x 9450685 SCREEN FRAME SUBASSEMBLY xx 9480343 PCN COVER KIT SUBASSEMBLY Amendment 1 04 97 Page 49 RAE RAK 1N After Sales Parts Lists Technical Documentation This page intentionally left blank Page 50 Amendment 1 04 97 After Sales Technical Documentation Appendix 1 RAE RAK 1N QUICK GUIDE Original 08 96 RAE RAK 1N After Sales Quick Guide Technical Documentation Contents Page No Overview pusiera eos tdi Rude 5 Communicator Applications 2 esses chan mtem mmm re 6 ERKENNEN Ee anda 7 List Of co M iani aada aa aaa aa pias leed irte fre 7 Display Indicators 3 ek a rate rrt mn px ERR E mx varas 8 G tting Started zx Se dt ake nee Ae dad eeu beg amd Ee dE 9 Using Memory dosis vod ties bed Pere jur Pts pud heels ead 9 Sing MMS MENUS suscritas RI WE EX EE EE RES ER 11 PDA Oper
191. RAM within first 1M DRAM Roll Over Doublemapped FLASH area FLASH memory under FLASH Flle System Figure 6 PROCU memory map part 1 Page 6 30 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware 200000h 1F0000h 1E0000h 1D0000h 17 1C0000h SWAP RAMDISK 1B0000h 1A0000h 190000h 180000h 170000h 160000h 150000h 140000h 130000h 120000h 110000h 100000h DRAM within first 1M I DRAM Roll Over DRAM 1M 2M WL SSSSSS Figure 7 PROCU memory map part 2 FLASH memory under FLASH Elle System Original 08 96 Page 6 31 RAE RAK 1N After Sales PDA Hardware Technical Documentation Jump to BIOS code Manufacturing and Aftersales data 4000000h 3FFFCOO GEOS and Applications non resident XIP DOS ROM_DISK 3F00000h BIOS 16K TFFS 20K 43K GEOS XIP rid ee 9s 3EC0000h 2 Mbytes XIP FLASH 1 3E00000h GEOS and Applica tions 3C00000h FLASH File 3A00000h DRAM within first 1M DRAM Roll Over XIP FLASH FLASH memory under FLASH Flle System Figure 8 PROCU memory map part 3 Page 6 32 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware Chip selects E3G CPU has four programmable chip selects Size of the memory block can be defined with 2K resolution Start address can be changed in 2K boundaries These chip selects have independent programmable wait states 0 64 Table 19 FLASH Chip Select G
192. S LLL uuuuuusuuueuuss 5 Figure 2 ACH type Fast Charger luusuuselussusss 6 Figure 3 PAR 1 left view ACP 3 connector right view 6 ele CH Se auscajpre ba Bess RE Det patrie xod b S RODA tens 7 Figure 5 Circuit diagram of DLR 1 cable 24 7 Figure 6 Spare battery Charger DCH A 9 Figure 7 Exploded view DCH A 13 After Sales RAE RAK 1N Technical Documentation Accessories Non Serviceable Accessories Battery Pack BLK 4S 0670153 Purpose a two cell Li lon battery by SONY Capacity 730 mAh Battery connector 4 pin pad plate Weight 82 5 59 Charge time 2 5h Charge voltage 8 4 0 1 V Charge current 800 mA Volume t b d Figure 1 Battery pack BLK 4S Universal Fast Charger ACH xxx Purpose fast charging of battery with transceiver Charger type switching mode power supply Operation constant current charging with limited voltage 12V nominal Input voltage 90 264 V 50 or 60 Hz Mains plug type Detachable AC cord to match any plug with local AC cord DC connector standard DC connector 3 8 mm Weight without AC cable 85 g with AC cable 110 g Volume 54 cm Cable length AC cable 200 mm DC cable min 300 mm max 2m Protection output current limiting max 830 mA output voltage limiting max 13 V unloaded Approvals Specific for country where sold Original 08 96 Page 5 RAE RAK 1N After Sales Accessories Technical Documentation Figure 2
193. S OW06 2K7 J 0603 R267 1430087 CHIPRES 0W06 100K J 0603 R268 1430087 CHIPRES 0W06 100K J 0603 Page 18 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists R270 1430776 CHIPRES 0W06 8K2 J 0402 R271 1430812 CHIPRES OW06 220K J 0402 R300 1430762 CHIPRES OW06 2K2 J 0402 R301 1430804 CHIPRES 0W06 100K J 0402 R302 1430804 CHIPRES 0W06 100K J 0402 R303 1430754 CHIPRES OW06 1KO J 0402 R304 1430730 CHIPRES 0W06 150R J 0402 R305 1430804 CHIPRES 0W06 100K J 0402 R306 1430788 CHIPRES OW06 22K J 0402 R307 1430794 CHIPRES OW06 39K J 0402 R308 1430804 CHIPRES OW06 100K J 0402 R309 1430796 CHIPRES 0W06 47K J 0402 R310 1430764 CHIPRES OW06 3K3 J 0402 R311 1430744 CHIPRES 0W06 470R J 0402 R312 1430796 CHIPRES OWOG 47K J 0402 R313 1430115 CHIPRES OW06 2K2 F 200PPM 0402 R314 1430115 CHIPRES OW06 2K2 F 200PPM 0402 R320 1430804 CHIPRES 0W06 100K J 0402 R330 1430722 CHIPRES 0WO06 68R J 0402 R331 1430726 CHIPRES 0W06 100R J 0402 R332 1430804 CHIPRES 0W06 100K J 0402 R333 1430770 CHIPRES 0WO06 4K7 J 0402 R334 1430760 CHIPRES OW06 1K8 J 0402 R335 1430804 CHIPRES 0W06 100K J 0402 R336 1430792 CHIPRES OW06 33K J 0402 R337 1430778 CHIPRES 0W06 10K J 0402 R338 1430726 CHIPRES 0W06 100R J 0402 R340 1430762 CHIPRES OW06 2K2 J 0402 R341 1430762 CHIPRES OW06 2K2 J 0402 R342 1430762 CHIPRES OW06 2K2 J 0402 R343 1430762 CHIPRES OW06 2K2 J 0402 R344 1430762 CHIPRES OW06 2K2 J 0402 R345 1430762 CHIPRES OW06 2K2 J 0402 R346 1430762 CHIPRES OW06
194. Sales Faultfinding Disassembly Technical Documentation 1 1 1 10 1 1 1 11 1 1 1 12 1 1 1 13 1 1 1 14 1 1 1 15 1 1 1 16 Reset OK The PWRGOOD signal should go from low to high after minimum time of 140ms when Vsys has risen to a valid level Time between battery connection and valid voltage at Vsys line should be in the order of 1 5ms If PWRGOOD signal rises too fast or the signal levels are illegal then go to 1 1 1 11 Replace D80 If this is not helping PWRGOOD line is pulled up or down somewhere or there is a CPU fault LCDVEE OK In boot sequence LCD is on If voltage other than 20V 24V near room temperature is seen at LCDVEE terminal then go to 1 1 1 13 Is LCDVEEON enabled There is LCD bias voltage shutdown feature in PDA normal use after set inactivity time period Check that LCDVEEON line is in logic high state 3 0V 3 4V If not go to 3 1 1 14 Otherwise go to 1 1 1 15 Command LCDVEE on Use PC Locals to command LCDVEE permanently on Select O Space Functions Target Signal Control to toggle LCDVEE This menu can also be used to control LCDVCC flash program voltage VCC5 and LCDPWM When LCD module is not connected verify also LCDVEE off state by toggling the control by PCLocals Is OV applied to N83 pin 4 Check that voltage between OV and 0 3V is seen at N83 controller pin 4 This signal enables the controller If not go to 1 1 1 16 When LCD module is not connected verify
195. T VBATT VB 2M Software limit 1 B2B 44 B2B 7 2V 8 7 Hardware limits 0 3V cut off min 1 SIMFLEX charging max Hardware limits n 3V during a call Original 08 96 Page 2 7 RAE RAK 1N After Sales Baseband Technical Documentation Table 3 Supply Voltages and Power Consumption continued Pin Conn Line Symbol Minimum Typical Unit Notes Nominal 14 B2B VCHAR 10 0V 12 0 13 0V Charger specifi 31 B2B cations without load 16 B2B VF 11 4V 12V 12 6V ma program ming voltage Table 4 Digital control signals VA2 VA3 11 B2B 12 B2B BACKLIGHT RBUSRXD RBUSTXD XPWRON ee 4 85V 5 0V 4 85V 5 0V 0 2V 0 7V 4 85V 5 0V 0 2V 0 7V OV oV 0 7V Output low back lights off Output high back lights on State 1 State 0 State 1 1 mA load State 0 Input low power on off Display and key board illu mination control RBUS trans mitted data from CMT Floating when inac tive A pull up in PSL 157 B2B BUZPWR Input low buzzer on Input high buzzer off 20 B2B 19 B2B 18 B2B 17 B2B Page 2 8 Output low Output high keyboard columns Original 08 96 After Sales Technical Documentation Output Input low RAE RAK 1N Baseband keyboard row lines Output Input high Output Input low Output Input high display data lines keyboard ro
196. The function asks the same questions about values from EEPROM or PC as power tuning The following automatic selections are made when this function is activated Active Unit TX Operation Mode Burst TX Power Level 10 GSM If TX Data Type RANDOM gt TX Data Type 1 Channel 60 GSM Amendment 1 04 97 Page 7 25 RAE RAK 1N After Sales Service Software Technical Documentation The next menu is displayed after the answer L TX Lal Tuning 1 2 Tune TX Q DC Offset 3 Tune TX I and Q DC Offset 4 Tune Amplitude Difference 0 0dB 5 Tune Phase Difference 90 0 Amplitude Difference l 5 Phase Difference 85 30 When a selection is made the menu will disappear from the display and the control will be on the tuning window The right top hand corner of the tuning window shows which tuning is activated The user can tune the current value with the plus lt gt and minus lt gt keys Tune TX I DC Offset The DC Offset is shown as a percentage of the maximum value 0 96 means that there is no DC The value range is 100 100 96 The value is rounded to the nearest integer value Tune TX Q DC Offset The operation of this function is the same as the previous one except with this selection the Q branch DC Offset is tuned Tune TX I and Q DC Offset The operation of this function is the same as the previous one except with this selection both and Q branch DC Offset is tuned
197. Trans supr 16V 23A 600W DO214AA Max809t mcu reset 3 08v SOT23 IC MCU TQFP176 Dram 1mx16bit 60ns 3v3 TSOP2 44 IC 1mx16bit120ns 3 3v tsop E28F016 TSOP56 IC flash memory E28F016SV TSOP56 IC flash memory E28F016SV TSOP56 Max3222 4xrs232 transceiver VSO20 IC regulator LP2980IM5X 5 0 5V 50mA SOT23 Max763a sw reg 3 3v 0 5 a 5 so8s SO8S IC 2 x comp LMC6762 SO8S Max772 sw reg 2 16 5v max 1a so8s SO8S Tfds3020 irda sir ir tx rx sm8pin SM8PIN Reed relay 1a 10 25at 0 5a 2 5x1 2 5x10 Pin header 1x02 1 25mm angle smd SMD SM conn 2x22 m p0 8 pcb pcb 9 0 9 0MM SM flex conn sfv 33pol p0 5 u c U CON SM system conn 12pol m p1 27 PCB GP1 170 9X51 0X1 0 M8 2 PA Amendment 1 04 97 Page 41 RAE RAK 1N After Sales Parts Lists Technical Documentation User Interface GK2 EDMS pn 02007068 issue 3 0 Item Code Description Value Type R001 1430063 Chip resistor 12k 5 0 063 W 0603 R002 1430063 Chip resistor 12k 5 0 063 W 0603 R003 1430075 Chip resistor 33 k 5 0 063 W 0603 R004 1430063 Chip resistor 12k 5 0 063 W 0603 R005 1430063 Chip resistor 12k 5 0 063 W 0603 R006 1430085 Chip resistor 82k 5 96 0 063 W 0603 R007 1430057 Chip resistor 8 2 k 5 0 063 W 0603 R008 1430076 Chip resistor 36 k 5 0 063 W 0603 R010 1430065 Chip resistor 10k 5 96 0 063 W 0603 R011 1430065 Chip resistor 10k 5 0 063 W 0603 R012 1430065 Chip resistor 10k 5 0 063 W 0603 R013 1430065 Chip resistor 10k 5 0 063 W 0603 R014 1430065 Chip resistor 10
198. W06 47R J 0402 R840 1430786 CHIPRES OW06 18K J 0402 R841 1430770 CHIPRES OWOG 4K7 J 0402 R842 1430770 CHIPRES OWOG 4K7 J 0402 R843 1430832 CHIPRES OW06 2K7 J 0402 R844 1430734 CHIPRES 0W06 220R J 0402 R845 1430700 CHIPRES OW06 10R J 0402 R846 1430710 CHIPRES OW06 22R J 0402 R847 1430718 CHIPRES 0W06 47R J 0402 R860 1430716 CHIPRES OW06 39R J 0402 C200 2310336 CHIPCAP NPO 18P J 50V 0805 C201 2320544 CHIPCAP NPO 22P J 50V 0402 C202 2320744 CHIPCAP X7R 1NO K 50V 0402 C203 2320744 CHIPCAP X7R 1NO K 50V 0402 C204 2320778 CHIPCAP X7R 10N K 16V 0402 C205 2320778 CHIPCAP X7R 10N K 16V 0402 C206 2320560 CHIPCAP NPO 100P J 50V 0402 C207 2320560 CHIPCAP NPO 100P J 50V 0402 C210 2320131 CHIPCAP X7R 33N K 16V 0603 C211 2320131 CHIPCAP X7R 33N K 16V 0603 C212 2320131 CHIPCAP X7R 33N K 16V 0603 C213 2320131 CHIPCAP X7R 33N K 16V 0603 C214 2320131 CHIPCAP X7R 33N K 16V 0603 C215 2320131 CHIPCAP X7R 33N K 16V 0603 C216 2320131 CHIPCAP X7R 33N K 16V 0603 C217 2320131 CHIPCAP X7R 33N K 16V 0603 C218 2320131 CHIPCAP X7R 33N K 16V 0603 C219 2320131 CHIPCAP X7R 33N K 16V 0603 C220 2320744 CHIPCAP X7R 1NO K 50V 0402 C221 2320544 CHIPCAP NPO 22P J 50V 0402 C225 2320107 CHIPCAP X7R 10N J 50V 0603 C230 2320560 CHIPCAP NPO 100P J 50V 0402 C231 2320620 CHIPCAP X7R 10N J 16V 0402 C232 2604209 CHIPTCAP 1U0 M 16V 3 2X1 6X1 6 C233 2604209 CHIPTCAP 1U0 M 16V 3 2X1 6X1 6 C234 2320744 CHIPCAP X7R 1NO K 50V 0402 Page 24 Amendment 1 04 97 After Sales RAE RAK 1N Technic
199. a fax modem other communication features are disabled but the communicator interface remains functional Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide File Transfer To connect to a PC press Connect to PC The right window shows the directories of the PC the left window shows the communicator folders In order to transfer the selected file you must first open the directory or folder you are transferring files to Installing Removing Software This allows installation or removal of new and update existing communicator applications drivers and other system software components Backup Restore This allows data backups and the facility to restore it later The Backup Restore main view shows the data group which will be backed up or restored current connection type and the current PC directory Importing Exporting Contacts Contact information can be exported or imported as an ASCII file which can then be edited on a PC When mport Export contacts is selected the System main view displays the connection type used and the default path in the PC Data Removal This enables data to be deleted from the communicator The data is arranged into four groups All data Calendar data Documents plus Contacts and Speed dials Settings Changes can be made to the following communicator settings Contrast control Screen blanker period System sounds Preferences Scroll to requi
200. access to the GSM PCN networks A PDA providing a User interface that supports personal handsfree audio graphical high resolution display control keys and a QWERTY keyboard for text input The two parts are combined with a hinge and all data transfer between these two physical modules is performed over an asynchronous 2wire serial bus called RBUS Summary of product features The 9000 provides an extented UI with appropriate new applications and access to both voice and data services over the GSM network The following table lists the main features on both categories Table 1 List of NOKIA 9000 applications call initiating using contact manager app using call stack or keypad dialling speakerphone control DTMF multiple calls conference calls calling called party ID call timer counters settings sending receiving forwarding sending forwarding based on a new document or an exist ing one manual call stack or contact manager based recipient selection viewing tools settings on fax call divert amp cover page sending receiving sending based on a new or an existing document business card exchange via SMS DTMF service cards settings Contact manager communication contact data handling default user customisable keeps track of recent communication Memos document editing amp viewing viewer for FAX WWW World Wide Web and JPEG printing and sending SMS
201. act directory opens a contact card Pressing ENTER moves the cursor to the beginning of the next line or adds a new line The ENTER key can also be used to select contacts and contact information in the Contacts directory When information notes are shown you may press ENTER instead of the OK command In options and settings when the value can be toggled you may press ENTER instead of Change Command Buttons The commands always relate to the column of four command buttons on the right side of the display these will vary according to the application selected HELP Pressing the HELP button activates a context sensitive on line help Page 14 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Audio Control The audio control enables you to adjust the volume level and to activate the communicator s handsfree operation To activate the handsfree operation press the Audio on command button After audio has been activated the command changes to Audio control Pressing Audio control lets you adjust the speaker volume or turn audio off The indicator in the audio control view shows the chosen volume level Original 08 96 Page 15 RAE RAK 1N After Sales Quick Guide Technical Documentation Contacts QD QD Qu Ges CD C Ge Ge Ce The Contacts directory is used by all communications applications Telephone Fax SMS and the Mail applications The Contacts directory lets you view and edit all c
202. activity CMT_PDA_REQUEST_SERVICE Power on Power on charger connect or PDA XPWRON pulse Battery level request Setting changes Power off or CMT battery cutt off Figure 4 CMT power states from PDA point of view Page 6 20 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware Battery charge level limits on CMT and PDA Figure 5 overleaf shows an example of combined CMT and PDA critical battery levels measurement accuracy 50mV There are two kind of limits most of which are implemented in software The AD converter located in the CMT module is used as a source for battery level values needed by both CMT and PDA software PDA gets battery level information from the AD converter via ECI messages The CMT HW limit PDA HW cut off and Battery protect circuit cut off are implemented in hardware and actions are taken without notice to any software The following limits are based on battery level values read from the AD converter decisions are made by software Battery low level warning 1 If CMT is ON this warning is generated by CMT sending a message to PDA when warning 1 is triggered If CMT is OFF PDA must generate this warning itself e CMT battery cut off CMT switches itself off when battery level has fallen below this level Battery low level warning 2 PDA generates this warning when the battery level value read from CMT has fallen below this level PDA
203. age 7 20 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 3 1 3 Operation Mode When burst selection is used synthesizer is controlled by using GSM PON receiving transmission measuring synthesizer control sequence synthesizer channel numbers are as given with Channel Monitoring Channel selections if Active Unit is TX data selected with TX Data Type is sent and the TX power is connected When continuous selection is used if Active Unit is TX operation mode is changed to burst mode and functionality is same than when burst selection is used synthesizer is set to a constant frequency synthesizer channel number is as given with Continuous Mode Channel selection when Active Unit is RX AGC is controlled 3 1 4 TX Data Type This function changes the transmission data type Every time when selection is made the next value in the list is shown i e 0 1 Random After random data selection 0 is used 3 1 5 Continuous Mode Channel Continuous mode may use any GSM PCN channel numbers GSM 1 124 PON 512 885 The used frequency depends on the active unit When active unit is RX then RX frequency is used If active unit is TX continuous mode channel is ignored 3 1 6 Channel Channel selection numbers are used for both transmission and receiving 3 1 7 Channel Monitoring Channel Monitoring channel is selected separately for a ne
204. age 8 23 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 3 Troubleshooting Diagram of the LCD Check The following diagram is to differentiate between an LCD module or a PDA fault An LCD module fault is beyond the scope of this document and requires that a replacement module be fitted 0 Start NO 1 1 Disconnect UI flex YES 2 YES 3 1 1 Change LCD contrast CPU fault 1 2 2 CPU fault 3 1 LCDPWM OK NO YES active Contrast change OK 1 3 2 Check PDAPWR e 3 1 2 Check 4 PDAPWR Check LCD test patterns 1 5 2 CPU fault Test patterns OK 1 5 PCLK LP FP DISPON OK YES 1 4 1 UI flex 1 5 1 LCD fault module fault Page 8 24 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 3 1 3 1 2 1 3 1 2 2 3 1 3 1 3 1 3 2 LCD ON The first step is to check whether the LCD is on when in testmode When the PDA boots and if the testmode pin is active the CPU controls the LCD on If the LCD remains blank then proceed to 3 1 1 If the LCD is set on then more detailed tests can be carried out when proceeding to 3 2 Disconnect UI Flex In order to isolate the problems in the LCD module disconnect the UI flex from the PDA Of course it can be easily tested i
205. al Documentation PDA Hardware VCC5 regulator 5V output is used only for data writing to FLASH memory and RBUS signals Regulator is taken out of shutdown when it is needed This simple linear regulator has pnp control transistor and overcurrent overtemperature protection circuitry Maximum current is 50mA Peak current is 100mA At higher loads case heats up and regulator is shut off for very short time and restarted to check if high load remains If so thermal cycling results Typical turn on time for the regulator is 50us Only small output capacitor is needed as external component However its ESR value must be within certain limits depending on capacitance and load current in order to get stable regulator output Reset circuit Purpose of the reset circuit is to generate proper reset to the CPU and also disable CPU operation when Vsys is below CPU Vcc range When the battery is plugged in reset circuit generates proper reset pulse when Vsys is risen up to CPU Vcc range Threshold difference between power good and power not good is about 0 02V Undervoltage lockout UVLO Input filter Battery voltage is compared to accurate reference diode to detect too low battery voltage Below this HW limit comparator shuts down VSYS regulator to prevent battery from overdischarge There is higher SW limit for PDA but VSYS regulator current drains the battery when left unused for long period After UVLO there is only reference diode and two co
206. al Documentation Parts Lists C235 2310791 CHIPCAP X7R 33N M 50V 0805 C236 2320620 CHIPCAP X7R 10N J 16V 0402 C237 2604329 CHIPTCAP 4U7 M 10V 3 5X2 8X1 9 C238 2604329 CHIPTCAP 4U7 M 10V 3 5X2 8X1 9 C239 2604329 CHIPTCAP 4U7 M 10V 3 5X2 8X1 9 C240 2320778 CHIPCAP X7R 10N K 16V 0402 C241 2604329 CHIPTCAP 4U7 M 10V 3 5X2 8X1 9 C242 2320560 CHIPCAP NPO 100P J 50V 0402 C243 2604329 CHIPTCAP 4U7 M 10V 3 5X2 8X1 9 C244 2604329 CHIPTCAP 4U7 M 10V 3 5X2 8X1 9 C245 2320560 CHIPCAP NPO 100P J 50V 0402 C246 2320620 CHIPCAP X7R 10N J 16V 0402 C247 2320560 CHIPCAP NPO 100P J 50V 0402 C248 2320560 CHIPCAP NPO 100P J 50V 0402 C249 2320107 CHIPCAP X7R 10N J 50V 0603 C250 2320107 CHIPCAP X7R 10N J 50V 0603 C251 2604209 CHIPTCAP 1U0 M 16V 3 2X1 6X1 6 C252 2320598 CHIPCAP X7R 3N9 J 50V 0402 C253 2320620 CHIPCAP X7R 10N J 16V 0402 C296 2320560 CHIPCAP NPO 100P J 50V 0402 C300 2320598 CHIPCAP X7R 3N9 J 50V 0402 C301 2320598 CHIPCAP X7R 3N9 J 50V 0402 C302 2320598 CHIPCAP X7R 3N9 J 50V 0402 C303 2320598 CHIPCAP X7R 3N9 J 50V 0402 C304 2320544 CHIPCAP NPO 22P J 50V 0402 C305 2320544 CHIPCAP NPO 22P J 50V 0402 C306 2320560 CHIPCAP NPO 100P J 50V 0402 C307 2320598 CHIPCAP X7R 3N9 J 50V 0402 C308 2320560 CHIPCAP NPO 100P J 50V 0402 C309 2320560 CHIPCAP NPO 100P J 50V 0402 C320 2320560 CHIPCAP NPO 100P J 50V 0402 C321 2320544 CHIPCAP NPO 22P J 50V 0402 C322 2320544 CHIPCAP NPO 22P J 50V 0402 C323 2320560 CHIPCAP NPO 100P J 50V 0402 C324 2320560 CHIPCAP NPO 100P J 50V 0
207. al Specifications RF frequency plan GSM 935 960 890 915 VCXO 26 MHz Figure 1 GSM Frequency Map RX 1492 1567 TX 1510 1585 Figure 2 PCN Frequency map Page 3 6 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation RF Maximum Ratings The maximum battery voltage during the transmission should not exceed 8 5 V Higher battery voltages may destroy the power amplifier During charging this will be quaranteed by hardware based limiting which has maximum value 7 6 0 3 V However the maximum voltage of the Li lon battery will be almost 8 5 V when the battery is full The charging algorithm ensures that the voltage never exceeds this limit Power Distribution Diagram GSM PON All currents in the power distribution diagram are peak currents Activity percentages are in CALL mode 24 6 96 for RXPWR 15 8 96 for TXPWR and 100 for SYNTHPWR In IDLE mode activities are 0 4 96 0 0 96 and 1 77 96 respectively The current of each block is controlled independently for example TXPWR and RXPWR are not on at the same time Regulators There is one regulator IC in the RF unit The regulator IC CRFCONT is an RF power supply circuit basically intended for digital handportable phones It has 8 separate linear regulators and power on off switches for RF circuitry Each regulator can be individually disabled and enabled and also has a voltage reference output See more details on Figure 3 and Figu
208. alid Boot Code in UCS Flash If the boot code in the D163 is corrupted then proceed to the 1 1 If the Flash is programmed or it is sure that it contains valid data and the CPU doesn t control the RS buffer correctly then proceed to 1 7 1 3 Program UCS Flash If there s no guarantee that the UCS Flash D163 contains a valid boot code re programme it with the JTAG method or change to a good one After programming replacing return to 1 6 CPU or UCS Flash Fault If the CPU D130 doesn t control the RS buffer although there is a valid boot code in the UCS Flash D163 then there is a fault either in the CPU or in the Flash itself In most cases the fault is likely to be the CPU but it cannot be guaranteed unless the functionality of the UCS Flash is verified with another system Activity in CPU RxDO If the RS buffer is activated and the IR tranceiver TFDS3000 M180 is put to active shutdown then it s worth checking if the RSRXD line D130 pin114 D180 pin10 is toggling i e are the host s pings received this far If the line is toggling and the signal levels are OK then the CPU receives the ping bytes If the RSRXD line is not toggling but the input of the buffer RXD D180 pin9 is toggling and the buffer control signals are OK then proceed to 1 7 2 1 If the RSRXD signal is toggling in the CPU pin then the CPU should be transmitting acknowledgement bytes to the host In the case proceed to 1 7 3
209. also LCDVEE off state by toggling the control by PCLocals In LCDVEE off state N83 pin 4 must see battery voltage Check N82 R75 R76 R96 First check that resistors R75 R76 and R96 are OK Check that voltage at comparator N82 pin 3 is in the range of 1 55V 1 75V If not check reference V84 In cathode of V84 voltage of 4 1V should be seen If OK replace N82 After that if still problems verify that comparator N82 pin 2 has higher voltage than pin 3 If yes and N82 pin 1 is not low 0V 0 3V then change N83 Page 8 16 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 1 1 1 17 1 1 1 18 1 1 1 19 1 1 1 20 1 1 1 21 1 1 1 22 1 1 1 23 Original Is N83 pin 1 toggling There should be seen about 300kHz voltage toggling between OV and VBatt In oscilloscope there should be seen about 20 pulse sequences at irregular pulse group periods If not go to 1 1 1 18 Otherwise if there are pulses coming to N83 pin 1 in continuous train the regulator is saturated Check that valid LCD voltage is seen at C89 positive terminal Measure LCDVEE current with UI module connected If current is higher than 4mA big LCD in UI module is probably corrupted LCDVEE controller fault Replace N83 Is V89 anode voltage toggling There should be seen irregular shaped voltage bursts at peak magnitude between OV and valid LCD voltage little higher Voltage bursts decrease in magnitude duri
210. an 80cm drop onto a solid floor Humidity and Water Resistance Relative humidity range in normal operation conditions 20 75 96 Relative humidity range allowed 5 95 96 The transceiver is not waterproof and care should be taken if used in damp conditions Maximum Ratings Table 11 Maximum Ratings Pin Conn Line Symbol Typical Unit Notes Nominal 1 Battery VBATT 5 0 qe V Phone off in min extreme PDA on 1 3 Char VCHAR V unloaded Operating Instructions Operating instructions are given in the QUICK GUIDE in the Appendix of this manual and the USER S GUIDE that comes with the product The transceiver is provided with a HELP system via both keypads lid open closed Also on line help will be available on the Internet via the Nokia club service Original 08 96 Page 1 19 RAE RAK 1N After Sales Overview Technical Documentation This page intentionally left blank Page 1 20 Original 08 96 After Sales Technical Documentation RAE RAK 1N Series Chapter 2 Transceiver GES GE9 Baseband Block Original 08 96 RAE RAK 1N After Sales Baseband Technical Documentation CONTENTS Baseband Page No dure e Tee E 2 5 Technical SUMMA ed eher Rte ER EE ENEE ee KREE e E eg 2 5 Interconnection Diagram osorno 2 6 Modes OF ODIO sacs ces itu eqs uim od e Pre malu ltd 2 7 Active Mode Guara gd ri a epg eb e duis px us 2 7 die MOOD suae i ier Age NER ee beaters PERSE
211. and RFI reset is released after 256 13 MHz clock cycles DSP reset release time from DSP clock activation can be selected from 0 to 255 13MHz clock cycles In our case 255 is selected SIM reset release time is according to GSM SIM specifications The RFC buffer buffers the 26 MHz clock from theVCXO to the ASIC In the ASIC the clock is further buffered and delivered to MCU The clock is also divided and delivered to RFI and SIM ASIC also generates main and sync clocks for audio codec DSP s SIOs and DBUS The clock outputs can be disabled in order to save current when the clock is not needed Also the 60 2 MHz DSP oscillator can be disabled by the ASIC Page 2 36 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Interface to the MCU is done with 8 bit data bus 5 bit lower address bus 4 bit upper address bus RSTROBEX WSTROBEX IRQX and NMI ASIC is in the same memory space as MCU memories There is also MBUS RBUS detector and netfree counter on the ASIC Netfree interrupt IRQX occurs if no activity is detected in MBUS in about 3 ms Note This netfree counter cannot be used in the CMT because RBUS data is seen at the same pin NMI is used to wake up the MCU from sleep mode MCU and DSP communicate through ASIC ASIC has an MCU mailbox and a DSP mailbox MCU writes data to DSP mailbox where DSP can only read the incoming data In MCU mailbox the data transfer direction is the opposite The size of the mailbox is 6
212. ange 000000h 1FFFFFh End Physical Address default 3E00000h Range 3A00000h 3C00000h 3E00000h End Relative Address default 1FFFFFh Range 000000h 1FFFFFh The output from the target shows the following whether the command was parsed successfully whether the Flash locking has been successful Amendment 1 04 97 Page 7 67 RAE RAK 1N After Sales Service Software Technical Documentation 3 6 Flash Several Targets This menu provides functions to access the PDA Flash memory Ping Targets Software Update Erase Flash Lock Flash Program Flash From File Calculate Checksum 3 6 1 Ping Targets This menu item verifies the validity of the communications channels to all the targets that the external serial ports card supports by sending a test message to the targets If the channels are fully functional the targets respond to the message requests The pinging can be repeated as soon as the other required targets have replied The user will not have time to boot up all eight targets all at once The output from the target shows the following how many targets responded 3 6 2 Software Update This menu provides means to update the PDA Flash memory in parallel to all the targets from a file on the disk in the host The enquired input parameters from the user are Name of the Update default none range none The user is expected to give the Name of the Update i e the name of the image file that will b
213. ange is from 1023 to 1024 and the voltage range from 0 25v to 4 45 accurate to within 0 01v T Diagram Value Type DAC Voltage Freguency Error Low 341 Middle 10 High 341 25 C Middle Temperature ESC Exit The value range of the error values is between 134 kHz and 134 kHz accurate to within 0 1 kHz If the measurement is incomplete when Esc is used an information message is shown The user can remove the information message with Y N or Esc key The measurement will be terminated by using Y key The measurement will continue if lt N gt or Esc key is used Upon exiting the next selections are set to the values which were selected before this adjustment Active Unit Operation mode Also AFC is set to the previous value Amendment 1 04 97 Page 7 29 RAE RAK 1N After Sales Service Software Technical Documentation 3 2 6 Noise Sensitivity This function is used for making Signal to Noise measurement The following automatic selections are made when this tuning function is activated Active Unit RX Operation mode Continuous AGC 93 dB in GSM 81dB in PCN When this selection is made the next window is displayed Noise Sensitivity J E Info 1 Clipping Distance 33 9dB OOOO SNR AD converter i cdvoooonct SESE S 00 i A TX Data Tuype Si Sq 1 4dB OUT OF RANGE Discharge information RFI TI VINO S SA I signal Q signal
214. ath Voltage gain over R112 is 83 in the amplifier This is compared to two reference voltages First determines the current at which LED color is changed 65mA Second reference is put for stopping the charge at lower current value 30mA This is made to ensure that there is no capacity loss in Li lon battery if it remains in desktop charger many days Different Charging Voltages Two cell Lithium lon carbon technology requires 8 4V constant voltage charging Two cell Lithium lon graphite technology must be charged by 8 2V constant voltage Because the controller is already set to 8 4V charging higher voltage reference and voltage dividor from reference to battery voltage is required to feed 8 4V to controller and maintain 8 2V in battery line for graphite batteries Because the reference is zener its voltage is not stable unless current is set high enough Voltage tolerance of charger sets minimum current value at this voltage 10V Nominal charger voltage makes zener current high This also makes high leakage current path from battery to regulator input V148 is cutting this current path when either charger or battery is disconnected Battery chemistry is detected by battery type sense resistor which is connected to ground inside battery pack Connecting battery biases pin 5 of N110 so that either voltage is selected when charging starts V147 controls the voltage shown to charge controller N115 If V147 conducts battery voltage is directly fed
