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MSP430 Hardware Tools User's Guide (Rev. P)

1. INSTRUMENTS MSP TS430PZ100B www ti com jpa CE DuDSvs OOCOEE AS R1 R11 JTAG L 3 BOOTST Connector J5 J5 External power connector RW OO 060 S680 DO DO OOOO Jumper JP1 to ext Su dek j se 2o o o 95 o es e es els Ra e gle 27 o e ra Jumper JP1 e Open to measure current Ey e s JP1 0 C29 e e ncs je 0 acts o es e Orient Pin 1 of MSP430 device bed EE e n 9 c7 a e e Cep Le e DCL e nu m Reci fors OC mcg O JP11 JP12 JP13 Jumpers JP5 to JP10 e 9 6 707 EE 12 n e Connect 1 2 to connect Close 1 2 to debug in Spy Bi Wire mode e Bee e AUXVCCx with DVCC or Close 2 3 to debug in 4 wire JTAG mode e MC TT AE drive AUXVCCx externally E AUXU mice a S JP1 DC D4 NI connected to es Qu me ED E Eie D1 LED ted to P1 0 1 ux TEED D I 15 20 XXL NON 00000006 000000000000 al Jumper JP2 Open to disconnect LED Figure B 52 MSP TS430PZ100B Target Socket Module PCB 110 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430PZ100B Table B 28 MSP TS430PZ100B Bill of Materials Position Ref Des ponat Descripti
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3. MSP TS430DL48 Target Socket DL48 TITLE MSP TS430DL48 Document Number Date 11 14 2006 1 24 44 PM Sheet 1 1 Figure B 25 MSP TS430DL48 Target Socket Module Schematic 67 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430DL48 www ti com 10 0090000901 000001 Jumper J5 JTAG cos BOOTST Open to measure current int LED connected Connector J3 to P1 0 External power connector Jumper JP1 to ext 000000000000 000000000000 U 1 Jumper J4 Open to disconnect LED 000000000000 000000000000 Orient pin 1 of MSP430 device Figure B 26 MSP TS430DL48 Target Socket Module PCB SLAU278P May 2009 Revised September 2013 68 Hardware Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430DL48 Table B 14 MSP TS430DL48 Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 C4 C7 2 10uF 10V Tantal Size B 511 1463 2 ND 3 C3 C5 2 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 D1 1 yellow LED TH 3mm T1 511 1251 ND DNP Headers and receptacles enclosed wit
4. O DUCC XIN P2 6 XOUT P2 7 P1 0 P1 1 P1 2 P1 3 P1 4 P1 5 P1 6 P1 7 P2 0 P2 1 P2 2 P2 3 P2 4 P2 5 P3 0 P3 1 P3 2 UL RUCC D AUSS RST NMI TCK TMS TDI TDO P4 7 P4 6 P4 5 P4 4 P4 3 P4 2 P4 1 P4 0 P3 7 P3 6 P3 5 P3 4 P3 3 Socket Enplas QFN 4 B 5 01 GND If external supply voltage remove R11 and add R10 Ohm MSP TS430F 23x0 Target Socket Board for MSP43 F23x IRHA TITLE MSP TS430F23x0 Document Number Date 3 05 2007 09 31 46a Sheet 1 1 IC Schemati TS430QFN23x0 Target Socket Module B 19 MSP Figure SLAU278P May 2009 Revised September 2013 Hardware 58 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Jumper JP2 Open to measure current Jumper JP3 Open to disconnect LED LED connected to P1 0 O 0000000 14 00000002 18 00000 000002 JPL JTAG ext UcC Co int HO m v N Ke 1 H 0000000000 a DCL c5 H Hi J4 BOOTST e 0 35 0 0000000000 c
5. ucc p4 em J3 GND 0 oe 0000000000000000000000000 SND 8 Be J 75 70 mi 65 8 55 51 anm nie Ww sje l 1300 lt 18 INSTRUMENTS e ee i7 o lz n 9 y ee 22 el n e 2 40 E C48 535 r1 el C19 e S Ite eil e Za C36 Ze c39 ac3g D2 000000000 e GND C7 D e e QA o e o e v Jmm UBAT elg c18C11 e 1 oucc ED e EZ Zeg de s JP3 R12 eee ra y 5 8 Po Tore ees e i 02 e LED S p Okin eee e lea el 9 n e e CH esmle jess e MES c9 E ba D 0 RIS eng AN e g e ot ee e ee oo e Dm eo H Hoc000000 nd ee e Da RIE 10 as 95 a ege nacio e e jo e e 7 GE DB de 5 S ll p cs le 2553 gjen e e eec n o R8 C1 C2R6 e 0 gt ee R2 ej Ce e e la EN Te Lr Zei Mp 1 5 18 15 20 25 O 9009000009000000000000900090 7 Figure B 58 MSP TS430PZ100USB Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Hardware 119 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430PZ100USB www ti com Table B 31 MSP TS430PZ100USB Bill of Materials Pos Ref Des NO FET Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 2 C6 C7 2 10uF 6 3V Tantal Size B 511 1463 2 ND C5 C11 3 C13 C14 5 100nF SMD0805 311 1245 2 ND C19
6. 4 2 3 4 5 6 A JP5 JP6 JP7 JP8 JP10 J5 R7 Too Da 1 ijs ijs SBW 1 330R RSTDVCC SHWIDIO m C9 ML 4 D 075 lt JTAG GND Ee RST NMI De tcea tms De moes 0a z E HEAD 1X3 PINHEAD 1X3 PINHEAD 1X3 PINHEAD 1X3 PINHEAD_1X3 PINHEAD 1X3 PINHEAD 1X3 ca TEST SBWTCK TT ae END ei DVCC RS o e EG Ce OR E y TE x HORTCUT2 R10 5 ext ay R pice tbd C4 vecja HH E int aH c8 TERIH S5SS55SS BSL z E JP3 A dao JE ob ofl fol af 0 oR 2 2nF 47K 2 EST SBWTCK DI Ip EES 12 1401 OS RSTDVCC SBWTDIO P1 7 Har P1 1 Ta0 0 gt 2 e R2 FB Eo b Ez Ez s bz 8 S Ste BOOTST PINHEAD 1X2 OR TELVA eLEEPEER UBB BEBER c Je TETTE 100nF 10uF ET Er ag EEEEEE J1 5 be DVCC 40uFl qu 1 p6 0 0B0 A0 S P4 7 PM NONE 48 16 a Ri C30 8 2 2 pesce Sam none AT Ge DVIO Power Circle OR B P6 2 CB2 A2 P45 PM UCATRXD D BH 4 pe3icB3 a3 P4 4 PM UGATTXD 45 13 gi 5j FACE P4 3 PM UGBICLK 44 121g SHC1 100nF me 6 pe5 0BS AS P4 2 PM UCB1SOMI 43 ile enp PINHEAD 1X3 2 CH DP 7 rearpong P4 1 PM UCBISIMO 42 10 y 3 ng JP4 m 8 67108717 Ut P4 0PM UCBiSTE 41 9s 2s Lis 1 61 T2pF a 9 9 P50 ABVEREF MSP430F5229 ovio 40 lg Tom rem d Zle wHo 10 p5 1 a9vEREF pvss 39 Let 1 1 j PINHEAD 1X2 a1 11 avec P3 AJUCADRXD UCADSOMI 6 le t 12 5 R6 Tatt P54 XIN P3 3 UCAOTXDIUCAOSIMO a EID Q1 R R8 g 13 13 pssxour Pa2IucBocLKucAosrE 36 Ale 100nF 4 7uF OR VE AVS gt 14 ass P3 11UCBOSOMVUCBOSCL 35
7. a 58 Bild MSPSISA30RSBAO EE 61 Ee MSP TS430RHA40A E 64 Bild MSP IS430D148 cR 67 B 14 MSP TS430RGZ48B deeg EeeER dee dee rra eer sva ers rock serta a ed SEENEN EENS 70 B 15 IMSP TS430RGZ48G D a ia 73 B16 MSP 1TS430PM64 p A 76 2 Contents SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated I TEXAS INSTRUMENTS www ti com B 17 MSP IS430PM64A eege iia tio 79 B 18 MSP TS430RGG64B sus ege sexi edle iaa ER Cake WEITEN 85 B 20 MSP TS430RGGOA4USB visenten and scream a 89 BS MSP TS430PN80 eiert e eeng e ege a ENEE EE cheeses RN DD FED NEQU NDS E 93 B22 IMSP TIS430PNS0A Legs C A A a 96 B 23 MSP T5430PN90USB ici ed See EEN an Des AE MCI Md cmd DCN DRE 99 Ee DE Le DO WE 103 B25 MSP TS430PZ100A vasen smekke Gea der 106 B26 MSP TS430PZ100B e 109 B27 S S EE TED e 112 B 28 MSP TS430PZ5X100 RE 115 B29 MSP TS430PZ100USB kuna rebranded EENS NEEN E ANEN 118 B 30 MSP IS430PEUM28 ee SNE Ife pel NTN 122 B 31 EM430F5137RF900 m e ci 125 B 32 EM430F6137RF900 iii dea 129 B 33 EM430F6147RF900 ii ii 133 B34 MSP FETASO0PIE E EE 187 B 35 MSP FET430UP er 139 B 35 1 MSP FET430UIF Revision History rxrnnennnennnnennnnnnnenennnnnnnennnnnnnnnnnnnnnenunenunnnnnnnnnn 144 C Hardware Installation Guide 145 C 1 Hardware Installati n TR EN RENE
8. e e R12mm 9 BEER Die Ke C4 nci OL C8 02 e EA UL ej e e ek ei e e e el e e er 63 Ez 000000 EL C13 C12 By LED 21 25 412 39 SS 000000000000000000001M 10 Tp 35 40 Z5I 0O00000000000000000009 MSP TS43 PN8 A Rev 1 8 RoHS Figure B 44 MSP TS430PN80A Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated MSP TS430PN80A Connector J5 External power connector Jumper JP3 to ext gt If the system should be supplied via LDOI J6 close JP4 and set JP3 to external Hardware 97 A TEXAS INSTRUMENTS MSP TS430PN80A www ti com Table B 24 MSP TS430PN80A Bill of Materials Position Ref Des pad Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C3 C4 0 47pF SMD0805 DNP C6 C7 3 C10 C12 3 10uF 6 3V SMD0805 DNP C10 C5 C11 4 C13 C14 5 100nF SMD0805 311 1245 2 ND C15 5 C8 1 2 2nF SMD0805 6 C9 1 470nF SMD0805 478 1403 2 ND 7 C16 1 4 7uF SMD0805 8 C17 1 220nF SMD0805 9 D1 1 green LED SMD0805 P516TR ND Ji J2 J8 SAM1029 20 ND DNP Headers and receptacles 10 i J4 0 20 pin header TH Header SAM1213 20 enclosed with kit Keep vias free of ND Receptacle solder 11 J5 J6 2 3 pin header
9. JF J2 0000000000 11 15 d Texas 20 INSTRUMENTS MSP TS430F23x0 Rev 2 2 MSP TS430QFN23x0 Connector J5 External power connector Jumper JP1 to ext Figure B 20 MSP TS430QFN23x0 Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 59 A TEXAS INSTRUMENTS MSP TS430QFN23x0 www ti com Table B 11 MSP TS430QFN23x0 Bill of Materials Pos Ref Des ae per Description DigiKey Part No Comment oard 1 C1 C2 0 12pF SMD0805 DNP 2 C3 1 10uF 10V Tantal Size B 511 1463 2 ND 3 C4 1 100nF SMD0805 478 3351 2 ND 4 C5 1 10nF SMD0805 478 1383 2 ND 5 D1 1 green LED SMD0603 475 1056 2 ND DNP headers and receptacles enclosed with 6 J1 e J3 0 10 pin header TH kit Keep vias free of solder SAM1034 10 ND Header SAM1212 10 ND Receptacle T Place jumper on header 7 J5 JP1 2 3 pin header male TH SAM1035 03 ND JP1 Pos 1 2 8 JP2 JP3 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 3 Jumper 15 38 1024 ND Place on JP1 JP2 JP3 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH BEER solder Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load pA UTEM solder 12 5pF 13 R1 1 330 Q SMD0805 541 330ATR ND 14 R2 R3 0 0 Q SMD
10. R Eu m o coo ajo jo o Im 330R JP1 Open JP1 if LCD is connected CC430 R4 47k C3 58 B 58 P7 3 TCK S35 P7 2 TMS S34 p7 e roo To1 s32 94 54 D UD q loz UD 3 d E E o H RST NMI SBHTDIO tio ER ERES EE aS E 3 33 Po E EE SE n Hox E SE P6 1 UCBOSONL UCBOSCL P 2 UCBOSIMO UCBOSDR P6 3 UCB STE UCA CLK A3 CAS UEREF UREF P6 4 UCB CLK UCA STE A4 CA6 UEREF UREF P6 5 UCABRXD UCABSOMI AS P6 6 UCABTXD UCABSIMD A6 Duce XIN 1 XOUT U DUss P6 7 A7 CA7 SUSIN P4 7 ADC1 CLK S P4 6 S1 P4 5 52 P4 4 53 P4 3 54 Socket Yamaichi 1C51 0644 807 3 T81 4 912 P2 2 TA1 3 513 P2 1 TA1 2 S14 pi o taeo sa1 53 53 P1 1 TAB 9 MCLK S30 P2 0 TA1 1 515 2nF IM DNP GND 3 3 3 1 C D GE JP6 JP8 P1 2 TAB 1 529 P1 3 TAL B SUSOUT S28 P1 7 TA CLK CADUT CAL P3 4 CADUT 519 PL 4 TAL O S27 1 5 TA CLK CADUT 526 MSP430F 41x2 P3 3 TAB TALCLK S20 P5 2 R13 LCDREF P1 6 ACLK CA P7 6 TAD 2 525 P5 0 TA1 1 524 R33 LCDCAP P5 1 R23 P5 3 R 3 P5 4 COM3 P5 5 C0M2 P5 6 COMA P5 7 CO0N P3 0 T81 2 523 P3 1 T61 3 522 P3 2 TA1 4 521 R1 Ol DN JP9 2 P7 3 TC HF TESLSBWICK ADD LCD CAP EE GND If supplied by interface populate R11 OR remove R1 If supplied locally populate R10
11. 114 Hardware Copyright 2009 2013 Texas Instruments Incorporated SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback MSP TS430PZ5x100 di TEXAS INSTRUMENTS B 28 MSP TS430PZ5x100 www ti com UCC RZ 338R Ick 1 JP5 ns DI DO TEST SBWTCK XTLGND2 2 2nF C8 RST NMI DNP If BSL is used If external supply voltage remove R11 and add R10 OH wl QFP1 PZ XTLGND1 m Socket Yamaichi 1C201 1004 008 NN OO G OO x 10 0 IN O0 D GO NL OO x 10 0 OO D 9 LOL Q0 00 00 00 00 00 00 00 00 CO s TT TTT TTT TH MSP430 Target Socket MSP TS430P25x100 for F543x TITLE MSP TS430P25x100 Document Number Date 3 20 2008 08 03 58a Sheet 1 1 115 Hardware Schematic TS430PZ5x100 Target Socket Module Copyright O 2009 2013 Texas Instruments Incorporated B 55 MSP Figure SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback MSP TS430PZ5x 100 Connector J5 External power connector Jumper J3 to ext Jumper JP1 Open to measure current Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Jumper JP3 A TEXAS INST
12. AO JI see Note A i O 1 eo d Ve AV DN J see Note A 1 l C2 63 R1 10 uF IT 01pF 47 KQ S See Note B JTAG VCC TOOL TDO TDI P RST NMI SBWTDIO VCC TARGET TCK GND TEST SBWTCK ci 2 2nF 1 Nal DN See Note B A Make connection J1 if a local target power supply is used or make connection J2 if the target is powered from the debug or programming adapter B The device RST NMI SBWTDIO pin is used in 2 wire mode for bidirectional communication with the device during JTAG access and any capacitance that is attached to this signal may affect the ability to establish a connection with the device The upper limit for C1 is 2 2 nF when using current TI tools Figure 2 3 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F5xx and MSP430F6xx Devices SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Design Considerations for In Circuit Programming Copyright O 2009 2013 Texas Instruments Incorporated 23 A TEXAS INSTRUMENTS External Power www ti com 2 2 2 3 24 External Power The MSP FET430UIF can supply targets with up to 60 mA through pin 2 of the 14 pin connector Note that the target should not consume more than 60 mA even as a peak current as it may violate the USB specification For example if the target board has a capacitor on V more than 10 uF it may cause inrush current during capacitor
13. 88 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com B 20 MSP TS430RGC64USB Due to the use of diodes in the power chain the voltage on the MSP430F5xx device is approximately 0 3 V lower than is set by the debugging tool Set the voltage in the IDE to 0 3 V higher than desired for example to run the MCU at 3 0 V set it to 3 3 V MSP TS430RGC64USB ong 3 D Giel E eed dUf9TId ON9 QN9 OND HIIMES7ISIT R11 1M SNA JE 3 4 JE Ela s 212 oR L AA NN ER HIE a 281320 o c rc D o af Tag M 3 a 2 Cl apy o X A M Z ois wv N E I 5 S 3 mud e Tl o a S a e gt 2 dx H o N S o a n y S 3 E A 2 o EN c D a D w V o A W 3 2 2 ES 2 EN p M Es e Ho pm aS TUEUEA TA 080 48z01 1184205 1 IC 101 VC TI i T wane za 24 102 104 L3 Tn ON9 OND 60SS 4J0E dSW o5ejaeiu gen MIr gt mas gt ang PUR3 j Teusaixe Oi Edf 185 pue part f aso gsn el parrddns aq pinoys WaISAS aui j 310N 8 D4 BHi E gt o LED 470R d 2 p LED2 OND 03
14. 38 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430L092 Table B 3 MSP TS430L092 Bill of Materials Pos Ref Des No nor Description DigiKey Part No Comment 1 C1 C2 2 330nF SMD0603 2 C5 1 100n SMD0603 3 C6 1 10u SMD0805 4 C10 1 100n SMD0603 5 EEPROM1 1 M95512 5008 SO8 ST Micro M95160R Digikey 497 8688 1 ND DNP headers and receptacles enclosed with kit 7 J1 J2 2 7 pin header TH Keep vias free of solder SAM1213 07 ND Header SAM1035 07 ND Receptacle 8 J3 1 3 pin header male TH SAM1035 03 ND 9 J4 J5 2 FEAL FE4H 4 pol Stiftreihe DNP eee ieee solder Reichelt MicroMaTch 11 J13 1 MICRO_STECKV_10 Connector MM FL 10G 12 JP1 JP2 JP3 3 2 pin header male TH SAM1035 02 ND place jumper on header 15 L1 1 33uH SMD0806 LQH2MCN330K02L Farnell 151 5557 16 LED1 LED4 2 LEDCHIPLED_0603 Farnell 1686065 17 Q2 1 BC817 16LT1SMD BC817 16LT1SMD SOT23 BEC 18 RO R6 R7 3 2K7 SMD0603 19 R1 1 1k SMD0603 20 R2 1 47k SMD0603 R4 R5 R8 21 R10 RC RD 6 10k SMD0603 22 RA 1 3 9k SMD0603 23 RB 1 6 8k SMD0603 24 Ut 1 ae Socket 10189 0142 Manuf Yamaichi DNP Enclosed with kit Is 22 MSP430 2 MSP430L092PWR supplied by Tl SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback
15. SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 111 A TEXAS INSTRUMENTS MSP TS430PZ100C www ti com B 27 MSP TS430PZ100C w 2 Oo o 2 Si mp f e o D ker e IT 3 8 El o g A SR s gt o vcc L E E E Spe p PEA poz FS sez E 235 iw i 25 o 88 lt lt H 4 sp ES 28 D 3 gee o E P zg O o O F 7 o s 5 S 5 o 33 pl gt 2 REE UC ES og 22008 p vera ag 2 ii r cn Pak T E o a 9 z o d ul U N PFTS A zie ITOcIX UH ON 8L315d Won t 1a OND T J2 E Q lio fro g Zz gt 2 amO E ES x 3 QNS DOT o W I T ode FT go 39 25 9 o6 3 83 J5 O O 2 155 ol of a PWR3 7 ol 4 ol a o 2 E E v pl z m Aa Hl oi u BI 3 2 S l a N zl 8 2 E e N I ro ol 3 4 2 e HI o d PI o amp o mA 3 8 Ka EN v 2 o N S es R S 2 o O P 4 o R p E T N S o 5 o m D p Som P m Figure B 53 MSP TS430PZ100C Target Socket Module Schematic 112 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Ju
16. Xi TEXAS INSTRUMENTS www ti com MSP TS430PEU128 B 30 MSP TS430PEU128 veci JP4 AS 10UF 6 3V JP5 2 IESI 3 4JP7 re 2 2 2 RST NMLS Ick 3 IMS A JP10 4JP9 E j lt SBW ToL 1 Ino 3 lt JTAG 12 Katie 10uF 6 3V DNP GND eiT ASS XIN XOUT AUXVCC3 RTCCAP1 RTCCAPO P1 5 SMCLK CBO AS P1 4 MCLK SDCLK CB1 A4 P1 3 ADC10CLK TACLKIRTCCLI AS P1 2 ACLK TA3 1 A2 P1 1 TA2 1 VEREF A1 P1 0TA1 1 TA0 0 VEREF AO P2 4 PM_TA2 0 P2 5 PM_UCBOSOMI PM_UCBOSCL P2 6 PM USBOSIMO PM UCBOSDA P2 7 PM UCBOCLK P3 0 PM UCAORXD PM UCAOSOMI P3 1 PM UCAOTXD PM UCAOSIMO IC1 P3 2 PM UGAOCLK P3 3IPM UCATCLK P3 4 PM UCATRXD PM UCA1SOMI P3 5 PM UCATTXD PM UCA1SIMO COMO COMI P1 6 COM2 P1 7 COM3 P5 0 COM4 P5 1 COM5 P5 2 COM6 P5 3 ICOM7 LCDCAP R33 P5 4 SDCLK R23 P5 5 SDODIO LCDREFIR13 P5 6 SD1DIO RO3 P5 7 SD2DIO CB2 P6 0 SD3DIO P3 6 PM_UCA2RXD PM_UCA2S P3 TIPM UCAZTXD PM UCAZSII P4 0 PM_UCA2CLK P4 5 PM_UCB1SIMO PM_UCB1SDA P4 2 PM_UCA3TXD PM_UCA3SIMO 9 GRXDIPM UCASSOMI P4 1 PM UR P4 3 PM UCA3CLK P4 4 PM_UCB1SOMI PM_UCB1SCL P4 6 PM_UCB1CLK PA TIPM TA3 0 P6 1 SDADIO S39 P6 2 SD5DIO S38 P6 3 SDEDIO S37 MSP430F677XIPEU P10 3 55 RST NMISBWTDIO PJ 3ITCK PJ 2TMS INP Pu 1 TDUTOLK PLOTDO BOOTST A OR TEST SBWTCK P2 3 PM_TA1 0 P2 2 PM TA0 2 P2 1 PM TAQ 1 P2 0 PM T
17. This appendix presents solutions to frequently asked questions regarding the MSP FET430 hardware Topic Page ATO Hardware FAOS ER ET EE EE OOodO 26 R2 EKnownilssues EE 28 SLAU278P May 2009 Revised September 2013 Frequently Asked Questions and Known Issues 25 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS Hardware FAQs www ti com A 1 Hardware FAQs 1 MSP430F22xx Target Socket Module MSP TS430DA38 Important Information Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN P2 6 socket pin 6 and RST SBWTDIO socket pin 7 in system debugging can disturb the LFXT1 low frequency crystal oscillator operation ACLK This behavior applies only to the Spy Bi Wire 2 wire JTAG configuration and only to the period while a debug session is active Workarounds Use the 4 wire JTAG mode debug configuration instead of the Spy Bi Wire 2 wire JTAG configuration This can be achieved by placing jumpers JP4 through JP9 accordingly Use the debugger option Run Free that can be selected from the Advanced Run drop down menu at top of Debug View This prevents the debugger from accessing the MSP430 device while the application is running Note that in this mode a manual halt is required to see if a breakpoint was hit See the IDE documentation for more information on this feature Use an external clock sour
18. p LED3 p St m 1 031 R15 03 rr 470R gt R16 SE zT 470R e R13 s2 m nl Pajquasse jou SNOSUEI SISTNY Figure B 39 MSP TS430RGC64USB Target Socket Module Schematic SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 89 MSP TS430RGC64USB 90 Hardware Qu Hs Xp Texas St EI god INSTRUMENTS eno 8 Gun 0000000000000000 USB1 m a J3 33 Bo C11 11 a N Cie m 1 se S B e Sue 3 ee o 9 o C409 n C33 ej Yo e e m C35 e Og D2 e r38533 00000 e pa e Ria 000000 e E e Bg p34 ri p e e e c cH pas m 9 e 7 o Ua e css See See g e s Yen e D on OM ss e 4 X e cn es s ef ote d e o z e n a e e ei O e o e ER AN e g e o e bod ee 00 e o o ee e el J ee e m 19 CA jo e e 10 poe E e el 01 8 Lm m012 je S1 os 0in T1C13 ee Si Dir JP2 LED1 eu mm OD rn 00 575 D sade Car 16 r3 ax JTAG LEQ3 A JE ez ma 0000000000000000 a ODE j Figure B 40 MSP TS430RGC64USB Target Socket Module PCB TEXAS INSTRUMENTS www ti com SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated
19. 1 6 J2 see Note A Vel AV DN C2 pr dI cd IC R1 gt 10yF 47 KQ See Note B JTAG i VCC TOOL THONTDH e RST NMI SBWTDIO VCC TARGET TEST VPP TCK GND R2 3300 TEST SBWTCK C1 2 2nF V JAV IDV See Note B 22 If a local target power supply is used make connection J1 If power from the debug or programming adapter is used make connection J2 The device RST NMI SBWTDIO pin is used in 2 wire mode for bidirectional communication with the device during JTAG access and any capacitance that is attached to this signal may affect the ability to establish a connection with the device The upper limit for C1 is 2 2 nF when using current TI tools R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the TEST VPP pin during the fuse blow process If fuse blow functionality is not needed R2 is not required populate 0 Q and do not connect TEST VPP to TEST SBWTCK Figure 2 2 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F2xx MSP430G2xx and MSP430F4xx Devices Design Considerations for In Circuit Programming SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Signal Connections for In System Programming and Debugging Importanttoconnect Veo 1 A MSP430Fxxx 438
20. C12 elen Co TGTRST R42 TTMS R21 100R ITCK CH a R22 188R SELT LI 1 R SN74LVC1G125DBV assembled SN74LUC1G 7DBU l T 3 n G f ND USBFET MSP FETU43 IF Document Number Date 7 25 2006 03 38 10p Sheet 2 4 2 of 4 IC Schemati FET430UIF USB Interface 70 MSP igure F SLAU278P May 2009 Revised September 2013 Hardware 140 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated di TEXAS INSTRUMENTS MSP FET430UIF www ti com 3 6U 6 6U UF R16 UcC 38k1 8 1 ADC I R17 C 22k1 0 1 8 TI GND GND Ji Ni R18 UCCT 3 ki 1 41 C24 Ma 108u 16U R48 39k2 8 17 ADC2 LC R19 22k1 0 1 GND BUCHSE2 J4 BUCHSE2 IN1 OUTI UCCT 1 8U 5U IN2 OUT2 EN FB UV PG SETUCCT TRS e7a sex 0 17 242 16 DI 2k2 RZ2 RIS UCCR 3 k1 0 1 ADC3 Ct R47 c37 22K1 0 1 T GND GND C R14 C17 22k1 0 1 Tu GND GND 39k2 0 1 CI CI ES 30k1 8 1 END m 10uF 76 3U 6k81 0 1 TPS77301DGK USBFET TITLE Document Number Date 7 25 2006 03 38 10p MSP FETU43 IF Sheet 3 4 141 Hardware 3 of 4 Ic Schemati FET430UIF USB Interface igure B 71 MSP F SLAU278P May 2009 Revised September 2013 Submit
21. C411 CAPACITOR SMT 0402 CERAMIC 1 5pF ig ed rear GRM1555C1H1R5CZ01 MURATA 20 L401 L411 2 e SMT 0402 12nH 5 500MA Qw15AN12NJOO MURATA C46 C48 CAPACITOR SMT 0402 CERAMIC 2 0pF SE RE GRM1555C1H2ROCZO1 Murata 22 L1 1 Dre e 0402 6 2nH 0 1nH LQW15AN6N2D00 Murata ULTRA SMALL TACTILE SWITCH SMT 2P 23 Se 2 SPST NO 1 2x3x2 5mm 0 05A 12V B3U 1000P OMRON 24 R7 1 en SMT 0402 0 9 5 ER J 2GEOROOX UN PANASONIC 25 R2 R3 R6 A enger PANASONIC 27 C511 1 Gr Pr Ele 0402 GER 2200pF ECJ 0EB1H222K PANASONIC NE uc aM PANASONIC 28a C041 1 CAP CERAMIC 4 7UF 6 3V X5R 0603 EGJ 1VB0J475M PANASONIC 29 R441 E 1 SPRE EIEN ses GR eren PANASONIC o 30 R1 1 io A JUMPER SMT 0402 00 5 ERJ 2GE0R00X PANASONIC 81 xi 1 SMASTRIGHT JACK SMT 32K10A 40ML5 ROSENBERGER SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 131 A TEXAS INSTRUMENTS EM430F6137RF900 www ti com Table B 34 EM430F6137RF900 Bill of Materials continued No Pos Ref Des per Description Part No Manufacturer Board DUT SMT PQFP RGC 64 0 5mmLS 33 i 1 9 15x9 15ximm THRM PAD CC430F6137 4 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 35 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH 36a JP3 JP5 JP10 3 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 132 Hard
22. D rc rc O W W z x gt S 3 818 3 8 2 EE St St St St o St o o 3 o o 3 3 VW 3 3 S Supports all programmable MSP430 and CC430 devices F1xx F2xx F4xx F5xx x F6xx G2xx L092 FR57xx FR59xx MSP430TCH5E Supports only F20xx G2x01 G2x11 G2x21 G2x31 Supports MSP430F20xx F21x2 F22xx gt G2x01 G2x11 G2x21 G2x31 G2x53 Supports MSP430F20xx F21x2 F22xx e x G2x01 G2x11 G2x21 G2x31 Supports F5438 F5438A x Supports BT5190 F5438A x Supports only F552x x Supports FR57xx F5638 F6638 X Supports only CC430F613x x Allows fuse blow x Adjustable target supply voltage D Fixed 2 8 V target supply voltage x Fixed 3 6 V target supply voltage x D D X X X D D D 4 wire JTAG x x 2 wire JTAG x D X D D D x x x x Application UART x x x x x x x x Supported by CCS for Windows x D D D D D x D D D D Supported by CCS for Linux D Supported by IAR x D x X D X x D D D D The MSP FET430PIF is for legacy device support only This emulation tool will not support any new devices released after 2011 DI The 2 wire JTAG debug interface is also referred to as Spy Bi Wire SBW interface SLAU278P May 2009 Revised September 2013 Get Started Now 11 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated I TEXAS INSTRUMENTS Kit Contents MSP FET430PIF www ti com 1 2 Kit Contents MSP FET430PIF One READ ME FIRST document One MSP FET430PIF interfa
23. JP8 13 JP9 JP10 JP11 JP12 JP13 R1 R2 R4 R6 R8 5 OR 0805 541 0 0ATR ND R10 R11 2 OR 0805 541 0 0ATR ND DNP 10 C3 1 2 2nF CSMD0805 490 1628 2 ND DNP 11 C13 C14 C16 7 4 7uF 6 3V CSMD0805 587 1302 2 ND C17 C18 C19 C29 12 C11 1 10uF 6 3V CSMD0805 445 1372 2 ND 13 C12 1 10uF 6 3V CSMD0805 445 1372 2 ND DNP 14 C1 C2 2 12pF CSMD0805 490 5531 2 ND DNP 15 R5 1 47K 0805 311 47KARTR ND C4 C5 C6 C7 C8 100nF CSMD0805 311 1245 2 ND 16 6 C15 17 C9 1 100nF CSMD0805 311 1245 2 ND DNP 18 R3 R7 2 330R 0805 541 330ATR ND 19 C10 C26 2 470nF CSMD0805 587 1282 2 ND 20 BOOTST 1 10 pin connector male TH HRP10H ND DNP keep vias free of solder 21 JTAG 1 14 pin connector male TH HRP14H ND 22 IC1 Socket 1 Socket 1C500 1284 009P Manuf Yamaichi 23 IC1 2 MSP430F67791IPEU DNP enclosed with kit Is supplied by Tl 24 J5 1 3 pin header male TH SAM1035 03 ND 25 Qi 1 Crystal MS3V T1R 32 768kHz DNP Crystal enclosed with kit Keep vias 12 5pF 20ppm free of solder 26 TP1 TP2 2 Test point DNP keep vias free of solder 27 J2 J4 2 26 pin header TH SAM1029 26 ND DNP Headers enclosed with kit Keep vias free of solder 28 J2 J4 2 26 pin receptable TH SAM1213 26 ND DNP Receptacles enclosed with kit Keep vias free of solder 38 pin header TH SAM1029 38 ND DNP Headers enclosed with kit Keep vias 29 J1 J3 2 free of solder 38 pin receptable TH SAM1213 38 ND DNP Receptacles enclosed with kit Keep 30 J1 J3 2 vias free of