215. ation LLuuusssesssesse nh 13 Keys and Buttons 2 lt 0 ceceensveedledws ERE RE eek RE AE d RS 13 Were MampC TET 15 EE 16 Contact CANIS uisus cede she reete SERRE EE FAR EE EE e 16 TELEPHONE zm 17 Making a Call From The Directory oocoocccccccnconc 17 Making a Call Manually ge Negi rr AEN ad 17 Answering Cales 17 Fak qe 18 Sending a New Fax 18 Sending a Fax from Own Texts Tolder eae 19 Sending from Received Faxes folder o o 19 Receiving Faxes 19 SMS Short Message Service 0 ccc cece eee eens 20 Sending messages cic woo deer eeks Geese ad Odes doaddede ear duad 20 Receiving messages cc ooo Eben bsp Rs ESPERE on EQ Rea Shades 21 MESI EE 22 AA 23 World Wide Web occ esee exe rh ser has cer ra 24 Telnet and Terminal EE 24 Ke 25 Reading Documents us dee ond ese E E E dade owe iewee 25 Creating Reef 25 Deleting Documents 4 erste Poe cre Doe ctl rg ia 25 Sending Documents ua utes mp UR RE REESE eed NES EE EE 25 Page 2 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Galendar uus due odore Eram dot rds och ew bot erem dios be didis 26 Month EEN 26 Day VIEW Ter CETT 26 xol MA PREMIT 27 SSI s ee E xu ta epit cua uote On it 28 DCCUMY sexos M 28 A armeni naa eE ae ag aE SE aE i aioi a a E a 28 Pa E Ee ia da See DE e E ee 28 File JEGEN Se ara ir as oe a wend ie 29 Installing Removing Software 29 Bac
216. ault 3C00000h Range 3A00000h 3C00000h 3E00000h Start Relative Address default 000000h Range 000000h 1FFFFFh End Physical Address default 3E00000h Range 3A00000h 3C00000h 3E00000h End Relative Address default 1FFFFFh Range 000000h 1FFFFFh The output from the target shows the following whether the command was parsed successfully whether the Flash reading to buffer has been successful whether the transferring of the buffer contents has been successful Page 7 66 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 3 4 Erase Flash This menu provides means to erase one or more blocks of the PDA Flash memory User options are Start Physical Address default 3A00000h Range 3A00000h 3C00000h 3E00000h Start Relative Address default 000000h Range 000000h 1FFFFFh End Physical Address default 3A00000h Range 3A00000h 3C00000h 3E00000h End Relative Address default 1FFFFFh Range 000000h 1FFFFFh The output from the target shows the following whether the command was parsed successfully whether the Flash erasing has been successful 3 5 Lock Flash This menu provides means to lock one or more blocks of the PDA Flash memory This function sets the particular lock bit in each Flash memory block that is to be locked User options are Start Physical Address default 3C00000h Range 3A00000h 3C00000h 3E00000h Start Relative Address default 000000h R
217. both the Telephone application and from the Extras application group The main view lists all available ringing tones but you can edit the three custom tones Edit Options Play Song Close Figure 28 Extras composer Help Y O Qu Help is context sensitive and if pressed will always display a help file about the application you are in Pressing Application topics gives you a list of topics covered for that application To view a list of general help topics including a troubleshooting guide press General topics To return to the active application press Close Document Outbox All documents you send go through the Document outbox where they are sent automatically whenever it is possible to do so The Document outbox can be accessed in the Fax SMS Mail and Notes applications main views where it is shown at the bottom of the folders list To open the Document outbox select the Document outbox from the list and press Open Press Start to send a document the top of the list is sent first Document outbox canco Doc To By Status Fax 2 Dekkert Manfred Fax Sending Start Mail 1 Parsons Russe Mail Upon request Mail 2 Aenstaedter Jens Mail Upon request Close Figure 29 Document outbox Page 32 Original 08 96 C 2 Co O C 2 USES NOTES gt This Service Manual are Manufacturer intellectual propriety The design and the way the documents are se
218. bout 5 dB attenuation MIC output mic sensitivity 62 dB 7 9 mV Pa 0dB 1V uBar 1uBar 0 1Pa Flat mic response Handset gain 27 dB Accessory level 140 mVrms HFJ gain 0 dB 140 mVrms 21 dB Cable level Attenuation on system board Page 2 12 Original 08 96 After Sales Technical Documentation Table 11 Accessory HS microphone HSMIC 1kHz rms Codec input level 12 5 mVrms RAE RAK 1N Baseband continued Fixed 20 dB programmable 0 22 5 dB 0 dBm0 490 mVrms 6 dBm0 250 mVrms Table 12 Accessory HS earpiece 6 0 dBm0 980 mVrms Level 0 dBm0 1965 mVrms Codec gain 6 dB With maximum gain Output attenuation 6 dB 6 dB attenuation because of single ended output Cable level 245 mVrms min impedance 1 kQ Accessory level 245 mVrms Handset gain 1 dB minimum 18 dB maximum EAR amp output 310 mVrms minimum 1 95 Vrms maximum Hanset gain 5 12 dB 6 dB from single side to differential conversion Measured differentially Earpiece pressure 1 dBPa minimum 18 dBPa maximum Table 13 Accessory HF microphone HFMIC NOTES 1 kHz rms MRP 15 dBPa 50 cm from MIC MIC 5 dBPa about 20 dB atten MIC output when HFJ 2 0 mVrms connected MIC sensitivity 65 dB 5 6 mV Pa mic output level 3 3 mV without load HFJ gain 40 dB Cable level 200 mVrms Attenuation on system 21 dB board Codec input level 18 mVr
219. cap 100p 5 96 50 V 0402 C243 2604329 Tantalum cap 4 7u 20 96 10 V 3 5x2 8x1 9 C244 2604329 Tantalum cap 4 7u 20 10 V 3 5x2 8x1 9 C245 2320560 Ceramic cap 100p 5 96 50 V 0402 C246 2320620 Ceramic cap 10n 5 96 16 V 0402 C247 2320560 Ceramic cap 100p 5 96 50 V 0402 C248 2320560 Ceramic cap 100p 5 96 50 V 0402 C249 2320107 Ceramic cap 10n 5 96 50 V 0603 C250 2320107 Ceramic cap 10n 5 96 50 V 0603 C251 2604209 Tantalum cap 1 0u 20 16 V 3 2x1 6x1 6 C252 2320598 Ceramic cap 3 9n 5 96 50 V 0402 0253 2320620 Ceramic cap 10n 5 96 16 V 0402 C300 2320598 Ceramic cap 3 9n 5 96 50 V 0402 C301 2320598 Ceramic cap 3 9n 5 96 50 V 0402 C302 2320598 Ceramic cap 3 9n 5 96 50 V 0402 C303 2320598 Ceramic cap 3 9n 5 96 50 V 0402 C304 2320544 Ceramic cap 22p 5 96 50 V 0402 C305 2320544 Ceramic cap 22p 5 96 50 V 0402 C306 2320560 Ceramic cap 100p 5 96 50 V 0402 C307 2320598 Ceramic cap 3 9n 5 96 50 V 0402 C308 2320560 Ceramic cap 100p 5 96 50 V 0402 Amendment 1 04 97 Page 9 After Sales RAE RAK 1N Parts Lists Technical Documentation C309 2320560 Ceramic cap 100p 5 96 50 V 0402 C320 2320560 Ceramic cap 100p 5 96 50 V 0402 C321 2320544 Ceramic cap 22p 5 96 50 V 0402 C322 2320544 Ceramic cap 22p 5 96 50 V 0402 C323 2320560 Ceramic cap 100p 5 96 50 V 0402 C324 2320560 Ceramic cap 100p 5 96 50 V 0402 C325 2320560 Ceramic cap 100p 5 96 50 V 0402 C326 2320560 Ceramic cap 100p 5 96 50 V 0402 C330 2320560 Ceramic ca
220. ce Software Help Functions The help key F1 can be used anytime when a menu is on the display The help key is context sensitive and gives information according to which function is highlighted The Esc key closes the help window Text Editing Windows When you have made a selection which needs some additional information the basic text editing window is activated The text editing window may have one or more editing lines The length of the line varies depending on the function When the window is activated the text which was previously in that window default text reappears on the screen The following key selections are possible Key Function Enter Esc Ins lt gt lt gt lt Home gt lt End gt lt BS gt Selects the text in the window the editing window is turned off The selected text will be the default text of the selection Interrupts editing the previous menu is shown and the default text won t be updated Toggles the editing mode between insert and overstrike modes The last line of the screen tells the current editing mode When editing ends the editing mode is retained and the same mode is used again when editing text Arrow keys right shift and left shift move the cursor The cursor moves as if the lines were positioned one after another For instance right shift causes the cursor to move from the last column of the first line to the first column of the second li
221. channel The muting unit can also be used as a relay to cut the main supply feed of the car radio Ignition Sense IGNS The Ignition Sense feature prevents your Communicator from draining the car battery by executing an auto power off in 20 seconds after the ignition key has been turned off The blue wire of the power cable is used for the ignition sense feature The use of ignition sense is recommended to prevent accidental draining of the car s battery The wire is connected via a 200 mA fuse to a 12 24 volt potential that is controlled by the ignition key Do not connect it directly to the high voltage sections of the ignition circuit All installations should take into account any special requirements of the customer However should the customer require an installation that is illegal or unsafe these facts must be pointed out to the customer and a policy of non compliance adopted After Sales Technical Documentation RAE RAK 1N Series Testing Once installed the equipment should be tested to ensure that it is operating satisfactorily and that the position of the units does not impair on the driver s ability to control and operate the vehicle in any way Use the Communicator to make a call when the vehicle is parked with the engine running During the call switch off the engine Ensure that the phone is operational with the engine running and with the engine switched off For operating information refer to the Accessories Guide
222. choice adds the PMI test to be included to the test sequence The test is performed with default parameter This test requires user activity the user must turn the CMT module on off using the CMT power switch or and the user must open close the UI The default parameters used TimeOut default 25 0s The output from the target shows the following whether the test was successful 7 7 RTC Test Enabling this choice adds the RTC test to be included to the test sequence The test is performed with no default parameters The output from the target shows the following whether the test was successful 7 8 Serial Test Enabling this menu adds the Serial test to be included to the test sequence The test is performed with default parameters as follows Mode default Local loop Port default COM1 COM2 The output from the target shows the following whether the test was successful Amendment 1 04 97 Page 7 61 RAE RAK 1N After Sales Service Software Technical Documentation 7 9 Checksum ROM Enabling this choice adds the Checksum ROM test to be included to the test sequence The test is performed with default parameters as follows Start Physical Address default 3C00000h Start Relative Address default 000000h End Physical Address default 3E00000h End Relative Address default 1FFBFFh The output from the target shows the following whether the command was parsed successfully whether the test was successful 7 10
223. connect M180 pins 2 6 7 By doing this the control signals can be isolated to the RS buffer or to the CPU Go back to 7 4 1 RG Buffer Fault If the control signals do not toggle to the right state even though the IR tranceiver is isolated then the fault is most likely in the RS buffer D180 However it is possible that the CPU does not control the lines But since the RS buffer is needed for the communications to the host it can not be tested if the control signals are disconnected between the CPU RS buffer RSRXD Activity If the byte is received by the IR tranceiver then the RSRXD line toggles right after the control signals are toggled If the RSRXD signal toggles proceed to 7 4 2 1 otherwise go to 7 4 2 2 CPU Fault If all the signal lines to the IR tranceiver toggle as they should and there is activity in the RSRXD while the IR transmitter connected to the host PC is transmitting the byte then the CPU is likely to be faulty M180 Fault If the RSRXD signal does not toggle then the M180 is likely to be faulty Original 05 97 Page 8 39 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 8 Troubleshooting Diagram of the RS 232 Check The following picture illustrates the serial port tests As the COM1 is being tested automatically in the communications to the host PC only the COM2 can be tested externally with the aid of the service software Both serial ports can be tested in
224. ctions All GSM channel numbers can be used If more than one selection has the same number the monitoring channel list neighbour list will have less than 6 selected channels The minimum number of monitoring channels is one all channels have the same value The monitoring channel can also have same value as a normal operating channel The first monitoring channel updates the same parameter as Monitoring Channel in the RF Controls menu Amendment 1 04 97 Page 7 33 RAE RAK 1N After Sales Service Software Technical Documentation 3 4 Internal Audio Loop Internal Audio Loop 1 Input CInt Ext Phf 2 Output Int Ext Phf 3 Loop OnOff HH H FiHelp Hu HE i H Ti Move by Line Enter Select ESC Exit This test interface allows selection of input and output Internal External Phf and also connects and disconnects the test loop The sent audio signal level has a constant value which depends on the selected interfaces When Esc key is used the internal loop is automatically ended Loop Off 3 5 External Audio Loop L External Audio Loop 1 1 Interface CHS HF PHF 2 Make a Measurement FREQUENCY Hz 300 1000 3000 RECEIVED LEVEL Fi Help Ti Move by Line Enter Select The first item selects the interface Internal External Phf The sent audio signal level has a constant value which depends on the interface When the frequency is changed the received signal strength is mea
225. d 11 SE sell D De TXC Sn 5 28 b E a al la x e lg DE HA a e E aM a ai Aj S la D m M S o 08 AN aa y Va 4 A geese EN gai E A E E o amp sS n i HIR i B0858N AUN 2 SMS 2165 CH 33 2x a A a SA e b pol WE i Sea loc a co 8 e 7159 De 5A LU 10 50 KE de Ex 7 E 778 a E His VE i a LN ES o 28 ele E P Ju o vet ong R do MO Uu d j EE BFROZA SC ell S Ma TX D E 6 WE f ER zu Jn d c164 180 n a a e a E 0 Ha il wall voca 0722 b g E aile Edi 22 SIN ZS eech Ai d ale HS 5 d HA el OR 220n Sn ac E m 303 902 544 FIRES zd o a Y 1155 d R Ed E bs 5 x Dt a e aie GE L ZS ms C72 Ca cles cm NT a ES c ig qe ee s I I m 100 120 ie p Ze s Te 1 bn y BFO540_X N 0 25 l ca To D 0138 1 71 ve m 100 D EE s BFRSA T G RER 28 9 E 105 L 40 5 CT26 303 Original 08 96 Page 10 16 Figure 7 RF RX Circuit Diagram RAE 1N
226. d date can be adjusted in the Clock settings Time Daylight saving Home city and time in use home country Alarm clock gt Clock World time C_D Cx oe acm Settings C_D i Friday 13 01 96 kees Close C D AM or PM Date Alarm active Time of Alarm Figure 26 Extras clock main view Alarm Clock The Alarm clock is activated with the Alarm clock command in the Clock main view The counter below the alarm clock is shown only if there is an active alarm and this activates according to the home city time World Time World time is activated with the World time command in the Clock main view The world map shows the currently elected destination city on the world map in cross hairs The Home box shows information on the currently selected home city The Destination box shows the same information for the currently selected destination city as well as the international call prefixes needed to make a call from the home city to the destination city Home Set Tampere Finland destination Q 20 43 amp 3 30 09 96 Cities CD Destination San Francisco USA O O 09 43 30 09 96 2 EL Close gt Figure 27 Extras clock world time Original 08 96 Page 31 RAE RAK 1N After Sales Quick Guide Technical Documentation Composer The Composer application enables you to compose customised phone ringing tones The Composer can be started from
227. d the CS1 CSO lines If there is no activity at all then check PWRGOOD signal during powering the device up If there is reasonable activity in the signals and the signal levels are OK proceed to 1 4 Original 05 97 Page 8 19 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 1 3 1 1 3 1 1 Reset OK The PWRGOOD signal coming from the PDA power unit should go from low to high after 140ms when VBatt is connected If this signal is not functioning as expected then disconnect the signal either from the CPU D130 or the Reset IC D80 and isolate the problem to the power unit or to the CPU If this signal rises too fast or the signal levels are illegal then check the power unit If the signal is OK but there s no bus activity at all then suspect a CPU fault see 1 3 1 1 CPU Fault If the PLL is running properly and the CPU gets the RESET signal from the power unit PWRGOOD but there is no bus activity at all then it is likely that the CPU is not functioning properly If the PLL circuitry surrounding the CPU is OK but the PLLDIV24 is not then it is likely that the CPU is defective It is possible that PLLDIV24 is OK as well as RESET but no activity is detected on CPU address lines Before you replace the CPU it is reasonable to check that circuitry around the HPLLI R137 C153 C154 and IREFH R139 is OK It is hard to measure these signals so a visual check is usually all that can be done
228. d to continue or break the tuning These responses are in use Key Response N or Esc The tuning is continued Y The tuning is ended without EEPROM writing and power coefficients are asked from EEPROM the user is informed other key Page 7 24 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software If the power tuning function is ended and EEPROM values are not received or an EEPROM fault is noticed an error message is shown Error message asks to initialize the phone and if initialization is performed successfully the program is restarted If this kind of error situation appears restart program check connections and retune If the TX Power Tuning is ended and power coefficients are acceptable Key Response Y The coefficients are written to EEPROM and tuning is ended N The tuning is ended without EEPROM writing but the tuned coefficient values are used when RF controls are used Esc The tuning is continued other key When all power co efficients have values that don t cause any error messages exit can be selected The latest tuning power is in use after exit When values are saved to EEPROM GSM levels 0 5 are set to same value as level 5 The next automatic selection is made when this tuning function is ended Active Unit RX 3 2 3 TX I Q Tuning This function is used for tuning TX and Q branch DC offset amplitude difference and phase difference
229. dB 8 dB max volume Maximum volume 10 dB Codec output 120 mVrms nominal 390 mVrms max vo lume Earpiece pressure 6 dBPa nominal Earpiece impedance 32 20 series resis 16 dBPa max volume tance in CMT Original 08 96 Page 2 11 RAE RAK 1N Baseband After Sales Technical Documentation Table 9 Personal HF microphone PHFMIC NOTES 1kHz rms MRP pressure 14 dBPa 50 cm from MIC 6 dBPa MIC pressure about 20 dB attenuation MIC output 3 1 mVrms Codec gain 30 5 dB mic sensitivity 64 dB 6 3 mV Pa 0 dB 1V uBar 1uBar 0 1Pa Fixed 20 dB programmable 0 22 5 dB 13 5 dBmO 105 mVrms Level 0 dBmO 490 mVrms Table 10 Personal HF speaker PHFEAR NOTES 1 kHz rms Level 6 0 dBm0 980 0 dBm0 1965 mVrms mVrms Codec gain 14 dB nominal 14 dB attenuation Controllable 0 30 dB 6 dB max volume Maximum volume 8 dB Output attenuation 6 dB 6 dB attenuation because of single ended output Codec output 100 mVrms nominal 245 mVrms maximum Speaker input 0 78 Vrms nominal 1 95 Vrms maximum 80 mW average 8Q Bridge tied load 480 mW average 8Q Bridge tied load 50 cm from speaker Speaker sensitivity 80 dB W 1m Foster T028S21 OdB 94 dBPa 20 uPa Pressure 19 dBPa nominal 11 dBPa maximum Table 11 Accessory HS microphone HSMIC NOTES 1kHz rms MRP pressure 3 dBPa 5 cm from MIC MIC pressure 2 dBPa a
230. divider dBm aux divider mVrms ref divider Amendment 1 04 97 Page 3 25 After Sales RAE RAK 1N RF Technical Documentation Connections Antenna The default antenna in GSM transceiver is helix with turnable joint and in PCN a whip antenna with turnable joint also The location of the antenna is in the gk2 module The antenna signal is lead through the turnable hinge separating the gk2 and CMTmain modules using 50Q flexible coaxial cable The feedpoint of the antenna is matched to the 50 cable using LC matching transformer There is a SMD coaxial connector on the CMT board for the cable Table 22 Specification of the antenna cable Parameter Typical Maximum Notes Nominal Insertion loss Whole assembly in cluding cable and connectors at both ends Whole assembly in cluding cable and connectors at both ends Cable length The external antenna connector includes an antenna switch between the built in and external antennas The nominal impedance of the external antenna connector is 50 The connector is located near the duplex filter of the RF module Page 3 26 Amendment 1 04 97 After Sales Technical Documentation RAE RAK 1N Series Chapter 4 Transceiver GE8 GE9 UIF Module RAE RAK 1N UIF CONTENTS User Interface Introduction Technical Summary UIF Mechanics UIF Flexes UIF Electronics Technical Specification UIF Electrical Characteristics DC Characteristics AC Character
231. does not subject the unit and cables to moisture or mechanical pressure The Hands Free Microphone should be installed according to the directions in the separate microphone installation guide Ensure the microphone is as close to the driver s mouth as possible and attached to a surface that is mechanically quiet The microphone should be mounted at least 3 ft 1 m away from the Hands Free Speaker to avoid acoustic feedback The Hands Free Speaker is not very sensitive to vibrations thus it can be located more freely The main idea is to optimize two requirements The driver should hear the signal from the loudspeaker without any special effort but attenuation between the loudspeaker and the microphone should be as high as possible That is they must look in opposite directions in order to minimize the acoustic feedback Ensure cables are routed as far away as possible from the vehicle s electronic systems refer to WARNINGS In addition ensure cables are not subjected to undue mechanical stress for example under seats or against sharp edges The charging holder should always be connected to the external mobile antenna via a non radiating cable for example 4 coaxial cable Original 08 96 RAE RAK 1N After Sales CARKO0 Installation Guide Technical Documentation Car Radio Muting CRM The Communicator offers a feature that can mute the car radio automatically during a conversation This feature is convenient and provides for sa
232. e DSPU resides physically both in MCM2 DSP and RAMs and on CMT motherboard clock generator and Schottky diode AND gate Main interfaces of the DSPU MCU via ASIC mailbox ASIC audio codec data bus interface DBUS for tracing purposes digital audio interface DAI for type approval measurements Page 2 28 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Main features of the DSP block speech processing speech coding decoding RPE LTP LPC regular pulse excitation long term prediction linear predictive coding voice activity detection VAD for discontinuous transmis sion DTX comfort noise generation during silence acoustic echo cancellation channel coding and transmission block coding with ASIC convolutional coding interleaving ciphering with ASIC burst building and writing it to ASIC Reception reading A D conversion results from ASIC impulse response calculation matched filtering bit detection with Viterbi on ASIC deinterleaving of soft decisions convolutional decoding with Viterbi block decoding with ASIC Adjacent cell monitoring signal strength measurements neighbour timing measurements neighbour parameter reception control functions RF controls synthesizer control power ramp programming automatic gain control AGC automatic frequency control AFC O
233. e PROCU FP PCLKI PDA LCD Pixel Clock PROCU PCLK LPI PDA LCD Line Pulse PROCU LP PHFMICNI Negative Hands Free MIC input B2B PHFMICN PHFMICPI Positive Hands Free MIC input B2B PHFMICP COL 3 0 I Lines for keypad write B2B COL 3 0 Lines for keypad read and LCD controller data B2B UIF 3 0 Line for keypad read and LCD controller read write strobe B2B UIF4 UIF5I Line for keypad read and LCD controller data insruction register B2B UIF5 selection UIF6I LCD controller enable srobe B2B UIF6 MBUSI Serial bidirectional data and control between the handphone and B2B MBUS accesseries EXTMICI External audio input from accessories or handsfree microphone B2B EX Multiplexed with junction box connection indication 16 8k pull TMIC down in CMT EXTEARI External audio output to accessories or handsfree speaker B2B EX 100k pull down in CMT to turn on the junction box TEAR Note 1 LOMCON LCD module connector on PDA module Original 08 96 Page 6 23 RAE RAK 1N After Sales PDA Hardware Technical Documentation Note 2 MICCON Hands free microfone connector on PDA module Note 3 SC System Connector Table 15 External Signals and Connections Outputs Signal Name Signal description To 1 2 3 BACKLIGHTO Backlights on off control LCDMCON BACKLIGH TO KEYDO 2 0 Keymatrix drive lines LCMCON KEYD 2 0 KEYSO 1 0 Keymatrix sense lines LCMCON KEYS 1 0
234. e cover The communicator interface has many organiser and communication applications and features a QWERTY keyboard command buttons and large display for easy application use The communicator interface has no power on off button and is activated when the cover is opened and deactivated it is closed Original 08 96 Page 5 RAE RAK 1N After Sales Quick Guide Technical Documentation Communicator Applications The application buttons on the communicator interface keyboard are used to start the corresponding applications Tel Telephone is used for managing voice calls Fax Fax enables you to send any of your own documents as a fax Faxes received can be read or forwarded SMS Short Message Service enables you to send short messages Short messages received can be read forwarded or replied to Internet Internet applications include Internet and modem based applications Mail World Wide Web Telnet and Terminal VT100 compliant Contacts Contacts is used for managing contact information names numbers and addresses Notes Notes is used for text editing printing and document management You can also send documents as SMS fax or mail in the Notes application Calendar Calendar contains an appointment book and a to do list You can set alarms and attach memos to events System System contains desktop connectivity security and other system related applications Extras Extras application
235. e last IF frequency After external filtering the signal is amplified and fed to baseband circuitry The supply current can be switched OFF by an internal switch when the RX is OFF Table 9 CRFRT RX part Specifications Nominal Currentconsumpion 39 49 ma 400 MHz Local frequency range of 170 mixer 2nd IF range Voltage gain max gain of AGC amplifier Noise figure AGC gain control slope Mixer output 1dB compres sion point Max output level after last IF buffer Last IF filter The last IF is a ceramic filter which makes the part of the channel selectivity of the receiver Amendment 1 04 97 Page 3 17 RAE RAK 1N After Sales RF Technical Documentation Transmitter Table 10 RF Characteristics Transmitter la SEN PN TX frequency range 890 915 MHz 1710 1785 MHz Modulator Circuit TX part of CRFRT The modulator is a quadrature modulator contained in Tx section of CRFRT IC The I and Q inputs generated by RFI interface are DC coupled and fed via buffers to the modulator The local signal is divided by two to get accurate 90 degrees phase shifted signals to the I Q mixers After mixing the signals are combined and amplified with temperature compensated controlled gain amplifier TCGA Gain is controlled with power control signal TXC The output of the TCGA is amplified and the maximum output level is 10 dBm typically Table 11 CRFRT TX part specifications Parameter Typical
236. e lines EMIU Block description PROCU Memories Two types of memory is used DRAM and FLASH ROM The E3G CPU has a 22 bits 26 bit internal wide external address bus A 21 0 and an 16 bit data bus The address bits A 25 11 are used for chip select decoding The decoding is done internally on the E3G CPU PROCU memory map is illustrated in figures 1 and 2 and in Table 31 DRAM 70 ns is refreshed only when main battery is connected As long as the main battery has power and is connected all the DRAM data stays valid When the main battery is removed all the DRAM data is lost All application data is saved to nonvolatile FLASH memory under control of flash file system TFFS by M Systems Application status is not stored Page 6 26 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware DRAM area is composed of a single 1M x 16 bit chip The access time of 70 ns enables zero wait state page access and one wait state page fault FLASH memory is used for two purposes on this device Two 1M x 16 bit chips 75 ns are used for BIOS DOS GEOS and applications this memory is usually called XIP FLASH A 1M x 16 bit chip 120 ns is used to save user data This memory device is handled by FLASH file system From application point of view this memory is accessed like hard disk using INT13 functions 75 ns FLASH device needs one wait state and 120 ns device two wait states FLASH devices are equi
237. e ous ame ax 7 70 TORING IASTUCHONS ee cour ond copas ed reb SCR Rb el Ee parere 7 73 o e Eh e E E E Rise t a ied 7 73 Required Equipment oocccccccccocccn cc 7 73 Equipment Setup sa ed ok mg ex Robe ds Reg doe Rei ene 7 74 Tuning Procedure for GSM units 7 77 1 RSSI Reference Signal Level Storage 7 77 2 AFC Diagram Storage a we IER ee ae e NEEN apenas 7 77 3 1 Q Modulator Amplitude Balance and Phase Shift Tuning 7 78 4 Tuning of Transmitter Power Levels Lss 7 79 5 Charge Voltage Adjustment 7 80 6 Battery Voltage Adjustment nunnana nananana 7 80 Tuning Procedure for PON units i cesare Rr he RE Rmus 7 81 1 RSSI Reference Signal Level Storage 7 81 2 AFC Diagram Storage 7 81 3 1 Q Modulator Amplitude Balance and Phase Shift Tuning 7 82 4 Tuning of Transmitter Power Levels Lse 7 83 5 Charge Voltage Adjustment 7 84 6 Battery Voltage Adjustment 00 0c e ee eee eee 7 84 Amendment 1 04 97 Page 7 5 RAE RAK 1N After Sales Service Software Technical Documentation List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Page 7 6 Page No Dongle IMSS ON se ad are Paese d e mie eee es eee Re E MEET 7 8 Servicing setup xs derart de eekd ad d e pad 7 9 GE8 and GP1 FLASH Download connections
238. e programmed to the Flash memories of the target PDAs The name of the file must be given without extension The service software gets the extensions of the header file and the image file from the PDA initialization file The Software Update reads the image file sends it to the targets in blocks erases the needed blocks of the Flash programs them and locks them Page 7 68 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software After the image is programmed the updated memory area is checksummed and the result is compared to the one given in the header file The memory area between 3FFFCOOh 3FFFFFFh is not included in the area where the checksumming is done 3 6 3 Erase Flash This menu provides means to erase one or more blocks of the PDA Flash memory in parallel to all the targets User options are Start Physical Address default 3A00000h Range 3A00000h 3C00000h 3E00000h Start Relative Address default 000000h Range 000000h 1FFFFFh End Physical Address default 3A00000h Range 3A00000h 3C00000h 3E00000h End Relative Address default 1FFFFFh Range 000000h 1FFFFFh The output from the target shows the following whether the command was parsed successfully whether the Flash erasing has been successful 3 6 4 Lock Flash This menu provides means to lock one or more blocks of the PDA Flash memory in parallel to all targets User options are Start Physical Address defa
239. ec chip select CTRLU PHF power amplifier control CTRLU MICN MICP Differential handportable microphone signal SIM Conn EXTMIC External microphone signal B2B Conn PHFMICN Differential Personal Hands Free microphone signal B2B Conn PHFMICP Table 35 External Signals and Connections Outputs Transmitted audio in PCM format DSPU PCMCDO Audio codec control data CTRLU Junction box connected signal multiplexed with EXTMIC CTRLU EARN EARP Received audio to the earphone differential signal n onn EXTEAR Received audio to the external accessories B2B Conn PHFEARN Received audio to the Personal Hands Free speaker PHF Conn PHFEARP differential signal Page 2 32 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Block description The codec has three microphone inputs and two earphone outputs The microphone inputs from handportable and PHF microphones plus the external audio input can be therefore connected directly to the codec The handportable earphone output and external audio are also connected directly to the codec using the two earphone output channels The booster amplifier for PFH uses the same codec output channel as the external audio The codec has internal switches for selecting which input or output is used It also has microphone amplifier with programmable gain and earphone attenuator with programmable attenuation Input output selection and amplification attenuation s
240. ecked only once after each boot and then after the VBACK is considered to be OK Check G87 V85 Check that voltage over G87 is 2 8V or higher If not check that there is maximum 35mV drop over resistor R90 If the drop is higher RTC circuitry in VBACK line take too much current If the drop is OK check that VBACK line voltage drop in diode V85 is less than 150mV If not replace V85 Page 8 18 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 1 2 1 2 1 1 3 PLLDIV24 If the Vsys and the current consumption is OK check whether the PLL circuitry and the clock generation inside the CPU D130 is working properly The output of pin 110 of the CPU should be a square wave and the frequency in A5 stepping of the CPU 307kHz in the A3 stepping of the CPU the frequency should be 614kHz The shape and the frequency can be checked with a scope the frequency can be measured more accurately with a frequency counter If the frequency is OK then proceed to 1 3 otherwise check the PLL circuitry 1 2 1 Check PLL Circuitry The crystal and circuitry around it can be checked by connecting oscilloscope XTALI signal On that point a 32 6 32 8 kHz signal with 2 5 3 5V peak to peak AC amplitude should be found The signal waveform can vary from almost square wave to sine wave If this signal can not be detected and VCCRTC level is 2 3V then check crystal and circuitry R140 R141 R146 R147 C
241. eived messages folder select a message and press Open ES Message 2 ang Forward We are at Walley s EL MS The band is great Reply Join us if you have time Eer rom Ex ja Cv Peter l 6 10 s 44123654987 Delete D gg P ng SIS Eb Close Figure 13 SMS Message received Original 08 96 Page 21 RAE RAK 1N After Sales Quick Guide Technical Documentation Internet Y C2 Co GED Ged Qe E Gen Gud Before you can connect to the Internet you must open an account with an Internet access provider see Internet Settings In the User Guide The Internet applications are Mail An electronic text mail application which lets you send and receive text messages all over the world using the Internet network World Wide Web WWW A hypertext based system for finding and accessing resources on the Internet network Telnet Allows connection to computers which provide terminal services through the Internet network Terminal Allows connection to computers like mainframe computers which provide direct dial in terminal services Both Telnet and Terminal applications emulate the VT100 terminal Select Internet 2 3 Mail a Internet O WWW amp Telnet ED 15 20 EI Terminal 16 10 96 UOQU Figure 14 Internet main View The Internet applications are started by selecting an application in the Internet main vie
242. elect RSSI Calibration and press Enter Adjust signal generator level to 45 dBm cable attenuation Press Enter DAC values should be in first row 0 dB 450 700 and last row 57 dB 750 1000 Press Esc key Store the value to the EEPROM with Y key Note Always take the target tuning value from the actual monitor screen as the value can vary according to which CMT software version is used 2 AFC Diagram Storage This tuning is used to calibrate the automatic frequency control range AFC tuning Set RF generator frequency 1842 8677 MHz at level 45 dBm RF cable attenuation Check that Cont mode channel is 700 Select adjustments menu option AFC Diagram and press Enter The measurement result should be e Low between 30 kHz and 10 kHz typically 20 kHz e Middle 3 0 kHz e High between 10 kHz and 30 kHz typically 20 kHz Press Esc key and store with Y key Amendment 1 04 97 Page 7 81 RAE RAK 1N After Sales Service Software Technical Documentation 3 1 Q Modulator Amplitude Balance and Phase Shift Tuning The purpose of this tuning operation is to adjust the I Q modulator d c offsets and the UO modulator amplitude balance and phase shift UO modulator d c offsets amplitude balance and phase shift tuning Connect spectrum analyzer with attenuator if needed to phone antenna connector Select adjustment menu option TX UO T
243. en the device is not used the transmit line must be in high impedance state Only one device is allowed to be enabled at a time RS buffer have two control signals RSENX to enable transmit line and RSSHDX to enable charge pump IrDA tranceiver is enabled with IRSHD signal External RS232 signals meet EIA TIA 232 specification PROCU EMIU EMI Unit is passive unit to reduce EMI noise on the lines that are located out of the shielding UO usage on E3G CPU The E3G CPU have configurable I O pins that are used like described on Table 21 Page 6 34 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware Table 20 I O usage on E3G CPU Signal name E3G CPU pin Polarity PWRGOOD RESET H Power good 5VPDX PMI2 P45 L Shut down TESTMODEX Input DTRO P02 L Test mode IRSHD RI1 P13 H Shut down RSSHDX DSRO POO L Shut down RSENX CTSO0 P04 L Enabled XPWRON PMI3 P44 H pulse gt CMT ON HO no LE ee LE In L In H H H L H H H H L L L In In FLASHPD1X SUSPEND L Shut down LCDVEEON LCDVEEON H Vee ON VL1 PMI H CMT ON In UO map All chipselects are generated in the E3G Table 21 UO Map Address Mee PICO 0020 0021 Standard PC compatible PICO F022h Edge Level control E3G Spe cific Port 92 0092h Standard PC compatible PIC1 00AO0h 00A1h Standard PC compatible cific COM2 02F8h 02FF Standard
244. enced installer and only genuine Nokia parts be used An end user should never attempt to install this car kit without professional assistance as the installation requires special tools and knowledge Please refer to the NOKIA 9000 communicator s User s Manual and Accessory Guide for instructions on the telephone s operation care and maintenance including important safety information Note Read the warnings below before beginning the installation procedure WARNINGS ENSURE THAT THE VEHICLE S BATTERY IS DISCONNECTED BEFORE YOU START THE INSTALLATION PROCEDURE AND THAT IT REMAINS DISCONNECTED DURING THE PROCEDURE DO NOT SMOKE OR USE OPEN FLAMES WHEN WORKING NEAR THE VEHICLE S FUEL SYSTEM ENSURE THAT ELECTRICAL CABLES HYDRAULIC LINES AND FUEL LINES ARE NOT DAMAGED DURING INSTALLATION ENSURE THAT NORMAL CONTROL AND OPERATION OF THE VEHICLE IS NOT IMPAIRED BY THE INSTALLATION PARTICULARLY THE BRAKES AND STEERING ALTHOUGH ELECTRONIC SPEED CONTROL ABS ANTI LOCK BRAKE AND FUEL INJECTION SYSTEMS ARE RELATIVELY IMMUNE TO MALFUNCTION CAUSED BY NEARBY RADIO TRANSMISSIONS SHOULD YOU EXPERIENCE FALSE OPERATION OF THESE SYSTEMS OR ARE IN ANY DOUBT WHATSOEVER AS TO THEIR FUNCTIONALITY PLEASE CONSULT THE VEHICLE S DEALER THE CAR KIT IS SUITABLE FOR USE ONLY IN VEHICLES WITH A 11 32 V NEGATIVE GROUNDING USE ON OTHER SUPPLY VOLTAGES OR ALTERNATIVE POLARITY WILL DAMAGE THE EQUIPMENT THE PHONE SHOULD NOT BE LEFT SWITCHED ON FOR EXT
245. eneration A CHIP NOTES SELECT PPP ni FLASH 1 ga X X X X X JUCS XIP Double map FLASH 1 ping X X X X 1X X X X X CS0 XIP FLASH 2 141 1 1 X X X X IX X X X X X CS1 RFD FLASH 1 DRAM controller enables shadowing in the area of 640KB 1MB in 16 Kbyte granularity Each block of memory can be configured as being disabled read only write only or read write Unused memory in the area of 640KB 1MB can be rolled over in 64 Kbyte granularity Roll over base is selectable in 512 Kbyte granularity FLASH programming PDA module FLASH memories can be programmed in two ways During the manufacturing JTAG interface of the E3G CPU is used to download FLASH image to FLASH devices For aftersales and R amp D purposes BIOS is equipped with FLASH download capability via RS232 JTAG method is needed at aftersales as a backup During the manufacturing it is not possible to use any download method that needs CPU involvement because there is no any program code for execution on the device JTAG interface was selected for this purpose because it exists on the E3G CPU and it is a standard In principle JTAG interface is able to set CPU signals address data etc to requested state By changing signal values in reasonable manner FLASH writing is possible Special hardware is needed for JTAG FLASH download during manufacturing as well as for aftersales purposes JTAG FLASH download system is integrated to PTS and
246. ent pulses which are delivered on load demand and skipped when in regulation pulse skipping regulation Benefits are very low supply current at light loads because of no oscillator and high energy conversion efficiency Because pulses come at unspecified time intervals switching noise is in broad frequency range However maximum inductor current is set to lowest practical value and output capacitor ESR is selected for low value to reduce EMI Output voltage is adjusted by LCDPWM signal from PROCU This pulse width modulated signal is first converted to analog dc voltage by RC filter This signal is fed to regulator feedback pin through a resistor which determines the scale at which the LCD display bias voltage can be adjusted Temperature compensation for bias voltage is made by resistor divider connected to regulator feedback pin Bias voltage is controlled by two NTC resistors so that optimum LCD contrast bias voltage is followed accurately by the regulator in temperature range between 20 C and 65 C Because feedback pin comparator voltage is 1 5V and regulator output voltage is over 20V high accuracy feedback resistors are needed for fairly accurate output voltage Shutdown is controlled by PROCU Because this is boost regulator there is current path from input to output which must be cut separately in shutdown Control switch is placed between regulator output and load Page 6 42 Original 08 96 After Sales RAE RAK 1N Technic
247. ep R914 R915 100R Cep R916 R917 e o ei El JN el F FT ee er p p p p z C905 C906 C997 C908 GND GND GND GND GND d JL JL L BE 1000 op 1080 y 1000 b GH R922 coor D gt T DocoLoo 100R R923 coir m Com coz 1 gt Tox gt coi20 Wie r C gt co30 100R R926 R927 pIsPoNIL r gt orsrono 100R Cep R928 R929 EXTEARIL gt gt extearo 100R 100R R930 R931 ExTMIcIL gt TH gt extmico 100R 100R R932 R933 E t Doro 100R ESR R936 R937 LP 33R 33R R938 R939 LPO Meus 4 ED muso 100R 100R R940 R941 PcLkIL gt Leon 100R eer R942 R943 PHFMIcNIL gt gt PurHICNO 100R 100R R944 R945 PHFMIcPIL gt d gt PHFMICPO 100R 100R R948 uo Tus Se E gt urroo urb Cum ure Tu ws Lure uai e C gt urr30 E M d dL ale B dL d ai d dL d dl d d d oe DUT eger SI eap San ml SR SR e sa e eel el el Sal el el Sg o lem 9 om 900 cup 00 Lon 9 eno 80 SND 09 onp 9 oND 9 Lem lem 2 Lem cup 2 Lon Te Lon 80 cup 89 on 900 Lem UIF4 Cc T m Ra Du F40 MIS li 1008 R954 Suen ue E gt urrso 100R R955 R956 BACKLIGHTIL gt t gt BackLIGHTO 100R 100R el el el P Lem W I P eno Original 05 97 Page 10 7 RAE 1N Figure 6 Keyboard matrix
248. er Buzzer mic and earphone are wired directly to flex connector without any extra components Microphone has one capasitor that works as a HF filter Connectors There is a custom design SIM Connector and flex connector shaped area in the flex Mecanical components There is MIC Boot and EMC tape for earpiece SIM interface The SIM interface is the electrical interface between the smart card used in the GSM and PCN applications and the MCU via the ASIC Four signals are used between the SIM card and the ASIC SIMDATA SIMCLK SIMRESET VSIM Serial data is transferred between the card and the ASIC the clock frequency is 3 25 MHz When there is no data transfer between the SIM card and the CMT the clock can be reduced to 1 625 MHz Some cards allow to stop the clock in that mode The ASIC also generates the reset for the card and the supply voltage VSIM Original 08 96 Page 5 5 RAE RAK 1N After Sales SIM Flex Technical Documentation This page intentionally left blank Page 5 6 Original 08 96 After Sales Technical Documentation RAE RAK 1N Series Chapter 6 PDA Hardware Module GP1 Original 08 96 RAE RAK 1N After Sales PDA Hardware Technical Documentation CONTENTS PDA unit Page No ze ee n EE 6 5 Technical SUMINANY EE 6 5 Modes of Op ration uoa aude meon mbar Por eerte he ir a 6 6 DC Characteristics EE 6 7 AC Characteristics occiso oxy oc EE AE deg 6 13 Eller 6 14 Connectors Inside Transceiver U
249. er Hitachi H8 communicates with the DSP memories and Logic control IC D2CA with an 8 bit data bus The purpose of the RF block is to receive and demodulate the radio frequency signal from the base station and to transmit a modulated RF signal to the base station Page 1 16 Original 08 96 After Sales RAE RAK 1N Technical Documentation Overview Handset Transceiver HSU 1 RER RAK 1N PCN RAE 1N csm Battery BLK 4S JOJ99UUO9 J9YLg JO199UUO9 l9S1eg HF Speaker HFS 6 Cradle System connector connector System socket Te zez connector Test battery BTD 1C J012euuoo l9Yeg DC connector Desktop Charger D connector Spare battery BLK 4S Charger connector J0128uuoo janeg Cigarette Lighter Charge Fast Travel Charger Fast Travel Charger LCH 2 ACP 3 Power Power Power connector connector Cigarette AC Line Car Lighter Battery Figure 5 Interconnection Diagram Original 08 96 Page 1 17 RAE RAK 1N Overview Mechanical Characteristics Table 9 Mechanical Characteristics Transceiver with standard battery pack Dimensions WxLxH mm 65 176 39 Volume cm Weight g After Sales Technical Documentation If antenna is in cluded length is 189 Transceiver w o battery pack same Radio module inc chassis shield 57 170 16
250. er the commands were parsed successfully Calculated 32 bit checksum 3 7 JTAG Flashing This menu provides means to program the PDA Flash memory from a file on the disk using the JTAG interface of the target The output from the target shows the following whether the command was parsed successfully whether the commands in the configuration file were executed successfully Page 7 70 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 50001217 Figure 4 CMT Upgrading Software Setup FPS 3 PROGRAMMER ACS X POWER SUPPLY FPS 3 CABLE FPS 3 CABLE FPS 3 CABLE SERVICE SOFTWARE DISK X 2 BTD 1 TEST BATTERY PAS 1 MODIFIED POWER ADAPTER pa TW Ge we B Ie c Amendment 1 04 97 Page 7 71 After Sales RAE RAK 1N Technical Documentation Service Software Gg 218 Figure 5 PDA Upgrading Software Setup PAS 1 1 1 DLR 2 SERVICE SOFTWARE 3 DISK X 2 3 Amendment 1 04 97 Page 7 72 After Sales RAE RAK 1N Technical Documentation Service Software Tuning Instructions General The service software program turns the phone into Locals mode which controls the phone via the M2BUS interface Tuning is based on the software communicating with the D A and A D converters of the phone In some instances the phone processor will also calculate the required correction parameter The tuning values of the phone reside on the EEPROM The program enable
251. eramic cap 1 0n 5 96 50 V 0402 C737 2320546 Ceramic cap 27p 5 96 50 V 0402 C738 2320536 Ceramic cap 10p 5 96 50 V 0402 C739 2320538 Ceramic cap 12p 5 96 50 V 0402 C740 2320584 Ceramic cap 1 0n 5 96 50 V 0402 C741 2320556 Ceramic cap 68p 5 96 50 V 0402 C742 2320536 Ceramic cap 10p 5 96 50 V 0402 C743 2320546 Ceramic cap 27p 5 96 50 V 0402 C744 2320538 Ceramic cap 12p 5 96 50 V 0402 C755 2320556 Ceramic cap 68p 5 96 50 V 0402 C756 2320578 Ceramic cap 560p 5 96 50 V 0402 C757 2320580 Ceramic cap 680p 5 96 50 V 0402 C758 2320556 Ceramic cap 68p 5 96 50 V 0402 C759 2320744 Ceramic cap 1 0n 10 96 50 V 0402 Amendment 1 04 97 Page 13 After Sales RAE RAK 1N Parts Lists Technical Documentation C760 2320546 Ceramic cap 27p 5 96 50 V 0402 C761 2320522 Ceramic cap 2 7p 0 25 96 50 V 0402 C762 2320602 Ceramic cap 4 7p 0 25 96 50 V 0402 C763 2610011 Tantalum cap 330u 10 96 10 V 6 9x6x3 5 C764 2320361 Ceramic cap 18p 2 96 25 V 0603 C768 2320584 Ceramic cap 1 0n 5 96 50 V 0402 C770 2320534 Ceramic cap 8 2p 0 25 50 V 0402 C780 2320536 Ceramic cap 10p 5 96 50 V 0402 C781 2320536 Ceramic cap 10p 5 96 50 V 0402 C782 2320546 Ceramic cap 27p 5 96 50 V 0402 C783 2320546 Ceramic cap 27p 5 96 50 V 0402 C784 2320756 Ceramic cap 3 3n 10 96 50 V 0402 C790 2610011 Tantalum cap 330 u 10 96 10 V 6 9x6x3 5 C791 2610011 Tantalum cap 330u 10 96 10 V 6 9x6x3 5 C792 2610011 Tantalum cap 330u 10 96 10 V 6 9x6x3 5 C793 2
252. es Pulse Width Modulator Unit 8 x 10 keyboard scan unit System power management unit Expanded Memory Specification EMS Unit 32 KHz Oscillator with Phase Locked Loop circuits to generate all needed frequencies JTAG IEEE 1149 1 Boundary scan testing capability E3G CPU is described in details in E3G EXTERNAL ARCHITECTURE SPECIFICATION Intel Corporation 5000 West Chandler Blvd Chandler AZ 85226 1M 16bit FLASH memory 75 ns Intel 28F016SV 065 75 ns maximum read access time SMART voltage device with 5 Volt programming Used to store all program code 1 Million Erase Cycles Per Block Deep power down mode Original 08 96 Page 6 37 RAE RAK 1N After Sales PDA Hardware Technical Documentation 1M 16bit FLASH memory 120 ns Intel 28F016SV 070 120 ns maximum read access time SMART voltage device with 5 Volt programming Used to store application data under FLASH File System 1 Million Erase Cycles Per Block Deep power down mode 1M 16bit DRAM memory 70 ns maximum access time Fast Page Mode CAS before RAS refresh CAS before RAS self refresh Refresh block size 1K QWERTY keypad Hard top rubber keymat with carbon contacts 56 QWERTY keys and 9 function keys Key ON resistance 1kohm VT100 emulation compatibility keys included Page 6 38 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware PDAPWRU Technical Desc
253. es The Swivel or the Flat Mounting Kit can be used to mount the Holder to the vehicle The Swivel is for adjustable mounting angles for each end of the Holder and the Flat Mounting Kit is for mounting in a flat fixed position To install the Holder using the Flat Mounting Kit 1 Attach the Snap Mounting Plate to convenient location using the four black screws provided 2 Attach the Fixed Mounting Plate to the Holder at whichever end is suitable using the three silver screws provided 3 Attach the Adapter Plate to the Fixed Mounting Plate using one of the large mushroom head screws 4 Slide the Adapter Plate on to the Snap Mounting Plate Fixed Mounting Plate Plate Figure 2 Flat Mounted Fixing Kit To install the Holder using the Swivel 1 Attach one of the Fixed Mounting Plates to a convenient location inside the vehicle using the three black screws Attach the other Fixed Mounting Plate to the Holder at whichever end is suitable using the three silver screws 2 Fasten a Swivel Body to the Fixed Mounting Plate on the Holder using one of the large mushroom head screws Before tightening the screw ensure that the Swivel Body is oriented to suit the mounting location Repeat this procedure for the Swivel Body which is to be attached to the Fixed Mounting Plate on the vehicle 3 Position the Holder in the desired orientation so that the teeth of the Swivel bodies interlock Fasten the bodies together using t
254. es the check sum sends acknowledge via RBUSTxD line and sends the data to flash When all the data is loaded the CMT makes reset and tells the flash loading box if the loading was succeeded or not Only PSL ASIC SCL and MCU must be active during the loading Page 2 24 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband CTRLU PWRU MCU controls the watchdog timer in PSL It sends a positive pulse at approximately 2 Hz to XPWROFF pin of the PSL to keep the power on If MCU fails to deliver this pulse the PSL will remove power from the system MCU also controls the charger on off switching in the PWRU block When power off is requested or MCU leaves PSL watchdog without reset after the watchdog time has elapsed the PSL cuts off the supply voltages from the phone CTRLU ASIC MCU and ASIC have a common 8 bit data bus and a 9 bit address bus Bits A 4 0 are used for normal addressing ASIC controls the main clock main reset and interrupts to MCU The 26 MHz MCUCLK is divided by two in SCL and the resulting 13 MHz clock is supplied to the MCU RESETX resets everything in MCU except the contents of the RAM IRQX is a general purpose interrupt request line from ASIC After IRQX request the interrupt register of the ASIC is read to find out the reason for interrupt NMI is used only to wake up MCU from software standby mode CTRLU DSPU MCU and DSP communicate through ASIC ASIC has an MCU mailb
255. et Test EXECUTED Power off Test Fi Help F8 Bus Test ESC Exit The test result will be shown to the user after each menu selection If no response was received in the defined time an error message is shown and No Response text will be shown in the menu Note power off test if passed turns power off and power should be reconnected by using the phones keypad after the successful test Power off test works MCU internal SW Version 2 17 or higher After the power has been connected to phone the normal start up routines are made and the self test results are shown in the MCU self tests menu i e all other than power up self tests are in NOT EXECUTED state after the power up routines Test results will be one of the next No Response OK NOT EXECUTED FAILED Note that power off test have no values because if test has been passed power has been turned off If power off test fails a special error message window is shown If no response is received to power off test message in a few seconds the user is requested to turn the power on and press the return key Amendment 1 04 97 Page 7 37 RAE RAK 1N After Sales Service Software Technical Documentation 3 8 Set MCU Start up Self tests This menu is used for changing the state of the EEPROM selectable tests When selection is On the test will be run every time when automatic start up self tests are activated e g in power up C Set MCU Start
256. et by using an accurate 6 0 V supply Calibration of the charge voltage Apply 6 V to VCHAR line Select adjustments menu option Charge Voltage Adjustment Program reads 6 V A D reading fed to phone VCHAR line Store charge voltage value to phone EEPROM by pressing lt Y gt 6 Battery Voltage Adjustment A reference value for battery are calibrated by using an accurate 6 V supply Calibration of the A D converter channels Apply 6 V to dummy battery Select adjustments menu option Battery Voltage Adjustment Program reads 6 V A D reading fed to phone VBAT line Store correct value to phone EEPROM by pressing Y Page 7 84 Amendment 1 04 97 After Sales Technical Documentation RAE RAK 1N Series Chapter 8 Faultfinding Disassembly Original 05 97 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation CONTENTS Faultfinding Page No General eR Tr dies Een ts bd 8 3 Disassembly PIODOSUIB ue ege pu oie eub e er beds 8 4 LCD UI Module Disassembly see fig 1 8 4 System Module Disassembly see fig 2 00 8 6 A aucun A RE See cu sdebeen ates Bm le dad enek as 8 8 ltr OdUCHON M m 8 8 Required Servicing Equipment 8 8 Block Diagrami EE 8 8 PDA COMPONEN xus cud n sue ud ume dE dE Rx Redes bud ex nba ed 8 9 PDA Troubleshooting Weeer A dE NEEN RR Ax RR ERE 8 10 1 Troubleshooting Diagram of the Power On Malfunction 8
257. et by using an accurate 6 0 V supply Calibration of the charge voltage Apply 6 V to modular power connector SCF 6 Select adjustments menu option Charge Voltage Adjustment Program reads 6 V A D reading fed to phone VCHAR line Store charge voltage value to phone EEPROM by pressing lt Y gt 6 Battery Voltage Adjustment A reference value for battery are calibrated by using an accurate 6 V supply Calibration of the A D converter channels Apply 6 V to carkit dummy test battery BTD 1C Select adjustments menu option Battery Voltage Adjustment Program reads 6 V A D reading fed to phone VBATT line Store correct value to phone EEPROM by pressing Y Page 7 80 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Tuning Procedure for PCN units Carry out this procedure in the order as shown 1 RSSI Reference Signal Level Storage Reference value for the received signal strength meter are program tuned RSSI reference signal level programming Start the service software and go to Main menu Select Phone mode and select local mode with Enter key Select Testing and Adjustments menu and press Enters Select Adjustments menu and press lt Enter gt Connect RF generator to antenna connector at 1842 8677 MHz Channel 700 Adjust signal generator level to 75 dBm cable attenuation see note below S
258. etting can be done using codec registers The registers are controlled by the MCU Handportable microphone MICN MICP and PHF microphone PHFMICN PHFMICP are connected directly to the codec s differential inputs There is a bias switch in the AUDIO block which connects the DC bias voltage for both microphones electret type when a call is activated The external microphone signal EXTMIC is connected single ended to the third microphone input channel There is 21 dB attenuation in the external microphone line before the codec to prevent clipping The handportable s earphone EARN EARP is connected directly to one of the two differential output channels The output can drive directly a 32 Q load The external audio signal EXTEAR is connected single ended to the other output channel This output is also connected to the input of the Personal Hands Free booster amplifier The booster is disabled by MCU when an external audio accessory is used In PHF mode the booster is enabled and its differential output is fed to the PHF speaker PHFEARN PHFEARP The load impedance of the PHF speaker is 8 Q Inside the codec the currently selected microphone signal is routed to the microphone amplifier After that it is fed to the bandpass filter and then to the A D converter After the conversion the digital speech is sent to the DSP in PCM format Digital downlink signal from the DSP is fed to the D A converted After the converter there is low
259. evious menu Page 7 42 Amendment 1 04 97 After Sales Technical Documentation 6 SW and HW Versions RAE RAK 1N Service Software This menu shows the current software and hardware versions L SW and HW Versions J MCU Internal SW Version U 2 16 18 09 95 D8 c NMP MCU External SW Version U 2 59 11 03 96 GES c NMP DSP Internal SW Version ROM MD DSP External SW Version G 17CR ASIC Version G 3 HJ Version lt lt rust 0001 Manufacture Month 0196 ESC Exit GSM Version sions MCU Internal SW Version U 2 17 12 02 96 D8 lt c NMP MCU External SW Version U 2 51 36 12 96 DSP Internal SW Version ROM lt MD gt DSP External SW Version P 26CR ASIC Uersion G 3 HW Uersion 6061 Manufacture Month gana PCN version Amendment 1 04 97 GE lt c NMP Page 7 43 RAE RAK 1N After Sales Service Software Technical Documentation The next tuning window will be activated automatically after value selection The power is presented in GSM values 5 15 The base GSM power 5 is selected automatically when the function is started The test value is always the same when the function is started for the first time The test value is not saved to the EEPROM and can be changed during tuning as other power coefficients and the program remembers its value when tuning function is activated later again If a SW version is not received spaces are shown in that vers
260. f the pin 124 in the CPU D130 Output should be a square wave at a given frequency If the signal is not toggling go to 4 2 2 1 If the CPU controls the output ok then proceed to 4 2 3 CPU Fault If the CPU does not control the SPKR output even though the buzzer test is reported to be successful by the service software then the CPU is likely to be faulty BUZZEROUT OK If the BUZZEROUT is OK then proceed to 4 2 4 otherwise the fault is in the buzzer driver circuitry proceed to 4 2 3 1 Check Driver Circuitry If the SPKR output stops before BUZZEROUT check the circuitry R142 R148 V132 V135 C138 SIM Flex OK Check if the SIM flex and all the connectors are OK If the connection from BUZZEROUT to the buzzer is OK then proceed to the 4 2 5 otherwise go to 4 2 4 1 SIM Flex Fault If the connection between the BUZZEROUT and the buzzer is broken check the SIM flex along with the board to board connectors CMT module etc Buzzer Fault If the CPU driven square wave is coming to the buzzer but the buzzer does not beep then change the buzzer Page 8 30 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 5 Troubleshooting Diagram of the PMI Check Once this test is activated the PDA waits for a power management interrupt to occur The two possible sources for this interrupt are the lid switch and the power switch of the CMT module C Sm gt 1 Start the PMI te
261. f the problem disappears when connecting a working LCD module to the PDA If the problem can be isolated to the PDA module then proceed to 3 1 2 LCDVCC OK Check if the LCDVCC is within it s legal limits 4 5V 4 8V If not then proceed to 3 1 2 1 If yes then go to 3 1 3 LCDVCCON active If the LOCDVCCON is active high but the LCDVCC level is out of the limits then proceed to 3 1 3 2 If the CPU does not control the LCDVCCON active then go to 3 1 2 2 CPU Fault If the CPU does not control either the LCDVCCON or and the LCDVEEON and the signals are not forced low in the PDA power unit then the CPU is defective LCDVEE OK Check if the LCDVEE is within it s legal limits 19V 23V If not then proceed to 3 1 3 1 If yes then go to 3 1 4 LCDVEEON Active If the LCDVEEON is active high but the LCDVEE level is out of the limits then proceed to 3 1 3 2 If the CPU does not control the LCDVCCON active then go to 3 1 2 2 Check PDA Power Unit If the CPU controls the LCDVCCON active but the LCDVCC is out of the limits check the PDA power unit Check components V80 V86 R81 R72 and C91 In a case that the CPU controls the LCDVEEON active but the LCDVEE is out of the limits check the PDA power unit If voltage at positive terminal of C89 is not between 20V and 24V go to PDA power unit complete check to 3 1 1 Check V84 R75 R76 and R96 There must be 4 1V voltage difference over V84 If OK check that N83 pin 4 is in
262. fault values Phone mode must be in the Local mode when this menu is selected 4 7 Set Factory Values The selection sets all except IMEI factory values including Ul Even though no memory patch message is sent to mobile the user is asked to confirm the functions with lt Y gt key Note RF Tuning values are lost when this function is performed 5 Power up Selftests This selection generates two windows Il d Eu ues ROM BUS Test ROM DATA Test ASIC BUS Test NOT EXECUTED ASIC Timer amp IRQX Test NOT EXECUTED ASIC Timer amp NMI Test NOT EXECUTED Audio Codec Test NOT EXECUTED DSP Code Download EEPROM Checksum Test SIM LOCK Checksum Test Fi Help F8 Bus Test ESC Exit When the window is activated all test result fields have value No response When responses are received the values will be updated When Esc key is used the previous menu is displayed Below is the list of DSP processor test faults Only one fault value is indicated in the DSP processor selftest message MCU test results are indicated one by one on the separate lines RAM BUS Fault ASIC BUS Fault RFI BUS Fault Download Error MCU test results will be one of the following No Response OK NOT EXECUTED FAILED When F8 key is pressed any failed test results are displayed If no MCU BUS tests have failed the display will say so Esc key returns to the pr
263. fer hands free operation The Car Radio Muting feature is based on a grounded line so it means that in standby the yellow wire XCRM is not grounded and car radio works normally but during a call line is grounded and car radio is muted The maximum load that this line can handle is 250 mA Note that an auxiliary relay or muting unit must be used when the car radio doesn t have a mute feature available When a relay is used this should be connected in series with the car radio main supply A 200 mA fuse should be used to protect the XCRM output in event of a short circuit Some radios have separate supplies for amplifiers and motors and another for memory backup purposes Very often these radios also have a secret code system which activates itself if a break in the memory supply is detected Be careful when installing the relay not to break the memory supply usually marked ACC or MEM but to install the relay in the main supply feed Bosch P N 0 332 204 150 GND CAR 87A 12 V 30 A SPDT za bcd EIN 30 12 V d c Supply for 87 F car radio To XCRM line 85 TA 86 12V d c yero wire Fuse 200 mA not supplied Figure 4 Radio Muting Circuit Another possibility is to use a special muting unit which mutes the radio by connecting load resistors to the speaker lines of the car radio Four loudspeakers can be muted and the maximum permitted power is 20 watts per
264. ff Off 4 SS Screen Indicator 1 2 Phase 1 When lt Esc gt key is used in this menu the program will ask if the values are to be saved to the EEPROM or not If lt Y gt key is used values are saved to the EEPROM before the ME Memory Functions menu is displayed If lt N gt key is used the ME Memory Functions menu is displayed without the save function being used If lt Esc gt key is used the Product Profile Setting menu is shown and the values can be changed Page 7 40 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 4 3 Write HW Version When HW version is selected the current version is read from the phone and displayed 4 4 IMEI Edit When this selection is made the old IMEI is requested from EEPROM If IMEI is not received within 2 seconds approx an error message is displayed Press any key to clear it and return to the previous menu If IMEI or EEPROM check sums have the wrong values an error message is also displayed After errors are acknowledged the editing window is displayed without data allowing at least 40 ASCII characters to be edited in the window After IMEI data the password must be edited IMEI and password data are written to the EEPROM when editing is ended The writing must be accepted by the user as with other EEPROM writing functions If no response message from MCU to IMEI writing function is received within a few seconds an error message is sho
265. for COM port selection RF Controls menu e All selections Call Simulation e All selections which are not the same as in the RF Controls menu Tuning parameters PC default values no effect on EEPROM values e TX power coefficients e Power connection diagram Run MCU Self tests e All selections The following selections are not saved to the setup file Values which are asked from MS e AFC value Main Menu e Phone Mode Start value Normal PC Setup menu e Default name for setup file Start value RAE 1 CON Internal audio loop Page 7 16 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software e input Start value Int e output Start value Int e loop Start value Off External audio loop e interface Start value HS Logic controls e LCD Test Display Start value 1 Load New Setup generates the same kind of message as the save function and asks for a setup file name When the name is keyed in and entered Enters the file is loaded and all previously selections and parameters are replaced with the values taken from the file This has same effect as command line parameter Both save file and load file functions have default names which are generally the previously used name For instance if setup was saved to file CONF CON and the load file function is activated the default value becomes CONF CON Press the ENTER key