24. MALE Jumper JP2 int sgu vg S z d S Open to measure current BOOTST 000000000090 INSTRUMENTS gt k E ER3 C5 R2 z Ucc a GND R7 a JP8 JP7 JP6 JP5 JP4 0000000000 2 20 15 11 DC DC 0000000000 s1 35 40 MSP TS43 RHA4 A Rev 1 8 RoHS MSP TS430RHA40A Connector J5 External power connector Jumper JP1 to ext Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode D1 LED connected to P1 0 Jumper JP3 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B 24 MSP TS430RHA40A Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 65 A TEXAS INSTRUMENTS MSP TS430RHA40A www ti com Table B 13 MSP TS430RHA40A Bill of Materials Position Ref Des pad Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C1 C2 2 C5 0 2 2nF SMD0805 DNP C12 3 C3 C7 2 10uF 10V SMD0805 5 DNP C11 4 C4 C6 2 100nF SMD0805 478 3351 2 ND 5 C9 1 470nF SMD0805 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit Keep vias free of 7 Er d 4 10 pin header TH de Header Receptacle DNP headers and receptacles enclosed with kit Keep vias free of 2 4 10 pin header
25. Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP T5430D8 www ti com 14 pin connector for debugging only in Spy Bi Wire mode 4 Wire JTAG not available D1 LED connected to P1 2 Connector J5 External power connector Jumper JP3 to ext Jumper JP2 pee T Open to disconnect LED 00 a o e x Ka m o e 7 hs a q gt bp X ER A Figure B 2 MSP TS430D8 Target Socket Module PCB 32 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430D8 Table B 1 MSP TS430D8 Bill of Materials ea No per PE Position Ref Des Board Description DigiKey Part No Comment 1 J4 J6 2 2 pin header male TH SAM1035 02 ND place jumper on header 2 J5 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 3 SBW 1 10 pin connector male TH HRP10H ND 4 J3 1 3 pin header male TH SAM1035 03 ND 5 C8 1 2 2nF CSMD0805 Buerklin 53 D 292 6 C7 1 10uF 10V 1210ELKO 478 3875 1 ND 7 R5 1 47K 0805 541 47000ATR ND 8 C5 1 100nF CSMD0805 311 1245 2 ND 9 R2 R3 2 330R 0805 541 330ATR ND DNP headers enclosed with kit 10 J1 J2 2 4 pin header TH SAM1029 04 ND Keep vias free of solder 10 1 IP 1 4 pin socket TH SAM1029 04 ND 11 Ut 1 SO8 Socket Type IC369 0082 Manu
26. TH solder Header Receptacle J5 JP1 JP4 JP5 Place jumper on 1 2 of JP4 JP9 8 JP6 JP7 8 3 pin header male TH SAM1035 03 ND Place on 1 2 on JP4 JP8 JP9 9 JP2 JP3 2 pin header male TH SAM1035 02 ND place jumper on header 10 Jumper 15 38 1024 ND see Pos 8an 9 11 JTAG 1 tapin sd male HRP14H ND 12 BOOTST 0 NE en DNP Keep vias free of solder 13 U1 1 Socket QFN 40B 0 5 01 Manuf Enplas Micro Crystal MS3V T1R 14 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF 15 R1 R7 2 330R SMD0805 541 330ATR ND R2 R3 16 R5 R6 2 0 Ohm SMD0805 541 000ATR ND DNP R2 R3 R5 R6 R8 R9 17 R4 1 47k SMD0805 18 PCB 1 79 x 66 mm 2 layers Rubber select appropriate for 19 stand off 4 example Buerklin apply to corners at bottom side 20H1724 20 MSP430 2 MSP430N5736IRHA SCH enclosed with kit Is supplied by 66 Hardware SLAU278P May 2009 Revised September 2013 Copyright O 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback di TEXAS INSTRUMENTS MSP TS430DL48 www ti com B 13 MSP TS430DL48 Ext_PWR RST NMI R5 1 Fon 1C51 1387 KS 15186 t I CIE C5 10uF 10v 100nF oo o fun uo In Q1 C1 C2 not assembled
27. www wellscti com Yamaichi www yamaichi us SLAU278P May 2009 Revised September 2013 Frequently Asked Questions and Known Issues 27 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Known Issues A 2 Known Issues MSP FET430UIF Problem Description Solution MSP FET430PIF Problem Description Solution A TEXAS INSTRUMENTS www ti com Current detection algorithm of the UIF firmware If high current is detected the lc monitor algorithm stays in a loop of frequently switching on and off the target power supply This power switching puts some MSP430 devices such as the MSP430F5438 in a state that requires a power cycle to return the device to JTAG control A side issue is that if the UIF firmware has entered this switch on and switch off loop it is not possible to turn off the power supply to the target by calling MSP430 VCC 0 A power cycle is required to remove the device from this state IAR KickStart and Code Composer Essentials that have the MSP430 dll version 2 04 00 003 and higher do not show this problem Update the software development tool to this version or higher to update the MSP FET430UIF firmware Some PCs do not supply 5 V through the parallel port Device identification problems with modern PCs because the parallel port often does not deliver 5 V as was common with earlier hardware 1 When connected to a laptop the test signal is clamped to 2 5 V
28. 15009 ym ATddns gt ta p s D uuod Jedunp 9v T1 Zv 10 6812 edh TYDTEWEA 1193208 pg 8NId 8 LS G6NId 6 or SSn av LI 330 TM or cTNId zr er ETNId Ev bt bTNId Y 3INA PQ euo hiuo yu Bak JONO 404 deg neauseieg WO SATILUAS1TY 21 681 T Td Td INN 1SU4 E Zd 00L Z Zd 101 T ZA SUL 9 Zzd 21 Z6 1 20 ZNId 2 980 9NId 9 S GNId S CH Ze Je TNIG Q Zd 21 TNId 1s008n SSNA Top und 1x3 r 39nd To TNId T ssnd U1OHL OT NAILS OYIIN SNId Figure B 5 MSP TS430L092 Target Socket Module Schematic 37 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430L092 www ti com Settings of the MSP TS430L092 Target Socket Figure B 6 shows the PCB layout of the MSP TS430L092 target socket The following pinning is recommended e JP1 is write enable for the EPROM If this is not set the EPROM can only be read e JP2 and JP3 connect device supply with boost converter They can be opened to measure device current consumption For default operation they should be closed JZ1e eeeeve ecco c Rea R50 OR wig Qc m1 JE mp4 00000008 7 4 Y 10189 9142 146 TEXAS MSP TS430L092 INSTRUMENTS Rev 1 1 E Q Figure B 6 MSP TS430L092 Target Socket Module PCB
29. 2 When the external Voc becomes less than 3 V up to 10 mA is flowing in the adapter through pin 4 sense Measure the voltage level of the parallel port If it is too low provide external 5 V to the Voc pads of the interface The jumper on a the target socket must be switched to external power 28 Frequently Asked Questions and Known Issues SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated 13 TEXAS BOO d SLAU278P May 2009 Revised September 2013 INSTRUMENTS Hardware This appendix contains information relating to the FET hardware including schematics PCB pictorials and bills of materials BOMs All other tools such as the 62430 series are described in separate product specific user s guides SLAU278P May 2009 Revised September 2013 Hardware 29 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated I TEXAS INSTRUMENTS Appendix B www ti com Topic Page Bill MSP TS430D8 SN mens EM 31 Bi2 9MSPZTSASO0PWIA NE 34 Bis E EE lt LEE 37 B 4 MSP T95430L092 Active Cable PSA TE EEE 40 A AE E A E 43 B MSP TSA30DW28 NN TENE RTI 46 BZ MSP TS430PW28 EE 49 BIO EE AT KEE EE 52 B 9STMSP TS430DAS EE 55 B 10MSP T5430QEN23X0 ete e EUER EMEN INE I CEN DU LEE E E NES 58 Bit MSP TS430RSBA0 Kee 61 B12 MSP TSA3SO0RHAA40A EE 64 BilS MS Ee 67 Bi4 5 MSP TS430RGZ48B I EN E Mauer 70 B 15 IMSP TS430RGZ48G NN ET
30. 2 2nF SMD0805 DNP 5 D1 1 LED green SMD0603 Micro Crystal MS1V T1K DNP Cover holes and 6 Q1 0 QUARZ Crystal 32 768kHz C Load neighboring holes while 12 5pF soldering DNP Headers and receptacles enclosed with 7 J1 J2 2 14 pin header TH male kit Keep vias free of solder Header Receptacle DNP headers and receptacles enclosed with 71 2 14 pin header TH female kit Keep vias free of solder Header Receptacle 8 J5 IP1 1 3 Pin Connector male JP1 JP4 8a T tee 7 3 Pin Connector male Jumper on Pos 1 2 JP9 9 JP2 JP3 2 2 Pin Connector male with Jumper 10 BOOTST 0 ML10 10 Pin Conn m RS 482 115 A holes while 11 JTAG 1 ML14 14 Pin Conn m RS 482 121 12 R1 R7 2 330R SMD0805 12 R2 e R5 0 OR SMD0805 DNP 14 R4 1 47K SMD0805 15 U1 1 SOP28PW socket Enplas OTS 28 0 65 01 PCB 66 x 79 mm two layers Rubber stand off four pieces SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 51 Xi TEXAS INSTRUMENTS www ti com MSP TS430PW28A B 8 MSP TS430PW28A RST NMI SBWTCK Ext_PWR TMS TDI TDO SBUTDIO TEST SBWTCK SE to measure supply current JP2 R 330R RST SBWTDIO JTAG gt 2g3 TEST SBHTCK a SBW gt jpg R4 JP7 JP6 LI 47K UCC430 1 mec MSP43 G2XXX M
31. 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 127 A TEXAS INSTRUMENTS EM430F5137RF900 www ti com Table B 33 EM430F5137RF900 Bill of Materials continued No per e Manufacturer s Part Item Reference Board Description Value Number Manufacturer Comment 30 R1 1 RESISTOR JUMPER SMT 0402 04 00 ERJ 2GEOR00X PANASONIC 5 1 16W UNINSTALLED CAP CERAMIC 4 7UF 31 C041 0 6 3V X5R 0603 4 7uF ECJ 1VB0J475K Panasonic DNP 32 x1 1 SMA STRIGHT JACK SMT 32K10A 40ML5 ROSENBERGER 33 Q2 0 Crystal SMT 32 768 kHz 32 768k MS3V T1R Micro Crystal DNP DUT SMT PQFP RGZ 48 0 5mmLS m ui i 7 15x7 15x1mm THRM PAD CC430F52x1 n 35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 36 CON1 CON9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP 37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH 38 gio ie 3 Pin Connector 1x2pin 61300211121 WUERTH 38a JP7 CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP 39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP 40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 128 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com EM430F6137RF900 B 32 EM430F6137RF900 y
32. 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430PW24 www ti com Connector J5 External power connector Jumper JP1 to ext Jumper JP2 Open to measure current JP9 JP8 JP7 JP6 JP5 JP4 J J2 e Jumpers JP4 to JP9 o e e e a e Close 1 2 to debug in Spy Bi Wire mode e e Close 2 3 to debug in 4 wire JTAG mode e e e e e H e Orient Pin 1 of MSP430 device e e e e e e o 24 28 gt 0 65 02 00 e e 1 e D1 LED connected to P1 0 e mun Gu R xas Su nU oO Jumper JP3 INSTRUMENTS MSP TS43 PW24 Open to disconnect LED O Rev 10 Ro Figure B 10 MSP TS430PW24 Target Socket Module PCB 44 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430PW24 Table B 6 MSP TS430PW24 Bill of Materials Position Ref Des pad Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C5 1 2 2nF SMD0805 3 C3 C7 2 10uF 10V SMD0805 4 C4 C6 C8 3 100nF SMD0805 478 3351 2 ND 5 D1 1 green LED SMD0805 P516TR ND nz DNP Headers and receptacles 6 Ji J2 0 12 pin header TH C a enclosed with kit Keep vias free of solder Header amp Receptacle J5 JP1 JP4 JP5 Ua Place jumper
33. 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com m 2 Device Manager La Batteries 3 Bluetooth Devices Computer ap Disk drives E Display adapters 2 DVD CD ROM drives Y Human Interface Devices 3 IDE ATA ATAPI controllers pa Infrared devices gt Keyboards B Mice and other pointing devices k Modems Monitors B P multi port serial adapters ST MSP FET430UIF TI USB FET Adapter E Network adapters PCMCIA adapters 7 2 Ports COM amp LPT EI Bluetooth Communications Port COM4 I Communications Port COM1 Y ECP Printer Port LPT1 EI MSP FET430UIF Serial Port COM19 g Processors e Smart card readers Sound video and game controllers System devices Universal Serial Bus controllers BB RE EIE REI E Hardware Installation Figure C 4 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF430 SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware Installation Guide 149 ig Texas INSTRUMENTS Hardware Installation www ti com Device Manager File Action View Help EECHER CNN0797344 Batteries d Computer s Disk drives Display adapters gi Human Interface Devices a Bluetooth HID port from TOSHIBA a Bluetooth HID port from TOSHIBA Sa Bluetooth HID port from TOSHIBA 23 HID compliant consumer con
34. 83 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430RGC64B www ti com Table B 20 MSP TS430RGC64B Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 C3 C4 0 47pF SMD0805 DNP 3 C6 C7 C10 3 10uF 6 3V SMD0805 C5 C11 4 C13 C14 5 100nF SMD0805 311 1245 2 ND C15 5 C8 1 2 2nF SMD0805 6 C9 1 470nF SMD0805 478 1403 2 ND 7 C16 1 4 7uF SMD0805 8 C17 1 220nF SMD0805 9 D1 1 green LED SMD0805 P516TR ND JH J2 J3 SAM1029 16 ND DNP Headers and receptacles 10 UA a 0 16 pin header TH Header SAM1213 16 enclosed with kit Keep vias free of J4 e ND Receptacle solder 11 J5 J6 2 3 pin header male TH jer pa place jumpers on pins 2 3 on JP5 JP6 12 7 3 pin header male TH SAM1035 03 ND JP7 JP8 JP9 JP10 place jumpers on JP8 JP9 pins 1 2 on JP3 JP10 JP1 JP2 13 JP4 3 2 pin header male TH SAM1035 02 ND Place jumper on header 14 10 Jumper 15 38 1024 ND See Pos 12 and Pos 13 15 JTAG 1 Se connector male 4RP14H ND 16 BOOTST 0 ee DNP Keep vias free of solder Micro Crystal MS3V T1R 17 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF Q2 4MHz Buerklin 18 Q2 0 Crystal 78D134 DNP Q2 Keep vias free of solder insulatin http Awww ettinger de Art 16 ri 0 Insulating disk t
35. BR z o HS amp Q j z g S z Figure B 63 EM430F6137RF900 Target board Schematic SLAU278P May 2009 Revised September 2013 Hardware 129 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS LED D1 green connected to P1 0 via JP5 connected to P1 7 INSTRUMENTS EM430F6137RF900 www ti com JTAG connector Jumper JP2 ER current Close EXT for external supply Jump Close INT for J AG supply External power connector bee GEN mode CON12 JP1 a JTAG GND Jumper JP1 s Close JTAG osition to Open to disconnect LEDs e ebo in Tm jumper JP5 JP10 S JTAG mode Ro position B Ss Er to E A Spy Bi Wire mode td b Push button S2 Por e m m 2 INSTRUMENTS EM43 F6137RF 900 Rev 3 2 EB1 HH cio C522 um ma Footprint for 32kHz crystal Use 00 resistor for R541 R551 to makeP5 0 P5 1 available on connector port5 RF Crystal Q1 26 MHz Reset button S1 RF Signal SMA R441 L451 Oo L401 L411 A 8 a bal C422 2 o C421 C381 F G N O A gt PR C402 L412 L414 C413 C414 L415 L413 C412 Figure B 64 EM430F6137RF900 Target board PCB The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12 Ensure correct battery insertion regarding the polari
36. Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 DNP Only recommendation i GA 8 pr ME Check your crystal spec 2 C6 C7 1 10uF 10V Tantal Size B 511 1463 2 ND 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 D1 1 green LED SMD0603 475 1056 2 ND DNP Headers and receptacles enclosed with 6 J1 J2 J3 J4 0 25 pin header TH kit Keep vias free of solder SAM1029 20 ND Header SAM1213 20 ND Receptacle 7 J5 JP1 2 3 pin header male TH SAM1035 03 ND 8 J6 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 3 Jumper 15 38 1024 ND E on J6 JP2 JP1 Pos1 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH Dis keep vas MAE O solder Q1 Micro Crystal MS1V T1K i 12 01 02 0 Crystal 32 768kHz C Load Mn solder 12 5pF 13 R3 1 560 O SMD0805 541 560ATR ND R1 R2 R4 14 R6 R7 R10 2 0 Q SMD0805 541 000ATR ND DAP RA RG RN R12 R11 R12 15 R5 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket IC201 0804 014 Manuf Yamaichi 17 PCB 1 77 x77 mm 2 layers Adhesive e for example 3M Bumpons Apply to corners at bottom 18 Plastic feet 4 6mm width 2mm height Part No SJ 5302 side 19 MSP430 2 MSP430FG439IPN DNP Enclosed me supplied by TI SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 95 X TEXAS INSTRUMENTS www ti com MSP TS
37. Buerklin 07E612 42 R34 1 27R Buerklin 07E444 43 R35 1 27R Buerklin 07E444 44 R36 1 33k Buerklin 07E740 45 S1 0 PB P12225STB ND DNP 46 S2 0 PB P12225STB ND DNP 46 S3 1 PB P12225STB ND 47 USB1 1 USB_RECEPTACLE FARNELL 117 7885 Hardware SLAU278P May 2009 Revised September 2013 102 Copyright O 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback JA TEXAS INSTRUMENTS www ti com MSP T5430PZ100 B 24 MSP TS430PZ100 reserved for further enhancement 1 1 1 l 1 1 I 1 R12 T 1 1 1 t 1 1 1 perquesse you mun 0 6H Ppe pue BY nowaa 95epo fiddns peussyxa 1 991r pei2euuoc2 ST 097 1 9f uedg 108nF 10uF 6 3U 180uF 6 3U fi ot assembled IJT 6234 INN7 ISS 119308 REIH 80 t T zdI FE25 1A4 31111 UT S23j O vdSsu ASQUNN iueunoog elt TY 6802 82 78 9120 Sc 4 5ads eisfuo y2eYD SMIPA J 1224402 404 pe quesse jou TZA EKSL dSKW Xppj pue XEb4 40j TZd EKSL dSW 18490S5 18bJey pe quasse ou WY Et pesn st 358 H ebei o Atddns euaaixe 4 cuyo Di TY PPE pue TTY 9 Ous4 NOTE Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made Figure B 47 MSP TS4
38. C5 1 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND DNP Headers and receptacles enclosed with 7 J1 J2 J3 J4 0 16 pin header TH kit Keep vias free of solder SAM1029 16 ND Header SAM1213 16 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 9 J6 J7 2 2 pin header male TH SAM1035 02 ND Place jumper on header 11 2 Jumper 15 38 1024 ND Place on J6 J7 12 JTAG 1 14 pin connector male TH HRP14H ND 13 BOOTST 0 10 pin connector male TH DNP Keep vias tree of solder Q1 Micro Crystal MS1V T1K y 14 Q1 Q2 0 Crystal 32 768kHz C Load DNP Keep vias iree ol solder 12 5pF 15 R3 1 330 Q SMD0805 541 330ATR ND R1 R2 R4 R6 R7 R8 16 R9 R10 3 0 Q SMD0805 541 000ATR ND DNG E R11 R12 R13 R14 R11 R12 R13 R14 17 R5 1 47k O SMD0805 541 47000ATR ND 18 U1 1 Socket IC51 0644 807 Manuf Yamaichi 19 PCB 1 78 x 75 mm 2 layers Rubber Apply to corners at bottom 20 standoff 4 select appropriate side 21 MSP430 22 MSP430F2619IPM DNP Enclosed with kit MSP430F417IPM supplied by TI 78 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated di TEXAS INSTRUMENTS MSP TS430PM64A www ti com B 17 MSP TS430PM64A VCC430 C6 10uF 6 3V
39. C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 67 1553 1 ND DNP headers and receptacles enclosed with kit 7 J1 J2 J3 J4 0 25 pin header TH Keep vias free of solder SAM1029 25 ND Header SAM1213 25 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JP7 JP8 6 3 pin header male TH SAM1035 03 ND Place jumpers on pins 2 3 JP9 JP10 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND Place jumper on pins 1 2 Place on JP1 JP2 JP3 JP5 12 9 Jumper 15 38 1024 ND JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND 14 BOOTST 0 10 pin connector male TH DNP poop Vids free of solder Q1 Micro Crystal MS1V T1K i 15 Q1 Q2 O Crystal 32 768kHz C Load e keopvias free of solder 12 5pF 16 R3 R7 2 330 Q SMD0805 541 330ATR ND R1 R2 R4 R6 R8 R9 4 DNP R6 R8 R9 R10 R11 17 R10 R11 3 0 O SMD0805 541 000ATR ND R12 R12 18 R5 1 47k Q SMD0805 541 47000ATR ND 19 U1 1 Socket IC357 1004 53N Manuf Yamaichi 20 PCB 1 90 x 82 mm 2 layers Rubber Apply to corners at bottom 21 standoff 4 Select appropriate side DNP Enclosed with kit 22 MSP430 2 MSP430F5438IPZ supplied by TI SLAU278P May 2009 Revised September 2013 Hardware 117 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430PZ100USB www ti com B 29 MSP TS430PZ100USB Due to the
40. Copyright 2009 2013 Texas Instruments Incorporated Hardware 39 X TEXAS INSTRUMENTS www ti com IC1 4 74RUG IC26 2 74RUC26125 IC4G 2 74RUC26125 IC3G 2 74RUC26125 Ds Submit Documentation Feedback SLAU278P May 2009 Revised September 2013 Copyright O 2009 2013 Texas Instruments Incorporated B 4 MSP TS430L092 Active Cable MSP TS430L092 Active Cable L 92 Active Cable TITLE MSP TS43 PW14_L 92_ActiveCable Document Number Sheet 1 1 Date 8 31 2009 4 21 17 PM Figure B 7 MSP TS430L092 Active Cable Target Socket Module Schematic Hardware 40 JA TEXAS INSTRUMENTS www ti com MSP TS430L092 Active Cable Figure B 8 shows the PCB layout for the Active Cable The following pinning is possible e JP1 has two jumpers Jumper 1 and Jumper 2 that can be set as shown in Table B 4 Table B 4 MSP TS430L092 JP1 Settings Jumper 1 Jumper 2 Description Off Off The active cable has no power and does not function Off On The active cable receives power from target socket For this option the target socket must have its own power supply On Off The active cable receives power from the JTAG connector The JTAG connector powers the active cable and the target socket For On On this option the
41. Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Hardware Installation 4 Browse to the folder where the driver information files are located see Figure C 2 For CCS the default folder is c tiiccsv5 ccs_base emulation drivers msp430 USB_CDC or c ti ccsv5 ccs_base emulation drivers msp430 USB_FET_XP_XxX or c ti ccsv5 ccs_base emulation drivers msp430 USB_eZ RF depending of firmware version of the tool For IAR Embedded Workbench the default folder is lt Installation Root gt Embedded Workbench x x 430 drivers TIUSBFET eZ430 UART or lt Installation Root gt Embedded Workbench x x 430 drivers lt Win_OS gt Found New Hardware Wizard Please choose your search and installation options SS Y 9 Search for the best driver in these locations Use the check boxes below to limit or expand the default search which includes local paths and removable media The best driver found will be installed C Search removable media floppy CD ROM Include this location in the search C Program Files VAR Systems Embedded Workben w Don t search will choose the driver to install Choose this option to select the device driver from a list Windows does not guarantee that the driver you choose will be the best match for your hardware Figure C 2 Windows XP Driver Location Selection Folder 5 The Wizard generates a message that an appropriate driver has been found SL
42. LEDs connected to P1 0 P1 1 P1 2 via JP9 JP10 JP11 only D1 assembled R1 D1 po QU ee ampio R10 D2 pol ee wa e R11 D3 Ge KR IW a 0000 0000 0000 o e QFN11T048 008 A101121 000000000000 o o o o o o o o o Oo O Oo me Device Pin 1 Switch SW2 connected to P1 3 40 45 000000000000 P1 3 SW2 Switch SW1 Device reset 13 HF and LF Oscillators with Capacitors and Resistors to connect Pinheads Figure B 30 MSP TS430RGZ48C Target Socket Module PCB Table B 16 MSP TS430RGZ48C Revision History Revision Comments 1 2 Initial release LFOSC pins swapped at SV1 9 10 1 3 HFOSC pins swapped at SV1 6 7 BOOTST pin 4 now directly connected to the device RST SBWTDIO pin 74 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430RGZ48C Table B 17 MSP TS430RGZ48C Bill of Materials Number Pos Ref Des Per Description DigiKey Part Number Comment Board 1 SV1 SV2 SV3 4 12 pin header TH DNP headers and receptacles enclosed with kit SV4 Keep vias free of solder SAM1029 12 ND Header Receptacle 14 SV1 SV2 SV3 4 12 pin receptable TH DNP headers and receptacles enclosed with kit SV4 Keep vias free of solder
43. NENNEN EN RN EN EN SEENEN NSA NEE NEEN ESA RES ENEE NEEN 146 Document Revision History lt lt lt 151 SLAU278P May 2009 Revised September 2013 Contents 3 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated IA TEXAS INSTRUMENTS www ti com List of Figures 2 1 Signal Connections for 4 Wire JTAG Communlcatton 21 2 2 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F2xx MSP430G2xx and MSP430F4xx Devices NENNEN 22 2 3 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F5xx and MSP430F6Xxx DEVICES iones mane SEENEN NEE 23 B 1 MSP TS430D8 Target Socket Module Schematic rxnnnnnnnnnnnennnnnnnnnnnnnnnnnennnnennnennnennnenunnnnnne 31 B 2 MSP TS430D8 Target Socket Module PCB rnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnennnnnunnnunnnnnnnnnuner 32 B 3 MSP TS430PW14 Target Socket Module Schematic nnnnnnnnnnnnnnnnnnnnnnnnnnnennnnennnennnennnennnnnnnne 34 BA MSP TS430PW14 Target Socket Module PCB sannnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnennnnnnnennnenunnnnu 35 B 5 MSP TS430L092 Target Socket Module Gchematc 37 B 6 MSP TS430L092 Target Socket Module DCH 38 B 7 MSP TS430L092 Active Cable Target Socket Module Schematic sssssssennnnnnnnnnnnnnnnnnnrnnnnnennnnn 40 B 8 MSP TS430L092 Active Cable Target Socket Module DCH 41 Bo MSP TS430PW24 Target Socket Module Schematic nnnnnnnn
44. One 433 MHz eZ430 Chronos watch battery included One 433 MHz eZ430 Chronos access point eZ430 Chronos 868 One 868 MHz eZ430 Chronos watch battery included One 868 MHz eZ430 Chronos access point eZ430 Chronos 915 One 915 MHz eZ430 Chronos watch battery included One 915 MHz eZ430 Chronos access point 1 9 Kit Contents MSP FET430UIF One READ ME FIRST document One MSP FET430UIF interface module One USB cable One 14 conductor cable 1 10 Kit Contents MSP FET430xx One READ ME FIRST document One MSP FET430UIF USB interface module This is the unit that has a USB B connector on one end of the case and a 2x7 pin male connector on the other end of the case One USB cable One 32 768 kHz crystal from Micro Crystal if the board has an option to use the quartz A2xT pin male JTAG connector is also present on the PCB see different setup for L092 One 14 Pin JTAG conductor cable One small box containing two MSP430 device samples See table for Sample Type Onetarget socket module To determine the devices used for each board and a summary of the board see Table 1 2 The name of MSP TS430xx board can be derived from the name of the MSP FET430xx kit for example the MSP FET430U28A kit contains the MSP TS430PW28A board Refer to the device data sheets for device specifications Device errata can be found in the respective device product folder on the web provided as a PDF document Depending on th