266. g a call The Holder is attached by screwing the Mounting Plate provided to the vehicle and sliding the Holder into place After Sales Technical Documentation RAE RAK 1N Series RS 232 Adapter Cable DLR 1 optional The Adapter Cable is an optional connection between your PC and the Communicator External Mobile Antenna not supplied The Hands Free Car Kit is designed to operate with a high quality external antenna However due to many different types of antennas being available an antenna is NOT included as part of this kit Please consult the dealer to find out which is the most suitable antena type for your installation Installation There are some important aspects that require special attention in positioning Hands Free Car Kit accessories The positioning of the Phone Holder is the most important factor when trying to achieve the most comfortable position for the user The location of the Holder should be selected so that the visibility of the Communicator s display is good under all lighting conditions but not so that the driver s attention is easily distracted The Holder should be located so that the driver can easily reach the keypad Under no circumstances should the Holder prevent the driver from controlling or operating the vehicle in any way or observing traffic The Junction Box can be installed in a hidden location since there is no need to disconnect cables during normal operation Ensure the location
267. g and Adjustment 4 CMT ME Memory Functions 5 CMT Power up Self tests 6 CMT SW and HW Versions 7 Phone Mode Local Normal Local 8 PDA Functions 9 Faultlog Q Quit Page 7 10 After Sales Technical Documentation PC Setup 1 Load New Setup 2 Save Current Setup CMT Testing and Adjustments 1 RF Controls 2 Adjustments 3 Call Simulation 4 Internal Audio Loop 5 External Audio Loop 6 Logic Controls 7 Run MCU Selftests 8 Set MCU Start Up Self tests CMT ME Memory Functions 1 User Settings and Values 2 Product Profile Settings 3 Write HW Version 4 IMEI Edit 5 IMEI Transfer 6 Set UI Factory Values 7 Set Factory Values CMT Power up Selftests MCU Internal Test MCU RAM BUS Test MCU IMEI Test MCU ROM DATA Test MCU ASIC BUS Test MCU ASIC Timer amp IRQX Test MCU ASIC Timer amp NMI Test MCU Audio Codec Test MCU DSP Code Download MCU EEPROM Checksum Test OK MCU SIM LOCK ChecksumTests OK CMT SW and HW Versions MCU Internal SW Version 2 16 18 09 95 D8 c NMP MCU External SW Version 2 61 18 03 96 GE8 c NMP DSP Internal SW Version ROM7 MD DSP External SW Version G7 21CR ASIC Version HW Version Manufacture month PDA Functions 1 Initialisation 2 Test Peripherals 3 Flash Utilities 4 DRAM Utilities 5 I O Space Functions 6 Product information Amendment 1 04 97 After Sales Technical Documentation RAE RAK 1N Service Software CMT Menu Structure
268. g reflow The bottom connector system connector carries two optional through hole pins which might prove useful i e soldered by hand if so required All PDA module components are located to one side of the PCB the other side of the PCB is used for QWERTY keypad wiring matrix The connection to the CMT module is made using a board to board connector and the connections from CMT to the phone User Interface module UIF are made through the PDA module The connections to the PDALCD module and phone user interface module excluding audio SIM card holder buzzer and call LED UIF are made using a flex cable The CMT module controls the battery charging via system connector on PDA Test pads located to the PCB under the battery pack are for CMT flash loading and fieldtest purposes Original 08 96 Page6 5 RAE RAK 1N After Sales Testpads PDA Hardware Technical Documentation CMT Module A CMN Module AN oe i d Audie PROCU imx16 1M x 16 1M x 16 1M x 16 DRAM FLASH FLASH FLASH i Control PDAPWRU Nod o O MA9 0 SA20 1 EE d EE HE PDALCD IrDA Lomas sio CPU Softkeys JTAG E3G sio D9 0 S7 0 C lt A 1 i i i 1 SIRU DRE i y
269. ge 0 1 25 5s The input parameters are given as plain figures without units Time referred input values are given as hundreds of milliseconds PMI source is given as a result 2 4 Test QWERTY Keyboard This menu provides tests for the PDA QWERTY keyboard User options are Method default One Key Range One Key TimeOut default 25 5s Range 0 1 25 5s The names of the pressed keys are displayed until the TimeOut measured from the last key pressed expires If no key is pressed at all until within this timeout period the test is the TimeOut expires considered to have failed To exit from the testing mode press any key on the PC keyboard and then any key on the communicator 2 5 Test IR Communications This menu provides a test for the PDA IR communications One of the two methods to test the IR can be chosen Test uses half duplex method to test the input and the output capabilities of the target User options are Mode default Output range Output Input Output Byte default 55 range 0 FF hex The IR tranceiver of the host PC will be set to the opposite port than that chosen for the service software i e if the service software communications port is set to COM1 then the IR tranceiver will be connected to the COM and vice versa The IR speed defaults to the one used by the COM port for service software communications The speed of the IR may be changed by changing the communications speed If the
270. ginal 05 97 Page8 7 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation PDA Faultfinding Introduction The purpose of this document is to provide methods to find the component that is malfunctioning in the PDA module of the Communicator Due to the large integration scale used in the Communicator it is always not possible to point the faulty component for sure However the flow diagram introduced here is made to fulfill the aim as well as it is possible Required Servicing Equipment PC for the PCLocals power supply RS cable digital multimeter oscilloscope frequency counter optional Block Diagram The block diagram of the Communicator PDA is described in the picture below EN CMT module 28F016SV 28FO16SV 28F016SV p FLASH FLASH FLASH Wd Wd d CS1 Cso UCS D 3A00000h 3C00000h 3E00000h io D 15 0 reset Intel 80386BX EE RS232 sio 1 e PDALCD IE Rh sio 0 Softkeys T zap io PLL D9 0 S7 0 tranceiver PLL circuit Clock generation UI module Page 8 8 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly PDA Components The following components of the Communicator PDA have an dramatic effect to the functionality of the module a fault in any of these may cause the module to appear totally dead PDA power unit CPU PLL clock generation circuit
271. ginal 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware SIRU Introduction IrDA transceiver and RS232 buffer are located to this module Infrared interface conforms to the Infrared Data Association Serial Interface SIR Physical Layer LInk Specification SIRU functions external interface signalling IIDA and RS232 Technical Description Table 26 External Signals and Connections Inputs Signal Name Signal description From 1 VSYS System voltage 3 3V PDAPWRU TXD External serial data from 9000 SC SYSTXD Note 1 SC System Connector Table 27 External Signals and Connections Outputs Signal Name Signal description To 1 RXD External serial data to 9000 SC SYSRXD RSRXD Serial data to PDA module PROCU Note 1 SC System Connector Main components IR tranceiver Temic IrDA SIR integrated transceiver TFDS3000 Shutdown pin RS 232 buffer MAX3222CAP transceiver from Maxim Two transmitters two receivers Generates EIA TIA 232 compatible signal levels Original 08 96 Page 6 45 RAE RAK 1N After Sales PDA Hardware Technical Documentation This page intentionally left blank Page 6 46 Original 08 96 After Sales Technical Documentation RAE RAK 1N Series Chapter 7 Service Software Amendment 1 04 97 RAE RAK 1N After Sales Service Software Technical Documentation CONTENTS Service Software Page No ligi fore lVier lor
272. ginal 08 96 Page 9 RAE RAK 1N After Sales Accessories Technical Documentation Operation The device has a dc plug input connector for the ACP 3 charger and 4 pin output connector for an extra battery Recommended charging temperature is between 0 45 degrees centigrade Charge control of the spare battery is done with a constant voltage controller and dissipative transistor located in a desktop charger PCB Charging indication Charge is indicated with two LEDs red and green They both shed their light into same mechanical light guide Red LED indicates that the battery is not full This color is shown to user until current to battery decreases under 65mA Green LED indicates that the battery is full but charging of the Lithium battery continues after green indication to ensure the maximum capacity Charging is stopped completely after current to battery decreases below 30mA Green LED stays visible until battery or charger is removed When battery is disconnected and charger is connected LEDs are off When charger is disconnected and battery is connected LEDs are off Battery is not discharged so there is no harm in leaving the battery to desktop charger for long periods For example during trips it is a benefit to carry both spare battery and desktop charger together in small space When full battery is reconnected to desktop charger LED color is first red and after couple of seconds it turns green Red color is shown because
273. gram yet Remove coaxial antenna cable E Remove EMC flex not shown from the top of the shield Lift out the sub assy Remove PDA module card I from the chassis by lifting it in the middle Remove the handsfree speaker from the chassis Open the SIM flex connector on the CMT module and unplug the SIM flex from the chassis F Remove 3 short Torx screws S open the shields and remove the CMT module Re assemble in reverse order and observe the following points Ensure the shield snaps into position properly Position the handsfree speaker gasket so that the sound gap in the chassis is open and the speaker wires are not trapped between the PDA module and chassis Check that the handsfree microphone wires go through the slot in the chassis and do not get trapped between the chassis and PDA module e Position the EMC flex with guide lines on the shield When re assembling the sub assy and cover locate the system connector end of the assy first Ensure the handsfree microphone dust washer inside the cover remains in place Position the coaxial antenna cable so that it goes around the screw tower The black mark on the cable is the correct fixing point for the cover Page 8 6 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly el WINDOW HINGE CENTER PART HINGE PIN 2 B COVER QWERTY KEYMAT xx E Figure 2 System Module disassembly Ori
274. he DRAM area that is under double mapped XIP FLASH and EMS registers True FFS FLASH area GEOS and applications XIP FLASH 2 GEOS and applications XIP FLASH 1 GEOS XIP XIP FLASH 1 ROM DOS XIP FLASH 1 True FFS XIP FLASH 1 BIOS XIP FLASH 1 Page 6 28 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware Table 18 continued Memory Map DOS ROM DISK about 80k GEOS and applications XIP FLASH 1 Upper non resident XIP Reserved for manufacturing and aftersales data PDA PROD HW VERSION PDA PROD HW CODE PDA PROD HW NUMBER PDA SW VERSION Jump to BIOS code jump command 3FFFFFC Image checksum 3FFFFFF Original 08 96 Page 6 29 RAE RAK 1N After Sales PDA Hardware Technical Documentation h BIOS NEE 100009 BIOS 16 kbytes True FFS Foooon True FFS 20 kbytes DOS DOS area 43 K ROM DOS resides E0000h here full time GEOS d h GEOS resident XIP fixed memory area XIP FEMA D0000 177 K accessible full time Fixed GEOS XIP MAMMA C0000h xb page Four EMS pages 16 kbyte each page TrueFFS amp ROM disk gt B0000h ideo buffer area Video Buffer AFAOOh BIOS and TrueFFS data 90000h 80000h 70000h 60000h GEOS heap area Interrupt vectors DOS data area and True FFS data area BIOS GEOS heap 50000h_ data area 641 5 K space accessible full time 40000h 30000h 20000h 10000h Vectors DOS data _ 00000h EMS registers D
275. he service software Test Patterns OK If all the pixels on the LCD toggle the LCD test can be considered to have been successful If there are some pixels patterns that are not OK then return to 3 1 4 Page 8 28 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 4 Troubleshooting Diagram of the Buzzer The functionality Of the buzzer can be checked with the Service Software The buzzer test tests the timer controls along with some other internal functions of the CPU Start 1 Beep the Buzzer NO 2 1 Disconnect SIM flex YES 22 NO 2 2 1 CPU SPKR pin 124 fault YES 2 3 1 2 3 NO Check BUZZEROUT Driver OK Circuitry YES 2 4 NO SIM flex OK YES 25 Buzzer fault Buzzer OK 4 1 Beep the Buzzer To beep the buzzer choose the buzzer test in the service software Give the desired frequency and the duration Original 05 97 Page 8 29 RAE RAK 1N After Sales FaultindingDisassembly Technical Documentation 4 2 4 2 1 4 2 2 4 2 2 1 4 2 3 4 2 3 1 4 2 4 4 2 4 1 4 2 5 Sound OK Listen to the sound or optionally measure the output of the BUZZEROUT with an oscilloscope If the frequency and the level are correct then proceed to 4 2 1 otherwise the buzzer can be considered to be functional Disconnect SIM Flex In order to isolate the fault to the PDA module disconnect the SIM flex SPKR pin 124 Check the output o
276. he silver bolt 4 and nut Original 08 96 RAE RAK 1N CARKO0 Installation Guide After Sales Technical Documentation 4 Once the desired position has been obtained ensure that all the screws are fastened securely ES Fixed mounting D Z plate t2 Fixed mounting plate Figure 3 Swivel Mounted Fixing Kit Junction Box HFJ 3 The Hands Free Junction Box provides and controls the supply voltages for the accessories and charging current for your Communicator In addition it controls the audio paths to accessories and hands free equipment The jack marked HANDSET ACCESSORY is reserved for the optional handset Hands Free Microphone HFM 10 and Speaker HFS 6 The Hands Free Microphone connects directly to the Junction Box MIC jack and Hands Free Speaker to the SPEAKER jack Power Cable PCH 4 The Power Cable connects to the Junction Box via the 4 pin connector The red 12 V and black GND wires connect to the battery via the supplied fused connectors The yellow XCRM wire is for car radio mute and the blue IGNS wire is for ignition sense The XCRM line goes down to 0 volts during a call The maximum sink current is 250 mA see Installation Car Radio Muting The IGNS line is connected to a 12 V voltage source controlled by the Car Ignition Key The Ignition Sense can utilize voltages up to 24 V see Installation Ignition Sense Handset HSU 1 optional An optional Handset offers more privacy durin
277. ighboring monitoring channel All GSM PCN channel numbers in GSM phone 1 124 PCN 512 885 are valid 3 1 8 AGC The AGC can have values of 0 93 dB by 3 dB steps If the number is not divisible evenly by 3 the number is rounded to the next bigger number divisible by 3 Only the number can be edited not letters dB 3 1 9 AFC Sets the AFC D A converter value This can have values from 1024 to 1023 Amendment 1 04 97 Page 7 21 RAE RAK 1N After Sales Service Software Technical Documentation 3 2 Adjustments L Adjustments 1 TX Power Tuning TX LA Tuning RSSI Calibration AFC Diagram Noise Sensitivity Charge Voltage Adjustment Battery Voltage fid justment All adjustments which have EEPROM saving selection have the next kind of behaving with F2 and ESC keys When adjustment function is activated and lt F2 gt key is used the program will ask are the values saved to the EEPROM or not If Y key is used adjustment values are saved to the EEPROM If lt N gt or Esc key is used the adjustment can be continued If any other key is used nothing happens When Esc key is used during adjustment function the program will ask are the values saved to the EEPROM or not If Y key is used adjustment values are saved to the EEPROM and exit from the function is done If N key is used exit is done from the function and nothing is saved to the EEPROM If Esc key is used the adjustment ca
278. indow will be seen when the tuning function is selected E RSSI Calibration 1 AGC DAC dB 511 511 511 511 511 511 511 511 511 511 511 511 511 511 511 511 511 511 511 511 lt D p E Z m Continuous mode channel 60 NNNN moon wn NNNNNNNNNNNNNNNNNNNN EEES FiHelp Low signal 5dB High signal 45dB ESC Ex RSSI offset value and AGC compensation terms have 0 1 dB precision The RSSI offset value and AGC compensation terms are read again when the previous values are received and results are shown on the screen If no measurement result is received when Esc key is used an information message is shown The user can remove the information message with Y N or Esc key The measurement will be terminated by using the Y key The measurement will continue if N or Esc key is used When at least one measurement is done and Esc key is used the user must answer to the values saving question If Esc key is used the measurement is continued Page 7 28 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Upon exiting the next selections are set to the values which were selected before this adjustment Active Unit Operation Mode 3 2 5 AFC Diagram The following automatic selections are made when this tuning function is activated Active Unit RX Operation mode Continuous The D A converter r
279. ine toggles immediately after the control signals are toggled If the RSTXD signal toggles proceed to 7 2 2 1 otherwise go to 7 2 2 2 M180 Fault If all the signal lines to the IR tranceiver toggle as they should the M180 is likely to be faulty CPU Fault If the RSTXD signal does not toggle then the CPU is likely to be faulty Page 8 38 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 7 3 7 4 7 4 1 7 4 1 1 7 4 1 2 7 4 1 3 7 4 2 7 4 2 1 7 4 2 2 Input a Byte via IR If the sending of a byte was successful try then to receive one Choose the Input mode in the service software and choose a byte to be received Received Byte OK If the service software reports success the IR test can be considered to have been successful otherwise proceed to 7 4 1 IRSHD RSENX RSSHDX OK When the 9000 begins to receive the byte it toggles the RSENX from logic low to high RSSHDX at the same time from logic high to low and after few milliseconds the IRSHD from logic high to low If these signals do not toggle correctly proceed to 7 4 1 1 If the signals are OK then go to 7 4 2 M180 pins 2 6 7 Disconnected To isolate a problem with the IRSHD RSENX and the RSSHDX that does not control the RS buffer and the M180 IR tranceiver module correctly disconnect the control signals from the M180 If the pins are connected continue to 7 4 1 2 otherwise go to 7 4 1 3 Dis
280. ing Channel Not in use Not in use Not in use Not in use Not in use Not in use Active Unit RX Operation mode Operation mode BURST CONT TX Data Type Removed AGC Values TX Power Level Continuos Mode Chan Removed nel Updated Channel Updated Monitoring Channel Note Continuous mode with TX active unit is not possible Amendment 1 04 97 Removed Updated Updated Removed Removed Page 7 19 RAE RAK 1N After Sales Service Software Technical Documentation 3 1 1 Active Unit Either receiving or transmission tests can be selected When TX is selected Data transmission is activated elf operation mode is continuous Continuous mode is changed to burst mode elf operation mode is burst TX power is activated TX channel is activated einformation window is updated When RX is selected Data transmission is deactivated eTX power is deactivated eif operation mode is continuous AGC is controlled Continuous mode RX channel is activated elf operation mode is burst RX and monitoring channel are activated einformation window is updated 3 1 2 TX Power Level With this function it is possible to change the transmission power When the selection is made the user can give the needed GSM power value 5 15 or select the test value which is tuned with TX power tuning function The test value selection is made by writing test with small or capital letters P
281. ing from the front end of the receiver Amendment 1 04 97 Page 3 15 RAE RAK 1N After Sales RF Technical Documentation 2nd mixer only in PCN The 2nd mixer is a single balanced passive diode mixer The local signal is balanced by a printed circuit transformer The mixer down converts the 1st IF signal 313 MHz to 2nd IF signal 87 MHz Table 7 2nd Mixer Specification PCN Nominal fistiFireuency toreen J 499 Me 2d IE trequemey WM y Cowon s e 7 es A a opere 3 1 2nd IF amplifier only in PCN The 2nd IF amplifier is realized using resistive feedback connection for bipolar RF transistor Table 8 2nd IF amplifier specification PCN Nominal Operatonirequency pe Suppl votage 45 V fCurentconsumpion n ma Input impedance matched to the mixer Output impedance matched to IF filter 2nd IF filter only in PCN The second IF filter SAW makes the part of the channel selectivity of the receiver It rejects adjacent channel signals except the 2nd adjacent It also rejects blocking signals and the 3rd image frequency Page 3 16 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation RF Receiver IF circuit RX part of CRFRT The receiver part of CRFRT consists of an AGC amplifier of 57 dB gain a mixer and a buffer amplifier for the last IF The mixer of the circuit down converts the received signal to th
282. ing functions are implemented and control I O lines are provided eg for synthesizer loading The DSP emulator can be connected to DSP pins TCK TMS TDO TDI GND and VDD JTAG standard Main components AT amp T DSP1616 X11 Digital signal processor with 12kword internal ROM The DSP locates physically in MCM2 Two 32k 8 70ns SRAMs for DSP external memory The SRAM s lo cate physically in MCM2 60 2 MHz crystal oscillator to generate differential small signal clock for the DSP Original 08 96 Page 2 31 RAE RAK 1N After Sales Baseband Technical Documentation AUDIO Introduction The AUDIO block contains an audio codec and a booster amplifier together with some peripheral components The codec contains microphone and earpiece amplifiers and all the necessary switches for routing The codec is controlled by the MCU The PCM data comes from and goes to the DSP The booster amplifier for the Personal Hands Free PHF is connected to one of the codec s outputs Physically the codec resides in MCM2 while the other parts are assembled on the CMT motherboard Technical specification Table 34 External Signals and Connections Inputs Signal Name Signal description From Analog supply voltage Max 40 mA PWRU Analog supply voltage for the PHF power amplifier Max 200 PWRU mA PCMIN Received audio in PCM format DSPU SYNC 8kHz codec frame sync ASIC CODEC CLK 512kHz codec main clock ASIC XSELPCMC Audio cod
283. ings c sz ERR Operating Instructions Page 1 2 After Sales Technical Documentation Original 08 96 After Sales Technical Documentation List of Figures Figure 1 Basto EEN Figure 2 Personal Digital Assistant Figure 3 Modular Structure Figure 4 PDA QWERTY keypads Figure 5 Interconnection Diagram Original 08 96 RAE RAK 1N Overview Page 1 3 RAE RAK 1N Overview List of abbreviations Page 1 4 AC AFC AGC ASIC BB CMT COB CODEC CRC CTRLU DAI DBUS DC DSP DSPU DTMF DTX EEPROM FAX GSM HF HFJ HS HW After Sales Technical Documentation Alternating Current Automatic Frequency Correction Automatic Gain Control Application Specific Integrated Circuit BaseBand Cellular Mobile Telephone Chip On Board COder DECoder Cyclic Redundancy Check ConTRoL Unit Digital Audio Interface Data BUS NMP s internal name Direct Current Digital Signal Processor Digital Signal Processing Unit Dual Tone Multiple Frequency Discontinuous Transmission Electrically Erasable Read Only Memory Facsimile Global System for Mobile communications Hands Free Hands Free Junction box HandSet HardWare Integrated Circuit Intermediate Frequency Joint Test Action Group Liquid Crystal Display Low Noise Amplifier Message BUS Multi Chip Module MicroController Unit Original 08 96 After Sales Technical Documentation NM
284. ion number s place The function is closed with Esc key Page 7 44 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 7 Phone Mode With this function you can change the phone state Normal or local mode When Normal mode is selected the normal start up functions take place in the phone and the phone is in normal operating mode When the local mode is selected the phone is deactivated to enable e g special RF tuning and adjustment values These are requested from the phone and used to control hardware 8 PDA Commands See PDA section Amendment 1 04 97 Page 7 45 RAE RAK 1N After Sales Service Software Technical Documentation 9 Faultlog Faultlogger allows a complete service record to be built up from each phone repaired The software automatically read the products details from EEPROM and writes a record to a pre determined file When an engineer adds the repair information a complete service record is formed and this record can then be utilsed by database software for accurate fault reporting purposes Basic Operating Principles Q Quit A valid ID and password is required to get access to faultlogger When accepted the unit to be repaired is connected to the software and the phones details are automatically read The repair is carried out and on completion of the repair the work performed is entered manually on a data entry screen The automatic data read ear
285. is OK press Esc Select option Tune Phase Difference and press Enter Adjust the level of signal CHF 67 7 kHz to minimum by varying D A converter value with lt gt and lt gt keys The amplitude difference between CHF 67 7 kHz and CHF 67 kHz should be gt 35 dB When value is OK press Esc Press Esc key and store new values with Y key 4 Tuning of Transmitter Power Levels This adjustment loads the power levels of the phone transmitter into the EEPROM When doing this a pulse power meter or spectrum analyzer must be used Note The cable loss of HCH 1 is about 2 4 dB Power levels programming Set power supply voltage to 7 2 V Connect pulse power meter or spectrum analyzer to antenna connector Check that channel is 700 Select adjustments menu option TX Power Tuning and press Enter Press Y Adjust the power level levels Base 0 8 and 10 with lt gt and lt gt keys and change levels with Up and Down keys Amendment 1 04 97 Page 7 83 RAE RAK 1N After Sales Service Software Technical Documentation Power Tuning Poyt dBm level VB 7 2 V CH700 0 tune first pe o fe Press lt F3 gt to calculate all other levels Once all TX levels are OK press Esc and store readings in phone EEPROM with pressing lt Y gt 5 Charge Voltage Adjustment A reference value for charge voltage is s
286. is typically 10dBm The output signal from CRFRT is band pass filtered in PCN low pass filtered to reduce harmonics and the final TX signal is achieved by mixing the UHF VCO signal and the modulated TX intermediate signal with passive mixer After mixing the TX signal is amplified and filtered by two amplifiers and filters except in GSM there is only one filter These filters are dielectric filters in both GSM and PCN After these stages the level of the signal is typically 1 mW 0 dBm in GSM and 2 mW 3 dBm in PCN The discrete power amplifier amplifies the TX signal to the desired power level The maximum output level is typically 1 5 2 0 W in GSM and 0 8 1 0 W in PON in the antenna terminal of the duplex filter The power control loop controls the output level of the power amplifier The power detector consists of a directional coupler and a diode rectifier Transmitted power is controlled with TCGA on TX path of CRFRT Power is controlled with TXC and TXP signals The power control signal TXC which has a raised cosine form comes from the RF interface circuit RFI which is located in the baseband section Page 3 12 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation RF RF Characteristics Receiver Table 3 RF characteristics Receiver RX frequency range MHz 935 960 1805 1880 Type Linear 2 IFs Linear 3 IFs Intermediate frequencies MHz 71 13 313 87 13 3 dB bandwidth kHz 100
287. is4 cis c155 b150 4 100n 10n y ind 22n 220 220 2n2 vsys VBACK z e ell HE Ka a a T2 L a8 zils R147 ME Iz CL 8 R140 3M3 2 10M e PWRGOOD T KEYSC1 0 4 19 26 31 48 51 VSYS VLI VB vccs VSYS vsYs VSYS eg VsYs soi TT US oa cist os cra es VB 100n 100n 100n 190n 100n CND CND eno Le CND VCC5 Original 05 97 Lou eum Lono Len 7 n 3 C158 3n GND ls 20k R148 100k Lem L BUZ7EROUT V135 BCV2T Lo LL KEYDC 0 Page 10 6 RAE 1N Figure 5 PDA EMIU Edit 21 for layout 13a KEYDIC2 0 R900 ge KEYDO 2 0 TOR ear R902 R903 gt 100R egr R904 R905 r4 100R 68R KEYSI 1 0 R906 R907 KEYSO 1 0 r4 100R 68R R908 R909 rd 100R 68R LCDDI 3 0 gt e910 gai LCDDO 3 0 y 100R 68R R912 R913 100R C
288. istics Table 3 AC characteristics of RF connectors 3 0 Impedance Transmitter frequency GSM PCN Receiver frequency GSM PCN Max output power UIF External Signals and Connections Table 4 Hinge flex connector X001 signals VEATT 7 Este vote p e kee LCMUIF 3 0 keypad row display data LCMUIF4 keypad row Read Write for strobe for CMT LCD Amendment 1 04 97 Page 4 9 RAE RAK 1N After Sales UF Technical Documentation Table 4 Hinge flex connector X001 signals continued LCMUIF5 keypad row LCD driver register select LCMUIF6 enable strobe for LCD driver Se o ew LCMCOL 3 0 11 14 Keypad column write A BACKLIGHTA 15 Display and keypad illu mination control LOMXPWRON fie jowTPoweOfRy ow qu mew LCDD 3 0 21 18 PDA LCD Data UH POLK ps POD TOD PRO ow m eed TT Let signal Lcbvcc fa POALCD Logic votage teve p POALCDVotage F mmen era PDAKemamkdWe KEYS 1 0 33 32 PDA Keymatrix sense NEN lines Table 5 PDA LCD flex connector X010 signals SussName Pim Seeche noe Dispo Display OnO oS FP Frame Pulse LP Line Pulse 2 3 Line Pulse PCLK Pixel Clock 5 LCDDO LCD Data LCDD1 6 LCD Data LCDD2 LCD Data p p p SE r EODD NEU O LEE p el p LCDVCC LCD Logic Voltage LCDVEE LCD Voltage Page 4 10 Amendment
289. istics UIF External Signals and Connections UIF Mechanical Characteristics Functional Description UIF Circuit Description Keypad scanning and display driver control Keypad and display illumination CMT LCD Module Interface PDA soft amp scroll keys Antenna matching circuit Page 4 2 After Sales Technical Documentation Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation UIF List of Figures Page No Figure 1 LCDM connections sxuxasu kx X aura SEN ox NEE E rd 4 5 Figure 2 UIF DOSIU ee gg Epor RR ra raa ts 4 6 Amendment 1 04 97 Page 4 3 RAE RAK 1N After Sales UIF Technical Documentation This page intentionally left blank Page 4 4 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation UIF Introduction This document describe UIF GK2 for GSM GK2 1 for PCN module UIF module includes CMT display CMT keypad PDA soft keypad and antenna matching circuit with connectors It has also connection to PDALCD GK1 PDALCD and UIF modules together these are called the LCDM The LCDM has all the electronics in the cover side of RAE 1 for GSM and RAK 1 for PCN Note GK2 is for GSM GK2 1 is for PCN Antenna amp antenna cable PDALCD D D a D D D Figure 1 LCDM Technical Summary UIF Mechanics The module is made for 0 6 mm thick Printed Circuit Board PCB has four layers Reasons for that kind of material Four layers are needed because
290. ite Lines for keypad read and LCD controller data COL 3 0 20 17 UIF 3 0 27 24 U Line for keypad read and LCD controller read write strobe U Line for keypad read and LCD controller data instruction register selection U R IF4 IF5 DA 28 29 30 DCLK 32 DBUS data clock DSYNC 33 DBUS data bit sync clock 34 DBUS received data from the accessories TDA 35 DBUS transmit data to the accessories MBUS 36 Serial bidirectional data and control between the handphone and accessories LIDOPEN Page 6 14 38 Lid status for CMT module Original 08 96 After Sales RAE RAK 1N PDA Hardware Technical Documentation Table 8 PDA board to board connector continued EXTMIC 41 External audio input from accessories or handsfree microphone Multiplexed with junc tion box connection indication 16 8k pull down in CMT EXTEAR 42 External audio output to accessories or hands free speaker 100kQ pull down in CMT to turn on the junc tion box AGND 43 Analog ground for accessories Connected directly to digital ground on the PCB Table 9 HFMIC Connector Signal Name Pm Notes o PHFMICN Negative MIC input PHFMICP 1 2 Positive MIC input Table 10 LCDM module flex connector on PROCU Signal Name Pin Ground or VB flex material dependent GND 10 17 24 VB L1 V 2 Power lines for backlight LEDs Phone LCD power LCMUIF 3 0
291. k 5 0 063 W 0603 R015 1430087 Chip resistor 100 k 5 0 063 W 0603 R016 1430087 Chip resistor 100 k 5 0 063 W 0603 R017 1430087 Chip resistor 100 k 5 0 063 W 0603 R018 1430087 Chip resistor 100 k 5 0 063 W 0603 R019 1430087 Chip resistor 100 k 5 0 063 W 0603 R020 1430087 Chip resistor 100 k 5 0 063 W 0603 R021 1430051 Chip resistor 4 7 k 5 0 063 W 0603 R022 1430051 Chip resistor 4 7 k 5 0 063 W 0603 R030 1430045 Chip resistor 2 7 k 5 0 063 W 0603 R031 1430043 Chip resistor 2 2 k 5 0 063 W 0603 R032 1430087 Chip resistor 100 k 5 0 063 W 0603 R033 1430165 Chip resistor 39 5 0 063 W 0603 R034 1430165 Chip resistor 39 5 0 063 W 0603 R035 1430165 Chip resistor 39 5 0 063 W 0603 R036 1430165 Chip resistor 39 5 0 063 W 0603 C001 2604248 Tantalum cap 4 7 u 20 96 16 V 6 0x3 2x2 5 C002 2604248 Tantalum cap 4 7 u 20 96 16 V 6 0x3 2x2 5 C003 2307816 Ceramic cap 47n 20 96 25 V 0805 C004 2307816 Ceramic cap 47n 20 96 25 V 0805 C005 2307816 Ceramic cap 47n 20 96 25 V 0805 C006 2307816 Ceramic cap 47n 20 96 25 V 0805 C007 2307816 Ceramic cap 47n 20 96 25 V 0805 C008 2307816 Ceramic cap 47n 20 96 25 V 0805 C009 2307816 Ceramic cap 47n 20 96 25 V 0805 Page 42 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists C010 2604431 Tantalum cap 10u 20 96 16 V 6 0x3 2x2 5 C011 2320107 Ceramic cap 10n 5 96 50 V 0603 C023 2320043 Ceramic cap 22p 5 96 50 V 0603 C025 2320043 Ceramic cap 22p 5 96 50 V 0