45. R1 R7 2 330 O SMD0805 541 330ATR ND ip Pao 0 0 Ohm SMD0805 541 000ATR ND DNP R2 R3 R5 R6 15 R4 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket OTS 28 0 65 01 Manuf Enplas 17 PCB 1 63 5 x 64 8 mm 2 layers for example 3M Adhesive Approximately 6mm 18 plastic feet 4 width 2mm height So Part No SJ Apply to corners at bottom side 19 MSP430 2 MSP430G2553IPW28 DNP enclosed with kit supplied by TI Hardware SLAU278P May 2009 Revised September 2013 54 Copyright O 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback di TEXAS INSTRUMENTS MSP T5430DA38 www ti com B 9 MSP TS430DA38 JTAG Mode selection 4 wire JTAG Set jumpers JP4 to JP9 to position 2 3 2 wire SpyBiWire Set jumpers JP4 to JP9 to position 2 1 Ext_PWR R1 330R R5 47k C8 TESTISAWTCK IE d sese on E IFE JP5 DNP GND MSP430F2274IDA O 3 3 3 3 ES E Sam JE ass E sam JP6 JP7 JP8 JP9 TEST SBWTCKI TEST SBWTCK P1 7 TDO DVCC P1 6 TDI P2 5 P1 5 TMS DVSS P1 4 TCK P2 7 P1 3 P2 6 P1 2 RST SBWDAT P1 1 P2 0 P1 0 P2 1 P24 P2 2 P23 P3 0 U1 P3 7 P3 1 P3 6 P3 2 P3 5 P3 3 P34 AVSS P4 7 AVCC P4 6 P4 0 Socket P4 5 P4 1 Yamaichi P4 4 P42 1C189 0382 037P4 3 R3 560R P10 r Lt Ab JP3 TEST SBWTCK P11 GND If external supply volt
46. R13 a N 5 5 o 3 4 Ka E g o n E S 313 1 v Di wo mi Ss o th D ba A 51 5 D pi m W 2 T Oo oO c 2 12 D ES E 2 3 v 2 D l u A m o 1 Wu 3 D 3 3 e T 3 a D S D E S a EI e w Ze zm Led em NS NOTE R11 should be populated Figure B 45 MSP TS430PN80USB Target Socket Module Schematic SLAU278P May 2009 Revised September 2013 Hardware 99 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated MSP TS430PN80USB USB Connector Jumper JP3 1 2 int Power supply via JTAG debug interface 2 3 ext External power supply Jumper JP1 Open to measure current Jumper JP5 to JP10 Close 1 2 to debug in Spy Bi A TEXAS INSTRUMENTS www ti com Connector J5 External power connector Jumper JP3 to ext Jumper JP4 Close for USB bus powered device Wire mode CEEI D Close 2 3 to debug in 4wire e se 7S Ron 4 65 ei Ye JTAG mode e Ca e e e e e e e e ge e e e e e e e 8 e e c ege Se e 5 333 e LED connected to P1 0 e ges HE e L e gt H ECG S e or e e o000000 ole e eg eg e Jumper JP2 e Open to disconnect LED Bu 321 21 25 J2 38 35 40 ooo 0990000e9009000000090 2 a R15 Ce LEG 29 9 0 KR gun Mono o WN P MSP TS430PNS8OUSB o o PCO UO Rev 1 2 RoHS SLNAWNUISN SvxaL of D4 BSL invoke bu
47. al aig DVCC 15 w 5 x P3 0UCBESIMOIUGBOSDA 34 21 2 to 16 16 ovss d 2 S Pamucgostencaocik 93 is 12pF 2 8 8 GND pvcc L E 3 z 3 EE EEN J3 j 3323222 283312 24222322 82 283 2253u0ddddd SEEEEEER EE zea ER ERE E 10uF HoonF dada Te e Tale Te oo ESP lene a allay SES ERES ERES EC SES ES NES EE E E ps ES Ez E pat o H ha Q pr ye RK Di N i dg R3 ER GND 22 330R M Raph gg y Se 470nF OR Jalal c9 ou cof solen o o E AL YA j TEXAS MED GND a BEBEEBEEHERETEERE DOS s 2 INSTRUMENTS comment TI Friesing Date Name Design 12 14 10 SG MSP TS430RGC64C Appr Title of Schematic Rev Drawing Revision 1 1 MSP TSA30RGCBAC sch Page 1 of 1 Mentor Pads Logic V9 size 1 2 3 4 5 6 Figure B 37 MSP TS430RGC64C Target Socket Module Schematic SLAU278P May 2009 Revised September 2013 Hardware 86 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode m Orient Pin 1 of MSP430 device a D gt D H a gt a gt D H a gt 4 a gt a gt x gt D1 LED connected to P1 0 Jumper JP2 Open to disconnect LED Tz fi ue s s s 9 blo amp x 3 m7 Facs Eco i mes e MSP TS430RGC64C Connector J6 External power connec
48. charging that may exceed 60 mA In this case the current should be limited by the design of the target board or an external power supply should be used The Vec for the target can be selected between 1 8 V and 3 6 V in steps of 0 1 V Alternatively the target can be supplied externally In this case the external voltage should be connected to pin 4 of the 14 pin connector The MSP FET430UIF then adjusts the level of the JTAG signals to external V automatically Only pin 2 MSP FET430UIF supplies target or pin 4 target is externally supplied must be connected not both at the same time When a target socket module is powered from an external supply the external supply powers the device on the target socket module and any user circuitry connected to the target socket module and the FET interface module continues to be powered from the PC through the parallel port If the externally supplied voltage differs from that of the FET interface module the target socket module must be modified so that the externally supplied voltage is routed to the FET interface module so that it may adjust its output voltage levels accordingly See the target socket module schematics in Appendix B The PC parallel port can source a limited amount of current Because of the ultralow power requirement of the MSP430 a standalone FET does not exceed the available current However if additional circuitry is added to the tool this current limit could be exceeded In
49. free of solder 12 5pF 16 R3 1 330 Q SMD0805 541 330ATR ND R1 R2 R4 R6 R7 R8 DNP R4 R6 R7 R8 R9 17 R9 R10 2 0 Q SMD0805 541 000ATR ND R10 R11 R12 R11 R12 18 R5 1 47k Q SMD0805 541 47000ATR ND 19 U1 1 Socket 1C357 1004 53N Manuf Yamaichi 20 PCB 1 90 x 82 mm 4 layers Rubber 2 Apply to corners at bottom 21 standoff 4 Select appropriate side DNP Enclosed with kit 22 MSP430 2 MSP430F5438IPZ supplied by TI Hardware SLAU278P May 2009 Revised September 2013 108 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated X TEXAS INSTRUMENTS MSP TS430PZ100B www ti com B 26 MSP TS430PZ100B UCC RZ33 R 1 JPS JP1 4 lt SBU 2 d 3 lt JTAG P1 190 eva Tes AUXUCCA Ben E H QFP100PZ Socket Yamaichi 1C201 1004 008 C6 near Pin 75 C14 CS near Pin 20 MSP430 Target Socket MSP TS430PZ100B for F67xx TITLE MSP TS43 PZ1 B Document Number Date 8 3 2010 1 05 54 PM Sheet 1 1 Ic Schemati TS430PZ100B Target Socket Module 51 MSP igure F 109 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated I TEXAS
50. iu 5 2 Keep vias free of 5pF 15 Q2 1 Crystal oiu CAS 16 R3 R7 2 330 Q SMD0805 541 330ATR ND R1 R2 R4 17 R6 R8 R9 2 0 Q SMD0805 541 000ATR ND DNP R4 R6 R8 R9 R12 R12 18 R10 1 100 Q SMD0805 Buerklin 07E500 18 R11 0 1M O SMD0805 DNP 18 R5 1 47k Q SMD0805 541 47000ATR ND 19 Ut 1 Socket 1C201 0804 014 Manuf Yamaichi 20 PCB 1 79 x 77mm 2 layers 21 Ge 4 Buerklin 20H1724 eid to corners at bottom 22 MSP430 2 MSP430F5529 IM WA Insulating http www ettinger de Art 3 disk to Q2 1 Insulating disk to Q2 Detail cfm ART_ARTNUM 70 08 121 27 C33 1 220n Buerklin 53D2074 SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 101 IA TEXAS INSTRUMENTS MSP TS430PN80USB www ti com Table B 25 MSP TS430PN80USB Bill of Materials continued Pos Ref Des pon Description DigiKey Part No Comment 28 C35 1 10p Buerklin 56D102 29 C36 1 10p Buerklin 56D102 30 C38 1 220n Buerklin 53D2074 31 C39 1 4u7 Buerklin 53D2086 32 C40 1 0 1u Buerklin 53D2068 33 D2 D3 D4 3 LL103A Buerklin 2453406 34 IC7 1 TPD4E004 Manu Tl 36 LED 0 JP3QE SAM1032 03 ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL 852 9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL 852 9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL 852 9841 DNP 40 d 5 0 470R Buerklin 07E564 DNP 41 R33 1 1k4
51. male TH ne 2 place jumpers on pins 2 3 on JP5 12 JP8 JP9 7 3 pin header male TH SAM1035 03 ND JP6 JP7 JP8 JP9 JP10 place jumpers on pins 1 2 on JP3 JP10 JP1 JP2 A 13 JP4 3 2 pin header male TH SAM1035 02 ND Place jumper on header 14 10 Jumper 15 38 1024 ND See Pos 12 and Pos 13 15 JTAG 1 Leg connector male HRP14H ND 16 BOOTST 0 ene DNP Keep vias free of solder Micro Crystal MS3V T1R 17 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF Q2 4MHz Buerklin i 18 Q2 0 Crystal 78D134 DNP Q2 Keep vias free of solder i http Awww ettinger de Ar 19 dd 0 Insulating disk to Q2 t Detail cfm ART ART NUM 70 08 121 20 D3 D4 2 LL103A Buerklin 2453406 21 R3 R7 2 330 O SMD0805 541 330ATR ND R1 R2 R4 R6 22 R8 3 0 Ohm SMD0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R9 R10 R11 R12 23 R5 1 47k O SMD0805 541 47000ATR ND 24 U1 1 Socket 1C201 0804 014 Manuf Yamaichi 25 PCB 1 77 x 91 mm 2 layers F f for example 3M Adhesive Approximately 6mm 26 plastic feet 4 width 2mm height EINE Part No SJ Apply to corners at bottom side 27 MSP430 2 MSP430F5329IPN DNP enclosed with kit supplied by Tl 98 Hardware SLAU278P May 2009 Revised September 2013 Copyright O 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback JA TEXAS INSTRUMENTS www ti com MSP TS430PN80USB B 23 MSP TS430PN80USB Due to the use of diodes in the power chain th
52. on Sub section 1 1 of Article 6 of the Ministry s Rule for Enforcement of Radio Law of Japan 2 Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product or 3 Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product Also please do not transfer this product unless you give the same notice above to the transferee Please note that if you could not follow the instructions above you will be subject to penalties of Radio Law of Japan Texas Instruments Japan Limited address 24 1 Nishi Shinjuku 6 chome Shinjuku ku Tokyo Japan http www tij co jp BRERA d ORMOMRRTY N RE III DKOFESTE FAREY NEAR UE ARMOCCAICRL CIE BREBTOL HO LTOUTHAOHBER TULE KEFEN ETN TC BLE EN 1 BRAT RUSSE SB VEIS C EO XE RLI8ES H28 AMBEETRH1735 CEOSHLEREESO MBM COR AN E 2 SEERIQ OD RE HUS e C BRI ICI 3 BEER AE DR RRC 38 cmi 1320 TEACO TOR ERE BEKLBALAVRU FE Scuto E FEE EFE NTV EAS SOEOBIRIZ3SR amp ND TREN 6 eE TAERE BATEA EECHER MALA RANTE KATE 6 TA 24815 Pax LGREJL http Awww tij co jp EVALUATION BOARD KIT MODULE EVM WARNINGS RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only in Laboratory Development Environments Unless otherwise indicated this EVM is not a finished electrical equipment and not intended for consumer use It is inten
53. pin header TH SAM1029 25 ND with kit Keep vias free of solder DNP headers and receptacles enclosed 7 1 4 25 pin header TH SAM1213 25 ND with kit Keep vias free of solder 8 J5 J6 2 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JPG BS 6 3 pin header male TH SAM1035 03 ND place jumpers on pins 2 3 JP10 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND place jumper on header 10 1 JP4 1 2 pin header male TH SAM1035 02 ND place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 Place on JP1 JP2 JP3 JP4 JP5 JP6 12 10 Jumper 15 38 1024 ND JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND 14 BOOTST 1 10 pin connector male TH HRP10H ND DNP keep vias free of solder 15 Q1 0 Crystal dri Q1 Keep vias free of solder 16 Q2 1 Crystal DNP Q2 Keep vias free of solder 17 R3 R7 2 330 Ohm SMD0805 541 330ATR ND R1 R2 R4 R6 R8 R9 18 R10 R11 3 0 Ohm SMD0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R12 19 R5 1 47k Ohm SMD0805 541 47000ATR ND 20 U1 1 Socket IC357 1004 53N Manuf Yamaichi MSP TS430PZ100C 21 PCB 1 79 5 x 99 5 mm Rev 1 0 2 layers 22 Rubber 4 Buerklin 20H1724 apply to corners at bottom side stand off 24 C16 1 4 7 nF SMD0603 Buerklin 53 D 2042 26 D3 D4 2 LL103A Buerklin 2453406 27 JP11 1 4 pin header male TH SAM1035 04 ND Place jumper on Pin 1 and Pin 2 28 C15 1 4 7 uF SMD0805 Buerklin 53 D 2430 29 C21 1 220nF SMD0805 Buerklin 53 D 2381
54. see Notes B and E Va AV DVs If a local target power supply is used make connection J1 lf power from the debug or programming adapter is used make connection J2 The configuration of R1 and C1 for the RST NMI pin depends on the device family See the respective MSP430 family user s guide for the recommended configuration The TEST pin is available only on MSP430 family members with multiplexed JTAG pins See the device specific data sheet to determine if this pin is available The connection to the JTAG connector RST pin is optional when using a device that supports only 4 wire JTAG communication mode and it is not required for device programming or debugging However this connection is required when using a device that supports 2 wire JTAG communication mode in 4 wire JTAG mode When using a device that supports 2 wire JTAG communication in 4 wire JTAG mode the upper limit for C1 should not exceed 2 2 nF This applies to both TI FET interface modules LPT and USB FET Figure 2 1 Signal Connections for 4 Wire JTAG Communication SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Design Considerations for In Circuit Programming Copyright O 2009 2013 Texas Instruments Incorporated 21 A TEXAS INSTRUMENTS Signal Connections for In System Programming and Debugging www ti com Importantto connect Vec 1 A MSP430F xxx lt 1 ar E J1 see Note A i e
55. solder 31 Rubber feet 4 Rubber feet Buerklin 20H1724 apply to bottom side corners Hardware SLAU278P May 2009 Revised September 2013 124 Copyright O 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback X TEXAS INSTRUMENTS EM430F5137RF900 www ti com B 31 EM430F5137RF900 REVISIONS ECR 2 XXXXX 20 9 9 MPK Ven R3 gees SEET DEE mEmm ut mr 20 09 09 DATE 20 99 09 SCHEMATIC EM43 F 5137RF 322 Rev 8 2 EBI 868 915MHz DATE 20 99 99 XXXXXXX Power Management VCCO1 external VCC Vdd DVCC Vddal A DD RF A CC RF Vdda2 A CC Port connec
56. target socket must not have its own power source as this would cause a not defined state e JP2 is for reset For the standard MSP TS430L092 this jumper must be set It sets the reset pin to high and can also control it Without this jumper on the MSP TS430L092 reset is set to zero gt 200000090 100000007 L 92 Active Cab RoHS Rev 1 21 2 Figure B 8 MSP TS430L092 Active Cable Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Hardware 41 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430L092 Active Cable www ti com Table B 5 MSP TS430L092 Active Cable Bill of Materials No Per er ae Pos Ref Des Board Description DigiKey Part No Comment ML 4 100nF SMD0603 2 C2 C4 1uF SMD0805 3 R1 R10 10K SMD0603 4 R2 4K7 SMD0603 g R3 R6 R7 4 100 SMD0603 R9 6 R8 1 680k SMD0603 7 R11 R15 2 1K SMD0603 8 R12 0 SMD0603 DNP 9 R13 0 SMD0603 DNP 10 R14 1 0 SMD0603 11 IC1 1 SN74AUC1G04DBVR Manu Tl 12 IC2 IC3 IC4 3 SN74AUC2G125DCTR Manu TI Reichelt MicroMaTch 13 J2 1 MICRO_STECKV_10 Connector MM FL 10G Put jumper on Position 1 and 14 JP1 1 2x2 Header JP2Q 5 Do not mixdirection 15 JP2 1 2 pin header male TH SAM1035 02 ND place jumper on header 16 JTAG 1 14 pin connector male TH HRP14H ND 17 Q1 1 BC817 25LT1SMD SOT
57. use of diodes in the power chain the voltage on the MSP430F5xx device is approximately 0 3 V lower than is set by the debugging tool Set the voltage in the IDE to 0 3 V higher than desired for example to run the MCU at 3 0 V set it to 3 3 V von s eg c R18 PI 03 21 TT igan af 142 m w T UT UE C IN ef ER Se R11 2 1 1M D EN i o L amp 2 H a sg n e Dy D zl Il el pro pin SS KR EE NES ez i 101 UCC L in io 102 104 B p E E B E SEET R E BRONPBESLRGRGSES ES E Jon Saf secEz TUDIEUEA 9930S 8 V GT T ZOL Zd Td4d TA Tesn ang Ele UTI E E Star gur gt MES gt J5 ON9 PURI 5 o LED1 470R p n 6 La R15 Be D s o a Ta m o o HH os gj t 96 Bee H Be rv e m R16 no t et EN sage 1 5 J 3 25385 ge ytt D E 9 e B m R13 E O X z v D E 9S 3 M n Ss 842 2 CO SAS 2 3 S R 9 Figure B 57 MSP TS430PZ100USB Target Socket Module Schematic 118 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430PZ100USB
58. 00A RST NMI CK MS DL DO 1 IP 2 2 10uF 6 3U R4 J R2 Joe BR DNP UCC U1 QFP100PZ Socket Yamaichi 1C201 1004 008 PL1 PLA DNP If BSL is used If external supply voltage remove R11 and add R10 Ohm C11 100nF DUCC1 il dl c9 10uF 6 3U R3 D1 3308 Q P5 1 ale CL HE MSP43 Target Socket MSP TS43 PZ1 A for F471xx TITLE MSP TS430P2100R Document Number Date 8 28 2009 12 43 14 PM Sheet 1 1 Figure B 49 MSP TS430PZ100A Target Socket Module Schematic SLAU278P May 2009 Revised September 2013 Hardware 106 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Jumper JP3 1 2 int Power supply via JTAG interface 2 3 ext External Power Supply Jumper JP1 Open to measure current Vec yp3 nn 2 3 Ri Rn int ext JP1 ca J3 10 BOOTST 80 70 65 60 C11 c9 C2 C1 Reg E E Rs f 55 MSP T543 PZ1 A 2 0 Rev Orient Pin 1 of Device cs C6 a R2 30 pen cem _ 1 26 J1 15 2 5 10 20 00000000000000000000000008
59. 00nF SMD0805 311 1245 2 ND DNP C11 4 C5 1 2 2nF SMD0805 C9 1 470nF SMD0805 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit 7 Jt J2 J3 J4 4 10 pin header TH KEEP ed Header Receptacle DNP headers and receptacles enclosed with kit 74 4 10 pin header TH Keep vias free of solder Header Receptacle JP1 JP4 JP5 ne SH 8 JP6 JP7 9 3 pin header male TH SAM1035 03 ND uic eH id JP8 JP9 J5 JP10 9 JP2 JP3 2 2 pin header male TH SAM1035 02 ND place jumper on header 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH ie Skt solder QFN 40B 0 4 12 a 1 ENPLAS_SOCKET Enplas Micro Crystal MS3V T1R i 13 Qi 0 Crystal 32 768kHz C Load PNP Q1 Keep vias free of solder 12 5pF Place on JP1 JP2 JP3 15 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 16 R1 R7 2 330R SMD0805 R2 R3 R5 17 R6 R8 R9 3 OR SMD0805 DNP R2 R3 R5 R6 R10 18 R4 1 47k SMD0805 DNP enclosed with kit Is 19 MSP430 2 MSP430F5132 supplied by TI 20 Rubber stand 4 select appropriate for apply to corners at bottom off example Buerklin 20H1724 side SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 63 www ti com di TEXAS INSTRUMENTS B 12 MSP TS430RHA40A MSP TS430RHA40A JTAG Mode selection 4 vire JTAG Set jumpers JP4 to JP
60. 0805 541 000ATR ND DNP 15 R4 1 47k Q SMD0805 541 47000ATR ND 16 Ut 1 Socket QFN 40B 0 5 01 Manuf Enplas 17 PCB 1 79 x 66 mm 2 layers Adhesive 8 for example 3M Bumpons Apply to corners at bottom 18 Plastic feet 6mm width emm height Part No SJ 5302 side DNP enclosed with kit 19 MSP430 2 MSP430F2370IRHA supplied by TI Hardware SLAU278P May 2009 Revised September 2013 60 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated di TEXAS INSTRUMENTS MSP TS430RSB40 www ti com B 11 MSP TS430RSB40 JTAG Mode selection 4 uire JTAG Set jumpers JP4 to JP9 to position 2 3 Set jumpers JP4 to JP9 to position 1 2 2 vire SpyBilire UCC430 Up 338R TEST SBUTCK 3 m Ti a QUARZ5 R1 330R PLA kK 4 AUSS a 3 2 PLO mf PL1 TDI a JP M E a D m CCO U48 auss OUS ON PIG _PJ 1 _PJ 2 a Gig E kb sl sl UUUUUUUUU DALGPPPPPR POONAGDAWNE GFN 40B 0 4 001 Ol470nF o 1 uF 18U MSP TS430RSB40 Target Socket Board for MSP43 F51x2IRSB TITLE MSP TS430RSB40 Document Number Date 8 11 2010 12 38 55 PM Sheet 1 1 IC Schemati TS430RSB40 Target Socket Module 21 MSP igure F 61 Hardware SLAU278P May 2009 Revised September 20
61. 0FE42xA MSP430FE42x2 MSP430FW42x MSP TS430PM64A 64 pin PM Eight PCB 1x16 pin headers four male red PCB QFP ZIF MSP430F41x2 2 x MSP430F4152IPM rd our emde MSP TS430RGC64B 64 pin RGC Eight PCB 1x16 pin headers four male blue PCB OPN ZIF MSP430F530x 2 x MSP430F5310IRGC ard ear female MSP430F522x MSP430F521x Le a M iod MSP430F523x 2 x MSP430F5229IRGC SI DIE pinhesdere gouFImalo MSP430F524x MSP430F525x MSP TS430RGC64USB 64 pin RGC WEE 2 x MSP430F5510IRGC or Eight PCB 1x16 pin headers four male green PCB QFN ZIF MSP430F552x 2 x MSP430F5528IRGC and four female MSP430F241x MSP430F261x MSP430F43x ye a eee ai MSP430F43x1 2 x MSP430FG439IPN eno RTE 9 MSP430FG43x MSP430F47x MSP430FG47x MSP TS430PN80A 80 pin PN Eight PCB 1x20 pin headers four male red PCB QFP ZIF MSP430F532x 2 x MSP430F5329IPN Bod four female MSP TS430PN80USB 80 pin PN MSP430F552x Eight PCB 1x20 pin headers four male green PCB QFP ZIF MSP430F551x 2 x MSP430F5529IPN and four female MSP430F43x i MSP430F43x1 MSP TS430PZ100 100 pin PZ Eight PCB 1x25 pin headers four male MSP430F44x 2 x MSP430FG4619IPZ green PCB QFP ZIF MSP430FG461x MSP430 and four female F47xx MSP TS430PZ100A 100 pin PZ Eight PCB 1x25 pin headers four male red PCB QFP ZIF MSP430F471xx 2 x MSP430F47197IPZ en MSP TS430PZ100B 100 pin PZ Eight PCB 1x25 pin headers four male blue PCB QFP ZIF MSP430F67xx 2 x MSP430F6733IPZ and four Temale MSP430F645x MSP TS4
62. 13 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A Texas INSTRUMENTS MSP TS430RSB40 www ti com 14 410 BS 0000000 00000 00000002 000002 BOOTSTCS Connector J5 JTAG e e er e External power connector i onc Hc Bn ou B Jumper JP1 to ext JPS JP8 JP7 JP6 JP5 JP4 0000000000 34 Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Jumper JP2 ri 18 Open to measure current ROBES ERS ng CU C2 o e C4 C2 Di Orient Pin 1 of MSP430 device i o das 0600000009009 ou Zz ES OBGON 321H U000000PB00 Jumper JP3 Open to disconnect LED O OOOO OOOO a D1 LED connected to P1 0 INSTRUMENTS msp T1543 RS840 Rev 1 2 e Figure B 22 MSP TS430RSB40 Target Socket Module PCB 62 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430RSB40 Table B 12 MSP TS430RSB40 Bill of Materials Pos Ref Des No Per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 a O 3 10uF 10V SMD 0805 445 1371 1 ND DNP C12 gs e 3 1
63. 16 pin header 2 54 mm solder Header SAM1029 16 ND Receptacle SAM1213 16 ND a Pin header 1x3 Grid 100mil 10 2 J5 J6 3 pin header male TH 2 54 mm SAM1035 03 ND JP5 JP6 JP7 Pinheader 1x3 Grid 100mil 11 JP8 JP9 JP10 3 pin header male TH 2 54 mm place jumpers on pins 2 3 SAM1035 03 ND 12 JP3 3 pin header male TH hes 1x3 Grid 100mil place jumper on pins 1 2 SAM1035 03 ND 13 JP1 JP2 JP4 2 pin header male TH el Grid 100mil place jumper on header SAM1035 02 ND Place on JP1 JP2 JP3 14 10 Jumper JP4 JP5 JP6 JP7 JP8 15 38 1024 ND JP9 JP10 Header THD Male 2x7 Pin 15 1 JTAG 2x7Pin Wanne Wanne 100mil spacing HRP14H ND 2 Header THD Male 2x5 Pin 16 0 BOOTST 2x5Pin Wanne Wanne 100mil spacing DNP CRYSTAL SMD 5x3MM 17 1 Q1 26MHz ASX53 26MHz Only Kit 18 0 Q2 26MHz ASX53 Gay ST at SME SJ MM 300 8219 1 ND 26MHz DIODE SMD SOD123 m 19 1 D3 LL103A Schottky Buerklin 24S3406 20 2 R3 R7 330 Ohm SMD0805 541 330ATR ND 21 1 R5 47k Ohm SMD0805 RES SMD 0805 1 8W x 541 47000ATR ND R1 R2 R4 22 R6 R8 R9 0 Ohm SMD0805 RES SMD 0805 1 8W x DNP R6 R8 R9 R10 5 popa TR ND R11 R12 R10 R11 R12 23 1 Ut Socket QFN11T064 006 N Manuf Yamaichi HSP IC MCU SMD 9 15x9 15mm 24 2 MSP430 MSP430F5229IRGCR Thermal Pad with Socket 25 4 Rubber stand Rubber stand off apply to corners at bottom Buerklin 2041724 26 1 PCB 84 x 76 mm 84 x 76 mm
64. 2 C252 C381 2 C391 C421 14 CD CH SMT 0402 CER 16V 10 9402YC104KAT2A AVX C431 C451 C522 C562 CAPACITOR SMT 0603 CERAMIC 0 47uF 3 C101 LT 0603YD474KAT2A AVX 4 R511 1 RES0402 47 0K CRCW04024702F100 DALE HEADER THU MALE 14P 2X7 5 CON1 1 LE 09 18 514 6323 HARTING 7 D1 1 LED SMT 0603 GREEN 2 1V APT1608MGC KINGBRIGHT 8 D2 1 LED SMT 0603 RED 2 0V APT1608EC KINGBRIGHT HEADER THU MALE 3P 1x3 10 CON12 UM e Ein 22 03 5035 MOLEX 11 C361 C371 2 50V 5 27pF GRM36COG270J50 MURATA 12 L451 1 Inductor SMD 0402 12nH 5 370mA LQW15AN12NJ00 MURATA CAPACITOR SMT 0402 CERAMIC 100pF 13 C403 M eroe GRM1555C1H101JZ01 MURATA INDUCTOR SMT 0402 2 2nH 0 2nH 14 L414 te LQW15AN2N2C10 MURATA 15 L413 1 Inductor SMD 0402 15nH 5 370mA LQW15AN15NJ00 MURATA 250MHz 15 L415 1 Mee eee LQW15AN15NJOO MURATA 16 L402 L412 2 Inductor SMD 0402 18nH 5 460mA LQW15AN18NJOO MURATA 250MHz CAPACITOR SMT 0402 CER 1pF 50V 17 C401 M GJM1555C1H1ROCBO1D MURATA CAPACITOR SMT 0402 CERAMIC 8 2pF 18 C413 M ues GRM1555C1H8R2CZ01 MURATA C402 C411 CAPACITOR SMT 0402 CERAMIC 1 5pF DAE SUE Hi ds GRM1555C1H1R5CZ01 MURATA 20 L1 L401 L411 a INDUCTOR SMT 0402 12nH 5 500mA Qw15AN12NJOO MURATA 250MHz C46 C48 CAPACITOR SMT 0402 CERAMIC 2 0pF 21 udo de Den GRM1555C1H2ROCZO MURATA S E Inductor SMD 0805 2 2uH 20 600A omp1PN2R2MCO MUERE 50MHz ULTRA SMALL TAC
65. 2009 Revised September 2013 Copyright 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback di TEXAS INSTRUMENTS MSP FET430UIF www ti com B 35 MSP FET430UIF amp DC3 GND C7 I al 10uF 6 3U ca SETUCCT pee JE 10uF 6 3U C2 T 335r I Qi 8MHz Ci 33prl DANGENWATANOENWA TCK TDO TDI TMS UF2TEST UF 2TDI IDIOFFs UCCTON ENI 204 TEST RST 3410 RXD TxD SETUF TGTRST SCL SDA USBFET TITLE MSP FETU43 IF Document Number Date 7 25 2006 03 38 10p Sheet 1 4 139 Hardware Figure B 69 MSP FET430UIF USB Interface Schematic 1 of 4 SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP FET430UIF UCCT US 4 D5 TEST ICK SN74LUC16G125 U1 4 bi LL1 3A SELT TMS 2 SN74LUC16125 U15 4 SN74LUC16125 U34 4 SN74LUC1G125 U35 4 SN74LUC1G125DBU R91 100R U4 AQY 211 EHA U29 SN75240 TDIOFF R 270R AQY211EHA TARGET CON SN74LUC1G07DBU Cii zi e 100nF
66. 23 Digi Key BC817 BEC 25LT1GOSCT ND 18 U1 U2 2 TLVH431IDBVR SOT23 5 Manu TI Hardware SLAU278P May 2009 Revised September 2013 42 Copyright 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback X TEXAS INSTRUMENTS MSP TS430PW24 www ti com B 5 MSP TS430PW24 JTAG Mode selection 4 uire JTAG Set jumpers JP4 to JP9 to position 2 3 2 vire SpyBilire Set jumpers JP4 to JP9 to position 1 2 TEST SBLTCK R7 330R TEST SBUWTCH JTAG gt a SBW gt JP4 3 x mf P2 TDI fs H H JP JP8 P2 STEG TAB TOI TCLK P1 7 UCLK TAL TDO TDI P1 6 S0MI TAZ TCK P1 5 SIMO8 SUSOUT TMS P1 4 URXDB SD2D0 P1 3 UTXD8 SD1DO P1 2 TAB SDEDO R1 330R P1 4 TAL SDCLK Duer P2 7 XT20UT P2 6 XT2IN DUSS Socket EnplasOTS 28 65 B1 MSP43 AFE2XX P1L kK DNP XT20UT P2 7 L2pF f 1H CL XTLGND ono s o FE12 1 2 L DNP GUARZ5 c2 11 e XT2IN P2 6 12pF DNP MSP TS43 PN24 Target Socket Board for MSP430 s AFE2xx ICs in PW24 package TITLE MSP TS43 PW24 Document Number Date 04 08 2010 13 36 04 Sheet 1 1 IC Schemati TS430PW24 Target Socket Module MSP 9 igure F 43 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O
67. 30PW14 14 pin PW Four PCB 1x7 pin headers two male and green PCB TSSOP ZIF oe EMP two female MSP430G2x31 Four PCB 1x7 pin headers two male and two female A Micro MaTch 10 pin T female connector is also present on the AREE TSSOP MSP TS430L092 2 x MSP430L092IPW PCB which connects the kit with an 9 Active Cable PCB this Active Cable PCB is connected by 14 pin JTAG cable with the FET430UIF MSP TS430PW24 24 pin PW Four PCB 1x12 pin headers two male green PCB TSSOP ZIF MSP430AFE2xx 2 x MSP430AFE253IPW and two female MSP430F11x1 MSP430F11x2 MSP TS430DW28 28 pin DW O 2 x MSP430F123IDW Four PCB 1x12 pin headers two male green PCB SSOP ZIF MSP430F21xx and two female Supports devices in 20 and 28 pin DA packages MSP430F11x1 A MSP430F11x2 MSP TS430PW28 28 pin PW A Four PCB 1x12 pin headers two male green PCB TSSOP ZIF Meus DEC D ARN and two female MSP430F21xx MSP430F20xx MSP430G2xxx in 14 20 on MSP TS430PW28A 28 pin PW and 28 pin PW packages 2 x MSP430G2452IPW20 Four PCB 1x12 pin headers two male red PCB TSSOP ZIF MSP430TCHSE in PW and two female package MSP TS430DA38 38 pin DA oa k IDA Four PCB 1x19 pin headers two male green PCB TSSOP ZIF MSP430G2x55 2 x MSP430G2955IDA and two female MSP TS430QFN23x0 40 pin RHA Eight PCB 1x10 pin headers four male green PCB GFN ZIF MSP430F23x0 2 x MSP430F2370IRHA and four female 14 Get Started Now SLAU278P May 2009 Revised
68. 30PZ100 Target Socket Module Schematic SLAU278P May 2009 Revised September 2013 Hardware 103 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430PZ100 www ti com Jumper J6 Jumper J7 Open to disconnect LED Open to measure current 14 Y 18 0000000 37 00000 00000002 000002 d RIB LED connected to pin 12 Gi JTAG GER B OTST Js as Open J6 if LCD connected Connector J5 CO 000000000009000009000000000 a 75 78 65 6a 55 1 External power connection 9 x e Remove R8 and jumper R9 ae ai nes m1 c8 A It 4 9 gi s Dlas 000000000 Gw 00000000 q2 o 00000000 d S l o o c4 C o o ES 99 998 o o9 o9 o o o9 o9 o 800 008 J2 o o9 o9 o IS 800 098 N 00000000 Al Orient Pin 1 of MSP430 device i Add o amp let E 3 C6 R12 RI ti JF E p cms S E 5 19 31 15 29 25 0000000000000000000000000 Figure B 48 MSP TS430PZ100 Target Socket Module PCB 104 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430PZ100 Table B 26 MSP TS430PZ100 Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only 1b C3 C4 0 47pF SMD0805 recommendation Check your crystal s
69. 30PZ100C 100 pin PZ MSP430F643x Eight PCB 1x25 pin headers four male black PCB QFP ZIF MSP430F535x 2 x MPPASUFBASEIP and four female MSP430F533x MSP430F543x i MSP TS430PZ5x100 100 pin PZ Eight PCB 1x25 pin headers four male MSP430BT5190 2 x MSP430F5438IPZ green PCB QFP ZIF MSP430SL5438A and four female SLAU278P May 2009 Revised September 2013 Get Started Now 15 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated 16 A TEXAS INSTRUMENTS Kit Contents EM430Fx1x7RF900 www ti com Table 1 2 Individual Kit Contents MSP TS430xx continued Part Number Socket Type Supported Devices Included Devices Headers and Comment MSP430F665x MSP TS430PZ100USB 100 pin PZ Eight PCB 1x25 pin headers four male MSP430F663x 2 x MSP430F6638IPZ green PCB QFP ZIF MSP430F563x and four female MSP430F677x MSP430F676x e Four PCB 1x26 pin headers two male MSP TS430PEU128 128 pin PEU MSP430F674x g green PCB QFP ZIF MSP430F677x1 2 x MSP430F67791IPEU eal ee E dris rn MSP430F676x1 eaders two male and two female MSP430F674x1 See the device data sheets for device specifications Device errata can be found in the respective device product folder on the web provided as a PDF document Depending on the device errata may also be found in the device bug database at www ti com sc cgi bin buglist cgi Kit Contents EM430Fx1x7RF900 One READ ME FIRST document
70. 30RGZ48B Connector J5 Ucc 14 410 Sa e o X IY ec o sa 00000002 0000902 660 Jumpers JP5 to JP10 z BHDTST eee Close 1 2 to debug in Spy Bi Wire mode ECKE zz Close 2 3 to debug in 4 wire JTAG mode ender SBWielelelelele JTAGlelelelelele Curr JPA Pl R10R11 000000000000 48 42 37 Meas E C84 C8 R5 SE MSP TS43 RGZ48B Rev 1 0 RoHS e s Orient Pin 1 of MSP430 device Ut 5 e QFN111048 008 A101121 ve C6C14 e e e e El e 9 n ge 9 c n o c11 10 2 de o c e e e rs e m m5 e Be C Ed Clamshell Je Jumper JP2 PE a i Open to disconnect LED R2 E Ece ig TEXAS P PU a Ki INSTRUMENTS R3 H 13 18 24 D1 LED connected to P1 0 S T 1000000000000 Q External power connector Jumper JP1 to ext Jumper JP1 Open to measure current Figure B 28 MSP TS430RGZ48B Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 71 A TEXAS INSTRUMENTS MSP TS430RGZ48B www ti com Table B 15 MSP TS430RGZ48B Bill of Ma
71. 3mm yellow RS 228 4991 Micro Crystal MS1V T1K 6 Q1 0 QUARZ Crystal 32 768kHz C Load DNP Cover holes while soldering 12 5pF DNP Headers and receptacles enclosed with kit Keep vias free of 7 J1 J2 2 14 pin header TH male solder Header Receptacle DNP Headers and receptacles enclosed with kit Keep vias free of 14 pin header TH solder P 2 female Header Receptacle 8 J3 1 3 Pin Connector male 9 J4 J5 2 2 Pin Connector male With jumper 10 BOOTST 0 ML10 10 Pin Conn m RS 482 115 DNP Cover holes while soldering 11 JTAG 1 ML14 14 Pin Conn m RS 482 121 R1 R2 R6 R7 12 R8 R9 4 OR SMD0805 DNP R1 R2 R9 R10 R10 R11 13 R3 1 560R SMD0805 14 R5 1 47K SMD0805 15 Ut 1 SOP28DW socket o add 16 U2 0 TSSOP DNP Hardware SLAU278P May 2009 Revised September 2013 48 Copyright O 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback di TEXAS INSTRUMENTS MSP TS430PW28 www ti com B 7 MSP TS430PW28 10uF 10 JTAG Mode selection 4 wire JTAG Set jumpers JP4 to JP9 to position 2 3 2 wire SpyBiWire Set jumpers JP4 to JP9 to position 1 2 R7 330R TEST SBWTCK 3 3 a P15 1MS F P1 4 TCK JP9 R1 330R P1 7 P1 6 P1 5 P1 4 XOUT P1 3 P1 2 P1 1 P1 0 P2 4 P2 3 P3 7 P3 6 P3 5 P3 4 Socket En OTS 28 0 65 01 GND If
72. 430PN80A B 22 MSP TS430PN80A UCC K R2330R JP5 lt SBH LL103h XTLGND2 T DNP EN c12 I C13 I ieur T ieenr l GND buy R3 7 S 330R lt JTAG GND BSL Interface BOOTST C11 100nF DUCC1 I QF P8 PN Socket Yamaichi C201 0804 014 2 41 n OQHANATNYVNAOG mmmmmmmmmmr for F532x GND o o bed Note If the system should supplied via LDOI J6 close and set JP3 to external LDOI b sel a MSP43 Target Socket MSP TS430PN80B TITLE MSP TS43 PN8 A Document Number Date 8 25 2010 12 43 41 PM Sheet 1 1 IC Schemati TS430PN80A Target Socket Module 43 MSP igure F SLAU278P May 2009 Revised September 2013 Hardware 96 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Orient Pin 1 of MSP430 device R18 y B4iJP4 ssne 00000000000000000000 88 75 78 J4 65 61 Open to disconnect LED D1 R3 D1 LED connected to E
73. 51 0xF432 430CDC inf MSP EXP430FR5739 0x0451 OxF432 430CDC inf MSP EXP430F5529 0x0451 OxF432 430CDC inf The older MSP FET430UIF used with IAR versions before v5 20 x and CCS versions before v5 1 has VID 0x0451 and PID OxF430 With the firmware update it is updated to the 0x2047 and 0x0010 respectively 1 Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one of IDEs CCS or IAR should be installed The IDE installation isntalls also drivers for USB Debug Interfaces without user interaction After IDE installation the USB Debug Interface can be connected and will be ready to work within few seconds 2 The driver can be also installed manually After plug in the USB Debug Interface to USB port of the PC the Hardware Wizard starts automatically and opens the Found New Hardware Wizard window 3 Select Install from a list or specific location Advanced see Figure C 1 Found New Hardware Wizard This wizard helps you install software for MSP FET430UIF TI USB FET Adapter If your hardware came with an installation CD IP or floppy disk insert it now What do you want the wizard to do C Install the software automatically Recommended Click Next to continue lt Back Next gt Cancel Figure C 1 Windows XP Hardware Wizard 146 Hardware Installation Guide SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback
74. 55R60J225ME15D MURATA 38 C041 1 vad SMD Ceramic 0603 4 7uF 16V 10 MURATA 136 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP FET430PIF B 34 MSP FET430PIF 02856211 vezdHsz 9 und 1x3 9 9 BESCHE rZIHYLZ R44 330k n a 330k en 9 84 GNI 10844SdL 9 Y KKH DEST ER R30 R29 optional optional R25 R24 27 KE 198 04d la aeg att TEZTNIL 901 Gr Il 1802 2 97 310 d133 dSUW bz EB a ejaeiu 1Di uonie u3 uset4 jI0 vd134 dSH SINAWNYLSNI SUX3L Figure B 67 MSP FET430PIF FET Interface Module Schematic SLAU278P May 2009 Revised September 2013 Hardware 137 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated 138 MSP FET430PIF Hardware 3uga1 Hn 3d981 a juger Ho ul al o is Hc ye se Tm N gt gt I o H ol e M25HP284 Di tp Go E is m B B 3 31 Ore 23 fas FIle B B o de pr H A Texas INSTRUMENTS www ti com EI ISI EIER iid NIIS Gales Ls o zi ao z gt ind T N gm RER BEE D C11 m cion o GESE E El N o BS US e 11 20L Sg on Eal SR y e gor D to S Sa C4 KS 2 al Figure B 68 MSP FET430PIF FET Interface Module PCB SLAU278P May
75. 724 apply to corners at bottom side 26 PCB 1 79 6 x 91 0 mm MSP TS430RGZ48C 2 layers black solder mask Rev 1 2 SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 75 MSP TS430PM64 A TEXAS INSTRUMENTS www ti com B 16 MSP TS430PM64 reserved for future enhancement R12 pajquiasse jou aBeyon Ajddns jeujejxe y WUYO 0 634 ppe pue gy anoual gg pajoauuoo s not assembled 1 JP1Q 10uF 6 3 d L 1 91 33 10uF 10V V 208 tt790 LSOI Pa quiesse jou d JequunN 1ueunooq pejquiesse jou WV 0E 97 0L 9002 vV IEC VOINdOEPSL dSW ZU XLp4 pue xp 4 JO Xy L JOEY ASIN o ddns euajxa y 0 pe pue LLH anowa s de o usado uedo XLy JOEY ASIN e usado uedo o v9lNd 194905 Jebel PINdOEPS1L dSW ppe eBesn 3Sg 104 vl CL ZH oi WYO 0 OLY 0 Wy 3eeus NOTE Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made Figure B 31 MSP TS430PM64 Target Socket Module Schematic 76 Hardware SLAU278P May 2009 Revised Septe
76. 8DW not assembled P1 7 P1 6 P1 5 P1 4 P1 2 P1 1 P1 0 P2 4 P2 3 P3 7 P3 6 P3 5 P3 4 If external supply voltage remove R11 and add R10 0 Ohm MSP TS430DW28 Target Socket DW28 TITLE MSP TS430DW28 Document Number Date 11 14 2006 1 26 04 PM Sheet 1 1 Figure B 11 MSP TS430DW28 Target Socket Module Schematic SLAU278P May 2009 Revised September 2013 Hardware 46 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430DW28 LED connected to P1 0 Jumper J5 Jumper J4 p Open to measure current Open to disconnect LED Connector J3 External power connector Remove R8 and jumper R9 70000000 10000000 Orient Pin 1 of Poor MSP430 device Figure B 12 MSP TS430DW28 Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Hardware 47 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430DW28 www ti com Table B 7 MSP TS430DW28 Bill of Materials Position Ref Des band Description DigiKey Part No Comment DNP C1 C2 Cover holes while 1 C1 C2 0 12pF SMD0805 soldering 2 C5 1 100nF SMD0805 3 C7 1 10uF 10V Tantal Elko B 4 C8 1 10nF SMD0805 5 D1 1 LED3 T1
77. 9 to position 2 3 2 uire SpuBillire Set jumpers JP4 to JP9 to position 1 2 ext 93 Ucc 2 int JA JP1 RZ 330R 2 3 3 a TEST SBUWTCH IDO JP PL1 TDI 2 PJ 3 TCK JP2 a L pucc43a JP JP9 NP C i 18uF 10U1900nF GND c2 c6 180uF 1Q0U100nF BOOTST connection by via C7139 ass CO D TEST SBUTCK P2 0 J3 TER 3_TCK UTUUUUUUUU T 8 gt T as 1 2 o d 2 3 ES F le co oo Jos for foo fi I co Joo vr av Jon e co Io BOONAGSJVONE SEO DOE S amp P Naa Vom N N N 0 0 D pile ls 1 TDI B 11 PJ GND If external supply voltage 1 a RI 330R remove R3 and add RZ 0 Ohm Sr L1 P 9 le meen 4 MSP TS43 RHA4 A JP3 Target Socket Board for MSP43 FR572x FR573x IRHA GND TITLE MSP TS43 RHA4 A Document Number Date 4 21 2010 1 23 27 PM Sheet 1 1 Ic Submit Documentation Feedback Schemat SLAU278P May 2009 Revised September 2013 TS430RHA40A Target Socket Module Copyright O 2009 2013 Texas Instruments Incorporated igure B 23 MSP F Hardware 64 A Texas d 18 00000 000002 INSTRUMENTS www ti com O ee ee 0001 00000002 JTAG oie
78. AO 0 P11 5 TACLK RTCCLK P11 4 CBOUT P11 3 TA2 1 P11 2 TA1 1 P11 1 TA3 1 083 P11 0 80 P10 7 81 P10 6 52 P10 5 53 P10 4 54 P10 2 56 P10 1 57 P10 0 58 P9 7 S9 P9 6 S10 P9 5 S11 P9 4 812 P9 3 S13 P9 2 514 P9 1 515 P9 0 516 Dvss2 pias DOSS fre re P8 7 817 100nF 4 7uF 100nF P amp 6 S18 to Bu Too Titel MSP430 Target Socket Bearb Petersen MSP TS430PEU128 for F6779 Dok 1080 1 001 01 1 MSP TS430PEU128 Datum 22 05 2012 09 37 33 Seite 1 1 Figure B 59 MSP TS430PEU128 Target Socket Module Schematic SLAU278P May 2009 Revised September 2013 Hardware 122 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com JP11 JP12 JP13 Connect 1 2 to connect AUXVCCx with DVCC or drive AUXVCCx externally e e nR D1 LED connected to P1 0 Jumper JP2 Open to disconnect LED y DO R3 DIS Orient Pin 1 of MSP430 device Lz Lz e e e e e Lz Lz e e e e e Lz e e e e Lx A0 PB 120 gel mR AUXVCC2 JP12 RST NMI TCK TMS TDI GND TDO TEST SBWTCK AUXVCC3 AUXVCC pvcc e 1234 ro oo mH C187 73 4 HI C19 macs DCH mci 4 TEXAS INSTRUMENTS MSP TS430PEU128 Rev 1 1 RoHS 45 50 55 60 64 J O 20000000000000000000000000 MSP TS430PEU128 Jumper JP1 Open to measure
79. AU278P May 2009 Revised September 2013 Hardware Installation Guide Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated 147 A Texas INSTRUMENTS Hardware Installation www ti com 6 The wizard installs the driver files 7 The wizard shows a message that it has finished the installation of the software USB Debug Interface 8 The USB debug interface is installed and ready to use The Device Manager lists a new entry as shown in Figure C 3 Figure C 4 or Figure C 5 B Device Manager t meS G a Ra U3 Human Interface Devices E IDE ATAJATAPI controllers LO Sa IEEE 1394 Bus host controllers gt Keyboards 15 Mice and other pointing devices t Modems Monitors EF B Network adapters B 1394 Net Adapter 3 E9 Broadcom Netxtreme 57xx Gigabit Controller B Cisco Systems VPN Adapter B Intel R Wireless WiFi Link 4965AGN E a PCMCIA adapters EA Ports COM amp LPT BT Port COM10 BT Port COM11 d BT Port COM12 d BT Port COM13 d BT Port COM14 BT Port COM20 d BT Port COM21 d BT Port COM22 BT Port COM6 y BT Port COM Communications Port COM1 d ECP Printer Port LPT1 ei MSP FET430UIF VCP COM49 2 Processors X Smart card readers Sound video and game controllers d System devices vi lakk Figure C 3 Device Manager Using USB Debug Interface using VID PID 0x2047 0x0010 148 Hardware Installation Guide SLAU278P May 2009 Revised September
80. B 15 MSP TS430RGZ48B Bill of Matertals nnmnnn nennen 72 B 16 MSP TS430RGZ48C Revision History ENEE En 74 B 17 MSP TS430RGZ48C Bill of Materials nrnnnnnnnnnnnnnnnnnnnnnennnnnnnnnnnnnnnnnennnnnnnnennnnnnnnnunnnnnnnnnnune 75 B 18 MSP TS430PM64 Bill of Materials ee ENEE ENNEN ENEE ENEE ENEE EE EEN 78 B 19 MSP TS430PM64A Bill of Materials cecee cece eee ee eee eee ee eee eee e nenne nen enhn hne nn n nnne 81 B 20 MSP TS430RGC64B Bill of Materials c cece cece eee eee e eee e reece eee eee e eee ene seas eens en eee eens eee 84 B 21 MSP TS430RGC64C Bill of Materials A 88 B 22 MSP TS430RGC64USB Bill of Materales 0 0 cceeeee cece cece eee ener eee eens eese en nnne 91 B 23 MSP TS430PN80 Bill of Materials 0ccceee cece eee eee ener eee e eee eee e eee nehm nh nnne nennen 95 B 24 MSP TS430PN80A Bill of Materials ccecee cece eee ee eee eee ee eee ene e eee a ne nnne nnne 98 B 25 MSP TS430PN80USB Bill of Materials c cece cece eee eee e ence eee ee eee eee eee e eae eeaeeeneeeneeeeeaeees 101 B 26 MSP TS430PZ100 Bill of Materals nnan nnnnnnnnnennn nnn 105 B 27 MSP TS430PZ100A Bill of Materials snnnssnnunnunnnunnnennnnnnnnnnnnnnnnnnnrnnnnnnnnnnnnnnn nnn ennnnnnnnnnnn nnn 108 B 28 MSP TS430PZ100B Bill of Materials nrnnnrnnnvennnennnenunenunnnnnnnnennvennnennnenunenunnnnnnnnvnnneuenenen 111 B 29 MSP TS430PZ100C Bill of Matertals sroine enama aa a a Ea a a 114 B 30 MS
81. C10 C12 3 3 1 C18 C17 0 100nF SMD0805 311 1245 2 ND DNP C10 C12 C18 C17 4 C8 1 2 2nF SMD0805 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit 7 J1 J2 J3 J4 4 25 pin header TH SAM1029 25 ND Keep vias free of solder Header Receptacle DNP headers and receptacles enclosed with kit 7 1 4 25 pin header TH SAM1213 25 ND Keep vias free of solder Header Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JP7 JP8 6 3 pin header male TH SAM1035 03 ND place jumpers on pins 2 3 JP9 JP10 JP1 JP2 10 JP4 3 2 pin header male TH SAM1035 02 ND place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 Place on JP1 JP2 JP3 12 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND Micro Crystal MS1V T1K i 14 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF 15 Q2 1 Crystal Q2 4MHz Buerklin 78D134 16 R3 R7 2 330 Q SMD0805 541 330ATR ND R1 R2 R4 17 R6 R8 R9 3 0 O SMD0805 541 000ATR ND DNP R6 R8 R9 R12 R12 18 R10 1 100 Q SMD0805 Buerklin 07E500 18 R11 1 1M Q SMD0603 not existing in Rev 1 0 18 R5 1 47k O SMD0805 541 47000ATR ND 19 U1 1 Socket 1C201 1004 008 Manuf Yamaichi 20 PCB 1 79 x 77 mm 2 layers 2 Rubber stand 4 Buerklin 20H1724 apply to corners at bottom off side DNP enclosed with kit Is 22 MS
82. CB rnnnnnnnnnnnnnnnnnnnnnnnnnnennennnnnnnnnnnnennnnnnnnnennennnnnnnnnnnnenen 134 B 67 MSP FET430PIF FET Interface Module Schematic xxannnnnnunnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnen 137 B 68 MSP FET430PIF FET Interface Module PCB arnnannnnnnnnnnnvnnennnnnnennennennnnnnnnnnnnennnnnnennnnnennnnnnr 138 B 69 MSP FET430UIF USB Interface Schematic 1 of 4 eeeeeeeeseeeeeeenen 139 B 70 MSP FET430UIF USB Interface Schematic 2 of Ai 140 B 71 MSP FET430UIF USB Interface Schematic 3 of Ai 141 B 72 MSP FET430UIF USB Interface Schematic 4 of 4 ococcccccnccncconcnncnncnnnnnnnnnnancnnnnnnnnnnannnncnnnnns 142 B 73 MSP FET430UIF USB Interface POB engste dee a dieg a ke RUE 143 C 1 Windows XP Hardware Wizard iii acc 146 C 2 Windows XP Driver Location Selection Folder ennnen 147 C 3 Device Manager Using USB Debug Interface using VID PID 0x2047 0x0010 cesses 148 C 4 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF430 eese 149 C 5 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF432 eee 150 SLAU278P May 2009 Revised September 2013 List of Figures 5 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated 6 IA TEXAS INSTRUMENTS www ti com List of Tables 1 1 Flash Emulation Tool FET Features and Device Compatibility eese 11 1 2 Individual Kit C
83. CH 87 B 39 MSP TS430RGC64USB Target Socket Module Schematic nnennnnnnnnnnnnnnennennnnennnennnennnnnennnnnnr 89 B 40 MSP TS430RGC64USB Target Socket Module PCB rannrnnnnnnnnennnnnnnnnnnnnnnnnnnnenennnennnennnennnnnnnne 90 B 41 MSP TS430PN80 Target Socket Module Schematic occoocccccccccncconccnnncnnancnanornnrrnnnennnnrnnrrnnananos 93 B 42 MSP TS430PN80 Target Socket Module DCH 94 B 43 MSP TS430PN80A Target Socket Module Schematic cccee cece cece neces eee e tees eeeeeeeneeeeeeeeeeenee 96 List of Figures SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated IA TEXAS INSTRUMENTS www ti com B 44 MSP TS430PN80A Target Socket Module DCH 97 B 45 MSP TS430PN80USB Target Socket Module Schematic rxnnnnnnnnnnnennnnnennnnnnnennnnnnennnnennnnnene 99 B 46 MSP TS430PN80USB Target Socket Module PCB 0 cceeeeecee cece eee eee cence sees eeeeeeeeeeeeeeenaees 100 B 47 MSP TS430PZ100 Target Socket Module Schematic cceeeeee cece ence eee ee eee sees eeeeeeeeeeeeeeenaees 103 B 48 MSP TS430PZ100 Target Socket Module PCB 2 ceceeeee cece eee ee eee e eee e ee eeee seen nennen nnne 104 B 49 MSP TS430PZ100A Target Socket Module Schematic uasnsssussssnnnnnnnnnnnnnnnnnrrnnrnrnnnnnnnnnn nanna 106 B 50 MSP TS430PZ100A Target Socket Module DCH 107 B 51 MSP TS430PZ100B Target Soc
84. D io MSP TS430PZ100A Jumper JP2 Open to disconnect LED LED D1 connected to P5 1 Figure B 50 MSP TS430PZ100A Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 107 A TEXAS INSTRUMENTS MSP TS430PZ100A www ti com Table B 27 MSP TS430PZ100A Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only 1b C3 C4 0 47pF SMD0805 recommendation Check your crystal spec 2 C7 C9 2 10uF 10V Tantal Size B 511 1463 2 ND 3 SECH 3 100nF SMD0805 311 1245 2 ND 4 C8 1 10nF SMD0805 478 1358 1 ND 5 C6 0 470nF SMD0805 478 1403 2 ND DNP 6 D1 1 green LED SMD0805 67 1553 1 ND DNP Headers and receptacles enclosed with 7 J1 d J3 0 25 pin header TH kit Keep vias free of solder SAM1029 25 ND Header SAM1213 25 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND pPlace jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND Place jumper on pins 1 2 12 3 Jumper 15 38 1024 ND Place on JP1 JP2 JP3 13 JTAG 1 14 pin connector male TH HRP14H ND 14 BOOTST 0 10 pin connector male TH PINE MOOD MIES MERGI solder Q1 Micro Crystal MS1V e 15 Qi Q2 0 Crystal T1K 32 768kHz C Load PNP Keep vias
85. Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated www ti com Xi TEXAS INSTRUMENTS RST 3410 R13 33k cg II A 1u 6 3U GND TXD 03 p 1N4148 RXD UREGEN RESET WAKEUP SUSPEND CLKOUT SIN SOUT SDA SCL P3 0 P3 1 P3 3 P3 4 X1 x2 TUSB3410UF R33__1k5 UCC R45 1 B K 1 R32 100k 717 100nF T GND 24LC128I SN UBUS R46 33R C R24 33R C35 mm 22p GND CI SHIELD SHIELD1 USB_RECEPTACLE Type B 33k U12 SN75240PH 4 of 4 IC Schemati FET430UIF USB Interface 72 MSP igure F SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated TITLE MSP FETU43 IF Document Number MSP FET430UIF Date 7 25 2006 03 38 10p Sheet 4 4 Hardware 142 JA TEXAS INSTRUMENTS www ti com MSP FET430UIF CH En Ex ang 50 N D DI N e 5 e giz b Hn We Mio amp o 9 2 H2 o ES m e se oa o N LE a m SS a 2 De 200 Do wW al e e e 2 e 3 oe Ww ns e GAN E D Kei DI om E H D amp 2 SETH Eo Gs CCS Lo D m2 o m g ETA manm ol N o af en R Ha ZS na co ES S B urs SEE o TESE Ge DEE STF NNN us TARGET CON Figure B 73 MSP FET430UIF USB Int
86. E nO SAO IEEE RE O 73 B16 MS RTE ME EE 76 BIM RTE Me 79 B8 MSP rTS430RGG64B EE 82 BilSosMSP TS430RGC6O4G EE 85 B20 MS DE EE RE 89 B21 IMSP TS430PNS80 EE 93 MS DENGE 96 B23 MOP DENGE EE EE 99 B 24 5 Ee Kn LL EE 103 B 25 MS DREI NE CERTE ENERO 106 B 26 MSP TS430PZ7100B 7 77 7 EE 109 B275MSP rTS430P71006 77 eroe Sm EI Nes RUN SEES EISE 112 B 28 MSBP TSA430PZ5x100 E A NT Pa ae T TRETEN STET ETT EE E T I EU RUE 115 B 29 MSP TS430PZ100USB EE MM S EE TTE S S TERT NE DOT 118 B 305SMSP TS430PEUT28 NN EE 122 B31 EMA30E5137RE90077 NER 125 B 32 7 EMA3OE6137RE900 EE 129 BS3S3IMEMISO EE 133 B34 CMSP EET4SORIE NN 137 B 35 2 MSP EETA430UIE NE 139 30 Harwae SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated X TEXAS INSTRUMENTS MSP TS430D8 www ti com MSP TS430D8 B 1 SBWICK RST SBWTDIO TST SBWTCK 2 to measure supply current Y J6 R2 330R TST SBWTCK R5 47K RST SBWTDIO i 100nF 10uF 10V DVCC DVSS P1 2 TA1 A2 TSTISBWTCK BEEN P1 5 TAO AS SCLK RST SBWTDIO betel IO P1 6 TAVAS SDOISCL P1 7 A7 SDI SDA MSP TS430D8 Socket YAMAICHI Type IC369 0082 MSP TS430D8 Target Socket Board TITLE MSP TS430D8 Document Number Date 28 07 20111 03 35 Sheet 11 Figure B 1 MSP TS430D8 Target Socket Module Schematic 31 Hardware SLAU278P May 2009
87. EMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use It generates uses and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES 008 rules which are designed to provide reasonable protection against radio frequency interference Operation of the equipment may cause interference with radio communications in which case the user at his own expense will be required to take whatever measures may be required to correct this interference General Statement for EVMs including a radio User Power Frequency Use Obligations This radio is intended for development professional use only in legally allocated frequency and power limits Any use of radio frequencies and or power availability of this EVM and its development application s must comply with local laws governing radio spectrum allocation and power limits for this evaluation module It is the user s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental development licenses from local regulatory authorities which is responsibility of user including its acceptable authorization For EVMs annotated as FCC FEDERAL COMMUNICATIONS COMMISSI
88. GC64B Document Number Date 10 13 2010 5 25 05 PM Sheet 1 1 IC Schemati TS430RGC64B Target Socket Module 35 MSP igure F SLAU278P May 2009 Revised September 2013 Hardware 82 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430RGC64B Connector J5 External power connector Uce 18 ayt E ext Alte ise los Zi Jumper JP3 to ext Jumpers JP5 to JP10 e ac 000002 55 5 Close 1 2 to debug in Spy Bi Wire mode Sos BOOTS OG Close 2 3 to debug in 4 wire JTAG mode cel se a Rim gru Ep ejejejeje r 03 RI e SPE da TEAS weg If the system should ale be supplied via LDOI J6 000000000000000 32156 ee ee CUM Orient Pin 1 of MSP430 device z DEEE iey BOE wre eres e O n n C15 e e GFN11T064 006 e C10 m e e e RE n Q eeeee Q e e cnj e uS e e o e c ne zi e ce e jv EE GE is e LES eer ze e D1 LED connected to P1 0 _ MOS e 3 C13 Pe EZ B Clamshell Q e e 1 c7 UT oe en WEN e Jumper JP2 3i W s 110000000000000000 a Open to disconnect LED MSP TS430RGC64B Neve VA RoHs Q Figure B 36 MSP TS430RGC64B Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Hardware