292. klet NMP Part Number RAE RAK 1 SERIES SERVICE MAN 0275188 UAL Name Position Signed Date Please return to Barry F Gibbons After Sales Documentation Manager NMP Camberley Fax 44 276 64478 Original 05 97 After Sales Technical Documentation RAE RAK 1 SERIES SERVICE MANUAL Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 Chapter 7 Chapter 8 Chapter 9 Chapter 10 Appx A Appx B OVERALL CONTENTS Overview of NOKIA 9000 communicator Baseband Module RF Modules UIF Modules SIM flex module PDA module Service Software Faultfinding Disassembly Service Tools Schematics Component Layouts Quick Guide Parts Lists Accessories Booklet Desktop Charger Handsfree Unit Non serviceable Accessories Vehicle Installation Guide Original 05 97 After Sales Technical Documentation RAE RAK 1N Series Chapter 1 Overview Original 08 96 RAE RAK 1N Overview CONTENTS Overview REESEN e eas ERE RES de Summary of product features GSM PCN Networks Modular Structure Product Variants d ss RE Rr RES Sales Packages EEN Accessories e Technical Summary us cera RR EXER Mechanical Characteristics Environmental Conditions Temperature Conditions Vibration and Free Fall Humidity and Water Resistance Warnings and Restrictions Maximum Rat
293. kup Restore 0 0 cece eee eee elles 29 Importing Exporting Contacts esr eee mnm 29 Data REMOVAL ER 29 SEWING p da ets 29 EEN 30 ET e TEE 30 CHOC MERO A 31 COMPOSE tcc asso Ee eB bbradU PRX aep e 32 ai cR rc beee bee adi aoe aa a a G a 32 Document QU DOX soe Mrt hecha Rd oi et cs EN 32 Original 08 96 Page 3 RAE RAK 1N After Sales Quick Guide Technical Documentation List of Figures Page No Figure 1 NOKIA 9000 Communicator 4 x o Re Rs eee Pex cured b Figure 2 Communicator Applications 6 Figure 3 Selection EE 8 Figure 4 Display Indicators 8 Fig re 5 PDALTASyGUL inkszsmesedes4E EN ee E SAP EP 13 Figure 6 Contacts Directory see EAER E e Rr Rer Rer nda 16 Figure 7 Contact Card uenis UE RP UR died oben EPI Se UR Rd 16 Figure 8 Telephone Directory 17 Figure 9 Fax Main VIEW pista PR RE ER Abd REP A NEE 18 Figure 10 Fax Directory EE 18 Higured1 TEE 19 Figure 12 SMS Main View sseeseseseee esee 20 Figure 13 SMS Message received Lssuuueluseusss 21 Figure 14 Internet main View eese 22 Figure 15 Mail main view deu RE dans EXE TRE os REPE ERE RA 23 Figure 16 Mail envelope 0 02 e eee ee eee 23 Figure 17 WWW e lt 24 Figure 18 Telnet VT100 emulation 0 0c cee eee eee 24 Figure 19 Notes main view 25 Figure 20 Calendar main view 26 Figure 21 Cale
294. l Documentation Parts Lists PDA Module GP1 EDMS pn 0200709 Issue 3 1 Item Code Description Value Type R065 1430822 Chip resistor 560 k 5 0 063 W 0402 R072 1430830 Chip resistor 1 0 M 5 0 063 W 0402 R074 1430142 Chip resistor 4 7 5 0 063 W 0603 R075 1430830 Chip resistor 1 0 M 5 0 063 W 0402 R076 1430826 Chip resistor 680 k 5 0 063 W 0402 R077 1430700 Chip resistor 10 5 0 063 W 0402 R078 1430183 Chip resistor 110k 1 96 0 063 W 0603 R080 1430778 Chip resistor 10k 5 96 0 063 W 0402 R081 1430804 Chip resistor 100 k 5 0 063 W 0402 R082 1430113 Chip resistor 348 k 1 96 0 063 W 0603 R083 1430822 Chip resistor 560 k 5 0 063 W 0402 R084 1430181 Chip resistor 30 9k 1 0 063 W 0603 R085 1430142 Chip resistor 4 7 5 0 063 W 0603 R086 1430804 Chip resistor 100 k 5 0 063 W 0402 R087 1414526 Chip resistor 120 k 1 96 0 1 W 0805 R088 1430780 Chip resistor 12k 5 0 063 W 0402 R089 1430131 Chip resistor 464 k 1 0 063 W 0603 R090 1430764 Chip resistor 3 3 k 5 0 063 W 0402 R092 1430820 Chip resistor 470 k 5 0 063 W 0402 R093 1820026 NTC resistor 100 k 5 0805 R094 1430830 Chip resistor 1 0 M 5 0 063 W 0402 R095 1430804 Chip resistor 100 k 5 0 063 W 0402 R096 1430796 Chip resistor 47 K 5 0 063 W 0402 R097 1820026 NTC resistor 100 k 5 0805 R098 1430820 Chip resistor 470 k 5 0 063 W 0402 R112 1430746 Chip resistor 560 5 0 063 W 0402 R113 1430746 Chip resistor 560 5 0 063 W 0402 R114 1430746 Chip resistor 560 5 0 063 W
295. l specification Parameter Typical Maximum Unit Notes Nominal Supply voltage using CRFRT a 2 Supply current using CRFRT Power control range GSM Dynamic range Input control voltage range GSM PCN Synthesizers Reference oscillator In GSM and PCN the reference oscillator is a discrete VCXO and the frequency is 26 MHz In PCN the buffer amplifier for the reference oscillator is located in the RF side near the local oscillator although it is drawn in the baseband schematic The oscillator signal is used for a reference frequency of the synthesizers and the clock source for the baseband circuits Table 16 VCXO specification Parameter Typical Maximum Unit Notes Nominal Center frequency Do 26 Frequency tolerance ppm Vc 2 2 V ED bell EU Supply voltage Page 3 22 Amendment 1 04 97 After Sales Technical Documentation Table 16 VCXO specification RAE RAK 1N RF continued Typical Nominal Output voltage 1 3 UNA 2 0 Vpp sine wave for PLLs EE Nominal Voltage for center frequency Control Sensitivity ppm V ppm 25 70 deg C ppm 4 5 V 4 5 96 ppm load 10 96 ppm year Frequency stability vs temperature vs supply voltage vs load vs aging Operating temperature range Load impedance resistive part parallel capacitance m p NIME VHF PLL The VHF PLL consists of the VHF VCO PLL integrated circuit and lo
296. layer PCB The chassis of the radio unit has separating walls between baseband and RF All components are surface mounted Transceiver GE8 is GSM Tranceiver GE9 is PCN The connection to the NOKIA 9000 communicator PDA module is made using a board to board connector The connections to the User Interface module UIF are made through the passive PDA module Besides the PDA board to board connector only the SIM audio and battery connector are on the baseband module There is no physical connector between the RF and baseband sections Technical Summary Because of extreme size constraints on this product new production technology will be used Most of the baseband ICs will be integrated in two multi chip modules These MCMs and all other baseband circuits are mounted on a single multilayer printed circuit board This board contains also RF parts The chassis of the radio unit has separating walls between baseband and RF All components of the baseband section including the MCMs are surface mountable They are soldered using reflow The connection to Responder PDA module is made using a board to board connector The connections to the User Interface module UIF are made through the PDA module Besides the PDA board to board connector only the SIM audio connector and battery connector are on the baseband module There is no physical connector between the RF and baseband sections Table 1 List of Functional Submodules Nameofsubmodue Fem
297. lected placed and related in this data base are the author s intellectual propriety E TURUTA
298. lier is checked for validity If O K the entry is saved and a complete service record is added to the fault log output file 1 Faultlog Entry 2 Edit Faultlog Entry 3 Edit Faultlog Configuration For further information refer to the Faultlogger User s Guide for NHE 4 This terminates the program and returns to DOS Page 7 46 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software PDA Menu Commands Introduction Upon selection the service software will try to establish a communications link to the PDA module via the second serial port if fitted or alternatively when the DLR 1 connector is attached to the first serial port in place of the MBUS Once a link is established between the service software and the PDA further tests may be carried out 1 Program Setup 2 Initialize CMT 3 CMT Testing and Adjustments gt 4 CMT ME Memory Functions gt 5 CMT Pouer up Self tests 6 CMT SH and HW Versions 7 CMT Phone Mode amp Local Normal Normal 8 PDA Functions 9 Faultlog H H H Q Quit
299. limit Data save PDA saves all user data and disables PDA when the battery level is below this level The following limits are implemented in hardware CMT HW limit CMT power supply switches itself off PDA HW cut off PDA power supply switches itself off Battery protect circuit cut off A circuit in the battery package switches power off from battery output pads Original 08 96 Page 6 21 RAE RAK 1N PDA Hardware After Sales Technical Documentation Standby test 3 K2 9 0609 Voltage V EMT battery cut off v Battery low level Wa rning 2S CMT HW limit PDA limit Data save 77 RDA HW cutoff 25 30 35 40 45 Time h Battery protect circuit 4 0 4 4V cut off Figure 5 Discharge voltage curve of battery two Li lon cells in stadby Page 6 22 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware EMIU This module contains only passive components to suppress EMI generated voltages on external signal lines Note 1 B2B Board to board connector between PDA and CMT modules Table 14 External Signals and Connections Inputs Signal Name Signal description From 1 BACKLIGHTI Backlights on off control B2B Back light KEYDI 2 0 Keymatrix drive lines PROCU KEYD 2 0 KEYSI 1 0 Keymatrix sense lines PROCU KEYS 1 0 LCDD 3 0 PDALCD Data PROCU LCDD 3 0 DISPONI PDA LCD Display on control signal PROCU DISPON FPI PDA LCD Frame Puls
300. low Output Input high keypad row lines display data lines LCMUIF4 Output Input low Output Input high keypad row read write strobe for LCD driver 9 UIF 14 11 UIF 15 UIF 16 UIF LCMUIF5 LCMUIF6 LCMCOL 3 BACKLIGHTO LCMXPWRON 21 18 LCDD 3 PDALCD 22 PDALCD Output Input low Output Input high 0 7V Output Input low Output Input high Output Input low Output Input high CC 4 65V 4 8V 4 9 V Output low back lights off Output high back lights on pans low power on Ir when inac tive A SUME in Output low Output high Output high keypad row LCD driver register select enable strobe for LCD driver Display and key pad illu mination control Power ON OFF key PDA LCD Data lines PDA LCD Line pulse 23 PDALCD Page 4 8 0 4 V Output low Output high PDA LCD Pixel clock Amendment 1 04 97 After Sales Technical Documentation RAE RAK 1N UIF Table 2 DC characteristics of PDA Hinge flex connector on LCDM module continued 29 PDALCD Line Symbol Se Output low Output high PDA LCD Frame Pulse 26 PDALCD DISPON Output low PDA Dis play on Output high control signal KEYD 2 0 0 4 V Output low Keymatrix drive lines 2 6 V Output high Keymatrix drive lines KEYS 1 0 0 5 0 8 V Input low Keymatrix V sense AC Character
301. lt FLASH SRAM EPROM MBUS TX ES ES A routed via SCL MCM1 N Figure 1 Interconnection diagram Page 2 6 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Modes of Operation There are four different operation modes active mode idle mode acting dead mode power off mode Active Mode In the active state all circuits are powered and part of the module may be in idle mode Idle Mode The module is usually in the idle mode when there is no call and the phone is in SERV In the idle mode circuits are reset powered down and clocks are stopped or the frequency reduced All the clocks except the main clock from VCXO can be stopped in that mode Whether the SIM clock is stopped or not depends on the network Acting Dead Mode The acting dead mode means that the baseband is powered but there is no difference from the power off mode from the user point of view The acting dead mode is used for performing some necessary control functions such as battery voltage measurement and reporting to PDA module Power Off Mode In power off mode only the circuits needed for power up are powered This means that only power up block inside the PSL is powered The power key is pulled up with a pull up resistor inside the PSL Performance Specifications DC Characteristics Table 3 Supply Voltages and Power Consumption Pin Conn Line Symbol Minimum Typical Unit Notes Nominal 4 BAT
302. maintenance software Original 08 96 Page 6 33 RAE RAK 1N After Sales PDAHarwae Technical Documentation RS232 FLASH load can be done with standard PC with a serial port and FLASH loading software Upload is also possible with this software On the PDA module RS232 FLASH download software is part of the BIOS RS232 FLASH download commands are integrated to maintenance software FLASH programming voltage is generated on PDAPWRU FLASH memory content validity can be checked by calculating error check code and comparing it to precalculated one PROCU PDAPWRU PDAPWRU generates 3 3V VSYS for overall system usage and 5V for FLASH programming FLASH programming voltage can be switched off with 5VPDX signal when it is not needed Switchmode powersupplies are used for VSYS and LCD Vee LCD display contrast control bias is generated by PWM unit in E3G CPU This signal controls LCD Vee power supply on PDAPWRU LCD bias and LCD logic voltages can be switched on and off by PROCU with LCDVEE and LCDVCC signals PDAPWRU generates power good PWRGOOD signal for PROCU reset purpose VBACK is always available for real time clock PROCU LCDM 640 x 200 LCD screen 8 actual grey scales on LCDM is controlled by PROCU Soft keys and scroll keys on LCDM module are connected to the keyboard controller on PROCU PROCU SIRU IrDA transceiver and RS232 buffer are located to SIRU Same RXD and TXD lines are used for both devices Wh
303. med as the JCONN signal Also external earphone signal is multiplexed 100 kohm pull down resistor is used to turn power on to the HF accessories Main components Audio codec ST5090 Contains e g PCM codec audio routing switches 3 differential microphone input channels 2 differential earpiece output chan nels ringing tone and DTMF generators Physically the codec is inside MCM2 Power amplifier LM4861 N400 Used as the booster amplifier for Personal Hands Free Transistors BC859C V380 and BC849C V381 Used for implementing the microphone bias switch ASIC Introduction The ASIC takes care of the following functions interface between MCU and UIF interface between MCU DSP and RFI hardware accelerator functions to DSP clock generation and disable enable RF controls UIF interface Timers MBUS or RBUS activity detection SIM interface Page 2 34 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Physically the D2CA ASIC is located in MCM2 The VCXO clock buffer and SIM power switch are assembled on CMT motherboard Technical specification Table 36 External Signals and Connections Inputs XRES Master reset PWRU DSPAD 16 0 DSP s address bus and control signals DSPU MCUAD 19 16 4 0 MCU s address bus DAX Data acknowledge MRBUSDET MBUS RBUS activity detection DBUSDET DBUS activity detection Table 37 External Sig
304. ment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software SN NULO A OO NDDL Figure 6 Tuning setup with covers on HCR 1 ADS 1 MODULAR T CONNECTOR XCM 1 SCF 6 RS232 9 25 PIN ADAPTER DAU 2 SERVICE SOFTWARE 3 DISK PKD 1 DONGLE BTD 1C gt 295 S XOU A AA qub et Amendment 1 04 97 Page 7 75 RAE RAK 1N After Sales Service Software Technical Documentation o dt ue QE dee on N um Figure 7 Tuning setup with covers off MJS 1 MODULE JIG SCH 7 SERVICE CABLE RS232 9 25 PIN ADAPTER DAU 2 2T SERVICE SOFTWARE 3 DISK PKD 1 DONGLE SCR 3 SERIAL CABLE RF TEST CABLE 7100424 RBM 1 BOARD TO BOARD MEASUREMENT ADAPTER HINGE FLEX NOT SHOWN RBM 2 HINGE FLEX MEASUREMENT ADAPTER NOT SHOWN INCLUDED IN MODULE JIG KIT MJS 1K Page 7 76 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Tuning Procedure for GSM units Carry out this procedure in the order as shown 1 RSSI Reference Signal Level Storage Reference value for the received signal strength meter are program tuned RSSI reference signal level programming Start the service software and go to Main menu Select Phone mode and select local mode with Enter key Select Testing and Adjustments menu and press Enters Select Adjustments menu and press Enters Connect RF generator to antenna connec
305. mentation PCN System Module GEO 05 EDMS pn 0200727 Issue 4 0 Item Code Description Value Type R200 1430796 CHIPRES 0WO06 47K J 0402 R201 1430804 CHIPRES OW06 100K J 0402 R202 1430788 CHIPRES OW06 22K J 0402 R206 1430726 CHIPRES 0W06 100R J 0402 R207 1430726 CHIPRES OW06 100R J 0402 R208 1430726 CHIPRES 0W06 100R J 0402 R209 1430726 CHIPRES 0W06 100R J 0402 R210 1430796 CHIPRES 0WO06 47K J 0402 R211 1430700 CHIPRES OW06 10R J 0402 R212 1430804 CHIPRES 0W06 100K J 0402 R213 1430726 CHIPRES 0WO06 100R J 0402 R216 1430778 CHIPRES 0WO06 10K J 0402 R220 1430770 CHIPRES 0WO06 4K7 J 0402 R222 1430726 CHIPRES OW06 100R J 0402 R224 1430079 CHIPRES OW06 47K J 0603 R230 1430842 CHIPRES 0W06 680K F 0402 R231 1430840 CHIPRES 0W06 220K F 0402 R232 1430804 CHIPRES OW06 100K J 0402 R233 1430804 CHIPRES 0W06 100K J 0402 R250 1430792 CHIPRES OW06 33K J 0402 R251 1430764 CHIPRES 0W06 3K3 J 0402 R252 1430846 CHIPRES OW06 2K7 F 0402 R253 1430764 CHIPRES 0W06 3K3 J 0402 R254 1430734 CHIPRES OW06 220R J 0402 R255 1430788 CHIPRES OW06 22K J 0402 R256 1430844 CHIPRES 0WO06 3K9 F 0402 R257 1430778 CHIPRES 0WO06 10K J 0402 R258 1430732 CHIPRES 0W06 180R J 0402 R259 1430804 CHIPRES OW06 100K J 0402 R260 1430762 CHIPRES OW06 2K2 J 0402 R261 1430762 CHIPRES OW06 2K2 J 0402 R262 1430732 CHIPRES OW06 180R J 0402 R263 1430778 CHIPRES OW06 10K J 0402 R264 1430778 CHIPRES OW06 10K J 0402 R265 1430045 CHIPRES OW06 2K7 J 0603 R266 1430045 CHIPRE
306. mic cap Ceramic cap Ceramic cap Ceramic cap Tantalum cap Tantalum cap Tantalum cap Chip coil Chip coil Diode BAS16 Transistor BC849C Transistor BCX19 Transistor BCX19 Transistor BCX19 Transistor BCX19 Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green Led Green 22 p 22p 22 p 10n 4 7 u 4 7 u 10 u After Sales Technical Documentation 5 50 V 0603 5 50 V 0603 5 50 V 0603 5 50 V 0603 20 16 V 6 0x3 2x2 5 20 16 V 6 0x3 2x2 5 20 16 V 6 0x3 2x2 5 2 n 7 0N2 Q 42 450M 0805 3 n 3 0N2 Q 38 450M 0805 75 V 250 mA 6 ns SOT23 npn 30 V 0 1 A SOT23 npn 50 V 0 5 A SOT23 npn 50 V 0 5 A SOT23 npn 50 V 0 5 A SOT23 npn 50 V 0 5 A SOT23 IC Icd 42dotm 3x7sgm 57ind DSL 12 EU 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 Push button switch 6 4x5 2 smd SM coax conn recep 50r 3ghz 5x4 5x4 5 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists X010 5469015 SM flex conn sfv 12pol p0 5 loc LOCK X001 5469021 SM flex conn 33pol po 5 l conta L CONTACT 9457468 Lightguide rae 1 dmc00310 X040 9510168 Antenna contact b11114 9795025 Keydome diam 5 6x20 sheet rae 1 RAE 1 9854198 PCB GK2 1 165 0X
307. modified baseband and adds a second improved user interface for data applications such as fax terminal emulator and graphical Internet browsers e g World Wide Web WWW The transceiver utilises common core electronics DCT2 which can be easily modified to comply with all digital standards in the world The HD841 is a GSM PCN project to develop a series of products for the GSM PCN markets and the 9000 s RF block is of this DCT2 generation The baseband section and accessories are derived from the DCT1 generation HD740 HD745 Original 08 96 Page 1 9 RAE RAK 1N After Sales Overview Technical Documentation Figure 2 Personal Digital Assistant GSM PCN Networks GSM is originally a pan European digital cellular network standard later phrased as the Global System for Mobile Communications The standard is defined jointly by all related parties in the European Telecommunication Standard Institute ETSI PCN is a European cellular mobile telephone standard based on the GSM DCS 1800 standard also defined by the ETSI The current PCN network licences have been granted to operators in Germany and the UK Page 1 10 Original 08 96 After Sales RAE RAK 1N Technical Documentation Overview Modular Structure The transceiver consists of the following modules GES GE9 Transceiver modules for PCN and GSM GP1 Personal Digital Assistant module GK2 Combined User interface module CMT PDA GEM1 SIM and audi
308. moved one position back If the cursor is at the last editing position of the last line nothing happens Function key number 1 activates the help window Clears text in the editing window Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software CMT Menu Commands When you start the program the phone will initialise if correctly connected It not an error message will appear Once initialised the main menu can be seen on the screen there are nine main functions Program Setup Initialize CMT j CMT Testing and fid justment 4 CMT ME Memory Functions b CMT Power up Self tests CMT SW and HW Versions A 9 Faultlog Q Quit The phone defaults to Normal mode and functions 3 and 4 are inaccessible in this mode Select function 7and press enter to change to Local mode for all test purposes The number identifier of each title in this chapter refers to a main function menu and sub menu items E g 3 Test and Adjustment main function 1 Rf Control menu 2 Tx Power level sub menu Amendment 1 04 97 Page 7 15 RAE RAK 1N After Sales Service Software Technical Documentation 1 PC Setup L Program Setup J L Load New Setu S Save Current Setup Fi Help fi Moue by Line Q Quit When Save Current Setup is selected the program asks for a setup file name The saved information will include all parameters shown below e Command line parameter value
309. mparators taking current from battery UVLO has hysteresis and is cancelled when battery voltage is risen to 6 0V Only way to do this is by charging or plugging in fresh battery Hysteresis is made to avoid unsuccessful power ups When lockout voltage level is reached battery voltage rises because load is removed LC lowpass filter is used between battery and regulators EMI is not big problem in regulator outputs but EMI conducted from switchmode regulator inputs to battery line needs filtering Also attenuation of EMI from CMT devices in battery line to PDA regulators is welcomed Good ground planes and placement of PDA power block to metal cavity and low output ripple voltages keep radiated EMI at low level Backup battery Original Real time clock is kept running by backup battery only when main battery is not connected At nominal RTC load 130mAh capacity of backup battery gives over two years of RTC operation when main battery is not connected Backup battery is not chargeable 08 96 Page 6 43 RAE RAK 1N After Sales PDA Hardware Technical Documentation Main components 3 3V current mode PWM controller IC MAX763AESA from Maxim 5V linear regulator LP29801M5 5 0 from National Semiconductor 21V switch mode PFM controller IC MAX772ESA from Maxim PWRGOOD reset circuit MAX809T from Maxim 3 0V primary back up battery 130mAh CR2320 with custom made pins from Matsushita Page 6 44 Ori
310. ms 6 dBm0 250 mVrms Original 08 96 Fixed 20 dB programmable 0 22 5 dB 0 dBm0 490 mVrms Page 2 13 RAE RAK 1N After Sales Baseband Technical Documentation Table 14 Accessory HF speaker HFEAR NOTES 1 kHz rms Level 10 dBm0 620 0 dBm0 1965 mVrms mVrms Codec gain 16 dB nominal Output attenuation 6 dB 6 dB attenuation because of single ended output Cable level 50 mVrms nominal minimum impedance 1kQ HFJ gain 27 dB HFJ output level 1 1 Vrms nominal Pressure about 2 dBPa 50 cm from loudspeaker Connectors Connectors to other modules of the product Table 15 PDA board to board connector B2B SignalName Pi Wee 1 44 Battery voltage to the PDA module 2 5 7 10 13 21 Ground 22 23 37 39 40 PHFMICN 3 PHF microphone negative node PHFMICP 4 PHF microphone positive node BUZPWR 15 PWM signal buzzer control input from PDA module F 16 Programming voltage for flash COL 3 0 20 19 18 17 Lines for keyboard write UIF 3 0 27 26 25 24 Lines for keyboard read and LCD controller data 28 Line for keyboard read and LCD controller read write strobe 29 Line for keyboard read and LCD controller data instruction register selection 30 LCD controller enable strobe DBUS data clock DBUS data bit sync clock Page 2 14 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Table 15 PDA board to board connector B2B co
311. ms are equal with each block the test is considered successful The test is performed with the default parameters shown below Filename default Flashtest bin Start Physical Address default 3A00000h Start Relative Address default 000000h End Physical Address default 3A00000h End Relative Address default 0OFFFFh Start Physical Address default 3C00000h Start Relative Address default 000000h End Physical Address default 3C00000h End Relative Address default 0OFFFFh Start Physical Address default 3E00000h Start Relative Address default 000000h End Physical Address default 3E00000h End Relative Address default DOFFFFh The output from the target shows the following whether the test was successful 7 4 LCD Test Enabling this choice adds the LCD test to be included to the test sequence The test is performed with default parameters as follows Contrast default 128 Test Pattern default Gray Gray inverted Matrix Matrix inverted Chess Chess inverted All ON All OFF Vision Vision inverted Page 7 60 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 7 5 Buzzer Test Enabling this choice adds the Buzzer test to be included to the test sequence The test is performed with default parameters as follows Frequency default 500 Hz Duration default 0 3s Frequency default 1000 Hz Duration default 0 38 Frequency default 1500 Hz Duration default 0 35 7 6 PMI Test Enabling this
312. n be continued If any other key is used nothing happens When exit is made from the adjustment menu the used adjustment values are used with the normal DSP control commands in the local mode i e power connection diagram and power levels 3 2 1 Continuous Mode Channel Continuous mode channel number can be selected from the Adjustments menu The real frequency transmission or receiving frequency area depends on the Active Unit selection and the selected tuning function Active Unit defects to the frequency when no selection is made from the Adjustments menu Note that this is same selection as in the RF Controls menu Page 7 22 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 3 2 2 TX Power Tuning Once selected the display asks the following Note Base Power level activated unless command is interrupted by ESC Do you want to load Values from EEPROM Y N _ If Y is selected tuning values from EEPROM are loaded If lt N gt is selected the values which the PC program normally uses when DSP is controlled are used ESC returns to the previous menu PC program values are tuning settings which are used for DSP control in the local mode C TX Power Tuning 1 Power Level Power Coefficient 0 617 569 530 499 rc 454 436 422 0 409 399 0 390 Test 0 015 real base level 0 275 GSM Version A Power Tuning Power Level Power Coefficient WER 671 O
313. nals and Connections Outputs Signal Name Signal description INTO INT1 Interrupts for DSP NMI Not maskable interrupt request IRQX Interrupt request RESETX Master power up reset CTRLU RFI DSP1RSTX Reset for the DSP DSPU SIMRESET Reset for the SIM SIMFLEX conn TXPWR TX Sa power enable Transmitter power control enable Main clock for MCU 26 MHz CTRLU Original 08 96 Page 2 35 RAE RAK 1N After Sales Baseband Technical Documentation Table 37 External Signals and Connections Outputs continued CODEC CLK POM data clock 512 kHz DSPU AU DIO PCMDATRCLKX Inverted PCM data clock 512 kHz DSPU used as input clock for Codec and DBUS interface SYNC Bit sync clock 8 kHz AUDIO PCMCOSYCLKX Bit sync clock 8 kHz inverted DSPU DCLK DBUS data clock 512 kHz DSPU DSYNC DBUS bit sync clock 8 kHz DSPU SIMCLK SIM data clock 3 25 1 625 MHz SIMFLEX Conn SIM power control SIMFLEX Conn Lines for keyboard column write B2B Conn Table 38 External Signals and Connections Bidirectional Signal Name Signal description To From DSPDA 15 0 DSP s 16 bit data bus MCUDA 15 8 MCU s 8 bit data bus RFIDA 11 0 RFI s 12 bit data bus UIF 6 0 LCD controller control and keyboard read bus B2B Conn SIMDATA Serial data from to SIM SIMFLEX Conn Block description PSL supplies the reset to the ASIC at power up The ASIC starts the clocks to the DSP and the MCU MCU
314. ndar day view 26 Figure 22 Calendar to do list 00 c cece eee eee eee 27 Figure 23 System main view 28 Figure 24 Extras Main view 30 Figure 25 ee EE 30 Figure 26 Extras clock main view 31 Figure 27 Extras clock world time 31 Figure 28 Extras composer uslussllseeeeleees 32 Figure 29 Document outbox age e een cl eer ES a a 32 Page 4 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Overview The NOKIA 9000 Communicator has two interfaces the phone interface and the communicator interface The word interface emphasizes the fact that of these two aspects of the NOKIA 9000 Communicator both use the same resources and work closely together they are not separate devices For example the phone interface uses names and phone numbers stored in the communicator interface s Contacts directory and the communicator interface uses the phone interface for communicating with the outside world for example sending receiving faxes and connecting to remote computers CE DO OOOO Soro E E33 GEJZ X628 cn a Gg DD COGO EH EE Vzys J ZE Figure 1 NOKIA 9000 Communicator The phone interface looks and operates like other NOKIA cellular phones except that the earpiece and microphone are located on the rear of the device The phone interface is switched on and off by pressing the button on th
315. ne If the right shift is used and the cursor is at the last position of the last line the cursor is not moved Similarly the cursor does not move with the left shift key when it is at the first position of the first line Moves the cursor to the start of the text Moves the cursor to the end of the text The backspace key has two different meanings depending on the editing mode eWhen the overstrike mode is activated the lt Backspace gt key moves the cursor back and changes the character under the cursor into a space If the cursor is at the first position of the first line nothing happens Amendment 1 04 97 Page 7 13 RAE RAK 1N Service Software Del F1 lt F4 gt Page 7 14 After Sales Technical Documentation e When the insert mode is activated the Back space key moves the cursor back and deletes the character under the cursor so that all characters after the deleted character are moved one position back If the cursor is at the first position of the first line nothing happens Has also two different meanings depending on the editing mode e When the overstrike mode is activated the Del key changes the character under the cursor into a space and moves the cursor forward If the cursor is at the last editing position of the last line nothing happens e When the insert mode is activated the Del key removes the character under the cursor so that all characters after the removedcharacter are
316. nes HI KEYS 9 0 3 2 Drives toggling KEYD 7 0 3 1 2 CPU fault 3 2 1 R112 R119 OK 4 All the keys pressed R120 R129 OK YES NO 3 1 3 EC test Fix the correspoding resistor 6 1 Start the Keyboard Test Start the keyboard test with the service software The test waits for a key press within the given time period 6 2 Press a QWERTY Softkey Press a key on the QWERTY keyboard or one of the soft keys of the PDA 6 3 Key Press Recognized If the key was recognized it prints the name of the key on the screen If a legal combination of keys are pressed simultaneously all the pressed keys are shown on the screen If the key press was not recognized then proceed to 6 3 1 otherwise go to 6 4 Page 8 34 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 6 3 1 6 3 1 1 6 3 1 2 6 3 1 3 6 3 2 6 3 2 1 6 3 3 6 3 3 1 6 3 3 2 Sense Lines HI KEYS 9 0 Pressing a key draws the sense line low from idle high state where it is connected in the keyboard matrix Therefore if no key is pressed all the KEYS sense lines should be in a logic high state Should this happen continue to 6 3 2 otherwise proceed to 6 3 1 1 R120 R129 OK Check the sense line pull ups If the resistors are OK then proceed to 6 3 1 2 otherwise go to 6 3 1 3 CPU fault If the pull ups R120 R129 are OK then it i
317. ng Y key The measurement will continue if N or Esc key is used When at least one measurement is completed and Esc key is used the user must answer the values saving question If Esc key is used the measurement is continued 3 2 8 Battery Voltage Adjustment This function needs 6 V battery voltage from external power supply When the function is activated the next window will be shown C Battery Voltage 1 fD converter value 608 uper Fi Help The operation is the same as in Charge Voltage calibration Page 7 32 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 3 3 Call Simulation Monitoring C Monitoring SE Monitoring 9395 Monitoring as Monitoring as Monitoring E Fi Help fi Mouve by Line Enter Select 3 3 1 TX Power Level All power levels GSM 5 15 PCN 0 10 can be selected This updates the same parameter as TX Power Level in the RF Controls menu Note that TEST value cannot be selected If TEST value was in use when Call simulation menu was selected power level is changed to the smallest value 3 3 2 Channel This displays the normal operating RF channel number Normal GSM channel numbers can be selected The same channel is used both for transmission and receiving this updates the same parameter as Channel in the RF Controls menu 3 3 3 Monitoring Channels Channels for monitoring are specified with these six sele
318. ng the device under test should be re booted and the normal usability of the GEOS along with the CMT module should be checked before the PDA can be considered to be fully functional Original 05 97 Page 8 11 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 1 Troubleshooting Diagram of the Power On Malfunction 21 2 T Check PLLDIV24 Check PDA PLL circuit ut OK power unit 3 3 1 B 313 Bus ac tivity Reset OK YES CPU fault D A R W CS 4 Check buzzer connections 5 Error beeps CPU related error beeps 6 Reboot and PING 5 1 2 from the PCLocals DRAM fault while in TestMode T TAD Respond to Program UCS PING from host Flash Power On 7 1 OK RS buffer actived 7 1 1 Valid Boot code in UC S Flash 7 1 3 7 2 CPU or UCS Activity in CPU Flash fault RxD0 NO 7 2 1 RS buffer fault 7 3 Activity in CPU TxD0 Page 8 12 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly 1 1 1 1 1 1 1 1 1 2 Vsys OK Start the Power On check by connecting the power supply to the target The power supply voltage limits are 5 8V min 7 2V nom 8 5V max The current consumption in a working PDA is typically about120mA If the Vsys is out of the limits 2 97V