89. Header SAM1213 12 ND Receptacle JP1 JP2 JP9 2 pin header male TH SAM1035 02 ND Place jumper on header JP10 JP11 2 pin header male TH SAM1035 02 ND DNP J1 JP3 JP4 JP5 3 pin header male TH SAM1035 03 ND Place jumpers on pins 2 3 JP6 JP7 JP8 J2 1 3 pin header male TH SAM1035 03 ND JP1 JP2 JP9 J1 10 Jumper 15 38 1024 ND Place on JP1 JP2 JP9 J1 JP3 JP4 JP5 JP6 JP3 JP4 JP5 JP7 JP8 JP6 JP7 JP8 7 R2 R3 R5 R6 9 DNP 0805 DNP R8 R9 R10 R11 R14 8 R12 R13 R7 3 OR 0805 541 000ATR ND 9 C5 1 1 1nF CSMD0805 490 1623 2 ND 10 C3 C7 2 1uF 10V CSMD0805 490 1702 2 ND 11 R4 1 47k 0805 541 47000ATR ND 12 C4 C6 2 100nF CSMD0805 311 1245 2 ND 13 R1 1 330R 0805 541 330ATR ND 14 C1 C2 C8 C9 4 DNP CSMD0805 DNP 15 SW1 SW2 2 EVQ 11L05R P8079STB ND DNP Lacon 1251459 16 BOOTST 1 10 pin connector male TH HRP10H ND DNP keep vias free of solder 17 JTAG 1 14 pin connector male TH HRP14H ND 18 Q1 1 DNP MS3V TR1 32768kHz depends on application Micro Crystal DNP enclosed in kit keep vias 20ppm 12 5pF free of solder 19 Q2 1 DNP Christal depends on application DNP keep vias free of solder 20 Ut 1 Socket QFN11T048 008 Manuf Yamaichi A101121 001 20 1 Ut 1 MSP430 DNP enclosed with kit Is supplied by TI 21 D1 1 green LED DIODE0805 P516TR ND 22 D3 1 red DNP DIODE0805 DNP 23 D2 1 yellow DNP DIODE0805 DNP 24 TP1 TP2 2 Testpoint DNP keep pads free of solder 25 Rubber stand off 4 Buerklin 20H1
90. JA TEXAS INSTRUMENTS www ti com MSP TS430RGC64USB Table B 22 MSP TS430RGC64USB Bill of Materials Pos Ref Des a Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 2 C6 C7 2 10uF 6 3V Tantal Size B 511 1463 2 ND 3 SERA A 4 100nF SMD0805 311 1245 2 ND 3 1 C10 C12 0 10uF SMD0805 DNP C10 C12 4 C8 1 2 2nF SMD0805 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit 7 J1 J2 J3 J4 4 16 pin header TH Keep vias free of solder SAM1029 16 ND Header SAM1213 16 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JP7 JP8 6 3 pin header male TH SAM1035 03 ND place jumpers on pins 2 3 JP9 JP10 10 T 3 2 pin header male TH SAM1035 02 ND place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 Place on JP1 JP2 JP3 12 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND Q1 Micro Crystal MS1V T1K DNP Q1 14 Q1 0 Crystal iS C Load Keep vias free of solder 5pF 15 Q2 1 Crystal Q2 4MHz Buerklin 78D134 16 R3 R7 2 330 Q SMD0805 541 330ATR ND R1 R2 R4 17 R6 e R9 2 0 Q SMD0805 541 000ATR ND DNP R4 R6 R8 R9 R12 18 R10 1 100 Q SMD0805 Buerklin 07E500 18 R11 1 1M Q SMD0805 18 R5 1 47k Q
91. L OTHER WARRANTIES EXPRESSED IMPLIED OR STATUTORY INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT SPECIAL INCIDENTAL OR CONSEQUENTIAL DAMAGES Please read the User s Guide and specifically the Warnings and Restrictions notice in the User s Guide prior to handling the product This notice contains important safety information about temperatures and voltages For additional information on TI s environmental and or safety programs please visit www ti com esh or contact TI No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine process or combination in which such TI products or services might be or are used TI currently deals with a variety of customers for products and therefore our arrangement with the user is not exclusive Tl assumes no liability for applications assistance customer product design software performance or infringement of patents or services described herein REGULATORY COMPLIANCE INFORMATION As noted in the EVM User s Guide and or EVM itself this EVM and or accompanying hardware may or may not be subject to the Federal Communications Commission FCC and Industry Canada IC rules For EVMs not subject to the above rules this evaluation board kit module is intended for use for ENGINEERING DEVELOPMENT D
92. LAU208 CC430 Family User s Guide literature number SLAU259 We I Iz I 8 Read This First SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com If You Need Assistance MSP430FR57xx Family User s Guide literature number SLAU272 MSP430FR58xx and MSP430FR59xx Family User s Guide literature number SLAU367 If You Need Assistance Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments Product Information Center PIC Contact information for the PIC can be found on the TI web site at www ti com support The Texas Instruments E2E Community support forums for the MSP430 provide open interaction with peer engineers TI engineers and other experts Additional device specific information can be found on the MSP430 web site SLAU278P May 2009 Revised September 2013 Read This First 9 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated IA TEXAS INSTRUMENTS Chapter 1 SLAU278P May 2009 Revised September 2013 Get Started Now This chapter lists the contents of the FET and provides instruction on installing the hardware Topic Page 1 1 Flash Emulation Tool EET Overview EE EE tr rer secs 11 12 Kit Contents ME ECK EE 12 13 Kit Gontents eZ430 E2013 EE 12 1 4 Kit Contents eZ430 T2012 SE 12 1 5 Kit Contents 6Z430 RE2500 EE 12 TOK C
93. LQW15AN15NG00 MURATA INDUCTOR SMT 0402 18nH 2 16 L292 L302 EE 0 018uH LQW15AN18NGOO MURATA CAPACITOR SMT 0402 CERAMIC GRM1555C1H1ROW r C291 1 1pF 50V 0 05pF COG NPO TRE an MURATA CAPACITOR SMT 0402 CERAMIC GRM1555C1H8R2W E 18 C303 1 8 2pF 50V 0 05pF COG NPO 82pF 701 MURATA C292 C301 CAPACITOR SMT 0402 CERAMIC GRM1555C1H1R5W 19 Cam C304 1 5pF 50V 0 05pF COG NPO 15pF 704 MURATA INDUCTOR SMT 0402 12nH 2 20 L291 L301 goes 0 012uH LOW15AN12NGO0 MURATA C282 C312 0312 CAPACITOR SMT 0402 CERAMIC GRM1555C1H2R0B 21 0351 C361 BS E VOL cU 2 0pF Soy Murata INDUCTOR SMT 0402 6 2nH 0 1nH 22 L1 1 se 6 2nH LQP15MN6N2BO2 Murata ULTRA SMALL TACTILE SWITCH SMT m MESE 2 op SPST NO 1 2x3x2 5mm 0 05A 12V Bal 000 OMRON R4 R5 R051 LG UNINSTALLED RESISTOR JUMPER 24 ROST R431 0 SNE 0402 00 5 ew 00 ERJ 2GE0R00X PANASONIC DNP 24a R7 1 Sen JUMPER SMT OSA 08 00 ERJ 2GEOROOX PANASONIC RESISTOR SMT 0402 THICK FILM 25 R2 R3 R6 ee ew ace 3300 ERJ 2GEJ331 PANASONIC CAPACITOR SMT 0402 CER 12pF 26 C431 C441 8 ese NED 12pF ECJ OEC1H120J PANASONIC CAPACITOR SMT 0402 CER 2200pF 27 C401 1 Ge 0 0022uF ECJ 0EB1H222K PANASONIC 28 R331 1 RESISTOR SMT THICK FILM 56K 56kQ ERJ 2GEJ563 PANASONIC 1 16W 5 C081 C221 CAPACITOR SMT 0603 CERAMIC si E ciel d VERE 10uF ECJ 1VBoJ106M PANASONIC SLAU278P May
94. MSP430 Hardware Tools User s Guide X TEXAS INSTRUMENTS Literature Number SLAU278P May 2009 Revised September 2013 13 TEXAS INSTRUMENTS Contents Preface NEE 7 1 Get Started Now anrarnnnnnnnnnnnnnnnnrnnnrnnnnennnrnnnrnnnnennnrnnnrnnnnnnnnnnsnrnsnnnnnnnnnnrnnnnnnnnnnnnsnnnnnnnnnnnne 10 1 1 Flash Emulation Tool FET Overview eie erunt EEN ENEE ENEE NES EE cose naken kven 11 1 2 Kit Contents MSP FET430PIF scott Te 1 3 Kit Contents 6 Z430 F Ah Ke EE 12 1 4 Kit Gontents e2430 T2012 see uana inna nscasxs qns vata ut ias 12 1 5 Kit Contents 2430 RF2500 s usssssnsvenavessaananseek n de us tcasusrrUstaratbheUPTP Uns RNSCR ENEE m ne de RER e 12 1 6 Kit Gontents 2430 RF2500T enee geseent Ee ee dee 12 1 7 Kit Contents eZ430 RF2500 SEH sisasciciescsstsasacsestensceneateavecceeteveceteres sass vase seustassesadseeneecavecenas 12 1 8 Kit Gontents 67430 CHrONOS XXX dass N EEN CEYERERRREERRBRARSERERUZASARSREMRRaKAREREAFGRRERERARANEASASDUAMUR 13 1 9 Kit Contents MSP FET4SQUIE 1 51 irire it ruant ro rau rre Dee a sacs RSA dao 13 140 KitContents MSP FET430XX aii ee ua aut uud ais aca aan uma rana an a a aa dte cx RR NENNEN GREEN ee 13 1 11 Kit Contents FET430F6137RF900 miii EEN ENEE SEENEN EEN REN NENNEN 14 1 12 Kit Contents MSP TS430XX NENNEN 14 1 13 Kit Contents EM430FX1X7RF900 seein iaaa aa iaaa Aawa hinaan Asrian ea iaai pei 16 1 14 Hardware Installation MSP FET430PIF nn NNN 16 1 15 Ha
95. ND Place jumper on header 9 9 Jumper 15 38 1024 ND Place on J5 J7 J12 Pos 1 2 10 JTAG 1 rad connector male HRP14H ND Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load DNP keep vias free of solder 12 5pF 13 R2 R3 2 330 Q SMD0805 541 330ATR ND 15 R5 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket OTS 14 0 65 01 Manuf Enplas 17 PCB 1 56 x 53 mm 2 layers For example 3M Adhesive Approximately 6mm 18 plastic feet 4 width 2mm height EE Part No SJ Apply to corners at bottom side 19 MSP430 2 MSP430F2013IPW DNP enclosed with kit supplied by Tl Hardware SLAU278P May 2009 Revised September 2013 Copyright 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback X TEXAS INSTRUMENTS MSP TS430L092 www ti com B 3 MSP TS430L092 T T nasus Wd bb 0T T 600Z ZT 8 9180 JOQUNN IUSWNRAEH se Jon you seop gylf 4e o furpeuon2un 30804 Pue 3SN3S Atddns 601 bTMd EHSL dSW 311IL p4eog 184205 186428 Z6 1 EKSL dSK ssng ssna T Zd SWL ZNId Ing gylf 4340 pattddns ag ued paeog seu e qe2 SANDE eui jo uadunf paeoq y Jano Atddns eu4e xe 404 ZNId ENId OGLN 1n Iain n SHLAAN 21n 1n ONS I D STN UN pa 0 10HL 6 Lsynin B 31899 3nl112U ASE uu ON 9 8 1 WOd 3 NId Lsoogn Z Cd IQL ENId 4290 S uereg PNId b Lsoogn D 1U844ND e2t4ep aunseaw oj pausdo aq o sey Edf jJO2
96. O ON S EZA O TM EE 12 17 Kit Contents GPA ROAR RASS ela eee ee ee E E EE EEEE EEE EEEE EEEE AE EEE EEEa 12 1 8 Kit Contents eZ430 Chronos2 00 JA NE 13 19 Kit Contents MSP EET430UIE ASS E EEEE A E TE a EO EE AE Ee E EA EEEE 13 110 Kit Contents MS PRETO AN 13 Tel Kit Contents FET430F6137RF900 PE 14 LAKE Contes MSP TS O O EE EEE EE 14 113 Kit Gontents EM430ExIXREI00 a cocoa E TET DTE 16 1 14 Hardware Installation MSP FET430PIF AA 16 1 15 Hardware Installation MSP FET430UIF 17 1 16 Hardware Installation eZ430 XXXX MSP EXP430G2 MSP EXP430FR5739 MSP EXP30E 5520 17 1 17 Hardware Installation MSP FET430Uxx MSP TS430xxx FET430F6137RF900 EMASOEXTISZRES00Z ENN ER ce re T 17 1 18 Important MSP430 Documents on the Web ENEE 18 10 Get Started Now SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Flash Emulation Tool FET Overview 1 1 Flash Emulation Tool FET Overview TI offers several flash emulation tools according to different requirements Table 1 1 Flash Emulation Tool FET Features and Device Compatibility e 9 e 3 D gt lt o 8 Eis o D u 5 e Lo z o te o o o O o 2 LL u eo e e x E o o o o o D D S o e e Do e Q o N N N 0 Ki ei E A LL LL uL a E TS a n a
97. ON Part 15 Compliant Caution This device complies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instruction manual may cause harmful interference to radio communications Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation Thi
98. OR remove R11 oe MSP TS430PM64A Target Socket for F4152 TITLE MSP TS430PM64A Document Number Date 3 29 2011 3 07 02 PM Sheet 1 1 Figure B 33 MSP TS430PM64A Target Socket Module Schematic 79 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated MSP TS430PM64A Jumper JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Jumper JP2 Open to measure current Orient Pin 1 of Device Jumper JP3 A TEXAS INSTRUMENTS www ti com 1 2 int Power supply via JTAG interface R TRI4 Scorer 172 JP2 JP3 R108 BB Brei c3 mr fel F fede tele paj fa tele mae week lt SBW SORI EX R6 let Lele let cno o JP5 JPO JP8 JP7 JP6 E Boa BR J4 lt 9 D se R2 P000000000000000 84 80 55 39 ale 2 Da e aa 1C51 0644 807 e e aslo Sau s S 3 e gt 5 e g soe el P als a y R S e i a Clamshell 35 10 a c Ui e fe 17 20 J2 25 30 32 le S 0000000000000000 2 2 3 ext External Power Supply Jumper JP1 Open to disconnect LED LED D1 connected to P5 1 Figure B 34 MSP TS430PM64A Target Socket Module PCB 80 Hardware SLAU278P May 2009 Revised September 2013 Copyright 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback JA TEXA
99. One legal notice Two target socket module MSP EM430F5137RF900 Two EM430F5137RF900 target socket modules This is the PCB on which is soldered a CC430F5137 device in a 48 pin RGZ package A 2x7 pin male connector is also present on the PCB MSP EM430F6137RF900 Two EM430F6137RF900 target socket modules This is the PCB on which is soldered a CC430F6137 device in a 64 pin RGC package A 2x7 pin male connector is also present on the PCB MSP EM430F6147RF900 Two EM430F6147RF900 target socket modules This is the PCB on which is soldered a CC430F6147 device in a 64 pin RGC package A 2x7 pin male connector is also present on the PCB Two CC430EM battery packs Four AAA batteries Two 868 or 915 MHz antennas Two 32 768 kHz crystals 18 PCB 2x4 pin headers Hardware Installation MSP FET430PIF Follow these steps to install the hardware for the MSP FET430PIF tools 1 Use the 25 conductor cable to connect the FET interface module to the parallel port of the PC The necessary driver for accessing the PC parallel port is installed automatically during CCS or IAR Embedded Workbench installation Note that a restart is required after the CCS or IAR Embedded Workbench installation for the driver to become active Use the 14 conductor cable to connect the parallel port debug interface module to a target board such as an MSP TS430xxx target socket module Module schematics and PCBs are shown in Appendix B Get Started Now SLAU278P May 2009 Revis
100. P TS430PZ5x100 Bill of Maierale 117 B 31 MSP TS430PZ100USB Bill of Materials 2 cece cece cece eee e eee ee ee eee eee eens enna enna eee eeeeeeeeeeeeeee 120 B 32 MSP TS430PEU128 Bill of Materials cece ec eee eee eee ee eee eee eee eee en nnne nnne nnne nnne 124 B 33 EM430F5137RF900 Bill of Materials ecce cece cece eee e ee eee eee eee een ee eee eee nnnm nnne 127 B 34 EM430F6137RF900 Bill of Materials ccc cece cece e ee eee ee eee eee eee e nnne nne enne nennen 131 B 35 EM430F6147RF900 Bill of Materials ccce cece cece cece eee eee ai nnn em enn emn nennen nnne 135 C 1 USB VIDs and PIDs Used in MSP430 Tools 146 List of Tables SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Texas Ke SLAU278P May 2009 Revised September 2013 INSTRUMENTS Read This First About This Manual This manual describes the hardware of the Texas Instruments MSP FET430 Flash Emulation Tool FET The FET is the program development tool for the MSP430 ultralow power microcontroller Both available interface types the parallel port interface and the USB interface are described How to Use This Manual Read and follow the instructions in Chapter 1 This chapter lists the contents of the FET provides instructions on installing the hardware and according software drivers After you see how quick and easy it is to us
101. P430 2 MSP430F5529 supplied by TI Insulatin http www ettinger de Art De 23 i 9 1 Insulating disk to Q2 tail cfm ART_ARTNUM 70 0 disk to Q2 8 121 24 C16 1 4 7 nF SMD0603 27 C33 1 220n SMD0603 Buerklin 53D2074 28 C35 C36 2 10p SMD0603 Buerklin 56D102 120 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430PZ100USB Table B 31 MSP TS430PZ100USB Bill of Materials continued Pos Ref Des aaa Description DigiKey Part No Comment 30 C38 1 220n SMD0603 Buerklin 53D2074 31 C39 1 4u7 SMD0603 Buerklin 53D2086 32 C40 1 0 1u SMD0603 Buerklin 53D2068 33 D2 D3 D4 3 LL103A Buerklin 2453406 34 IC7 1 TPD4E004 Manu Tl 35 LED 0 JP3QE SAM1032 03 ND DNP 36 E 0 LEDCHIPLED 0603 FARNELL 852 9833 DNP ae 0 470R SMD0603 Buerklin 07E564 DNP 38 R33 1 1k4 1k5 SMD0603 Buerklin 07E612 39 R34 1 27R SMD0603 Buerklin 078444 40 R35 1 27R SMD0603 Buerklin 078444 41 R36 1 33k SMD0603 Buerklin 07E740 42 S1 S2 S3 1 PB P12225STB ND DNP S1 and S2 Only S3 43 USB1 1 USB RECEPTACLE FARNELL 117 7885 44 JP11 1 4 pin header male TH SAM1035 04 ND place jumper only on Pin 1 SLAU278P May 2009 Revised September 2013 Hardware 121 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated
102. RUMENTS www ti com 1 2 int Power supply via JTAG debug interface 2 3 ext External power supply Sa EY 00000001 00000002 JTAG GND 99000000000000000000000000 GND 75 70 65 60 55 51 e ucc eje TEXAS sje s e INSTRUMENTS e e R4 e o Bcio H e 8 er E e sl cs del D e e ra e e ele cug e vg i Jom Si e 33 CH gt u e seu JTRG 8 o O92 ses 3210 eeje n je e 6130 qe le e dire 00000000 e le e dejo e 00000000 e nm0o00000009 e e are LL AA e ECKE IS Wb EE Di e uw oe BEB ERs Uc se R s Ale er ch Ll Ra e o c8 e R2 e e es us LED connected to P1 0 1 5 18 J115 20 000000000000000000000000 Jumper JP2 Open to disconnect LED Figure B 56 MSP TS430PZ5x100 Target Socket Module PCB 116 Hardware SLAU278P May 2009 Revised September 2013 Copyright 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback JA TEXAS INSTRUMENTS www ti com MSP TS430PZ5x100 Table B 30 MSP TS430PZ5x100 Bill of Materials Pos Ref Des Gage Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only recommendation m C3 C4 47pF SMDOBOS Check your crystal spec 2 C6 C7 2 10uF 10V Tantal Size B 511 1463 2 ND C5 C10 3 C11 C12 4 100nF SMD0805 311 1245 2 ND DNP C12 C14 C13 C14 4 C8 0 2 2nF SMD0805 DNP 5
103. S INSTRUMENTS www ti com LED connected to pin 12 Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device 2050 000002 Ucci int exh 21 e BOOTST o B v Cap Rm JTAG XX fa RIG HEr SE W Pr 00000000000000000000 lt lt 0 Sc 6 S 58 J3 45 1 np J5 o E eil i98 0 9 cno 9 e 2 e e o 2 je eccccec e Bas Ze e 0000000 e F43x elo e gt O OS 2v amp 2 le Se r2xix Y o ul o SCH 3 0 19 ees ee 9 3 Ole e e ha cre je Ze ose e 2 a O ese Zz e e D See e 5 noma e ese ess C4 C3 le sie 0 bei y tr e e a e 000000 Be a H 2E e mI o A e L 07 nu O le meee ce 23 Ri le e e 7 e C1 E e c2E JF e E 1 E mcs LESTE e n Des ale Z R2 4 5 1 12 15 20 00000000000000000000 Connector J5 sarta External power connection Remove R8 and jumper R9 Figure B 42 MSP TS430PN80 Target Socket Module PCB 94 Hardware SLAU278P May 2009 Revised September 2013 Copyright 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback JA TEXAS INSTRUMENTS www ti com MSP TS430PN80 Table B 23 MSP TS430PN80 Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment
104. S INSTRUMENTS www ti com Table B 19 MSP TS430PM64A Bill of Materials MSP TS430PM64A No per Pos Ref Des Board Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C3 0 2 2nF SMD0805 DNP 3 C6 1 10uF 10V Tantal Size B 511 1463 2 ND 4 C4 C5 2 100nF SMD0805 478 3351 2 ND 5 D1 1 green LED SMD0805 P516TR ND DNP Headers and receptacles enclosed with kit 6 J1 J2 J3 J4 0 16 pin header TH Keep vias free of solder SAM1029 16 ND Header SAM1213 16 ND Receptacle J5 JP3 JP4 7 Je ies 8 3 pin header male TH SAM1035 03 ND JP9 JP1 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header 2 Jumper 15 38 1024 ND Place on J6 J7 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH EO vias ee of 12 Q1 0 Crystal S2 eek Coad H 5 Mr vias free of 5pF 13 R3 R6 2 330 Q SMD0805 541 330ATR ND R1 R2 R5 14 RI DEO 2 0 Q SMD0805 541 000ATR ND SCH SE E R14 15 R4 1 47k O SMD0805 541 47000ATR ND 16 U1 1 Socket IC51 0644 807 Manuf Yamaichi 17 PCB 1 78 x 75 mm 4 layers 18 al 4 select appropriate SE to corners at bottom 19 MSP430 2 MSP430F4152IPM SD ER SLAU278P May 2009 Revised September 2013 Hardware 81 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP TS430RGC64B B 18 MSP TS430RGC64B UCC
105. SB and eZ430 Chronos SLAU278C Added bills of materials and updated some PCBs in Appendix B Added information about MSP TS430DA38 MSP TS430DL48 MSP TS430PW14 MSP TS430PW28 SLAU278D Added information about MSP TS430L092 MSP TS430RSB40 MSP TS430RGC64USB MSP TS430PZ100USB MSP FET430F5137RF900 SLAU278E Added jumper information o MSP TS430L092 PCBs to Appendix B Added new supported devices in Chapter 1 Added information about MSP TS430PW24 MSP TS430PW28A MSP TS430RHA40A MSP TS430RGZ48B MSP SLAU278F TS430RGC64B MSP TS430PN80A and MSP TS430PZ100B Updated MSP TS430RSB40 schematics SLAU278G Added information for MSP TS430PZ100C SLAU278H Added information for MSP TS430D8 and MSP TS430RGC64C Updated Table 1 1 Replaced Figure 2 2 SLAU278I Added Figure 2 3 l Replaced Figure B 37 and Figure B 67 Added Table C 1 Editorial changes throughout SLAU278J Added EM430F6147RF900 Section B 33 Added battery pack connection information to all EM430Fx1x7RF900 kits SLAU278K Added information for MSP TS430RGZ48C and MSP TS430PEU128 Updated Figure B 38 SLAU278L Changed descriptions in Section B 19 and Section B 30 Changed Figure B 60 SLAU278M Added information for MSP430G2x44 and MSP430G2x55 in Table 1 2 SLAU278N Updated Table 1 1 Updated Section 2 3 Changed Table 1 1 and Table 1 2 for MSP430TCH5E Changed Figure 2 1 through Figure 2 3 LAU27 SLAU2780 Changed FAQ 12 in Section A 1 Changed Figure B 47 Figure B 49 and Figure B 69 t
106. SI SBHICK R44 OR P1 2 TA 1 P1 1 TAQ 2 DNP Thermal Pad P6 3 CB3 A3 P6 2 CB2 A2 P6 4 0B4 A4 P6 1 C81 A1 P6 5 CBS AS RST NMI SBUTOIO P5 UREF VeREF A8 PJ 3 TCK P5 1 UREF USREF A9 PJ 2 TMS AUCC1 PJ A TDI TCLK P5 4 XIN PJ TDO P5 5 XOUT TEST SBATCK AUSS1 P5 3 XT20UT pucca P5 2 XT2IN DUSS1 DUSS3 P1 1 TA8 8 P4 6 PM_NONE 24 P1 4 TA8 3 DUCC2 P1 5 TA8 4 DUSS2 P1 6 TALCLK CBOUT P4 3 PH UCB1CLK P1 7 TAL G P4 2 PM_UCBASOMI ans P2 7 UCB STE UCA CLK P4 1 PM UCBASINO P3 8 UCBOSIMO UCBESDA P4 0 PM UCB1STE P3 1 UCB SOMI UCB SCL P3 4 UCA RXD UCA SOMI P3 2 UCB CLK UCA STE P3 3 UCA TXD UCA SIMO MSP430F 534X Socket Yamaichi QFN11T 48 8 8101121 UCORE ps2 iees 32 3357 P4 8 TARCLK ACLK p 7 em_none 36 36 PL TMAi P4 5 PM UCALRXO PM UCALSOMI 34 34 33 33 P1 3 TA 2 P4 4 PM UCALTXO PM UCALSIMD C11 1 nF 8 ND 38 7 37 XTLGND2 d MSP43 Target Socket MSP TS43 RGZ48B for F534x TITLE MSP TS430RG248B Document Number Date 10 15 2010 11 44 25 AM Sheet 1 1 IC Schemati TS430RGZ48B Target Socket Module 27 MSP igure F SLAU278P May 2009 Revised September 2013 Hardware 70 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS4
107. SMD0805 541 47000ATR ND 19 U1 1 Socket QFN11T064 006 Manuf Yamaichi 20 PCB 1 79 x 77mm 2 layers 2 RE UE 4 Buerklin 20H1724 Sa to corners at bottom 22 MSP430 2 MSP430F5509 RGC ee WIRES Insulating http www ettinger de Art_De 3 disk to Q2 1 Insulating disk to Q2 id 27 C33 1 220n SMD0603 Buerklin 53D2074 28 C35 1 10p SMD0603 Buerklin 56D102 29 C36 1 10p SMD0603 Buerklin 56D102 30 C38 1 220n SMD0603 Buerklin 53D2074 31 C39 1 4u7 SMD0603 Buerklin 53D2086 32 C40 1 0 1u SMD0603 Buerklin 53D2068 33 D2 D3 D4 3 LL103A Buerklin 24S3406 SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 91 A TEXAS INSTRUMENTS MSP TS430RGC64USB www ti com Table B 22 MSP TS430RGC64USB Bill of Materials continued Pos Ref Des No Per Description DigiKey Part No Comment Board 34 IC7 1 TPD4E004 Manu Tl 36 LED 0 JP3QE SAM1032 03 ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL 852 9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL 852 9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL 852 9841 DNP 40 SEM 0 470R Buerklin 07E564 DNP 41 R33 1 1k4 1k5 Buerklin 07E612 42 R34 1 27R Buerklin 07E444 43 R35 1 27R Buerklin 07E444 44 R36 1 33k Buerklin 07E740 45 S1 0 PB P12225STB ND DNP 46 S2 0 PB P12225STB ND DNP 46 S3 1 PB P12225STB ND 47 USB1 1 USB RECEPTACLE FARNELL 117 7885 92 Ha
108. SP4 2 P1 2 porn P1 1 TA D Es 4 P1 2 TA 4 14 14 03 3 1m1 2 2 vire SpyBilire GND R5 R DND XIN P2 6 TR8 1 XOUT P2 7 TEST SBUTCK IEST SBUTCK 3 3 3 3 P1 2 TDO P1 6 TDI P1 5 TMS j P1 4 a a JTAG Mode selection o 4 uire JTAG Set jumpers J to J12 to position 2 3 JP5 JP4 et jumpers J7 to J12 to position 2 1 BSL Interface BOOTST Ra er L3 5 R3 R I P1 5 TMS BSL D E GND P1 17 T160 SL T DNP P2 4 181 2 P2 3 TA1 0 3 4 180 e G2XXX PW28 ENPLASSOCKET Socket ENPLAS Type OTS 28 0 65 01 RST SBWTDIO MSP TS43 PW28A Socket Board for G2XXX and F2 XX TITLE MSP TS43 PW28A Document Number Date 10 14 2010 9 34 34 AM Sheet 1 1 Ic Schemati TS430PW28A Target Socket Module 15 MSP igure F SLAU278P May 2009 Revised September 2013 Hardware 52 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Jumper JP2 Open to measure current Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1 0 de 0000000 000000902 00000 000002 q 10 BOOTST Cog R28 HR3 ucc ai OTS 28 0 65 01 00 Y TEXAS INSTR
109. September 2013 Copyright O 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback JA TEXAS INSTRUMENTS www ti com Kit Contents MSP TS430xx Table 1 2 Individual Kit Contents MSP TS430xx continued Part Number Socket Type Supported Devices Included Devices Headers and Comment MSP TS430RSB40 40 pin RSB MSP430F51x1 Eight PCB 1x10 pin headers four male green PCB QEN ZIF MSP430F51x2 2 x MSP430F5172IRSB and four female MSP TS430RHA40A 40 pin RHA MSP430FR572x Eight PCB 1x10 pin headers four male red PCB QFN ZIF MSP430FR573x 2 x MSP430FR5739IRHA and four female MSP TS430DL48 48 pin DL Four PCB 2x12 pin headers two male green PCB TSSOP ZIF MSP430F42x0 2 x MSP430F4270IDL and two female MSP TS430RGZ48B 48 pin RGZ Eight PCB 1x12 pin headers four male blue PCB QFN ZIF MSP430F534x 2 x MSP430F5342IRGZ and four demais MSP TS430RGZ48C 48 pin RGZ MSP430FR58xx and Eight PCB 1x12 pin headers four male black PCB QFN ZIF MSP430FR59xx 2 x MSP430FR5969IRGZ and four female MSP430F13x MSP430F14x MSP430F14x1 MSP430F15x MSP430F16x MSP430F16x1 MSP430F23x TS Kit MSP TS430PM64 64 pin PM MSP4B0F RAX EN Eight PCB 1x16 pin headers four male green PCB QFP ZIF Mir SORG FET fb and four female MSP430F261x 2 x MSP430F417IPM and MSP430F41x 2 x MSP430F169IPM MSP430F42x MSP430F42xA MSP430FE42x MSP43
110. T430UIF JTAG debugger interface Connect the MSP FET430UIF JTAG connector to the target board Start the debug session using IAR or CCS IDE For more information on debugging the MSP4and MSP430F525x see the device specific data sheets MSP430F522x SLAS718 MSP430F525x SLAS903 and Designing with MSP430F522x and MSP430F521x Devices SLAA558 For debuggiong of devices MSP430F524x and MSP430F523x without use of the DVIO power domain short J6 with the jumper SLAU278P May 2009 Revised September 2013 Hardware 85 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP TS430RGC64C
111. TILE SWITCH SMT 2P 23 S1 S2 2 SPST NO 1 2x3x2 5mm 0 05A 12V B3U 1000P OMRON R1 R7 R551 RESISTOR JUMPER SMT 0402 0 Q 5 24 E CNR ERJ 2GEOROOX UN PANASONIC 25 R2 R3 R6 a RESISTOR SMT 0402 THICK FILM 5 ERJ 2GEJ331 PANASONIC 1 16W 330 CAPACITOR SMT 0402 CER 2200pF 27 C511 M ECJ 0EB1H222K PANASONIC C111 C251 CAPACITOR SMT 0603 CERAMIC 1uF CZ eV ECJ 1VB0J105K PANASONIC 28a C041 1 CAP CERAMIC 4 7UF 6 3V X5R 0603 ECJ 1VB0J475M PANASONIC 29 R441 SOR SMT TOK E E FERE PANASONIC 30 xi 1 SMA STRIGHT JACK SMT 32K10A 40ML5 ROSENBERGER SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Hardware 135 Copyright 2009 2013 Texas Instruments Incorporated l TEXAS INSTRUMENTS EM430F6147RF900 www ti com Table B 35 EM430F6147RF900 Bill of Materials continued No Pos Ref Des per Description Part No Manufacturer Board DUT SMT PQFP RGC 64 0 5mmLS 31 i 1 19 15x9 15x1mm THRM PAD CC430F6147 d IC Step Down Converter with Bypass Mode 33 E 1 for Low Power Wireless TPS62370 T 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 35 JP2 JP6 JP8 3 Pin Connector 1x3pin 61300311121 WUERTH 36a PA 4 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 38 C7 1 Capacitor Ceramic 1206 16V X5R 20 GRM31CR61C226ME15L MURATA 38 C8 9 2 CAP SMD Ceramic 0402 2 2uF X5R GRM1
112. UMENTS MSP TS43 PW28A Rev 1 8 RoHS e eere amp ex je e 06 e 0 0 O0 O O0 O O O O O MSP TS430PW28A Connector J5 External power connector Jumper JP1 to ext Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Figure B 16 MSP TS430PW28A Target Socket Module PCB Red SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Hardware 53 Copyright 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430PW28A www ti com Table B 9 MSP TS430PW28A Bill of Materials Position Ref Des pad Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C5 1 2 2nF SMD0805 3 C3 1 10uF 10V SMD0805 4 C4 C6 2 100nF SMD0805 478 3351 2 ND 5 D1 1 green LED SMD0805 P516TR ND DNP Headers and receptacles 6 J1 J2 0 14 pin header TH enclosed with kit Keep vias free of solder Header amp Receptacle J5 JP1 JP4 JP5 Un Place jumper on 1 2 of JP4 JP9 7 JP6 JP7 8 3 pin header male TH SAM1035 03 ND Place on 1 2 on JET JP8 JP9 8 JP2 JP3 2 pin header male TH SAM1035 02 ND Place jumper on header 9 Jumper 15 38 1024 ND see Pos 7 an 8 10 JTAG 1 zm connector male HRP14H ND 11 BOOTST 0 DNP Keep vias free of solder Micro Crystal MS3V 12 Q1 0 Crystal 32 768kHz C Load DNP keep vias free of solder 12 5pF 13
113. age remove R11 and add R10 0 Ohm MSP TS430DA38 Target Socket Board for MSP430F2247IDA TITLE MSP TS430DA38 Document Number Sheet 1 1 Date 6 18 2008 11 04 56 AM Figure B 17 MSP TS430DA38 Target Socket Module Schematic 55 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP T5430DA38 www ti com Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire Mode Close 2 3 to debug in 4 wire JTAG Mode LED connected to P1 0 Jumper JP3 Open to disconnect LED 6600000006 Orient pin 1 of 999999299 MSP430 device Jumper JP2 Open to measure current o000000000 Connector J3 EE External power connector Jumper JP1 to ext 0000000000000000000 29 25 32 30 35 38 Figure B 18 MSP TS430DA38 Target Socket Module PCB 56 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430DA38 Table B 10 MSP TS430DA38 Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 C7 1 10uF 10V Tantal Size B 511 1463 2 ND 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 0 2 2nF SMD0805 DNP 5 D1 1 green LED SMD0603 475 1056 2 ND DNP headers
114. and receptacles enclosed with 6 J1 J2 0 19 pin header TH kit Keep vias free of solder SAM1029 19 ND Header SAM1213 19 ND Receptacle Es pe Place jumpers on headers 7 8 3 pin header male TH SAM1035 03 ND JP1 JP4 JP5 JP6 JP7 E e JP8 JP9 Pos 1 2 JP8 JP9 8 JP2 JP3 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 9 Jumper 15 38 1024 ND Nr 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH ONP Keep ide aa solder Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load Te Keep Vias freeoi solder 12 5pF 13 R1 R3 2 330 Q SMD0805 541 330ATR ND 14 R10 R11 0 0 Q SMD0805 541 000ATR ND DNP 15 R5 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket IC189 0382 037 Manuf Yamaichi 17 PCB 1 67 x 66 mm 2 layers Adhesive i i for example 3M Bumpons Apply to corners at bottom 18 Plastic feet 4 6mm width 2mm height part No SJ 5302 side DNP enclosed with kit 19 MSP430 2 MSP430F22741DA supplied by TI SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 57 X TEXAS INSTRUMENTS www ti com MSP TS430QFN23x0 B 10 MSP TS430QFN23x0 c3 18uF 18U J5 Ext PAR R1 330R P1 0 Ki ene mr JP3 ico oo py fan on Joa
115. ce module One 25 conductor cable One 14 conductor cable NOTE This part is obsolete and is not recommended to use in new design 1 3 Kit Contents eZ430 F2013 One QUICK START GUIDE document One eZ430 F2013 development tool including one MSP430F2013 target board 1 4 Kit Contents eZ430 T2012 Three MSP430F2012 based target boards 1 5 Kit Contents eZ430 RF2500 One QUICK START GUIDE document One eZ430 RF2500 CD ROM One eZ430 RF2500 development tool including one MSP430F2274 and CC2500 target board One eZ430 RF2500T target board OneAAA battery pack with expansion board batteries included 1 6 Kit Contents eZ430 RF2500T One eZ430 RF2500T target board OneAAA battery pack with expansion board batteries included 1 7 Kit Contents eZ430 RF2500 SEH One MSP430 development tool CD containing documentation and development software One eZ430 RF USB debugging interface Two eZ430 RF2500T wireless target boards One SEH 01 solar energy harvester board OneAAA battery pack with expansion board batteries included 12 Get Started Now SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Kit Contents eZ430 Chronos xxx 1 8 Kit Contents eZ430 Chronos xxx 433 868 915 One QUICK START GUIDE document One ez430 Chronos emulator One screwdriver Two spare screws eZ430 Chronos 433
116. ce to drive XIN directly With current interface hardware and software there is a weakness when adapting target boards that are powered externally This leads to an accidental fuse check in the MSP430 device This is valid for PIF and UIF but is seen most often on the UIF A solution is being developed Workarounds Connect the RST NMI pin to the JTAG header pin 11 LPT and USB tools are able to pull the RST line which also resets the device internal fuse logic e Use the debugger option Release JTAG On Go that can be selected from the IDE drop down menu This prevents the debugger from accessing the MCU while the application is running Note that in this mode a manual halt is required to see if a breakpoint was hit See the IDE documentation for more information on this feature Use an external clock source to drive XIN directly The 14 conductor cable that connects the FET interface module and the target socket module must not exceed 8 inches 20 centimeters in length The signal assignment on the 14 conductor cable is identical for the parallel port interface and the USB FET To use the on chip ADC voltage references the capacitor must be installed on the target socket module See the schematic of the target socket module to populate the capacitor according to the data sheet of the device To use the charge pump on the devices with LCD Module the capacitor must be installed on the target socket module See the schematic o
117. current Connector J5 External power connector Jumper JP1 to ext Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Figure B 60 MSP TS430PEU128 Target Socket Module PCB NOTE The MSP TS430PEU128 Rev 1 1 ships with the following modifications R7 value is changed to 0 Q instead of 330 Q e JTAG pin 8 is connected only to JP5 pin 3 and not to pin 2 e JP5pin2 is connected to ICT pin 97 BOOTST pin 7 is connected to IC1 pin 97 SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 123 A TEXAS INSTRUMENTS MSP TS430PEU128 www ti com Table B 32 MSP TS430PEU1 28 Bill of Materials No Per et Pos Ref Des Description DigiKey Part No Comment Board 94x119 4mm 4 layers MSP TS430PEU128 4 layers green solder mask 1 PCB 1 Rev 1 1 D1 1 green LED DIODE0805 516 1434 1 ND JP1 JP2 JP4 3 2 pin header male TH SAM1035 02 ND Place jumper on header JP5 JP6 JP7 JP8 3 pin header male TH SAM1035 03 ND Place jumpers on pins 1 2 SBW 4 6 JP9 JP10 JP11 JP12 JP13 3 4 pin header male TH SAM1035 04 ND Place jumpers on pins 1 2 AVCC VCC JP3 1 4 pin header male TH SAM1035 04 ND Place jumpers on pins 1 2 JP1 JP2 JP3 JP4 Jumper WM4592 ND 7 JP5 JP6 JP7
118. ded solely for use for preliminary feasibility evaluation in laboratory development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components systems and subsystems It should not be used as all or part of a finished end product Your Sole Responsibility and Risk You acknowledge represent and agree that 1 You have unique knowledge concerning Federal State and local regulatory requirements including but not limited to Food and Drug Administration regulations if applicable which relate to your products and which relate to your use and or that of your employees affiliates contractors or designees of the EVM for evaluation testing and other purposes 2 You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements and also to assure the safety of any activities to be conducted by you and or your employees affiliates contractors or designees using the EVM Further you are responsible to assure that any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard 3 Since the EVM is not a completed product it may not meet all applicable regulatory and safety compliance standards
119. e device errata may also be found in the device bug database at www ti com sc cgi bin buglist cgi SLAU278P May 2009 Revised September 2013 Get Started Now 13 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Kit Contents FET430F6137RF900 1 11 Kit Contents FET430F6137RF900 One READ ME FIRST document 1 12 One legal notice One MSP FET430UIF interface module Two EM430F6137RF900 target socket modules This is the PCB on which is soldered a CC430F6137 device in a 64 pin RGC package A 2x7 pin male connector is also present on the PCB Two CC430EM battery packs Four AAA batteries Two 868 MHz or 915 MHz antennas Two 32 768 kHz crystals 18 PCB 2x4 pin headers One USB cable One 14 pin JTAG conductor cable Kit Contents MSP TS430xx One READ ME FIRST document One 32 768 kHz crystal from Micro Crystal except MSP TS430PW24 One target socket module A TEXAS INSTRUMENTS www ti com A 2x7 pin male JTAG connector is also present on the PCB see different setup for L092 MSP430 Device samples see Table 1 2 for sample type Table 1 2 Individual Kit Contents MSP TS430xx Part Number Socket Type Supported Devices Included Devices Headers and Comment MSP TS430D8 8 pin D MSP430G2210 1 x MSP430G2210 and Two PCB 1x4 pin headers two male and green PCB TSSOP ZIF MSP430G2230 1 x MSP430G2230 two female MSP430F20xx MSP430G2x01 MSP TS4
120. e the development tools TI recommends that you read all of this manual This manual describes the setup and operation of the FET but does not fully describe the MSP430 microcontrollers or the development software systems For details of these items see the appropriate Tl documents listed in Section 1 18 This manual applies to the following tools and devices e MSP FET430PIF debug interface with parallel port connection for all MSP430 flash based devices e MSP FET430UIF debug interface with USB connection for all MSP430 flash based devices e eZ430 F2013 USB stick form factor interface with attached MSP430F2013 target for all MSP430F20xx MSP430G2x01 MSP430G2x11 MSP430G2x21 and MSP430G2x31 devices e eZ430 T2012 three MSP430F2012 based target boards e eZ430 RF2500 USB stick form factor interface with attached MSP430F2274 and CC2500 target for all MSP430F20xx MSP430F21x2 MSP430F22xx MSP430G2x01 MSP430G2x11 MSP430G2x21 and MSP430G2x31 devices e eZ430 RF2500T one MSP430F2274 and CC2500 target board including battery pack e eZ430 RF2500 SEH USB stick form factor interface with attached MSP430F2274 and CC2500 target and solar energy harvesting module e eZ430 Chronos xxx USB stick form factor interface with CC430F6137 based development system contained in a watch Includes lt 1 GHz RF USB access point Stand alone target socket modules without debug interface named as MSP TS430TSxx Tools named as MSP FET430Uxx c
121. e voltage on the MSP430F5xx device is approximately 0 3 V lower than is set by the debugging tool Set the voltage in the IDE to 0 3 V higher than desired for example to run the MCU at 3 0 V set it to 3 3 V E rie PRE c 9 g tear FB 7 o sl s3 BB as exco 5 LTD ae s e eS eE SPRE Zu u 3 H TRT B zt ln pa 5 R11 D B HA HEI 9 EM 6 03 bal id Leon S i 5 3 zo n a E Sg 5 8 g n a 9 B E IL g It Q 5 80 ala z oR NN DT S g 51 z Ejea e mp bis 8 B Bbbb n BEER BRER Paz P 38 5B 8 b BR Ova muni T 1 101 VCC i 2 2 102 104 5 3 2 Z 3 GND 103 4 25 76 26 75 TPD4E 4 2 E E 74 alla d 28 73 5 29 eem e gt Bs E 3e S tz 71 H p 9 E 1 5 R U ana 2 31 SER 7e a l alla 32 183 OD se S9XI2IN ES g 33 gz 68 2 a OQ E 35 E s og U s R 38 63 39 E e E S S 3 E z Li T gen as ER UuSB H 2 E ueus 19 22 Plu1 DH St legt Er 88 358 BLL DP 3 ook c 5 2 E ges n2 R 8 HU B d aoe 38 23 Sie 8 D4 LLIB3A PUR3 part m 7 K x o LE 4708 FR Ges o S alza p R15 8 g d S e N A Al 3 2 oa o LED 470R Ka 8 ec cj 5 M m 3 go m R16 Sg E gt 3 a 2 o LED 4708 e ty 8 zar Z 5 Q X 2 9 z 9 z aw
122. ector xo b Sann ES us gun onsets INSTRUMENTS cau o C511 EM430F6147RF900 Rev 4 0 xt c O D A TEXAS INSTRUMENTS www ti com Jumper JP6 1 2 Bypass 2 3 TPS mode Jumper JP8 1 2 Bypass 2 3 TPS mode TPS62730 Jumper JP2 Y Close EXT for external supply I e Close INT for JTAG supply oR aug CO Jumper JP1 Spy Bi Wire mode Close SBW position to debug in Spy Bi Wire mode Jumper JP1 Close JTAG position to debug in JTAG mode Push button S2 connected to P1 7 32kHz crystal Use 00 resistor for R554 R551 to makeP5 0 P5 1 available on connector port5 Reset button S1 Figure B 66 EM430F6147RF900 Target Board PCB The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12 Ensure correct battery insertion regarding the polarity as indicated in battery holder 134 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com EM430F6147RF900 Table B 35 EM430F6147RF900 Bill of Materials No Pos Ref Des per Description Part No Manufacturer Board CUSTOMER SUPPLY CRYSTAL SMT AKER 1 Q1 1 4P 26MHz ASX 531 CS ELECTRONIC C1 5 C11
123. ed September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated l www ti com TEXAS INSTRUMENTS Hardware Installation MSP FET430UIF 1 15 Hardware Installation MSP FET430UIF Follow these steps to install the hardware for the MSP FET430UIF tool 1 2 Install the IDE CCS or IAR you plan to use before connecting USB FET interface to PC The IDE installation installs drivers automatically Use the USB cable to connect the USB FET interface module to a USB port on the PC The USB FET should be recognized as the USB device driver is installed automatically If the driver has not been installed yet the install wizard starts Follow the prompts and point the wizard to the driver files The default location for CCS is c ti ccsv5 ccs_base emulation drivers msp430 USB_CDC or c ti ccsv5 ccs_base emulation drivers msp430 USB_FET_XP_XX depending of firmware version of the tool The default location for IAR Embedded Workbench is lt Installation Root gt Embedded Workbench x x 430 drivers TIUSBFET eZ430 UART or Installation Root gt Embedded Workbench x x 430 drivers lt Win_OS gt depending of firmware version of the tool The USB driver is installed automatically Detailed driver installation instructions can be found in Appendix C After connecting to a PC the USB FET performs a self test during which the red LED may flash for approximately two seconds If the self test passes succes
124. ed from TI Customers should erase the information memory before its first use Main memory of packaged devices is blank when the device is delivered from TI 12 The device current is higher then expected The device current measurement may not be accurate with the debugger connected to the device For accurate measurement disconnect the debugger Additionally some unused pins of the device should be terminated See the Connection of Unused Pins table in the device s family user s guide 13 The following ZIF sockets are used in the FET tools and target socket modules 8 pin device D package Yamaichi IC369 0082 14 pin device PW package Enplas OTS 14 065 01 14 pin package for L092 PW package Yamaichi IC 189 0142 146 24 pin package PW package Enplas OTS 24 28 0 65 02 28 pin device DW package Wells CTI 652 D028 28 pin device PW package Enplas OTS 28 0 65 01 38 pin device DA package Yamaichi IC 189 0382 037 40 pin device RHA package Enplas QFN 40B 0 5 01 40 pin device RSB package Enplas QFN 40B 0 4 48 pin device RGZ package Yamaichi QFN11T048 008 A101121 001 48 pin device DL package Yamaichi IC51 0482 1163 64 pin device PM package Yamaichi IC51 0644 807 64 pin device RGC package Yamaichi QFN11T064 006 80 pin device PN package Yamaichi IC201 0804 014 100 pin device PZ package Yamaichi IC201 1004 008 128 pin device PEU package Yamaichi IC500 1284 009P Enplas www enplas com Wells CTl
125. emperatures greater than 60 C as long as the input and output are maintained at a normal ambient operating temperature These components include but are not limited to linear regulators switching transistors pass transistors and current sense resistors which can be identified using the EVM schematic located in the EVM User s Guide When placing measurement probes near these devices during normal operation please be aware that these devices may be very warm to the touch As with all electronic evaluation tools only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs Agreement to Defend Indemnify and Hold Harmless You agree to defend indemnify and hold TI its licensors and their representatives harmless from and against any and all claims damages losses expenses costs and liabilities collectively Claims arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory and even if the EVM fails to perform as described or expected Safety Critical or Life Critical Applications If you intend to evaluate the components for possible use in safety critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury or death such as device
126. ennnnnnnennnnnnnnnennnnennnennnennnennnnnnnnr 43 B 10 MSP TS430PW24 Target Socket Module PCB annnnnnnnnnnnnnnnnnnnennnnnnnnnnnnnnnnnnnnnnnnnnnnnnennnnuunnnune 44 B 11 MSP TS430DW28 Target Socket Module Schematic 0cceeeee eee e eee e ence neces eee eeeeeeeeeeeaeeeneenee 46 B 12 MSP TS430DW28 Target Socket Module PCB cceceee cece cece eee eee eee ee ences e nnne nnnm nenne 47 B 13 MSP TS430PW28 Target Socket Module Schematic rnnnnnnnnnnnnnnnnnnnnnnnnnnnnnneennnennnennnennnnennne 49 B 14 MSP TS430PW28 Target Socket Module PCB sannnnnnnnnnnnnnnnnnnnennnnnnnennnnennnnnnnnnnnnnnnnnennnenunnnnnne 50 B 15 MSP TS430PW28A Target Socket Module Gchematc 52 B 16 MSP TS430PW28A Target Socket Module PCB Red eee eeeeeeeeeenaeeeeeeeeeees 53 B 17 MSP TS430DA38 Target Socket Module Schematic annnnnnnnnnnnnnnnnnnnnnnnennnennnnnnnnennennnennnnnenne 55 B 18 MSP TS430DA38 Target Socket Module DCH 56 B 19 MSP TS430QFN23x0 Target Socket Module Schematic nnnnnnnnnnnnnnnnnnnnnnnnnnnnennnennnennnennnnennne 58 B 20 MSP TS430QFN23x0 Target Socket Module PCB usnnnnnnnnnnnnnnnennnnnnnennnnnnnnnennnnennnennnnnnnennnnnnnnr 59 B 21 MSP TS430RSB40 Target Socket Module Schematic ooocccoccconncnnncconecnnacnnnnncnnnrnnnrnnnrrnnnrnnannnns 61 B 22 MSP TS430RSB40 Target Socket Module DCH 62 B 23 MSP TS430RHA40A Target Socket Module Schematic nnnnnnnnnnnnnnnnnnnnnnnnennnnnnnne
127. erface PCB SLAU278P May 2009 Revised September 2013 Hardware 143 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated 144 A TEXAS INSTRUMENTS MSP FET430UIF www ti com B 35 1 MSP FET430UIF Revision History Revision 1 3 Initial released hardware version Assembly change on 1 3 May 2005 R29 R51 R42 R21 R22 R74 value changed from 330R to 100R Changes 1 3 to 1 4 Aug 2005 J5 VBUS and RESET additionally connected R29 R51 R42 R21 R22 R74 value changed from 330R to 100R U1 U7 F1612 can reset TUSB3410 R44 OR added TARGET CON pins 6 10 12 13 14 disconnected from GND Firmware upgrade option through BSL R49 R52 R53 R54 added R49 R52 are currently DNP Pullups on TCK and TMS R78 R79 added U2 Changed from SN74LVC1G125DBV to SN74LVC1G07DBV NOTE Using a locally powered target board with hardware revision 1 4 Using an MSP FET430UIF interface hardware revision 1 4 with populated R62 in conjunction with a locally powered target board is not possible In this case the target device RESET signal is pulled down by the FET tool It is recommended to remove R62 to eliminate this restriction This component is located close to the 14 pin connector on the MSP FET430UIF PCB See the schematic and PCB drawings in this document for the exact location of this component Assembly change on 1 4 January 2006 R62 not populated Hardware SLAU278P May 2009 Revised Septe
128. ess Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2014 Texas Instruments Incorporated
129. external supply voltage remove R11 and add R10 0 Ohm MSP TS430PW28 Target Socket Board for MSP430 s in PW28 package TITLE MSP TS430PH28 Document Number Date 11 15 2007 4 05 56 PM Sheet 1 1 Figure B 13 MSP TS430PW28 Target Socket Module Schematic 49 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS MSP TS430PW28 www ti com Jumper JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Soe BER 00000001 60000092 Jumper JP1 JP1 JTAG 1 2 int Power supply via JTAG interface WE 2 3 ext External Power Supply Jumper JP2 Open to measure current 0 o Orient Pin 1 of Device e o o o o o o x OTS 28 0 65 01 00 o Jumper JP3 o s V o 3 Open to disconnect LED MSP TS430PW28 op BR Rev 3 1 P LED D1 connected to P5 1 Figure B 14 MSP TS430PW28 Target Socket Module PCB 50 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430PW28 Table B 8 MSP TS430PW28 Bill of Materials Pos Ref Des As Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 de i holes 2 C3 1 10uF 10V Tantal Elko B 3 C4 1 100nF SMD0805 4 C5 0
130. f Yamaichi 12 D1 1 red LED 0603 DNP enclosed with kit Is 13 MSP430 2 MSP430x supplied by TI 14 PCB 1 50 0mmx44 5mm ee SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 33 www ti com Xi TEXAS INSTRUMENTS B 2 MSP TS430PW14 MSP TS430PW14 RST NMI SBWTCK TMS TDI TDO SBWTDIO TEST SBWTCK R2 R5 47K 330R 3 3 3 3 JTAG gt 3 3 le TEST SBWTCK RST SBWTDIO f P1 7 TDO P1 6 TDI f P1 5 TMS P1 4 TCK 1 1 1 1 1 1 SBW gt J7 J8 J9 J10 J11 J12 C8 2 2nF 29 to measure supply current DNP JTAG Mode selection 4 wire JTAG Set jumpers J7 to J12 to position 2 3 I 2 wire SpyBiWire Set jumpers J7 to J12 to position 2 1 C5 WE J6 GND ra 10uF 10 VCC430 1208 E XOUT DN TEST SBWICK i RST SBWTDIO Q1 j P1 7 1DO DNP PT 5 TMS P1 6 TDI 1225 pa I XIN DN 100nF Socket ENPLAS Type OTS 14 065 Sp R3 green pi MSP TS430PW14 Target Socket Board TITLE MSP TS430PW14 Document Number Date 7 16 2007 8 22 36 AM Sheet 1 1 Submit Documentation Feedback SLAU278P May 2009 Revised September 2013 Copyright O 2009 2013 Texas Instruments Incorporated Figure B 3 MSP TS430PW14 Target S
131. f the target socket module to populate the capacitor according to the data sheet of the device Crystals or resonators Q1 and Q2 if applicable are not provided on the target socket module For MSP430 devices that contain user selectable loading capacitors see the device and crystal data sheets for the value of capacitance Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or C SPY as any required clocking and timing is derived from the internal DCO and FLL On devices with multiplexed port or JTAG pins to use these pin in their port capability For CCS Run Free in Run pulldown menu at top of Debug View must be selected For C SPY Release JTAG On Go must be selected 10 As an alternative to sharing the JTAG and port pins on low pin count devices consider using an MSP430 device that is a superset of the smaller device A very powerful feature of the MSP430 is that the family members are code and architecturally compatible so code developed on one device for example one without shared JTAG and port pins ports effortlessly to another assuming an equivalent set of peripherals 26 Frequently Asked Questions and Known Issues SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Hardware FAQs 11 Information memory may not be blank erased to OxFF when the device is deliver