319. ng their period The bursts appear at irregular time intervals If not go to 1 1 1 20 Check L81 V81 R77 R74 R85 Most probably V81 is broken Check and replace If not helping check L81 and R74 R85 These resistors provide current feedback information to the controller There should be seen increasing voltage spikes at peak magnitude of a little less than 300mV If yes L81 V81 R74 and R85 are OK Then check and replace V89 Is there valid bias voltage at C89 plus terminal Measure DC voltage over C89 It should be within 20V 24V at room temperature Measure also peak to peak AC voltage from 100ms sample It should be less than 100mV If not go to 1 1 1 22 If yes go to 1 1 1 23 Check V89 C89 and feedback resistors First measure voltage from N83 pin 3 It should be exactly 1 5V If yes replace C89 Also check C95 and V89 If not check resistance and replace if needed for resistors R84 R82 R78 R93 and R97 Also check C79 Check V87 V82 R95 R98 R94 The fault is that the regulator works correctly but the switch between the regulator and LCD module is broken This switch is needed to totally cut voltage from LCDVEE line First measure collector voltage of V87 It should be near OV If not check and replace V87 R95 and C98 If yes replace V82 Also check R94 and R98 05 97 Page 8 17 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 1 1 1 24 1 1 1 25 1 1 1 26 1 1 1 27 1 1 1 2
320. nit 2 00005 6 14 Connectors Out of Transceiver Un 6 16 Internal Signals and Connections ssa quedo ir da 6 17 Functional Description 252i Ae e AE E E EA 6 18 iio MERE 6 18 Clocking Scheme d die K dee Sek dg ENEE Ee ee ebe d 6 18 Reset and Power Management 6 18 PDA power management principle ooocooccoocoo 6 19 CMT power management principle 6 20 Battery charge level limits on CMT and PDA 6 21 A O E ww alee ae 6 23 PROCU AAA E E ered bo arao E EE EE ued ee pune area 6 25 Technical specifications sinu Pad iii 6 25 Block DSC eas o re ii e sede Doe ia EAR eas 6 26 Memory Map che gege deg geg eeh EP os eee 6 27 VO usage on EG CPU uiuere be ee nep ev BEE eg 6 34 WOMB APA AUN esae d Rie m puis Du Ib dog dara ales dde bal eel 6 35 eege AP E a E T EEE E 6 36 Main componhenls me sepe sud er RR Rm RR Ros ed nate 6 37 PDAPWRU EE 6 39 Technical Description dues umen user candor B ERAS 6 39 Functional Description i sese na hh nr RR nre m 6 41 Mam Re leie EE 6 44 SIRU e A O O 6 45 Introduction MEET 6 45 Technical Description 6 45 Main COMPOnENlS EE 6 45 Page 6 2 Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware List of Figures Page No Figure 1 PDA Interconnection diagram 6 6 Figure 2 Reset and power management block diagram 6 18 Figure 3 PDA power states from CMT point of view
321. nload connections JTAG PC is backup method for GP1 FLASH download Page 7 64 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 3 Flash Utilities This menu provides functions to access the PDA Flash memory TET 2 Program Flash Fron File 3 Save Flash to File 4 Erase Flash 5 Lock Flash 6 Flash Several Targets 7 JTAG Flashing Fi Help ti Moue by Line ESC Preuious Menu 3 1 Software Update This menu provides means to update the software in the PDA s Flash memory from a file on the disk in the host The user is expected to give the Name of the Update i e the name of the image file that will be programmed to the Flash memory of the target PDA The name of the file must be given without extension The service software gets the extensions of the header file and the image file from the PDA initialization file The Software
322. ns e Servicing and alignment must be undertaken by qualified personnel only Ensure all work is carried out at an anti static workstation and that an anti static wrist strap is worn e Ensure solder wire or foreign matter does not enter the telephone as damage may result Use only approved components as specified in the parts list e Ensure all components modules screws and insulators are correctly re fitted after servicing and alignment Ensure all cables and wires are repositioned correctly Company Policy Our policy is of continuous development details of all technical modifications will be included with service bulletins Original 05 97 After Sales Technical Documentation IMPORTANT While every endeavour has been made to ensure the accuracy of this document some errors may exist If any errors are found by the reader NOKIA MOBILE PHONES Ltd should be notified in writing Please state Title of the Document Issue Number Date of publication Latest Amendment Number if applicable Page s and or Figure s in error Please send to Nokia Mobile Phones Ltd After Sales Technical Documentation PO Box 86 24101 SALO Finland Original 05 97 After Sales Technical Documentation RAE RAK 1 SERIES SERVICE MANUAL ORDER FORM 7j Business Area Please indicate on the form below the booklets required for your Service Manual and the total number of manuals required Boo
323. nsceiver RAE 1Nx RAK 1NX Standard Battery Pack BLK 45 Fast Travel Charger ACH 3 Power Adapter Module PAR 1 PC Diskette connection software Windows User s Manual amp Quick Guide Packaging materials Security Code Envelope Accessories The following tables outline accessory part numbers and specifications Table 5 Batteries Name of battery Type code Material code Battery BLK 4S 0670153 730 mAh Li lon Table 6 Chargers Name of charger Type code Material Notes code Fast Travel Charger ACH 4E 0675008 Euro Mains voltage 200 240 V Fast Travel Charger ACH 4X 0675009 UK Mains voltage 200 240 V Fast Travel Charger ACH 4A 0675036 Australian Mains voltage 200 240 V Fast Travel Charger ACH 4P 0675065 Philippines Mains voltage 200 240 V Name of accessory Type code Material HF Junction Box 0694009 Table 7 HF Car Installation code Hands Free Speaker 0692005 Hands Free Microphone 0690009 Page 1 14 Original 08 96 After Sales RAE RAK 1N Technical Documentation Overview Table 7 HF Car Installation Name of accessory Type code Material code Power Cable PCH 4 0730009 External Audio Handset HSU 1 0640047 Swivel Kit MKR 1 0620033 Mounting Plate MKE 1 0650007 Installation Guide CARK 60 9385069 HF Car kit Table 8 Data and office accessories Name of accessory Type code Material code RS232 cable DLR 1
324. nsmit path includes 8 bit D A converters to generate the in phase TXI and quadrature TXQ signals RFI has differential outputs for TXI and TXQ The sample rate is 1 0833 MHz There is an 11 bit D A converter for automatic frequency correction AFC The sample rate is 1 3542 kHz Power ramp TXC is done with 10 bit D A converter The sample frequency is 1 0833 MHz This converter is also used for AGC during receive slots The PDATAO signal is used for LNA gain reduction in strong field conditions The rest of the AGC control is analog The analog AGC used in receive is multiplexed with the TXC signal used in transmit The RFI has 12 bit data bus to the ASIC The registers in the RFI are accessed using 4 address bits Control and clock signals are coming from the ASIC The RFI has external 4 096 V voltage reference Main components RFI ASIC physically in MCM2 4 096 V external voltage reference LM4040 V420 Original 08 96 Page 2 39 RAE RAK 1N After Sales Baseband Technical Documentation This page intentionally left blank Page 2 40 Original 08 96 After Sales Technical Documentation RAE RAK 1N Series Chapter 3 Transceiver GE8 GE9 RF Block Amendment 1 04 97 RAE RAK 1N After Sales RF Technical Documentation CONTENTS RF Page No IN PORUCHON Em 3 5 Technical Summary ooccocccccc eee eee eee eee 3 5 External Signals and Connections 3 5 Main Technical Specifications 3 6
325. nterface keyboard Fax sending and receiving is not possible if you already have an active voice or data call the call indicator is shown in the indicator area The Fax main view shows two folders Own texts and Received faxes and the Document Outbox which acts as a storage folder see User Guide for further information The Received faxes folder contains all received faxes and Own texts includes all created faxes short messages memos notes and user s mail Use scroll keys to select EI us Own texts We Write Fax 2 D t outb E L Document outbox Settings C D ag F ng Fax TH Received faxes HI Figure 9 Fax Main View Sending a New Fax Press Write fax Input fax information at the cursor prompt Style changes fonts and text sizes Press Recipient the Fax Directory is displayed Select C gt Anstaedter Jens Z M Bankers Enter d Bayer Anna number ES Cv Carr John Research Ltd Y S Recent numbers is Cancel gt Dekkert Manfred Travel agent Figure 10 Fax Directory To choose a recipient in the Fax directory select a contact by scrolling or searching The names of contacts who have no fax number are dimmed and cannot be selected Press Select Check the info shown is correct and press Send Page 18 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Sending a Fax from Own Texts folde
326. ntinued Signal Name Ping Wees DBUS received data from the accessories TDA 35 Transmitted DBUS data to the accessories 36 Serial bidirectional data and control between the CMT and accessories LID 38 Cover switch state from PDA to CMT EXTMIC 41 External audio input from accessories or 34 handsfree microphone Multiplexed with junc tion box connection indication 16 8k pull down in CMT EXTEAR 42 External audio output to accessories or hands free speaker 100kQ pull down in CMT to turn on the junction box AGND 43 Analog ground for accessories Connected directly to digital ground on the PCB Table 16 PHF speaker connector Signal Name ms nos PHFEARN 1 PHF speaker negative node PHFEARP 2 PHF speaker positive node Table 17 SIMFLEX Connector Sollen Pin Nos Differential audio for the earpiece SIMCLK 6 Clock for SIM data SIMRESET 7 Reset for SIM VSIM 8 SIM voltage supply SIMDATA 9 Serial data for SIM MICN 11 Differential audio from the microphone MICP 12 Original 08 96 Page 2 15 RAE RAK 1N After Sales Baseband Technical Documentation Connectors out of Transceiver Unit Table 18 Battery connector Signal Name Pn Notes y O BGND 1 Battery ground TBAT 2 Battery temperature BTYPE 3 Battery type Battery voltage Internal Signals and Connections Table 19 Signals Between RF and D2CA ASIC MCM2 SewiName Die metes SCLK Syn
327. ntrol data transmitting XSELPCMC Chip select for audio codec MBUS TX data open drain B2B Conn Table 25 External Signals and Connections Bidirectional Signal Name Signal description MCUDA 15 8 MCU s 8 bit data bus ASIC Page 2 22 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Block description MCU Memories The MCU has a 20 bits wide address bus A 19 0 and an 16 bit data bus with memories The address bits A 19 13 are used for chip select decoding The decoding is done inside the SCL in CTRLU submodule Hitachi HD6475388 processor has internal ROM and RAM memories Memory Map Table 26 Memory Map PAGE ADDRESS FPAGE 1 0 00 FPAGE 1 0 01 FPAGE 1 0 10 INTERNAL ROM 60 Kbytes 16 bit EXTERNAL ADDRESS SPACE INTERNAL RAM 2 Kbyte 16 bit REGISTER FIELD 384 bytes RAM 64 Kbytes 16 bit FLASH 640 Kbytes 16 bit FA 19 17 001 101 FLASH FLASH FLASH 128 Kbytes 16 bit 128 Kbytes 16 bit 128 Kbytes 16 bit FLASH page 0 FLASH page 1 FLASH page 2 FA 19 17 110 FA 19 17 111 FA 19 17 000 SRAM 56 Kbytes 16 bit EEPROM 8 Kbytes 8 bit ASIC 26 bytes 8 bit Original 08 96 Page 2 23 RAE RAK 1N After Sales Baseband Technical Documentation Table 27 Chip Select Generation A15 A14 A13 CHIP SELECT NOTES X SRAM page 1 32K x 16 bit area 0 SRAM page 14 28K x 16 bit area 0 X SRAM page 14 X
328. ntrollers Disable Port B and video display Initialize chipset and start auto memory detect Test 8254 Timer2 for speaker Port B Test 8254 Timer1 for refresh Test 8254 TimerO for 18 2Hz Start memory refresh Test 15 us refresh ON OFF time Test memory refresh Test address lines Base 64kB memory read write test System initialization before vector table init Initialize vector table Check ROM BIOS data area at segment 40h Prepare virtual memory test verify from display memory Enter virtual mode for memory test Initialize data for checking wraparound at 0 0 Clear extended memory for soft reset Save memory size Save registers amp memory size enter real mode Disable A20 line Initialize interrupt controllers Initialize circular buffer Check for memory size mismatch CMOS BIOSDATA Configure floppy drives Set base amp extended memory sizes Memory size adjusted for 1k verify display memory Initialization before calling C800h Call ROM BIOS extensions at C800h Processing after extension returns Configure timer data area Enable NMIs Page 8 43 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation This page intentionally left blank Page 8 44 Original 05 97 After Sales Technical Documentation RAE RAK 1N Series Chapter 9 Service Tools Original 08 96 RAE RAK 1N After Sales Service Tools Technical Documentation CONTENTS Service Tools Page No itii ele o EE 9 3 BTD
329. o TE 7 7 Required Servicing Equipment 7 7 TeShti FUNCHONS EE 7 8 Mechanical Connections 4 Nd Ee E RE Poe mitior e we bees 7 8 Loading the Software hc e NN Ee NEE dene EENS ANNER er RE RAE exa 7 9 Complete Menu Structure 7 10 CMT Menu Structure Testing and Adjustment 7 11 CMT Menu Structure ME Short Code Memory 7 12 Using Memes T 7 12 Help PUNCHONG MMC 7 13 Text Editing WindOWS d sexe ro RR EET xeu ee abe ere M 7 13 CMT Menu Commands amp sseecosesuterteFmbeu sE e Rem cue 7 15 USPC Soup EE 7 16 2 Initialize TE 7 17 3 Testing and Adjustments LLuuussluussuuss 7 18 3 HF Contlals oces sto tea ue bh mars E ge ee 7 18 Sh ACIVe D Scr 7 20 3 1 2 TX Power Level 152 ur ERU ET Resp ae ere e es 7 20 3 1 3 Operation Mode 7 21 3 1 4 TX Data Type esseseseeeeel lee 7 21 3 1 5 Continuous Mode Channel LLusuuus 7 21 3 1 6 Channel MOD 7 21 3 1 7 Channel Monitoring Channel lusu 7 21 BU eso TPE Dei ada did dior dao qa ela E ure ie 7 21 cw Ron cf 7 21 3 2 Adjustments ieu seem ee NR ANEREN da ER RE RE RE Ex 7 22 3 2 1 Continuous Mode Channel 7 22 3 2 2 TA Power Tuning duas BN E Ee RN sd Seen ERE e de e 7 23 22 50 UK VS TURING WEE 7 25 3 2 4 RSSI Calibration 00 cee ee 7 28
330. o module CMT In addition the CMT baseband contains multichip modules MCM that are in fact submodules but should be considered as components for the CMT unit The LCD module GK2 consists of a CMT U I module and a graphic LCD module for the PDA GK2 contains an insert for an antenna this Antenna is by default a helix with a joint but can be replaced with a whip type The CMT and PDA modules are assembled inside the same covers and connected via a board to board connector The LCD module and antenna are installed in the lid part which is in turn connected to the main part with a hinge the LCD module being connected to the PDA module through the hinge with a flexible flat cable The antenna is connected to the CMT module via coax cable The SIM flex module contains the SIM card holder the buzzer and the standard handset acoustic components i e microphone and earpiece on a flex carrier Handsfree audio components i e microphone and speaker are assembled in cavities in a magnesium chassis and connected on the PDA via a pair of cables In addition the NOKIA 9000 has a dedicated attachable Li lon battery and contains 2 cells with 730 mAh capacity 1Q 96 plus necessary protection circuitry with external connector The CMT module is covered by EMC EMI shields i e magnesium chassis and metallized plastic shield of which the chassis is also extended to cover critical parts of the PDA module e g switched mode power supply SMPS
331. om the 9000 The external IR tranceiver should be connected to the other serial port where the DLR 1 cable is connected Sent Byte Received OK If the service software can receive the byte sent continue to 7 3 otherwise proceed to 7 2 1 IRSHD RSENX RSSHDX OK When the byte is sent it toggles the RSENX from logic low to high RSSHDX at the same time from logic high to low and after few milliseconds the IRSHD from logic high to low If these signals do not toggle correctly proceed to 7 2 1 1 If the signals are OK then go to 7 2 2 M180 pins 2 6 7 Disconnected To isolate a problem with the IRSHD RSENX and the RSSHDX that does not control the RS buffer and the M180 IR tranceiver module correctly disconnect the control signals from the M180 If the pins are connected continue to 7 2 1 2 otherwise go to 7 2 1 3 Disconnect M180 pins 2 6 7 By doing this the control signals can be isolated to the RS buffer or to the CPU Go back to 7 2 1 RS Buffer Fault If the control signals do not toggle to the right state even though the IR tranceiver is isolated then the fault is most likely in the RS buffer D180 However it is possible that the CPU does not control the lines But since the RS buffer is needed for the communications to the host it can not be tested if the control signals are disconnected between the CPU RS buffer RSTXD Activity If the byte is already sent to the IR tranceiver then the RSTXD l
332. on Oo CTRLU Control Unit for phone PWRU Power supply and charging electronics ASIC RF baseband interface analog signals The above blocks are only functional blocks and therefore have no type or material codes Physically the baseband contains two submodules MCM1 and MCM2 which utilise COB chip on board packaging technology The MCM 1 contains the 7 ICs in the CTRLU submodule plus bypass capacitors and some resistors Original 08 96 Page 2 5 RAE RAK 1N After Sales Baseband Technical Documentation The MCM 2 contains the 6 ICs in DSPU AUDIO ASIC and RFI submodules plus bypass capacitors and some resistors The PWRU module is laid out in the CMT board using conventional SMD assembly The rest of the functional modules are partly packaged in the MCM s and partly SMD assembled on the CMT board In the latter description of the modules the functional partitioning will be used Table 2 List of Physical Submodules Name of submodule MCM1 Contains MCU SCL 2xFLASH 2xSRAM and EEPROM MCM2 Contains DSP 2xSRAM ASIC RFl and CODEC Interconnection Diagram MCM2 12 bit parallel DBUS e 8 x control mic extmic PHFmic UIF controls ear eg Ly SIM controls extear sg ee A 4 0 A 19 16 amp_pwr D 15 8 A 19 0 D 15 0 A 19 13 A 16 1 A 12 0 PHFear 5t 5 Das CHRGR 64K x 16 E2PROM RBUS lt lt SRAM 8K X 8 MBUS
333. on from the service software to the PDA Activate the testmode pin of the PDA Select a menu from the software that pings the target and then reboot the PDA Pinging the target sends bytes 55h to the PDA via the serial RXD and waits for a response byte AAh from it via the TXD Respond to PING from the Target If the target PDA respond to the host s request the Power On procedure has succeeded and further tests can be carried out by proceeding to the uppermost level of the fault finding tree If no acknowledge is received then proceed to 1 7 1 HG Butter Activated If the service software cannot receive the acknowledgement then the fault can be in the CPU D130 in the boot code that is located in the UCS Flash device D163 or in the connection between the CPU and the host PC Original 05 97 Page 8 21 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 1 7 1 1 1 7 1 2 1 7 1 3 1 7 2 1 7 2 1 First check the connection During startup the CPU D130 enables the RS buffer MAX3222 D180 by setting the RSENX D180 pin1 low RSSHDX D180 pin20 high and the IRSHD M180 pin6 high The signals RSENX and the RSSHDX are toggled for the period of time that the CPU waits for a ping from the host typically 3 5s Check if this happens and whether the signal levels are OK If the signals are OK then proceed to 1 7 2 If the CPU does not control the lines correctly then proceed to 1 7 1 1 V
334. onitoring signals Pin Type Line Symbol Minimum Typical Maxi Nominal mum 11 SIMFLEX MICN 12 SIMFLEX MICP Unit Notes Differential 3 SIMFLEX 4 SIMFLEX EARN EARP Differential RL 329 3 B2B 4 B2B PHFMICN PHFMICP Differential 1 PHF 2 PHF PHFEARP PHFEARN Differential RL 8Q 41 B2B EXTMIC minimum DC level 2 0V 42 B2B EXTEAR minimum DC level 2 0V Page 2 10 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband AC Characteristics Table 6 Audio Signals Pin Type Line Symbol Minimum Typical Unit Notes Nominal 11 SIM Differential FLEX 12 SIM FLEX 3 SIMFLEX EARN 1 965 Vims Differential 4 SIMFLEX EARP D 320 3 B2B PHFMICN 19MVims Differential 4 B2B PHFMICP PHFEARP 2 8 Vims Differential PHFEARN RL 89 EXTMIC 530 MVims minimum DC level 2 0V EXTEAR 410 MVims minimum DC level 2 0V Table 7 Handportable audios microphone HPMIC NOTES 1kHz rms MRP pressure 3 dBPa 5 cm from MIC MIC pressure 2 dBPa about 5 dB attenuation MIC output mic sensitivity 64 dB 6 3 mV Pa 0dB 1V uBar 1uBar 0 1Pa 29 dB Fixed 20 dB programmable 0 22 5 dB Level 11 dBmO 140 0 dBmO 490 mV mVrms Table 8 Handportable earpiece Level 6 0 dBmO 980 0 dBmO 1965 mVrms mVrms Codec gain 18 dB nominal 18 dB atten Controllable 0 30
335. ontact information in the form of Contact cards Contacts directory Open CD Aaltonen Jukka ABC Design Co Anstaedter Jens Z amp M Bankers New CD Bayer Anna Carr John Research Ltd Chaung Cari Business Plc Logs C gt Dekkert Manfred Travel agent CEN OS Search Settings C 7 Figure 6 Contacts Directory The main view shows the Contacts directory This is a list of all Contact cards and are listed in alphabetical order according to the first name in each Contact card s Name field To create a new Contact card press New in the Contacts main view To open an existing Contact card locate the card you want to open and press Open When the card you are searching for is shown select it with the selection frame and press Open Contact Cards Contact card Fields J gt q ui NOM NA UM NNNM MM Speed CAO dob Title ee dials a ag GE ee lete O Close 0000 Figure 7 Contact Card To edit or fill in a card use the keyboard and arrow keys Fields is for adding extra fields or editing modifying and deleting them Speed Dials is for setting quick dialling to a contacts number It is only functional from the Phone interface To delete a card open it and press Delete card Page 16 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Telephone GD ES gt Tel is used for making and receiving voice calls and adjusting the Telephone settings
336. op filter The output signal is used for the 2nd and 3rd in PCN mixer of the receiver and for the UO modulator of the transmitter Table 17 VHF PLL specification Typical Parameter Maximum Unit Notes Nominal Praseeror S 1 jm Sidebands 200 kHz 400 kHz 1 MHz 2 MHz 3 MHz gt 4 MHz VHF VCO buffer The VHF VCO uses a bipolar transistor as a active element and a combination of a chip coil and varactor diode as a resonance circuit The buffer is combined into the VCO circuit so that they use same collector Current Amendment 1 04 97 Page 3 23 RAE RAK 1N After Sales RF Technical Documentation Table 18 VHF VCO buffer specification Parameter Typical Maximum Unit Notes Nominal Control voltage Supply current Operation frequency Output power level MVrms 1 kohm Control voltage sensitivity GSM MHz V PCN MHz V Phase noise GSM PCN fo 25 kHz fo 200 kHz dBc Hz fo 1600 kHz dBc Hz fo 3000 kHz dBc Hz Harmonics dBc UHF PLL The UHF PLL consists of a UHF VCO divider PLL circuit and a loop filter The output signal is used for the 1st mixer of the receiver and the upconversion mixer of the transmitter In PCN the VCO changes the frequency according to the RX TX mode change Table 19 UHF PLL specification Parameter Typical Maximum Unit Notes Nominal EE eg Settling time 93 MHz GSM 525
337. osing this menu the user can write a command that will be executed in the target s DOS Amendment 1 04 97 Page 7 57 RAE RAK 1N After Sales Service Software Technical Documentation 6 Product Information This menu provides functions to access the production and the service information of the PDA 1 Get To 2 Read Version Production Code 3 Read Production Number 6 1 Get Target Info This menu shows additional information of the target itself All the information is not necessarily supported by both TestModes 6 2 Read Version This menu returns either the Production Code Hardware version or the Software version of the target User options are Name default Production Code Range Production Code Hardware Software The output from the target shows the following The enquired information 6 3 Read Production Number This menu returns the Production Number The output from the target shows the following The production number Page 7 58 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 7 Complete Test This menu provides functions to perform various test with default parameters automatically Any of 9 different tests maybe included or excluded to the test series Choosing the Start Testing starts the automatic test sequence Menory Test Enable Disable ENABLED Get POST Code Enable Disable ENABLED Test Flash Enable Disable
338. out PCN R34 d RAS Tm V40 R32 Amendment 1 04 97 x010 R30 R31 V38 V18 J V16 VI V26 v20 V24 V22 4 V23 x001 29 V21 V19 R13 R15 R16 R11 R21 R20 R2 RAK 1N V28 d J II xO20 Y J 4 V30 I C SE R36 RIL vae 25 Q 29 X055 LO O Ls lo Q 8 UE pa Tig iB A MN E sls 21 8 O amp a y of fle O C o e a Page 10 25 RAE 1N
339. ow eje fe keys Keyboard Figure 5 PDA Layout Original 08 96 Page 13 RAE RAK 1N After Sales Quick Guide Technical Documentation Scroll Keys Whenever the selection frame is shown you can select items by moving the selection frame with the scroll buttons Arrow Keys As above some applications employ these keys for special functions Application buttons The row of buttons at the top of the keyboard starting from Tel activate the corresponding applications Keyboard Keys ESC cancels an action as does the Cancel key The ESC key can only be used when Cancel is among the available commands All information notes shown on the display can also be dismissed with the ESC key instead of pressing the OK command SHIFT plus a letter key inserts an uppercase letter in front of the cursor The SHIFT key does not need to be held down when pressing a key once you have pressed the SHIFT key the next key press always generates a shifted character CTRL pressed together with certain keys generates shortcut commands which can be used in most viewers and text editors CHR Some of the numeric keys have a third character printed on them pressing CHR and the key inserts the third character in front of the cursor The CHR key also generates other special characters not shown on the keyboard see Notes Editing in the User Guide ENTER When in a document or note adds a new line When in the Cont
340. ox and a DSP mailbox MCU writes data to DSP mailbox where DSP can only read the incoming data In MCU mailbox the data transfer direction is the opposite When power is switched on the MCU loads data from the flash memory to DSP s external memory through this mailbox CTRLU AUDIO When the the chip select signal XSELPCMC goes low MCU writes or reads control data to or from the speech codec registers at the rate defined by PCMCLK PCMCDI is an output data line from MCU to codec and PCMCDO is an input data line from codec to MCU The AMP PWR signal is used for switching the Personal Hands Free amplifier between On and Standby modes CTRLU RF BATTERY Monitoring MCU has internal 12 channel 10 bit AD converter Following signals are used for monitoring battery charging and RF BTYPE battery size TBAT battery temperature VBATDET battery voltage VC charging voltage TRF RF temperature CTRLU Keyboard and LCD Driver Interface MCU and User Interface communication is controlled through ASIC Original 08 96 Page 2 25 RAE RAK 1N After Sales Baseband Technical Documentation CTRLU ACCESSORIES MBUS is used to control external accessories This interface can also be used for factory testing and maintenance purposes There are also some control and indication signals for the accessories JCONN is used to indicate that junction box is connected JCONN is actually the DC level of the EXTMIC signal Phone can al
341. p 100p 5 96 50 V 0402 C331 2320536 Ceramic cap 10p 5 96 50 V 0402 C332 2320620 Ceramic cap 10n 5 96 16 V 0402 0333 2320536 Ceramic cap 10p 5 50 V 0402 C340 2320560 Ceramic cap 100p 5 96 50 V 0402 C341 2320560 Ceramic cap 100p 5 96 50 V 0402 C342 2320560 Ceramic cap 100p 5 96 50 V 0402 C343 2320560 Ceramic cap 100p 5 96 50 V 0402 C345 2320560 Ceramic cap 100p 5 96 50 V 0402 C346 2320552 Ceramic cap 47 p 5 96 50 V 0402 C347 2320560 Ceramic cap 100p 5 96 50 V 0402 C348 2320560 Ceramic cap 100p 5 96 50 V 0402 C349 2320560 Ceramic cap 100p 5 96 50 V 0402 C350 2320560 Ceramic cap 100p 5 96 50 V 0402 C360 2320544 Ceramic cap 22p 5 96 50 V 0402 C361 2320560 Ceramic cap 100p 5 96 50 V 0402 C362 2320560 Ceramic cap 100p 5 96 50 V 0402 C363 2320560 Ceramic cap 100p 5 96 50 V 0402 C380 2320560 Ceramic cap 100p 5 96 50 V 0402 C381 2604209 Tantalum cap 1 0u 20 16 V 3 2x1 6x1 6 C382 2320604 Ceramic cap 18p 5 96 50 V 0402 C383 2320604 Ceramic cap 18p 5 96 50 V 0402 C384 2320131 Ceramic cap 33n 10 96 16 V 0603 C385 2320131 Ceramic cap 33n 10 96 16 V 0603 C386 2320131 Ceramic cap 33n 10 96 16 V 0603 C387 2320131 Ceramic cap 33n 10 96 16 V 0603 C388 2320131 Ceramic cap 33n 10 96 16 V 0603 C389 2320560 Ceramic cap 100p 5 96 50 V 0402 C390 2320560 Ceramic cap 100p 5 96 50 V 0402 C391 2320560 Ceramic cap 100p 5 96 50 V 0402 C392 2320560 Ceramic cap 100p 5 96 50 V 0402 C393 2320560 Ceramic cap 100p 5 96 50 V 0402 C394 232013
342. p RFI bupass cepacitors r MCM2 oin 8 Place noa MEMS g SYNTHPWR VLI GE SES s S 3 A M 100k E j I vL2 100k Tla t gt pF IREF ogee 4 91 EN T 0420 0421 C422 E C423 fC C404 E c 8 3 T TROF g J gt feo Ta 110 irre io alie L Tr RFIREF added 2 2 1995 ICTSQOE oul 061 conl ap Dr ep ox 0320 P c321 P 0322 P c323 P ca24 P c325 P P E e m i fr nf on 1 oND oft ond d r ono Pin 9 Pin 8 Pin 116 I SS ES FROM RFC C gt 85 54L1 if MCUCLK eh BEE zap PCM DD C360 1 400 RESETX 3n9 MEN z MCN2_02 NL ela AFC 115 vi C302 so GND Tee TXC R330 68R 1 3n9 m ANEREN TXQP T ell CND 150R l EH Ee TN L4 Res SIME SET s a GND 2 A E l SIE TXIP VSIM XT r3 l 3 CHRDET TXIN IAS SIMDATA Ee R309 e 96 xere PDATAO 113 100R v2 d Jup 22k OUT E DTAII4EE 8 JRFIREF sek 15 SIM connect or g um T SUE EEN SDATA E 330 4 I FROM PWRU SENAI 21 08 gt casi d SH cl gxeug 27 100 Ed GSM 307 c304 c30s 100k TXPWR 18 GND GNI LL 39k LJ Ze jl V301 R309 13 rcg SYNTHPUR 5 LOND 100K 6300 if aur Ak i 11 exo Typ 20 WE Jon LSND 100p L 10 ex1 rROM TO RF vencaP _ 7 l SEN L300 C305 V460 22p 470n 6 1 EgAMu1 100 R333 2 OsPADic 99 BASTO 07 1 WCS Aet Ike c 3 V460 B LL pin 4 p vp ea Ls ae DSPCKP DSPCLKEN 88 K EE R334 Q R312 0 S u C307 C308 0309 DSPCKN E R335 3k3 E 00 47k 00 DSP CLK GEN BAS70 07 eno i de d A n ai las R311 RSTROBEX NMI 40 100k 0332 10k 2 2 Lo
343. p X e A v ER A E Wii z AE V tg LU y dni Had gt Bete SW A i 83 3 332 Pv Ll eee eee JN o A gt Figure 4 RF Functional Block diagram Page 3 11 Amendment 1 04 97 RAE RAK 1N After Sales HF Technical Documentation Frequency Synthesizers The stable frequency source for the synthesizers and base band circuits is discrete voltage controlled crystal oscillator VCXO in GSM and PCN The frequency of the oscillators is controlled by an AFC voltage which is generated by the base band circuits The VCXO is always running when the CMT is powered up The nominal frequency is 26 MHz in GSM and PCN The UHF PLL generates the down conversion signal for the receiver and the up conversion signal for the transmitter The VHF PLL signal divided by 4 in CRFRT is used as a local oscillator for the last mixer Directly it is used as a second local oscillator in PCN The VHF PLL signal divided by 2 in CRFRT is also used in the I Q modulator of the transmitter chain The VHF VCO is made of discrete components Transmitter The TX intermediate frequency is modulated by an l Q modulator contained on transmitter section of CRFRT IC The TX and Q signals are generated in the RFI interface circuit and they are fed differentially to the modulator Modulated intermediate signal is amplified or attenuated in temperature compensated controlled gain amplifier TCGA The output of the TCGA is amplified and the output level
344. pass filter and attenuator before the earphone output All these are inside the codec The ASIC generates the 512 kHz and 8 kHz clocks for the codec and data transmission between the codec and the DSP The audio codec communicates with the DSP digital speech through an SIO signals PCMIN SYNC CODEC CLK and PCMOUT The MCU controls the audio codec function through a separate serial bus signals PCMCDO PCMCDI PCMCLK and XSELPCMO The PHF power amplifier can be enabled or disabled using the AMP_PWR signal from the MCU The power amplifier is enabled only when needed due to power consumption reasons Original 08 96 Page 2 33 RAE RAK 1N After Sales Baseband Technical Documentation The codec generates DTMF tones key beeps to the earphone and in PHF mode to the PHF speaker When an external audio accessory is used the DTMF tones are directed to the external audio output In handportable and PHF modes the codec generates ringing tones and also some warning tones to the PHF speaker In external HF mode they are driven to the external speaker line Some tones come also from the network One codec output pin is used to switch on off the microphone bias circuit Both microphones are biased simultaneously regardless of which one is actually used External microphone line is used also to detect if the junction box is connected to the bottom connector Microphone signal is therefore low pass filtered and routed to the MCU A D converter na