132. h 6 J1 J2 0 24 pin header TH kit Keep vias free of solder SAM1034 12 ND Header SAM1212 12 ND Receptacle i AA Place jumper on header 7 J3 JP1 JP2 2 3 pin header male TH SAM1035 03 ND JP1 Pos 1 2 DNP JP2 8 J4 J5 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 3 Jumper 15 38 1024 ND Place on JP1 J4 J5 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH BEER solder Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load EE solder 12 5pF 13 R3 1 560 Q SMD0805 541 560ATR ND 14 loud 2 0 Q SMD0805 541 000ATR ND DNP R6 R7 15 R5 1 47k O SMD0805 541 47000ATR ND Socket IC51 1387 KS 16 U1 1 15186 Manuf Yamaichi 17 PCB 1 58 x 66 mm 2 layers Adhesive for example 3M Bumpons Apply to corners at bottom 18 Plastic feet 6mm width 2mm height part No SJ 5302 side DNP Enclosed with kit 19 MSP430 2 MSP430F4270IDL supplied by TI SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 69 X TEXAS INSTRUMENTS www ti com MSP TS430RGZ48B B 14 MSP TS430RGZ48B UCC R2330R 4 JP5 FE TES JP10 JP8 JP9S SES ig lt SEU 2 n 2 I 2 o 2 4 iE eE lt JTAG BSL Interface one BOOTST Rio OR 2 2nF C8 FE12 1 1 m E 10uF 6 3U 6 i i IE
133. hrough Figure B 73 Added information about F523x F524x and F525x to Table 1 2 and Section B 19 SLAU278P Changed Figure B 38 Added BSL information to note on Figure B 41 NOTE Page numbers for previous revisions may differ from page numbers in the current version SLAU278P May 2009 Revised September 2013 Revision History 151 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated RF EMISSION TESTING All MSP TS430xxx kits and kits listed below have been tested for compliance with Part 15 of the FCC and Canadian ICES 003 rules See for details on compliance with these rules All other kits described in this document either have not been tested or have the statement in their documentation which is listed in Related Documentation From Texas Instruments MSP FET430UIF EVALUATION BOARD KIT MODULE EVM ADDITIONAL TERMS Texas Instruments TI provides the enclosed Evaluation Board Kit Module EVM under the following conditions The user assumes all responsibility and liability for proper and safe handling of the goods Further the user indemnifies TI from all claims arising from the handling or use of the goods Should this evaluation board kit not meet the specifications indicated in the User s Guide the board kit may be returned within 30 days from the date of delivery for a full refund THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF AL
134. ions of the target socket modules and their parts are found in Appendix B SLAU278P May 2009 Revised September 2013 Get Started Now 17 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS Important MSP430 Documents on the Web www ti com 1 18 Important MSP430 Documents on the Web The primary sources of MSP430 information are the device specific data sheet and user s guide The MSP430 web site www ti com msp430 contains the most recent version of these documents PDF documents describing the CCS tools CCS IDE the assembler the C compiler the linker and the librarian are in the msp430 documentation folder A Code Composer Studio specific Wiki page FAQ is available and the Texas Instruments E2E Community support forums for the MSP430 and Code Composer Studio v5 provide additional help besides the product help and Welcome page PDF documents describing the IAR tools Workbench C SPY the assembler the C compiler the linker and the librarian are in the common doc and 430 doc folders Supplements to the documents that is the latest information are available in HTML format in the same directories A IAR specific Wiki Page is also available 18 Get Started Now SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated J TEXAS ERA SLAU278P May 2009 Revised September 2013 INSTRUMENTS Desig
135. is not required the desired Vc connections may be hard wired to eliminate the jumper block Pins 2 and 4 must not be connected at the same time Note that in 4 wire JTAG communication mode see Figure 2 1 the connection of the target RST signal to the JTAG connector is optional when using devices that support only 4 wire JTAG communication mode However when using devices that support 2 wire JTAG communication mode in 4 wire JTAG mode the RST connection must be made The MSP430 development tools and device programmers perform a target reset by issuing a JTAG command to gain control over the device However if this is unsuccessful the RST signal of the JTAG connector may be used by the development tool or device programmer as an additional way to assert a device reset Design Considerations for In Circuit Programming SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Signal Connections for In System Programming and Debugging Important to connect mr 8 J1 see Note A 1 A J2 see Note A MSP430Fxxx op x e Q Voc AVeclD Vcc 62 10 uF La nn R1 47 KQ see Note B ANN RST NMI TDO TDI TDI VPP TMS TCK VCC TOOL VCC TARGET TDO TDI TDI VPP TEST VPP RST see Note D TEST VPP see Note C C1 10 nF 2 2 nF TT
136. ket Module Schematic uaassassssssunnnennnnnrnnnnrnnrrnnnnennnnnnnnnnnnnnn 109 B 52 MSP TS430PZ100B Target Socket Module DCH 110 B 53 MSP TS430PZ100C Target Socket Module Schematic annnnnnnnnnnnnnnennnnnnnnenennnnnnnnnnnennnnnnnnnne 112 B 54 MSP TS430PZ100C Target Socket Module PCB nnnnennnnnnnnnnnnnnnnnnnnnnnnnnennnnnnnnnnnnennnnnennnenunene 113 B 55 MSP TS430PZ5x100 Target Socket Module Schematic nrnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnenuneer 115 B 56 MSP TS430PZ5x100 Target Socket Module DCH 116 B 57 MSP TS430PZ100USB Target Socket Module Schematic s assusseusnnennnnnnnnnnnnnrrnnnnennnnnnnnnnnnnnn 118 B 58 MSP TS430PZ100USB Target Socket Module DCH 119 B 59 MSP TS430PEU128 Target Socket Module Schematic ceceeeee cece ee eeee eee ence eeeeeeeeeeeeeeeneees 122 B 60 MSP TS430PEU128 Target Socket Module PCB 20ceeeee cece eeee eee eee e eee eeneeeeneeeeeeeeeeeeeneees 123 B 61 EM430F5137RF900 Target board Schematic assssssssnnnnnrnnnnnnnnnnnnnnennnnnnnnnnnnnnnnnnnnnnnnnnnnnn 125 B 62 EM430F5137RF900 Target board DCH 126 B 63 EM430F6137RF900 Target board Schematic sssssssssrsnnnnsrrrrrnnnnnnnnrnnnnnnunnnnnnnnnnnnnnnnnnnnnnn 129 B 64 EM430F6137RF900 Target board DCH 130 B 65 EM430F6147RF900 Target Board Schematic nnnnnnnnennnnnnnennnnnnnnnennnennnnennnnnenenennnennnnnnnenne 133 B 66 EM430F6147RF900 Target Board P
137. mber 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated 13 TEXAS INSTRUMENTS Appendix C SLAU278P May 2009 Revised September 2013 Hardware Installation Guide This section describes the hardware installation process of the following USB debug interfaces on a PC running Windows XP e MSP FET430UIF e eZ430 F2013 e eZ430 RF2500 e eZ430 Chronos e eZ430 HF2780 e eZ430 RF2560 e MSP WDSxx Metawatch e LaunchPad MSP EXP430G2 e MSP EXP430FR5739 e MSP EXP430F5529 The installation procedure for other supported versions of Windows is very similar and therefore not shown here Topic Page Gal Hardware Installation TIEREN E EAE E CUENTEN 146 SLAU278P May 2009 Revised September 2013 Hardware Installation Guide 145 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS Hardware Installation www ti com C 1 Hardware Installation Table C 1 shows the USB VIDs and PIDs used in MSP430 tools Table C 1 USB VIDs and PIDs Used in MSP430 Tools Tool USB VID USB PID INF File Name eZ430 F2013 0x0451 0xF430 usbuart3410 inf eZ430 RF2500 0x0451 OxF432 430CDC inf eZ430 RF2780 0x0451 0xF432 430CDC inf eZ430 RF2560 0x0451 OxF432 430CDC inf MSP WDSxx Metawatch 0x0451 OxF432 430CDC inf eZ430 Chronos 0x0451 0xF432 430CDC inf MSP FET430UIF 0x2047 0x0010 msp430tools inf LaunchPad MSP EXP430G2 0x04
138. mber 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com 14 00000001 00000002 sg JTAG Ra es LED connected pi R3 e to pin 12 Ie ra as R SB Kr Es J7 Open J6 if XTCLK Jumper J7 LG cs LCD connected H E 0000 Open to measure current Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device Figure B 32 MSP TS430PM64 Target Socket Module PCB Hi ES AS UCC Rz GND D GND 00000000000000090 el ei J4 49 Ae o o cem o IC51 644 8 7 o o 000000 o L 00000 o o 00000 o eis 7 o o o 388 8 8 o o 998 988 o o O O o olo o ic 00000 o o 00000 o o 000000 o o Clamshell o o o ON 12 J2 s emo 32 DO OO OO OO OO OO OOO O0 SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Qs MSP TS430PM64 Connector J5 External power connection Remove R8 and jumper R9 Hardware 77 A TEXAS INSTRUMENTS MSP TS430PM64 www ti com Table B 18 MSP TS430PM64 Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only recommendation i GA 8 pr ME Check your crystal spec 2 C6 C7 1 10uF 10V Tantal Size B 511 1463 2 ND DNP C6 3
139. military aerospace applications or environments Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer s risk and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use TI has specifically designated certain components as meeting ISO TS16949 requirements mainly for automotive use In any case of use of non designated products TI will not be responsible for any failure to meet ISO TS16949 Products Applications Audio www ti com audio Automotive and Transportation www ti com automotive Amplifiers amplifier ti com Communications and Telecom www ti com communications Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity dataconverter ti com www dlp com www ti com clocks interface ti com logic ti com microcontroller ti com www ti rfid com www ti com omap Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space Avionics and Defense Video and Imaging TI E2E Community www ti com wirelessconnectivity www ti com computers www ti com consumer apps www ti com energy www ti com industrial www ti com medical www ti com security www ti com space avionics defense www ti com video Mailing Addr
140. mpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Orient Pin 1 of MSP430 device D1 LED connected to P1 0 Jumper JP2 Open to disconnect LED MSP TS430PZ100C JP11 O a vi Er O EN PTS o a 1 y EEE VED 2 wm cm cR KS 9 Bo 384 9 x 3 09 vu GOOD Ei HSP TS430P2100C Rev 1 1 1 R3 JP Connector J5 External power connector Jumper JP3 to ext If the system should be supplied via LDOI J6 close JP4 and set JP3 to external O Figure B 54 MSP TS430PZ100C Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 113 A TEXAS INSTRUMENTS MSP TS430PZ100C www ti com Table B 29 MSP TS430PZ100C Bill of Materials Number Pos Ref Des Per Description Digi Key Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 DNP C3 C4 2 C6 C7 2 10uF 6 3V Tantal Size B 511 1463 2 ND C5 C11 3 C13 C14 6 100nF SMD0805 311 1245 2 ND C19 C20 C10 C12 i 3 1 018 17 0 100nF SMD0805 311 1245 2 ND DNP C10 C12 C18 C17 C8 1 2 2nF SMD0805 Buerklin 53 D 292 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND JH J2 J3 DNP headers and receptacles enclosed 7 J4 4 25
141. n Considerations for In Circuit Programming This chapter presents signal requirements for in circuit programming of the MSP430 Topic Page 2 1 Signal Connections for In System Programming and Debugging 20 ET ett 24 2 35 Bootstrap Loader BS HE 24 SLAU278P May 2009 Revised September 2013 Design Considerations for In Circuit Programming 19 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated I TEXAS INSTRUMENTS Signal Connections for In System Programming and Debugging www ti com 2 1 20 Signal Connections for In System Programming and Debugging MSP FET430PIF MSP FET430UIF MSP GANG MSP GANG430 MSP PRGS430 With the proper connections the debugger and an FET hardware JTAG interface such as the MSP FET430PIF and MSP FET430UIF can be used to program and debug code on the target board In addition the connections also support the MSP GANG430 or MSP PRGS430 production programmers thus providing an easy way to program prototype boards if desired Figure 2 1 shows the connections between the 14 pin FET interface module connector and the target device required to support in system programming and debugging for 4 wire JTAG communication Figure 2 2 shows the connections for 2 wire JTAG mode Spy Bi Wire The 4 wire JTAG mode is supported on most MSP430 devices except devices with low pin counts for example MSP430G2230 The 2 wire JTAG mode is available
142. nas Under Industry Canada regulations this radio transmitter may only operate using an antenna of a type and maximum or lesser gain approved for the transmitter by Industry Canada To reduce potential radio interference to other users the antenna type and its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Cet appareil num rique de la classe A ou B est conforme la norme NMB 003 du Canada Les changements ou les modifications pas express ment approuv s par la partie responsable de la conformit ont pu vider l autorit de l utilisateur pour actionner l quipement Concernant les EVMs avec appareils radio Le pr sent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fo
143. nctionnement Concernant les EVMs avec antennes d tachables Conform ment la r glementation d Industrie Canada le pr sent metteur radio peut fonctionner avec une antenne d un type et d un gain maximal ou inf rieur approuv pour l metteur par Industrie Canada Dans le but de r duire les risques de brouillage radio lectrique l intention des autres utilisateurs il faut choisir le type d antenne et son gain de sorte que la puissance isotrope rayonn e quivalente p i r e ne d passe pas l intensit n cessaire l tablissement d une communication satisfaisante Le pr sent metteur radio a t approuv par Industrie Canada pour fonctionner avec les types d antenne num r s dans le manuel d usage et ayant un gain admissible maximal et l imp dance requise pour chaque type d antenne Les types d antenne non inclus dans cette liste ou dont le gain est sup rieur au gain maximal indiqu sont strictement interdits pour l exploitation de l metteur Important Notice for Users of EVMs for RF Products in Japan This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan you are required by Radio Law of Japan to follow the instructions below with respect to this product 1 Use this product in a shielded room or any other test facility as defined in the notification 173 issued by Ministry of Internal Affairs and Communications on March 28 2006 based
144. nnnennnennnnnenne 64 B 24 MSP TS430RHA40A Target Socket Module PCB essuessseeessleslleeesn enne nennen nnne 65 B 25 MSP TS430DL48 Target Socket Module Schematic nnannnnnnnnnnnnnnnnnnnnnnnnnnnnneennnennnennnennnnnennr 67 B 26 MSP TS430DL48 Target Socket Module PCB 0cceeeeee eee eee eee e eee e eee eee e enne enne nennen 68 B 27 MSP TS430RGZ48B Target Socket Module Schematic seceeeeee cece eee ee eee eeeeeeeeeeeeeeeneeeneeeeee 70 B 28 MSP TS430RGZ48B Target Socket Module PCB nsnnnnnnnnnnnnnnnennnnnnnnnnnnnnnnnnnnnnennnennnennnennnnnnvne 71 B 29 MSP TS430RGZ48C Target Socket Module Schematic cceceeeee cece eee eeeee cece ee eeeeeeeeeneeeneeeees 73 B 30 MSP TS430RGZ48C Target Socket Module DCH 74 B 31 MSP TS430PM64 Target Socket Module Schematic sssssssnnnnssrrnnrnnnnnnnrnnnnnnnnnnnnnnnnnnnennnnnnn 76 B 32 MSP TS430PM64 Target Socket Module DCH 77 B 33 MSP TS430PM64A Target Socket Module Schematic annnnnnnennnnnnnennnnennnnennenennnennnennnennnnnnnnr 79 B 34 MSP TS430PM64A Target Socket Module DCH 80 B 35 MSP TS430RGC64B Target Socket Module Schematic xarnnnnnnnnnnnnnnnnnnnnnnennnnnnnnennnennnennnnnennr 82 B 36 MSP TS430RGC64B Target Socket Module DCH 83 B 37 MSP TS430RGC64C Target Socket Module Schematic oocooccccccconccnnncnnccncnancrnnncnnncnnnrnnnncnnnnnnns 86 B 38 MSP TS430RGC64C Target Socket Module D
145. o L SBHITCI boor T A c o 2 2nF C8 as R1 R uF 6 3V a R2330R 4 JP5 JP10 1 2 3 UCC1 47K onf O RST NMI SBATDIO P6 0 CBB A0 P6 1 CB1 A1 P6 2 CB2 A2 P6 3 CB3 A3 P6 4 0B4 A4 P6 5 CB5 AS P5 AB UREF UeREF P5 1 89 UREF UeREF AVCC1 P5 4 XIN P5 5 XQUT AUSS1 pucca DUSS1 P1 TA CLK ACLK P1 1 TA9 2 P1 2 TA L F53XX PJ 1 TOL TCLK es ck ST SBHT us 3 XT20UT P5 P5 2 XT2IN Socket Yamaichi C20 0804 914 P1 3 TA 2 4 TA 3 5 TAQ 4 6 TALCLK CBI 2 T81 8 Q TR1 A A TAL2 2 TA2CLK SM 3 TA2 8 4 TA2 1 5 TA2 2 P4 7 PM_NONE P4 6 P NONE XTLGND2 Il GND BSL Interface lt SBH lt JTAG GND R12 OR L3 R11 OR UCC DNP P4 5 PMUCALRXD PM UCALSOMI 46 46 P4 4 PM UCALTXO PM UCALSIMO 45 45 P4 3 PM UCB1CLK PM UCALSTE 44 94 P4 2 PM UCB1SOMI PM UCB1scL 43 43 LDOI LDOO P4 1 PM UCB1SIMO PM UCB1SOA 42 42 P4 2 PM_UCBLSTE PM_UCALCLK p2 41 41 C11 100nF D je Note If the system should be supplied via LDOI J6 close JP4 and set JP3 to external P3 1 UCB somI ucB scL 35 35 CCLK OMAE E 22 6 RT 34 34 LDOI Interface MSP430 Target Socket MSP TS430RGC64B for F53xx TITLE MSP TS43 R
146. o Q2 _Detail cfm ART_ARTNU M 70 08 121 20 R3 R7 2 330 Q SMD0805 541 330ATR ND R1 R2 R4 Bb m 3 0 Ohm SMD0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R11 R12 22 R5 1 47k Q SMD0805 541 47000ATR ND Socket QFN11T064 006 inhi 23 U1 1 N HSP Manuf Yamaichi 24 PCB 1 85 x 76 mm 2 layers for example 3M Adhesive Approximately 6mm y E 25 plastic feet 4 width 2mm height EIE Part No SJ Apply to corners at bottom side 26 D3 D4 27 MSP430 2 MSP430F5310 RGC DNP enclosed with kit supplied by TI 84 Hardware SLAU278P May 2009 Revised September 2013 Copyright O 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback JA TEXAS INSTRUMENTS www ti com MSP TS430RGC64C B 19 MSP TS430RGC64C The MSP TS430RGC64C target board has been designed with the option to operate with the target device DVIO input voltage supplied via header J6 see Figure B 37 This development platform does not supply the 1 8 V DVIO rail on board and it MUST be provided by external power supply for proper device operation For correct JTAG connection programming and debug operation it is important to follow this procedure 1 2 3 4 5 Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully discharged to 0 V Enable the 1 8 V external DVIO power supply Enable the 1 8 V to 3 6 V VCC power supply alternatively this supply can be provided from the MSP FE
147. ocket Module Schematic Hardware 34 JA TEXAS INSTRUMENTS www ti com LED connected to P1 0 Jumper J4 Open to disconnect LED Orient Pin 1 of MSP430 device c3 M O Ul AA MSP TS438PL14 QD Rev 2 Figure B 4 MSP TS430PW14 Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated MSP TS430PW14 Connector J3 External power connector Jumper J5 to ext Jumpers J7 to J12 Close 1 2 to debug in Spy Bi Wire Mode Close 2 3 to debug in 4 wire JTAG mode Jumper J6 Open to measure current Hardware 35 MSP TS430PW14 36 A TEXAS INSTRUMENTS www ti com Table B 2 MSP TS430PW14 Bill of Materials m No per mer SR Position Ref Des Board Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C7 1 ps 10V Tantal Size 511 1463 2 ND 3 C3 C5 1 100nF SMD0805 478 3351 2 ND DNP C3 4 C8 0 2 2nF SMD0805 DNP 5 D1 1 green LED SMD0603 475 1056 2 ND DNP Headers and receptacles enclosed with kit Keep vias free of i solder 6 J1 J2 0 7 pin header TH SAM1029 07 ND Header SAM1213 07 ND Receptacle J3 J5 J7 deed P Place jumpers on headers J5 J7 J8 7 J8 J9 J10 8 3 pin header male TH SAM1035 03 ND J9 J10 J11 J12 Pos 1 2 J11 J12 8 J4 J6 2 2 pin header male TH SAM1035 02
148. on 1 2 of JP4 JP9 7 JP6 JP7 8 3 pin header male TH SAM1035 03 ND Place on 1 2 on JET JP8 JP9 8 JP2 JP3 2 pin header male TH SAM1035 02 ND Place jumper on header 9 Jumper 15 38 1024 ND see Pos7an8 10 JTAG 1 br connector male HRP14H ND 11 Q1 0 Crystal DNP keep vias free of solder 12 R1 R7 2 330 Q SMD0805 541 330ATR ND 13 BR BS 2 0 Ohm SMD0805 541 000ATR ND DNP R5 R6 14 R4 1 47k Ohm SMD0805 541 47000ATR ND Socket OTS 24 28 15 Ut 1 065 02 00 Manuf Enplas 16 PCB 1 68 5 x 61 mm 2 layers e for example 3M Adhesive Approximately 6mm 17 plastic feet 4 width 2mm height En Part No SJ Apply to corners at bottom side 18 MSP430 2 MSP430AFE2xx DNP enclosed with kit supplied by TI SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 45 Xi TEXAS INSTRUMENTS www ti com MSP TS430DW28 B 6 MSP TS430DW28 If external supply voltage remove R8 and add R9 0 Ohm RST NMI R5 50K VCC Ext_PWR TCK TMS TDI TDO R1 C1 C2 TST VPP not assembled TST VPP RST NMI TF 4 J4 SMD Footprint F123 TST VCC P2 5 VSS XOUT P1 3 XIN RST P2 0 P2 1 P2 2 P3 0 P3 1 P3 2 P3 3 OBGNPDURKRVN Socket Yamaichi Type IC189 0282 042 SOCK2
149. on DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C4 C5 2 C6 C7 6 100nF SMD0805 311 1245 2 ND C8 C9 3 C10 C26 2 470 nF SMD0805 478 1403 2 ND C11 C12 1 10 uF 6 3 V SMD0805 C12 DNP C13 C14 5 C16 C18 6 4 7 uF SMD0805 C19 C29 6 D1 1 green LED SMD0805 P516TR ND Ji J2 J3 SAM1029 25 ND DNP Headers and receptacles 7 J4 i 0 25 pin header TH Header SAM1213 25 enclosed with kit Keep vias free of ND Receptacle solder 8 J5 1 3 pin header male TH pue e place jumpers on pins 2 3 on JP5 9 JP8 JP9 7 3 pin header male TH SAM1035 03 ND JP6 JP7 JP8 JP9 JP10 place E i jumpers on pins 1 2 on JP3 JP10 JP1 JP2 10 JP4 3 2 pin header male TH SAM1035 02 ND Place jumper on header 11 JE 3 4 pin header male TH place jumper on header 1 2 JP12 JP13 S yeas 12 13 Jumper 15 38 1024 ND See Pos 9 and Pos 10 and Pos 11 15 JTAG 1 n connector male HRP14H ND 16 BOOTST 0 A OA DNP Keep vias free of solder 17 Q1 0 Crystal DNP Q1 Keep vias free of solder 21 R3 R7 2 330 Q SMD0805 541 330ATR ND R1 R2 22 ES RIO 2 0 Ohm SMD0805 541 000ATR ND DNP R4 R6 R8 R10 R11 R11 23 R5 1 47k O SMD0805 541 47000ATR ND 24 U1 1 Socket IC357 1004 53N Manuf Yamaichi 25 PCB 1 90 x 82 mm 2 layers e for example 3M Adhesive Approximately 6mm d E 26 plastic feet 4 width 2mm height Eu uh Part No SJ Apply to corners at bottom side 27 MSP430 2 MSP430F6733IPZ DNP enclosed with kit supplied by TI
150. on selected devices only See the Code Composer Studio for MSP430 User s Guide SLAU157 or IAR Embedded Workbench Version 3 for MSP430 User s Guide SLAU138 for information on which interface method can be used on which device The connections for the FET interface module and the MSP GANG MSP GANG430 or MSP PRGS430 are identical Both the FET interface module and MSP GANG430 can supply Vec to the target board through pin 2 In addition the FET interface module MSP GANG and MSP GANG430 have a Vec sense feature that if used requires an alternate connection pin 4 instead of pin 2 The V sense feature senses the local Vec present on the target board that is a battery or other local power supply and adjusts the output signals accordingly If the target board is to be powered by a local Vec then the connection to pin 4 on the JTAG should be made and not the connection to pin 2 This uses the Vec sense feature and prevents any contention that might occur if the local on board Vec were connected to the Vec supplied from the FET interface module MSP GANG or the MSP GANG430 If the V sense feature is not necessary that is if the target board is to be powered from the FET interface module MSP GANG or MSP GANG430 the Vec connection is made to pin 2 on the JTAG header and no connection is made to pin 4 Figure 2 1 and Figure 2 2 show a jumper block that supports both scenarios of supplying Voc to the target board If this flexibility
151. onsible or liable for any such statements Buyer acknowledges and agrees that it is solely responsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures monitor failures and their consequences lessen the likelihood of failures that might cause harm and take appropriate remedial actions Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety critical applications In some cases TI components may be promoted specifically to facilitate safety related applications With such components Tl s goal is to help enable customers to design and create their own end product solutions that meet applicable functional safety standards and requirements Nonetheless such components are subject to these terms No TI components are authorized for use in FDA Class III or similar life critical medical equipment unless authorized officers of the parties have executed a special agreement specifically governing such use Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
152. ontain the USB debug interface MSP FET430UIF and the respective target socket module MSP TS430TSxx where xx is the same for both names Following tools contain also the USB debug interface MSP FET430UIF e FET430F5137RF900 for CC430F513x devices in 48 pin RGZ packages green PCB e FET430F6137RF900 for CC430F612x and CC430F613x devices in 64 pin RGC packages green PCB These tools contain the most up to date materials available at the time of packaging For the latest materials data sheets user s guides software application information and so on visit the TI MSP430 web site at www ti com msp430 or contact your local TI sales office SLAU278P May 2009 Revised September 2013 Read This First 7 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated A TEXAS INSTRUMENTS Information About Cautions and Warnings www ti com Information About Cautions and Warnings This document may contain cautions and warnings CAUTION This is an example of a caution statement A caution statement describes a situation that could potentially damage your software or equipment WARNING This is an example of a warning statement A warning statement describes a situation that could potentially cause harm to you The information in a caution or a warning is provided for your protection Read each caution and warning carefully Related Documentation From Texas Instruments MSP430 de