345. peaker plus a SIM connector Flex Connector Figure 1 SIM Flex components Technical Specification DC Characteristics Table 1 Supply Voltages Pin Line Symbol Connec tor 1 SIM BUZZ1 8 SIM VSIM 4 95V SIM card reader supply voltage Original 08 96 Page 5 3 RAE RAK 1N After Sales SIM Flex Technical Documentation Table 2 Digital Control Signals Pin Line Symbol Connec tor 2 SIM BUZZ2 Input low buzzer on Pe S AN Input high buzzer off 6 SIM SIMCLK State 1 Clock for 7 SIM SIMRESET Output high Reset for dull 9 SIM SIMDATA State 1 Data for p PTT Kei External Signals and Connections Table 3 From CMT Module Signal Name Pin Conn M Nodes 12 Microphone positive node 11 Microphone negative node Table 4 SIM Connector Signal Name Pin Gonn oes SIMCLK 1 Clock for SIM data SIMRESET 2 Reset for SIM SIMDATA 6 Serial data for SIM VSIM 3 5 SIM supply voltage GND 4 Ground Page 5 4 Original 08 96 After Sales RAE RAK 1N Technical Documentation SIM Flex AC Characteristics Table 5 Audio Signals Pin Line Symbol Minimum Typical Maximum Unit Notes Connector Nominal 5 mVims 19MVims Differential 124 MVims 1 965 Vims Differential Ry 3202 Functional Description Main Components Audio components The flex has three audio components microphone earphone and buzz
346. pped with Reset Power down pin RP which can be used to place devices in a Deep PowerDown state RP pin of two XIP FLASH devices is connected to SUSPEND pin of E3G SUSPEND pin is active when E3G is in SUSPEND mode and internal PLL s are not runnig RP pin of the FLASH device under TFFS is connected to a GPIO pin and itis controlled by TFFS TFFS and RS232 flash download softwares are able to control 5V power supply powerdown There is 100us delay needed between 5V power up and write command 1 Mbyte of address space is directly addressable by the CPU conventional memory Any additional memory is accessed via Expanded Memory System EMS EMS system follows LIM 4 0 specification Memory Map Table 18 Memory Map Interrupt Vector DOS data DRAM GEOS heap DRAM True FFS data DRAM BIOS data DRAM Video buffer DRAM EMS page 0 True FFS amp GEOS ROM disk EMS page 1 XIP page 2 EMS register Original 08 96 Page 6 27 RAE RAK 1N After Sales PDA Hardware Technical Documentation Table 18 continued Memory Map EMS page 2 XIP page 1 EMS register EMS page 3 Fixed GEOS XIP EMS register GEOS XIP XIP FLASH 1 Double mapped area ROM DOS XIP FLASH 1 Double mapped area True FFS XIP FLASH 1 Double mapped area OFC000 BIOS XIP FLASH 1 OFFFFF Double mapped area 100000 SWAP RAMDISK Uppermost meg of DRAM 1FFFFF SWAP RAMDISK DRAM Roll Over T
347. put high keypad row read write strobe for LCD driver Original 08 96 After Sales Technical Documentation Line Symbol 0 7V Output Input low 29 UIF UIF5 4 e 3 7 B 4 85V 5 0V Output Input high 0 7V Output Input low 30 UIF UIF6 OV 4 7V 32 test DCLK 3 6V OV 33 test DSYNC 3 6V OV 34 test 3 6V V V V 7V 6V 0 3 0 4 85V 5 0V Output Input high State 1 State 0 State 1 State 0 State 1 State 0 State 1 1 mA load State 0 Input low level Input high level o lt MBUS 0 3 0V 3 6V 38 PDA LIDOPEN 2 735 0 35V Output low level 4 85V 5 0V Output high level RD 8 1 Nominal voltage will be Original 08 96 State 1 0 2V State 0 4 75 5 V RAE RAK 1N PDA Hardware keypad row LCD driver register select enable strobe for LCD driver DBUS clock 512 kHz DBUS sync 8 kHz DBUS trans mitted data from 9000 Isink lt 5mA Baud rate 9600 bits s or double Lid status for CMT module Page 6 9 RAE RAK 1N PDA Hardware Table 4 DC characteristics of system connector signals VCHARGER After Sales Technical Documentation Charger voltage Input low level Input high level Output low level j Output high level 4 TESTMODEX EM 3 635 State 1 V SYSTxD 50v 73V Output high level V SYSRxD pev ew Input low level Isink lt 5mA
348. r To send your own text as fax Select the Own texts folder in the Fax main view and press Open Select a document and press Open Press Recipient to access the Fax directory select a contact Press Select Check the info shown is correct and press Send Sending from Received Faxes folder To forward on a received fax Select the Received faxes folder in the Fax main view and press Open Select a fax and press Open Press Forward to access the Fax directory select a contact Press Select Check the info shown is correct and press Send Receiving Faxes Faxes are received automatically When a new fax has been received you will hear a beep unless the system is set to silent service mode and an information note is shown on the screen Received faxes go automatically in the Received faxes folder Unread received faxes are marked with an icon To rename or delete the selected fax open the Received faxes folder and press Rename or Delete To view a received fax open the Received faxes folder select a fax and press Open the fax viewer opens Use the scroll or the arrow keys to scroll the fax up down or horizontally Where is the meeting For y Lorem ipsum dolor sit amet consectetuer adipis war cing elit sed diam nonummy nibh euismod tin cidunt ut laoreet dolore magna aliquam erat volut View CD pat Ut wisi enim ad minim veniam quis nostrud exerci tation ullamcorp er suscipit lobortis nid ut aliquip e
349. r 100 k 5 0 063 W 0603 R018 1430087 Chip resistor 100 k 5 0 063 W 0603 R019 1430087 Chip resistor 100 k 5 0 063 W 0603 R020 1430087 Chip resistor 100 k 5 0 063 W 0603 R032 1430087 Chip resistor 100 k 5 0 063 W 0603 R033 1430165 Chip resistor 39 5 0 063 W 0603 R034 1430165 Chip resistor 39 5 0 063 W 0603 R035 1430165 Chip resistor 39 5 0 063 W 0603 R036 1430165 Chip resistor 39 5 0 063 W 0603 C003 2307816 Ceramic cap 47n 20 96 25 V 0805 C004 2307816 Ceramic cap 47n 20 96 25 V 0805 C005 2307816 Ceramic cap 47n 20 96 25 V 0805 C006 2307816 Ceramic cap 47n 20 96 25 V 0805 C007 2307816 Ceramic cap 47n 20 96 25 V 0805 C008 2307816 Ceramic cap 47n 20 96 25 V 0805 C009 2307816 Ceramic cap 47n 20 96 25 V 0805 C029 2310375 Ceramic cap 39 p 5 96 50 V 0805 C025 2320043 Ceramic cap 22p 5 96 50 V 0603 Amendment 1 04 97 Page 45 RAE RAK 1N Parts Lists C026 2320043 C027 2320043 C028 2320043 C011 2320107 C001 2604248 C002 2604248 C010 2604431 L002 3643041 L001 3643043 V036 4111824 V040 4200811 V041 4200836 V042 4200836 V043 4200836 V044 4200836 4850038 V011 4864388 V012 4864388 V013 4864388 V014 4864388 V015 4864388 V016 4864388 V017 4864388 V018 4864388 V019 4864388 V020 4864388 V021 4864388 V022 4864388 V023 4864388 V024 4864388 V026 4864388 V027 4864388 V028 4864388 V029 4864388 V030 4864388 V031 4864388 V032 4864388 V033 4864388 V034 4864388 V038 4864388 S036 5200120 X035 5429003 Page 46 Cera
350. re 4 Amendment 1 04 97 Page 3 7 RAE RAK 1N RF CRFCONT 44V5 TX VHLO TX buffers VHF LO GSM 13 mA GSM 8 mA PCN 21 mA PON 17 mA Page 3 8 vee d al HU ANA Battery 7 2V min 5 7 V VPLL UMA1018 Negat volt 18 5 mA Power distribution diagram Power Amplifier After Sales Technical Documentation 2 mA VCXO di q VREF 4 TXP GSM 1300 mA PCN 900 mA 4 TXPWR 4 RXPWR VTX CRFRT VTX CRFRT VTX slow GSM 18 mA 39 mA PCN 31 mA VRX CRFRT VRX 35 mA CRFRT VB ext ad See d VREF PSL Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation RF Control Signals In the following tables Table 2 3 4 the RF current consumption can be seen with different status of the control signals The VCXO current is not included in the results Table 2 Control Signals and Current Consumption GSM PCN SYNTHPWR RXPWR TXPWR TXP Typical load current mA Leakage current Synthesizers active Reception TX active Transmission GSM Transmission PCN Amendment 1 04 97 Page 3 9 RAE RAK 1N After Sales RF Technical Documentation Functional Description Receiver The GSM receiver is a double conversion receiver The PCN receiver has three conversions The received RF signal from the antenna is fed via a duplex filter to the receiver unit The signal is amplified by a discrete lo
351. red setting and press Change options are self explanatory Original 08 96 Page 29 RAE RAK 1N After Sales Quick Guide Technical Documentation Extras CD QD QD GD QD Ge GD Cr ES The Extras application group contains Calculator Clock Composer Future communicator add on software will also be installed in the Extras application group Extras Select QD Clock J Composer Figure 24 Extras main view To start one of the applications scroll to an application and press Select If one Extras application is active you must close it by pressing Close before you can start another Calculator The calculation is entered from the keyboard into the entry field at the bottom of the screen Press Enter to perform the calculation previous calculations are shown in the list above the entry field The list can be scrolled with the scroll keys and cleared by pressing Clear list 24521 60 12 720 C 5 5 25 23 5 7 5 12 97 0 3 23 5 7 5 12 97 143608 5 E 4 23 45 674 8904 1 24 324 43 54 65 76 87 A 98 32 21 1536 Clear list 1234456 0 0000 Close Figure 25 Extras calculator Page 30 Original 08 96 After Sales RAE RAK 1N Jl Technical Documentation Quick Guide Clock The Clock shows the time and date in your home city and country as well as in several other cities and countries throughout the world The Clock also includes an alarm clock The system time an
352. riginal 08 96 Page 2 29 RAE RAK 1N After Sales Baseband Technical Documentation frame structure control control of operations during a TDMA frame with ASIC control of multiframe structure channel configuration control data functions RLP CRC calculation fax V110 frame encode decode test functions functions for RF measurements debugging functions for product development Technical description Table 31 External Signals and Connections Inputs PCM data input clock ASIC DBUS data input clock PCMCOSYCLKX PCM data bit sync clock ASIC PCMOUT Received audio in PCM format AUDIO DBUS data output clock ASIC DBUSSYNC DBUS data bit sync clock ASIC RDA DBUS received data B2B Conn INTO INT1 Interrupts for the DSP ASIC Table 32 External Signals and Connections Outputs Signal Name Signal description PCMIN Transmitted audio in PCM format AUDIO IOX I O enable Indicates access to DSP I O address space ASIC RWX Read Write control ASIC DSPAD 16 0 Address bus and control signals ASIC TDA DBUS transmit data B2B Conn Table 33 External Signals and Connections Bidirectional Signal Name Signal description To From DSPDA 15 0 16 bit data bus ASIC Page 2 30 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Block description The DSPU communicates with the CTRLU through a mailbox in the D2CA ASIC The software for the e
353. ription The power block creates supply voltages for the PROCU and LCDM generates reset signal for CPU and contains LCD contrast control and enable circuits Input filter is required to reduce input noise of switching regulators Back up battery keeps RTC alive when main battery is not connected System voltage is present allways until battery voltage drops below 5 0V 3 3V 500mA current mode buck VSYS regulator internal switch transistor LCDVCC LCDVCCON LCD Vcc switch circuit VCC5 SVPDX 5V 50mA low drop out linear regulator LCDVEEON 21V 6mA SMPS including output voltage LCDVEE RE adjustment by LCDPWM signal and tem perature compensation LCDPWM Undervoltage lockout VBACK 3V backup battery Figure 9 PDAPWRU block diagram Table 23 External Signals and Connections Inputs Signal Name Signal description From 1 LCDVCCON LCD Vcc on off PROCU LCDVEEON LCD Vee on off PROCU LCDPWM PWM signal for LCD voltage control PROCU 5VPDX 5V regulator powerdown PROCU VB Battery voltage B2B VB Note 1 B2B Board to board connector between PDA and CMT modules Original 08 96 Page 6 39 RAE RAK 1N After Sales PDA Hardware Technical Documentation Table 24 External Signals and Connections Outputs VSYS System voltage 3 3V PROCU SIRU VCC5 5V for FLASH and RBUS PWRGOOD Reset signal for CPU VBACK Backup battery voltage to RTC LCDVCC LCD Vcc to LCDM LCDVEE LCD Vee to LCDM Note
354. rolled by an analog signal via TXC line The amplified IF signal is down converted to the last IF in the mixer of CRFRT The last local signal is generated from VHF VCO by dividing the original signal by 4 in the dividers of CRFRT The last IF frequency is 13 MHz in GSM and PCN The last IF is filtered by a ceramic filter The filter rejects signals of the adjacent channels The filtered last IF is fed back to CRFRT where it is amplified Finally the IF signal is split to 45 and 45 signals and then fed to RFI The block diagram overleaf Figure 4 is common for GSM and PCN Blocks in parenthesis refer to PCN only In GSM these parts do not exist and in the signal path are replaced by direct connection to the next block Page 3 10 Amendment 1 04 97 RAE RAK 1N After Sales Technical Documentation HF x H i A IN 4 EX nx x M oy d SIA NC y EN x z A V X f
355. rovides functions to test the discrete components of the PDA target Gra Test Buzzer Test Power Managenent Inputs Test QWERTY Keyboard Test IrDA Communications Output Test Serial Ports 2 1 Test LCD Panel This menu provides tests for the PDA LCD panel Various test patterns can be chosen to be displayed with any contrast value User options are Contrast default 128 range 0 255 Test Pattern default Gray range Gray Gray inverted Matrix Matrix inverted Chess Chess inverted All ON All OFF Vision Vision inverted 2 2 Test Buzzer This menu provides a test for the PDA buzzer User options are Frequency default 1000Hz range 20 18000Hz Duration default 1 0s range 0 1 25 5s The input parameters are given as plain figures without units Time referred input values are given as hundreds of milliseconds Amendment 1 04 97 Page 7 51 RAE RAK 1N After Sales Service Software Technical Documentation 2 3 Test Power Management Inputs This menu provides a test for the PDA power management inputs The enquired input parameters from the user are TimeOut default 5 0s ran
356. s 3 Call costs limit 4 Show costs in NETWORK SELECTION CS MEMORY FUNCTIONS 1 Memory selection 2 SIMcard memory status 3 Copy between memories 4 Erase SlMcard memory 5 Show own number W CALOPIONS ALL SOUNDS A KEYPAD LOCK A Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide PDA Operation When the cover is opened the application which was active last appears in the same state However if you have made or answered a voice call in the phone interface and switch to the communicator interface by opening the device cover the telephone application starts automatically To switch to another application press the corresponding application button you can do this even during an active call You need not exit any application before starting another as all inactive applications remain frozen until they are activated again However if the battery is removed or completely discharged all data is saved but applications will return to their default states An auto save occurs every 5 minutes and when an application is changed all data is saved automatically Data is also saved when pressing the Close command button or closing the device cover Every time the cover is opened a note is shown listing any unread faxes mail or short messages unsent documents and missed calls Keys and Buttons Display Cover lock Command buttons Application buttons SSES SESS OOOO Sono onooo A
357. s include Calculator Clock and Composer Help Context sensitive help feature c a e d 5 Application HE Te eS OES SIS se BUNONS 0 OODODODOD G OD amp 2 OA amp 0263 Di GC om woo Go 165300 E OO NM Figure 2 Communicator Applications Page 6 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide CMT Operation In order to make phone calls the communicator must have a proper SIM card fitted and the phone interface must be switched on using the button Note Opening or closing the cover does not affect active phone calls The phone interface keys are not functional when the device cover is open e fyouhavean active phone call and you open the cover the phone application will start automatically and you can continue the call in the communicator interface Whenever you have made a voice call via the phone interface and change to the communicator interface the audio is off see Audio Control When you make a call via the communicator interface with the Tel application the audio is on List Of Keys When operating the phone interface keys are pressed one at a time Two keys are never to be pressed simultaneously Switches the phone interface on and off This button does not func tion when the device cover is open This rocker key is used to scroll through menus sub menus or settings If there are no active calls the scroll keys can be used
358. s likely that the CPU D130 is pulling the sense line low Expect a CPU fault Fix the Corresponding Resistor Change the faulty resistor Drives Toggling KEYD 7 0 Once the keyboard test is running it drives the keyboard drive lines from idle high to low state one by one one at a time if one or more line s remain fixed low or high go to 6 3 2 1 R112 R119 OK The keyboard matrix is driven through the series resistors R112 R119 Check if all the resistors are OK If the resistors are OK go to 6 3 1 2 if not go to 6 3 1 3 NOTE Resistors R112 R119 are installed only in CPU versions A3 or A5 If A7 version of the CPU is used the resistors are not installed Also if the A7 version of the CPU is used then the value of the resistors R120 R129 is changed Do Senses Go Low if Driven and a Key Is Pressed Press a key in the matrix and scope the corresponding sense line If the drive line is driven but the sense line remains high proceed to 6 3 3 1 otherwise go to 6 3 3 2 Check keyboard matrix If the sense line remains high even though it should be forced low when driven expect a fault on the circuit connections Although the CPU can force the senses high also CPU Fault If the sense lines toggle according to the pressed keys on the keyboard when they are driven then the CPU is likely to be defective Original 05 97 Page 8 35 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 6 4 All
359. s one wide ground line It is connected by using two sided copper tape with conducting adhesive It is needed to improve EMC characteristics Page 4 6 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation UIF Both flexes are made of flexible material Flexible material is needed because the hinge will be opened thousands of times and the signals must be working all the time UIF Electronics The following sections of circuitry are on the UIF module CMT LCD Display Module CMT LCD voltage divider amp temperature compensation circuit CMT Keypad amp CMT LCD illuminating circuits CMT amp Soft keypad matrix Antenna impedance matching circuit Hinge flex connector PDALCD flex connector Technical Specification UIF Electrical Characteristics DC Characteristics Table 1 Supply Voltages and Power Consumption Pin Conn Line Symbol Minimum Typical Maximum Unit Notes Nominal 2 X001 VL1 4 65 4 8 4 95 LCD material D without tempera ture compensation 1 X001 VBATT i V Display illumination Keypad illumination 27 X001 LCDVCC 3 3V PDALCD Logic voltage 28 X001 LCDVEE 17V 22V 25V PDALCD LCD volt age Amendment 1 04 97 Page 4 7 RAE RAK 1N UIF After Sales Technical Documentation Table 2 DC characteristics of PDA Hinge flex connector on LCDM module Pin Type 10 17 24 UIF Line Symbol GND GND 6 3 UIF LCMUIF 3 0 Output Input
360. s writing the default parameters on the EEPROM in which case all tuning steps should be carried out NOTE During tuning proceed as follows Take care not to damage sensitive measuring instruments with excessive RF power Carry out all tuning steps in the shortest possible time to avoid excessive heating of RF units Perform all tuning steps in the order presented Never try to mask a fault by tuning it out Required Equipment PC AT computer with service software software see Sect 7 for instructions on installation and use M2BUS adapter DAU 2 and other service accessories see equipment setup pictures Multimeter or DVM GSM radio telephone test station or separate measuring equipment as follows frequency counter 1 ppm HF generator pulse power meter spectrum analyzer attenuator and branching unit Amendment 1 04 97 Page 7 73 RAE RAK 1N After Sales Service Software Technical Documentation Equipment Setup To set up the equipment connect the M2BUS adapter to the serial port RS 232 of the computer In case you are using a 9 pin serial port normal with an AT set use the mating adapter supplied with the M2BUS adapter Turn off the computer before connecting to avoid possible damage to the serial port Attach one end of the XCM 1 modular cable to the DAU 2 PC M2BUS adapter and the other end to the modulator T connector when the covers of the phone are in place Page 7 74 Amend
361. see next section Flash Downloading Amendment 1 04 97 Page 7 53 RAE RAK 1N After Sales Service Software Technical Documentation 4 DRAM Utilities This menu provides functions to access the PDA DRAM 2 Read DRAM 3 Write DRAM 4 1 Test DRAM This menu provides a test utility for testing the PDA DRAM User options are Test type default WalkingBit Range WalkingBit ChessBoard Start Address default 000000h Range 000000 1FFFFFh End Address default OFFFFFh Range 3A00000h 1FFFFFh The area between addresses B0000h FFFFFh cannot be tested The output from the target shows the following whether the test was successful 4 2 Read DRAM This menu provides means to read the DRAM of the target User options are Start Address default 000000h Range 000000 1FFFFFh The output from the target shows the following Values of the memory bytes at the enquired addresses Page 7 54 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 4 3 Write DRAM This menu provides means to write the DRAM of the target User options are Start Address default 000000h Range 000000 1FFFFFh Bytes default none Range 0 FFh Note The number of bytes has to be even 5 I O Space Functions This menu provides functions to access the PDA I O Ports 2 Read 1 0 Port 3 Write I 0 Port 4 Get Date amp Tine 5 Set Date amp Tine
362. sful If the test passes in the external loop the serial ports can be considered to be functional otherwise continue to 8 7 1 R947 OK There is only one resistor between the CPU pins 97 98 check it along with the connections If OK go to 8 2 1 if not go to 8 7 1 1 Change Resistor Change the faulty R974 Original 05 97 Page 8 41 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation Appendix A POST beep codes number of beeps 1 Memory refresh is not working 3 Memory failure in 1st 64KB of memory 4 Timer T1 not operational 5 CPU test failed 6 Gate A20 failure 10 CMOS shutdown register failed 13 Exhaustive low memory test failed 14 Exhaustive extended memory test failed 15 CMOS restart byte can t hold data 16 Address line test failed 18 Interrupt controller failure Page 8 42 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly Appendix B POST progress codes These are written during POST to the IO address 2FFh and if the BIOS testmode is entered the last code is copied to the IO address 3FFh 00h 01h 05h ODh OEh 11h 12h 13h 15h 16h 17h 18h 1Ah 19h 20h 22h 23h 24h 35h 40h 42h 44h 4Ch 4Dh 53h 55h 66h 82h 84h Original 05 97 POST beginning CPU register test starting Disabling shadowing amp cache Test CMOS RAM shutdown register Check CMOS checksum update DIAG byte Disable interrupts co
363. sistor 10k 5 96 0 063 W 0402 R576 1430770 Chip resistor 4 7 k 5 0 063 W 0402 R577 1430792 Chip resistor 33k 5 0 063 W 0402 R578 1430794 Chip resistor 39k 5 96 0 063 W 0402 R579 1430778 Chip resistor 10k 5 0 063 W 0402 R580 1430790 Chip resistor 27k 5 0 063 W 0402 R583 1430790 Chip resistor 27k 5 0 063 W 0402 R584 1430310 Chip resistor 75k 2 0 063 W 0603 R601 1430762 Chip resistor 2 2k 5 96 0 063 W 0402 R602 1430762 Chip resistor 2 2k 5 0 063 W 0402 R603 1430762 Chip resistor 2 2k 5 96 0 063 W 0402 Page 6 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists R701 1430832 Chip resistor 2 7 k 5 96 0 063 W 0402 R702 1430770 Chip resistor 4 7 k 5 96 0 063 W 0402 R703 1430710 Chip resistor 22 5 96 0 063 W 0402 R704 1430740 Chip resistor 330 5 0 063 W 0402 R705 1430724 Chip resistor 82 5 0 063 W 0402 R708 1430690 Chip jumper 0402 R711 1430758 Chip resistor 1 5k 5 0 063 W 0402 R712 1430832 Chip resistor 2 7 k 5 96 0 063 W 0402 R713 1430744 Chip resistor 470 5 0 063 W 0402 R714 1430700 Chip resistor 10 5 0 063 W 0402 R715 1430693 Chip resistor 5 6 5 0 063 W 0402 R716 1430693 Chip resistor 5 6 5 0 063 W 0402 R717 1430734 Chip resistor 220 5 0 063 W 0402 R725 1430792 Chip resistor 33k 5 0 063 W 0402 R726 1430790 Chip resistor 27k 5 0 063 W 0402 R727 1430770 Chip resistor 4 7 k 5 0 063 W 0402 R728 1430730 Chip resistor 150 5 0 063 W 0402 R736 1430776 Chip resistor 8 2k 5 0 063 W 0
364. sistors BC848W V330 and BCW30 V331 The SIM power switch RFI Introduction The RFI block consists of the RFI ASIC and its reference voltage generator This block is an interface between the RF and baseband sections The RFI block has the following functions F receiving and A D conversion 1 Q separation and Q transmit and D A conversion AFC D A conversion TXC D A conversion burst template analog AGC and digital LNA gain switch Technical specification Table 39 External Signals and Connections Inputs Master power up reset PWRU ROX E y e wx wess me CS RFICLK RFI master clock ASIC RFI sleep clock ASIC RX aa signal SR Page 2 38 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Table 40 External Signals and Connections Outputs Signal Name Signal description To DAX Data acknowledge ASIC AFC Automatic frequency control voltage HF TXC RF TX transmit power control voltage RX AGC voltage TXQP TXQN differential TX quadrature signal TXIP TXIN differential TX in phase signal PDATAO LNA gain reduction Table 41 External Signals and Connections Bidirectional Signal Name Signal description RFIDA 11 0 12 bit data bus ASIC Block description The RFI provides A D conversion of the in phase RXI and quadrature RXQ signals in receive path It has 12 bit A D converters and the output sample rate is 541 667 kHz Analog tra
365. so enter minimum mode when MBUS is connected to EXTMIC line Main components Hitachi H8 538 H8 538 is a CMOS microcontroller unit MCU which includes a static CPU core and on chip supporting modules with 16 bit architecture The data bus to outside world is 16 bits wide SCL ASIC MCU address decoding and memory chip select generation FLASH and system ASIC address mapping MBUS interface MBUS RBUS activity detection MCU clock division from 26 MHz to 13 MHz 512k 16bit FLASH memory two 512Kx8 FLASH chips 65 ns maximum read access time contains the main program code for the MCU part of the DSP pro gram code also located on FLASH 64k 16bit SRAM memory two 64Kx8 SRAM chips 65 ns maximum read access time 8k 8bit EEPROM memory 150 ns maximum read access time contains user defined information PWRU Introduction The power block creates the supply voltages for the baseband block and contains the charging switch and its control electronics Technical description Table 29 External Signals and Connections Inputs Signal Name Signal description XPWROFF PSL watchdog updating power off control CTRLU VBATT Battery voltage Battery conn Page 2 26 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Table 29 External Signals and Connections Inputs continued Signal Name Signal description From Charger on off control CTRLU VCHAR
366. sos ad eue ecu EP RE ASSERERE EN ee E 2 31 Page 2 2 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Main components 2 31 A a a e a E a a e E E 2 32 ajos aa e Ee be e 2 2 32 Technical specification e seg AIR REENEN EE Nee Rer hh Eae 2 32 Blick descebpilohi es deo eps o e hm era s 2 33 Maitt GOITipODIOMs cuum pd ue e nm Ben e ea beate 2 34 nol ve rd Rd ERRARE on MAG CU aded da MN d d 2 34 nuieses TETTE Pr 2 34 Technical specification ad e ge rera e e ERE RET EREPE RS 2 35 Block descrplDEE 2 222592 10846 d Ae d ORE erac ns bs 2 36 Main components 2 38 A II EEEE 2 38 INU OOUCHOM AAA cR 2 38 Technical specification 2 38 Black de e o A1 suuin aeu mE Rit c Situ rerba rubis 2 39 Main components 2 39 Original 08 96 Page 2 3 RAE RAK 1N After Sales Baseband Technical Documentation List of Figures Page No Figure 1 Interconnection diagram osea dees ee bs eee Pee eed 2 6 Figure 2 Power Distribution Diagram 0 00 cee eee eee 2 17 Figure 9 GIOCKING Schemes cai sirio pause dsp doce arte bee ened bees 2 18 Figure 4 Reset and Power Control 2 19 Figure S Watchdog SYSISM See a 2 20 Page 2 4 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Introduction The baseband engine consists of two multi chip modules MCM mounted along with other baseband circuitry and RF parts on a single multi
367. splay When either signal or noise measurement results are received MEASURING text is removed and the first mentioned help line is on the display When both measurements signal and noise are done at least once the signal to noise relationship and difference are also shown on the display Upon exiting the next selections are set to the values which were selected before this adjustment Active Unit Operation mode AGC value Compensation factors comp factor1 4 64 dB Compensation factor for 67 71 kHz signal because ASIC filter attenuates 67 71 kHz signal 4 64 dB comp factor2 2 27 dB Compensation factor for real and calculated noise bandwidth difference Real noise bandwidth is 80 kHz and calculated bandwidth is 135 kHz 3 2 7 Charge Voltage Adjustment This function needs 6 V charge voltage from external power supply When the function is activated the next window will be shown C Charge Voltage 1 E Info 1 A D converter value 3 Sooo orn to eo The A D converter has positive 10 bit value The A D converter value is read again when the previous value is received and shown on the screen Amendment 1 04 97 Page 7 31 RAE RAK 1N After Sales Service Software Technical Documentation If no measurement result is received when Esc key is used the information message is shown The user can remove the information message with Y N or Esc key The measurement will be terminated by usi
368. ssible Operating tem some circuits tolerate perature range wider temperature range Functional Description VSYS regulator System voltage regulator is current mode pulse width modulation PWM dc dc step down converter It has internal switch transistor and current sense resistor for current mode control Oscillator makes the switch transistor to turn on at fixed frequency Switch transistor on time is determined by load taken at output Current mode feedback makes transient response fast and provides cycle by cycle current limiting This means that outer loop determines threshold voltage for current sense amplifier to reach to turn switch transistor off Inner current feedback loop makes response to load current changes fast Outer feedback loop takes output voltage information and compares it to reference and drives the error towards zero in order to keep regulation This kind of control keeps good regulation at output in rapidly changing load conditions Tradeoff is high operation current in very light loads because oscillator is running all the time VSYS regulator operates at discontinuous conduction mode DCM at light loads This means that current through inductor decreases to zero before new switch transistor turn on pulse comes and current through inductor starts to increase At heavy loads inductor current does not go to zero and operation is in continuous conduction mode CCM Original 08 96 Page 6 41 RAE RAK
369. ssories and part numbers are given in Chapter 9 of this manual Note Screen shots for both PCN and GSM units are in general universal Where they differ an extra screenshot is shown Amendment 1 04 97 Page 7 7 RAE RAK 1N After Sales Service Software Technical Documentation Testing Functions Mechanical Connections Caution Make sure that you have switched off the PC and the printer before making connections Do not connect the PKD 1 key to the serial port You may damage your PKD 1 Attach the protection key PKD 1 to parallel port one 25 pin female D connector of the PC When connecting the PKD 1 to the parallel port be sure that you insert the PC end of the PKD 1 to the PC male side If you use a printer on parallel port one place the PKD 1 between the PC and your printer cable The PKD 1 should not effect devices working with it If some errors occur errors in printing are possible please try printing without the PKD 1 If printing is OK without the PKD 1 please contact your dealer We will offer you a new PKD 1 in exchange for your old one Figure 1 Dongle insertion Connect up service tools as shown in Figure 2 overleaf The dummy battery BTD 1 contains the following leads The M2BUS lead DAU 2 2T connect to COM1 9 pin male D connector this is for testing the CMT module Power leads connect to suitable 7 2vdc power supply DLR 1 should be connected to PAS 1 and to COM on the
370. st 3 1 1 Disconnect LIDOPEN from CMT module 2 Toggle cover YES 3 PMI test successful 3 1 LIDOPEN connected to CMT YES NO NO 3 2 33 NO Cover opened and CPU pin127 O Ch gt eck S170 R160 closed toggling R161 C139 R131 YES YES 5 Start the PMI test 3 2 1 CPU fault 6 Toggle phone ON OFF YES 7 7 1 12 PMI test NO CPU pin128 NO successful toggling Check R130 R146 YES NO 7 3 1 Phone powered Discrete comps ON and OFF Check CMI and connections OK YES NO 7 3 2 Fix the Power Management corresponding Inputs OK component Original 05 97 Page 8 31 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 5 1 5 2 5 3 5 3 1 5 3 1 1 5 3 2 5 3 2 1 5 3 3 5 4 5 5 Start the PMI Test Start the PMI test by choosing the PMI test in the service software Give a reasonable timeout value within which the interrupt is likely to occur Toggle Cover In order to generate an interrupt toggle the cover open or close PMI Test Successful If the service software reports the PMI test to been successful proceed to 5 4 otherwise go to 5 3 1 LIDOPEN Connected to CMT In order to isolate the fault to the PDA module check if the LIDOPEN signal is connected to the CMT module If the signal is connected go to 5 3 1
371. supplied with the Communicator Original 08 96 RAE RAK 1N After Sales CARK60 Installation Guide Technical Documentation This page intentionally left blank Page 12 Original 08 96 After Sales Technical Documentation Appendix 2 RAE RAK 1N PARTS LISTS Amendment 1 04 97 After Sales RAE RAK 1N Parts Lists Technical Documentation CONTENTS Parts lists Page No GSM System Module GEB AN e NEE pu Ra rh Ry RR Re eae eens 3 PCN System Module GE9 18 PDA Rieger GPI ua eund deam ese nia borea sioe oc d ener een 35 User Interface GK2 A a i NEIEN NENNEN NNN ELE E ips nne rs 42 User Interface GK2 1 0 cece esee 45 similex Sub module GEM iiia ean re d Rok ac dcn AR d 47 Mechanical Assy Parts RAE 1N 0 0c cece eee eee neces 48 Mechanical Assy Parts RAK 1N 00 cece eee e eee eens 49 Note Common Modules for all versions are GP1 and GEM1 Page 2 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Parts Lists Parts Lists GSM System Module GES EDMS pn 0200712 Issue 3 19 Item Code Description Value Type R200 1430796 Chip resistor 47k 5 0 063 W 0402 R201 1430804 Chip resistor 100 k 5 0 063 W 0402 R202 1430788 Chip resistor 22k 5 96 0 063 W 0402 R206 1430726 Chip resistor 100 5 0 063 W 0402 R207 1430726 Chip resistor 100 5 0 063 W 0402 R208 1430726 Chip resistor 100 5 0 063 W 0402 R209 1430726 Chip resistor 100 5 0 063 W 0402 R210 1430796
372. sured and if too big an error message is displayed Three different frequencies are used Page 7 34 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software When Make a Measurement is selected the received signal strength is displayed square root of the received value on the separate window If any of the signal values differs more than 3 dB from the reference values shown in the table below the OUT OF RANGE message will be displayed HS Interface HF Interface PHF Interface Fere e EZ zl em Received level data fields have no value before measurement results are received Below is the separate window where results are shown FREQUENCY Hz 300 1000 3000 RECEIVED LEVEL 120 122 1 79 OUT OF RANGE Received level value has scale from 0 to 256 3 6 Logic Controls After this selection new window is shown E Logic Controls 1 1 Read A D Converters 2 LCD test display 1 72 nter Se lect Amendment 1 04 97 Page 7 35 RAE RAK 1N After Sales Service Software Technical Documentation 3 6 1 Read A D Converters After this selection new window is shown L Read A D Converters 1 Battery Uoltage Charge Voltage Cover Information Battery Temperature digi o vill PISIS Battery Type Junction Box Connected FiHelp ESC Exit No value is shown when selected When correspondent messages
373. t Power good PWRGOOD signal from PDAPWRU module is used as a system reset Both PDA and CMT modules power management system is implemented with special hardware in close co operation with operating system POWER SUPPLY 5 V Power supply 5VPDX Integrated CPU 1 0 LCD Power supply LCDVCCON LCDPVEEON LCDVCCON LCDPVEEON RESET E3G CPU y o 1 0 SUS PMI PMI PEND WO 3 3 V Power supply PWRGOOD Note 1 S oo bees UD SWITCH GND EC LIDOPEN CMT Figure 2 Reset and power management block diagram Page 6 18 PowerDown 1M x 16 FLASH IR tranceiver Shutdown RS232 Buffer Shutdown Enable XIP FLASH FLASH file system Original 08 96 After Sales RAE RAK 1N Technical Documentation PDA Hardware PDA power management principle Operating voltage is always ON on the PDA module when battery is connected and charge level on the battery is above PDA power supply limit HW cutt off When battery is connected voltage must rise over PDA HW limit cancel voltage to start CPU power up Power consumption reduction is achieved by stopping clocks from the system stable state power consumption in CMOS logic is really small From CMT point of view PDA module have only two states PDA ON and PDA SUSPEND illustrated in figure 3 When PDA is in PDA SUSPEND state it takes about 500 ms max Note 1 to wake it up During the wakeup period
374. t MCU and five memory circuits 2XFLASH 2xSRAM and EEPROM a 20 bit address bus and a 16 bit data bus Physically the CTRLU resides entirely on MCM1 Main Features of the CTRLU Block MCU functions system control communication control user interface functions GSM data encoding and decoding authentication RF monitoring power up down control accessory monitoring battery monitoring and charging control self test and production testing flash loading Technical specifications Table 23 External Signals and Connections Inputs Reference voltage for MCU AD converter PWRU m O RF Cover open closed detection HOOK A D input B2B Conn RBUSRXD RBUS receive data B2B Conn TBAT Battery temperature monitoring Battery Conn Original 08 96 Page 2 21 RAE RAK 1N After Sales Baseband Technical Documentation Table 23 External Signals and Connections Inputs continued Signal Name Signal description From BTYPE Battery size identification Battery Conn JCONN Junction box connection identification AUDIO MBUSIN MBUS RX data B2B Conn Table 24 External Signals and Connections Outputs PWM Charger switch on off control PWRU MCU write strobe ASIC RSTROBEX MCU read strobe MCUAD 19 16 Parts of MCU address bus MCUAD 4 0 MRBUSDET MBUS and RBUS activity detection PCMCLK Clock for audio codec control data transfer PCMCDI Audio codec co
375. tage required for operation The oscillator frequency is fixed on the UIF module by the resistance from pins 2 to 3 of X020 with the values of R6 and R7 shown the frequency is within 180 kHz to 370 kHz The negative going pulses appear at pin 9 of X020 where they are smoothed by C1 to givea voltage which is nominally equal but opposite to VL1 For correct operation of the display dc voltages between VL1 and VL 1 need to be generated and fed back to the driver chip at pins 4 to 8 inclusive of X020 The exact voltages depend on the relative values of the resistors R8 R1 R2 R3 R4 and R5 The display driver is connected to the radio module with a 4 bit data bus Data transfer is controlled with the following signals R W selects read or write operation 0 write 1 read Enable activates read write operations and RS selects the register 0 instruction register writing or busy flag reading 1 data register PDA soft amp scroll keys Six PDA keys is located in the UIF module They connected to the same keymatrix as other PDA keys Page 4 12 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation UIF Antenna matching circuit The purpose of the antenna matching circuit is to transform the antenna feedpoint impedance to 50 ohm which is the nominal impedance of the antenna cable The matching circuit consists of a series inductor and capasitor and shunt inductor in GSM and series inductor and
376. the Keys Pressed If all the keys are pressed and they have been recognized correctly the keyboard test can be considered to have been successful If all the keys have not been tested go back to 6 2 Page 8 36 Original 05 97 After Sales RAE RAK 1N Technical Documentation Faultfinding Disassembly Troubleshooting Diagram of the InfraRed Check The following picture illustrates the troubleshooting diagram of the infrared test Only half duplex method is supported for testing the IR connection 1 Output a byte via IR 2 1 2 Disconnect M180 pins 2 6 7 2 2 1 2 1 1 Sent byte received IRSHD RSENX M180 pins 2 6 7 NO RSSHDX NO disconnected NO OK OK YES YES YES 2 2 2 1 3 RSTXD NO RS buffer 3 activity fault Input a byte via IR YES 22 1 2 2 2 M180 fault CPU fault 4 1 2 Disconnect M180 pins 2 6 7 4 1 4 1 1 Received byte OK IRSHD RSENX RSSHDX OK M180 pins 2 6 7 disconnected NO 4 2 RSRXD activity RS buffer fault 4 2 1 4 2 2 CPU fault M180 fault IR test OK Original 05 97 Page 8 37 RAE RAK 1N After Sales Faultfinding Disassembly Technical Documentation 7 1 7 2 7 2 1 7 2 1 1 7 2 1 2 7 2 1 3 7 2 2 7 2 2 1 7 2 2 2 Output a Byte via IR Start the IR test from the service software Select output mode and the byte to send fr
377. the standard memory of the communicator indicated by the letter B on the phone interface display The B memory is the communicator memory the Contacts directory When the communicator is started up for the first time the B memory is selected automatically The A memory is located on the SIM card that is inserted in the communicator The SIM card memory uses numbered memory locations to store data When numbers are saved in the SIM card A memory a message will indicate its location number The number of standard memory locations available on SIM cards varies from one card to another When the A memory is selected the phone interface stores all contact information on the SIM card and cannot access the Contacts directory Therefore the use of the communications applications of the communicator interface will be less convenient you will have to enter most contact information manually This manual will assume that you use the standard B memory Original 08 96 Page 9 RAE RAK 1N After Sales Quick Guide Technical Documentation Storing information Press Memory Key in the name of up to 30 charac ters that you want to store with the phone number Press Save Key in the international access and country codes if necessary area code and phone number Press Save The message SAVED will appear in the middle of the display The entry will be automatically saved in the Contacts directory in alphabetical order
378. thesizer clock From ASIC to RF Synthesizer data From ASIC to RF SENA1 UHF and VHF PLL enable From ASIC to RF Transmitter power control enable From ASIC to RF 26 MHz clock from RF to baseband From RF to ASIC Table 20 Signals Between RF and RFI MCM2 Automatic frequency control voltage From RFI to RF TXC TX transmit power control voltage and RX From RFI to RF automatic gain control voltage TXQP TXQN differential TX quadrature signal From RFI to RF TXIP TXIN differential TX in phase signal From RFI to RF PDATAO LNA gain control From RFI to RF RXQ RX quadrature signal 13 MHz From RF to RFI RXI RX inphase signal 13 MHz From RF to RFI RFIREF 4 096 V reference voltage From RFI to RF Table 21 Signals Between RF and CTRLU MCM1 TRF HF temperature sensor From RF to CTRLU Page 2 16 Original 08 96 After Sales RAE RAK 1N Technical Documentation Baseband Table 22 Signals Between RF and PWRU VREF Supply voltage for VCXO From PWRU to RF VBATT Battery voltage From PWRU to RF Circuit Descriptions Power Distribution VBATT Tee VA2 VLI VBATT VREF L A RF VCHAR RFI e en 2421 PDA UIF module _ VBATT VL2 VL2 VL1 L 7 VCHAR i LCD Driver IK Ge DSP ASIC SRAM i VL1 PDA i pro i Se E SE d VA1 a HF power VREF VL1
379. tion Baseband The DSP has its own crystal oscillator which can be turned off and on by the ASIC The DSP uses differential sinusoidal clock The frequency is 60 2 MHz The MCU generates 8 kHz clock to the codec for the control data transfer In the idle mode all the clocks can be stopped except 26 MHz main clock coming from the VCXO Reset and power control RFI Reset in Reset Out reset in Reset Out ASIC SIMReset gt DSP veo resetreg Reset in XPWRON reset in approx 2Hz MCU Figure 4 Reset and Power Control There are three different ways to switch power on Pulling the XPWRON line down e g by pressing the power key The PSL detects that and switches the power on Charger detection on PSL detects that charger is connected and switches power on PSL will switch power on when the battery is connected After that the MCU will detect if power key is pressed or charger connected If not the power will be switched off Original 08 96 Page 2 19 RAE RAK 1N After Sales Baseband Technical Documentation All devices are powered up at the same time by the PSL It supplies the reset to the ASIC at power up The ASIC starts the clocks to the DSP and the MCU After about 100 ms the PSL releases the reset to ASIC ASIC releases the resets to MCU and RFI after 256 13 MHz
380. to accept these files parameters or press the BACKSPACE key to clear entry and key in another filename and then press ENTER The lt Esc gt key returns to the previous menu Invalid DOS filenames will give an error message If phone mode had Local value before setup file loading the mode is changed to Normal in the phone by special Normal mode message and all functions caused by the change are done If mode was Normal before new setup all needed setup file settings are sent to MS as in the previous case but phone mode change command is not sent to MS Note next exception If phone mode is Normal and interface is M2BUS and communication port is different in the setup file than the value before file loading then also Normal phone mode message has to be sent to MS Every time when phone mode change message from Local to Normal is received by MS it makes reset to the whole MS 2 Initialize Phone With this function you can initialize the phone to accept M2BUS commands from the PC This function should be used right after the phone is connected to PC and powered up This function also asks for the PIN code if the phone s PIN asking is activated The initialization function performs the following subfunctions MBUS registration Test mode message sent to the phone Phone mode set to GSM AFC value removed from info window Amendment 1 04 97 Page 7 17 RAE RAK 1N Service Software After Sales Technical Documentation
381. tor at 947 06771 MHz Adjust signal generator level to 80 dBm cable attenuation Select RSSI Calibration and press Enter Adjust signal generator level to 50 dBm cable attenuation see note below Press Enter DAC values should be in first row 0 dB 450 700 and last row 57 dB 750 1000 Press Esc key Store the value to the EEPROM with Y key 2 AFC Diagram Storage This tuning is used to calibrate the automatic frequency control range AFC tuning Set RF generator frequency 947 06771 MHz at level 45 dBm Select adjustments menu option AFC Diagram and press Enter Check that Cont mode channel is 60 The measurement result should be e Low over 22 kHz lt 8 kHz e Middle 1 5 kHz e High below 22 kHz 8 kHz Press Esc key and store with Y key Note Always take the target tuning value from the actual monitor screen as the value can vary according to which CMT software version is used Amendment 1 04 97 Page 7 77 RAE RAK 1N After Sales Service Software Technical Documentation 3 1 Q Modulator Amplitude Balance and Phase Shift Tuning The purpose of this tunig operation is to adjust the I Q modulator d c offsets and the UO modulator amplitude balance and phase shift UO modulator d c offsets amplitude balance and phase shift tuning Connect spectrum analyzer with attenuator if needed to external
382. u item is selected these can be changed by using the arrow keys 1 2 Set Serial Speed This menu item provides means to change the speed of the serial channel used between the service software and the PDA This function sets the speed of the UART in the PC running the service software and the speed of the UART in the target User options are as follows BaudRate default 115200 Optional rates 1200 2400 4800 9600 19200 28800 57600 115200 1 3 Boot Operating System This menu item commands the target to boot the primary operating system typically DOS 1 4 Reset Target This menu item commands the target to jump unconditionally to the desired memory location This allows jumping from the DOS testmode to the BIOS testmode If testmode pin is active while polling it in BIOS the handler in the BIOS test program is entered and the BIOS testmode is activated User options are as follows Address default BlOS testmode range BIOS testmode PON 0000 0000 FFFF FFFF 1 5 Exit DOS Testmode This menu item commands the target to exit the DOS testmode i e if the menu is chosen the secondary operating system typically GEOS is booted Note The GEOS looses the communications ability to the CMT if booted through either testmode In this case the GEOS will not operate normally Page 7 50 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 2 Test Peripherals This menu p
383. ult 3C00000h Range 3A00000h 3C00000h 3E00000h Start Relative Address default 000000h Range 000000h 1FFFFFh End Physical Address default 3E00000h Range 3A00000h 3C00000h 3E00000h End Relative Address default 1FFFFFh Range 000000h 1FFFFFh The output from the target shows the following whether the command was parsed successfully whether the Flash locking has been successful Amendment 1 04 97 Page 7 69 RAE RAK 1N After Sales Service Software Technical Documentation 3 6 5 Program Flash From File This menu provides means to program the PDA Flash memory from a file on the disk in the host to all the targets in parallel Start Physical Address default 3C00000h Range 3A00000h 3C00000h 3E00000h Start Relative Address default 000000h Range 000000h 1FFFFFh If the Start Physical Address is set to 3E00000h the maximum Start Relative Address may not be greater than 1FFBFFh The output from the target shows the following whether the command was parsed successfully whether the buffer filling was successful whether the Flash programming was successful 3 6 6 Calculate Checksum By choosing this menu the target calculates a 32 bit checksum of the ROM between the given physical addresses User options are Start Physical Address default 3C00000h Range 3A00000h SFFFBFFh End Physical Address default 3FFFBFFh Range 3A00000h 3FFFBFFh The output from the target shows the following wheth
384. uning and press Enter Check that TX power level is level 5 channel is 700 and TX data type is 1 Adjust spectrum analyzer centre frequency to 1747 8 MHz Span 200 kHz Res BW 10 kHz Video BW 1 kHz and Sweep time 0 5 s CHF 67 71 kHz 67 71 kHz lt gt lt D C offset tunings Set this value to minimum Amplitude amp phase difference Set this value to minimum Select option TX d c offset and press lt Enter gt Adjust the level of centre frequency CHF signal to minimum by varying D A converter value with lt gt and lt gt keys When value is OK press Esc Select option TX Q d c offset and press lt Enter gt Adjust the level of signal CHF to minimum by varying D A converter value with lt gt and lt gt keys When value is OK press Esc Page 7 82 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software Select option TX and Q d c offset and press Enter Adjust the level of signal CHF to minimum by varying D A converter value with lt gt and lt gt keys The amplitude difference between CHF 67 7 kHz and CHF should be gt 30 dB When value is OK press Esc Select option Tune Amplitude Difference and press Enters Adjust the level of signal CHF 67 7 kHz to minimum by varying D A converter value with lt gt and lt gt keys When value
385. up 1 ASIC RIS Testo ERE 2 ASIC Timer amp IRQX Test COn Off 3 ASIC Timer amp NMI Test COn Off 4 fiudio Codec Test On Off Fi Help F2 Save to EEPROM fi Moue by Line Enter Select ESC Exit When menu is selected the previous values will be read from the MCU EEPROM and shown on the screen When ESC is used user is asked to confirm the EEPROM values saving Error handling is done as in other functions which read and save EEPROM values Page 7 38 Amendment 1 04 97 After Sales RAE RAK 1N Technical Documentation Service Software 4 ME Memory Functions c H Product Profile Settings gt Write HW Version IMEI Edit IMEI Transfer E Set UI Factory Values Set Factory Values E Ee GE rA 3 4 5 6 deterrent etter everett et GE ZE i Fi Help tl tove by Line Q Quit When ME Memory functions menu is selected the Phone Mode must be set to Local If the local mode is not set an error message is shown Different parameters saved to the memory of ME can be read from memory or written to the
386. upply voltage range is 4 65 4 95 V The card detect input of the ASIC is connected to BTYPE pin and when the battery is removed the ASIC will drive the SIM down The interface to the DSP is done using 6 bit address bus 16 bit data bus IOX and RWX lines Data bus is latched using IOX address bus is not The ASIC also generates interrupt INTO when an edge occurs in DBUS line if the mask bit is off INT1 is used as RX interrupt and as MFI modulator interrupt to the DSP Viterbi is used to perform GSM PCN convolutional decoding and bit detection according to the Viterbi algorithm It can be controlled and accessed thoroughly by the DSP Original 08 96 Page 2 37 RAE RAK 1N After Sales Baseband Technical Documentation Coder is used to perform block encoding decoding and ciphering according to GSM algorithms A5 and A5 2 The ASIC takes care of the interface between the DSP and the RFI TX modulator RX filter TX and RX sample buffers and controlling state machine The interface to RFI is done using 12 bit data bus 4 bit address bus RDX and WRX There is also data acknowledge DAX signal from HFI to ASIC Also in this block is the serial RF synthesizer interface SCLK SDAT SENA1 and the digital RF control signals RXPWR TXPWR TXP SYNTHPWR Main components D2CA ASIC physically in MCM2 2x TC7S00F D300 D301 NAND gate Inverter buffer stage is used for converting the low level VCXO clock to valid logic levels Tran
387. ure lists the names of the main menus and their sub menus Third level menus are not shown here Some menu functions are shown in italics these denote a network service Press MENU Key Scroll Press SS to scroll thru menu options Select function Press Select to view sub menu options and then Select again to modify the option Shortcut facility Press MENU key then enter the number of the menu function required see following table The main menu features available are listed in the table below EE No DUDEN Nb NN CALLS 1 Dialled calls 2 Received calls 3 Missed calls 4 Erase all recent Calls MESSAGES 1 Listen to voice messages 2 Set voice mailbox number 3 Head messages 4 Broadcast messages VOICE CALL DIVERTING 1 Divert all voice calls 2 Divert when busy 3 Divert when not answered 4 Divert if not reachable 5 Cancel all diverts Original 08 96 Page 11 RAE RAK 1N Quick Guide Menu No Shortcut Page 12 After Sales Technical Documentation PHONE SETTINGS 1 Lights 2 Ringing volume 3 Ringing tone 4 Keypad tones 5 Warning tones 6 One touch dialling 7 Automatic answer 8 Cell info display 9 own number sending 10 Call waiting 11 Restore factory settings 12 Menu list SECURITY OPTIONS 1 PIN code request 2 SIM change security 3 Voice Call barring 4 View fixed dial list 5 Fixed dialling 6 Change access codes 7 Closed user group 8 System lock DURATION AND COST 1 Call duration 2 Call cost
388. us Charging Holder MBRIST erg See EN Der DE e RATE dE Mounting Plate MKE 1 Flat Mounting Kit MKK 1 and Swivel MKR 1 JUNCHON Box HFJ 3 d Aen sites Aa acht en recu Clm RE Et sce miri as Hands Free Microphone HFM 10 and Speaker HFS 6 Power Cable POH M EEN Handset HSU 1 optional i inia tne pum Ett meni mm mine RS 232 Adapter Cable DLR 1 optional External Mobile Antenna not supplied n on n nnnnn unnan E EEN Car Radio Muting CRM ug dE eb dra lgnition Sense IONS asss ibd xh ves ance E mese a ASE as weed TESIM EE List of Figures Figure 1 GARKGO Kit and options iu Ra o xx alterada Figure 2 Flat Mounted Fixing ky Figure 3 Swivel Mounted Fixing KIEiiud dese RR ERR fesse ESL REDE REG Figure 4 Radio Muting Circuit oocoocccoccconocnnnro o Original 08 96 O O OO Oo Oo OO OO O OO CI i i sch ch O O cd Oo N RAE RAK 1N After Sales CARK60 Installation Guide Technical Documentation This page intentionally left blank Page 4 Original 08 96 After Sales Technical Documentation RAE RAK 1N Series Introduction This installation guide has been prepared to provide the basic information necessary to install this car kit This guide is not intended to be definitive because different types and models of vehicles will require different installation work The information given is for general guidance only The terms of warranty demand that this car kit be installed by an experi
389. ve VSYS shut down VSYS 3 135V 3 465V regulator Imax 500mA VCC5 4 825V 5 5 175V PDA FLASH pro gramming voltage Imax 50mA LCDVEE 17V 22V 25V regulator Imax 6mA PDALCD bias voltage LCDVCC 3 135V 3 3V 3 465V VSYS to LCD that can be switched off VF test 11 4V 12V 12 6V Flash programming voltage for CMT module age VCHAR 10 0V 12V 13 0V Charger specification without load PDA CMT VCHARGER 10 0V 12V 13 0V Charger specification 730mA 780mA 830mA VCHAR in to 9000 Original 08 96 Page 6 7 RAE RAK 1N PDA Hardware After Sales Technical Documentation Table 3 DC characteristics of board to board connector Signals Line Symbol ll BACKLIGHT OV Output low back lights off 4 7V Output high back lights on Display and key pad illu mination control RBUSRxD RBUSTxD 12 UIF XPWRON 15 SIM BUZZEROUT 2 735 V State 1 3 6V 4 85V ilia State 0 State 1 State 0 State 1 1 mA load State 0 Floating when inac tive A pull up in Output low buzzer off Output high buzzer on RBUS re ceived data to CMT RBUS re ceived data to CMT Dur ing CMT FLASH download RBUS trans mitted data from CMT 0 7V Input low power on off Input low Input high keypad columns Output Input low Output Input high keypad row lines display data lines Page 6 8 Output Input low Output In
390. w read write strobe for LCD driv er Output Input low keyboard row LCD driv ii 4 ul 4 Output Input high Output Input low Output Input high er register select enable strobe for LCD driv er State 1 DBUS 4 85V 5 0V State 0 State 1 State 0 clock 512 kHz DBUS sync 8 kHz State 1 DBUS re ceived 0 0 0 0 0 0 0 7 0 k V IN V IN V IN V IN V V V 6V V State 0 State 1 1 mA load State 0 data to CMT DBUS trans mitted data from CMT OV Input low level Isink lt 5m 3 0V Input high level ABaud rate 9600 OV Bw oa Output low level Output high level Lid open Lid closed bits s or double Cover switch status 2 SIMFLEX BUZZER Original 08 96 3 3V 0 0V 1 0V OV 0 7V 3V 72V 8 4V Output low buzzer on Output high buzzer off Buzzer on SIM flex Page 2 9 RAE RAK 1N Baseband After Sales Technical Documentation 6 SIMFLEX SIMCLK 3 0V 4 85V 5 0V State 1 ov 0 2V 0 7V State 0 7 SIMFLEX SIMRESET 4 V 4 85V 5 0V Output high OV 0 7V 8 SIMFLEX Clock for SIM card Reset for SIM card Output low SIM card reader supply voltage 9 SIMFLEX SIMDATA Data for SIM card Input low level Input high level Output low level Output high level Table 5 Battery m
391. w and pressing Select If an Internet application is already active you must close it by pressing Close before you can start another Note Depending on the network configuration and load establishing an Internet connection may take some time If a connection is idle for longer than the factory set time out period the connection is terminated automatically This time out period applies to connections made with all Internet applications In addition the World Wide Web application has its own Auto disconnect period When you want to disconnect from the host press Hang up Disconnecting is indicated by a note and the data call indicator disappears When the Internet applications main view returns on display the communicator is no longer connected to the Internet Page 22 Original 08 96 After Sales RAE RAK 1N Technical Documentation Quick Guide Mail Mail enables you to send and receive mail The Mail system is compliant with the Internet standards SMTP IMAP4 and MIME1 Own texts contains previously created texts Received mail contains mail fetched from the Remote mailbox Remote mailbox this is a network service and receives all incoming mail using the IMAP4 standard Document outbox storage area for outgoing mail BZ A SS Open ea Mail C Received mail M ll CD a G2 Remote mailbox m a DEM uE Document outbox Settings CD O __ saul a Close C gt
392. w noise preamplifier The gain of the amplifier is controlled by the AGC control line PDATAO The nominal gain of 10 dB in PCN is reduced in the strong field condition about 24 dB and in GSM the nominal gain of 16 5 dB is reduced about 36 dB After the preamplifier the signal is filtered by ceramic PCN or SAW GSM RF filter The filter rejects spurious signals coming from the antenna and spurious emissions coming from the receiver unit In PCN the filtered RF signal is down converted by a passive diode mixer The frequency of the first IF is 313 MHz The first local signal is generated by the UHF synthesizer The IF signal is amplified and then filtered by a microstripline filter The filtered 1st IF is down converted by the second mixer which is also a passive diode mixer The 2nd IF frequency is 87 MHz The 2nd local signal is generated by the VHF synthesizer In the GSM system the filtered RF signal is also down converted by the passive diode mixer The first IF frequency is 71 MHz and the first local signal is generated by the UHF synthesizer All the IF signals 71 and 87 MHz are amplified and filtered by SAW filter in GSM and PCN The filter rejects adjacent channel signal intermodulating signals and the last IF image signal The filtered IF signal is fed to the receiver part of the integrated RF circuit CRFRT In CRFRT the filtered IF signal is amplified by an AGC amplifier which has gain control range of 57 dB The gain is cont
393. wn 4 5 IMEI Transfer The purpose of this function is to transfer the IMEI code from an old system board to a new system board This function is used when system boards are changed The selection program asks to confirm the function with Y key Pressing the N or Esc keys cancels the selection After pressing Y key the IMEI is read from EEPROM to PC When the IMEI code is received by PC information is displayed and the IMEI code is destroyed in the EEPROM After clearing the IMEI number the old system board becomes unusable Caution The IMEI is now situated in the PC and quitting the Service software program at this stage will cause all IMEI data to be lost At this time switch the phone power off exchange the system boards and switch the phone power on again A Selftest failed message will appear in the phones display After pressing the Enter key the IMEI will be transferred to the new system board The IMEI data in the PC will be cleared and cannot be used again For resetting the phone you must select the Initialize phone option from the Main menu If the phone does not show the Selftest failed message the transfer is successful If the fail message is still displayed contact your local technical support Amendment 1 04 97 Page 7 41 RAE RAK 1N After Sales Service Software Technical Documentation 4 6 Set Ul factory Values This function sets the Ul parameters to factory de
394. x ea commodo consequat Duis autem vel eum iriure dolor in hendrerit in Delete CN Duis autem vel eum iriure dolor in hendrerit in vulputate velit esse molestie consequat vel illum vulputate velit esse molestie consequat vel dolore ou feugiat nulla facilisis at pares illum dolore eu feugiat nulla facilisis at vero EE Close CD Figure 11 Fax Viewer Pressing View allows Zoom in Zoom out functions to be performed Rotate rotates the fax 90 degrees clockwise with each key press Delete deletes the viewed fax Original 08 96 Page 19 RAE RAK 1N After Sales Quick Guide Technical Documentation SMS Short Message Service DE The Short Message Service SMS is a network service and enables you to send and receive short alphanumeric text messages of up to 160 characters over the digital cellular network Short messages are particularly well suited for sending short urgent messages from one cellular phone to another Sending is practically instantaneous messages can be sent or received even during a voice or data call and can be read in any cellular phone that has the capability The SMS main view shows four folders and the Document outbox The Own texts folder contains texts that you have written Received messages contains short messages you have received Standard messages contains predefined message templates and Business cards contains all Contact cards in the Contacts directory Open ES
395. xternal memories are loaded through this mailbox in start up The DSP includes two serial buses One is used for digitized speech transfer between the DSP and the codec The other is used as an external data bus and it is connected to the B2B connector This bus can be used for DSP tracing in product development and also as a digital audio interface DAI in audio type approval measurements The clocks 512 kHz main clock and 8 kHz sync clock are generated by the D2CA ASIC In transmit mode the DSP codes the speech and routes the resulting transmit slots to the D2CA The D2CA ASIC controls timing and at specified intervals sends these bits to the RFI for D A conversion In digital receive mode the RFI A D converts the IF signal from the RF unit under the control of the D2CA The DSP controls the D2CA and receives the converted samples The received bits are detected from these samples in DSPU with the aid of some HW accelerators in ASIC After channel and speech decoding the bits are converted into an analog signal in the PCM codec The echo cancellation algorithms of the handportable and Hands Free modes are also performed in DSPU when needed In the case of the data or fax call the DSP performs CRC calculation or FAX V110 frame encoding decoding instead of the speech encoding decoding Channel encoding decoding and demodulation are performed in DSPU in this case also The DSP controls the RF through the D2CA ASIC where all necessary tim
396. yout 10 10 GSM version 09 Figure 9 CMT Component Layout Bottom 10 11 Figure 10 CMT Component Layout iop o 10 12 Figure 11 Baseband Circuit Diagram PWRU 10 13 Figure 12 Baseband Circuit Diagram MOM1 10 14 Figure 13 Baseband Circuit Diagram MOM2 10 15 Figure 14 RF TX Circuit Diagram uan aka mae aer ug co eia 10 16 Figure 15 RF RX Circuit Diagram uaxeus gege ER RE Aa Ee 10 17 Figure 16 UIF Schematic v10 Lssluuseluseeeeessss 10 18 Figure 17 UIF Component Layout wvi0 ee eee 10 19 PCN version 05 Figure 18 Component Layout Bottom Lis 10 20 Figure 19 Component Layout Top 10 21 Figure 20 RF TX Circuit DISOFSITI uud s seus dies oasis 10 22 Figure 24 RF RX Circuit Diagram 10 23 Figure 22 UIF Schematic v1 scsi E Res REEF E 10 24 Figure 23 UIF Component Layout vi 10 25 Page 10 2 Original 04 97 RAE 1N Component Layout Bottom Figure 1

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