153. ontents MSP TS430XX ENNEN 14 B 1 MSP TS430D8 Bill of Materials rdi nr ena ron no root rnnt nun ENNER EN NEESS a une renne date see 33 B 2 MSP TS430PW14 Bill of Materials 0a00nannnannnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnn nnnm 36 B 3 MSP TS430L092 Bill of Materials 0 cceeee cece ee eee ee eee eee ee eee eee nn nnn nennen ehe nnne nennen 39 B 4 MSP TS430L092 JP1 Settings eu SNE SES a EN dE SEAN 41 B 5 MSP TS430L092 Active Cable Bill of Materials nmnnnnnnnnnnnnnnvnnnnnnnnennnennnnnennnnnnnnnnnnennnennnennnne 42 B 6 MSP TS430PW24 Bill of Materals terisin niusnian aaen E E a 45 B 7 MSP TS430DW28 Bill of Materials oim ena rn nin ro nnnm urne nitent esun acu vene enaa E EEEE 48 B 8 MSP TS430PW28 Bill of Materials ccce cece eee e eee ence eee e eee eee eee eee nnn nmn nnne ne nennen 51 Bo MSP TS430PW28A Bill of Materials ooooocccccccccncnccncnnecnnncnnnncnnnrrnnnrnnnrrnnrrnnnrnnnrrrnrrrnsnrnanenanes 54 B 10 MSP TS430DA38 Bill of Materials ee ENEE EE EEN EEN ENEE EEN 57 B 11 MSP TS430QFN23x0 Bill of Matertals A 60 B 12 MSP TS430RSB40 Bill of Materials occoocccccccccncnnnccnnncnnncnnnncnnnrnnnnrnnnrrnnrrnnnrnnnrrrnrrrnanrnaneranes 63 B 13 MSP TS430RHA40A Bill of Matertals 00nnaaannnnnnnnnnunnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnn nnmnnn nnne 66 B 14 MSP TS430DL48 Bill of Materials rannrnunrnnnnennnenennnennnennnrvnnnnnnnnunnenunenunnnennnevunnunnnevnnenener 69
154. orporated JA TEXAS INSTRUMENTS www ti com EM430F5137RF900 Table B 33 EM430F5137RF900 Bill of Materials No per a Manufacturer s Part Item Reference Board Description Value Number Manufacturer Comment CUSTOMER SUPPLY CRYSTAL i AKER 1 Q1 1 SMT 4P 26MHz 26M ASX 531 CS ELECTRONIC C1 C5 C082 C222 C271 2 C281 C311 14 c EM SMT 0402 CER 16V O tuF 0402YCi04KAT2A AVX C321 C341 SC C412 C452 CAPACITOR SMT 0603 CERAMIC 3 C071 1 SUF EV en 0 47uF 0603YD474KAT2A AVX 4 R401 1 RES0402 47 0K 47kQ ee DALE HEADER THU MALE 14P 2X7 5 CON11 1 yep sa 09 18 514 6323 HARTING HEADER THU MALE 10P 2X5 6 CON10 B oum 09 18 510 6323 HARTING DNP 7 D1 1 LED SMT 0603 GREEN 2 1V active APT1608MGC KINGBRIGHT 8 D2 1 LED SMT 0603 RED 2 0V active APT1608EC KINGBRIGHT UNINSTALLED CRYSTAL SMT 3P MICRO d o3 H MS1V Customer Supply 9269k i MSLVETIK UN CRYSTAL BNP HEADER THU MALE 3P 1x3 10 CON12 1 e 22 03 5035 MOLEX 11 C251 C261 2 50V 5 27pF 27pF GRM36COG270J50 MURATA 12 L341 1 FERRITE SMT 0402 1 0KQ 250mA 1kQ BLM15HG102SN1D MURATA CAPACITOR SMT 0402 CERAMIC GRM1555C1H101JZ E 18 GE 1 100pF 50V 0 25pF COG NPO 100PF Ae MORATA INDUCTOR SMT 0402 2 2nH 0 1nH 5 14 L304 1 Bot SOOMUS 0 0022uH LOP15MN2N2B02 MURATA INDUCTOR SMT 0402 15nH 2 15 L303 L305 2 na Seen 0 015uH
155. pec 2 C6 C7 1 10uF 10V Tantal Size B 511 1463 2 ND DNP C6 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 yellow LED TH 3mm T1 511 1251 ND DNP Headers and receptacles enclosed with 7 J1 ky J3 0 25 pin header TH kit Keep vias free of solder SAM1029 25 ND Header SAM1213 25 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 9 J6 J7 2 2 pin header male TH SAM1035 02 ND place jumper on header 10 2 Jumper 15 38 1024 ND Place on J6 J7 11 JTAG 1 14 pin connector male TH HRP14H ND 12 BOOTST 0 10 pin connector male TH ONE Gop Mids Iree oi solder Q1 Micro Crystal MS1V 13 Qi Q2 0 Crystal T1K 32 768kHz C Load niri aor Migs NSO 12 5pF 14 R3 1 330 Q SMD0805 541 330ATR ND R1 R2 R4 15 R8 R9 R10 3 0 Q SMD0805 541 000ATR ND DNP R4 R9 R10 R12 R11 R12 16 R5 1 47k Q SMD0805 541 47000ATR ND Socket 1C201 1004 008 or 17 U1 1 1C357 1004 53N Manuf Yamaichi 18 PCB 1 82 x 90 mm 2 layers Adhesive i for example 3M Bumpons Apply to corners at bottom 19 Plastic feet 6mm width 2mm height Part No SJ 5302 side DNP enclosed with kit 20 MSP430 2 MSP430FG4619IPZ supplied by TI SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Hardware 105 Xi TEXAS INSTRUMENTS www ti com MSP TS430PZ100A B 25 MSP TS430PZ1
156. ple 3M Adhesive Approximately 6mm 23 plastic feet 4 width 2mm height S ad Part No SJ Apply to corners at bottom side 24 MSP430 2 MSP430F5342IRGZ DNP enclosed with kit supplied by TI 72 Hardware SLAU278P May 2009 Revised September 2013 Copyright O 2009 2013 Texas Instruments Incorporated Submit Documentation Feedback MSP TS430RGZ48C JTAG JTAG Mode selection 2 wire 4 wire JTAG Set jumpers JP3 to JP8 to position 2 3 SpyBiWire Set jumpers JP3 to JP8 to position 1 2 GND VCC J2 Ext_PWR di TEXAS INSTRUMENTS B 15 MSP TS430RGZ48C www ti com C3 C4 LFGND IQUARZ5 OR R6 SV1 1uF 10V 100nF connection by via OR R5 R8 OR EELS NOU a R9 OR ISI TU i QUARZ5 UUUUUUUUU BABOON OO pwr Sorat a LI I TT HH E PrwnNwn ono N I o G i Ki Ki ONEZHEZNIONO O023x029x0wddd9 229045290K2888 Edert XXE C lA mu DN e CC TT aM gs 5 e e t ki x GG ED SE TREX SS FME Eg EE ECKE SIZES NINAS ng MANONRODOr NMY eee ee ec e ANNNQ 36_DVSS 35 P4 6 34 P4 5 33 P4 4 32 P1 7 31 P1 6 30 P3 7 29 P3 6 28 P3 5 27 P3 4 26 P2 2 25 P2 1 Ler i went 100nF GND BOOTST DNP 9 T ad TEST SBWTCK H DNP co DNP If ex
157. pplications using Tl components To minimize the risks associated with Buyers products and applications Buyers should provide adequate design and operating safeguards TI does not warrant or represent that any license either express or implied is granted under any patent right copyright mask work right or other intellectual property right relating to any combination machine or process in which TI components or services are used Information published by TI regarding third party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof Use of such information may require a license from a third party under the patents or other intellectual property of the third party or a license from TI under the patents or other intellectual property of TI Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties conditions limitations and notices TI is not responsible or liable for such altered documentation Information of third parties may be subject to additional restrictions Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice Tl is not resp
158. rdware Installation MSP FET430UIF uunnnnnnnnnnnnnnunnnnnunnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnunnne 17 1 16 Hardware Installation eZ430 XXXX MSP EXP430G2 MSP EXP430FR5739 MSP EXP430F5529 17 1 17 Hardware Installation MSP FET430Uxx MSP TS430xxx FET430F6137RF900 EM430Fx137RF900 17 1 18 Important MSP430 Documents on the Web EE 18 2 Design Considerations for In Circuit Programming 19 2 1 Signal Connections for In System Programming and Debugging ococccccccccnnccnccnncnncnnccnnnnnnancnncnnnans 20 2 2 External POWer is c sicisisisicisistaistaiaisiaaiaiaisiasotaicce ENEE NEIERENS ste SEENEN EENS REENEN ee 24 2 3 Bootstrap Loader BSL c Dn 24 A Frequently Asked Questions and Known Issues sess 25 A 1 Hardware FAQS m 26 A 2 ale NET 28 B Hardware m A XOO 29 B 1 MSP TS430DB8 ios A A A ANEN ENEE ENNEN A NS NONE 31 B 2 MSP TS430PWI14 siii 34 B 3 MSP TS4930L092 eegen re rere ENEE NR NENNEN gg ges ele EN A 37 B 4 MSP TS430L092 Active Cable 1 555 552 entere reu EE ENNER ENEE p YER S NEEN EEN TRIER REN SEN E SR REN 40 B 5 MSP TS430PW24 caia ca A A A A RR la a a Ai 43 B 6 EK EN BET 46 B 7 MSP TS430PW28 iii uuu mus a A A A 49 B 8 MSP TS430PW28A e 52 B 9 dE 0 DIG I E 55 B 10 MSP TS430QFN23X0 E
159. rdware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com MSP TS430PN80 B 21 MSP TS430PN80 payquasse you Pe138uU0D St ne 9 4n81 p sse you 93 c 43 ya NE 9 3N T za IHN 1Su Tu Ieue A 1183208 10 080 18Z91 3180 31111 BErdSW J48QUNN 1USWNIOJ pelquasse 10u 10 9002 61 21 SN ETSL dSK XIXZ4 pue xgypj 404 SN EKSL dSW 1e320 19542e HG det XE J EHdSUW e uado uado xIxz J ELdSUW E tpasn SI 158 JI 9bei oA Apddns eusaixe 4 D cuyo gt ala PPE pue iH SAOUSA 0 usdo uado NOTE For MSP430F47x and MSP430FG47x devices Connect pins 7 and 10 GND externally to DVss see data sheet Connect load capacitance on Va pin 60 when SD16 is used see data sheet For use of BSL connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1 Figure B 41 MSP TS430PN80 Target Socket Module Schematic SLAU278P May 2009 Revised September 2013 Hardware 93 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated MSP TS430PN80 A TEXA
160. s which are classified as FDA Class III or similar classification then you must specifically notify Tl of such intent and enter into a separate Assurance and Indemnity Agreement Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2014 Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries Tl reserve the right to make corrections enhancements improvements and other changes to its semiconductor products and services per JESD46 latest issue and to discontinue any product or service per JESD48 latest issue Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete All semiconductor products also referred to herein as components are sold subject to Tl s terms and conditions of sale supplied at the time of order acknowledgment TI warrants performance of its components to the specifications applicable at the time of sale in accordance with the warranty in Tl s terms and conditions of sale of semiconductor products Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty Except where mandated by applicable law testing of all parameters of each component is not necessarily performed Tl assumes no liability for applications assistance or the design of Buyers products Buyers are responsible for their products and a
161. s equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help For EVMs annotated as IC INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES 003 Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment Concerning EVMs including radio transmitters This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Concerning EVMs including detachable anten
162. sfully the green LED stays on Use the 14 conductor cable to connect the USB FET interface module to a target board such as an MSP TS430xxx target socket module Ensure that the MSP430 device is securely seated in the socket and that its pin 1 indicated with a circular indentation on the top surface aligns with the 1 mark on the PCB Compared to the parallel port debug interface the USB FET has additional features including JTAG security fuse blow and adjustable target Vec 1 8 V to 3 6 V Supply the module with up to 60 mA Hardware Installation e2430 XXXX MSP EXP430G2 MSP EXP430FR5739 MSP EXP430F5529 To install eZA30 XXXX MSP EXP430G2 MSP EXP430FR5739 MSP EXP430F5529 tools follow instructions 1 and 2 of Section 1 15 Hardware Installation MSP FET430Uxx MSP TS430xxx FET430F6137RF900 EM430Fx137RF900 Follow these steps to install the hardware for the MSP FET430Uxx and MSP TS430xxx tools 1 2 3 Follow instructions 1 and 2 of Section 1 15 Connect the MSP FET430PIF or MSP FET430UIF debug interface to the appropriate port of the PC Use the 14 conductor cable to connect the FET interface module to the supplied target socket module Ensure that the MSP430 device is securely seated in the socket and that its pin 1 indicated with a circular indentation on the top surface aligns with the 1 mark on the PCB Ensure that the two jumpers LED and VCC near the 2x7 pin male connector are in place Illustrat
163. such as UL CSA VDE CE RoHS and WEEE which may normally be associated with similar items You assume full responsibility to determine and or assure compliance with any such standards and related certifications as may be applicable You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage injury or death even if the EVM should fail to perform as described or expected 4 You will take care of proper disposal and recycling of the EVM s electronic components and packing materials Certain Instructions It is important to operate this EVM within Te recommended specifications and environmental considerations per the user guidelines Exceeding the specified EVM ratings including but not limited to input and output voltage current power and environmental ranges may cause property damage personal injury or death If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads Any loads applied outside of the specified output range may result in unintended and or inaccurate operation and or possible permanent damage to the EVM and or interface electronics Please consult the EVM User s Guide prior to connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation some circuit components may have case t
164. terials Position Ref Des penat Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C3 C4 0 47pF SMD0805 DNP 3 OG OG 3 10uF 6 3V SMD0805 C12 C5 C11 4 C13 C14 4 100nF SMD0805 311 1245 2 ND 5 C8 1 2 2nF SMD0805 6 C9 1 470nF SMD0805 478 1403 2 ND 7 D1 1 green LED SMD0805 P516TR ND Ji J2 J3 SAM1029 12 ND DNP Headers and receptacles 8 d SE 0 12 pin header TH Header SAM1213 12 enclosed with kit Keep vias free of J4 ND Receptacle solder 9 J5 1 3 pin header male TH d oe place jumpers on pins 2 3 on JP5 10 JP8 IPQ 7 3 pin header male TH SAM1035 03 ND JP6 JP7 JP8 JP9 JP10 place jumpers on pins 1 2 on JP3 JP10 11 JP1 JP2 2 pin header male TH SAM1035 02 ND Place jumper on header 12 Jumper 15 38 1024 ND See Pos 10and Pos 11 13 JTAG 1 nm connector male HRP14H ND 14 BOOTST 0 Kaag Connector male DNP Keep vias free of solder Micro Crystal MS3V T1R 15 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF Q2 4MHz Buerklin E 16 Q2 0 Crystal 78D134 DNP Q2 Keep vias free of solder e http www ettinger de Ar 17 ea 0 Insulating disk to Q2 t Detail cfm ART ART NUM 70 08 121 18 R3 R7 2 330 O SMD0805 541 330ATR ND R1 R2 R4 R6 19 R8 3 0 Ohm SMD0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R9 R10 R11 R12 20 R5 1 47k O SMD0805 541 47000ATR ND Socket QFN11T048 2s 21 U1 1 008 A101121 RGZ48 Manuf Yamaichi 22 PCB 1 81 x 76 mm 2 layers for exam
165. ternal supply volta e remove R3 and add RS 0 Ohn 7 AVES ORR12 TNS ORR13 l d d sF n R14DNP 4 R Ny Rupe D3 ale red DNP e JP11 NS Ly Rupe D2 ale yellow DNP FF JP10 ke R1 330R DR green BS JP9 ND MSP TS430RGZ48C Target Socket Board for MSP430FR58xx FR59xx IRGZ TITLE MSP TS43 RGZ48C Document Number Date 9 7 2012 11 20 36 AM 73 Hardware Copyright O 2009 2013 Texas Instruments Incorporated Figure B 29 MSP TS430RGZ48C Target Socket Module Schematic SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback A TEXAS INSTRUMENTS MSP TS430RGZ48C www ti com 10 Connector JTAG 000001 Connector BOOTST For JTAG Tool 000002 For BSL Tool Jumper J1 J1 TCK TMS IDI TDO C5 af Bo Ext Power select extIEI JTAG II OI OI ONT owe 2882 we Connector J2 ext for external supply Vec ae DoD E E TEXAS GN External Power int for tool supply JP8 JP5 JP4 Jp3 8 INSTRUMENTS SN J1 connect to ext ewe Yi JP7 JP6 4 J2 Jumper JP1 bidon a RST SBWTDIO TEST SBWTCK Power measurement Nec DE zg MSP TS430RGZ48C seg Jumper JP2 20 15 S ZE Analog Digital Power TEM o 30 Clamshell e 0000 e 0000 0000 Jumper JP3 8 Connect 1 2 for SpyBiWire Connect 2 3 for JTAG Debugging ad o
166. this case external power can be supplied to the tool through connections provided on the target socket modules See the schematics and pictorials of the target socket modules in Appendix B to locate the external power connectors Note that the MSP FET430PIF is not recommended for new design Bootstrap Loader BSL The JTAG pins provide access to the memory of the MSP430 and CC430 devices On some devices these pins are shared with the device port pins and this sharing of pins can complicate a design or sharing may not be possible As an alternative to using the JTAG pins most MSP430Fxxx devices contain a program a bootstrap loader that permits the flash memory to be erased and programmed using a reduced set of signals The MSP430 Programming Via the Bootstrap Loader User s Guide SLAU319 describes this interface See the MSP430 web site for the application reports and a list of MSP430 BSL tool developers TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind that is Tl suggests providing access to these signals by for example a header See FAQ Hardware 10 for a second alternative to sharing the JTAG and port pins Design Considerations for In Circuit Programming SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated Appendix A l TO E SLAU278P May 2009 Revised September 2013 Frequently Asked Questions and Known Issues
167. tor to supply DVIO Jumper JP4 O For F524x devices close O For F522x F523x and F525x devices close only if one power supply is used for VCC and DVIO and if VCC is not higher then 1 98 V Otherwise supply DVIO over J6 Do not close if VCC gt 1 98 V as it may damage the chip Connector J5 External power connector for DVCC Set jumper JP3 to ext IMPORTANT NOTE Rev1 0 of the board does not have connection from pin 4 of BOOTST to pin 64 of MCU To use BSL these pins should be connected by a wire Figure B 38 MSP TS430RGC64C Target Socket Module PCB SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated Hardware 87 A TEXAS INSTRUMENTS MSP TS430RGC64C www ti com Table B 21 MSP TS430RGC64C Bill of Materials Item Qty Reference Value Description Comment Supplier No 1 0 C1 C2 12pF CAP SMD Ceramic 0805 DNP C1 C2 2 0 C3 C4 tbd CAP SMD Ceramic 0805 DNP C3 C4 4 3 C5 C7 C10 10uF CAP SMD Ceramic 0805 5 5 C8 C6 C13 15 100nF CAP SMD Ceramic 0805 DigiKey 311 1245 2 ND 5 5 C8 2 2nF CAP SMD Ceramic 0805 6 1 C9 470nF CAP SMD Ceramic 0805 DigiKey 478 1403 2 ND 7 1 C16 4 7uF CAP SMD Ceramic 0805 8 1 D1 Green LED LED SMD 0805 DNP headers and receptacles enclosed with Pin header 1x16 Grid 100mil kit Keep vias free of 9 4 J1 J4
168. tors CONI CON3 Port Port3 of cc430 CON4 spare CONS 1 XIN 2 XOUT CON6 Vdd GND Vcore COMo LCDCAP CON7 Vddai Vdda2 GND AGND CONS JTAG BASE JTAG Port CON Vdd GND AGND Figure B 61 EM430F5137RF900 Target board Schematic 125 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS EM430F5137RF900 www ti com JTAG connector Jumper JP2 tg ly ASUTE CUNMENE No etelelelob Close EXT for external supply Jump O PN Donos Close INT for JAG supply External power connector ND E ue meda CON12 JPi a JTAG GND Jumper JP1 Close JTAG osition to Open to disconnect LEDs debug in N jumper JP5 JP10 JTAG mode pid SBW position o debug in GE Ss Ee to Spy Bi Wire mode Push button S2 LED D1 green connected connected ta P17 to P1 0 via JP5 Footprint for 32kHz crystal Use 00 resistor for R431 R441 to make XIN XOUT available on connector port5 RF Crystal Q1 26 MHz Reset button S1 RF Signal SMA Figure B 62 EM430F5137RF900 Target board PCB The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12 Ensure correct battery insertion regarding the polarity as indicated in battery holder 126 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Inc
169. trol device 3 HID compliant device a USB Human Interface Device Ga USB Human Interface Device i amp IDE ATA ATAPI controllers General Driver Details Go Keyboards 1 Mice and other pointing devices ay USB Human Interface Device Monitors USB Human Interface Device Properties ge er ig AA S H PCMCIA adapters e i F Ports COM amp LPT USBWID 0451 amp PID F4325MI 01V7 amp 2C60AFE 35050001 2 Communications Port COMI 2 ECP Printer Port Aer y Toshiba BT Port COM10 2 Toshiba BT Port COM11 2 Toshiba BT Port COM12 2 Toshiba BT Port COM13 2 Toshiba BT Port COM14 2 Toshiba BT Port COM20 2 Toshiba BT Port COM21 a Toshiba BT Port COM40 Y Toshiba BT Port COMS Toshiba BT Port COM7 S R Processors Ze Smart card readers 9 Sound video and game controllers 3 System devices Figure C 5 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF432 150 Hardware Installation Guide SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com Document Revision History Document Revision History Version Changes SLAU278 Initial release SLAU278A Updated USB driver installation according to CCE v3 1 SR1 and CCS v4 SLAU278B Added information about MSP FET430U80USB MSP TS430PN80U
170. tton S3 Figure B 46 MSP TS430PN80USB Target Socket Module PCB 100 Hardware Copyright 2009 2013 Texas Instruments Incorporated SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback JA TEXAS INSTRUMENTS www ti com MSP TS430PN80USB Table B 25 MSP TS430PN80USB Bill of Materials Pos Ref Des de Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 2 C6 C7 2 10uF 6 3V Tantal Size B 511 1463 2 ND 3 eer A 4 100nF SMD0805 311 1245 2 ND 3 1 C10 C12 0 10uF SMD0805 311 1245 2 ND DNP C10 C12 C8 1 2 2nF SMD0805 C9 1 470nF SMD0805 478 1403 2 ND D1 1 green LED SMD0805 P516TR ND DNP headers and 7 WE CH 4 20 pin header TH SAM1029 20 ND pe with solder DNP headers and receptacles enclosed with kit Keep vias free of 7 1 4 20 pin header TH solder SAM1213 20 ND Header Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JPG JE 6 3 pin header male TH SAM1035 03 ND Place jumpers on pins 2 3 JP10 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header JP4 1 SAM1035 02 ND dcn jumper only on one 11 JP3 1 3 pin header male TH SAM1035 03 ND Place jumper on pins 1 2 Place on JP1 JP2 JP3 12 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND 14 Q1 0 Crystal saree Coad
171. ty as indicated in battery holder 130 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright 2009 2013 Texas Instruments Incorporated JA TEXAS INSTRUMENTS www ti com EM430F6137RF900 Table B 34 EM430F6137RF900 Bill of Materials No Pos Ref Des per Description Part No Manufacturer Board CUSTOMER SUPPLY CRYSTAL SMT AKER 1 Q1 1 4P 26MHz ASX 531 CS ELECTRONIC C1 C5 C112 C252 C381 2 C391 C421 14 CD CH SMT 0402 CER 16V 10 9492YC104KAT2A AVX C431 C451 C522 C562 3 C101 1 AN B 0603 CERAMIC 0 47UF 0603YD474KAT2A AVX 4 R511 1 RES0402 47 0K CRCW04024702F100 DALE 5 CON11 1 EN EX 09 18 514 6323 HARTING 7 D1 1 LED SMT 0603 GREEN 2 1V APT1608MGC KINGBRIGHT 8 D2 1 LED SMT 0603 RED 2 0V APT1608EC KINGBRIGHT 10 CON12 1 dd Line MALE 3P 1x3 22 03 5035 MOLEX 11 C361 C371 2 50V 5 27pF GRM36COG270J50 MURATA 12 L451 1 FERRITE SMT 0402 1 0kO 250mA BLM15HG102SN1D MURATA 13 C403 e AMI TH GRMISSSCIHI01JZ01 MURATA 14 L414 1 Te oe 0402 2 2nH 0 2nH LQW15AN2N2C10 MURATA 15 L413 L415 2 ce SMT 0402 15nH 5 460MA QW15AN15NJ00 MURATA 16 L402 L412 2 ae SMT 0402 18nH 5 370MA Qw15AN18NJOO MURATA 17 C401 o GER TPF SOV GJM1555C1H1ROCBO1D MURATA 18 C413 1 GOV EOS COGINED MG DH GRMISSSCIHBR2CZ01 MURATA C402
172. velopment tools documentation Code Composer Studio v5 4 for MSP430 User s Guide literature number SLAU157 Code Composer Studio v5 x Core Edition CCS Mediawiki IAR Embedded Workbench Version 3 for MSP430 tm User s Guide literature number SLAU138 IAR Embedded Workbench KickStart installer literature number SLACO50 eZ430 F2013 Development Tool User s Guide literature number SLAU176 eZ430 RF2480 Demonstration Kit User s Guide literature number SWRU151 eZ430 RF2500 Development Tool User s Guide literature number SLAU227 eZ430 RF2500 SEH Development Tool User s Guide literature number SLAU273 eZ430 Chronos Development Tool User s Guide literature number SLAU292 Spectrum Analyzer MSP SA430 SUB1GHZ User s Guide literature number SLAU371 MSP EXP430F5529 Experimenter Board User s Guide literature number SLAU330 MSP EXP430F5438 Experimenter Board User s Guide literature number SLAU263 MSP EXP430G2 LaunchPad Experimenter Board User s Guide literature number SLAU318 MSP Gang Programmer MSP GANG User s Guide literature number SLAU358 MSP430 Gang Programmer MSP GANG430 User s Guide literature number SLAU101 MSP430 device user s guides MSP430x1xx Family User s Guide literature number SLAU049 MSP430x2xx Family User s Guide literature number SLAU144 MSP430x3xx Family User s Guide literature number SLAUO12 MSP430x4xx Family User s Guide literature number SLAU056 MSP430x5xx and MSP430x6xx Family User s Guide literature number S
173. ware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated X TEXAS INSTRUMENTS EM430F6147RF900 www ti com B 33 EM430F6147RF900 zer cas reat 2pr Car Kal C414 RF SINGLE SAL 1 5pF mm SMA F AVCC RVCC_1 uninstalled Je 1210 uF ET T Correspondig Layout Revisions 4 0 U1 direct soldered VOC external VCC DVCC Digital VCC AVCC Analog VCC RVCC RF VCC Port connectors CONI CONS Port1 Port5 of cc430 CONG DVCC GND Vcore COMO LCDCAP CON7 RFVCC_1 AVCC GND AGND CON8 JTAG BASE JTAG Port CON9 DVCC GND AGND Figure B 65 EM430F6147RF900 Target Board Schematic 133 Hardware SLAU278P May 2009 Revised September 2013 Submit Documentation Feedback Copyright O 2009 2013 Texas Instruments Incorporated EM430F6147RF900 Jumper JP9 TPS status Open to measure current jumper JP3 External power connector CON12 Open to disconnect LEDs jumper JP5 JP10 LED D2 red connected to P3 6 via JP10 LED D1 green connected ee D lt H cc o to P1 0 via JP5 ER e O in 5 i o o 5 Li SE si w ud CN gt ii S Ut bw o sg 0562 R55 a 5 on o9 cael 02 fy is gt C RF Crystal Q1 26 MHz gt Gm 20554 15 P R554 E sad 000 c431 D I m peta E gt uc tg Un Q 2800 05 RF Signal SMA o VCC GND GND JTAG conn

MSP430 Hardware Tools User's Guide (Rev. P)

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